Management device, management method, and program

Abstract

To provide a technique advantageous for effectively planning an adjustment order regarding a plurality of adjustment items corresponding to various adjustment conditions and corresponding to an adjustment error.SOLUTION: A management device that manages execution of adjustment regarding a plurality of adjustment items of industrial equipment has: an acquisition part which acquires a process chart in which the plurality of adjustment items are listed according to an execution order; and a processing part which updates the process chart on the basis of correlation information in which implementation permission conditions based on a relationship with other adjustment items regarding each adjustment item are defined corresponding to an occurrence of an adjustment error while executing adjustment according to the process chart.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a management device, a management method, and a program. [Background technology]

[0002] After assembling each unit constituting a lithography apparatus such as an exposure apparatus, an adjustment process is carried out in which errors are measured and offset adjustments are performed. Such errors may include unit installation errors, processing errors of optical components, part errors (manufacturing variations) of light intensity sensors, linearity errors of drive mechanisms, etc. In the adjustment process, error measurements and offset adjustments are repeated so that the evaluation value of a performance specification (hereinafter referred to as the "performance evaluation value") falls within an allowable range.

[0003] It has been proposed to shorten the lead time of the adjustment process by replacing the adjustment process that was conventionally performed by an operator with automatic adjustment using a combination of self-measurement functions. Patent Document 1 discloses a method that combines the execution of a maintenance item selected by an operator with the execution of a self-measurement function for an automatic adjustment item. Patent Document 2 discloses a scheduling method that has a maintenance schedule creation function and makes it possible to move the date and time of maintenance execution in order to periodically perform maintenance items (automatic adjustment items). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 10-4047 [Patent Document 2] JP 2003-338446 A Summary of the Invention [Problem to be solved by the invention]

[0005] In recent years, with the increasing precision of exposure equipment and the diversification of customer performance specifications, the advance preparations (process setup work) performed by operators have become more complex. In addition, the frequency of exposure equipment stopping due to adjustment errors caused by performance evaluation values ​​not converging within the allowable range is increasing.

[0006] The current issue is how to effectively plan an adjustment sequence for automatic adjustment that reduces the number of advance preparations (process setup work) by diversifying operators for each exposure tool. Also, even if an adjustment error occurs in the exposure tool, the current issue is how to effectively plan an adjustment sequence for automatic adjustment according to the adjustment error state of the exposure tool.

[0007] The present invention provides an advantageous technique for effectively planning an adjustment sequence for a plurality of adjustment items, while dealing with a variety of adjustment conditions and adjustment errors. [Means for solving the problem]

[0008] According to one aspect of the present invention, there is provided a management device that manages the implementation of adjustments for multiple adjustment items of industrial equipment, the management device comprising: an acquisition unit that acquires a schedule in which the multiple adjustment items are listed in order of implementation; and a processing unit that updates the schedule based on correlation information that specifies implementation permission conditions for each adjustment item based on its relationship with other adjustment items in response to an adjustment error occurring while adjustment is being implemented in accordance with the schedule. Effect of the Invention

[0009] According to the present invention, it is possible to provide a technique that is advantageous for effectively planning the adjustment order for a plurality of adjustment items in response to a variety of adjustment conditions and adjustment errors. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a diagram showing the configuration of an exposure apparatus. [Figure 2A] FIG. 13 is a diagram illustrating a process chart showing an adjustment order and adjustment conditions. [Figure 2B]FIG. 13 is a diagram illustrating a schedule updated according to a first adjustment order. [Figure 2C] FIG. 13 is a diagram illustrating a process chart in which information on whether execution is possible after an adjustment error occurs is described. [Figure 2D] FIG. 13 is a diagram illustrating a schedule updated according to a first adjustment order. [Figure 3A] FIG. 13 is a diagram illustrating a Gantt chart showing an adjustment order. [Figure 3B] FIG. 13 is a diagram illustrating an example of an updated Gantt chart. [Figure 3C] FIG. 13 is a diagram illustrating an example of an updated Gantt chart. [Figure 4A] FIG. 13 is a diagram illustrating an adjustment order; [Figure 4B] FIG. 13 illustrates an example diagram updated according to a first adjustment order. [Figure 4C] FIG. 13 is a diagram illustrating an example of a diagram when an adjustment error occurs. [Figure 4D] FIG. 13 illustrates an example diagram updated according to a second adjustment order. [Figure 4E] FIG. 13 illustrates a diagram according to an updated second adjustment order. [Diagram 5] FIG. 4 is a diagram illustrating process correlation information. [Figure 6] 4 is a flowchart of a management method according to the first embodiment. [Figure 7] 13 is a flowchart of a management method according to a second embodiment. [Figure 8A] FIG. 13 is a diagram illustrating a process correlation learning table. [Figure 8B] FIG. 13 is a diagram illustrating a process correlation learning table after the success rate is reflected. [Figure 9] FIG. 1 is a diagram showing a configuration of an information processing system. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0012] First Embodiment The present disclosure relates to a management device or a management method for managing the implementation of adjustments for a plurality of adjustment items of industrial equipment. The industrial equipment is generally equipment used in various fields of industry, and examples thereof include industrial robots, semiconductor manufacturing equipment, inspection equipment, medical equipment, and the like. Here, a technology for managing the implementation of adjustments for a plurality of adjustment items of, for example, a lithography device used in a semiconductor manufacturing process as an example of industrial equipment will be described. The lithography device is an apparatus that transfers a pattern of an original onto a substrate, and can be embodied as, for example, an exposure device, a drawing device, or an imprint device. The exposure device forms a (latent image) pattern on a substrate (resist thereon) using, for example, (extreme) ultraviolet light. The drawing device forms a (latent image) pattern on a substrate (resist thereon) using, for example, a charged particle beam (electron beam, etc.). The imprint device forms a pattern on a substrate by molding an imprint material on the substrate. In the following, an exposure device will be described in order to show a specific example.

[0013] 1 shows a schematic diagram of an exposure apparatus 1 including an information processing apparatus 10 according to the first embodiment. Note that the drawings shown below may be drawn at a scale different from the actual scale in order to facilitate understanding of this embodiment. In addition, in the following description, the actual adjustment conditions and the number of steps in the adjustment process may be simplified in order to facilitate understanding of this embodiment.

[0014] In the following description, the units that may be subject to adjustment may include at least one of an illumination system unit (illumination optical system), a projection system unit (projection optical system), an alignment unit (hereinafter referred to as the "OAS unit"), a focus unit, an original stage unit, and a substrate stage unit.

