Field programmable solder ball grid array with embedded control system - Patents.com

Abstract

Field Programmable Solder BeTA (FPSBGA) modules can be utilized to assemble PCBs / substrates in any stack-up configuration. The localized field programmable solder BGA includes a control system that provides the necessary feedback for effective control of the thermal profile. The FPSBGA enables the control component (110) to trigger the execution of the temperature application component (120) to cause the non-uniform application of specified temperature parameters to the substrate.

Description

[Technical Field]

[0001] [CROSS-REFERENCE TO RELATED APPLICATIONS] This application claims the benefit of U.S. Provisional Patent Application No. 63 / 260,374, filed August 18, 2021, entitled "FIELD PROGRAMMABLE SOLDER BALL GRID ARRAY WITH EMBEDDED CONTROL SYSTEMS," the disclosure of which is incorporated herein by reference in its entirety for all purposes.

[0002] FIELD OF THE DISCLOSURE The present disclosure relates generally to electronic system assembly, and more particularly to a control system for utilizing field programmable solder. [Background technology]

[0003] Electronic system assemblies can include multiple components, such as systems-on-chips (SOCs), application-specific integrated circuits (ASICs), and printed circuit board assemblies (PCBAs). Such electronic system assemblies can utilize reflow solder to secure the components to the substrate. Traditional convection or mass reflow is significantly limited when addressing array-based applications, and the thermal mass significantly reduces the feasibility of assembly. This increases the likelihood of catastrophic package integrity failure. [Brief explanation of the drawings]

[0004] [Figure 1] 1 illustrates a system for implementing a programmable solder ball reflow grid array including a control system and temperature application components according to an aspect of the present application.

[0005] [Figure 2A] FIG. 1 is a perspective view of an exemplary electronic system assembly including an array of solder balls that can be utilized to create electronic traces on the electronic system assembly. [Figure 2B]FIG. 1 is a perspective view of an exemplary electronic system assembly including an array of solder balls that can be utilized to create electronic traces on the electronic system assembly.

[0006] [Figure 3] FIG. 1 is a block diagram of an example architecture of a control system for performing programmable solder ball reflow in accordance with one or more aspects of the present application.

[0007] [Figure 4A] 1 is an illustration of a substrate incorporating traces generated in accordance with an execution program executed by a control component in accordance with one or more aspects of the present application. [Figure 4B] 1 is an illustration of a substrate incorporating traces generated in accordance with an execution program executed by a control component in accordance with one or more aspects of the present application. [Figure 4C] 1 is an illustration of a substrate incorporating traces generated in accordance with an execution program executed by a control component in accordance with one or more aspects of the present application. [Figure 4D] 1 is an illustration of a substrate incorporating traces generated in accordance with an execution program executed by a control component in accordance with one or more aspects of the present application.

[0008] [Figure 5] FIG. 10 is a flow diagram illustrating a control program implemented by a control component to apply a temperature application component, according to an aspect of the present application. DETAILED DESCRIPTION OF THE INVENTION

[0009] The following detailed description of certain embodiments presents various descriptions of specific embodiments. However, the innovations described herein can be embodied in many different ways, for example, as defined and encompassed by the claims. In this description, reference will be made to the drawings, where like reference numbers and / or terminology may indicate identical or functionally similar elements. It will be understood that elements depicted in the figures are not necessarily drawn to scale. Furthermore, it will be understood that certain embodiments can include more elements than shown in the drawings and / or a subset of the elements depicted in the drawings. Furthermore, some embodiments can incorporate any suitable combination of features from two or more drawings.

[0010] According to aspects of the present application, field programmable solder ball grid array (FPSBGA) modules can be utilized to assemble PCBs / substrates in any stackup configuration. A control system is operable to obtain a system configuration associated with a reflow grid array on the substrate. The system configuration can include at least one specified temperature parameter of a temperature-applying component and at least one trace pattern for positioning the temperature-applying component along the substrate according to the reflow grid array. The control system can then execute a control program to apply the temperature-applying component according to the at least one trace pattern. As described in detail, applying the temperature-applying component according to the at least one trace pattern is characterized by non-uniform application of the specified temperature parameter to the substrate. The non-uniform application can correspond to applying specified temperature attributes to portions of the substrate, illustratively using a solder ball array to create specified traces. Furthermore, the non-uniform application of the specified temperature parameter can minimize or mitigate application of elevated temperatures to other portions of the substrate, such as portions of dielectric material, mounted components (e.g., temperature-sensitive components), etc.

