Wiring board

Abstract

To suppress warping of a wiring board generated in a region where a conductive pattern is not formed onto a back surface.SOLUTION: A wiring board 1 comprises: a main body part 2 on a flat plane having a pair of surfaces and having two pairs of sides that face each other; a metal conductive pattern 3 that is projected from one surface of the main body part 2; and a dummy pattern 4 that is projected from the one surface, and is covered with an insulation material. The dummy pattern 4 is formed in a region where the conductive pattern 3 is not formed from four outer peripheral regions AR1 to AR4 in the case where the outer peripheral part of at least one surface is divided into the four outer peripheral regions AR1 to AR4 respectively corresponding to the two pair of sides that face each other.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a wiring board. [Background technology]

[0002] A wiring board on which a semiconductor chip is mounted is known (see, for example, Patent Document 1). The wiring board described in Patent Document 1 has a dummy pattern forming region between two wiring board forming regions. The dummy pattern forming region is configured so that the warping tendency of the dummy pattern forming region during firing is opposite to the warping tendency of the wiring board forming region. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2009-152282 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the wiring board, a conductive pattern is formed on the back surface opposite to the surface on which the semiconductor chip is mounted. This conductive pattern protrudes from the flat board body of the wiring board. Therefore, the thickness of the wiring board including the board body and the conductive pattern in the area where the conductive pattern is formed differs from the thickness of the wiring board only including the board body in the area where the conductive pattern is not formed. Due to this difference in thickness, warping may occur in the board body in the area where the conductive pattern is not formed when the wiring board is fired. In the wiring board described in Patent Document 1, the thickness of the wiring board differs between the area where the conductive pattern is formed and the area where it is not formed, so warping may occur in the board body. In addition, in the wiring board described in Patent Document 1, re-surface treatment such as NiAu plating is performed on the area where the surface of the dummy pattern formation area not used as the wiring board is exposed, which generates unnecessary costs.

[0005] The present invention has been made to solve at least part of the above-mentioned problems, and aims to suppress warping of a wiring board that occurs in areas where no conductive patterns are formed. [Means for solving the problem]

[0006] The present invention has been made to solve at least part of the above-mentioned problems, and can be realized in the following forms.

[0007] (1) According to one aspect of the present invention, there is provided a wiring board comprising: a flat body having a pair of surfaces, the body having two sets of opposing sides, a metal conductive pattern protruding from one surface of the body, and a dummy pattern protruding from the one surface and covered with an insulating material, the dummy pattern being formed in at least one of the four outer peripheral regions where the conductive pattern is not formed when the outer peripheral portion of the one surface is divided into four outer peripheral regions corresponding to the two sets of opposing sides.

[0008] According to this configuration, a dummy pattern is formed in the peripheral region where no conductive pattern is formed. In the region where the dummy pattern is formed, the thickness of the wiring board is the sum of the thickness of the main body and the thickness of the dummy pattern, compared to when the dummy pattern is not formed. Therefore, the thickness of the wiring board in the region where the dummy pattern is formed approaches the thickness of the wiring board in the region where the conductive pattern is formed. As a result, in the peripheral region where the main body is likely to warp, the difference in thickness of the wiring board is reduced by the dummy pattern, so that warping occurring in the peripheral region of the main body during firing is suppressed. Furthermore, since the dummy pattern of this configuration is covered with an insulating material and surface treatment such as plating is not applied to the dummy pattern, costs such as plating and resource consumption can be suppressed.

[0009] (2) In the wiring board of the above embodiment, the dummy patterns may be further formed in two of the four peripheral regions that face each other such that the arrangement of a pattern group consisting of the conductive pattern and the dummy pattern formed in one peripheral region is symmetrical to the arrangement of the pattern group formed in the other peripheral region. According to this configuration, the pattern groups, each consisting of a conductive pattern and a dummy pattern, are arranged symmetrically in the two opposing peripheral regions, which reduces the variation in thickness of the wiring board in the two opposing peripheral regions compared to when the pattern groups are arranged asymmetrically, thereby further suppressing warping that occurs in the peripheral region of the main body during firing.

