Fluorescent light source device

Abstract

To provide a small-sized light source device capable of acquiring line-like illumination light while using a solid light source.SOLUTION: A fluorescent light source device includes: a plurality of semiconductor laser elements; a plurality of collimation optical systems for reducing a divergent angle of the light emitted from emitters of the plurality of semiconductor laser elements respectively; a reflection optical system including a plurality of reflection elements for converting a travelling direction of the light emitted from the plurality of collimation optical systems; a condensing optical system for condensing the light emitted from the plurality of reflection elements; and a fluorescent member where the light emitted from the condensing optical system enters, and which emits fluorescent light of wavelengths different from that of the light which has entered. On the surface of the fluorescent member, an irradiation region is formed where images of emitters of the plurality of semiconductor laser elements are projected respectively. In the plurality of reflection elements, an inclination angle of each reflection surface is set so that the irradiation region presents a line-like shape.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a fluorescent light source device including a fluorescent member that receives excitation light and emits fluorescent light. [Background technology]

[0002] In general, lamps can provide high-intensity light in comparison with solid-state light sources such as LEDs and LDs, but they have the drawback of a short lifespan and a long startup time. For this reason, there are circumstances in which solid-state light sources are desired instead of lamps in order to achieve longer lifespans and instant lighting. However, in the case of LEDs, the amount of light can be insufficient depending on the application, so the development of laser-excited fluorescent light source devices is underway in order to obtain sufficient light.

[0003] However, depending on the application of the light source device, such as a light source device for a fundus camera, a line-shaped illumination light may be required. Conventionally, the line-shaped illumination light has been realized by irradiating light from a xenon lamp through a slit.

[0004] Known examples of light source devices for fundus cameras include those disclosed in Patent Documents 1 and 2 below. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 4-303413 [Patent Document 2] JP 2000-116602 A Summary of the Invention [Problem to be solved by the invention]

[0006] The technology of Patent Document 1 is related to a fundus camera, and it is known that a halogen lamp or the like is used as an illumination light source when observing the fundus. However, in order to illuminate the fundus, it is necessary to take in light from the pupil into the inside of the eyeball, and therefore the light source must have high brightness.

[0007] In response to this, Patent Document 2 describes the use of a laser as a solid-state light source for the fundus illumination light source of a fundus camera. However, in order to obtain a line-shaped light suitable for a fundus illumination light source, a slit or the like is used, so only a part of the laser light can be used, resulting in a problem that sufficient illuminance cannot be obtained. In addition, there is a problem that the entire device becomes large when multiple light source parts including optical systems are provided to obtain high illuminance.

[0008] The present invention has been made in consideration of the above problems, and has an object to provide a small light source device that can obtain line-shaped illumination light while using a solid-state light source. [Means for solving the problem]

[0009] The fluorescent light source device of the present invention comprises: A plurality of semiconductor laser elements arranged on a surface; a plurality of collimating optical systems arranged corresponding to the plurality of semiconductor laser elements, each of which reduces a divergence angle of light emitted from an emitter of the plurality of semiconductor laser elements; a reflection optical system including a plurality of reflection elements arranged corresponding to the plurality of collimating optical systems and converting the traveling direction of each of the light beams emitted from the plurality of collimating optical systems; a focusing optical system that focuses light emitted from the plurality of reflecting elements; a fluorescent member into which the light emitted from the light collecting optical system is incident and which emits fluorescent light having a wavelength different from that of the incident light, an illumination region onto which images of the emitters of the plurality of semiconductor laser elements are respectively projected is formed on a surface of the fluorescent member; The plurality of reflective elements are characterized in that the inclination angles of the reflective surfaces are set so that the irradiation area has a line shape.

[0010] According to the above-mentioned device, a collimating optical system and a reflecting element are arranged corresponding to each semiconductor laser element. Therefore, a large optical system for splitting one light into multiple lights is not required. The collimating optical system and the reflecting element can be small and corresponding to each semiconductor laser element.

[0011] In the above device, the reflection angles of the multiple reflecting elements are appropriately adjusted, so that the light (excitation light) from the semiconductor laser element forms a linear irradiation area on the surface of the fluorescent member, and an image of the emitter of each semiconductor laser element is projected onto the irradiation area.

[0012] By forming a linear irradiation area on the surface of the fluorescent member in this manner, a linear fluorescence is emitted from the fluorescent member.

[0013] In this specification, "line-shaped" refers to a shape that, when projected onto a certain surface, has an extremely long length along a certain direction (referred to as the "first direction") that is 10 times or more longer than the length along a direction perpendicular to the first direction (referred to as the "second direction").

[0014] The emission wavelength of the semiconductor laser element is not limited, but for example, it is an element that emits light in the blue region with a main peak wavelength of 400 nm to 500 nm. The fluorescent member is not limited in material or shape as long as it receives light emitted from the semiconductor laser element, converts the wavelength, and emits fluorescence. As an example, the fluorescent member is a rare earth compound (Ce 3+ ,EU 2+ The phosphor particles are a sintered body in which particles of an inorganic phosphor material activated by an inorganic fluorescer or the like are mixed with binder particles made of an inorganic material.