[0011] Localized field-programmable solder ball-shaped arrays (FPSBGAs) solve this problem by decoupling the need for global heating from localized heating. Illustratively, incorporating FPSBGAs can create additional space by freeing up much-needed area on electronic systems, increasing application density. Illustratively, FPSBGAs also feature a fully integrated control system that utilizes passive / active embedding technology embedded within the module outline. This control system provides the necessary feedback for effective control of the thermal profile, which can be customized based on the solder material used. It targets array-based applications, such as neural network computing or machine learning compute node applications. Furthermore, FPSBGAs enable vertical reflow solutions, helping to increase packaging density, resulting in increased integration density. They also address challenges with overall thermal mass that are difficult to address with traditional reflow techniques without compromising performance or lifetime reliability.

[0012] The FPSBGA and associated control system described herein can be used to provide mass reflow soldering for mounting components onto an electronic system assembly. Components that can be incorporated or utilized include, but are not limited to, circuit boards (e.g., PCBAs, daughter boards, laminated PCBAs, etc.), heat sinks, bus bars, metal plates, sheet metal plates, and / or other metal components.

[0013] FIG. 1 illustrates a system 100 for implementing a programmable solder ball reflow grid array, including a control system and a temperature-application component, according to an embodiment of the present application. The system 100 includes a control processing system 110 including at least one control processing component 112 for receiving configuration information related to programmable reflow on an implemented substrate. The control processing component 112 can also operate a temperature-application component 120 and receive feedback regarding the achievement of desired / specified temperature parameters. The control processing system 100 can include one or more data stores for implementing the control program. The data stores can include a trace pattern data store 114 corresponding to specified or generated trace patterns to be implemented on the substrate. The data store can also include one or more machine learning algorithms trained to provide control signals to the temperature-application component 120, receive feedback / operational parameters regarding the execution of the control signals, and provide additional or updated control signals.

[0014] The system 100 further includes a temperature application control component 120 corresponding to one or more physical components for mounting a substrate and locally applying a heat source 122 to at least a portion of the mounted substrate. The temperature application control component 120 can correspond to any of a variety of physical hardware and associated software components based on operating parameters such as substrate dimensions, operating temperature, power consumption, etc. The temperature application control component 120 can receive control signals from the control processing component, including positioning information, temperature control, duration, etc. The temperature application control component 120 can include multiple data stores 124, 126 for storing and executing received control signals and for recording and storing feedback.

[0015] 1 is intended to be a logical representation of the various components / systems of system 100. As such, those skilled in the art will appreciate that implementations of individual systems or components included in system 100 may include any number of physical devices, computing devices, communication networks, and other components or physical items. As such, FIG. 1 is for illustrative purposes only.

[0016] 2A and 2B are perspective views of an exemplary electronic system assembly including an array of solder balls that can be utilized to create electronic traces on the electronic system assembly. More specifically, FIGS. 2A and 2B are perspective views of exemplary electronic system assemblies 200, 250 that include arrays of solder balls 202, 252 that can be utilized to create electronic traces on the electronic system assembly. Upon application of a heat source, such as from temperature-application component 120, one or more of the solder balls in array 202, 252 may be activated by transitioning to a liquid or semi-liquid form.

[0017] Illustratively, the array of solder balls can correspond to different designs of an electronic system assembly. For example, electronic system assembly 200 of FIG. 1A can correspond to a top layer of an electronic system assembly. Electronic system assembly 250 of FIG. 1B can correspond to an inner layer of an electronic system assembly. In an illustrative embodiment, the array of solder balls is formed as a matrix having 33 rows 204, 254, with each row having 31 solder balls. The number of rows in the array and the number of solder balls in each row can vary, and the illustrated electronic system assemblies 200, 250 are exemplary. As described in more detail below, by locally applying a heat source to solder ball arrays 202, 252 for a specified period of time, individual sets of solder balls can form trace patterns along a portion of the electronic system assembly.

