Manufacturing method of pixel definition layer

Abstract

To form a pixel separation layer and a metal mask support layer after an exposure and a phenomenon step at once, miniaturize a damage of a panel by a step time reduction, an additional phenomenon step, and a rear heating processing step, and prevent a pixel shrinkage.SOLUTION: The present invention provides a manufacturing method of a pixel definition layer, for forming a step by combining two patterning steps to one, realizing a coloring pattern having a low water containing amount onto an electrode substrate, and enhancing reliability and life of a display without having a brightness color phase. That is, by forming a pixel separation layer and a metal mask support layer after an exposure and a phenomenon step at once, a damage of a panel due to a step time reduction, an additional phenomenon step, and a rear heating processing step is minimized, and a pixel shrinkage is prevented in order to miniaturize an illuminance reduction and a life reduction.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a method for fabricating a pixel defining layer of a light emitting display device using a photosensitive composition. [Background technology]

[0002] The most widely used flat panel displays include liquid crystal display devices (LCDs), organic light emitting display devices (OLEDs), etc. Among them, OLEDs have advantages such as low power consumption, fast response speed, high color reproduction rate, high brightness, and wide viewing angle.

[0003] In the case of the organic light emitting display device, a polarizing film is used to block external light that is reflected from the panel. However, the polarizing film has a drawback in that it is not suitable for application to a flexible device due to a lack of bending properties.

[0004] As a method for solving the above problems, a method of forming an inorganic film for blocking light on the upper substrate in addition to the color filter and black matrix has been proposed, but the method has a limit in obtaining a desired level of anti-reflection effect and does not specifically propose a method for replacing the polarizing film.

[0005] Meanwhile, the colored pattern is red, green, and blue color filters, and is used not only in liquid crystal displays but also in organic light-emitting displays.

[0006] When manufacturing the colored pattern, various kinds of organic pigments as well as carbon black and inorganic pigments are used as colorants, and a pigment dispersion in which these are dispersed is mixed with other compositions to form a pattern. Before depositing the organic light-emitting layer, a photolithography process is added to support a metal mask for deposition, and then the deposition process is carried out.

[0007] An OLED made with pixels formed in this way can achieve brighter colors. However, the colored pattern contains a lot of moisture due to insufficient crosslinking during the development process, and the moisture is removed through a post-heat treatment process. Also, if the post-heat treatment process does not result in sufficient crosslinking, the pattern may absorb moisture from the outside. If there is a lot of moisture, problems such as pixel shrinkage, dark spots, and electrode oxidation may occur, and the lifespan and brightness of the OLED display may be reduced. become. Summary of the Invention [Problem to be solved by the invention]

[0008] In an attempt to solve the problems of the prior art, one embodiment of the present invention is to realize a colored pattern on an electrode substrate that has a low moisture content and low moisture absorption rate, thereby not only providing vivid colors but also improving the reliability and lifespan of the display.

[0009] In other words, if the moisture content in the panel after post-heat treatment is 50ppm or more, it may cause a decrease in brightness and shortened lifespan due to pixel shrinkage, so in order to minimize the moisture content after the post-heat treatment process is completed, the goal is to thoroughly remove moisture in the post-heat treatment stage, block external moisture absorption, and minimize moisture generation in the panel state.

[0010] Yet another example is to integrate the processes for making two layers into one process to reduce damage to the panel, thereby realizing a colored pattern on the electrode substrate with a short process time, not only achieving vivid colors but also improving the reliability and lifespan of the display.

[0011] That is, if the amount of irradiation is varied by reducing the transmittance of a portion of a negative-type photomask that transmits light and hardens the material, a step occurs in the pattern after development due to a difference in the degree of hardening depending on the amount of irradiation.

[0012] Yet another embodiment is to provide an organic light emitting display device including a pixel defining layer manufactured by the method.

[0013] Yet another embodiment is to provide an electronic device including the organic light emitting display device. [Means for solving the problem]

[0014] The method for manufacturing a pixel defining layer according to the present invention includes steps of applying and coating a photosensitive composition; pre-baking; exposing; developing; post-exposing; and post-heat treating. It is preferable that the photomask transmittance is divided into three sections, namely, 0% (non-exposed area), 20-50% (half-tone), and 100% (full-tone), and that the post-heat treating step is performed at an oven temperature of 210°C to 300°C for 30 minutes to 120 minutes, and that the content of moisture generated after the post-heat treating step is 50 ppm or less.

[0015] It is more preferable that the moisture content is 40 ppm or less.

[0016] It is more preferable that the moisture content is 30 ppm or less.

[0017] More preferably, the hot plate temperature in the pre-baking step is 90°C to 120°C.

[0018] More preferably, the pre-baking step is performed for 100 to 150 seconds.

[0019] It is preferred that the development step lasts for 35 to 55 seconds.

[0020] 80-110mJ / cm 2 It is more preferable to irradiate the film with actinic rays of 1000 nm or more.

[0021] More preferably, after the developing step, the thickness of the half-tone is 1.40 to 2.00 μm.

[0022] More preferably, after the developing step, the full-tone has a thickness of 3.25 to 3.35 μm.

[0023] The post-exposure step is performed by irradiating the entire area with 190 to 600 nm actinic radiation without a mask at 100 to 900 mJ / cm 2 , similar to the exposure step. 2 It is preferred that the exposure energy be irradiated.

[0024] It is more preferable that after the post-heat treatment, the taper angle of the lower pattern is 15 to 65 degrees (°) and the taper angle of the upper pattern is 10 to 45 degrees (°) or less.

[0025] After the post-heat treatment step, the thickness of the half-tone is preferably 1.00 to 1.90 μm.

[0026] More preferably, after the post-heat treatment step, the thickness of the half-tone is 1.20 to 1.80 μm.

[0027] After the post-heat treatment step, the full-tone thickness is preferably 2.80 to 3.20 μm.

[0028] More preferably, the full-tone has a thickness of 2.90 to 3.10 μm after the post-heat treatment step.

[0029] The photosensitive composition preferably contains a colorant.

[0030] The colorant preferably includes one or more of an inorganic dye, an organic dye, an inorganic pigment, and an organic pigment.

[0031] The colorant is preferably contained in an amount of 1 to 40% by weight based on the total amount of the photosensitive composition.

[0032] The colorant is preferably pretreated with a dispersing agent; or a water-soluble inorganic salt and a wetting agent.

[0033] The photosensitive composition preferably includes a patterning resin that includes an acrylic binder resin, a cardo binder resin, or a combination thereof.

[0034] The weight average molecular weight of the acrylic binder resin is preferably 3,000 g / mol to 150,000 g / mol.

[0035] The cardo-based binder resin preferably contains a repeating structure of the following formula 1:

[0036] [ka]

[0037] In the above Chemical Formula 1,

[0038] 1) R 1 and R 2 are each independently hydrogen; deuterium; halogen; C6-C 30 aryl groups of C2-C containing at least one heteroatom of O, N, S, Si and P; 30 Heterocyclic group; C6-C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1-C 20 Alkyl group; C2-C 20 Alkenyl group; C2-C 20 Alkynyl group; C1-C 20 Alkoxy group: C6~C 30 an aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C1-C 20 is an alkoxycarbonyl group of the formula

[0039] 2) R 1 and R 2 can form a ring with adjacent groups,

[0040] 3) m and n are each independently an integer of 0 to 4;

[0041] 4) A1 and A2 are each independently represented by the following formula 2 or 3:

[0042] [ka]

[0043] [ka]

[0044] In the above Chemical Formula 2 and Chemical Formula 3,

[0045] 4-1) * indicates the linkage site,

[0046] 4-2) R 3 ~R 6 are each independently hydrogen; deuterium; halogen; C6-C 30 aryl groups of C2-C containing at least one heteroatom of O, N, S, Si and P; 30 A fused ring group of an aliphatic ring and an aromatic ring; C1-C 20 Alkyl group; C2-C 20 Alkenyl group; C2-C 20 Alkynyl group; C1-C 20 Alkoxy group: C6~C 30 an aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C1-C 20 is an alkoxycarbonyl group of the formula

[0047] 4-3) R 3 ~R 6 can form a ring with adjacent groups,

[0048] 4-4) Y 1 and Y 2 are each independently represented by the following formula 6 or 7:

[0049] [ka]

[0050] [ka]

[0051] In the above Chemical Formula 6 and Chemical Formula 7,

[0052] 4-4-1) * indicates the bond position,

[0053] 4-4-2)R 9 is hydrogen or methyl,

[0054] 4-4-3)R 10 ~R 13 are each independently hydrogen; deuterium; halogen; C6-C 30 aryl groups; C2-C containing at least one heteroatom selected from O, N, S, Si and P; 30 Heterocyclic groups; C6-C30 fused ring groups of an aliphatic ring and an aromatic ring; C1-C 20 Alkyl group; C2-C 20 Alkenyl group; C2-C 20 Alkynyl group; C1-C 20 Alkoxy group; C6-C 30 an aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C1-C 20 is an alkoxycarbonyl group of the formula