[0015] In Fig. 1, the direction perpendicular to the substrate mounting surface of the substrate stage unit 116 (optical axis direction) is defined as the Z direction. The substrate mounting surface is a surface parallel to the XY plane. The substrate stage moves along the substrate mounting surface (XY plane). Below, the direction in which the substrate mounted on the substrate mounting surface (XY plane) of the substrate stage unit 116 is scanned is called the scanning direction (Y direction), and the direction perpendicular to the scanning direction in a plane parallel to the substrate mounting surface is called the non-scanning direction (X direction).

[0016] The exposure apparatus 1 is a lithography apparatus that transfers a pattern of an original onto a substrate carried in from a stocker apparatus (not shown). The exposure apparatus 1 exposes a substrate to light, for example, by a step-and-scan method, so as to transfer a pattern formed on an original (reticle, mask) onto the substrate. The information processing apparatus 10 functions as a management apparatus (process scheduler 30) that manages adjustments of a plurality of adjustment items for a plurality of units of the exposure apparatus 1. The information processing apparatus 10 can be realized by, for example, a general-purpose or dedicated computer apparatus including a CPU (processing unit) and memories such as RAM and ROM. A storage device 20 is connected to the information processing apparatus 10. The storage device 20 records various data related to adjustment processes used by the process scheduler 30. For example, a control program for realizing the process scheduler 30 is stored in the storage device 20, and is loaded into the RAM and executed by the CPU after the information processing apparatus 10 is powered on.

[0017] An output device 40 is connected to the information processing device 10. The output device 40 includes a display unit, and an input device such as a touch panel may be configured on the display unit. An operator can input adjustment information via the touch panel. The process scheduler 30 can create setup work navigation information based on the input adjustment information and display it on the output device 40.

[0018] A main controller 151 is connected to the information processing device 10 via an interface cable. The main controller 151 controls each unit of the exposure apparatus 1 in response to an adjustment command transmitted from the information processing device 10. Note that the information processing device 10 and the main controller 151 may be configured as separate entities as shown in FIG. 1, or may be configured as a single device that performs the functions of both.

[0019] The multiple units that make up the exposure apparatus 1 can include, for example: (a) Illumination system unit 102 and illumination system control device 153; (b) the projection system unit 114 and the projection system control device 155; (c) the original stage unit 123 and the original stage control device 154; (d) the substrate stage unit 116 and the substrate stage control device 156; (e) focus unit 130 and focus control device 157; (f) OAS unit 133 and OAS control device 158.

[0020] In this embodiment, the adjustment process can be performed on a unit basis. The main controller 151 is connected to the illumination system controller 153, the projection system controller 155, the original stage controller 154, the substrate stage controller 156, the focus controller 157, and the OAS controller 158 via respective interface cables. The main controller 151 can generate commands to control each of these controllers, and commands to control the exposure apparatus 1 as a whole.

[0021] The main operations of the exposure apparatus 1 will be described. The laser light source 101 is filled with a gas such as KrF, and emits a laser beam in the far ultraviolet region, for example, a wavelength of 248 nm. The gas exchange operation of the laser light source 101, the control for stabilizing the wavelength, the control of the discharge applied voltage, and the like are controlled by a light source control device 152.

[0022] The illumination system unit 102 guides the beam emitted from the laser light source 101 to the reticle 112 placed on the original stage unit 123. The beam emitted from the laser light source 101 is shaped into a predetermined shape (circular, annular, quadrupole, dipole, etc.) via a beam shaping optical system 103, and is incident on an integrator lens 104 to form a secondary light source. The light beam from the secondary light source is directed by a condenser lens 106 that has a function of changing the illuminance distribution on the reticle 112, thereby illuminating a variable slit 107. The variable slit 107 has a mechanism that can change the aperture width. By controlling the aperture width, the intensity distribution (illuminance distribution) of the slit-shaped light (exposure light) in the non-scanning direction is made uniform.

[0023] An aperture stop 105 having a substantially circular opening is provided between the integrator lens 104 and the condenser lens 106. The illumination system control device 153 controls the diameter of the opening of the aperture stop 105, thereby allowing the numerical aperture (NA) of the illumination system unit 102 to be set to a desired value. The ratio of the numerical aperture of the illumination system unit 102 to the numerical aperture of the projection system unit 114 is the coherence factor (σ value). The illumination system control device 153 controls the aperture stop 105 of the illumination system unit 102 to set the σ value.

[0024] One of the adjustment conditions is the illumination mode. Depending on the specified illumination mode, the illumination shape (circular, annular, quadrupole, etc.) and the numerical aperture (NA) of the illumination system can be controlled.

[0025] A half mirror 108 is disposed on the optical path of the illumination system unit 102, specifically between the condenser lens 106 and the variable slit 107. A part of the exposure light illuminating the reticle 112 is reflected by the half mirror 108 and extracted. A photosensor 109 is disposed on the optical path of the reflected light from the half mirror 108. The photosensor 109 generates an output corresponding to the intensity of the exposure light (exposure energy). The output of the photosensor 109 is converted to exposure energy per pulse by an integration circuit (not shown) that performs integration for each pulse emission of the laser light source 101. The value of the exposure energy is input to the main controller 151 via the illumination system controller 153.

[0026] A circuit pattern of a semiconductor element to be printed is formed on the reticle 112. The reticle 112 is illuminated by the illumination system unit 102. A variable blade 110 made of a light blocking member movable in two dimensions, i.e., in the XY plane perpendicular to the optical axis direction, is provided between the variable slit 107 and the original stage unit 123. The variable blade 110 arbitrarily sets the irradiation area of ​​the pattern surface of the reticle 112.

[0027] The projection system unit 114 guides the exposure light that has passed through the reticle 112 to a wafer 115 placed on a substrate stage unit 116. As a result, the pattern on the reticle 112 is image-projected onto one shot area on the wafer 115 that is coated with photoresist.

[0028] The exposure apparatus 1 can perform scanning exposure. In scanning exposure, a part of the pattern on the reticle 112 is reduced and exposed onto the wafer 115 at a reduction ratio β (for example, 1 / 4). At this time, the original stage unit 123 and the substrate stage unit 116 are scanned in opposite directions in the scanning direction with respect to the slit-shaped light at a speed ratio equal to the reduction ratio β. By repeating multi-pulse exposure using pulsed light emitted from the laser light source 101, the pattern formed on the entire surface of the reticle 112 can be transferred to a shot area on the wafer 115.

[0029] One of the adjustment conditions is the scanning speed. The scanning speed is generally the speed of the substrate stage. The speed of the substrate stage is set according to the specified scanning speed. This controls the speed of the original stage at the same speed ratio as the reduction ratio β.

