Ois drive unit, camera module and mobile terminal

Abstract

To provide a camera module having a hand-shaking correction function.SOLUTION: The camera module comprises: a first printed circuit board on which an image sensor is mounted; a housing unit arranged above the first printed circuit board; a holder module arranged separately from the inner bottom surface of the housing unit at a predetermined space, with a first coil wound on the outer circumferential face, and including at least one lens in the inside; a second printed circuit board joined to the bottom surface of the holder module; a third printed circuit board 50 provided above the holder module; a plurality of wire springs 60, one end being connected to the second printed circuit board and the other end being connected to the third printed circuit board 50; and a buffer unit provided in the connection portion between the wire springs 60 and the third printed circuit board 50 and enclosing the connection portion between the wire springs and the third printed circuit board 50.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to an OIS driving unit, a camera module, and a mobile terminal. [Background technology]

[0002] Camera modules mounted on small electronic products are frequently subjected to shocks during use and may be subject to slight vibrations caused by the user's shaking when taking pictures, etc. Therefore, camera modules having means for preventing camera shake have been disclosed recently.

[0003] For example, Korean Patent No. 10-0741823 (registered on July 16, 2007) introduces a method of installing a gyro sensor IC or an angular velocity sensor inside a device with a camera module, such as a mobile phone, in order to correct the phenomenon of camera shake.

[0004] However, providing a separate angular velocity detection sensor in this manner requires a separate detection sensor to implement the anti-shake function, which not only increases manufacturing costs but also requires space to configure and install the anti-shake device separately from the camera module, which is inconvenient. Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present invention is to provide a camera module having an optical image stabilizer function. [Means for solving the problem]

[0006] The camera module according to the present invention includes a first printed circuit board having an image sensor mounted thereon, a housing unit disposed on an upper side of the first printed circuit board, a holder module disposed at a certain distance from an inner bottom surface of the housing unit, having a first coil wound around an outer circumferential surface and including at least one lens therein, a second printed circuit board coupled to a bottom surface of the holder module, a third printed circuit board disposed on an upper side of the holder module, a plurality of wire springs each having one end connected to the second printed circuit board and the other end connected to the third printed circuit board, and a buffer unit disposed at a connection portion between the wire springs and the third printed circuit board and surrounding the connection portion between the wire springs and the third printed circuit board.

[0007] It is preferable that the buffer unit includes at least one injection hole formed in the third printed circuit board in a periphery of a through hole to which the wire spring is connected, and a second wire spring through hole formed in the housing unit with an upper wide and lower narrow shape so as to be coaxial with the through hole of the third printed circuit board, and communicating with the injection hole via an upper opening.

[0008] The camera module may further include an adhesive material injected into the second wire spring through-hole through the injection hole.

[0009] It is preferable that the wire spring and the third printed circuit board are connected to each other through the through hole, and that the upper and lower surfaces of the third printed circuit board are also connected to each other through the through hole with a connecting material, which may be a conductive material such as lead.

[0010] It is preferable that the buffer unit includes a pair of injection holes formed on both sides of a first wire spring through-hole, the first wire spring through-hole being formed through the third printed circuit board and soldered to the wire spring, and a second wire spring through-hole formed through the housing unit in a shape that is wider at the top and narrower at the bottom so as to be coaxial with the first wire spring through-hole of the third printed circuit board, and communicating with the injection holes via an upper opening.

[0011] In addition, it is preferable that the camera module further includes an adhesive material injected into the second wire spring through-hole through the injection hole, and the adhesive material covers the inside of the second wire spring through-hole and the entire connecting portion formed on the upper side of the third printed circuit board. In this case, the adhesive material may be an epoxy.

[0012] It is preferable that the second wire spring through-hole includes an upper opening provided in the housing unit in a funnel shape that is wider at the top and narrower at the bottom, and a wire spring support hole provided coaxially with the through-hole.

[0013] The diameter of the second wire spring through hole may be the same as or larger than the diameter of the through hole.

