Cup and substrate processing device

Abstract

To clean an inner peripheral surface of a guard which is far from a substrate of two guards for preventing scattering of processing liquid from the substrate.SOLUTION: A cup presents an annular shape extending along one direction and receives processing liquid supplied to a substrate and scattering from the substrate. The cup includes: an annular first guard which is tapered in one direction; a second guard having an inner peripheral surface which is an annular surface facing the first guard at one direction side relative to the first guard; and a cleaning unit sandwiched between the inner peripheral surface and the first guard and configured to clean the inner peripheral surface.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] Both the method and the apparatus disclosed herein relate to techniques for processing substrates, such as semiconductor wafers, glass substrates for liquid crystal displays, substrates for flat panel displays (FPDs) used in organic electroluminescence (EL) displays, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, glass substrates for photomasks, ceramic substrates, substrates for field emission displays (FEDs), and substrates for solar cells. [Background technology]

[0002] In order to appropriately perform various processes on a substrate, the substrate is cleaned before the process. An example of the cleaning is to remove chemicals used in other processes performed before the process.

[0003] An example of the cleaning is so-called scrubbing, which uses, for example, a cleaning brush and, for example, de-ionized water (DIW) as a cleaning liquid.

[0004] When the substrate is being cleaned, it rotates, causing droplets of cleaning fluid to splash outward from the substrate. The splashed cleaning fluid is caught by a guard (also called a "cup").

[0005] For example, Patent Document 1 discloses a cup for receiving a processing liquid, such as pure water, and a cover member for preventing the processing liquid from leaking out of the cup. It is assumed that the processing liquid received in the cup may contain components of a chemical solution used in another process carried out prior to the processing with the processing liquid.

[0006] Patent documents 2, 3 and 4 propose techniques for cleaning cups. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] JP 2011-71405 A [Patent Document 2] Japanese Patent Application Publication No. 6-106126 [Patent Document 3] Japanese Patent Application Publication No. 9-115873 [Patent Document 4] JP 2007-149890 A Summary of the Invention [Problem to be solved by the invention]

[0008] Patent documents 2 and 3 do not consider the components corresponding to the cover member in Patent document 1, and are therefore silent about cleaning of the components corresponding to the cover member. Patent document 4 discloses a processing cup and a rising and lowering splash guard, the former of which may be considered to correspond to the cup in Patent document 1, and the latter to the cover member in Patent document 2, respectively.

[0009] Patent Document 4 discloses a guard washing nozzle for washing the outer wall surface of a splash guard and a cup washing nozzle for washing the inner peripheral surface of a processing cup, but is silent about washing the inner peripheral surface of the splash guard.

[0010] No technology is disclosed for cleaning the inner circumferential surfaces of either the cover member described in Patent Document 1 or the splash guard described in Patent Document 4. However, these components are assumed to be located above the substrate during various processes on the substrate. This is because the various processes are performed on the upper surface side of the substrate. Therefore, there is concern that contamination of the inner circumferential surfaces of these components may lead to the adhesion of foreign matter or components of chemical solutions that are the cause of the contamination to the upper surface of the substrate.

[0011] The technology disclosed herein has been developed in consideration of the anticipated occurrence of the above-mentioned event, and aims to clean the inner surface of the guard farthest from the substrate, of the two guards that prevent processing liquid from splashing from the substrate. [Means for solving the problem]

[0012] A first aspect of the present disclosure is a cup having an annular shape extending in one direction, for receiving processing liquid supplied to a substrate and splashed from the substrate, the cup comprising: a first guard which is annular and tapers as it proceeds in the one direction; a second guard which has an inner circumferential surface which is an annular surface facing the first guard on the one directional side of the first guard; and a cleaning unit which is sandwiched between the inner circumferential surface and the first guard and which cleans the inner circumferential surface.

[0013] A second aspect of the present disclosure is the first aspect, wherein the cleaning unit has an annular guard cleaning nozzle with a discharge port facing the inner circumferential surface.

[0014] A third aspect of the present disclosure is the second aspect, wherein the second guard is annular and has selective cutouts in a circumferential direction of the annular shape, and the discharge outlet opens so as to avoid the circumferential position where the cutouts are provided when viewed along the one direction.

[0015] A fourth aspect of the present disclosure is any of the first to third aspects, further comprising a connecting wall having a tubular shape extending along the one direction and connecting the first guard and the second guard in the one direction. An exhaust port is opened in the connecting wall at or near a position where the first guard and the second guard are connected.

[0016] A fifth aspect of the present disclosure is a substrate processing apparatus including a rotating device that holds a substrate to be processed and rotates it about a rotation axis, a nozzle that ejects a processing liquid for processing the substrate onto the substrate, and a cup that surrounds the rotating device when viewed along the rotation axis. The cup has an annular shape extending along one direction parallel to the rotation axis. The cup has a first guard that is annular and tapered in the one direction and has an uppermost end, a second guard that has an inner peripheral surface that is an annular surface facing the first guard on the one direction side of the first guard, and a cleaning unit that is sandwiched between the inner peripheral surface and the first guard and cleans the inner peripheral surface. When the processing liquid is ejected, the cup is located at an upper position, and at the upper position, the uppermost end is located above a holding position, and the holding position is a position where the rotating device holds the substrate.

[0017] A sixth aspect of the present disclosure is the fifth aspect, further comprising a nozzle movement mechanism that moves the nozzle along a movement path between a position facing the region where the substrate is held and a position not facing the region, and a notch is provided in the second guard opposite a position where the movement path intersects with a part of an outer edge of the region.

[0018] A seventh aspect of the present disclosure is the fifth or sixth aspect, further comprising a cleaning brush for cleaning the substrate, and a brush movement mechanism for moving the cleaning brush along a movement path between a position facing the region where the substrate is held and a position not facing the region. A notch is provided in the second guard opposite a position where the movement path intersects with a part of an outer edge of the region.

[0019] An eighth aspect of the present disclosure is any one of the fifth to seventh aspects, wherein the cleaning unit has an annular guard cleaning nozzle with an outlet opening facing the inner circumferential surface, and the outlet opening avoids the circumferential position of the second guard where the notch is provided, as viewed along the one direction.

[0020] A ninth aspect of the present disclosure is any of the fifth to eighth aspects, wherein the cup has a cylindrical shape extending along the one direction and further includes a connecting wall connecting the first guard and the second guard in the one direction, and a drain opening is opened in the connecting wall at or near a position where the first guard and the second guard are connected.

[0021] A tenth aspect of the present disclosure is any of the fifth to ninth aspects, further comprising a control device that controls the rotation of the substrate by the rotation device, the position of the cup, the ejection of the processing liquid from the nozzle, and the operation of the cleaning unit. Effect of the Invention

[0022] According to the first aspect of the present disclosure, contamination of the substrate is suppressed by cleaning the inner circumferential surface.

