Retainer, manufacturing method of retainer, mounting body, and manufacturing method of mounting body

Abstract

To provide a retainer having a structure that facilitates repair of a porous body in a gas passage of a holding substrate, and provide a manufacturing method of the retainer.SOLUTION: A retainer 100 of the present invention comprises: a plate-like member 11 that contains a first front surface S1 holding an object W and a second front surface S2 arranged to the side opposite to the first front surface S1, and has a ceramic as a main component; a mounting hole part 150 that is formed in the plate-like member 11 so as to contain a mounting port 151 that is opened to the first front surface S1 side, and a housing part 153 extended to the second front surface S2 side from the mounting port 151 side; a mounting frame part 50 that uses the ceramic as a main component, and is fixed to the housing part 153; and a mounting body 90 that uses the ceramic as a main component, is mounted into an inner side of the mounting frame part 50, and includes a porous body 70 extended to the second front surface S2 from the first front surface S1. An porosity of the porous body 70 is higher than a porosity of the mounting frame part 50, and an end part 50a on the first front surface S1 of the mounting frame part 50 and an end part 70a on the first front surface S1 of the porous body 70 are exposed from the mounting port 151.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a holding device, a method for manufacturing a holding device, an attachment, and a method for manufacturing an attachment. [Background technology]

[0002] Electrostatic chucks are known as holding devices that hold wafers (semiconductor wafers) when manufacturing semiconductors. Electrostatic chucks are equipped with a holding substrate (ceramic substrate) mainly made of insulating ceramics (e.g., alumina), and the wafer is held on the surface of the holding substrate by electrostatic attraction. The electrostatic attraction is generated by applying a voltage to a chuck electrode provided inside the holding substrate.

[0003] In this type of electrostatic chuck, in plasma processing such as plasma etching, a thermally conductive gas such as helium gas is supplied between the holding substrate and the wafer to remove heat from the wafer. For this reason, a gas flow path is formed inside the holding substrate of the electrostatic chuck to allow the thermally conductive gas supplied from the outside to flow toward the wafer. A plurality of gas outlets are provided on the surface of the holding substrate at the ends of the gas flow paths, and the thermally conductive gas is supplied toward the wafer from each gas outlet.

[0004] In addition, the high frequency power applied during plasma processing may cause abnormal discharge (arcing) in the gas flow passage, which may damage the wafer on the holding substrate. Therefore, in order to suppress such abnormal discharge, a gas-permeable porous body made of an insulating ceramic material is provided inside the gas flow passage. The porous body is, for example, a part of the gas flow passage, and is filled inside a vertical gas flow passage that extends straight from the gas outlet in the thickness direction of the holding substrate, with the upper surface exposed from the gas outlet. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent No. 4959905 Summary of the Invention [Problem to be solved by the invention]

[0006] In the conventional holding device, the porous body was sometimes formed integrally with the ceramic plate-like member constituting the holding substrate. In this case, first, a paste for the porous body is filled into a large number of holes for gas flow paths provided in a laminate of green sheets for the plate-like member by injection molding or the like. Then, by firing the laminate in a state in which each hole is filled with the paste, a holding substrate is obtained in which each porous body is filled in the corresponding gas flow path in the plate-like member. Since the paste for the porous body contains ceramic powder (alumina powder, etc.), when it is fired simultaneously with the laminate, the porous body obtained after firing is in a state of being integrally connected to the peripheral wall portion (accommodation portion) surrounding the hole portion formed in the ceramic plate-like member.

[0007] In this way, when the porous body is formed integrally with the ceramic plate-like member that constitutes the holding substrate, if a defect (discoloration, dents, etc.) occurs in the porous body after firing, it is difficult to replace the porous body with a new porous body, which is a problem.

[0008] An object of the present invention is to provide a holding device having a structure that allows easy repair of the porous body in the gas flow passage of the holding substrate, and a method for manufacturing the holding device. [Means for solving the problem]

[0009] The means for solving the above problems are as follows. <1> a plate-shaped member made primarily of ceramics, including a first surface for holding an object and a second surface disposed opposite the first surface; a mounting hole portion formed in the plate-shaped member to include a mounting opening opening on the first surface side and a storage portion extending from the mounting opening side to the second surface side; a mounting frame portion made primarily of ceramics and fixed to the storage portion; and a porous body made primarily of ceramics, disposed inside the mounting frame portion and extending from the first surface side to the second surface side, wherein the porosity of the porous body is higher than the porosity of the mounting frame portion, and an end portion of the mounting frame portion on the first surface side and an end portion of the porous body on the first surface side are exposed from the mounting opening.

[0010] <2> The plate-shaped member has a lateral gas flow passage formed therein, connected to the porous body, and extending parallel to the first surface. <1> A holding device as described in

[0011] <3> The mounting frame portion surrounds the porous body and has a cylindrical main body portion fixed to the housing portion, and an annular protruding portion disposed on the first surface side and protruding outward beyond the cylindrical main body portion. The housing portion includes a first housing portion that houses the protruding portion, and a second housing portion that includes a first annular peripheral surface that is disposed so as to surround the protruding portion and extends from the mounting opening to the second surface side, and an annular mounting surface that is disposed parallel to the first surface and on which the protruding portion is placed from the first surface side. <1> or <2> A holding device as described in

[0012] <4> The adhesive is interposed between the second peripheral surface and the outer peripheral surface of the cylindrical main body and fixes the second peripheral surface and the outer peripheral surface. <3> A holding device as described in

[0013] <5> The lateral gas flow passage has a bottom lateral flow passage portion that overlaps with an end face of the second surface side of the porous body when viewed in a plan view from the first surface side and has a contour larger than that of the end face of the second surface side of the porous body, and is disposed on the porous body side of a position of the adhesive interposed between the second peripheral surface and the outer peripheral surface of the cylindrical main body such that a position of the contour of the bottom lateral flow passage portion does not overlap a position of the adhesive interposed between the second peripheral surface and the outer peripheral surface of the cylindrical main body when viewed in a plan view from the first surface side. <4> A holding device as described in

[0014] <6> The mounting frame and the porous body constituting the mounting body are integrated by simultaneous firing. <1> or <2> A holding device as described in

[0015] <7> a porous body formed of a sintered body of the object to be processed, the porous body being a sintered body of the paste, and a frame-shaped portion arranged around the porous body, are integrally removed from the sintered body of the object to be processed after the firing step to obtain a mounting body; and an attachment step of attaching the obtained mounting body to a mounting hole portion formed in the plate-shaped member having a ceramic main component so as to include an attachment opening formed on one surface of the plate-shaped member and an accommodation portion extending from the attachment opening side to the other surface side of the plate-shaped member.

[0016] <8> A mounting body having a mounting frame portion whose main component is ceramics, and a porous body whose main component is ceramics and is arranged inside the mounting frame portion, wherein the porosity of the porous body is higher than the porosity of the mounting frame portion, and the mounting frame portion and the porous body are integrated by co-firing.

