Processor and display device production method

Abstract

To provide a processor which can improve production yield of a display device.SOLUTION: A processor comprises: a stage; a support member having a movable support block; and a vacuum device comprising a main body and a block. The support block is moved in a first direction and supports an end region of the display panel arranged outside of the stage and a flexible wiring board. On a body of the vacuum device, the end region of the display panel and the flexible wiring board are absorbed, and then by rotation of the body of the vacuum device and the block by 180°, the display panel is folded at a folding region of the end region.SELECTED DRAWING: Figure 8

Description

[Technical field]

[0001] An embodiment of the present invention relates to a processing apparatus for a flexible display device. [Background technology]

[0002] A flat panel display such as an organic electroluminescence (EL) display device has a display panel in which thin film transistors (TFTs), organic light-emitting diodes (OLEDs), etc. are formed on a substrate. Conventionally, a glass substrate has been used as the base material for the display panel, but in recent years, flexible displays that use a resin film or the like as the base material and allow the display panel to be bent have been developed. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-047738 A Summary of the Invention [Problem to be solved by the invention]

[0004] The present embodiment provides a processing apparatus capable of improving the manufacturing yield of display devices. [Means for solving the problem]

[0005] A processing apparatus according to an embodiment includes: Stage and a support member having a movable support block; A vacuum device having a body and a block; Equipped with A display device including a flexible display panel having a flexible substrate on which a display area and an edge area are provided, and a flexible wiring board connected to a connection portion provided in the edge area, the display area of ​​the display panel is held on the stage, and the edge area of ​​the display panel and the flexible wiring board are disposed outside the stage, The support member is disposed adjacent to the stage and the display panel; the support block moves in a first direction to support the edge region of the display panel and the flexible wiring substrate disposed outside the stage; The vacuum device moves beneath the support block; the support block moves in a direction opposite to the first direction, and the support block retreats from the edge region of the display panel and the flexible wiring substrate; the vacuum device is raised, and the end region of the display panel and the flexible wiring board are adsorbed to the main body of the vacuum device; The body and the block of the vacuum device are rotated 180 degrees to fold the display panel at a folding region of the end region; The block of the vacuum device moves downward to press the folded areas of the display panel that face each other.

[0006] In addition, a method for manufacturing a display device according to an embodiment includes the steps of: a flexible display panel comprising a flexible substrate having a display region and an edge region; a flexible wiring board connected to a connection portion provided in the end region; A method for manufacturing a display device comprising: The manufacturing method includes: the display area of ​​the display panel is held on a stage, and the edge area of ​​the display panel and the flexible wiring board are disposed outside the stage; a support member having a movable support block is disposed adjacent to the stage and the display panel; the support block moves in a first direction to support the edge region of the display panel and the flexible wiring substrate disposed outside the stage; a vacuum device having a body and a block is moved beneath the support block; the support block moves in a direction opposite to the first direction, and the support block retreats from the edge region of the display panel and the flexible wiring substrate; the vacuum device is raised, and the end region of the display panel and the flexible wiring board are adsorbed to the main body of the vacuum device; The body and the block of the vacuum device are rotated 180 degrees to fold the display panel at a folding region of the end region; The block of the vacuum device moves downward to press the folded areas of the display panel that face each other. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is an overall perspective view of a display device according to an embodiment. [Diagram 2] FIG. 2 is a cross-sectional view showing an example of a schematic configuration of a display device. [Diagram 3] FIG. 3 is a diagram showing a schematic configuration of a processing device for bending a flexible wiring board. [Figure 4] FIG. 4 is a plan view of the display device and the processing device. [Diagram 5] FIG. 5 is a cross-sectional view of the display device and the processing device. [Figure 6] FIG. 6 is a plan view of the display device and the processing device. [Figure 7] FIG. 7 is a cross-sectional view of the display device and the processing device. [Figure 8] FIG. 8 is a plan view of the display device and the processing device. [Figure 9] FIG. 9 is a cross-sectional view of the display device and the processing device. [Figure 10] FIG. 10 is a plan view of the display device and the processing device. [Figure 11] FIG. 11 is a cross-sectional view of the display device and the processing device. [Figure 12] FIG. 12 is a plan view of the display device and the processing device. [Figure 13] FIG. 13 is a cross-sectional view of the display device and the processing device. [Figure 14] FIG. 14 is a plan view of the display device and the processing device. [Figure 15] FIG. 15 is a cross-sectional view of the display device and the processing device. [Figure 16] FIG. 16 is a partial plan view showing an example of a schematic configuration of a display panel. [Figure 17] FIG. 17 is a cross-sectional view taken along line A1-A2 of the display panel shown in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, each embodiment of the present invention will be described with reference to the drawings. Note that the disclosure is merely an example, and those who are skilled in the art can easily come up with appropriate modifications while maintaining the gist of the invention, which are naturally included in the scope of the present invention. In addition, in order to make the explanation clearer, the drawings may show the width, thickness, shape, etc. of each part in a schematic manner compared to the actual embodiment, but these are merely examples and do not limit the interpretation of the present invention. In addition, in this specification and each figure, elements similar to those described above with respect to the previous figures may be given the same reference numerals, and detailed explanations may be omitted as appropriate.