[0023] According to the second aspect of the present disclosure, the cleaning liquid is discharged from the discharge port to clean the inner circumferential surface, thereby suppressing contamination of the substrate.

[0024] According to the third aspect of the present disclosure, the cutouts are unlikely to impede movement of a mechanism for supplying a processing liquid to a substrate or movement of a cleaning brush used for scrubbing the substrate. The selective opening of the outlet prevents the cleaning liquid discharged from the outlet from splashing out of the cup.

[0025] According to the fourth aspect of the present disclosure, the cleaning liquid that is discharged from the discharge port and used to clean the inner circumferential surface is less likely to remain in the cup, making it easier to clean the inner circumferential surface.

[0026] According to the fifth aspect of the present disclosure, contamination of the substrate is suppressed by cleaning the inner circumferential surface.

[0027] According to the sixth aspect of the present disclosure, the nozzle is prevented from coming into contact with the second guard during its movement.

[0028] According to the seventh aspect of the present disclosure, the cleaning brush is prevented from coming into contact with the second guard during its movement.

[0029] According to the eighth aspect of the present disclosure, the selective opening of the discharge port prevents the cleaning liquid discharged from the discharge port from splashing out of the cup.

[0030] According to the ninth aspect of the present disclosure, the cleaning liquid that is discharged from the discharge port and used to clean the inner circumferential surface is less likely to remain in the cup, making it easier to clean the inner circumferential surface.

[0031] A tenth aspect of the present disclosure contributes to coordination of substrate rotation, cup positioning, processing liquid dispensing, and cleaning unit operation. [Brief description of the drawings]

[0032] [Figure 1] 1 is a plan view illustrating an example of a configuration of a substrate processing apparatus. [Diagram 2] FIG. 2 is a side view illustrating a schematic configuration of a chamber. [Diagram 3] 10 is a plan view showing a schematic positional relationship between a spin base, a cleaning brush and its position, a treatment liquid discharge nozzle and its position, and a part of a cup. FIG. [Figure 4] FIG. [Diagram 5] FIG. 2 is a plan view illustrating a portion of a cup. [Figure 6] FIG. 4 is a plan view illustrating a guard cleaning nozzle. [Figure 7] FIG. 2 is a cross-sectional view illustrating a portion of a cup. [Figure 8] FIG. 2 is a cross-sectional view illustrating a portion of a cup. [Figure 9] FIG. 2 is a block diagram illustrating a main control system of the substrate processing apparatus. [Figure 10] 1 is a flow chart illustrating a process for cleaning a substrate in a chamber. [Figure 11] FIG. 13 is a cross-sectional view illustrating a first modified example of the guard cleaning nozzle. [Figure 12] FIG. 13 is a cross-sectional view illustrating a second modified example of the guard cleaning nozzle. [Figure 13] FIG. 13 is a cross-sectional view illustrating a second modified example of the guard cleaning nozzle. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0033] Hereinafter, each embodiment of the present disclosure will be described with reference to the attached drawings. The components described in each embodiment are merely examples, and the scope of the present disclosure is not intended to be limited to only the examples. The drawings are merely schematic. In the drawings, the dimensions and numbers of each part may be exaggerated or simplified as necessary to facilitate understanding. In the drawings, parts having similar configurations and functions are given the same reference numerals, and duplicated descriptions are appropriately omitted.

[0034] In this specification, expressions indicating a relative or absolute positional relationship (e.g., "parallel," "orthogonal," "center") not only indicate the exact positional relationship, but also indicate a state including tolerances and a state in which the same degree of functionality is obtained. Expressions indicating that two or more things are in an equal state (e.g., "same," "equal," "homogeneous") not only indicate a state in which they are strictly equal quantitatively, but also indicate a state in which there is a difference that allows for tolerances or similar functions, unless otherwise specified.

[0035] Unless otherwise specified, expressions indicating a shape (such as "rectangular" or "cylindrical") not only represent a strict geometrical shape, but also represent a shape having, for example, irregularities or chamfers, within the scope of obtaining the same degree of effect.

[0036] The expressions "comprise," "include," "have," "includes," or "have" of one element are not exclusive expressions excluding the presence of other elements.

[0037] Unless otherwise specified, the expression "connected" includes a state in which two elements are in contact with each other, as well as a state in which two elements are separated by another element.

[0038] 1 is a plan view illustrating a schematic configuration of a substrate processing apparatus 1. The substrate processing apparatus 1 is a single-wafer processing apparatus that processes, one by one, substrates W as processing objects. For example, the substrates W are substantially disk-shaped semiconductor substrates.

[0039] The substrate W is not necessarily limited to a semiconductor substrate. For example, various substrates such as a glass substrate for a photomask, a glass substrate for a liquid crystal display, a glass substrate for a plasma display, a substrate for an FED (Field Emission Display), a substrate for an optical disk, a substrate for a magnetic disk, and a substrate for a magneto-optical disk can be applied to the substrate W. The shape of the substrate is also not limited to a disk shape, and various shapes such as a rectangular plate shape can be adopted.

[0040] <1. Configuration of the substrate processing apparatus 1> The substrate processing apparatus 1 includes a load port 105, an indexer section 103, a processing section 102, a transfer section 104, a transport section 106, and a controller 107. The controller 107 comprehensively controls the operations of the components of the substrate processing apparatus 1 other than the controller 107.

[0041] The processing section 102 has a plurality of, for example, four towers 20. In a plan view, the four towers 20 are arranged around the transport section 106. Each of the towers 20 has a plurality of, for example, three chambers 2 stacked vertically in a plan view. The chambers 2 function as processing chambers for performing processing on the substrate W.

[0042] A plurality of, for example, four, carriers C are loaded into the load port 105. As the carriers C, a FOUP (Front Opening Unified Pod) that stores the substrates W in an enclosed space, a SMIF (Standard Mechanical Interface) pod, or an OC (Open Cassette) that exposes the substrates W to the outside air may be used.

[0043] The substrate processing apparatus 1 includes an indexer robot 109. The indexer robot 109 moves mainly along the direction in which the carriers C are lined up in the indexer section 103 (see arrow F1 in FIG. 1). The indexer robot 109 moves between the indexer section 103 and the transfer section 104 (see arrow F2 in FIG. 1). The indexer robot 109 has a function of holding a substrate W. The indexer robot 109 transports the substrate W between the carriers C in the indexer section 103.

[0044] The substrate processing apparatus 1 includes a transfer robot 108. The transfer robot 108 has a function of holding a substrate W. The transfer robot 108 moves between the delivery section 104 and the transfer section 106 (see arrow F3 in FIG. 1).

[0045] The transfer robot 108 transfers the substrate W between the indexer robot 109 and the transfer section 104. The indexer robot 109 transfers the substrate W between the transfer robot 108 and the transfer section 104.