[0055] 4-4-4)L 1 ~L 3 are each independently a single bond; a fluorenylene group; C2-C 30 Arylene; C2~C 30 Heterocycles; C1-C 30 Alkoxylenes; C2-C 30 Alkyleneoxy; C6-C 30 Aryloxy group; C2-C 30 is a polyethyleneoxy group of the formula

[0056] 4-4-5) q and r are each independently an integer of 0 to 3; provided that q+r=3;

[0057] 5) In the polymer chain of the resin containing the repeating unit represented by formula 1, the ratio of A1 to A2 is 9:1 to 1:9;

[0058] 6) X 1 is a single bond; O; CO; SO2; CR'R"; SiR'R"; Chemical formula 4 below; or Chemical formula 5,

[0059] 6-1) R' and R" are each independently hydrogen; deuterium; halogen; C6-C 30 aryl groups, C2-C groups containing at least one heteroatom selected from O, N, S, Si and P; 30 Heterocyclic groups; C6-C30 fused aliphatic and aromatic ring groups; C1-C 20 Alkyl group; C2-C 20 Alkenyl group; C2-C 20 Alkynyl group; C1-C 20 Alkoxy group: C6~C 30 an aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C1-C 20 is an alkoxycarbonyl group of the formula

[0060] (6-2) R' and R" can form a ring together with adjacent groups,

[0061] [ka]

[0062] [ka]

[0063] In the above Chemical Formula 4 and Chemical Formula 5,

[0064] 6-3) * indicates the bond position,

[0065] 6-4) R 7 ~R 8 are each independently hydrogen; deuterium; halogen; C6-C 30aryl groups of C2-C containing at least one heteroatom of O, N, S, Si and P; 30 Heterocyclic groups; C6-C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1-C 20 Alkyl group; C2-C 20 Alkenyl group; C2-C 20 Alkynyl group; C1-C 20 Alkoxy group; C6-C 30 an aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C1-C 20 is an alkoxycarbonyl group of the formula

[0066] 6-5) o and p are each independently an integer of 0 to 4;

[0067] 7) X 2 is C6~C 30 aryl groups, C2-C groups containing at least one heteroatom selected from O, N, S, Si and P; 30 Heterocyclic groups, C6-C 30 A fused ring group of an aliphatic ring and an aromatic ring, C1-C 20 Alkyl groups of C2 to C 20 Alkenyl group; C2-C 20 Alkynyl group; C1-C 20 Alkoxy group; C6-C 30 an aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C1-C 20 is an alkoxycarbonyl group of the formula

[0068] 8) The R', R", and X 2 , L 1 ~L 3 , R 1 ~R 8 and R 10 ~R 13 are deuterium, halogen, and C1-C 30 or C6-C 30 aryl groups, substituted or unsubstituted silane groups; siloxane groups; boron groups; germanium groups; cyano groups; amino groups; nitro groups; C1-C 30 Alkylthio group; C1-C 30Alkoxy group; C6-C 30 Arylalkoxy groups; C1-C 30 Alkyl groups of C2 to C 30 Alkenyl group; C2-C 30 Alkynyl group; C1-C 30 Aryl groups; C6-C substituted with deuterium 30 an aryl group; a fluorenyl group; a C2-C group containing at least one heteroatom selected from the group consisting of O, N, S, Si and P; 30 Heterocyclic group; C3-C 30 Aliphatic ring group; C7-C 30 Aryl alkyl group; C8-C 30 and combinations thereof, wherein adjacent substituents may be joined to form a ring.

[0069] The cardo resin preferably has a weight average molecular weight of 1,000 to 100,000 g / mol.

[0070] The cardo resin is preferably contained in an amount of 1 to 30% by weight based on the total amount of the photosensitive composition.

[0071] The photosensitive composition preferably contains 1 to 40% by weight of the reactive unsaturated compound based on the total amount of the photosensitive composition.

[0072] The photosensitive composition preferably contains a photoinitiator in an amount of 0.01 to 10% by weight based on the total amount of the photosensitive composition.

[0073] In another embodiment, the present invention preferably provides a pixel defining layer manufactured by the above manufacturing method.

[0074] In still another embodiment, the present invention preferably provides an organic light emitting display device including the pixel defining layer.

[0075] In another embodiment, the present invention preferably provides an electronic device including the display device and a controller for driving the display device. Effect of the Invention

[0076] The present invention integrates two patterning processes into one to form a step and realize a colored pattern with low moisture content on an electrode substrate, resulting in bright colors and improved reliability and lifespan of the display. That is, after the exposure and development processes, a pixel isolation layer and a metal mask support layer are formed at once, shortening the process time and minimizing damage to the panel due to additional development and post-heat treatment processes, and preventing pixel shrinkage to minimize reduction in brightness and lifespan. [Brief description of the drawings]

[0077] [Figure 1] 1 is a schematic diagram showing the surfaces of pixel defining layers of an example and a comparative example photographed by a scanning electron microscope. [Diagram 2] 1 is a schematic diagram showing the surfaces of pixel defining layers of an example and a comparative example photographed by a scanning electron microscope. [Diagram 3] 1 is a schematic diagram showing the surfaces of pixel defining layers of an example and a comparative example photographed by a scanning electron microscope. [Figure 4] 1 is a schematic diagram showing the surfaces of pixel defining layers of an example and a comparative example photographed by a scanning electron microscope. [Diagram 5] 1 is a schematic diagram showing the surfaces of pixel defining layers of an example and a comparative example photographed by a scanning electron microscope. [Figure 6] 1 is a schematic diagram showing the surfaces of pixel defining layers of an example and a comparative example photographed by a scanning electron microscope. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0078] Hereinafter, some embodiments of the present invention will be described in detail with reference to the accompanying drawings. When reference numerals are used to designate components in each drawing, the same reference numerals are used to designate the same components even if they are displayed in different drawings.

[0079] In the description of the present invention, if it is determined that a specific description of related publicly known configurations or functions may make the gist of the present invention unclear, the detailed description may be omitted. When "comprises," "has," "consists of," and the like are used in this specification, other parts may be added as long as "only" is not used. When a component is expressed in the singular, it includes the plural unless otherwise expressly specified.

[0080] In addition, in describing the components of the present invention, terms such as first, second, A, B, (a), (b), etc. are used to distinguish the components from other components, and the terms do not limit the nature, order, sequence, number, etc. of the components.

[0081] In describing the positional relationship of components, when two or more components are described as being "coupled," "coupled," or "connected," it should be understood that the two or more components may be directly "coupled," "coupled," or "connected," but that the two or more components may also be "coupled" or "connected" through further "intervening" components, where the other components may be included in one or more of the two or more components that are "coupled," "coupled," or "connected" to each other.

[0082] In addition, when a component such as a layer, film, region, or plate is described as being "on" or "on" another component, this should be understood to include not only the case where the component is "directly on" the other component, but also the case where there is another component in between. Conversely, when a component is described as being "directly on" another part, it should be understood to mean that there is no other part in between.

[0083] In describing a temporal sequence relating to components, methods of operation, methods of production, etc., when the temporal or flow sequence is described using, for example, "after," "following," "next to," or "before," this also includes cases where the sequence is not consecutive, unless "immediately" or "directly" is used.

[0084] On the other hand, when numerical values ​​or corresponding information for components are mentioned, even if there is no separate explicit description, the numerical values ​​or corresponding information can be interpreted as including an error range that may occur due to various factors (e.g., process factors, internal or external impacts, noise, etc.).

[0085] The terms used in this specification and the appended claims are as follows, unless otherwise specified, within the scope of the present invention.

[0086] The term "halo" or "halogen" as used in this application includes fluorine (F), chlorine (Cl), bromine (Br), and iodine (I), unless otherwise stated.

[0087] The term "alkyl" or "alkyl group", as used in this application, unless otherwise specified, means the radical of a saturated aliphatic group having 1 to 60 carbons linked by a single bond, including straight-chain alkyl groups, branched-chain alkyl groups, cycloalkyl (alicyclic) groups, alkyl-substituted cycloalkyl groups, and cycloalkyl-substituted alkyl groups.

[0088] The term "haloalkyl group" or "haloalkyl group" as used herein means, unless otherwise specified, an alkyl group substituted with a halogen.

[0089] The terms "alkenyl" or "alkynyl" as used herein, unless otherwise specified, include groups having double or triple bonds, straight or branched chain groups, and having from 2 to 60 carbon atoms, but are not limited thereto.

[0090] The term "cycloalkyl" as used in this application, unless otherwise specified, means an alkyl group forming a ring having 3 to 60 carbon atoms, but is not limited thereto.

[0091] The term "alkoxy group" or "alkyloxy group" as used herein means an alkyl group having an oxygen radical attached thereto, and unless otherwise specified, has from 1 to 60 carbon atoms, but is not limited thereto.

