Secure ventilation with protected flexible sensors

Abstract

The tamper detection system can include an organic material and a tamper detection circuit embedded in the organic material. A portion of the organic material is ablated to form a cut in the organic material. A portion of the tamper detection circuit interrupts a fragment of the ablation path. The tamper detection circuit remains intact. The cut allows gas flow between a first side of the organic material and a second side of the organic material.

Description

[Technical field]

[0001] The present invention relates to secure enclosures, and more particularly to secure enclosures requiring ventilation. [Background technology]

[0002] Secure enclosures can be used to protect contents such as data or machinery or both. Some secure enclosures require ventilation to allow pressure relief from inside the secure enclosure. Pressure inside the secure enclosure can result in false tamper detections that can cause unnecessary downtime of associated systems. Due to various constraints of secure module systems, such as physical and mechanical constraints, it can be difficult to include ventilation in the secure module enclosure while still maintaining the security of the enclosure. Summary of the Invention

[0003] Embodiments of the present disclosure include systems, methods, and computer program products for tamper detection. The tamper detection system may include an organic material and a tamper detection circuit embedded in the organic material. A portion of the organic material is ablated to form a cut in the organic material. A portion of the tamper detection circuit interrupts a fragment of the ablation path. The tamper detection circuit remains intact. The cut allows gas flow between a first side of the organic material and a second side of the organic material.

[0004] The above summary is not intended to describe each illustrated embodiment or every implementation of the present disclosure.

[0005] The drawings included in this application are incorporated in and constitute a part of this specification. They illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure. The drawings are merely illustrative of particular embodiments and are not intended to limit the disclosure. [Brief description of the drawings]

[0006] [Figure 1] 1 illustrates a secure ventilation system according to some embodiments of the present disclosure. [Diagram 2] 1 illustrates a material having a secure ventilation mechanism according to some embodiments of the present disclosure. [Diagram 3] 1 illustrates a material undergoing a secure ventilation process according to some embodiments of the present disclosure. [Figure 4] 1 illustrates a material with secure ventilation, according to some embodiments of the present disclosure. [Diagram 5] 1 illustrates a material with secure ventilation, according to some embodiments of the present disclosure. [Figure 6] 1 shows a schematic diagram of a material with secure ventilation according to some embodiments of the present disclosure. [Figure 7] 1 illustrates a system utilizing materials with secure ventilation, according to some embodiments of the present disclosure. [Figure 8] 1 shows a schematic diagram of a material with secure ventilation according to some embodiments of the present disclosure. [Figure 9] 1 illustrates a system utilizing materials with secure ventilation, according to some embodiments of the present disclosure. [Figure 10] FIG. 1 illustrates a high-level block diagram of an exemplary computer system that may be used to implement one or more of the methods, tools, and modules and related functions according to some embodiments of the present disclosure.

[0007] While the invention is amenable to various modifications and alternative forms, specific aspects thereof have been shown by way of example in the drawings and will be described in detail. It is to be understood, however, that there is no intention to limit the invention to the particular embodiments described. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the scope of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Aspects of the present disclosure relate to secure enclosures, and more particularly, to secure enclosures that require ventilation.

[0009] Secure enclosures are used to protect the contents within the enclosure. Some secure enclosures require a mechanism to relieve pressure that can build up within the secure enclosure, which can result in false tamper detection unless effectively relieved. Constraints can make it difficult to ventilate the secure enclosure while maintaining the tamper-detecting and / or tamper-resistant capabilities of the enclosure.

[0010] The present disclosure includes a tamper detection circuit embedded in an organic material that ablates a portion of the organic material to create a passageway from one side of the material to the other side of the enclosure while allowing ventilation while maintaining the tamper detection circuitry. A tamper detection system according to the present disclosure can include an organic material and a tamper detection circuit embedded in the organic material. A portion of the organic material is ablated to form a cut in the organic material. A portion of the tamper detection circuit interrupts a fragment of the ablation path. The tamper detection circuit remains intact, and the cut allows a flow of gaseous material between a first side of the organic material and a second side of the organic material.

