Substrate processing apparatus and substrate processing method

Abstract

To provide a substrate processing apparatus capable of improving throughput of substrate processing, and a substrate processing method.SOLUTION: An outer peripheral edge of a substrate W is held by an upper holding device, and a central region of a bottom face of the substrate W is cleaned using a bottom face brush 51. After the central region of the bottom face of the substrate W is cleaned, the substrate W is moved down from the upper holding device and transferred to a suction holding part 21 of a lower holding device. The substrate W held by the suction holding part 21 is cleaned using a process liquid. A cup 61 enclosing the substrate W in a planar view is provided so as to be moved up and down between an upper cup position, where the process liquid can be received, and a lower cup position which is lower than the upper cup position. The cup 61 is at the lower cup position during a standby period. Respective operations are started in such a manner that a period in which the bottom face brush 51 is moved from the standby position toward the substrate W for cleaning the substrate W at least partially overlaps a period of a cup rising operation in which the cup rises from the lower cup position to the upper cup position.SELECTED DRAWING: Figure 15

Description

[Technical field]

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method for cleaning a substrate. [Background technology]

[0002] Substrate processing apparatuses are used to perform various processes on various substrates such as FPD (Flat Panel Display) substrates used in liquid crystal display devices or organic EL (Electro Luminescence) display devices, semiconductor substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photomask substrates, ceramic substrates, solar cell substrates, etc. Substrate cleaning apparatuses are used to clean substrates.

[0003] For example, the substrate cleaning apparatus described in Patent Document 1 includes two suction pads that hold the peripheral portion of the back surface of the wafer, a spin chuck that holds the central portion of the back surface of the wafer, and a brush that cleans the back surface of the wafer. The two suction pads hold the wafer and move laterally. In this state, the central portion of the back surface of the wafer is cleaned with the brushes. The spin chuck then receives the wafer from the suction pads, and rotates while holding the central portion of the back surface of the wafer. In this state, the peripheral portion of the back surface of the wafer is cleaned with the brushes. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 5904169 Summary of the Invention [Problem to be solved by the invention]

[0005] In the above-mentioned substrate cleaning apparatus, a large number of substrates are sequentially loaded and unloaded, and each substrate is subjected to a cleaning process. Therefore, if the time required for processing one substrate can be shortened, the processing efficiency for a large number of substrates can be significantly improved. Therefore, in the substrate cleaning apparatus, a further improvement in the throughput of substrate processing is required.

[0006] An object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of improving the throughput of substrate processing. [Means for solving the problem]

[0007] A substrate processing apparatus according to one aspect of the present invention includes a first substrate holding unit configured to be able to hold a substrate at a first height position, a second substrate holding unit configured to be able to hold a substrate at a second height position lower than the first height position, a processing unit configured to be able to perform a first processing on a substrate held by the first substrate holding unit and a second processing on a substrate held by the second substrate holding unit, a substrate moving unit configured to perform a substrate lowering operation of lowering the substrate from the first height position to the second height position in order to transfer the substrate from the first substrate holding unit to the second substrate holding unit, and a control unit, wherein the processing unit includes a lower surface brush configured to contact an underside of the substrate to clean the underside, and a front surface brush configured to contact an underside of the substrate to clean the underside. The second process includes a lower surface brush moving unit configured to move the lower surface brush between a lower surface brush processing position in contact with the lower surface of the substrate held by the second substrate holding unit and a lower surface brush waiting position spaced from the lower surface brush processing position, and the second process includes a cleaning process of the lower surface of the substrate using the lower surface brush, and the control unit controls the substrate moving unit and the lower surface brush moving unit to perform a substrate lowering operation by the substrate moving unit and a lower surface brush preparation operation that moves the lower surface brush from the lower surface brush waiting position to the lower surface brush processing position, so that at least a portion of the period of the substrate lowering operation and the period of the lower surface brush preparation operation overlap.

[0008] A substrate processing apparatus according to another aspect of the present invention includes a first substrate holding unit configured to be able to hold a substrate at a first height position, a second substrate holding unit configured to be able to hold a substrate at a second height position lower than the first height position, a processing unit configured to be able to perform a first processing on a substrate held by the first substrate holding unit and to perform a second processing on a substrate held by the second substrate holding unit, a substrate moving unit that performs a substrate lowering operation to lower the substrate from the first height position to the second height position in order to transfer the substrate from the first substrate holding unit to the second substrate holding unit, and a control unit, wherein the processing unit includes a fluid nozzle that ejects a fluid including a processing liquid onto an upper surface of the substrate. and a nozzle moving unit configured to move the fluid nozzle between a nozzle processing position above the substrate held by the second substrate holding unit and a nozzle standby position spaced laterally from the substrate held by the second substrate holding unit, wherein the second processing includes a cleaning processing of the upper surface of the substrate using the fluid nozzle, and the control unit controls the substrate moving unit and the nozzle moving unit to perform a substrate lowering operation by the substrate moving unit and a nozzle preparation operation that moves the fluid nozzle from the nozzle standby position to the nozzle processing position, such that at least a portion of the period of the substrate lowering operation and the period of the nozzle preparation operation overlap.

[0009] A substrate processing apparatus according to still another aspect of the present invention includes a first substrate holding unit configured to be able to hold a substrate at a first height position, a second substrate holding unit configured to be able to hold a substrate at a second height position lower than the first height position, a processing unit configured to be able to perform a first processing on a substrate held by the first substrate holding unit and to perform a second processing on a substrate held by the second substrate holding unit, a substrate moving unit configured to perform a substrate lowering operation for lowering the substrate from the first height position to the second height position in order to transfer the substrate from the first substrate holding unit to the second substrate holding unit, and a control unit, wherein the processing unit includes an edge brush configured to contact an outer circumferential edge of the substrate to clean the outer circumferential edge, and a cleaning brush configured to clean the outer circumferential edge of the substrate. The apparatus includes an end brush moving unit configured to move a brush between an end brush processing position in contact with the outer peripheral edge of a substrate held by the second substrate holding unit and an end brush waiting position spaced laterally from the substrate held by the second substrate holding unit, and the second processing includes a cleaning processing of the outer peripheral edge of the substrate using the end brush, and the control unit controls the substrate moving unit and the end brush moving unit to perform a substrate lowering operation by the substrate moving unit and an end brush preparation operation in which the end brush is moved from the end brush waiting position to the end brush processing position, so that at least a portion of the period of the substrate lowering operation and the period of the end brush preparation operation overlap.

[0010] A substrate processing method according to yet another aspect of the present invention includes the steps of performing a first processing on a substrate held by a first substrate holding part at a first height position, performing a second processing including contacting a lower surface brush with an underside of a substrate held by a second substrate holding part at a second height position lower than the first height position to clean the underside of the substrate, and performing a substrate lowering operation for lowering the substrate from the first height position to the second height position in order to transfer the substrate from the first substrate holding part to the second substrate holding part after the first processing and before the second processing. and a step of moving the underside brush between a lower surface brush processing position in contact with the underside of the substrate held by the second substrate holding portion and a lower surface brush waiting position spaced from the lower surface brush processing position, wherein after the first processing and before the second processing, the step of performing the substrate lowering operation and the step of moving the lower surface brush are initiated so that at least a portion of a period of the substrate lowering operation and a period of a lower surface brush preparation operation for moving the lower surface brush from the lower surface brush waiting position to the lower surface brush processing position overlap.

[0011] A substrate processing method according to yet another aspect of the present invention includes the steps of performing a first processing on a substrate held by a first substrate holding part at a first height position; performing a second processing including discharging a fluid including a processing liquid from a fluid nozzle onto an upper surface of a substrate held by a second substrate holding part at a second height position lower than the first height position to clean the upper surface of the substrate; performing a substrate lowering operation for lowering the substrate from the first height position to the second height position in order to transfer the substrate from the first substrate holding part to the second substrate holding part after the first processing and before the second processing; and moving the fluid nozzle between a nozzle processing position above the substrate held by the second substrate holding part and a nozzle standby position spaced laterally from the substrate held by the second substrate holding part, wherein the steps of performing the substrate lowering operation and moving the fluid nozzle are initiated after the first processing and before the second processing such that a period of the substrate lowering operation and a period of a nozzle preparation operation for moving the fluid nozzle from the nozzle standby position to the nozzle processing position overlap at least partially.

[0012] A substrate processing method according to yet another aspect of the present invention includes the steps of performing a first processing on a substrate held by a first substrate holding part at a first height position, performing a second processing including contacting an edge brush with an outer circumferential edge of the substrate held by a second substrate holding part at a second height position lower than the first height position to clean the outer circumferential edge of the substrate, and performing a substrate lowering operation, after the first processing and before the second processing, of lowering the substrate from the first height position to the second height position in order to transfer the substrate from the first substrate holding part to the second substrate holding part. and a step of moving the end brush between an end brush processing position in contact with the outer peripheral edge of the substrate held by the second substrate holding portion and an end brush waiting position spaced laterally away from the substrate held by the second substrate holding portion, wherein after the first processing and before the second processing, the step of performing the substrate lowering operation and the step of moving the end brush are initiated so that at least a portion of a period of the substrate lowering operation and a period of an end brush preparation operation for moving the end brush from the end brush waiting position to the end brush processing position overlap. Effect of the Invention

[0013] According to the present invention, it is possible to improve the throughput of substrate processing. [Brief description of the drawings]

[0014] [Figure 1] 1 is a schematic plan view of a substrate cleaning apparatus according to an embodiment of the present invention; [Diagram 2] 2 is an external perspective view showing an internal configuration of the substrate cleaning apparatus of FIG. 1. [Diagram 3] FIG. 3 is an external perspective view of the lower chuck shown in FIGS. 1 and 2. [Figure 4] FIG. 3 is an external perspective view of the upper chuck of FIGS. 1 and 2. [Diagram 5] 2 is a block diagram showing the configuration of a control system of the substrate cleaning apparatus of FIG. 1. [Figure 6]2 is a schematic diagram for explaining an example of the operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 7] 2 is a schematic diagram for explaining an example of the operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 8] 2 is a schematic diagram for explaining an example of the operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 9] 2 is a schematic diagram for explaining an example of the operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 10] 2 is a schematic diagram for explaining an example of the operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 11] 2 is a schematic diagram for explaining an example of the operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 12] 2 is a schematic diagram for explaining an example of the operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 13] 2 is a schematic diagram for explaining an example of the operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 14] 2 is a schematic diagram for explaining an example of the operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 15] 2 is a schematic diagram for explaining an example of the operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 16] 2 is a schematic diagram for explaining an example of the operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 17] 2 is a schematic diagram for explaining an example of the operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 18] 2 is a schematic diagram for explaining an example of the operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 19] 2 is a schematic diagram for explaining an example of the operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 20] 2 is a schematic diagram for explaining an example of the operation of the substrate cleaning apparatus of FIG. 1. FIG. [Figure 21] FIG. 13 is a schematic plan view of a substrate cleaning apparatus according to another embodiment. [Figure 22] 22 is a block diagram showing the configuration of a control system of the substrate cleaning apparatus of FIG. 21. [Diagram 23] 23 is a side view for explaining an example of control of the rinse drive unit and the rinse liquid supply unit by the rinse control unit in FIG. 22. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] Hereinafter, a substrate processing apparatus and a substrate processing method according to an embodiment of the present invention will be described with reference to the drawings. The substrate processing apparatus and the substrate processing method according to this embodiment are a substrate cleaning apparatus and a substrate cleaning method. In the following description, the substrate refers to a semiconductor substrate (wafer), a substrate for FPD (Flat Panel Display) such as a liquid crystal display device or an organic EL (Electro Luminescence) display device, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell. In this embodiment, the upper surface of the substrate is a circuit formation surface (front surface), and the lower surface of the substrate is a surface (rear surface) opposite to the circuit formation surface. Furthermore, the substrate used in this embodiment has at least a partially circular outer periphery. For example, the substrate used in this embodiment has a circular outer periphery except for the notch.

[0016] 1. Structure of the substrate cleaning equipment Fig. 1 is a schematic plan view of a substrate cleaning apparatus according to an embodiment of the present invention. Fig. 2 is an external perspective view showing the internal configuration of the substrate cleaning apparatus 1 of Fig. 1. In the substrate cleaning apparatus 1 according to this embodiment, mutually orthogonal X, Y, and Z directions are defined to clarify the positional relationship. In Fig. 1 and certain figures following Fig. 2, the X, Y, and Z directions are appropriately indicated by arrows. The X and Y directions are mutually orthogonal in a horizontal plane, and the Z direction corresponds to the vertical direction (up-down direction).

[0017] 1, the substrate cleaning apparatus 1 includes upper holding devices 10A and 10B, a lower holding device 20, a pedestal device 30, a delivery device 40, a lower surface cleaning device 50, a cup device 60, an upper surface cleaning device 70, an edge cleaning device 80, and an opening / closing device 90. These components are provided in a unit housing 2. In FIG. 2, the unit housing 2 is indicated by a dotted line.

[0018] The unit housing 2 has a rectangular bottom surface portion 2a and four side walls 2b, 2c, 2d, and 2e extending upward from the four sides of the bottom surface portion 2a. The side walls 2b and 2c face each other, and the side walls 2d and 2e face each other. A rectangular opening is formed in the center of the side wall portion 2b. This opening is an entrance / exit 2x for the substrate W, and is used when the substrate W is carried into and carried out of the unit housing 2. In FIG. 2, the entrance / exit 2x is indicated by a thick dotted line. In the following description, the direction from inside the unit housing 2 through the entrance / exit 2x toward the outside of the unit housing 2 (the direction from the side wall portion 2c to the side wall portion 2b) in the Y direction is referred to as the front, and the opposite direction (the direction from the side wall portion 2b to the side wall portion 2c) is referred to as the rear.

[0019] An opening / closing device 90 is provided in the portion of the side wall 2b where the loading / unloading opening 2x is formed and in the area nearby. The opening / closing device 90 includes a shutter 91 configured to be able to open and close the loading / unloading opening 2x, and a shutter drive unit 92 that drives the shutter 91. In FIG. 2, the shutter 91 is indicated by a thick two-dot chain line. The shutter drive unit 92 drives the shutter 91 to open the loading / unloading opening 2x when the substrate W is loaded into and unloaded from the substrate cleaning apparatus 1. This brings the shutter 91 into an open state. In addition, the shutter drive unit 92 drives the shutter 91 to close the loading / unloading opening 2x when the substrate W is cleaned in the substrate cleaning apparatus 1. This brings the shutter 91 into a closed state.

