Electronic apparatus

Abstract

To provide an electronic apparatus which can effectively dissipate heat generated from heating components.SOLUTION: An electronic apparatus 1 into and out of which external air flows comprises: a housing provided with an inlet port 35; a fan 60 housed in the housing; a substrate 40 housed in the housing; a first heating component 43 mounted on a first surface of the substrate; and a second heating component 42 mounted on a second surface of the substrate. Inside the housing, there are formed a first passage and a second passage for guiding, to the fan, the air sent from the inlet port. The first passage includes a space which is formed on the first surface, and in which the first heating component is disposed. The second passage includes a space which is formed on the second surface, and in which the second heating component is disposed. In a direction vertical to the substrate, a distance between the first surface to its opposite surface in the first passage is longer than a distance between the second surface to its opposite surface in the second passage. The amount of heat generated by the first heating component is greater than that by the second heating component.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present disclosure relates to electronic devices. [Background technology]

[0002] Conventionally, there has been known an electronic device having a housing with an intake port and an exhaust port, and a board disposed inside the housing and on which a heat-generating component is mounted (for example, Patent Document 1). In particular, the electronic device described in Patent Document 1 has a fan disposed in a hole provided in the board, and is configured such that air drawn in from the intake port passes under the board and flows to the fan, and then the air flowing out from the fan passes over the board and flows to the exhaust port. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2001-111275 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, the electronic device described in Patent Document 1 has room for improvement in terms of dissipating heat generated from heat-generating components.

[0005] In view of the above problems, an object of the present disclosure is to provide an electronic device that can effectively dissipate heat generated from a heat-generating component. [Means for solving the problem]

[0006] The gist of the present disclosure is as follows.

[0007] (1) An electronic device in which air flows in and out from the outside, A housing having an air intake; A fan accommodated in the housing; A substrate accommodated in the housing; one or more first heat generating components mounted on a first surface of the substrate; and one or more second heat generating components mounted on a second surface of the substrate opposite to the first surface, A first flow path and a second flow path are formed in the housing to guide the air flowing in through the intake port to the fan, the first flow path is at least partially defined by the first surface and a first opposing surface opposing the first surface, the second flow path is at least partially defined by the second surface and a second opposing surface opposing the second surface, a distance between the first surface and the first opposing surface in the first flow path is longer than a distance between the second surface and the second opposing surface in the second flow path in a direction perpendicular to the substrate; An electronic device, wherein a total heat generation amount of all of the first heat generating components is greater than a total heat generation amount of all of the second heat generating components, or a heat generation amount of a component among the first heat generating components that generates the greatest heat generation is greater than a heat generation amount of a component among the second heat generating components that generates the greatest heat generation. (2) the first opposing surface is formed by a first metal plate disposed opposite the first surface, the second opposing surface is formed by a second metal plate disposed opposite the second surface, The electronic device described in (1) above, wherein at least a portion of the housing is formed by the first metal plate or the second metal plate. (3) The electronic device according to (2) above, wherein the first metal plate is connected to at least one of the first heat generating component and the substrate by a first thermally conductive connecting member. (4) The electronic device according to (2) or (3) above, wherein the second metal plate is connected to at least one of the second heat-generating component and the substrate by a second thermally conductive connecting member. (5) The electronic device according to (3) above, wherein at least a portion of the first connection member connects the first metal plate and a first wiring pattern provided on the substrate. (6) the first wiring pattern is electrically connected to a ground potential of the electronic device; The electronic device according to (5) above, wherein the first metal plate is arranged so as to overlap at least a portion of the first heat-generating component when viewed in a direction perpendicular to the substrate. (7) The electronic device according to (4) above, wherein at least a portion of the second connection member connects the second metal plate and a second wiring pattern provided on the substrate. (8) the second wiring pattern is electrically connected to a ground potential of the electronic device, The electronic device according to (7) above, wherein the second metal plate is arranged so as to overlap at least a portion of the second heat-generating component when viewed in a direction perpendicular to the substrate. (9) The fan is attached to the second metal plate, and has a fan second surface facing the second metal plate in a direction perpendicular to the substrate, and a fan first surface opposite the fan second surface, and has an inlet formed in the fan first surface and an inlet formed in the fan second surface, the first opposing surface also faces an inlet formed in the first fan surface, and the second opposing surface also faces an inlet formed in the second fan surface, The electronic device described in (2) above, wherein the distance between an inlet formed in the first surface of the fan and the first opposing surface is longer than the distance between an inlet formed in the second surface of the fan and the second opposing surface. (10) The electronic device described in (1) above, wherein the first heat-generating component that generates the greatest amount of heat is positioned so as to be at least partially located within the space between the air intake and the fan inlet when viewed in a direction perpendicular to the board. (11) The electronic device described in (1) or (10) above, wherein the second heat-generating component that generates the greatest amount of heat is positioned so as to be at least partially located within the space between the intake port and the fan inlet when viewed in a direction perpendicular to the substrate. (12) The air intake port includes two air intake ports, a first air intake port and a second air intake port, which are arranged spaced apart from each other on the same surface of the housing, the first heat generating component that generates the largest amount of heat is disposed so as to be at least partially located within a space between the first air intake and the air inlet of the fan when viewed in a direction perpendicular to the board; The electronic device described in (1) or (2) above, wherein the second heat-generating component that generates the greatest amount of heat is positioned so as to be at least partially located within the space between the second air intake and the air inlet when viewed in a direction perpendicular to the substrate. (13) A battery disposed within the housing, The electronic device described in (12) above, wherein the battery is positioned closer to the space between the second air intake and the air inlet than to the space between the first air intake and the air inlet. Effect of the Invention

[0008] According to the present disclosure, an electronic device capable of effectively dissipating heat generated from a heat-generating component is provided. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic perspective view of an electronic device as viewed from above and in the front. [Diagram 2] FIG. 2 is a schematic exploded perspective view of the electronic device as viewed from above and in front. [Diagram 3] FIG. 3 is a plan view of the front housing half as seen from the rear. [Figure 4] FIG. 4 is a plan view of the substrate as seen from the rear. [Diagram 5] FIG. 5 is a plan view of the electronic device as viewed from the rear with the rear housing half and the rear metal plate removed. [Figure 6] FIG. 6 is a partial cross-sectional view of the electronic device taken along line VI-VI in FIG. [Figure 7] FIG. 7 is a cross-sectional view of the electronic device taken along line VII-VII in FIG. [Figure 8] FIG. 8 is a cross-sectional view that shows, in schematic form, how the front metal plate, the base plate, and the rear metal plate are attached to one another by fasteners. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, the embodiments will be described in detail with reference to the drawings. In the following description, like elements are designated by like reference numerals.

[0011] <Overall configuration of electronic device> First, an overall configuration of an electronic device 1 according to an embodiment will be described with reference to Figures 1 and 2. The electronic device 1 is a roughly rectangular parallelepiped device equipped with a display panel, such as a portable game console, a tablet, or a mobile monitor. In particular, in this embodiment, the electronic device 1 is a portable device that is used by placing it on a placement surface such as a floor surface or a tabletop surface.

[0012] Fig. 1 is a schematic perspective view of electronic device 1 as viewed from above the front. Fig. 2 is a schematic exploded perspective view of electronic device 1 as viewed from above the front. As shown in Fig. 1, electronic device 1 has a housing 10 formed in a substantially rectangular parallelepiped shape and a display panel 5 provided on one side of the housing 10.

[0013] In this specification, the direction in which the display panel 5 is provided with respect to the housing 10 is referred to as the front, and the direction opposite to the front is referred to as the rear. Thus, the display panel 5 is provided on the front surface of the housing 10. Furthermore, when the electronic device 1 is placed upright perpendicular to a placement surface in a normal orientation and viewed from the front, the upward, downward, leftward, and rightward directions are referred to as the upward, downward, leftward, and rightward directions of the electronic device 1 and its components, respectively, and the left-right direction of the electronic device 1 is also referred to as the width direction.

[0014] 2 , the electronic device 1 includes, in addition to the housing 10 and the display panel 5, a substrate 40, a rear metal plate 50, a fan 60, a heat pipe 70, a heat sink 72, and a battery 75. The substrate 40, the rear metal plate 50, the fan 60, the heat pipe 70, the heat sink 72, and the battery 75 are accommodated within the housing 10.

[0015] <Housing> Next, the housing 10 will be described with reference to Figs. 1 to 3. As shown in Fig. 1, the housing 10 has a front wall 11 located on the front side of the housing 10, a rear wall 12 located on the rear side of the housing 10, and an upper wall 13, a lower wall 14, a left wall 15, and a right wall 16 located between the front wall 11 and the rear wall 12. In particular, the upper wall 13 is provided on the upper side of the housing 10, the lower wall 14 is provided on the lower side of the housing 10, the left wall 15 is provided on the left side of the housing 10, and the right wall 16 is provided on the right side of the housing 10. In this embodiment, the upper wall 13, the lower wall 14, the left wall 15, and the right wall 16 extend perpendicularly to the front wall 11 and the rear wall 12. Note that extending perpendicularly includes not only walls extending strictly perpendicularly to each other, but also walls extending substantially perpendicularly. In this embodiment, the front wall 11 and the rear wall 12 are formed flat. Additionally, in this embodiment, the upper wall 13, the lower wall 14, the left wall 15 and the right wall 16 are also formed flat.

[0016] 2, the housing 10 is mainly formed by two housing halves 20, 30. The front housing half 20 is disposed relatively forward, and the rear housing half 30 is disposed relatively rearward.

