Multilayer ceramic capacitor

Abstract

To provide a multilayer ceramic capacitor capable of improving moisture resistance and flexural strength.SOLUTION: A multilayer ceramic capacitor has an element portion including a plurality of dielectric layers stacked in a thickness direction and a plurality of internal electrode layers containing Ni, and in the internal electrode layers, the width of an opposing portion in a width direction is greater than the width of a drawn-out portion 151. The element portion includes a first region R1, a second region R2, and a third region R3 in each of a region extending from one side end portion 151t1 of the drawn-out portion 151 located on one side in the width direction to a first side surface 113, and a region extending from the other side end portion 151t2 of the drawn-out portion 151 located on the other side in the width direction to a second side surface 114, the first, second and third regions R1, R2 and R3 being arranged in this order from the inside in the width direction to the outside in the width direction. When the grain diameter of a plurality of dielectrics included in the first region R1 is represented by gr1, the grain diameter of a plurality of dielectrics included in the second region R2 is represented by gr2, and the grain diameter of a plurality of dielectrics included in the third region R3 is represented by gr3, the relationship gr1<gr2<gr3 is satisfied.SELECTED DRAWING: Figure 15

Description

[Technical Field]

[0001] The present disclosure relates to multilayer ceramic capacitors. [Background technology]

[0002] As a conventional multilayer ceramic capacitor, Japanese Patent Laid-Open Publication No. 2006-179873 (Patent Document 1) discloses a configuration including a laminate in which a plurality of dielectric layers and a plurality of internal electrode layers are stacked, chip protection members provided on both side surfaces of the laminate, and a pair of external electrodes provided on both end surfaces of the laminate.

[0003] The internal electrode layers each include an opposing portion facing an electrode layer adjacent to the internal electrode layers in the stacking direction, and an extension portion extending from the opposing portion to an end face of the laminate. The width of the extension portion is narrower than the width of the opposing portion. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-179873 Summary of the Invention [Problem to be solved by the invention]

[0005] In recent years, multilayer ceramic capacitors have become smaller and larger in capacitance. As a result, while the size of the multilayer ceramic capacitor itself has decreased, the internal electrode layers embedded inside it have become larger. As a result, the volume of the areas other than the internal electrode layers has become increasingly smaller, and unless some measures are taken, there is a concern that the moisture resistance and flexural strength will decrease.

[0006] The present disclosure has been made in view of the above-mentioned problems, and an object of the present disclosure is to provide a multilayer ceramic capacitor that can improve moisture resistance and flexural strength. [Means for solving the problem]

[0007] The multilayer ceramic capacitor based on the present disclosure has a first main surface and a second main surface facing each other in the thickness direction, a first side surface and a second side surface facing each other in the width direction, and a first end surface and a second end surface facing each other in the length direction, and includes a body portion including a plurality of dielectric layers laminated in the thickness direction and a plurality of internal electrode layers containing Ni. Each of the plurality of internal electrode layers includes a facing portion facing the internal electrode layer disposed adjacent in the thickness direction, and a lead-out portion connected to the facing portion and drawn out to the first end surface or the second end surface. In the width direction, the width of the facing portion is larger than the width of the lead-out portion. The body portion includes a first region, a second region, and a third region in order from the inner side to the outer side in the width direction in each of a region from one end portion of the lead-out portion located on one side in the width direction to the first side surface, and a region from the other end portion of the lead-out portion located on the other side in the width direction to the second side surface. When the grain diameter of the plurality of dielectrics included in the first region is gr1, the grain diameter of the plurality of dielectrics included in the second region is gr2, and the grain diameter of the plurality of dielectrics included in the third region is gr3, the relationship of gr1 < gr2 < gr3 is satisfied.

[0008] In the multilayer ceramic capacitor based on the present disclosure, the amount of deviation in the width direction between the lead-out portions adjacent in the thickness direction may be 3 μm or more.

[0009] In the multilayer ceramic capacitor based on the present disclosure, the voids between the grains of the plurality of dielectrics included in the second region and the voids between the grains of the plurality of dielectrics included in the third region may be less than the voids between the grains of the plurality of dielectrics included in the first region.

[0010] In the multilayer ceramic capacitor based on the present disclosure, each of a region from one end portion of the facing portion located on one side in the width direction to the first side surface, and a region from the other end portion of the facing portion located on the other side in the width direction to the second side surface may be constituted by the second region and the third region. [Effects of the Invention]

[0011] According to the present disclosure, it is possible to provide a multilayer ceramic capacitor capable of improving moisture resistance and flexural strength. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a perspective view schematically illustrating the appearance of a multilayer ceramic capacitor according to an embodiment. [Figure 2] 1 is a perspective view schematically showing an element body of a multilayer ceramic capacitor according to an embodiment of the present invention; [Figure 3] FIG. 3 is an exploded perspective view for schematically explaining the configuration of the element body shown in FIG. 2. [Figure 4] FIG. 2 is a schematic cross-sectional view taken along line IV-IV shown in FIG. [Figure 5] FIG. 2 is a schematic cross-sectional view taken along line VV shown in FIG. [Figure 6] FIG. 6 is a schematic cross-sectional view taken along line VI-VI shown in FIG. [Figure 7] FIG. 7 is a schematic cross-sectional view taken along line VII-VII shown in FIG. [Figure 8] FIG. 2 is a schematic cross-sectional view for explaining details of the multilayer ceramic capacitor according to the embodiment. [Figure 9] 3 is a schematic cross-sectional view illustrating the shape of the element body portion on the end face side and the state of the lead portions of the internal electrode layers in the multilayer ceramic capacitor according to the embodiment. FIG. [Figure 10] 4 is a schematic cross-sectional view illustrating the outer shape of the element body at the center in the length direction and the state of the opposing portions of the internal electrode layers in the multilayer ceramic capacitor according to the embodiment. FIG. [Figure 11] 3 is a schematic cross-sectional view for explaining the detailed shape of the element body of the multilayer ceramic capacitor according to the embodiment. FIG. [Figure 12] 5 is a schematic cross-sectional view illustrating a shift in the width direction of lead portions of internal electrode layers in the multilayer ceramic capacitor according to the embodiment. FIG. [Figure 13] 5 is a schematic cross-sectional view illustrating a shift in the width direction of opposing portions of internal electrode layers in the multilayer ceramic capacitor according to the embodiment. FIG. [Figure 14] 3 is an enlarged schematic cross-sectional view showing an end portion in the width direction of a lead portion of the multilayer ceramic capacitor according to the embodiment. FIG. [Figure 15] 3 is a schematic cross-sectional view illustrating the grain diameter of the multilayer ceramic capacitor according to the embodiment. FIG. [Figure 16] FIG. 2 is a schematic cross-sectional view showing a detailed configuration of an external electrode of the multilayer ceramic capacitor according to the embodiment. [Figure 17] 3A to 3C are diagrams showing a step of providing a conductive pattern on an inner layer ceramic green sheet in a manufacturing process of the multilayer ceramic capacitor according to the embodiment. [Figure 18] 10A and 10B are diagrams illustrating a step of arranging ceramic paste for eliminating steps in the manufacturing process of the multilayer ceramic capacitor according to the embodiment. [Figure 19] 3A to 3C are diagrams showing a step of laminating a plurality of inner layer ceramic green sheets and a plurality of outer layer ceramic green sheets in a manufacturing process of the multilayer ceramic capacitor according to the embodiment. [Figure 20] 10A and 10B are views showing a step of cutting a structure in which a plurality of inner layer ceramic green sheets and a plurality of outer layer ceramic green sheets are thermocompression-bonded in a manufacturing process of the multilayer ceramic capacitor according to the embodiment. [Figure 21] FIG. 10 is a diagram showing a region in which a ceramic paste for eliminating steps is placed in an individual laminated chip. [Figure 22] 10 is a diagram showing an area where a predetermined component is segregated in a part of an internal electrode layer in an element part formed by firing a laminated chip coated with a side ceramic paste. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the embodiments described below, identical or common parts are designated by the same reference numerals in the drawings, and their description will not be repeated. In the drawings, the length direction of the element body portion described below is indicated by L, the width direction of the element body portion by W, and the thickness direction of the element body portion by T.