[0020] A pedestal device 30 is provided in the center of the bottom surface portion 2a. The pedestal device 30 includes a linear guide 31, a movable pedestal 32, and a pedestal drive unit 33. The linear guide 31 includes two rails and is provided so as to extend in the Y direction from the vicinity of the side wall portion 2b to the vicinity of the side wall portion 2c in a plan view. The movable pedestal 32 is provided so as to be movable in the Y direction on the two rails of the linear guide 31. The pedestal drive unit 33 includes, for example, a pulse motor, and moves the movable pedestal 32 in the Y direction on the linear guide 31.

[0021] The lower holding device 20 and the lower surface cleaning device 50 are provided on the movable base 32 so as to be aligned in the Y direction. The lower holding device 20 includes an adsorption holding unit 21 and an adsorption holding drive unit 22. The adsorption holding unit 21 is a so-called spin chuck, and has a circular adsorption surface capable of adsorbing and holding the lower surface of the substrate W, and is configured to be rotatable around an axis (axis in the Z direction) extending in the vertical direction. In the following description, when the substrate W is adsorbed and held by the adsorption holding unit 21, the region of the lower surface of the substrate W to be adsorbed by the adsorption surface of the adsorption holding unit 21 is referred to as a lower surface central region. Meanwhile, the region of the lower surface of the substrate W surrounding the lower surface central region is referred to as a lower surface outer region.

[0022] The suction-holding drive unit 22 includes a motor. The motor of the suction-holding drive unit 22 is provided on the movable base 32 so that the rotation shaft protrudes upward. The suction-holding unit 21 is attached to the upper end of the rotation shaft of the suction-holding drive unit 22. A suction path is formed in the rotation shaft of the suction-holding drive unit 22 for suctioning and holding the substrate W in the suction-holding unit 21. The suction path is connected to a suction device (not shown). The suction-holding drive unit 22 rotates the suction-holding unit 21 around the rotation shaft.

[0023] A delivery device 40 is further provided on the movable base 32 near the lower holding device 20. The delivery device 40 includes a plurality of support pins 41 (three in this example), a pin connecting member 42, and a pin lifting and lowering drive unit 43. The pin connecting member 42 is formed so as to surround the suction holding unit 21 in a plan view, and connects the plurality of support pins 41. The plurality of support pins 41 extend upward a certain length from the pin connecting member 42 while being connected to one another by the pin connecting member 42. The pin lifting and lowering drive unit 43 raises and lowers the pin connecting member 42 above the movable base 32. As a result, the plurality of support pins 41 rise and lower relative to the suction holding unit 21.

[0024] The lower surface cleaning device 50 includes a lower surface brush 51, two substrate nozzles 52, two brush nozzles 52a, 52b, a gas ejection unit 53, a lifting support unit 54, a lower surface brush rotation drive unit 55a, and a lower surface brush lifting drive unit 55b. As shown in Fig. 2, the lifting support unit 54 is provided on the movable base 32 so as to be able to lift and lower. The lifting support unit 54 has an upper surface 54u that slopes obliquely downward in a direction away from the suction holding unit 21 (rearward in this example).

[0025] 1, the lower brush 51 has a circular outer shape in a plan view, and is formed to be relatively large in this embodiment. Specifically, the diameter of the lower brush 51 is larger than the diameter of the adsorption surface of the adsorption holding unit 21, for example, 1.3 times the diameter of the adsorption surface of the adsorption holding unit 21. The diameter of the lower brush 51 is also larger than 1 / 3 and smaller than 1 / 2 the diameter of the substrate W. The diameter of the substrate W is, for example, 300 mm.

[0026] The lower brush 51 is a sponge brush, and is preferably made of a material with relatively low wettability, such as a fluororesin. In this case, adhesion of contaminants to the lower brush 51 is reduced. This makes the lower brush 51 less likely to become contaminated. In this example, the lower brush 51 is made of PTFE (polytetrafluoroethylene), but the embodiment is not limited to this. The lower brush 51 may be made of a relatively soft resin material, such as PVA (polyvinyl alcohol).

[0027] The lower surface brush 51 has a cleaning surface capable of contacting the lower surface of the substrate W. In addition, the lower surface brush 51 is attached to the upper surface 54u of the lifting support part 54 so that the cleaning surface faces upward and so that the cleaning surface can rotate around an axis extending in the vertical direction through the center of the cleaning surface.

[0028] Each of the two substrate nozzles 52 is attached to an upper surface 54u of the lift support part 54 so as to be located near the lower surface brush 51 and so that its liquid discharge port faces upward. A lower surface cleaning liquid supply part 56 (FIG. 5) is connected to the substrate nozzle 52. The lower surface cleaning liquid supply part 56 supplies cleaning liquid for cleaning the substrate to the substrate nozzle 52. When the substrate W is cleaned by the lower surface brush 51, the substrate nozzle 52 discharges the cleaning liquid supplied from the lower surface cleaning liquid supply part 56 onto the lower surface of the substrate W. In this embodiment, pure water is used as the cleaning liquid supplied to the substrate nozzle 52.

[0029] The two brush nozzles 52a, 52b are used to clean the lower surface brush 51. Each of the two brush nozzles 52a, 52b is attached to the upper surface 54u of the lift support part 54 so as to be located near the lower surface brush 51. A brush cleaning liquid supply part 57 (FIG. 5) is connected to the brush nozzles 52a, 52b. The brush cleaning liquid supply part 57 supplies cleaning liquid for brush cleaning to the brush nozzles 52a, 52b. As a result, the cleaning liquid supplied from the brush cleaning liquid supply part 57 is discharged from the brush nozzles 52a, 52b toward the lower surface brush 51. The cleaning liquid supplied to the two substrate nozzles 52 is the same as the cleaning liquid supplied to the two brush nozzles 52a, 52b. Therefore, in this embodiment, pure water is used as the cleaning liquid supplied to the brush nozzles 52a, 52b.

[0030] One of the brush nozzles, 52a, is provided at a lateral position of the lower brush 51 such that the tip portion (liquid discharge port) of the brush nozzle 52a faces a position above the lower brush 51. Therefore, the cleaning liquid discharged from the brush nozzle 52a is guided from a lateral position of the lower brush 51 to the center of the cleaning surface of the lower brush 51 so as to draw a parabola. The other brush nozzle, 52b, is provided at a lateral position of the lower brush 51 such that the tip portion (liquid discharge port) of the brush nozzle 52b faces a side portion (outer peripheral end portion) of the lower brush 51. Therefore, the cleaning liquid discharged from the brush nozzle 52b is guided from a lateral position of the lower brush 51 to a side portion (outer peripheral end portion) of the lower brush 51.

[0031] As described later, the lower brush 51 basically rotates while the power of the substrate cleaning apparatus 1 is on. Therefore, when the cleaning liquid is discharged from the brush nozzles 52a and 52b to the lower brush 51, the entire lower brush 51 is smoothly washed with the cleaning liquid. In addition, the cleaning surface of the lower brush 51 is uniformly wetted. This prevents the lower brush 51 from partially hardening.

[0032] The gas jetting part 53 is a slit-shaped gas injection nozzle having a gas outlet extending in one direction. The gas jetting part 53 is provided on the movable base 32 so as to be movable up and down independently of the other components of the lower surface cleaning device 50. A description of a drive part for moving the gas jetting part 53 up and down will be omitted. The gas jetting part 53's gas outlet is located between the lower surface brush 51 and the suction holding part 21 in a plan view and faces upward. A jet gas supply part 58 (FIG. 5) is connected to the gas jetting part 53.

[0033] The jet gas supply unit 58 supplies gas to the gas jet unit 53. In this embodiment, an inert gas such as nitrogen gas is used as the gas supplied to the gas jet unit 53. The gas jet unit 53 jets the gas supplied from the jet gas supply unit 58 onto the underside of the substrate W when the substrate W is cleaned by the lower surface brush 51 and when the underside of the substrate W is dried, which will be described later. In this case, a band-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the suction holding unit 21.

[0034] 1 includes a motor, and basically rotates the lower surface brush 51 while the power of the substrate cleaning apparatus 1 is on. The lower surface brush lifting and lowering drive unit 55b includes a stepping motor or an air cylinder, and lifts and lowers the lifting support part 54 above the movable base 32.

[0035] A cup device 60 is further provided in the center of the bottom surface portion 2a. The cup device 60 includes a cup 61 and a cup drive unit 62. The cup 61 is provided so as to surround the lower holding device 20 and the base device 30 in a plan view and is movable up and down. In FIG. 2, the cup 61 is indicated by a dotted line. The cup drive unit 62 moves the cup 61 between a lower cup position and an upper cup position depending on which part of the lower surface of the substrate W is to be cleaned by the lower surface brush 51. The lower cup position is a height position where the upper end of the cup 61 is below the substrate W adsorbed and held by the adsorption holding unit 21. The upper cup position is a height position where the upper end of the cup 61 is above the adsorption holding unit 21. When the cup 61 is in the upper cup position, the cup 61 and the adsorption holding unit 21 overlap each other in a side view. Therefore, it can be said that the upper cup position is a height position corresponding to the height position of the substrate W adsorbed and held by the adsorption holding unit 21.

[0036] A pair of upper holding devices 10A, 10B are provided at a height position above cup 61 so as to face each other across base device 30 in a plan view. Upper holding device 10A includes a lower chuck 11A, an upper chuck 12A, a lower chuck driving unit 13A, and an upper chuck driving unit 14A. Upper holding device 10B includes a lower chuck 11B, an upper chuck 12B, a lower chuck driving unit 13B, and an upper chuck driving unit 14B.

[0037] Fig. 3 is an external perspective view of the lower chucks 11A and 11B of Fig. 1 and Fig. 2. In Fig. 3, the lower chucks 11A and 11B are indicated by thick solid lines. Furthermore, the upper chucks 12A and 12B are indicated by dotted lines. In the external perspective view of Fig. 3, the enlargement and reduction ratios of each part have been changed from those in the external perspective view of Fig. 2 so that the shapes of the lower chucks 11A and 11B can be easily understood.

[0038] 3, the lower chucks 11A, 11B are disposed symmetrically with respect to a vertical plane that passes through the center of the suction holding portion 21 and extends in the Y direction (front-rear direction) in a plan view, and are provided to be movable in the X direction within a common horizontal plane. Each of the lower chucks 11A, 11B has two support pieces 200. Each support piece 200 is provided with an inclined support surface 201 and a movement limiting surface 202.

[0039] In the lower chuck 11A, the inclined support surface 201 of each support piece 200 is formed so as to be capable of supporting the outer peripheral edge of the substrate W from below and to extend obliquely downward toward the lower chuck 11B. The movement limiting surface 202 extends upward a fixed distance from the upper end of the inclined support surface 201 and forms a step at the upper end of the lower chuck 11A. On the other hand, in the lower chuck 11B, the inclined support surface 201 of each support piece 200 is formed so as to be capable of supporting the outer peripheral edge of the substrate W from below and to extend obliquely downward toward the lower chuck 11A. The movement limiting surface 202 extends upward a fixed distance from the upper end of the inclined support surface 201 and forms a step at the upper end of the lower chuck 11B.

[0040] The lower chuck driving units 13A and 13B in FIG. 1 include an air cylinder or a motor as an actuator. The lower chuck driving units 13A and 13B move the lower chucks 11A and 11B so that the lower chucks 11A and 11B approach each other or move away from each other. Here, when the target positions of the lower chucks 11A and 11B in the X direction are predetermined, the lower chuck driving units 13A and 13B can individually adjust the positions of the lower chucks 11A and 11B in the X direction based on the information of the target positions. For example, the distance between the lower chucks 11A and 11B can be made smaller than the outer diameter of the substrate W. In this case, the substrate W can be placed on the multiple inclined support surfaces 201 of the lower chucks 11A and 11B.

[0041] Fig. 4 is an external perspective view of the upper chucks 12A and 12B of Fig. 1 and Fig. 2. In Fig. 4, the upper chucks 12A and 12B are indicated by thick solid lines. The lower chucks 11A and 11B are indicated by dotted lines. In the external perspective view of Fig. 4, the enlargement and reduction ratios of each part are changed from those in the external perspective view of Fig. 2 so that the shapes of the upper chucks 12A and 12B can be easily understood.

[0042] 4, the upper chucks 12A and 12B, like the lower chucks 11A and 11B, are disposed symmetrically with respect to a vertical plane extending in the Y direction (front-rear direction) passing through the center of the suction holding portion 21 in a plan view, and are provided to be movable in the X direction within a common horizontal plane. Each of the upper chucks 12A and 12B has two holding pieces 300. Each holding piece 300 has an abutment surface 301 and a protrusion 302.

[0043] In the upper chuck 12A, the contact surface 301 of each holding piece 300 is formed at a lower tip of the holding piece 300 so as to face the upper chuck 12B and is perpendicular to the X direction. The protrusion 302 is formed so as to protrude a predetermined distance from the upper end of the contact surface 301 toward the upper chuck 12B. On the other hand, in the upper chuck 12B, the contact surface 301 of each holding piece 300 is formed at a lower tip of the holding piece 300 so as to face the upper chuck 12A and is perpendicular to the X direction. The protrusion 302 is formed so as to protrude a predetermined distance from the upper end of the contact surface 301 toward the upper chuck 12A.

[0044] The upper chuck driving units 14A and 14B in Fig. 1 include an air cylinder or a motor as an actuator. The upper chuck driving units 14A and 14B move the upper chucks 12A and 12B so that the upper chucks 12A and 12B approach each other or move away from each other. Here, when the target positions of the upper chucks 12A and 12B in the X direction are determined in advance, the upper chuck driving units 14A and 14B can individually adjust the positions of the upper chucks 12A and 12B in the X direction based on information about the target positions.

[0045] In the above-described upper holding devices 10A, 10B, for example, the upper chucks 12A, 12B move toward the outer circumferential edge of the substrate W placed on the lower chucks 11A, 11B. The two abutment surfaces 301 of the upper chuck 12A and the two abutment surfaces 301 of the upper chuck 12B come into contact with a plurality of portions of the outer circumferential edge of the substrate W, thereby holding the outer circumferential edge of the substrate W and firmly fixing the substrate W.

[0046] The upper holding devices 10A, 10B transition to three states, a retracted state, a placement-ready state, and a holding state, by adjusting the distance between the lower chucks 11A, 11B and the distance between the upper chucks 12A, 12B in a predetermined combination.

[0047] The retracted state of the upper holding devices 10A, 10B is a state in which the distance between the lower chucks 11A, 11B is greater than the outer diameter of the substrate W and the distance between the upper chucks 12A, 12B is greater than the outer diameter of the substrate W. In this case, the substrate W in a horizontal position can be moved in the vertical direction (Z direction) between the lower chucks 11A, 11B and between the upper chucks 12A, 12B.

[0048] The upper holding devices 10A, 10B are in a state in which the distance between the lower chucks 11A, 11B is smaller than the outer diameter of the substrate W and the distance between the upper chucks 12A, 12B is larger than the outer diameter of the substrate W. In this case, the substrate W can be placed in a horizontal position on the inclined support surfaces 201 of the lower chucks 11A, 11B while preventing interference between the substrate W and the upper chucks 12A, 12B. In addition, the substrate W placed on the lower chucks 11A, 11B can be picked up.

