Component mounting device and component mounting method

Abstract

To provide a component mounting device capable of suppressing deterioration of productivity even if a component to be finally absorbed at one turn becomes a final component of a preceding tape.SOLUTION: A component mounting device 100 comprises: a component supply part (a tape feeder 5); a mounting part (a component mounting mechanism 130); a subsequent tape processing execution part (an LCR checker 19) that executes a predetermined subsequent tape processing to a component to a subsequent tape supplied to a component fetching position; and a control part 110. The control part 110 makes the component supply part to supply a first component of the subsequent tape to a component fetching position in a second turn when it is detected that the final component of the preceding tape is supplied to the component fetching position as the final component supplied to the component fetching position from the component supply part in a first turn, and makes the subsequent tape processing execution part to execute a predetermined subsequent tape processing to the first component of the subsequent tape.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present disclosure relates to a component mounting apparatus and the like. [Background technology]

[0002] Patent Document 1 discloses a component mounting device that can accurately determine the identity of components before and after a switch from a leading tape to a trailing tape in a tape feeder, and ensure the mounting quality of components even after the tape switch. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2007-19297 A Summary of the Invention [Problem to be solved by the invention]

[0004] In a component mounting device such as that described in Patent Document 1, for example, when switching from a leading tape to a trailing tape occurs, trailing tape processing is performed on the components on the trailing tape, such as measuring the electrical characteristics and detecting the pickup position and pickup height of the components. This makes it possible to mount components with the correct electrical characteristics, and also to mount the components in the correct positions, ensuring the quality of component mounting.

[0005] However, if the component to be picked up at the end of one turn is the last component on the preceding tape, the following problem can occur. Note that one turn is defined as the process of picking up at least one component supplied to the component removal position by a mounting head having multiple suction nozzles, moving the head onto the board to place the component on the board, and then returning the mounting head to the component removal position.

[0006] If the component picked up at the end of one turn is the last component on the leading tape, the first component on the trailing tape will be supplied to the component pick-up position by tape feeding in the next turn. However, in order to perform trailing tape processing for that component, part pick-up may be skipped in that turn, and trailing tape processing may be performed for that component in the next turn. In this case, one turn's worth of production time is lost, reducing productivity.

[0007] Therefore, the present invention provides a component mounting device and the like that can suppress a decrease in productivity even when the component picked up at the end of one turn is the last component on the preceding tape. [Means for solving the problem]

[0008] A component mounting device according to the present disclosure includes a component supply unit that feeds a leading tape and a trailing tape, each of which stores a plurality of components, to a component removal position, and then supplies the plurality of components on the trailing tape to the component removal position; a mounting unit that repeats a plurality of turns, each of which is defined as a turn in which at least one component supplied to the component removal position by the component supply unit is removed and mounted on a board; and a trailing tape processing unit that performs a predetermined trailing tape process on the components on the trailing tape supplied to the component removal position by the component supply unit. The system includes a processing execution unit and a control unit which controls the component supply unit, the mounting unit, and the subsequent tape processing execution unit, and when it is detected that the last component of the preceding tape has been supplied to the component removal position as the last component to be supplied to the component removal position from the component supply unit in a first turn of the multiple turns, the control unit causes the component supply unit to supply the first component of the subsequent tape to the component removal position in a second turn after the first turn, and causes the subsequent tape processing execution unit to execute the specified subsequent tape processing on the first component of the subsequent tape.

[0009] These comprehensive or specific aspects may be realized by a system, an apparatus, a method, a recording medium, or a computer program, or may be realized by any combination of a system, an apparatus, a method, a recording medium, and a computer program. Effect of the Invention

[0010] According to the component mounting device and the like according to the present disclosure, a decrease in productivity can be suppressed even if the component picked up at the end of one turn is the last component on the preceding tape. [Brief description of the drawings]

[0011] [Figure 1] 1 is a plan view showing an example of a component mounting apparatus according to an embodiment; [Diagram 2] 1 is a partial cross-sectional view showing an example of a component mounting apparatus according to an embodiment. [Diagram 3] 1A to 1C are diagrams illustrating a configuration of a tape feeder according to an embodiment. [Figure 4A] FIG. 1 is a diagram for explaining tape splicing. [Figure 4B] FIG. 1 is a diagram for explaining tape splicing. [Figure 5A] 10A and 10B are diagrams for explaining a method of detecting a joint between a leading tape and a trailing tape; [Figure 5B] 10A and 10B are diagrams for explaining a method of detecting a joint between a leading tape and a trailing tape; [Figure 6A] 11A and 11B are diagrams for explaining an example of operation of the component mounting device in the comparative example. [Figure 6B] 5A to 5C are diagrams for explaining an example of the operation of the component mounting device according to the embodiment. [Figure 7] 1 is a block diagram showing an example of a component mounting apparatus according to an embodiment; [Figure 8] FIG. 11 is a diagram illustrating an example of implementation data. [Figure 9] 5 is a flowchart showing an example of an operation of the component mounting apparatus according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] The embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, the arrangement and connection of the components, steps, and the order of steps shown in the following embodiments are merely examples and are not intended to limit the present disclosure.

[0013] (Embodiment) Hereinafter, a component mounting apparatus according to an embodiment will be described with reference to FIGS.

[0014] First, the structure of the component mounting apparatus will be described with reference to FIGS.

[0015] FIG. 1 is a plan view showing an example of a component mounting apparatus 100 according to an embodiment.

[0016] 2 is a partial cross-sectional view showing an example of the component mounting apparatus 100 according to the embodiment. FIG 2 partially shows the AA cross section in FIG 1.