[0010] (3) In the wiring board of the above embodiment, the shape of the dummy pattern included in the pattern group formed in one of the peripheral regions may be the same as the shape of the conductive pattern arranged at a corresponding position in the pattern group formed in the other peripheral region. According to this configuration, the shape of the dummy patterns formed in the two opposing peripheral regions is the same as the shape of the conductive pattern formed in the corresponding position of the other peripheral region, which further reduces the variation in thickness of the wiring board in the two opposing peripheral regions compared to a case in which the shape of the dummy patterns is different from the shape of the conductive pattern, thereby further suppressing warping that occurs in the peripheral region of the main body during firing.

[0011] The present invention can be realized in various forms, for example, in the form of a wiring board, a multilayer board, a semiconductor package, a semiconductor device, and a system including these, a method for manufacturing a wiring board, and a system including these, etc. [Brief description of the drawings]

[0012] [Figure 1] 1 is a schematic top view of a wiring board according to an embodiment of the present invention; [Diagram 2] FIG. 2 is a schematic bottom view of the wiring board. [Diagram 3] 3 is a schematic diagram of a cross section taken along line AA of the wiring board in FIG. 2. [Figure 4] FIG. 11 is a schematic cross-sectional view of a wiring board of a comparative example. [Diagram 5] FIG. 13 is a schematic bottom view of a wiring board according to a modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] <Embodiment> FIG. 1 is a schematic top view of a wiring board 1 according to one embodiment of the present invention. FIG. 2 is a schematic bottom view of the wiring board 1. A semiconductor chip is mounted on the surface of the wiring board 1 according to this embodiment, as shown in FIG. 1. Also, as shown in FIG. 2, a plurality of conductive patterns 3 are formed on the back surface of the wiring board 1 as BGA (ball grid array) pads. In addition to the conductive patterns 3, a plurality of dummy patterns 4 having surfaces covered with alumina are formed on the back surface of the wiring board 1 according to this embodiment, thereby suppressing warping that occurs in the main body 2 of the wiring board 1 during firing.

[0014] As shown in Figs. 1 and 2, the wiring board 1 of this embodiment includes a flat body 2, a ring metal fitting 5 formed on the surface of the body 2, and a plurality of conductive patterns 3 and dummy patterns 4 formed on the back surface of the body 2. The body 2 is made of a ceramic material and has a flat shape. The body 2 has a pair of rectangular surfaces, the front surface shown in Fig. 1 and the back surface shown in Fig. 2. The orthogonal coordinate system CS shown in Figs. 1 and 2 is composed of an X-axis and a Y-axis parallel to each side of the rectangular shape of the body 2 that intersect at right angles, and a Z-axis parallel to the thickness direction of the body 2. The orthogonal coordinate system CS shown in Figs. 3 to 5 corresponds to the orthogonal coordinate system CS shown in Figs. 1 and 2.

[0015] The ring fitting 5 is formed so as to protrude in the positive direction of the Z axis from the surface of the main body 2. The ring fitting 5 has a predetermined width along the outer periphery of the main body 2. The ring fitting 5 is made of metal.

[0016] A plurality of conductive patterns 3 shown in FIG. 2 protrude from the rear surface of the main body 2. Each of the conductive patterns 3 has the same shape and is made of metal. In FIG. 2, the conductive patterns 3 are shown as circles with no hatching inside. That is, the conductive patterns 3 have a cylindrical shape protruding from the main body 2 with a predetermined thickness. In this embodiment, a total of 19 conductive patterns 3 spaced apart from each other are formed on the rear surface of the main body 2.

[0017] The multiple dummy patterns 4 shown in Fig. 2 protrude from the rear surface of the main body 2 in the same manner as the conductive patterns 3. Each of the dummy patterns 4 in this embodiment has the same shape as the conductive patterns 3. The dummy patterns 4 are shown as circles with hatching applied therein in Fig. 2. In this embodiment, a total of 13 dummy patterns 4 spaced apart from one another are formed on the rear surface of the main body 2.