[0049] The holding state of the upper holding devices 10A, 10B can be changed only when the upper holding devices 10A, 10B are in a state ready for placement and the substrate W is placed on the lower chucks 11A, 11B. Specifically, the holding state of the upper holding devices 10A, 10B is a state in which the distance between the lower chucks 11A, 11B is smaller than the outer diameter of the substrate W and the upper chucks 12A, 12B are in contact with the outer peripheral end of the substrate W on the lower chucks 11A, 11B to fix the substrate W.

[0050] Here, in the upper holding devices 10A, 10B, when transitioning from a placement-ready state to a holding state, the upper chucks 12A, 12B move in the X direction so as to approach each other across the substrate W. At this time, the upper chucks 12A, 12B are moved specifically as follows.

[0051] First, one upper chuck moves toward the other upper chuck and stops at a predetermined target position. Then, the other upper chuck moves toward the one upper chuck and comes into contact with a part of the outer peripheral end of the substrate W. Furthermore, the other upper chuck moves toward the one upper chuck until another part of the outer peripheral end of the substrate W comes into contact with the one upper chuck. When the substrate W is shifted from the mountable state to the holding state in this manner, the substrate W is positioned on the lower chucks 11A and 11B with the above-mentioned target position as a reference. Therefore, when the dimensions of the substrate W are known, the center of the substrate W can be easily positioned at a planar reference position rp (FIG. 6) to be described later by determining the target position based on the dimensions.

[0052] In the upper holding devices 10A, 10B, when transitioning from the holding state to the loading state, the upper chucks 12A, 12B move in the X direction so as to sandwich the substrate W and move away from each other. At this time, the upper chucks 12A, 12B are moved specifically as follows.

[0053] First, with one upper chuck at a predetermined target position, the other upper chuck moves away from the one upper chuck. After the other upper chuck moves away from the substrate W, the one upper chuck moves away from the other upper chuck. When the substrate W transitions from the held state to the mountable state in this manner, the substrate W is positioned on the lower chucks 11A, 11B with reference to the target position. Therefore, when the dimensions of the substrate W are known, the center of the substrate W can be easily positioned at a planar reference position rp (FIG. 6) to be described later by determining the target position based on the dimensions.

[0054] As shown in Fig. 1, a light-projecting portion 19a and a light-receiving portion 19b are provided on two side walls 2c, 2b facing each other in the Y direction. The light-projecting portion 19a includes a light-projecting element. The light-receiving portion 19b includes a light-receiving element. The light-projecting portion 19a and the light-receiving portion 19b form one transmission-type photoelectric sensor 19 (Fig. 5).

[0055] The light-projecting unit 19a and the light-receiving unit 19b are arranged such that the light-projecting unit 19a is located lower than the light-receiving unit 19b. In addition, the light-projecting unit 19a and the light-receiving unit 19b are arranged such that a straight line connecting the light-projecting unit 19a and the light-receiving unit 19b crosses the substrate W when the substrate W is held by the upper holding devices 10A and 10B.

[0056] In the substrate cleaning apparatus 1, when the substrate W is placed on the upper holding devices 10A, 10B in a placement-ready state, light is emitted from the light-projecting unit 19a toward the light-receiving unit 19b (see the dashed arrow in FIG. 2). When the substrate W is properly placed on the upper holding devices 10A, 10B, the light emitted from the light-projecting unit 19a is blocked by the substrate W. As a result, the light-receiving unit 19b does not receive the light emitted from the light-projecting unit 19a. On the other hand, when the substrate W is not properly placed on the upper holding devices 10A, 10B, the light emitted from the light-projecting unit 19a is not blocked by the substrate W and enters the light-receiving unit 19b. Therefore, based on the light-receiving signal output from the light-receiving element of the light-receiving unit 19b, it can be determined whether the substrate W is properly placed on the upper holding devices 10A, 10B. In the following description, this determination is called a substrate placement state determination.

[0057] In the substrate cleaning apparatus 1, when the upper holding devices 10A, 10B transition from the placement-ready state to the holding state, light is also emitted from the light-projecting unit 19a to the light-receiving unit 19b. This makes it possible to determine whether the substrate W is normally held by the upper holding devices 10A, 10B based on the light-receiving signal output from the light-receiving element of the light-receiving unit 19b for the same reason as above. In the following description, this determination will be referred to as substrate holding state determination.

[0058] 1, an upper surface cleaning device 70 is provided on one side of the cup 61 so as to be located near the upper holding device 10B in a plan view. The upper surface cleaning device 70 includes a rotating support shaft 71, an arm 72, a spray nozzle 73, and an upper surface cleaning drive unit 74.

[0059] The rotating support shaft 71 is supported on the bottom surface portion 2a so as to extend in the vertical direction and to be movable up and down and rotatable by an upper surface cleaning drive unit 74. As shown in Fig. 2, the arm 72 is provided at a position above the upper holding device 10B and extends horizontally from the upper end of the rotating support shaft 71. A spray nozzle 73 is attached to the tip of the arm 72.

[0060] An upper surface cleaning fluid supply unit 75 (FIG. 5) is connected to the spray nozzle 73. The upper surface cleaning fluid supply unit 75 supplies a cleaning liquid and a gas to the spray nozzle 73. In this embodiment, pure water is used as the cleaning liquid supplied to the spray nozzle 73, and an inert gas such as nitrogen gas is used as the gas supplied to the spray nozzle 73. When cleaning the upper surface of the substrate W, the spray nozzle 73 mixes the cleaning liquid and the gas supplied from the upper surface cleaning fluid supply unit 75 to generate a mixed fluid, and sprays the generated mixed fluid downward.

[0061] The upper surface cleaning drive unit 74 includes one or more pulse motors, an air cylinder, etc., and raises and lowers the rotary support shaft 71 and rotates the rotary support shaft 71. According to the above configuration, by moving the spray nozzle 73 in an arc above the upper surface of the substrate W that is attracted and held by the suction holding unit 21 and rotated, it is possible to clean the entire upper surface of the substrate W.

[0062] 1, an edge cleaning device 80 is provided on the other side of the cup 61 so as to be located near the upper holding device 10A in a plan view. The edge cleaning device 80 includes a rotating support shaft 81, an arm 82, a bevel brush 83, and a bevel brush driving unit 84.

[0063] The rotating support shaft 81 is supported by a bevel brush driving unit 84 on the bottom surface portion 2a so as to extend in the vertical direction and to be movable up and down and rotatable. As shown in Fig. 2, the arm 82 is provided at a position above the upper holding device 10A and extends horizontally from the upper end of the rotating support shaft 81. A bevel brush 83 is provided at the tip of the arm 82 so as to protrude downward and to be rotatable around a vertical axis.

[0064] The upper half of the bevel brush 83 has an inverted truncated cone shape, and the lower half has a truncated cone shape. With this bevel brush 83, the outer periphery edge of the substrate W can be cleaned by the central part in the up-down direction of the outer periphery surface.

[0065] The bevel brush driving unit 84 includes one or more pulse motors and air cylinders, and raises and lowers the rotary support shaft 81 and rotates the rotary support shaft 81. According to the above configuration, by bringing the central portion of the outer circumferential surface of the bevel brush 83 into contact with the outer circumferential edge of the substrate W that is attracted and held by the attracting and holding unit 21 and rotated, the entire outer circumferential edge of the substrate W can be cleaned.

[0066] Here, the bevel brush driving unit 84 further includes a motor built into the arm 82. The motor rotates the bevel brush 83 provided at the tip of the arm 82 about an axis in the vertical direction. Therefore, when cleaning the outer circumferential edge of the substrate W, the cleaning power of the bevel brush 83 at the outer circumferential edge of the substrate W is improved by the rotation of the bevel brush 83.

[0067] 2. Control system of substrate cleaning device 1 Fig. 5 is a block diagram showing the configuration of a control system of substrate cleaning apparatus 1 of Fig. 1. Substrate cleaning apparatus 1 includes a control device 170. Control device 170 includes a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), and a storage device. The RAM is used as a working area for the CPU. The ROM stores a system program. The storage device stores a substrate cleaning program.

[0068] 5, the control device 170 includes a chuck control unit 9A, a suction control unit 9B, a pedestal control unit 9C, a delivery control unit 9D, a lower surface cleaning control unit 9E, a cup control unit 9F, an upper surface cleaning control unit 9G, a bevel cleaning control unit 9H, and a carry-in / carry-out control unit 9I as functional units for controlling the operation of each of the plurality of substrate cleaning devices 1. The functional units of the control device 170 are realized by the CPU executing a substrate cleaning program stored in the storage device on the RAM. Some or all of the functional units of the control device 170 may be realized by hardware such as electronic circuits.

[0069] The chuck control unit 9A receives the substrate W carried into the substrate cleaning apparatus 1 and controls the lower chuck driving units 13A, 13B and the upper chuck driving units 14A, 14B to hold the substrate W at a position above the suction holding unit 21. The chuck control unit 9A also controls the photoelectric sensor 19 so that the above-mentioned substrate placement state determination and substrate holding state determination are performed. The suction control unit 9B controls the suction holding driving unit 22 to suction and hold the substrate W by the suction holding unit 21 and to rotate the suction-held substrate W.

[0070] The pedestal control unit 9C controls the pedestal drive unit 33 to move the movable pedestal 32 relative to the substrate W held by the upper holding devices 10A, 10B. The delivery control unit 9D controls the pin lift drive unit 43 to move the substrate W between the height position of the substrate W held by the upper holding devices 10A, 10B and the height position of the substrate W held by the suction holder 21.

[0071] The lower surface cleaning control unit 9E controls the lower surface brush rotation drive unit 55a, the lower surface brush lift drive unit 55b, the lower surface cleaning liquid supply unit 56, and the jet gas supply unit 58 in order to clean the lower surface of the substrate W. The lower surface cleaning control unit 9E also controls the brush cleaning liquid supply unit 57 in order to clean the lower surface brush 51. The cup control unit 9F controls the cup drive unit 62 in order to use a cup 61 to receive the cleaning liquid splashed from the substrate W when the substrate W adsorbed and held by the suction holding unit 21 is cleaned.

[0072] The upper surface cleaning control unit 9G controls the upper surface cleaning drive unit 74 and the upper surface cleaning fluid supply unit 75 to clean the upper surface of the substrate W adsorbed and held by the suction holding unit 21. The bevel cleaning control unit 9H controls the bevel brush drive unit 84 to clean the outer circumferential edge of the substrate W adsorbed and held by the suction holding unit 21. The load / unload control unit 9I controls the shutter drive unit 92 to open and close the load / unload opening 2x of the unit housing 2 when the substrate W is loaded into and unloaded from the substrate cleaning apparatus 1.

[0073] 3. Operation of the Substrate Cleaning Apparatus 1 6 to 20 are schematic diagrams for explaining an example of the operation of the substrate cleaning apparatus 1 of FIG. 1. In each of FIGS. 6 to 20, a plan view of the substrate cleaning apparatus 1 is shown in the upper part. A side view of the lower holding device 20 and its periphery as viewed along the Y direction is shown in the middle part, and a side view of the lower holding device 20 and its periphery as viewed along the X direction is shown in the lower part. The side view in the middle part corresponds to the side view along the AA line in FIG. 1, and the side view in the lower part corresponds to the side view along the BB line in FIG. 1. In addition, in order to facilitate understanding of the shape and operating state of each component in the substrate cleaning apparatus 1, the enlargement and reduction ratios of some components are different between the plan view in the upper part and the side views in the middle and lower parts. In addition, in FIGS. 6 to 21, the cup 61 is shown by a two-dot chain line, and the outline of the substrate W is shown by a thick dashed line.

[0074] 6 to 20 show, in the plan views at the top, the state of the shutter 91 or a change in that state, and also show, in the plan views at the top, the state of the upper holding devices 10A, 10B or a change in that state, by text. Also, in the side views at the middle, Fig. 6 to 21 show, in the plan views at the top, the state of the lower holding device 20 or a change in that state, by text. The state of the lower holding device 20 refers to a state indicating whether or not the suction holding part 21 is rotating.

[0075] First, as shown in Fig. 6, a state in which the substrate W is not present in the unit housing 2 is assumed as an initial state (standby state). In the initial state before the substrate W is loaded into the substrate cleaning apparatus 1, the shutter 91 of the opening / closing device 90 is in a closed state. Therefore, the loading / unloading opening 2x is blocked by the shutter 91. In addition, the upper holding devices 10A and 10B are in a retracted state. Therefore, the lower chucks 11A and 11B are maintained in a state in which the distance between them is sufficiently larger than the diameter of the substrate W. In addition, the upper chucks 12A and 12B are also maintained in a state in which the distance between them is sufficiently larger than the diameter of the substrate W. The lower holding device 20 is in a stopped state in which the rotation of the suction holding part 21 is stopped.

[0076] Moreover, in the initial state, the movable base 32 of the base device 30 is disposed so that the center of the suction holding part 21 is located at the center of the cup 61 in a plan view. At this time, the lower surface cleaning device 50 is located at a position on the movable base 32 spaced a certain distance from the suction holding part 21 in the Y direction. Furthermore, the cleaning surface (upper end) of the lower surface brush 51 of the lower surface cleaning device 50 is located below the suction holding part 21. The vertical (Z direction) position of the lower surface brush 51 in the initial state is called the lower surface brush standby position. When the substrate W is held by the suction holding part 21, the lower surface brush standby position is below the substrate W. Particularly in this embodiment, the lower surface brush standby position corresponds to the lowest position within the vertical range in which the lower surface brush 51 can be raised and lowered by the lifting support part 54.

[0077] In the initial state, the delivery device 40 has the support pins 41 positioned below the suction holding unit 21. Furthermore, the cup 61 of the cup device 60 is in the lower cup position. In the following description, the center position of the cup 61 in a plan view is referred to as the planar reference position rp. Furthermore, the position of the movable base 32 on the bottom surface portion 2a when the center of the suction holding unit 21 is at the planar reference position rp in a plan view is referred to as the reference horizontal position.

[0078] Furthermore, in the initial state, the spray nozzle 73 of the upper surface cleaning device 70 is held at a standby position spaced a predetermined distance to one side from the cup 61 in the X direction and above the upper holding devices 10A, 10B and the cup 61. Hereinafter, this standby position of the spray nozzle 73 in the initial state will be referred to as the spray nozzle standby position.

[0079] Further, bevel brush 83 of edge cleaning device 80 is held at a standby position spaced a predetermined distance to the other side from cup 61 in the X direction and above upper holding devices 10A, 10B and cup 61. Hereinafter, this standby position of bevel brush 83 in the initial state will be referred to as the bevel brush standby position.