[0017] In FIG. 1, a transport path 2 is disposed in the center of a base 1 in the X direction (substrate transport direction). The transport path 2 transports a substrate 3 carried in from the upstream side and positions it on a mounting stage. The transport path 2 is an example of a substrate transport mechanism 120 (see FIG. 7 described later) that transports the substrate 3. Component supply units 4 are disposed on both sides of the transport path 2, and a plurality of tape feeders 5 are arranged in parallel in each component supply unit 4. The tape feeders 5 are also referred to as component supply units 4. The tape feeders 5 feed the carrier tape holding the components by a pitch, thereby supplying the components to a component suction position (also referred to as a component removal position) where the components are suctioned by a suction nozzle 8a (see FIG. 2) of a mounting head 8.

[0018] Y-axis tables 6A and 6B are disposed on both ends of the upper surface of base 1, and two X-axis tables 7A and 7B are mounted on Y-axis tables 6A and 6B. Driving Y-axis table 6A causes X-axis table 7A to move horizontally in the Y direction, and driving Y-axis table 6B causes X-axis table 7B to move horizontally in the Y direction. Mounting head 8 and board recognition camera 9, which moves integrally with mounting head 8, are attached to X-axis tables 7A and 7B, respectively.

[0019] By driving the Y-axis table 6A, X-axis table 7A, Y-axis table 6B, and X-axis table 7B in combination, the mounting head 8 moves horizontally, picks up components from each component supply unit 4 with the suction nozzle 8a, and mounts them on the board 3 positioned on the transport path 2. The mounting head 8 is an example of a mounting unit that repeats turns multiple times, with one turn being taken out of at least one component supplied to the component removal position by the component supply unit 4 and mounted (mounted) on the board 3. The Y-axis table 6A, X-axis table 7A, Y-axis table 6B, and X-axis table 7B and the mounting head 8 form a component mounting mechanism 130 (see FIG. 7 described later) that moves the mounting head 8 to mount components on the board 3.

[0020] The board recognition camera 9, which has moved onto the board 3, captures and recognizes the board 3. In addition, a component recognition camera 10 and a nozzle holder 11 are disposed on the path from the component supply unit 4 to the transport path 2. When the mounting head 8, which has taken out a component from the component supply unit 4, moves to the board 3 positioned on the mounting stage, the component held by the suction nozzle 8a is moved in the X direction above the component recognition camera 10, so that the component recognition camera 10 captures an image of the component held by the suction nozzle 8a.

[0021] The captured image is then processed by an image processing unit 114 (see FIG. 7 described later) to recognize the position of the component held by the suction nozzle 8a and to identify the type of component. The nozzle holding unit 11 stores multiple types of suction nozzles 8a in predetermined orientations, and the mounting head 8 accesses the nozzle holding unit 11 to perform a nozzle replacement operation, thereby replacing the nozzles in the mounting head 8 according to the type of target component.

[0022] Here, the structure of the component supply unit 4 will be described. As shown in Fig. 2, the component supply unit 4 is provided with a feeder base 4a for mounting a plurality of tape feeders 5. The tape feeders 5 are placed in the component supply unit 4 by a feeder mounting dolly 12. The dolly 12 is provided with a reel holding unit 13 for holding a tape reel 14 on which a carrier tape 15 is stored in a wound state. The reel holding unit 13 includes a holding roller for rotatably holding the tape reel 14, and the carrier tape 15 can be pulled out by rotating the tape reel 14 placed in the component supply unit 4.

[0023] Next, the function of the tape feeder 5 will be described with reference to FIG.

[0024] FIG. 3 is a diagram for explaining the configuration of tape feeder 5 according to the embodiment.

[0025] 3, frame member 5a attached to feeder base 4a is provided with tape running path 5b along which carrier tape 15 runs. Components P are held in component pockets 16a, which are recesses for storing components and are formed at a fixed pitch in carrier tape 15. The upper surface of component pocket 16a is covered with top tape 17.

[0026] The carrier tape 15 drawn out from the tape reel 14 is introduced from the rear of the frame member 5a and fed downstream (to the right in FIG. 3) along the upper surface of the tape running path 5b. In a component supply operation in which components are continuously supplied while the carrier tape 15 is pitch-fed, when the carrier tape 15 (also called the leading tape 15) wound around the tape reel 14 is consumed, a tape splicing is performed in which the leading end of the carrier tape 15 already loaded on the tape feeder 5 is spliced ​​to the leading end of the carrier tape 15 via a joint J. In this way, the leading tape 15 and the trailing tape 15A are spliced ​​together. The component supply unit 4 feeds the leading tape 15 and the trailing tape 15A, each of which stores a plurality of components, to the component removal position, and then supplies the trailing tape 15A to the component removal position.

[0027] A sprocket 21 driven by a rotary drive mechanism 20 is disposed above the downstream end of frame member 5a. Sprocket 21 is provided with feed pins 21a (see FIGS. 5A and 5B) that fit into feed holes 16b (see FIGS. 4A and 4B) provided at a fixed pitch in carrier tape 15. By driving sprocket 21 to rotate by rotary drive mechanism 20, sprocket 21 rotates, thereby feeding carrier tape 15 downstream.

[0028] The front side of sprocket 21 is a component suction position where component P in component pocket 16a is suctioned and picked up by suction nozzle 8a of mounting head 8. Note that hereinafter, suctioning a component is also referred to as "taking out a component." Sprocket 21 and rotation drive mechanism 20 form a tape feed mechanism that pitch-feeds carrier tape 15 along tape running path 5b to feed component P held on carrier tape 15 to the component suction position by suction nozzle 8a.