[0014] It is preferable that the housing unit includes a first housing disposed above the first printed circuit board, a second housing disposed above the first housing and having the third printed circuit board provided thereon, first and second permanent magnets interposed between the first and second housings, and a yoke disposed between the first and second permanent magnets or on the inner surfaces of the first and second housings to transmit a magnetic force to the inside of the holder module.

[0015] It is preferable that the yoke has a central portion protruding toward the holder module.

[0016] The second housing and the third printed circuit board may be fixed together with double-sided tape.

[0017] The camera module may further include a shielding can having through holes at positions corresponding to the third printed circuit board, a connection portion of the wire spring, and a lens module, and surrounding the housing unit.

[0018] The holder module may include an outer blade having a first coil wound around its outer circumferential surface, a bobbin that is elastically supported by an elastic member on the upper side of the outer blade and is arranged inside the outer blade so as to be movable up and down, has a second coil wound around its outer circumferential surface, and has at least one lens attached therein, and upper and lower elastic members that are arranged above and below the bobbin, respectively, and elastically support the bobbin against the outer blade, and a space may be formed in the center of the first coil so that a magnetic force can be transmitted toward the second coil.

[0019] The wire spring may be made of a metal material and may be electrically connected to the second and third printed circuit boards.

[0020] At least six of the wire springs may be provided, and two polarities of power for autofocus control and four polarities of power for driving the OIS may be supplied to the holder module through connections with the second and third printed circuit boards.

[0021] The wire springs may have the same length and be disposed two at each corner of the holder module, making a total of eight.

[0022] According to a preferred embodiment of the present invention, there is provided a camera module including: a first printed circuit board having an image sensor mounted thereon; a housing unit disposed on an upper side of the first printed circuit board; a holder module disposed at a certain distance from an inner bottom surface of the housing unit, having a first coil wound around an outer circumferential surface thereof and including at least one lens therein; a second printed circuit board coupled to a bottom surface of the holder module; a third printed circuit board disposed on an upper side of the holder module; and a plurality of wire springs, one end of which is connected to the second printed circuit board and the other end of which is connected to the third printed circuit board, the wire springs being connected to upper and lower surfaces of the third printed circuit board by a connecting material via through holes formed through the third printed circuit board.

[0023] Meanwhile, the camera module may further include a surface treatment portion formed on both ends of the wire spring to improve a bonding strength between the wire spring and the second and third printed circuit boards.

[0024] The surface treatment portion may be formed by polishing the surface of the wire spring to make it rough, or by removing a coating film from the wire spring. Effect of the Invention

[0025] Since the present invention has a buffer unit capable of absorbing a load repeatedly applied to the wire spring, the wire spring can be firmly connected to the connection portion of the printed circuit board.

[0026] In addition, even if the wire spring is subjected to excessive force during the assembly process of the lens module, the excessive force can be absorbed by the buffer unit, improving the ease of assembly and minimizing the loss of parts due to assembly defects. [Brief description of the drawings]

[0027] [Figure 1]1 is a schematic plan view of a camera module according to an embodiment of the present invention; [Diagram 2] 2 is a cross-sectional view taken along line AA in FIG. 1. [Diagram 3] FIG. 2 is a side view of a camera module according to an embodiment of the present invention. [Figure 4] FIG. 2 is a side view of a camera module according to an embodiment of the present invention. [Diagram 5] FIG. 3 is an enlarged view of part B of FIG. 2 according to the first embodiment of the present invention. [Figure 6] FIG. 3 is an enlarged view of part B of FIG. 2 according to a second embodiment of the present invention. [Figure 7] FIG. 4 is an enlarged view of part B of FIG. 2 according to third and fourth embodiments of the present invention. [Figure 8] FIG. 11 is a diagram showing a surface treatment portion of a wire spring according to a third embodiment of the present invention. [Figure 9] FIG. 13 is a diagram showing a surface treatment portion of a wire spring according to a fourth embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0028] Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

[0029] FIG. 1 is a schematic plan view of a camera module according to one embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line AA of FIG. 1, FIG. 3 is a side view of a camera module according to one embodiment of the present invention, FIG. 4 is an enlarged view of part B of FIG. 2 according to a first embodiment of the present invention, and FIG. 5 is an enlarged view of part B of FIG. 2 according to a second embodiment of the present invention.