[0080] 7, when the substrate W is carried into the substrate cleaning apparatus 1, the shutter 91 transitions from the closed state to the open state just before the substrate W enters the unit housing 2. In addition, as indicated by the thick solid arrow a1 in FIG. 7, the lower chucks 11A, 11B approach each other, causing the upper holding devices 10A, 10B to transition from the retracted state to a state ready for placement.

[0081] As described above, the operation of the shutter 91 moving from the closed state to the open state is called the shutter opening operation. Also, the operation of the upper holding devices 10A, 10B moving from the retreated state to the loading-ready state is called the loading preparation operation. In this case, the chuck control unit 9A and the loading / unloading control unit 9I in FIG. 5 start each operation so that the period of the shutter opening operation and the period of the loading preparation operation overlap at least partially.

[0082] 8, a hand (substrate holding portion) Ma of a substrate transport robot (not shown) enters the inside of the unit housing 2 through the loading / unloading opening 2x and moves the substrate W to a position approximately in the center of the unit housing 2. At this time, the substrate W held by the hand Ma is positioned between the lower chuck 11A and the upper chuck 12A and the lower chuck 11B and the upper chuck 12B.

[0083] Next, the hand Ma descends. At this time, the upper holding devices 10A, 10B are in a state in which they can be placed. Therefore, the hand Ma moves lower than the upper holding devices 10A, 10B, so that the substrate W held by the hand Ma is placed on the pair of lower chucks 11A, 11B. As a result, multiple portions of the lower peripheral edge of the substrate W are supported by the multiple support pieces 200 (FIG. 3) of the lower chucks 11A, 11B, respectively. Thereafter, the empty hand Ma exits from the loading / unloading opening 2x.

[0084] Next, after the hand Ma has left the chamber, the shutter 91 transitions from the open state to the closed state as shown in FIG. 9. Furthermore, the photoelectric sensor 19 (FIG. 5) determines the substrate placement state. Specifically, light is emitted from the light-projecting unit 19a toward the light-receiving unit 19b, and based on the light-receiving signal of the light-receiving unit 19b, it is determined whether the substrate W is properly placed on the upper holding devices 10A, 10B. If it is determined that the substrate W is not properly placed, the processing of the substrate W is stopped.

[0085] 9, the upper chucks 12A, 12B approach each other, causing the multiple holding pieces 300 of the upper chucks 12A, 12B to come into contact with the outer circumferential edge of the substrate W. As a result, the upper holding devices 10A, 10B transition from the mountable state to the holding state, and the substrate W is held by the upper holding devices 10A, 10B. During this transition, one of the upper chucks 12A, 12B is moved to the target position as described above, and then the other upper chuck is moved toward the one upper chuck, thereby accurately positioning the substrate W in the X direction.

[0086] At this time, the photoelectric sensor 19 (FIG. 5) also judges the substrate holding state. Specifically, light is emitted from the light projecting unit 19a toward the light receiving unit 19b, and based on a light receiving signal from the light receiving unit 19b, it is judged whether the substrate W is normally held by the upper holding devices 10A, 10B. If it is judged that the substrate W is not normally held, the processing of the substrate W is stopped.

[0087] In the substrate cleaning apparatus 1 according to the present embodiment, while the substrate W is held by the upper holding devices 10A, 10B, the central region of the underside of the substrate W is cleaned by the lower surface brush 51. After the hand Ma has been withdrawn, the lower surface brush 51 moves to a position facing a predetermined region (initial contact region) of the underside of the substrate W that is to be contacted first, in preparation for cleaning the central region of the underside of the substrate W. In this example, the initial contact region is assumed to be the central region of the underside of the substrate W.

[0088] In this case, specifically, the movable base 32 moves in the Y direction so that the lower brush 51 overlaps the initial contact area of ​​the substrate W in plan view. Also, the lifting support part 54 rises so that the lower brush 51 approaches a height position close to the lower surface of the substrate W. More specifically, in the example of FIG. 9, as shown by a thick solid arrow a4, the movable base 32 moves forward from the reference horizontal position until the center of the lower brush 51 overlaps the planar reference position rp in plan view. Also, as shown by a thick solid arrow a5 in FIG. 9, the lifting support part 54 rises so that the lower brush 51 approaches a position near the substrate W (a position spaced about 5 mm from the substrate W) from the lower brush standby position. Note that the lifting support part 54 may rise to a position where the lower brush 51 contacts the lower surface of the substrate W.

[0089] As described above, the operation of the shutter 91 transitioning from the open state to the closed state is called the shutter closing operation. Also, the operation of the upper holding devices 10A, 10B transitioning from the placement-ready state to the holding state is called the holding transition operation. Furthermore, the operation of the lower surface brush 51 moving so as to overlap the initial contact area of ​​the substrate W in a plan view, and the operation of moving in the vertical direction from the lower surface brush standby position toward the lower surface of the substrate W held by the upper holding devices 10A, 10B are called the first brush preparation operation. In this case, the chuck control unit 9A, the pedestal control unit 9C, the lower surface cleaning control unit 9E, and the carry-in / carry-out control unit 9I in FIG. 5 start each operation so that the period of the shutter closing operation, the period of the holding transition operation, and the period of the first brush preparation operation overlap at least partially.

[0090] Here, after the hand Ma has been withdrawn, the suction holding part 21 starts to rotate as shown by the thick solid arrow a6 in Fig. 9. That is, the lower holding device 20 transitions from a stopped state to a rotating state. This transition of the lower holding device 20 is performed, for example, during the period from when the substrate W enters the inside of the unit housing 2 to when the substrate W is held by the upper holding devices 10A and 10B.

[0091] Next, the lower surface brush 51 is pressed against the initial contact region (the lower surface central region in this example) of the substrate W. In addition, as indicated by a thick solid arrow a7 in Fig. 10, the lower surface brush 51 rotates (spins) around an axis in the vertical direction. As a result, contaminants adhering to the lower surface central region of the substrate W are physically peeled off by the lower surface brush 51.

[0092] 10, an enlarged side view of the portion where the lower surface brush 51 contacts the lower surface of the substrate W is shown in a bubble. As shown in the bubble, with the lower surface brush 51 in contact with the substrate W, the substrate nozzle 52 and the gas ejection part 53 are held in positions close to the lower surface of the substrate W. At this time, the substrate nozzle 52 ejects the cleaning liquid toward the lower surface of the substrate W at a position close to the lower surface brush 51, as shown by the outlined arrow a51. As a result, the cleaning liquid supplied to the lower surface of the substrate W from the substrate nozzle 52 is guided to the contact part between the lower surface brush 51 and the substrate W, and the contaminants removed from the rear surface of the substrate W by the lower surface brush 51 are washed away by the cleaning liquid.

[0093] Here, the upper surface 54u of the lifting support part 54 is inclined obliquely downward in a direction away from the suction holding part 21. In this case, when the cleaning liquid containing contaminants drops from the lower surface of the substrate W onto the lifting support part 54, the cleaning liquid received by the upper surface 54u is guided in a direction away from the suction holding part 21.

[0094] Moreover, when the lower surface of the substrate W is cleaned by the lower surface brush 51, the gas ejection unit 53 ejects gas toward the lower surface of the substrate W at a position between the lower surface brush 51 and the adsorption holding unit 21, as shown by the white arrow a52 in the blowout of FIG. 10. In this embodiment, the gas ejection unit 53 is attached to the movable base 32 so that the gas ejection port extends in the X direction. In this case, when gas is ejected from the gas ejection unit 53 toward the lower surface of the substrate W, a band-shaped gas curtain extending in the X direction is formed between the lower surface brush 51 and the adsorption holding unit 21. This prevents the cleaning liquid containing contaminants from scattering toward the adsorption holding unit 21 when the lower surface of the substrate W is cleaned by the lower surface brush 51. Therefore, when the lower surface of the substrate W is cleaned by the lower surface brush 51, the cleaning liquid containing contaminants is prevented from adhering to the adsorption holding unit 21, and the adsorption surface of the adsorption holding unit 21 is kept clean.

[0095] 10, the gas jetting part 53 jets gas obliquely upward from the gas jetting part 53 toward the lower surface brush 51 as shown by the outlined arrow a52, but the present invention is not limited to this. The gas jetting part 53 may jet gas from the gas jetting part 53 toward the lower surface of the substrate W along the Z direction.

[0096] As described above, while the central region of the lower surface of the substrate W is being cleaned, the lower holding device 20 continues to rotate. As a result, even if droplets of the cleaning liquid used to clean the substrate W fall onto the suction holding part 21, the droplets are shaken off from the rotating suction holding part 21. This prevents the droplets of the cleaning liquid from remaining on the suction holding part 21.

[0097] 10, when cleaning of the central region of the lower surface of the substrate W is completed, the lifting support part 54 descends so that the cleaning surface of the lower surface brush 51 is spaced a predetermined distance from the substrate W. In addition, the ejection of the cleaning liquid from the substrate nozzle 52 to the substrate W is stopped. At this time, the ejection of the gas from the gas ejection part 53 to the substrate W continues.

[0098] 11, the movable base 32 moves to a position shifted a predetermined distance rearward from the reference horizontal position in a plan view. At this time, the gas ejection unit 53 continues to eject gas onto the substrate W, so that the central region of the lower surface of the substrate W is successively dried by a gas curtain. When the central region of the lower surface of the substrate W is dried by the gas ejection unit 53, the rotation of the lower surface brush 51 may be temporarily stopped.

[0099] 12, the lifting support part 54 is lowered so that the cleaning surface of the lower surface brush 51 is positioned below the adsorption surface (upper end) of the adsorption holding part 21. This causes the lower surface brush 51 to move to the lower surface brush standby position (height position). Note that the lower surface brush 51 may move from a position in contact with the lower surface of the substrate W to the lower surface brush standby position after cleaning the central region of the lower surface of the substrate W and before drying by the gas ejection part 53.

[0100] 12, the upper chucks 12A, 12B move away from each other so as to be separated from the outer circumferential edge of the substrate W. As a result, the upper holding devices 10A, 10B transition from the holding state to a state in which the substrate W can be placed, and the substrate W is supported on the lower chucks 11A, 11B so as to be able to be picked up. During this transition, while one of the upper chucks 12A, 12B is in the target position as described above, the other upper chuck is moved away from the one upper chuck. As a result, the substrate W on the lower chucks 11A, 11B is accurately positioned in the X direction.

[0101] Thereafter, as shown in the middle and lower parts of FIG. 13, the lower holding device 20 transitions from a rotating state to a stopped state. That is, the rotation of the suction holding part 21 of the lower holding device 20 stops. This stopping of the rotation takes, for example, about 2 seconds. Furthermore, as shown by a thick solid arrow a11 in FIG. 13, the movable base 32 moves forward toward the reference horizontal position. Furthermore, as shown by a thick solid arrow a12 in FIG. 13, the pin connecting member 42 rises so that the upper ends of the multiple support pins 41 are positioned slightly above the lower chucks 11A and 11B. As a result, the substrate W supported by the lower chucks 11A and 11B is received by the multiple support pins 41.

[0102] 5 raises the support pins 41 at high speed while the upper ends of the support pins 41 move from a position below the suction holding unit 21 to a height position slightly below the support pieces 200 (FIG. 3) of the lower chucks 11A, 11B. On the other hand, the delivery control unit 9D raises the support pins 41 at low speed while the upper ends of the support pins 41 move from a height position slightly below the support pieces 200 to a height position slightly above the support pieces 200. This prevents damage to the substrate W when the support pins 41 come into contact with the substrate W, and shortens the time until the support pins 41 in the initial state receive the substrate W.

[0103] As described above, the operation of the lower holding device 20 moving from a rotating state to a stopped state is called a rotation stopping operation. Also, the operation of the movable base 32 moving in the horizontal direction (forward in this example) toward the reference horizontal position is called a horizontal movement operation. Furthermore, the operation of the multiple support pins 41 moving upward is called a vertical movement operation. The horizontal movement operation of the movable base 32 and the vertical movement operation of the multiple support pins 41 are operations performed to transfer the substrate W from the upper holding devices 10A, 10B to the lower holding device 20. In this case, the chuck control unit 9A, base control unit 9C, and delivery control unit 9D in FIG. 5 start each operation so that at least a part of the period of the rotation stopping operation, at least a part of the period of the horizontal movement operation, and at least a part of the period of the vertical movement operation overlap with each other.

[0104] Next, as shown by the thick solid arrow a13 in FIG. 14, the lower chucks 11A and 11B move away from each other. As a result, the upper holding devices 10A and 10B move from the mountable state to the retreated state. At this time, the lower chucks 11A and 11B are in positions that do not overlap the substrate W supported by the support pins 41 in a plan view. This makes it possible to move the substrate W supported in a horizontal position by the support pins 41 in the vertical direction (Z direction) through the upper holding devices 10A and 10B. Furthermore, in this embodiment, when the upper holding devices 10A and 10B are in the retreated state, the lower chucks 11A and 11B and the upper chucks 12A and 12B are in positions that do not overlap the cup 61 in a plan view.

[0105] 15, the pin connecting member 42 is lowered so that the upper ends of the multiple support pins 41 are positioned below the suction holding portion 21. As a result, the substrate W supported on the multiple support pins 41 is received by the suction holding portion 21. In this state, the suction holding portion 21 suction-holds the central region of the lower surface of the substrate W.

[0106] 5 lowers the support pins 41 at high speed to a degree that the substrate W does not float while the upper ends of the support pins 41 move from a position above the suction holding unit 21 to a height position slightly above the suction holding unit 21. On the other hand, the delivery control unit 9D lowers the support pins 41 at a low speed while the upper ends of the support pins 41 move from a height position slightly above the suction holding unit 21 to a height position below the suction holding unit 21. This prevents damage to the substrate W when the suction holding unit 21 comes into contact with the substrate W, and shortens the time until the substrate W on the upper holding device 10A, 10B is delivered to the lower holding device 20.

[0107] Here, as described above, the operation of the delivery device 40 until the substrate W held by the upper holding devices 10A, 10B is lowered and delivered onto the lower holding device 20 is called a substrate lowering operation. In this embodiment, the cup lifting operation, the second brush preparation operation, the first nozzle preparation operation and the third brush preparation operation described below are performed so as to overlap at least a part of the period of the substrate lowering operation of the delivery device 40.

[0108] The cup lifting operation is an operation for lifting the cup 61 from the lower cup position to the upper cup position, as indicated by the thick solid arrow a15 in Fig. 15. As described above, the lower chucks 11A, 11B and the upper chucks 12A, 12B do not overlap the cup 61 in a plan view when the upper holding devices 10A, 10B are in the retracted state. Therefore, it is preferable that the cup lifting operation is started at a timing when at least the upper holding devices 10A, 10B are in the retracted state. In this case, interference between the cup 61 and the upper holding devices 10A, 10B is prevented when the cup 61 is lifted.