[0018] In an exemplary embodiment, the amount of heat required to activate an individual solder ball on the array can be calculated as a function of the solder material and the symmetry of the array of solder balls in one embodiment. Illustratively, the heat required to raise the solder temperature is defined as follows:

[0019] TIFF2024534017000002.tif2175

[0020] The total amount of heat required to melt the solder can be defined as:

[0021] TIFF2024534017000003.tif2175

[0022] Therefore, the total heat required for each solder ball can be defined as follows: TIFF2024534017000004.tif2175

[0023] Table 1 shows sample current and temperature values. [Table 1]

[0024] FIG. 3 is a block diagram of an example architecture of a control system component 112 for performing programmable solder ball reflow in accordance with one or more aspects of the present application. The general architecture of the control system component 112 shown in FIG. 3 includes an arrangement of computer hardware and software components that may be used to implement aspects of the present disclosure. As shown, the control system component 112 may include a processing unit 302, an input / output device interface 308, a computer-readable medium 306, and a network interface 304, all of which may communicate with each other via a communication bus. The components of the control system component 112 may be physical hardware components or may be implemented as software modules. For example, the control system component 112 may be implemented as a general-purpose computing device configured with the illustrated executable code to implement the functions, or as a dedicated computing component.

[0025] The network interface 304 may provide connectivity to one or more networks, such as a communication network, for interacting with the temperature application component 120. The input / output device interface 308 may be an interface for receiving or transmitting signals. The computer-readable medium drive 306 may be utilized to access executable components or data. In some embodiments, the control system component 112 may include more (or fewer) components than those shown in FIG. 3 .

[0026] The memory 310 may include computer program instructions that the processing unit 302 executes to implement one or more embodiments. The memory 310 typically includes RAM, ROM, or other persistent or non-transitory memory. The memory 310 may store interface software 312 and an operating system 314 that provides computer program instructions used by the processing unit 302 in the general management and operation of the control system component 112. The memory 310 may further include computer program instructions and other information for implementing aspects of the present disclosure. For example, in one embodiment, the memory 310 includes interface software 316 for sending control signals to the temperature-application component 120 and receiving feedback / processing results regarding the application of localized energy / heat to the substrate. The memory 310 also includes a reflow configuration processing component 318 for processing configuration information associated with the programmable solder ball reflow grid array. The configuration information illustratively includes one or more temperature parameters / attributes for the temperature-application component 120 and desired / specified traces to be generated on the mounted substrate.

[0027] The memory further includes a machine learning algorithm component 320 corresponding to one or more machine learning algorithms for processing the temperature parameters / attributes, the generated feedback / processing results, and the desired trace pattern and generating corresponding control signals for the temperature application component 120. Illustratively, the machine learning algorithm is generated based on training the machine learning algorithm based on a training set corresponding to processing inputs and generating outputs related to the application of heat. However, by way of non-limiting example, the machine learning algorithm can incorporate different learning models, including, but not limited to, a supervised learning model, an unsupervised learning model, a reinforcement learning model, or a feature-based learning model. Depending on the type of learning model employed in the machine learning algorithm, the configuration for processing the collected individual information may differ (e.g., using a training set for a supervised learning model or a semi-supervised learning model). In other embodiments, the machine learning algorithm can implement a reinforcement-based learning model that implements a penalty / reward model implemented by the control system.

[0028] As described above, in accordance with aspects of the present application, operation of temperature-application component 120 can be controlled to apply heat non-uniformly to a portion of a substrate. Illustratively, operation of temperature-application component 120 can be controlled to localize specific temperature parameters to cause one or more solder balls in an array of solder balls (as shown in FIG. 2A or 2B ) to form traces according to a desired trace pattern or otherwise become liquid or semi-liquid according to a desired pattern. FIGS. 4A-4D are illustrations of a substrate incorporating traces generated according to an executable program implemented by a control component according to one or more aspects of the present application.