[0015] The irradiation region may be formed by arranging a plurality of images of the emitters of the semiconductor laser element along a longitudinal direction of the images of the emitters of the semiconductor laser element.

[0016] By adjusting the inclination angle of the reflecting surface of each of the plurality of reflecting elements so that the irradiation area has the above-mentioned shape, a linear beam of light with a narrow line width can be obtained.

[0017] Several methods can be used to adjust the inclination angle of each of the reflecting surfaces of the plurality of reflecting elements.

[0018] For example, the fluorescent light source device may include an angle adjustment mechanism capable of adjusting the inclination angle of the reflecting surface of each of the plurality of reflecting elements.

[0019] In this case, the angle adjustment mechanism can be configured to rotate the reflecting surface of the reflecting element about an axis corresponding to a fast direction of light incident on the reflecting surface.

[0020] In another example, the fluorescent light source device includes an installation member on which a plurality of the reflection elements are installed, The installation member has a plurality of installation surfaces on which the reflection surfaces of the plurality of reflection elements are installed, The plurality of installation surfaces may have different inclination angles.

[0021] The irradiation area may be such that first areas at both ends in the longitudinal direction of the line have a higher power density of incident light than a second area located more centrally than the first areas.

[0022] The light intensity of the semiconductor laser element projected onto the first region at both ends in the longitudinal direction may be higher than the light intensity of the semiconductor laser element projected onto the second region located more centrally than the first region. Images of light emitted from the multiple semiconductor laser elements with projection magnification adjusted by an optical system are projected onto the light emission surface of the phosphor. In this embodiment, an example of the size is 1.4 mm x 0.25 mm in longitudinal length x width.

[0023] The length of both ends in the longitudinal direction of the images of the emitters of two adjacent semiconductor laser elements projected onto the first region may be shorter than the length of both ends in the longitudinal direction of the images of the emitters of two adjacent semiconductor laser elements projected onto the second region.

[0024] With the above configuration, in a line-shaped irradiation area, the density of light projected onto first areas at both ends in the longitudinal direction is higher than the density of light projected onto a second area located more centrally than the first areas. Effect of the Invention

[0025] According to the present invention, a small-sized light source device is realized that can obtain line-shaped illumination light while using a solid-state light source. [Brief description of the drawings]

[0026] [Figure 1] 1 is a block diagram showing a schematic configuration of an embodiment of a fluorescent light source device of the present invention. [Diagram 2] FIG. 2 is a plan view showing a schematic structure of a solid-state light source included in the fluorescent light source device. [Diagram 3] 1 is a diagram illustrating a state in which light that has passed through a focusing optical system is projected onto a surface of a fluorescent member. [Figure 4] 1 is a diagram showing a schematic diagram of a light ray diagram of excitation light emitted from semiconductor laser elements (3a, 3b, 3c, 3d) until it is incident on a fluorescent member. [Diagram 5]11 is a diagram showing a schematic diagram of a light ray diagram of excitation light emitted from semiconductor laser elements (3e, 3f, 3g, 3h) until it is incident on a fluorescent member. [Figure 6] 5 is a schematic enlarged view of the vicinity of a surface 11 of the fluorescent member 10 in FIG. 4. FIG. [Figure 7] 6 is a schematic enlarged view of the vicinity of a surface 11 of the fluorescent member 10 in FIG. 5. FIG. [Figure 8] 11 is a diagram illustrating a simulation of light when the inclination angle of the reflecting surface of each reflecting element is adjusted. [Figure 9] FIG. 2 is a schematic perspective view showing a first configuration example of a reflecting member. [Figure 10] FIG. 2 is a schematic plan view showing a first configuration example of a reflecting member, in which a base portion is omitted. [Figure 11] 11 is a diagram illustrating the mirror base and the connecting member extracted from FIG. 10. [Figure 12] FIG. 12 is a perspective view showing a schematic exploded view of each element from FIG. 11. [Figure 13] FIG. 11 is a schematic perspective view showing a second configuration example of the reflective member. [Figure 14] FIG. 11 is a schematic plan view showing a second configuration example of the reflective member, in which the base portion is omitted. [Figure 15] 15 is a diagram illustrating the mirror base and the connecting member extracted from FIG. 14. [Figure 16] FIG. 16 is a perspective view showing a schematic exploded view of each element from FIG. 15. [Figure 17] FIG. 13 is a schematic plan view showing a third configuration example of the reflective member, in which the base portion is omitted. [Figure 18] 18 is a diagram illustrating the mirror base and the connecting member extracted from FIG. 17. [Figure 19] FIG. 19 is a perspective view showing a schematic exploded view of each element from FIG. 18. [Figure 20] 18 is another drawing illustrating the mirror base and the connecting member extracted from FIG. 17. [Figure 21] FIG. 21 is a perspective view showing a schematic exploded view of each element from FIG. 20. [Figure 22]13 is a diagram illustrating a state in which light that has passed through a focusing optical system is projected onto a surface of a fluorescent member in a fluorescent light source device according to another embodiment. [Diagram 23] 13 is a diagram illustrating a state in which light that has passed through a focusing optical system is projected onto a surface of a fluorescent member in a fluorescent light source device according to another embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0027] An embodiment of a fluorescent light source device of the present invention will be described with reference to the drawings. Note that in the following drawings, the dimensional ratios in the drawings do not necessarily match the actual dimensional ratios, and the dimensional ratios between the drawings do not necessarily match.