[0014] FIG. 1 is a perspective view schematically showing the appearance of a multilayer ceramic capacitor according to an embodiment. FIG. 2 is a perspective view schematically showing an element body of the multilayer ceramic capacitor according to an embodiment. FIG. 3 is an exploded perspective view for schematically explaining the configuration of the element body shown in FIG. 2. FIG. 4 is a schematic cross-sectional view taken along line IV-IV shown in FIG. 1. FIG. 5 is a schematic cross-sectional view taken along line VV shown in FIG. A multilayer ceramic capacitor 100 according to an embodiment will be described with reference to FIGS. 1 to 5.

[0015] As shown in FIGS. 1 to 5, the multilayer ceramic capacitor 100 according to the embodiment includes an element body 110, a first external electrode 120, and a second external electrode .

[0016] The element body 110 has a substantially rectangular parallelepiped shape and includes a first main surface 111 and a second main surface 112 that face each other in a thickness direction T, a first side surface 113 and a second side surface 114 that face each other in a width direction W that intersects with the thickness direction T, and a first end surface 115 and a second end surface 116 that face each other in a length direction L that intersects with the thickness direction T and the width direction W.

[0017] It is preferable that the corners and ridges of the element body 110 are rounded. Here, a corner is a portion where three faces of the element body 110 intersect, and a ridge is a portion where two faces of the element body 110 intersect.

[0018] The first external electrode 120 is provided on the first end surface 115. Specifically, the first external electrode 120 is formed over the entire first end surface 115, and is formed so as to extend from the first end surface 115 to the first main surface 111, the second main surface 112, the first side surface 113, and the second side surface 114.

[0019] The second external electrode 130 is provided on the second end surface 116. Specifically, the second external electrode 130 is formed over the entire second end surface 116, and is formed so as to extend from the second end surface 116 to the first main surface 111, the second main surface 112, the first side surface 113, and the second side surface 114.

[0020] The detailed configurations of the first external electrode 120 and the second external electrode 130 will be described later with reference to FIG.

[0021] The element body 110 includes a laminate 101, a first side margin S1, and a second side margin S2.

[0022] The laminate 101 has a pair of main surfaces 101a, 101b facing each other in the thickness direction T, a pair of side surfaces 101c, 101d facing each other in the width direction, and a pair of end surfaces 101e, 101f facing each other in the length direction. The pair of main surfaces 101a, 101b constitute a part of the first main surface 111 and the second main surface 112 of the element body part 110. The side surface 101c is covered by a first side margin part S1, and the side surface 101d is covered by a second side margin part S2. The pair of end surfaces 101e, 101f constitute a part of the first end surface 115 and the second end surface 116 of the element body part 110.

[0023] The laminate 101 has a plurality of dielectric layers 140 and a plurality of internal electrode layers 150 alternately stacked along the thickness direction T.

[0024] The plurality of internal electrode layers 150 includes a plurality of first internal electrode layers 151 and a plurality of second internal electrode layers 152. The plurality of first internal electrode layers 151 and the plurality of second internal electrode layers 152 are alternately stacked in the thickness direction T.

[0025] The plurality of first internal electrode layers 151 are extended to the first end surface 115. The plurality of first internal electrode layers 151 are connected to the first external electrode 120. The plurality of second internal electrode layers 152 are extended to the second end surface 116. The plurality of second internal electrode layers 152 are connected to the second external electrode 130. Both end portions in the width direction W of the plurality of first internal electrode layers 151 and the plurality of second internal electrode layers 152 are exposed to the side surfaces 101c, 101d.

[0026] Although Figures 3 to 5 show an example in which seven first internal electrode layers 151 and seven second internal electrode layers 152 are provided, the number of each of the first internal electrode layers 151 and the second internal electrode layers 152 is not limited to seven.

[0027] Each of the plurality of dielectric layers 140 is made of a dielectric ceramic material containing, for example, a perovskite compound containing Ba and Ti as a main component. The dielectric layer 140 may also contain Si, Mg, Mn, V, Cr, and rare earth elements as additives.

[0028] Each of the first internal electrode layer 151 and the second internal electrode layer 152 contains Ni. Each of the first internal electrode layer 151 and the second internal electrode layer 152 may further contain dielectric particles having the same composition as the ceramic contained in the dielectric layer 140. Furthermore, each of the first internal electrode layer 151 and the second internal electrode layer 152 may contain Sn at the interface with the dielectric layer 140.

[0029] The laminate 101 is divided into an inner layer portion C, a first outer layer portion X1, a second outer layer portion X2, and a first end margin portion E1 and a second end margin portion E2. The inner layer portion C has a capacitance due to a first opposing portion 151C (described later) of the first internal electrode layer 151 and a second opposing portion 152C (described later) of the second internal electrode layer 152 being stacked in the thickness direction T.

[0030] The first outer layer portion X1 and the second outer layer portion X2 sandwich the inner layer portion C in the thickness direction T. The first outer layer portion X1 is located outside the inner layer portion C in the thickness direction T, on the first main surface 111 side. The second outer layer portion X2 is located outside the inner layer portion C in the thickness direction T, on the second main surface 112 side.

[0031] The first outer layer portion X1 and the second outer layer portion X2 are made of a dielectric ceramic material containing a perovskite compound containing Ba and Ti as a main component. The first outer layer portion X1 and the second outer layer portion X2 may be made of the same dielectric ceramic material as the plurality of dielectric layers 140, or may be made of a dielectric ceramic material different from that of the plurality of dielectric layers 140.

[0032] The first end margin E1 and the second end margin E2 sandwich the inner layer portion C in the longitudinal direction L. The first end margin E1 is located outside the inner layer portion C in the longitudinal direction L, on the side of the first end face 115. The second end margin E2 is located outside the inner layer portion C in the longitudinal direction L, on the side of the second end face 116.

[0033] The first side margin S1 is provided on a side surface 101c of the laminate. The first side margin S1 is provided so as to cover the entire side surface 101c. The first side margin S1 exists in the element body portion 110 from one end of the internal electrode layer 150 located on one side in the width direction W to the first side surface 113.

[0034] The second side margin portion S2 is provided on the side surface 101d of the laminate. The second side margin portion S2 is provided so as to cover the entire side surface 101d. The second side margin portion S2 exists in the element body portion 110 from the other end of the internal electrode layer 150 located on the other side in the width direction W to the second side surface 114.

