Apparatus and method for multi-step processing of planar substrates - Patents.com

Abstract

The present invention relates to an apparatus and method for processing planar substrates, in particular planar glass substrates, on a substrate support in multiple steps, in which a plurality of spatially separated processing stations are connected to one another by a substrate support transport device, and the substrate support is transported from one processing station to the next by the substrate support transport device, so that the planar substrate placed on the substrate support can be subjected to multiple processing steps in sequence.

Description

[Technical field]

[0001] The present invention relates to an apparatus and method for processing planar substrates, particularly planar glass substrates, in multiple steps.

[0002] Planar substrates, such as glass, thin glass, ultra-thin glass (UTG), wafers, films and other thin substrates, may be sold in various forms after their manufacture. Depending on the material properties, it is conceivable, for example, to roll or stack such substrates. However, it is often desirable to post-process them after manufacture, for example to be able to provide desired criteria, for example predetermined intermediate or final dimensions, to improve transport capabilities and / or to facilitate post-processing.

[0003] However, when trying to optimize such a process, for example with regard to speed, degree of automation or costs, problems can often arise if the upstream production contains a specific process flow, e.g. time course, that does not immediately correspond to the process flow of the post-processing. This can be the case, for example, when production is continuous, but a certain cycle control should take precedence in order to optimize the post-processing.

[0004] Thin glass and ultra-thin glass (UTG) are generally produced by drawing, where a certain glass thickness can be obtained depending on the drawing speed. In particular, high drawing speeds can be applied to produce very thin glass. In glass production, e.g. in the case of thin glass or UTG, it may be desirable to carry out processing after melting and forming, which may include, for example, thickness measurement, error detection, edge cutting, sheet singulation (cross cutting), edge inspection, size check and / or packaging. These processing steps may be realized and / or performed, for example, vertically or horizontally. Basically, some of the processing steps, e.g. handling steps, may be performed manually or automatically.

[0005] However, the automation of online processes may not be flexible and increases the complexity of an already complicated process chain. This means that, for example, the glass ribbon cannot simply be stopped in an online process in order to perform, for example, a cutting (resetting is laborious and expensive for laser technology). Furthermore, even in a single step, functional problems can lead to the entire production line being stopped. Furthermore, size changes (change of drawing speed, change of thickness) often require the exchange of equipment components in order to adapt the cycle speed (for example, if the drawing speed is significantly increased, additional robots have to be used, since the working speed of the robots is often not scaled to the same extent as the working speed of the hot forming of the glass). The cycle times of melting and forming often cannot be adapted to the ideal cycle times of the post-processing without much effort.

[0006] In the case of UTG, one must also bear in mind the lack of inherent stiffness and increased susceptibility to breakage compared to thicker glasses, which makes such glasses particularly difficult to process in online processes, especially where individual sheets are accelerated at a "cold end" in online processes, for example to ensure the spacing of the sheets relative to one another.

[0007] In the case of UTG, this can also result in high drawing speeds, for example more than 10 m / min, preferably more than 15 m / min, particularly preferably more than 50 m / min, which often means that it is no longer possible to easily integrate the steps of edge cutting, singulating, inspection, size / edge checking and / or packaging into the production process without incurring a lot of automation effort and / or space requirements. At such speeds, manual handling and / or packaging can be personnel or cost-intensive or inconvenient from the standpoint of work safety.

[0008] Winding UTG glass ribbons may have the disadvantage of requiring additional effort, for example to unwind or to sort out defective glass. Furthermore, it is often desirable in the market to be able to purchase UTG glass already pre-manufactured (in intermediate or final dimensions). This can reduce the complexity of UTG handling as well as the effort of the customer.

[0009] The object of the present invention is therefore to provide an installation and a method for processing, in particular post-processing, planar substrates, in particular glass substrates, so that they can be provided with desired standards after production, for example with specific dimensions, a given edge strength, and / or good suitability for transport and post-processing. One aspect of the object is to optimize the processing steps of planar substrates, in particular with regard to speed, degree of automation and / or costs. Another aspect of the object is to enable the processing or optimization of the processing, completely independent of the process flow and / or time course of the upstream production flow. In particular, it is desirable to enable flexible post-processing for continuous production processes, for example for glass, thin glass, UTG, wafers and / or films.

[0010] Said problem is solved by the subject matter of the independent claims. Further advantageous embodiments are set forth in the dependent claims.

[0011] The present invention relates to an installation for processing planar substrates, in particular planar glass substrates, on a substrate support in multiple steps, which comprises a number of processing stations spatially separated from one another, which are connected to one another by a substrate support transport device, whereby the substrate support can be transported from one processing station to the next along a transport path defined by the substrate support transport device, so that the planar substrate placed on the substrate support can be subjected to a number of processing steps in succession in each processing station.

[0012] One of the processing stations is configured as a loading station configured to place a planar substrate on the substrate support, at least one of the processing stations is further configured as a processing station configured to process, e.g., cut, the planar substrate placed on the substrate support, and one of the processing stations is further configured as an unloading station configured to unload the processed planar substrate from the substrate support.

[0013] In one preferred embodiment, the substrate support transport device is configured as a circulating device, so that the substrate support transport device defines a closed transport path, by which the substrate support can be transported from a loading station via at least one processing station and an unloading station and back to the loading station again.

[0014] The substrate support transport device may have a plurality of, in particular four, transport sections, each of which defines a single, in particular linear, transport direction, in which case the transport directions of the transport sections run at an angle to one another, in particular at right angles.

[0015] It is also not excluded that the substrate support transport device has, for example, three transport sections arranged based on a triangular geometric shape, or five transport sections arranged based on a pentagonal geometric shape, etc.

[0016] It may further be envisaged that the substrate support transport apparatus (110) defines a circular transport path.

[0017] The loading station may include a pick-up device, by which a planar substrate can be picked up, eg lifted from the stack, and the picked substrate can be placed on a substrate support.

[0018] The pick-up device preferably comprises a handling system, for example a robotic arm, and / or a suction gripping device with a negative pressure module, by which the planar substrate can be sucked onto the suction gripping device.

[0019] The loading station may include an inspection device, which allows the planar substrate to be inspected, particularly to identify defects, such as breaks or cracks, before the planar substrate is picked up.

[0020] In one refinement, one or more of the processing stations, in particular the loading station and / or at least one processing station, comprise means for subjecting the substrate to a force acting in the direction of the substrate support, in particular for fixing the substrate in position on the substrate support.

[0021] These means are preferably configured to generate a force acting in the direction of the substrate support by applying a negative pressure to the surface of the substrate facing the substrate support, in particular via openings in the substrate support or continuous pores in the substrate support, and / or to generate a force acting in the direction of the substrate support by mechanically pressing or attracting the substrate to the substrate support and / or to generate a force acting in the direction of the substrate support by adhesion or surface forces (e.g. van der Waals forces or electrostatic forces), in particular by electrostatic charging of the substrate and / or the substrate support.

[0022] The apparatus may include a substrate support having openings or interconnected pores for applying a negative pressure to a substrate placed thereon and / or having a surface with enhanced electrostatic charging properties or enhanced frictional properties for fixing a substrate placed on the substrate support.

[0023] One or more of the processing stations may be configured as a pre-cutting station configured to pre-cut a planar substrate mounted on a substrate support along a predetermined cutting line, whereby in particular the cutting line separates a waste surface of the substrate from a use surface of the substrate.

[0024] The pre-cutting may in particular include the introduction of damage into the substrate, preferably extending along a predetermined cutting line, for example by laser, saw wheel, diamond, water jet cutting and / or ultrasonic cutting.