[0029] An upper guide section 18 is disposed on the upper surface of the downstream portion of the frame member 5a, which covers and guides the upper side of the carrier tape 15 in the vicinity of the component suction position. A suction opening 18a is provided in the upper guide section 18, and the component suction position is exposed from the upper guide section 18 by the suction opening 18a. The downstream end of the suction opening 18a serves as a top tape peeling section for peeling off the top tape 17. That is, while the carrier tape 15 runs under the upper guide section 18, the top tape 17 is peeled off by the top tape peeling section and folded back toward the upstream side. Then, from the component pocket 16a exposed by the peeling of the top tape, the component P is picked up by the suction nozzle 8a. The folded back top tape 17 is fed into the tape recovery section 5c by the top tape feeding mechanism 22 and recovered.

[0030] Next, tape splicing will be described with reference to Figures 4A and 4B.

[0031] 4A and 4B are diagrams for explaining tape splicing.

[0032] As shown in Fig. 4A, in tape splicing, the tail end of carrier tape 15 already loaded on tape feeder 5 and the head end of carrier tape 15A to be newly loaded are joined together via a butt line E. Splice tapes 28 and 29 are attached to both the top and bottom of the tape attachment margins of base tape 16 that sandwich butt line E in positions that cover component pockets 16a and feed holes 16b, respectively. As a result, as shown in Fig. 4B, the two carrier tapes 15 and 15A become one continuous carrier tape at seam J.

[0033] The splice tape 29 has a slit 29a in the longitudinal direction, so that when the feed pin 21a of the sprocket 21 fits into the feed hole 16b from below, the feed pin 21a can protrude upward through the slit 29a, preventing any hindrance to tape feeding. Note that while Fig. 4A shows a state in which the top tape 17 has been peeled off from the base tape 16, in tape splicing, the splice tape 28 is attached from above the top tape 17.

[0034] This tape splicing operation is performed using a dedicated jig, and the two carrier tapes 15 and 15A are aligned so that the pitch p* between the two component pockets 16a on either side of the butt line E is equal to the predetermined pitch p in the base tape 16. At this time, due to operational errors, the pitch p* does not necessarily match the predetermined pitch p perfectly, and after splicing, there may be a pitch error between the component pockets 16a near the seam J or a misalignment in the longitudinal direction of the two carrier tapes 15 and 15A.

[0035] Due to such pitch errors and alignment errors, when the seam J approaches the component suction position, the component pocket 16a cannot be pitch-fed to the correct position. That is, the component pockets 16a are aligned by fitting the feed pins 21a of the sprocket 21 into the component pockets 16a, but if there are pitch errors or alignment errors as described above, the positions of the component pockets 16a vary, and the suction nozzle 8a cannot stably pick up the components P in the component pockets 16a. For this reason, a suction position correction is required to relatively align the suction nozzle 8a with the component suction position where the component P fed by the tape feed mechanism stops.

[0036] For example, by photographing the components on the following tape 15A with the board recognition camera 9, the positions of the components on the following tape 15A, i.e., the suction positions of the components on the following tape 15A can be detected, and the suction position can be corrected. Also, for example, by lowering the suction nozzle 8a and measuring the distance until it contacts the top surface of the components on the following tape 15A, the height of the components on the following tape 15A, i.e., the suction height of the components on the following tape 15A can be detected, and the suction position can be corrected.

[0037] In addition, in order to accurately determine the identity of electrical characteristics of components before and after the switch from the preceding tape 15 to the following tape 15A in the tape feeder 5, the component mounting apparatus 100 is provided with an LCR checker 19. The LCR checker 19 can measure, for example, an inductance value, a capacitance value, and a resistance value as electrical characteristics of components. For example, a component on the following tape 15A that is picked up by the suction nozzle 8a is placed on the LCR checker 19, whereby the electrical characteristics of the component are measured, and the identity of the electrical characteristics with the component on the preceding tape 15 can be determined. Note that the component placed on the LCR checker 19 for use in measuring the electrical characteristics may be discarded or mounted on the board 3 after the electrical characteristics are measured.

[0038] The LCR checker 19, the board recognition camera 9, and the component mounting mechanism 130 are an example of a subsequent tape processing execution unit that executes a predetermined subsequent tape processing on the components on the subsequent tape 15A that are supplied to the component removal position by the component supply unit 4. For example, the predetermined subsequent tape processing includes measuring the electrical characteristics of the components on the subsequent tape 15A, detecting the suction positions of the components on the subsequent tape 15A, or detecting the suction height of the components P on the subsequent tape 15A.

[0039] Next, a method for detecting the seam J during the tape feeding process of the carrier tape 15 will be described with reference to FIG.

[0040] 5A and 5B are diagrams for explaining a method of detecting seam J between leading tape 15 and following tape 15A.

[0041] 5A shows a plan view of the upper guide portion 18 provided at the tip of the frame member 5a. A component pocket 16a is exposed within a suction opening 18a of the upper guide portion 18 provided corresponding to the pick-up position by the suction nozzle 8a. A feed pin 21a of the sprocket 21 engages with a feed hole 16b downstream of the suction opening 18a. A groove for allowing the feed pin 21a to escape is provided at a position on the upper guide portion 18 corresponding to the sprocket 21, so that the feed pin 21a protruding upward from the feed hole 16b does not interfere with the upper guide portion 18.

[0042] At a position corresponding to above the feed hole 16b in the upper guide portion 18, an opening 18b for detecting a seam is provided at a position separated from the suction opening 18a on the upstream side. As shown in Fig. 5B, a sensor 30, which is a reflective optical sensor, is inserted from below at a position corresponding to the opening 18b in the frame member 5a, and a detection signal from the sensor 30 is sent to a control portion 110 (see Fig. 7 described later), and the control portion 110 detects a seam J in the carrier tape 15 based on the detection signal from the sensor 30. In other words, the control portion 110 detects that a component of the succeeding tape 15A is supplied to the suction opening 18a (component removal position) (i.e., a change of the tape occurs) by feeding the tape a predetermined number of times thereafter.