[0030] Projection system unit 114 is provided with a field lens 125. The field lens 125 is held by a lens barrel 126, and can be moved in the optical axis direction by a drive mechanism 127 configured with air pressure, a piezoelectric element, or the like. By the projection system control device 155 controlling the position of the field lens 125 on the optical axis LA, it is possible to improve the projection reduction magnification β and reduce distortion errors while suppressing deterioration of various aberrations of the projection system unit 114.

[0031] The substrate stage unit 116 can move in the optical axis direction (Z direction) of the projection system unit 114, and in the X and Y directions that are orthogonal to each other in a plane perpendicular to the Z direction, while holding the wafer 115. The laser interferometer 118 can measure the position of the substrate stage unit 116 in the XY plane by measuring the distance to a movable mirror 117 fixed to the substrate stage unit 116. The substrate stage control device 156 moves the substrate stage unit 116 to a predetermined position in the XY plane by controlling a drive mechanism 119 such as a motor based on the position of the substrate stage unit 116 measured by the laser interferometer 118.

[0032] The focus unit 130 has a focus surface detection function. The focus unit 130 projects a plurality of light beams consisting of non-exposure light that does not expose the photoresist of the wafer 115 through the projection optical system 130a. These light beams are each collected and reflected on the wafer 115, and are then incident on the detection optical system 130b. Although not shown, the detection optical system 130b is provided with a plurality of light receiving elements for position detection corresponding to the respective reflected light beams. The light receiving surface of each light receiving element and the reflection point of each light beam on the wafer 115 are configured to be substantially conjugate with each other through the imaging optical system. The positional deviation of the wafer 115 surface in the optical axis direction of the projection system unit 114 is measured as the positional deviation of the incident light beam on the light receiving element for position detection in the detection optical system 130b.

[0033] The OAS unit 133 is an optical microscope used for aligning the wafer 115. An alignment illumination system (not shown) in the OAS unit 133 irradiates an alignment mark transferred onto the wafer 115, and a detection system 134 in the OAS unit 133 captures an image of the alignment mark to obtain image data, thereby performing alignment.

[0034] In the exposure apparatus 1, the reticle 112 and the wafer 115 are positioned so as to have a predetermined positional relationship with each other. Then, based on a synchronization signal from the main controller 151, the light source controller 152, the substrate stage controller 156, and the original stage controller 154 perform respective controls for scan exposure. As a result, the circuit pattern formed on the entire surface of the reticle 112 is transferred to the chip area of ​​the wafer 115.

[0035] Then, the wafer 115 is moved a predetermined amount in the XY plane by the substrate stage 116 based on the step-and-scan method, and the pattern formed on the reticle 112 is similarly projected and exposed onto other chip areas of the wafer 115 in a sequential manner.

[0036] Next, a description will be given of conventional adjustment steps and adjustment sequences in the performance adjustment and performance maintenance work of the exposure apparatus 1. Note that in order to facilitate understanding of this embodiment, the actual adjustment conditions and number of steps will be explained in a simplified manner.

[0037] FIG. 2A shows an example of a process chart showing the adjustment order and adjustment conditions of the exposure tool 1. In the process chart 200, a plurality of adjustment items of the exposure tool 1 are listed in the order of implementation. The adjustment order 201 indicates the order of adjustment based on the design information. The adjustments indicated in the adjustment items 204 corresponding to the units are executed, with the units indicated in the process names 203 as the basic units. The adjustment IDs 202 correspond to the adjustment names of the adjustment items 204. The hatched adjustment IDs correspond to advance preparations (process setup work) involving manual work by an operator, and are assigned the number 0. The other adjustment IDs correspond to automatic adjustments not involving manual work by an operator, and are assigned numbers starting from 1. The standard time 205 indicates the standard time required to execute the adjustment item.

[0038] A standard value 206, a wafer type 207, a number of wafers 208, and an adjustment condition 209 can be set according to the customer's required specifications. The standard value 206 indicates a judgment index of a performance evaluation value according to an adjustment item. For example, when an automatic adjustment is performed, it is judged whether or not a performance evaluation value indicating an adjustment result has converged to the range of the standard value 206.

[0039] The adjustment conditions 209 indicate the inspection conditions according to the customer's required specifications. One example of the adjustment conditions is the scanning speed. For example, the scanning speed of the stage unit device may be controlled and adjusted under three conditions: high speed (1000 mm / sec), medium speed (750 mm / sec), and low speed (500 mm / sec). Another example of the adjustment conditions is the illumination mode. For example, the illumination mode of the illumination system unit 102 may be controlled and adjusted under three conditions: large σ0.80 (circular), small σ0.60 (circular), and 1 / 2 annular illumination (annular).

[0040] The number of conditions 210 indicates the number of times that the adjustment item 204 is executed according to the adjustment condition 209. For example, when the above-mentioned scanning speed has five conditions, the corresponding adjustment item is executed five times, and when the lighting condition has three conditions, the corresponding adjustment item is executed three times.

[0041] The stage process 212 will be described. The stage process 212 includes adjustment of the original stage unit 123 and adjustment of the substrate stage unit 116 as adjustment items. Specifically, the stage process 212 includes three processes: a process setup indicated by adjustment ID=a0, an original stage adjustment indicated by adjustment ID=a1, and a substrate stage adjustment indicated by adjustment ID=a2. In the process setup (a0) indicated by adjustment ID=a0, adjustment is performed without using a wafer. In the original stage adjustment indicated by adjustment ID=a1 and the substrate stage adjustment indicated by adjustment ID=a2, adjustment is performed at three scanning speed conditions, respectively, so that the adjustment time 211 requires three times the standard time 205.

[0042] The focusing process 213 will be described. The focusing process 213 includes two processes, a process setup indicated by adjustment ID=b0 and a focus sensor adjustment indicated by adjustment ID=b1, as adjustment items of the focusing unit 130. In the process setup indicated by adjustment ID=b0, adjustment is performed using one tool wafer b. In the focus sensor adjustment indicated by adjustment ID=b1, adjustment is performed at three scanning speed conditions, so that the adjustment time 211 requires three times the standard time 205.

[0043] The OAS process 214 will be described. The OAS process 214 includes three adjustment items for the OAS unit 133: process setup indicated by adjustment ID=c0, light intensity adjustment indicated by adjustment ID=c1, and focus adjustment indicated by adjustment ID=c2. In the process setup indicated by adjustment ID=c0, adjustment is performed using one tool wafer c. In the light intensity adjustment indicated by adjustment ID=c1 and focus adjustment indicated by adjustment ID=c2, adjustment is performed in five OAS illumination modes, so that the adjustment time 211 takes five times the standard time.