[0025] The preliminary cutting may furthermore in particular comprise the introduction of a laser beam into the substrate, in which case adjacent, spaced apart, in particular filament-like damage portions are introduced into the substrate, preferably along a predetermined cutting line.

[0026] One or more of the processing stations may be configured as a separation station configured to separate a planar substrate mounted on a substrate support into a plurality of portions along predetermined cutting lines, in particular into a portion comprising a waste surface of the substrate and a portion comprising a utilization surface of the substrate.

[0027] The separation may include, inter alia, the action of force, moment, temperature, vibration and / or fracture at a predetermined cut line in the planar substrate, particularly at a damage site or sites extending along the cut line.

[0028] One or more of the processing stations may be configured as a waste station, which is configured to separate waste material of the planar substrate located on the substrate support from used material of the planar substrate located on the substrate support, in particular to separate pieces comprising the waste surface of the substrate separated along a predetermined cutting line from pieces comprising the used surface of the substrate separated along the cutting line.

[0029] Sorting may include removing waste material from the substrate support, particularly pieces including the waste surface of the substrate.

[0030] Sorting may further include detection and separation of pieces of the utilized material, particularly the utilized surface of the substrate, from the substrate support.

[0031] In one embodiment of the invention, one or more of the processing stations may be configured as both a separation station and a disposal station, in other words, the processing stations may form a combined separation and disposal station.

[0032] Furthermore, further processing stations may also be configured as combined stations, for example, it may be envisaged that the removal station is integrated into the disposal station, so that the net material can already be inspected, removed and packaged upon disposal of the waste material.

[0033] Furthermore, for example, a pre-cutting station can be integrated into the disposal station. In this case, for example, a robot arm can be provided with a laser unit (for example a fiber laser with a scanner) attached, which is designed to be exchanged for another robot arm with a breaking unit attached. For example, a third robot arm can also be provided for removal. Alternatively, however, for example, a robot arm can also be provided with a corresponding tool attached.

[0034] In general, however, it may be advantageous to separate the individual work steps spatially and / or temporally, so that in principle the individual processing stations can also be designed to be spatially decoupled.

[0035] One or more of the processing stations may be configured as a substrate cleaning station, which is configured to clean a planar substrate, in particular a processed substrate, placed on a substrate support and / or a portion of the planar substrate, including the useful material, in particular the useful surface, of the substrate, located on the substrate support.

[0036] One or more of the processing stations may be configured as an inspection station, which is configured to inspect a planar substrate, in particular a processed substrate, placed on a substrate support and / or a piece including the utilized material, in particular the utilized surface of the substrate, of the planar substrate located on the substrate support, in particular to identify defects, e.g. breaks or cracks.

[0037] The removal station may include a pick-up device for picking up the processed planar substrate and / or the utilized material of the planar substrate, in particular a portion including the utilized surface of the substrate, from the substrate support and depositing, for example, into a packaging box and / or onto a stack.

[0038] The pick-up device preferably includes a handling system, e.g. a gantry system or a robot arm, and / or an adhesive gripping device equipped with a negative pressure module, by which the processed planar substrate and / or the applicable material of the planar substrate, in particular a partial piece including the applicable surface of the substrate, can be adsorbed to the adhesive gripping device.

[0039] The removal station may include an inspection device for inspecting and then picking up the processed planar substrate and / or the utilized material of the planar substrate, in particular the piece including the utilized surface of the substrate, in particular for identifying particles, dirt, defects, such as geometric defects, angular errors, shell-like fractures, breaks or cracks.

[0040] One of the processing stations is configured as a substrate support cleaning station, which is configured to clean the substrate support, in particular after removing from the substrate support a processed planar substrate and / or a piece of the planar substrate comprising a used material, in particular a used surface of the substrate, and it may also be possible in this case to adjust the surface forces used for the adhesion.

[0041] The loading station may be arranged in the transport path between the substrate support cleaning station and the pre-cutting station, preferably directly between them, or may be arranged in the first or second transport section of the substrate support transport device.

[0042] The pre-cutting station may be arranged in the transport path between the loading station and the separating station, preferably directly therebetween, or may be arranged in the second transport section of the substrate support transport device.

[0043] The separation station may be arranged in the transport path between the pre-cutting station and the disposal station, preferably directly between them, or may be arranged in the second or third transport section of the substrate support transport device.

[0044] The disposal station may be arranged in the transport path between the separation station and the removal station, preferably directly therebetween, or may be arranged in the second or third transport section of the substrate support transport device.

[0045] In the case of a combined separation and disposal station, this may be arranged in the transport path between the pre-cutting station and the removal station, preferably directly between them, or the combined separation and disposal station may be arranged in the second or third transport section of the substrate support transport device.

[0046] The unloading station may be arranged in the transport path between the disposal station and the substrate support cleaning station, preferably directly between them, or may be arranged in the third or fourth transport section of the substrate support transport apparatus.

[0047] The substrate support cleaning station may be arranged in the transport path between the unloading station and the loading station, preferably directly between them. The substrate support cleaning station may be arranged in a fourth transport section of the substrate support transport device. In one refinement, the installation comprises a clean room and / or a clean room in which the substrate support transport device and / or one or several of the processing stations are arranged, and preferably an airlock leading to the clean room and / or the clean room, via which the planar substrates are fed to the installation, for example to a stack or a transport section.

[0048] The facility may be directly connected (in particular via an airlock leading to a clean room) to an apparatus for melting and / or shaping the raw materials for planar substrates, in particular green glass with an edge.

[0049] The invention further relates to a method for processing a planar substrate, in particular a planar glass substrate, on a substrate support in multiple steps, in which the planar substrate is placed on the substrate support in a processing station configured as a loading station, the substrate support together with the placed planar substrate is transported from the loading station by a substrate support transport device either directly or via one or more further processing stations to a processing station configured as a processing station, the planar substrate placed on the substrate support is processed, e.g. cut, in the processing station, the substrate support together with the placed processed planar substrate is transported from the processing station by a substrate support transport device either directly or via one or more further processing stations to a processing station configured as an unloading station, and the processed planar substrate placed on the substrate support is removed from the substrate support in the unloading station.

[0050] In one preferred embodiment, the substrate support is transported from the unloading station back to the loading station by the substrate support transport apparatus.

[0051] In one exemplary configuration, the substrate support together with the planar substrate placed thereon is transported from the loading station by the substrate support transport device directly or via one or more other processing stations to a processing station configured as a pre-cutting station, the planar substrate placed on the substrate support is pre-cut along a predetermined cutting line at the pre-cutting station, the substrate support together with the pre-cut planar substrate placed thereon is transported from the pre-cutting station by the substrate support transport device directly or via one or more other processing stations to a processing station configured as a separation station, the pre-cut planar substrate placed on the substrate support is separated into a plurality of pieces along the predetermined cutting line at the separation station, the substrate support together with the plurality of pieces of the planar substrate is transported from the separation station by the substrate support transport device directly or via one or more other processing stations to a processing station configured as a disposal station (or the processing station configured as the separation station is simultaneously configured as a disposal station), and at least one piece of the planar substrate is sorted in the disposal station.

[0052] As already mentioned, the loading station may comprise a pick-up device (unprocessed glass pick-up device) for picking up the planar substrate and / or the unloading station may comprise a pick-up device (finished glass pick-up device) for picking up the processed planar substrate and / or the application material of the planar substrate. Such a pick-up device may be configured as a suction gripping device, as will be explained in more detail below. In this connection, the German patent application No. 102021116381.1 is incorporated by reference into the present application.