[0018] As shown in FIG. 2, when the peripheral region of a predetermined width of the main body 2 is divided into four peripheral regions AR1 to AR4 corresponding to the four sides of a rectangle, at least one of the conductive pattern 3 and the dummy pattern 4 is formed in each of the peripheral regions AR1 to AR4. Here, the main body 2 has a pair of rectangular faces, and therefore has two sets of sides that face each other along the X-axis and the Y-axis. Therefore, the four peripheral regions AR1 to AR4 can be said to be regions in which the peripheral region of the main body 2 corresponds to each of the two sets of facing sides. The peripheral regions AR1 to AR4 in the main body 2 of this embodiment are the outer 50% of the region excluding the central 50%. The peripheral regions AR1 to AR4 are the outer regions of the rectangle formed by the straight lines Lx1, Ly1, Lx2, and Ly2 shown by the dashed lines. The straight lines Lx1 and Lx2 are located at 25% and 75% of the distance from one of the two opposing sides when the distance between the two opposing sides on the positive and negative Y-axis sides is divided into four. Similarly, the straight lines Ly1 and Ly2 are located at 25% and 75% of the distance from one of the two opposing sides when the distance between the two opposing sides on the positive and negative X-axis sides is divided into four.

[0019] The outer peripheral regions AR1 to AR4 are divided into the respective outer peripheral regions by straight lines L1 to L4 indicated by dashed lines. The straight line L1 is a straight line connecting the intersection point of the straight line Lx1 and the straight line Ly1 with the apex P1 located on the X-axis positive direction side and the Y-axis positive direction side in the main body 2. The straight line L1 divides the outer peripheral region AR1 located on the Y-axis positive direction side and the outer peripheral region AR2 located on the X-axis positive direction side in the main body 2. Similarly, the straight line L2 connects the intersection point of the straight line Ly1 and the straight line Lx2 with the apex P2 located on the Y-axis positive direction side and the X-axis negative direction side in the main body 2. The straight line L2 divides the outer peripheral region AR2 located on the X-axis positive direction side and the outer peripheral region AR3 located on the Y-axis negative direction side. The straight line L3 connects the intersection point of the straight line Lx2 and the straight line Ly2 with the apex P3 located on the Y-axis negative direction side and the X-axis negative direction side in the main body 2. Line L3 divides outer circumferential region AR3 located on the negative Y-axis side from outer circumferential region AR4 located on the negative X-axis side. Line L4 connects the intersection of line Ly2 and line Lx1 to vertex P4 located on the negative X-axis side and the positive Y-axis side of main body 2. Line L4 divides outer circumferential region AR4 located on the negative X-axis side from outer circumferential region AR1 located on the positive Y-axis side.

[0020] In this embodiment, four pattern groups Gr1 to Gr4 are defined, each of which is made up of a conductive pattern 3 and a dummy pattern 4 formed in each of the four peripheral regions AR1 to AR4. In FIG. 2, each of the pattern groups Gr1 to Gr4 is shown surrounded by a dashed line. In this embodiment, as shown in FIG. 2, when viewed from the thickness direction of the main body 2, the conductive pattern 3 or the dummy pattern 4 that overlaps each of the straight lines L1 to L4 and is included in the two peripheral regions is defined as being formed in the two peripheral regions that include it. For example, in the pattern group Gr4 formed in the peripheral region AR4, one dummy pattern 4 and eight conductive patterns 3 are arranged at a distance from each other along the Y axis, in order from the negative Y-axis direction side. In addition, in the pattern group Gr3 formed in the peripheral region AR3, nine dummy patterns 4 are arranged at a distance from each other along the X axis. In other words, nine dummy patterns 4 are formed in the peripheral region AR3 in which the conductive pattern 3 is not formed.

[0021] In this embodiment, in two of the four peripheral regions AR1 to AR4, the pattern groups Gr1 and Gr2 formed in one peripheral region AR1 and AR3 or the peripheral regions AR2 and AR4 facing each other are formed so as to be symmetrical to the pattern groups Gr3 and Gr4 formed in the other peripheral regions AR3 and AR4. Specifically, the arrangement of the nine conductive patterns 3 and dummy patterns 4 included in the pattern group Gr1 formed in the peripheral region AR1 is the same as the arrangement of the nine dummy patterns 4 included in the pattern group Gr3 formed in the peripheral region AR3, which is located at a line symmetrical position in the main body 2. Similarly, the arrangement of the conductive patterns 3 and dummy patterns 4 included in the pattern group Gr2 formed in the peripheral region AR2 is the same as the arrangement of the conductive patterns 3 and dummy patterns 4 included in the pattern group Gr4 formed in the peripheral region AR4, which is located at a line symmetrical position.