[0043] When the normal portion of the carrier tape 15 passes above the sensor 30, the light from the sensor 30 passes upward through the sprocket holes 16b and the openings 18b at the timing when the sprocket holes 16b are positioned between the sensor 30 and the openings 18b. At this timing, the sensor 30 does not detect the reflected light, and a signal is sent indicating that the sprocket holes 16b have been detected. This sprocket hole detection signal is then repeatedly output at intervals corresponding to the sprocket hole pitch, allowing the control unit 110 to determine that there is no seam J.

[0044] 5B, when seam J with feed holes 16b blocked by splice tape 29 passes above sensor 30, the light from sensor 30 is reflected by splice tape 29 in the area where splice tape 29 is attached, and feed holes 16b are not detected. When this state of not detecting feed holes continues for a predetermined period of time, control unit 110 detects that seam J has passed the position of sensor 30.

[0045] There are cases where the component picked up at the end of one turn is the last component on the leading tape 15. The problem that arises in this case will be described with reference to FIG. 6A.

[0046] Fig. 6A is a diagram for explaining an example of the operation of a component mounting device in a comparative example. Fig. 6A shows a top view of leading tape 15 and trailing tape 15A connected at joint J. In Fig. 6A, the component marked "L" is the last component on leading tape 15, the component marked "1" is the first component on trailing tape 15A, and the second and subsequent components on trailing tape 15A are marked "2" and "3."

[0047] For example, the last component "L" of the leading tape 15 is supplied to the component removal position as the component to be picked up at the end of the first turn, and the last component "L" of the leading tape 15 is picked up in the first turn. Next, the tape is fed in the second turn, and the first component "1" of the following tape 15A is supplied to the component removal position. In the comparative example, at this timing, it is recognized that the tape has been switched, and in order to perform the following tape processing on the first component "1" of the following tape 15A, the removal of the first component "1" of the following tape 15A is skipped in the second turn. Then, in the third turn, the following tape processing is performed on the first component "1" of the following tape 15A. This causes a loss of one turn of production time, which may result in a decrease in productivity.

[0048] In contrast, the component mounting apparatus 100 according to the embodiment can solve the above problem as shown in FIG. 6B.

[0049] Fig. 6B is a diagram for explaining an example of the operation of the component mounting apparatus 100 in the embodiment. Fig. 6B shows a top view of the leading tape 15 and the trailing tape 15A connected at the joint J. In Fig. 6B, the component marked "L" is the last component on the leading tape 15, the component marked "1" is the first component on the trailing tape 15A, and the second and subsequent components on the trailing tape 15A are marked "2" and "3".

[0050] For example, as in the comparative example, the last component "L" of the leading tape 15 is supplied to the component removal position as the component to be picked up at the end of the first turn, and the last component "L" of the leading tape 15 is picked up at the first turn. Next, the tape is fed at the second turn, so that the first component "1" of the following tape 15A is supplied to the component removal position. In the embodiment, since it is recognized in advance that the last component "L" of the leading tape 15 is supplied to the component removal position as the component to be picked up at the end of the first turn, the following tape processing execution unit can be made to execute the following tape processing for the first component "1" of the following tape 15A at the second turn, not the third turn. This makes it possible to suppress a decrease in productivity even if the component to be picked up at the end of one turn is the last component of the leading tape 15.

[0051] The following describes the functional configuration and operation of component mounting apparatus 100, which can suppress a decrease in productivity even when the component picked up at the end of one turn is the last component on leading tape 15.

[0052] 7 is a block diagram showing an example of a component mounting apparatus 100 according to an embodiment. Note that the board transport mechanism 120, the component mounting mechanism 130, the tape feeder 5, the LCR checker 19, the component recognition camera 10, and the board recognition camera 9 have already been described, and therefore their description will be omitted.

[0053] The control unit 110 controls the component supply unit 4, the mounting unit (eg, the mounting head 8), and the subsequent tape processing execution unit (eg, the LCR checker 19, the board recognition camera 9, and the component mounting mechanism 130).

[0054] The control unit 110 includes a storage unit 111, a mechanism driving unit 112, a new tape processing control unit 113, and an image capture processing unit 114. The control unit 110 is a computer including a processor (microprocessor) and a memory. The memory is a ROM (Read Only Memory) and a RAM (Random Access Memory), and can store a program executed by the processor. The mechanism driving unit 112, the new tape processing control unit 113, and the image capture processing unit 114 are realized by a processor that executes a program stored in the memory. The storage unit 111 is realized by a memory, but may be a memory separate from the memory in which the program is stored.

[0055] For example, mounting data, component data, tape switching information, a new tape processing required flag, and component pickup position / height information are stored in storage unit 111. Now, mounting data will be described with reference to FIG.

[0056] FIG. 8 is a diagram illustrating an example of the mounting data.

[0057] 8, for example, the mounting data includes information indicating, for each turn, what component ID each of the multiple suction nozzles 8a of the mounting head 8 will pick up, from which supply position (in other words, from which of the multiple tape feeders 5), and at which position (x, y) and in what orientation (θ) the picked-up component will be mounted on the board 3. By referring to such mounting data, the component mounting apparatus 100 can mount the component supplied to the component removal position on the board 3 for each turn.

[0058] The component data includes information indicating the electrical characteristics of each component mounted on the board 3. For example, by comparing the electrical characteristics of the components on the following tape 15A measured by the LCR checker 19 with the component data, it is possible to determine whether the electrical characteristics of the components on the following tape 15A are correct.