[0053] The suction gripping device may include a base, in particular for attachment to a robot arm, in which case the base may define a plane that preferably extends at least partially parallel to the substrate when picking up the substrate.

[0054] The suction gripping device may further include at least one gas intake type negative pressure module disposed on the substrate as well as at least one gas exhaust type negative pressure module disposed on the substrate.

[0055] The gas-suction negative pressure module preferably comprises at least one gas-suction opening for sucking in gas, in particular by the Venturi effect, to generate a negative pressure, by means of which the substrate can be suctioned to the suction gripping device.

[0056] The gas-releasing negative pressure module preferably comprises at least one gas-releasing opening for releasing gas and creating a negative pressure, in particular by means of the Bernoulli effect, by means of which the substrate can be attracted to the suction gripping device.

[0057] In other words, the suction gripping device may include two negative pressure modules based on different principles, in which the gas suction type negative pressure module generates negative pressure by sucking in gas above the substrate, while the gas discharge type negative pressure module generates negative pressure by discharging gas above the substrate, in which case the substrate is attracted by the Bernoulli effect as the gas flows rapidly past along the substrate.

[0058] The gas-intake negative pressure module may be configured as or may include, for example, a Venturi ejector. The gas-intake negative pressure module may in particular include a gas inlet, in particular for the inflow of compressed air, a gas outlet, in particular for the re-outflow of compressed air, a connection with a constriction leading from the gas inlet to the gas outlet, and a connection to a gas inlet opening, which branches off between the gas inlet and the gas outlet in order to generate a negative pressure by the Venturi effect.

[0059] The negative pressure module with gas discharge can be configured as or can include, for example, a Bernoulli floating adsorbent. The negative pressure module with gas discharge can in particular include a gas inlet, in particular for the inflow of compressed air, and a connection from the gas inlet to a gas discharge opening, in particular for the re-outflow of compressed air, the gas discharge opening being configured in such a way that the discharged gas runs obliquely relative to the plane of the substrate, preferably impinges obliquely on the substrate to be removed, thereby generating a negative pressure by the Bernoulli effect.

[0060] The gas discharge openings of the gas discharge negative pressure module or Bernoulli floating adsorber are preferably configured so that the discharged gas is discharged in the form of a cone and preferably impinges on the surface of the substrate in a conical manner, whereby the gas flows past the substrate and creates a negative pressure inside the cone, the normal of the cone being preferably perpendicular to the plane of the substrate and preferably substantially perpendicular to the surface of the substrate to be picked up.

[0061] The gas-suction negative pressure module may have a contact surface which at least partially contacts the substrate to be picked up by the suction gripping device, in which gas-suction openings are arranged as recesses in the contact surface, so that the substrate can be sucked onto the contact surface by suction of gas.

[0062] Preferably, a plurality of gas inlet openings, for example at least 10 or for example at least 50 gas inlet openings, preferably at least 224 gas inlet openings, particularly preferably at least 1108 gas inlet openings, and even more preferably at least 1662 gas inlet openings, are arranged as notches in the contact surface.

[0063] Furthermore, the contact surface of the gas-suction type negative pressure module preferably has an area of, for example, 100 square centimeters, preferably at least 530 square centimeters, particularly preferably at least 1280 square centimeters, and even more preferably at least 1984 square centimeters.

[0064] In one preferred embodiment, the suction gripping device comprises a number of gas intake negative pressure modules, in particular Venturi ejectors, and / or a number of gas ejection negative pressure modules, in particular Bernoulli floating adsorbents.

[0065] The gas intake negative pressure module or modules, in particular their contact surfaces, are preferably arranged closer to the center of the plane of the base body than the gas outlet negative pressure module or modules, in particular their gas outlet openings, preferably along at least one direction extending in the plane of the base body, particularly preferably along two directions extending perpendicular to each other in the plane of the base body.

[0066] The gas intake negative pressure module or modules, in particular their contact surfaces, are further preferably arranged between the gas discharge negative pressure modules, in particular between their gas discharge openings, again preferably along at least one direction extending in the plane of the base body, particularly preferably along two directions extending perpendicular to one another in the plane of the base body.

[0067] For example, the gas-emission negative pressure module (or Bernoulli floating adsorbent) may be located at the edge of the substrate, for example the distance of one or more gas-emission negative pressure modules to the edge of the substrate may be less than 10 cm, in particular less than 5 cm, preferably less than 3.5 cm, particularly preferably less than 0.4 cm.

[0068] If the suction gripping device comprises several gas-intake negative pressure modules, in particular Venturi ejectors, and several gas-exhaust negative pressure modules, in particular Bernoulli floating adsorbers, the gas-intake negative pressure modules and the gas-exhaust negative pressure modules may be arranged, for example, mixed across the plane of the substrate. In this case, but also for other embodiments, it may be assumed that several or some of the gas-intake negative pressure modules are controllable individually or in groups and / or several or some of the gas-exhaust negative pressure modules are controllable individually or in groups, so that in particular a locally limited suction can be provided in the plane of the substrate. Locally limited suction, for example, by a subset of gas-exhaust negative pressure modules arranged on the edge side with respect to the substrate to be picked up and / or locally limited suction, for example, by a subset of gas-intake negative pressure modules arranged in the center with respect to the substrate to be picked up, may be assumed. This may provide a suction gripping device that can be used variably for different substrate sizes, for example.

[0069] In one preferred embodiment, the suction gripping device may be configured to pick up a thin flexible raw glass sheet having a bezel on opposing edges. Such a suction gripping device may be referred to as a "raw glass gripper." In this case, the suction gripping device may include a plurality of negative pressure modules, e.g., strip-shaped, that define a convex surface along a first direction extending from one bezel to the other bezel when picking up the substrate.

[0070] For example, the suction grip device includes at least one gas-intake type negative pressure module group, which is arranged along a first direction, preferably between two gas-release type negative pressure module groups arranged on edges located on opposite sides of the base.

[0071] The gas-inhaling negative pressure module group may include one or more, for example four, gas-inhaling negative pressure modules, the contact surfaces of which extend along a second direction perpendicular to the first direction, preferably in the shape of a strip, in other words the gas-inhaling negative pressure module group may be longer along the second direction (along the edging) than along the first direction (perpendicular to the edging).

[0072] The group of gas-discharging negative pressure modules may include a plurality of gas-discharging negative pressure modules arranged side-by-side along a second direction extending perpendicular to the first direction.

[0073] One or more gas-breathing negative pressure modules, in particular a group of gas-breathing negative pressure modules, can define a first suction direction, in particular a first suction direction extending perpendicular to the contact surface of the gas-breathing negative pressure module and / or perpendicular to the plane of the substrate.

[0074] Furthermore, one or more gas-releasing negative pressure modules, in particular a group of gas-releasing negative pressure modules, can define a second suction direction extending obliquely to the first suction direction, whereby in particular the suction direction defines (first and second) perpendicular lines of the convex surface, whereby flexible planar substrates with concave curvatures and / or edging portions located on opposite sides can be picked up.

[0075] In one refinement, the suction gripping device may comprise an adjustment device, which is configured to change the inclination between the first and second suction directions. For example, an adjustment mechanism may be provided for this purpose, which allows the inclination between the gas-exhausting negative pressure module or modules and the gas-intake negative pressure module or modules. In particular, the inclination of the Bernoulli adsorbent may be variably adjustable, which allows, for example, for the Bernoulli adsorbent to be brought into closer contact with the substrate to be picked up. When dismantling the raw glass stack with the bezel, for example, the inclination can be gradually reduced, which allows the fact that the concave warping of the substrate to be picked up is gradually reduced.