[0030] As shown in FIG. 1 which is a schematic plan view, and FIG. 2 which is a schematic side view showing a cross section along line AA of FIG. 1, the camera module according to the present invention includes a first printed circuit board 10, a housing unit 20, a holder module 30, a second printed circuit board 40, a third printed circuit board 50, a wire spring 60, and a buffer unit 100.

[0031] The first printed circuit board 10 preferably includes a PCB board and has the image sensor 11 mounted approximately in the center. The first printed circuit board 10 may have components for operating the image sensor 11 arranged thereon and may have a plurality of terminals for supplying power and outputting information from the image sensor 11.

[0032] The housing unit 20 is disposed on the upper side of the first printed circuit board 10 and forms a framework of the camera module. According to a preferred embodiment of the present invention, the housing unit 20 includes a first housing 21, a second housing 22, first and second permanent magnets 23 and 24, and a yoke 25.

[0033] The first housing 21 is a base, and is disposed on the upper side of the first printed circuit board 10 at a certain distance from the image sensor 11. The first housing 21 may further include a filter member for filtering an image incident on the image sensor 11, if necessary.

[0034] The second housing 22 is disposed above the first housing 21 and configured to cover the first housing 21. An opening is formed in the approximate center of the second housing 22 at a position corresponding to the position through which an image is transmitted to the image sensor 11. A third printed circuit board 50, which will be described later, is fixed to the upper side of the second housing 22 by a fixing member such as double-sided tape or adhesive, but this is not limited thereto. Depending on the product design, a separate third housing such as a case or a shielding can may be provided, and the third printed circuit board 50 may be fixed to the inner side of the case by the above-mentioned fixing member. When the third housing is provided, the third printed circuit board 50 may be pressed and supported by the third housing without a separate fixing member.

[0035] The first and second permanent magnets 23, 24 are sandwiched between the first and second housings 21, 22 and transmit magnetic force to the holder module 30. The first and second permanent magnets 23, 24 may be of the same size. Furthermore, the first and second permanent magnets 23, 24 and the yoke 25 may be disposed on the inner surfaces of the first and second housings, if possible, within the design tolerance range.

[0036] On the other hand, as the size of the first and second permanent magnets 23, 24 increases, the OIS drive becomes larger even with a small current, and in the event that the size of the first and second permanent magnets 23, 24 is configured to be constant, the OIS drive becomes larger as the current flowing through the first and second coils 31a, 32a arranged at positions corresponding to the first and second permanent magnets 23, 24 is increased. In short, the larger the size of the first and second permanent magnets 23, 24, the better the OIS drive, but it is preferable to design the optimal size taking other design allowable values ​​into consideration.

[0037] The yoke 25 is sandwiched between the first and second permanent magnets 23, 24. The yoke 25 has a shape that protrudes near the center so that the magnetic force of the first and second permanent magnets 23, 24 can be transmitted to the internal space of the holder module 30. Preferably, the yoke 25 has the same width as the first and second permanent magnets 23, 24 and is configured so that the center protrudes by a certain amount, so that the permanent magnets and the yoke are roughly "T" shaped.

[0038] The holder module 30 is disposed at a certain distance from the inner bottom surface of the housing unit 20 and is composed of an outer blade 31 and a bobbin 32. The holder module 30 is suspended from a wire spring 60 and can perform pendulum motion in the front-back, left-right and diagonal directions.

[0039] Spring members 35, 36 are provided on the upper and lower sides of the outer blade 31, and the bobbin 32 is elastically supported by the spring member 35 and connected so as to be capable of vertical movement.

[0040] 1, a total of four first coils 31a-31d are wound around the outer circumferential surface of four side surfaces of the outer blade 31, and the center portions of the four side surfaces around which the coils 31a-31d are wound are open and do not include a coil. The yoke 25 is disposed at a position corresponding to this open space, and the yoke 25 may be configured to be partially inserted inside this space.

