Dams and filters for spectrometers

Abstract

The present invention defines a predefined range of interest λ [roi] A method (126) for manufacturing at least one optical detector (110) for optically detecting electromagnetic radiation in a substrate, the method comprising the steps of: a) providing at least one detector pixel (112) on a circuit carrier (114); b) applying at least one fluid material to at least one line (122) on the circuit carrier (114), such that the line (122) of fluid material surrounds at least one, and in particular exactly one, detector pixel (112) and such that the at least one line (122) of fluid material extends higher from the circuit carrier (114) than the detector pixel (112); c) at least partially hardening, particularly hardening, at least one line of fluid material (122) such that the at least one line forms a dam (116) surrounding at least one, particularly exactly one, detector pixel (112); and d) depositing at least one filter substrate (118) on the at least one dam (116), such that the filter substrate (118) is adhesively attached to the dam (116) and covers at least one detector pixel (112) on at least one side facing the circuit carrier (114); The present invention relates to a method comprising the steps of: The present invention further relates to a method (124) for manufacturing at least one photodetector system (120) having at least two photodetectors (110), the photodetectors (110), the photodetector system (120), and a spectroscopic sensing application including the at least one photodetector system (120).

Description

[Technical field]

[0001] The present invention uses a preset range of interest λ [roi] The present invention relates to a method for manufacturing at least one optical detector for optically detecting electromagnetic radiation in a space. Furthermore, the present invention relates to a method for manufacturing an optical detector system, which comprises at least two optical detectors. Furthermore, the present invention relates to an optical detector, an optical detector system and a spectroscopic sensing application comprising at least one optical detector. Such a method and device can be employed in various fields of optical sensing and detection technology, such as, for example, in professional environments, for example, devices for medical and physiological diagnostics and research, as well as devices used for quality control and in various other fields of scientific research. Further applications are possible in household appliances and household equipment, in particular in manually operated equipment. However, further applications are also possible. [Background technology]

[0002] Optical detectors generally respond to electromagnetic radiation in a particular wavelength range depending on the material composition of the detector. To further functionalize such detectors, for example for spectroscopic sensing applications, filters such as optical windows and bandpass filters can be employed to limit the spectral response of the detector in terms of center wavelength, full width at half maximum (FWHM) and cutoff range. In a typical spectroscopic sensing (detection) system, one or more detectors are required and can be combined for the intended application.

[0003] Patent Document 1 (US2021 / 028217A1) describes a semiconductor package and a manufacturing method thereof. The semiconductor package may include a semiconductor chip structure, a transparent base material (substrate) disposed on the semiconductor chip structure, a dam disposed at an end of the semiconductor chip structure and disposed between the semiconductor chip structure and the transparent base material, and an adhesive layer interposed between the dam and the semiconductor chip structure. The semiconductor chip structure may include an image sensor chip and a logic chip in contact with each other, and the image sensor chip may be closer to the transparent base material than the logic chip.

[0004] US 2017 / 213864 A1 describes a trenched bonding dam device and a corresponding manufacturing method. The trenched bonding dam device includes a bonding dam structure disposed on an upper surface of a substrate. The bonding dam structure has a bottom surface attached to the upper surface of the substrate, an inner dam surrounded by an outer dam, and a trench between the inner dam and the outer dam. The device may further include an optical system including a lens and an adhesive disposed in a bonding region between a bottom surface of the optical system and an upper surface of at least one of the inner dam and the outer dam. The trench may be dimensioned to receive a portion of excess adhesive that flows laterally out of the bonding region when bonding the substrate to the optical system, to laterally confine the excess adhesive, and to reduce lateral bleeding of the adhesive.

[0005] Patent Document 3 (CN 108649045 A) describes a packaging structure including a substrate, a sealing adhesive and a chip. The chip is packaged on the substrate via the sealing adhesive, and at least one sealing adhesive is disposed on the substrate, the substrate has a first end and a second end disposed opposite to each other, the sealing adhesive has a first end and a second end, the first end of the sealing adhesive is disposed at the first end of the substrate, the second end of the sealing adhesive is disposed at the second end of the substrate, and a plurality of chips are disposed on the sealing adhesive; an exhaust groove is formed at the second end of the substrate, and the exhaust groove is connected to the second end of the sealing adhesive. This packaging structure can effectively improve packaging molding defects. This invention further discloses a camera module.

[0006] To limit the spectral response of the detector, e.g., the central wavelength, full width at half maximum (FWHM) and cut-off range, filters such as optical windows or bandpass filters can generally be employed to further functionalize such detectors, e.g., for spectroscopic sensing applications. However, the installation and assembly of filters still requires high labor and time. Furthermore, a typical manufacturing process with multiple steps usually requires a different manufacturing setup for each step. Such different manufacturing setups generally make the steps complicated, error-prone and very time-consuming even in the case of full automation.

[0007] Moreover, typically, multiple detectors and filters are required and combined for use in such intended applications. In order to incorporate detectors and filters into known devices, such as consumer devices, home devices, portable devices, etc., the assembly must be very compact. However, generally and especially in compact assemblies, stray light and crosstalk can result in faulty or distorted measurements, especially when more than one detector is employed. In particular, stray light or diffracted light that does not pass through a filter and interacts with a pixel, or that was intended to interact with a particular pixel, but instead interacts with a different pixel, such as one or more adjacent pixels, usually results in distorted measurements. These phenomena are becoming more sensitive due to the trend towards smaller footprints and higher density sensor systems. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] US2021 / 028217A1 [Patent Document 2] US 2017 / 213864 A1 [Patent Document 3] CN 108649045A Summary of the Invention [Problem to be solved by the invention]

[0009] It is therefore desirable to provide a method and apparatus which at least substantially avoids the drawbacks of known methods and apparatus. In particular, it is an object of the present invention to provide a method and apparatus which aims at a fast, reliable and cost-effective process, in particular for mass production, while maintaining a high yield. It is therefore desirable to provide an apparatus and method, e.g. a smart concept, for filter attachment and assembly, in particular which minimizes stray light and suppresses crosstalk. [Means for solving the problem]

[0010] overview This problem is solved by a method for manufacturing at least one photodetector, a method for manufacturing at least one photodetector system, a photodetector, a photodetector system and a spectroscopic sensing application, which have the features of the independent claims. Advantageous embodiments, which can be realized independently or in any combination, are set out in the dependent claims and in the entire specification.

[0011] As used herein, the terms "have", "comprise" or "include", or any grammatical variants thereof, are used in a non-exclusive sense. Thus, these terms may refer to the situation where there are no further features in the entity described in this context, other than the features introduced by these terms, as well as the situation where there are one or more further features. As an example, the expressions "A has B", "A comprises B" and "A includes B" may refer both to the situation where there are no other elements in A besides B (i.e., A consists only of B) and to the situation where, besides B, one or more further elements are present in the entity A, such as element C, elements C and D, or even other elements.

[0012] Furthermore, it should be noted that the terms "at least one," "one or more," or similar language indicating that a feature or element may be present one or more times, are typically used only once when introducing each feature or element. In most cases, the language "at least one" or "one or more" will not be repeated when referring to each feature or element, regardless of the fact that each feature or element may be present one or more times.

[0013] Furthermore, as used herein, the terms "preferably", "more preferably", "particularly", "more particularly", "particularly", "more particularly" or similar terms are used in combination with any feature without limiting the possibility of substitution. Features introduced by these terms are therefore optional features and are not intended to limit the scope of the claims in any way. The invention can be practiced with alternative features, as the skilled artisan will recognize. Similarly, features introduced by "in an embodiment of the invention" or similar expressions are intended to be optional features, without any limitation on alternative embodiments of the invention, without any limitation on the scope of the invention, and without any limitation on the possibility of combining the feature so introduced with other optional or non-optional features of the invention.

[0014] In a first aspect, the present invention provides a method for determining a predefined range of interest λ [roi] The present invention relates to a method of manufacturing at least one optical detector for optically detecting electromagnetic radiation in a semiconductor device. The method includes the following method steps, which may be performed in the given order, although different orders may be possible. Furthermore, one, more than one, or all of the method steps may be performed once or repeatedly. Furthermore, the method steps may be performed sequentially, or two or more method steps may be performed with overlapping time or in parallel. The method may further include additional method steps not listed.