[0046] The transfer robot 108 moves between the transfer section 106 and each of the chambers 2 (see arrow F4 in FIG. 1). The transfer robot 108 delivers and receives the substrate W between each of the chambers 2.

[0047] The transfer robot 108 receives the substrate W from the indexer robot 109 and transfers it into any one of the chambers 2. The transfer robot 108 transfers the processed substrate W out of the chamber 2 and passes it to the indexer robot 109.

[0048] <2. Configuration of Chamber 2> 2 is a side view illustrating a schematic configuration of the chamber 2. The chamber 2 has a housing 201, a spin chuck 7, a processing liquid discharge nozzle 6, a cleaning brush 8, and a cup 9.

[0049] The spin chuck 7 is housed in a housing 201. The spin chuck 7 has a function of holding one substrate W to be processed in a horizontal position and a function of rotating about a vertical rotation axis A1. The substrate W held by the spin chuck 7 rotates about the rotation axis A1 by the rotation of the spin chuck 7. For example, the substrate W is held horizontally by the spin chuck 7 with its center positioned on the rotation axis A1. The spin chuck 7 functions as a rotation device that holds the substrate W to be processed and rotates it about the rotation axis A1.

[0050] The spin chuck 7 includes a chuck pin 701, a spin base 702, a rotating shaft 704, and a spin motor 705. The spin motor 705 has a function of rotating the rotating shaft 704 about a rotation axis line A1. The rotating shaft 704 extends vertically along the rotation axis line A1 and is, for example, a hollow shaft. The upper end of the rotating shaft 704 is connected to the center of the lower surface of the spin base 702.

[0051] The upper part of the spin base 702 has a disk shape extending horizontally. A plurality of chuck pins 701 are arranged at intervals in the circumferential direction on the peripheral portion of the upper surface of the spin base 702. The chuck pins 701 grip the substrate W above the spin base 702 and release the grip of the substrate W.

[0052] The chuck pin 701 is fixed above the spin base 702 and functions as an end of the spin chuck 7 that holds the substrate W above the spin base 702. A position 7a of the upper end of the chuck pin 701 can be considered as an example of a holding position where the spin chuck 7 holds the substrate W. In a plan view, the spin base 702 can be considered to correspond to a region where the spin chuck 7 holds the substrate W.

[0053] The chuck pins 701 grip the substrate W, the spin motor 705 applies a rotational force to the rotation shaft 704, and the spin base 702 rotates, whereby the substrate W rotates about a rotation axis A1.

[0054] The processing liquid discharge nozzle 6 is disposed above the spin chuck 7. The processing liquid discharge nozzle 6 has a function of discharging a processing liquid 62 downward. When the substrate W is held by the spin chuck 7 and the processing liquid discharge nozzle 6 is disposed at a position 61 facing the substrate W, the processing liquid discharge nozzle 6 can be said to have a function of supplying the processing liquid 62 to the substrate W, more specifically, to the upper surface thereof, by this function. For example, a cleaning liquid such as deionized water is used as the processing liquid 62.

[0055] The position 61 includes the rotation axis A1 in a plan view, for example. When the processing liquid discharge nozzle 6 is at the position 61 and the substrate W is held by the spin chuck 7 and rotates, the processing liquid discharge nozzle 6 faces the center of rotation of the substrate W, for example.

[0056] Position 60 is a position where the processing liquid discharge nozzle 6 is retracted. The processing liquid discharge nozzle 6 is disposed at position 60 when it is not discharging the processing liquid 62 onto the substrate W. Position 60 does not face the spin base 702, and is located outside the spin chuck 7 in a plan view.

[0057] The processing liquid discharge nozzle 6 is movable in the horizontal direction between positions 60 and 61. The movement of the processing liquid discharge nozzle 6 is performed by an arm 602, more specifically, by the arm 602 that rotates by a mechanism described later. In Fig. 2, a plane 8L virtually indicates a position that the bottom end of the processing liquid discharge nozzle 6 can take in the vertical direction, and is, for example, a horizontal plane. The bottom end of the processing liquid discharge nozzle 6 moves along the plane 8L. The plane 8L is above the position 7a.

[0058] The cleaning brush 8 is disposed above the spin chuck 7. Both positions 81 and 82 are located on the outer periphery of the substrate W held by the spin chuck 7, or near the outer periphery on the center side of the substrate W. For example, the positions 81 and 82 face each other across the rotation axis A1. With the substrate W held by the spin chuck 7, the cleaning brush 8 moves horizontally between the positions 81 and 82. Regardless of whether the cleaning brush 8 is disposed at the positions 81 and 82, the cleaning brush 8 comes into contact with the upper surface of the substrate W held by the spin chuck 7. When the cleaning brush 8 moves horizontally between the positions 81 and 82, the cleaning brush 8 has the function of scrubbing the upper surface of the substrate W while coming into contact with the upper surface of the substrate W.

[0059] Position 80 is a position where the cleaning brush 8 is retracted. The cleaning brush 8 is positioned at position 80 when it is not scrubbing the substrate W. The bottom end of position 80 is located higher than the bottom ends of positions 81 and 82. Figure 2 illustrates an example where the bottom end of position 80 is located higher than the surface 8L.

[0060] For example, the cleaning brush 8 moves horizontally from position 80 to a position opposite the spin chuck 7 while maintaining its vertical position, then moves vertically until it contacts the upper surface of the substrate W held by the spin chuck 7, and then moves horizontally between positions 81 and 82.

[0061] In the present embodiment, the movement of the cleaning brush 8 is illustrated, for example, as being dependent on the driving of the arm 801. However, the function of the cleaning brush 8 and a specific mode of its movement are illustrated in more detail in Patent Document 1 and are publicly known.

[0062] The vertical position of the bottom end of position 80 may be virtually indicated by surface 8L. Of the bottom ends of positions 60, 61, and 80, the vertical position of the one that is located lowest is virtually indicated by surface 8L.

[0063] FIG. 3 is a plan view that shows a schematic positional relationship between the spin base 702, the cleaning brush 8 and its positions 80, 81, and 82, the processing liquid discharge nozzle 6 and its positions 60 and 61, and a part of the cup 9 in a plan view.

[0064] The processing liquid discharge nozzle 6 is connected to a nozzle movement mechanism 601 via an arm 602. The nozzle movement mechanism 601 is realized by, for example, a known turning mechanism. The arm 602 turns by the operation of the nozzle movement mechanism 601, and the processing liquid discharge nozzle 6 moves along a movement path 69 between positions 60 and 61. For example, the movement path 69 is arc-shaped. The movement path 69 intersects with a part 702a of the outer edge of the spin base 702 in a plan view.

