Stretchable device

Abstract

To provide a stretchable device which is less likely to damage functional elements arranged in a body by a load during use.SOLUTION: A stretchable device 100 has a resin base material 10, an array layer 30 provided on the resin base material 10, and a pair of resin layers which sandwich the resin base material 10 and the array layer 30 from both sides in a thickness direction where the resin base material 10 and the array layer 30 are arranged and are formed of a resin having elastic modulus smaller than that of the resin base material 10, wherein the resin base material 10 has a plurality of body parts 11 separated from each other in a direction perpendicular to the thickness direction, and a plurality of hinge parts 12 for connecting the body parts 11 while meandering, the array layer 30 has functional elements 36 overlapped with the body part 11 when being viewed from the thickness direction, the resin layer 50 is provided with a first rigid part 20 having elastic modulus higher than that of a resin forming the resin layer 50, and the first rigid part 20 is overlapped with the body part 11 when being viewed from the thickness direction.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a stretchable device. [Background technology]

[0002] The stretchable device has excellent elasticity and flexibility. The stretchable device includes an array layer, a resin substrate serving as the base material of the array layer, and two resin layers sandwiching the array layer and the resin substrate. The resin substrate includes body parts arranged in a matrix and hinge parts connecting the body parts to each other. The hinge parts have a meandering shape as shown in Patent Document 1, for example. The array layer of the stretchable device includes an electric circuit. An example of the electric circuit is a load detection circuit. The load detection circuit includes a strain gauge and a switch element. The strain gauge is arranged so as to overlap the hinge part in a planar view. The switch element is arranged so as to overlap the body part in a planar view. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-118273 Summary of the Invention [Problem to be solved by the invention]

[0004] When a tensile load acts on a stretchable device, the arc portion of the hinge portion is deformed so as to expand. This lengthens the distance from one end of the hinge portion to the other end, and the stretchable device is extended. Furthermore, the strain gauge is deformed in response to the deformation of the hinge portion, and the resistance value of the strain gauge changes. Then, by detecting the amount of change in the resistance value, the magnitude of the load acting on the hinge portion is calculated. On the other hand, deformation of the body portion may damage the switch element disposed in the body portion, which is undesirable. Therefore, there is a demand for the development of a stretchable device in which the functional element (switch element) disposed in the body portion is less likely to be damaged.

[0005] An object of the present invention is to provide a stretchable device in which a functional element disposed in a body is unlikely to be damaged by the load during use. [Means for solving the problem]

[0006] A stretchable device according to one aspect of the present disclosure includes a resin substrate, an array layer provided on the resin substrate, and a pair of resin layers sandwiching the resin substrate and the array layer from both sides in the thickness direction in which the resin substrate and the array layer are arranged, the pair being made of a resin having a smaller elastic modulus than the resin substrate. The resin substrate includes a plurality of body portions spaced apart from each other in a direction perpendicular to the thickness direction, and a plurality of hinge portions that meander and connect the body portions. The array layer includes a functional element that overlaps with the body portions when viewed from the thickness direction. The resin layer includes a first rigid portion having a higher elastic modulus than the resin forming the resin layer. The first rigid portion overlaps with the body portions when viewed from the thickness direction. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic diagram of a stretchable device according to an embodiment. [Diagram 2] FIG. 2 is a schematic diagram showing a cross section of a stretchable device according to an embodiment, and more specifically, a cross section taken along line II-II in FIG. [Diagram 3] FIG. 3 is a plan view of the resin base material disposed on the first surface of the first resin layer in the first embodiment, viewed from the first thickness direction. [Figure 4] FIG. 4 is an enlarged view of the body portion and the hinge portion of the first embodiment. [Diagram 5] FIG. 5 is an enlarged view of the body portion and the hinge portion to which a tensile load is applied in the first embodiment. [Figure 6] FIG. 6 is a circuit diagram of an electric circuit included in the array layer of the first embodiment. [Figure 7] FIG. 7 is an enlarged view of the glass piece of embodiment 1 as viewed from the second thickness direction. [Figure 8] FIG. 8 is a flow diagram showing the first half of the manufacturing process for the stretchable device of the first embodiment. [Figure 9] FIG. 9 is a flow diagram showing the latter half of the manufacturing process for the stretchable device of the first embodiment. [Figure 10] FIG. 10 is an enlarged view of the first rigid portion of the first modification example viewed from the second thickness direction. [Figure 11] FIG. 11 is an enlarged view of the first rigid portion of the second modification example viewed from the second thickness direction. [Figure 12] FIG. 12 is a schematic cross-sectional view of the stretchable device according to the second embodiment. As shown in FIG. [Figure 13] FIG. 13 is a flow diagram showing the first half of the manufacturing process for the stretchable device of the second embodiment. [Figure 14] FIG. 14 is a flow diagram showing an intermediate stage of the manufacturing process for the stretchable device of the second embodiment. [Figure 15] FIG. 15 is a flow diagram showing the latter half of the manufacturing process for the stretchable device of the second embodiment. [Figure 16] FIG. 16 is a schematic cross-sectional view of the stretchable device according to the third embodiment. As shown in FIG. [Figure 17] FIG. 17 is a flow diagram showing the first half of the manufacturing process for the stretchable device of the third embodiment. [Figure 18]FIG. 18 is a flow diagram showing the latter half of the manufacturing process for the stretchable device of the third embodiment. [Figure 19] FIG. 19 is a schematic cross-sectional view of the stretchable device according to the fourth embodiment. As shown in FIG. [Figure 20] FIG. 20 is a flow diagram showing the first half of the manufacturing process for the stretchable device of the fourth embodiment. [Figure 21] FIG. 21 is a flow diagram showing the latter half of the manufacturing process for the stretchable device of the fourth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] The form (embodiment) for carrying out the present disclosure will be described in detail with reference to the drawings. The invention of the present disclosure is not limited to the contents described in the following embodiment. In addition, the components described below include those that a person skilled in the art can easily imagine and those that are substantially the same. Furthermore, the components described below can be appropriately combined. Note that the disclosure is merely an example, and those that a person skilled in the art can easily imagine appropriate modifications while maintaining the gist of the invention are naturally included in the scope of the present invention. In order to make the explanation clearer, the drawings may be schematic in terms of the width, thickness, shape, etc. of each part compared to the actual embodiment, but are merely an example and do not limit the interpretation of the present invention. In addition, in this specification and each figure, the same reference numerals are given to components similar to those described above with respect to the previous figures, and detailed explanations may be omitted as appropriate.