[0028] Fig. 1 is a block diagram showing a schematic configuration of an embodiment of a fluorescent light source device. The fluorescent light source device 1 includes an excitation light source 3, multiple collimating optical systems 5, a reflective optical system 7, a focusing optical system 9, and a fluorescent member 10. As shown in Fig. 1, the reflective optical system 7 includes multiple reflecting elements 7a, 7b, 7c, 7d, ...

[0029] Fig. 2 is a plan view showing a schematic example of the structure of the excitation light source 3. The excitation light source 3 shown in Fig. 2 is configured by arranging a plurality of semiconductor laser elements (3a, 3b, 3c, 3d, 3e, 3f, 3g, 3h) on a plane. For convenience of illustration, only the semiconductor laser elements (3a, 3b, 3c, 3d) are shown in Fig. 1, but it is acceptable to assume that the remaining semiconductor laser elements (3e, 3f, 3g, 3h) are arranged in the depth direction of the semiconductor laser elements (3a, 3b, 3c, 3d) on the page, for example.

[0030] In this embodiment, the case where the excitation light source 3 includes eight semiconductor laser elements (3a, 3b, 3c, 3d, 3e, 3f, 3g, 3h) will be described as an example, but in the present invention, the number of semiconductor laser elements mounted on the excitation light source 3 is not limited as long as it is two or more.

[0031] In the present invention, the wavelength of light emitted from each of the semiconductor laser elements (3a, 3b, 3c, 3d, . . . ) is not limited, but may be, for example, an element that emits light in the blue region with a main peak wavelength of 400 nm to 500 nm.

[0032] In FIG. 2, the emitter 4 of each semiconductor laser element (3a, 3b, 3c, 3d, 3e, 3f, 3g, 3h) is shown in schematic form. The emitter 4 has a rectangular shape with the slow direction S as the longitudinal direction and the fast direction F as the transverse direction. The light emitted from the emitter 4 of each semiconductor laser element (3a, 3b, 3c, 3d, ...) is incident on the collimating optical system 5 (5a, 5b, 5c, 5d, ...) arranged corresponding to each semiconductor laser element (3a, 3b, 3c, 3d, ...) as shown in FIG. 1. The collimating optical system 5 (5a, 5b, 5c, 5d, ...) reduces the divergence angle of the incident light and emits it. The collimating optical system 5 (5a, 5b, 5c, 5d, ...) typically converts the light diverging along the fast direction F into parallel light.

[0033] 1, the light emitted from the collimating optical system 5 (5a, 5b, 5c, 5d, ...) is incident on a plurality of reflecting elements (7a, 7b, 7c, 7d, ...) arranged corresponding to each of the semiconductor laser elements (3a, 3b, 3c, 3d, ...). As described later, the inclination angles of the reflecting surfaces of the respective reflecting elements (7a, 7b, 7c, 7d, ...) are slightly different from each other.

[0034] The light emitted from the collimating optical system 5 (5a, 5b, 5c, 5d, ...) has its traveling direction changed by each reflecting element (7a, 7b, 7c, 7d, ...) of the reflecting optical system 7, and is then guided to the dichroic mirror 8. In the example illustrated in FIG. 1, the dichroic mirror 8 is configured to reflect the light (excitation light) emitted from the excitation light source 3 and transmit the fluorescence emitted from the fluorescent member 10. However, it is only necessary that the dichroic mirror 8 be able to separate the optical path of the excitation light emitted from the excitation light source 3 and the optical path of the fluorescence emitted from the fluorescent member 10. That is, as another example, light emitted from the excitation light source 3 and whose direction of travel is converted by each reflective element (7a, 7b, 7c, 7d, ...) of the reflective optical system 7 may be transmitted through the dichroic mirror 8 and incident on the fluorescent member 10, and the fluorescence emitted from the fluorescent member 10 may be reflected by the dichroic mirror 8 and travel along an optical path different from that of the excitation light.

[0035] The excitation light that has passed through the dichroic mirror 8 is collected by the collecting optical system 9 on the surface of the fluorescent member 10. The fluorescent member 10 includes a phosphor that emits fluorescence of a wavelength different from the wavelength of the received excitation light. When the fluorescent member 10 receives the excitation light incident via the collecting optical system 9, the phosphor is excited and emits fluorescence. The fluorescence passes through the collecting optical system 9 in the opposite direction to the excitation light, and then passes through the dichroic mirror 8 to be emitted.