[0035] The first side margin portion S1 and the second side margin portion S2 are made of a dielectric ceramic material whose main component is a perovskite compound containing Ba and Ti. The first side margin portion S1 and the second side margin portion S2 may be made of the same dielectric ceramic material as the plurality of dielectric layers 140, or may be made of a different dielectric ceramic material from the plurality of dielectric layers 140.

[0036] The first side margin portion S1 and the second side margin portion S2 may be, for example, a dielectric material manufactured by a solid phase method. In this case, no voids exist in the grains (granular matter) included in the first side margin portion S1 and the second side margin portion S2.

[0037] The first side margin portion S1 and the second side margin portion S2 may contain Si and / or Mg. The first side margin portion S1 and the second side margin portion S2 may also contain Mn.

[0038] Si segregates in the first side margin S1 and the second side margin S2. The Si segregation can be confirmed by observing the cross section using, for example, SEM / EDX. Mn segregation can be confirmed by observing the main components, such as Ti or Ba, using EPMA or the like.

[0039] The first side margin portion S1 and the second side margin portion S2 may be composed of multiple layers. The multiple layers do not necessarily require that the interface between the layers be observed. For example, the grain size may be different between the side surface and the internal electrode layer 150, i.e., the grain size may vary in the width direction. The grain size can be measured using an electron microscope such as a TEM. For example, the area of ​​each grain within a field of view is measured within an area of ​​approximately 10 μm × 10 μm. The circle-equivalent diameter is calculated by converting the area of ​​each grain into a circle-equivalent diameter, and the average of the circle-equivalent diameters is used as the grain size.

[0040] As described above, the size of the multilayer ceramic capacitor 100 including the element body 110, the first external electrode 120, and the second external electrode 130 is not particularly limited, but may fall within the following ranges, for example.

[0041] The dimension of the multilayer ceramic capacitor 100 in the length direction L (length dimension L0) is, for example, 0.2 mm or more and 4.5 mm or less. The dimension of the multilayer ceramic capacitor 100 in the width direction W (width dimension W0) is, for example, 0.125 mm or more and 3.2 mm or less. The dimension of the multilayer ceramic capacitor 100 in the thickness direction T (thickness dimension T0) is, for example, 0.125 mm or more and 2.5 mm or less.

[0042] The multilayer ceramic capacitor 100 has, for example, a length L of 0.2 mm, a width W of 0.125 mm, and a thickness T of 0.125 mm, or a length L of 0.4 mm, a width W of 0.2 mm, and a thickness T of 0.2 mm, or a length L of 0.6 mm, a width W of 0.3 mm, and a thickness T of 0.3 mm, or a length L of 1.0 mm, a width W of 0.5 mm, and a thickness T of 0.5 mm, or a length L of 3.2 mm, a width W of 1.6 mm, and a thickness T of 1.6 mm, or a length L of 4.5 mm, a width W of 3.2 mm, and a thickness T of 2.5 mm. Note that tolerances are taken into account in the above sizes.

[0043] Fig. 6 is a schematic cross-sectional view taken along the line VI-VI shown in Fig. 4. The shape of the first internal electrode layer 151 will be described with reference to Fig. 6.

[0044] As shown in FIG. 6, the first internal electrode layer 151 includes a first opposing portion 151C and a first lead portion 151X. The first opposing portion 151C faces the adjacent second internal electrode layer 152 in the thickness direction T. The first lead portion 151X connects the first opposing portion 151C and the first external electrode 120. The first lead portion 151X is led to the first end surface 115. A width W1 of the first opposing portion 151C in the width direction W is larger than a width W2 of the first lead portion 151X in the width direction W. The first opposing portion 151C and the first lead portion 151X are integrally formed.

[0045] Fig. 7 is a schematic cross-sectional view taken along the line VII-VII shown in Fig. 4. The shape of the second internal electrode layer 152 will be described with reference to Fig. 7.

[0046] As shown in FIG. 7, the second internal electrode layer 152 includes a second opposing portion 152C and a second lead portion 152X. The second opposing portion 152C faces the adjacent first internal electrode layer 151 in the thickness direction T. The second lead portion 152X connects the second opposing portion 152C and the second external electrode 130. The second lead portion 152X is led to the second end surface 116. The width W3 of the second opposing portion 152C in the width direction W is larger than the width W4 of the second lead portion 152X in the width direction W. The second opposing portion 152C and the second lead portion 152X are integrally formed.

[0047] When the first lead portion 151X and the second lead portion 152X are not particularly distinguished, they may simply be referred to as lead portions, and when the first opposing portion 151C and the second opposing portion 152C are not particularly distinguished, they may simply be referred to as opposing portions. Similarly, when the first internal electrode layer 151 and the second internal electrode layer 152 are not particularly distinguished, they may simply be referred to as internal electrode layers. When the first external electrode 120 and the second external electrode 130 are not particularly distinguished, they may simply be referred to as external electrodes.

[0048] 8 is a schematic cross-sectional view for explaining details of the internal electrode layers of the multilayer ceramic capacitor according to the embodiment. Details of the multilayer ceramic capacitor 100 will be explained with reference to FIG.

[0049] Within the element body 110 in the portion sandwiched in the thickness direction T by the first external electrode 120 provided on the first main surface 111 and the second main surface 112, and within the element body 110 in the portion sandwiched in the thickness direction T by the second external electrode 130 provided on the first main surface 111 and the second main surface 112, some of the multiple internal electrode layers 150 have a shape that bulges toward one of the main surfaces of the first main surface 111 and the second main surface 112.

[0050] Specifically, for example, on the first end face 115 side, the lead-out portion side of the internal electrode layer 150 arranged closest to the first main surface 111 bulges out towards the first main surface 111 side.

[0051] On the second end face 116 side, the lead-out portion side of the internal electrode layer 150 arranged one layer closer to the second main surface 112 than the internal electrode layer 150 arranged closest to the first main surface 111 bulges out towards the first main surface 111. On the other hand, the internal electrode layer 150 located closest to the second main surface 112 has a flat shape.

[0052] The internal electrode layers 150 bulging out toward the first main surface 111 are not limited to the internal electrode layer 150 arranged closest to the first main surface 111 and the internal electrode layer 150 adjacent thereto. For example, the internal electrode layers 150 from the internal electrode layer 150 arranged closest to the first main surface 111 to the third layer may be curved toward the second main surface 112. Of all the multiple internal electrode layers 150, 20% or less of the internal electrode layers 150 arranged closest to the first main surface 111 may bulge out toward the first main surface 111.

[0053] Within the element body 110 in the portion sandwiched in the thickness direction T by the first external electrode 120 provided on the first main surface 111 and the second main surface 112, the portion of the internal electrode layer 150 that bulges toward the first main surface 111 is not limited to the lead-out portion, but may also include the opposing portion of the portion located on the lead-out portion side.

[0054] Furthermore, a part of the internal electrode layer 150 that does not have a lead portion provided on the first end face 115 side may bulge toward the first main surface 111. In this case, the end side of the internal electrode layer 150 that is located opposite to the side where the lead portion is located bulges.

[0055] The same applies to the inside of the element body 110 in the portion sandwiched in the thickness direction T between the second external electrodes 130 provided on the first main surface 111 and the second main surface 112.

[0056] By curving some of the internal electrode layers 150 toward the first main surface 111, the contact area between the internal layer portion C and the first external layer portion X1 can be increased, thereby suppressing interlayer peeling between the internal layer portion C and the first external layer portion X1.