[0022] In this embodiment, the shape of the dummy pattern 4 is also the same as the shape of the conductive pattern 3. Therefore, the shape of the dummy pattern 4 included in the pattern group Gr3 in the peripheral region AR3 formed at a position that is line-symmetrical to the pattern group Gr1 formed in the peripheral region AR1 is the same as the shapes of the conductive pattern 3 and the dummy pattern 4 arranged at the corresponding position that is line-symmetrical to the pattern group Gr1. Similarly, the shape of the dummy pattern 4 included in the pattern group Gr4 in the peripheral region AR4 formed at a position that is line-symmetrical to the pattern group Gr2 formed in the peripheral region AR2 is the same as the shapes of the conductive pattern 3 and the dummy pattern 4 arranged at the corresponding position that is line-symmetrical to the pattern group Gr2.

[0023] Fig. 3 is a schematic diagram of the AA cross section of the wiring board 1 in Fig. 2. Fig. 3 shows the wiring board 1 after firing. As shown in Fig. 3, the dummy pattern 4 includes a cylindrical dummy body 4A made of the same material as the conductive pattern 3, and a covering portion 4B covering the surface of the dummy body 4A. The covering portion 4B is made of alumina, which is an insulating material. As shown in Fig. 3, the body portion 2 of the wiring board 1 is not warped.

[0024] In the manufacturing process, the dummy body 4A is formed on the main body 2 at the same time as the conductive pattern 3. The dummy body 4A is coated with alumina after being formed on the main body 2. Therefore, the dummy pattern 4 can be easily formed on the main body 2 by changing a jig (e.g., a screen mask) for forming a pattern on the main body 2.

[0025] FIG. 4 is a schematic cross-sectional view of a wiring board 1z of a comparative example. The wiring board 1z of the comparative example shown in FIG. 4 is different from the wiring board 1 of the present embodiment in that the dummy pattern 4 is not formed. The cross-sectional view shown in FIG. 4 corresponds to the AA cross section shown in FIG. 2 of the wiring board 1z of the comparative example. As shown in FIG. 4, in the comparative example, the thickness of the wiring board 1z in the region where the conductive pattern 3 is formed is the combined thickness of the conductive pattern 3 and the thickness of the main body 2z. On the other hand, the thickness of the wiring board 1z in the peripheral region where the conductive pattern 3 is not formed is the thickness of only the main body 2z. That is, in the wiring board 1z of the comparative example, the thickness of the wiring board 1z is different between the region where the conductive pattern 3 is formed and the peripheral region where the conductive pattern 3 is not formed. As a result, warping occurs in the main body 2z of the comparative example due to the difference in thickness as the wiring board 1z.

[0026] As described above, the wiring board 1 of the present embodiment includes a flat body 2 and a plurality of conductive patterns 3 and dummy patterns 4 formed on the back surface of the body 2, as shown in Figs. 1 and 2. As shown in Fig. 2, when the outer peripheral region of the body 2 is divided into four outer peripheral regions AR1 to AR4 corresponding to each of two pairs of opposing sides, at least one of the conductive pattern 3 and the dummy pattern 4 is formed in each of the outer peripheral regions AR1 to AR4. For example, nine dummy patterns 4 are formed in the outer peripheral region AR3 where the conductive pattern 3 is not formed. The surface of the dummy pattern 4 is covered with an insulating material. In the present embodiment, in the outer peripheral region AR3 where the dummy pattern 4 is formed, the thickness of the wiring board 1 is the sum of the thickness of the body 2 and the thickness of the dummy pattern 4, compared to when the dummy pattern 4 is not formed. Therefore, the thickness of the wiring board 1 in the region where the dummy pattern 4 is formed approaches the thickness of the wiring board 1 in the outer peripheral regions AR1, AR2, and AR4 where the conductive pattern 3 is formed. As a result, in the outer peripheral region AR3 where the main body 2 is prone to warping, the difference in thickness of the wiring board 1 is reduced by the dummy pattern 4, so that warping occurring in the outer peripheral region AR3 of the main body 2 during firing is suppressed. By suppressing the warping of the wiring board 1, the sealing performance of the lid and the like in the sealing portion is improved. In addition, by suppressing the warping, the mounting performance of the die in the die attachment portion is improved. Furthermore, the dummy pattern 4 of this embodiment is covered with an insulating material, and the conductive dummy main body 4A is not exposed on the surface. As a result, surface treatment such as NiAu plating is not applied to the dummy main body 4A, so that costs and resource consumption according to the plating material can be suppressed.

