Liquid jet head and liquid jet device

Abstract

To provide a liquid jet head and a liquid jet device that can suppress deterioration in adhesive strength between a first channel member and a second channel member, and maintain the adhesion stability for a long period of time.SOLUTION: A liquid jet head comprises: a nozzle 21 for jetting liquid; first channel members 15, 100 for defining a part of a channel for supplying liquid to the nozzle 21; a metal-made second channel member 40 for defining a part of the channel by being adhered to the first channel member 15; and an adhesive agent 60 for binding the first channel member to the second channel member. The adhesive agent contains a water-insoluble chelate compound.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a liquid ejection head that ejects liquid, and a liquid ejection apparatus. [Background technology]

[0002] 2. Description of the Related Art A liquid ejecting apparatus, typified by an ink jet recording apparatus such as a printer or a plotter, includes a liquid ejecting head, such as an ink jet recording head, that ejects ink.

[0003] For example, Patent Document 1 discloses a liquid ejection head including a nozzle plate having nozzles for ejecting liquid formed therein, a flow path plate laminated on the nozzle plate, a diaphragm member laminated on the flow path plate, and a frame member laminated on the diaphragm member. The diaphragm member is formed from a nickel (Ni) metal plate and manufactured by electroforming. The document also describes that the nozzle plate, flow path plate, and diaphragm member as a thin-film member are laminated. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-54446 Summary of the Invention [Problem to be solved by the invention]

[0005] However, when a metal flow path member is bonded with an adhesive to a flow path member that forms a flow path through which a liquid flows, as in the liquid jet head disclosed in Patent Document 1, there is a problem in that when the adhesive interface comes into contact with the liquid in the flow path, metal ions are eluted from the adhesive interface into the liquid in the flow path, which may result in a decrease in adhesive strength. Such problems also exist in liquid jet heads and liquid jet devices that eject liquids other than ink. [Means for solving the problem]

[0006] An aspect of the present invention that solves the above problem is a liquid ejection head comprising: a nozzle for ejecting liquid; a first flow path member that defines a portion of a flow path for supplying liquid to the nozzle; a second flow path member made of metal that is adhered to the first flow path member to define a portion of the flow path; and an adhesive that adheres the first flow path member and the second flow path member, wherein the adhesive contains a water-insoluble chelate compound.

[0007] Another aspect of the present invention is a liquid ejecting apparatus including the liquid ejecting head of the above aspect. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a schematic diagram of an ink jet recording apparatus according to a first embodiment. [Figure 2] FIG. 2 is an exploded perspective view of the recording head according to the first embodiment. [Figure 3] FIG. 2 is a plan view of the recording head according to the first embodiment. [Figure 4] 1 is a cross-sectional view of a recording head according to a first embodiment. [Figure 5] 1 is a table ta1 showing the components and test results of chelate compound mixtures 1-4 and chelate compounds 5-6. [Figure 6] 1 is Table ta2 showing the components and test results of adhesive samples 1 to 10. [Figure 7] 1 is Table ta3 showing the components and test results of adhesive samples 11 to 20. [Figure 8] 1 is Table ta4 showing the components and test results of adhesive samples 21 to 30. [Figure 9] 1 is Table ta5 showing the components and test results of adhesive samples 31 to 40. [Figure 10] 1 is Table ta6 showing the components and test results of adhesive samples 41 to 44. DETAILED DESCRIPTION OF THE INVENTION

[0009] The present invention will be described in detail below based on embodiments. However, the following description shows only one aspect of the present invention and can be arbitrarily modified within the scope of the present invention.

[0010] In each figure, X, Y, and Z represent three spatial axes that are orthogonal to each other. The directions along these three axes are the X, Y, and Z directions, without limiting them to positive and negative directions. The directions of the arrows in each figure are the X1, Y1, and Z1 directions, and the directions opposite the arrows are the X2, Y2, and Z2 directions. The Y direction (Y1 and Y2 directions) corresponds to the medium transport direction. The Z2 direction is vertically downward, and the Z1 direction is vertically upward. Note that the Z direction does not have to be vertical. Furthermore, although the X, Y, and Z axes are orthogonal to each other, this is not a limitation, and they may intersect at an angle between 80 degrees and 100 degrees, for example.

[0011] First Embodiment The inkjet recording apparatus (hereinafter simply referred to as "recording apparatus") 1 shown in FIG. 1 is an example of a liquid ejection apparatus, and is a printing apparatus that ejects and impacts ink, a type of liquid, as ink droplets onto a medium M such as printing paper, and prints an image or the like by forming an array of dots on the medium M. Examples of the liquid include ultraviolet-curable ink (hereinafter referred to as UV ink) and solvent-based ink. Note that the medium M can be made of any material, such as recording paper, resin film, or cloth.

[0012] Solvent-based ink is an ink whose main solvent is an organic solvent, and is also called solvent ink or non-aqueous ink. Solvent-based ink is an ink containing one or more of glycol ethers, glycol ether esters, dibasic acid esters, ester-based solvents, hydrocarbon-based solvents, and alcohol-based solvents. UV ink is an ink containing, for example, a monomer or oligomer that undergoes a polymerization reaction and hardens when irradiated with ultraviolet light. Examples of UV ink compositions include inks containing, as a polymerizable compound, any of (meth)acrylates, (meth)acrylamides, and N-vinyl compounds.

[0013] The recording device 1 includes an ink jet recording head 2 (hereinafter also simply referred to as the “recording head 2”), a liquid container 3, a control unit 4, a transport mechanism 5 that feeds out the medium M, and a moving mechanism 6.

[0014] The recording head 2 is an example of a liquid ejection head, and ejects ink supplied from a liquid container 3 from a plurality of nozzles onto the medium M. The detailed configuration of the recording head 2 will be described later.

[0015] The liquid container 3 is an example of a liquid storage unit that stores the liquid to be supplied to the recording head 2, and stores multiple types of ink (for example, multiple colors) individually to be ejected from the recording head 2. Examples of liquid storage units include a cartridge that can be attached to and detached from the recording device 1, a bag-shaped ink pack made of flexible film, and an ink tank that can be refilled with ink.

[0016] The control unit 4 includes a control device such as a CPU (Central Processing Unit) or an FPGA (Field Programmable Gate Array), and a storage device such as a semiconductor memory. The control unit 4 comprehensively controls each element of the recording device 1, i.e., the recording head 2, the transport mechanism 5, the moving mechanism 6, etc., by the control device executing a program stored in the storage device.