[0036] In the present invention, the configuration of the fluorescent member 10 is not limited. As an example, the fluorescent member 10 may be a rare earth compound (Ce 3+ ,EU 2+ It is a sintered body in which particles of an inorganic phosphor material activated by an inorganic fluorescer are mixed with binder particles made of an inorganic material. A specific example of the phosphor material is LSN (La3Si6N 11 , (La,Y)3Si6N 11 ), CSO(CaSc2O4), LuAG(AlO 12 Lu3), YAG(AlO 12Specific examples of binder particles include CaF2, BaF2, MgF2, ZnS, Al2O3, MgO, ZrO2, ZnO, and TiO2.

[0037] Furthermore, for the purpose of exhausting heat, the fluorescent member 10 may have a substrate made of a material having a thermal conductivity of 90 [W / m K] or more, more specifically, for example, 230 to 400 [W / m K]. Examples of materials for such a substrate include Cu, copper compounds (MoCu, CuW, etc.), Al, and AlN.

[0038] Fig. 3 is a diagram showing a state in which light (excitation light) that has passed through the focusing optical system 9 is projected onto a surface 11 of a fluorescent member 10. As shown in Fig. 3, in the fluorescent light source device 1 of this embodiment, irradiation regions 20 (20a, 20b, 20c, 20d, ...) onto which images of the emitters 4 of the semiconductor laser elements (3a, 3b, 3c, 3d, ...) are respectively projected are formed on the surface 11 of the fluorescent member 10. As shown in Fig. 3, these irradiation regions 20 (20a, 20b, 20c, 20d, ...) are linear.

[0039] 2, the emitter 4 has a rectangular shape with its longitudinal direction aligned in the slow direction S and its transverse direction aligned in the fast direction F. In the fluorescence light source device 1 of the present embodiment, images of the emitters 4 of the semiconductor laser elements (3a, 3b, 3c, 3d, ...) are arranged in a line along the slow direction S, as shown in FIG.

[0040] 3, each of the irradiation areas (20a, 20b, 20c, 20d, ...) may be slightly misaligned with respect to the fast direction F. Here, the allowable misalignment amount of each of the irradiation areas (20a, 20b, 20c, 20d, ...) with respect to the fast direction F is 0.5 times or less the length of each of the irradiation areas (20a, 20b, 20c, 20d, ...) with respect to the slow direction S.

[0041] In this embodiment, the inclination angles of the reflective surfaces of the reflective elements (7a, 7b, 7c, 7d, ...) of the reflective optical system 7 provided in the fluorescent light source device 1 are set to be slightly different from one another, so that the irradiation areas 20 (20a, 20b, 20c, 20d, ...) are arranged in a line along the throw direction S, as shown in Figure 3.

[0042] In this way, a linear irradiation area 20 is formed on the surface 11 of the fluorescent member 10, and thus a linear fluorescence is emitted from the fluorescent member 10. This fluorescence passes through the condensing optical system 9 and the dichroic mirror 8 and is extracted, thereby obtaining a linear light. As an example, the emitter 4 of each semiconductor laser element (3a, 3b, 3c, 3d, ...) has a rectangular shape of about 40 μm × 1 μm, and the size of the light projected on each irradiation area (20a, 20b, 20c, 20d, ...) has a rectangular shape of about 1.4 mm × 0.25 mm. Each irradiation area (20a, 20b, 20c, 20d, ...) is arranged substantially along the longitudinal direction of each rectangle, thereby forming a linear shape as a whole.

[0043] Fig. 4 is a diagram that typically shows a light ray diagram of the excitation light emitted from the semiconductor laser elements (3a, 3b, 3c, 3d) of the excitation light source 3 until it is incident on the fluorescent member 10. Similarly, Fig. 5 is a diagram that typically shows a light ray diagram of the excitation light emitted from the semiconductor laser elements (3e, 3f, 3g, 3h) of the excitation light source 3 until it is incident on the fluorescent member 10. Fig. 6 is a schematic enlarged view of the vicinity of surface 11 of fluorescent member 10 in Fig. 4, and Fig. 7 is a schematic enlarged view of the vicinity of surface 11 of fluorescent member 10 in Fig. 5.

[0044] The inclination angles of the reflecting surfaces of the reflecting elements (7a, 7b, 7c, 7d) shown in FIG. 4 and the inclination angles of the reflecting surfaces of the reflecting elements (7e, 7f, 7g, 7h) shown in FIG. 5 are, for example, as follows. Reflective element 7a: 45°-0.7°=44.3° Reflector 7b: 45°-0.3°=44.7° Reflection element 7c: 45°+0.1°=45.1° Reflective element 7d: 45°+0.5°=44.5° Reflector 7e: 45°-0.5°=44.3° Reflector 7f: 45°-0.1°=44.9° Reflector 7g: 45°+0.3°=45.3° Reflector 7h: 45°+0.7°=45.7°

[0045] The inclination angle of the reflecting surface referred to here is an angle that is set so that the inclination angle of a reflecting surface that is positioned to direct light incident from directly on the side straight upwards is 45°, and the angle that is set so that the angle of inclination of a reflecting surface that is positioned to direct light incident from directly on the side straight back to the incident side is 90°.