[0009] Furthermore, in this specification and the claims, when expressing an aspect of arranging another structure on top of a certain structure, the term "on top" is used, unless otherwise specified, to include both the case where another structure is arranged directly on top of a certain structure so as to be in contact with the certain structure, and the case where another structure is arranged above a certain structure via yet another structure.

[0010] (Embodiment 1) FIG. 1 is a schematic diagram of a stretchable device according to an embodiment. FIG. 2 is a schematic diagram of a cross section of a stretchable device according to an embodiment, specifically, a cross section taken along line II-II in FIG. 3. As shown in FIGS. 1 and 2, the stretchable device 100 is formed in a plate shape. The stretchable device 100 has a front surface 1 and a back surface 2 (not shown in FIG. 1; see FIG. 2) that face in opposite directions. Hereinafter, the directions parallel to the front surface 1 and the back surface 2 are referred to as planar directions.

[0011] 1, the stretchable device 100 is formed into a rectangle when viewed from a direction opposite to the surface 1. Thus, the surface 1 has a pair of long sides 3 and a pair of short sides 4. Hereinafter, the direction parallel to the long sides 3 will be referred to as the longitudinal direction, and the direction parallel to the short sides 4 will be referred to as the cross direction.

[0012] 2, the stretchable device 100 includes a first resin layer 50, a resin substrate 10, an array layer 30, and a second resin layer 60, which are laminated in this order. The first resin layer 50 and the second resin layer 60 may be referred to as a pair of resin layers.

[0013] Hereinafter, the direction in which the first resin layer 50, the resin substrate 10, the array layer 30, and the second resin layer 60 are stacked is referred to as the thickness direction. With respect to the thickness direction, the direction in which the second resin layer 60 is arranged as viewed from the first resin layer 50 is referred to as the first thickness direction Z1, and the opposite direction to the first thickness direction Z1 is referred to as the second thickness direction Z2. Furthermore, viewing the stretchable device 100 from the first thickness direction Z1 or the second thickness direction Z2 is referred to as a plan view.

[0014] The first resin layer 50 and the second resin layer 60 are formed of a resin and have insulating properties, elasticity, and flexibility. An example of a resin used for the first resin layer 50 and the second resin layer 60 is an acrylic resin. The elastic modulus of the acrylic resin is 0.1 to 10 MPa. The first resin layer 50 and the second resin layer 60 of the present disclosure are not limited to an acrylic resin, and may be an epoxy resin, a urethane resin, or the like, and are not particularly limited.

[0015] The first resin layer 50 and the second resin layer 60 are formed in a plate shape and extend in a planar direction. The surface of the first resin layer 50 in the second thickness direction Z2 constitutes the back surface 2 of the stretchable device 100. The first resin layer 50 has a first surface 51 facing the first thickness direction Z1. The resin base material 10 is laminated on the first surface 51. In addition, the first resin layer 50 is provided with a first rigid portion 20. The details of the first rigid portion 20 will be described later.

[0016] A surface of the second resin layer 60 in the first thickness direction Z1 constitutes a surface 1 of the stretchable device 100. A surface 61 of the second resin layer 60 in the second thickness direction Z2 covers the array layer 30 from the first thickness direction Z1. A frame portion 62 protruding in the second thickness direction Z2 beyond the surface 61 is provided at an end in the longitudinal direction and an end in the intersecting direction of the second resin layer 60.

[0017] The frame 62 has an annular shape in a plan view and surrounds the outer periphery of the resin substrate 10 and the array layer 30. A surface in the second thickness direction of the frame 62 is bonded to the first surface 51 of the first resin layer 50. Thus, the first resin layer 50 and the second resin layer 60 cooperate with each other to form a housing that houses the resin substrate 10 and the array layer 30.

[0018] Fig. 3 is a plan view of the resin base material arranged on the first surface of the first resin layer in the first embodiment, viewed from the first thickness direction. In Fig. 3, the resin base material 10 is hatched to make it easier to see. The resin base material 10 is adhered to the first surface 51 of the first resin layer 50. The resin base material 10 has elasticity, flexibility, and insulating properties. The resin base material 10 is formed from a resin material such as polyimide.