[0017] <9> A method for manufacturing a mounting body, comprising: a hole forming step of forming a hole penetrating in the thickness direction in a workpiece consisting of one green sheet or a laminate of two or more green sheets; a filling step of filling the hole with a paste for a porous body; a firing step of firing the workpiece with the hole filled with the paste; and a removal step of removing, after the firing step, a porous body consisting of a sintered body of the paste together with a frame-shaped portion arranged around the porous body from the sintered body of the workpiece to obtain a mounting body. Effect of the Invention

[0018] According to the present invention, it is possible to provide a holding device having a structure that allows easy repair of the porous body in the gas flow passage of the holding substrate, and a method for manufacturing the holding device. [Brief description of the drawings]

[0019] [Figure 1] FIG. 1 is a perspective view showing a schematic external configuration of a holding device according to a first embodiment; [Diagram 2] FIG. 1 is a cross-sectional view showing a schematic internal structure of a holding device according to a first embodiment; [Diagram 3] Top view of the holding board with the mounting body and surrounding area enlarged [Figure 4] Cross section of line AA in Figure 3 [Diagram 5] FIG. 1 is a schematic explanatory diagram showing a method for manufacturing a mounting body that is a part of a holding substrate. [Figure 6] FIG. 1 is a schematic diagram illustrating a method for manufacturing a holding substrate; [Figure 7] FIG. 1 is a schematic diagram illustrating a method for manufacturing a holding substrate; [Figure 8] FIG. 11 is an enlarged cross-sectional view of the vicinity of a mounting body provided on a holding substrate according to a second embodiment; [Figure 9] FIG. 11 is an enlarged cross-sectional view of the vicinity of a mounting body provided on a holding substrate according to a third embodiment; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] <Embodiment 1> A holding device 100 according to a first embodiment will be described below with reference to Figs. 1 to 7. The holding device 100 is an electrostatic chuck that attracts and holds an object (e.g., a wafer W) by electrostatic attraction. The electrostatic chuck is used as a table on which the wafer W is placed in a process of etching using plasma in a reduced pressure chamber, for example.

[0021] Fig. 1 is a perspective view showing a schematic external configuration of a holding device 100 according to the first embodiment, and Fig. 2 is a cross-sectional view showing a schematic internal structure of the holding device 100 according to the first embodiment. The holding device 100 includes a disk-shaped holding substrate (ceramic substrate) 10 and a disk-shaped base member 20 larger than the holding substrate 10. For example, when the holding substrate 10 is disk-shaped with a diameter of 300 mm and a thickness of 3 mm, the base member 20 is set to a disk-shaped with a diameter of 340 mm and a thickness of 20 mm. The holding substrate 10 and the base member 20 may each be provided with a positioning portion (such as a projection or recess) for mutual alignment.

[0022] The holding substrate 10 and the base member 20 are stacked on top of each other in the vertical direction, with the holding substrate 10 disposed on the upper side and the base member 20 disposed on the lower side. The holding substrate 10 and the base member 20 are bonded to each other by a bonding material 30 interposed therebetween.

[0023] The holding substrate 10 has a substantially circular first surface S1 disposed on the upper side, and a substantially circular second surface S2 disposed on the opposite side (i.e., the lower side) of the first surface S1 and facing the base member 20. The base member 20 has a substantially circular third surface S3 disposed on the upper side and facing the second surface S2 of the holding substrate 10, and a substantially circular fourth surface S4 disposed on the opposite side (i.e., the lower side) of the third surface S3. The above-mentioned bonding material 30 is sandwiched between the second surface S2 of the holding substrate 10 and the third surface S3 of the base member 20 and spread out in a layered state.

[0024] The holding substrate 10 includes a disk-shaped plate-like member 11 and a substrate-side gas flow path 12 formed inside the plate-like member 11. The upper surface of the plate-like member 11 serves as a first surface S1 of the holding substrate 10. The lower surface of the plate-like member 11 serves as a second surface S2 of the holding substrate 10.

[0025] The plate-shaped member 11 is a plate-shaped (disk-shaped) insulating member whose main component is ceramic. In this specification, the term "main component" means the component with the largest content. The plate-shaped member 11 in this embodiment is made of alumina (Al2O3). In other embodiments, the plate-shaped member 11 may be made of other ceramics such as aluminum nitride (AlN).

[0026] The substrate-side gas flow passage (an example of a gas flow passage) 12 constitutes a part of a flow passage 60 for flowing an inert gas (for example, helium gas, which is a thermally conductive gas) provided in the holding device 100. The substrate-side gas flow passage 12 is formed inside the plate-like member 11 of the holding substrate 10. The substrate-side gas flow passage 12 is a hole-like flow passage extending in the vertical direction (thickness direction) inside the holding substrate 10, including an inlet 12a arranged on the second surface S2 side of the holding substrate 10 and a gas outlet 12b arranged on the first surface S1 side. When the inert gas is supplied from the inlet 12a, the inert gas passes through the substrate-side gas flow passage 12 and is finally discharged to the outside from the gas outlet 12b.

[0027] Fig. 3 is a top view of the holding substrate 10 with the mounting body 90 and the vicinity enlarged, and Fig. 4 is a cross-sectional view taken along the line AA in Fig. 3. Fig. 4 shows a cross-sectional structure of the substrate-side gas flow passage 12 provided in the holding substrate 10, cut along the thickness direction of the holding substrate 10. As shown in Figs. 2 and 3, the substrate-side gas flow passage 12 includes a first vertical gas flow passage 120, a horizontal gas flow passage 130, and a second vertical gas flow passage 140.

[0028] The first vertical gas flow passage 120 includes a gas outlet 12b disposed on the first surface S1 side, and is a flow passage extending from the gas outlet 12b to the second surface S2 side along the thickness direction of the plate-like member 11. The first vertical gas flow passage 120 has a substantially cylindrical shape extending in the vertical direction, and is provided with an inlet 12c, which is an inlet of the first vertical gas flow passage 120 and has a diameter substantially the same as that of the gas outlet 12b, on the opposite side of the gas outlet 12b. A porous body 70, which will be described later, is filled and fixed in the first vertical gas flow passage 120. The first vertical gas flow passage 120 is composed of a section between the gas outlet 12b and the inlet 12c in the substrate-side gas flow passage 12.

[0029] The lateral gas flow passage 130 is formed inside the plate-like member 11, is connected to the porous body 70 in the first vertical gas flow passage 120, and is a flow passage extending parallel to the first surface S1. The downstream side of the lateral gas flow passage 130 is connected to the inlet 12c which is the upstream side of the first vertical gas flow passage 120. In the substrate-side gas flow passage 12, the inlet 12a side is the upstream side, and the gas outlet 12b is the downstream side.

[0030] The lateral gas flow passage 130 comprises a bottom lateral flow passage section 131 including a bottom 131a facing the porous body 70 filled in the first vertical gas flow passage 120, and a main body lateral flow passage section 132 connecting the bottom lateral flow passage section 131 and the second vertical gas flow passage 140.