[0017] As shown in FIG. 2, in this embodiment, the front housing half 20 mainly constitutes the front wall 11, the left wall 15, and the right wall 16 of the housing 10. The rear housing half 30 mainly constitutes the rear wall 12, the upper wall 13, and the lower wall 14 of the housing 10. Therefore, when the rear housing half 30 is attached to the front housing half 20, the housing 10 having the front wall 11, the rear wall 12, the upper wall 13, the lower wall 14, the left wall 15, and the right wall 16 is formed. Note that the upper wall 13, the lower wall 14, the left wall 15, and the right wall 16 may be respectively constituted by either the front housing half 20 or the rear housing half 30. Therefore, the front housing half 20 may mainly constitute the front wall 11, the upper wall 13, and the lower wall 14, and the rear housing half 30 may mainly form the rear wall 12, the left wall 15, and the right wall 16. Alternatively, at least one of the upper wall 13, the lower wall 14, the left wall 15 and the right wall 16 may be formed by both the front housing half 20 and the rear housing half 30 (e.g., so that both housing halves 20, 30 meet in the center in the front-to-rear direction).

[0018] The front housing half 20 has a front main wall 21, a left side wall 22 and a right side wall 23, which respectively constitute the front wall 11, the left wall 15 and the right wall 16 of the housing 10. As shown in Fig. 2, a display panel 5 is provided on the front main wall 21. The front main wall 21 extends in a direction perpendicular to the front-to-rear direction. The left side wall 22 extends rearward from the left end of the front main wall 21. The right side wall 23 extends rearward from the right end of the front main wall 21. The left side wall 22 and the right side wall 23 extend over the entire length of the front main wall 21 in the up-down direction.

[0019] The front main wall 21 of the front housing half 20 has a groove 24 on its front side that is recessed rearward. The groove 24 extends over the entire front surface of the front main wall 21 except for the outer periphery of the front main wall 21. In particular, the groove 24 extends over lengths in the up-down and lateral directions that are approximately the same as the lengths of the display panel 5 in the up-down and lateral directions. Moreover, the groove 24 is formed so that its depth is slightly longer than the length of the display panel 5 in the front-rear direction.

[0020] Moreover, in front of the groove 24, a thermally conductive sheet for a display 25 is disposed so as to be in contact with the front main wall 21 (particularly, the front metal plate 28 described later) in the groove 24. The thermally conductive sheet for a display 25 is a sheet having thermal conductivity. As shown in FIG. 2, in this embodiment, the thermally conductive sheet for a display 25 is disposed over the entire groove 24. Moreover, the display panel 5 is fitted into this groove 24. Therefore, the thermally conductive sheet for a display 25 is disposed between the display panel 5 and the front main wall 21 (particularly, the front metal plate 28 described later). Moreover, the thermally conductive sheet for a display 25 is in contact with the rear surface of the display panel 5. Therefore, the thermally conductive sheet for a display 25 is disposed so as to be in contact with the rear surface of the display panel 5 and the front main wall 21 (particularly, the front metal plate 28). By disposing the thermally conductive sheet for display 25 between the display panel 5 and the front metal plate (second metal plate) 28 in this manner, heat generated in the display panel 5 can be dissipated to the front metal plate 28 via the thermally conductive sheet for display.

[0021] In addition, other elements may be used instead of the thermally conductive sheet for display 25 as long as they have thermal conductivity. Therefore, thermally conductive grease may be used instead of the thermally conductive sheet for display 25. In addition, in this embodiment, the thermally conductive sheet for display 25 or the thermally conductive grease is in contact with the rear surface of the display panel 5, but may not be in contact with the rear surface of the display panel 5 and a small layer of air may be formed therebetween. Furthermore, in this embodiment, the thermally conductive sheet for display 25 or the thermally conductive grease is disposed on the front main wall 21 in the groove portion 24, but may be disposed on the rear surface of the display panel 5. In this case, a small layer of air may be formed between the thermally conductive sheet for display 25 or the thermally conductive grease provided on the rear surface of the display panel 5 and the front main wall 21 in the groove portion 24.

[0022] Fig. 3 is a plan view seen from the rear of the front housing half 20. As shown in Fig. 3, a frame portion 26 for holding a battery 75 and a plurality of fastening holes 27 are provided on the rear surface of the front main wall 21.

[0023] The frame portion 26 is a substantially rectangular wall extending rearward from the rear surface of the front main wall 21. The frame portion 26 is arranged to be slightly larger than the outer shape of the battery 75 so that the battery 75 can be arranged inside the frame portion 26. The frame portion 26 has a height such that its rear end portion contacts the rear metal plate (first metal plate) 50. The frame portion 26 has two notches 26a and 26b. The first notch 26a is arranged downward, and the second notch 26b is arranged on the fan 60 side. In the region where the notches 26a and 26b are provided, the frame portion 26 has a height such that its rear end portion does not reach the rear metal plate 50, and an opening is formed between the rear metal plate 50 and the frame portion 26. Therefore, air flows in and out of the region surrounded by the frame portion 26 through the notches 26a and 26b.

[0024] The fastening holes 27 are configured to receive fasteners such as screws and are used to attach the base plate 40 or the rear metal plate 50 to the front main wall 21 (particularly the front metal plate 28). In the example shown in Fig. 3, the fastening holes 27 include a plurality of base plate fastening holes 27a used to receive first fasteners 81 (see Fig. 8) for attaching the base plate 40, and a plurality of metal plate fastening holes 27b used to receive third fasteners 83 for attaching the rear metal plate 50.

[0025] The front housing half 20 is formed of resin and metal. In particular, in this embodiment, the region of the front housing half 20 where the groove portion 24 is provided (the region located behind the groove portion 24) is formed as a metal plate. Therefore, the part of the front housing half 20 formed of metal in this manner is hereinafter referred to as the front metal plate 28. Thus, a part of the front main wall 21 of the front housing half 20 is formed of the front metal plate 28. On the other hand, the parts of the front housing half 20 other than the front metal plate 28 (the remaining part of the front main wall 21, the left side wall 22 and the right side wall 23) are formed of a resin member. Therefore, when viewed in the front-rear direction, the front housing half 20 is formed of the front metal plate 28 and a resin member that surrounds the periphery (up, down, left and right) of the front metal plate 28. Also, in this embodiment, the resin member is configured so as not to substantially cover the front and rear surfaces of the front metal plate 28. In any case, in this embodiment, the front housing half 20 is configured of the front metal plate 28 and a resin member.

[0026] Further, the front metal plate 28 of the front housing half 20 is formed of a metal such as magnesium or aluminum. The front metal plate 28 has a plurality of openings (openings penetrating the front metal plate 28) 29 extending in the vertical direction along the frame portion 26, closer to the center than the frame portion 26. The plurality of openings 29 are arranged in a vertical line. In this embodiment, the plurality of openings 29 are formed to extend over at least half of the vertical length of the front metal plate 28. Resin is embedded in each of the plurality of openings 29. Since the thermal conductivity of the resin is lower than the thermal conductivity of the metal constituting the front metal plate 28, the plurality of openings 29 and resin thus configured suppress the transfer of heat through the plurality of openings 29. As a result, the transfer of heat from the region on the opposite side of the openings 29 to the region where the battery 75 is disposed is suppressed, and thus unnecessary heating of the battery 75 is suppressed. For example, in this embodiment, by arranging a heat generating component such as an SoC on the right side and the battery 75 on the left side in the left-right direction based on the openings 29 aligned in the vertical direction, it is possible to prevent heat from the heat generating component such as an SoC from transferring via the resin embedded in the openings 29. Note that, in this embodiment, the front metal plate 28 is provided with the openings 29 penetrating the front metal plate 28, but instead of the openings 29, grooves that do not penetrate the front metal plate 28 may be provided.

[0027] In this embodiment, the region of the front housing half 20 corresponding to the groove 24 is formed of metal as the front metal plate 28. However, a region larger than the groove 24 or a region smaller than the groove 24 may be formed of metal as the front metal plate 28. Alternatively, the entire front housing half 20 may be formed of metal as the front metal plate 28. Therefore, at least a part of the front housing half is formed by the front metal plate 28. Also, in this embodiment, the front metal plate 28 constitutes a part of the front housing half 20. However, the front metal plate 28 may be a member separate from the front housing half 20. In this case, for example, the entire front housing half 20 is formed of resin, and the front metal plate 28 is attached to the rear of the front housing half 20 made of resin. Also, the front housing half 20 may be formed of other members in addition to the front metal plate 28 and the resin member.

[0028] The rear housing half 30 is formed of resin and has a rear main wall 31, an upper wall 32, and a lower wall 33. The rear main wall 31, upper wall 32, and lower wall 33 respectively constitute the rear wall 12, upper wall 13, and lower wall 14 of the housing 10. The rear main wall 31 extends in a direction perpendicular to the front-to-rear direction. The upper wall 32 extends forward from an upper end of the rear main wall 31. The lower wall 33 extends forward from a lower end of the rear main wall 31. The upper wall 32 and lower wall 33 extend over the entire length of the rear main wall 31 in the lateral width direction.

[0029] The upper wall 32 has one exhaust port 34 at a position including the center in the width direction. The exhaust port 34 is an opening for discharging air in the housing 10, particularly air flowing out from the fan 60, to the outside of the housing 10. The exhaust port 34 extends in the width direction through the upper wall 32. In the present embodiment, the exhaust port 34 is disposed in the center of the upper wall 32 in the front-rear direction. In the present embodiment, the exhaust port 34 is formed as one opening, but may be formed as multiple openings. In this case, the exhaust port 34 may be formed as multiple openings arranged in a row in the width direction, for example. In addition, the exhaust port 34 may be provided with a mesh-like member or the like to prevent foreign matter from entering the housing 10 through the exhaust port 34.