[0017] The transport mechanism 5 is a mechanism that transports the medium M in the X direction. Specifically, the transport mechanism 5 has a transport roller 7, and the rotation of the transport roller 7 transports the medium M in the X direction. The transport mechanism 5 that transports the medium M is not limited to a mechanism that includes the transport roller 7, and may be, for example, a mechanism that transports the medium M using a belt or a drum.

[0018] The movement mechanism 6 is a mechanism for reciprocating the recording head 2 in the Y direction, and includes a conveyor 8 and a conveyor belt 9. The conveyor 8 is a generally box-shaped structure, a so-called carriage, that houses the recording head 2, and is fixed to the conveyor belt 9. The conveyor belt 9 is an endless belt that is stretched along the Y direction. The recording head 2 moves back and forth in the Y direction together with the conveyor 8 as the conveyor belt 9 rotates under the control of the control unit 4. The conveyor 8 may be configured to carry a liquid container 3 together with the recording head 2.

[0019] Under the control of the control unit 4, the recording head 2 performs an ejection operation in which ink supplied from the liquid container 3 is ejected as ink droplets from each of a plurality of nozzles onto the medium M in the Z2 direction. This ejection operation by the recording head 2 is performed in parallel with the transport of the medium M by the transport mechanism 5 and the reciprocating movement of the recording head 2 by the movement mechanism 6, thereby forming an image in ink on the surface of the medium M, or so-called printing.

[0020] The recording head 2 will be described using Figures 2 to 4. Figure 2 is an exploded perspective view of the recording head 2, Figure 3 is a plan view of the recording head 2, and Figure 4 is a cross-sectional view of the recording head. Figure 3 shows the pressure chamber substrate 10 and filter member 40, which are elements that make up the recording head 2, but does not show the protection substrate 30 and case member 100. Figure 4 is a view corresponding to line AA in Figure 3.

[0021] As shown in the figure, the recording head 2 according to this embodiment includes a pressure chamber substrate 10. The pressure chamber substrate 10 is made of, for example, a silicon substrate, a glass substrate, an SOI substrate, or any of various ceramic substrates.

[0022] In the pressure chamber substrate 10, pressure chambers 12, which are recesses that open to the Z2 direction side, are arranged in a line along the X direction. The multiple pressure chambers 12 are arranged in a straight line along the X direction so that they are positioned at the same position in the Y direction. Adjacent pressure chambers 12 in the X direction are partitioned by partition walls (not shown). In this embodiment, the pressure chambers 12 are arranged in a line along the X direction. Two rows of pressure chambers, each consisting of multiple pressure chambers 12 lined up in a line, are provided in the Y direction. The multiple pressure chambers 12 in each row are arranged so that they are positioned at the same position in the Y direction. The arrangement of the pressure chambers 12 is not particularly limited. For example, the arrangement of the multiple pressure chambers 12 arranged in the X direction may be a so-called staggered arrangement, in which every other pressure chamber 12 is shifted in the Y direction.

[0023] The pressure chamber 12 is formed in a rectangular shape with a length in the Y direction longer than its length in the X direction in a plan view seen in the Z direction. Of course, the shape of the pressure chamber 12 is not particularly limited, and may be a parallelogram, polygon, circle, oval, etc. Note that the oval shape referred to here refers to a shape based on a rectangular shape with semicircular ends at both longitudinal ends, and includes a rounded rectangular shape, an elliptical shape, an egg shape, etc.

[0024] On the Z2 direction side of the pressure chamber substrate 10, a communication plate 15, a nozzle plate 20, and a compliance substrate 110 are laminated in this order.

[0025] The communicating plate 15 is provided with nozzle communicating passages 16 that communicate between the pressure chambers 12 and the nozzles 21. The communicating plate 15 is provided with a first manifold portion 17 and a second manifold portion 18 that constitute a part of a manifold 130 that serves as a common liquid chamber through which the multiple pressure chambers 12 communicate. The first manifold portion 17 is provided so as to penetrate the communicating plate 15 in the Z direction. The second manifold portion 18 is provided so as to open on the surface on the Z2 direction side without penetrating the communicating plate 15 in the Z direction. The first manifold portion 17 and the second manifold portion 18 also constitute the manifold 130. The manifold 130 is provided continuously along the X direction, and the supply communicating passages 19 that communicate between the pressure chambers 12 and the manifold 130 are arranged side by side in the X direction.

[0026] The communication plate 15 is provided with supply communication passages 19 that communicate with one end of the pressure chambers 12 in the Y direction, and are independent of each other for each pressure chamber 12. The supply communication passages 19 communicate between the second manifold portion 18 and each pressure chamber 12, and supply ink in the manifold 130 to each pressure chamber 12.

[0027] The communicating plate 15 may be a silicon substrate, a glass substrate, an SOI substrate, various ceramic substrates, a metal substrate, or the like.

[0028] The nozzle plate 20 is provided on the surface of the communication plate 15 on the Z2 direction side, which is opposite to the pressure chamber substrate 10. Nozzles 21 that communicate with each pressure chamber 12 via nozzle communication paths 16 are formed in the nozzle plate 20.

[0029] The plurality of nozzles 21 are provided corresponding to each pressure chamber 12 and are arranged in a line along the X direction. Two nozzle rows each consisting of a plurality of nozzles 21 arranged in a line are provided in the Y direction. The plurality of nozzles 21 in each row are arranged so that they are positioned at the same position in the Y direction. The arrangement of the nozzles 21 is not particularly limited. For example, the nozzles 21 arranged in a line in the X direction may be arranged so that every other nozzle 21 is shifted in the Y direction.

[0030] The material of the nozzle plate 20 is not particularly limited, and examples thereof include a silicon substrate, a glass substrate, an SOI substrate, various ceramic substrates, and a metal substrate. Examples of metal plates include a stainless steel substrate. Furthermore, the nozzle plate 20 can also be made of an organic material such as a polyimide resin.

[0031] The compliance substrate 110, together with the nozzle plate 20, is provided on the surface of the communication plate 15 on the Z2 direction side, which is opposite to the pressure chamber substrate 10. The compliance substrate 110 is provided around the nozzle plate 20 and seals the openings of the first manifold section 17 and the second manifold section 18 provided in the communication plate 15. In this embodiment, the compliance substrate 110 includes a sealing film 111 made of a flexible thin film, and a fixed substrate 112 made of a hard material such as metal. The region of the fixed substrate 112 facing the manifold 130 is a removed portion 118 that is completely removed in the thickness direction. Therefore, one side of the manifold 130 forms a compliance portion 119 that is sealed only by the flexible sealing film 111.