[0109] The second brush preparatory operation is an operation for lifting the lower brush 51 from the lower brush standby position toward the lower surface of the substrate W held by the lower holding device 20, as indicated by a thick solid arrow a16 in Fig. 15. During this second brush preparatory operation, the rotation of the lower brush 51 (rotation about an axis extending in the vertical direction) continues, as indicated by a thick solid arrow a23 in Fig. 17, which will be described later.

[0110] 5, during the second brush preparation operation, temporarily stops the raising of the lower surface brush 51 or reduces the raising speed of the lower surface brush 51 when the lower surface brush 51 reaches a height position slightly below the lower surface of the substrate W. This prevents damage to the substrate W when the lower surface brush 51 comes into contact with the substrate W.

[0111] The first nozzle preparation operation is an operation of moving the spray nozzle 73 from the spray nozzle standby position toward the spray nozzle processing position above the substrate W. At the start of the first nozzle preparation operation, the spray nozzle 73 is at a height position above the substrate W, the upper holding devices 10A and 10B, and the cup 61. When the first nozzle preparation operation is started, the rotating support shaft 71 of the upper surface cleaning device 70 rotates. As a result, as shown by the thick solid arrow a17 in FIG. 15, the spray nozzle 73 moves from the spray nozzle standby position to a position above the substrate W. Then, the rotating support shaft 71 moves down a predetermined distance. As a result, as shown by the thick solid arrow a18 in FIG. 16, the tip of the spray nozzle 73 moves down to a height position about several centimeters above the upper surface of the substrate W, and the spray nozzle 73 reaches the spray nozzle processing position.

[0112] The third brush preparation operation is an operation of moving the bevel brush 83 from the bevel brush standby position toward the bevel brush processing position where the bevel brush 83 contacts the outer peripheral edge of the substrate W. At the start of the third brush preparation operation, the bevel brush 83 is at a height position above the substrate W, the upper holding devices 10A and 10B, and the cup 61. When the third brush preparation operation is started, the rotating support shaft 81 of the edge cleaning device 80 rotates. As a result, as shown by the thick solid arrow a19 in FIG. 15, the bevel brush 83 moves from the bevel brush standby position to a position above a part of the outer peripheral edge of the substrate W. In addition, the rotating support shaft 81 descends a predetermined distance. As a result, as shown by the thick solid arrow a20 in FIG. 16, the bevel brush 83 descends to a position where the bevel brush 83 contacts a part of the outer peripheral edge of the substrate W, and reaches the bevel brush processing position.

[0113] 5 temporarily stops the descent of the bevel brush 83 or reduces the descent speed during the third brush preparation operation when the bevel brush 83 reaches a position slightly spaced from the outer circumferential edge of the substrate W. This prevents the substrate W from being damaged when the bevel brush 83 comes into contact with the substrate W.

[0114] 17, the suction holding part 21 rotates around the vertical axis (the axis of the rotation shaft of the suction holding drive part 22). As a result, the substrate W suctioned and held by the suction holding part 21 rotates in a horizontal position. Note that the timing for starting rotation of the suction holding part 21 may be any time after the substrate W transferred from the transfer device 40 to the lower holding device 20 has been suctioned and held by the suction holding part 21.

[0115] Thereafter, a mixed fluid of cleaning liquid and gas is sprayed from the spray nozzle 73 onto the upper surface of the substrate W. In addition, the rotary support shaft 71 rotates. As a result, as indicated by a thick solid arrow a22 in Fig. 17, the spray nozzle 73 moves in an arc at a position above the rotating substrate W. As the mixed fluid is sprayed onto the entire upper surface of the substrate W, the entire upper surface of the substrate W is cleaned.

[0116] At this time, the bevel brush 83 rotates (spins) about an axis extending in the vertical direction, with the central portion of the outer circumferential surface of the bevel brush 83 in contact with the outer circumferential edge of the substrate W. As a result, the contaminants adhering to the outer circumferential edge of the substrate W are physically peeled off by the bevel brush 83. The contaminants peeled off from the outer circumferential edge of the substrate W are washed away by the cleaning liquid of the mixed fluid sprayed from the spray nozzle 73 onto the substrate W.

[0117] 17, the lower surface brush 51 continues to rotate (spin) around the vertical axis. Furthermore, the substrate nozzle 52 ejects a cleaning liquid toward the lower surface of the substrate W, and the gas ejection unit 53 jets gas toward the lower surface of the substrate W. This allows the lower surface brush 51 to clean the entire outer lower surface region of the substrate W that is attracted, held, and rotated by the suction holding unit 21. The rotation direction of the lower surface brush 51 may be opposite to the rotation direction of the suction holding unit 21. In this case, the outer lower surface region of the substrate W can be efficiently cleaned.

[0118] The lifting support part 54 may be configured to be movable in the Y direction on the movable base 32 relative to the lower holding device 20. In this case, as shown by a thick solid arrow a24 in Fig. 17, the lifting support part 54 is moved in the Y direction on the movable base 32. This expands the area that can be cleaned by the lower brush 51 with the movable base 32 fixed in a predetermined position.

[0119] When cleaning of the upper surface, the outer peripheral end, and the outer region of the lower surface of the substrate W is completed, the spray of the mixed fluid from the spray nozzle 73 to the substrate W is stopped. Also, as shown by a thick solid arrow a25 in FIG. 18, the spray nozzle 73 moves to the spray nozzle standby position (initial state position). Also, as shown by a thick solid arrow a26 in FIG. 18, the bevel brush 83 moves to the bevel brush standby position (initial state position). Furthermore, the lift support part 54 descends. As a result, the lower surface brush 51 moves from the position where it contacts the lower surface of the substrate W to the lower surface brush standby position. Also, the discharge of the cleaning liquid from the substrate nozzle 52 to the substrate W and the spray of the gas from the gas blowing part 53 to the substrate W are stopped. In this state, the suction holding part 21 rotates at high speed, so that the cleaning liquid adhering to the substrate W is shaken off, and the entire substrate W is dried (spin drying). Note that the rotation of the lower surface brush 51 may be temporarily stopped during this spin drying.

[0120] 19, the cup 61 descends from the upper cup position to the lower cup position. Thereafter, the substrate W is unloaded from the unit housing 2 of the substrate cleaning apparatus 1. When the substrate W is unloaded from the unit housing 2, the shutter 91 transitions from the closed state to the open state (shutter opening operation) immediately before the hand (substrate holding portion) Ma of the substrate transport robot (not shown) enters the unit housing 2.

[0121] 20, the hand (substrate holder) Ma of the substrate transport robot enters the unit housing 2 through the loading / unloading opening 2x. The hand Ma then receives the substrate W on the suction holder 21 and exits through the loading / unloading opening 2x. After the hand Ma exits, the shutter 91 transitions from the open state to the closed state (shutter closing operation).

[0122] Incidentally, following the unloading of the substrate W, a new unprocessed substrate W may be loaded into the unit housing 2 (substrate W replacement). In this case, the chuck control unit 9A and the loading / unloading control unit 9I in Fig. 5 start each operation so that the period of the shutter opening operation for unloading the processed substrate W and the period of the placement preparation operation for the upper holding devices 10A, 10B to receive the unprocessed substrate W overlap at least partially.

[0123] As described above, the lower surface brush 51 basically rotates continuously while the power supply of the substrate cleaning apparatus 1 is on. The lower surface cleaning control unit 9E in Fig. 5 controls the brush cleaning liquid supply unit 57 to supply cleaning liquid for brush cleaning from the brush cleaning liquid supply unit 57 to the brush nozzles 52a, 52b in Fig. 1 during a predetermined brush cleaning period. In this case, the brush cleaning period may include a period during which the substrate W is not present in the unit housing 2. The brush cleaning period may also include a period during which the lower surface brush 51 is at a lower surface brush standby position in the up-down direction.

[0124] 4.Effects (a) In the above-mentioned substrate cleaning apparatus 1, the substrate W is held by the upper holding devices 10A and 10B, and the central region of the lower surface of the substrate W is cleaned. Next, the substrate W is transferred from the upper holding devices 10A and 10B to the lower holding device 20 by the substrate lowering operation of the transfer device 40. At this time, the substrate W held by the upper holding devices 10A and 10B is lowered from the height position of the upper holding devices 10A and 10B to the height position of the suction holding unit 21 of the lower holding device 20 by the substrate lowering operation of the transfer device 40. Thereafter, the substrate W is suction-held by the suction holding unit 21 and rotates. In this state, the outer region of the lower surface of the substrate W is cleaned by the lower surface cleaning device 50. The upper surface of the substrate W is cleaned by the upper surface cleaning device 70, and the outer peripheral edge of the substrate W is cleaned by the edge cleaning device 80. The cleaning liquid splashed from the substrate W is received by the cup 61 and is collected or discarded.

[0125] (b) The cup 61 is in a standby state at the lower cup position during a period when cleaning of the substrate W held by the lower holding device 20 is not being performed. This prevents interference between the cup 61 and other components of the substrate cleaning apparatus 1. Therefore, a cup lifting operation is performed to lift the cup 61 from the lower cup position to the upper cup position immediately before cleaning of the substrate W held by the lower holding device 20 is started.

[0126] The transfer control unit 9D and the cup control unit 9F in Fig. 5 start each operation so that the period of the substrate lowering operation and the period of the cup lifting operation at least partially overlap each other. This reduces the period required to process one substrate W by the overlapping period compared to when each operation is performed so that the period of the substrate lowering operation and the period of the cup lifting operation do not overlap. This improves the throughput of substrate processing.

[0127] It is preferable that the substrate lowering operation and the cup raising operation are started or ended simultaneously, so that an overlapping period of at least one of the two operation periods can be ensured.

[0128] 5 starts each operation so that the period of the substrate lowering operation and the period of the second brush preparation operation at least partially overlap each other. This reduces the period required to process one substrate W by the overlapping period compared to when each operation is performed so that the period of the substrate lowering operation and the period of the second brush preparation operation do not overlap. This improves the throughput of substrate processing.

[0129] It is preferable that the substrate lowering operation and the second brush preparation operation are started or ended simultaneously, so that an overlapping period of at least one of the two operation periods can be ensured.

[0130] 5 starts each operation so that the period of the substrate lowering operation and the period of the first nozzle preparation operation at least partially overlap each other. This reduces the period required to process one substrate W by the overlapping period compared to when each operation is performed so that the period of the substrate lowering operation and the period of the first nozzle preparation operation do not overlap. This improves the throughput of substrate processing.

[0131] It is preferable that the substrate lowering operation and the first nozzle preparation operation are started or ended simultaneously, so that an overlapping period of at least one of the two operation periods can be secured.

[0132] (e) Furthermore, the delivery control unit 9D and the bevel cleaning control unit 9H in Fig. 5 start each operation so that the period of the substrate lowering operation and the period of the third brush preparation operation at least partially overlap each other. This reduces the period required to process one substrate W by the overlapping period compared to when each operation is performed so that the period of the substrate lowering operation and the period of the third brush preparation operation do not overlap. This improves the throughput of substrate processing.

[0133] It is preferable that the substrate lowering operation and the third brush preparation operation are started or ended simultaneously, so that an overlapping period of at least one of the two operation periods can be ensured.

[0134] (f) In the present embodiment, at least a portion of the period of the substrate lowering operation, at least a portion of the period of the cup raising operation, at least a portion of the period of the second brush preparatory operation, at least a portion of the period of the first nozzle preparatory operation, and at least a portion of the period of the third brush preparatory operation overlap with one another. In this manner, when multiple operations are performed in parallel, the throughput of substrate processing is further improved.

[0135] It is preferable that the substrate lowering operation, the cup lifting operation, the second brush preparation operation, the first nozzle preparation operation, and the third brush preparation operation are started or ended simultaneously, which can further improve the throughput of the substrate processing.

[0136] 5. Other embodiments (a) In the above embodiment, at least a portion of the period of the substrate lowering operation, at least a portion of the period of the cup raising operation, at least a portion of the period of the second brush preparatory operation, at least a portion of the period of the first nozzle preparatory operation, and at least a portion of the period of the third brush preparatory operation overlap with one another. However, the present invention is not limited to this.

[0137] When the period of the substrate lowering operation and the period of the cup raising operation at least partially overlap, the period of the second brush preparatory operation, the period of the first nozzle preparatory operation, and the period of the third brush preparatory operation do not have to overlap with the period of the substrate lowering operation. Even in this case, by at least partially overlapping the period of the substrate lowering operation and the period of the cup raising operation, the throughput of the substrate processing is improved as described above.

[0138] When the period of the substrate lowering operation and the period of the second brush preparation operation at least partially overlap, the period of the cup raising operation, the period of the first nozzle preparation operation, and the period of the third brush preparation operation do not have to overlap with the period of the substrate lowering operation. Even in this case, by at least partially overlapping the period of the substrate lowering operation and the period of the second brush preparation operation, the throughput of the substrate processing is improved as described above.

[0139] When the period of the substrate lowering operation and the period of the first nozzle preparation operation at least partially overlap, the period of the cup raising operation, the period of the second brush preparation operation, and the period of the third brush preparation operation do not have to overlap with the period of the substrate lowering operation. Even in this case, by at least partially overlapping the period of the substrate lowering operation and the period of the first nozzle preparation operation, the throughput of the substrate processing is improved as described above.

[0140] When the period of the substrate lowering operation and the period of the third brush preparation operation at least partially overlap, the period of the cup raising operation, the period of the second brush preparation operation, and the period of the first nozzle preparation operation do not have to overlap with the period of the substrate lowering operation. Even in this case, by at least partially overlapping the period of the substrate lowering operation and the period of the third brush preparation operation, the throughput of the substrate processing is improved as described above.

[0141] (b) The substrate cleaning apparatus 1 according to the above embodiment may have a back-rinse nozzle that supplies a rinsing liquid to an outer region of the lower surface of the substrate W adsorbed and held by the lower holding device 20. Furthermore, the substrate cleaning apparatus 1 may have a rinse nozzle that supplies a rinsing liquid to the upper surface of the substrate W adsorbed and held by the lower holding device 20.

[0142] Figure 21 is a schematic plan view of a substrate cleaning apparatus 1 according to another embodiment. Figure 22 is a block diagram showing the configuration of a control system of the substrate cleaning apparatus 1 of Figure 21. The schematic plan view of Figure 21 corresponds to the schematic plan view of Figure 1. The block diagram of Figure 22 corresponds to the block diagram of Figure 5. Regarding the substrate cleaning apparatus 1 of Figure 21, differences from the substrate cleaning apparatus 1 according to the above-mentioned embodiment will be described.

[0143] As shown in FIG. 21, the substrate cleaning apparatus 1 of this example further includes an upper surface rinsing apparatus 210 in addition to upper holding devices 10A, 10B, a lower holding device 20, a base device 30, a transfer device 40, a lower surface cleaning device 50, a cup device 60, an upper surface cleaning device 70, an edge cleaning device 80 and an opening / closing device 90.