[0044] The illumination system process 215 will be described. The illumination system process 215 includes three imaging performance adjustment processes, namely, process setup indicated by adjustment ID=d0, telecentric adjustment indicated by adjustment ID=d1, and illuminance unevenness adjustment indicated by adjustment ID=d2, as adjustment items of the illumination system unit 102. In the process setup indicated by adjustment ID=d0, adjustment is performed without using a wafer. In the telecentric adjustment indicated by adjustment ID=d1 and the illuminance unevenness adjustment indicated by adjustment ID=d2, adjustment is performed in three illumination modes, so that the adjustment time 211 requires three times the standard time 205.

[0045] The projection system process 216 will be described. The projection system process 216 includes three processes as adjustment items of the projection system unit 114: process setup indicated by adjustment ID=e0, magnification correction adjustment indicated by adjustment ID=e1, and focus adjustment indicated by adjustment ID=e2. In the process setup indicated by adjustment ID=e0, adjustment is performed using six first exposure wafers. In the magnification correction adjustment indicated by adjustment ID=e1 and focus adjustment indicated by adjustment ID=e2, adjustment is performed in three illumination modes, so that the adjustment time 211 requires three times the standard time 205.

[0046] The synchronization control accuracy 217 will now be described. The process of synchronization control accuracy 217 includes two processes, a process setup indicated by adjustment ID=f0 and a synchronization control inspection indicated by adjustment ID=f1, as adjustment items when scanning and exposing the original stage unit 123 and the substrate stage unit 116. In the process setup indicated by adjustment ID=f0, adjustment is performed using five first exposed wafers. In the synchronization control inspection indicated by adjustment ID=f1, adjustment is performed at five scanning speed conditions, so that the adjustment time 211 requires five times the standard time 205.

[0047] The overlay accuracy 218 will be described. The process of overlay accuracy 218 includes two processes, a process setup indicated by adjustment ID=g0 and an overlay accuracy inspection (alignment performance adjustment) indicated by adjustment ID=g1, as adjustment items when overlaying on the base mark of wafer 115. In the process setup indicated by adjustment ID=g0, adjustment is performed using five 2nd wafers with base patterns. In the overlay accuracy inspection indicated by adjustment ID=g1, adjustment is performed at five scanning speed conditions, so that adjustment time 211 requires five times the standard time 205.

[0048] The exposure aberration accuracy 219 will be described. The process of the exposure aberration accuracy 219 includes three steps, namely, a process setup indicated by adjustment ID=h0, an exposure magnification adjustment indicated by adjustment ID=h1, and an exposure focus adjustment indicated by adjustment ID=h2, as adjustment items of the exposure thermal characteristics of the projection system unit 114. In the process setup indicated by adjustment ID=h0, adjustment is performed using 20 first exposure wafers. In the exposure magnification adjustment indicated by adjustment ID=h1 and the exposure focus adjustment indicated by adjustment ID=h2, adjustment is performed in three illumination modes, so that the adjustment time 211 requires three times the standard time 205.

[0049] Conventional performance adjustment is performed according to an adjustment sequence 201. Fig. 4A shows a diagram following the adjustment sequence 201. Circles (shaded) indicate advance preparations (process setup work) involving work by an operator, and their adjustment IDs are written therein. Squares indicate automatic adjustments, and their adjustment IDs are written therein. Because the process setup work mediated by the operator and the automatic adjustment of the exposure tool are performed alternately, if the operator is unable to perform the setup in a timely manner, the adjustment process is temporarily halted, resulting in a loss of time.

[0050] FIG. 3A shows a Gantt chart 300 indicating an execution plan when the schedule 200 in FIG. 2A is carried out. The schedule for each of the four work days (24 hours) is shown here. Time is shown in 30-minute increments. The gray areas from 1:00 to 7:00, the gray areas from 12:00 to 18:00 indicate unmanned time periods when no workers are present. The work symbols written on the bar graph in the Gantt chart (e.g., a0) correspond to the adjustment IDs in FIG. 2A, and the hatching in the bar graph indicates processes (process setups) that involve manual work by workers.

[0051] If the adjustment process starts from 8:00 as shown by time T1 on day 1 301, then the setup (c0) will start from 18:00 on that day, but since the 18:00 hour is an unmanned time, workers cannot work there. Therefore, the setup (c0) will start from 19:00, and the adjustment process will stop for one hour, which can result in a loss of time. Also, in the grey areas from 1:00 to 7:00 on day 2 302 and day 3 303, there is a high percentage of the adjustment process being temporarily stopped. In this way, the temporary stop of the adjustment process during an unmanned time can result in a loss of time.

[0052] In this embodiment, management is performed to reduce such time loss. A management method for managing the implementation of adjustments for a plurality of adjustment items by the process scheduler 30 in this embodiment will be described with reference to Fig. 6. Note that the following describes a method based on the process chart 200 in Fig. 2A.

[0053] In S1, the process scheduler 30 (processing unit) acquires the process chart 200. When the process chart 200 is stored in the storage device 20, the process scheduler 30 can function as an acquisition unit that acquires the process chart 200 from the storage device 20. When the process chart 200 is stored in an external device, the process scheduler 30 can function as an acquisition unit that acquires the process chart 200 from the external device via a network. Alternatively, the process chart 200 may be created by inputting each data of the process chart by an operator via an input device such as a touch panel configured on the display unit of the output device 40. The process scheduler 30 reads adjustment conditions according to the performance specifications from the acquired process chart 200. The adjustment conditions may include the standard value 206, the wafer type 207, the number of wafers 208, the adjustment conditions 209, and the number of conditions 210 in the process chart 200. Here, the process scheduler 30 reads all data set in the adjustment items 204.

[0054] In S2, the process scheduler 30 optimizes the number of setups. In S2, a first adjustment sequence is created that minimizes the number of manual setups and operates the automatic adjustments that follow the setups continuously without pausing, thereby reducing time loss.

[0055] In the case of process chart 200 shown in FIG. 2A, in each process setup, the following number of wafers must be prepared and placed in exposure tool 1 (stored in a stocker device). - One wafer in process setup (b0), - 2 wafers in process setup (c0), - 6 wafers in process setup (e0), - 5 wafers in process setup (f0), - 5 wafers in process setup (g0), · 20 wafers in process setup (h0).

[0056] The process scheduler 30 calculates the conditions under which multiple wafer placements can be set up at once, using the number of substrates that the stocker device can store as a constraint. If the constraint for the number of wafers is 25, then there are two conditions that do not exceed the upper limit of 25: a total of 19 substrates for process setup (a0) through process setup (g0), and 20 substrates for process setup (h0). In this way, the process scheduler 30 (processing unit) aggregates two or more adjustment items that require manual work by an operator into a setup process so that the number of substrates to be processed does not exceed the number of substrates that the stocker device can store.