[0057] The first end face 115 and the second end face 116 have a shape that recesses inward in the length direction L toward the center in the thickness direction T. This increases the contact area between the first end face 115 and the first external electrode 120, and the contact area between the second end face 116 and the second external electrode 130. As a result, the connection efficiency between the internal electrode layer 150 and the first external electrode 120 and the second external electrode 130 can be improved.

[0058] On the first end face 115 side, in the region of the element body 110 where adjacent internal electrode layers 150 do not overlap in the thickness direction T (the region outside the region where adjacent internal electrode layers 150 overlap in the thickness direction T), if the region up to the first end face 115 is defined as Lgap, the length of Lgap along the longitudinal direction L increases as one moves from the first main surface 111 toward the second main surface 112.

[0059] Specifically, for example, the length of Lgap from the internal electrode layer 150 located in the fourth layer from the first main surface 111 side to the first end surface 115 is longer than the length of Lgap from the internal electrode layer 150 located in the second layer from the first main surface 111 side to the first end surface 115. At least, the Lgap from the internal electrode 150 located closest to the second main surface 112 side to the first end surface 115 is longer than the Lgap from the internal electrode 150 located closest to the first main surface 111 side to the first end surface 115.

[0060] By increasing the length of Lgap in this way, even if a crack occurs in Lgap of the element part 110, it is possible to prevent the multilayer ceramic capacitor 100 from short-circuiting.

[0061] The relationship between the shape and length described above with reference to Figure 8 can be observed by exposing a cross section that passes through the center of the width of the element body 110 and is parallel to the length direction L and thickness direction T by polishing or the like, and then observing the cross section using an optical microscope, an electron microscope, etc. When observing with an optical microscope or an electron microscope, a bright field or a dark field is used as needed.

[0062] 9 is a schematic cross-sectional view illustrating the shape of the element body 110 on the end face side and the state of the lead-out portions of the internal electrode layers in a multilayer ceramic capacitor according to an embodiment. Fig. 9 shows a cross section of the element body 110 on the first end face 115 side, parallel to the thickness direction T and the width direction W.

[0063] 9, the cross section of the element body part 110 parallel to the thickness direction T and width direction W is a substantially parallelogram shape. In this cross section, the four corners are rounded. By making the cross section a substantially parallelogram shape, the dimension in the thickness direction T can be reduced, and the multilayer ceramic capacitor 100 can be made smaller.

[0064] The plurality of first draw sections 151X may have a width in the width direction W that decreases toward one side in the thickness direction T. Specifically, the plurality of first draw sections 151X may have a width that decreases from the second main surface 112 side toward the first main surface 111 side. The same applies to the plurality of second draw sections 152X.

[0065] If the shortest distance in the width direction from the end of each of the plurality of first draw-out sections 151X to the first side surface 113 or the second side surface 114 is defined as Sgm, Sgm is, for example, 90 μm or more and 110 μm or less. Note that the numerical value of Sgm is not limited to the above.

[0066] 9 can be confirmed by polishing element body 110 until first end face 115 is exposed from the first external electrode 120 side, and observing a cross section of element body 110 parallel to thickness direction T and width direction W using an optical microscope, an electron microscope, or the like. When observing with an optical microscope or an electron microscope, a bright field or a dark field is used as needed.

[0067] 10 is a schematic cross-sectional view illustrating the outer shape of the element body 110 at the center in the longitudinal direction and the state of the opposing portions of the internal electrode layers in a multilayer ceramic capacitor according to an embodiment. Fig. 10 shows a cross section of the element body 110 parallel to the thickness direction T and width direction W at the center of the element body 110 in the longitudinal direction L.

[0068] As shown in FIG. 10, at least one of the internal electrode layers 150, which is within 20% of the number of the internal electrode layers 150 located closest to the first main surface 111 toward the center in the thickness direction, protrudes outward in the width direction W from the internal electrode layer 150 located in the center in the thickness direction.

[0069] At least one of the internal electrode layers 150, which is within 20% of the number of the internal electrode layers 150 located closest to the second main surface 112 toward the center in the thickness direction, protrudes outward in the width direction W from the internal electrode layer 150 located in the center in the thickness direction.

[0070] In this way, the internal electrode layers 150 protruding in the width direction are provided on the first main surface 111 side and the second main surface 112 side, so that the side surfaces 101c, 101d of the laminate 101 have an uneven shape. This increases the contact area between the side surfaces 101c, 101d and the first side margin portion S1 and the second side margin portion S2. This makes it possible to prevent the first side margin portion S1 and the second side margin portion S2 from peeling off from the laminate 101.

[0071] In a cross section of the element body 110 parallel to the thickness direction T and the width direction W at the center of the element body 110 in the thickness direction L, the amount of misalignment in the width direction W between internal electrode layers 150 adjacent to each other in the thickness direction T is less than 3 μm.

[0072] When the shortest distance from the end of the plurality of internal electrode layers 150 (more specifically, the opposing portion) in the width direction to the first side surface 113 or the second side surface 114 is defined as Sgc, Sgc is, for example, 10 μm or more and 20 μm or less. Note that the numerical value of Sgc is not limited to the above.

[0073] The above-mentioned Sgm is preferably at least five times the above-mentioned Sgc, thereby improving the moisture resistance reliability of the multilayer ceramic capacitor 100.

[0074] In a cross section of the body part 110 parallel to the thickness direction T and the width direction W at the center of the body part 110 in the length direction L, the first side surface 113 and the second side surface 114 have a shape that is concave inward in the width direction W as it approaches the center of the thickness direction T.

[0075] The relationship between the shape and length described above with reference to Figure 10 can be confirmed by polishing the element body 110 from the first external electrode 120 side to the center in the length direction L, and observing a cross section of the element body 110 parallel to the thickness direction T and width direction W using an optical microscope, an electron microscope, or the like. When observing with an optical microscope or an electron microscope, a bright field or a dark field is used as needed.

[0076] 11 is a schematic cross-sectional view for explaining the detailed shape of the element body of the multilayer ceramic capacitor according to the embodiment. Note that Fig. 11 shows a cross section of the element body 110 passing through the center in the width direction W and parallel to the thickness direction T and the length direction L.

[0077] 11 , at both end sides in the length direction L, the first main surface 111 and the second main surface 112 bulge outward in the thickness direction T. The element part 110 has thick parts at both end sides in the length direction L that are thicker than the central part in the length direction L. More specifically, the region of the element part 110 where the lead part overlaps in the thickness direction has a thick part that is thicker than the central part of the element part 110 in the length direction L. The thickness h2 of the thick parts is thicker than the thickness h1 of the central part of the element part 110 in the length direction L.

[0078] As will be described later, the thick portion is formed in a region where a ceramic paste for eliminating steps is placed on the conductive paste that will become the internal electrode layer 150 in the manufacturing process.

[0079] The body portion 110 is configured so that its thickness gradually increases from a position about a length W6 inward from the end of the inner layer portion C in the longitudinal direction L, and gradually decreases from the position where it is thickest toward the end face. The length W6 is approximately 5 μm or less.