[0092] The terms "alkeneoxyl group," "alkenoxy group," "alkenyloxyl group," or "alkenyloxy group" as used in this application mean an alkenyl group having an oxygen radical attached thereto, and unless otherwise specified, has 2 to 60 carbon atoms, but is not limited to this.

[0093] The terms "aryl group" and "arylene group" used in this application each have 6 to 60 carbon atoms, unless otherwise specified, but are not limited thereto. In this application, the aryl group or arylene group includes a single ring, a ring assembly, a fused multiple ring system compound, etc. For example, the aryl group includes a phenyl group, a monovalent functional group of biphenyl, a monovalent functional group of naphthalene, a fluorenyl group, and a substituted fluorenyl group, and the arylene group includes a fluorenylene group and a substituted fluorenylene group.

[0094] The term "ring assemblies" as used in this application means two or more ring systems (single ring or joined ring systems) directly linked to each other by single or double bonds, and the number of such direct connections between rings is one less than the total number of ring systems in the compound. Ring assemblies can be identical or different ring systems directly linked to each other by single or double bonds.

[0095] In the present application, the aryl group includes ring assemblies, and therefore includes biphenyl and terphenyl in which a single aromatic ring, a benzene ring, is connected by a single bond. The aryl group also includes compounds in which an aromatic ring system connected to a single aromatic ring is connected by a single bond, and therefore includes compounds in which an aromatic ring system, such as fluorene, is connected to a single aromatic ring, such as a benzene ring.

[0096] The term "fused ring system" used in this application means a fused ring form sharing at least two atoms, including a fused ring form of two or more hydrocarbon ring systems and a fused ring form of at least one heterocyclic ring system containing at least one heteroatom. Such fused ring systems may be aromatic rings, heteroaromatic rings, aliphatic rings, or combinations of these rings. For example, in the case of an aryl group, it may be a naphthalenyl group, a phenanthrenyl group, a fluorenyl group, etc., but is not limited thereto.

[0097] The term "spiro compound" as used in this application has a "spiro union", which means a union in which two rings share only one atom. In this case, the atom shared by the two rings is called a "spiro atom". Depending on the number of spiro atoms in a compound, these compounds are called "monospiro-", "dispiro-", and "trispiro-" compounds, respectively.

[0098] The terms "fluorenyl group", "fluorenylene group", and "fluorenetriyl group" used in this application mean, unless otherwise specified, a monovalent, divalent, or trivalent functional group in which R, R', R" and R'" are all hydrogen in the following structure, respectively, and "substituted fluorenyl group", "substituted fluorenylene group", or "substituted fluorenetriyl group" means that at least one of the substituents R, R', R" and R'" is a substituent other than hydrogen, and includes the case where R and R' are bonded to each other to form a spiro compound together with the carbon to which they are bonded. In this specification, regardless of the valence such as monovalent, divalent, or trivalent, fluorenyl group, fluorenylene group, and fluorenetriyl group can all be named fluorene group.

[0099] [ka]

[0100] Furthermore, the R, R', R" and R'" are each independently an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or a heterocyclic group having 2 to 30 carbon atoms. For example, the aryl group may be phenyl, biphenyl, naphthalene, anthracene, or phenanthrene, and the heterocyclic group may be pyrrole, furan, thiophene, pyrazole, imidazole, triazole, pyridine, pyrimidine, pyridazine, pyrazine, triazine, indole, benzofuranquinazoline, or quinoxaline. For example, the substituted fluorenyl group and fluorenylene group may be a monovalent functional group or a divalent functional group of 9,9-dimethylfluorene, 9,9-diphenylfluorene, and 9,9'-spirobi[9H-fluorene], respectively.

[0101] The term "heterocyclic group" as used herein includes not only aromatic rings such as "heteroaryl groups" or "heteroarylene groups" but also non-aromatic rings, and means, but is not limited to, a ring having 2 to 60 carbon atoms and containing one or more heteroatoms, unless otherwise specified. The term "heteroatom" as used herein means N, O, S, P, or Si, unless otherwise specified, and heterocyclic group means a single ring, ring assembly, fused multiple ring system, spiro compound, etc., containing a heteroatom.

[0102] For example, the term "heterocyclic group" may include compounds that contain heteroatoms such as SO2, P=O, etc., in place of the carbons that form the ring, as in the compounds below.

[0103] [ka]

[0104] The term "ring" as used in this application includes single and multiple rings, including hydrocarbon rings as well as heterocycles containing at least one heteroatom, and includes aromatic and non-aromatic rings.

[0105] The term "polycyclic" as used in this application includes ring assemblies such as biphenyls, terphenyls, fused multiple ring systems, and spiro compounds, and includes aromatic as well as non-aromatic rings, including hydrocarbon rings as well as heterocycles containing at least one heteroatom.

[0106] The term "aliphatic cyclic group" used in the present application means a cyclic hydrocarbon other than aromatic hydrocarbon, including a single ring, a ring assembly, a fused multiple ring system, a spiro compound, etc., and means a ring having 3 to 60 carbon atoms unless otherwise specified, but is not limited thereto. For example, a fusion of an aromatic ring, benzene, and a non-aromatic ring, cyclohexane, also falls under the category of an aliphatic ring.

[0107] Also, when the prefixes are named consecutively, it means that the substituents are listed in the order in which they are written, for example, an arylalkoxy group means an alkoxy group substituted with an aryl group, an alkoxycarbonyl group means a carbonyl group substituted with an alkoxy group, and an arylcarbonylalkenyl group means an alkenyl group substituted with an arylcarbonyl group, where the arylcarbonyl group is a carbonyl group substituted with an aryl group.

[0108] In addition, unless otherwise specified, in the term "substituted or unsubstituted" used in this application, "substituted" means deuterium, halogen, amino group, nitrile group, nitro group, C1-C 30 Alkyl groups, C1-C 30 Alkoxy groups, C1-C 30 Alkylamine groups, C1-C 30 Alkylthiophene groups, C6-C 30 Arylthiophene groups, C2-C 30 Alkenyl groups, C2-C 30 Alkynyl group, C3-C 30 Cycloalkyl groups of C6 to C 30 Aryl groups, C6-C substituted with deuterium 30 Aryl groups, C8-C 30an arylalkenyl group, a silane group, a boron group, a germanium group, and a C2-C alkyl group containing at least one heteroatom selected from the group consisting of O, N, S, Si, and P; 30 The term "substituted" means that the heterocyclic group is substituted with one or more substituents selected from the group consisting of the following heterocyclic groups, but is not limited to these substituents.

[0109] In this application, the "functional group name" corresponding to an aryl group, an arylene group, a heterocyclic group, etc., which are exemplified as examples of each symbol and its substituent, can be described as the "functional group name reflecting the valence" or as the "parent compound name." For example, in the case of "phenanthrene," which is a type of aryl group, the name of the group can be described by dividing the valence, such as "phenanthryl (group)" for a monovalent "group" and "phenanthrylene (group)" for a divalent group, or it can be described as the parent compound name "phenanthrene" regardless of the valence.

[0110] Similarly, pyrimidine can be described as "pyrimidine" regardless of the valence, or as the "name of the group" of the relevant valence, such as pyrimidinyl (group) in the case of a monovalent group, pyrimidinylene (group) in the case of a divalent group, etc. Thus, when the type of substituent is described in the name of a parent compound in this application, it can mean an n-valent "group" formed by eliminating hydrogen atoms bonded to carbon atoms and / or heteroatoms of the parent compound.

[0111] In addition, in this specification, when describing the names of compounds and substituents, numbers and letters indicating positions may be omitted. For example, pyrido[4,3-d]pyrimidine may be described as pyridopyrimidine, benzofuro[2,3-d]pyrimidine as benzofuropyrimidine, 9,9-dimethyl-9H-fluorene as dimethylfluorene, etc. Therefore, both benzo[g]quinoxaline and benzo[f]quinoxaline may be described as benzoquinoxaline.

[0112] In addition, unless otherwise expressly stated, the chemical formulas used in the present application are applied in the same manner as the substituent definitions according to the index definitions of the following chemical formulas.

[0113] [ka]

[0114] where a is an integer of 0, the substituent R 1 In other words, when a is 0, it means that all the carbons forming the benzene ring are bonded to hydrogen, and in this case, the hydrogen bonded to the carbon may be omitted and the chemical formula or compound may be written. Also, when a is an integer of 1, one substituent R 1 is bonded to any one of the carbons forming a benzene ring. When a is an integer of 2 or 3, it can be bonded as shown below. When a is an integer of 4 to 6, it can be bonded to a carbon of the benzene ring in a similar manner. When a is an integer of 2 or more, R 1 may be the same as or different from each other.

[0115] [ka]

[0116] Unless otherwise stated in this application, by forming a ring it is meant that adjacent groups are joined together to form a single ring or joined rings, and the single rings and joined rings formed include hydrocarbon rings as well as heterocycles containing at least one heteroatom, and include aromatic and non-aromatic rings.