[0030] The lower wall 33 has two intake ports 35 arranged on both sides of the center in the width direction. The intake ports 35 are openings for drawing air outside the housing 10 into the housing 10. The left intake port (second intake port) 35a is arranged on the left side of the center of the lower wall 33, and the right intake port (first intake port) 35b is arranged on the right side of the center of the lower wall 33. Each intake port 35 extends in the width direction through the lower wall 33. In this embodiment, each intake port 35 is arranged in the center of the lower wall 33 in the front-rear direction. Both intake ports 35 are arranged at the same position in the front-rear direction. In this embodiment, the left intake port 35a and the right intake port 35b are each formed as one opening, but each may be formed as multiple openings. In this case, each intake port 35 may be formed as multiple openings arranged in a row in the width direction, for example. Further, each air intake 35 may be provided with a mesh-like member or the like to prevent foreign matter from entering the housing 10 through the air intake 35. Further, in addition to the two air intakes 35 disposed on either side of the center, or instead of these air intakes 35, an air intake 35 may be provided at a position including the center in the width direction of the lower wall 33.

[0031] In this embodiment, the intake port 35 is provided in the lower wall 33 (i.e., the lower wall 14 of the housing 10). However, the intake port 35 may be provided in other side walls (for example, the upper wall 32, the left side wall 22, and the right side wall 23 that respectively form the upper wall 13, the left wall 15, and the right wall 16 of the housing 10). That is, the multiple intake ports 35 only need to be arranged spaced apart from each other on the same surface of the housing 10. Also, the multiple intake ports 35 are provided in the lower wall 33 that is the same side wall (i.e., the lower wall 14 that is the same side wall of the housing 10). However, the multiple intake ports 35 may be provided in different side walls, for example, the left side wall 22 and the right side wall 23 that respectively form the left wall 15 and the right wall 16 of the housing 10. In any case, the multiple intake ports 35 are arranged spaced apart from each other so as to be located in different directions relative to the fan 60.

[0032] <Display panel> As shown in Figs. 1 and 2, a display panel 5 is disposed on the front main wall 21 of the front housing half 20. In this embodiment, the display panel 5 is disposed over almost the entire surface of the front main wall 21, and has a flat surface. The display panel 5 is an example of a device that displays still images and moving images in accordance with a signal output from an electronic component (not shown) for video control disposed in the electronic device 1. The display panel 5 is, for example, a liquid crystal display panel, an EL (Electro Luminescence) display panel, or a plasma display panel. The display panel 5 may be provided with a touch panel on its surface that functions as an input device.

[0033] <Substrate> Next, the board 40 will be described with reference to Fig. 2 and Fig. 4 to Fig. 6. The board 40 is an example of a member for mounting electronic components for realizing various functions of the electronic device 1. Fig. 4 is a plan view of the board 40 seen from the rear. Fig. 5 is a plan view of the electronic device 1 seen from the rear with the rear housing half 30 and the rear metal plate 50 removed (only the side walls are shown in cross section). Fig. 6 is a partial cross-sectional view of the electronic device 1 seen along line VI-VI in Fig. 5.

[0034] The board 40 is disposed between the front main wall 21 and the rear main wall 31 in the front-rear direction, and extends in a direction perpendicular to the front-rear direction. As shown in FIG. 5, the board 40 has a shape that does not overlap with the fan 60 when viewed in the front-rear direction. In particular, in this embodiment, as shown in FIG. 2, FIG. 4, and FIG. 5, the board 40 is formed in an L-shape. Also, as shown in FIG. 5, the board 40 is disposed so as to be located on both sides of the center line C in the width direction of the electronic device 1. In particular, in this embodiment, the board 40 is disposed so as to be located mostly on the right side of the center line C in the width direction of the electronic device 1. Also, in this embodiment, the board 40 is disposed so as to be located in the space between each intake port 35 and the inlet 61 of the fan 60 when viewed in the front-rear direction. Specifically, the board 40 is located in a space X1 between a straight line L1l connecting the left end of the left air intake 35a and the left end of the inlet 61 of the fan 60, and a straight line L1r connecting the right end of the left air intake 35a and the right end of the inlet 61 of the fan 60 in FIG. 5. In addition, the board 40 is located in a space X2 between a straight line L2l connecting the left end of the right air intake 35b and the left end of the inlet 61 of the fan 60, and a straight line L2r connecting the right end of the right air intake 35b and the right end of the inlet 61 of the fan 60 in FIG. Note that the board 40 may be disposed in any manner as long as it is disposed so as to be located in the space (X1, X2) between each of the multiple air intakes 35 and the inlet 61 of the fan 60. Therefore, the board 40 may be disposed so as to be located only on one side of the center line C in the width direction of the electronic device 1.

[0035] 4 and 5, a plurality of electronic components 41 and a shielding member 44 that covers some of the electronic components 41 are attached to the substrate 40. The substrate 40 also has a plurality of openings 46 on the substrate and a ground pattern 47.

[0036] The electronic components 41 are an example of electronic components mounted on the substrate 40, each of which realizes a different function, and are heat-generating components that generate heat when activated. The electronic components 41 include one or more front electronic components (second heat-generating components) 42 mounted on the front surface (second surface) of the substrate 40, and one or more rear electronic components (first heat-generating components) 43 mounted on the rear surface (surface opposite to the front surface; first surface) of the substrate 40. In the example shown in FIG. 4 and FIG. 5, two front electronic components 42 are mounted on the front surface of the substrate 40, and three rear electronic components 43 are mounted on the rear surface of the substrate 40. All or a part of the front electronic components 42 are disposed so as to at least partially overlap with the front metal plate 28 in the front-rear direction. All or a part of the rear electronic components 43 are disposed so as to at least partially overlap with the rear metal plate 50 in the front-rear direction. In addition, the front electronic components 42 and the rear electronic components 43 are disposed so as not to overlap with each other in the front-rear direction.

[0037] In the example shown in FIG. 4 and FIG. 5, the front electronic component 42 has a first front electronic component 42a provided at the lower left end of the substrate 40 and a second front electronic component 42b provided on the substrate 40 toward the left of the center. Therefore, the first front electronic component 42a and the second front electronic component 42b are disposed relatively toward the left. As a result, at least a part of the first front electronic component 42a and the second front electronic component 42b is located in the space X1 between the left air intake 35a and the inlet 61 of the fan 60. In particular, in this embodiment, the second front electronic component 42b has a larger average heat generation amount or a larger maximum heat generation amount than the first front electronic component 42a. Therefore, the front electronic component 42 with the largest average heat generation amount or the largest maximum heat generation amount among the front electronic components 42 provided on the front side of the substrate 40 is at least partially located in the space X1 between the left air intake 35a and the inlet 61 of the fan 60.

[0038] In this embodiment, the first front-side electronic component 42a is a component including a rewritable memory or a storage IC, and the second front-side electronic component 42b is a component including neither a rewritable memory nor a storage IC. Therefore, the first front-side electronic component 42a is a component that is more vulnerable to heat than the second front-side electronic component 42b.

[0039] Only one front electronic component 42 may be provided on the front side of the substrate 40, or three or more front electronic components 42 may be provided. In addition, a part or all of the front electronic components 42 may be disposed relatively to the right of the substrate 40. Furthermore, a part or all of the front electronic components 42 may be located in the space X1 between the left air intake 35a and the inlet 61 of the fan 60, or the whole of the front electronic components 42 may not be located in the space X1. In particular, when the front electronic components 42 are disposed so as to be capable of transferring heat with a member such as a shielding member, the front electronic components 42 may not be located in the space X1 as long as at least a part of the member is located in the space X1. In addition, the front electronic component 42 having the largest average heat generation amount or the largest maximum heat generation amount among the front electronic components 42 may not be located in the space X1 between the left air intake 35a and the inlet 61 of the fan 60.

[0040] 4 and 5, the rear electronic component 43 includes a first rear electronic component 43a provided on the right side of the center of the substrate 40, a second rear electronic component 43b provided on the right side of the first rear electronic component 43a, and a third rear electronic component 43c provided below the first rear electronic component 43a. Therefore, the first rear electronic component 43a, the second rear electronic component 43b, and the third rear electronic component 43c are disposed relatively to the right. As a result, at least a part of the first rear electronic component 43a and the third rear electronic component 43c is located in the space X2 between the right air intake 35b and the inlet 61 of the fan 60. In particular, in this embodiment, the average heat value or the maximum heat value of the first rear electronic component 43a is larger than that of the second rear electronic component 43b and the third rear electronic component 43c. Therefore, among the rear electronic components 43 provided on the rear side of the board 40, the rear electronic component 43 having the largest average heat generation or the largest maximum heat generation is at least partially located within the space X2 between the right-side air intake 35b and the inlet 61 of the fan 60.

[0041] Only one rear electronic component 43 may be provided on the rear side of the substrate 40, or two or four or more rear electronic components 43 may be provided. In addition, a part or all of the rear electronic components 43 may be disposed relatively to the left of the substrate 40. Furthermore, a part or all of the rear electronic components 43 may be located in the space X2 between the right air intake 35b and the inlet 61 of the fan 60, or the whole of the rear electronic components 43 may not be located in the space X2. In particular, when the rear electronic components 43 are disposed so as to be capable of transferring heat with a member such as the shield member 44, the front electronic components 42 may not be located in the space X2 as long as at least a part of the member is located in the space X2. In addition, the rear electronic component 43 having the largest average heat generation amount or the largest maximum heat generation amount among the rear electronic components 43 may not be located in the space X2 between the right air intake 35b and the inlet 61 of the fan 60.

[0042] In this embodiment, the total heat generation amount of all the rear electronic components 43 is greater than the total heat generation amount of all the front electronic components 42. In addition, in this embodiment, the average heat generation amount or the maximum heat generation amount of the component (first rear electronic component 43a) having the largest average heat generation amount or the largest maximum heat generation amount among the rear electronic components 43 is greater than the average heat generation amount or the maximum heat generation amount of the component (second front electronic component 42b) having the largest average heat generation amount or the largest maximum heat generation amount among the front electronic components 42.