[0009] The embodiments described in this specification are not general, but are embodiments that describe the same or corresponding special technical features of the present invention. Hereinafter, a processing device and a display device according to an embodiment will be described in detail with reference to the drawings.

[0010] In this embodiment, the first direction X, the second direction Y, and the third direction Z are perpendicular to each other, but may intersect at an angle other than 90 degrees. The direction toward the tip of the arrow of the third direction Z is defined as up or upward, and the direction opposite to the direction toward the tip of the arrow of the third direction Z is defined as down or downward. The first direction X, the second direction Y, and the third direction Z may also be called the X direction, the Y direction, and the Z direction, respectively.

[0011] Furthermore, in the case of "a second member above the first member" and "a second member below the first member," the second member may be in contact with the first member or may be located away from the first member. In the latter case, a third member may be interposed between the first and second members. On the other hand, in the case of "a second member above the first member" and "a second member below the first member," the second member is in contact with the first member.

[0012] Also, it is assumed that an observation position for observing the processing device and the display device is located at the tip side of the arrow in the third direction Z, and a planar view refers to a view from this observation position toward the XY plane defined by the first direction X and the second direction Y. A cross-sectional view refers to a view of a cross section of the processing device and the display device in the XZ plane defined by the first direction X and the third direction Z, or in the YZ plane defined by the second direction Y and the third direction Z.

[0013] [Embodiment] 1 is an overall perspective view of a display device according to an embodiment. The display device DSP has a display area DA and a peripheral area FA provided around the display area DA on a substrate SUB1. The display device DSP has a plurality of pixels PX arranged in the display area DA. In the display device DSP, light LT from the pixels PX is emitted upward.

[0014] 1, the substrate SUB1 and the multiple pixels PX are collectively referred to as the display panel PNL. The surface of the display panel PNL that emits the light LT is referred to as the surface FF. The surface opposite the surface FF in the third direction Z is referred to as the surface RF. The surface FF can be said to be the emission surface, front surface, or top surface, and the surface RF can be said to be the back surface or bottom surface.

[0015] An area EA at the edge of the substrate SUB1 is disposed outside the display area DA. Of the area EA, an area close to the display area DA will be referred to as an edge ES11. Of the area EA, an edge away from the display area DA along the second direction Y will be referred to as an edge ES12. Of the surfaces of the substrate SUB1, a surface that emits light LT will be referred to as a surface FL. A surface opposite to surface FL will be referred to as a surface RL. Surface RL is the same surface as surface RF. The area EA will also be referred to as an edge area of ​​the display panel PNL.

[0016] A connection part WPD is provided in the area EA on the end ES12 side. Wiring from the display area DA extends to the connection part WPD. The wiring from the display area DA is a scanning line or a signal line from the pixel PX, or a wiring connected to the scanning line or the signal line.