[0029] 4A and 4B are illustrations of trace elements that may be utilized on one or more layers of an electronic assembly. Illustratively, FIGS. 4A and 4B correspond to one or more embodiments of electronic assemblies 400 and 420 including traces 402 that may be utilized on both sides of a layer. In this embodiment, the trace elements 402 are symmetrical about the horizontal axis of the substrate 402. FIG. 4A shows a single electronic assembly 400 including a single substrate 402 having traces 404. The substrate 402 may include copper pads 406 for portions / regions of the substrate 402 on which one or more components may be mounted. Additionally, the substrate 402 may include one or more portions or sections 408 that may be non-conductive or substantially non-conductive, such as a dielectric material used as an insulating layer (e.g., poorly conductive). Dielectric materials may include, but are not limited to, porcelain, mica, glass, plastic, metal oxides, and the like.

[0030] 4B shows a multi-layer electronic assembly 420 including multiple substrates 422A-422J. In this embodiment, the multiple substrates are complementary and every other layer is free of trace elements.

[0031] 4C-4D are illustrations of trace elements that may be utilized on one or more layers of an electronic assembly. Illustratively, FIGS. 4C-4D correspond to traces that may be utilized on one side of a layer. In this embodiment, the trace elements 402 are asymmetric with respect to the horizontal axis of the substrate 452. FIG. 4C shows a single electronic assembly 450 including a single substrate 452 having traces 454. The substrate 452 may include copper pads 456 for portions / regions of the substrate 452 on which one or more components may be mounted. Additionally, the substrate 452 may include one or more portions or sections 408 that may be non-conductive or substantially non-conductive, such as a dielectric material used as an insulating layer (e.g., poorly conductive). As discussed above, dielectric materials may include, but are not limited to, porcelain, mica, glass, plastic, metal oxides, and the like.

[0032] 4B shows a multi-layer electronic assembly 470 including multiple substrates 472A-472J. In this embodiment, the substrates are complementary, with every other layer being free of trace elements. Substrate 472 may have two copper pads 476 mounted thereon.

[0033] 5 is a flow diagram illustrating a control program implemented by the control component 112 to apply a temperature application component 120 according to aspects of the present application. At block 502, the control component 112 obtains a system configuration associated with a reflow grid array on a substrate. Illustratively, the system configuration includes at least one specified temperature parameter for the temperature application component 120. The temperature parameter may include a specified temperature range to be applied. In other embodiments, the temperature parameter may include a temperature category or level (e.g., low, high, medium, etc.).

[0034] Additionally, the system configuration can include at least one trace pattern for positioning temperature-applying components along the substrate according to a reflow grid array. The trace pattern can be specified in a variety of ways, including by graphical representation, by reference to a template design or pre-configured shape / pattern, by coordinate description, etc.

[0035] At block 504, the control component 112 executes or causes to be executed a control program to cause application of a temperature-applying component according to at least one trace pattern. Illustratively, this begins with application of temperature parameters on a first portion of the substrate. As previously described, application of the temperature-applying component can be configured to apply a non-uniform application resulting from specified temperature parameters to the substrate. Illustratively, the control program can include applying the temperature-applying component along a portion of the substrate having the solder ball grid array for a specified time or to achieve a specified temperature range such that the solder balls achieve a liquid or semi-liquid phase. For example, application of the temperature parameters can cause the formation of trace elements.

[0036] At block 506, the control component 112 can receive feedback regarding the application. If the desired temperature or resulting state is not achieved, the control component 112 remains in the current section. Alternatively, if the desired temperature configuration is achieved, the control component continues to additional or next sections according to the pattern specified in the configuration component. Illustratively, one or more components or sections of the substrate can be omitted to achieve non-uniform application of temperature parameters. When additional sections or sections are no longer needed, the control component 112 can stop sending control signals or cause the temperature application component 120 to cease operation. Thus, sections such as components on copper pads or portions of dielectric material can receive less temperature input from the temperature application component 120. At block 508, the routine 500 ends.