[0065] A branch pipe 603 is connected to the arm 602 via a nozzle moving mechanism 601. The branch pipe 603 is connected to a main pipe 50 via a valve 53. A processing liquid 62 (see FIG. 2 ) is supplied to the main pipe 50 by a known mechanism (not shown). The valve 53 adjusts the flow rate of the processing liquid 62 flowing through the branch pipe 603, and typically opens and closes the flow path of the branch pipe 603. The valve 53 is provided in the chamber 2, for example.

[0066] When the valve 53 is opened, the processing liquid 62 is supplied from the main pipe 50 through the branch pipe 603 and the arm 602 to the processing liquid discharge nozzle 6. For example, when the processing liquid discharge nozzle 6 is located at position 61, the valve 53 is opened and the processing liquid 62 is discharged from the processing liquid discharge nozzle 6. For example, when the processing liquid discharge nozzle 6 is located at a position other than 61, the valve 53 is closed and the processing liquid 62 is not discharged from the processing liquid discharge nozzle 6.

[0067] The cleaning brush 8 is connected to a brush moving mechanism 802 via an arm 801. Operation of the brush moving mechanism 802 moves the arm 801 up and down (corresponding to the direction perpendicular to the paper surface in FIG. 3), and thus the cleaning brush 8 also moves up and down. Operation of the brush moving mechanism 802 causes the arm 801 to move the cleaning brush 8 horizontally (the horizontal direction corresponds to the left-right direction in FIG. 3). This horizontal movement causes the cleaning brush 8 to move from position 80 along a movement path 89 to above the spin base 702, or between positions 81 and 82. The movement path 89 intersects with a portion 702b of the outer edge of the spin base 702 in a plan view.

[0068] The brush moving mechanism 802 is realized, for example, by using a ball screw mechanism attached to the arm 801 and a motor that provides a driving force to the ball screw mechanism (neither of which is shown).

[0069] 2, the cup 9 has an annular shape and includes an annular first guard 901, an annular second guard 902, and an annular hollow guard washing nozzle 903.

[0070] The following description will introduce the direction Q in which the annular shape of the cup 9 extends. The first guard 901 and the second guard 902 are connected in the direction Q. When viewed along the direction Q, the first guard 901 is closer to the viewer than the second guard 902. The second guard 902 is closer to the direction Q than the first guard 901. The component of the direction in which the second guard 902 is viewed from the first guard 901 along the direction Q is positive.

[0071] The first guard 901 tapers in the direction Q. The annular shape of the first guard 901 has a diameter that decreases in the direction Q. The second guard 902 has an annular inner circumferential surface 902c. The inner circumferential surface 902c faces the first guard 901. For example, the inner circumferential surface 902c tapers in the direction Q. The guard cleaning nozzle 903 is sandwiched between the first guard 901 and the inner circumferential surface 902c.

[0072] For example, the cup 9 includes a connecting wall 905. The connecting wall 905 has an annular shape extending along the direction Q. The connecting wall 905 connects the first guard 901 and the second guard 902 in the direction Q.

[0073] The cup 9 is stored in the housing 201. The cup 9 is annular and surrounds the spin base 702, farther from the outer edge of the spin base 702 when viewed from the outside of the spin base 702, specifically from the rotation axis A1. The direction Q is a direction relative to the cup 9 and has no direct relationship to the rotation axis A1 of the spin chuck 7. However, when the cup 9 is placed in the chamber 2, the direction Q is parallel to the rotation axis A1. The direction Q is aligned in the upward direction along the rotation axis A1, for example, in the same direction as the vertical upward direction. It can also be said that the second guard 902 is farther from the substrate W placed on the spin base 702 than the first guard 901.

[0074] 4 is a plan view illustrating the cup 9 as viewed along a direction opposite to the direction Q. The second guard 902 is provided with notches 902a and 902b. The notches 902a and 902b are selectively provided in the circumferential direction about the annular shape of the second guard 902.

[0075] At both of the notches 902a and 902b, the radial width of the second guard 902, specifically the width between the inner peripheral edge and the outer peripheral edge of the second guard 902, is locally narrowed when viewed in the direction opposite to the direction Q. The outer peripheral edge of the second guard 902 is circular in plan view. The inner peripheral edge of the second guard 902 is arc-shaped in plan view except for the notches 902a and 902b, and approaches the outer peripheral edge of the second guard 902 at the notches 902a and 902b.

[0076] The notch 902a faces a part 702a of the outer edge of the spin base 702. Specifically, in a plan view, the notch 902a exposes the part 702a of the outer edge. The notch 902b faces a part 702b of the outer edge of the spin base 702. Specifically, in a plan view, the notch 902b exposes the part 702b of the outer edge.

[0077] As described above, the inner surface 902c tapers in the direction Q, so the length of the second guard 902 along the direction Q at the notches 902a, 902b is shorter than the length of the second guard 902 along the direction Q other than the notches 902a, 902b.

[0078] 2, the cup 9 can take two positions, an upper position 9u and a lower position 9d. The upper position 9u is higher than the lower position 9d. When the cup 9 is in the upper position 9u, the uppermost end 901d of the first guard 901 is higher than the position 7a. When the cup 9 is in the upper position 9u, the second guard 902 is lower than the surface 8L at the notches 902a and 902b, and the second guard 902 is both higher and lower than the surface 8L except for the notches 902a and 902b.

[0079] 3, the cup 9 has a connecting portion 907 on its outer periphery, and the connecting portion 907 is connected to the cup lifting mechanism 52 via the arm 54. The cup lifting mechanism 52 lifts and lowers the arm 54, and thus lifts and lowers the cup 9. The cup 9 is moved by the cup lifting mechanism 52 between two positions, an upper position 9u and a lower position 9d. The cup lifting mechanism 52 stops lifting and lowering when the cup 9 is in the upper position 9u, and the state in which the cup 9 is in the upper position 9u is maintained. The cup lifting mechanism 52 stops lifting and lowering when the cup 9 is in the lower position 9d, and the state in which the cup 9 is in the lower position 9d is maintained. In FIG. 2, the position of the cup lifting mechanism 52 is typically indicated by a chain line.

[0080] When the cup 9 is in its lower position 9d, both the uppermost end 901d and the uppermost end 902d of the second guard 902 are lower than the holding position 7a. Setting the lower position 9d in this manner makes it easier to attach and detach the substrate W to and from the spin chuck 7.

[0081] The cup lifting mechanism 52 is realized, for example, using a support member (not shown) that supports the arm 54, a ball screw mechanism (not shown) attached to the support member, and an electric motor (not shown) that provides a driving force to the ball screw mechanism.