[0117] In addition, unless otherwise specified in this specification, when describing a fused ring, the number in "number-fused ring" indicates the number of fused rings. For example, a form in which three rings are fused to each other, such as anthracene, phenanthrene, benzoquinazoline, etc., can be represented as a 3-fused ring.

[0118] In contrast, the term "bridged bicyclic compound" as used herein, unless otherwise specified, refers to a compound in which two rings share three or more atoms to form a ring, where the shared atoms include carbon or heteroatoms.

[0119] In this application, an organic electronic device may refer to the component(s) between the positive electrode and the negative electrode, or may refer to an organic light-emitting diode including the positive electrode, the negative electrode, and the component(s) located therebetween.

[0120] In some cases, the display device in this application may refer to an organic electric element, an organic light-emitting diode, and a panel including the same, or an electronic device including a panel and a circuit. Here, for example, the electronic device may include lighting devices, solar cells, portable or mobile terminals (e.g., smartphones, tablets, PDAs, electronic dictionaries, PMPs, etc.), navigation terminals, game consoles, various TVs, various computer monitors, etc., and may be any type of device that includes the above-mentioned component(s) without being limited thereto.

[0121] Hereinafter, the implementation of the present invention will be described in detail, but it should be understood that the present invention is not limited to the above embodiment, and is defined only by the scope of the claims that follow.

[0122] A composition including a colorant according to an embodiment of the present invention is used to manufacture a red pattern, a green pattern, a blue pattern, or a black matrix, a pixel defining layer (PDL).

[0123] The black pixel defining layer (PDL) according to an embodiment of the present invention may further include an organic black pigment or black dye as an additional colorant other than the colorant contained in the colorant. For example, an organic pigment may be used alone or an organic pigment may be mixed with a color pigment, and in this case, since a color pigment with insufficient light blocking properties is mixed, there is an advantage that the strength of the film (layer) or adhesion to the substrate does not decrease even if the amount of the colorant increases relatively. The negative pixel defining layer (Negative PDL) according to an embodiment of the present invention may include a black pigment or black dye as an additional colorant instead of the colorant contained in the colorant.

[0124] Each component will be specifically described below.

[0125] 1. The manufacturing process of the negative pixel defining layer is as follows:

[0126] (1) Application and coating stage

[0127] The photosensitive composition is a low-viscosity liquid sample, and a spin coater or slit coater is used to coat the substrate at a consistent thickness after application. The faster the spin coater rotates, the less the thickness is, but the greater the reduction in the deviation in flatness over the surface area. For coating large substrates, a slit coater is more preferable than a spin coater. After coating, the surface becomes fluid due to the remaining solvent, which can cause poor flatness. To overcome this, a vacuum chamber dryer (VCD) is used to remove part of the solvent, reducing the fluidity on the surface.

[0128] (2) Pre-bake stage

[0129] This is a process in which the coated substrate is heated at a certain temperature and time on a hot plate or in an oven to remove a portion of the solvent contained in the coating film. If the surface or deep part of the coating film is not dried, contamination of the photomask occurs during exposure in the next process, and the exposed part does not harden well when irradiated with ultraviolet light, and the uncured part is removed without forming a pattern in the development process.

[0130] (3) Exposure stage

[0131] After the pre-bake process is completed, the photomast with the pattern is used to irradiate actinic rays (ultraviolet rays) to harden the film. The types of lamps that generate actinic rays include LED lamps and metal (mercury) lamps, and the wavelengths are g-line (436nm), h-line (405nm), i-line (365nm), and deep UV (<260nm), which can be used individually or in combination.

[0132] (4) Development stage

[0133] In the exposure step, exposed and non-exposed areas are separated by a photomask when irradiated with actinic radiation. In the case of a positive type, the exposed areas are dissolved by a developer, while the non-exposed areas are resistant to the developer, leaving a pattern. In the case of a negative type, the exposed areas are hardened and resistant to the developer, while the non-exposed areas are developed. The black pixel defining layer (Black PDL) manufactured using a composition containing the colorant of the present invention is a negative type, and a pattern is formed by dividing the exposed areas (hardened) and non-exposed areas (developed).

[0134] (5) Post-exposure step

[0135] After the developing process is completed, the substrate on which the pattern is formed is irradiated with actinic rays (ultraviolet rays) again to further harden the formed film. The types of lamps that generate actinic rays include LED lamps and metal (mercury) lamps, and the wavelengths include g-line (436nm), h-line (405nm), i-line (365nm), and Deep UV (<260nm), which can be used individually or in combination.

[0136] (6) Post-heat treatment stage

[0137] This is a process to remove the remaining solvent and fumes by heating the developed substrate at a high temperature between 200℃ and 300℃. If the solvent and fumes are not completely removed in this process, outgassing will occur in the post-heat treatment process, which will affect the device, resulting in dark spots or pixel shrinkage.

[0138] 2. The composition forming the negative pixel defining layer containing the colorant is as follows:

[0139] (1) Patterning resin

[0140] The patterning resin according to an embodiment of the present invention may include an acrylic binder resin, a cardo binder resin, or a combination thereof.

[0141] The acrylic binder resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and is a resin containing one or more acrylic repeating units.

[0142] The first ethylenically unsaturated monomer is an ethylenically unsaturated monomer containing one or more carboxy groups, and specific examples thereof include acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, or a combination thereof. The first ethylenically unsaturated monomer may be contained in an amount of 5% by weight to 50% by weight, for example, 10% by weight to 40% by weight, based on the total amount of the acrylic binder resin.

[0143] Examples of the second ethylenically unsaturated monomer include aromatic vinyl compounds such as styrene, α-methylstyrene, vinyl toluene, and vinylbenzyl methyl ether; unsaturated carboxylate compounds such as methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, benzyl (meth)acrylate, cyclohexyl (meth)acrylate, and phenyl (meth)acrylate; unsaturated carboxylate aminoalkyl ester compounds such as 2-aminoethyl (meth)acrylate and 2-dimethylaminoethyl (meth)acrylate; carboxylate vinyl ester compounds such as vinyl acetate; and unsaturated carboxylate glycidyl ester compounds such as glycidyl (meth)acrylate; cyanide vinyl compounds such as (meth)acrylonitrile; and unsaturated amide compounds such as (meth)acrylamide. These may be used alone or in combination of two or more.

[0144] Specific examples of the acrylic binder resin include, but are not limited to, (meth)acrylic acid / benzyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene copolymer, (meth)acrylic acid / benzyl methacrylate / 2-hydroxyethyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene / 2-hydroxyethyl methacrylate copolymer, etc. These may be used alone or in combination of two or more. The weight average molecular weight of the acrylic binder resin may be 3,000 g / mol to 150,000 g / mol, for example, 5,000 g / mol to 50,000 g / mol, for example, 20,000 g / mol to 30,000 g / mol.

[0145] Cardo resins contain a repeating structure as shown in Formula 1 below.

[0146] [ka]

[0147] In the above Chemical Formula 1,

[0148] 1) R 1 and R 2 are each independently hydrogen; deuterium; halogen; C6-C 30 aryl groups of C2-C containing at least one heteroatom of O, N, S, Si and P; 30 Heterocyclic group; C6-C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1-C 20 Alkyl group; C2-C 20 Alkenyl group; C2-C 20 Alkynyl group; C1-C 20 Alkoxy group; C6-C 30 an aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C1-C 20 is an alkoxycarbonyl group of the formula

[0149] 2) adjacent groups of R' and R" can form a ring;

[0150] 3) m and n are each independently an integer of 0 to 4;

[0151] 4) A1 and A2 are each independently represented by the following formula 2 or 3:

[0152] [ka]

[0153] [ka]

[0154] In the above Chemical Formula 2 and Chemical Formula 3,

[0155] 4-1) * indicates the linkage site,

[0156] 4-2) R 3 ~R 6are each independently hydrogen; deuterium; halogen; C6-C 30 aryl groups of C2-C containing at least one heteroatom of O, N, S, Si and P; 30 Heterocyclic groups; C6-C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1-C 20 Alkyl groups of C2 to C 20 Alkenyl group; C2-C 20 Alkynyl group; C1-C 20 Alkoxy group; C6-C 30 an aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C1-C 20 is an alkoxycarbonyl group of the formula

[0157] 4-3) R 3 ~R 6 can form a ring with adjacent groups,

[0158] 4-4) Y 1 and Y 2 are each independently represented by the following formula 6 or 7:

[0159] [ka]

[0160] [ka]

[0161] In the above Chemical Formula 6 and Chemical Formula 7,

[0162] 4-4-1) * indicates the bond position,

[0163] 4-4-2)R 9 is hydrogen or methyl,

[0164] 4-4-3)R 10 ~R 13 are each independently hydrogen; deuterium; halogen; C6-C 30aryl group; C2-C containing at least one hetero group selected from O, N, S, Si, and P; 30 Heterocyclic groups; C6-C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1-C 20 Alkyl groups of C2 to C 20 Alkenyl group; C2-C 20 Alkynyl group; C1-C 20 Alkoxy group; C6-C 30 an aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C1-C 20 is an alkoxycarbonyl group of the formula