[0015] The method includes the steps of: a) providing at least one detector pixel (112) on a circuit carrier; b) applying at least one fluid material in at least one line on the circuit carrier, such that the line of fluid material surrounds at least one detector pixel, in particular exactly one detector pixel, and such that the at least one line of fluid material extends higher from the circuit carrier than the detector pixel; c) at least partially hardening, in particular curing, the at least one line of fluid material such that the at least one line forms a dam surrounding at least one detector pixel, in particular exactly one detector pixel; and d) depositing at least one filter substrate on the at least one dam such that the filter substrate is adhesively attached to the dam and covers at least one detector pixel on at least one side facing the circuit carrier.

[0016] The term "electromagnetic radiation" as used herein is a broad term and should be given its ordinary and customary meaning to those skilled in the art and should not be limited to any special or customized meaning. The term may specifically, but is not limited to, refer to at least one wave of an electromagnetic field that is emitted through space carrying electromagnetic radiation energy. Electromagnetic radiation may include, for example, radio waves, microwaves, infrared, e.g., near infrared, visible light, particularly light visible to the human eye, ultraviolet, x-rays, and gamma rays. Thus, "electromagnetic radiation λ in a predefined range of interest" may be used to refer to at least one wave of an electromagnetic field that is emitted through space while carrying electromagnetic radiation energy. [roi] " may specifically refer to electromagnetic radiation having wavelengths within a predefined and / or specified range. As an example, a predefined range of interest λ [roi] may particularly represent a property and / or characteristic of the optical detector, such as a response range of at least one detector pixel of the optical detector.

[0017] As used herein, the term "detector pixel" is a broad term and should be given its ordinary and customary meaning to those skilled in the art, and should not be limited to any special or customized meaning. The term may specifically, but not limited to, represent an electronic component and / or portion configured to generate at least one signal in response to the presence of electromagnetic radiation. In particular, a detector pixel may be a sensor unit cell, and may specifically include at least one photodetector and one or more transistors. In particular, a detector pixel may be or include a photoconductive material, such as polycrystalline lead selenide (PbSe) and / or polycrystalline lead sulfide (PbS).

[0018] In step a) of the method, the detector pixels are arranged on at least one circuit carrier, which may in particular be or include a printed circuit board. As an example, the circuit carrier may be or include a glass material, such as a glass-reinforced epoxy laminate material, e.g. FR4. In particular, the detector pixels may in particular be arranged on one or more sheet layers including conductive features arranged to mechanically support and electrically connect electronic components.

[0019] The term "dispensing" as used herein is a broad term and should be given its usual and customary meaning to those skilled in the art, and should not be limited to any special or customized meaning. The term may specifically, but not exclusively, refer to the step of outputting at least one material. In particular, the term may refer to the step of applying a fluid material onto any base element in a structured manner. In particular, a dispenser may be used to dispense a material, e.g., a flowable material. As an example, dispensing may consist of a flowable material flowing out of a reservoir of the dispenser onto the base element in a structured manner, e.g., by a relative movement between the dispenser and the base element.

[0020] Dispensing in step b) may particularly represent a step of applying at least one flowable material onto the circuit carrier, for example onto the base element, in at least one line, for example in a structured manner. The term "flowable material" as used herein is a broad term and should be given its usual and customary meaning for the skilled person and should not be limited to a special or customized meaning. This term may particularly represent, but is not limited to, any at least temporarily liquid and / or viscose material. In particular, the flowable material may have liquid and / or viscose properties, particularly while being dispensed. Thus, the flowable material may particularly be any material that has the ability to flow, particularly while being dispensed. Furthermore, the flowable material may particularly be at least partially hardenable, particularly hardenable.

[0021] As used herein, the term "hardning" is a broad term and is given its usual and customary meaning to those skilled in the art, and is not limited to any special or customized meaning. The term may refer to a step that enhances the molding stability of a material, such as, but not limited to, the ability to resist deformation due to gravity. In particular, hardening may refer to a step that increases the viscosity of a flowable material. As an example, hardning may be or may include a curing and / or crosslinking step. Thus, hardening may particularly refer to a step that includes any reaction that enhances the molding stability of a material, particularly by modifying the molecular structure of the material and / or by evaporating solvent or softener molecules. In particular, hardening at least one line of a flowable material may refer to a hardening step, such as, for example, a step that increases the viscosity of the flowable material. Thus, in particular, the viscosity of the flowable material may increase during hardening.

[0022] In particular, the hardening of step c) may occur after the dispensing of step b). Alternatively, however, at least partial hardening of the flowable material may begin while still dispensing the flowable material, and thus steps b) and c) may be performed in a timely overlap. By way of example, such a timely overlap of steps b) and c) may in particular enable rapid and cost-effective processing.

[0023] Furthermore, the deposition of step d) may take place after the curing of step c), but instead steps c) and d) can also be overlapped in time, in particular at least one filter substrate can be deposited on the dam during a step in which the flowable material of the dam is still at least partially cured.

[0024] The term "filter substrate" as used herein is a broad term and should be given its usual and customary meaning to those skilled in the art and should not be limited to any special or customized meaning. The term may specifically, but not exclusively, refer to slide and / or sheet-like materials configured to selectively transmit electromagnetic radiation, specifically one or more of the visible, infrared or ultraviolet spectral ranges. In particular, the filter substrate may be or include a form-stable and / or rigid material. As an example, the filter substrate adhesively mounted to the dam may specifically be configured to form a roof-like structure covering the detector pixels.

[0025] As used herein, the term "adhesively attached" is a broad term and should be given its ordinary and customary meaning to those of skill in the art and is not limited to any special or customized meaning. The term may specifically, but not exclusively, refer to a material-to-material bond and / or joining between at least two components and / or materials, the bond being configured to provide a transfer and / or transmission of force between the joined components and / or materials. Thus, by way of example, an external force acting on a filter substrate adhesively attached to a dam may be transferred to the dam, and the dam may support the external force acting on the filter substrate.

[0026] As an example, in step d), the dam itself, particularly the line of flowable material that has been at least partially cured, particularly cured and / or dried to form the dam, may be or include an adhesive and / or glue for attaching the filter substrate onto the dam, whereby the filter substrate may be adhesively attached onto the dam by placing the filter substrate directly onto the dam. Additionally or alternatively, further substances for adhesively attaching the filter substrate onto the dam may be used, such as an intermediate layer of adhesive and / or glue.

[0027] In particular, the flowable material dispensed (applied) in step b) may be or may include, in particular, one or more of an adhesive, in particular a glue, an airtight material, in particular a material that prevents the passage of gas, and a dielectric material. By way of example, the flowable material may at least partially include, in particular, one or more of an epoxy resin, in particular an epoxy resin with at least one further component, a silane-modified polymer, and methanol. In particular, the flowable material may include methanol. In particular, the flowable material may include a combination of these materials. Thus, the flowable material may include an epoxy resin with at least one further component, such as, for example, methanol. Additionally or alternatively, the flowable material may include a silane-modified polymer, and may optionally further include methanol.

[0028] By way of example, the dam may consist of a plurality of lines of at least partially hardened flowable material. Step b) may thus further comprise dispensing two or more lines on top of one another. In particular in step b), two or more lines of flowable material may then be dispensed on top of one another, in particular such that a stack of lines is created, which by way of example may thus form the dam.

[0029] Furthermore, the method may include adjusting the height of the dam extending from the circuit carrier in step b) according to a predefined numerical aperture of the photodetector, such as by placing an appropriate number of lines overlapping each other. In particular, the height of the dam may be selected to adjust the numerical aperture of at least one detector. In particular, the height of the dam may have an opposite and / or opposite effect on the numerical aperture of the detector. Thus, by way of example, the higher the dam, e.g. the larger the gap between the filter substrate and the detector pixel, the smaller the numerical aperture of the detector may be, and vice versa.