[0011] The present disclosure includes a method for manufacturing a tamper detection system. The method can include obtaining a tamper detection circuit embedded in an organic material and ablating a portion of the organic material to form a notch. Ablating the notch can remove the organic material in the ablation path. A portion of the tamper detection circuit can obstruct a portion of the ablation path. The tamper detection circuit remains intact and the notch allows gas flow between a first side of the organic material and a second side of the organic material.

[0012] 1 illustrates a secure ventilation system 100, according to some embodiments of the present disclosure. A top view 100a and a side view 100b of the secure ventilation system 100 are provided.

[0013] The secure ventilation system 100 includes an organic substrate 112, an inorganic tamper detection circuit 114, and an opening 116. The organic substrate 112 may be any organic material, with the tamper detection circuit 114 suspended therein. The tamper detection circuit 114 may be any metal capable of conducting an electrical impulse such that a tamper can be identified. The organic substrate 112 may include, for example, a polyimide substrate. The tamper detection circuit may include, for example, copper.

[0014] The openings 116 allow for ventilation of the system to permit fluid flow between the first and second sides of the system 100. The openings 116 are formed through the organic substrate 112, leaving the tamper detection circuitry 114 intact. The openings 116 can be formed by any means that allows for ablation of the organic material without compromising the electrical integrity of the tamper detection circuitry, such that an incision can be made to fluidly connect one side of the system 100 to the other side of the system 100.

[0015] Methods that may be used to form the openings 116 may include, for example, laser ablation or chemical ablation or both. Laser ablation may be used by tuning a laser to ablate the particular organic material used in the organic substrate 112 while not interfering with the tamper detection circuitry 114. Chemical ablation may similarly be used by applying a chemical suitable for ablating the organic material to the substrate to form the desired openings 116.

[0016] In some embodiments, laser ablation may be preferred because the exact result is easier to control with a laser. For example, in some embodiments, an angle of the opening (rather than directly perpendicular) may be preferred, and the laser may allow for precise angle adjustment. Additionally, the use of a laser may allow for a shadowing effect such that the substrate behind portions of the tamper detection circuitry 114 is protected from ablation, which in some cases may help prevent shorting out the tamper detection circuitry 114.

[0017] 2 illustrates a material 200 having a secure ventilation mechanism, according to some embodiments of the present disclosure. The material 200 is shown in a first environment 202, a second environment 204, and a third environment 206. In each environment, side schematic views 222a, 224a, 226a are shown, as well as top views 222b, 224b, 226b.

[0018] In the first environment 202, the light source 212 is applied to the top of the material 200, as shown in side view 222a. The top view 222b illustrates the visibility of the proposed cut locations in the material under the conditions of the first environment 202. With the light source 212 applied above the material 200, the cuts are not noticeable and may not even be visible to the naked eye. This ability for the cuts to be generally invisible increases safety as weaknesses in the material will not be revealed by the ventilation mechanism. Additionally, in some embodiments, the only way to apply light to the material 200 is through the use of an overhead directed light source 212, so the ventilation system is generally invisible to the observer.

[0019] In the second environment 204, the light source 214 is applied underneath the material 200, as shown in side view 224a. Top view 224b shows the visibility of the proposed cut locations in the material under the conditions of the second environment 204. With the light source 214 applied underneath the material, the cuts are unnoticeable as they appear to be like the other spaces between the copper traces; that is, they are visually indistinguishable from the portion of the material 200 that holds the organic substrate. Thus, again, the cuts are not weakened.

[0020] In the third environment 206, light sources 216a and 216b are applied both above and below the material 200, as shown in side view 226a. Top view 226b illustrates the visibility of the proposed cut locations in the material under the conditions of the third environment 206. With light sources 216a and 216b applied both above and below the material, the cuts are not noticeable, as they appear to be the same as other spaces between the copper traces, as they were when light source 214 was only applied underneath the material; that is, they are visually indistinguishable from the portion of material 200 that holds the organic substrate. Thus, again, the cuts are not particularly vulnerable and are protected from the observer identifying a potential weakness in the system.

[0021] In some embodiments, the incision can be formed by exposing the tamper detection circuitry embedded in the organic material to an organic removal mechanism that removes the organic material and does not remove the inorganic material. In some embodiments, the organic removal mechanism can be a laser tuned to ablate the organic material while leaving the tamper detection circuitry unaffected, such that the organic material in the drill path of the laser is removed and the tamper detection circuitry in the drill path of the laser remains intact.