[0076] In one preferred embodiment, the suction gripping apparatus may be configured to pick up a thin, flexible, finished glass sheet without edges. Such a suction gripping apparatus may be referred to as a "finished glass gripper." In this case, the suction gripping apparatus may include a plurality of negative pressure modules that define a substantially flat surface.

[0077] For example, the suction grip device includes at least one gas-intake type negative pressure module, which is arranged along both a first direction and a second direction extending perpendicular to the first direction, preferably between at least four gas-release type negative pressure modules arranged in corner or edge regions of the base.

[0078] Furthermore, one or more gas intake vacuum modules may be arranged inside a rectangle defined by the four gas discharge vacuum modules, with all gas intake vacuum modules of the suction gripping device being preferably arranged inside such a rectangle, i.e. it may be assumed, for example, that the suction gripping device does not have any gas intake vacuum modules outside the envelope defined by the gas discharge vacuum modules.

[0079] The one or more gas-intake negative pressure modules can define a first adsorption direction and the one or more gas-outtake negative pressure modules can define a second adsorption direction, in which case the first and second adsorption directions extend parallel to each other, in particular perpendicular to the contact surface of the gas-intake negative pressure module and / or perpendicular to the plane of the substrate.

[0080] It may be envisaged that the one or more gas-emitting negative pressure modules are recessed along the first adsorption direction, along the second adsorption direction, perpendicular to the contact surface of the gas-intake negative pressure module and / or perpendicular to the plane of the substrate, preferably by at least 0.2 centimeters, particularly preferably by at least 0.45 centimeters and even more preferably by at least 0.5 centimeters.

[0081] In general, in the suction gripping device, the one or more gas intake negative pressure modules and the one or more gas exhaust negative pressure modules are preferably configured as separate components, which may be available, for example, as commercial components, and may thus be preferably separated and / or spaced apart from one another, so that mutual influences between them can be minimized.

[0082] For example, between a gas-suction type negative pressure module, in particular its contact surface, and a gas-discharge type negative pressure module, in particular its gas discharge opening, there may be a distance of at least 1 centimeter, preferably at least 2 centimeters, and particularly preferably at least 4 centimeters.

[0083] Preferably, the one or more gas intake negative pressure modules and the one or more gas discharge negative pressure modules can be controlled separately, so that in particular a flexible planar substrate can be first adsorbed by the gas discharge negative pressure module and then adsorbed by the gas intake negative pressure module.

[0084] Furthermore, the one or more gas intake negative pressure modules each have a holding force of at least 12 Newtons, preferably at least 37 Newtons, particularly preferably at least 43 Newtons, and / or the one or more gas exhaust negative pressure modules each have a holding force of at least 1.8 Newtons, preferably at least 3.2 Newtons, particularly preferably at least 5.4 Newtons.

[0085] Preferably, the gas-intake negative pressure module or modules are variably controllable, so that at least two different values ​​of the holding force can be generated.More preferably, the gas-exhaust negative pressure module or modules are variably controllable, so that at least two different values ​​of the holding force can be generated.In particular, the suction gripping device can thereby be configured as a combined suction gripping device for air-impermeable and air-permeable substrates.

[0086] As mentioned, one or more of the processing stations may comprise means for subjecting the substrate to a force acting in the direction of the substrate support. In this case, as will be explained in more detail below, these means may for example be configured to subject the substrate to a force acting in the direction of the substrate support only within an action zone, for example within the area of ​​the substrate's application surface. In this connection, German patent application no. 102020134451.1 is incorporated by reference into the present application.

[0087] These means may, for example, be configured as a negative pressure source for applying negative pressure to an opening in the substrate support or to continuous pores in the substrate support, or may, for example, be configured as a holder or, for example, as a voltage source.

[0088] For example, each processing station may have a negative pressure source, a holder and / or a voltage source, which can generate forces in the corresponding action zones, it may be assumed that no forces are applied during the transport of the substrate support.

[0089] On the other hand, it may be envisaged that the force continues to be maintained during the movement or transport of the substrate support. For example, the substrate support includes a negative pressure source, which generates a negative pressure, for example, during the movement of the substrate support. In this case, for example, the substrate can be kept fixed in position across multiple processing stations. This clamping technique can therefore essentially continue to be maintained during transport, i.e., during the transition between, for example, two processing stations.

[0090] The processing station, in particular the pre-cutting station, may for example be configured to carry out a method for processing, in particular a pre-cutting, of a planar substrate, in particular a glass substrate, in which the substrate is placed on a substrate support and is exposed to forces acting in the direction of the substrate support within the range of the action zone, whereby in particular the substrate is brought close to the substrate support within the range of the action zone and is not exposed to forces acting in the direction of the substrate support within the range of the compensation zone, whereby in particular the substrate can form temporary deformations within the range of the compensation zone.

[0091] In this example, the substrate is clamped, particularly in the region of the effect zone, but not in the region of the compensation zone, so that the flatness of the glass substrate can be locally increased, which allows processing, for example, by laser filamentation, inscription or other forms of processing. At the same time, the stresses that occur in the substrate can be kept small, in particular smaller than in a substrate that is clamped all over, i.e. that is stretched completely flat. This is because the energy required for deformation is very small, and therefore the additional stresses that occur due to deformation are also very small.

[0092] Basically, a locally limited zone of action may be provided at any point of the substrate, which zone of action may in particular be different from the point at which the substrate is processed and / or at which a locally increased flatness occurs.

[0093] That is, for example, the material can only be fixed in a small, in particular maximally remote, active zone away from the zone to be treated, although the flatness in the treatment zone achieved in this way, not only in the case of processing with a laser but generally in general, is often still not sufficient for treating, for example, a glass plate with a laser at the focal point.

[0094] Therefore, not only in the case of processing with a laser but generally, it is also conceivable to clamp the glass sheet within or around the processing zone within a sufficiently small range, so that the glass sheet rests sufficiently flat on the substrate support within this zone.

[0095] The method for processing, in particular pre-cutting, a planar substrate, which can preferably be performed by a processing station, in particular a pre-cutting station, preferably further comprises a step of processing, in particular pre-cutting, for example by laser filamentation, inscription or any pre-cutting form in general, the substrate while it is exposed to a force acting in the direction of the substrate support within the action zone.

[0096] The method, which can be preferably carried out by a processing station, in particular a pre-cutting station, is, for example, particularly suitable for thin, large-area substrates, which may have a usable surface and a waste surface (e.g. a trim), and which in particular comprise or consist of a material which has inherent material stresses and is preferably susceptible to brittle fracture, such as glass, glass-like material, ceramic or glass-ceramic.

[0097] Preferably, the substrate has a thickness in the region of the application surface of less than 100 μm, preferably less than 70 μm, particularly preferably less than 50 μm or less than 40 μm.

[0098] Preferably, the substrate has a greater thickness in the region of the waste surface, in particular a thickness at least two times, at least three times or at least five times greater than the thickness in the region of the utilization surface.

[0099] The waste surface preferably comprises an edge region of the substrate extending along the edge of the substrate, particularly preferably two edge regions located on opposite sides of the substrate each extending along the edge of the substrate, the utilization surface being located between these edge regions, in which case the edge region of the substrate or the two edge regions located on opposite sides may, for example, be configured as a border.

[0100] The waste surface may further include one or two further edge regions extending along edges of the substrate that are each perpendicular to the waste surface, so that, for example in the case of a rectangular substrate, there is an edge region to be cut along each edge.

[0101] The substrate has a length of more than 100 mm, preferably more than 300 mm, particularly preferably more than 500 mm or more than 600 mm or more than 700 mm, where length particularly means the dimension extending along the border.