[0017] Between the end ES11 and the end ES12 of the area EA, an area BND is provided. Between the area BND and the end ES12, an area BSF is provided. The area BND is a folding area, and the area BSF is an area that is folded upside down. The areas BND and BSF will be described in detail later.

[0018] A flexible wiring board FPC1 is provided in the connection part WPD of the area EA. The flexible wiring FPC1 has a plurality of wires arranged along the first direction X. The wires of the flexible wiring FPC1 are electrically connected to the connection part WPD by an anisotropic conductive film (ACF). This electrically connects the wires from the display area DA and the wires of the flexible wiring FPC1.

[0019] Among the ends of flexible wiring FPC1, an end close to connection part WPD is defined as end EF11. Along the second direction Y, an end opposite end EF11 is defined as end EF12. End EF11 is closer to end ES12 of substrate SUB1 than end EF12. In other words, end EF11 is located between end EF12 and end ES12.

[0020] End EF12 of flexible wiring board FPC1 is electrically connected to the printed circuit board PCB. The end of the printed circuit board PCB connected to end EF12 of flexible wiring board FPC1 is defined as end EB11. The end opposite end EB11 along the second direction Y is defined as end EB12. End EB11 is closer to end ES12 of substrate SUB1 than end EB12. In other words, end EB11 is located between end EB12 and end ES12.

[0021] The flexible wiring board FPC1 and the printed circuit board PCB may be collectively referred to as the flexible wiring board FPC. Alternatively, the printed circuit board PCB may not be provided, and only the flexible wiring board FPC1 may be provided.

[0022] The flexible wiring FPC1 may be provided with a driving element that outputs a video signal and a driving signal. The signal from the driving element is input to the pixel PX in the display area DA via the flexible wiring board FPC1. The pixel PX emits light based on the video signal and various control signals.

[0023] The substrate SUB1 includes a flexible base material (base material BA1 described later) and a plurality of pixels PX. The base material may be formed of, for example, a resin film material, more specifically, acrylic, polyimide, polyethylene terephthalate, polyethylene naphthalate, or the like. A plurality of pixels PX including a plurality of switching elements, a plurality of scanning lines, a plurality of signal lines, a plurality of pixel electrodes, a common electrode, a plurality of light-emitting layers, and the like are provided on the base material. A detailed configuration of the pixels PX, etc. will be described later.

[0024] Since the substrate SUB1 is flexible, the display panel PNL is a flexible display.

[0025] 2 is a cross-sectional view showing an example of a schematic configuration of a display device DSP. The display device DSP includes a display panel PNL, a polarizing plate POL, an optical adhesive OCA1, a cover material CG, a protective member BPT, a protective member UVR, a protective member PRS, a protective member DST, and a flexible wiring board FPC.

[0026] 2, the display panel PNL is folded at the region BND. By folding the display panel PNL at the region BND, the region EA including the connection portion WPD becomes smaller, and the frame can be narrowed.

[0027] The region BSF of the display panel PNL overlaps a part of the display region DA in the direction opposite to the third direction Z. Between the part of the display region DA and the region BSF, the protective members BPT, DST, and SPT are arranged along the direction opposite to the third direction Z.

[0028] A polarizing plate POL is provided on the surface FF side of the display panel PNL in contact with the display area DA. The polarizing plate POL is, for example, a circular polarizing plate. By providing the polarizing plate POL, for example, it is possible to suppress reflection of external light in the display area DA.

[0029] A cover material CG is provided on the polarizing plate POL with an optical adhesive OCA1. The cover material CG may be, for example, a thin plate made of glass or plastic.

[0030] A protective member BPT is provided on the surface RF side of the display panel PNL. Of the surfaces of the protective member BPT, the surface that contacts the surface RF of the display panel PNL is referred to as surface FB. Of the surfaces of the protective member BPT, the surface opposite surface FB is referred to as surface RB. A protective member DST is provided in contact with a portion of surface RB. The protective member BPT generally overlaps the display area DA of the display panel PNL. More specifically, the protective member BPT overlaps the display area DA and portions of area EA.