[0059] The tape switching information is stored in the memory unit 111 for each of the multiple tape feeders 5. For example, when a detection signal of the seam J from the sensor 30 of a certain tape feeder 5 is sent to the control unit 110, tape switching information indicating that the seam J has been detected for that tape feeder 5 is stored in the memory unit 111. This allows the control unit 110 to detect that the last component of the leading tape 15 has been supplied to the component removal position by the tape feeder 5 feeding the tape a predetermined number of times. For example, the predetermined number of times can be set according to the distance between the portion where the sensor 30 detects the seam J (e.g., the opening 18b) and the component removal position (e.g., the suction opening 18a). Note that the tape feeder 5 may transmit to the control unit 110 that the last component of the leading tape 15 has been supplied to the component removal position at the timing when the tape feeder 5 has fed the tape a predetermined number of times after detecting the seam J. In other words, the control unit 110 or the tape feeder 5 may determine whether or not the tape feed has been performed a predetermined number of times after the seam J has been detected. In this way, whether the last component of the leading tape 15 has been supplied as the last component supplied from the component supply unit 4 in the first turn is determined based on the number of components supplied after the seam J between the leading tape 15 and the trailing tape 15A is detected.

[0060] The new tape processing required flag is stored in the storage unit 111 for each of the multiple tape feeders 5. The new tape processing required flag will be described later.

[0061] The component suction position / height information is stored in the memory unit 111 for each of the multiple tape feeders 5. For example, component suction position / height information indicating the suction position and suction height of the components on the following tape 15A detected by the board recognition camera 9 and the component mounting mechanism 130 is stored in the memory unit 111. This allows the control unit 110 to correct the suction position in order to correctly pick up the components on the following tape 15A. Note that the component suction position / height information may be information indicating the suction position and suction height of the components after the correction.

[0062] The mechanism driving unit 112 is a component for driving the board transport mechanism 120, the component mounting mechanism 130, and the tape feeder 5.

[0063] The new tape processing control unit 113 is a component that causes the subsequent tape processing execution unit (e.g., the LCR checker 19, the board recognition camera 9, and the component mounting mechanism 130) to execute a specified subsequent tape processing (e.g., measuring the electrical characteristics of components on the subsequent tape 15A, detecting the adsorption position of components on the subsequent tape 15A, or detecting the adsorption height of components on the subsequent tape 15A).

[0064] The image capturing processing unit 114 controls the component recognition camera 10 and the board recognition camera 9, and also performs recognition processing of the images captured by the component recognition camera 10 and the board recognition camera 9.

[0065] When the control unit 110 detects that the last component on the leading tape 15 has been supplied to the component removal position as the last component to be supplied from the component supply unit 4 to the component removal position in the first turn of the multiple turns, the control unit 110 causes the component supply unit 4 to supply the first component on the following tape 15A to the component removal position in the second turn after the first turn, and causes the following tape processing execution unit to execute a predetermined following tape processing on the first component on the following tape 15A. Details of this operation of the control unit 110 will be described with reference to FIG. 9.

[0066] 9 is a flowchart showing an example of the operation of component mounting apparatus 100 according to the embodiment. Note that component mounting apparatus 100 performs the process shown in FIG.

[0067] First, the control unit 110 determines whether or not a component is picked up in this turn (step S11). For example, the control unit 110 performs the above determination by checking the mounting data stored in the storage unit 111.

[0068] When the control unit 110 determines that a component is being picked up during this turn (Yes in step S11), it causes the tape feeder 5 to feed the tape (step S12). This causes the component to be supplied to the component pick-up position. For example, this turn is the first turn of multiple turns.

[0069] Next, the control unit 110 determines whether or not a new tape processing required flag is ON (step S13). For example, the control unit 110 performs the above determination by checking the new tape processing required flag of the target tape feeder 5 stored in the storage unit 111.

[0070] When the control unit 110 determines that the new tape processing required flag is not ON (No in step S13), it controls the mounting head 8 to pick up (suck up) the components on the preceding tape 15 (step S14).

[0071] Next, the control unit 110 determines whether or not there is further component pickup in this turn (first turn) (step S15). For example, the control unit 110 performs the above determination by checking the mounting data stored in the storage unit 111.

[0072] When the control unit 110 determines that there is another component to be picked up in this turn (Yes in step S15), it repeats the process from step S12 onwards. That is, the process from step S12 to step S15 is repeated until the last component in the first turn is supplied to the component removal position.

[0073] If the control unit 110 determines that no further components are being picked up in this turn (No in step S15), it determines whether or not a change in tape will occur as a result of the next component being supplied (step S16). That is, the control unit 110 determines whether or not it has been detected that the last component on the leading tape 15 has been supplied to the component removal position as the last component to be supplied to the component removal position from the component supply unit 4 in the first turn. This is because if it has been detected that the last component on the leading tape 15 has been supplied to the component removal position as the last component to be supplied to the component removal position from the component supply unit 4 in the first turn, a change in tape will occur as a result of the next component being supplied.

[0074] When the control unit 110 determines that a tape change will occur due to the supply of the next component (Yes in step S16), it turns on a new tape processing required flag (step S17). For example, the control unit 110 stores in the memory unit 111 that the new tape processing required flag of the target tape feeder 5 has been turned on. The new tape processing required flag is a flag for causing a subsequent tape processing execution unit (e.g., the LCR checker 19, the board recognition camera 9, and the component mounting mechanism 130) to execute a predetermined subsequent tape processing (e.g., measurement of electrical characteristics of a component on the subsequent tape 15A, detection of the suction position of a component on the subsequent tape 15A, or detection of the suction height of a component on the subsequent tape 15A) for the first component on the subsequent tape 15A in a second turn after the first turn.

[0075] If the control unit 110 determines that no component is picked up in this turn (first turn) (No in step S11), if it determines that no tape change will occur even if the next component is supplied (No in step S16), or if it sets the new tape processing required flag to ON, it determines whether there is a next turn (step S18). For example, the control unit 110 makes the above determination by checking the mounting data stored in the memory unit 111. For example, the next turn is set to the second turn after the first turn.