[0046] Since the inclination angles of the reflecting surfaces of the reflecting elements (7a, 7b, 7c, 7d) are different from one another, the excitation light (9a, 9b, 9c, 9d) emitted from the semiconductor laser elements (3a, 3b, 3c, 3d) and passed through the focusing optical system 9 are incident on different positions on the surface 11 of the fluorescent member 10, as shown in Fig. 6. Similarly, since the inclination angles of the reflecting surfaces of the reflecting elements (7e, 7f, 7g, 7h) are different from one another, the excitation light (9e, 9f, 9g, 9h) emitted from the semiconductor laser elements (3e, 3f, 3g, 3h) and passed through the focusing optical system 9 are incident on different positions on the surface 11 of the fluorescent member 10, as shown in Fig. 7. By appropriately adjusting the inclination angle of the reflective surface of each reflective element (7a, 7b, 7c, 7d, ...), it is possible to arrange each irradiation area (20a, 20b, 20c, 20d, ...) illuminated onto the surface 11 of the fluorescent member 10 in a line shape, as described above with reference to Figure 3.

[0047] Fig. 8 is a diagram showing the area (irradiation area) irradiated with the excitation light that has passed through the focusing optical system 9 when a simulation is performed with the inclination angle of the reflecting surface of each reflecting element (7a, 7b, 7c, 7d, ...) set to the value of the above example. According to Fig. 8, it is confirmed that eight irradiation areas are arranged in a line, as shown typically in Fig. 3.

[0048] A specific example of a method for adjusting the inclination angle of the reflecting surface of each of the reflecting elements (7a, 7b, 7c, 7d, . . . ) will be described below.

[0049] (First configuration example) 9 is a schematic perspective view of a first configuration example of the reflecting member 30 including each of the reflecting elements (7a, 7b, 7c, 7d, ...). The reflecting member 30 includes a base portion 31 and a mirror seat 32. The mirror seat 32 is arranged according to each of the reflecting elements (7a, 7b, 7c, 7d, ...), and each of the mirror seat 32 is fixed to the base portion 31.

[0050] Fig. 10 is a plan view of the reflecting member 30 shown in Fig. 9 when viewed from the opposite side to the reflecting elements (7a, 7b, 7c, 7d, ...), and the base portion 31 is omitted. Fig. 11 is a drawing illustrating the mirror base 32 and connecting members (such as the set screws 34) extracted from Fig. 10. Fig. 12 is a perspective view showing each element of Fig. 11 exploded and typically shown.

[0051] In the reflecting member 30 shown in Figs. 9 to 12, three setscrews 34 serving as connecting members are connected to one mirror base 32. Furthermore, a tension spring 33 is connected to the mirror base 32. A setscrew 35 is attached to the end of the tension spring 33 closer to the mirror base 32, and a pin 36 is attached to the end of the tension spring 33 farther from the mirror base 32. As shown in Fig. 11, the mirror base 32 has an inclined mounting surface 39 on its inside, and the reflecting elements (7a, 7b, 7c, 7d, ...) are adhesively fixed onto this mounting surface 39.

[0052] A tension spring 33 is fixed to the mirror base 32 with a set screw 35, in a state in which the reflection optical system 7 (reflection elements 7a, 7b, 7c, 7d, ...) is fixed on a mounting surface 39. The tension spring 33 is also fixed to the base part 31 (see FIG. 9) with a pin 36 attached to the tension spring 33. In this way, one axis (for convenience, referred to as the "Y axis") of the mirror base 32 is fixed.

[0053] Next, three set screws 34 are attached to the base portion 31 and pressed against the mirror base 32. As a result, the mirror base 32 is also fixed in the plane direction perpendicular to the Y axis.

[0054] Depending on the tightening of the three set screws 34, the mirror base 32 can be tilted around the Y axis. This allows the tilt angle of each reflective element (7a, 7b, 7c, 7d, ...) adhesively fixed to the mirror base 32 to be adjusted. Since a mirror base 32 is provided for each reflective element (7a, 7b, 7c, 7d, ...), the tilt angle of each reflective element (7a, 7b, 7c, 7d, ...) can be adjusted by adjusting the position of each mirror base 32. That is, in this configuration example, the set screws 34 correspond to the "angle adjustment mechanism."

[0055] (Second configuration example) 13 is a schematic perspective view of a second configuration example of the reflecting member 30 including each of the reflecting elements (7a, 7b, 7c, 7d, ...). As in the first configuration example, the reflecting member 30 includes a base portion 31 and a mirror seat 32. The mirror seat 32 is disposed in accordance with each of the reflecting elements (7a, 7b, 7c, 7d, ...), and each of the mirror seat 32 is fixed to the base portion 31.