[0057] In S3, the process scheduler 30 creates a first adjustment order using the results of optimization in S2. The first adjustment order is an order in which the setup process in which two or more adjustment items involving manual work by an operator are aggregated is performed first. FIG. 2B shows a process table 220 updated according to the first adjustment order. FIG. 4B shows a diagram updated according to the first adjustment order. A process 221 is a plurality of process setups M1 aggregated in S2. This is a result of optimization so that seven process setups from process setup (a0) to process setup (g0) are performed continuously. The types and numbers of wafers to be arranged in the exposure tool 1 in the aggregated process setup (M1) are one wafer tool b, two wafer tool c, eleven 1st exposure wafers, and five 2nd wafers with base patterns. The process group 222 includes an automatic adjustment process that can be operated continuously after the wafers are arranged in the process setup (M1).

[0058] Step 223 is a process setup (h0), and includes a process of placing 20 first exposure wafers in the exposure apparatus 1. Step group 224 includes an automatic adjustment process that can operate continuously after the wafers are placed in the process setup (h0).

[0059] In S4, the process scheduler 30 outputs the first adjustment order created in S3 to the output device 40. Since the operator alternates between manual process setup work and automatic adjustment of the exposure tool 1, the process scheduler 30 supports the operator by outputting information for the operator to prepare the setup in a timely manner. For example, the process scheduler 30 can display the process table 220 shown in FIG. 2B in a table format on the output device 40. The operator can easily know the wafer type 207 and the number of wafers 208 to be prepared next from the information of the displayed process table 220. Alternatively, the process scheduler 30 can display the Gantt chart 310 shown in FIG. 3B on the output device 40. The Gantt chart 310 includes time information of the process setup. The operator can know the timing to place the wafer next on the exposure tool 1 from the displayed Gantt chart 310. For example, an operator may know that process setup (M1) is required at time T3 on day 1 311, and process setup (h0) is required at time T6 on day 3 313.

[0060] In S5, the process scheduler 30 waits for a setup completion input from the operator. The operator checks the information output to the output device 40 and places the wafer in the exposure apparatus 1. When the operator inputs that the wafer placement is complete, the process can proceed to S6 and onwards.

[0061] In S6 to S8, the process scheduler 30 executes the adjustment items (automatic adjustment). In S6, the process scheduler 30 sets an adjustment offset to control the units, and self-measures data that is the basis of performance evaluation using a sensor or the like of the exposure apparatus 1. In S7, the process scheduler 30 acquires (calculates) a performance evaluation value based on the data measured in S6. In S8, the process scheduler 30 determines whether the performance evaluation value has converged within the allowable range of the specification value 206. If the performance evaluation value has converged within the range of the specification value 206, the process proceeds to S9, and the process scheduler 30 registers the offset amount in the storage device 20.

[0062] In S10, the process scheduler 30 determines whether the final process has been completed. If the final process has not been completed, the process scheduler 30 executes S6 to S8 for the next adjustment item (automatic adjustment). Here, the explanation will be continued assuming that the automatic adjustments of S6 to S8 in the process group 222 of FIG. 4B have been executed in the order of automatic adjustment (a1), automatic adjustment (a2), automatic adjustment (b1), and automatic adjustment (c1), and that the performance evaluation value has converged to within the range of the specification value 206.

[0063] If the performance evaluation value is outside the range of the standard value 206 in S8, the process proceeds to S11. In S11, the process scheduler 30 determines whether the adjustment item (automatic adjustment) has been executed a predetermined number of times. If the adjustment item has not been executed the predetermined number of times, in S12, the process scheduler 30 calculates the next offset amount based on the performance evaluation value, and the process returns to S6. For example, if the predetermined number of times is three, the adjustment items of S6 to S8 are repeatedly executed up to three times while changing the offset amount in S12, thereby performing a process of converging the performance evaluation value to within the allowable range.

[0064] If the performance evaluation value does not converge within the allowable range of the specification value 206 even after performing the refinement process a predetermined number of times, the process scheduler 30 determines that an adjustment error has occurred for the adjustment item, and the process proceeds to S13. In S13, in response to the occurrence of an adjustment error, the process scheduler 30 selects an adjustment item that can be performed based on the process correlation information. The process correlation information is correlation information that specifies the implementation permission conditions for each adjustment item based on the relationship with other adjustment items.

[0065] FIG. 5 shows an example of the process correlation information 500. A method for selecting an adjustment process that can be performed using the process correlation information 500 will be described. The process correlation information 500 shows the correspondence between a process name 501, an adjustment item 502, and an adjustment ID 503 in a table format. The process correlation information 500 describes the adjustment completion conditions of other processes as the start conditions of each adjustment item 502 indicated by the adjustment ID 503 (condition column 504). A circle mark indicates that the corresponding adjustment item indicated by the adjustment ID 503 can be performed even if the adjustment item indicated by the condition column 504 is incomplete. A black circle mark indicates that the corresponding adjustment item indicated by the adjustment ID 503 cannot be performed when the adjustment item indicated by the condition column 504 is incomplete. According to the process correlation information 500 in FIG. 5, for example, the process 505 in which the focus sensor adjustment (b1) is performed can be performed (circle mark) even if the original stage adjustment (a1) is incomplete, and cannot be performed (black circle mark) unless the substrate stage adjustment (a2) is completed. In other words, the focus sensor adjustment (b1) can be performed once the substrate stage adjustment (a2) is completed, even if the original stage adjustment (a1) is not yet completed. Thus, the process correlation information 500 includes, for each combination of adjustment items among a plurality of adjustment items, information indicating whether or not the completion of the adjustment of one adjustment item is a condition for permitting the implementation of the adjustment of the other adjustment item. Here, since the adjustment items are performed on the basis of the above-mentioned units, it is possible to change the adjustment order between units.

[0066] As an example, the following describes an adjustment method when an adjustment error (adjustment incomplete) occurs in the light intensity adjustment (c1) of the OAS process. Fig. 4C shows a diagram when an adjustment error occurs in the light intensity adjustment (c1) of the OAS process. Fig. 4C shows that after process setup (M1), automatic adjustment (a1), automatic adjustment (a2), and automatic adjustment (b1) are completed, and an adjustment error occurs in process 231 where light intensity adjustment (c1) is performed. The process scheduler 30 selects adjustment items that can be automatically adjusted from a series of processes 232 from focus adjustment (c2) to overlay accuracy inspection (g1) of the OAS process.