[0041] The second printed circuit board 40 may be fixed to the bottom surface of the outer blade 31 with a fixing member 33 such as double-sided tape or adhesive. The outer blade 31 is suspended from a plurality of wire springs 60 so that it can move forward, backward, left, right or diagonally as shown by the arrows in Fig. 2 by the interaction between the magnetic force of the first and second permanent magnets 23, 24 and the first coil 31a, and is disposed at a predetermined distance from the bottom surface of the first housing 21.

[0042] In addition, the outer blade 31 may have a plurality of spring through holes 37 through which the wire springs 60 pass to be connected to the second printed circuit board 40 .

[0043] The bobbin 32 is disposed inside the outer blade 31 so as to be movable up and down, and at least one lens 34 is attached inside the bobbin 32. A second coil 32a is wound around the outer circumferential surface of the bobbin 32, and the second coil 32a moves the bobbin 32 up and down by interacting with a magnetic force transmitted from the yoke 25 through an open space of the outer blade 31 where the first coils 31a to 31d are not provided. The larger the yoke 25, the better the AF drive, but this may also vary depending on the optimum design value. The lifting and lowering action of the bobbin 32 makes it possible to automatically adjust the focus of the image transmitted to the image sensor 11.

[0044] As described above, the second printed circuit board 40 is disposed on the bottom surface of the outer blade 31, and the wire spring 60 is connected to supply power to the first and second coils 31a and 32a. The connection method may be any method that connects the coils by soldering or other conductive materials. That is, the connection portion w' of the second printed circuit board 40 is connected to the first and second coils 31a and 32a, respectively, as shown in FIG. 2, and transmits the power supplied through the wire spring 60 to the first and second coils 31a and 32a to generate electromagnetic force.

[0045] In this case, the second coil 32a may be directly connected to the second printed circuit board 40, or, as shown in FIG. 2, may be first connected to the lower spring 36, and then the lower spring 36 may be connected to the second printed circuit board 40.

[0046] The third printed circuit board 50 is fixed to the upper side of the second housing 22 by a fixing member such as double-sided tape or an adhesive member as described above, and power transmitted through the terminal portion 52 of the third printed circuit board 50 connected to the first printed circuit board 10 is transmitted to the second printed circuit board 40 through the wire spring 60 connected together with the second printed circuit board 40. Any connection method may be used as long as it is connected by soldering or other conductive material.

[0047] As shown in Figures 3 and 4, the third printed circuit board 50 is arranged to cover one side wall surface of the first and second housings 21, 22, and a window 55 is formed on the surface facing the first and second permanent magnets 23, 24 and the yoke 25, so that interference therewith can be avoided.

[0048] This is because the first and second permanent magnets 23, 24 and the yoke 25 are mainly attached directly to the shield can 70, which will be described later, by a fixing means such as epoxy.

[0049] Meanwhile, the second printed circuit board 40 and the third printed circuit board 50 may be a flexible printed circuit board (FPCB), a printed circuit board (PCB) or an R-FPCB (rigid FPCB integrated type), but are not limited thereto, and any board that can be electrically connected may be used.

[0050] Both ends of the wire spring 60 are connected to the second and third printed circuit boards 40 and 50. At this time, one end of the wire spring 60 is connected to a pad 51 formed on the third printed circuit board 50 as shown in Fig. 5, and a through hole 53 through which the wire spring 60 passes is formed in the center of the pad 51. Any connection method can be used as long as it is connected by soldering or other conductive material. Meanwhile, a solder register (SR) is provided around the pad 51 to protect the surface of the third printed circuit board 50, and the pad 51 area can be connected electrically by opening the solder register.

[0051] In this manner, the wire spring 60 connected at the pad 51 supplies power supplied from the terminal portion 52 to the second printed circuit board 40, enabling the first and second coils 31a, 32a to interact with the first and second permanent magnets 23, 24.