[0043] The shielding member 44 is an example of a member used to block noise radiated from the electronic component 41, and is made of a metal having thermal conductivity. In this embodiment, the shielding member 44 is arranged to cover all three rear electronic components 43 as shown in FIG. 5 and FIG. 6. In this embodiment, the shielding member 44 is attached to the board 40 so as to be in contact with the rear surface of the first rear electronic component 43a and to be separated from the rear surfaces of the second rear electronic component 43b and the third rear electronic component 43c. The shielding member 44 may be attached to the board 40 so as to be connected to at least any or all of the rear surfaces of the first rear electronic component 43a, the second rear electronic component 43b, and the third rear electronic component 43c via thermally conductive grease. With this configuration, even if the heights of the electronic components are different, the first to third rear electronic components and the shielding member 44 can be connected in a thermally movable manner.

[0044] In the present embodiment, the shielding member 44 is provided so as to cover the three rear electronic components 43. However, the shielding member 44 may be provided so as to cover only a part of the three rear electronic components 43. In the present embodiment, one shielding member 44 is provided so as to cover the three rear electronic components 43. However, a plurality of shielding members 44 may be provided on the board 40, and each may be arranged so as to cover one or a plurality of rear electronic components 43. In addition, a portion of the plurality of shielding members 44 may be provided so as to cover the front electronic component 42. In addition, the shielding member 44 is attached to the board 40 so as to be in contact with the rear surface of the first rear electronic component 43a, but may be attached to the board 40 so as to be in contact with the rear surfaces of the second rear electronic component 43b and / or the third rear electronic component 43c in addition to or instead of the first rear electronic component 43a. In addition, the shielding member 44 may be attached to the board 40 so as to be in contact with the rear surfaces of other electronic components, such as the front electronic component 42. Furthermore, the shielding member 44 may be formed to have an opening so that a part of the electronic components 41 covered by the shielding member 44 is exposed to the outside of the shielding member 44.

[0045] In this embodiment, the shield member 44 is attached to the board 40 by a metal mounting fixture 45 having thermal conductivity. As shown in FIG. 5 and FIG. 6, the mounting fixture 45 is disposed rearward of the shield member 44 in contact with the shield member 44, and is fixed to the board 40 and the front housing half 20 by a first fastener 81 for mounting the board 40 to the front housing half 20 (particularly, the front metal plate 28). When an opening is formed in the shield member 44, the mounting fixture 45 may be disposed so as to cover the opening. In this case, the mounting fixture 45 is used to block noise radiated from the electronic component 41 located in the shield member 44. In this case, the mounting fixture 45 may be disposed so as to contact the rear surface of the electronic component 41 located in the opening of the shield member 44. The mounting fixture 45 may be formed of a material other than metal as long as it has thermal conductivity.

[0046] The board opening 46 is an opening for passing a first fastener 81 for attaching the board 40 to the front housing half 20 (particularly, the front metal plate 28) or a second fastener 82 for attaching the rear metal plate 50 to the board 40. As can be seen from FIG. 3 and FIG. 4, the first board opening 46a for passing the first fastener 81 for attaching the board 40 to the front metal plate 28 is disposed at a position corresponding to the board fastening hole 27a of the front housing half 20. In addition, the second board opening 46b for passing the second fastener 82 for attaching the rear metal plate 50 to the board 40 is disposed at a position corresponding to the metal plate opening 51 provided in the rear metal plate 50. As shown in FIG. 4, the number of the first board openings 46a is greater than the number of the second board openings 46b. In particular, in this embodiment, only one second board opening 46b is provided on the board 40.

[0047] The ground pattern 47 is a wiring pattern electrically connected to the ground potential of the electronic device 1. As shown in FIG. 4, the ground pattern 47 is arranged so as to extend over the entire substrate 40 except for the vicinity of the first front electronic component 42a. Therefore, the ground pattern 47 is arranged so as to overlap at least some of the electronic components 41 when viewed in the front-rear direction. In particular, in this embodiment, the ground pattern 47 is arranged so that all the front electronic components 42 other than the first front electronic component 42a overlap with the ground pattern 47 when viewed in the front-rear direction. Also, in this embodiment, the ground pattern 47 is arranged so that all the rear electronic components 43 overlap with the ground pattern 47 when viewed in the front-rear direction. Note that, when viewed in the front-rear direction, the ground pattern 47 may be arranged so that all the front electronic components 42 overlap with the ground pattern 47, or some of the rear electronic components 43 may not overlap with the ground pattern 47. Also, all the front electronic components 42 and / or all the rear electronic components 43 may be arranged so as not to overlap with the ground pattern 47.

[0048] The ground pattern 47 is made of a conductor such as copper or silver, and is formed by a general processing method (e.g., etching) for providing a wiring pattern on a printed circuit board. In this embodiment, the board 40 is formed to have a plurality of layers, and the ground pattern 47 is disposed on one of these layers.

[0049] In this embodiment, the ground pattern 47 is electrically connected to at least a part of the inner surface of the board opening 46. Particularly, in this embodiment, the ground pattern 47 is electrically connected to at least a part of the inner surface of the first board opening 46a. As a result, the ground pattern 47 is electrically connected to the front metal plate 28 via the first fastener 81 inserted into the first board opening 46a. Therefore, the front metal plate 28 is electrically connected to the ground potential via the first fastener 81. Also, in this embodiment, the ground pattern 47 is electrically connected to the inner surface of the second board opening 46b (at least a part of the inner surfaces of the second board opening 46b when there are a plurality of second board openings 46b). As a result, the ground pattern 47 is electrically connected to the rear metal plate 50 via the second fastener 82 inserted into the second board opening 46b. Therefore, the rear metal plate 50 is electrically connected to the ground potential via the second fastener 82.

[0050] Moreover, the ground pattern 47 is connected to at least a part of the inner surface of the board opening 46 in a manner capable of thermal transfer. In particular, the ground pattern 47 is connected to at least a part of the inner surface of the first board opening 46a in a manner capable of thermal transfer. As a result, the ground pattern 47 is connected to the front metal plate 28 in a manner capable of thermal transfer via the first fastener 81 inserted into the first board opening 46a. Also, the ground pattern 47 is connected to the inner surface of the second board opening 46b (at least a part of the inner surfaces of the second board opening 46b when there are a plurality of second board openings 46b) in a manner capable of thermal transfer. As a result, the ground pattern 47 is connected to the rear metal plate 50 in a manner capable of thermal transfer via the second fastener 82 inserted into the second board opening 46b.

[0051] In this embodiment, the ground pattern 47 is electrically and thermally connected to all or some of the electronic components 41 provided on the substrate 40. Specifically, the ground pattern 47 extends to the vicinity of all or some of the electronic components 41 provided on the substrate 40 so as to contact some terminals of these electronic components 41.

[0052] In this embodiment, the first board opening 46a and the second board opening 46b are both connected to the same ground pattern 47, and the front electronic component 42 and the rear electronic component 43 are both connected to the same ground pattern 47. However, the board 40 may have a plurality of ground patterns. In this case, the first board opening 46a and the second board opening 46b may be electrically and thermally connected to different ground patterns, and the front electronic component 42 and the rear electronic component 43 may be electrically and thermally connected to different ground patterns. In this case, at least a part of the front electronic component 42 is arranged so as to overlap with the ground pattern connected to the front electronic component 42 when viewed in the front-rear direction. In addition, at least a part of the rear electronic component 43 is arranged so as to overlap with the ground pattern connected to the rear electronic component 43 when viewed in the front-rear direction.

[0053] Furthermore, the substrate 40 may have one or more wiring patterns different from the ground pattern 47 (not electrically connected to the ground potential of the electronic device 1). In this case, the first substrate opening 46a and / or the second substrate opening 46b may be connected to a wiring pattern different from the ground pattern 47 in addition to or instead of the ground pattern 47. In this case, the first substrate opening 46a and the second substrate opening 46b may be connected to the same wiring pattern different from the ground pattern 47, or may be connected to separate wiring patterns different from the ground pattern 47. In summary, the front metal plate 28 is electrically and thermally connected to the second wiring pattern of the substrate 40 via the first substrate opening 46a and the first fastener 81 inserted into the first substrate opening 46a, and the rear metal plate 50 is electrically and thermally connected to the first wiring pattern of the substrate 40 via the second substrate opening 46b and the second fastener 82 inserted into the second substrate opening 46b. The first wiring pattern and the second wiring pattern may be the same wiring pattern or may be different wiring patterns from each other. The first wiring pattern and the second wiring pattern may be a ground pattern electrically connected to the ground potential of the electronic device 1 or may be a wiring pattern different from the ground pattern.

[0054] Similarly, the front electronic component 42 and the rear electronic component 43 may be connected to a wiring pattern different from the ground pattern 47 in addition to or instead of the ground pattern 47. In this case, the front electronic component 42 and the rear electronic component 43 may be connected to the same wiring pattern different from the ground pattern 47, or may be connected to separate wiring patterns different from the ground pattern 47. In summary, the front electronic component 42 is electrically and thermally connected to the first wiring pattern of the substrate 40, and the rear electronic component 43 is electrically and thermally connected to the second wiring pattern of the substrate 40. The first wiring pattern and the second wiring pattern may be the same wiring pattern or may be different wiring patterns from each other. The first wiring pattern and the second wiring pattern may be a ground pattern electrically connected to the ground potential of the electronic device 1, or may be a wiring pattern different from the ground pattern.

[0055] In this embodiment, the ground pattern 47 is formed by a general processing method, but the ground pattern 47 or other wiring patterns connected to the opening 46a on the first substrate and / or the opening 46b on the second substrate may be wiring patterns formed as a membrane sheet fixed on a substrate formed as a resin frame. Alternatively, the ground pattern 47 or other wiring patterns connected to the opening 46a on the first substrate and / or the opening 46b on the second substrate may be wiring patterns formed of conductive ink printed between two resin films (for example, polyester sheets).

