Device for boring and gripping, and gripping method

The device and method allow for efficient perforation and collection of objects by using a stopper and gripper mechanism to directly grasp and hold objects during and after perforation, addressing the limitations of conventional hole-sews.

JP2025012081APending Publication Date: 2025-01-24HITACHI GE NUCLEAR ENERGY LTD
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Patent Information

Application Number
JP2023114642
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-07-12
Publication Date
2025-01-24

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Abstract

To bore a hole in a boring object and recover a core and also grip and recover the boring object itself.SOLUTION: A device for boring and gripping includes: a hole saw 10 which bores a circular through-hole in a boring object with mechanical processing; a gripping device 4 which is provided in the hole saw for gripping the boring object; a stopper 5 which has a larger outer diameter than that of the hole saw and restricts the movement of the boring object; a body 9; a spring 7 for stopper which expands and contracts with the movement of the stopper; and a spring 8 for gripping device whose one end is connected to the hole saw and other end is connected to the gripping device. The hole saw bores a hole in the boring object, the boring object operates by coming into contact with the stopper, the gripping device extends to the outside of the body to restrict the movement of the boring object and grips the boring object.SELECTED DRAWING: Figure 1(a)
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Citation Information

Patent Citations

  • Boring device and boring method

    WO2014155649A1