[0019] The resin substrate 10 includes a plurality of body portions 11, a plurality of hinge portions 12 extending in a meandering manner, a connecting body portion (not shown), and a connecting hinge portion 18. The connecting body portion (not shown) is disposed at one end portion in the longitudinal direction of the first surface 51 (see dashed line A in FIG. 1). The connecting body portion (not shown) is provided with a connecting portion 40 of the array layer 30 in the first thickness direction Z1. The body portion 11 and the hinge portion 12 are disposed in a region of the first surface 51 excluding the one end portion in the longitudinal direction (see dashed line B in FIG. 1). The connecting hinge portion 18 is disposed between dashed line A and dashed line B in FIG. 1.

[0020] Hereinafter, regarding the longitudinal direction, the direction in which the body portion 11 and the hinge portion 12 are arranged as viewed from the connection hinge portion 18 is referred to as the first longitudinal direction X1, and the direction opposite to the first longitudinal direction X1 is referred to as the second longitudinal direction X2. Also, regarding the intersecting direction, when the stretchable device 100 is viewed from the first thickness direction Z1, the direction in which the right hand is arranged is referred to as the first intersecting direction Y1, and the direction in which the left hand is arranged is referred to as the second intersecting direction Y2.

[0021] 4 is an enlarged view of the body part and the hinge part of the first embodiment. The body part 11 has a quadrangular (square) shape in a plan view. The body part 11 is arranged so that its four corners point in a direction intersecting the longitudinal direction. As shown in FIG. 3, the multiple body parts 11 are arranged in a direction intersecting the longitudinal direction and are spaced apart from each other. Note that the shape of the body part 11 in the present disclosure in a plan view is not limited to a quadrangular shape, and may be a circular shape or another polygonal shape.

[0022] 3, the hinge portion 12 has a vertical hinge portion 12A extending in the longitudinal direction and a horizontal hinge portion 12B extending in the intersecting direction. When the vertical hinge portion 12A is rotated by 90° in a plan view, it has the same shape as the horizontal hinge portion 12B. Therefore, in the following description of the hinge portion 12, the vertical hinge portion 12A will be described as a representative example, and a description of the horizontal hinge portion 12B will be omitted.

[0023] As shown in Fig. 4, the vertical hinge portion 12A has four bent portions 13 and extends in a serpentine manner in the longitudinal direction. Each bent portion 13 in this embodiment is formed in an arc shape. Note that the bent portions of the present disclosure may be formed in an angular shape instead of an arc shape. The number of bent portions is not limited to four.

[0024] The four bent portions 13 are a first arc portion 14, a second arc portion 15, a third arc portion 16, and a fourth arc portion 17, which are arranged in this order from the second longitudinal direction X2. The first arc portion 14 and the fourth arc portion 17 are quadrant-shaped and bent by 90 degrees. The second arc portion 15 and the third arc portion 16 are semicircular-shaped and bent by 180 degrees.

[0025] FIG. 5 is an enlarged view of the body and hinge parts to which a tensile load is applied in the first embodiment. As shown in FIG. 5, when a tensile load in the longitudinal direction (see arrow C in FIG. 5) is applied to the vertical hinge part 12A, the first arc part 14, the second arc part 15, the third arc part 16, and the fourth arc part 17 are deformed so that their curvatures become smaller. As a result, the distance from one end to the other end of the vertical hinge part 12A becomes larger, and the body parts 11 are separated from each other. In addition, when a compressive load in the longitudinal direction (not shown) is applied to the vertical hinge part 12A, the first arc part 14, the second arc part 15, the third arc part 16, and the fourth arc part 17 are deformed so that their curvatures become larger. As a result, the distance from one end to the other end of the vertical hinge part 12A becomes smaller, and the body parts 11 are closer to each other.

[0026] 3, a portion surrounded by the four hinge portions 12 arranged in a ring shape (square shape) forms a lightening portion 19 that penetrates the resin base material 10 in the thickness direction. In other words, the resin base material 10 has a plurality of lightening portions 19.

[0027] 2, the hollowed-out portion 19 is filled with the second resin layer 60. That is, the second resin layer 60 having low rigidity (high elastic modulus) is disposed adjacent to the hinge portion 12 in the longitudinal direction or adjacent to the hinge portion 12 in the cross direction. Therefore, when a load is applied to the stretchable device 100, the hinge portion 12 is deformed.

[0028] Although the cutout portion 19 in the present embodiment is filled with the second resin layer 60, in the present disclosure, it may be filled with the first resin layer 50. Alternatively, the cutout portion 19 may be filled with both the first resin layer 50 and the second resin layer 60. Alternatively, the cutout portion 19 may be filled with a resin other than the first resin layer 50 and the second resin layer 60. Alternatively, nothing may be disposed in the cutout portion 19, and the cutout portion 19 may be left as a space.

[0029] As shown in FIG. 3, the connection hinge portion 18 extends in the longitudinal direction. An end portion of the connection hinge portion 18 in the first longitudinal direction X1 is connected to the body portion 11. An end portion of the connection hinge portion 18 in the second longitudinal direction X2 is connected to a connection body (not shown). The connection hinge portion 18 has a plurality of bent portions 18a, similar to the hinge portion 12, and extends in a serpentine manner in the longitudinal direction. The spaces between the connection hinge portions 18 are hollow portions 19, which are filled with the second resin layer 60. Therefore, when a load acts on the stretchable device 100, the connection hinge portion 18 is also deformed.