[0032] A vibration plate 84 and a piezoelectric actuator 80 are provided on the surface of the pressure chamber substrate 10 on the Z1 direction side. That is, the pressure chamber substrate 10, vibration plate 84, and piezoelectric actuator 80 are layered in this order from the Z2 direction to the Z1 direction.

[0033] The diaphragm 84 is composed of an elastic film provided on the surface of the pressure chamber substrate 10 facing the Z1 direction and an insulating film provided on the surface of the elastic film facing the Z1 direction. The elastic film is, for example, a film made of silicon oxide (SiO2). When a silicon substrate is used as the pressure chamber substrate 10, such an elastic film can be formed by thermally oxidizing the surface of the pressure chamber substrate 10 facing the Z1 direction. The insulating film is, for example, a film made of zirconium oxide (ZrO2). Such an insulating film can be formed, for example, by forming a layer of simple zirconium by sputtering or the like and then thermally oxidizing the layer. Note that the diaphragm is not limited to one made of an elastic film and an insulating film. For example, the diaphragm 84 may be provided with either an elastic film or an insulating film. Furthermore, the first electrode 81 of the piezoelectric actuator 80 (described later) may serve as the diaphragm without providing an elastic film or an insulating film.

[0034] A piezoelectric actuator 80 including a first electrode 81, a piezoelectric layer 82, and a second electrode 83 is provided on the surface of the vibration plate 84 facing in the Z1 direction. Such a piezoelectric actuator 80 is also called a piezoelectric element, and refers to a portion including the first electrode 81, the piezoelectric layer 82, and the second electrode 83. The piezoelectric actuator 80 serves as a driving element that generates a pressure change in the ink in the pressure chamber 12. The portion where piezoelectric strain occurs in the piezoelectric layer 82 when a voltage is applied between the first electrode 81 and the second electrode 83 is called an active portion. In other words, the active portion refers to the portion where the piezoelectric layer 82 is sandwiched between the first electrode 81 and the second electrode 83. In this embodiment, an active portion is formed for each pressure chamber 12. These multiple active portions serve as a "driving element" that generates a pressure change in the ink in the pressure chamber 12. Generally, one of the electrodes in each active portion is an individual electrode that is independent for each active portion, and the other electrode is configured as a common electrode shared by multiple active portions. In this embodiment, the first electrode 81 is separated for each active portion to form an individual electrode for the active portion, and the second electrode 83 is provided continuously across multiple active portions to form a common electrode for the multiple active portions. Of course, the first electrode 81 may form a common electrode and the second electrode 83 may form an individual electrode.

[0035] The piezoelectric layer 70 is made of a piezoelectric material made of a complex oxide with a perovskite structure represented by the general formula ABO3, for example.

[0036] An individual lead electrode 91 is drawn out from the first electrode 81, and a common lead electrode 92 is drawn out from the second electrode 83. A flexible wiring board 120 is connected to the individual lead electrode 91 and the common lead electrode 92 at the end opposite the piezoelectric actuator 80. In this embodiment, the individual lead electrode 91 and the common lead electrode 92 extend so as to be exposed in a first wiring insertion hole 32 formed in the protection substrate 30, and are electrically connected to the wiring board 120 within this first wiring insertion hole 32. A drive circuit 121 having a switching element for driving the piezoelectric actuator 80 is mounted on the wiring board 120.

[0037] In the above-described piezoelectric actuators 80, the first electrode 81 is an individual electrode for each piezoelectric actuator 80, and the second electrode is a common electrode shared by all the piezoelectric actuators 80, but the present invention is not limited to this configuration. In other words, the first electrode 81 may be a common electrode shared by all the piezoelectric actuators 80, and the second electrode may be an individual electrode for each piezoelectric actuator 80.

[0038] A protection substrate 30 having approximately the same size as the pressure chamber substrate 10 is bonded to the surface of the pressure chamber substrate 10 on the Z1 direction side. The protection substrate 30 has holding portions 31 which are spaces that protect the piezoelectric actuators 80. The holding portions 31 are provided independently for each row of piezoelectric actuators 80 arranged side by side in the X direction, and two holding portions 31 are formed side by side in the Y direction. In addition, the protection substrate 30 is provided with a first wiring insertion hole 32 that penetrates in the Z direction between the two holding portions 31 arranged side by side in the Y direction.

[0039] In this manner, the filter member 40 is joined to the surface of the communication plate 15 on the Z1 direction side, and the case member 100 is joined to the surface of the filter member 40 on the Z1 direction side.

[0040] Here, the communicating plate 15 and the case member 100 are an example of a first flow path member, and the filter member 40 is an example of a second flow path member. 2 and 3, the region R on the Z1 direction side surface of the filter member 40 where the filter holes 50 are provided is shown only by hatching, and the individual filter holes 50 are not shown.

[0041] The case member 100 has an accommodating section 101, which is a space deep enough to accommodate the pressure chamber substrate 10 and the protective substrate 30. The accommodating section 101 has an opening area wider than the surface of the protective substrate 30 that is bonded to the pressure chamber substrate 10. When the pressure chamber substrate 10 and the protective substrate 30 are accommodated in the accommodating section 101, the opening surface of the accommodating section 101 on the pressure chamber substrate 10 side is sealed by a vibration plate 84. Furthermore, the case member 100 is provided with a second wiring insertion hole 103 that communicates with the first wiring insertion hole 32 of the protective substrate 30 and through which the wiring substrate 120 is inserted.

[0042] Ink introduction sections 102 are defined on both outer sides of the storage section 101 in the Y direction in the case member 100. The case member 100 is provided with introduction ports 104 that communicate with the ink introduction sections 102 and supply ink to each ink introduction section 102.

[0043] Here, the ink introduction section 102 and the manifold 130 formed in the above-described communication plate 15 constitute a reservoir 140.

[0044] The material of the case member 100 is not particularly limited, but in this embodiment, it is made of a thermosetting resin. Examples of thermosetting resins include, but are not limited to, phenolic resin, urea resin, melamine resin, epoxy resin, alkyd resin, unsaturated polyester resin, epoxy resin, and diallyl phthalate resin. These may be used alone or in combination of two or more types as a copolymer or blend. The thermosetting resin may contain one or both of an inorganic filler and an inorganic fiber substrate.

[0045] The filter member 40 is a member that allows ink to pass through while capturing foreign matter heading toward the nozzles 21. In the example shown in Figures 2 and 3, the filter member 40 is arranged so as to divide the reservoir 140 into the manifold 130 and the ink introduction section 102. In other words, the filter member 40 is interposed between the communicating plate 15 and the case member 100, and is adhered to the communicating plate 15 and the case member 100.