[0165] 4-4-4)L 1 ~L 3 are each independently a single bond; a fluorenylene group; C2-C 30 Alkylene; C6~C 30 Arylene; C2~C 30 Heterocycles; C1-C 30 Alkoxylenes; C2-C 30 alkyleneoxy; C6-C30 aryloxy; C2-C 20 is a polyethyleneoxy group of the formula

[0166] 4-4-5) q and r are each independently an integer of 0 to 3, provided that q+r=3;

[0167] 5) In the polymer chain of the resin containing the repeating unit represented by formula 1, the ratio of A1 to A2 is 9:1 to 1:9;

[0168] 6) X 1 is a single bond; O; CO; SO2; CR'R"; SiR'R"; the following chemical formula 4; or chemical formula 5,

[0169] 6-1) R' and R" are each independently hydrogen; deuterium; halogen; C6-C 30 aryl groups of C2-C containing at least one heteroatom of O, N, S, Si and P; 30 Heterocyclic groups; C6-C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1-C20 Alkyl group; C2-C 20 Alkenyl group; C2-C 20 Alkynyl group; C1-C 20 Alkoxy group; C6-C 30 an aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C1-C 20 is an alkoxycarbonyl group of the formula

[0170] 6-2) R' and R" can form a ring with adjacent groups,

[0171] [ka]

[0172] [ka]

[0173] In the above Chemical Formulas 4 and 5,

[0174] 6-3) * indicates the bond position,

[0175] 6-4) R 7 ~R 8 are each independently hydrogen; deuterium; halogen; C6-C 30 aryl groups of C2-C containing at least one heteroatom of O, N, S, Si and P; 30 Heterocyclic group; C6-C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1-C 20 Alkyl group; C2-C 20 Alkenyl group; C2-C 20 Alkynyl group; C1-C 20 Alkoxy group; C6-C 30 an aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C1-C 20 is an alkoxycarbonyl group of the formula

[0176] 6-5) o and p are each independently an integer of 0 to 4;

[0177] 7) X 2 is C6~C 30 aryl groups of C2-C containing at least one heteroatom of O, N, S, Si and P; 30 Heterocyclic groups; C6-C 30 A fused ring group of an aliphatic ring and an aromatic ring; C1-C 20 Alkyl group; C2-C 20 Alkenyl group; C2-C 20 Alkynyl group; C1-C 20 Alkoxy group; C6-C 30 an aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C1-C 20 is an alkoxycarbonyl group of the formula

[0178] 8) The R', R", and X 2 , L 1 ~L 3 , R 1 ~R 8 and R 10 ~R 13 are deuterium, halogen, and C1-C 30 or C6-C 30 Silane groups, substituted or unsubstituted with aryl groups; siloxane groups; boron groups; germanium groups; cyano groups; amino groups; nitro groups; C1-C 30 Alkylthio group; C1-C 30 Alkoxy group; C6-C 30 Arylalkoxy groups; C1-C 30 Alkyl group; C2-C 30 Alkenyl group; C2-C 30 Alkynyl group; C6-C 30 Aryl groups; C6-C substituted with deuterium 30 an aryl group; a fluorenyl group; a C2-C group containing at least one heteroatom selected from the group consisting of O, N, S, Si and P; 30 Heterocyclic group; C3-C 30 Aliphatic ring group; C7-C 30 Aryl alkyl group; C8-C 30and combinations thereof, wherein adjacent substituents may be joined to form a ring.

[0179] The R', R", and X 2 , L 1 ~L 3 , R 1 ~R 8 and R 10 ~R 13 When is an aryl group, it is preferably a C6 to C 30 Aryl groups of C6 to C 18 The aryl groups may be, for example, phenyl, biphenyl, naphthyl, terphenyl, and the like.

[0180] The R', R", and X 2 , L 1 ~L 3 , R 1 ~R 8 and R 10 ~R 13 When is a heterocyclic group, it is preferably a C2 to C 30 Heterocyclic groups of the formula: 18 heterocyclic groups such as dibenzofuran, dibenzothiophene, naphthobenzothiophene, naphthobenzofuran, and the like.

[0181] The R′, R″ and R 1 ~R 8 and R 10 ~R 13 When is a fluorenyl group, it may be preferably 9,9-dimethyl-9H-fluorene, 9,9-diphenyl-9H-fluorenyl, 9,9'-spirobifluorene, or the like.

[0182] Said L 1 ~L 3 When is an arylene group, it is preferably a C6-C 30 and more preferably an arylene group having from C6 to C18, such as phenyl, biphenyl, naphthyl, or terphenyl.

[0183] The R′, R″ and X 2 , R 1 ~R 8 and R 10 ~R 13 When is an alkyl group, it is preferably a C1-C 10 and may be, for example, methyl, t-butyl, and the like.

[0184] The R′, R″ and X 2 , R 1 ~R 8 and R 10 ~R 13 When is an alkoxy group, it is preferably a C1-C 20 More preferably, an alkoxy group of C1 to C 10 The alkoxy group may be, for example, methoxy, t-butoxy, and the like.

[0185] The R′, R″ and X 2 , L 1 ~L 3 , R 1 ~R 8 and R 10 ~R 13 The ring formed by bonding adjacent groups to each other is C6-C 60 an aromatic ring group; a fluorenyl group; a C2-C group containing at least one heteroatom selected from O, N, S, Si, and P; 60 or a C3-C 60 For example, when adjacent groups are bonded to each other to form an aromatic ring, preferably, 20 More preferably, the aromatic ring is C6 to C 14 can form aromatic rings such as benzene, naphthalene, phenanthrene, etc.

[0186] The cardo resin may be prepared by mixing two or more of the following: a fluorene-containing compound such as 9,9-bis(4-oxiranylmethoxyphenyl)fluorene; an anhydride compound such as benzenetetracarboxylic dianhydride, naphthalenetetracarboxylic dianhydride, biphenyltetracarboxylic dianhydride, benzophenonetetracarboxylic dianhydride, pyromellitic dianhydride, cyclobutanetetracarboxylic dianhydride, perylenetetracarboxylic dianhydride, tetrahydrofurantetracarboxylic dianhydride, and tetrahydrophthalic anhydride; a glycol compound such as ethylene glycol, propylene glycol, and polyethylene glycol; an alcohol compound such as methanol, ethanol, propanol, n-butanol, cyclohexanol, and benzyl alcohol; a solvent compound such as propylene glycol methyl ethyl acetate and N-methylpyrrolidone; a phosphorus compound such as triphenylphosphine; and an amine or ammonium salt compound such as tetramethylammonium chloride, tetraethylammonium bromide, benzyldiethylamine, triethylamine, and benzyltriethylammonium chloride.

[0187] The weight average molecular weight of the cardo resin may be 1,000 to 100,000 g / mol, preferably 1,000 to 50,000 g / mol, and more preferably 1,000 to 30,000 g / mol. When the weight average molecular weight of the resin is within the above range, the pattern formation is performed well without residue during the production of the light-shielding layer, and a good pattern can be obtained without loss of film thickness during development. The resin may be included in an amount of 1 to 30 wt %, more preferably 3 to 20 wt %, based on the total amount of the photosensitive resin composition. When the resin is included within the above range, excellent sensitivity, developability, and adhesion (adhesion) can be obtained.

[0188] (2) Reactive unsaturated compounds

[0189] The reactive unsaturated compound, which is essential for a negative pattern, has an ethylenically unsaturated double bond, and thereby undergoes sufficient polymerization upon exposure in the pattern formation process, thereby enabling the formation of a pattern having excellent heat resistance, light resistance and chemical resistance.

[0190] Specific examples of the reactive unsaturated compound include ethylene glycol diacrylate, ethylene glycol dimethacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, pentaerythritol triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, bisphenol A epoxy acrylate, ethylene glycol monomethyl ether acrylate, trimethylolpropane triacrylate, and tripentaerythritol octaacrylate.

[0191] Examples of commercially available products of the reactive unsaturated compounds are as follows:

[0192] Examples of the bifunctional ester of (meth)acrylic acid include Aronix M-210, M-240, M-6200, etc., manufactured by Toagosei Chemical Industry Co., Ltd.; KAYARAD HDDA, HX-220, R-604, etc., manufactured by Nippon Kayaku Co., Ltd.; and V-260, V-312, V-335HP, etc., manufactured by Osaka Organic Chemical Industry Co., Ltd.

[0193] Examples of the trifunctional esters of (meth)acrylic acid include ARONIX M-309, M-400, M-405, M-450, M-7100, M-8030, M-8060, etc., available from Toagosei Chemical Industry Co., Ltd.; KAYARAD TMPTA, DPCA-20, DPCA-60, DPCA-120, etc., available from Nippon Kayaku Co., Ltd.; and V-295, V-300, V-360, etc., available from Osaka Organic Chemical Industry Co., Ltd.