[0144] The upper surface rinsing device 210 is provided adjacent to the edge cleaning device 80 at a position to the side of the cup 61 in the X direction. The upper surface rinsing device 210 includes a rotation support shaft 211, an arm 212, a rinse nozzle 213, and a rinse drive unit 214.

[0145] The rotation support shaft 211 is supported by a rinse drive unit 214 so as to extend in the vertical direction on the bottom surface portion 2a and to be movable up and down and rotatable. The arm 212 is provided at a position above the upper holding device 10A and to extend horizontally from the upper end of the rotation support shaft 211. A rinse nozzle 213 is attached to the tip of the arm 212.

[0146] A rinsing liquid supply unit 215 (FIG. 22) is connected to the rinsing nozzle 213. The rinsing liquid supply unit 215 supplies a rinsing liquid to the rinsing nozzle 213. In this example, pure water is used as the cleaning liquid supplied to the rinsing nozzle 213. The rinsing nozzle 213 sprays the cleaning liquid supplied from the rinsing liquid supply unit 215 onto the upper surface of the substrate W during or after cleaning of the upper surface of the substrate W by the spray nozzle 73 and before drying of the substrate W.

[0147] The rinse driving unit 214 includes one or more pulse motors, an air cylinder, etc., and raises and lowers the rotation support shaft 211 and rotates the rotation support shaft 211. According to the above configuration, as shown by the thick dotted arrow in Fig. 21, the rinse nozzle 213 is moved in an arc over the upper surface of the substrate W that is attracted and held by the suction holding unit 21 and rotated, so that the rinse liquid can be supplied to the entire upper surface of the substrate W.

[0148] Furthermore, as described above, when the substrate cleaning apparatus 1 further has a back rinse nozzle, the rinse liquid can also be supplied to the underside of the substrate W that is attracted, held and rotated by the attracting and holding part 21. In this manner, the substrate cleaning apparatus 1 of Fig. 21 allows rinsing processing to be performed on the upper and lower surfaces of the substrate W after or during cleaning.

[0149] 22, the control device 170 of this example includes, as a functional unit, a rinse control unit 9J in addition to the various control units shown in FIG. 5. The function of the rinse control unit 9J is realized by a CPU executing a substrate cleaning program stored in a storage device on a RAM, as with the other control units. A part or all of the rinse control unit 9J may be realized by hardware such as an electronic circuit. The rinse control unit 9J controls a rinse drive unit 214 and a rinse liquid supply unit 215 to perform a rinse process on the upper surface of the substrate W attracted and held by the suction holding unit 21.

[0150] 21 also performs a series of processes shown in Figures 6 to 20 for one substrate W, basically similarly to the substrate cleaning apparatus 1 according to the above embodiment. During the series of processes, a rinse control unit 9J in Figure 22 may control the rinse drive unit 214 and the rinse liquid supply unit 215 as described below.

[0151] Figure 23 is a side view for explaining an example of control of the rinse drive unit 214 and the rinse liquid supply unit 215 by the rinse control unit 9J of Figure 22. The side view of Figure 23 is a side view of the lower holding device 20 and its peripheral parts as viewed along the Y direction of the substrate cleaning apparatus 1 of Figure 21, and corresponds to the side view of line CC in Figure 21. Furthermore, the timing of the operating states of the substrate cleaning apparatus 1 shown in the side view of Figure 23 corresponds to the timing of the operating states of the substrate cleaning apparatus 1 according to the above embodiment in Figure 15.

[0152] 23, in this example, the second nozzle preparation operation is performed so as to overlap at least a part of the period of the substrate lowering operation of the delivery device 40. The second nozzle preparation operation is an operation of moving the rinse nozzle 213 from the rinse nozzle standby position beside the cup 61 toward the rinse nozzle processing position above the substrate W.

[0153] At the start of the second nozzle preparation operation, the rinse nozzle 213 is held at a height position above the substrate W, the upper holding devices 10A and 10B, and the cup 61. When the second nozzle preparation operation is started, the rotary support shaft 211 of the upper surface rinsing device 210 rotates. As a result, as shown by a thick solid arrow a29 in FIG. 23, the rinse nozzle 213 moves from the rinse nozzle standby position to a position above the substrate W. Then, the rotary support shaft 211 descends a predetermined distance. As a result, the tip of the rinse nozzle 213 descends to a height position about several centimeters above the upper surface of the substrate W, and the rinse nozzle 213 reaches the rinse nozzle processing position. Thereafter, the rinse liquid is supplied to the upper surface of the substrate W from the rinse nozzle 213 at the rinse nozzle processing position.

[0154] In this example, the delivery control unit 9D and the rinse control unit 9J in FIG. 22 start each operation so that the period of the substrate lowering operation and the period of the second nozzle preparation operation overlap each other at least partially. As a result, the period required to process one substrate W is shortened by the overlapping period compared to a case where each operation is performed so that the period of the substrate lowering operation and the period of the second nozzle preparation operation do not overlap. This improves the throughput of the substrate processing. Note that the substrate cleaning apparatus 1 in FIG. 21 may not be provided with the lower surface cleaning apparatus 50, the upper surface cleaning apparatus 70, or the edge cleaning apparatus 80.

[0155] In this example as well, the cup lifting operation (arrow a15 in FIG. 23), the second brush preparation operation, the first nozzle preparation operation (arrow a17 in FIG. 23), and the third brush preparation operation (arrow a19 in FIG. 23) are performed so as to overlap with at least a portion of the period of the substrate lowering operation of the delivery device 40. However, these operations (the cup lifting operation, the second brush preparation operation, the first nozzle preparation operation, and the third brush preparation operation) may be performed so as not to overlap with the period of the substrate lowering operation of the delivery device 40.

[0156] (c) In the above embodiment, the predetermined area (initial contact area) where the lower surface brush 51 should first come into contact with the lower surface of the substrate W held by the upper holding devices 10A, 10B is set to the central area of ​​the lower surface of the substrate W, but the present invention is not limited to this. The initial contact area may be set at a position shifted a predetermined distance in the Y direction from the central area of ​​the lower surface. In this case, when cleaning the central area of ​​the lower surface of the substrate W, after the lower surface brush 51 comes into contact with the initial contact area, the movable base 32 operates so that the lower surface brush 51 moves from the initial contact area to the central area of ​​the lower surface on the underside.

[0157] (d) In the substrate cleaning apparatus 1 according to the above embodiment, the upper holding devices 10A, 10B are configured to hold the outer peripheral edge of the substrate W, but the present invention is not limited thereto. For example, each of the upper holding devices 10A, 10B may be provided with a plurality of suction pads instead of the above-mentioned lower chucks 11A, 11B and upper chucks 12A, 12B, and configured to be capable of suction-holding a part of the lower surface of the substrate W. In this case, the upper holding devices 10A, 10B suction-hold an outer region of the lower surface of the substrate W as the peripheral portion of the substrate W. Thereby, the central region of the lower surface of the substrate W can be cleaned while the substrate W is suction-held by the upper holding devices 10A, 10B.

[0158] (e) In the substrate cleaning apparatus 1 according to the above embodiment, in order to transfer the substrate W from the upper holding device 10A, 10B to the lower holding device 20, the transfer device 40 moves the multiple support pins 41 up and down, but the present invention is not limited to this.

[0159] The substrate cleaning apparatus 1 may be provided with a lifting drive unit that lifts and lowers the lower holding device 20 relative to the upper holding devices 10A and 10B. Alternatively, a lifting drive unit that lifts and lowers the upper holding devices 10A and 10B relative to the lower holding device 20 may be provided. In these cases, at least one of the lower holding device 20 and the upper holding devices 10A and 10B lifts and lowers relative to the other, making it possible to transfer the substrate W between the two holding devices without using multiple support pins 41. In this case, the transfer device 40 is not necessary, and the lifting drive unit of the lower holding device 20 or the lifting drive unit of the upper holding devices 10A and 10B functions as a component that performs the substrate lowering operation.

[0160] (f) In the substrate cleaning apparatus 1 according to the above embodiment, the movable base 32 is moved horizontally by the base device 30 in order to transfer the substrate W from the upper holding device 10A, 10B to the lower holding device 20, but the present invention is not limited to this.

[0161] The substrate cleaning apparatus 1 may be provided with a movement drive unit that moves the upper holding devices 10A, 10B in the Y direction relative to the lower holding device 20. In this case, by moving the upper holding devices 10A, 10B in the Y direction relative to the lower holding device 20, it becomes possible to transfer the substrate W between the two holding devices without moving the lower holding device 20 in the horizontal direction.

[0162] (g) As shown in the above embodiment, when the cleaning liquid for substrate cleaning and the cleaning liquid for brush cleaning are the same, it is not necessary to provide two substrate nozzles 52. In this case, when cleaning the central region of the underside of the substrate W and when cleaning the outer region of the underside of the substrate W, the cleaning liquid discharged from brush nozzles 52a and 52b to lower surface brush 51 can be used as the cleaning liquid for substrate cleaning.

[0163] (h) In the substrate cleaning apparatus 1 according to the above embodiment, cleaning liquid is supplied to the substrate W from two substrate nozzles 52 while the lower surface brush 51 is cleaning the central region of the lower surface of the substrate W, but the present invention is not limited to this.

[0164] In the substrate cleaning apparatus 1, before cleaning the lower surface of the substrate W with the lower brush 51, the lower brush 51 may be preliminarily cleaned to soak the lower brush 51 in cleaning liquid. In this case, by bringing the lower brush 51 soaked in cleaning liquid into contact with the lower surface of the substrate W, the lower surface of the substrate W can be cleaned with the lower brush 51 in contact with the substrate W without the need to supply new cleaning liquid.

[0165] (i) The substrate cleaning apparatus 1 according to the above embodiment may include at least one of the lower surface cleaning apparatus 50, the upper surface cleaning apparatus 70, and the edge cleaning apparatus 80, and may not include any apparatus other than the at least one apparatus. Furthermore, the substrate cleaning apparatus 1 according to the above embodiment may include components for performing processes other than the cleaning process on the substrate W held by the upper holding devices 10A, 10B.

[0166] 6. Correspondence between each component of the claims and each part of the embodiment Below, examples of the correspondence between each component of the claims and each element of the embodiment will be described, but the present invention is not limited to the following examples. Various other elements having the configuration or function described in the claims can also be used as each component of the claims.

[0167] In the above embodiment, the substrate cleaning apparatus 1 is an example of a substrate processing apparatus, the height position of the substrate W held by the upper holding devices 10A, 10B is an example of a first height position, the upper holding devices 10A, 10B are an example of a first substrate holding unit, the height position of the substrate W held by the lower holding device 20 is an example of a second height position, and the lower holding device 20 is an example of a second substrate holding unit.

[0168] Furthermore, cleaning processing of the central region of the underside of the substrate W using the lower surface brush 51 is an example of a first process, cleaning processing of the upper surface of the substrate W, cleaning processing of the outer peripheral edge of the substrate W, cleaning processing of the outer region of the underside of the substrate W, and rinsing processing of the substrate W are examples of a second process, and the lower surface cleaning device 50, the upper surface cleaning device 70, the edge cleaning device 80 and the upper surface rinsing device 210 are examples of processing devices.

[0169] In addition, the transfer device 40 is an example of a substrate moving part, the control device 170 is an example of a control part, the cup 61 is an example of a processing cup, the cup drive part 62 is an example of a cup drive part, the lower surface brush 51 is an example of a lower surface brush, and the lifting support part 54 and the lower surface brush lifting drive part 55b are examples of a lower surface brush moving part.

[0170] In addition, the cleaning liquid and the rinsing liquid are examples of processing liquids, the spray nozzle 73 and the rinsing nozzle 213 are examples of fluid nozzles, the rotating support shaft 71, the arm 72, the upper surface cleaning drive unit 74, the rotating support shaft 211, the arm 212 and the rinsing drive unit 214 are examples of nozzle moving parts, the bevel brush 83 is an example of an end brush, and the rotating support shaft 81, the arm 82 and the bevel brush drive unit 84 are examples of end brush moving parts.

[0171] 7. Summary of the embodiment (Item 1) The substrate processing apparatus according to item 1 comprises: a first substrate holding part configured to be able to hold a substrate at a first height position; a second substrate holding portion configured to be able to hold a substrate at a second height position that is lower than the first height position; a processing section configured to perform a first processing on a substrate held by the first substrate holding section and to perform a second processing on a substrate held by the second substrate holding section; a substrate moving unit that performs a substrate lowering operation to lower the substrate from the first height position to the second height position in order to transfer the substrate from the first substrate holding unit to the second substrate holding unit; A control unit. the second treatment includes a treatment using a treatment liquid, The processing section includes a processing cup that is formed to surround the second substrate holding section in a plan view and is provided so as to be movable up and down between an upper cup position corresponding to the second height position and a lower cup position that is lower than the upper cup position; a cup drive unit that raises and lowers the processing cup, The control unit controls the substrate moving unit and the cup driving unit to cause the substrate moving unit to perform the substrate lowering operation and the cup raising operation to raise the processing cup from the lower cup position toward the upper cup position so that at least a portion of the period of the substrate lowering operation and the period of the cup raising operation overlap.

[0172] In the substrate processing apparatus, the substrate is held by a first substrate holder at a first height position, and a first process is performed. Next, the substrate is transferred from the first substrate holder to a second substrate holder. At this time, the substrate is lowered from the first height position to a second height position by a substrate lowering operation. The substrate is held by the second substrate holder at the second height position, and a second process is performed.

[0173] In the second process, a processing liquid is used. Therefore, the processing cup is placed at the upper cup position. The processing liquid used in the second process is received by the processing cup at the upper cup position. When the processing cup is not receiving the processing liquid, it retreats to the lower cup position to prevent interference with other members. Therefore, when starting the second process, it is necessary to raise the processing cup from the lower cup position to the upper cup position. According to the above substrate processing apparatus, at least a part of the period of the substrate lowering operation and the period of the cup raising operation overlap. The period during which these periods overlap is called an overlap period.

[0174] This reduces the time required to process one substrate by the overlap period compared to when the substrate is lowered to the second height position by the substrate lowering operation and then the cup lifting operation is started. Also, compared to when the substrate lowering operation is started after the cup lifting operation, the time required to process one substrate is reduced by the overlap period. Therefore, the throughput of substrate processing is improved.