[0056] In this embodiment, as shown in FIG. 4, the ground pattern 47 is not provided around the first front electronic component 42a. In addition, no wiring pattern other than the wiring pattern for connecting to the first front electronic component 42a is provided around the first front electronic component 42a. This prevents heat from being transferred to the first front electronic component 42a, which is vulnerable to heat, via the wiring pattern provided on the substrate 40, and prevents the first front electronic component 42a from malfunctioning due to heat. In particular, in this embodiment, the first front electronic component 42a is a component including a memory or storage IC capable of rewriting information, and therefore malfunction due to rewriting or the like caused by heat is less likely to occur.

[0057] Furthermore, the substrate 40 may have a metal pattern different from the ground pattern 47 and the wiring pattern other than the ground pattern 47. Such a metal pattern is connected to at least one of the inner surfaces of the first substrate opening 46a and the second substrate opening 46b in a manner allowing thermal transfer. Even if the substrate 40 has the ground pattern 47 or other wiring patterns, such a metal pattern is not connected to the ground pattern 47 or other wiring patterns. Such a metal pattern allows the heat of the substrate 40 to be transferred to at least one of the front metal plate 28 and the rear metal plate 50.

[0058] <Rear metal plate> Next, the rear metal plate 50 will be described with reference to Fig. 2, Fig. 6, and Fig. 7. Fig. 7 is a cross-sectional view of the electronic device 1 taken along line VII-VII in Fig. 5. The rear metal plate 50 is an example of a member at the rear of the substrate 40 that is used to dissipate heat generated in the electronic component 41. As shown in Fig. 2, the rear metal plate 50 is formed in a plate shape.

[0059] The rear metal plate 50 is made of a metal such as magnesium or aluminum. In particular, in this embodiment, the rear metal plate 50 is made of a material having a higher thermal conductivity and a higher specific gravity than the front metal plate 28. Therefore, for example, the front metal plate 28 is made of magnesium, and the rear metal plate 50 is made of aluminum. Also, in this embodiment, the rear metal plate 50 has a smaller area than the front metal plate 28 when viewed in the front-rear direction.

[0060] As shown in FIG. 2, the rear metal plate 50 has a shape that does not overlap the fan 60 when viewed in the front-rear direction. In this embodiment, the rear metal plate 50 is formed and arranged so as to overlap the board 40 and the battery 75 when viewed in the front-rear direction. Particularly, in this embodiment, the rear metal plate 50 is formed in a U-shape so as to surround the fan 60 when viewed in the front-rear direction. Also, in this embodiment, the rear metal plate 50 is arranged so as to be located in the spaces X1 and X2 between each intake port 35 and the inlet 61 of the fan 60 when viewed in the front-rear direction. Specifically, the rear metal plate 50 is located in the space X1 between the left intake port 35a and the inlet 61 of the fan 60, and is located in the space X2 between the right intake port 35b and the inlet 61 of the fan 60.

[0061] The rear metal plate 50 may be partially located in the space X1 between the left air intake 35a and the inlet 61 of the fan 60. Similarly, the rear metal plate 50 may be partially located in the space X2 between the right air intake 35b and the inlet 61 of the fan 60.

[0062] The rear metal plate 50 has a plurality of metal plate openings 51. The metal plate openings 51 are openings for passing a third fastener 83 for attaching the rear metal plate 50 to the front housing half 20 (particularly, the front metal plate 28) or a second fastener 82 for attaching the rear metal plate 50 to the board 40. As can be seen from FIG. 2 and FIG. 4, the first metal plate openings 51a for passing the third fastener 83 for attaching the rear metal plate 50 to the front housing half 20 are arranged at positions corresponding to the metal plate fastening holes 27b of the front housing half 20. In addition, the second metal plate openings 51b for passing the second fastener 82 for attaching the rear metal plate 50 to the board 40 are arranged at positions corresponding to the second board openings 46b provided on the board 40. As shown in FIG. 2, the number of the first metal plate openings 51a is greater than the number of the second metal plate openings 51b. In particular, in this embodiment, the rear metal plate 50 is provided with only one second metal plate opening 51b.

[0063] In this embodiment, the rear metal plate 50 is formed as a separate member from the rear housing half 30. However, the rear metal plate 50 may be formed as the rear main wall 31 of the rear housing half 30 or as a part thereof. In this case, the rear metal plate 50 is formed as a part of the rear housing half 30 so as to be exposed on the front surface of the rear housing half 30 integrally formed therewith. Therefore, at least a part of the housing 10 is formed by the front metal plate 28 or the rear metal plate 50.

[0064] <Fan> Next, the fan 60 will be described with reference to Figs. 2 and 7. The fan 60 is a device that takes in air from an inlet 61 and expels the taken-in air from an outlet 62. In this embodiment, the fan 60 is attached to the front housing half 20 (particularly, the front metal plate 28) behind the front housing half 20. Particularly, in this embodiment, the fan 60 is attached so that a gap is formed between the rear surface of the front housing half 20 and the front surface of the fan 60. Also, the fan 60 is disposed so as to be located above the center of the housing 10 when viewed in the front-rear direction. The fan 60 has an inlet 61 provided on the front and rear surfaces thereof, and an outlet 62 provided above.

[0065] The inlet 61 has a first inlet 61a provided on the front side and a second inlet 61b provided on the rear side. In this embodiment, as shown in Figs. 2 and 7, the first inlet 61a and the second inlet 61b are both formed in the same circular shape. The fan 60 may have the inlet 61 only on the rear side. Alternatively, the fan 60 may have an inlet provided below, to the left, and / or to the right of the fan 60 in addition to or instead of the first inlet 61a and / or the second inlet 61b.

[0066] One outlet 62 is provided above the fan 60. The outlet 62 is arranged to face the exhaust port 34 of the rear housing half 30. The outlet 62 may be arranged in any direction of the fan 60 as long as it faces the exhaust port 34 of the housing 10. For example, when the exhaust port 34 of the housing 10 is formed in the left wall 15 or right wall 16 of the housing 10 (the left side wall 22 or the right side wall 23 of the front housing half 20), the fan 60 is arranged so that the outlet 62 faces in the width direction.

[0067] When the fan 60 configured in this manner is driven, air is sucked into each of the intake ports 35 of the rear housing half 30 from outside the electronic device 1. The air sucked into the intake ports 35 passes through the housing 10 and is taken into the fan 60 from the inlet 61 of the fan 60. At this time, the air sucked into the left intake port 35a mainly flows through the space X1 between the left intake port 35a and the inlet 61 of the fan 60. Similarly, the air sucked into the right intake port 35b mainly flows through the space X2 between the right intake port 35b and the inlet 61 of the fan 60. The air taken into the fan 60 is exhausted from the fan 60 through the outlet 62, and the exhausted air flows upward inside the housing 10 and flows out of the electronic device 1 from the exhaust port 34 of the rear housing half 30. In this embodiment, a heat sink 72 is disposed between the air outlet 62 of the fan 60 and the exhaust port 34, so that the air flowing out from the air outlet 62 of the fan 60 flows through the heat sink 72 and then flows out from the exhaust port 34 to the outside of the electronic device 1.

[0068] <Other components> Next, the heat pipe 70, the heat sink 72, the battery 75 and the fasteners 81 to 83 will be described with reference to FIGS. 2 and 5 to 8. FIG.

[0069] The heat pipe 70 is an example of a member that transfers heat generated in the rear electronic component 43 to the heat sink 72. The heat pipe 70 is a pipe made of a metal having thermal conductivity, such as copper or aluminum, in which a liquid is sealed. As shown in FIG. 5 and FIG. 6, one end of the heat pipe 70 is disposed behind the mounting fixture 45 in contact with the mounting fixture 45. Therefore, a part of the heat generated in the rear electronic component 43 is transferred to the heat pipe 70 via the shield member 44 and the mounting fixture 45. In addition, the other end of the heat pipe 70 is connected to the heat sink 72 so as to be capable of transferring heat. Therefore, the heat transferred via the heat pipe 70 is transferred to the heat sink 72.

[0070] Note that, as long as the heat generated in the rear electronic component 43 can be transferred to the heat sink 72, a member other than the heat pipe 70 may be used. Therefore, for example, a vapor chamber or the like may be used instead of the heat pipe 70. Also, the heat pipe 70 may be arranged so as to be in direct contact with the shield member 44 or the rear electronic component 43, instead of the mounting fixture 45. In any case, the heat pipe 70 may be arranged in any manner as long as the heat of the rear electronic component 43, particularly the rear electronic component 43 that has the largest average heat generation amount or the largest maximum heat generation amount among the rear electronic components 43, is transferred to the heat pipe 70.

[0071] The heat sink 72 is an example of a heat dissipation member for dissipating heat, and dissipates heat transferred through the heat pipe 70 into the air. In this embodiment, the heat sink 72 has a plurality of fins extending in the vertical direction. The heat sink 72 is connected to the heat pipe 70 so as to be capable of transferring heat. The heat sink 72 is disposed above the outlet 62 of the fan 60 and below the exhaust port 34 of the housing 10. Thus, the heat sink 72 is disposed between the outlet and the exhaust port 34 of the fan 60. In the heat sink 72 configured in this manner, when the air flowing out from the outlet 62 of the fan 60 flows through the fins, heat is transferred from the heat sink 72 to the air.

[0072] The battery 75 is a component that accumulates power. In this embodiment, the battery 75 is a chargeable and dischargeable secondary battery. The battery 75 supplies power to the electronic components 41 and the display panel 5. The battery 75 is a relatively large component in the electronic device 1, and is held in the frame portion 26 formed in the front housing half 20.