[0031] The bottom 131a of the bottom horizontal passage section 131 has a substantially circular shape in plan view. In this embodiment, as shown in FIG. 3, the bottom 131a is set to be larger than the gas outlet 12b and the inlet 12c, which have a substantially circular shape in plan view. In FIG. 3, for convenience of explanation, the horizontal gas passages 130 (the bottom horizontal passage section 131 and the main body horizontal passage section 132) formed inside the plate-like member 11 are shown by dashed lines. The surface (bottom surface) of the bottom 131a is flat. The bottom horizontal passage section 131 has a substantially cylindrical peripheral wall section 131b that rises from the periphery of the bottom 131a toward the first surface S1 side. The peripheral wall section 131b has an opening 131c, which is connected to the downstream side of the main body horizontal passage section 132. The bottom horizontal channel portion 131 constitutes a flat channel that spreads in parallel to the first surface S1.

[0032] The main body horizontal passage section 132 forms an elongated passage extending parallel to the first surface S1, the upstream side of which is connected to the second vertical gas passage 140 and the downstream side of which is connected to the opening 131c of the bottom horizontal passage section 131.

[0033] The second vertical gas flow passage 140 includes an inlet 12a that opens to the second surface S2, and is a flow passage extending from the inlet 12a to the first surface S1 side along the thickness direction of the plate-like member 11. The downstream side of the second vertical gas flow passage 140 is connected to the upstream side of the horizontal gas flow passage 130. The inlet 12a forms the inlet of the substrate-side gas flow passage 12. The second vertical gas flow passage 140 has a substantially cylindrical shape extending in the vertical direction.

[0034] The holding substrate 10 also includes a gas-permeable porous body 70 mainly composed of ceramics, which is filled in the first vertical gas flow passage 120 that is a part of the substrate-side gas flow passage 12. The porous body 70 of this embodiment constitutes a mounting body 90 together with the mounting frame 50, and is attached to a mounting hole 150 formed in the plate-like member 11 in the state of the mounting body 90. Details of the porous body 70 and the like will be described later.

[0035] The holding substrate 10 further includes a chuck electrode 40 which is an electrode member. The chuck electrode 40 is generally planar (layered) and generally parallel to the first surface S1. The chuck electrode 40 is made of an electrically conductive material such as tungsten, molybdenum, or platinum. As shown in FIG. 2, the chuck electrode 40 is disposed on the first surface S1 side inside the holding substrate 10 (plate-like member 11). The chuck electrode 40 is connected to an external power source via a terminal or the like. When power is supplied to the chuck electrode 40, an electrostatic attraction is generated, and the wafer W is attracted and held on the first surface S1 of the holding substrate 10 by the electrostatic attraction. The chuck electrode 40 includes a through hole 41 which penetrates in the thickness direction (vertical direction). In other embodiments, a high-frequency electrode or a heater electrode may be provided as the electrode member.

[0036] 1 and 2, a plurality of gas outlets 12b are provided on the first surface S1 of the holding substrate 10. The outer peripheral edge of the first surface S1 is formed in an annular shape and protrudes slightly upward compared to the inner portion thereof. Therefore, when the wafer W is attracted and held on the first surface S1, a gap G is formed between the wafer W and the inner portion of the first surface S1, as shown in FIG.

[0037] The base member 20 is mainly composed of, for example, a metal (aluminum, aluminum alloy, etc.), a composite of metal and ceramics (Al-SiC), or ceramics (SiC).

[0038] A coolant flow path 21 is provided inside the base member 20. A coolant (e.g., a fluorine-based inert liquid, water, etc.) is caused to flow through the coolant flow path 21 to cool the plasma heat. When the coolant flows through the coolant flow path 21, the base member 20 is cooled, and the holding substrate 10 is cooled by heat transfer (heat withdrawal) between the base member 20 and the holding substrate 10 via the bonding material 30. As a result, the wafer W held on the first surface S1 of the holding substrate 10 is cooled. The temperature of the wafer W held on the first surface S1 can be controlled by appropriately adjusting the flow rate of the coolant through the coolant flow path 21.

[0039] A base-side gas flow passage 22 constituting a part of the flow passage 60 is provided inside the base member 20. The base-side gas flow passage 22 is generally in the form of a through hole extending in the thickness direction of the base member 20, and includes an inlet 22a opening on the fourth surface S4 of the base member 20 and an outlet 22b opening on the third surface S3. The inlet 22a forms the inlet of the base-side gas flow passage 22, and also forms the inlet of the entire flow passage 60 provided in the holding device 100.

[0040] The bonding material 30 is composed of, for example, a bonding sheet containing a silicone-based organic bonding agent, an inorganic bonding agent, or an Al-based metal adhesive. The bonding material 30 is preferably one that has high adhesive strength to both the holding substrate 10 and the base member 20, as well as high pressure resistance and thermal conductivity.

[0041] The bonding material 30 also has a bonding-side gas flow passage 31 that constitutes a part of the flow passage 60. The bonding-side gas flow passage 31 is formed of a hole that penetrates the layered bonding material 30 in the thickness direction.

[0042] The flow path 60 supplies an inert gas (helium gas, etc.) to the first surface S1 side of the holding device 100. As described above, the first surface S1 is provided with a large number of gas outlets 12b which are outlets of the flow path 60, and the inert gas is supplied to the first surface S1 side by being discharged from each gas outlet 12b. As described above, such a flow path 60 includes the base-side gas flow path 22, the bonding-side gas flow path 31, and the substrate-side gas flow path (gas flow path) 12.

[0043] A plurality of inlets 22a of the flow passage 60 are provided on the fourth surface S4 of the base member 20. When an inert gas is supplied from each inlet 22a, the inert gas passes through the base-side gas passage 22, the bonding-side gas passage 31, and the substrate-side gas passage (gas passage) 12 connected to each inlet 22a in this order, and is finally discharged from a plurality of gas outlets 12b provided on the first surface S1.

[0044] The outlet 22b of the base-side gas flow passage 22 is connected to a lower (base member 20 side) opening of the bonding-side gas flow passage 31. In addition, the upper (holding substrate 10 side) opening of the bonding-side gas flow passage 31 is connected to an inlet 12a of the substrate-side gas flow passage (gas flow passage) 12. A plurality of inlets 12a of the substrate-side gas flow passage (gas flow passage) 12 are provided on the second surface S2 of the holding substrate 10.

[0045] The second vertical gas flow passage 140 including the inlet 12a of the substrate-side gas flow passage (gas flow passage) 12 is connected to a plurality of horizontal gas flow passages 130 on the downstream side. The first vertical gas flow passage 120 is connected to each of the horizontal gas flow passages 130. In other words, the substrate-side gas flow passage (gas flow passage) 12 is branched into a plurality of passages from the upstream side to the downstream side inside the holding substrate 10 (plate-like member 11).

[0046] Next, the porous body 70 and the like will be described in detail.

[0047] The porous body 70 is a gas-permeable member containing a large number of pores, mainly composed of insulating ceramics. The porous body 70 is filled in each of the first vertical gas flow passages 120 in the substrate-side gas flow passage 12. The porous body 70 is generally cylindrical and extends in the vertical direction (thickness direction of the holding substrate 10), and a ventilation path for passing an inert gas is formed in the inside in a mesh-like shape. The ventilation path is composed of a large number of pores connected to each other in the porous body 70. The pores are formed as traces of particulate pore-forming material burned (disappeared) during the manufacturing (firing) of the porous body 70. As the pore-forming material, for example, synthetic resin beads, carbon powder, etc. are used. The porosity of the porous body 70 is 60% or more.