[0030] 2, the array layer 30 is provided on a surface in the first thickness direction Z1 of the resin base material 10. The array layer 30 includes a plurality of insulating layers (not shown) stacked in the thickness direction, and a load detection circuit 31 (see FIG. 6) whose insulation from the outside is ensured by the plurality of insulating layers.

[0031] Fig. 6 is a circuit diagram of an electric circuit included in the array layer of embodiment 1. As shown in Fig. 6, the load detection circuit 31 has a strain gauge 32, a gate line 33, a signal line 34, a power supply line 35, a transistor 36, a gate line driving circuit 37 (see Fig. 1), a signal line selection circuit 38 (see Fig. 1), a power supply line selection circuit 39 (see Fig. 1), and a connection section 40 (see Fig. 1).

[0032] 3, the strain gauge 32 is disposed at the vertical hinge portion 12A and extends along the vertical hinge portion 12A. Therefore, when the vertical hinge portion 12A is deformed, the strain gauge 32 is also deformed, and the resistance value of the strain gauge 32 changes. Note that, although the strain gauge 32 in this embodiment is disposed at the vertical hinge portion 12A, in the present disclosure, the strain gauge 32 may also be disposed at the horizontal hinge portion 12B.

[0033] Also, the strain gauges 32 are not arranged at all the vertical hinge parts 12A. To explain in detail, the strain gauges 32 are not arranged at the vertical hinge parts 12A arranged on both sides in the intersecting direction among the multiple vertical hinge parts 12A (see the area surrounded by the dashed line B1 in FIG. 1). Also, the strain gauges 32 are not arranged at the vertical hinge parts 12A arranged at the end of the second longitudinal direction X2 among the multiple vertical hinge parts 12A (see the area surrounded by the dashed lines B2 and B3 in FIG. 1). That is, the strain gauges 32 are arranged only at the vertical hinge parts 12A arranged in the area surrounded by the dashed line B4 in FIG. 1. Hereinafter, the area where the strain gauges 32 are arranged is referred to as the detection area B4.

[0034] 3, the gate line 33 extends in the cross direction in the detection area B4 by being disposed across the horizontal hinge parts 12B and the body parts 11. The signal line 34 and the power supply line 35 extend in the longitudinal direction in the detection area B4 by being disposed across the vertical hinge parts 12A and the body parts 11.

[0035] The transistor 36 is disposed in each body portion 11 disposed in the detection region B4. As shown in Fig. 6, the gate electrode of the transistor 36 is connected to the gate line 33. The drain electrode of the transistor 36 is connected to the power supply line 35. The source electrode of the transistor 36 is connected to the signal line 34 via the strain gauge 32.

[0036] The gate line driving circuit 37 is a circuit that drives the multiple gate lines 33 based on a control signal from a driving IC (Integrated Circuit). The gate line driving circuit 37 is arranged in the multiple body parts 11 and the multiple hinge parts 12 that are arranged on both sides in the intersecting direction among the multiple body parts 11 and the multiple hinge parts 12 (see the area surrounded by the dashed line B1 in FIG. 1).

[0037] The signal line selection circuit 38 is a switch circuit that sequentially or simultaneously selects the multiple signal lines 34 based on a control signal from the driving IC. As shown in Fig. 1, the signal line selection circuit 38 is arranged in the multiple body parts 11 and the multiple hinge parts 12 that are arranged at the ends in the second longitudinal direction X2 (see the area surrounded by the dashed line B2 in Fig. 1) among the multiple body parts 11 and the multiple hinge parts 12.

[0038] The power supply line selection circuit 39 is a switch circuit that sequentially or simultaneously selects a plurality of power supply lines based on a control signal from the driving IC. As shown in Fig. 1, the power supply line selection circuit 39 is arranged in the plurality of body parts 11 and the plurality of hinge parts 12 that are arranged at the end in the second longitudinal direction X2 (see the area surrounded by the dashed line B3 in Fig. 1) among the plurality of body parts 11 and the plurality of hinge parts 12.

[0039] The connection portion 40 is for connecting to a driving IC (Integrated Circuit) arranged outside the stretchable device 100. Note that the driving IC in the present disclosure may be mounted as a COF (Chip On Film) on a flexible printed circuit board connected to the connection portion 40 or a rigid board.

[0040] An operation example of the load detection circuit 31 will be described. As shown in Fig. 6, when one gate line 33 selected by the gate line driving circuit 37 is driven, multiple transistors 36 in the intersecting direction connected to the gate line 33 are closed. In addition, the power supply line selection circuit 39 selects one or more power supply lines 35. As a result, a signal (e.g., a voltage value) is supplied to the strain gauge 32 from the selected power supply line 35 via the transistor 36.

[0041] Here, when the vertical hinge portion 12A is not deformed, the voltage value of the signal flowing through the strain gauge 32 is a predetermined value. On the other hand, when the vertical hinge portion 12A is deformed, the resistance value of the strain gauge 32 changes. In other words, the signal flowing through the strain gauge 32 indicates a voltage value different from the predetermined value. The signal (detection result) output from the strain gauge 32 is supplied to a signal line 34. When the signal line 34 is selected by a signal line selection circuit 38, the signal line 34 supplies the signal (detection result) to an external computing device (not shown) via a connection portion 40. The computing device calculates the load acting on the hinge portion 12 from the received signal (detection result). Next, the first rigid portion 20 will be described in detail.