[0046] The filter member 40 is preferably made of a metal such as nickel or palladium, and is manufactured by electroforming.

[0047] The method for manufacturing the filter member 40 is not limited to electroforming, and may be, for example, a method using dry etching or wet etching.

[0048] The filter member 40 does not have to be made of a single layer, and may be a laminate of multiple layers, at least one of which is made of metal. Alternatively, two filter members 40 may be connected to each other to form a frame.

[0049] By adhering the filter member 40 made of such a metal with the adhesive used in the present invention, the elution of metal ions into the liquid is reduced even when the filter member 40 comes into contact with the liquid in the flow path, as will be described in detail later, thereby suppressing interfacial peeling, etc.

[0050] Although such elution of metal ions may occur with metals other than nickel and palladium, and similar effects can be achieved with metals other than nickel and palladium, such as copper or copper-containing alloys, electroformed filters containing at least one of nickel and palladium are particularly preferred. In this embodiment, the filter member 40 is an electroformed filter made of Ni-Pd.

[0051] In this embodiment, in a plan view seen in the Z2 direction, the outer shape of the filter member 40 is substantially the same as the outer shape of the communicating plate 15. The filter member 40 also has an opening 45 in which the area facing the pressure chamber substrate 10 has been removed in the Z direction. The filter member 40 is provided on the surface of the communicating plate 15 on the Z1 direction side, with the pressure chamber substrate 10 disposed inside the opening 45.

[0052] The filter member 40 has filter holes 50 in a region R facing the first manifold portion 17 in a plan view seen in the Z2 direction. The detailed configurations of the filter member 40 and the filter holes 50 are not particularly limited.

[0053] In this way, the filter member 40 is provided between the communication plate 15 and the case member 100, and they are bonded together with the adhesive 60. By stacking the communication plate 15, filter member 40, and case member 100 in this order with the adhesive 60 from the Z2 direction to the Z1 direction in this way, the manifold 130 and the ink introduction section 102 are in communication with each other via the filter holes 50 of the filter member 40. Here, the adhesive 60 represents the adhesive layer after the adhesive has hardened.

[0054] Here, thermosetting resins have excellent mold-filling properties and produce molded articles with edges, which means that filler and epoxy resin components of the molded articles are prone to detaching and becoming foreign matter. If foreign matter is generated during operation of the recording head 2 after ink has been filled, the foreign matter may clog the nozzles 21, necessitating the installation of a filter near the nozzles 21. Because the filter must be smaller in diameter than the nozzles 21, it must be thin to account for pressure loss. Therefore, as in this embodiment, it is preferable to use an electroformed thin film created by electroforming for the filter member 40. In particular, considering liquid resistance and corrosion resistance, it is preferable to use an electroformed filter made of nickel, palladium, or an alloy thereof for the filter member 40. However, because the filter member 40 is made of metal, when the filter member 40 comes into contact with ink, metal ions from the filter member 40 may leach into the ink at the adhesive interface between the filter member 40 and the case member 100, potentially reducing adhesive strength.

[0055] Therefore, the adhesive used as the adhesive 60 in the present invention contains a water-insoluble chelate compound.

[0056] When such an adhesive is used, the chelate compound inhibits the elution of metal ions from the filter member 40, thereby inhibiting interfacial peeling and improving the reliability of the adhesive strength of the adhesive 60. Furthermore, because the chelate compound is water-insoluble, it is possible to reduce the elution of the chelate compound into the liquid (ink), and the stability of the adhesive is maintained for a long period of time.

[0057] Here, "water-insoluble" means that when 0.5 g of the chelate compound is dissolved in 100 g of water at 25°C, the insoluble content is 99 mass % or more.

[0058] The chelate compound is a compound having a benzotriazole skeleton, preferably an oil-soluble benzotriazole. Examples of the oil-soluble benzotriazole include 1-[N,N-bis(2-ethylhexyl)aminomethyl]benzotriazole, 1-[N,N-bis(2-ethylhexyl)aminomethyl]methylbenzotriazole, 5-carboxybenzotriazole, and tolyltriazole, and particularly preferably 5-carboxybenzotriazole.

[0059] Here, oil-soluble refers to a compound that has lipophilic (organic solvent) properties as a whole compound, and benzotriazoles with many hydrophilic substituents are not preferred. An oil-soluble benzotriazole is a compound that does not dissolve in an amount of 0.5 g or more in 100 g of pure water at 20°C.

[0060] As described above, the adhesive used in the present invention is not particularly limited as long as it contains a chelate compound and has adhesive properties to the communicating plate 15 and case member 100 of the first flow path member and the filter member 40 of the second flow path member, and examples thereof include epoxy-based adhesives. In particular, epoxy-based adhesives containing a multifunctional epoxy resin having two or more epoxy groups as a main component and at least one of a curing accelerator and a curing agent are preferred. The adhesive may also contain inorganic powders such as silica powder or alumina powder.

[0061] Examples of curing agents include aliphatic polyamines, polyaminoamides, polymercaptans, acid anhydrides, phenol novolac resins, and dicinamide. Examples of curing accelerators include DBU, DBN, tris(dimethylaminomethyl)phenol, 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-ethyl-4-methylimidazole, 3-phenyl-1,1-dimethylurea, and sulfonium salts. Any accelerator having one or more active hydrogen atoms in the molecule capable of undergoing an addition reaction with an epoxy group may be used. Examples of the curing accelerator include aliphatic amine compounds such as diethylenetriamine, triethylenetetramine, n-propylamine, 2-hydroxyethylaminopropylamine, cyclohexylamine, and 4,4'-diamino-dicyclohexylmethane; aromatic amine compounds such as 4,4'-diaminodiphenylmethane and 2-methylaniline; imidazole compounds such as imidazole, 2-methylimidazole, 2-ethylimidazole, and 2-isopropylimidazole; and imidazoline compounds such as imidazoline, 2-methylimidazoline, and 2-ethylimidazoline. From the viewpoints of being liquid and having good storage stability, aromatic amine compounds are preferred.

[0062] The adhesive of the present invention is a mixture of a chelating compound and a base adhesive component, such as a mixture of components of a one-component epoxy adhesive. The chelating compound is as described above. However, when the chelating compound is an oil-soluble benzotriazole that is solid before curing, in other words, an oil-soluble benzotriazole that forms a complex coating after curing, it is preferable to dissolve it in a suitable organic solvent and mix it with the adhesive component. Examples of suitable organic solvents include diethylene glycol diethyl ether and diethylene glycol dibutyl ether.