[0067] Again, the process correlation information 500 in FIG. 5 is referred to. Here, consider a case where an adjustment error occurs in a process 510 where a light amount adjustment (c1) is performed. In this case, the process scheduler 30 judges whether the adjustment of the light amount adjustment (c1) needs to be completed for the adjustment items surrounded by the dashed line 512, from the focus adjustment (c2) to the overlay accuracy inspection (g1), which can be automatically adjusted. This judgment can be made by referring to the item for the light amount adjustment (c1) in the condition column 511 (dashed line area 513). A black circle indicates that the completion of the adjustment of the adjustment item of interest in the condition column 511 (c1 in this case) (first adjustment item) is a condition for allowing the implementation of the corresponding adjustment item. A circle indicates that the completion of the adjustment of the adjustment item of interest in the condition column 511 (c1 in this case) (first adjustment item) is not a condition for allowing the implementation of the corresponding adjustment item. According to the description in the dashed line region 513, the focus adjustment (c2) cannot be performed (marked with a black circle) unless the light amount adjustment (c1) is completed, whereas the telecentric adjustment (d1) is determined to be executable (marked with a circle) even if the light amount adjustment (c1) is incomplete. Also, the illuminance unevenness adjustment (d2), the magnification correction adjustment (e1), and the focus correction adjustment (e2) are determined to be executable (marked with a black circle) even if the light amount adjustment (c1) is incomplete. Also, the overlay accuracy inspection (g1) is determined to be executable (marked with a black circle) unless the light amount adjustment (c1) is completed. Thus, in this example, there are multiple second adjustment items marked with a black circle for which the completion of the first adjustment item (c1) is not a condition for permission to perform the adjustment.

[0068] 2C shows a selection result 235 of executable adjustment steps based on the step correlation information 500. As a result of the determination of feasibility of a series of steps 232 that can be automatically adjusted, a circle is added to each of the series of steps 233 that can be executed.

[0069] After the adjustment process is selected in S13, in S14, the process scheduler 30 determines whether there is an adjustable adjustment item. If there is no adjustable adjustment item, the process proceeds to S17, where the adjustment process is suspended and waits until recovery. If there is an adjustable adjustment process, the process proceeds to S15. In S15, the process scheduler 30 creates a second adjustment order based on the selection result of S13. FIG. 2D shows a process table 240 according to the second adjustment order. FIG. 4D shows a diagram according to the second adjustment order. In FIG. 2D and FIG. 4D, a series of processes 242 that can be executed even in a state where an adjustment error (adjustment not completed) occurs in process 241 where the light amount adjustment (c1) is executed is shown. The series of processes 242 includes one or more adjustment items (d1, d2, e1, e2, f1) that can be automatically adjusted. Process 243 is a wait for recovery of the OAS process (X1), and is generally a task that involves manual work by an operator. Such manual work may include, for example, fine-tuning the mechanical position within the unit and removing dirt from the parts. After the recovery work is completed, a series of steps 244 is performed. The series of steps 244 may include an OAS step of adjusting the amount of light (c1), an OAS step of adjusting focus (c2) whose start condition is the completion of the light amount adjustment (c1), and an overlay accuracy inspection (g1).

[0070] In S16, the process scheduler 30 outputs the second adjustment sequence created in S15 to the output device 40. As in S4, the process scheduler 30 can display the process chart 240 shown in FIG. 2D in a table format on the output device 40 to present it to the operator. The operator can easily know the recovery wait (X1) of the OAS process from the information of the displayed process chart 240. Alternatively, the process scheduler 30 may display a Gantt chart 320 according to the updated process chart, as shown in FIG. 3C, on the output device 40. The operator can know the next time when the exposure apparatus 1 will stop due to the recovery wait (X1) of the OAS process from the displayed Gantt chart 320. For example, the operator can know that the start of the recovery wait (X1) of the OAS process will be at time T9 on the second day 322.

[0071] In this way, the process scheduler 30 handles the case where an adjustment error occurs for a first adjustment item among a plurality of adjustment items while adjustment according to the acquired process schedule is being performed. That is, in this case, the process scheduler 30 selects a second adjustment item for which the completion of adjustment of the first adjustment item is not a condition for permission to be performed, based on the process correlation information. Then, the process scheduler 30 updates the process schedule so that the second adjustment item is performed before the first adjustment item.

[0072] As described above, according to this embodiment, a first adjustment sequence is created in which the number of setups by the operator is reduced according to the adjustment conditions of the exposure apparatus 1. This makes it possible to reduce time loss caused by the adjustment process being stopped due to the intervention of the operator during automatic adjustment. Furthermore, according to this embodiment, even if the performance evaluation value does not converge within the allowable range during automatic adjustment, a second adjustment sequence is created based on the process correlation information, including one or more adjustment items that can be automatically adjusted. This makes it possible to further reduce time loss caused by the adjustment process being stopped. Furthermore, according to the process scheduler 30 of this embodiment, the output device 40 provides wafer information related to the first adjustment sequence and the second adjustment sequence, and time information for each process. This makes it possible to navigate the operator to an efficient work.

[0073] <Second embodiment> FIG. 9 is a block diagram showing the configuration of an exposure processing system 1000 according to the second embodiment. In the above-mentioned first embodiment, the information processing device 10 is a so-called stand-alone type device connected to the main controller 151 in the exposure apparatus 1 via an interface cable as shown in FIG. 1. In contrast, the information processing device 10 according to the second embodiment is a so-called online type device connected to a plurality of exposure apparatuses including a first exposure apparatus 1001 and a second exposure apparatus 1002 via a network cable 1003 as shown in FIG. 9. Also, as shown in FIG. 9, the information processing device 10 (process scheduler 30) outputs a second adjustment order 1004 to each exposure apparatus, and receives an adjustment result 1005 indicating the execution result of the adjustment according to the second adjustment order 1004 performed in each exposure apparatus. The process scheduler 30 calculates the success rate of the adjustment based on the adjustment result 1005 received from each exposure apparatus.

[0074] FIG. 8A shows an example of a process correlation learning table 800. The process correlation learning table 800 shows the correspondence between a process name 801, an adjustment item 802, and an adjustment ID 803 in a table format, similar to the process correlation information 500 shown in FIG. 5. In the information column 804 of the process correlation learning table 800, for each adjustment item shown by the adjustment ID 803, the adjustment completion condition of other processes or the success rate of adjustment is described. The success rate refers to the ratio of the number of times that the adjustment is successful among the number of times that the corresponding adjustment item shown by the adjustment ID 803 is executed when the adjustment item shown by the information column 804 is incomplete (adjustment error). The success rate when the adjustment item has not yet been executed is set to 0%. Here, the ● mark indicates that, similar to the process correlation information 500 in FIG. 5, when the adjustment item shown by the information column 804 is incomplete, the corresponding adjustment item shown by the adjustment ID 803 cannot be executed.