[0048] The porous body 70 constitutes a mounting body 90 together with the mounting frame 50. The mounting body 90 is a part used for mounting the porous body 70 to a predetermined position of the plate-like member 11 when manufacturing the holding substrate 10. The porous body 70 has a mounting frame 50 mainly made of ceramics, and a porous body 70 mainly made of ceramics and disposed inside the mounting frame 50. The porosity of the porous body 70 is higher than the porosity of the mounting frame 50. As described later, the mounting frame 50 and the porous body 70 are integrated by simultaneous firing.

[0049] The mounting body 90 is attached by fitting into a mounting hole 150 formed in the plate-like member 11 using an adhesive 160. The mounting body 90 attached to the plate-like member 11 ultimately constitutes the holding substrate 10 together with the plate-like member 11 and the like.

[0050] The mounting frame 50 is generally cylindrical and surrounds the peripheral surface of the cylindrical porous body 70. The mounting frame 50 is mainly composed of ceramics, and is ultimately fixed to a mounting hole 150, which will be described later. The ceramics constituting the mounting frame 50 are the same as the ceramics constituting the plate-like member 11 (e.g., alumina, aluminum nitride, etc.). The mounting frame 50 of this embodiment is made of alumina (Al2O3) like the plate-like member 11. Also, like the plate-like member 11, the mounting frame 50 is dense and non-gas permeable (e.g., porosity 5% or less, relative density 95% or more).

[0051] The mounting frame portion 50 of this embodiment surrounds the porous body 70 and comprises a cylindrical main body portion 51 which is fixed to the accommodating portion 153 (second circumferential surface 153b1) of the mounting hole portion 150 described later, and an annular protrusion portion 52 which is arranged on the first surface S1 side and protrudes outward further than the cylindrical main body portion 51.

[0052] The mounting hole portion 150 includes a first opening (mounting port) 151 that opens on the first surface S1 side, a cylindrical housing portion 153 that extends from the first opening 151 side to the second surface S2 side, and a second opening 152 that is open and disposed on the second surface S2 side of the housing portion 153. A plurality (a large number) of such mounting holes 150 are provided on the first surface S1 side of the plate-like member 11.

[0053] The first opening (mounting opening) 151 has a circular shape when viewed from above, and is provided in the plate-like member 11 so as to open on the first surface S1 side. The second opening 152 is provided on the second surface S2 side and inside the plate-like member 11. More specifically, the second opening 152 is provided inside the plate-like member 11 so as to open on the space V side in the bottom horizontal flow passage portion 131. The second opening 152 has a circular shape when viewed from above. In this embodiment, the size of the second opening 152 is set to be smaller than the size of the first opening 151.

[0054] The accommodation portion 153 has a cylindrical shape extending in the vertical direction (thickness direction of the plate-like member 11) as a whole. The accommodation portion 153 has a first accommodation portion 153a that accommodates the protruding portion 52 of the mounting frame portion 50, and a second accommodation portion 153b that accommodates the cylindrical main body portion 51 of the mounting frame portion 50.

[0055] The first accommodating portion 153a is arranged to surround the protrusion portion 52 and includes an annular first peripheral surface 153a1 extending from the first opening 151 toward the second surface S2, and an annular support surface 153a2 arranged parallel to the first surface S1 and on which the protrusion portion 52 is placed from the first surface S1 side.

[0056] The second housing portion 153b includes an annular second circumferential surface 153b1 extending from the first housing portion 153a side toward the second surface S2 side.

[0057] 3 and 4, the mounting body 90 is attached to the mounting hole 150 of the plate-like member 11 by using an adhesive 160. The adhesive 160 is interposed between the second circumferential surface 153b1 of the second housing portion 153b of the housing portion 153 and the outer circumferential surface 51a of the cylindrical main body portion 51, and fixes the second circumferential surface 153b1 and the outer circumferential surface 51a. As the adhesive 160, for example, a known adhesive such as an alumina-based adhesive or a silicon-based adhesive can be used.

[0058] In the mounting body 90, the porous body 70 is arranged inside the mounting frame portion 50, as shown in Figures 3 and 4, and has a cylindrical shape extending from the first surface S1 side to the second surface S2 side.

[0059] 3 and 4, when the mounting body 90 is attached to the mounting hole 150 of the plate-like member 11, the end 50a on the first surface S1 side of the mounting frame 50 (i.e., the end of the protruding portion 52) and the end (end face) 70a on the first surface S1 side of the porous body 70 are exposed from the first opening (mounting opening) 151. In the case of this embodiment, the first surface S1 and the end of the mounting body 90 on the first surface S1 side (i.e., the end 50a of the mounting frame 50 and the end 70a of the porous body 70) are arranged to be flush with each other.

[0060] The end 50a of the mounting frame 50 has an annular shape in plan view, and its outer periphery is disposed within the first opening (mounting port) 151 along the periphery (inner periphery) of the first opening (mounting port) 151. The end 70a of the porous body 70 has a circular shape in plan view, and is disposed so as to be exposed on the first surface S1 side from the gas outlet 12b located inside the end 50a of the mounting frame 50 having an annular shape.

[0061] The mounting frame 50 and the porous body 70 constituting the mounting body 90 are solid-phase bonded to each other by simultaneous firing and integrated. Therefore, a cylindrical boundary portion extending in the vertical direction exists between the mounting frame 50 and the porous body 70. The inner peripheral surface of the mounting frame 50 constituting such a boundary portion constitutes the above-mentioned first vertical gas flow passage 120. The gas outlet 12b arranged at the downstream end of the first vertical gas flow passage 120 is made of the inner peripheral edge of the mounting frame 50 (projection portion 52) constituting the portion of the boundary portion arranged on the first surface S1 side. The inlet 12c arranged at the upstream end of the first vertical gas flow passage 120 is made of the inner peripheral edge of the mounting frame 50 (cylindrical main body portion 51) constituting the portion of the boundary portion arranged on the second surface S2 side. Although the porous body 70 and the mounting frame portion 50 are integrated with each other, the porosity of the porous body 70 is higher than the porosity of the mounting frame portion 50, so that the boundary between them can be easily identified.

[0062] When the inert gas is supplied into the bottom horizontal flow passage section 131 of the horizontal gas flow passage 130, the inert gas is supplied into the porous body 70 from the end face 70b on the second surface S2 side, which is exposed from the inlet 12c to the bottom horizontal flow passage section 131 side. The end face 70b entirely faces the surface of the bottom 131a with the space V in the bottom horizontal flow passage section 131 therebetween, so that a sufficient flow rate of the inert gas can be introduced into the porous body 70 from the end face 70b.

[0063] When the mounting body 90 is viewed in plan from the first surface S1 side, the adhesive 160 is not exposed to the first surface S1 side and is covered by the protruding portion 52. Since the adhesive 160 is covered by the protruding portion 52 in this manner, the adhesive 160 is in a sealed state. As a result, for example, when a plasma process is performed using the holding device 100, the adhesive 160 is prevented from being exposed to plasma from the outside, which would cause problems such as deterioration and damage to the adhesive 160.