[0175] (2) The substrate processing apparatus according to the 2nd paragraph comprises: a first substrate holding part configured to be able to hold a substrate at a first height position; a second substrate holding portion configured to be able to hold a substrate at a second height position that is lower than the first height position; a processing section configured to perform a first processing on a substrate held by the first substrate holding section and to perform a second processing on a substrate held by the second substrate holding section; a substrate moving unit that performs a substrate lowering operation to lower the substrate from the first height position to the second height position in order to transfer the substrate from the first substrate holding unit to the second substrate holding unit; A control unit. The processing unit includes: a bottom brush that cleans the bottom surface of the substrate by contacting the bottom surface; a lower surface brush moving unit configured to be able to move the lower surface brush between a lower surface brush processing position in which the lower surface brush contacts the lower surface of the substrate held by the second substrate holding unit and a lower surface brush standby position spaced apart from the lower surface brush processing position, the second process includes a cleaning process of the lower surface of the substrate with the lower surface brush; The control unit controls the substrate moving unit and the underside brush moving unit to perform the substrate lowering operation by the substrate moving unit and the underside brush preparation operation that moves the underside brush from the underside brush waiting position to the underside brush processing position so that at least a portion of the period of the substrate lowering operation and the period of the underside brush preparation operation overlap.

[0176] In the substrate processing apparatus, the substrate is held by a first substrate holder at a first height position, and a first process is performed. Next, the substrate is transferred from the first substrate holder to a second substrate holder. At this time, the substrate is lowered from the first height position to a second height position by a substrate lowering operation. The substrate is held by the second substrate holder at the second height position, and a second process is performed.

[0177] The second process includes a cleaning process of the underside of the substrate by a lower surface brush. The lower surface brush is held at a lower surface brush standby position while the underside of the substrate is not being cleaned. Therefore, when starting the second process, it is necessary to move the lower surface brush from the lower surface brush standby position to the lower surface brush processing position. According to the above substrate processing apparatus, at least a part of the period of the substrate lowering operation and the period of the lower surface brush preparation operation overlap. The period during which these periods overlap is called an overlap period.

[0178] This reduces the time required to process one substrate by the overlap period compared to when the lower surface brush preparation operation is started after the substrate is lowered to the second height position by the substrate lowering operation, thereby improving the throughput of substrate processing.

[0179] (Item 3) The substrate processing apparatus according to item 3 comprises: a first substrate holding part configured to be able to hold a substrate at a first height position; a second substrate holding portion configured to be able to hold a substrate at a second height position that is lower than the first height position; a processing section configured to perform a first processing on a substrate held by the first substrate holding section and to perform a second processing on a substrate held by the second substrate holding section; a substrate moving unit that performs a substrate lowering operation to lower the substrate from the first height position to the second height position in order to transfer the substrate from the first substrate holding unit to the second substrate holding unit; A control unit. The processing unit includes: a fluid nozzle that ejects a fluid including a processing liquid onto an upper surface of the substrate; a nozzle moving unit configured to be able to move the fluid nozzle between a nozzle processing position above the substrate held by the second substrate holding unit and a nozzle standby position spaced laterally from the substrate held by the second substrate holding unit, the second process includes a cleaning process of the top surface of the substrate by the fluid nozzle; The control unit controls the substrate moving unit and the nozzle moving unit to perform the substrate lowering operation by the substrate moving unit and the nozzle preparation operation that moves the fluid nozzle from the nozzle standby position to the nozzle processing position so that at least a portion of the period of the substrate lowering operation and the period of the nozzle preparation operation overlap.

[0180] In the substrate processing apparatus, the substrate is held by a first substrate holder at a first height position, and a first process is performed. Next, the substrate is transferred from the first substrate holder to a second substrate holder. At this time, the substrate is lowered from the first height position to a second height position by a substrate lowering operation. The substrate is held by the second substrate holder at the second height position, and a second process is performed.

[0181] The second process includes a cleaning process of the upper surface of the substrate by the fluid nozzle. The fluid nozzle is held at the nozzle standby position while the upper surface of the substrate is not being cleaned. Therefore, when starting the second process, it is necessary to move the fluid nozzle from the nozzle standby position to the nozzle processing position. According to the above substrate processing apparatus, the period of the substrate lowering operation and the period of the nozzle preparation operation at least partially overlap. The period during which these periods overlap is called an overlap period.

[0182] This reduces the time required to process one substrate by the overlap period compared to when the nozzle preparation operation is started after the substrate is lowered to the second height position by the substrate lowering operation, thereby improving the throughput of substrate processing.

[0183] (4) The substrate processing apparatus according to the 4th paragraph is a first substrate holding part configured to be able to hold a substrate at a first height position; a second substrate holding portion configured to be able to hold a substrate at a second height position that is lower than the first height position; a processing section configured to perform a first processing on a substrate held by the first substrate holding section and to perform a second processing on a substrate held by the second substrate holding section; a substrate moving unit that performs a substrate lowering operation to lower the substrate from the first height position to the second height position in order to transfer the substrate from the first substrate holding unit to the second substrate holding unit; A control unit. The processing unit includes: an edge brush that cleans the outer peripheral edge of the substrate by contacting the outer peripheral edge; an end brush moving unit configured to be able to move the end brush between an end brush processing position in which the end brush contacts an outer peripheral end of the substrate held by the second substrate holding unit and an end brush standby position spaced laterally from the substrate held by the second substrate holding unit; the second process includes a cleaning process of the outer peripheral edge of the substrate by the edge brush; The control unit controls the substrate moving unit and the end brush moving unit to perform the substrate lowering operation by the substrate moving unit and the end brush preparation operation that moves the end brush from the end brush waiting position to the end brush processing position so that at least a portion of the period of the substrate lowering operation and the period of the end brush preparation operation overlap.

[0184] In the substrate processing apparatus, the substrate is held by a first substrate holder at a first height position, and a first process is performed. Next, the substrate is transferred from the first substrate holder to a second substrate holder. At this time, the substrate is lowered from the first height position to a second height position by a substrate lowering operation. The substrate is held by the second substrate holder at the second height position, and a second process is performed.

[0185] The second process includes a cleaning process of the outer peripheral edge of the substrate by the edge brush. The edge brush is held at the edge brush standby position while the outer peripheral edge of the substrate is not being cleaned. Therefore, when starting the second process, it is necessary to move the edge brush from the edge brush standby position to the edge brush processing position. According to the above substrate processing apparatus, at least a part of the period of the substrate lowering operation and the period of the edge brush preparation operation overlap. The period during which these periods overlap is called an overlap period.

[0186] This reduces the time required to process one substrate by the overlap period compared to when the end brush preparation operation is started after the substrate is lowered to the second height position by the substrate lowering operation, thereby improving the throughput of substrate processing.

[0187] (5) In the substrate processing apparatus according to (1), The processing unit includes: a bottom brush that cleans the bottom surface of the substrate by contacting the bottom surface; a lower surface brush moving unit configured to be able to move the lower surface brush between a lower surface brush processing position in which the lower surface brush contacts the lower surface of the substrate held by the second substrate holding unit and a lower surface brush standby position spaced apart from the lower surface brush processing position; a fluid nozzle that ejects a fluid including a processing liquid onto an upper surface of the substrate; a nozzle moving unit configured to be able to move the fluid nozzle between a nozzle processing position above the substrate held by the second substrate holding unit and a nozzle standby position spaced apart from the substrate held by the second substrate holding unit; an edge brush that cleans the outer peripheral edge of the substrate by contacting the outer peripheral edge; an end brush moving unit configured to be able to move the end brush between an end brush processing position in which the end brush contacts an outer peripheral end of the substrate held by the second substrate holding unit and an end brush standby position spaced apart from the substrate held by the second substrate holding unit; the second process includes, as a process using the processing liquid, a cleaning process of the lower surface of the substrate by the lower surface brush, a cleaning process of the upper surface of the substrate by the fluid nozzle, and a cleaning process of the outer peripheral edge of the substrate by the edge brush; The control unit may control the lower surface brush moving unit, the nozzle moving unit and the end brush moving unit in addition to the substrate moving unit and the cup driving unit, to perform the substrate lowering operation, the cup lifting operation, a lower surface brush preparation operation for moving the lower surface brush from the lower surface brush waiting position to the lower surface brush processing position, a nozzle preparation operation for moving the fluid nozzle from the nozzle waiting position to the nozzle processing position, and an end brush preparation operation for moving the end brush from the end brush waiting position to the end brush processing position, so that at least a portion of the duration of the substrate lowering operation, at least a portion of the duration of the cup lifting operation, at least a portion of the duration of the lower surface brush preparation operation, at least a portion of the duration of the nozzle preparation operation, and at least a portion of the duration of the end brush preparation operation overlap with each other.

[0188] In this case, the second process includes a cleaning process of the lower surface of the substrate with a lower surface brush, a cleaning process of the upper surface of the substrate with a fluid nozzle, and a cleaning process of the outer peripheral edge of the substrate with an edge brush.

[0189] The lower surface brush is held at the lower surface brush standby position while the underside of the substrate is not being cleaned, and therefore, when starting the second process, the lower surface brush needs to be moved from the lower surface brush standby position to the lower surface brush processing position.

[0190] The fluid nozzle is held at the nozzle standby position while the top surface of the substrate is not being cleaned, and therefore, when starting the second process, the fluid nozzle needs to be moved from the nozzle standby position to the nozzle process position.

[0191] The edge brush is held at the edge brush standby position while the outer peripheral edge of the substrate is not being cleaned, and therefore, when the second process is to be started, the edge brush needs to be moved from the edge brush standby position to the edge brush processing position.

[0192] According to the above-mentioned substrate processing apparatus, at least three or more of the following periods overlap with each other: at least a portion of the period of the substrate lowering operation, at least a portion of the period of the cup lifting operation, at least a portion of the period of the lower surface brush preparation operation, at least a portion of the period of the nozzle preparation operation, and at least a portion of the period of the end brush preparation operation. A period in which these three or more periods overlap is called an overlapping period.

[0193] This reduces the time required to process one substrate by the overlapping periods compared to when the substrate lowering operation, cup lifting operation, lower surface brush preparation operation, nozzle preparation operation, and end brush preparation operation are performed such that three or more of these periods do not overlap with each other, thereby improving the throughput of substrate processing.

[0194] (Item 6) The substrate processing method according to item 6 includes: performing a first process on a substrate held by a first substrate holder at a first height position; performing a second process using a process liquid on a substrate held by a second substrate holder at a second height position that is lower than the first height position; performing a substrate lowering operation for lowering the substrate from the first height position to the second height position in order to transfer the substrate from the first substrate holding unit to the second substrate holding unit after the first processing and before the second processing; a processing cup that is formed to surround the second substrate holding part in a plan view and is provided so as to be liftable and movably disposed at an upper cup position that corresponds to the second height position, thereby receiving a processing liquid used in the second process; raising and lowering the processing cup between the upper cup position and a lower cup position below the upper cup position; After the first process and before the second process, a step of performing the substrate lowering operation and a step of raising and lowering the processing cup are initiated so that at least a portion of a period of the substrate lowering operation and a period of a cup raising operation that raises the processing cup from the lower cup position to the upper cup position overlap.

[0195] In the substrate processing method, the substrate is held by a first substrate holding part at a first height position, and a first process is performed. The substrate is then transferred from the first substrate holding part to a second substrate holding part. At this time, the substrate is lowered from the first height position to a second height position by a substrate lowering operation. The substrate is held by the second substrate holding part at the second height position, and a second process is performed.

[0196] In the second process, a processing liquid is used. Therefore, the processing cup is placed at the upper cup position. The processing liquid used in the second process is received by the processing cup at the upper cup position. When the processing cup is not receiving the processing liquid, it retreats to the lower cup position to prevent interference with other members. Therefore, when starting the second process, it is necessary to raise the processing cup from the lower cup position to the upper cup position. According to the above substrate processing method, at least a part of the period of the substrate lowering operation and the period of the cup raising operation overlap. The period during which these periods overlap is called an overlap period.

[0197] This reduces the time required to process one substrate by the overlap period compared to when the substrate is lowered to the second height position by the substrate lowering operation and then the cup lifting operation is started. Also, compared to when the substrate lowering operation is started after the cup lifting operation, the time required to process one substrate is reduced by the overlap period. Therefore, the throughput of substrate processing is improved.

[0198] (Item 7) The substrate processing method according to item 7 includes: performing a first process on a substrate held by a first substrate holder at a first height position; performing a second process including contacting a lower surface brush with a lower surface of a substrate held by a second substrate holder at a second height position lower than the first height position to clean the lower surface of the substrate; performing a substrate lowering operation for lowering the substrate from the first height position to the second height position in order to transfer the substrate from the first substrate holding unit to the second substrate holding unit after the first processing and before the second processing; a step of moving the lower surface brush between a lower surface brush processing position in which the lower surface brush contacts the lower surface of the substrate held by the second substrate holding portion and a lower surface brush standby position spaced from the lower surface brush processing position; After the first processing and before the second processing, the step of performing the substrate lowering operation and the step of moving the lower surface brush are initiated so that at least a portion of the period of the substrate lowering operation and the period of the lower surface brush preparation operation for moving the lower surface brush from the lower surface brush waiting position to the lower surface brush processing position overlap.

[0199] In the substrate processing method, the substrate is held by a first substrate holding part at a first height position, and a first process is performed. The substrate is then transferred from the first substrate holding part to a second substrate holding part. At this time, the substrate is lowered from the first height position to a second height position by a substrate lowering operation. The substrate is held by the second substrate holding part at the second height position, and a second process is performed.

[0200] The second process includes a cleaning process of the underside of the substrate using a lower surface brush. The lower surface brush is held at a lower surface brush standby position while the underside of the substrate is not being cleaned. Therefore, when starting the second process, it is necessary to move the lower surface brush from the lower surface brush standby position to the lower surface brush processing position. According to the above substrate processing method, at least a part of the period of the substrate lowering operation and the period of the lower surface brush preparation operation overlap. The period during which these periods overlap is called an overlap period.

[0201] This reduces the time required to process one substrate by the overlap period compared to when the lower surface brush preparation operation is started after the substrate is lowered to the second height position by the substrate lowering operation, thereby improving the throughput of substrate processing.

[0202] (Item 8) The substrate processing method according to item 8 includes: performing a first process on a substrate held by a first substrate holder at a first height position; performing a second processing step including discharging a fluid including a processing liquid from a fluid nozzle onto an upper surface of a substrate held by a second substrate holding unit at a second height position lower than the first height position, thereby cleaning the upper surface of the substrate; performing a substrate lowering operation for lowering the substrate from the first height position to the second height position in order to transfer the substrate from the first substrate holding unit to the second substrate holding unit after the first processing and before the second processing; moving the fluid nozzle between a nozzle processing position above a substrate held by the second substrate holder and a nozzle standby position spaced laterally from the substrate held by the second substrate holder; After the first process and before the second process, the step of performing the substrate lowering operation and the step of moving the fluid nozzle are initiated so that at least a portion of the period of the substrate lowering operation and a period of a nozzle preparation operation that moves the fluid nozzle from the nozzle standby position to the nozzle processing position overlap.