[0042] 2, the first rigid portion 20 is formed of a material having a higher elastic modulus than the resin forming the pair of resin layers (the first resin layer 50 and the second resin layer 60). In this embodiment, the first rigid portion 20 is a glass piece 21 made of glass. Therefore, the first rigid portion 20 has a higher rigidity than the first resin layer 50 and the second resin layer 60.

[0043] The glass piece 21 is formed in a plate shape and extends in a planar direction. The glass piece 21 is embedded in the first resin layer 50. A surface 21a of the glass piece 21 in the first thickness direction Z1 is parallel to the first surface 51 of the first resin layer 50. The surface 21a of the glass piece 21 in the first thickness direction Z1 abuts against the body portion 11 of the resin base material 10. In other words, the glass piece 21 overlaps with the body portion 11 in the thickness direction. For this reason, the body portion 11 is less likely to deform, and damage to the transistor 36 (functional element) arranged in the first thickness direction Z1 of the body portion 11 is suppressed.

[0044] 7 is an enlarged view of the glass piece of the first embodiment viewed from the second thickness direction. As shown in FIG. 7, the glass piece 21 is formed in a quadrangular shape in plan view. Therefore, the outer peripheral surface 22 of the glass piece 21 has four side surfaces 23 and four corners 24 where the side surfaces 23 intersect with each other. The glass piece 21 is arranged so that the four corners 24 point in the longitudinal direction and the intersecting direction. In plan view, the glass piece 21 is larger than the transistor 36 (functional element). In other words, the glass piece 21 overlaps with the entire transistor 36 (functional element). Therefore, damage to the transistor 36 (functional element) is reliably suppressed.

[0045] Moreover, the glass piece 21 is smaller than the body portion 11 in a plan view. That is, the outer peripheral surface 22 of the glass piece 21 does not protrude to the outside of the body portion 11. If a part of the glass piece 21 is disposed in the hinge portion 12 beyond the boundary line L between the body portion 11 and the hinge portion 12, the glass piece 21 will hinder the deformation of the hinge portion 12. On the other hand, according to the present embodiment, the glass piece 21 does not exceed the boundary line L and is not disposed in the hinge portion 12. Furthermore, the glass piece 21 is not disposed in the hollow portion 19. Therefore, the glass piece 21 does not hinder the deformation of the hinge portion 12 or the deformation of the second resin layer 60 in the hollow portion 19. That is, even if the glass piece 21 is provided, the stretchability and flexibility of the stretchable device 100 are not hindered. Next, a manufacturing method of the stretchable device 100 of the first embodiment will be described.

[0046] Fig. 8 is a flow diagram showing the first half of the manufacturing process of the stretchable device of embodiment 1. Fig. 9 is a flow diagram showing the second half of the manufacturing process of the stretchable device of embodiment 1. In the following description, the part of the array layer 30 that overlaps with the body portion 11 is referred to as the body array layer 30A, and the part that overlaps with the hinge portion 12 is referred to as the hinge array layer 30B.

[0047] As shown in Figures 8 and 9, the manufacturing method S100 of the stretchable device 100 includes a preparation step S1, a resin substrate forming step S3, an array layer forming step S5, a second resin layer forming step S7, a trimming step S9, a lift-off step S11, and a first resin layer forming step S13.

[0048] 8, the preparation step S1 is a step of preparing a glass plate 120. The glass plate 120 has a first surface 121 facing in a first thickness direction Z1 and a second surface 122 facing in a second thickness direction Z2.

[0049] In the resin base material formation step S3, a resin layer is formed as a solid film on the first surface 121 of the glass plate 120. Thereafter, unnecessary portions are removed by etching, thereby forming the resin base material 10.

[0050] The array layer formation step S5 is a step of forming an array layer 30 in the first thickness direction Z1 of the resin base material 10. As a result, a body array layer 30A is provided in the first thickness direction Z1 of the body portion 11. A hinge array layer 30B is provided in the first thickness direction Z1 of the hinge portion 12. The body array layer 30A includes a transistor 36 (see FIG. 6).

[0051] The second resin layer formation step S7 is a step of overlapping a preformed second resin layer 60 on the array layer 30 and the resin substrate 10. The second resin layer 60 has high adhesion. Therefore, the second resin layer 60 adheres to the array layer 30 and the resin substrate 10. The outer periphery of the array layer 30 and the resin substrate 10 is surrounded by a frame portion 62 of the second resin layer 60.

[0052] The trimming process S9 is a process of irradiating the second surface 122 of the glass plate 120 with a laser to form a crack 123 in the glass plate 120. The crack 123 is annular and formed so as to overlap with the outer shape of the body portion 11. Hereinafter, the inside of the crack 123 will be referred to as an intermediate glass piece 124, and the remainder will be referred to as a remaining portion 125 of the glass plate 120.