[0037] The foregoing disclosure is not intended to limit the disclosure to the precise form or particular field of use disclosed. Accordingly, various alternative embodiments and / or modifications to the disclosure, whether expressly described or implied herein, are contemplated as possible in light of the present disclosure. While embodiments of the present disclosure have been described in this manner, those skilled in the art will recognize that changes can be made in form and detail without departing from the scope of the present disclosure. Accordingly, the present disclosure is limited only by the claims.

[0038] In the foregoing specification, the present disclosure has been described with reference to specific embodiments. However, as those skilled in the art will understand, the various embodiments disclosed herein can be modified or embodied in various other ways without departing from the spirit and scope of the present disclosure. Accordingly, this description is to be considered illustrative and is for the purpose of teaching those skilled in the art how to make and use various embodiments of the disclosed press-fit fastener assembly. It should be understood that the forms of the disclosure shown and described herein are to be construed as representative embodiments. Equivalent elements, materials, processes, or steps may be substituted for those typically shown and described herein. Furthermore, certain features of the present disclosure can be utilized independently of the use of other features, as will become apparent to those skilled in the art after having the benefit of this description of the present disclosure. The terms "including," "comprising," "incorporating," "consisting of," "having," "being," and the like, as used to describe and claim the present disclosure, are intended to be non-exclusive, i.e., allowing for the presence of items, components, or elements not expressly described. References to the singular should also be construed to relate to the plural.

[0039] Furthermore, the various embodiments disclosed herein should be construed in an illustrative and explanatory sense, and should not be construed as limiting the present disclosure in any way. All joinder references (e.g., attached, affixed, coupled, connected, etc.) are used solely to aid the reader in understanding the present disclosure and do not create limitations with respect to the position, orientation, or use of the systems and / or methods disclosed herein in particular. Accordingly, any joinder references should be interpreted broadly. Furthermore, such joinder references do not necessarily imply that two elements are directly connected to each other. Furthermore, all numerical terms, such as, but not limited to, "first," "second," "third," "primary," "secondary," "main," or other conventional and / or numerical terms, should be construed only as identifiers to aid the reader's understanding of the various elements, embodiments, variations and / or modifications of the present disclosure, and in particular cannot impose any limitations regarding the order or priority of any element, embodiment, variation and / or modification relative to or over other elements, embodiments, variations and / or modifications.

[0040] It will also be understood that one or more of the elements shown in the drawings / figures may also be implemented in a more separate or integrated manner, or may be removed or rendered inoperable in certain cases, as may be useful depending on the particular application.

Claims

1. A system, a temperature application component, wherein the temperature application component is controllable according to instructions regarding position and temperature, and a control unit for causing operation of the temperature application component, wherein when the control unit is executed, the control unit is caused to obtain a system configuration related to a reflow grid array on a substrate, the system configuration including at least one of the specified temperature parameters for the temperature application component according to the reflow grid array and at least one trace pattern for positioning the temperature application component along the substrate, the at least one trace pattern being stored in a trace pattern data store (114) of the system, and a control unit including computer-executable instructions for executing a control program to apply the temperature application component according to the at least one trace pattern, applying the temperature application component according to the at least one trace pattern is characterized by non-uniform application of the specified temperature parameters to the substrate, and the non-uniform application of the specified temperature parameters forms trace elements (404) on solder balls (202, 252) related to the substrate (402) according to the at least one trace pattern. A system.

2. The system according to claim 1, wherein the control program for causing application of the temperature application component includes at least one machine learning component for causing application of the temperature application component according to the at least one trace pattern on the substrate.

3. The system according to claim 1, wherein the at least one trace pattern corresponds to one side of the substrate.

4. The system configuration according to claim 1, wherein the system configuration includes a reflow grid array on a plurality of substrates, and each individual substrate includes at least one trace pattern for positioning the temperature application component along the substrate according to the reflow grid array.