[0076] When the control unit 110 determines that there is a next turn (Yes in step S18), it determines whether or not there is component suction in this turn (second turn) (step S11), and when it determines that there is component suction in this turn (Yes in step S11), it causes the tape feeder 5 to feed the tape (step S12). Then, the control unit 110 determines whether or not a new tape processing required flag is ON (step S13), and when it determines that the new tape processing required flag is ON (Yes in step S13), it causes the subsequent tape processing execution unit to execute a predetermined subsequent tape processing for the first component on the subsequent tape 15A in the second turn. Specifically, the control unit 110 causes the board recognition camera 9 and the component mounting mechanism 130 to execute detection of the component suction position and the component suction height (step S19), controls the mounting head 8 to take out (suck) the component (step S20), and causes the LCR checker 19 to execute measurement of the electrical characteristics of the component (LCR check) (step S21). For example, in step S19, detection of the component suction position and component suction height is performed for a component supplied at the component removal position by the board recognition camera 9 and component mounting mechanism 130. For example, in step S20, the component whose component suction position and component suction height have been detected is picked up by the mounting head 8. For example, in step S21, the component picked up by the mounting head 8 is moved to the LCR checker 19 and placed on the LCR checker 19, where an LCR check is performed.

[0077] Next, the control unit 110 obtains the result of the LCR check from the LCR checker 19, and determines whether or not the result is acceptable (step S22). For example, the control unit 110 performs the above determination by comparing the obtained result of the LCR check with the part data stored in the storage unit 111.

[0078] When the control unit 110 determines that the result of the LCR check is satisfactory (Yes in step S22), that is, when it has been confirmed that the electrical characteristics of the components before and after the switch from the preceding tape 15 to the following tape 15A are identical, it turns off the new tape processing required flag (step S23). Thereafter, the component mounting apparatus 100 can mount components on the board 3 using the components on the following tape 15A whose electrical characteristics have been confirmed to be identical to those of the components on the preceding tape 15. As described above, the components used in the LCR check may be mounted on the board 3 or may be discarded.

[0079] If the control unit 110 determines that the result of the LCR check is problematic (No in step S22), that is, if it is not possible to confirm the identity of the electrical characteristics of the components before and after the switch from the preceding tape 15 to the following tape 15A, it issues a notice (step S24). This allows an operator or the like to recognize that the following tape 15A is a tape that stores components with electrical characteristics different from those of the preceding tape 15, and, for example, to replace the following tape 15A with one that stores the correct components.

[0080] The component supply unit 4 may be an autoload feeder, and may automatically start feeding the following tape 15A when it detects that the end of the leading tape 15 has passed a predetermined position. In this case, when it is detected in step S12 that the end of the leading tape 15 has passed a predetermined position, the control unit 110 can determine in step S16 that a tape change will occur when the next component is supplied.

[0081] As described above, when it is detected that the last component on the leading tape 15 has been supplied to the component removal position as the last component to be supplied from the component supply unit 4 to the component removal position in the first turn, it is known in advance that the first component on the trailing tape 15A will be supplied to the component removal position in the next second turn. Therefore, when the component supply unit 4 is caused to supply the first component on the trailing tape 15A to the component removal position in the second turn, it is possible to cause the trailing tape processing execution unit to execute a predetermined trailing tape processing on the first component on the trailing tape 15A in the second turn instead of the next turn. Therefore, even if the component to be picked up at the end of one turn is the last component on the leading tape 15, a decrease in productivity can be suppressed.

[0082] In addition, when the leading tape 15 and the trailing tape 15A are joined by splicing, by detecting the joint J between the leading tape 15 and the trailing tape 15A, it is possible to detect that the last component of the leading tape 15 has been supplied to the component removal position as the last component to be supplied from the component supply unit 4 in the first turn. For example, at the timing when the joint J between the leading tape 15 and the trailing tape 15A is detected, it is possible to recognize how many more times the tape needs to be fed before the last component of the leading tape 15 is supplied. Therefore, it is possible to determine that the last component of the leading tape 15 has been supplied as the last component to be supplied from the component supply unit 4 in the first turn, based on the number of components supplied after the joint J between the leading tape 15 and the trailing tape 15A is detected.

[0083] In addition, if the component supply unit 4 is an autoload feeder, by detecting that the end of the leading tape 15 has passed a predetermined position, it is possible to detect that the last component on the leading tape 15 has been supplied to the component removal position as the last component to be supplied from the component supply unit 4 to the component removal position in the first turn.

[0084] (Other embodiments) Although the component mounting device 100 of the present disclosure has been described based on the embodiment, the present disclosure is not limited to the above embodiment. As long as it does not deviate from the gist of the present disclosure, various modifications conceived by a person skilled in the art to the present embodiment and forms constructed by combining components in different embodiments are also included within the scope of the present disclosure.

[0085] For example, the present disclosure can be realized not only as the component mounting apparatus 100 but also as a component mounting method including steps (processing) performed by the components that make up the component mounting apparatus 100.

[0086] The component mounting method is a component mounting method executed by a component mounting device, and the component mounting device includes a component supplying section that supplies all of the components on the leading tape to a component removal position by sending out a leading tape and a trailing tape, each of which stores a plurality of components, and then supplies the plurality of components on the trailing tape to the component removal position; a mounting section that repeats turns a plurality of times, with one turn being defined as removing at least one component supplied to the component removal position by the component supplying section and mounting it on a board; and a predetermined trailing tape processing for the components on the trailing tape that have been supplied to the component removal position by the component supplying section. and a subsequent tape processing execution unit which executes a predetermined subsequent tape processing for the first component on the subsequent tape, and in the component mounting method, as shown in FIG. 9, when it is detected that the last component on the preceding tape has been supplied to the component removal position as the last component to be supplied to the component removal position from the component supply unit in a first turn of multiple turns (Yes in step S16), in a second turn after the first turn, the component supply unit is caused to supply the first component on the subsequent tape to the component removal position (step S12), and the subsequent tape processing execution unit is caused to execute a predetermined subsequent tape processing for the first component on the subsequent tape (steps S19, S21).