[0031] Among the surfaces of the protective member DST, the surface that contacts the surface RB of the protective member BPT is referred to as a surface FP. Among the surfaces of the protective member DST, the surface opposite to the surface FP is referred to as a surface RP. The protective member SPT is provided in contact with the surface RP. The protective member SPT overlaps the region BSF.

[0032] Of the surfaces of the protective member SPT, the surface that contacts the surface RP of the protective member DST is referred to as surface FS. Of the surfaces of the protective member SPT, the surface opposite to surface FS is referred to as surface RS. Surface RS contacts surface RF of the region BSF of the display panel PNL (surface RL of the substrate SUB1).

[0033] The protective members BPT and SPT may be made of a plate-shaped resin material, for example, plate-shaped polyethylene terephthalate (PET). The protective members BPT and SPT are attached to the surface RF of the display panel PNL and face each other in the third direction Z, sandwiching the protective member DST therebetween. This provides a function of protecting the display panel PNL.

[0034] The protective member DST is a member having adhesive layers on the front and back surfaces, for example, a double-sided tape. The protective member DST bonds the protective member SPT and the protective member BPT. More preferably, the protective member DST is made of a resin material having cushioning properties. The protective member DST has a function of maintaining the gap of the folded display panel PNL at a certain level or more. This keeps the curvature of the region BND within an allowable range even if pressure is applied to the display panel PNL in the thickness direction (third direction Z).

[0035] The protective member UVR is provided in contact with the surface FL in the region BND of the display panel PNL. The protective member UVR has a function of protecting the bending region BND of the display panel PNL. The protective member UVR is provided in contact with the surface FL of the display panel PNL between the end of the polarizing plate POL and the end EF11 of the flexible wiring board FPC.

[0036] The protective member UVR may be made of, for example, a photocurable resin material. The protective member UVR is provided so as not to leave a gap between the polarizing plate POL. If a gap exists between the polarizing plate POL and the protective member UVR, the display panel PNL will break from the gap during the process of bending the display panel PNL, causing the wiring of the display panel PNL to break.

[0037] A protective member PRS is provided near the end portion ES12 of the display panel PNL, in contact with the end portion ES12, the protective member SPT, and the flexible printed circuit board FPC.

[0038] The protective member PRS may be made of, for example, a resin material, and has a function of protecting the edge portion ES12 of the display panel PNL.

[0039] 3 is a diagram showing a schematic configuration of a processing device that bends a flexible wiring board. The processing device BAP has a stage STG. In the process of bending the flexible wiring board FPC1 of the display device DSP, the display area DA of the display panel PNL (substrate SUB1) is placed on the stage STG, and the end area EA, the flexible wiring board FPC1, and the printed circuit board PCB are placed protruding from the stage STG.

[0040] As shown in FIG. 3, after the display panel PNL and the like are arranged, a unit equipped with a suction and pressure bonding member moves to the stage STG side, suctions it, and rotates to bend the area BND of the display panel PNL. No holding mechanism is provided in the portion that protrudes from the stage STG so that the unit can make contact. Therefore, the area EA of the display panel PNL and the flexible wiring board FPC1 that protrude from the stage STG sag under their own weight, and there is a risk that the wiring in the display panel PNL and the wiring in the flexible wiring board FPC1 may be damaged. If such wiring is broken, the display device DSP may become a defective product, and there is a risk that the yield will decrease.

[0041] The display device DSP is placed on the stage STG upside down, with the light-emitting surface FF facing downward. The display device DSP shown in Fig. 3 has a polarizing plate POL in contact with the display panel PNL. A touch panel TP is bonded to the polarizing plate POL by an optical adhesive OCA1. Furthermore, a cover material CG is provided on the touch panel TP by an optical adhesive OCA2.