[0082] During both scrubbing and when the processing liquid 62 is discharged from the processing liquid discharge nozzle 6, the cup 9 is placed at the upper position 9u by the cup lifting mechanism 52 (the cup 9 is located at the upper position 9u). The first guard 901 receives the processing liquid 62 splashed from the substrate W. The inner peripheral surface 902c receives the processing liquid 62 that has splashed from the substrate W beyond the first guard 901.

[0083] For example, the cup 9 has an annular tray 904 on the side opposite to the direction Q with respect to the first guard 901 (on the lower side in the chamber 2). The processing liquid 62 received by the first guard 901 is collected by a known collection mechanism (not shown). The collected processing liquid 62 can be reused.

[0084] When the cup 9 is located at the upper position 9u, the second guard 902 prevents the processing liquid 62 from splashing from the substrate W over the cup 9.

[0085] Because the notch 902a is provided, movement of the processing liquid discharging nozzle 6 is not easily hindered even when the cup 9 is located at the upper position 9u and the processing liquid discharging nozzle 6 moves between the positions 60 and 61. Specifically, the notch 902a prevents the processing liquid discharging nozzle 6 from coming into contact with the second guard 902 during its movement.

[0086] Because the notch 902b is provided, the movement of the cleaning brush 8 and the arm 801 is not easily hindered even when the cup 9 is located at the upper position 9u and the cleaning brush 8 moves between the positions 80, 81, and 82. Specifically, the notch 902b prevents the cleaning brush 8 and the arm 801 from coming into contact with the second guard 902 when they move.

[0087] Fig. 5 is a plan view illustrating a part of the cup 9 in the direction opposite to the direction Q, particularly with the guard cleaning nozzle 903 exaggerated. Fig. 6 is a plan view illustrating the guard cleaning nozzle 903 in the direction opposite to the direction Q.

[0088] 7 and 8 are cross-sectional views illustrating a portion of the cup 9 taken along a direction perpendicular to the direction Q. Fig. 7 shows a cross-section at a position where the notches 902a and 902b are not present. Fig. 8 shows a cross-section at a position where the notches 902a or 902b are present. In Fig. 8, the imaginary outline of the second guard 902 in the absence of the notches 902a or 902b is shown by a dashed line.

[0089] The processing liquid 62 received by the first guard 901 can itself clean the first guard 901. The processing liquid 62 received by the inner circumferential surface 902c is small in amount compared to the processing liquid 62 received by the first guard 901. The small amount of processing liquid 62 that reaches the inner circumferential surface 902c can be a source of contamination of the inner circumferential surface 902c and, ultimately, of the substrate W, but may not be sufficient to clean the inner circumferential surface 902c. The guard cleaning nozzle 903 ejects a cleaning liquid onto the inner circumferential surface 902c to clean the inner circumferential surface 902c. Cleaning the inner circumferential surface 902c suppresses contamination of the substrate W resulting from contamination of the inner circumferential surface 902c.

[0090] The guard cleaning nozzle 903 is divided into a first portion 903a and a second portion 903b along its circumferential direction. The first portion 903a extends in the circumferential direction of the guard cleaning nozzle 903 except for the range in which the second portion 903b extends in the circumferential direction of the guard cleaning nozzle 903.

[0091] The range in which the second portion 903b extends in the circumferential direction of the guard cleaning nozzle 903 coincides with the range in which the notches 902a and 902b each extend in the circumferential direction of the second guard 902. Specifically, within the range in which the notch 902a extends in the circumferential direction of the second guard 902, one second portion 903b extends in the circumferential direction of the guard cleaning nozzle 903. Within the range in which the notch 902b extends in the circumferential direction of the second guard 902, the other second portion 903b extends in the circumferential direction of the guard cleaning nozzle 903.

[0092] Fig. 5 is a plan view at a position where the notches 902a and 902b are not present. In Fig. 6, the boundary between the first part 903a and the second part 903b is indicated by a dashed line. In the circumferential direction of the guard cleaning nozzle 903, the outlet 903c is selectively opened. Specifically, the outlet 903c is opened in the first part 903a, and the outlet 903c is not opened in the second part 903b.

[0093] The discharge port 903c opens toward, for example, the inner circumferential surface 902c. In Fig. 7, the cleaning liquid J discharged from the discharge port 903c to the inner circumferential surface 902c is illustrated by a dashed arrow. After reaching the inner circumferential surface 902c, the cleaning liquid J flows downward along the inner circumferential surface 902c and the connecting wall 905 and along the first guard 901, and is discharged to the outside of the cup 9 through the discharge port 906.

[0094] This flow and discharge are also illustrated diagrammatically using dashed arrows in Figure 7. Discharge port 906 is selectively opened at or near the position where first guard 901 and second guard 902 are connected, for example, in connecting wall 905.

[0095] 4 illustrates an example in which eight outlets 906 are open at approximately equal intervals in the circumferential direction of cup 9. Outlet 906 is located on a path for discharging cleaning liquid J that has reached inner circumferential surface 902c from ejection port 903c. Discharging cleaning liquid J through outlet 906 prevents cleaning liquid J that has cleaned inner circumferential surface 902c from accumulating in cup 9, making it easier to clean inner circumferential surface 902c.

[0096] The discharge port 903c is opened in the first portion 903a, and the first portion 903a is sandwiched between the second guard 902 and the first guard 901. When viewed along the direction Q, the discharge port 903c is not opened at the position where the notches 902a and 902b are provided (see FIG. 8). When viewed along the direction Q, the discharge port 903c is opened so as to avoid the circumferential position where the notches 902a and 902b are provided. At this position, the cleaning liquid J is reduced from reaching the inner circumferential surface 902c. This reduction suppresses the cleaning liquid J from splashing out of the cup 9.

[0097] A supply pipe 909 is connected from the outside to the guard cleaning nozzle 903. The supply pipe 909 communicates with the first part 903a and the second part 903b. The cleaning liquid J flows from the outside through the supply pipe 909 into the first part 903a and the second part 903b.

[0098] 4 and 6 show an example in which the supply pipe 909 is connected to the first portion 903a, but the supply pipe 909 may be connected to the second portion 903b. The supply pipe 909 may be configured as a part of the cup 9. The guard cleaning nozzle 903 may be considered to be an example of a cleaning unit 900 that cleans the inner circumferential surface 902c, and a combination of the guard cleaning nozzle 903 and the supply pipe 909 as shown in FIG. 4 may be considered to be an example of a cleaning unit 900. It can be said that cleaning the inner circumferential surface 902c by the cleaning unit 900 reduces contamination of the substrate W resulting from contamination of the inner circumferential surface 902c.

[0099] For example, the same liquid, such as deionized water, is used for both the cleaning liquid J and the processing liquid 62. Fig. 3 illustrates a case in which the same liquid is used for both the cleaning liquid J and the processing liquid 62. Referring to Fig. 3, a supply pipe 909 is connected to a main pipe 50 via a valve 59. The supply pipe 909, together with a branch pipe 603, can be considered to be a branch pipe to the main pipe 50. The valves 53 and 59 side of the main pipe 50 are branched in the form of a so-called tee piping. The valves 53 and 59 are provided in the chamber 2, for example.