[0063] When a chelate compound is mixed into a two-component epoxy adhesive, it is preferable to mix it in advance with either the epoxy resin as the main component or an auxiliary agent, which is either a curing accelerator or a curing agent, but it is even more preferable to mix it into the main component.

[0064] The content of the chelate compound in the adhesive used in the present invention is preferably 0.56% by mass or more, in order to effectively exert the effects of suppressing the elution of metal ions from the filter member 40 by the chelate compound, thereby suppressing interfacial peeling and improving the reliability of the adhesive strength of the adhesive.

[0065] Furthermore, the content of the chelate compound in the adhesive is preferably 3.51% by mass or less. This is because, when the case member 100, which is the first flow path member, is made of a thermosetting resin, an excessively large amount of the chelate compound tends to decrease the adhesiveness to the case member 100.

[0066] Therefore, the content of the chelate compound in the adhesive is preferably 0.56% by mass or more and 3.51% by mass or less, because the chelate compound suppresses the elution of metal ions from the filter member 40, thereby suppressing interfacial peeling and effectively exhibiting the effect of improving the reliability of the adhesive strength, and the adhesive strength with the first flow path member is not reduced even if the first flow path member is made of a thermosetting resin.

[0067] Here, the content of the chelate compound in the adhesive is the ratio to the mass of the adhesive after curing. In other words, the chelate compounds contained in the adhesive, such as 1-[N,N-bis(2-ethylhexyl)aminomethyl]benzotriazole and 1-[N,N-bis(2-ethylhexyl)aminomethyl]methylbenzotriazole, are liquids, but become a complex coating (solid) after curing, so the content of the chelate compound in the adhesive is the ratio of the complex coating to the mass of the adhesive after curing.

[0068] In the recording head 2 of this embodiment, ink is supplied to the ink inlet portion 102 from an inlet 104 connected to an external ink supply means (not shown). Foreign matter is removed from the ink in the ink inlet portion 102 by a filter member 40, and the ink is supplied to the manifold 130. Then, after the interior from the manifold 130 to the nozzles 21 is filled with ink, a voltage is applied to each piezoelectric actuator 80 corresponding to each pressure chamber 12 in accordance with a recording signal from a drive circuit 121. This causes the piezoelectric actuator 80 and the vibration plate 84 to flex and deform, increasing the pressure inside each pressure chamber 12 and causing ink droplets to be ejected from each nozzle 21.

[0069] In this embodiment, UV ink or solvent-based ink is preferred as the ink, but UV ink or solvent-based ink is hygroscopic and contains 1 to 2% water. Therefore, when supplied to the flow path of the recording head 2, electricity flows easily between the filter member 40 and the ink, which makes it easier for metal ions to leach from the filter member 40 into the water in the ink. However, in the present invention, an adhesive containing a chelate compound is used as the adhesive 60, and the chelate compound that forms a complex with metal ions is present at the adhesion interface of the filter member 40. This reduces the leach of metal ions from the filter member 40 into the water in the ink, and prevents a decrease in adhesive strength.

[0070] The present invention will be described in more detail below based on examples. FIG. 5 is Table ta1 showing the components and test results of chelate compound mixtures 1-4 and chelate compounds 5-6. FIG. 6 is Table ta2 showing the components and test results of adhesive samples 1-10. FIG. 7 is Table ta3 showing the components and test results of adhesive samples 11-20. FIG. 8 is Table ta4 showing the components and test results of adhesive samples 21-30. FIG. 9 is Table ta5 showing the components and test results of adhesive samples 31-40. FIG. 10 is Table ta6 showing the components and test results of adhesive samples 41-44.

[0071] (Chelate Compound Mixture 1-4, Chelate Compound 5-6) Chelate compound mixture 1-4 was produced by mixing the chelate compound and each dispersant shown in Table ta1 in Fig. 5 at the blending ratio shown in Table ta1. In chelate compound mixture 1-4, 5-carboxybenzotriazole was used as the oil-soluble chelating compound.

[0072] Since 5-carboxybenzotriazole is a powdery solid, diethylene glycol diethyl ether or diethylene glycol dibutyl ether was added as an organic solvent serving as a dispersant, and the mixture was stirred with a stirrer for 1 hour to produce chelate compound mixture 1-4.

[0073] Chelate compound 5-6, 1-[N,N-bis(2-ethylhexyl)aminomethyl]benzotriazole and 1-[N,N-bis(2-ethylhexyl)aminomethyl]methylbenzotriazole, shown in Table ta1 of Figure 5, are liquids, so no organic solvent was used. Note that chelate compound 5-6 may be prepared as a chelate compound mixture by stirring it together with the organic solvent used as a dispersant.

[0074] Here, each of the chelating compound mixtures 1-4 was observed for the presence of aggregates and for the presence of a supernatant after 28 days. The former was judged as follows: when aggregates were measured using a ground gauge, if no aggregate streaks of 20 μm or larger were observed, it was rated A; and if aggregate streaks of 20 μm or larger were observed but no aggregate streaks of 50 μm or larger were observed, it was rated B. If no supernatant was observed after 28 days, it was rated A; and if a supernatant was observed after 28 days, it was rated B.

[0075] Since chelate compound 5-6 is a liquid, neither aggregates nor supernatant liquid are generated. Therefore, the above-mentioned observations were not performed on chelate compound 5-6, and it was marked as unevaluated (-) in Table ta1.

[0076] As shown in Table 1, a supernatant was observed after 28 days for chelate compound mixture 1-2, indicating that when the dispersant is diethylene glycol diethyl ether, the chelate compound and dispersant are easily separated. Therefore, it is preferable to mix chelate compound mixture 1-2 with the adhesive immediately after kneading. Furthermore, since chelate compound mixture 2 contains a larger amount of dispersant than chelate compound mixture 1, it is less likely to produce aggregates.

[0077] As shown in Table 1, in the case of chelate compound mixture 3-4, no supernatant was observed after 28 days, and aggregates were hardly formed. Therefore, it is preferable to use diethylene glycol dibutyl ether as a dispersant.