[0052] 2, the other end of the wire spring 60 passes through a spring through hole 37 formed in the outer blade 31 and is connected to the second printed circuit board 40 provided on the bottom surface of the outer blade 31. At this time, the other end of the wire spring 60 is connected to a pad (not shown) formed on the second printed circuit board 40, similar to the third printed circuit board 50, and a through hole (not shown) through which the wire spring 60 passes is formed in the center of the pad (not shown). The connection method may be any method that is connected by soldering or other conductive material. With this configuration, the outer blade 31 is suspended from the wire spring 60 and can be spaced apart from the bottom surface of the first housing 21 by a certain distance or more. Therefore, the outer blade 31 performs a pendulum motion due to the interaction between the first coil 31a and the first and second permanent magnets 23, 24, and vibration of the outer blade 31 due to hand shake can be corrected by the interaction between the first coil 31a and the first and second permanent magnets 23, 24. For this reason, the wire spring 60 is preferably made of a metallic material that has elasticity to withstand impact and is electrically conductive.

[0053] On the other hand, the smaller the thickness of the wire spring 60, the better the image stabilization movement will be even for a small current, but this may vary depending on the optimum design value. Preferably, the thickness of the wire spring 60 is several μm to several hundred μm, and more preferably, 1 to 100 μm.

[0054] In addition, it is preferable that at least six wire springs 60 are provided because at least two polarities of power for autofocus control and four polarities of power for image stabilization need to be supplied to the holder module 30 through the connection with the second and third printed circuit boards 40 and 50.

[0055] According to a preferred embodiment of the present invention, as shown in Figures 1 and 2, the wire springs 60 are of the same length and are arranged in two at each corner of the holder module 30, for a total of eight, for balance.

[0056] Meanwhile, in the case where a separate third housing such as a shielding can 70 is further included as shown in FIG. 2, the first and second permanent magnets 23, 24 and the yoke 25 are bonded to the shielding can 70 with epoxy or the like as described above, so that the third printed circuit board 50 has a window 55 formed therein to cover the side walls of the first and second housings 21, 22 in order to avoid the bonding portions.

[0057] If the shielding can 70 is omitted, it is also possible to form the third printed circuit board 50 from a PCB or the like and attach and fix the first and second permanent magnets 23, 24 and the yoke 25 inside it. As described above, it is also possible to form the third printed circuit board 50 from a PCB and provide the above-mentioned window 55, insert the first and second permanent magnets 23, 24 and the yoke 25 into the window 55, and further reinforce the outside with shielding tape or the like.

[0058] The buffer unit 100 encases the wire spring 60 and the connection portion w of the third printed circuit board 50 to absorb impacts and repeated loads applied to the wire spring 60 .

[0059] According to a preferred embodiment of the present invention, the buffer unit 100 includes an injection hole 110 and a second wire spring through hole 120 .

[0060] The injection hole 110 is formed near the through hole 53 to which the wire spring 60 passing through the third printed circuit board 50 is soldered. According to the first embodiment of the present invention, one injection hole 110 may be formed as shown in FIG.

[0061] The second wire spring through hole 120 is provided in the second holder 22. The second wire spring through hole 120 includes an upper opening 121 and a support hole 122.

[0062] The upper opening 121 is preferably in a funnel shape that is wider at the top and narrower at the bottom as shown in Figures 5 and 6. The support hole 122 is formed coaxially with the through hole 53 and has a diameter equal to or larger than that of the through hole 53.

[0063] It is preferable that the diameter of the through hole 53 is slightly larger than that of the wire spring 60. When the wire spring 60 is connected to the pad 51 formed on the third printed circuit board 50, a connecting material 101 such as solder or other conductive material can flow down through the through hole 53 and be connected to and fixed to the wire spring 60 on both the upper and lower surfaces of the third printed circuit board 50 as shown in FIGS. 5 and 6.