[0027] In this embodiment, in the two opposing peripheral regions AR1, AR3 or AR2, AR4 among the four peripheral regions AR1 to AR4, the pattern groups Gr1, Gr2 formed in one peripheral region AR1, AR2 are arranged symmetrically to the pattern groups Gr3, Gr4 formed in the other peripheral region AR3, AR4. By forming the opposing pattern groups Gr1 to Gr4 to be arranged symmetrically, the variation in thickness of the wiring board 1 in the two opposing peripheral regions AR1 to AR4 is reduced compared to when the pattern groups Gr1 to Gr4 are not arranged symmetrically. As a result, warping occurring in the peripheral regions AR1 to AR4 of the main body 2 during firing is further suppressed.

[0028] In addition, in this embodiment, the shape of the dummy pattern 4 included in the pattern group Gr3 in the outer peripheral region AR3 formed at a position that is line symmetrical to the pattern group Gr1 formed in the outer peripheral region AR1 is the same as the shape of the conductive pattern 3 or dummy pattern 4 arranged at the corresponding position that is line symmetrical to the pattern group Gr1. Similarly, the shape of the dummy pattern 4 included in the pattern group Gr4 in the outer peripheral region AR4 formed at a position that is line symmetrical to the pattern group Gr2 formed in the outer peripheral region AR2 is the same as the shape of the conductive pattern 3 arranged at the corresponding position that is line symmetrical to the pattern group Gr2. Therefore, in this embodiment, the variation in thickness of the wiring board 1 in the two opposing outer peripheral regions AR1, AR3 or the outer peripheral regions AR2, AR4 is further reduced compared to the case where the shape of the dummy pattern 4 is different from the shape of the conductive pattern 3. As a result, the warping occurring in the outer peripheral regions AR1 to AR4 of the main body 2 during firing is further suppressed.

[0029] <Modifications of the embodiment> The present invention is not limited to the above-described embodiment, and can be embodied in various forms without departing from the spirit and scope of the invention. For example, the following modifications are also possible.

[0030] <Variation 1> The wiring board 1 of the above embodiment is merely an example, and can be modified as long as the dummy pattern 4 covered with an insulating material is formed in at least one of the peripheral regions AR1 to AR4 on the main body 2. For example, the dummy pattern 4 may be formed only in the peripheral region AR3, of the four peripheral regions AR1 to AR4, where no conductive patterns 3 are formed at all. In addition, in two mutually opposing peripheral regions AR1 to AR4, the arrangement of the pattern groups Gr1 to Gr4 formed in one peripheral region AR1 to AR4 may be asymmetrical with the arrangement of the pattern groups Gr1 to Gr4 formed in the other peripheral region AR1 to AR4.

[0031] In other embodiments, the shape of the dummy pattern 4 may be different from the shape of the conductive pattern 3. For example, the dummy pattern 4 may have a rectangular cross section protruding from the rear surface of the main body 2. The amount of protrusion of the dummy pattern 4 from the rear surface of the main body 2 may be different from the amount of protrusion of the conductive pattern 3. For example, when the five conductive patterns 3 included in the pattern group Gr1 shown in FIG. 2 have different shapes, it is preferable that the shape of the dummy pattern 4 included in the pattern group Gr3 facing the pattern group Gr1 is the same as the shape of each of the five conductive patterns arranged at the corresponding positions in the pattern group Gr1.

[0032] It is sufficient that the dummy pattern 4 is covered with an insulating material, and the material of the dummy body 4A of the dummy pattern 4 may be different from the material of the conductive pattern 3. The insulating material covering the surface of the dummy pattern 4 may be a well-known material other than alumina. The conductive pattern 3 provided on the wiring board 1 in the above embodiment is an example, and the arrangement and shape of the dummy pattern 4 may be determined according to the shape and arrangement of the conductive pattern 3. In the above embodiment, for convenience, the surface of the body portion 2 on which the conductive pattern 3 is formed is defined as the back surface, but the definitions of the back surface and the front surface can be modified.