[0056] Fig. 14 is a plan view of the reflecting member 30 shown in Fig. 13 when viewed from the opposite side to the reflecting elements (7a, 7b, 7c, 7d, ...), and the base portion 31 is omitted. Fig. 15 is a drawing illustrating the mirror base 32 and connecting members (such as the set screws 34) extracted from Fig. 14. Fig. 16 is a perspective view showing each element of Fig. 15 exploded.

[0057] In the reflection member 30 shown in Figs. 13 to 16, three setscrews 34 serving as connection members are connected to one mirror base 32. Furthermore, an adjuster 43 is attached to the mirror base 32. As shown in Fig. 16, the adjuster 43 has a spherical end 43a, a shaft 43b, and a screw 43c. The mirror base 32 has a spherical recess so that the spherical end 43a of the adjuster 43 can be attached. As shown in Fig. 15, similarly to the first configuration example, the mirror base 32 has a mounting surface 39 with an inclination therein, and each of the reflection elements (7a, 7b, 7c, 7d, ...) is adhesively fixed onto the mounting surface 39.

[0058] During installation, first, the adjuster 43 is fixed to the base portion 31 (see FIG. 13) using the screw 43c of the adjuster 43. Then, the spherical end portion 43a of the adjuster 43 is inserted into the mirror base 32 in a state in which each of the reflective elements (7a, 7b, 7c, 7d, ...) of the reflective optical system 7 is fixed on the installation surface 39, thereby fixing the mirror base 32 to one axis (for convenience, referred to as the "Y axis").

[0059] Next, three set screws 34 are attached to the base portion 31 and pressed against the mirror base 32. As a result, the mirror base 32 is also fixed in the plane direction perpendicular to the Y axis.

[0060] Depending on how tightly the three set screws 34 are fastened, the mirror base 32 can be tilted around the Y-axis. This makes it possible to adjust the tilt angle of each of the reflective elements (7a, 7b, 7c, 7d, ...) adhesively fixed to the mirror base 32. Since a mirror base 32 is provided for each of the reflective elements (7a, 7b, 7c, 7d, ...), by adjusting the position of each mirror base 32, the tilt angle of each of the reflective elements (7a, 7b, 7c, 7d, ...) can be adjusted.

[0061] In this configuration example, in comparison with the first configuration example, the base portion 31 and the mirror pedestal 32 are fixed by the adjuster 43 including the spherical end portion 43a, so that the tilt angle of each of the reflective elements (7a, 7b, 7c, 7d, ...) can be adjusted while the Y direction is completely fixed by tightening the three set screws 34. In this configuration example, the set screws 34 correspond to the "angle adjustment mechanism."

[0062] (Third configuration example) A perspective view of the reflecting member 30 of the third configuration example is omitted because it is substantially the same as the reflecting member 30 of the first configuration example shown in Fig. 9. As in the first configuration example, the reflecting member 30 of the third configuration example also includes a base portion 31 and a mirror pedestal 32. The mirror pedestals 32 are arranged in accordance with the respective reflecting elements (7a, 7b, 7c, 7d, ...), and each mirror pedestal 32 is fixed to the base portion 31.

[0063] Fig. 17 is a plan view of the reflecting member 30 of the third configuration example when viewed from the opposite side to the reflecting elements (7a, 7b, 7c, 7d, ...), and the base portion 31 is omitted. Fig. 18 is a drawing illustrating the mirror base 32 and connecting members (such as the set screws 34) extracted from Fig. 17. Fig. 19 is a perspective view showing each element of Fig. 18 exploded and typically shown.

[0064] In the reflecting member 30 shown in Figures 17 to 19, two setscrews 34 serving as connecting members are connected to one mirror base 32. Furthermore, an adjuster 53 is attached to the mirror base 32. As shown in Figure 19, the adjuster 53 has a structure that allows a setscrew 57 to be attached. Furthermore, as shown in Figures 18 to 19, a C-ring 58 and a compression spring 56 are attached to the adjuster 53. An end 53a of the adjuster 53 on the side that is attached to the mirror base 32 has a cylindrical shape.

[0065] In this third configuration example, a compression spring 55 is attached to one of the two setscrews 34 (see FIGS. 18 and 19).

[0066] As shown in FIG. 18, similarly to the first configuration example, the mirror base 32 has an inclined mounting surface 39 on which the respective reflective elements (7a, 7b, 7c, 7d, ...) are adhesively fixed.

[0067] During installation, one end of adjuster 53 with compression spring 56 attached is attached to base portion 31 (see FIG. 9) and fixed by C-ring 58. Then, the other end of adjuster 53 is inserted into mirror base 32 and fixed by set screw 57. In this way, one axis (for convenience, referred to as the "Y axis") of mirror base 32 is fixed.

[0068] Next, two set screws 34 are inserted into the base portion 31. As described above, one of the two set screws 34 has the compression spring 55 attached thereto. After that, the two set screws 34 are pressed against the mirror base 32. As a result, the mirror base 32 is also fixed in the plane direction perpendicular to the Y-axis.