[0022] 3 illustrates a material 300 undergoing a secure ventilation process, according to some embodiments of the present disclosure. More specifically, the material 300 is shown in a first state 302. In the first state 302, the material 300 has been identified for use in implementing a secure ventilation system and ablation locations for ventilation have been identified. A second state 304 illustrates the material 300 after a cut has been made by ablating organic material in the drill path of a laser used to ablate the cut in the material 300.

[0023] In many applications, it is desirable to use laser ablation of organic materials, as the shape of the drill path and therefore the shape of the cut can be precisely determined. The laser needs to be properly tuned to the use case as well as the specific components within the material used for ventilation (e.g., substrate and tamper detection circuitry). Tuning the laser to the specific components within the material allows the laser to ablate the organic material while leaving the tamper detection unit intact. Specifically, maintaining the electrical integrity of the substrate allows the material to maintain its detection capabilities.

[0024] In some embodiments, a multi-layer polyimide substrate with copper traces can be used as the secure vent material. The copper traces form a tamper detection circuit and are therefore sometimes referred to as a secure mesh. In some embodiments, a laser can be used to remove (or laser ablate) the organic material. A variety of laser wavelengths, from ultraviolet to infrared wavelengths, can be used to laser ablate the organic material while leaving the security trace intact. Similarly, a variety of laser pulse widths, from continuous wave (CW) to femtosecond pulses, can be used to laser ablate the organic material while leaving the security trace intact.

[0025] In some embodiments, a radio frequency (RF) laser can be used to ablate organic materials (such as polyimide substrates) while leaving the tamper detection circuitry (such as copper traces) intact. The RF laser can be tuned to wavelength 1035 nm, pulse width 300 fsec, amplifier 1 MHz, split mode 5, pulse rep rate (PRR) 200 KHz, RF 30. Those skilled in the art will recognize other specifications for tuning the laser depending on the materials used in other embodiments.

[0026] Similarly, the scanner can be set to specific specifications to optimize the performance of the laser to ablate the material. In the embodiment described above using a polyimide substrate, copper traces, and an RF laser, the scanner can be set to a scan speed of 1 M / s, line spacing of 0.05 mm, and 10-15 μm (FWHM). Those skilled in the art will recognize desirable scanner specifications for other embodiments.

[0027] 4 shows a material 400 with secure ventilation according to an embodiment of the present disclosure. The material 400 is ablated by a laser on a first side 402a such that a cut traverses the entirety of the material. Thus, the cut is visible on a second side 402b of the material 400. The force of the laser ablating the first side 402a of the material may leave an ablation bevel between the cut and the peripheral portion of the material 400.

[0028] The width of the drill path of the laser used to ablate the material, and therefore the width of the cut formed by the laser in the material, can vary. The width of the cut can be affected by other factors related to the ventilation system, specifically the length of processing time required, the amount of fluid flow through the cut, and how the material is ablated, among other factors, which can vary. In one embodiment, the ventilation cut can be formed by drilling a 100 μm diameter through hole with a laser in a processing time of less than 4 seconds. In another embodiment, a large ventilation cut (e.g., as shown in FIG. 5) has an ablation area with a large width and can be ablated with the laser from both the first and second sides to ablate the organic material in the ablation area and expose the through hole between the tamper detection members. In such an embodiment, more processing time may be required.

[0029] FIG. 5 shows a material 500 with secure ventilation according to some embodiments of the present disclosure. The material 500 has large ventilation cuts. The material 500 is shown from a first side 502a and a second side 502b. The cuts start on the first side 502a and open a vent hole and penetrate halfway through the material 500. The cuts then finish on the second side 502b and open the remaining part of the material 500 to form a vent hole. The illustrated material 500 uses a polyimide substrate as the organic material and copper traces as the tamper detection circuitry. The copper traces can be seen crossing each other with ablation. Through holes can be seen between the copper traces. In these through holes, the polyimide substrate has been laser ablated to allow ventilation while maintaining the electrical integrity of the detection circuitry.