[0030] At least step d) may be carried out in an inert atmosphere, in particular in a glove box, such as a nitrogen glove box. Further method steps, such as steps b) and c), or all of the method steps, may be carried out in an inert atmosphere. In particular, the step of depositing the filter substrate on the dam may be carried out in an inert atmosphere, for example in an atmosphere that avoids undesired chemical reactions, such as oxidation reactions and hydrolysis reactions, for example in a noble gas atmosphere, for example in an argon and / or nitrogen gas atmosphere. Thus, by way of example, step d) can be carried out in an environment that contains high levels of argon gas and / or nitrogen gas, for example 80% or more, preferably 90% or more, more preferably 95% or more. In particular, to avoid undesired chemical reactions, step d) may be carried out in an inert atmosphere with low levels of chemically reactive components, such as oxygen and / or moisture, for example air and / or an atmosphere with high levels of noble gases. Thus, in an inert atmosphere, in particular in a glove box, the principle that the higher the level of noble gas, the better may be applied.

[0031] Furthermore, the circuit carrier, the at least one dam and the at least one filter substrate (substrate) may be configured to form a hermetically sealed packaging, in particular a hermetically sealed packaging surrounding the detector pixels. The circuit carrier, the dam and the filter substrate may thus be configured to prevent the passage of fluids, in particular gases and / or gas mixtures, such as air and oxygen. Furthermore, all joints and / or connections, in particular between the dam and the circuit carrier and between the dam and the filter substrate, may be particularly hermetically sealed. Thus, the connections between the dam and the circuit carrier may form a hermetically sealed seal, and the connections between the dam and the filter substrate may form a hermetically sealed seal. In particular, the packaging surrounding the detector pixels may form a hermetically sealed packaging by performing step d) in an inert atmosphere, where an inert atmosphere may also be present inside the hermetically sealed packaging surrounding the detector pixels. In particular, by encapsulating the detector pixels in an inert atmosphere within hermetic packaging, undesirable chemical reactions between the atmosphere and the detector pixels, such as oxidation and / or hydrolysis of the detector pixels, may be avoided, thereby increasing the lifetime of the entire detector, in particular preventing long term degradation of the optical detector. The inert atmosphere may specifically contain low levels and / or concentrations of oxygen. Specifically, there may be an oxygen concentration of ≦18% by volume in the inert atmosphere. Preferably, there may be an oxygen concentration of ≦15% by volume in the inert atmosphere. More preferably, there may be an oxygen concentration of ≦10% by volume in the inert atmosphere. Most preferably, there may be an oxygen concentration of ≦5% by volume in the inert atmosphere.

[0032] The inert atmosphere may in particular contain low levels and / or concentrations of moisture and / or humidity. In particular, in the inert atmosphere, a humidity of ≦5% by volume may be present. Preferably, in the inert atmosphere, a humidity of ≦3% by volume may be present. More preferably, in the inert atmosphere, a humidity of ≦1% by volume may be present.

[0033] Additionally or alternatively, step d) may be performed in a vacuum atmosphere, such as in a vacuum chamber. In particular, the vacuum atmosphere may be or may include atmospheric pressure of ≦0.3 bar. Thus, for example, at least step d) may be performed in a vacuum atmosphere, so that the hermetically sealed packaging may, for example, include a vacuum atmosphere.

[0034] In particular, at least one dam, such as a flowable material that has been cured, e.g., hardened, to form a dam, may be configured such that the dam may form part of the sealed package. In particular, the flowable material may be a material, such as an adhesive (glue) type, configured to enable sealing, such that the dam may form part of the sealed package, in particular since sealing may be highly dependent on the material properties of the dam, such as the cured flowable material.

[0035] The method may specifically further comprise the steps of: e) depositing at least one spacer element within the dam to ensure a predetermined gap between the detector pixel and the filter substrate.

[0036] In particular, in the method, step e) may be performed before performing step d), whereby at least one spacer element may be deposited in the dam before at least one filter substrate is deposited on the dam.

[0037] The spacer elements may be specifically configured to ensure a predefined gap between the detector pixels and the filter substrate by being present in and / or near the gap, e.g., next to the detector pixels, in the dam, etc. As an example, the spacer elements may be or include at least one glass and / or plastic bead having a diameter d, e.g., 50 μm≦d≦250 μm.

[0038] The dam is specifically designed for the wavelength range of interest, λ [roi] Within or equal to the wavelength range λ [dam]The term "essentially blocking" as used herein is a broad term and should be given its ordinary and customary meaning to those skilled in the art and should not be limited to any special or customized meaning. The term may specifically, but without limitation, refer to a step in which a majority of electromagnetic radiation is prevented or blocked from passing through a material. In particular, the term "essentially blocking" may refer to a step in which a majority of electromagnetic radiation is prevented or blocked from passing through a material, particularly in the wavelength range of interest λ [roi] Within or equal to the wavelength range λ [dam] The dam is specifically configured to essentially block electromagnetic radiation in the range λ [dam] The dam may be configured to have one or both of an absorption or reflection configuration from transmitting or passing through the dam of ≧95%, preferably ≧97%, and more preferably ≧99% of the intensity of electromagnetic radiation having a wavelength within 0.5 μm. Specifically, as an example, the dam may include an optical density of 2, such as OD2.

[0039] In particular, the wavelength range λ [dam] may be or may include one or more wavelengths from the wavelength range of near infrared radiation, also called NIR, and visible light, also called VIS. The VIS-range may particularly include wavelengths from 400 nm to 700 nm. The NIR wavelength range may particularly include wavelengths from 700 nm to 2500 nm. By way of example, the dam may be configured to reduce the transmission over the VIS- and / or NIR-range to 5% or less. Additionally or alternatively, the thickness of the dam may be adjustable depending on the desired blocking or transmission of electromagnetic radiation. Thus, by way of example, if a lower transmission may be required, the dam may be selected to be thicker. By way of particular example, a thickness between 450 μm and 600 μm, for example 500 μm, may be sufficient to block at least 70% of the transmission of electromagnetic radiation.

[0040] In particular, by reducing the transmission of electromagnetic radiation through the dam, for example in the VIS- and / or NIR-range, crosstalk can be reduced, which in particular can refer to electromagnetic radiation intended to interact with a particular detector pixel interacting instead with another detector pixel, for example one or more adjacent pixels, for example a detector pixel of another optical detector, which may be located nearby.

[0041] Predefined range of interest λ [roi] Specifically, the wavelength range of interest may be or may include electromagnetic radiation in at least one range between 200 nm and 1 mm. [roi] 350nm≦λ [roi] ≦5000 nm, more particularly 1000 nm≦λ [roi] It may be selected to be ≦3000 nm.

[0042] By way of example, the filter substrate deposited in step d) may be or may include one or more of a filter slide, a filter sheet and a filter layer. In particular, the filter substrate may have a flat and / or planar basic shape. The filter substrate may further have a form and / or shape similar to the contour of the dam or at least the contour of the dam. By way of example, the filter substrate may be a flat filter slide or layer cut into the shape of a square, a rectangle, a circle or an oval.

[0043] In particular, the filter substrate deposited in step d) is preferably a filter material having a wavelength range of interest λ [roi] Further, the filter substrate may be adapted to transmit electromagnetic radiation in the wavelength range of interest λ [roi] At least one wavelength range λ having at least one wavelength λ1 outside [filter]の The filter substrate may be adapted to at least partially block the transmission of electromagnetic radiation. [filter]In some embodiments, the filter substrate may be configured to absorb or reflect ≧60%, particularly ≧80%, and more particularly ≧90% of the intensity of electromagnetic radiation having a wavelength within the range of ≧60% from being transmitted or passed through the filter substrate.