[0069] The end 53a of the adjuster 53 has a cylindrical shape, which allows the adjuster 53 to rotate. Therefore, the position of the mirror base 32 can be adjusted in two axial directions by the tightening of the set screw 34 on the side not equipped with the compression spring 55 and by the rotation of the adjuster 53.

[0070] 20 and 21, the compression spring 55 may not be attached to the set screws 34. In this case, the position of the mirror base 32 can be adjusted in two axial directions by the tightening of the two set screws 34 and the rotation of the adjuster 53. That is, in this configuration example, the set screws 34 and the adjuster 53 correspond to the "angle adjustment mechanism."

[0071] [Another embodiment] Another embodiment will now be described.

[0072] 〈1〉 As shown in FIG. 22, in a linear irradiation region 20, the first regions 21 at both ends in the longitudinal direction may have a higher power density of incident light than the second region 22 located in the center of the first region 21. In FIG. 22, the power density is shown by the density of hatching. For example, the power density of the irradiation region 20a and the irradiation region 20h located at both ends is set to be the highest, and the power density of the irradiation region 20d and the irradiation region 20e is set to be lower than the irradiation region 20a and the irradiation region 20h. On the other hand, the power density of the irradiation region 20c and the irradiation region 20f located near the center is set to be the lowest, and the power density of the irradiation region 20b and the irradiation region 20g is set to be higher than the irradiation region 20c and the irradiation region 20f. In this example, the power density of the irradiation region 20c and the irradiation region 20f is the lowest, and the power density of the irradiation region 20b and the irradiation region 20g is higher than that of the irradiation region 20c and the irradiation region 20f. Furthermore, the power density of the irradiated regions 20d and 20e is higher than the power density of the irradiated regions 20b and 20g, and the power density of the irradiated regions 20a and 20h is higher than the power density of the irradiated regions 20d and 20e.

[0073] Specifically, the emission intensity of the semiconductor laser elements 3c and 3f projected onto the irradiation region 20c and the irradiation region 20f is made the lowest. The emission intensity of the semiconductor laser elements 3b and 3g projected onto the irradiation region 20b and the irradiation region 20g is made higher than the emission intensity of the semiconductor laser elements 3c and 3f. The emission intensity of the semiconductor laser elements 3d and 3e projected onto the irradiation region 20d and the irradiation region 20e is made higher than the emission intensity of the semiconductor laser elements 3b and 3g. Furthermore, the emission intensity of the semiconductor laser elements 3a and 3h projected onto the irradiation region 20a and the irradiation region 20h is made higher than the emission intensity of the semiconductor laser elements 3d and 3e.

[0074] When the emission intensities of all the excitation light sources 3 are set to be the same, the light projected onto the irradiation region 20 may tend to have lower intensity at the ends than at the center in the linear longitudinal direction.

[0075] In response to this, the emission intensity of the excitation light source 3 projected near the center of the irradiation area 20 is relatively lowered, and the emission intensity of the excitation light source 3 projected near the edge of the irradiation area 20 is relatively increased, thereby improving the uniformity of the illuminance of the light projected on the surface 11 of the fluorescent member 10. This also improves the uniformity of the intensity of the line-shaped fluorescence emitted from the fluorescent member 10.

[0076] In addition, in FIG. 22, the emission intensities of the semiconductor laser elements 3a, 3d, 3e, and 3h projected onto the irradiation regions 20a, 20d, 20e, and 20h may be set to the same value α, and the emission intensities of the semiconductor laser elements 3b, 3c, 3f, and 3g projected onto the irradiation regions 20b, 20c, 20f, and 20g may be set to the same value β smaller than α.

[0077] In some cases, when the emission intensities of all the excitation light sources 3 are made the same, the intensity of the light projected onto the irradiation region 20 may be higher at the ends than at the center in the longitudinal direction of the line. In such a case, the emission intensities of the excitation light sources 3 projected onto the vicinity of the center of the irradiation region 20 are made relatively higher and the emission intensities of the excitation light sources 3 projected onto the vicinity of the ends of the irradiation region 20 are made relatively lower, in contrast to Fig. 22, thereby improving the uniformity of the illuminance of the light projected onto the surface 11 of the fluorescent member 10.

[0078] In other words, by appropriately adjusting the emission intensity of each excitation light source 3, it is possible to improve the uniformity of the illuminance of the light projected onto the surface 11 of the fluorescent member .

[0079] <2> From the viewpoint of improving the uniformity of the illuminance of the light projected on the surface 11 of the fluorescent member 10, the density of the arrangement of adjacent irradiation regions 20 may be adjusted as shown in Fig. 23. In the example shown in Fig. 23, adjacent irradiation regions 20 are densely arranged in first regions 21 at both ends in the longitudinal direction, while adjacent irradiation regions 20 are sparsely arranged in second region 22 corresponding to the center.