[0102] The substrate has a width of more than 100 mm, preferably more than 300 mm, particularly preferably more than 500 mm or more than 600 mm or more than 700 mm, where width in particular means the dimension extending perpendicularly to the border.

[0103] The entire board is 0.01m 2 Over 0.1m 2 More than or equal to 0.25m 2 The surface area may be greater than 100 mm.

[0104] As already mentioned, the substrate may not be exposed to forces all over but only locally in the processing stations, in particular in the pre-cutting station: the zone of action within which the substrate is exposed to forces acting in the direction of the substrate support is in particular less than 80% of the substrate's area, preferably less than 60% of the substrate's area, particularly preferably less than 40% of the substrate's area.

[0105] The compensation zone, inside which the substrate is not exposed to forces acting in the direction of the substrate support, is in particular more than 20% of the substrate's area, preferably more than 40% of the substrate's area, particularly preferably more than 60% of the substrate's area.

[0106] In particular in the case of laser processing, but also in general, it may be considered to subject the substrate to forces in, near or around the processing area. In this case, but also in general, the lateral form of the width around the zone to be treated may be empirically defined or may be definable from the material-specific stresses. These may be very different depending on the hot forming process and the material.

[0107] For example, it may be envisaged that the action zone, on which the force acts, includes at least a part of the waste surface, in particular the edge region, in particular the border, as well as a part of the utilization surface of the substrate.

[0108] Preferably, the action zone may be formed as a band extending in particular along the length of the substrate, in particular along the edge, in which case the band preferably has a width of less than 50% of the width of the substrate, particularly preferably less than 40% of the width of the substrate or less than 30% of the width of the substrate.

[0109] In one exemplary embodiment, the action zones may for example be provided only on the inside or only on the outside, or a combination may be envisaged in case of different cuts.

[0110] In this example, the force acting in the direction of the substrate support within the action zone, e.g. causing a local positional fixation of the glass plate, may be generated by various mechanisms, e.g. vacuum, electrostatic or mechanical, or other forms of generating force are also considered.

[0111] The force acting in the direction of the substrate support within the action zone may be generated by applying a negative pressure to the surface of the substrate facing the substrate support, in particular through openings in the substrate support or through continuous pores in the substrate support. The force may be applied to the substrate from above, for example by a holder. Furthermore, the force may be generated by a voltage source (for example a charging system, an ionization system).

[0112] The force acting towards the substrate support within the action zone may be caused by electrostatic charging of the substrate and / or the substrate support.

[0113] The force acting in the direction of the substrate support within the zone of action may furthermore be produced by mechanically pressing or attracting the substrate to the substrate support.

[0114] That is, in general, the force acting in the direction of the substrate support to which the substrate is exposed within the action zone may be, in a physical sense, a force that is particularly related to area ("pressure" or "force per unit area").

[0115] Regardless of how the forces are generated within the area of ​​the action zone, the flatness of the substrate can be increased, in particular within the area of ​​the action zone, but also basically outside the area of ​​the action zone, and at the same time, due to the locally limited action zone, the stresses induced in the substrate can be kept small, in particular smaller than in a globally clamped substrate.

[0116] While the substrate is exposed to a force acting in the direction of the substrate support within the action zone, the maximum distance between the substrate support and the substrate within the action zone may be less than 5 mm, preferably less than 3 mm, particularly preferably less than 1 mm.

[0117] The state thus produced may be called bistable. The exemplary values ​​given are only given locally. Furthermore, this distance may often depend on the material thickness and / or the initial material stress. In one example, the above values ​​may be given for a substrate having a thickness of, for example, less than 100 μm, in particular less than 70 μm or less than 50 μm. In one example, said values ​​may occur for a substrate having a punctiform protuberance of more than 4 mm over the rest surface without further external influence.

[0118] Furthermore, the maximum tensile stress in the substrate, particularly including the action zone and the compensation zone, while the substrate is exposed to a force acting in the direction of the substrate support within the action zone may be less than 50 MPa, preferably less than 30 MPa, particularly preferably less than 20 MPa.

[0119] Furthermore, the maximum tensile stress in the substrate within the zone of action while the substrate is exposed to a force within the zone of action may be less than 33 MPa, preferably less than 20 MPa, particularly preferably less than 15 MPa.

[0120] In comparison to the tensile stresses mentioned above, in one example in a substrate that is stretched flat all over, tensile stresses of up to or in the range of 100 MPa may be formed in the edge regions.

[0121] The abovementioned MPa values ​​can be determined, for example, by simulation. By tightening certain zones, the stresses can be transferred to the edges to a greater extent.

[0122] As already mentioned, the method for processing, in particular pre-cutting, a planar substrate, which can preferably be carried out by a processing station, in particular a pre-cutting station, also preferably comprises a step of processing, in particular pre-cutting, the substrate while it is exposed to a force within the action zone.

[0123] The processing of the substrate, in particular the pre-cutting, is preferably carried out along a predetermined cutting line, which may extend at least partially or to a large extent within the action zone.

[0124] The predetermined cutting line preferably extends along the length of the substrate, in particular along the edge, in which case the cutting line in particular separates the waste surface from the utilisation surface, so that the waste surface can be separated from the utilisation surface, from which the glass substrate can be produced as the final product.

[0125] In principle, the cutting lines may extend in a straight line, may extend in a curved line and / or there may be several intersecting cutting lines, in particular in the case of intersecting cutting lines a sequential processing may be envisaged.

[0126] The processing of the substrate, in particular the pre-cutting, preferably involves the introduction of a laser beam into the substrate, in particular in the region of the action zone, whereby adjacent, spaced apart damages, in particular along a predefined cutting line, can be introduced into the substrate, whereby the damages are preferably formed as filament-like damages and are particularly preferably produced by a pulsed laser beam of an ultrashort-pulse laser.

[0127] Processing of the substrate, in particular pre-cutting, may generally involve the introduction of any kind of pre-damage into the substrate, in particular in the area of ​​the action zone, in which case damage may be introduced into the substrate, in particular along a predefined cutting line, which damage may be produced, for example, by a laser, by an engraving wheel, by a needle (for example a diamond needle) or by another tool for processing the substrate.

[0128] The action zone, inside which in this example the substrate is exposed to a force acting in the direction of the substrate support, may in particular be formed as a strip along the first edge, and a predefined cutting line, along which the pre-cutting of the substrate is carried out, may extend adjacent to this edge and in particular along the entire length of the substrate, so that the edge can be cut off along the cutting line.

[0129] The advantage of the method, which can be advantageously carried out by the processing station, in particular the pre-cutting station, is that the overall stresses are kept small, so that it is also possible to produce pre-damage in the substrate all the way to the glass edge. Tests, however, have shown that with full clamping it is often not possible to introduce pre-damage all the way to the glass edge, and a sufficient distance is required to prevent uncontrolled cutting. The reason for this is that the tensile stresses induced at the substrate edge by flattening the main deformations of large local wavelengths (domes, bowls, saddles) are so high that they often exceed the breaking strength of the pre-damage.

[0130] In one refinement, various combinable action zones may be provided, which can locally tighten and / or flatly fix specific areas depending on the process.

[0131] Preferably, a second action zone may be provided, for example formed as a strip along the second border located on the opposite side to the first border, and a second predetermined cutting line may be provided extending next to the second border, in particular extending along the entire length of the substrate, so that the second border can be cut off along the cutting line.

[0132] Furthermore, a third and possibly a fourth action zone may be provided, which are, for example, formed as bands along the edge region, each extending perpendicularly to the border, and a third and possibly a fourth predetermined cutting line may be provided, each extending next to the edge of the substrate, so that the respective edge region can be cut off along the cutting line.