[0053] The lift-off process S11 is a process of peeling off the remaining portion 125 of the glass plate 120 from the resin substrate 10. Specifically, in the lift-off process S11, a mask 130 is placed in the second thickness direction Z2 of the intermediate glass piece 124. Next, a laser is irradiated from the second thickness direction Z2 of the mask 130 toward the surface 10a of the resin substrate 10 in the second thickness direction Z2. As a result, a gap is formed between the resin substrate 10 and the remaining portion 125, and the remaining portion 125 can be peeled off. Meanwhile, the bonding surface between the intermediate glass piece 124 and the resin substrate 10 is covered with the mask 130, and the laser is not incident thereon. The bonding between the intermediate glass piece 124 and the resin substrate 10 is maintained. As a result, the intermediate glass piece 124 becomes the glass piece 21. In addition, the mask 130 prevents the laser from being incident on the body array layer 30A. Therefore, the performance of the transistor 36 is not deteriorated.

[0054] The first resin layer forming step S13 is a step of overlapping the first resin layer 50, which has been formed in advance, from the second thickness direction Z2 of the resin base material 10. The first resin layer 50 adheres to the resin base material 10. The first resin layer 50 is also bonded to the second resin layer 60 by an adhesive. In this way, the stretchable device 100 having the glass piece 21 is completed.

[0055] Although the first embodiment has been described above, the present disclosure is not limited to the above example. For example, in the first embodiment, the electric circuit included in the array layer 30 is the load detection circuit 31, but the present disclosure is not particularly limited and may be a pressure detection circuit that detects a load applied to the surface 1, a detection circuit that detects light incident on the surface 1, or the like.

[0056] In addition, in the first embodiment, the shape of the first rigid portion 20 (glass piece 21) in plan view is rectangular (quadrangle), but the present disclosure is not limited to this shape. Next, modified examples 1 and 2 in which the shape of the first rigid portion 20 is changed will be described. In the following explanation, the differences from the first embodiment will be focused on.

[0057] (Variation 1) Fig. 10 is an enlarged view of the first rigid portion of Modification 1 as viewed from the second thickness direction. As shown in Fig. 10, the first rigid portion 20A of Modification 1 is similar to the first rigid portion 20 of Embodiment 1 in that it is rectangular in plan view. However, the first rigid portion 20A differs from the first rigid portion 20 of Embodiment 1 in that a corner 24A of the first rigid portion 20A is R-chamfered. That is, the corner 24A is formed in an arc shape in plan view.

[0058] Here, when a compressive load or a bending load acts on the stretchable device 100, the first resin layer 50 is pressed against the corners 24A of the first rigid portion 20A. Since the corners 24 in the first embodiment are sharp, there is a possibility that the first resin layer 50 will tear. On the other hand, since the corners 24A in the first modification example are not sharp, there is an extremely small possibility that the first resin layer 50 will tear. Therefore, the durability of the first resin layer 50 is improved.

[0059] (Variation 2) 11 is an enlarged view of the first rigid portion of the second modification from the second thickness direction. As shown in FIG. 11, the first rigid portion 20B of the second modification is the same as the first rigid portion 20 of the first embodiment in that it is rectangular in plan view. However, the first rigid portion 20B differs from the first rigid portion 20 of the first embodiment in that the corners 24B of the first rigid portion 20B are chamfered. That is, the corners 24A are formed in a straight line in plan view. With such corners 24B, the first resin layer 50 is unlikely to tear, as in the first modification, and the durability of the first resin layer 50 is improved.

[0060] In addition, in the stretchable device 100 of the first embodiment, an example having the first rigid portion 20 has been given, but in the present disclosure, a second rigid portion may be further provided in addition to the glass piece 21 (first rigid portion 20). Hereinafter, a stretchable device 100C of the second embodiment having the first rigid portion 20 and the second rigid portion will be described.

[0061] (Embodiment 2) FIG. 12 is a schematic diagram showing a cross section of a stretchable device according to embodiment 2. FIG. 13 is a flow diagram showing a first half of the manufacturing process of the stretchable device of embodiment 2. FIG. 14 is a flow diagram showing an intermediate part of the manufacturing process of the stretchable device of embodiment 2. FIG. 15 is a flow diagram showing a latter half of the manufacturing process of the stretchable device of embodiment 2. The stretchable device 100C of embodiment 2 is common to embodiment 1 in that a glass piece 21 (first rigid portion 20) is provided in the first resin layer 50. However, the stretchable device 100C of embodiment 2 differs from embodiment 1 in that a second rigid portion 27 is further provided.

[0062] The second rigid portion 27 is a metal piece formed of a metal material. The type of metal material is not particularly limited as long as it has a higher elastic modulus than the resin layers (the first resin layer 50 and the second resin layer 60). The second rigid portion 27 overlaps with the body portion 11 and the first rigid portion 20 in a plan view. The second rigid portion 27 is provided on the resin base material 10. According to the second embodiment, deformation of the body portion 11 is suppressed. Therefore, damage to the functional element (transistor 36) is reliably avoided.

[0063] 13 to 15, the manufacturing method S200 of the stretchable device 100C includes a preparation step S1, a second rigid portion forming step S2, a resin base material forming step S3, an array layer forming step S5, a second resin layer forming step S7, a trimming step S9, a lift-off step S11, and a first resin layer forming step S13. The manufacturing method S200 of the second embodiment differs from the manufacturing method S100 of the first embodiment in that it includes the second rigid portion forming step S2. The steps described in the first embodiment will be briefly described.