[0044] The filter substrate may specifically be or may constitute an interference filter. As used herein, the term "interference filter" is a broad term and should be given its usual and customary meaning to those skilled in the art and should not be limited to any special or customized meaning. The term may refer to, but is not limited to, an optical filter that reflects one or more spectral bands or lines of electromagnetic radiation and transmits others while maintaining an absorption coefficient near zero. As an example, an interference filter may include multiple layers of dielectric materials with different refractive indices. In particular, interference filters include wavelength selectivity. In particular, when the filter substrate is an interference filter, the filter substrate may be or include one or more of a long pass filter, a short pass filter, a notch filter, and a band pass filter. In particular, when the filter substrate includes a band pass filter, the filter substrate may include a filter having a wavelength range λ 2 , λ 3 , λ 4 , λ 5 , λ 6 , λ 7 , λ 8 , λ 9 , λ 10 , λ 11 , λ 12 , λ 13 , λ 14 , λ 15 , λ 16 , λ 17 , λ 18 , λ 19 , λ 20 , λ 21 , λ 22 , λ 24 , λ 25 , λ 26 , λ 27 , λ 28 , λ 29 , λ 30 , λ 31 , λ 32 , λ 34 , λ 35 , λ 36 , λ 37 , λ 38 , λ 39 , λ 40 , λ 41 , λ 42 , λ 44 , λ 45 , λ 46 , λ 47 , λ 48 , λ 49 , λ 50 , [filter]は、 At least two ranges λ [filter-low] and λ [filter-high] and both ranges λ [filter-low] and λ [filter-high] may be essentially blocked from being transmitted or passed through the filter substrate.

[0045] In particular, in the wavelength range λ [filter-low] and λ [filter-high] is the wavelength range of interest, λ [roi] Thus, by way of example, a filter substrate may represent a broad wavelength range having wavelengths outside the wavelength range of interest λ [roi] In one embodiment, the optical filter is configured to absorb and / or reflect ≧60%, particularly ≧80%, more particularly ≧90% of the intensity of electromagnetic radiation having a wavelength between 400 nm and 5000 nm that does not fall within the wavelength range of 400 nm≦λ. [filter-low] <1000nm, 3000nm<λ [filter-high]≦5000 nm. Such filter substrates may specifically include one or more of a mirror and an absorbing substrate. In such configurations, the detector produced may be referred to as "dark."

[0046] Instead, the wavelength range λ [filter-low] and λ [filter-high] is the wavelength range of interest, λ [roi] Thus, as an example, the wavelength range λ [フィルタ] is, for example, the wavelength range of interest λ [roi] The filter substrate may be selected based on the wavelength range detectable by the detector pixels, such as blocking only a narrow wavelength band flanking the filter substrate. By way of example, in such a configuration, the detector may be referred to as "optical", particularly depending on the wavelength range of electromagnetic radiation reaching the filter substrate, e.g., depending on the wavelength range of the light emitting element. Additional filters may be used, such as one or more of long pass filters, short pass filters, notch filters, and band pass filters. By way of example, a "dark" detector may be less susceptible to long term detection drift and optical degradation than a "bright" detector.

[0047] Step a) of the method may further comprise connecting the detector pixel to the circuit carrier by at least one bond contact (for example by at least one bond contact wire). In particular, if the detector pixel is connected to the circuit carrier via at least one bond contact, step b) may further comprise dispensing the flowable material on the circuit carrier around the bond contact such that the flowable material surrounds the bond contact. Thus, in step b), for example, the flowable material may be dispensed such that the bond contact is surrounded by the flowable material. In particular, step b) may further comprise dispensing the flowable material to be molded around the bond contact, for example around at least one bond wire, which is particularly the case when a bond wire is used to connect the detector pixel to the circuit carrier. Furthermore, if the flowable material is molded around the bond contact, the flowable material, in particular the hardened flowable material, for example the dam, may have essentially the same expansion coefficient as the bond contact, for example a similar expansion coefficient. This may make it possible to avoid damage to the bond contacts, especially due to temperature changes.

[0048] In a further aspect of the invention, a method for manufacturing at least one photodetector system having at least two photodetectors is disclosed. The method includes the following method steps, which may be performed in a given order. However, different orders may be possible. Furthermore, one, more than one or all of the method steps may be performed once or repeatedly. Furthermore, the method steps may be performed sequentially, or two or more method steps may be performed with overlapping time or in parallel. The method may further include additional method steps not listed.

[0049] The method for manufacturing at least one photodetector system comprises at least steps a) to d) of the method for manufacturing at least one photodetector system as described above or outlined in more detail below, where in step a) at least two detector pixels are provided on the same circuit carrier. Therefore, reference can be made to the above description or to the description outlined in more detail below regarding the meaning and / or possible definitions of terms relating to the method.

[0050] In particular, in the manufacturing step of the at least one photodetector system, at least one void may be present between at least two adjacent dams of the at least two detectors. Thus, in particular, the manufacturing method of the at least one photodetector system may further comprise the steps of: f) filling at least one gap between the dam of the first optical detector and the dam of the second optical detector with a filler material.

[0051] In particular, the filling material may comprise the flowable material dispensed in step b). Additionally or alternatively, the filling material may be or comprise a material that may be optimized for void filling. In particular, the filling material may be or comprise one or more of the following: an epoxy-based material, e.g. an epoxy, such as an epoxy adhesive; an acrylate-based material, e.g. an acrylate adhesive; a silicone-based material, e.g. a silicone adhesive; a hybrid adhesive.

[0052] As an example, step f) may further include filling voids between the detector dam and the filter substrate, e.g., voids that may have inadvertently and unintentionally occurred between the dam and the filter substrate. In this manner, the filling of step f) may in particular provide preventative void filling of voids that may, for example, have occurred unintentionally.

[0053] In particular, at least two, more than two or all of the method steps of both the method of manufacturing at least one detector and the method of manufacturing at least one detector system may be performed in a pick-and-place setup, such as in a pick-and-place machine. Thus, by way of example, at least steps b), c) and d) and optionally steps e) and f) of the method may in particular be performed in a pick-and-place setup, such as in a pick-and-place machine, which may also be referred to as a Surface Mount Technology (SMT) component placement system.

[0054] In a further aspect of the present invention, a predefined wavelength range of interest λ [roi] An optical detector for optically detecting electromagnetic radiation of is disclosed. The optical detector comprises at least one detector pixel, the detector pixel being disposed on a circuit carrier, the circuit carrier also being included in the optical detector. The optical detector further comprises at least one dam of at least one curing line of the fluid material, where the detector pixel is surrounded by the at least one dam, and the dam extends higher from the circuit carrier than the detector pixel. The optical detector further comprises at least one filter substrate, where at least one detector pixel on at least one side facing the circuit carrier is covered by the filter substrate, and the filter substrate is adhesively attached to the dam.

[0055] The optical detector may in particular be manufactured using the method for manufacturing an optical detector described above or the method for manufacturing an optical detector outlined in more detail below, and therefore for possible definitions of terms reference is made to the methods described above or the methods outlined in more detail below.

[0056] The flowable material, particularly the flowable material that is hardened to form the dam, may be or include, for example, one or more of an adhesive, particularly a glue, an airtight material, particularly a material that prevents the passage of gas, and a dielectric material.

[0057] The dam may specifically be or include two or more lines of cured flowable material stacked on top of each other. Thus, the dam may be or include a stack of cured lines of fluid material. Furthermore, the height of the dam extending from the circuit carrier may be adjusted according to a predefined numerical aperture of the optical detector. Specifically, if the dam includes multiple cured lines of flowable material stacked on top of each other, the number of cured lines may be adjusted to adjust the height of the dam according to the numerical aperture of the optical detector.

[0058] The circuit carrier, the at least one dam, and the at least one filter substrate may be configured to form a hermetic packaging surrounding the detector pixels. In particular, the atmosphere within the hermetic packaging formed by the circuit carrier, the dam, and the filter substrate may be an inert atmosphere, such as an atmosphere that avoids unwanted chemical reactions, such as oxidation and hydrolysis reactions. The atmosphere within the hermetically sealed package may thus be or include a noble gas atmosphere, such as an argon and / or nitrogen gas atmosphere. In particular, the inert atmosphere within the hermetic packaging formed by the circuit carrier, the dam, and the filter substrate may include a low level and / or low concentration of oxygen. By way of example, the oxygen concentration within the hermetic packaging may be ≦18 vol.-%, preferably ≦15 vol.-%, more preferably ≦10 vol.-%, or most preferably ≦5 vol.-%.

[0059] Furthermore, the inert atmosphere within the sealed packaging formed by the circuit carrier, the dam and the filter substrate may contain a low level and / or low concentration of moisture and / or humidity. In particular, the humidity within the sealed packaging may be ≦5 vol.-%, preferably ≦3 vol.-%, or more preferably ≦1 vol.-%. Additionally or alternatively, the atmosphere within the sealed packaging formed by the circuit carrier, the dam and the filter substrate may be a vacuum atmosphere.