[0133] In the case of multiple action zones, the force application may occur in succession in the action zones. While the force application occurs in one particular action zone, a preliminary cut is preferably performed along an associated cutting line, in particular running through this action zone. It may also be envisaged that the force application occurs simultaneously in a number of action zones of multiple action zones and occurs succession in time between the action zones. For example, the zones may be "overlapped", i.e. activated in a time sequence in which, for example, multiple zones are activated simultaneously (for example, the first and second zones are activated, followed by the third and fourth zones).

[0134] In particular, pre-cutting of the substrate may be performed (e.g., in a processing station configured for pre-cutting) along one or more provided cutting lines, followed by cutting of the substrate along one or more provided cutting lines (e.g., in a processing station configured for cutting).

[0135] During cutting, the substrate may also be subjected to a force which preferably acts in the direction of the substrate support, this force being in particular acting in the region of the application surface.

[0136] Before pre-cutting of the substrate along one or more provided cutting lines is performed (e.g., in a processing station configured for pre-cutting), contacting of the substrate to the substrate support may also be performed (particularly in a processing station configured for contacting).

[0137] During contact, the substrate may also be subjected to a force acting in the direction of the substrate support, which force may act, for example, on the area of ​​the utilization surface and also on the area of ​​the waste surface, in which case the force may in particular act first on the area of ​​the utilization surface and then on the area of ​​the waste surface, thereby bringing the substrate into contact with the substrate support from the inside outwards.

[0138] The substrate support may in particular be configured to be mobile, e.g. to be moved from one processing station to the next during the method. The substrate support may for example be mobile within the facility. The substrate support may for example be configured to be transportable, e.g. to be transportable between stations or facilities (e.g. by roller conveyors, robots and / or automated transport systems).

[0139] Furthermore, the substrate support may have means for exposing the substrate placed thereon to a force acting in the direction of the substrate support within an action zone, for example formed as an opening in the substrate support or as continuous pores in the substrate support, by means of which a negative pressure can be applied to the substrate placed on the substrate support.

[0140] In the case of openings in the substrate support, these may have a diameter of, for example, 0.5 mm to 12 mm, preferably 1 mm to 6 mm. The openings may be formed, for example, as cylindrical or approximately cylindrical passages. In the case of interconnected porosity, this may result from a powder metallurgical process.

[0141] In general, the means for applying the force may preferably be configured to ensure that the force is applied locally. For example, it may be envisaged that the structure of the fastening system (e.g. vacuum or vacuum system) can be configured locally sufficiently well. In this case, crosstalk to other zones is preferably excluded or largely avoided. In the case of a vacuum, this may often be assisted by the small diameter of the opening.

[0142] The substrate support may essentially comprise or consist of various materials, for example comprise or consist of plastic or ceramic.

[0143] The substrate support is preferably configured to be movable and / or transportable, so that it may be moved together with the substrate mounted thereon, in particular from one processing station to the next and / or between facilities.

[0144] In one exemplary embodiment, the substrate support comprises an active area within which the means for applying a force are arranged, in which case the active area is less than 80% of the area of ​​the substrate support, preferably less than 60% of the area of ​​the substrate support, particularly preferably less than 40% of the area of ​​the substrate support, and / or the substrate support comprises a compensation area within which the means for applying a force are not arranged, in which case the compensation area is more than 20% of the area of ​​the substrate support, preferably more than 40% of the area of ​​the substrate support, particularly preferably more than 60% of the area of ​​the substrate support.

[0145] The active area may be less than 70% of the area of ​​the substrate support, or less than 30% of the area of ​​the substrate support.

[0146] The active area may, for example, be formed as a strip, which in particular has a width of less than 50% of the width of the substrate support, particularly preferably less than 40% of the width of the substrate support or less than 30% of the width of the substrate support. The substrate support may furthermore preferably comprise a second active area, which in particular preferably extends parallel to the first active area, and furthermore preferably has a third active area and possibly a fourth active area, which in particular preferably extends perpendicular to the first or second active area.

[0147] The active area formed as a band may have a width that is less than 70% of the width of the substrate support.

[0148] In the following, the invention will be explained in more detail on the basis of certain drawings. [Brief description of the drawings]

[0149] [Figure 1] 1 is a schematic diagram of an installation for processing a planar substrate according to a first embodiment; [Diagram 2]2 is a schematic diagram of an installation for processing a planar substrate according to a second embodiment;

[0150] 1 shows an installation 100 for the post-processing of planar glass substrates 1 arranged on a substrate support 10 (carrier). The installation comprises a substrate support transport device 110 configured as a circulator or turntable with four transport sections 112, 114, 116, 118, each of which has a transport direction indicated by an arrow. Furthermore, the installation 100 comprises a number of spatially separated processing stations 200 which are connected to one another by the substrate support transport device 110, so that the substrate support 10 can be transported from one processing station 200 to the next processing station 200 along the respective transport direction.

[0151] In this example, the processing station 200 arranged in the first transport section 112 is configured as a loading station 300 for placing a planar substrate 1 on the substrate support 10. The processing station 200 arranged in the second transport section 114 is configured as a processing station 500 for performing a processing step on the substrate 1 located on the substrate support 10. The processing station 200 arranged in the third transport section 116 is configured as an unloading station 400 for unloading the processed substrate. The empty substrate support 10 returns to the loading station 300 via the transport section 118.

[0152] FIG. 2 likewise shows an installation 100 for post-processing glass substrates 1, in particular UTG. The installation 100 comprises a processing station 200 configured as a loading station 300, which may in particular comprise an inspection device, by means of which the planar substrates can be inspected before being picked up. The installation 100 also optionally comprises in this example an airlock 600 leading to a clean room. The installation 100 further comprises a processing station 500 configured as a pre-cutting station 501, in which the substrate is pre-cut along a cutting line by means of a laser. The installation 100 further comprises a processing station 500 configured as a combined separation and disposal station 504, in which the substrate is broken along the cutting line, the usable material and the waste material are separated and the waste material is sorted. The facility 100 further comprises a processing station 200 configured as a removal station 400, which may in particular comprise an inspection device, by means of which the processed planar substrates can be inspected before being picked up and possibly sorted. The facility 100 further comprises a processing station 200 configured as a substrate support cleaning station 450 for cleaning and / or purifying the substrate support 10, with possible adjustment of the surface forces utilized for the adhesion.

[0153] While horizontal or transverse acceleration is difficult when manufacturing UTG in an online process, this is possible due to the substrate support. A post-processing process may in particular refer to a downstream offline process, so that it is no longer necessary to stop the glass ribbon in an upstream online process to carry out a specific process step, such as cutting. This means that the process chain can be separated, in particular spatially, into raw glass production and post-processing. For example, intermediate steps of packaging and transport may be provided between forming and cutting. However, a post-processing directly connected to an upstream process, such as forming, may also be envisaged.

[0154] Green glass production may for example include a mixture being fed to a melting process followed by forming, online inspection for glass defects and / or thickness measurement. This may result in a green glass sheet (UTG) with an edge, which often does not yet have its final size. The transport may take place for example in a green glass box or any other suitable transport system.

[0155] The offline post-treatment line may be configured as a loop or circulation system as described, in which case the post-treatment may preferably be carried out under clean room or clean room conditions and / or under controlled environmental conditions (T, p, humidity, etc.).