[0087] For example, the present disclosure can be realized as a program for causing a computer (processor) to execute steps included in the component mounting method. Furthermore, the present disclosure can be realized as a non-transitory computer-readable recording medium, such as a CD-ROM, on which the program is recorded.

[0088] For example, when the present disclosure is realized by a program (software), each step is executed by executing the program using hardware resources such as a computer's CPU, memory, input / output circuit, etc. In other words, each step is executed by the CPU acquiring data from the memory or input / output circuit, etc., performing calculations, and outputting the calculation results to the memory or input / output circuit, etc.

[0089] In the above embodiment, each component included in the component mounting apparatus 100 may be configured with dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU or a processor reading and executing a software program recorded on a recording medium such as a hard disk or a semiconductor memory.

[0090] Some or all of the functions of the component mounting apparatus 100 according to the above embodiment are typically realized as an LSI, which is an integrated circuit. These may be individually integrated into one chip, or may be integrated into one chip that includes some or all of them. The integrated circuit is not limited to an LSI, and may be realized by a dedicated circuit or a general-purpose processor. An FPGA (Field Programmable Gate Array) that can be programmed after the LSI is manufactured, or a reconfigurable processor that can reconfigure the connections and settings of circuit cells inside the LSI may be used.

[0091] Furthermore, if an integrated circuit technology that can replace LSI emerges due to advances in semiconductor technology or a different derivative technology, naturally, each component included in component mounting apparatus 100 may be integrated into an integrated circuit using that technology.

[0092] In addition, the present disclosure also includes forms obtained by applying various modifications to the embodiments that a person skilled in the art may conceive, and forms realized by arbitrarily combining the components and functions of each embodiment within the scope that does not deviate from the spirit of the present disclosure.

[0093] (Additional Note) The above description of the embodiments discloses the following techniques.

[0094] (Technology 1) A component supply unit that feeds a leading tape and a trailing tape, each of which stores a plurality of components, to supply all of the plurality of components on the leading tape to a component removal position, and then supplies the plurality of components on the trailing tape to the component removal position; a mounting unit that takes at least one component supplied to the component removal position by the component supply unit and mounts it on a board, and repeats the turn a plurality of times; a trailing tape processing execution unit that executes a predetermined trailing tape process on the components on the trailing tape supplied to the component removal position by the component supply unit; and a control unit which controls the component supply unit, the mounting unit, and the subsequent tape processing execution unit, wherein when it is detected that the last component of the preceding tape has been supplied to the component removal position as the last component to be supplied to the component removal position from the component supply unit in a first turn of the plurality of turns, the control unit causes the component supply unit to supply the first component of the subsequent tape to the component removal position in a second turn after the first turn, and causes the subsequent tape processing execution unit to execute the predetermined subsequent tape processing on the first component of the subsequent tape.

[0095] According to this, when it is detected that the last component on the leading tape has been supplied to the component removal position as the last component to be supplied from the component supply unit to the component removal position in the first turn, it is known in advance that the first component on the trailing tape will be supplied to the component removal position in the next second turn. Therefore, when the component supply unit is caused to supply the first component on the trailing tape to the component removal position in the second turn, it is possible to cause the trailing tape processing execution unit to execute a predetermined trailing tape processing on the first component on the trailing tape in the second turn instead of the next turn. Therefore, even if the component picked up at the end of one turn is the last component on the leading tape, a decrease in productivity can be suppressed.

[0096] (Technology 2) The component mounting apparatus according to Technology 1, wherein the predetermined subsequent tape processing includes measuring electrical characteristics of components on the subsequent tape.

[0097] This allows components with the correct electrical characteristics (inductance value, capacitance value, or resistance value) to be mounted.

[0098] (Technology 3) The component mounting device according to Technology 1 or 2, wherein the predetermined subsequent tape processing includes detection of a component suction position on the subsequent tape.

[0099] This allows the component to be picked up at the correct pickup position.

[0100] (Technology 4) The component mounting device according to any one of Technologies 1 to 3, wherein the predetermined subsequent tape processing includes detection of a suction height of components on the subsequent tape.

[0101] This allows the component to be picked up at the correct pickup height.

[0102] (Technical Technique 5) The component mounting device according to any one of Technical Techniques 1 to 4, wherein the preceding tape and the succeeding tape are joined by splicing.

[0103] When the leading tape and the trailing tape are joined by splicing, by detecting the joint between the leading tape and the trailing tape, it is possible to detect that the last component of the leading tape has been supplied to the component removal position as the last component to be supplied from the component supply section to the component removal position in the first turn.

[0104] (Technology 6) The component mounting device described in Technology 5, in which the fact that the last component of the preceding tape has been supplied as the last component supplied from the component supply unit in the first turn is determined based on the number of components supplied after the seam between the preceding tape and the following tape is detected.

[0105] For example, at the timing when the splice between the leading tape and the trailing tape is detected, it is possible to recognize how many more times the tape needs to be fed before the last component on the leading tape is supplied. Therefore, it is possible to determine that the last component on the leading tape has been supplied as the last component supplied from the component supply unit in the first turn, based on the number of components supplied after the splice between the leading tape and the trailing tape is detected.