[0042] The process of folding the display panel PNL by the processing device BAP will be described with reference to Figs. 4 to 15. Figs. 4, 6, 8, 10, 12, and 14 are plan views of the display device and the processing device. Figs. 5, 7, 9, 11, 13, and 15 are cross-sectional views of the display device and the processing device.

[0043] As shown in Figures 4 and 5, the processing device BAP includes a support member SPD and a vacuum device VAC in addition to the stage STG. The support member SPD includes a support base SPH and a support block SPB. The stage STG is disposed on the stage base STD. The stage STG and the stage base STD are collectively referred to as the stage device STP.

[0044] The support stand SPH of the support member SPD is provided adjacent to the stage STG. The support block SPB moves in a direction opposite to the first direction X. The support block SPB is disposed below the end area EA, the flexible wiring board FPC1, and the printed circuit board PCB, but not directly below them. The support block SPB is disposed spaced apart from the end area EA, the flexible wiring board FPC1, and the printed circuit board PCB in a plan view.

[0045] The vacuum device VAC includes a main body VAD and a block VAS. In Figures 4 and 5, the vacuum device VAC is separated from the display device DSP and the stage device STP.

[0046] First, the display area DA of the display panel PNL is held on the stage STG in the same manner as in Fig. 3. The edge area EA, the flexible wiring board FPC1, and the printed circuit board PCB are disposed so as to protrude from the stage STG.

[0047] Next, the support block SPB slides in the direction opposite to the first direction X (see FIGS. 6 and 7). The support block SPB moves below the area EA, the flexible wiring board FPC1, and the printed circuit board PCB to support the area EA, the flexible wiring board FPC1, and the printed circuit board PCB.

[0048] Then, the vacuum device VAC moves along a direction opposite to the second direction Y. The vacuum device VAC is disposed below the support block SPB (see FIGS. 8 and 9).

[0049] After the vacuum device VAC moves below the support block SPB, the support block SPB that was located below the display panel PNL moves away. Only the vacuum device VAC is disposed below the display panel PNL. Next, the vacuum device VAC moves along the third direction Z, i.e., rises, and adsorbs the area EA, the flexible wiring board FPC1, and the printed circuit board PCB (see FIGS. 10 and 11).

[0050] Next, the vacuum device VAC rotates 180° with respect to the XY plane (see Figures 12 and 13). That is, the vacuum device VAC rotates so that it is upside down. The main body VAD of the vacuum device VAC adsorbs the area EA, the flexible wiring board FPC1, and the printed circuit board PCB. As a result, the display panel PNL is bent at the area BND. Of the area EA, the area BSF, the flexible wiring board FPC1, and the printed circuit board PCB are arranged upside down. The area BND is also called the bending area, and the area BSF is also called the inversion area.

[0051] The block VAS of the vacuum device VAC is disposed above the region BSF, the protective member DST, and the protective member SPT, and is spaced apart from the protective member DST and the protective member SPT. In Fig. 13, the lengths of the protective member DST and the protective member SPT in the direction parallel to the second direction Y are substantially the same for convenience of drawing. However, as shown in Fig. 2, the length of the protective member SPT in the direction parallel to the second direction Y is longer than the length of the protective member DST in the direction parallel to the second direction Y.

[0052] Next, the block VAS of the vacuum device VAC moves downward (in the direction opposite to the third direction Z) and presses the areas of the bent display panel PNL that face each other in the third direction Z together. More specifically, the block VAS moves downward to press the area BSF, the protective member DST, and the protective member SPT of the display panel PNL (see Figs. 14 and 15). More specifically, as shown in Fig. 2, the protective member BPT overlapping the display area DA of the display panel PNL, the protective member SPT overlapping the area BSF, and the protective member DST disposed between the protective members BPT and SPT are pressed together, so that the display area DA and the area BSF are pressed together at a predetermined interval. The protective member BPT and the protective member SPT are also referred to as the first protective member and the second protective member, respectively.

[0053] At this time, the pressure bonding of the region BSF of the display panel PNL, the protection member DST, and the protection member SPT may be so-called temporary fastening. After the process described in Fig. 14 and Fig. 15, the display panel PNL, the protection member DST, and the protection member SPT may be fixed by another pressure bonding device.