[0030] In some embodiments, the large ventilation cutout can have an ablation region with a width of 1.5 mm where the laser ablates from both a first side (e.g., the side adjacent to the protected resource) and a second side (e.g., the side facing the exterior) to ablate organics (e.g., a substrate such as a polyimide substrate) in the ablation region to expose through-holes between tamper detection members (e.g., copper traces). In such embodiments, the laser is tuned to remove the substrate without adversely affecting the tamper detection circuitry, so that spaces between the tamper detection circuits can be ablated to allow ventilation while leaving the electrical integrity of the tamper detection circuits intact.

[0031] In some embodiments, maintaining the organic material between the tamper sensor traces can prevent shorting of the tamper detection system. Laser ablation of material according to embodiments of the present disclosure can leave a shadow behind the area of ​​the tamper detection circuitry. For example, if the laser ablates the polyimide substrate but not the copper traces, the copper traces overlying the polyimide substrate will protect the overlying polyimide substrate from ablation. That is, a laser tuned to ablate organics will not ablate organics behind inorganics. Thus, with this technique, the organics between the tamper sensor traces are protected.

[0032] 6 shows a schematic diagram of a material 600 with secure ventilation, according to some embodiments of the present disclosure. The schematic diagram of the material 600 shows a first segment of secure ventilation material 610 and a second segment of secure ventilation material 620. The first segment 610 includes an organic material 612 (e.g., a polyimide substrate) and traces 614 of a tamper detection system (e.g., copper).

[0033] The first segment 610 includes a first cut 616a and a second cut 616b. The cuts may be vertical, angled, cornered, or some combination thereof. The cuts must connect a first side (e.g., the side facing the protected resource) to a second side (e.g., the side facing the exterior) to allow ventilation (e.g., gas flow from one side to the other). In the first segment 610, the first cut 616a is a straight vertical cut. The second cut 616b is an angled cut. In some embodiments, an angled cut, such as the second cut 616b, may be preferred to increase the difficulty of successful unauthorized access to the protected resource.

[0034] In some embodiments, the cut can be formed by ablating the material multiple times. A first ablation can be laser drilled on a first side of the organic material and a second ablation can be laser drilled on a second side of the organic material. In some embodiments, the angle of the cut formed by the first ablation and the second ablation is between 60° and 120°. The angle of the cut can be where the two ablations meet or intersect.

[0035] The second segment 620 of the secure ventilation material has an organic material 622 (e.g., a polyimide substrate) and traces 624 (e.g., copper) of the tamper detection system. The second segment 620 includes a first cut 626a, a second cut 626b, and a third cut 626c. The first cut 626a is a vertical cut, the second cut 626b is an angled cut, and the third cut 626c is an angular cut.

[0036] In FIG. 6, the vectors (straight portions of the cuts) of the third cut 626c meet at approximately a right angle (a 90° angle). Other meeting angles according to the present disclosure may be used so long as ventilation is promoted between the first side of the material and the second side of the material. For example, in some embodiments, a meeting angle of 35° may be preferred, while in other embodiments, a meeting angle of 155° may be preferred. In some embodiments of the present disclosure, an exact 90° angle may be preferred, and in some embodiments of the present disclosure, a meeting angle in the range of 60° to 120° may be preferred.

[0037] In some embodiments, multiple angled cuts can be employed. In such embodiments, the same meeting angle can be used throughout the ventilating material. For example, all cut vectors can intersect at an angle of about 85°. In such embodiments, the meeting angles of the cuts can be varied. For example, a material with three ventilation cuts can have meeting angles of 102°, 93°, and 24°. In some embodiments, a combination of unique and replicated meeting angles can be used. For example, a material with four ventilation cuts can have meeting angles of 102°, 93°, 24°, and 93°.

[0038] The ventilation cutouts may be used once or multiple times on a material. In some embodiments, the ventilation material may be a relatively small component of the secure system. For example, the ventilation material may be embedded in the mechanical can such that there is an opening through the mechanical can on either side of the cutout opening. In such embodiments, fewer cutouts (e.g., only one) may be preferred to minimize the proper opening of the mechanical can. In some embodiments, the ventilation material may be applied on top of the mechanical can, rather than applied inside the mechanical can. In such embodiments, fewer cutouts (e.g., three) may be preferred to minimize the size of the mechanical can opening, while maximizing the ventilation capacity of the opening.