[0156] One exemplary installation may, for example, include one or more of the following aspects, particularly stations: i. Station for inspecting raw glass substrates (for damage, cracks, etc.) ii. A station for automated removal of raw glass substrates (including optional sorting of separation (spacer) material, e.g., sheets) and skilled placement of the raw glass substrates onto substrate supports. iii. Optional: (here or in v.) A station for cleaning raw glass substrates iv. A station for placing a raw glass substrate (one or more raw glass substrates) on a substrate support. v. Optional: A station for cleaning raw glass substrates (see iii above) vi. Optional: Station for checking the correct position of the raw glass substrate (adjustment of the laser cutting device relative to the glass position on the substrate support) vii. Optional: A station for inspecting and locating glass defects for filamentation adaptation. viii. A station for cutting (laser cutting, wheel cutting, diamond cutting, water jet cutting, ultrasonic cutting) to desired sizes (e.g. Gen2, Gen3, Gen5 as well as wafers and freeforms). ix. Breaking or Separation Station x. A station for disposing of cut pieces (including waste products) and trimmings xi. An optional station for cleaning the glass substrates. xii. Inspection station (edge, breakage, size) xiii. A station for removing (manual and / or automatic) the glass substrate from the substrate support. xiv. Station for packaging (final packaging) including the insertion of separation (spacer) material (sheets) xv. Station for cleaning the substrate support xvi. A station for providing a substrate support for step iv.

[0157] One exemplary installation may implement a continuous or intermittent method that includes, for example, one or more of the following steps: 1) melting the mixture; 2) refining the glass melt; 3) homogenizing the glass melt; 4) forming an endless glass ribbon using a downdraw or overflow downdraw process; 5) cooling the glass ribbon; 6) inspecting the glass ribbon for glass defects; 7) cutting the glass ribbon into individual glass sheets; 8) placing the glass plate in a suitable shipping or storage package; 9) sending the glass sheet to a post-processing line; 10) inspecting the glass sheet for glass defects and / or cracks; 11) transferring the glass plate to a suitable substrate support; 12) introducing the glass plate on the substrate support into a cutting device; 13) forming a target break point in the glass sheet; 14) breaking the glass sheet at the target break location; 15) separating a use surface of the substrate from a waste surface of the substrate; 16) optionally washing the "net material" and inspecting the "net material"; 17) Removing the "net material" from the substrate support; 18) packaging the "net material" in a suitable shipping package; 19) cleaning the substrate support and providing the substrate support to the transfer station (11); 20) Discharging the packaged "net material" from the post-processing line.

[0158] The advantages of the invention are, in particular, the flexible adaptation of the size to be cut without downtime during the melting run (in hot production), the enhancement of the product by delivery of the final product to the customer, in particular by cutting to customer size, high flexibility in terms of cycle times for hot forming and offline post-processing, in particular short changeover times (high degree of optimization) during the melting run, especially if the same raw glass can be produced continuously during the melting run. This results in the independence of the melting run from the final product size, in particular a reduction in the required area in hot production due to a reduction in the "cold ends". Furthermore, the separation of the process chain into online / offline processing can result in a higher Overall Equipment Effectiveness (in English OEE) and a minimization of downtimes and / or allow clean room or clean room conditions during post-processing. The separation of the process chain further allows for more precise cutting and, optionally, additional quality checks before packaging and delivery, as well as easy scale-up, for example by running several post-processing lines in parallel. Additionally, the melting tank is not depleted all year round with one type of glass and / or glass thickness, and can therefore be used to produce other types of glass and other sizes. Finally, the present invention allows for the selection of substrate area in the glass substrate before the actual cutting, which can result in less waste in hot production.

[0159] The equipment according to the invention may envisage cycle times of less than 20 seconds, preferably less than 15 seconds, particularly preferably less than 10 seconds per substrate. This allows, for example, to feed multiple equipment from one upstream production line (hot mill / melt bath) in order to generate maximum OEE and cycle speed. For small sizes, even shorter cycle times may often be envisaged. The invention is preferably suitable for the processing of ultra-thin glass, thin glass, flat glass, wafers, films or other thin substrates.

Claims

1. An installation (100) for processing planar substrates (1), in particular planar glass substrates, on a substrate support (10) in multiple steps, comprising: It comprises a plurality of processing stations (200) spatially separated from one another, which processing stations (200) are connected to one another by a substrate support transport device (110) so that a substrate support (10) can be transported from one processing station (200) to the next processing station (200) along a transport path defined by said substrate support transport device (110), so that a planar substrate (1) placed on the substrate support (10) can be subjected to a plurality of processing steps in succession in each of said processing stations (200), one of said processing stations (200) is configured as a loading station (300) configured to place a planar substrate (1) on a substrate support (10); At least one of the processing stations (200) is configured as a processing station (500) configured to process, for example cut, a planar substrate (1) mounted on a substrate support (10), one of said processing stations (200) is configured as an unloading station (400) equipped to unload a processed planar substrate (1) from a substrate support (10); Equipment (100).

2. the substrate support transport device (110) is configured as a circulatory device, whereby the substrate support transport device (110) defines a closed transport path for transporting the substrate supports (10) from the loading station (300) via the at least one processing station (500) and the unloading station (400) and back again to the loading station (300); and / or the substrate support transport device (110) has a plurality of, in particular four, transport sections (112, 114, 116, 118), each of which defines a, in particular linear, transport direction, the transport directions of the transport sections running at an angle to one another, in particular at right angles, and / or The substrate support transport apparatus (110) defines a circular transport path. An apparatus (100) for processing a planar substrate (1) on a substrate support (10) in multiple steps according to claim 1.

3. said loading station (300) comprises a pick-up device for picking up, e.g. lifting, a planar substrate (1) from a stack and for placing said picked up substrate on a substrate support (10); the pick-up device preferably comprises a handling system, e.g. a robot arm and / or a suction gripping device with a negative pressure module, whereby the planar substrate can be sucked onto the suction gripping device; and / or said loading station (300) including an inspection device for inspecting the planar substrate (1) in particular to identify defects, such as breaks or cracks, before picking up said planar substrate (1); 3. An installation (100) for processing a planar substrate (1) on a substrate support (10) in multiple steps according to claim 1 or 2.

4. one or more of said processing stations (200), in particular said loading station (300) and / or said at least one processing station (500), comprises means for subjecting said substrate (1) to a force acting in the direction of said substrate support (10), in particular means for fixing said substrate (1) on said substrate support (10), The means are preferably configured to generate the force acting in the direction of the substrate support (10) by applying a negative pressure to the surface of the substrate facing the substrate support (10), in particular via an opening in the substrate support (10) or via a continuous porosity of the substrate support (10), and / or to generate the force acting in the direction of the substrate support (10) by mechanically pressing or attracting the substrate (1) to the substrate support (10), and / or to generate the force acting in the direction of the substrate support (10) by adhesion or surface forces, in particular by electrostatic charging of the substrate (1) and / or the substrate support (10), and / or The apparatus (100) may include a substrate support (10), the substrate support (10) having openings or continuous pores for applying a negative pressure to a substrate (1) placed thereon, and / or a surface having enhanced electrostatic charging properties or enhanced frictional properties for fixing a substrate (1) placed on the substrate support (10).

3. An installation (100) for processing a planar substrate (1) on a substrate support (10) in multiple steps according to claim 1 or 2.

5. one or more of said processing stations (500) are configured as pre-cutting stations (501) which are configured to pre-cut a planar substrate (1) placed on a substrate support (10) along a predefined cutting line, whereby in particular said cutting line separates a waste surface of said substrate (1) from a utilization surface of said substrate (1), The pre-cutting in particular comprises the introduction of damage into the substrate, preferably extending along the predetermined cutting line, for example by laser, engraving wheel, diamond, water jet cutting and / or ultrasonic cutting; and / or the pre-cutting in particular comprises the introduction of a laser beam into the substrate, preferably along the predetermined cutting line, so that adjacent, spaced apart, in particular filament-like, damages are introduced into the substrate, 3. An installation (100) for processing a planar substrate (1) on a substrate support (10) in multiple steps according to claim 1 or 2.