[0100] <3. Control system of substrate processing apparatus 1> 9 is a block diagram illustrating a main control system of the substrate processing apparatus 1. The control device 107 includes a processor 3A and a memory 3B. The memory 3B stores a control program. The control program is executed by the processor 3A to control the operation of the substrate processing apparatus 1. For example, the processor 3A and the memory 3B are realized by a microcomputer.

[0101] The processor 3A is composed of, for example, one or more central processing units (CPUs). The memory 3B is composed of, for example, a volatile storage medium such as a random access memory (RAM) and a non-volatile storage medium such as a hard disk drive (HDD) or a solid state drive (SSD). In the non-volatile storage medium, for example, in addition to the above-mentioned control program, various information can be stored. When the processor 3A executes the control program, the RAM is used, for example, as a workspace, and stores information that is temporarily generated or acquired. At least a part of the functions realized by the control device 107 may be realized by hardware such as a dedicated electronic circuit.

[0102] In the main control system of the substrate processing apparatus 1, the control device 107 controls the spin motor 705, the brush moving mechanism 802, the nozzle moving mechanism 601, the cup lifting mechanism 52, and the valves 53 and 59. Such controls are represented by solid arrows in FIG.

[0103] The spin base 702 is driven to rotate by a spin motor 705. The cleaning brush 8 is moved by a brush moving mechanism 802. The treatment liquid discharge nozzle 6 is moved by a nozzle moving mechanism 610. The cup 9 is lifted and lowered by a cup lifting mechanism 52. The mechanical connections between these components are represented by dashed arrows in FIG.

[0104] The control device 107 may not be provided in the substrate processing apparatus 1 but may be provided outside the substrate processing apparatus 1. The processor 3A may be provided in the substrate processing apparatus 1, and the memory 3B may be provided outside the substrate processing apparatus 1. The memory 3B may be provided in the substrate processing apparatus 1, and the processor 3A may be provided outside the substrate processing apparatus 1. It is clear that the control system illustrated in FIG. 9 can be realized in these cases as well.

[0105] <4. Cleaning treatment> Fig. 10 is a flow chart illustrating a process of cleaning the substrate W in the chamber 2. Specifically, in Fig. 10, the flow chart is titled "Substrate Cleaning Process" and illustrates a process of scrubbing the substrate W. The flow chart includes steps S11, S12, S13, S14, S15, S16, and S17, and Fig. 10 illustrates a mode in which the steps are performed in this order. However, as described below, these steps may be performed in an order other than the order.

[0106] 1, in step S11, the cup 9 is placed in the lower position 9d by the cup lifting mechanism 52 (the cup 9 is located at the lower position 9d). When step S11 is performed or before it is performed, the cleaning brush 8 is located at position 80, and the processing liquid discharge nozzle 6 is located at position 60.

[0107] In step S12, the substrate W is placed on the spin base 702, for example, by the transfer robot 108. Prior to step S12, step S11 is performed to position the cup 9 at the lower position 9d, which facilitates the placement of the substrate W. In step S13, the cup 9 is placed at the upper position 9u by the cup lifting mechanism 52 (the cup 9 is located at the upper position 9u).

[0108] With the cup 9 located at the upper position 9u, step S14 is performed. In step S14, the substrate W is scrubbed using the processing liquid 62 and the cleaning brush 8. At this time, the cleaning brush 8 is moved away from position 80 by the brush moving mechanism 802 and moved between positions 81 and 82. The processing liquid discharge nozzle 6 is moved from position 60 to position 61 by the nozzle moving mechanism 601.

[0109] Even when the cup 9 is located at the upper position 9u, the second guard 902 is provided with the notches 902a and 902b, thereby preventing the second guard 902 from coming into contact with the moving processing liquid discharge nozzle 6 or the moving cleaning brush 8.

[0110] During the scrubbing, the processing liquid 62 scattered from the substrate W is received by the first guard 901. The processing liquid 62 scattered beyond the first guard 901 adheres to the inner circumferential surface 502c.

[0111] The valve 53 is opened and the processing liquid discharge nozzle 6 discharges the processing liquid 62. The valve 59 is closed and the cleaning liquid J is not discharged from the guard cleaning nozzle 903. The substrate W is rotated by the spin chuck 7. In order not to impede the movement of the cleaning brush 8 between the positions 81 and 82, the relationship between the position 61 and the positions 81 and 82 may be adjusted, or the timing at which the processing liquid discharge nozzle 6 is located at the position 61 may be shifted from the timing at which the cleaning brush 8 moves between the positions 81 and 82.

[0112] When scrubbing using the cleaning brush 8 is performed for a predetermined period of time, the valve 53 is closed, the cleaning brush 8 is positioned at position 80, the processing liquid discharge nozzle 6 is positioned at position 60, and step S14 is completed.

[0113] In step S15, the cup 9 is placed in the lower position 9d by the cup lifting mechanism 52 (the cup 9 is located in the lower position 9d). In step S16, the substrate W is removed from the spin base 702 by, for example, the transfer robot 108. Execution of step S15 prior to step S16 to position the cup 9 in the lower position 9d facilitates removal of the substrate W.

[0114] In step S17, cleaning of the inner circumferential surface 902c is performed using the cleaning liquid J and the guard cleaning nozzle 903. Specifically, the valve 59 is opened while the valve 53 is kept closed, and the cleaning liquid J is discharged from the guard cleaning nozzle 903. More specifically, the cleaning liquid J is discharged from the discharge port 903c onto the inner circumferential surface 902c.

[0115] When the cleaning liquid J has been discharged onto the inner circumferential surface 902c for a predetermined period of time, the valve 59 is closed, and step S17 is completed. When step S17 is completed, the substrate cleaning process illustrated in FIG.

[0116] <4-1. Timing for cleaning the inner circumferential surface 502c> In the above example, step S17 is performed after steps S14, S15, and S16. Performing steps S14, S15, S16, and S17 in this order is preferable from the viewpoint of cleaning the inner circumferential surface 502c that may have been contaminated in step S14.

[0117] In the above example, step S17 is performed after step S16. Performing steps S16 and S17 in this order is preferable from the viewpoint of preventing the cleaning of the inner circumferential surface 502c from being adversely affected by the cleaning liquid J that may splash from the inner circumferential surface 502c on the substrate W that has been scrubbed and cleaned in step S14.

[0118] In the above example, step S17 is performed after step S 15. Performing steps S15 and S17 in this order is preferable from the viewpoint that cleaning of inner circumferential surface 502c is less likely to affect spin base 702.