[0194] The above products can be used alone or in combination of two or more.

[0195] The reactive unsaturated compound may be treated with an acid anhydride to provide better developability. The reactive unsaturated compound may be contained in an amount of 1 to 40% by weight, for example, 1 to 20% by weight, based on the total amount of the photosensitive resin composition. When the reactive unsaturated compound is contained within the above range, curing occurs sufficiently upon exposure in the pattern formation process, resulting in excellent reliability, and the pattern has excellent heat resistance, light resistance, and chemical resistance, as well as excellent resolution and adhesion.

[0196] (3) Photoinitiator

[0197] To realize a negative pattern in photolithography, a photoradical initiator must be used. The photoinitiator has a molar absorption coefficient of 10,000 (L / mol cm) or more in the 330-380 nm region, and a 5% weight loss occurs at 200°C or less. Here, the molar absorption coefficient can be calculated by the Beer-Lambert Law. The weight loss was measured by heating up to 300°C at a rate of 5°C per minute in a nitrogen atmosphere using a TGA.

[0198] The photopolymerization initiator is an initiator commonly used in photosensitive resin compositions, and examples of the photopolymerization initiator that can be used include acetophenone-based compounds, benzophenone-based compounds, thioxanthone-based compounds, benzoin-based compounds, and triazine-based compounds.

[0199] Examples of the acetophenone-based compounds include 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, pt-butyltrichloroacetophenone, pt-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-(morpholinophenyl)-butan-1-one, and the like.

[0200] Examples of the benzophenone-based compounds include benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, and 3,3'-dimethyl-2-methoxybenzophenone.

[0201] Examples of the thioxanthone compounds include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, and 2-chlorothioxanthone.

[0202] Examples of the benzoin-based compounds include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and benzyl dimethyl ketal.

[0203] Examples of the triazine-based compound include 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl) )-s-triazine, 2-biphenyl 4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphth1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphth1-yl)4,6-bis(trichloromethyl)-s-triazine, 2-4-trichloromethyl(piperonyl)-6-triazine, 2-4-trichloromethyl(4'-methoxystyryl)-6-triazine, and the like.

[0204] In addition to the above compounds, the photoinitiator may be a carbazole-based compound, a diketone compound, a sulfonium borate-based compound, a diazo-based compound, an imidazole-based compound, a non-imidazole-based compound, or the like.

[0205] The photoinitiator may be a radical polymerization initiator such as a peroxide-based compound or an azobis-based compound.

[0206] Examples of the peroxide-based compound include ketone peroxides such as methyl ethyl ketone peroxide, methyl isobutyl ketone peroxide, cyclohexanone peroxide, methylcyclohexanone peroxide, and acetylacetone peroxide; diacyl peroxides such as isobutyryl peroxide, 2,4-dichlorobenzoyl peroxide, o-methylbenzoyl peroxide, and bis-3,5,5-trimethylhexanoyl peroxide; hydroperoxides such as 2,4,4-trimethylpentyl-2-hydroperoxide, diisopropylbenzene hydroperoxide, cumene hydroperoxide, and t-butyl hydroperoxide; dicumyl peroxide, 2,5-dimethyl-2,5-di(t-butyl) hydroperoxide, and the like. peroxyhexane, 1,3-bis(t-butyloxyisopropyl)benzene, t-butylperoxyvaleric acid n-butyl ester and other dialkyl peroxides; 2,4,4-trimethylpentylperoxyphenoxyacetate, α-cumylperoxyneodecanoate, t-butylperoxybenzoate, di-t-butylperoxytrimethyladipate and other alkyl peresters; di-3-methoxybutylperoxydicarbonate, di-2-ethylhexylperoxydicarbonate, bis-4-t-butylcyclohexylperoxydicarbonate, diisopropylperoxydicarbonate, acetylcyclohexylsulfonyl peroxide, t-butylperoxyallylcarbonate and other percarbonates.

[0207] Examples of the azobis compounds include 1,1'-azobiscyclohexane-1-carbonitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile), α,α'-azobis(isobutylnitrile), and 4,4'-azobis(4-cyanovaleric acid).

[0208] The photoinitiator may be used together with a photosensitizer that absorbs light, becomes excited, and then transfers the energy to initiate a chemical reaction. Examples of the photosensitizer include tetraethylene glycol bis-3-mercaptopropionate, pentaerythritol tetrakis-3-mercaptopropionate, dipentaerythritol tetrakis-3-mercaptopropionate, etc.

[0209] The photoinitiator may be included in an amount of 0.01 to 10 wt %, for example, 0.1 to 5 wt %, based on the total amount of the photosensitive composition. When the photoinitiator is included within this range, curing occurs sufficiently upon exposure in the pattern formation process, so that excellent reliability can be obtained, and the pattern has excellent heat resistance, light resistance, and chemical resistance, excellent resolution and adhesion, and a decrease in transmittance due to unreacted initiator can be prevented.

[0210] (4) Colorant

[0211] As the colorant, organic pigments, inorganic pigments, and dyes can all be used.

[0212] As the colorant, red pigments, green pigments, blue pigments, yellow pigments, black pigments, etc. can be used.

[0213] Examples of the red pigment include CI Red Pigment 254, CI Red Pigment 255, CI Red Pigment 264, CI Red Pigment 270, CI Red Pigment 272, CI Red Pigment 177, CI Red Pigment 89, and the like.

[0214] Examples of the green pigment include halogen-substituted copper phthalocyanine pigments such as CI Green Pigment 36 and CI Green Pigment 7.

[0215] Examples of the blue pigment include copper phthalocyanine pigments such as CI Blue Pigment 15:6, CI Blue Pigment 15, CI Blue Pigment 15:1, CI Blue Pigment 15:2, CI Blue Pigment 15:3, CI Blue Pigment 15:4, CI Blue Pigment 15:5, and CI Blue Pigment 16.

[0216] Examples of the yellow pigment include isoindoline pigments such as CI Yellow Pigment 139, quinophthalone pigments such as CI Yellow Pigment 138, nickel complex pigments such as CI Yellow Pigment 150, and the like.

[0217] Examples of the black pigment include lactam black, aniline black, perylene black, titanium black, and carbon black.

[0218] In addition, the colorant in the photosensitive resin composition according to the embodiment may include a pigment, a dye, or a combination thereof. For example, the dye may include a phthalocyanine-based compound.

[0219] The pigments and dyes may be used alone or in combination, and are not limited to these examples.

[0220] Among these, the black pigment can be used to efficiently block light in the light-shielding layer. When the black pigment is used, it can be used together with a color correction agent such as anthraquinone pigments, perylene pigments, phthalocyanine pigments, and azo pigments.

[0221] A dispersant may be used together with the pigment in order to disperse the pigment in the photosensitive resin composition. Specifically, the pigment may be surface-treated with a dispersant before use, or the dispersant may be added together with the pigment during the preparation of the photosensitive resin composition.

[0222] The dispersant may be a nonionic dispersant, an anionic dispersant, a cationic dispersant, etc. Specific examples of the dispersant include polyalkylene glycol and its ester, polyoxyalkylene, polyhydric alcohol ester alkylene oxide adduct, alcohol alkylene oxide adduct, sulfonic acid ester, sulfonate, carboxylate, carboxylate, alkylamide alkylene oxide adduct, alkylamine, etc., which may be used alone or in combination of two or more.

[0223] Examples of commercially available dispersant products include DISPERBYK-101, DISPERBYK-130, DISPERBYK-140, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK-164, DISPERBYK-165, DISPERBYK166, DISPERBYK-170, DISPERBYK-171, DISPERBYK-182, DISPERBYK-2000, DISPERBYK-2001, etc.; EFKA-47, EFKA-47EA, EFKA-48, EFKA-49, EFKA-100, EFKA-400, EFKA-450, etc. from EFKA Chemical; Solsperse 5000, Solsperse 12000, Solsperse 13240, Solsperse 13940, Solsperse 17000, Solsperse 20000, Solsperse 24000GR, Solsperse 27000, Solsperse 28000, etc. from Zeneka; or PB711, PB821 from Ajinomoto, etc.

[0224] The dispersant may be contained in an amount of 0.1% by weight to 15% by weight based on the total amount of the photosensitive resin composition. When the dispersant is contained within the above range, the dispersibility of the composition is excellent, and therefore the stability, developability, and patternability during the production of the light-shielding layer are excellent.

[0225] The pigment may be pretreated with a water-soluble inorganic salt and a wetting agent before use. When the pigment is pretreated, the average particle size of the pigment may be reduced.

[0226] The pretreatment includes kneading the pigment with a water-soluble inorganic salt and a wetting agent, and filtering and washing the pigment obtained from the kneading step.