[0054] In this embodiment, a support member SPD having a support stand SPH and a support block SPB is prepared in addition to the stage STG. The support block SPB of the support member SPD can support the display panel PNL, the flexible wiring board FPC1, and the printed circuit board PCB. This prevents the display panel PNL1 and the flexible wiring board FPC1 from bending under their own weight. This makes it possible to prevent the wiring in the display panel PNL1 and the wiring of the flexible wiring board FPC1 from being broken.

[0055] Here, the pixels PX of the display panel PNL will be explained in more detail.

[0056] 16 is a partial plan view showing an example of a schematic configuration of a display panel. The pixels PX include a pixel PXR that emits red light, a pixel PXG that emits green light, and a pixel PXB that emits blue light. The pixels PXR, PXG, and PXB are also referred to as a first pixel, a second pixel, and a third pixel, respectively. The pixel PXR is disposed adjacent to the pixel PXB along the first direction X and the second direction Y. The pixel PXG is disposed adjacent to the pixel PXB along the first direction X and the second direction Y. The pixel PXB is disposed adjacent to the pixel PXR along the first direction, and adjacent to the pixel PXG along the second direction Y.

[0057] FIG. 17 is a cross-sectional view taken along line A1-A2 of the display panel shown in FIG. The base material BA1 may be a base material made of a resin film material, as described above. Examples of the resin film material include acrylic, polyimide, polyethylene terephthalate, polyethylene naphthalate, etc., and may be formed as a single layer or a laminate of multiple layers.

[0058] An insulating layer UC1 is provided on the base material BA1. The insulating layer UC1 is formed of, for example, a single layer or a laminate of a silicon oxide film and a silicon nitride film.

[0059] A light-shielding layer BM may be provided on the insulating layer UC1 so as to overlap the transistor Tr. The light-shielding layer BM suppresses changes in transistor characteristics due to light intrusion from the back surface of the channel of the transistor Tr. When the light-shielding layer BM is formed of a conductive layer, it is also possible to provide a backgate effect to the transistor Tr by applying a predetermined potential.

[0060] An insulating layer UC2 is provided to cover the insulating layer UC1 and the light-shielding layer BM. The insulating layer UC2 may be made of the same material as the insulating layer UC1. The insulating layer UC2 may be made of a different material from the insulating layer UC1. For example, the insulating layer UC1 may be made of silicon oxide, and the insulating layer UC2 may be made of silicon nitride. The insulating layers UC1 and UC2 are collectively referred to as the insulating layer UC.

[0061] A transistor Tr is provided on the insulating layer UC. The transistor Tr has a semiconductor layer SC, an insulating layer GI, a gate electrode GE (scanning line), an insulating layer ILI, a source electrode SE (signal line), and a drain electrode DE. The transistor Tr is a thin film transistor (TFT).

[0062] The semiconductor layer SC is made of amorphous silicon, polysilicon, or an oxide semiconductor. The insulating layer GI is formed, for example, by using a single layer or a stack of silicon oxide or silicon nitride.

[0063] The gate electrode GE is made of, for example, a molybdenum tungsten alloy (MoW). The gate electrode GE may be formed integrally with the scanning line GL.

[0064] An insulating layer ILI is provided to cover the semiconductor layer SC and the gate electrode GE. The insulating layer ILI is formed of, for example, a single layer or a multilayer of silicon oxide layers or silicon nitride layers.

[0065] A source electrode SE and a drain electrode DE are provided on the insulating layer ILI. The source electrode SE and the drain electrode DE are connected to the source region and the drain region of the semiconductor layer SC via contact holes provided in the insulating layer ILI and the insulating layer GI, respectively. The source electrode SE may be formed integrally with the signal line.

[0066] An insulating layer PAS is provided covering the source electrode SE, the drain electrode DE, and the insulating layer ILI. An insulating layer PLL is provided covering the insulating layer PAS.