[0064] In addition, when viewed from the first surface S1 side, the adhesive 160 is generally formed in a thin layer between the second peripheral surface 153b1 of the accommodation portion 153 (second accommodation portion 153b) and the outer peripheral surface 51a of the mounting frame portion 50 (cylindrical main body portion 51), but there are some portions where the adhesive 160 is not formed, as shown in FIG. 3. Specifically, when viewed from the first surface S1 side, the adhesive 160 is not formed at a portion that overlaps with the main body horizontal flow path portion 132 of the horizontal gas flow path 130. In other words, the adhesive 160 is provided between the second peripheral surface 153b1 and the outer peripheral surface 51a so as not to overlap with the main body horizontal flow path portion 132 of the horizontal gas flow path 130, when viewed from the first surface S1 side. Therefore, when viewed in a plan view from the first surface S1 side, the adhesive 160 is provided between the second circumferential surface 153b1 and the outer circumferential surface 51a so as to generally form a C-shape (a C-shape inverted from left to right in FIG. 3). By providing the adhesive 160 in this manner, the inert gas (helium, etc.) flowing in the main body horizontal flow path portion 132 of the horizontal gas flow path 130 is prevented from coming into contact with the adhesive 160.

[0065] 3 and 4, the bottom horizontal flow passage section 131 of the horizontal gas flow passage 130 formed inside the plate-like member 11 overlaps with the end face 70b on the second surface S2 side of the porous body 70 when viewed in plan from the first surface S1 side, and has a contour R larger than that of the end face 70b on the second surface S2 side of the porous body 70. The bottom horizontal flow passage section 131 has a substantially circular shape in plan view, and the contour R has a substantially circular shape (substantially arc-shaped).

[0066] 4, when viewed from the first surface S1 side, the position of the contour R of the bottom horizontal flow passage section 131 is arranged closer to the porous body 70 than the position of the adhesive 160 so as not to overlap the position of the adhesive 160 interposed between the second circumferential surface 153b1 and the outer circumferential surface 51a of the cylindrical main body 51. In other words, the adhesive 160 is arranged so as not to overlap the bottom horizontal flow passage section 131 of the horizontal gas flow passage 130 when viewed from the first surface S1 side. By setting the position of the adhesive 160 in this manner, the space V in the bottom horizontal flow passage section 131 is not arranged directly below the adhesive 160, and the adhesive 160 is prevented from coming into contact with the inert gas (helium, etc.) flowing in the bottom horizontal flow passage section 131.

[0067] As described above, the adhesive 160 of this embodiment prevents the inert gas flowing in the bottom horizontal flow passage portion 131 of the horizontal gas flow passage 130 from coming into contact with the inert gas flowing in the main body horizontal flow passage portion 132. Therefore, when the holding device 100 is used, defects such as deterioration and damage to the adhesive 160 due to arcing (abnormal discharge) generated inside the substrate-side gas flow passage 12 of the holding substrate 10 are prevented.

[0068] Next, an example of a method for manufacturing the holding device 100 of this embodiment will be described. First, a method for manufacturing the holding substrate 10 constituting the holding device 100 will be described with reference to FIGS.

[0069] 5 is an explanatory diagram that diagrammatically illustrates a method for manufacturing the mounting body 90, which is a component of the holding substrate 10. Here, the method for manufacturing the mounting body 90 will be described with reference to FIG.

[0070] As shown in Fig. 5(A), an object 200 is prepared, which is made of one green sheet or a laminate of two or more green sheets. In this embodiment, the object 200 is made of a laminate of multiple green sheets. The green sheet used in manufacturing the mounting body 90 is the same as that used in manufacturing the plate-like member 11 described later.

[0071] 5(B), holes 201 are formed in the prepared workpiece 200 so as to penetrate the workpiece 200 in the thickness direction (hole forming step). In order to manufacture a plurality of mounting bodies 90 from one workpiece 200, a plurality of holes 201 are formed in one workpiece 200. In other embodiments, one hole 201 may be formed in one workpiece 200 as long as the object of the present invention is not impaired. A known processing method is used as a method for forming the hole 201 in the workpiece 200.

[0072] 5(C), each of the holes 201 formed in the workpiece 200 is filled with a paste 202 for a porous body (filling step). The paste 202 for a porous body is obtained by kneading a mixture containing, for example, alumina powder, a pore former, a binder, an organic solvent, and the like. Examples of a method for filling the holes 201 with the paste 202 for a porous body include a method using an injection molding device and a method using a screen printing device. The workpiece 200 in which the holes 201 are filled with the paste 202 for a porous body is dried as appropriate.

[0073] Then, the object 200 in which the holes 201 are filled with the paste 202 for the porous body is fired at a predetermined temperature (firing step). Through this firing step, the paste 202 for the porous body filled in the holes 201 and the part of the object 200 including the holes 201 arranged around the paste 202 are fired at the same time. In the sintered body 203 made of the object 200 after firing, a porous body 70 made of a fired product (porous sintered body) of the paste 202 is formed in each hole 201, as shown in FIG. 5(D). The porous body 70 and the sintered body 203 (frame-shaped part 204 described later) arranged therearound are integrated with each other by solid-state bonding.

[0074] After the firing step, as shown in Fig. 5(D) and Fig. 5(E), the porous body 70 made of the sintered body of the paste 202 and the frame-shaped part 204 arranged around the porous body 70 are taken out together from the sintered body 203 of the processing object 200 (removal step). The member 205 taken out from the sintered body 203 by a predetermined processing method is appropriately processed by cutting, polishing, etc., so as to become the mounting body 90 of a predetermined shape. When polishing the mounting body 90 (member 205), it is preferable to perform dry polishing or polishing using water, etc., so as not to cause defects (discoloration, dents, etc.) in the porous body 70. As described above, a plurality of mounting bodies 90 each composed of the porous body 70 and the mounting frame part 50 are obtained through the hole forming step, filling step, firing step, and removal step.

[0075] In the present embodiment, since a plurality of mounting bodies 90 can be simultaneously manufactured from one workpiece 200, even if a defective product (e.g., a porous body 70 with discoloration) is included among the plurality of mounting bodies 90, the defective product can be removed in advance from among the plurality of mounting bodies 90 before being attached to the plate-like member 11. Therefore, in other embodiments, when polishing the mounting body 90 (member 205), polishing using a grinding fluid may be performed.

[0076] Next, a method for manufacturing the holding substrate 10 will be described with reference to Fig. 6 and Fig. 7. Fig. 6 and Fig. 7 are explanatory diagrams that typically show the method for manufacturing the holding substrate 10. This method for manufacturing the holding substrate 10 is an application of a sheet lamination method that uses green sheets (ceramic green sheets).

[0077] 6(A), a first laminate 80a is formed by laminating a plurality of green sheets for forming the plate-like member 11 of the holding substrate 10. Note that a conductor layer 9 is formed on a predetermined green sheet constituting the first laminate 80a, and such a green sheet is laminated on another green sheet.