[0227] The kneading is carried out at a temperature of 40° C. to 100° C., and the filtering and washing are carried out by washing the inorganic salt with water or the like and then filtering.

[0228] Examples of the water-soluble inorganic salt include, but are not limited to, sodium chloride and potassium chloride.

[0229] The wetting agent serves as a medium for uniformly mixing the pigment and the water-soluble inorganic salt to facilitate pulverization of the pigment. Examples of the wetting agent include alkylene glycol monoalkyl ethers such as ethylene glycol monoethyl ether, propylene glycol monomethyl ether, diethylene glycol monomethyl ether, etc.; alcohols such as ethanol, isopropanol, butanol, hexanol, cyclohexanol, ethylene glycol, diethylene glycol, polyethylene glycol, and glycerin polyethylene glycol, and these can be used alone or in combination of two or more.

[0230] The pigment having undergone the kneading step may have an average particle size of 20 nm to 110 nm. When the average particle size of the pigment is within the above range, it is possible to effectively form a fine pattern while having excellent heat resistance and light resistance.

[0231] The pigment may be contained in an amount of 1 to 40% by weight, more specifically 2 to 30% by weight, based on the total amount of the photosensitive resin composition. When the pigment is contained within the above range, the color reproduction rate is excellent, and the curing property and adhesion of the pattern are excellent.

[0232] (5) Solvent

[0233] The solvent used is a material that is compatible with, but does not react with, the cardo resin, the reactive unsaturated compound, the pigment, the cardo compound, and the initiator.

[0234] Examples of the solvent include alcohols such as methanol and ethanol; ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, methyl phenyl ether, and tetrahydrofuran; glycol ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; cellosolve acetates such as methyl cellosolve acetate, ethyl cellosolve acetate, and diethyl cellosolve acetate; carbitols such as methyl ethyl carbitol, diethyl carbitol, diethyl glycol monomethyl ester, diethylene glycol monomethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, and diethylene glycol diethyl ether; propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate; aromatic hydrocarbons such as toluene and xylene; methyl ethyl ketone, cyclohexanone, 4-hydroxy-4- Ketones such as methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-amyl ketone, and 2-heptanone; saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate, and isobutyl acetate; lactate esters such as methyl lactate and ethyl lactate; oxyacetic acid alkyl esters such as methyl oxyacetate, ethyl oxyacetate, and butyl oxyacetate; alkoxyacetic acid alkyl esters such as methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, and ethyl ethoxyacetate; 3-oxypropionic acid alkyl esters such as methyl 3-oxypropionate and ethyl 3-oxypropionate; 3-alkoxypropionic acid alkyl esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, and methyl 3-ethoxypropionate; 2-oxypropionic acid alkyl esters such as methyl 2-oxypropionate, ethyl 2-oxypropionate, and propyl 2-oxypropionate;2-alkoxypropionic acid alkyl esters such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, ethyl 2-ethoxypropionate, and methyl 2-ethoxypropionate; 2-oxy-2-methylpropionic acid esters such as methyl 2-oxy-2-methylpropionate and ethyl 2-oxy-2-methylpropionate; monooxymonocarboxylic acid alkyl esters of 2-alkoxy-2-methylpropionic acid alkyl esters such as methyl 2-methoxy-2-methylpropionate and ethyl 2-ethoxy-2-methylpropionate; esters such as ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl hydroxyethyl acetate, and methyl 2-hydroxy-3-methylbutanoate; and ketone acid esters such as ethyl pyruvate.

[0235] Also usable are high boiling point solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethylsulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, and phenyl cellosolve acetate.

[0236] Among the above solvents, in consideration of compatibility and reactivity, glycol ethers such as ethylene glycol monoethyl ether; ethylene glycol alkyl ether acetates such as ethyl cellosolve acetate; esters such as ethyl 2-hydroxypropionate; carbitols such as diethylene glycol monomethyl ether; and propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate may be used.

[0237] The solvent may be contained as the remainder based on the total amount of the photosensitive resin composition, specifically, 40 to 90% by weight. When the solvent is contained within the above range, the photosensitive resin composition has an appropriate viscosity, and thus has excellent processability during the production of the pattern layer.

[0238] (6) Other additives

[0239] The photosensitive composition may further contain additives such as malonic acid; 3-amino-1,2-propanediol; a silane coupling agent containing a vinyl group or a (meth)acryloxy group; a leveling agent; a fluorine-based surfactant; and a radical polymerization initiator in order to prevent stains and spots during application, improve leveling performance, and prevent the generation of residues due to undeveloped film.

[0240] For example, the photosensitive resin composition may further include a silane coupling agent having a reactive substituent such as a vinyl group, a carboxyl group, a methacryloxy group, an isocyanate group, or an epoxy group in order to improve adhesion to a substrate.

[0241] Examples of the silane coupling agent include trimethoxysilylbenzoic acid, gamma methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, gamma isocyanatepropyltriethoxysilane, gamma glycidoxypropyltrimethoxysilane, and beta epoxycyclohexylethyltrimethoxysilane. These may be used alone or in combination of two or more.

[0242] The silane coupling agent may be contained in an amount of 0.01 to 10 parts by weight relative to 100 parts by weight of the photosensitive resin composition. When the silane coupling agent is contained within the above range, the composition has excellent adhesion, storage stability, and the like.

[0243] In addition, the photosensitive resin composition may further contain a surfactant, for example, a fluorine-based surfactant, in order to improve coating properties and prevent the generation of defects, if necessary.

[0244] The fluorine-based surfactant is BM Fluorosurfactants commercially available under the names of BM-1000 (registered trademark), BM-1100 (registered trademark) and the like from Chemie; Megafac F142D (registered trademark), F172 (registered trademark), F173 (registered trademark), F183 (registered trademark) and the like from Dainippon Ink and Chemicals Co., Ltd.; Fluorad FC-135 (registered trademark), FC-170C (registered trademark), FC-430 (registered trademark), FC-431 (registered trademark) and the like from Sumitomo 3M Co., Ltd.; Surflon S-112 (registered trademark), S-113 (registered trademark), S-131, S-141, S-145 and the like from Asahi Glass Co., Ltd.; SH-28PA (registered trademark), S-190 (registered trademark), S-193 (registered trademark), SZ-6032 (registered trademark), SF-8428 (registered trademark) and the like from Dray Silicon Co., Ltd. may also be used.

[0245] The surfactant may be used in an amount of 0.001 to 5 parts by weight based on 100 parts by weight of the photosensitive resin composition. When the surfactant is included within this range, coating uniformity is ensured, spots are not generated, and wetting to glass substrates is excellent. In addition, the photosensitive resin composition may contain other additives such as antioxidants and stabilizers in a certain amount within a range that does not impair physical properties.

[0246] In another embodiment, the above-mentioned photosensitive resin composition can be used to pattern the pixel separation portion of the organic light emitting element electrode.

[0247] Synthesis examples and examples according to the present invention will be specifically described below, but the synthesis examples and examples of the present invention are not limited thereto.

[0248] (Preparation of Black Photosensitive Composition)

[0249] Synthesis Example 1: (Production of 9,9-Bis[4-(glycidyloxy)phenyl]fluorene of Chemical Formula 8)

[0250] 20g of 9,9'-bisphenolfluorene (Sigma Aldrich), 8.67g of glycidyl chloride (Sigma Aldrich), and 30g of anhydrous potassium carbonate were placed in a 300ml three-necked round-bottom flask equipped with 100ml of dimethylformamide and a distillation tube, and the mixture was heated to 80°C and reacted for 4 hours. The temperature was then lowered to 25°C, and the reaction solution was filtered. The filtrate was added dropwise to 1000ml of water with stirring, and the precipitated powder was filtered, washed with water, and dried under reduced pressure at 40°C to obtain 25g of 9,9-Bis[4-(glycidyloxy)phenyl]fluorene of the following chemical formula 8. The purity of the obtained powder was 98% as a result of HPLC analysis.

[0251] [ka]

[0252] Synthesis Example 2: Production of Cardo-based binder resin

[0253] 25g (54mmol) of compound 1 obtained from Synthesis Example 1, 8g of acrylic acid (Daejung Chemicals & Metals), 0.2g of benzyltriethylammonium chloride (Daejung Chemicals & Metals) and 0.2g of hydroquinone (Daejung Chemicals & Metals) were placed in a 300ml three-necked round-bottom flask equipped with a distillation tube together with 52g of propylene glycol methyl ether acetate (Sigma Aldrich), and stirred at 110°C for 6 hours. After the reaction was completed, 8g of biphenyltetracarboxylic dianhydride (Mitsubishi Gas) and 1.8g of tetrahydrophthalic acid (Sigma Aldrich) were added, and the mixture was stirred again at 110°C for 6 hours. After the reaction was completed, the reaction solution was collected and analyzed, and it was found that a cardo-based binder resin with a molecular weight of 4,580 and a solid content of 45% was obtained.