[0119] Step S17 may be performed between steps S11 and S14 instead of after step S16, or may be performed after step S16 and at the same time. Performing step S17 in this order is preferable from the viewpoint of cleaning the inner circumferential surface 502c that may have been contaminated in other processes prior to performing step S14, and reducing contamination of the substrate W to be subjected to scrubbing cleaning.

[0120] In particular, when step S17 is performed between step S11 and step S13, the inner circumferential surface 502c is cleaned while the cup 9 is in the lower position 9d. This is preferable from the viewpoint that cleaning of the inner circumferential surface 502c is unlikely to affect the spin base 702 or the substrate W. In particular, it is preferable to perform step S17 between step S11 and step S12 from the viewpoint that cleaning of the inner circumferential surface 502c is unlikely to affect the substrate W.

[0121] <4-2. Cleaning of the inner circumferential surface 502c independent of cleaning of the substrate W> The cleaning of the inner circumferential surface 502c can be performed independently of the scrubbing of the substrate W. In accordance with the flowchart of Fig. 10, for example, steps S11, S12, S14, S15, and S16 can be omitted, and steps S13 and S17 can be performed in this order. In this case, the inner circumferential surface 502c is cleaned while the cup 9 is in the upper position 9u.

[0122] Alternatively, for example, steps S12, S13, S14, S15, and S16 may be omitted, and steps S11 and S17 may be performed in this order. In this case, the inner circumferential surface 502c is cleaned while the cup 9 is in the lower position 9d. This is preferable in that cleaning of the inner circumferential surface 502c is less likely to affect the spin base 702.

[0123] <4-3 Overall viewpoint of the embodiment> <4-3-1. Perspective of the 9 of Cups> The techniques disclosed in the above-described embodiments can be generally described from the viewpoint of the cup 9 as follows.

[0124] The cup 9 has an annular shape extending along the direction Q. The cup 9 receives the processing liquid 62 that is supplied to the substrate W and splashes from the substrate W.

[0125] The cup 9 includes a first guard 901, a second guard 902, and a cleaning unit 900. The first guard 901 has an annular shape that tapers in the direction Q. The second guard 902 has an inner circumferential surface 902c. The inner circumferential surface 902c is an annular surface that faces the first guard 901 on the direction Q side relative to the first guard 901.

[0126] The cleaning unit 900 is sandwiched between the inner circumferential surface 902c and the first guard 901 to clean the inner circumferential surface 902c.

[0127] The cleaning unit 900 has a guard cleaning nozzle 903. The guard cleaning nozzle 903 has a discharge port 903c that faces the inner circumferential surface 902c. The guard cleaning nozzle 903 has an annular shape. The cleaning liquid J is discharged from the discharge port 903c.

[0128] The second guard 902 is annular, and is selectively provided with notches 902a and 902b in the circumferential direction of the annular shape. The discharge port 903c opens, when viewed along the direction Q, avoiding the circumferential positions where the notches 902a and 902b are provided.

[0129] The cup 9 also includes a connecting wall 905. The connecting wall 905 has a cylindrical shape extending along the direction Q. The connecting wall 905 connects the first guard 901 and the second guard 902 in the direction Q. An outlet 906 opens in the connecting wall 905 at or near the position where the first guard 901 and the second guard 902 are connected. The cleaning liquid J is discharged from the outlet 906 to the outside of the cup 9.

[0130] <4-3-2. Viewpoint of the substrate processing apparatus 1> The techniques disclosed in the above-described embodiments can be generally described as follows from the viewpoint of a substrate processing apparatus 1 in which scrub cleaning is performed.

[0131] The substrate processing apparatus 1 includes a spin chuck 7, a processing liquid discharge nozzle 6, and a cup 9. The spin chuck 7 functions as a rotation device that holds a substrate W to be processed and rotates the substrate W about a rotation axis A1. The processing liquid discharge nozzle 6 is a nozzle that discharges a processing liquid 62 for processing the substrate W onto the substrate W. The cup 9 surrounds the spin chuck 7 when viewed along the rotation axis A1.

[0132] The cup 9 has an annular shape extending along a direction Q parallel to the rotation axis A1. The cup 9 has a first guard 901, a second guard 902, and a cleaning unit 900. The first guard 901 has an annular shape that tapers in the direction Q. The first guard 901 has an uppermost end 901d. The second guard 902 has an inner circumferential surface 902c. The inner circumferential surface 902c is an annular surface that faces the first guard 901 on the direction Q side of the first guard 901. The cleaning unit 900 is sandwiched between the inner circumferential surface 502c and the first guard 901 to clean the inner circumferential surface 902c.

[0133] When the processing liquid 62 is discharged, the cup 9 is located at the upper position 9u. At the upper position 9u, the uppermost end 901d is located above the position 7a. The position 7a is a holding position where the spin chuck 7 holds the substrate W.

[0134] The substrate processing apparatus 1 also includes a nozzle moving mechanism 601. The nozzle moving mechanism 601 moves the processing liquid discharge nozzle 6 along a movement path 69 between positions 61 and 60. At position 61, the processing liquid discharge nozzle 6 faces a spin base 702 on which the substrate W is held. At position 60, the processing liquid discharge nozzle 6 does not face the spin base 702. A notch 902a is provided in the second guard 902. The notch 902a faces a position where the movement path 69 intersects with a part 702a of the outer edge of the spin base 702.

[0135] The substrate processing apparatus 1 also includes a cleaning brush 8 and a brush moving mechanism 802. The cleaning brush 8 cleans the substrate W. The brush moving mechanism 802 moves the cleaning brush 8 along a moving path 89 between positions 81, 82 and position 80. The cleaning brush 8 faces the spin base 702 at positions 81, 82. The cleaning brush 8 does not face the spin base 702 at position 80. A notch 902b is provided in the second guard 902. The notch 902b faces a position where the moving path 89 intersects with a part 702b of the outer edge of the spin base 702.

[0136] The cleaning unit 900 has a guard cleaning nozzle 903. The guard cleaning nozzle 903 has an outlet 903c that faces the inner circumferential surface 902c. The guard cleaning nozzle 903 has an annular shape. When viewed along the direction Q, the outlet 903c opens so as to avoid the circumferential position of the second guard 902 where the notches 902a and 902b are provided. The cleaning liquid J is discharged from the outlet 903c.

[0137] For example, the substrate processing apparatus 1 includes a control device 107. The control device 107 controls the rotation of the substrate W by the spin chuck 7, the positioning (arrangement) of the cup 9 by the cup lifting mechanism 52, the discharge of the processing liquid 62 from the processing liquid discharge nozzle 6, and the operation of the cleaning unit 900. The control device 107 contributes to cooperation between the rotation of the substrate W, the arrangement of the cup 9, the movement of the cleaning brush 8, the arrangement of the processing liquid discharge nozzle 6, the discharge of the processing liquid 62, and the operation of the cleaning unit 900.