[0080] By providing the thick portion as described above, the area covered by the first external electrode 120 or the second external electrode 130 from the first main surface 111 side to the end of the lead portion located closest to the first main surface 111 is longer, as shown by arrow AR1, compared to a configuration in which no thick portion is provided. This makes it difficult for moisture that penetrates from the tip side of the first external electrode 120 or the second external electrode 130 located on the first main surface 111 to reach the end of the lead portion. As a result, the moisture resistance reliability of the multilayer ceramic capacitor 100 can be improved.

[0081] Fig. 12 is a schematic cross-sectional view illustrating the widthwise displacement of the lead portions of the internal electrode layers in a multilayer ceramic capacitor according to an embodiment. Note that Fig. 12 is illustrated for convenience in illustrating the amount of displacement of the lead portions, and the shape of the element body 110, the positions of the lead portions, and the like are not limited to the embodiment shown in Fig. 12.

[0082] 12, the misalignment D1 in the width direction W between the first draw portion 151X located closest to the first side surface 113 and the first draw portion 151X located closest to the second side surface 114 among the multiple first draw portions 151X is 3 μm or more. The misalignment in the width direction between adjacent first draw portions 151X is also 3 μm or more. The misalignment amounts in the multiple second draw portions 152X are the same as those of the first draw portion 151X.

[0083] As described above, by setting the offset between adjacent lead portions in the thickness direction to 3 μm or more, when moisture penetrates from the tip sides of the first external electrode 120 and the second external electrode 130 to the interface between the first external electrode 120 and the second external electrode 130 and the first main surface 111 and attempts to reach a lead portion other than the lead portion located closest to the first main surface, the path length from the tip to the other lead portion increases. This also makes it more difficult for moisture to reach the lead portions, thereby improving the moisture resistance reliability of the multilayer ceramic capacitor 100. Furthermore, by offsetting the lead portions adjacent to each other in the thickness direction T in the width direction, the ends of the lead portions are less likely to come close to each other. This prevents short-circuiting between the lead portions and improves the reliability of the multilayer ceramic capacitor 100.

[0084] At both end portions 151t1 and 151t2 in the width direction W of each of the plurality of first lead portions 151X, Si or Mg is segregated.

[0085] The widthwise ends of the multiple first lead portions 151X are not aligned in the thickness direction T, but are offset in the width direction W. In this case, a part of the internal electrode layer 150 adjacent in the thickness direction may be close to one of both widthwise end portions 151t1, 151t2 of the multiple first lead portions 151X. The segregation of Si or Mg at both end portions 151t1, 151t2 improves the insulation of both end portions 151t1, 151t2, and can prevent short-circuiting between the internal electrode layers 150 adjacent in the thickness direction. As a result, the reliability of the multilayer ceramic capacitor 100 can be improved.

[0086] Si or Mg is also segregated at the widthwise end portions of the second draw-out portions 152X, and the same effect as above can be obtained.

[0087] In each of the plurality of first lead portions 151X and the plurality of second lead portions 152X, Si or Mg is segregated on one main surface in the thickness direction. The main surface on one side in the thickness direction is the main surface on which ceramic paste for eliminating steps is applied in the manufacturing process of the multilayer ceramic capacitor 100, which will be described later. In this way, the segregation of Si or Mg on the main surface on one side in the thickness direction of the lead portion ensures insulation from the adjacent internal electrode layers 150. This improves the reliability of the multilayer ceramic capacitor 100.

[0088] The amount of Si or Mg segregated at the end of each of the plurality of lead portions in the width direction is greater than the amount of Si or Mg segregated at one main surface of the lead portion in the thickness direction, thereby further improving the reliability of the multilayer ceramic capacitor 100.

[0089] In addition, each of the multiple internal electrode layers 150 has a non-connected end portion 150U (see Figure 22) that is not connected to an external electrode on the opposite side in the longitudinal direction from the side on which the lead-out portion is located, and Si or Mg is segregated in the non-connected end portion 150U as well.

[0090] Fig. 13 is a schematic cross-sectional view for explaining the widthwise misalignment of the opposing portions of the internal electrode layers in the multilayer ceramic capacitor according to the embodiment. Note that Fig. 12 is illustrated for convenience in explaining the amount of misalignment of the opposing portions, and the shape of the element body 110, the positions of the opposing portions, etc. are not limited to the form shown in Fig. 13.

[0091] 13, the amount of misalignment D2 in the width direction W between the facing portion closest to the first side surface 113 and the facing portion closest to the second side surface 114 among the plurality of facing portions (more specifically, the plurality of first facing portions 151C and the plurality of second facing portions 152C) is smaller than 3 μm. The amount of misalignment D2 is smaller than the above-mentioned amount of misalignment D1, and satisfies the relationship D1>D2. The amount of misalignment in the width direction between adjacent facing portions is also smaller than 3 μm.

[0092] When the thickness of the opposing portion at the end in the width direction W is T1 and the thickness of the drawn-out portion at the end in the width direction is T2 (see FIG. 12), the relationship T1>T2 may be satisfied.

[0093] FIG. 14 is an enlarged schematic cross-sectional view showing an end portion in the width direction of a lead portion of the multilayer ceramic capacitor according to the embodiment.

[0094] As shown in FIG. 14 , an enlarged view of the end of the first lead portion 151X in the width direction W shows that the end portions are spaced apart in the width direction and extend intermittently in the width direction. The gaps between adjacent portions of the end portions spaced apart in the width direction are filled with the dielectric layer 140. Here, if the continuity of the end portions of the first lead portion 151X in the width direction W is C1 and the continuity of the end portions of the first opposing portion 151C in the width direction W is C2, then the relationship C1 > C2 is satisfied. As a result, a larger proportion of the dielectric layer 140 fills the gaps at the end portions on the first opposing portion 151C side, and adjacent dielectric layers 140 are firmly fixed to each other, sandwiching the internal electrode layer 150. As a result, interlayer delamination between the internal electrode layer 150 and the dielectric layer 140 can be suppressed. The same continuity relationship applies to the second lead portion 152X and the second opposing portion 152C.

[0095] The continuity of the end portions of the first lead portions 151X and the first opposing portions 151C can be measured as follows. First, the first external electrode 120 is polished so that the first lead portions 151X are exposed in a cross section of the multilayer ceramic capacitor 100 parallel to the width direction and thickness direction. As the first lead portions 151X to be measured, some of the first lead portions 151X located toward the center in the thickness direction T are selected from the multiple first lead portions 151X.

[0096] At the end of the selected first draw section 151X, the area from the outermost position in the width direction W to the area W10 inward is examined using SEM / EDX, and the widths W11 and W12 of the area where Ni is not detected are measured. For each of the selected first draw sections 151X, the value obtained by (W10-(W11+W12)) / W10 (i.e., the value obtained by subtracting the sum of the widths of the areas where Ni is not detected from the width of the measurement range, and dividing the resulting value by the width of the measurement range) is calculated, and the average of approximately 10 of these values, excluding outliers, is taken as continuity.

[0097] W10 can be set to, for example, about 20 μm, and can be set appropriately depending on the size of the multilayer ceramic capacitor 100.

[0098] The continuity of the first opposing portion 151C, the continuity of the second drawn-out portion 152X, and the continuity of the second opposing portion 152C can also be calculated in the same manner as above.