[0064] The diameter of the support hole 122 is preferably slightly larger than that of the wire spring 60, and may be formed to be the same as or larger than the diameter of the through hole 53. In other words, the wire spring 60 can be designed so as not to come into contact with the second holder 22 near the support hole 122 and cause interference.

[0065] The adhesive material 130 is injected through the injection hole 110 and filled in the internal space of the second wire spring through hole 120 as shown in Fig. 5. The adhesive material 130 may also be added to cover the connection portion w of the third printed circuit board 50. The adhesive material 130 filled in the second wire spring through hole 120 absorbs impact and load transmitted to the connection portion w of the wire spring 60 and the third printed circuit board 50 and prevents the wire spring 60 from swinging inside the upper opening 121 of the second wire spring through hole 120. The adhesive material 130 may be epoxy, but is not limited thereto, and any material that can be bonded and elastically supported may be used.

[0066] According to the second embodiment of the present invention, the buffer unit 100 is configured in the same manner as the first embodiment, but the two injection holes 110 are paired and may be arranged on either side of the through hole 53 or may be arranged symmetrically, but the positions are not limited thereto.

[0067] In this case, the adhesive 130 injected through the pair of injection holes 110 may completely cover not only the inside of the upper opening 121 of the second wire spring through hole 120, but also the connecting portion w formed on the upper side of the third printed circuit board 50, as shown in FIG. 6.

[0068] According to this configuration, the connection portion w of the third printed circuit board 50 exposed at the upper part can be prevented from being damaged by an external impact, and further, the effect of insulating the connection portion w can be obtained.

[0069] Meanwhile, the general assembly sequence is to couple the bobbin 32 and the outer blade 31, then couple the second housing 22, the second and third printed circuit boards 40, 50, and the wire spring 60 using a jig, couple the bobbin 32 with the lens barrel, and then couple the first housing 21 and mount it on the first printed circuit board 10. The permanent magnet and the yoke may be coupled before coupling the first housing 21. This assembly sequence may be changed as necessary. That is, it is also possible to assemble directly on the equipment without using a jig. In this process, even if the force for inserting and coupling the bobbin 32 with the lens barrel is too large and puts strain on the coupling part w, the excessive force can be absorbed by the buffer unit 100.

[0070] That is, as shown in Figures 2, 5 and 6, when a load is generated on the wire spring 60 near the connection portion w between the wire spring 60 and the third printed circuit board 50 and the wire spring 60 is pulled in the direction of gravity or sways left and right, the buffer unit 100 absorbs the load as deformation energy of the buffer unit 100.

[0071] Therefore, it is possible to prevent problems such as having to repeat the connecting work due to damage to the connecting portion w during the assembly process or making the parts unusable, and it is possible to produce a more reliable camera module.

[0072] The surface treatment portion 1100 is formed on both ends of the wire spring 60 to improve the connection between the second and third printed circuit boards 40 and 50 and the wire spring 60 .

[0073] According to the third and fourth preferred embodiments of the present invention, the surface treatment part 1100 may be formed by polishing the surface of the wire spring 60 to make it rough, as shown in Fig. 8, or by removing part of the coating film formed on the surface of the wire spring 60 by a method such as corrosion, as shown in Fig. 9. By forming the surface treatment part 1100 in this manner, the bonding strength between the lead and the wire spring 60 can be improved when a soldering process using lead as a connecting material is performed.

[0074] On the other hand, the second holder 22 is provided with a second wire-passing hole 120 as shown in FIG.

[0075] The upper opening 121 is funnel-shaped and narrows as it goes downward, and the wire spring support hole 122 is formed coaxially with the first wire passage hole 53 and preferably has the same diameter as or a larger diameter than the first wire passage hole 53.

[0076] Here, the diameter of the first wire-through hole 53 may be formed to be slightly larger than the diameter of the wire spring 60, and may be designed such that when the wire spring 60 is connected to the pad 51 formed on the third printed circuit board 50, a connecting material such as solder or other conductive material flows down along the first wire-through hole 53 to be connected and fixed to the wire spring 60 on both the upper and lower surfaces of the third printed circuit board 50.