[0138] For example, the control device 107 also controls the movement of the cleaning brush 8 by the brush moving mechanism 802 and the movement of the processing liquid discharge nozzle 6 by the nozzle moving mechanism 601 .

[0139] <5. Transformation> <5-1. First transformation> 2, 4, 5, and 7 show an example in which the first portion 903a is hidden by the second guard 902 when viewed in the direction opposite to the direction Q. However, there are also cases in which the first portion 903a is not hidden by the second guard 902.

[0140] 11 is a cross-sectional view illustrating a first modification of the guard cleaning nozzle 903. FIG. 11 illustrates a cross-section of the guard cleaning nozzle 903 at a position where the first portion 903a appears. In the first modification, the first portion 903a is not hidden by the second guard 902 when viewed in the opposite direction to the direction Q. The direction in which the cleaning liquid J is discharged from the discharge port 903c is a direction in which the cleaning liquid J spreads in the radial direction, and the cleaning liquid J reaches the inner circumferential surface 902c. In the first modification, the inner circumferential surface 902c is also cleaned by the guard cleaning nozzle 903.

[0141] As illustrated in FIG. 11, when the position of the uppermost end 901d is approximately the same as the position of the uppermost end 902d in the direction Q, it is preferable that the first guard 901 also be provided with notches similar to the notches 902a and 902b.

[0142] <5-2. Second transformation> 4 and 7 show an example in which second portion 903b is exposed through notch 902a or notch 902b when viewed in the direction opposite to direction Q. However, there is also a case in which second portion 903b is not exposed through either notch 902a or notch 902b.

[0143] 12 and 13 are cross-sectional views illustrating a second modification of the guard cleaning nozzle 903. FIG. 12 illustrates a cross-section of the guard cleaning nozzle 903 at a position where the second portion 903b appears. However, the imaginary outline of the second guard 902 in the absence of the notch 902a or notch 902b is shown by a chain line. FIG. 13 illustrates a cross-section of the guard cleaning nozzle 903 at a position where the first portion 903a appears. However, the imaginary outline of the second guard 902 in the presence of the notch 902a or notch 902b is shown by a chain line.

[0144] In the second modification, the second portion 903b is hidden by the second guard 902 when viewed in the opposite direction to the direction Q. The direction in which the cleaning liquid J is discharged from the discharge port 903c is a radially narrowing direction, and the cleaning liquid J reaches the inner circumferential surface 902c. In the second modification, the inner circumferential surface 902c is also cleaned by the guard cleaning nozzle 903.

[0145] <5-3.Third transformation> For example, the substrate processing apparatus 1 may include a plurality of cleaning brushes 8. In this case, it is preferable that the second guard 902 is provided with a plurality of notches 902b corresponding to the movements of the respective cleaning brushes 8.

[0146] It goes without saying that all or part of the components constituting each of the above-described embodiments and various modified examples can be appropriately combined to the extent that no contradictions occur. [Explanation of symbols]

[0147] 1. Substrate Processing Equipment 6 Processing liquid discharge nozzle 7 Spin chuck (rotating device) 7a position (holding position) 8 Cleaning Brush 9 cups 9u upper position 60,61,80,81,82 position 62 Processing fluid 69,89 Travel route 601 Nozzle movement mechanism 702 Spin Base (area) 702a,702b part 802 Brush moving mechanism 900 Cleaning Unit 901 1st Guard 901d top end 902 2nd Guard 902a,902b Notch 902c Inner surface 903 Guard cleaning nozzle 903c outlet 905 Connecting wall 906 Outlet A1 Rotation axis Q Direction W substrate

Claims

1. A cup having an annular shape extending in one direction, for receiving a processing liquid supplied to a substrate and splashed from the substrate, a first guard that is annular and tapered in one direction; a second guard having an inner circumferential surface that is an annular surface facing the first guard on the one direction side of the first guard; a cleaning unit that is sandwiched between the inner circumferential surface and the first guard and cleans the inner circumferential surface; Provided with a cup.

2. The cup according to claim 1 , wherein the cleaning unit has an annular guard cleaning nozzle having a discharge port facing the inner circumferential surface.

3. The second guard is annular and has a cutout selectively provided in a circumferential direction of the annular shape. The cup according to claim 2 , wherein the discharge port opens so as to avoid a circumferential position where the notch is provided when viewed along the one direction.

4. a connecting wall having a cylindrical shape extending along the one direction and connecting the first guard and the second guard in the one direction; Further comprising:

4. The cup according to claim 1, wherein the connecting wall has a drain opening at or near a position where the first guard and the second guard are connected.

5. a rotation device that holds a substrate to be processed and rotates the substrate about a rotation axis; a nozzle that ejects a processing liquid onto the substrate; a cup surrounding the rotating device as viewed along the axis of rotation; Equipped with The cup has an annular shape extending along one direction parallel to the rotation axis, The cup is a first guard having an annular shape tapered in one direction and having an uppermost end; a second guard having an inner circumferential surface that is an annular surface facing the first guard on the one direction side of the first guard; a cleaning unit that is sandwiched between the inner circumferential surface and the first guard and cleans the inner circumferential surface; having When the processing liquid is discharged, the cup is in the upper position. In the upper position, the uppermost end is located above the holding position, The substrate processing apparatus, wherein the holding position is a position where the rotation device holds the substrate.

6. a nozzle moving mechanism that moves the nozzle along a movement path between a position facing the region where the substrate is held and a position not facing the region; Further comprising: The substrate processing apparatus according to claim 5 , wherein the second guard has a notch formed in a position opposite to where the movement path intersects with a portion of an outer edge of the area.

7. a cleaning brush for cleaning the substrate; a brush moving mechanism that moves the cleaning brush along a movement path between a position facing the region where the substrate is held and a position not facing the region; Further comprising: The substrate processing apparatus according to claim 5 , wherein the second guard has a notch formed in a position opposite to where the movement path intersects with a portion of an outer edge of the area.

8. the cleaning unit has an annular guard cleaning nozzle with a discharge port facing the inner circumferential surface, 8. The substrate processing apparatus according to claim 5, wherein, when viewed along the one direction, the discharge port opens so as to avoid a circumferential position of the second guard where the notch is provided.

9. The cup is a connecting wall having a cylindrical shape extending along the one direction and connecting the first guard and the second guard in the one direction; Further comprising:

8. The substrate processing apparatus according to claim 5, wherein the connecting wall has a discharge port at or near a position where the first guard and the second guard are connected.

10. 8. The substrate processing apparatus according to claim 5, further comprising a control device that controls rotation of the substrate by the rotation device, a position of the cup, ejection of the processing liquid from the nozzle, and operation of the cleaning unit.

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