[0078] (Adhesive Samples 1-10) Chelate compound mixture 1 was mixed with the epoxy adhesive having the formulation shown in Table ta2 in FIG. 6 in a formulation shown in Table ta2 to prepare adhesive sample 1-10. The epoxy adhesive used was a mixture of the following components: Component P: Triglycidyl-p-aminophenol Component Q: Bisphenol F epoxy resin (epoxy equivalent weight 160) Component S: 2-ethyl-4-methylimidazole

[0079] Component S may be any compound having one or more active hydrogen atoms capable of undergoing an addition reaction with an epoxy group in the molecule. Examples of component S include aliphatic amine compounds such as diethylenetriamine, triethylenetetramine, n-propylamine, 2-hydroxyethylaminopropylamine, cyclohexylamine, 4,4'-diamino-dicyclohexylmethane, and metaxylenediamine; aromatic amine compounds such as 4,4'-diaminodiphenylmethane and 2-methylaniline; imidazole compounds such as imidazole, 2-methylimidazole, 2-ethylimidazole, and 2-isopropylimidazole; and imidazoline compounds such as imidazoline, 2-methylimidazoline, 2-ethylimidazoline, 2-ethyl-4-methylimidazole, and 1-benzyl-2-phenylimidazole.

[0080] (Adhesion test: transfer film shape) First, each of adhesive samples 1-10 was applied to Lumirror (registered trademark), a 100 μm-thick, A4-sized PET film, using a bar coater with a coating width of approximately 70 mm and a wet film thickness of 100 μm. Lumirror was folded into a curved shape, with the short edges of the Lumirror overlapping, so that the surface coated with the adhesive sample was facing outward. The folded Lumirror's adhesive-coated surface was pressed perpendicularly onto the surface of a rectangular object (100 mm wide x 100 mm deep x 2 mm thick) made of cured epoxy resin, thereby transferring the adhesive. The shape of the adhesive sample transfer film formed on the surface of the epoxy resin object was then observed, and the presence or absence of irregularities on the adhesive surface on the rectangular object was evaluated as follows:

[0081] The adhesive sample was pre-filled into a syringe and applied to the surface of a Ni-Pd electroformed sheet (20 mm wide x 20 mm deep x 10 μm thick) to a diameter of approximately 2 mm and height of 1 mm. Next, a piece of Lumirror (registered trademark), a 100 μm thick, A4-sized PET film, was folded into a curved shape so that the short edges of the applied sample overlapped, and the adhesive sample was evaluated as follows to see if any bleeding occurred at the boundary between the adhesive and the Ni-Pd electroformed film. A: No irregularities are observed on the surface of the adhesive on the rectangular object on which the epoxy resin has hardened. Furthermore, no bleeding is observed at the boundary between the adhesive and the Ni-Pd electroformed surface. B: No irregularities are observed on the surface of the adhesive on a rectangular object on which epoxy resin has been cured. However, some wear is observed at the boundary between the adhesive and the Ni-Pd electroformed layer.

[0082] (Adhesion test: adhesive strength) The adhesive strength after adhesion and the adhesive strength after immersion in the evaluation liquid at 60°C for 8 weeks were also measured. To evaluate the adhesive strength, adhesive sample 1-10 was sandwiched between a 200 μm shim ring made of Ni-Pd electroformed material and a thermosetting resin molding material, and then cured at 100°C for 8 hours to create a tensile strength test piece.

[0083] Here, the tensile strength test pieces will be described in detail. To prepare one set of test pieces, two 300 mm cubes (hereinafter, one will be referred to as the first epoxy molded product and the other as the second epoxy molded product) made of cured epoxy resin, two 100 μm thick stainless steel shim rings (hereinafter, one will be referred to as the first shim ring and the other as the second shim ring), and a 10 μm thick electroformed Ni-Pd sheet were prepared. The first shim ring was placed on the first epoxy molded product. Then, an adhesive sample was applied to the inside of the first shim ring on the same side of the first epoxy molded product as the first shim ring, without touching the first shim ring. An electroformed sheet was then placed on the side of the first shim ring opposite the first epoxy molded product, so that the side of the electroformed sheet that would be placed on the first shim ring was bonded to the first epoxy molded product using the adhesive sample applied to the first epoxy molded product. Next, a second shim ring was placed on the side of the electroformed sheet opposite the first shim ring. The adhesive sample was then applied to the inside of the second shim ring on the same side of the electroformed sheet as the second shim ring, without touching the second shim ring. Next, a second epoxy molded product was placed on the side of the second shim ring opposite the electroformed sheet, so that the side of the second epoxy molded product that would be placed on the second shim ring was bonded to the electroformed sheet using the adhesive sample applied to the side of the electroformed sheet opposite the first epoxy molded product. The epoxy molded product, shim ring, and electroformed sheet were then assembled as described above, and the assembled test specimen was then cured by heating at a curing temperature of 100°C for 8 hours to produce the test specimen.

[0084] The test piece thus obtained was set in a tensile testing machine, and the first epoxy molded product and the second epoxy molded product were gripped and pulled apart to perform a destructive test of the adhesive in terms of tensile strength. This test was performed in accordance with JIS K 6849. The maximum load (N) at which the adhesive of the bonded sample broke (interfacial peeling) was calculated by combining this with the area of ​​the bonded sample remaining on the epoxy molded product after adhesive failure, measured with a digital microscope, to obtain the adhesive strength (MPa).

[0085] The tensile strength of the test specimen was measured using a tensile tester before and after immersion in the evaluation liquid, and the results were evaluated as follows. The tensile strength test specimens were immersed in a UV monomer evaluation liquid containing N-vinyl-ε-caprolactam (CAS 2235-00-9):tetrahydrofurfuryl acrylate (CAS 2399-48-6):water = 48:48:4, which was an excessively hygroscopic UV ink. After immersion, the test specimens were removed and washed with ethanol, and then evaluated for tensile strength based on the tensile adhesion strength test method (JIS K 6849). A: Initial adhesive strength is 30 MPa or more, and adhesive strength after immersion is 10 MPa or more B: Initial adhesive strength is 20 MPa or more, and adhesive strength after immersion is 10 MPa or more C: Initial adhesive strength is less than 20 MPa, or adhesive strength after immersion is less than 10 MPa The results are shown in Table ta2. Table ta2 also shows the mass of the chelate compound contained in the cured adhesive and the mass % of the chelate compound relative to the cured adhesive, rounded to two decimal places.

[0086] (Result 1) In the case of adhesive sample 1-10, the shape of the transferred film was B, and there were no particular problems. However, since there was some drag at the boundary between the adhesive and the Ni-Pd electroformed film, the adhesive had poor wettability before hardening and was difficult to spread. In addition, the adhesive strength was within the acceptable range for adhesive samples 1-8 (B), but adhesive sample 9, which had a low chelate compound content of 0.3 mass%, and adhesive sample 10, which had a high chelate compound content of 5.71 mass%, had low adhesive strength.