[0077] In addition, the diameter of the wire spring support hole 122 may be formed to be slightly larger than the diameter of the wire spring 60, and may be formed to be the same diameter as or larger than the first wire through-hole 53. In other words, it is sufficient to design the wire spring 60 so that it does not come into contact with the second holder 22 near the wire spring support hole 122 and cause interference.

[0078] According to this configuration, the wire spring 60 can be more firmly connected to the second and third printed circuit boards 40, 50, and reliability issues such as separation and breakage of the wire spring 60 that may occur due to external forces such as being dropped can be improved.

[0079] That is, as shown in Figures 2, 8 and 9, the surface treatment unit 1100 increases the frictional force between the wire spring 60 and the connection parts w, w' of the second and third printed circuit boards 40, 50, so as to maximize the resistance to the load in the direction of gravity applied to the wire spring 60 at the connection parts w, w' and the load generated when it swings left and right.

[0080] Therefore, it is possible to prevent problems such as having to repeat the connecting work due to damage to the connecting portion w during the assembly process or making the parts unusable, and it is possible to produce a more reliable camera module.

[0081] Meanwhile, although not shown, the surface treatment portion 1100 may be formed only on one end of the wire spring 60. That is, it may be formed only on the connection portion w of the third printed circuit board 50 which is subjected to a large repetitive load, or it may be formed only on the connection portion w' of the second printed circuit board 40.

[0082] Meanwhile, the housing unit 21, 22 may further include a shielding can 70 having a through hole at a position corresponding to the lens module 30 around the connection portion w of the third printed circuit board 50 and the wire spring 60, and arranged to surround the housing units 21, 22. In this case, as described above, the third printed circuit board 50 may be attached and fixed to the inner peripheral surface of the shielding can 70. Meanwhile, the shielding can 70 is not essential and may be omitted depending on the configuration of the housing units 21, 22.

[0083] 2, a hook unit 80 can be provided on four surfaces or at least one surface in order to fasten the shielding can 70 to the first housing 21. The position of the hook unit 80 may be within the range permitted by the design of the center or edge, and the number of hook units may be one or more.

[0084] The hook unit 80 may be composed of a hook 81 protruding from the first housing 21 and a hook hole 82 formed through the shielding can 70 opposite the hook 81, or the reverse configuration is also possible if necessary.

[0085] The embodiments of the present invention described above and shown in the drawings should not be construed as limiting the technical idea of ​​the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and it is obvious that a person skilled in the art with ordinary knowledge in the technical field of the present invention can make various modifications without departing from the technical idea of ​​the present invention. Therefore, if these modifications are obvious to a person skilled in the art, they can belong to the scope of protection of the present invention.

Claims

1. base; a first substrate disposed on the base and including a terminal; a holder module including an outer blade, a bobbin disposed within the outer blade, and a spring member connecting the bobbin and the outer blade, the holder module being disposed apart from the base; a first coil disposed on the bobbin; a magnet facing the first coil; a second coil facing the magnet; a wire coupled to the holder module; and a buffer portion disposed on a portion of the wire and including an adhesive material; the holder module includes first to fourth corner portions, the first coil is electrically connected to the wire; The wire is disposed at the first to fourth corners of the holder module, The wires include six wires spaced apart from one another; An OIS driving unit, characterized in that two of the six wires are arranged in the first corner portion, and the other two of the six wires are arranged in the third corner portion.

2. The OIS driving unit of claim 1 , wherein the first substrate includes a first portion disposed on the base and a second portion bent and extending from the first portion.

3. The OIS driving unit of claim 1 or 2, wherein two of the six wires are electrically connected to the first coil.

4. The OIS driving unit of claim 1 or 2, wherein the two wires disposed in the first corner portion are electrically connected to the first coil.

5. The OIS driving unit of claim 1 , wherein the terminals are a plurality of terminals, and the six wires are electrically connected to different terminals among the plurality of terminals.

6. The OIS driving unit of claim 1 , wherein the first corner portion and the third corner portion are disposed on opposite sides of an optical axis.