[0060] The photodetector may further include at least one spacer element for ensuring a predefined gap between the detector pixel and the filter substrate. In particular, the spacer element may be disposed in the dam and may be present in and / or near the gap, e.g., next to the detector pixel. As an example, the spacer element may be or include glass and / or plastic beads having a diameter d, where 50 μm≦d≦250 μm.

[0061] The optical detector dam is specifically designed for the wavelength range of interest λ [roi] Within or equal to the wavelength range λ [dam] In particular, the dam may be configured to essentially block the transmission of electromagnetic radiation in the NIR and VIS ranges, such as the wavelength range of 400 nm to 2500 nm. Thus, by way of example, the flowable material that is cured to become and / or form the dam may be configured to essentially block the transmission of electromagnetic radiation in the VIS and NIR ranges. However, in the wavelength range of interest λ [roi] In particular, the wavelength range of interest may be or include at least one range between 200 nm and 1 mm. Thus, 200 nm≦λ [roi] ≦1mm, specifically 350nm≦λ [roi] ≦5000 nm, more particularly 1000 nm≦λ [roi] ≦3000 nm. In particular, the dam may be a multi-functional element. By way of example, the dam may function as a stray light blocker, such as by essentially blocking electromagnetic radiation from being transmitted and / or passing through the dam. Additionally, the dam may function as a filter holder and spacer, which can hold a filter substrate in a predefined and / or controlled orientation on the dam and at a predefined and / or controlled distance relative to the detector pixels.

[0062] The filter substrate of the photodetector may in particular be or may include one or more of a filter slide, a filter sheet, and a filter layer. In particular, the filter substrate may have a flat and / or planar basic shape and may further have a shape and / or form similar to the contour of the dam or at least the contour of the dam. In particular, the filter substrate may be a flat filter slide or layer that is cut into the shape of a square, rectangle, circle or ellipse, for example according to the contour of the dam.

[0063] Furthermore, the filter substrate is particularly suitable for the wavelength range of interest λ [roi] and transmits electromagnetic radiation in the wavelength range of interest λ [roi] At least one wavelength range λ having at least one wavelength λ1 outside [filter] The filter substrate may be adapted to at least partially block the transmission of electromagnetic radiation from the optical fiber. In particular, the filter substrate may be or include at least one interference filter. Thus, by way of example, the filter substrate may be or include one or more of a long pass filter, a short pass filter, and a band pass filter.

[0064] The detector pixels of the photodetector may be connected to the circuit carrier, in particular via at least one bond contact, in particular via at least one bond wire. In particular, if the detector pixels are connected to the circuit carrier via at least one bond wire, a dam may be molded around the at least one bond contact, for example the bond wire. For example, a dam molded around the bond contact may be able to seal and / or bypass the bond contact. Furthermore, in case of a dam molded around the bond contact, the hardened flowable material of the dam may have a similar coefficient of expansion as the bond contact. This may particularly increase the temperature robustness of the optical detector, since damage to the bond contact due to temperature changes may be avoided. Furthermore, the robustness of the optical detector against mechanical stress may be increased, since a dam molded around the bond contact may further stabilize the bond contact and thus provide extra protection against mechanical strain.

[0065] In a further aspect of the invention, a photodetector system is disclosed. The photodetector system comprises at least two photodetectors, where the at least two photodetectors share at least one circuit carrier. The photodetector system thus comprises at least two detector pixels, where the detector pixels are arranged on one common and / or shared circuit carrier, where the circuit carrier is also included by the photodetector system. For possible definitions of terms, reference is made to the photodetectors mentioned above or to the photodetectors outlined in more detail below.

[0066] In the photodetector system, at least one void between at least two adjacent dams of at least two detectors may be filled with a filling material. Thus, in the photodetector system, at least one void between a dam of a first photodetector and a dam of a second photodetector may be filled with a filling material. The filling material may specifically be or at least partially include at least one flowable material that is cured to form a dam. Additionally or alternatively, the filling material may be or include a material optimized for void filling. In particular, the filling material may be or include one or more of an epoxy-based material, e.g., an epoxy, such as an epoxy-based glue; an acrylate-based material, e.g., an acrylate-based glue; a silicone-based material, e.g., a silicone-based glue; and a hybrid glue.

[0067] In a further aspect of the invention, a spectroscopic sensing application is disclosed, comprising at least one optical detector system as described above or as outlined in more detail below, and therefore for possible definitions of terms reference is made to the optical detector system as described above or as outlined in more detail below.

[0068] The method and the device according to the invention may offer a number of advantages compared to known methods and devices for optical detection of electromagnetic radiation. In particular, the invention may therefore offer a high degree of integration, a low technological effort for manufacturing and assembly, and may be very cost-effective even for large-scale production. In particular, due to at least two, more than two, or even all of the method steps of both the method for manufacturing at least one detector and the method for manufacturing at least one detector system being able to be performed in a pick-and-place setup, the method may in particular enable a very cost-effective production, furthermore be highly integrated into existing manufacturing processes and require particularly low effort to implement. In particular, the method and the device according to the invention may be scalable for mass production and provide high flexibility without requiring high modification efforts.

[0069] Furthermore, the method and the device according to the invention may strongly and effectively reduce crosstalk and thus avoid the negative effects due to crosstalk. In particular, crosstalk may be avoided. Furthermore, the method and the device according to the invention avoids and / or prevents stray light and / or diffracted light from interacting with the detector pixels without passing through the filter substrate. As an example, possible stray light may be strongly minimized in the detector system by filling gaps between detectors, for example gaps between dams and / or filter substrates, for example gaps between two dams and / or between at least one side edge of the filter substrate and the dam. The method and the device according to the invention may in particular make it possible to suppress most or all of the undesired electromagnetic radiation and thus avoid or at least reduce distorted measurements due to crosstalk.

[0070] Furthermore, the method and device according to the invention may be able to withstand higher mechanical stresses than known methods and devices. In particular, if spacer elements are used to ensure a predefined gap between the detector pixel and the filter substrate, the spacer elements may further protect the bond contacts, e.g., bond wires, from mechanical stresses, and thus may particularly increase the robustness of the photodetector with respect to mechanical stresses. In particular, if the detector pixel is electrically connected to a circuit carrier, e.g., the rest of the system, via bond-con contacts, the bond contacts may require a certain radius for bending, such that it is difficult to directly assemble the filter substrate to the detector pixel. However, by employing spacer elements such as glass beads and / or plastic beads, a predefined minimum gap may be ensured between the filter substrate and the detector pixel, which may further protect the bond wires from breaking.

[0071] Moreover, in particular by adjusting the height of the dam depending on the predefined numerical aperture of the photodetector, the spectral resolution of the detector may be increased compared to known detectors. In particular, the increase in the spectral resolution of the detector by adjusting the height of the dam may be attributed to the fact that filters, such as optical filters based on interference effects, e.g. filter substrates, may exhibit a wavelength shift depending on the angle of incidence of electromagnetic radiation. As an example, such filters may transmit a shifted wavelength rather than a specific wavelength, e.g. a characteristic wavelength that they are designed to transmit, depending on the angle of incidence of electromagnetic radiation. Thus, if a high numerical aperture may be selected, e.g. if the distance between the filter and the detection pixel is very small, not only the desired wavelength but also further wavelengths may pass through the optical filter and then reach the detection pixel. This may in particular result in a decrease in the spectral resolution of the optical detector and / or the optical detector system. However, by adjusting the height of the dam, this effect may be at least partially suppressed, thus resulting in a smaller decrease in the spectral resolution or even allowing a higher spectral resolution than is typically present in known detectors.

[0072] Furthermore, the proposed method and apparatus may require less space compared to known methods and apparatus, allowing for significant cost savings. In particular, the proposed photodetector may be cooled, for example for improved performance, by simply placing the detector on a cooling system, for example a thermoelectric cooler, such as a thermoelectric cooler based on the Peltier effect. In this way, using the proposed method and apparatus, it may be possible to forego the need for a metal TO housing with an integrated cooling system, as is common in known methods and apparatus, for example to prevent icing of detector pixels due to humidity.