[0087] (Adhesive Samples 11-20) Chelate compound mixture 2 was mixed with the epoxy adhesive having the formulation shown in Table ta3 in FIG. 7 in a formulation shown in Table ta3 to prepare adhesive samples 11-20. The adhesion test was carried out in the same manner as described above, and the results are shown in Table ta3.

[0088] (Result 2) In the case of adhesive sample 11-20, the shape of the transferred film was A, and there were no problems at all. Comparing with result 1, it was found that when more organic solvent was used as a dispersant, the streaks of aggregates became smaller and the shape of the transferred film was good. Furthermore, adhesive samples 11-18 had an adhesive strength of A, which was within the acceptable range, but adhesive sample 19, which contained a low chelate compound content of 0.23 mass%, and adhesive sample 20, which contained a high chelate compound content of 4.35 mass%, had low adhesive strength. In other words, adhesive strength depends on the shape of the transfer film. Furthermore, adhesive strength depends on the amount of chelate compound contained in the cured adhesive.

[0089] (Adhesive Samples 21-30) Chelate compound mixture 3 was mixed in the formulation shown in Table ta4 with the epoxy adhesive having the formulation shown in Table ta4 in FIG. 8 to prepare adhesive samples 21-30. The adhesion test was carried out in the same manner as described above, and the results are shown in Table ta4.

[0090] (Result 3) In the case of adhesive sample 21-30, the shape of the transferred film was A, and there was no problem at all. Furthermore, the adhesive strength of adhesive samples 21-28 was within the acceptable range (A), but adhesive sample 29, which contained a low chelate compound content of 0.26% by mass, and adhesive sample 30, which contained a high chelate compound content of 4.94% by mass, had low adhesive strength.

[0091] (Adhesive Samples 31-40) Chelate compound mixture 4 was mixed in the formulation shown in Table ta5 with an epoxy adhesive having the formulation shown in Table ta5 in FIG. 9 to prepare adhesive samples 31-40. The adhesion test was carried out in the same manner as described above, and the results are shown in Table ta5.

[0092] (Result 4) In the case of adhesive sample 31-40, the shape of the transferred film was A, and there was no problem at all. Furthermore, adhesive samples 31-38 had an adhesive strength of A, which was within the acceptable range, but adhesive sample 39, which contained a low chelate compound content of 0.26% by mass, and adhesive sample 40, which contained a high chelate compound content of 4.94% by mass, had low adhesive strength.

[0093] (Adhesive Samples 41-44) Chelate compound 5 or 6 was mixed with the epoxy adhesive having the formulation shown in Table ta6 in FIG. 10 in the formulation shown in Table ta6 to prepare adhesive samples 41-44. The adhesion test was carried out in the same manner as described above, and the results are shown in Table ta6.

[0094] (Result 5) In adhesive samples 41-44 using chelating compound 5 or 6, the shape of the transferred film and adhesive strength were B, and were therefore feasible.

[0095] Other Embodiments In the above embodiment, an inkjet recording head has been described as an example of a liquid jet head, but the present invention is intended for a wide range of liquid jet heads and can be applied to liquid jet heads that eject liquids other than ink. Examples of other liquid jet heads include various recording heads used in image recording devices such as printers, colorant jet heads used in manufacturing color filters for liquid crystal displays and the like, electrode material jet heads used in forming electrodes for organic EL displays, FEDs (field emission displays), and the like, and bioorganic material jet heads used in manufacturing biochips, and the present invention can also be applied to liquid jet devices equipped with such liquid jet heads.

[0096] In the above embodiment, a piezoelectric actuator is used as the driving element that generates a pressure change in the pressure chamber, but the present invention is not limited to this. For example, the driving element may be a device in which a heating element is disposed in the pressure chamber and ink droplets are ejected from the nozzle by bubbles generated by the heat generated by the heating element, or a so-called electrostatic actuator in which static electricity is generated between a vibration plate and an electrode and the vibration plate is deformed by the electrostatic force, thereby ejecting ink droplets from the nozzle.

[0097] In the above-described embodiment, the filter member 40 of the second flow path member is bonded as the first flow path member between the communication plate 15 and the case member 100 with the adhesive 60. The chelate compound contained in the adhesive prevents metal ions from eluting from the filter member 40 into the liquid, thereby preventing a decrease in adhesive strength at the interface. However, as long as the combination is similar, the second flow path member does not have to be the filter member 40. For example, the second flow path member may be the diaphragm 84, which may function as both a filter and a diaphragm. Furthermore, the second flow path member may be any member that has the potential to elute metal, and may therefore be a flow path member made of a metal such as SUS.

[0098] In the above-described embodiment, the first flow path member bonded with adhesive to the second flow path member such as an electroformed filter is, for example, the silicon communication plate 15 and the thermosetting resin case member 100, but is not limited to this. The first flow path member may be made of metal such as SUS, ceramic, or thermoplastic resin.

[0099] In the above-described embodiment, it is preferable to use UV ink or solvent-based ink as the ink, but the ink is not limited to this and, for example, water-based ink may also be used.

[0100] It goes without saying that the present invention is not limited to the above-described embodiment. The mutually replaceable components and configurations disclosed in the above embodiments may be appropriately changed and applied. Although not disclosed in the above examples, components and configurations that are publicly known and can be mutually substituted for the components and configurations disclosed in the above embodiments may be appropriately substituted, and the combinations thereof may be changed and applied. Appropriately substituting components and configurations that are not disclosed in the above embodiments but that a person skilled in the art could conceive as substitutes for the components and configurations disclosed in the above embodiments based on publicly known technology, and changing and applying the combinations thereof. is disclosed as one embodiment of the present invention.

[0101] (Addendum) From the above-described exemplary embodiments, the following configurations can be understood, for example.

[0102] A liquid ejection head according to a preferred embodiment, aspect 1, includes a nozzle for ejecting liquid, a first flow path member defining a portion of a flow path for supplying liquid to the nozzle, a second flow path member made of metal and adhered to the first flow path member to define a portion of the flow path, and an adhesive for adhering the first flow path member and the second flow path member, wherein the adhesive contains a water-insoluble chelate compound.

[0103] According to the first aspect, the adhesive contains a water-insoluble chelate compound, which prevents metal ions from leaching out of the second flow path member, thereby preventing interfacial peeling and improving the reliability of the adhesive strength. Furthermore, since the chelate compound is water-insoluble, the leaching of the chelate compound into the liquid is reduced, and the adhesive stability is maintained for a long period of time.