[0039] In some embodiments, the ventilating material may form the entire secure enclosure. For example, the ventilating material may form a sphere surrounding a polygonal sphere that levitates the protected resources using magnets affixed inside the triangular joints of the polygon. In such an embodiment, multiple cuts (e.g., one on the center of the various lines of the polygon) may be used to ventilate the protected resources.

[0040] In some embodiments, the organic material and the tamper detection circuit embedded in the organic material can completely enclose the protected volume. Some embodiments of the tamper detection system can further include a mechanical can. The mechanical can can include a mechanical opening. The tamper detection circuit embedded in the organic material may be affixed over the mechanical opening of the mechanical can. In some embodiments, a tamper detection method according to the present disclosure can include affixing the tamper detection circuit embedded in the organic material to the mechanical can. The mechanical can can include a mechanical opening and the tamper detection circuit embedded in the organic material may be affixed over the mechanical opening of the mechanical can.

[0041] 7 illustrates a system 700 utilizing materials with secure ventilation, according to some embodiments of the present disclosure. A first perspective shows a cross-sectional view 700a of the system 700, and a second perspective shows a top-down view 700b of the system 700.

[0042] The system 700 includes a mechanical can 702 that connects to a circuit board 704 surrounding a protected resource 706. The mechanical can 702 has a mechanical opening 712. The mechanical opening 712 may be, for example, a hole that extends through the mechanical can 702. A vent material 714 is attached to the mechanical can 702 on the side of the protected resource 706. The system 700 further includes a tamper sensor 716 that extends around the entire inside circumference of the mechanical can 702.

[0043] In this embodiment, the ventilating material 714 is on the protected resource 706 side of the tamper sensor 716. In other embodiments, the ventilating material 714 may be between the tamper sensor 716 and the mechanical can 702, or may be integrated with the tamper sensor 716 as a combined unit. For example, the tamper sensor 716 may be embedded in the organic matter of the ventilating material 714, and in such embodiments, the organic matter of the ventilating material may cover some or all of the tamper sensor 716.

[0044] System 700 is also shown in a top view 700b. Top view 700b shows mechanical can 702, circuit board 704, and tamper sensor 716 through mechanical opening 712 in mechanical can 702. Top view 700b shows a second mechanical opening 722 in mechanical can 702. In this embodiment, tamper sensor 716 extends around the entire protected resource such that tamper sensor 716 is visible through both mechanical opening 712 and second mechanical opening 722.

[0045] In some embodiments, the tamper detection system can further include a wire trap affixed to a first side of the organic material adjacent the incision. The wire trap can include a tamper detection sensor and a bond member. The tamper detection sensor can be attached to the organic material via the bond member. The bond member can physically separate the tamper detection sensor from the organic material.

[0046] 8 shows a schematic diagram of a material 800 with secure ventilation, according to some embodiments of the present disclosure. The schematic diagram of the material 800 shows a wire trap ventilation material 810, a sliced ​​side view 820a and a top view 820b of wire traps 820. The wire trap ventilation material 810 includes an organic material 812 and a tamper detection trace 814. The wire trap ventilation material 810 includes angled ventilation cuts 816. The wire trap ventilation material 810 further includes wire traps 820.

[0047] The wire trap 820 is shown in sliced ​​side view 820a and top view 820b. The wire trap 820 has a tamper sensor 824. The tamper sensor 824 may include a solid metal plate or woven copper fabric as part of the tamper detection circuit. In some embodiments, the tamper sensor 824 may include a solid segment of non-breathable material (e.g., copper plate) since ventilation may occur around the bond member 828. The bond member 828 may physically separate the wire trap 820 from the remainder of the ventilation material 810 such that fluid (e.g., air) may flow between the wire trap 820 and the remainder of the ventilation material 810.

[0048] In this embodiment, the tamper sensor 824 is on an organic base 822 (e.g., a polyimide substrate). In some embodiments, the tamper sensor 824 may exist separately from the organic base 822.