[0073] In this embodiment, the battery 75 is disposed so as to be at least partially located in the space X1 between the left air intake 35a and the inlet 61 of the fan 60. In addition, the battery 75 is disposed so as not to be located in the space X2 between the right air intake 35b and the inlet 61 of the fan 60. However, the battery 75 may be disposed so as to be located in either of the spaces X1 and X2, or so as not to be located in either of the spaces. The battery 75 may also be disposed closer to the space X1 between the left air intake 35a and the inlet 61 of the fan 60 than to the space X2 between the right air intake 35b and the inlet 61 of the fan 60.

[0074] The fasteners 81 to 83 are used to attach the front housing half 20 (particularly the front metal plate 28), the substrate 40, and the rear metal plate 50 to one another. In this embodiment, the fasteners 81 to 83 are made of metal, but may be made of other materials as long as they have thermal conductivity and electrical conductivity.

[0075] Fig. 8 is a cross-sectional view showing a state in which the front metal plate 28, the board 40 and the rear metal plate 50 are attached to one another by fasteners 81 to 83. As shown in Fig. 8, the first fastener 81 passes through the first board opening 46a formed in the board 40 and is attached to the board fastening hole 27a of the front metal plate 28. As a result, the board 40 is fixed to the front metal plate 28 and the board 40 and the front metal plate 28 are connected to each other so as to be capable of thermal transfer. In addition, the ground pattern 47 of the board 40 is electrically connected to the front metal plate 28.

[0076] The second fastener 82 passes through the second board opening 46b formed in the board 40 and the second metal plate opening 51b formed in the rear metal plate 50, and is fixed by a nut. As a result, the board 40 is fixed to the rear metal plate 50, and the board 40 and the rear metal plate 50 are connected to each other so as to be capable of thermal transfer. In addition, the ground pattern 47 of the board 40 is electrically connected to the rear metal plate 50. The third fastener 83 passes through the first metal plate opening 51a formed in the rear metal plate 50, and is attached to the metal plate fastening hole 27b of the front metal plate 28. As a result, the rear metal plate 50 is fixed to the front metal plate 28, and the rear metal plate 50 and the front metal plate 28 are connected to each other so as to be capable of thermal transfer. In addition, the rear metal plate 50 is electrically connected to the front metal plate 28.

[0077] <Relationships between components> Next, the relationship between the components of the electronic device 1 will be described with reference to FIGS. 6 and 7. As shown in FIGS. 6 and 7, the front metal plate 28 is located in front of the substrate 40. When the fan 60 is driven, air that flows into the housing 10 through the air intake 35 flows in the space between the front surface (second surface) of the substrate 40 and the rear surface of the front metal plate 28. Therefore, an air flow path (second flow path, hereinafter referred to as the "front flow path") 91 is formed between the front surface of the substrate 40 and the rear surface of the front metal plate 28. Also, as described above, when the front metal plate 28 is a member separate from the front main wall 21 of the front housing half 20, the front flow path 91 is formed between the front surface of the substrate 40 and the rear surface of the front metal plate 28 or the rear surface of the front main wall 21. Therefore, the front flow path 91 is formed between the front surface of the substrate 40 and the front side facing surface (second facing surface) facing the front surface of the substrate 40. In other words, the front flow path 91 includes the space between the front surface of the substrate 40 and the front side facing surface. The front flow passage 91 guides the air that has flowed into the housing 10 via the intake port 35 to the inlet 61 of the fan 60 .

[0078] 7, the front electronic components 42 are disposed in the front flow passage 91. In particular, the front electronic components 42 that have the largest average heat generation amount or the largest maximum heat generation amount are disposed in the front flow passage 91.

[0079] 6 and 7, the rear metal plate 50 and the rear main wall 31 are located behind the substrate 40. Air that flows into the housing 10 through the air inlet 35 when the fan 60 is driven flows in a space between the rear surface (first surface) of the substrate 40 and the front surface of the rear metal plate 50 or the front surface of the rear main wall 31. Therefore, an air flow path (first flow path, hereinafter referred to as a "rear flow path") 92 is formed between the rear surface of the substrate 40 and the front surface of the rear metal plate 50 or the front surface of the rear main wall 31. Furthermore, as described above, when the rear metal plate 50 is integrally formed with the rear main wall 31 of the rear housing half 30, the rear flow path 92 is formed between the rear surface of the substrate 40 and the front surface of the rear metal plate 50. Therefore, the rear flow path 92 is formed between the rear surface of the substrate 40 and the rear side facing surface (first facing surface) facing the rear surface of the substrate 40. In other words, the rear flow path 92 includes a space between the rear surface of the substrate 40 and the rear side facing surface. The rear flow passage 92 guides the air that has flowed into the housing 10 via the intake port 35 to the inlet 61 of the fan 60 .

[0080] 6, the rear electronic components 43 are disposed in the rear flow passage 92. In particular, the rear electronic components 43 that have the largest average heat generation amount or the largest maximum heat generation amount are disposed in the rear flow passage 92.

[0081] In addition, in this embodiment, in the front-rear direction, the distance D1 between the rear surface of the substrate 40 and the front surface of the rear metal plate 50 or the front surface of the rear main wall 31 is longer than the distance D2 between the front surface of the substrate 40 and the rear surface of the front metal plate 28. Therefore, the distance in the front-rear direction of the rear flow path 92 in which the rear electronic components 43 that generate a large amount of heat are provided is longer than the distance in the front-rear direction of the front flow path 91 in which the front electronic components 42 that generate a small amount of heat are provided. In the example shown in FIG. 6 and FIG. 7, the distance D2 between the front surface of the substrate 40 and the rear surface of the front metal plate 28 is constant. Also, the distance D1 between the rear surface of the substrate 40 and the front surface of the rear metal plate 50 is constant. However, for example, when the front metal plate 28 or the rear metal plate 50 has an uneven shape, the distance between the front surface of the substrate 40 and the rear surface of the front metal plate 28 and the distance between the rear surface of the substrate 40 and the front surface of the rear metal plate 50 are not constant. In such a case, the average distance D1 between the rear surface of the substrate 40 and the front surface of the rear metal plate 50 or the front surface of the rear main wall 31 is set to be longer than the average distance D2 between the front surface of the substrate 40 and the rear surface of the front metal plate 28. Alternatively, the maximum distance D1 between the rear surface of the substrate 40 and the front surface of the rear metal plate 50 or the front surface of the rear main wall 31 is set to be longer than the maximum distance D2 between the front surface of the substrate 40 and the rear surface of the front metal plate 28.

[0082] Further, the fan 60 has a rear surface 63 (fan first surface) and a front surface 64 (fan second surface) opposite to the rear surface 63. A first inlet 61a is provided on the rear surface 63, and a second inlet 61b is provided on the front surface 64. As shown in FIG. 7, the rear surface 63 of the fan 60 faces the rear main wall 31, and the front surface 64 of the fan 60 faces the front metal plate 28. In this embodiment, the distance between the rear surface 63 of the fan 60 and the front surface of the rear main wall 31, which is the surface opposite to the rear surface 63 of the fan 60, is longer than the distance between the front surface 64 of the fan 60 and the rear surface of the front metal plate 28, which is the surface opposite to the rear surface 63 of the fan 60. Therefore, the distance between the first inlet 61a formed on the rear surface 63 of the fan 60 and the front surface of the rear main wall 31 (i.e., the surface opposite to the rear surface 63 of the fan 60) is longer than the distance between the second inlet 61b formed on the front surface 64 of the fan 60 and the rear surface of the front metal plate 28 (i.e., the surface opposite to the front surface 64 of the fan 60).

[0083] In this embodiment, as shown in FIG. 6, a rear thermally conductive sheet 86 is provided between the heat pipe 70 and the rear metal plate 50 in the region near the mounting fixture 45. The rear thermally conductive sheet 86 is a sheet having thermal conductivity. The rear thermally conductive sheet 86 is arranged so as to be in contact with the heat pipe 70 and the rear metal plate 50. Therefore, heat is transferred between the mounting fixture 45 and the rear metal plate 50 via the rear thermally conductive sheet 86. As a result, the shield member 44, the mounting fixture 45, the heat pipe 70, and the rear thermally conductive sheet 86 are arranged in layers in the front-rear direction between the rear electronic component 43, particularly the first rear electronic component 43a, and the rear metal plate 50, and are connected to each other so as to be capable of transferring heat. Therefore, the shield member 44, the mounting fixture 45, the heat pipe 70, and the rear thermally conductive sheet 86 function as a thermally conductive connecting member (first connecting member) that connects the rear electronic component 43, particularly the first rear electronic component 43a, and the rear metal plate 50 in a manner that allows thermal transfer between them. As a result, when the rear electronic component 43, particularly the first rear electronic component 43a, generates a large amount of heat, the generated heat is transferred to the heat sink 72 via the heat pipe 70 and also transferred to the rear metal plate 50 via these layered components.

[0084] The rear thermally conductive sheet 86 may be arranged in any manner as long as it can connect at least one of the rear electronic components 43 and the rear metal plate 50 in a manner that allows thermal transfer. Therefore, for example, it may be arranged so as to be in contact with both the rear electronic components 43 and the rear metal plate 50. Also, other elements may be used in place of the rear thermally conductive sheet 86 as long as they are elements that have thermal conductivity. Therefore, thermally conductive grease may be used in place of the rear thermally conductive sheet 86.

[0085] In addition, in this embodiment, as shown in Fig. 8, the substrate 40 and the rear metal plate 50 are attached to each other by a second fastener 82 having thermal conductivity. Therefore, the substrate 40 and the rear metal plate 50 are connected to each other by the second fastener 82 in a manner that allows thermal movement. Therefore, the second fastener 82 functions as a thermally conductive connecting member (first connecting member) that connects the substrate 40 and the rear metal plate 50 to each other in a manner that allows thermal movement without passing through the rear electronic component 43. Note that, as such a connecting member, a part other than a fastener such as a screw or a bolt may be used as long as it is a thermally conductive member that connects the substrate 40 and the rear metal plate 50 in a manner that allows thermal movement.