[0073] In summary, without excluding further possible embodiments, the following embodiments may be envisaged:

[0074] Embodiment 1: Predefined range of interest λ [roi] 1. A method for manufacturing at least one optical detector for optically detecting electromagnetic radiation in a substrate, the method comprising the steps of: a) providing at least one detector pixel on a circuit carrier; b) applying at least one fluid material in at least one line on the circuit carrier, such that the line of fluid material surrounds at least one detector pixel, in particular exactly one detector pixel, and such that the at least one line of fluid material extends higher from the circuit carrier than the detector pixel, c) at least partially hardening, in particular curing, the at least one line of fluid material such that the at least one line forms a dam surrounding at least one detector pixel, in particular exactly one detector pixel; and d) depositing at least one filter substrate on the at least one dam such that the filter substrate is adhesively attached to the dam and covers at least one detector pixel on at least one side facing the circuit carrier; The method includes:

[0075] Embodiment 2: 2. The method of claim 1, wherein the flowable material applied in step b) is one or more of an adhesive, particularly a glue, a sealing material, particularly a material that prevents gas flow, and a dielectric material.

[0076] Embodiment 3: 3. The method according to embodiment 1 or 2, wherein step b) comprises, for example then, dispensing two or more lines so as to overlap each other, in particular resulting in a stack of lines.

[0077] Embodiment 4: 4. The method according to any one of the preceding claims, further comprising, in step b), adjusting the height of the dam extending from the circuit carrier according to a predefined numerical aperture of the photodetector by placing an appropriate number of lines on top of each other.

[0078] Embodiment 5: 5. The method according to any one of the preceding claims, wherein at least step d) is performed in an inert atmosphere, in particular in a glove box, such as a nitrogen glove box, and wherein the circuit carrier, the at least one dam and the at least one filter substrate form a hermetically sealed packaging, the hermetically sealed packaging enclosing the detector pixels.

[0079] Embodiment 6: The method according to any one of the preceding embodiments, wherein the inert atmosphere has an oxygen concentration of ≦18 vol.-%, preferably ≦15 vol.-%, more preferably ≦10 vol.-%, most preferably ≦5 vol.-%.

[0080] Embodiment 7: The method according to any one of the two previous embodiments, wherein the humidity in the inert atmosphere is ≦5 vol.-%, preferably ≦3 vol.-%, more preferably ≦1 vol.-%.

[0081] Embodiment 8: 8. The method according to any one of the preceding embodiments, wherein at least step d) is carried out in a vacuum atmosphere.

[0082] Embodiment 9: Further steps: a) depositing at least one spacer element in the dam to ensure a predetermined gap between the detector pixel and the filter substrate; The method according to any one of embodiments 1 to 8, comprising:

[0083] Embodiment 10: 10. The method according to any one of the preceding claims, wherein the spacer elements deposited in step e) are glass and / or plastic beads having a diameter d, where 50 μm≦d≦250 μm.

[0084] Embodiment 11: The dam is a wavelength range of interest, λ [roi] Within or equal to the wavelength range λ [dam] 11. The method according to any one of the preceding embodiments, wherein the substrate is adapted to essentially block the transmission of electromagnetic radiation.

[0085] Embodiment 12: 200nm≦λ [roi] ≦1mm, specifically 350nm≦λ [roi] ≦5000 nm, more particularly 1000 nm≦λ [roi] 12. The method of any one of the preceding embodiments, wherein the thickness of the first to second optical fibers is ≦3000 nm.

[0086] Embodiment 13: 13. The method according to any one of the preceding claims, wherein the filter substrate deposited in step d) is one or more of a filter slide, a filter sheet, and a filter layer, and the filter substrate further has the form and / or shape of the contour of the dam, or at least has a form and / or shape similar to the contour of the dam.

[0087] Embodiment 14: The filter substrate deposited in step d) is [roi] and in the wavelength range of interest λ [roi] At least one wavelength range λ having at least one wavelength λ1 outside [フィルタ]の 14. The method according to any one of the preceding embodiments, wherein the barrier layer is adapted to at least partially block the penetration of electromagnetic radiation or has a form and / or shape at least similar to the outline of a dam.

[0088] Embodiment 15: 15. The method according to any one of the preceding claims, wherein the filter substrate deposited in step d) is or comprises at least one interference filter, in particular one or more of a long pass filter, a short pass filter, a notch filter and a band pass filter.

[0089] Embodiment 16: A method according to any one of embodiments 1 to 15, wherein step a) further comprises connecting the detector pixel to the circuit carrier by at least one bond contact, in particular by at least one bond contact wire, and step b) further comprises dispensing a fluid material onto the circuit carrier around the bond contact such that the fluid material surrounds the bond contact.

[0090] Embodiment 17: 1. A method for manufacturing at least one photodetector system having at least two photodetectors, comprising: A method comprising the steps of the method for manufacturing at least one optical detector described in any one of embodiments 1 to 16, and wherein in step a) at least two detector pixels are provided on the same circuit carrier.

[0091] Embodiment 18: Additionally, the following steps: f) filling at least one gap between the dam of the first photodetector and the dam of the second photodetector with a filler material; 18. The method of embodiment 17, comprising:

[0092] Embodiment 19: 20. The method of claim 18, wherein the filler material comprises one or more of the flowable material dispensed in step b); an epoxy-based material, e.g. an epoxy, such as an epoxy glue; an acrylate-based material, e.g. an acrylate, such as an acrylate glue; a silicone-based material, e.g. a silicone glue; or a hybrid adhesive.

[0093] Embodiment 20: Predefined wavelength range of interest λ [roi] 1. An optical detector for optically detecting electromagnetic radiation of a wavelength of 1000 nm, the optical detector comprising: at least one detector pixel arranged on a circuit carrier; at least one dam in at least one hardening line of the fluid material, the detector pixel being surrounded by the at least one dam, the dam extending higher from the circuit carrier than the detector pixel; at least one filter substrate, at least one detector pixel on at least one side facing the circuit carrier is covered by the filter substrate, and the filter substrate is adhesively attached to the dam, an optical detector comprising:

[0094] Embodiment 21: An optical detector as described in embodiment 20, wherein the fluid material, particularly the fluid material hardened to form the dam, is one or more of an adhesive, particularly a glue, an airtight material, particularly a material that prevents the passage of gas, and a dielectric material.

[0095] Embodiment 22: The photodetector of any one of the previous embodiments referring to a photodetector, wherein the dam is or includes two or more curing lines, e.g., a stack of curing lines, stacked on top of each other.

[0096] Embodiment 23: An optical detector as described in any one of the previous embodiments referring to an optical detector, wherein the height of the dam extending from the circuit carrier, in particular the multiple overlapping hardening lines, is adjusted according to a predefined numerical aperture of the optical detector.

[0097] Embodiment 24: The photodetector of any one of the above embodiments referring to a photodetector, wherein the circuit carrier, the at least one dam and the at least one filter substrate form a hermetically sealed package surrounding the detector pixel.

[0098] Embodiment 25: 25. A photodetector according to embodiment 24, wherein the oxygen concentration within the hermetic packaging is ≦18 vol.-%, preferably ≦15 vol.-%, more preferably ≦10 vol.-%, and most preferably ≦5 vol.-%.

[0099] Embodiment 26: A photodetector according to any one of the two previous embodiments, wherein the humidity within the sealed packaging is ≦5 vol.-%, preferably ≦3 vol.-%, more preferably ≦1 vol.-%.

[0100] Embodiment 27: 13. A photodetector according to any one of the previous three embodiments, wherein a vacuum atmosphere is present within the hermetic packaging.

[0101] Embodiment 28: The photodetector of any one of the above embodiments referring to a photodetector, wherein the photodetector further comprises at least one spacer element for ensuring a predefined gap between the detector pixel and the filter substrate.

[0102] Embodiment 29: 29. The photodetector of embodiment 28, wherein the spacer elements are glass and / or plastic beads having a diameter d of 50 μm≦d≦250 μm.