[0203] In the substrate processing method, the substrate is held by a first substrate holding part at a first height position, and a first process is performed. The substrate is then transferred from the first substrate holding part to a second substrate holding part. At this time, the substrate is lowered from the first height position to a second height position by a substrate lowering operation. The substrate is held by the second substrate holding part at the second height position, and a second process is performed.

[0204] The second process includes a cleaning process of the upper surface of the substrate by the fluid nozzle. The fluid nozzle is held at the nozzle standby position while the upper surface of the substrate is not being cleaned. Therefore, when starting the second process, it is necessary to move the fluid nozzle from the nozzle standby position to the nozzle processing position. According to the above substrate processing method, at least a part of the period of the substrate lowering operation and the period of the nozzle preparation operation overlap. The period during which these periods overlap is called an overlap period.

[0205] This reduces the time required to process one substrate by the overlap period compared to when the nozzle preparation operation is started after the substrate is lowered to the second height position by the substrate lowering operation, thereby improving the throughput of substrate processing.

[0206] (Item 9) The substrate processing method according to item 9 includes: performing a first process on a substrate held by a first substrate holder at a first height position; performing a second process including contacting an edge brush with an outer circumferential edge of the substrate held by a second substrate holder at a second height position lower than the first height position to clean the outer circumferential edge of the substrate; performing a substrate lowering operation for lowering the substrate from the first height position to the second height position in order to transfer the substrate from the first substrate holding unit to the second substrate holding unit after the first processing and before the second processing; moving the edge brush between an edge brush processing position in contact with the outer peripheral edge of the substrate held by the second substrate holding portion and an edge brush waiting position spaced laterally from the substrate held by the second substrate holding portion; After the first processing and before the second processing, a step of performing the substrate lowering operation and a step of moving the end brush are initiated so that at least a portion of the period of the substrate lowering operation and a period of the end brush preparation operation for moving the end brush from the end brush waiting position to the end brush processing position overlap.

[0207] In the substrate processing method, the substrate is held by a first substrate holding part at a first height position, and a first process is performed. The substrate is then transferred from the first substrate holding part to a second substrate holding part. At this time, the substrate is lowered from the first height position to a second height position by a substrate lowering operation. The substrate is held by the second substrate holding part at the second height position, and a second process is performed.

[0208] The second process includes a cleaning process of the outer peripheral edge of the substrate by the edge brush. The edge brush is held at the edge brush standby position while the outer peripheral edge of the substrate is not being cleaned. Therefore, when starting the second process, it is necessary to move the edge brush from the edge brush standby position to the edge brush processing position. According to the above substrate processing method, the period of the substrate lowering operation and the period of the edge brush preparation operation at least partially overlap. The period in which these periods overlap is called an overlap period.

[0209] This reduces the time required to process one substrate by the overlap period compared to when the end brush preparation operation is started after the substrate is lowered to the second height position by the substrate lowering operation, thereby improving the throughput of substrate processing.

[0210] (Item 10) In the substrate processing method according to item 6, The second treatment using a treatment liquid includes: cleaning the underside of the substrate by bringing a underside brush into contact with the underside of the substrate held by the second substrate holding unit at the second height position that is lower than the first height position; discharging a fluid including a processing liquid from a fluid nozzle onto an upper surface of a substrate held by the second substrate holding unit at the second height position that is lower than the first height position, thereby cleaning the upper surface of the substrate; and cleaning the outer circumferential edge of the substrate by bringing the edge brush into contact with the outer circumferential edge of the substrate held by the second substrate holder at the second height position that is lower than the first height position, The substrate processing method includes: moving the lower surface brush between a lower surface brush processing position in which the lower surface brush contacts the lower surface of the substrate held by the second substrate holding portion and a lower surface brush standby position spaced from the lower surface brush processing position; moving the fluid nozzle between a nozzle processing position above a substrate held by the second substrate holder and a nozzle standby position spaced laterally from the substrate held by the second substrate holder; and moving the edge brush between an edge brush processing position in contact with the outer peripheral edge of the substrate held by the second substrate holder and an edge brush waiting position spaced laterally from the substrate held by the second substrate holder, After the first processing and before the second processing, the steps of performing the substrate lowering operation, receiving the processing liquid, moving the lower brush, moving the fluid nozzle, and moving the end brush may be started so that three or more of the following periods overlap with each other: at least a portion of the period of the substrate lowering operation, at least a portion of the period of the cup raising operation, at least a portion of the period of the lower brush preparation operation in which the lower brush is moved from the lower brush waiting position to the lower brush processing position, at least a portion of the period of the nozzle preparation operation in which the fluid nozzle is moved from the nozzle waiting position to the nozzle processing position, and at least a portion of the period of the end brush preparation operation in which the end brush is moved from the end brush waiting position to the end brush processing position.

[0211] In this case, the second process includes a cleaning process of the lower surface of the substrate with a lower surface brush, a cleaning process of the upper surface of the substrate with a fluid nozzle, and a cleaning process of the outer peripheral edge of the substrate with an edge brush.

[0212] The lower surface brush is held at the lower surface brush standby position while the underside of the substrate is not being cleaned, and therefore, when starting the second process, the lower surface brush needs to be moved from the lower surface brush standby position to the lower surface brush processing position.

[0213] The fluid nozzle is held at the nozzle standby position while the top surface of the substrate is not being cleaned, and therefore, when starting the second process, the fluid nozzle needs to be moved from the nozzle standby position to the nozzle process position.

[0214] The edge brush is held at the edge brush standby position while the outer peripheral edge of the substrate is not being cleaned, and therefore, when the second process is to be started, the edge brush needs to be moved from the edge brush standby position to the edge brush processing position.

[0215] According to the above-mentioned substrate processing method, at least three or more of the following periods overlap with each other: at least a portion of the period of the substrate lowering operation, at least a portion of the period of the cup lifting operation, at least a portion of the period of the lower surface brush preparatory operation, at least a portion of the period of the nozzle preparatory operation, and at least a portion of the period of the end brush preparatory operation. A period in which these three or more periods overlap is called an overlapping period.

[0216] This reduces the time required to process one substrate by the overlapping periods compared to when the substrate lowering operation, cup lifting operation, lower surface brush preparation operation, nozzle preparation operation, and end brush preparation operation are performed such that three or more of these periods do not overlap with each other, thereby improving the throughput of substrate processing.

[0217] According to the substrate processing apparatus and the substrate processing method of the above embodiment, the throughput of the substrate processing is improved, and the substrate processing efficiency is improved, so that the energy consumption of the substrate processing is reduced. In addition, when a chemical solution is used in the substrate processing, the yield is improved, and the wasteful use of the chemical solution is reduced, so that the pollution of the global environment is reduced. [Explanation of symbols]

[0218] 1...substrate cleaning apparatus, 2...unit housing, 2a...bottom surface portion, 2b, 2c, 2d, 2e...side wall portion, 2x...loading / unloading port, 9A...chuck control portion, 9B...suction control portion, 9C...pedestal control portion, 9D...delivery control portion, 9E...lower surface cleaning control portion, 9F...cup control portion, 9G...upper surface cleaning control portion, 9H...bevel cleaning control portion, 9I...loading / unloading control portion, 9J...rinsing control portion, 10A, 10B...upper holding device, 11A, 11B...lower chuck, 12A, 12B...upper chuck , 13A, 13B...lower chuck drive unit, 14A, 14B...upper chuck drive unit, 19...photoelectric sensor, 19a...light projecting unit, 19b...light receiving unit, 20...lower holding device, 21...suction holding unit, 22...suction holding drive unit, 30...pedestal device, 31...linear guide, 32...movable base, 33...pedestal drive unit, 40...transfer device, 41...support pin, 42...pin connecting member, 43...pin lift drive unit, 50...lower surface cleaning device, 51...lower surface brush, 52...substrate nozzle, 52a, 5 2b...brush nozzle, 53...gas ejection section, 54...lifting support section, 54u...upper surface, 55a...lower surface brush rotation drive section, 55b...lower surface brush lifting drive section, 56...lower surface cleaning liquid supply section, 57...brush cleaning liquid supply section, 58...ejected gas supply section, 60...cup device, 61...cup, 62...cup drive section, 70...upper surface cleaning device, 71, 81, 211...rotating support shaft, 72, 82, 212...arm, 73...spray nozzle, 74...upper surface cleaning drive section, 75...upper surface cleaning Cleaned fluid supply unit, 80...edge cleaning device, 83...bevel brush, 84...bevel brush drive unit, 90...opening / closing device, 91...shutter, 92...shutter drive unit, 170...control device, 200...support piece, 201...inclined support surface, 202...movement limiting surface, 210...upper surface rinsing device, 213...rinsing nozzle, 214...rinsing drive unit, 215...rinsing liquid supply unit, 300...holding piece, 301...contact surface, 302...projection portion, Ma...hand, W...substrate, rp...planar reference position

Claims

1. a first substrate holding part configured to be able to hold a substrate at a first height position; a second substrate holding portion configured to be able to hold a substrate at a second height position that is lower than the first height position; a processing section configured to perform a first processing on a substrate held by the first substrate holding section and to perform a second processing on a substrate held by the second substrate holding section; a substrate moving unit that performs a substrate lowering operation to lower the substrate from the first height position to the second height position in order to transfer the substrate from the first substrate holding unit to the second substrate holding unit; A control unit. The processing unit includes: a bottom brush that cleans the bottom surface of the substrate by contacting the bottom surface; a lower surface brush moving unit configured to be able to move the lower surface brush between a lower surface brush processing position in which the lower surface brush contacts the lower surface of the substrate held by the second substrate holding unit and a lower surface brush standby position spaced apart from the lower surface brush processing position, the second process includes a cleaning process of the lower surface of the substrate with the lower surface brush; The control unit controls the substrate moving unit and the lower surface brush moving unit to perform the substrate lowering operation by the substrate moving unit and the lower surface brush preparation operation that moves the lower surface brush from the lower surface brush waiting position to the lower surface brush processing position so that at least a portion of the period of the substrate lowering operation and the period of the lower surface brush preparation operation overlap.

2. a first substrate holding part configured to be able to hold a substrate at a first height position; a second substrate holding portion configured to be able to hold a substrate at a second height position that is lower than the first height position; a processing section configured to perform a first processing on a substrate held by the first substrate holding section and to perform a second processing on a substrate held by the second substrate holding section; a substrate moving unit that performs a substrate lowering operation to lower the substrate from the first height position to the second height position in order to transfer the substrate from the first substrate holding unit to the second substrate holding unit; A control unit. The processing unit includes: a fluid nozzle that ejects a fluid including a processing liquid onto an upper surface of the substrate; a nozzle moving unit configured to be able to move the fluid nozzle between a nozzle processing position above the substrate held by the second substrate holding unit and a nozzle standby position spaced laterally from the substrate held by the second substrate holding unit, the second process includes a cleaning process of the top surface of the substrate by the fluid nozzle; The control unit controls the substrate moving unit and the nozzle moving unit to perform the substrate lowering operation by the substrate moving unit and the nozzle preparation operation that moves the fluid nozzle from the nozzle standby position to the nozzle processing position so that at least a portion of the period of the substrate lowering operation and the period of the nozzle preparation operation overlap.

3. a first substrate holding part configured to be able to hold a substrate at a first height position; a second substrate holding portion configured to be able to hold a substrate at a second height position that is lower than the first height position; a processing section configured to perform a first processing on a substrate held by the first substrate holding section and to perform a second processing on a substrate held by the second substrate holding section; a substrate moving unit that performs a substrate lowering operation to lower the substrate from the first height position to the second height position in order to transfer the substrate from the first substrate holding unit to the second substrate holding unit; A control unit. The processing unit includes: an edge brush that cleans the outer peripheral edge of the substrate by contacting the outer peripheral edge; an end brush moving unit configured to be able to move the end brush between an end brush processing position in which the end brush contacts an outer peripheral end of the substrate held by the second substrate holding unit and an end brush standby position spaced laterally from the substrate held by the second substrate holding unit, the second process includes a cleaning process of the outer peripheral edge of the substrate by the edge brush; The control unit controls the substrate moving unit and the end brush moving unit to perform the substrate lowering operation by the substrate moving unit and the end brush preparation operation to move the end brush from the end brush waiting position to the end brush processing position so that at least a portion of the period of the substrate lowering operation and the period of the end brush preparation operation overlap.

4. performing a first process on a substrate held by a first substrate holder at a first height position; performing a second process including contacting a lower surface brush with a lower surface of a substrate held by a second substrate holder at a second height position lower than the first height position to clean the lower surface of the substrate; performing a substrate lowering operation for lowering the substrate from the first height position to the second height position in order to transfer the substrate from the first substrate holding unit to the second substrate holding unit after the first processing and before the second processing; a step of moving the lower surface brush between a lower surface brush processing position in which the lower surface brush contacts the lower surface of the substrate held by the second substrate holding portion and a lower surface brush standby position spaced from the lower surface brush processing position; A substrate processing method in which, after the first processing and before the second processing, a step of performing the substrate lowering operation and a step of moving the lower surface brush are initiated so that at least a portion of the period of the substrate lowering operation and a period of a lower surface brush preparation operation for moving the lower surface brush from the lower surface brush waiting position to the lower surface brush processing position overlap.

5. performing a first process on a substrate held by a first substrate holder at a first height position; performing a second processing step including discharging a fluid including a processing liquid from a fluid nozzle onto an upper surface of a substrate held by a second substrate holding unit at a second height position lower than the first height position, thereby cleaning the upper surface of the substrate; performing a substrate lowering operation for lowering the substrate from the first height position to the second height position in order to transfer the substrate from the first substrate holding unit to the second substrate holding unit after the first processing and before the second processing; moving the fluid nozzle between a nozzle processing position above a substrate held by the second substrate holder and a nozzle standby position spaced laterally from the substrate held by the second substrate holder; a step of performing a substrate lowering operation and a step of moving the fluid nozzle are initiated after the first processing and before the second processing so that at least a portion of a period of the substrate lowering operation and a period of a nozzle preparation operation that moves the fluid nozzle from the nozzle standby position to the nozzle processing position overlap.

6. performing a first process on a substrate held by a first substrate holder at a first height position; performing a second process including contacting an edge brush with an outer peripheral edge of the substrate held by a second substrate holder at a second height position lower than the first height position to clean the outer peripheral edge of the substrate; performing a substrate lowering operation for lowering the substrate from the first height position to the second height position in order to transfer the substrate from the first substrate holding unit to the second substrate holding unit after the first processing and before the second processing; moving the edge brush between an edge brush processing position in contact with the outer peripheral edge of the substrate held by the second substrate holding portion and an edge brush waiting position spaced laterally from the substrate held by the second substrate holding portion; A substrate processing method in which, after the first processing and before the second processing, a step of performing a substrate lowering operation and a step of moving the end brush are initiated so that at least a portion of the period of the substrate lowering operation and a period of an end brush preparation operation for moving the end brush from the end brush waiting position to the end brush processing position overlap.

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