7. The OIS driving unit of claim 1 , wherein the first corner portion and the third corner portion are diagonal to each other.

8. The OIS driving unit according to claim 1 , wherein the buffer portion is configured to absorb an impact or a load applied to the wire.

9. The OIS driving unit of claim 1 , wherein the wire connects the holder module and the first portion of the first substrate.

10. the first substrate further includes a pad formed on the first portion; The pad is formed with a hole through which the wire passes, The OIS driving unit of claim 1 , wherein the wire passes through the hole and is connected to the pad by soldering.

11. The OIS driving unit of claim 10 , wherein a solder resistor is disposed around the pad to form a surface of the first substrate.

12. a first soldering portion for connecting the wire to the holder module, and a second soldering portion for connecting the wire to the first portion of the first substrate, The OIS driving unit of claim 9 , wherein a distance between the first soldering portion and the second soldering portion is longer than a distance between the first portion of the first substrate and the spring member.

13. the first portion of the first substrate includes a first surface facing the holder module and a second surface disposed on an opposite side to the first surface; The OIS driving unit according to claim 9 or 12, wherein the wire is coupled to the second surface of the first portion of the first substrate.

14. The OIS driving unit according to claim 12 , wherein a portion of the buffer portion is disposed between the first soldering portion and the second soldering portion.

15. The OIS driving unit according to claim 1 , wherein a virtual straight line connecting the two wires arranged at the first corner portion is arranged diagonally with respect to a side surface of the outer blade.

16. The OIS driving unit of claim 1 , wherein at least a portion of the second portion of the first substrate extends along an outer surface of the base.

17. The OIS driving unit of claim 1 , wherein the terminals of the first substrate include at least six terminals for supplying current to the first coil and the second coil.

18. a shield can for receiving the holder module therein; The OIS driving unit of claim 1 , wherein the first coil is electrically connected to the spring member.

19. The OIS driving unit according to claim 15 , wherein the two wires arranged in the first corner portion are arranged at the same distance from the optical axis.

20. An OIS driving unit according to any one of claims 1 to 19; a second substrate disposed below the base; an image sensor disposed on the second substrate; and further comprising a lens coupled to the bobbin; A camera module, wherein the terminals of the first substrate are coupled to the second substrate by soldering.

21. A mobile terminal comprising the camera module of claim 20.

22. base; a substrate disposed on the base and including a plurality of terminals; a holder module including an outer blade, a bobbin disposed within the outer blade, and a spring member connecting the bobbin and the outer blade, the holder module being disposed apart from the base; a first coil disposed on the bobbin; a magnet facing the first coil; a second coil facing the magnet; a wire coupled to the holder module; and an adhesive material disposed on a portion of the wire; the holder module includes first to fourth corner portions, the first coil is electrically connected to the wire; The wire is disposed at the first to fourth corners of the holder module, The wire includes a plurality of wires spaced apart from one another, Two wires of the plurality of wires are disposed at the first corner portion, and the other two wires of the plurality of wires are disposed at the third corner portion; The OIS driving unit, wherein each of the two wires disposed at the first corner portion is electrically connected to a different terminal among the plurality of terminals.

23. the wire connects the holder module and the substrate; the substrate includes a pad having a hole through which the wire passes; the wire passes through the hole and is connected to the pad by soldering; the plurality of terminals of the substrate include at least six terminals for supplying current to the first coil and the second coil; the first coil is electrically connected to the spring member; The two wires arranged at the first corner portion are arranged at the same distance from the optical axis, The OIS driving unit of claim 22, wherein the first corner portion and the third corner portion are disposed on opposite sides of an optical axis.

24. base; a substrate disposed on the base; a holder module including an outer blade, a bobbin disposed within the outer blade, and a spring member connecting the bobbin and the outer blade, the holder module being disposed apart from the base; a first coil disposed on the bobbin; a magnet facing the first coil; a second coil facing the magnet; a wire connecting to the holder module; and An OIS drive unit comprising an adhesive material disposed on a portion of the wire.

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