[0103] Embodiment 30: The dam is a wavelength range of interest, λ [roi] Within or equal to the wavelength range λ [dam] 4. The optical detector of any one of the preceding embodiments referring to an optical detector adapted to essentially block the transmission of electromagnetic radiation of

[0104] Embodiment 31: 200nm≦λ [roi] ≦1mm, specifically 350nm≦λ [roi] ≦5000 nm, more particularly 1000 nm≦λ [roi] 3. The photodetector of any one of the preceding embodiments referring to a photodetector, wherein the photodetector is ≦3000 nm.

[0105] Embodiment 32: The photodetector of any one of the above embodiments referring to a photodetector, wherein the filter substrate is one or more of a filter slide, a filter sheet, and a filter layer, and the filter substrate further has a shape and / or form that is the same as or at least similar to the outline of the dam.

[0106] Embodiment 33: The filter substrate is a material having a wavelength range of interest, λ [roi] transmits electromagnetic radiation in the wavelength range of interest, λ [roi] At least one wavelength range λ having at least one wavelength λ1 outside [filter] 13. The photodetector of any one of the preceding embodiments, wherein the photodetector is adapted to at least partially block the transmission of electromagnetic radiation of.

[0107] Embodiment 34: The photodetector according to any one of the previous embodiments referring to a photodetector, wherein the filter substrate is or includes at least one interference filter, in particular one or more of a long pass filter, a short pass filter, and a band pass filter.

[0108] Embodiment 35: The photodetector of any one of the preceding embodiments referring to a photodetector, wherein the detector pixel is connected to the circuit carrier via at least one bond contact, particularly via at least one bond wire, and a dam is molded around the at least one bond contact.

[0109] Embodiment 36: 36. A photodetector as described in embodiment 35, wherein the hardened fluid material has essentially the same coefficient of expansion as at least one bond contact, particularly a bond-con contact wire.

[0110] Embodiment 37: 13. A photodetector system comprising at least two photodetectors as in any one of the preceding embodiments referring to a photodetector, wherein the at least two photodetectors share at least one circuit carrier.

[0111] Embodiment 38: 38. The photodetector system of embodiment 37, wherein at least one void between the dam of the first photodetector and the dam of the second photodetector is filled with a filling material.

[0112] Embodiment 39: The optical detector system of embodiment 38, wherein the filling material comprises one or more of a flowable material; an epoxy-based material, e.g. an epoxy such as an epoxy adhesive; an acrylate-based material, e.g. an acrylate such as an acrylate adhesive; a silicone-based material, e.g. a silicone such as a silicone adhesive; a hybrid adhesive epoxy, acrylate, silicone or a hybrid adhesive.

[0113] Embodiment 40: A spectroscopic sensing application comprising at least one photodetector system as in any one of the preceding embodiments referring to a photodetector system. [Brief description of the drawings]

[0114] Further optional features and embodiments are disclosed in more detail in the description of the following embodiments, preferably in conjunction with the dependent claims, where each optional feature may be realized in an isolated manner as well as in any possible combination as understood by a person skilled in the art. The scope of the present invention is not limited by the preferred embodiments. The embodiments are illustrated diagrammatically in the figures, where the same reference numbers in these figures refer to the same or functionally equivalent elements. [Figure 1] FIG. 1 illustrates in perspective one embodiment of a photodetector. [Diagram 2] FIG. 2 is a cutaway top plan view of one embodiment of a light detection system. [Diagram 3] FIG. 3 shows different flow charts of a method for manufacturing a photodetector and a method for manufacturing a photodetector system. [Figure 4] FIG. 4 shows different flow charts of the method for manufacturing a photodetector and a method for manufacturing a photodetector system. [Diagram 5] FIG. 5 illustrates different manufacturing stages of one embodiment of a light detection system. [Figure 6] FIG. 6 illustrates different manufacturing stages of one embodiment of a light detection system. [Figure 7] FIG. 7 shows a transmission grade diagram of different fluid materials.

[0115] Detailed Description of the Preferred Embodiments Figure 1 shows the predefined wavelength range of interest, λ [roi]1 shows an embodiment of an optical detector 110 for optically detecting electromagnetic radiation, the optical detector 110 including at least one detector pixel 112 disposed on a circuit carrier 114, at least one dam 116 of a hardened flowable material, and at least one filter substrate 118 adhesively secured to the dam 116. As shown, the dam 116 extends higher from the circuit carrier 114 than the detector pixels 112, and the detector pixels 112 are covered by the filter substrate 118 on the side opposite the circuit carrier 114. Here, in FIG. 1, for ease of illustration, the outlines of the dam 116 and the detector pixels 112 covered by the filter substrate 118 are shown as dashed lines.

[0116] The circuit carrier 114, the dam 116 and the filter substrate 118 may in particular form a hermetically sealed package surrounding the detector pixels 112. The atmosphere within the hermetically sealed packaging may therefore be different from the atmosphere surrounding the photodetector. The atmosphere within the hermetically sealed packaging may, by way of example, be an inert atmosphere that allows for avoiding undesirable chemical reactions, such as oxidation and / or hydrolysis reactions, of the detector pixels 112 within the hermetically sealed package.

[0117] 2 illustrates an embodiment of a photodetector system 120 in a cutaway view, with the filter substrate 118 not shown for purposes of illustration. The photodetector system 120 includes multiple photodetectors 110, which share at least one circuit carrier 114. Thus, the photodetector system 120 may include multiple detector pixels 112 disposed on a single circuit carrier 114. Each of the detector pixels 112 is surrounded by a dam 116, and thus the photodetector system 120 may include one dam 116 for each detector pixel 112. Additionally, the dam 116 extends higher from the circuit carrier 114 than the detector pixels 112.

[0118] The dams 116 may be interconnected like a network and / or a grid. In particular, lines of the hardened fluid material 122 may be connected to form the dams 116. Such interconnected dams 116 may save space on the circuit carrier 114, for example. In particular, this is because one line of the fluid material 122 forming the dam 116 may be part of two adjacent dams 116. As an example, a line width and / or thickness of 500 μm plus or minus 10 μm may be possible. As shown in particular in FIG. 2, the dams 116 may form a grid shape, and the spacing, such as the distances d1 and d2 between the lines of the fluid material 122 forming the grid of the dams 116, may be adjusted according to the distance and / or spacing between the detector pixels 112.

[0119] 3 and 4 show different flow charts of a method for manufacturing a photodetector system (method indicated with reference numeral 124) and a method for manufacturing a photodetector (method indicated with reference numeral 126). [roi] A method 126 for manufacturing a photodetector 112 configured to optically detect electromagnetic radiation at comprises at least the following steps: a) providing at least one detector pixel on a circuit carrier (indicated with reference numeral 128); b) dispensing at least one flowable material into at least one line 122 on the circuit carrier 114 (denoted by reference numeral 130), such that the line 122 of flowable material surrounds at least one detector pixel 112 and such that the at least one line 122 of flowable material extends higher from the circuit carrier 114 than the detector pixel 112; c) at least partially hardening the at least one line 122 of fluid material such that the at least one line 122 forms a dam 116 surrounding at least one detector pixel 112 (denoted by reference numeral 132); and d) depositing at least one filter substrate 118 on at least one dam 116 (indicated by reference numeral 134) such that the filter substrate 118 is adhesively attached to the dam 116 and covers at least one detector pixel 112 on at least one side facing the circuit carrier 114.

[0120] When performing the method 126 of manufacturing the photodetector 112, steps a) 128 through d) 134 may be performed in the particular order given, and one or more of the method steps, such as steps b) 130 and c) 132 and steps c) 132 and d) 134, may overlap in time, e.g., be performed at least partially simultaneously.

[0121] Additionally, and as exemplarily shown in FIG. 4, the method 126 for manufacturing the photodetector 112 may further include the steps of: e) depositing at least one spacer element (indicated by reference numeral 136 ) within the dam 116 to ensure a predetermined gap between the detector pixel 112 and the filter substrate 118 .