[0086] Further, in this embodiment, as shown in FIG. 7, a front thermally conductive sheet 85 is provided between the second front electronic component 42b and the front metal plate 28 in the front-rear direction. The front thermally conductive sheet 85 is a sheet having thermal conductivity. The front thermally conductive sheet 85 is arranged so as to contact the second front electronic component 42b and the front metal plate 28. Therefore, heat is transferred between the second front electronic component 42b and the front metal plate 28 via the front thermally conductive sheet 85. Therefore, the front thermally conductive sheet 85 functions as a thermally conductive connecting member (second connecting member) that connects the front electronic component 42 and the front metal plate 28 to be able to transfer heat to each other. As a result, when the amount of heat generated by the second front electronic component 42b is large, the generated heat is transferred to the front metal plate 28 via the front thermally conductive sheet 85.

[0087] The front thermally conductive sheet 85 may be arranged in any manner as long as it can connect at least one of the front electronic components 42 and the front metal plate 28 in a manner that allows thermal transfer. Therefore, for example, another component having thermal conductivity may be arranged between the front electronic components 42 and the front thermally conductive sheet 85 or between the front metal plate 28 and the front thermally conductive sheet 85. Furthermore, another element having thermal conductivity may be used instead of the front thermally conductive sheet 85. Therefore, thermally conductive grease may be used instead of the front thermally conductive sheet 85.

[0088] In addition, in this embodiment, as shown in Fig. 8, the board 40 and the front metal plate 28 are attached to each other by a first fastener 81 having thermal conductivity. Therefore, the board 40 and the front metal plate 28 are connected to each other by the first fastener 81 in a manner that allows thermal movement. Therefore, the first fastener 81 functions as a thermally conductive connecting member (second connecting member) that connects the board 40 and the front metal plate 28 to each other in a manner that allows thermal movement without going through the front electronic component 42. Note that, as such a connecting member, a part other than a fastener such as a screw or a bolt may be used as long as it is a thermally conductive member that connects the board 40 and the front metal plate 28 in a manner that allows thermal movement.

[0089] As described above, in this embodiment, the number of the first fasteners 81 is greater than the number of the second fasteners 82. Therefore, the first fasteners 81 are configured to conduct heat more easily than the second fasteners. Note that the first fasteners 81 and the second fasteners 82 may be configured in any manner as long as the first fasteners 81 are configured to conduct heat more easily than the second fasteners. Therefore, for example, the same number of first fasteners 81 having a relatively large cross-sectional area and second fasteners 82 having a relatively small cross-sectional area may be provided. Alternatively, the first fasteners 81 may be formed of a material having a higher thermal conductivity than the second fasteners 82. In this case, the number of the first fasteners 81 and the number of the second fasteners 82 may be the same.

[0090] In addition, in this embodiment, the number of first connection members including the first fastener 81 and the front thermal conductive sheet 85 is greater than the number of second connection members including the second fastener 82 and the rear thermal conductive sheet 86. Therefore, the first connection members are configured to conduct heat more easily than the second connection member. Note that the first connection members and the second connection members may be configured in any way as long as the first connection members are configured to conduct heat more easily than the second connection members. Therefore, for example, the same number of first connection members having a relatively large cross-sectional area and second connection members having a relatively small cross-sectional area may be provided. Alternatively, the first connection members may be formed of a material having a higher thermal conductivity than the second connection members. In this case, the number of first connection members and the number of second connection members may be the same.

[0091] Furthermore, in this embodiment, as shown in Fig. 8, the front metal plate 28 and the rear metal plate 50 are attached to each other by a third fastener 83 having thermal conductivity. Therefore, the front metal plate 28 and the rear metal plate 50 are connected to each other by the third fastener 83 in a manner allowing thermal transfer. Therefore, the third fastener 83 functions as a thermally conductive connecting member (third connecting member) that connects the front metal plate 28 and the rear metal plate 50 to each other in a manner allowing thermal transfer. Note that, as such a connecting member, a part other than a fastener such as a screw or a bolt may be used as long as it is a thermally conductive member that connects the front metal plate 28 and the rear metal plate 50 to allow thermal transfer.

[0092] <Effects> In this embodiment, the front-rear distance of the rear flow passage 92 in which the rear electronic components 43 that generate a large amount of heat are provided is longer than the front-rear distance of the front flow passage 91 in which the front electronic components 42 that generate a small amount of heat are provided. Therefore, the flow rate of air flowing through the rear flow passage 92 in which the rear electronic components 43 that generate a large amount of heat are provided is greater than the flow rate of air flowing through the front flow passage 91, and this makes it easier to dissipate heat from the rear electronic components 43. As a result, the heat generated from the heat-generating electronic components 41 can be effectively dissipated.

[0093] In this embodiment, a front metal plate 28 is disposed opposite the front surface of the substrate 40, and a rear metal plate 50 is disposed opposite the rear surface of the substrate 40. By disposing the highly thermally conductive metal plates 28, 50 on the front and rear surfaces of the substrate 40 in this manner, heat generated in the electronic components 41 and the substrate 40 can be diffused, and as a result, heat generated from the heat-generating electronic components 41 can be effectively dissipated.

[0094] In addition, in this embodiment, the rear metal plate 50 is connected to the rear electronic components 43 and the board 40 by connecting members such as the second fastener 82 and the rear thermally conductive sheet 86. As a result, heat from the rear electronic components 43 and the board 40 can be dissipated to the air flowing through the rear flow path 92 via the rear metal plate 50. Similarly, in this embodiment, the front metal plate 28 is connected to the front electronic components 42 and the board 40 by connecting members such as the first fastener 81 and the front thermally conductive sheet 85. As a result, heat from the front electronic components 42 and the board 40 can be dissipated to the air flowing through the front flow path 91 via the front metal plate 28.

[0095] In this embodiment, the second fastener 82 connects the rear metal plate 50 to the first wiring pattern in a manner allowing thermal transfer. Similarly, the first fastener 81 connects the front metal plate 28 to the second wiring pattern in a manner allowing thermal transfer. As a result, the wiring pattern provided on the substrate 40 promotes the transfer of heat, so that the heat of the substrate 40 can be transferred quickly to the metal plates 28, 50 via the second fastener 82 and the first fastener 81.

[0096] In this embodiment, the first wiring pattern and the second wiring pattern are electrically connected to the ground potential, and the rear metal plate 50 connected to the first wiring pattern overlaps with the rear electronic component 43 when viewed in the front-rear direction, and the front metal plate 28 connected to the second wiring pattern overlaps with the front electronic component 42 when viewed in the front-rear direction. As a result, the metal plates 28, 50 are connected to the ground potential, and noise generation from the electronic component 41 is suppressed.

[0097] In addition, in this embodiment, the distance between the rear surface of the fan 60 and the front surface of the rear main wall 31, which is the opposite surface of the fan 60, is longer than the distance between the front surface of the fan 60 and the rear surface of the front metal plate 28, which is the opposite surface of the fan 60. As a result, the flow rate of air flowing through the rear flow passage 92 communicating with the rear side of the fan 60 tends to be greater than the flow rate of air flowing through the front flow passage 91 communicating with the front side of the fan 60, and therefore heat is easily dissipated from the rear electronic components 43. As a result, heat generated from the heat-generating electronic components 41 can be effectively dissipated. In addition, in this embodiment, inlets are provided on both the front and rear sides of the fan 60, and as a result, the flow rate of air is prevented from changing significantly between the front flow passage 91 and the rear flow passage 92, which are respectively communicating with the front side and the rear side of the fan 60, and heat generated from the heat-generating electronic components 41 can be effectively dissipated.

[0098] Furthermore, in this embodiment, the distance between the first inlet 61a formed in the rear face 63 of the fan 60 and the opposing surface of the rear face 63 of the fan 60 is longer than the distance between the second inlet 61b formed in the front face 64 of the fan 60 and the front face 64 of the fan 60. As a result, a large space is formed near the inlet on the rear side of the fan 60, which makes it easier to dissipate heat on the rear side of the fan 60, and therefore makes it easier to dissipate heat from the rear electronic components 43.

[0099] In addition, in this embodiment, the second front electronic component 42b having the largest average heat generation amount or the largest maximum heat generation amount among the front electronic components 42 and the first rear electronic component 43a having the largest average heat generation amount or the largest maximum heat generation amount among the rear electronic components 43 are arranged in the space between each of the multiple air intakes 35 and the inlet 61 of the fan 60. As a result, the electronic component 41 having a large heat generation amount is arranged in the main air passage in the housing 10, and thus heat dissipation from the electronic component 41 having a large heat generation amount can be promoted. In particular, in this embodiment, the second front electronic component 42b having the largest average heat generation amount or the largest maximum heat generation amount among the front electronic components 42 and the first rear electronic component 43a having the largest average heat generation amount or the largest maximum heat generation amount among the rear electronic components 43 are arranged in the space between the separate air intakes 35 and the inlet 61 of the fan 60, so that the influence between the components having large heat generation amounts can be minimized, and therefore the heat generated from the heat-generating electronic component 41 can be effectively dissipated.

[0100] In this embodiment, the battery 75 is disposed close to the space between the left air intake 35a and the inlet 61 of the fan 60, where the front electronic components 42, which generate less heat than the rear electronic components 43, are located. The battery 75 is a relatively large component among the components of the electronic device 1, and therefore is likely to cause flow path resistance when disposed close to the air flow path. In this embodiment, the battery 75 is disposed away from the space between the right air intake 35b and the inlet 61 of the fan 60, where the rear electronic components 43, which generate a large amount of heat, are located, so that air can easily flow to the rear electronic components 43, which generate a large amount of heat, and thus the heat generated by the heat-generating electronic components 41 can be effectively dissipated.