[0064] 13, the preparation step S1 is a step of preparing a glass plate 120. The second rigid portion formation step S2 is a step of forming a second rigid portion 27 on a first surface 121 of the glass plate 120. The method of forming the second rigid portion 27 is not particularly limited, but an example of the method is to form a metal layer as a solid film on the first surface 121 of the glass plate 120, and then remove unnecessary portions by etching to form the second rigid portion 27.

[0065] The resin substrate forming step S3 is a step of forming the resin substrate 10 in the first thickness direction Z1 of the glass plate 120. In this embodiment, since the second rigid portion 27 is provided on the first surface 121 of the glass plate 120, a resin layer that is a solid film is formed so as to cover the second rigid portion 27, and then etching is performed to form the resin substrate 10.

[0066] 14, the array layer forming step S5 is a step of forming the array layer 30 in the first thickness direction Z1 of the resin substrate 10. The second resin layer forming step S7 is a step of overlapping a preformed second resin layer 60 on the array layer 30 and the resin substrate 10. The trimming step S9 is a step of irradiating a laser onto the second surface 122 of the glass plate 120 to form cracks 123.

[0067] As shown in FIG. 15, the lift-off process S11 is a process of peeling off the remaining portion 125 of the glass plate 120 from the resin substrate 10. In this embodiment, since the second rigid portion 27 is provided, the mask 130 is not placed in the second thickness direction Z2 of the intermediate glass piece 124. When the laser is irradiated toward the surface 10a of the resin substrate 10 in the second thickness direction Z2, a gap is formed between the resin substrate 10 and the remaining portion 125, and the remaining portion 125 is peeled off from the resin substrate 10. In addition, with the amount of energy of the laser in the lift-off process S11, no gap is formed on the bonding surface between the intermediate glass piece 124 and the second rigid portion 27, and the bonding state is maintained. Therefore, the intermediate glass piece 124 does not peel off and remains as the glass piece 21. In addition, the second rigid portion 27 prevents the laser from being incident on the transistor 36. Therefore, the performance of the transistor 36 does not deteriorate.

[0068] The first resin layer formation step S13 is a step of overlapping the first resin layer 50, which has been molded in advance, from the second thickness direction Z2 of the resin base material 10. In this way, the stretchable device 100C having the glass piece 21 and the second rigid portion 27 is completed.

[0069] In the above, in the first and second embodiments, examples have been given in which the glass piece 21 is used as the first rigid portion 20, but the present disclosure may use a first rigid portion 20 formed of a material other than glass. In the third embodiment, a stretchable device 100D including a first rigid portion 20 formed of a material other than glass will be described.

[0070] (Embodiment 3) Fig. 16 is a schematic diagram showing a cross section of a stretchable device according to embodiment 3. Fig. 17 is a flow diagram showing the first half of the manufacturing process of the stretchable device of embodiment 3. Fig. 18 is a flow diagram showing the second half of the manufacturing process of the stretchable device of embodiment 3.

[0071] The stretchable device 100D of the third embodiment differs from the first embodiment in that it has a resin piece 28 instead of the glass piece 21. The resin piece 28 is provided in the first resin layer 50. The resin piece 28 is made of a resin material exhibiting a higher elastic modulus than the resin layers (the first resin layer 50 and the second resin layer 60). The first rigid portion 20 (resin piece 28) of the third embodiment also suppresses deformation of the body portion 11 and suppresses damage to the functional element (transistor 36).

[0072] 17 and 18, the manufacturing method S300 of the stretchable device 100D includes a preparation step S1, a resin base material forming step S3, an array layer forming step S5, a second resin layer forming step S7, a lift-off step S11, a resin piece forming step S12, and a first resin layer forming step S13. The manufacturing method S300 of the third embodiment differs from the manufacturing method S100 of the first embodiment in that it does not include a trimming step S9. The manufacturing method S300 of the third embodiment also differs from the manufacturing method S100 of the first embodiment in that it includes a resin piece forming step S12.

[0073] 17, in a preparation step S1, a glass plate 120 is prepared. In a resin substrate forming step S3, a resin substrate 10 is formed in a first thickness direction Z1 of the glass plate 120. In an array layer forming step S5, an array layer 30 is formed in the first thickness direction Z1 of the resin substrate 10. In a second resin layer forming step S7, a second resin layer 60 is layered on the array layer 30 and the resin substrate 10 and adhered thereto.

[0074] 18, in the lift-off process S11, a laser is irradiated from the second thickness direction Z2 of the glass plate 120 toward the surface 10a of the resin base material 10. In this embodiment, the mask 130 is not used. As a result, the entire glass plate 120 is peeled off from the resin base material 10.

[0075] In the resin piece formation process S12, a resin layer is formed as a solid film on the surface 10a of the resin base material 10, and then etching is performed to form the resin pieces 28. In the first resin layer formation process S13, a first resin layer 50 that has been formed in advance is disposed in the second thickness direction Z2 of the resin base material 10. This completes the stretchable device 100D having the glass pieces 21.

[0076] In the third embodiment, the resin pieces 28 are provided in the first resin layer 50, but the present disclosure is not limited to this. Hereinafter, a fourth embodiment in which the position of the resin pieces 28 is changed will be described.