[0106] (Technology 7) A component mounting device according to any one of Technologies 1 to 4, wherein the component supply unit is an autoload feeder, and when it detects that the end of the preceding tape has passed a predetermined position, it automatically starts feeding out the following tape.

[0107] If the component supply unit is an autoload feeder, by detecting that the end of the leading tape has passed a predetermined position, it is possible to detect that the last component on the leading tape has been supplied to the component removal position as the last component to be supplied from the component supply unit to the component removal position in the first turn.

[0108] (Technology 8) A component mounting method executed by a component mounting device, the component mounting device comprising: a component supply unit that feeds a leading tape and a trailing tape, each of which stores a plurality of components, to supply all of the plurality of components on the leading tape to a component removal position, and then supplies the plurality of components on the trailing tape to the component removal position; a mounting unit that repeats a turn a plurality of times, each turn being one turn for removing at least one component supplied to the component removal position by the component supply unit and mounting the component on a board; and a subsequent tape processing execution unit that executes a predetermined subsequent tape processing on the components, wherein when it is detected that the last component of the preceding tape has been supplied to the component removal position as the last component to be supplied to the component removal position from the component supply unit in a first turn of the multiple turns, the component mounting method causes the component supply unit to supply the first component of the subsequent tape to the component removal position in a second turn after the first turn, and causes the subsequent tape processing execution unit to execute the predetermined subsequent tape processing on the first component of the subsequent tape.

[0109] This makes it possible to provide a component mounting method that can suppress a decrease in productivity even if the component picked up at the end of one turn is the last component on the preceding tape. [Industrial Applicability]

[0110] The present disclosure can be applied to a component mounting device that picks up components from a tape feeder and mounts the components. [Explanation of symbols]

[0111] 1 Base 2 Transport path 3. Substrate 4. Parts Supply Department 4a Feeder Base 5 Tape Feeder 5a Frame member 5b Tape running path 5c Tape Collection Section 6A, 6B Y-axis table 7A, 7B X-axis table 8 Mounting Head 8a Suction nozzle 9. Circuit Board Recognition Camera 10 Part Recognition Camera 11 Nozzle holder 12 Trolley 13 Reel holder 14 Tape reel 15 Carrier tape (preceding tape) 15A Carrier Tape (Subsequent Tape) 16 Base Tape 16a Parts pocket 16b Feed hole 17 Top Tape 18 Upper guide part 18a Suction opening 18b opening 19 LCR Checker 20 Rotational drive mechanism 21 Sprocket 21a Feed pin 22 Top tape feed mechanism 28, 29 Splice tape 29a Slit 30 Sensors 100 Component mounting equipment 110 Control section 111 Storage section 112 Mechanism drive unit 113 New Tape Processing Control Unit 114 Imaging processing section 120 Substrate transport mechanism 130 Component Mounting Mechanism E Butt Line J Seam P parts p, p* pitch

Claims

1. a component supply unit that feeds a leading tape and a trailing tape, each of which stores a plurality of components, to supply all of the plurality of components on the leading tape to a component removal position, and then supplies the plurality of components on the trailing tape to the component removal position; a mounting unit which performs one turn to pick up at least one component supplied to the component pick-up position by the component supply unit and mount the component on a board, the mounting unit repeating the turn a number of times; a subsequent tape processing execution unit that executes a predetermined subsequent tape processing on the components on the subsequent tape that have been supplied to the component removal position by the component supply unit; a control unit that controls the component supply unit, the mounting unit, and the subsequent tape processing execution unit, when it is detected that the last component of the preceding tape has been supplied to the component removal position as the last component to be supplied from the component supply unit to the component removal position in a first turn of the plurality of turns, the control unit causes the component supply unit to supply the first component of the succeeding tape to the component removal position in a second turn after the first turn, and causes the succeeding tape processing execution unit to execute the predetermined succeeding tape processing on the first component of the succeeding tape. Component mounting equipment.

2. the predetermined subsequent tape processing includes measuring electrical characteristics of components of the subsequent tape; The component mounting apparatus according to claim 1 .

3. the predetermined subsequent tape processing includes detecting a suction position of a component on the subsequent tape; The component mounting apparatus according to claim 1 .

4. the predetermined subsequent tape processing includes detecting a suction height of a component on the subsequent tape; The component mounting apparatus according to claim 1 .

5. The preceding tape and the following tape are joined by splicing. The component mounting apparatus according to claim 1 .

6. The fact that the last component of the preceding tape has been supplied as the last component supplied from the component supply unit in the first turn is determined according to the number of components supplied after a joint portion between the preceding tape and the following tape is detected. The component mounting apparatus according to claim 5 .

7. the component supply unit is an autoload feeder, and when it detects that the end of the preceding tape has passed a predetermined position, it automatically starts feeding the succeeding tape. The component mounting apparatus according to claim 1 .

8. A component mounting method executed by a component mounting apparatus, comprising: The component mounting apparatus includes: a component supply unit that feeds a leading tape and a trailing tape, each of which stores a plurality of components, to supply all of the plurality of components on the leading tape to a component removal position, and then supplies the plurality of components on the trailing tape to the component removal position; a mounting unit which performs one turn to pick up at least one component supplied to the component pick-up position by the component supply unit and mount the component on a board, the mounting unit repeating the turn a number of times; a subsequent tape processing execution unit that executes a predetermined subsequent tape processing on the components of the subsequent tape that are supplied to the component removal position by the component supply unit, In the component mounting method, when it is detected that the last component of the preceding tape has been supplied to the component removal position as the last component to be supplied from the component supply unit to the component removal position in a first turn of the plurality of turns, in a second turn after the first turn, the component supply unit is caused to supply the first component of the succeeding tape to the component removal position, and the succeeding tape processing execution unit is caused to execute the predetermined succeeding tape processing on the first component of the succeeding tape. Component mounting method.

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