[0101] In this embodiment, the substrate 40 and the front metal plate 28 are connected to each other so as to be able to move heat by the first connecting member including the first fastener 81 and the front thermally conductive sheet 85. In this way, the substrate 40 and the front metal plate 28 are connected to each other so as to be able to move heat, so that a part of the heat of the substrate 40 can be dissipated to the air flowing through the front flow path 91 via the first connecting member and the front metal plate 28. As a result, the heat of the substrate 40 is less likely to be dissipated to the air flowing through the rear flow path 92 in which the rear electronic components 43 are arranged, and the dissipation of heat from the rear electronic components 43, which generate a large amount of heat, to the air flowing through the rear flow path 92 can be promoted. Therefore, the heat generated from the heat-generating electronic components 41 can be dissipated effectively.

[0102] In addition, in this embodiment, the number of first connection members including the first fasteners 81 and the front thermally conductive sheet 85 is greater than the number of second connection members including the second fasteners 82 and the rear thermally conductive sheet 86. Therefore, the first connection members are configured to conduct heat more easily than the second connection members. As a result, more heat from the board 40 can be transferred to the front metal plate 28 via the first connection members. This makes it difficult for the heat from the board 40 to be dissipated to the rear flow path 92 in which the rear electronic components 43 are arranged, and it is possible to promote the dissipation of heat from the rear electronic components 43, which generate a large amount of heat, to the air flowing through the rear flow path 92. Therefore, the heat generated from the heat-generating electronic components 41 can be effectively dissipated.

[0103] In this embodiment, the first connection member including the first fastener 81 and the front thermally conductive sheet 85, etc. is made of a material having a higher thermal conductivity than the second connection member including the second fastener 82 and the rear thermally conductive sheet 86, etc. Therefore, the first connection member is configured to conduct heat more easily than the second connection member. As a result, heat generated from the heat-generating electronic component 41 can be dissipated effectively.

[0104] Furthermore, in this embodiment, in addition to the first and second connecting members, a third connecting member including a third fastener 83 that connects the front metal plate 28 and the rear metal plate 50 in a manner that allows thermal transfer is provided. As a result, heat can be dispersed between the front metal plate 28 and the rear metal plate 50, and thus localized heat generation can be suppressed.

[0105] In addition, in this embodiment, the wiring pattern connected to the front electronic component 42 in a manner capable of transferring heat is connected to the first connection member in a manner capable of transferring heat. Therefore, heat generated in the front electronic component 42 can be transferred to the front metal plate 28 via the wiring pattern and the first connection member. As a result, heat generated in the front electronic component 42 can be dispersed to the front metal plate 28, and localized generation of heat can be suppressed.

[0106] In this embodiment, the rear metal plate 50 and the front metal plate 28 are electrically connected to the ground potential, and the rear metal plate 50 overlaps the rear electronic component 43 when viewed in the front-rear direction, and the front metal plate 28 overlaps the front electronic component 42 when viewed in the front-rear direction. As a result, the metal plates 28 and 50 are connected to the ground potential, and noise generation from the electronic component 41 is suppressed.

[0107] In this embodiment, the front electronic component 42 and the rear electronic component 43 are disposed at positions where they do not overlap each other in the front-rear direction. This disperses heat generated in the board 40. Also, air flows from separate air intakes to the front electronic component 42 and the rear electronic component 43, so that heat generated from the heat-generating electronic component 41 can be effectively dissipated.

[0108] In this embodiment, the metal constituting the rear metal plate 50 has a lower thermal conductivity and a larger specific gravity than the metal constituting the front metal plate 28. This increases the thermal conductivity of the metal plate on the rear electronic component 43 side, which generates a relatively large amount of heat, making it easier to disperse heat, and also makes it possible to reduce the weight of the metal plate on the front electronic component 42 side, which generates a relatively small amount of heat. This makes it possible to effectively dissipate heat generated from the electronic component 41 while suppressing an increase in the weight of the electronic device 1 as a whole. In particular, by reducing the area of ​​the rear metal plate 50 while arranging the rear metal plate 50 so as to face the first rear electronic component 43a, which generates the largest amount of heat, it is possible to suppress an increase in the weight of the electronic device 1 while suppressing a decrease in the heat dissipation effect.

[0109] In addition, in this embodiment, the periphery of the front metal plate 28 is surrounded by a resin member. If the area of ​​a metal frame becomes large, it becomes weak against plastic deformation such as bending, but in this embodiment, since the periphery of the front metal plate 28 is surrounded by a resin member, plastic deformation can be suppressed.

[0110] In this embodiment, the resin member is configured so as not to substantially cover the front and rear surfaces of the front metal plate 28. This facilitates heat dissipation forward from the front metal plate 28, and the provision of the resin member can suppress a decrease in the rigidity of the electronic device 1.

[0111] In this embodiment, the heat generated from the front electronic component 42 is dissipated via a thermally conductive sheet or the like, and the heat generated from the rear electronic component 43 is dissipated via a heat pipe or the like. In this manner, the heat generated from the rear electronic component 43, which generates a relatively large amount of heat, is dissipated via a heat pipe or the like, which has a large heat dissipation effect, and the heat generated from the front electronic component 42, which generates a relatively small amount of heat, is dissipated without using a heat pipe or the like, which takes up space in the electronic device 1, thereby making it possible to improve the heat dissipation effect while saving space.

[0112] Although the preferred embodiments according to the present disclosure have been described above, the present disclosure is not limited to these embodiments, and various modifications and changes can be made within the scope of the claims. [Explanation of symbols]

[0113] 1 Electronic equipment 10. Housing 20 Front housing half 28 Front metal plate 30 Rear housing half 40 Substrate 50 Rear metal plate 60 Fans

Claims

1. An electronic device in which air flows in and out from the outside, A housing having an air intake; A fan accommodated in the housing; A substrate accommodated in the housing; one or more first heat generating components mounted on a first surface of the substrate; one or more second heat generating components mounted on a second surface of the substrate opposite to the first surface, A first flow path and a second flow path are formed in the housing to guide the air flowing in through the intake port to the fan. the first flow path is at least partially defined by the first surface and a first opposing surface opposing the first surface, the second flow path is at least partially defined by the second surface and a second opposing surface opposing the second surface, a distance between the first surface and the first opposing surface in the first flow path is longer than a distance between the second surface and the second opposing surface in the second flow path in a direction perpendicular to the substrate; An electronic device, wherein the total heat generation amount of all of the first heat generating components is greater than the total heat generation amount of all of the second heat generating components, or the heat generation amount of the first heat generating components that has the greatest heat generation amount is greater than the heat generation amount of the second heat generating components that has the greatest heat generation amount.

2. the first opposing surface is formed by a first metal plate disposed opposite the first surface, the second opposing surface is formed by a second metal plate disposed opposite the second surface, The electronic device according to claim 1 , wherein at least a portion of the housing is formed by the first metal plate or the second metal plate.

3. The electronic device according to claim 2 , wherein the first metal plate is connected to at least one of the first heat generating component and the substrate by a first thermally conductive connecting member.

4. The electronic device according to claim 2 , wherein the second metal plate is connected to at least one of the second heat generating component and the substrate by a second thermally conductive connecting member.

5. The electronic device according to claim 3 , wherein at least a portion of the first connection member connects the first metal plate and a first wiring pattern provided on the substrate.

6. the first wiring pattern is electrically connected to a ground potential of the electronic device, The electronic device according to claim 5 , wherein the first metal plate is disposed so as to overlap at least a portion of the first heat generating component when viewed in a direction perpendicular to the substrate.

7. The electronic device according to claim 4 , wherein at least a portion of the second connection member connects the second metal plate and a second wiring pattern provided on the substrate.

8. the second wiring pattern is electrically connected to a ground potential of the electronic device, The electronic device according to claim 7 , wherein the second metal plate is disposed so as to overlap at least a portion of the second heat generating component when viewed in a direction perpendicular to the substrate.

9. the fan is attached to the second metal plate, and has a fan second surface facing the second metal plate in a direction perpendicular to the substrate, and a fan first surface opposite the fan second surface, and has an inlet formed in the fan first surface and an inlet formed in the fan second surface, the first opposing surface also faces an inlet formed in the first fan surface, and the second opposing surface also faces an inlet formed in the second fan surface, 3 . The electronic device according to claim 2 , wherein a distance between an inlet formed in the first fan surface and the first opposing surface is longer than a distance between an inlet formed in the second fan surface and the second opposing surface.

10. 2. The electronic device according to claim 1, wherein the first heat generating component is arranged so as to be at least partially located within a space between the air intake and the fan inlet when viewed in a direction perpendicular to the board.

11. 11. The electronic device according to claim 1 or 10, wherein the second heat generating component that generates the greatest amount of heat is positioned so as to be at least partially located within a space between the intake port and the fan inlet when viewed in a direction perpendicular to the board.

12. The air intake includes two air intakes, a first air intake and a second air intake, which are arranged spaced apart from each other on the same surface of the housing, a component that generates the largest amount of heat among the first heat generating components is disposed so as to be at least partially located within a space between the first air intake and an air inlet of the fan when viewed in a direction perpendicular to the board; 3. The electronic device according to claim 1, wherein the second heat generating component having the greatest heat generation amount is arranged so as to be at least partially located within a space between the second air intake and the air inlet when viewed in a direction perpendicular to the substrate.

13. a battery disposed within the housing; The electronic device according to claim 12 , wherein the battery is disposed closer to a space between the second intake port and the inlet than to a space between the first intake port and the inlet.

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