[0254] A dispersion was obtained by dispersing 15 g of Irgaphor Black S 100 CF (black pigment / BASF), 8.5 g of Disperbyk 163 (BYK), and 6.5 g of SR-3613 (SMS) together with 70 g of propylene glycol methyl ether acetate using a paint shaker (Asada) and 100 g of zirconia beads (Toray) with a diameter of 0.5 mm for 10 hours.

[0255] A photosensitive liquid composition was prepared according to the composition shown in Table 1 below.

[0256] Specifically, the initiator was dissolved in a solvent and stirred at room temperature, and then the binder resin and the polymerizable compound were added thereto and stirred at room temperature. Then, the colorant and other additives were added to the obtained reaction product and stirred at room temperature. Then, the product was filtered three times to remove impurities, thereby preparing a photosensitive resin composition.

[0257] [Table 1]

[0258] A method for preparing a negative pixel defining layer (NDL) using the photosensitive composition is as follows.

[0259] (1) Application and coating stage

[0260] The photosensitive composition is applied to a cleaned 10cm x 10cm metal-deposited substrate using a spin coater to a certain thickness, and then a coating is formed by removing part of the solvent using VCD (vacuum chamber dry). The coating thickness of the photosensitive composition is 3.3 to 3.5 micrometers after VCD.

[0261] (2) Pre-bake stage

[0262] In order to remove the solvent contained in the obtained coating film, it is heated on a hot plate at 80°C to 120°C for 50 to 200 seconds. By removing a certain amount of the solvent in this process, it is possible to reduce pixel-shaped mask contamination in the next process (exposure) and create a clean pattern.

[0263] (3) Exposure stage

[0264] In order to obtain a desired pattern and a certain thickness of the obtained coating film, a pixel-shaped mask is interposed, and then the film is irradiated with actinic radiation of 190 nm to 600 nm, preferably a light source of a metal or LED lamp having a ghi-line, using an exposure machine to form a pattern. The exposure dose for forming a pattern is 20 to 150 mJ / cm. 2 It is a negative type photoresist material that is formed by exposing the photomask to light. The transmittance of the photomask used during exposure was set to three ranges: 0% (non-exposed area), 20-50% (half-tone), and 100% (full-tone), to form a pattern.

[0265] (4) Development stage

[0266] Following the exposure step, the film is developed using a 2.38 wt% TMAH (tetramethylammonium hydroxide) developer at 23±2°C for a certain time (minutes) by dipping for 30 to 60 seconds, and then washed with ultrapure water (DI water), whereby the non-exposed areas are dissolved and removed, leaving only the exposed areas to form an image pattern. The coating thickness is 1.30 to 1.95 μm for half-tone and 3.20 to 3.40 μm for full-tone.

[0267] (5) Post-exposure step

[0268] Following the development step, in order to prevent the pattern from collapsing after post-heat treatment, the strength of the coating film can be increased by irradiating the entire area through light with a metal or LED lamp light source having actinic radiation of 190 nm to 600 nm, preferably ghi-line, without a photomask. The exposure dose for increasing the strength is 50 to 1,000 mJ / cm. 2 , preferably 100 to 900 mJ / cm 2 It is.

[0269] (6) Post-heat treatment stage

[0270] In order to obtain the image pattern obtained by the development, post baking is performed in an oven at 210~300°C for 30~120 minutes to completely remove the solvent and ultrapure water (DI water, moisture) absorbed into the coating film during the development step, and the pattern is cured to form a film, after which the moisture content is measured.

[0271] (7) Moisture content measurement

[0272] After forming a pattern on a substrate through the above steps (1), (2), (3), (4), and (5) using the photosensitive composition, the moisture content was measured in an area of ​​10 cm x 10 cm. The coating thickness was 1.45 to 1.55 μm after post-heat treatment, and the weight of the 10 cm x 10 cm substrate after coating the photosensitive composition and post-heat treatment was 11 to 12 g. The substrate was subjected to moisture collection at 120°C for 5 minutes using Brookfield's Vapor Pro XL. Samples were prepared by changing process conditions such as the development time and temperature in the development step, and the heating temperature and heat treatment time in the post-heat treatment step, and the moisture content was compared.

[0273] (8) Element reliability evaluation

[0274] When comparing the amount of moisture detection, the minimum and maximum amount of moisture detection was confirmed under each process condition, and after forming a pixel defining layer (PDL) pattern substrate under each condition, organic materials were deposited to evaluate the device reliability, and reliability verification factors such as high temperature operation, pixel shrinkage, dark spots, and life time were confirmed.

[0275] (element substrate manufacturing)

[0276] As shown in Figures 1 to 6, the OLED device substrate had electrodes formed on a glass surface with a thickness of ITO (80-120 Å)-Ag (900-1,100 Å)-ITO (80-120 Å), and an evaluation substrate was obtained with a negative pixel definition layer formed on the electrodes through coating, exposure, development, and post-heat treatment with a composition containing a colorant. The physical properties of the evaluation substrate were measured with an ultraviolet spectroscope (UV-Vis. Spectrometer), and the reflectance was 95% or more at 550 nm, and the ITO surface roughness was 2 nm or less when measured with an atomic force microscope (AFM).

[0277] [Table 2]

[0278] After the post-heat treatment step, the amount of moisture generated from the substrate obtained from the process was measured and compared. With reference to Comparative Examples 1 to 6 in Table 2, it was confirmed that the moisture content after post-heat treatment was 50 ppm or more even when the post-heat treatment temperature was low and the post-heat treatment time was increased. It was confirmed that if the moisture content after post-heat treatment was high, dark spots occurred when the device was operated as shown in Figure 1. With reference to Examples 1 to 12, it was confirmed that there were no problems with dark spots and lifespan when the moisture content after post-heat treatment was 50 ppm or less.

[0279] The above description is merely illustrative of the present invention, and various modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention.

[0280] Therefore, the embodiments disclosed in this specification are for illustrative purposes only and are not intended to limit the present invention, and the spirit and scope of the present invention are not limited by such embodiments. The scope of protection of the present invention should be interpreted by the claims, and all technologies within the scope equivalent thereto should be interpreted as being included in the scope of the present invention.

Claims

1. A method for manufacturing a pixel defining layer, comprising the steps of applying and coating a photosensitive composition; pre-baking; exposing; developing; post-exposing; and post-heat treating, wherein the photomask transmittance is divided into three sections, namely, 0% (non-exposed area), 20-50% (half-tone), and 100% (full-tone), the post-heat treating step is performed at an oven temperature of 210°C to 300°C for 30 minutes to 120 minutes, and the content of moisture generated after the post-heat treating step is 50 ppm or less.

2. 2. The method of claim 1, wherein the pre-baking step is performed at a hot plate temperature of 90.degree. C. to 120.degree. C.

3. 2. The method of claim 1, wherein the pre-baking step is performed for 100 to 150 seconds.

4. 2. The method of claim 1, wherein the developing step is performed for 35 to 55 seconds.

5. The exposure step is performed at 80 to 110 mJ / cm ２ The method for manufacturing a pixel defining layer according to claim 1 , further comprising irradiating energy.

6. 2. The method of claim 1, wherein the thickness of a half-tone of the pattern after the developing step is 1.40 to 2.00 μm.

7. 2. The method of claim 1, wherein the full-tone thickness of the pattern after the developing step is 3.25 to 3.35 μm.

8. The post-exposure step is performed by irradiating the entire area with 190 to 600 nm actinic radiation without a mask at 100 to 900 mJ / cm 2 , similar to the exposure step. ２ The method for manufacturing a pixel defining layer according to claim 1 , further comprising irradiating the layer with exposure energy.

9. 2. The method of claim 1, wherein after the post-heat treatment, the taper angle of the lower pattern is 15 to 65 degrees and the taper angle of the upper pattern is 10 to 45 degrees.

10. 2. The method of claim 1, wherein the pattern has a half-tone thickness of 1.00 to 1.90 μm after the post-heat treatment.

11. 2. The method of claim 1, wherein the pattern has a full-tone thickness of 2.80 to 3.20 μm after the post-heat treatment.

12. 2. The method of claim 1, wherein the photosensitive composition contains a colorant.

13. 2. The method of claim 1, wherein the photosensitive composition comprises a patterning resin comprising an acrylic binder resin, a cardo binder resin, or a combination thereof.

14. 2. The method for manufacturing a pixel-defining layer according to claim 1, wherein the photosensitive composition contains 1 to 40% by weight of the reactive unsaturated compound based on the total amount of the photosensitive composition.

15. 2. The method of claim 1, wherein the photosensitive composition contains 0.01 to 10% by weight of a photoinitiator based on the total weight of the photosensitive composition.

16. A pixel defining layer manufactured according to claim 1.

17. An organic light emitting display comprising the pixel defining layer according to claim 16.

18. 20. An electronic device comprising the display device of claim 17 and a control unit for driving the display device.

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