[0099] Fig. 15 is a schematic cross-sectional view illustrating the grain diameter of a multilayer ceramic capacitor according to an embodiment. Note that Fig. 15 is illustrated for convenience in illustrating the region of element body 110 and the grain diameter in that region, and the shape of element body 110, the position of the lead-out portion, and the like are not limited to the embodiment shown in Fig. 15. Fig. 15 also illustrates a state in which multiple dielectric layers 140 are produced by a solid-phase method.

[0100] As shown in Figure 15, the body part 110 includes a first region, a second region, and a third region, in that order from the inside of the width direction W to the outside of the width direction W, in each of the regions from one end of the draw-out part located on one side of the width direction W to the first side surface 113, and from the other end of the draw-out part located on the other side of the width direction W to the second side surface 114.

[0101] Specifically, the first region R1 is a portion of the element body 110 between the widthwise end of the first lead portion 151X located on the first side surface 113 side and the first side margin S1, or between the widthwise end of the first lead portion 151X located on the second side surface 114 side and the second side margin S2. The second region R2 and the third region R3 constitute the first side margin S1 or the second side margin S2 on one side and the other side in the width direction W, respectively. That is, the region from one side end of the opposing portion located on one side in the width direction W to the first side surface 113, and the region from the other side end of the opposing portion located on the other side in the width direction W to the second side surface 114, respectively, are constituted by the second region and the third region.

[0102] The width of the first region R1 in the width direction W is greater than the width of the second region R2 in the width direction W. The width of the second region R2 in the width direction W2 is greater than the width of the third region R3 in the width direction W.

[0103] Specifically, the width of the first region R1 is 50 μm or more. The width of the second region R2 is 10 μm or less. The width of the third region R3 is 3 μm or less. These widths are values ​​measured at the center in the thickness direction in a cross section of the element part 110 that is parallel to the width direction W and the thickness direction T and in which the first lead portion 151X is exposed.

[0104] Here, the first side margin portion S1 and the second side margin portion S2 have a larger amount of Mn than the dielectric layer 140 (more specifically, the dielectric layer 140 of the inner layer portion C) of the laminate 101. As a result, the grain diameter of the second side margin portion S2 is smaller than the grain diameter of the dielectric layer 140.

[0105] Specifically, when the grain diameter of the plurality of dielectrics included in the first region R1 is defined as gr1, the grain diameter of the plurality of dielectrics included in the second region R2 is defined as gr2, and the grain diameter of the plurality of dielectrics included in the third region R3 is defined as gr3, the relationship gr1>gr2>gr3 is satisfied. The grain diameters are defined as the circle-equivalent diameters described above.

[0106] When the grain diameter is small, the density of the dielectric increases. By reducing the grain diameter (more specifically, gr3) of the dielectric located on the outer side in the width direction W, the density of the dielectric can be improved on the first side face 113 and second side face 114 sides. This makes it possible to suppress the intrusion of moisture from the first side face 113 and second side face 114 sides, thereby improving the moisture resistance of the multilayer ceramic capacitor 100. Furthermore, by achieving the above-mentioned relationship of gr1>gr2>gr3, the flexural strength can be increased.

[0107] As described above, when the dielectric layer 140 and the side margins are fabricated using a solid-phase process, no voids exist within the grains, and gaps are formed between the grains. The holes formed within the grains are defined as voids, and the gaps formed between the grains are defined as voids. The voids between the grains refer to, for example, triple points.

[0108] The amount of voids between the plurality of dielectric grains included in the second region R2 and the third region R3 is smaller than the amount of voids between the plurality of dielectric grains included in the first region R1.

[0109] By reducing the amount of voids on the first side surface 113 and the second side surface 114 side, it is possible to suppress the intrusion of moisture from the first side surface 113 and the second side surface 114 side. As a result, it is possible to improve the moisture resistance and reliability of the multilayer ceramic capacitor 100.

[0110] On the other hand, when the plurality of dielectric layers 140 are produced using hydrothermal synthesis, the grain diameter of the dielectric layers 140 (more specifically, the dielectric layers 140 in the inner layer portion C) of the laminate 101 is smaller than the grain diameter of the second side margin portion S2. In this case, voids may be provided within the grains of the dielectric layers 140.

[0111] The pores or voids mentioned above can be observed using an electron microscope such as SEM or TEM.

[0112] Fig. 16 is a schematic cross-sectional view showing a detailed configuration of the external electrodes of the multilayer ceramic capacitor according to the embodiment. The detailed configuration of the external electrodes will be described with reference to Fig. 16. The first external electrode 120 and the second external electrode 130 have almost the same configuration.

[0113] As shown in FIG. 16, the first external electrode 120 and the second external electrode 130 include a Cu layer 121 provided on the element body 110, a Ni plating layer 122 provided on the Cu layer 121, and a Sn plating layer 123 provided on the Ni plating layer 122.

[0114] The Cu layer 121 has a first layer portion 125 connected to the plurality of first lead portions 151X or the plurality of second lead portions 152X, and a second layer portion 126 covering the first layer portion 125.

[0115] The first layer 125 is a so-called Cu-rich layer, and has a higher Cu content than the second layer 126. The first layer 125 extends along the thickness direction T on the first end face 115 or the second end face 116. The second layer 126 is a so-called glass-rich layer, and has a higher glass content than the first layer 125.

[0116] The first layer 125 has high continuity in the thickness direction T. In a cross section of the multilayer ceramic capacitor 100 passing through the center in the width direction and parallel to the thickness and length directions, the first layer 125 extends along the thickness direction T so as to bridge between adjacent lead-out portions in the thickness direction T. Note that, in the above description, "high continuity" means that Cu is in contact with the exposed portions of the end faces of the internal electrode layers, and these are continuously connected in a layered manner in the thickness direction. The first layer 125 plays a role in ensuring connectivity with the internal electrode layers 150. The Cu contained in the first layer 125 can be made continuous by micronizing the Cu powder in the Cu paste used for the Cu layer and appropriately adjusting the sintering conditions.

[0117] The first layer 125 of the first external electrode 120 is connected to the plurality of first lead portions 151X. The first layer 125 of the first external electrode 120 is a layer in which Cu is continuous so as to connect adjacent first lead portions 151X.

[0118] In a cross section of the multilayer ceramic capacitor 100 passing through the center in the width direction and parallel to the thickness direction and length direction, the first layer portion 125 of the first external electrode 120 extends in the thickness direction T so as to connect 80% or more of the multiple first lead portions 151X.

[0119] The first layer 125 of the second external electrode 130 is connected to the plurality of second lead portions 152X. The first layer 125 of the second external electrode 130 is a layer in which Cu is continuous so as to connect the adjacent second lead portions 152X.

[0120] In a cross section of the multilayer ceramic capacitor 100 passing through the center in the width direction and parallel to the thickness direction and length direction, the first layer portion 125 of the second external electrode 130 extends in the thickness direction T so as to connect 80% or more of the multiple second lead portions 152X.

[0121] Ni is diffused in the first layer 125. As described above, the multiple internal electrode layers 150 contain Ni, and Ni diffuses from the first lead portion 151X and the second lead portion 152X into the first layer 125. In the first layer 125, the concentration of Ni increases toward the element body portion 110. By diffusing Ni in this manner, even if the widths of the first lead portion 151X and the second lead portion 152X are small, the connectivity between the first layer 125 and the first lead portion 151X and the second lead portion 152X can be improved.