[0078] The slurry for the green sheets is obtained by, for example, mixing a mixture containing alumina powder, an acrylic binder, a dispersant, a plasticizer, etc., with an organic solvent added thereto, using a ball mill. This slurry is formed into a sheet shape using a casting device, and then the formed product is dried to obtain multiple green sheets.

[0079] The metallization paste for forming the conductor layer 9 is obtained by adding conductive powder such as tungsten or molybdenum to a mixture of alumina powder, an acrylic binder, and an organic solvent, and kneading the mixture. The metallization paste is printed using, for example, a screen printing device, to form the conductor layer 9 on a specific green sheet.

[0080] 6(B), holes 81 for forming mounting holes 150 are formed at predetermined locations of the first laminate 80a. The holes 81 are provided in a substantially cylindrical shape penetrating the first laminate 80a in the thickness direction. The holes 81 are formed at predetermined locations of the first laminate 80a using a known processing device (router, etc.).

[0081] Thereafter, as shown in Fig. 6(C), a first laminate 80a and a second laminate 80b are laminated. The second laminate 80b is made of a plurality of green sheets laminated together. Grooves 82 and holes (not shown) for forming substrate-side gas flow paths 12 (such as lateral gas flow paths 130) are provided at predetermined locations of the second laminate 80b. The laminate made up of the first laminate 80a and the second laminate 80b is made of, for example, 20 green sheets laminated together by thermocompression.

[0082] The outer periphery of the laminate consisting of the first laminate 80a and the second laminate 80b may be cut as appropriate. The laminate is then cut by machining to produce a disk-shaped compact. The resulting compact is then degreased and fired, and the degreased and fired compact is then fired (main firing) to obtain a fired body 110 as shown in FIG. 7(D). The fired body 110 includes a plate-shaped member 11, a chuck electrode 40, an attachment hole 150, a substrate-side gas flow passage 12 such as a lateral gas flow passage 130, and the like.

[0083] The mounting body 90 obtained by the manufacturing method of the mounting body 90 is attached to the mounting hole 150 formed in the plate-shaped member 11 of the sintered body 110 so as to include the mounting opening (first opening) 151 formed on one surface (first surface S1) of the plate-shaped member 11 and the accommodation portion 153 extending from the mounting opening 151 side to the other surface (second surface S2) side of the plate-shaped member 11 (mounting step). Before attaching the mounting body 90 to the mounting hole 150, the adhesive 160 is applied in advance to a predetermined location on the outer circumferential surface 51a of the cylindrical main body 51. Note that in other embodiments, the adhesive 160 may be applied in advance to a predetermined location on the second circumferential surface 153b1. The mounting body 90 is fixed to the mounting hole 150 in such a manner that the protruding portion 52 of the mounting frame 50 is accommodated in the first accommodation portion 153a and the cylindrical main body portion 51 of the mounting frame 50 is accommodated in the second accommodation portion 153b. If necessary, the plate-like member 11 (fired body 110) to which the mounting body 90 is attached may be heated in order to thermally harden the adhesive 160.

[0084] Then, a mask is placed on the surface of the sintered body to cover the portion corresponding to the convex outer periphery, and a convex outer periphery is formed on the surface of the sintered body by, for example, shot blasting, which projects particles of ceramics, etc. Then, the surface of the sintered body is polished, etc., to obtain a holding substrate 10 as shown in FIG.

[0085] The method of manufacturing the base member 20 is basically the same as that of the conventional product, and therefore a detailed description thereof will be omitted.

[0086] After the holding substrate 10 and the base member 20 are produced, they are bonded together using a bonding material 30. The bonding of the holding substrate 10 and the base member 20 with the bonding material 30 is basically the same as that in the conventional products. Therefore, a detailed description thereof will be omitted. In this manner, the holding device 100 is manufactured.

[0087] As described above, the holding substrate 10 of the present embodiment has a structure that allows the mounting body 90 including the porous body 70 to be easily removed from the mounting hole 150 when the porous body 70 needs to be replaced. Therefore, it can be said that the holding device 100 of the present embodiment has a structure that allows the porous body 70 in the substrate-side gas flow passage 12 of the holding substrate 10 to be easily repaired.

[0088] Furthermore, since the porous body 70 in the mounting body 90 of this embodiment is integrated with the surrounding mounting frame portion 50 by co-firing, it is easier to maintain the pores (gas permeability) within the porous body 70 compared to, for example, conventional products in which the porous body is fixed with an adhesive.

[0089] Furthermore, in the case of this embodiment, as described above, even if the mounting body 90 is attached to the mounting hole portion 150 using the adhesive 160, the occurrence of defects such as deterioration and damage to the adhesive 160 due to external plasma or arcing generated in the substrate side gas flow path 12, etc., is suppressed.

[0090] <Embodiment 2> Next, the holding substrate 10A included in the holding device according to the second embodiment will be described with reference to Fig. 8. Fig. 8 is an enlarged cross-sectional view of the vicinity of the mounting body 90A included in the holding substrate 10A according to the second embodiment. The basic configuration of the holding substrate 10A of this embodiment is the same as that of the first embodiment. Therefore, in Fig. 8, the parts corresponding to those of the first embodiment are denoted by the same reference numerals as those of the first embodiment with the addition of the reference numeral "A", and detailed description thereof will be omitted.

[0091] The holding substrate 10A includes a disk-shaped plate-like member 11A and a substrate-side gas flow path 12A (such as a lateral gas flow path 130A) formed therein. The upper surface of the plate-like member 11A serves as a first surface SA1 of the holding substrate 10A, and the lower surface of the plate-like member 11A serves as a second surface SA2 of the holding substrate 10A.

[0092] Similar to the first embodiment, the plate-like member 11A has a plurality of mounting holes 150A, and a mounting body 90A is fixed to each mounting hole 150A using an adhesive 160A. For ease of explanation, Fig. 8 shows one mounting hole 150A and one mounting body 90A fixed thereto.

[0093] The mounting hole portion 150A of this embodiment includes a cylindrical receiving portion 153A that extends straight from the first opening portion (mounting hole) 151A side to the second surface SA2 side.

[0094] The mounting body 90A is composed of a columnar porous body 70A extending in the vertical direction and a cylindrical mounting frame portion 50A extending in the vertical direction surrounding the porous body 70A. The mounting frame portion 50A in this embodiment has a cylindrical tubular main body portion 51A. The porous body 70A and the mounting frame portion 50A (tubular main body portion 51A) are solid-phase bonded to each other by simultaneous firing and integrated. The porosity of the porous body A is higher than that of the mounting frame portion 50A, as in the first embodiment.

[0095] An end (end face) 50Aa on the first surface SA1 side of the mounting frame 50A and an end (end face) 70Aa on the first surface SA1 side of the porous body 70A are exposed from a first opening (mounting opening) 151 A. In addition, the end (end face) 50Aa of the mounting frame 50A and the end (end face) 70Aa of the porous body 70A are set at the same height position.