[0077] (Embodiment 4) Fig. 19 is a schematic diagram showing a cross section of a stretchable device according to embodiment 4. Fig. 20 is a flow diagram showing the first half of the manufacturing process of the stretchable device of embodiment 4. Fig. 21 is a flow diagram showing the second half of the manufacturing process of the stretchable device of embodiment 4.

[0078] The stretchable device 100E of the fourth embodiment differs from the third embodiment in that the resin pieces 28 are provided in the second resin layer 60. The resin pieces 28 are arranged in the first thickness direction Z1 of the body array layer 30A of the array layer 30. According to the stretchable device 100E, deformation of the body portion 11 is suppressed, and damage to the functional element (transistor 36) provided in the body array layer 30A is suppressed.

[0079] 20 and 21, the manufacturing method S400 of the stretchable device 100E includes a preparation step S1, a resin base material forming step S3, an array layer forming step S5, a resin piece forming step S6, a second resin layer forming step S7, a lift-off step S11, and a first resin layer forming step S13. The manufacturing method S300 of the fourth embodiment differs from the manufacturing method S300 of the third embodiment in that it does not include the resin piece forming step S12. The manufacturing method S300 of the fourth embodiment also differs from the manufacturing method S300 of the third embodiment in that it includes the resin piece forming step S6.

[0080] 20, in a preparation step S1, a glass plate 120 is prepared. In a resin substrate forming step S3, a resin substrate 10 is formed in a first thickness direction Z1 of the glass plate 120. In an array layer forming step S5, an array layer 30 is formed in the resin substrate 10 in the first thickness direction Z1.

[0081] In the resin piece formation process S6, a resin layer is formed as a solid film on the surface of the array layer 30 in the first thickness direction Z1, and then etching is performed to form the resin pieces 28. In the second resin layer formation process S7, a second resin layer 60 is overlaid on the resin pieces 28 from the first thickness direction Z1, and the second resin layer 60 is adhered to the resin pieces 28, the array layer 30, and the resin base material 10, respectively.

[0082] As shown in FIG. 21, in the lift-off process S11, a laser is irradiated from the second thickness direction of the glass plate 120 toward the surface 10a of the resin base material 10 in the second thickness direction. In this embodiment, a mask 130 is not used. This allows the entire glass plate 120 to peel off from the resin base material 10. In the first resin layer formation process S13, a first resin layer 50 that has been molded in advance is disposed in the second thickness direction Z2 of the resin base material 10, and the first resin layer 50 and the second resin layer 60 are bonded together. This completes a stretchable device 100E having a glass piece 21.

[0083] In the third embodiment, the resin piece 28 that is separate from the resin base material 10 is used as an example, but the resin base material 10 and the resin piece 28 may be integrated together. In other words, the resin base material 10 may be formed to have different thicknesses in the thickness direction, and the thicker part may be the first rigid portion 20. [Explanation of symbols]

[0084] 100, 100C, 100D, 100E Stretchable Device 10 Resin substrate 11 Body 12 Hinge part 13 Bend 18 Connection hinge part 19 Cutout section 20, 20A, 20B 1st rigid part 21 Glass fragments 22 Outer surface 23 Side 24, 24A, 24B Corner 27 Second rigid part 28 Resin piece 30 Array Layer 31 Load detection circuit 32 Strain gauge 36 Transistors (functional elements) 50 1st resin layer 51 Page 1 60 2nd resin layer

Claims

1. A resin substrate; An array layer provided on the resin substrate; a pair of resin layers sandwiching the resin substrate and the array layer from both sides in a thickness direction in which the resin substrate and the array layer are disposed, the pair of resin layers being made of a resin having a smaller elastic modulus than that of the resin substrate; having The resin substrate is A plurality of body portions spaced apart from each other in a direction perpendicular to the thickness direction; a plurality of hinge portions that connect the body portions to each other while meandering; having the array layer has a functional element overlapping the body portion when viewed in the thickness direction, The resin layer is provided with a first rigid portion having a higher elastic modulus than a resin forming the resin layer, The first rigid portion overlaps with the body portion when viewed in the thickness direction. Stretchable device.

2. The pair of resin layers are A first resin layer disposed in an opposite direction to the array layer when viewed from the resin substrate; A second resin layer disposed in an opposite direction to the resin substrate as viewed from the array layer; having The first rigid portion is a glass piece provided in the first resin layer. The stretchable device of claim 1.

3. The glass piece has an outer circumferential surface formed in a rectangular shape when viewed from the thickness direction, The corners of the outer circumferential surface are chamfered.

3. The stretchable device of claim 2.

4. The resin base material is provided with a second rigid portion that overlaps the body portion and the first rigid portion when viewed in the thickness direction and is made of a metal material.

3. The stretchable device of claim 2.

5. The resin base material is provided with a second rigid portion that overlaps the body portion and the first rigid portion when viewed in the thickness direction and is made of a metal material. The stretchable device of claim 3.

6. The first rigid portion is formed of a resin having a higher elastic modulus than the resin layer and the resin base material. The stretchable device of claim 1.

7. The first rigid portion is disposed on the inner side of an outer shape of the body portion when viewed in the thickness direction. A stretchable device according to any one of claims 1 to 6.

8. The first rigid portion overlaps with the entire functional element when viewed in the thickness direction. A stretchable device according to any one of claims 1 to 6.

9. The first rigid portion overlaps with the entire functional element when viewed in the thickness direction.

8. The stretchable device of claim 7.

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