[0122] In a cross section of the multilayer ceramic capacitor 100 that passes through the center in the width direction W and is parallel to the thickness direction T and the length direction L, the thickness of the first layer 125 along the length direction L at the center in the thickness direction T is 25% or less of the entire thickness of the Cu layer 121 along the length direction L at the center in the thickness direction T. The thickness of the first layer 125 is preferably 5% or less of the entire thickness of the Cu layer 121.

[0123] The first layer 125 can be observed using SEM / EDX. The degree of Ni diffusion in the first layer 125 can be detected by composition analysis such as WDX or EDX in the cross section.

[0124] The second layer 126 contains Cu and glass. The glass occupies 10% or more of the cross-sectional area of ​​the second layer 126 in a cross section of the multilayer ceramic capacitor 100 that passes through the center in the width direction and is parallel to the thickness direction and length direction. More specifically, the glass may occupy 25% or more of the cross-sectional area of ​​the second layer 126 in the cross section. The inclusion of Cu in the second layer 126 makes it easier to adsorb hydrogen, improving reliability.

[0125] In a cross section of the multilayer ceramic capacitor 100 that passes through the center in the width direction W and is parallel to the thickness direction T and the length direction L, the thickness of the second layer 126 along the length direction L at the portion where the first external electrode 120 is thickest in the length direction L is 75% or more of the thickness of the Cu layer 121 along the length direction. This allows the second layer 126 to sufficiently adsorb hydrogen. The thickness of the second layer 126 can be measured using an SEM or the like.

[0126] (Manufacturing method) 17 to 19 are diagrams showing predetermined steps for manufacturing the multilayer ceramic capacitor according to the embodiment. A method for manufacturing the multilayer ceramic capacitor 100 will be described with reference to FIGS.

[0127] First, a ceramic slurry containing ceramic powder, a binder, and a solvent is prepared when manufacturing the multilayer ceramic capacitor 100. The ceramic powder can be synthesized by a known method such as a solid phase method or a hydrothermal synthesis method.

[0128] The ceramic slurry is formed into sheets on a carrier film using a die coater, gravure coater, microgravure coater, or the like, to produce ceramic green sheets 23 for inner layers and ceramic green sheets 26 for outer layers, which will be described later.

[0129] FIG. 17 is a diagram showing a step of providing a conductive pattern on an inner layer ceramic green sheet in the manufacturing process of the multilayer ceramic capacitor according to the embodiment.

[0130] Next, as shown in FIG. 17, a plurality of strip-shaped conductive patterns 24 extending in a predetermined direction are formed on the inner layer ceramic green sheet 23. The plurality of strip-shaped conductive patterns 24 are arranged at intervals in an arrangement direction perpendicular to the extension direction of the conductive patterns 24. The conductive patterns 24 are portions that will become the internal electrode layers 150. Each strip-shaped conductive pattern 24 has a plurality of openings 24h that are spaced apart in the extension direction of the conductive pattern 24. The portions of the conductive pattern 24 located between adjacent openings 24h in the extension direction will become lead-out portions. The extension direction of the conductive patterns 24 is parallel to the width direction W. The arrangement direction is parallel to the length direction L.

[0131] The conductive pattern 24 is printed on the inner layer ceramic green sheet 23 by screen printing, inkjet printing, gravure printing or the like.

[0132] FIG. 18 is a diagram showing a step of arranging ceramic paste for eliminating steps in the manufacturing process of the multilayer ceramic capacitor according to the embodiment.

[0133] 18, ceramic paste 25 for eliminating steps is applied. Specifically, ceramic paste 25 is applied along the extending direction to regions on inner layer ceramic green sheets 23 where conductive patterns 24 are not formed, and ceramic paste 25 is also applied onto each conductive pattern 24 so as to fill multiple openings 24h aligned in the extending direction.

[0134] To facilitate alignment, the ceramic paste 25 is applied in a manner that partially overlaps the conductive pattern 24. In the arrangement direction in which the plurality of conductive patterns 24 are arranged, the ceramic paste 25 applied to the outside of each conductive pattern 24 preferably overlaps the conductive pattern 24 within a range of 5 μm from the end of the conductive pattern 24 in the arrangement direction.

[0135] The ceramic paste 25 is printed by, for example, screen printing, inkjet printing, or gravure printing.

[0136] The ceramic paste 25 may be formed of the same material as the inner layer ceramic green sheets 23, or may contain a different component. As described above, when Si or Mg is to be segregated at both widthwise ends of the drawn-out portion and on one main surface of the drawn-out portion in the thickness direction, Si and / or Mg is added to the ceramic paste 25.

[0137] In the above example, the ceramic paste 25 is applied after the conductive pattern 24 is applied, but the conductive pattern 24 may be applied after the ceramic paste 25 is applied.

[0138] 19 is a diagram showing a step of laminating a plurality of inner layer ceramic green sheets and a plurality of outer layer ceramic green sheets in a manufacturing process of a multilayer ceramic capacitor according to an embodiment. Note that in FIG. 19, the lamination of a plurality of inner layer ceramic green sheets 23 and a plurality of outer layer ceramic green sheets 26 is viewed from the direction of arrow XIX shown in FIG.

[0139] As shown in FIG. 19, a plurality of inner layer ceramic green sheets 23 and a plurality of outer layer ceramic green sheets 26, each having a conductive pattern 24 and a ceramic paste 25 applied thereto, are laminated.

[0140] The multiple inner layer ceramic green sheets 23 are stacked such that the strip-shaped conductive patterns 24 between adjacent inner layer ceramic green sheets 23 are shifted in the arrangement direction by half the printing pitch of the conductive patterns 24. Specifically, the multiple inner layer ceramic green sheets 23 are stacked such that the openings 24h of the conductive patterns 24 provided on the inner layer ceramic green sheets 23 adjacent in the stacking direction are alternately aligned in the arrangement direction when viewed from the stacking direction. The stacking method is approximately parallel to the thickness direction T, and the arrangement direction is approximately parallel to the length direction L.

[0141] A plurality of outer layer ceramic green sheets 26 are laminated on both sides of the laminated inner layer ceramic green sheets 23 in the lamination direction.

[0142] Subsequently, the stacked inner layer ceramic green sheets 23 and outer layer ceramic green sheets 26 are thermocompression bonded to form a structure 200 (see FIG. 20).

[0143] 20 is a diagram showing a step of cutting a structure formed by thermocompression bonding a plurality of inner layer ceramic green sheets and a plurality of outer layer ceramic green sheets in a manufacturing process of a multilayer ceramic capacitor according to an embodiment. Although Fig. 20 shows a schematic plan view of the structure, for convenience, outer layer ceramic green sheet 26 is omitted and only inner layer ceramic green sheet 23 having conductive pattern 24 formed thereon is shown in plan view.

[0144] Next, as shown in FIG. 20, the structure 200 is cut along cut lines CL1 and CL2 to cut out the laminated chip 10 (see FIG. 21). The cut line CL1 is parallel to the length direction L. The cut line CL2 is parallel to the width direction W. The structure 200 is cut by push cutting using a push cutting blade, dicing using a cutting blade, laser cutting, or the like. The laminated chip is the part that will become the laminate 101.

[0145] FIG. 21 is a diagram showing an area in which ceramic paste for eliminating steps is placed in an individual laminated chip.