[0096] In the mounting body 90A of this embodiment, the vertical length of the porous body 70A is set to be longer than the vertical length of the mounting frame 50A (cylindrical main body 51A). Therefore, the end (end face) 70Ab of the porous body 70A on the second surface SA2 side protrudes downward (to the second surface SA2 side) from the end (end face) 50Ab of the mounting frame 50A on the second surface SA2 side. The end 70Ab of the porous body 70A is placed on the bottom 131Aa of the bottom horizontal flow path section 131A of the horizontal gas flow path 130A. The end 70Ab of the porous body 70A is disposed approximately in the center of the bottom horizontal flow path section 131A (bottom 131Aa) which is circular in plan view. In the bottom horizontal flow path section 131A, an annular space VA is formed so as to surround the end 70Ab of the porous body 70A.

[0097] The adhesive 160A is provided between an inner circumferential surface (second circumferential surface) 153Ab1 of the accommodation portion 153A and an outer circumferential surface 51Aa of the mounting frame portion 50A so as not to overlap with the main body horizontal flow path portion 132A of the horizontal gas flow path 130A when viewed in plan from the first surface SA1 side, similar to embodiment 1. By providing the adhesive 160A in this manner, similar to embodiment 1, the inert gas (helium, etc.) flowing in the main body horizontal flow path portion 132A of the horizontal gas flow path 130A is prevented from coming into contact with the adhesive 160A.

[0098] Furthermore, as in embodiment 1, the bottom horizontal flow path portion 131A, on the second surface SA2 side of the porous body 70A, has a contour RA that overlaps with the end face 70Ab on the second surface SA2 side of the porous body 70A when viewed in a plane from the first surface SA1 side, but is larger than the end face 70Ab on the second surface SA2 side of the porous body 70A.

[0099] When viewed from the first surface SA1 side, the position of the outline RA of the bottom horizontal flow passage section 131A is arranged on the porous body 70A side from the position of the adhesive 160A so as not to overlap with the position of the adhesive 160A interposed between the inner peripheral surface (second peripheral surface) 153Ab1 of the storage section 153A and the outer peripheral surface 51Aa of the mounting frame section 50A. In other words, the adhesive 160A is arranged so as not to overlap with the bottom horizontal flow passage section 131A of the horizontal gas flow passage 130A when viewed from the first surface SA1 side. By setting the position of the adhesive 160A in this way, the space VA in the bottom horizontal flow passage section 131A is not arranged directly below the adhesive 160A, and the inert gas (helium, etc.) flowing in the bottom horizontal flow passage section 131A and the adhesive 160A are prevented from contacting each other.

[0100] As described above, the adhesive 160A of this embodiment prevents contact between the inert gas flowing in the bottom horizontal flow passage portion 131A of the horizontal gas flow passage 130A and the inert gas flowing in the main body horizontal flow passage portion 132A, as in the case of embodiment 1. Therefore, when the holding device is used, defects such as deterioration and damage to the adhesive 160A due to arcing (abnormal discharge) generated inside the substrate side gas flow passage 12A of the holding substrate 10A are prevented.

[0101] Further, the holding device 100A of this embodiment has a structure that allows easy repair of the porous body 70A in the substrate-side gas flow passage 12A of the holding substrate 10A, similarly to the first embodiment.

[0102] <Embodiment 3> Next, a holding substrate 10B provided in a holding device according to embodiment 3 will be described with reference to Fig. 9. Fig. 9 is an enlarged cross-sectional view of the vicinity of an attachment body 90B provided in the holding substrate 10B according to embodiment 3. The basic configuration of the holding substrate 10B of this embodiment is the same as that of embodiment 1. Therefore, in Fig. 9, parts corresponding to those of embodiment 1 are denoted by the same reference numerals as those of embodiment 1 with the addition of the reference numeral "B", and detailed description thereof will be omitted.

[0103] The holding substrate 10B includes a disk-shaped plate-like member 11B and a substrate-side gas flow path 12B (such as a lateral gas flow path 130B) formed therein. The upper surface of the plate-like member 11B becomes a first surface SB1 of the holding substrate 10B, and the lower surface of the plate-like member 11B becomes a second surface SB2 of the holding substrate 10B.

[0104] Similar to the first embodiment, the plate-like member 11B is provided with a plurality of mounting holes 150B, and a mounting body 90B is fixed to each mounting hole 150B using an adhesive 160B. For ease of explanation, Fig. 9 shows one mounting hole 150B and one mounting body 90B fixed thereto.

[0105] The mounting hole portion 150B of this embodiment includes a cylindrical receiving portion 153B that extends straight from the first opening portion (mounting hole) 151B side to the second surface SB2 side.

[0106] The mounting body 90B is composed of a cylindrical porous body 70B extending in the vertical direction and a substantially cylindrical mounting frame portion 50B extending in the vertical direction surrounding the cylindrical porous body 70B. The mounting frame portion 50B of this embodiment has a substantially cylindrical tubular main body portion 51B, similar to the second embodiment. However, in this embodiment, a part of the end portion 50Bb arranged on the second surface SB2 side of the tubular main body portion 51B extends downward from the end portion (end face) 70Bb on the second surface SB2 side of the porous body 70B. In this specification, such a part of the end portion Bb is referred to as a support portion 50Bb1.

[0107] The porous body 70B and the mounting frame 50B (the cylindrical main body 51B) are solid-phase bonded together by simultaneous firing to form an integrated body. Similarly to the first embodiment, the porosity of the porous body 70B is higher than the porosity of the mounting frame 50B.

[0108] An end (end face) 50Ba on the first surface SB1 side of the mounting frame 50B and an end (end face) 70Ba on the first surface SB1 side of the porous body 70B are exposed from a first opening (mounting opening) 151B. In addition, the end (end face) 50Ba of the mounting frame 50B and the end (end face) 70Ba of the porous body 70B are set at the same height position.

[0109] In the mounting body 90B of this embodiment, the end (end face) 70Ba on the second surface SB2 side of the porous body 70B is set at a height position so as not to enter the space VB within the bottom horizontal flow passage portion 131B of the horizontal gas flow passage 130B.

[0110] In this embodiment, a space for accommodating the support portion 50Bb1 of the mounting frame portion 50B (cylindrical main body portion 51B) is provided adjacent to the bottom horizontal passage portion 131B. The support portion 50Bb1 is placed on the adjacent bottom portion 231Ba that is continuous with the bottom portion 131Ba of the bottom horizontal passage portion 131B. In this manner, the support portion 50Bb1 is placed on the adjacent bottom portion 231Ba that is continuous with the bottom portion 131Ba, which makes it easier to position the mounting body 90B, which is generally substantially cylindrical, with respect to the mounting hole portion 150B.

[0111] The adhesive 160B is provided between an inner circumferential surface (second circumferential surface) 153Bb1 of the accommodation portion 153B and an outer circumferential surface 51Ba of the mounting frame portion 50B (cylindrical main body portion 51B) so as not to overlap with the main body horizontal flow path portion 132B of the horizontal gas flow path 130B when viewed in a plan view from the first surface SB1 side. By providing the adhesive 160B in this manner, as in the first embodiment, the inert gas (helium, etc.) flowing in the main body horizontal flow path portion 132B of the horizontal gas flow path 130B is prevented from coming into contact with the adhesive 160B.