[0080] 23, the length of the region formed by the irradiation region 20h located at the end (in the first region 21) and the adjacent irradiation region 20d is set to be shorter than the length of the region formed by the irradiation region 2c located near the center (in the second region 22) and the adjacent irradiation region 20f. Similarly, the length of the region formed by the irradiation region 20a located at the end (in the first region 21) and the adjacent irradiation region 20e is set to be shorter than the length of the region formed by the irradiation region 20c located near the center (in the second region 22) and the adjacent irradiation region 20f.

[0081] As described above, when the emission intensities of all the excitation light sources 3 are the same, the light projected onto the irradiation region 20 may tend to have lower intensity at the ends in the linear longitudinal direction than at the center. In contrast, by using the configuration shown in Fig. 23, the illuminance of the light projected onto the surface 11 of the fluorescent member 10 becomes more uniform, and therefore the intensity of the linear fluorescence emitted from the fluorescent member 10 becomes more uniform.

[0082] In some cases, when the emission intensities of all the excitation light sources 3 are made the same, the intensity of the light projected onto the irradiation region 20 may be higher at the ends in the longitudinal direction of the line than at the center. In such a case, contrary to Fig. 23, adjacent irradiation regions 20 may be arranged sparsely in the first regions 21 at both ends in the longitudinal direction, and adjacent irradiation regions 20 may be arranged densely in the second region 22 corresponding to the center.

[0083] In other words, by appropriately adjusting the density of adjacent illumination regions 20, it is possible to improve the uniformity of the illuminance of the light projected onto the surface 11 of the fluorescent member .

[0084] It is possible to adjust the position of each irradiation region 20 by adjusting the inclination angle of each reflection element (7a, 7b, 7c, 7d, . . . ).

[0085] <3> In each of the above embodiments, the fluorescence emitted from the fluorescent member 10 is emitted toward the side of the excitation light incident on the fluorescent member 10, and then the traveling direction of the fluorescence is separated from the excitation light via the dichroic mirror 8. However, the fluorescence emitted from the fluorescent member 10 may travel in the opposite direction to the excitation light. In this case, the dichroic mirror 8 is not necessarily required.

[0086] <4> In the above embodiment, the position of the mirror pedestal 32 is adjusted using the set screw 34 or the like. However, if the angles of the inclined surfaces 39 of the mirror pedestals 32 are made different from each other, it is not necessary to provide a mechanism for adjusting the position of the mirror pedestal 32. [Explanation of symbols]

[0087] 1: Fluorescent light source device 2c: Irradiation area 3: Excitation light source 3a,3b,3c,3d,3e,3f,3g,3h: Semiconductor laser element 4: Emitter 5: Collimated optical system 7: Reflective optical system 7a, 7b, 7c, 7d, 7e, 7f, 7g, 7h: Reflective element 8:Dichroic mirror 9: Focusing optical system 10: Fluorescent materials 11: Fluorescent material surface 20: Irradiation area 20a, 20b, 20c, 20d, 20e, 20f, 20g, 20h: Irradiation area 21:First area 22:Second area 30: Reflective material 31: Base section 32: Mirror base 33: Tension spring 34,35: Set screw 36: Pin 39: Installation surface 43: Adjuster 43a: End of adjuster 43b: Adjuster shaft 43c: Screw 53: Adjuster 53a: End of adjuster 55: Compression spring 56: Compression spring 57: Set screw 58: C-Ring F: First direction S: Slow direction

Claims

1. A plurality of semiconductor laser elements arranged on a surface; a plurality of collimating optical systems arranged corresponding to the plurality of semiconductor laser elements, each of which reduces a divergence angle of light emitted from an emitter of the plurality of semiconductor laser elements; a reflection optical system including a plurality of reflection elements arranged corresponding to the plurality of collimating optical systems and converting the traveling direction of each of the light beams emitted from the plurality of collimating optical systems; a focusing optical system that focuses light emitted from the plurality of reflecting elements; a fluorescent member into which the light emitted from the light collecting optical system is incident and which emits fluorescent light having a wavelength different from that of the incident light, an illumination region onto which images of the emitters of the plurality of semiconductor laser elements are respectively projected is formed on a surface of the fluorescent member; A fluorescent light source device, characterized in that the inclination angle of the reflection surface of each of the plurality of reflection elements is set so that the irradiation area has a line shape.

2. 2. The fluorescent light source device according to claim 1, wherein the irradiation region is formed by arranging a plurality of images of the emitter of the semiconductor laser element along a longitudinal direction of the image of the emitter of the semiconductor laser element.

3. 3. The fluorescent light source device according to claim 1, further comprising an angle adjustment mechanism capable of adjusting an inclination angle of the reflecting surface of each of the plurality of reflecting elements.

4. 4. The fluorescent light source device according to claim 3, wherein the angle adjustment mechanism is configured to be capable of rotating the reflecting surface of the reflecting element about an axis corresponding to a fast direction of light incident on the reflecting surface.

5. A mounting member on which a plurality of the reflective elements are mounted, The installation member has a plurality of installation surfaces on which the reflection surfaces of the plurality of reflection elements are installed, 3. The fluorescent light source device according to claim 1, wherein the plurality of installation surfaces have mutually different inclination angles.

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