[0146] Fig. 21 shows a cross section of the laminated chip 10 parallel to the length direction L and width direction, and the range of the conductive pattern 24 is indicated by a dashed line in Fig. 21. In the laminated chip 10, the conductive pattern 24 includes a lead-out region 24X that serves as a lead-out portion and a facing region 24C that serves as a facing portion.

[0147] The ceramic paste 25 for eliminating the step overlaps the conductive pattern 24 in regions R6 and R7. Region R6 is composed of a region where the lead-out region 24X is formed and a facing region 24C located closer to the lead-out region 24X. Region R7 is a region on the end side of the facing region 24C located opposite the side where the lead-out region 24X is located.

[0148] In this way, the conductive pattern 24 that becomes the internal electrode layer 150 and the ceramic paste 25 that forms part of the dielectric layer 140 overlap in regions R6 and R7, causing parts of the laminate 101 to bulge on both sides in the longitudinal direction L, as described above.

[0149] Furthermore, by adding Si and / or Mg to the ceramic paste 25 for eliminating the step, Si and / or Mg can be segregated in the regions R6 and R7 of the internal electrode layer 150.

[0150] Next, ceramic paste for the sides is applied to both widthwise end faces of the laminated chip 10. Specifically, the ceramic paste is filled into multiple recesses (grooves) provided on the application surface of the plate, and the widthwise end faces of the laminated chip 10 are brought into contact with the application surface. This allows the ceramic paste for the sides to be applied only to the end faces by capillary action. The applied ceramic paste for the sides is fired to form the first side margin portion S1 and the second side margin portion S2.

[0151] The ceramic paste for the sides may be made of the same material as the material of the inner layer ceramic green sheets 23, or may contain different components. By making the ceramic paste for the sides contain more Mn than the inner layer ceramic green sheets 23, the first side margin portion S1 and the second side margin portion S2 can be densified. The ceramic powder contained in the ceramic paste for the sides is synthesized, for example, by a solid phase method.

[0152] Next, the laminated chip 10 to which the ceramic paste for the sides has been applied is fired to form the element part 110.

[0153] Figure 22 is a diagram showing an area in which a specified component segregates in part of the internal electrode layer in an element body part according to an embodiment, formed by firing a laminated chip to which a ceramic paste for a specified component side has been applied.

[0154] As shown in FIG. 22, in the internal electrode layer 150 (more specifically, the first internal electrode layer 151) of the element body part 110, in the regions R6 and R7, Si and / or Mg contained in the ceramic paste 25 overlapping the conductive pattern 24 segregates.

[0155] In region R6, Si and / or Mg are segregated on one main surface of the first drawn portion 151X in the thickness direction and on one main surface of the first opposing portion 151C located on the first drawn portion 151X side. In particular, the amount of segregation of Si or Mg is larger in regions on both ends of the outer periphery of region R6 in the width direction W than in inner region R8 of region R6.

[0156] In region R7, Si and / or Mg segregate on one main surface of the first opposing portion 151C at the end opposite to the side facing the first lead portion 151X in the longitudinal direction L. In particular, in the first side margin S1, the second side margin S2, and the portion along the dielectric layer 140 in the outer periphery of region R7, the amount of Si or Mg segregation is greater than that in inner region R9 in region R7. That is, the amount of Si or Mg segregation is greater in the internal electrode layer at the non-connection end 150U that is located opposite to the side where the lead portion is located in the longitudinal direction L and that is not connected to an external electrode.

[0157] Incidentally, on the second internal electrode layer 152 side, Si and / or Mg are segregated as in the first internal electrode layer 151.

[0158] Next, the first external electrode 120 and the second external electrode 130 are formed on both end faces (first end face 115, second end face 116) of the element body 110, respectively. Specifically, a Cu paste containing atomized Cu particles is applied to both end faces of the element body 110. As an application method, for example, a method of forming a paste layer that will become the first layer on a plate and immersing the end faces in the paste layer can be used. The applied paste layer is baked, and plating is performed in the following order: Cu plating, Ni plating, and Sn plating.

[0159] Through the above steps, the multilayer ceramic capacitor 100 according to the embodiment can be manufactured.

[0160] The embodiments disclosed herein are illustrative in all respects and are not restrictive. The scope of the present invention is defined by the claims, and includes all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0161] 10 laminated chip, 23 ceramic green sheet for inner layer, 24 conductive pattern, 24C opposing region, 24X lead-out region, 24h opening, 25 ceramic paste, 26 ceramic green sheet for outer layer, 100 laminated ceramic capacitor, 101 laminate, 101a, 101b main surface, 101c, 101d side surface, 101e, 101f end surface, 110 element portion, 111 first main surface, 112 second main surface, 113 first side surface, 114 second side surface, 115 first end surface, 116 second end surface, 120 first external electrode, 121 Cu layer, 122 Ni plating layer, 123 Sn plating layer, 125 first layer portion, 126 second layer portion, 130 second external electrode, 140 dielectric layer, 150 internal electrode layer, 150U Non-connected end portion, 151 first internal electrode layer, 151C first opposing portion, 151X first lead-out portion, 151t1, 151t2 end portion, 152 second internal electrode layer, 152C second opposing portion, 152X second lead-out portion, 200 structure, C inner layer portion, CL1, CL2 cut line, E1 first end margin portion, E2 second end margin portion, R1 first region, R2 second region, R3 third region, R6, R7 regions, R8, R9 inner region, S1 first side margin portion, S2 second side margin portion, X1 first outer layer portion, X2 second outer layer portion.

Claims

1. the element portion has a first main surface and a second main surface opposed to each other in a thickness direction, a first side surface and a second side surface opposed to each other in a width direction, and a first end surface and a second end surface opposed to each other in a length direction, the element portion including a plurality of dielectric layers and a plurality of internal electrode layers containing Ni stacked in the thickness direction, each of the plurality of internal electrode layers includes an opposing portion opposing the internal electrode layer disposed adjacent thereto in the thickness direction, and a lead portion connected to the opposing portion and led to the first end face or the second end face; In the width direction, the width of the facing portion is larger than the width of the pull-out portion, the body portion includes a first region, a second region, and a third region, which are arranged in this order from an inner side in the width direction to an outer side in the width direction, in a region from one end of the pull-out portion located on one side in the width direction to the first side surface, and in a region from the other end of the pull-out portion located on the other side in the width direction to the second side surface, A multilayer ceramic capacitor in which, when a grain diameter of a plurality of dielectrics included in the first region is gr1, a grain diameter of a plurality of dielectrics included in the second region is gr2, and a grain diameter of a plurality of dielectrics included in the third region is gr3, the relationship of gr1<gr2<gr3 is satisfied.

2. 2. The multilayer ceramic capacitor according to claim 1, wherein the one-side ends of the lead portions adjacent to each other in the thickness direction are shifted from each other by 3 μm or more in the width direction.

3. 2. The multilayer ceramic capacitor according to claim 1, wherein gaps between the grains of the plurality of dielectric materials included in the second region and gaps between the grains of the plurality of dielectric materials included in the third region are smaller than gaps between the grains of the plurality of dielectric materials included in the first region.

4. 4. The multilayer ceramic capacitor according to claim 1, wherein a region from one end of the opposing portion located on one side in the width direction to the first side surface, and a region from the other end of the opposing portion located on the other side in the width direction to the second side surface are each formed by the second region and the third region.

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