[0067] The insulating layer PAS is formed using an inorganic insulating material. Examples of the inorganic insulating material include a single layer or a multilayer of silicon oxide or silicon nitride. The insulating layer PLL is formed using an organic insulating material. Examples of the organic insulating material include organic materials such as photosensitive acrylic and polyimide. By providing the insulating layer PLL, the step caused by the transistor Tr can be flattened.

[0068] An anode AD is provided on the insulating layer PLL. The anode AD is connected to the drain electrode DE via a contact hole provided in the insulating layer PAS and PLL. The anode provided in the pixel PXR is referred to as the anode ADR, the anode provided in the pixel PXB is referred to as the anode ADB, and the anode provided in the pixel PXG is referred to as the anode ADG. When there is no need to distinguish between the anode ADR, anode ADG, and anode ADB, they are simply referred to as the anode AD.

[0069] The anode AD may be formed, for example, of a laminate of a reflective electrode and a transparent electrode. The reflective electrode is formed of a conductive material with high reflectivity, for example, silver (Ag) or aluminum (Al). The transparent electrode is formed, for example, of indium tin oxide (ITO) or indium zinc oxide (IZO). In this embodiment, the configuration from the substrate BA1 to the insulating layer PLL is referred to as a backplane BPS.

[0070] A bank BK (also called a protrusion or rib) is provided between adjacent anodes AD. The bank BK is made of an organic material similar to that of the insulating layer PLL. The bank BK is opened so as to expose a part of the anode AD.

[0071] The opening provided in pixel PXR is referred to as an opening OPR, the opening provided in pixel PXB is referred to as an opening OPB, and the opening provided in pixel PXG is referred to as an opening OPG. When there is no need to distinguish between the openings OPR, OPB, and OPG, they are simply referred to as openings OP.

[0072] The edge of the opening OP preferably has a gently tapered shape in cross section, since if the edge of the opening OP has a steep shape, poor coverage will occur in the organic EL layer ELY to be formed later.

[0073] The organic EL layer ELY is provided between the adjacent banks BK so as to overlap with the anode AD. The organic EL layer ELY includes a hole injection layer HIL, a hole transport layer HTL, an emission layer EML, an electron transport layer ETL, and an electron injection layer EIL, which will be described in detail later. The organic EL layer ELY may further include an electron blocking layer and a hole blocking layer, if necessary.

[0074] The organic EL layer provided in pixel PXR is referred to as organic EL layer ELYR, the organic EL layer provided in pixel PXB is referred to as organic EL layer ELYB, and the organic EL layer provided in pixel PXG is referred to as organic EL layer ELYG. When there is no need to distinguish between the organic EL layer ELYR, the organic EL layer ELYG, and the organic EL layer ELYB, they are simply referred to as the organic EL layer ELY.

[0075] A cathode CD is provided on the organic EL layer ELY. The cathode CD is formed using, for example, a magnesium-silver alloy (MgAg) film, a single layer film of silver (Ag), or a laminate film of silver (Ag) and a transparent conductive material. The transparent conductive material may be, for example, indium tin oxide (ITO), indium zinc oxide (IZO), or the like.

[0076] An insulating layer SEY is provided to cover the cathode CD. The insulating layer SEY has a function of preventing moisture from entering the organic EL layer ELY from the outside. The insulating layer SEY is preferably one having high gas barrier properties. As the insulating layer SEY, for example, an insulating layer in which an organic insulating layer is sandwiched between two inorganic insulating layers containing nitrogen can be mentioned. Examples of materials for the organic insulating layer include acrylic resin, epoxy resin, polyimide resin, etc. Examples of materials for the inorganic insulating layer containing nitrogen can include silicon nitride and aluminum nitride.

[0077] Light emitted from the organic EL layer ELY is extracted upward through the cathode CD. That is, the display device DSP (display panel PNL) of this embodiment has a top emission structure.