[0033] The dimensions and shapes of the four outer peripheral regions AR1 to AR4 can be modified. In the above embodiment, the outer 50% of the main body 2 excluding the central 50% is defined as the outer peripheral regions AR1 to AR4, but the proportion of the outer peripheral region may be more than 50% or less than 50%. The boundary of the outer peripheral region may be defined based on the position of the conductive pattern 3 formed on the main body 2 instead of based on the distance between the two opposing sides. For example, the outer peripheral region may be defined based on the position of one conductive pattern 3 formed closest to the center of gravity of the main body 2. In this case, in the surface direction perpendicular to the thickness direction, the outside of a circle having the center of gravity as the center and the distance between the reference conductive pattern 3 and the center of gravity as the radius may be defined as the outer peripheral region before being divided into four.

[0034] The method of dividing the outer periphery of the back surface of the main body 2 into four outer periphery regions corresponding to each of the two pairs of opposing sides can also be modified. For example, in the wiring board 1 shown in FIG. 2, the straight lines Lx1, Ly1, Lx2, and Ly2 are each extended to each side of the main body 2, and the outer periphery region is divided into eight regions by the extended straight lines Lx1, Ly1, Lx2, and Ly2. Of the eight regions, the four regions other than the four corner regions including the vertices P1 to P4 may be defined as the four outer periphery regions corresponding to each of the two pairs of opposing sides. In the above embodiment, the conductive patterns 3 and the dummy patterns 4 overlapping the straight lines L1 to L4 that divide the four outer periphery regions AR1 to AR4 when viewed from the thickness direction are defined as being included in both of the two regions of the outer periphery regions AR1 to AR4 divided by the straight lines L1 to L4. However, in other embodiments, the conductive patterns 3 or dummy patterns 4 that overlap the straight lines L1 to L4 do not have to be included in both of the divided outer periphery regions, or may be included in one of the two outer periphery regions.

[0035] <Variation 2> Fig. 5 is a schematic bottom view of a wiring board 1a of a modified example. The wiring board 1a of the modified example shown in Fig. 5 includes a main body 2a having a shape different from that of the main body 2 included in the wiring board 1 shown in Figs. 1 and 2. Compared to the main body 2 of the above embodiment, the shape of the main body 2a is such that a pair of faces are rectangular, with chamfers C1 to C4 and openings AP1 and AP2 formed thereon.

[0036] Chamfers C1 to C4 are formed at each of vertices P1 to P4 of the main body 2 shown in FIG. 2. A straight line LN1 connecting chamfer C1 and chamfer C2, and a straight line LN2 connecting chamfer C3 and chamfer C4 are a pair of opposing sides parallel to the Y-axis. A broken line BL1 connecting chamfer C1 and chamfer C4 forms a part of the outer periphery on the Y-axis positive side of the main body 2a. The broken line BL1 is composed of a straight line connecting chamfer C1 and chamfer C2, and a periphery line forming an opening AP1. Similarly, a broken line BL2 connecting chamfer C2 and chamfer C3 forms a part of the outer periphery on the Y-axis negative side of the main body 2a. The broken line BL2 is composed of a straight line connecting chamfer C2 and chamfer C3, and a periphery line forming an opening AP2. The broken lines BL1 and BL2 are plane-symmetric broken lines with respect to the ZX plane passing through the center of gravity G of the main body 2, and are a pair of opposing sides. Therefore, when the outer circumferential region of the main body 2a is divided into four outer circumferential regions AR1a to AR4a corresponding to the two pairs of opposing sides of the straight lines LN1, LN2 and the broken lines BL1, BL2, at least one of the conductive pattern 3 and the dummy pattern 4 is formed in each of the outer circumferential regions AR1a to AR4a. In this way, the two pairs of opposing sides of the main body 2a can be deformed.