[0122] Predefined range of interest λ [roi] The method 126 for manufacturing an optical detector system 120 configured for optically detecting electromagnetic radiation of comprises at least steps a) 128 to d) 134 of the method 126 for manufacturing an optical detector 112, where in step a) 128 at least two detector pixels 112 are provided on the same circuit carrier 114. In the method 126 for manufacturing an optical detector system 120, two or more dams 116 are thus created and two or more filter substrates 118 are deposited, which corresponds in particular to the number of detector pixels 112 provided on the circuit carrier 114. In the method 124 for manufacturing an optical detector system 120, steps b) 130 and d) 134 may thus be performed two or more times, the number of repetitions corresponding, for example, to the number of detector pixels 112 provided on the circuit carrier 114. In Fig. 3 and Fig. 4, such repetition of steps is exemplarily indicated by arrows and boxes arranged on the right side of the figures.

[0123] Furthermore, the method 124 of manufacturing the photodetector system 120 may further include the steps: f) filling at least one gap 140 between the dam 116 of the first photodetector 142 and the dam 116 of the second photodetector 144 (denoted by reference numeral 138) with a filler material.

[0124] In particular, during manufacturing of the photodetector system, a void 140 may be present between at least two adjacent dams 116 of a first photodetector 142 and a second photodetector 144, where the void 128 may be filled with a filling material in step f) 138.

[0125] 5 and 6 show different manufacturing states of an embodiment of a photodetector system 120. In particular, FIG. 5 shows an embodiment of a photodetector system 120 where at least steps a) 128 and b) 130 have been performed. In this state, the photodetector system 120 may in particular include a plurality of detector pixels 112 on one shared circuit carrier 114. Surrounding each detector pixel 112 is a line of dispensed fluid material 122, which is cured in step c) 132 to form a dam 116. In particular, the shape of the line of fluid material 122, and thus the shape of the dam 116, may vary and be different for each detector pixel 112 on the circuit carrier 114. Thus, as exemplarily shown in FIG. 5, the form and / or shape of the first dam 146 may be different from the form and / or shape of the second dam 148. In particular, one dam 116, e.g., the first dam 146, may form an isolated enclosure around the detector pixel 112, where another dam, e.g., the second dam 148, may be connected to one or more adjacent dams 116, e.g., as part of a grid of dams 116. In particular, the first dam 146 and the second dam 148 may differ in one or more of shape, spacing, and height. As exemplarily shown in FIG. 5, a gap 140 may be present in particular between the first photodetector 142 and the second photodetector 144 during the manufacturing of the photodetector system 120. In particular, as an example, the gap 140 may be present between the first dam 146 and the second dam 148. In FIG. 6, an embodiment of the photodetector system 120 is shown in which at least steps a) 128, b) 130, c) 132, and d) 134 have been performed. In particular, in this embodiment of the optical detector system 120 , a filter substrate 118 is deposited and adhesively mounted on the dam 116 .

[0126] In Fig. 7, a transmission grade diagram of different fluid materials is shown. In particular, this diagram shows the transmission grade of different fluid materials depending on the wavelength of electromagnetic radiation. The transmission grade is shown in transmittance [%] on the vertical axis (y-axis), with 0% meaning no transmission of electromagnetic radiation and 100% meaning complete transmission, e.g. no blocking of any electromagnetic radiation. Furthermore, the wavelength of electromagnetic radiation is shown in nanometers [nm] on the horizontal axis (x-axis). As exemplarily shown by a first set of data 154 in the diagram, a low transmission grade, in particular less than 2%, may be possible for an epoxy-based flowable material further comprising methanol over the entire illustrated wavelength range of electromagnetic radiation. An even lower transmission grade, in particular less than 7%, may be achieved over the entire illustrated wavelength range of electromagnetic radiation by a silane-modified polymer-based flowable material comprising methanol, as exemplarily shown by a second set of data 156 in the diagram. Further, a transmission rating of less than 10% over the entire illustrated range of electromagnetic radiation may be achieved by a methanol-free epoxy-based flowable material, and over a broad range of electromagnetic radiation by a methanol-free silane-modified polymer-based flowable material, as exemplarily shown by the third datum 158 and the fourth datum 160 in the figure. Finally, a transmission rating of still less than 30% over the entire illustrated range of electromagnetic radiation may be achieved by a flowable material including a curable polymer, as exemplarily shown by the fifth datum 162.

[0127] [Table 1]

Claims

1. Predefined region of interest λ [roi] A method (126) for manufacturing at least one optical detector (110) for optically detecting electromagnetic radiation in, the method comprising the following steps: a) providing at least one detector pixel (112) on a circuit carrier (114); b) applying at least one fluid material to at least one line (122) on the circuit carrier (114), such that the line (122) of the fluid material surrounds at least one detector pixel (112) and at least one line (122) of the fluid material extends higher from the circuit carrier (114) than the detector pixel (112); c) at least partially curing at least one line (122) of the fluid material such that the at least one line forms a dam (116) surrounding the at least one detector pixel (112); and d) depositing at least one filter substrate (118) on the at least one dam (116), such that the filter substrate (118) adheres to and is attached to the dam (116) and covers the at least one detector pixel (112) on at least one side facing the circuit carrier (114); comprising, wherein the method (126) further comprises, in step b), adjusting the height of the dam (116) extending from the circuit carrier (114) according to a predefined numerical aperture of the photodetector (110) by arranging an appropriate number of lines (122) overlapping each other. A method (126) characterized by this.

2. The method (126) according to claim 1, characterized in that the fluid material applied in step b) is one or more of an adhesive, a hermetic material, and a dielectric material.

3. The method (126) according to claim 1 or 2, characterized in that at least step d) is performed in an inert atmosphere, wherein a packaging sealed by the circuit carrier (114), the at least one dam (116), and the at least one filter substrate (118) is formed, and the sealed packaging surrounds the detector pixel (112).

4. The method (126) further comprises e) depositing at least one spacer element in the dam (116) to ensure a predefined gap between the detector pixel (112) and the filter substrate (118). The method (126) according to claim 1 or 2, characterized by this.

5. A method (124) for manufacturing at least one photodetector system (120) having at least two photodetectors (110), comprising steps of a method (126) for manufacturing at least one photodetector (110) according to claim 1 or 2, and characterized in that, in step a), at least two detector pixels (112) are provided on the same circuit carrier, a method (124). **Claim 6** further comprising the following steps: f) filling at least one gap (140) between the dam (116) of the first photodetector (142) and the dam (116) of the second photodetector (144) with a filling material; The method according to claim 5, characterized by comprising this. **Claim 7** Predefined wavelength range of interest λ [roi] An optical detector (110) for optically detecting electromagnetic radiation in, the optical detector (120) having the following configuration: - at least one detector pixel (112) disposed on a circuit carrier (114); - at least one dam (116) of at least one cured line (122) of a fluid material, wherein the detector pixel (112) is surrounded by at least one dam (116), and the dam (116) extends higher from the circuit carrier (114) than the detector pixel (112), and the height of the dam (116) extending from the circuit carrier (114) is adjusted according to a predefined numerical aperture of the photodetector (110), at least one dam (116); - at least one filter substrate (118), wherein at least one detector pixel (112) on at least one side facing the circuit carrier (114) is covered by the filter substrate (118), and the filter substrate (118) is adhesively attached to the dam (116), at least one filter substrate (118); An optical detector (110), characterized by comprising this. **Claim 8** The photodetector (110) according to claim 7, wherein the fluid material is one or more of an adhesive, an airtight material, and a dielectric material. **Claim 9** The photodetector (110) according to claim 7 or 8, characterized in that the circuit carrier (114), the at least one dam (116), and the at least one filter substrate (118) form a hermetic packaging surrounding the detector pixel (112). **Claim 10** The photodetector (110) according to claim 7 or 8, further comprising at least one spacer element for ensuring a predefined gap between the detector pixel (112) and the filter substrate (118). **Claim 11** The photodetector system (120) according to claim 7 referring to the photodetector (110), comprising at least two photodetectors (110), characterized in that at least two photodetectors (110) share at least one circuit carrier (114).

12. The photodetector system (120) according to claim 11, characterized in that at least one gap (140) between the dam (116) of the first photodetector (142) and the dam (116) of the second photodetector (144) is filled with a filling material.

13. A spectroscopic sensing application, characterized by comprising at least one optical detector system (120) according to claim 11 or 12.

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