[0049] A top view 820b of the wire trap 820 shows that the bond member 828 is L-shaped over the tamper sensor 824. The bond member 828 may be any shape that allows for fluid flow between the wire trap 820 and the remainder of the ventilated material 810. For example, in some embodiments, the bond member 828 may include one or more posts of bond segments that connect the tamper sensor 824 to the remainder of the ventilated material 810.

[0050] 9 illustrates a system 900 utilizing a material with secure ventilation, according to some embodiments of the present disclosure. The system 900 includes a mechanical can 902 that connects to a circuit board 904 surrounding a protected resource 906. The mechanical can 902 has a mechanical opening 912. The system 900 further includes a tamper sensor 916 that extends around the entire inside circumference of the mechanical can 902. A ventilated material 914 is attached to the mechanical can 902 on the side where the protected resource 906 is located. A wire trap 918 is attached to the ventilated material 914 between the ventilated material 914 and the protected resource 906.

[0051] 10 illustrates a high-level block diagram of an exemplary computer system that may be used to implement one or more of the methods, tools, and modules and related functions according to some embodiments of the present disclosure. It should be understood in advance that the components, layers, and functions illustrated in FIG. 10 are intended to be illustrative only, and the embodiments of the present disclosure are not limited thereto. As shown below, the following layers and corresponding functions are provided:

[0052] The hardware and software layer 1015 includes hardware and software components. Examples of hardware components include mainframe 1002, reduced instruction set computer (RISC) architecture based server 1004, server 1006, blade server 1008, storage device 1011, and network and network components 1012. In some embodiments, the software components may include network application server software 1014. The hardware and software layer 1015 may further include a tamper detection system with secure ventilation 1016.

[0053] The virtualization layer 1020 provides an abstraction layer from which the following virtual entities can be provided, for example: virtual servers 1022, virtual storage 1024, virtual networks including virtual private networks 1026, virtual applications and operating systems 1028, and virtual clients 1030.

[0054] By way of example, the management layer 1040 may provide the following functionality: Resource provisioning 1042 enables dynamic procurement of computing and other resources utilized to execute tasks within the cloud computing environment. Metering and pricing 1044 enables cost tracking as resources are utilized within the cloud computing environment and billing or invoicing for the consumption of these resources. By way of example, these resources may include application software licenses. Security enables identification and verification of cloud consumers and tasks, as well as protection for data and other resources. User portal 1046 provides consumers and system administrators with access to the cloud computing environment. Service level management 1048 enables allocation and management of cloud computing resources such that requested service levels are met. Service level agreement (SLA) planning and fulfillment 1050 enables pre-arrangement and procurement of anticipated future needs for cloud computing resources according to SLAs.

[0055] The workload layer 1060 provides examples of functionality available to a cloud computing environment. Examples of workloads and functionality that can be provided from this layer include mapping and navigation 1062, software development and lifecycle management 1064, virtual classroom instruction delivery 1066, data analytics processing 1068, transaction processing 1070, and data generation tools 1072.

[0056] Although the present disclosure has been described in terms of specific embodiments, it is expected that changes and modifications thereof will become apparent to those skilled in the art. The description of various embodiments of the present disclosure is presented for illustrative purposes, but is not intended to be exhaustive, and is not intended to be limited to the disclosed embodiments. It will be apparent to those skilled in the art that many modifications and changes are possible without departing from the scope of the present invention. The terms used in this specification are selected to best explain the principles of the embodiments, practical applications or technical improvements to the technology found in the market, or to enable those skilled in the art to understand the embodiments described herein. Therefore, it is intended that the following claims be interpreted as covering all such changes and modifications as fall within the true scope of the present disclosure.

Claims

1. 1. A tamper detection system, comprising: An organic material; a tamper detection circuit embedded in the organic material; ablating a portion of the organic material to form a cut in the organic material; a portion of the tamper detection circuit interrupts a portion of the ablation path; the tamper detection circuitry remains intact; the cut allows gas flow between the first side of the organic material and the second side of the organic material. Tamper detection system.

2. a wire trap attached to the first side of the organic material to cover the notch; the wire trap includes a tamper detection sensor and a bond member, the tamper detection sensor being attached to the organic material via the bond member, and the bond member physically separating the tamper detection sensor from the organic material; The tamper detection system of claim 1 .