6. one or more of the processing stations (500) are configured as a separation station (502) configured to separate a planar substrate (1) placed on a substrate support (10) into a plurality of pieces along predetermined cutting lines, in particular into a piece comprising a waste surface of the substrate (1) and a piece comprising a utilization surface of the substrate (1), The separation includes, in particular, the action of forces, moments, temperatures, vibrations and / or the breaking of the planar substrate at a predetermined cut line, in particular at a damage site or sites extending along the cut line, 3. An installation (100) for processing a planar substrate (1) on a substrate support (10) in multiple steps according to claim 1 or 2.

7. one or more of the processing stations (500) is configured as a waste station (503) configured to separate waste material of a planar substrate (1) located on the substrate support (10) from useful material of the planar substrate (1) located on the substrate support (10), in particular to separate pieces of the substrate (1) separated along a predetermined cutting line, comprising a waste surface of the substrate (1), from pieces of the substrate (1) separated along the cutting line, comprising a useful surface of the substrate (1), The sorting comprises removing waste material from the substrate support (10), in particular pieces including waste surfaces of the substrate (1), and / or The sorting includes the detection and separation of the utilized material, in particular the utilized surface of the substrate (1), from the substrate support (10).

3. An installation (100) for processing a planar substrate (1) on a substrate support (10) in multiple steps according to claim 1 or 2.

8. one or more of the processing stations are configured as both a separation station and a disposal station, whereby the processing stations form a combined separation and disposal station (504); 3. An installation (100) for processing a planar substrate (1) on a substrate support (10) in multiple steps according to claim 1 or 2.

9. said unloading station (400) comprises a pick-up device for picking up the processed planar substrate (1) and / or the applied material of said planar substrate (1), in particular a piece comprising the applied surface of said substrate (1), from the substrate support (10) and for depositing, for example, in a packaging box and / or on a stack, the pick-up device preferably comprises a handling system, e.g. a portal system or a robot arm, and / or a suction gripping device with a negative pressure module, by means of which the processed planar substrate and / or a part comprising a workpiece of the planar substrate (1), in particular the workpiece surface of the substrate (1), can be sucked onto the suction gripping device; and / or the removal station (400) comprises an inspection device for inspecting and then picking up the processed planar substrate (1) and / or the applied material of the planar substrate (1), in particular the pieces including the applied surface of the substrate (1), in particular for identifying particles, dirt, defects, such as geometrical defects, angular errors, shell-like fractures, breaks or cracks, 3. An installation (100) for processing a planar substrate (1) on a substrate support (10) in multiple steps according to claim 1 or 2.

10. one of the processing stations is configured as a substrate support cleaning station, which is configured to clean the substrate support (10), in particular after removing from the substrate support (10) a processed planar substrate (1) and / or a piece comprising a used material of the planar substrate (1), in particular a used surface of the substrate (1); 3. An installation (100) for processing a planar substrate (1) on a substrate support (10) in multiple steps according to claim 1 or 2.

11. the loading station (300) is located in the transport path between the substrate support cleaning station and the pre-cutting station, preferably directly therebetween; and / or said pre-cutting station (501) is arranged in said transport path between said loading station and said separating station, preferably directly therebetween; and / or the separation station (502) is located in the transport path between the pre-cutting station and the disposal station, preferably directly therebetween; and / or said disposal station (503) is located in said transport path between said separation station and said removal station (400), preferably directly therebetween; and / or said combined separation and disposal station (504) is located in said transport path between said pre-cutting station and said removal station (400), preferably directly therebetween; and / or the unloading station (400) is located in the transport path between, preferably directly between, the disposal station and the substrate support cleaning station; and / or the substrate support cleaning station (450) is located in the transport path between the unloading station and the loading station, preferably directly therebetween; 3. An installation (100) for processing a planar substrate (1) on a substrate support (10) in multiple steps according to claim 1 or 2.

12. the loading station (300) is arranged in the first or second transport section (112, 114) of the substrate support transport apparatus (110); and / or the pre-cutting station (501) is arranged in the second transport section (114) of the substrate support transport device (110); and / or the separation station (502) is arranged in the second or third transport section (114, 116) of the substrate support transport apparatus (110); and / or the disposal station (503) is arranged in the second or third transport section (114, 116) of the substrate support transport device (110); and / or the combined separation and disposal station (504) is arranged in the second or third transport section (114, 116) of the substrate support transport apparatus (110); and / or the unloading station (400) is arranged in the third or fourth transport section (116, 118) of the substrate support transport apparatus (110); and / or the substrate support cleaning station (450) is disposed in the fourth transport section (118) of the substrate support transport apparatus (110); 3. An installation (100) for processing a planar substrate (1) on a substrate support (10) in multiple steps according to claim 1 or 2.

13. a clean room in which the substrate support transport device (110) and / or the processing station (200) are arranged and preferably an airlock leading to the clean room and / or the substrate support transport device (110) and / or the processing station (200) and / or a cleaning device ... the installation (100) is directly connected to an apparatus for melting and / or shaping raw materials for planar substrates, in particular unprocessed glass with an edge, in particular via an airlock leading to the clean room and / or the clean room, 3. An installation (100) for processing a planar substrate (1) on a substrate support (10) in multiple steps according to claim 1 or 2.

14. A method for processing a planar substrate (1), in particular a planar glass substrate, on a substrate support (10) in multiple steps, comprising: A planar substrate (1) is placed on a substrate support (10) in a processing station (200) configured as a loading station (300), transporting the substrate support (10) together with the planar substrate (1) placed thereon from the loading station (300) by a substrate support transport device (110) either directly or via one or more further processing stations (200) to a processing station (200) configured as a processing station (500), The planar substrate (1) mounted on the substrate support (10) is processed, e.g. cut, in the processing station; transporting the substrate support (10) together with the processed planar substrate (1) placed thereon from the processing station (500) by the substrate support transport device (110) either directly or via one or more further processing stations (200) to a processing station (200) configured as a removal station (400), The method comprises removing the processed planar substrate (1) mounted on the substrate support (10) from the substrate support (10) at the removal station (400).

15. transporting the substrate support (10) from the unloading station (400) back to the loading station (300) by the substrate support transport device (110); 15. Method for processing a planar substrate (1) in multiple steps according to claim 14.

16. transporting the substrate support (10) together with the planar substrate (1) placed thereon from the loading station (300) by a substrate support transport device (110) either directly or via one or more further processing stations (200) to a processing station (500) configured as a pre-cutting station, pre-cutting the planar substrate (1) placed on the substrate support (10) along a predetermined cutting line in the pre-cutting station; transporting the substrate support (10) together with the planar substrate (1) placed thereon from the pre-cutting station by the substrate support transport device (110) either directly or via one or more further processing stations (200) to a processing station (500) configured as a separation station, Separating the planar substrate (1) mounted on the substrate support (10) into a plurality of pieces along the cutting lines in the separation station; the substrate support (10) together with the plurality of pieces of the planar substrate (1) is transported from the separation station by the substrate support transport device (110) directly or via one or more further processing stations (200) to a processing station (500) configured as a separation station, which processing station (500) is configured as a disposal station at the same time, Sorting at least one piece of the planar substrate (1) in the disposal station. Method for treating a planar substrate (1) in multiple steps according to claim 14 or 15.

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