[0037] In the above embodiment, four sides constituting a rectangle are exemplified as two sets of sides facing each other, and in the modified example shown in FIG. 5, straight lines LN1 and LN2 and broken lines BL1 and BL2 are exemplified, but the opposing sides do not necessarily have to be plane-symmetric, point-symmetric, or line-symmetric. For example, the side facing the straight line LN1 parallel to the Y axis shown in FIG. 5 may be a straight line LN2 inclined at 10 degrees with respect to the Y axis. In addition, the side facing the straight line LN1 may have an opening like the openings AP1 and AP2 formed on the broken lines BL1 and BL2 in a part of the straight line LN2, or may be a curved line. In this specification, for example, the side facing the straight line LN1 includes a curved line or a broken line that is included in a range of widths of (-0.2×L12) or more and (0.2×L12) or less along the X axis centered on the straight line LN2 when the distance between the straight lines LN1 and LN2 in FIG. 5 is L12. Therefore, as long as this width range is satisfied, the side opposite to the broken line BL1 may be a straight line with no opening AP2 formed relative to the broken line BL2, or a semicircular opening may be further formed relative to the broken line BL2.

[0038] Although the present aspect has been described above based on the embodiment and modified examples, the above-mentioned embodiment of the aspect is intended to facilitate understanding of the present aspect and does not limit the present aspect. The present aspect may be modified or improved without departing from the spirit and scope of the claims, and equivalents are included in the present aspect. Furthermore, if a technical feature is not described as essential in this specification, it may be deleted as appropriate.

[0039] The present invention can also be realized in the following forms. [Application example 1] A wiring board, A flat body portion having a pair of surfaces, the body portion having two sets of sides facing each other; a metal conductive pattern protruding from one surface of the main body; a dummy pattern protruding from the one surface and covered with an insulating material; Equipped with The dummy pattern includes at least A wiring board characterized in that, when the outer periphery of the one surface is divided into four outer periphery regions corresponding to each of the two sets of opposing sides, the conductive pattern is formed in an area of ​​the four outer periphery regions where the conductive pattern is not formed. [Application example 2] The wiring board according to Application Example 1, The wiring board is further characterized in that, in two of the four peripheral regions that face each other, the dummy patterns are formed in the peripheral regions such that the arrangement of a pattern group consisting of the conductive pattern and the dummy pattern formed in one of the peripheral regions is symmetrical to the arrangement of the pattern group formed in the other peripheral region. [Application example 3] The wiring board according to the first or second aspect of the present invention, A wiring board, characterized in that the shape of the dummy pattern included in the pattern group formed in one of the peripheral regions is the same as the shape of the conductive pattern arranged at a corresponding position of the pattern group formed in the other peripheral region. [Explanation of symbols]

[0040] 1, 1a, 1z...Wiring board 2,2a,2z…Main body 3...Conductive pattern 4…Dummy pattern 4A…Dummy body 4B…Coating part 5…Ring fittings AP1,AP2…Aperture AR1~AR4,AR1a~AR4a...outer area BL1,BL2...Broken line C1~C4…Chamfering CS...Cartesian coordinate system G...Center of gravity Gr1~Gr4: Pattern group L1~L4, LN1, LN2, Lx1, Lx2, Ly1, Ly2...straight lines P1~P4: Vertices of the main body

Claims

1. A wiring board, A flat body portion having a pair of surfaces, the body portion having two sets of opposing sides; a metal conductive pattern protruding from one surface of the main body; a dummy pattern protruding from the one surface and covered with an insulating material; Equipped with The dummy pattern includes at least A wiring board characterized in that, when the outer periphery of the one surface is divided into four outer periphery regions corresponding to each of the two sets of opposing sides, the conductive pattern is formed in an area of ​​the four outer periphery regions where the conductive pattern is not formed.

2. 2. The wiring board according to claim 1, The wiring board is further characterized in that, in two of the four peripheral regions that face each other, the dummy pattern is formed in the peripheral region such that the arrangement of a pattern group consisting of the conductive pattern and the dummy pattern formed in one of the peripheral regions is symmetrical to the arrangement of the pattern group formed in the other peripheral region.

3. 3. The wiring board according to claim 2, A wiring board, characterized in that the shape of the dummy pattern included in the pattern group formed in one of the peripheral regions is the same as the shape of the conductive pattern arranged at a corresponding position of the pattern group formed in the other peripheral region.

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