3. the incisions are formed by ablating the organic material multiple times, a first ablation being laser drilled on the first side of the organic material and a second ablation being laser drilled on the second side of the organic material; The tamper detection system of claim 1 .

4. the angle of the cut formed by the first ablation and the second ablation is between 60° and 120°; The tamper detection system of claim 3 .

5. the notch is formed by exposing the tamper detection circuit embedded in the organic material to an organic matter removal mechanism, the organic matter removal mechanism removing organic matter while not removing inorganic matter. The tamper detection system of claim 1 .

6. the organic removal mechanism is a laser tuned to ablate the organic material while not adversely affecting the tamper detection circuitry, such that the organic material in the drill path of the laser is removed and the tamper detection circuitry in the drill path of the laser remains intact; The tamper detection system of claim 5 .

7. Further comprising a mechanical can, the mechanical can includes a mechanical opening, and the tamper detection circuit embedded in the organic material is attached to the mechanical can over the mechanical opening. The tamper detection system of claim 1 .

8. the organic material and the tamper detection circuit embedded in the organic material completely enclose a protected volume; The tamper detection system of claim 1 .

9. 1. A method for manufacturing a tamper detection system, the method comprising: Obtaining a tamper detection circuit embedded in an organic material; ablating a portion of the organic material to form a notch; ablating the cut removes organic material within the ablation path; a portion of the tamper detection circuit interrupts a portion of the ablation path; the tamper detection circuitry remains intact; the cut allows gas flow between the first side of the organic material and the second side of the organic material. A method for manufacturing a tamper detection system.

10. a wire trap attached to the first side of the organic material to cover the notch, the wire trap including a tamper detection sensor and a bond member, the tamper detection sensor being attached to the organic material via the bond member, and the bond member physically separating the tamper detection sensor from the organic material; 10. The method of claim 9.

11. the incisions are formed by ablating the organic material multiple times, a first ablation being laser drilled on the first side of the organic material and a second ablation being laser drilled on the second side of the organic material; 10. The method of claim 9.

12. the angle of the cut formed by the first ablation and the second ablation is between 60° and 120°; The method of claim 11.

13. the notch is formed by exposing the tamper detection circuit embedded in the organic material to an organic matter removal mechanism, the organic matter removal mechanism removing organic matter while not removing inorganic matter.

10. The method of claim 9.

14. the organic removal mechanism is a laser tuned to ablate the organic material while not adversely affecting the tamper detection circuitry, such that the organic material within the drill path of the laser is removed and the tamper detection circuitry within the drill path remains intact; The method of claim 13.

15. attaching the tamper detection circuit embedded in the organic material to a mechanical can; the mechanical can includes a mechanical opening, and the tamper detection circuit embedded in the organic material is attached to the mechanical can over the mechanical opening.

10. The method of claim 9.

16. the organic material and the tamper detection circuit embedded in the organic material completely enclose a protected volume; 10. The method of claim 9.

17. A computer program, the computer program comprising program instructions, the program instructions executable by a processor to cause the processor to perform a function, the function being: Obtaining a tamper detection circuit embedded in an organic material; ablating a portion of the organic material to form a notch; ablating the cut removes organic material within the ablation path; a portion of the tamper detection circuit interrupts a portion of the ablation path; the tamper detection circuitry remains intact; the cut allows gas flow between the first side of the organic material and the second side of the organic material. Computer program.

18. a wire trap attached to the first side of the organic material to cover the notch, the wire trap including a tamper detection sensor and a bond member, the tamper detection sensor being attached to the organic material via the bond member, the bond member physically separating the tamper detection sensor from the organic material; 18. A computer program according to claim 17.

19. the incisions are formed by ablating the organic material multiple times, a first ablation being laser drilled on the first side of the organic material and a second ablation being laser drilled on the second side of the organic material; 18. A computer program according to claim 17.

20. The method of claim 20, wherein the notch is formed by exposing the tamper detection circuit embedded in the organic material to an organic matter removal mechanism, the organic matter removal mechanism removing organic matter while not removing inorganic matter; the organic removal mechanism is a laser tuned to ablate the organic material while not adversely affecting the tamper detection circuitry, such that the organic material within the drill path of the laser is removed and the tamper detection circuitry within the drill path remains intact; 18. A computer program according to claim 17.

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