[0104] In Aspect 2, which is a specific example of Aspect 1, the chelating compound is an oil-soluble benzotriazole. According to Aspect 2, since the chelating compound is an oil-soluble benzotriazole, elution of the chelating compound into the liquid can be more reliably reduced, and the stability of the adhesion is maintained for a long period of time.

[0105] In Aspect 3, which is a specific example of Aspect 2, the chelating compound is 5-carboxybenzotriazole. According to Aspect 3, since the chelating compound is 5-carboxybenzotriazole, elution of the chelating compound into the liquid can be more reliably reduced, and the stability of the adhesion can be maintained for a long period of time.

[0106] In Aspect 4, which is a specific example of Aspect 1, the adhesive contains a multifunctional epoxy resin having difunctional or higher epoxy groups as a base resin, and at least one of a curing accelerator and a curing agent. According to Aspect 4, the use of an epoxy-based adhesive ensures reliable adhesive strength, more reliably reduces elution of the chelate compound into the liquid, and maintains adhesive stability for a long period of time.

[0107] In addition, in Aspect 5, which is a specific example of Aspect 1, the content of the chelate compound relative to the adhesive is 0.56 mass % or more. According to Aspect 5, the chelate compound can more reliably reduce the elution of metal ions from the second flow path member, thereby suppressing interfacial peeling and effectively achieving the effect of improving the reliability of the adhesive strength of the adhesive.

[0108] In addition, in Aspect 6, which is a specific example of Aspect 1, the content of the chelate compound relative to the adhesive is 3.51 mass % or less. According to Aspect 6, even if the first flow path member is a thermosetting resin, it is possible to reduce a decrease in adhesion to the first flow path member due to the chelate compound.

[0109] In addition, in Aspect 7, which is a specific example of Aspect 1, the content of the chelate compound in the adhesive is 0.56% by mass or more and 3.51% by mass or less. According to Aspect 7, the chelate compound suppresses the elution of metal ions from the second flow path member, thereby suppressing interfacial peeling and effectively exhibiting the effect of improving the reliability of the adhesive strength of the adhesive, and the adhesive strength with the first flow path member is not reduced even if the first flow path member is made of a thermosetting resin.

[0110] In Aspect 8, which is a specific example of Aspect 1, the second flow path member is an electroformed filter made of a metal containing at least one of nickel and palladium. According to Aspect 8, the chelate compound prevents elution of metal ions of nickel and palladium from the second flow path member, thereby suppressing interfacial peeling and improving the reliability of the adhesive strength. Furthermore, since the chelate compound is water-insoluble, elution of the chelate compound into the liquid can be reduced, and the stability of the adhesive can be maintained for a long period of time.

[0111] In Aspect 9, which is a specific example of Aspect 8, the first flow path member is made of a thermosetting resin, and the liquid is supplied to the nozzle by passing through the electroformed filter from the flow path in the first flow path member. According to Aspect 9, the chelate compound suppresses elution of metal ions from the second flow path member, thereby suppressing interfacial peeling and effectively exhibiting the effect of improving reliability in terms of adhesive strength, and even if the first flow path member is made of a thermosetting resin, adhesion to the first flow path member is not reduced.

[0112] In Aspect 10, which is a specific example of Aspect 1, the liquid is an ultraviolet-curable ink or a solvent-based ink. According to Aspect 10, UV ink or solvent-based ink, which is hygroscopic, contains 1 to 2% water. Therefore, when supplied to a flow path of a liquid jet head, electricity flows easily between the second flow path member and the ink, and metal ions are easily eluted from the second flow path member into the water in the ink. However, in the present invention, an adhesive containing a chelate compound is used as the adhesive. Therefore, the chelate compound that forms a complex with the metal ions is present at the adhesive interface of the second flow path member. This prevents metal ions from eluting from the electroformed filter into the water in the ink, thereby preventing a decrease in adhesive strength.

[0113] A liquid jet apparatus according to an eleventh aspect, which is another preferred aspect, includes the liquid jet head according to any one of the first to tenth aspects.

[0114] According to aspect 11, an adhesive containing a water-insoluble chelate compound is used, which prevents metal ions from leaching out of the second flow path member using the chelate compound, thereby preventing interfacial peeling and realizing a liquid injection device that can improve the reliability of the adhesive strength. [Explanation of symbols]

[0115] 1... Recording device (liquid ejection device), 2... Recording head (liquid ejection head), 3... Liquid container (liquid storage section), 10... Pressure chamber substrate, 12... Pressure chamber, 15... Communication plate, 20... Nozzle plate, 21... Nozzle, 40... Filter member, 50... Filter hole, 60... Adhesive, 80... Piezoelectric actuator, 84... Vibration plate, 100... Case member, 110... Compliance substrate, 120... Wiring board, 121... Drive circuit, 130... Manifold, 140... Reservoir

Claims

1. A nozzle for spraying liquid; A first flow path member that defines a portion of a flow path for supplying liquid to the nozzle; a second flow path member bonded to the first flow path member to define a portion of the flow path and made of a metal; an adhesive that bonds the first flow path member and the second flow path member; Equipped with The adhesive contains a water-insoluble chelate compound. A liquid jet head comprising:

2. The chelating compound is an oil-soluble benzotriazole. The liquid jet head according to claim 1 .

3. The chelating compound is 5-carboxybenzotriazole. The liquid jet head according to claim 2 .

4. The adhesive contains a polyfunctional epoxy resin having difunctional or higher epoxy groups as a base resin, and at least one of a curing accelerator and a curing agent. The liquid jet head according to claim 1 .

5. The content of the chelate compound in the adhesive is 0.56% by mass or more. The liquid jet head according to claim 1 .

6. The content of the chelate compound in the adhesive is 3.51% by mass or less. The liquid jet head according to claim 1 .

7. The content of the chelate compound in the adhesive is 0.56% by mass or more and 3.51% by mass or less. The liquid jet head according to claim 1 .

8. The second flow path member is an electroformed filter made of a metal containing at least one of nickel and palladium. The liquid jet head according to claim 1 .

9. the first flow path member is made of a thermosetting resin; the liquid is supplied to the nozzle by passing through the electroformed filter from the flow path in the first flow path member; The liquid jet head according to claim 8 .

10. The liquid is an ultraviolet-curable ink or a solvent-based ink. The liquid jet head according to claim 1 .

11. A liquid jet head according to any one of claims 1 to 10, a liquid storage section configured to store a liquid to be supplied to the liquid jet head; A liquid ejection apparatus comprising:

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