5. The system according to claim 4, wherein the individual trace patterns of the plurality of substrates are complementary to adjacent substrates.

6. The system according to claim 1, wherein the control unit further operates to receive feedback regarding the application of the temperature application component to a designated portion of the substrate.

7. The system according to claim 1, wherein the substrate includes one or more portions related to a dielectric material, and the application of the temperature application component by the at least one trace pattern is characterized by a non-uniform application of the designated temperature parameters to the substrate, and includes minimizing the application of the temperature application component to the one or more portions related to the dielectric material.

8. The system according to claim 1, wherein the substrate includes one or more components mounted on the substrate, and the application of the temperature application component to the substrate by the at least one trace pattern is characterized by a non-uniform application of the designated temperature parameters to the substrate, and includes minimizing the direct application of the temperature application component to the one or more components mounted on the substrate.

9. The system according to claim 1, wherein the at least one trace pattern includes a pattern symmetric with respect to an axis of the substrate.

10. The system according to claim 1, wherein the at least one trace pattern includes a pattern asymmetric with respect to an axis of the substrate.

11. A control system for selectively applying a temperature application component to a substrate, the control system comprising One or more processing components, wherein the control system acquires a specification of at least one trace pattern for positioning the temperature application component along the substrate according to a reflow grid array, the at least one trace pattern being stored in a trace pattern data store (114) of the control system, and comprises one or more processing components executable to execute executable instructions to cause the temperature application component to be applied according to the at least one trace pattern. Applying the temperature application component according to the at least one trace pattern is characterized by a non-uniform application of specified temperature parameters to the substrate, and the non-uniform application of the specified temperature parameters causes trace elements to be formed on solder balls associated with the substrate according to the at least one trace pattern. A control system. Claim 12 The control system according to claim 11, wherein the one or more processing components include at least one machine learning component for causing application of the temperature application component according to the at least one trace pattern on the substrate. Claim 13 The control system according to claim 11, wherein the at least one trace pattern corresponds to one side of the substrate. Claim 14 The system configuration includes the reflow grid array on a plurality of substrates, and each individual substrate includes at least one trace pattern for positioning the temperature application component along the substrate according to the reflow grid array. The control system according to claim 11. Claim 15 The control system according to claim 14, wherein the individual trace patterns of the plurality of substrates are complementary to adjacent substrates. Claim 16 The control system according to claim 11, wherein the control system further operates to receive feedback regarding the application of the temperature application component to a designated portion of the substrate. **Claim 17** Applying the temperature application component according to the at least one trace pattern is characterized by a non-uniform application of the designated temperature parameters to the substrate, and includes minimizing the application of the temperature application component to one or more identified portions of the substrate. The control system according to claim 11. **Claim 18** The control system according to claim 11, wherein the at least one trace pattern includes a pattern symmetric with respect to the axis of the substrate. **Claim 19** The control system according to claim 11, wherein the at least one trace pattern includes a pattern asymmetric with respect to the axis of the substrate. **Claim 20** A control method for applying a temperature application component to a substrate, the control method comprising: Obtaining a specification of at least one trace pattern for positioning the temperature application component along the substrate according to a reflow grid array, wherein the at least one trace pattern is stored in a trace pattern data store (114) of the system; Executing a control program for causing the application of the temperature application component according to the at least one trace pattern, wherein applying the temperature application component according to the at least one trace pattern is characterized by a non-uniform application of designated temperature parameters to the substrate, and the non-uniform application of the designated temperature parameters causes trace elements to be formed in solder balls associated with the substrate according to the at least one trace pattern; A control method including the above. **Claim 21** The control method according to claim 20, wherein the step of executing the control program includes executing a machine learning algorithm for applying the temperature application component according to the at least one trace pattern on the substrate.

22. The control method according to claim 20, further comprising the step of receiving feedback regarding the application of the temperature application component to a designated portion of the substrate.

23. Applying the temperature application component according to the at least one trace pattern is characterized by non-uniform application of the designated temperature parameters to the substrate and includes minimizing the application of the temperature application component to one or more identified portions of the substrate. The control method according to claim 20.

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