[0078] Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and spirit of the invention, and are included in the scope of the invention and its equivalents described in the claims. [Explanation of symbols]

[0079] BAP...processing equipment, BND...area, BPT...protective material, DA...display area, DSP...display device, EA...area, FA...peripheral area, FPC1...flexible wiring board, UVR...protective material, PCB...printed circuit board, PNL...display panel, DST...protective material, SPB...support block, SPD...support material, SPH...support base, SPT...protective material, STD...stage base, STG...stage, STP...stage equipment, VAC...vacuum equipment, VAD...main body, VAS...block, WPD...connection part.

Claims

1. Stage and a support member having a movable support block; A vacuum device having a body and a block; Equipped with In a display device including a flexible display panel having a flexible base material and a display area and an edge area, and a flexible wiring board connected to a connection portion provided in the edge area, the display area of ​​the display panel is held on the stage, and the edge area of ​​the display panel and the flexible wiring board are disposed outside the stage, The support member is disposed adjacent to the stage and the display panel; the support block moves in a first direction to support the edge region of the display panel and the flexible wiring substrate disposed outside the stage; The vacuum device moves beneath the support block; the support block moves in a direction opposite to the first direction, and the support block retreats from the edge region of the display panel and the flexible wiring board; the vacuum device is raised, and the end region of the display panel and the flexible wiring board are adsorbed to the main body of the vacuum device; The body and the block of the vacuum device are rotated by 180 degrees to fold the display panel at a folding region of the end region; The processing device, in which the block of the vacuum device moves downward to pressurize the bent areas of the display panel that face each other.

2. The processing device according to claim 1 , wherein the display device further comprises a printed circuit board connected to the flexible wiring board.

3. 2. The processing device according to claim 1, wherein the base material is made of a resin film material selected from the group consisting of acrylic, polyimide, polyethylene terephthalate, and polyethylene naphthalate.

4. The processing device according to claim 1 , wherein a double-sided tape is disposed between the opposing regions.

5. The processing device according to claim 1 , wherein the bending region is provided with a photocurable resin material.

6. The display device includes: A first protective member overlapping the display area; A second protective member overlaps an inverted region of the end region that is different from the folded region; Further equipped with The processing device according to claim 1 , wherein a double-sided tape is disposed between the first protective member and the second protective member.

7. a flexible display panel comprising a flexible substrate having a display region and an edge region; a flexible wiring board connected to a connection portion provided in the end region; A method for manufacturing a display device comprising: The manufacturing method includes: the display area of ​​the display panel is held on a stage, and the edge area of ​​the display panel and the flexible wiring board are disposed outside the stage; a support member having a movable support block is disposed adjacent to the stage and the display panel; the support block moves in a first direction to support the edge region of the display panel and the flexible wiring substrate disposed outside the stage; a vacuum device having a body and a block is moved beneath the support block; the support block moves in a direction opposite to the first direction, and the support block retreats from the edge region of the display panel and the flexible wiring board; the vacuum device is raised, and the end region of the display panel and the flexible wiring board are adsorbed to the main body of the vacuum device; The body and the block of the vacuum device are rotated by 180 degrees to fold the display panel at a folding region of the end region; The method for manufacturing a display device further comprises: pressing the bent areas of the display panel, the areas facing each other, against each other by moving the block of the vacuum device downward.

8. The method for manufacturing a display device according to claim 7 , wherein the display device further comprises a printed circuit board connected to the flexible wiring board.

9. The method for manufacturing a display device according to claim 7 , wherein the base material is made of a resin film material selected from the group consisting of acrylic, polyimide, polyethylene terephthalate, and polyethylene naphthalate.

10. The method for manufacturing a display device according to claim 7 , further comprising disposing a double-sided tape between the opposing regions.

11. The method for manufacturing a display device according to claim 7 , wherein a photocurable resin material is provided in the bending region.

12. The display device includes: A first protective member overlapping the display area; A second protective member overlaps an inverted region of the end region that is different from the folded region; Further equipped with The method for manufacturing a display device according to claim 7 , further comprising disposing a double-sided tape between the first protective member and the second protective member.

Images