[0075] FIG. 8B shows an example of the process correlation learning table 810 after the success rate is reflected based on the adjustment result 1005 input from the exposure apparatus to the information processing apparatus 10. Here, as an example, the success rate for each of one or more adjustment items after an adjustment error occurs in the process 812 in which the light intensity adjustment (c1) of the OAS process is performed is shown (area 811). Specifically, the telecentric adjustment (d1) of the illumination system process was successful in one try, so the success rate is 100%. The illuminance unevenness adjustment (d2) was also successful in one try, so the success rate is 100%. The magnification correction adjustment (e1) of the projection system process was successful in two tries, so the success rate is 50%. The focus correction adjustment (e2) was also successful in two tries, so the success rate is 50%. The synchronization control inspection (f1) was successful in one try, so the success rate is 100%. In this manner, the success rate data of the process correlation learning table learned for a plurality of exposure tools is recorded in the storage device 20 to create a learning model, thereby making it possible to improve the accuracy of the adjustment sequence.

[0076] Learning of an adjustment order acquired by machine learning will be described with reference to Fig. 7. In the flowchart shown in Fig. 7, steps related to processing of a learning model of an adjustment order are S20 to S23 shown in a dotted line frame, and the other steps are the same as the processing described in the flowchart of Fig. 6, so description thereof will be omitted.

[0077] The second embodiment will be described using the process chart 200 in Fig. 2A. Here, the description starts after an adjustment error (adjustment incomplete) occurs in the light intensity adjustment (c1) of the OAS process in the first exposure tool 1001, and a second adjustment order (Figs. 2D and 4D) is created based on the process correlation information 500 in S15.

[0078] In S20, the process scheduler 30 updates the second adjustment order based on the success rate recorded in the process correlation learning table 800. If an adjustment error occurs in process 805 where the light intensity adjustment (c1) of the OAS process in FIG. 8A is performed, the initial success rate 807 of the adjustment item 806 for which automatic adjustment can be performed is 0%. At this point, the success rate of each adjustment item 806 is the same. In this case, the adjustment order shown in 242 in FIG. 2D and FIG. 4D is maintained.

[0079] In S16, the second adjustment order is output to the output device 40, and then the process returns to S6. In S6 to S9, the automatic adjustments shown in 242 in Fig. 4D are executed in order, and the process scheduler 30 determines whether the performance evaluation values ​​have converged within the allowable range.

[0080] In S21 to S23, the process scheduler 30 calculates and updates the success rate of the process correlation learning table 800. In this embodiment, after an adjustment error occurs in the light intensity adjustment (c1) of the OAS process, the success rates for one or more adjustment items are as follows: The telecentric adjustment (d1) of the illumination system process was successful in one try, so the success rate is 100%. The illuminance unevenness adjustment (d2) was also successful in one try, so the success rate is 100%. The magnification correction adjustment (e1) of the projection system process was successful in two tries, so the success rate is 50%. The focus correction adjustment (e2) was also successful in two tries, so the success rate is 50%. The synchronization control inspection (f1) was successful in one try, so the success rate is 100%. The updated results are shown in area 811 of FIG. 8B.

[0081] As described above, the process scheduler 30 updates the success rate of the process correlation learning table 810 based on the adjustment result indicating the execution result of the adjustment of the first exposure tool 1001 according to the second adjustment order.

[0082] Next, assume that an adjustment error (adjustment incomplete) occurs in the light intensity adjustment (c1) of the OAS process in the second exposure tool 1002. In S20, the process scheduler 30 updates the second adjustment order based on the success rate recorded in the process correlation learning table 810 of FIG. 8B. If an adjustment error occurs in the process 812 where the light intensity adjustment (c1) of the OAS process is performed, the process scheduler 30 updates the second adjustment order in descending order of success rate by referring to the area 811 in which the success rate of the adjustment items that can be automatically adjusted is described. The process scheduler 30 updates the second adjustment order so that, for example, the synchronization control inspection (f1) with a high success rate is performed first, and the magnification correction adjustment (e1) and focus correction adjustment (e2) with a low success rate are performed thereafter. FIG. 4E shows a diagram according to the updated second adjustment order.

[0083] According to this embodiment, the process scheduler 30 calculates and accumulates the success rate of the process correlation learning table based on the adjustment results 1005 according to the second adjustment order 1004 performed on the multiple exposure tools. The process scheduler 30 stores the success rate data of the process correlation learning table learned for the multiple exposure tools in the storage device 20 and creates a learning model. This makes it possible to improve the accuracy of the second adjustment order and further reduce time loss due to the stoppage of the adjustment process.

[0084] <Other embodiments> The present invention can also be realized by a process in which a program for implementing one or more of the functions of the above-described embodiments is supplied to a system or device via a network or a storage medium, and one or more processors in a computer of the system or device read and execute the program. The present invention can also be realized by a circuit (e.g., ASIC) for implementing one or more of the functions.