[0112] Furthermore, as in embodiment 1, the bottom horizontal flow path section 131B has a contour RB on the second surface SB2 side of the porous body 70B that overlaps with the end face 70Bb on the second surface SB2 side of the porous body 70B when viewed in a plane from the first surface SB1 side, but is larger than the end face 70Bb on the second surface SB2 side of the porous body 70B.

[0113] When viewed from the first surface SB1 side, the position of the contour RB of the bottom horizontal flow passage section 131B is arranged on the porous body 70B side from the position of the adhesive 160B so as not to overlap with the position of the adhesive 160B interposed between the inner peripheral surface (second peripheral surface) 153Bb1 of the storage section 153B and the outer peripheral surface 51Ba of the mounting frame section 50B (cylindrical main body section 51B). In other words, the adhesive 160B is arranged so as not to overlap with the bottom horizontal flow passage section 131B of the horizontal gas flow passage 130B when viewed from the first surface SB1 side. By setting the position of the adhesive 160B in this way, the space VB in the bottom horizontal flow passage section 131B is not arranged directly below the adhesive 160B, and the inert gas (helium, etc.) flowing in the bottom horizontal flow passage section 131B and the adhesive 160B are prevented from contacting each other.

[0114] As described above, in the adhesive 160B of this embodiment, contact between the inert gas flowing in the bottom horizontal flow passage portion 131B of the horizontal gas flow passage 130B and the inert gas flowing in the main body horizontal flow passage portion 132B is suppressed, as in the case of embodiment 1. Therefore, when the holding device is used, defects such as deterioration and damage to the adhesive 160B due to arcing (abnormal discharge) generated inside the substrate side gas flow passage 12B of the holding substrate 10B are suppressed.

[0115] Further, the holding device 100B of this embodiment has a structure that allows easy repair of the porous body 70B in the substrate-side gas flow passage 12B of the holding substrate 10B, similarly to the first embodiment.

[0116] <Other embodiments> The present invention is not limited to the embodiments described above and illustrated in the drawings, and the following embodiments, for example, are also included within the technical scope of the present invention.

[0117] (1) The shape of the mounting opening may be a shape other than a circle (e.g., a polygonal shape) as long as the shape does not impair the objective of the present invention. Similarly, the shape of the mounting body when viewed in a plan view may be a shape other than a circle.

[0118] (2) When attaching the mounting body to the mounting hole, it is also possible to form a male thread on the mounting body and a female thread on the mounting hole, and screw the male thread and the female thread together, without using an adhesive. However, in consideration of the ease of attaching the mounting body to the mounting hole, it is preferable to attach them using an adhesive, as in the above-mentioned embodiment 1, etc.

[0119] (3) The gas flow passage for passing the inert gas does not have to be formed in the base member, and may be formed only in the holding substrate.

[0120] (4) The manufacturing method of the holding device shown in the above embodiment is just one example, and other manufacturing methods may be used as long as they do not impair the object of the present invention. [Explanation of symbols]

[0121] Reference Signs List 100...holding device, 10...holding substrate, 11...plate-like member, 12...substrate-side gas flow path (gas flow path), 50...mounting frame portion, 50a...end surface of mounting frame portion, 51...cylindrical main body portion, 51a...outer peripheral surface, 52...projection portion, 70...porous body, 70a...end surface of porous body, 90...mounting body, 150...mounting hole portion, 151...mounting port (first opening portion), 153...accommodating portion, S1...first surface, S2...second surface, S3...third surface, S4...fourth surface

Claims

1. A plate-shaped member including a first surface for holding an object and a second surface disposed on an opposite side of the first surface, the plate-shaped member being mainly composed of ceramics; an attachment hole portion formed in the plate-like member so as to include an attachment opening that opens to the first surface side and a housing portion that extends from the attachment opening side to the second surface side; a mounting body having a mounting frame portion mainly made of ceramics and fixed to the housing portion; and a porous body mainly made of ceramics, disposed inside the mounting frame portion, and extending from the first surface side to the second surface side; the porosity of the porous body is higher than the porosity of the mounting frame portion, A holding device in which the end portion on the first surface side of the mounting frame and the end portion on the first surface side of the porous body are exposed from the mounting opening.

2. The holding device according to claim 1 , further comprising a lateral gas flow passage formed inside the plate-like member, connected to the porous body, and extending parallel to the first surface.

3. the mounting frame portion has a cylindrical main body portion that surrounds the porous body and is fixed to the housing portion, and a ring-shaped protruding portion that is disposed on the first surface side and protrudes outward beyond the cylindrical main body portion, The retaining device described in claim 1 or claim 2, wherein the accommodating portion includes a first annular circumferential surface arranged to surround the protrusion and extending from the mounting opening toward the second surface side, and a annular mounting surface arranged parallel to the first surface and on which the protrusion is placed from the first surface side, and has a first accommodating portion that accommodates the protrusion, and a second accommodating portion that includes a second annular circumferential surface extending from the first accommodating portion side to the second surface side and accommodates the tubular main body portion.

4. The holding device according to claim 3 , further comprising an adhesive interposed between the second peripheral surface and the outer peripheral surface of the cylindrical main body and fixing the second peripheral surface to the outer peripheral surface.

5. the lateral gas flow passage has a bottom lateral flow passage portion, on the second surface side of the porous body, which overlaps with an end face on the second surface side of the porous body when viewed in a plan view from the first surface side and has a contour larger than that of the end face on the second surface side of the porous body; and A holding device as described in claim 4, wherein, when viewed in a plane from the first surface side, the position of the contour of the bottom horizontal flow path portion is arranged on the porous body side of the position of the adhesive interposed between the second circumferential surface and the outer circumferential surface of the cylindrical main body portion so as not to overlap with the position of the adhesive.

6. 3. The holding device according to claim 1, wherein the mounting frame and the porous body constituting the mounting body are integrated together by co-firing.

7. a hole forming step of forming a hole penetrating in a thickness direction in a processing object made of one green sheet or a laminate of two or more green sheets; a filling step of filling the hole with a paste for a porous body; a firing step of firing the object having the holes filled with the paste; a removal step of removing, from the sintered body of the object after the firing step, a porous body made of the sintered body of the paste together with a frame-shaped portion disposed around the porous body to obtain an attachment body; A manufacturing method for a retaining device, comprising an attachment step of attaching the obtained mounting body to an attachment hole portion formed in a plate-shaped member whose main component is ceramic so as to include an attachment port formed on one surface of the plate-shaped member and a accommodating portion extending from the attachment port side to the other surface side of the plate-shaped member.

8. A mounting body having a mounting frame portion mainly made of ceramics and a porous body mainly made of ceramics and disposed inside the mounting frame portion, the porosity of the porous body is higher than the porosity of the mounting frame portion, The mounting frame and the porous body are integrated together by co-firing.

9. a hole forming step of forming a hole penetrating in a thickness direction in a processing object made of one green sheet or a laminate of two or more green sheets; a filling step of filling the hole with a paste for a porous body; a firing step of firing the object having the holes filled with the paste; and a removal process for removing, after the firing process, a porous body made of the sintered paste together with a frame-shaped portion arranged around the porous body from the sintered body of the object to be processed to obtain an attachment body.

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