[0085] The disclosure of this specification includes at least the following management device, management method, and program. (Item 1) A management device for managing the implementation of adjustments for a plurality of adjustment items of industrial equipment, an acquisition unit that acquires a schedule in which the plurality of adjustment items are listed in order of implementation; a processing unit that updates the schedule based on correlation information that specifies an implementation permission condition for each adjustment item based on a relationship with other adjustment items in response to an occurrence of an adjustment error while an adjustment according to the schedule is being performed; A management device comprising: (Item 2) The management device according to item 1, characterized in that the correlation information includes, for each combination of adjustment items in the plurality of adjustment items, information indicating whether or not completion of adjustment of one adjustment item is a condition for permitting implementation of adjustment of the other adjustment item. (Item 3) The management device described in item 2, characterized in that, in response to an adjustment error occurring for a first adjustment item among the plurality of adjustment items while adjustment according to the schedule is being performed, the processing unit selects a second adjustment item for which completion of the adjustment of the first adjustment item is not a condition for permission to be implemented based on the correlation information, and updates the schedule so that the second adjustment item is implemented before the first adjustment item. (Item 4) The management device described in item 3, characterized in that after the adjustment of the first adjustment item is performed, the processing unit acquires a performance evaluation value for the first adjustment item, and if it determines that the performance evaluation value does not converge within an acceptable range, it determines that the adjustment error has occurred for the first adjustment item. (Item 5) There are a plurality of the second adjustment items, The processing unit includes: Obtaining a success rate of each of the second adjustment items implemented according to the updated schedule; and updating the schedule so that the execution order of the plurality of second adjustment items is arranged in descending order of success rate; 5. The management device according to item 3 or 4. (Item 6) The processing unit aggregates two or more adjustment items that require manual work by an operator among the plurality of adjustment items as a process setup, and updates the process schedule so that the process setup is performed first. 6. The management device according to any one of items 1 to 5, (Item 7) the industrial equipment is a lithography apparatus that transfers a pattern of an original onto a substrate carried in from a storage device; the processing unit aggregates the two or more adjustment items so that the number of substrates to be processed does not exceed the storage capacity of the storage device, using the storage capacity as a constraint condition. 7. The management device according to item 6, (Item 8) The processing unit is configured to output the process chart to an output device to present the process chart to a worker, The process chart includes information on the number of substrates used in each adjustment for the two or more adjustment items. 8. The management device according to item 7, (Item 9) the processing unit is configured to output a Gantt chart based on the process chart to an output device; The Gantt chart includes time information of the process setup. 8. The management device according to item 7, (Item 10) the lithography apparatus is an exposure apparatus that transfers a pattern of an original onto a substrate by exposing the substrate to light; the plurality of adjustment items include at least one of a performance adjustment of an illumination optical system of the exposure apparatus, an imaging performance adjustment of a projection optical system of the exposure apparatus, a focus adjustment of the projection optical system, and an alignment performance adjustment; 10. The management device according to any one of items 7 to 9. (Item 11) A management device for managing the implementation of adjustments for a plurality of adjustment items of industrial equipment, an acquisition unit that acquires a schedule in which the plurality of adjustment items are listed in order of implementation; a processing unit that aggregates two or more adjustment items that require manual work by an operator among the plurality of adjustment items as a process setup, and updates the process schedule so that the process setup is performed first; A management device comprising: (Item 12) A management method for managing the implementation of adjustments for a plurality of adjustment items of industrial equipment, comprising: obtaining a schedule in which the plurality of adjustment items are listed in order of implementation; updating the schedule based on correlation information that specifies an implementation permission condition for each adjustment item based on a relationship with other adjustment items in response to an occurrence of an adjustment error while an adjustment according to the schedule is being performed; A management method comprising the steps of: (Item 13) A management method for managing the implementation of adjustments for a plurality of adjustment items of industrial equipment, comprising: obtaining a schedule in which the plurality of adjustment items are listed in order of implementation; a step of aggregating two or more adjustment items that require manual work by an operator among the plurality of adjustment items into a process setup, and updating the process schedule so that the process setup is performed first; A management method comprising the steps of: (Item 14) 14. A program for causing a computer to execute each step of the management method according to item 12 or 13.

[0086] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0087] 1: exposure device, 10: information processing device, 30: process scheduler, 40: output device

Claims

1. A management device for managing the implementation of adjustments for a plurality of adjustment items of industrial equipment, an acquisition unit that acquires a schedule in which the plurality of adjustment items are listed in order of implementation; a processing unit that updates the schedule based on correlation information that specifies an implementation permission condition for each adjustment item based on a relationship with other adjustment items in response to an occurrence of an adjustment error while an adjustment according to the schedule is being performed; A management device comprising:

2. 2. The management device according to claim 1, wherein the correlation information includes, for each combination of adjustment items in the plurality of adjustment items, information indicating whether or not completion of adjustment of one adjustment item is a condition for permitting implementation of adjustment of the other adjustment item.

3. The management device according to claim 2, characterized in that, in response to an adjustment error occurring for a first adjustment item among the plurality of adjustment items while adjustment according to the schedule is being carried out, the processing unit selects a second adjustment item for which completion of the adjustment of the first adjustment item is not a condition for permission to be implemented based on the correlation information, and updates the schedule so that the second adjustment item is implemented before the first adjustment item.

4. 4. The management device according to claim 3, wherein the processing unit acquires a performance evaluation value for the first adjustment item after adjustment of the first adjustment item is performed, and determines that the adjustment error has occurred for the first adjustment item if it determines that the performance evaluation value does not converge within an acceptable range.

5. There are a plurality of the second adjustment items, The processing unit includes: Obtaining a success rate of each of the second adjustment items implemented according to the updated schedule; updating the schedule so that the execution order of the plurality of second adjustment items is arranged in descending order of success rate; 4. The management device according to claim 3.

6. the processing unit aggregates, among the plurality of adjustment items, two or more adjustment items that require manual work by an operator as a process setup, and updates the process schedule so that the process setup is performed first.

2. The management device according to claim 1.

7. the industrial equipment is a lithography apparatus that transfers a pattern of an original onto a substrate carried in from a storage device; the processing unit aggregates the two or more adjustment items so that the number of substrates to be processed does not exceed the storage capacity of the storage device, the storage capacity being a constraint condition.

7. The management device according to claim 6.

8. The processing unit is configured to output the process chart to an output device to present the process chart to a worker, The process chart includes information on the number of substrates used in each adjustment for the two or more adjustment items.

8. The management device according to claim 7.

9. the processing unit is configured to output a Gantt chart based on the process chart to an output device; The Gantt chart includes time information of the process setup.

8. The management device according to claim 7.

10. the lithography apparatus is an exposure apparatus that transfers a pattern of an original onto a substrate by exposing the substrate to light; the plurality of adjustment items include at least one of a performance adjustment of an illumination optical system of the exposure apparatus, an imaging performance adjustment of a projection optical system of the exposure apparatus, a focus adjustment of the projection optical system, and an alignment performance adjustment; 8. The management device according to claim 7.

11. A management device for managing the implementation of adjustments for a plurality of adjustment items of industrial equipment, an acquisition unit that acquires a schedule in which the plurality of adjustment items are listed in order of implementation; a processing unit that aggregates two or more adjustment items that require manual work by an operator among the plurality of adjustment items as a process setup, and updates the process schedule so that the process setup is performed first; A management device comprising:

12. A management method for managing the implementation of adjustments for a plurality of adjustment items of industrial equipment, comprising: obtaining a schedule in which the plurality of adjustment items are listed in order of implementation; updating the schedule based on correlation information that specifies an implementation permission condition for each adjustment item based on a relationship with other adjustment items in response to an occurrence of an adjustment error while an adjustment according to the schedule is being performed; A management method comprising the steps of:

13. A management method for managing the implementation of adjustments for a plurality of adjustment items of industrial equipment, comprising: obtaining a schedule in which the plurality of adjustment items are listed in order of implementation; a step of aggregating two or more adjustment items that require manual work by an operator among the plurality of adjustment items into a process setup, and updating the process schedule so that the process setup is carried out first; A management method comprising the steps of:

14. A program for causing a computer to execute each step of the management method according to claim 12 or 13.

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