Integrated sealing sheet, light emitting electronic component and method for manufacturing light emitting electronic component

Abstract

To provide an integrated sealing sheet with a protective layer having higher durability, a light emitting electronic component using the sheet, and a method for manufacturing a light emitting electronic component.SOLUTION: It relates to an integrated sealing sheet 1 designed to be crimped onto a surface on which a plurality of light emitting elements 21, 22, 23 are arranged in a substrate 2 with elements, in which a plurality of light emitting elements 21, 22, 23 are arranged in the substrate 20, and comprising at least a curable resin layer 15 and a glass layer 12, a light emitting electronic component and a method for manufacturing the light emitting electronic component.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an integrated encapsulating sheet, a light-emitting electronic component, and a method for manufacturing a light-emitting electronic component. [Background technology]

[0002] In recent years, displays using extremely small light-emitting diodes called mini-LEDs or micro-LEDs have been attracting attention. There are roughly two known methods for using such extremely small light-emitting diodes in displays. One is to arrange a large number of light-emitting diodes on a substrate to form a backlight for liquid crystal, and to locally control the brightness of the backlight. The other is to make light-emitting diodes of each color (red, green, and blue) emit light, sending each color of light to the viewer's eyes on a pixel-by-pixel basis.

[0003] Light-emitting diodes such as mini LEDs or micro LEDs are generally arranged on a substrate. When multiple light-emitting diodes (referred to as light-emitting elements) are arranged on a substrate, it is necessary to prevent light diffusion between adjacent light-emitting elements. As a method for shielding light between multiple light-emitting elements with a resin having a light diffusion prevention function, for example, a method using a dry film is known (see Patent Document 1). The dry film is a film obtained by applying and drying a light-shielding resin composition on a protective film.

[0004] When the dry film is pressed onto a substrate from above a number of light-emitting elements, a light-shielding resin layer is formed not only in the gaps between the light-emitting elements but also on the upper surface (light-emitting surface) of the light-emitting elements. Under such circumstances, the resin layer may block light from reaching the viewer of the display. To prevent this, the above-mentioned conventional technology employs a method in which the light-emitting surface of the light-emitting element is etched by plasma treatment or the like to remove the resin layer on the light-emitting surface, and the removed surface is covered with a light-transmitting sealant. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent Publication No. 2022-22562 Summary of the Invention [Problem to be solved by the invention]

[0006] However, the above-mentioned conventional technology requires a long time for the etching process, which leads to an increase in manufacturing costs. Also, it is difficult to completely remove the resin layer on the light-emitting surface of the light-emitting element, and as a result, it is difficult to completely prevent the diffusion of light that should reach the viewer side of the display. In addition, a step of laminating a highly transparent sealing film is required after the etching process, which increases the number of manufacturing processes.

[0007] In view of the above problems, the present inventors have developed an integrated encapsulating sheet having one or more curable resin layers formed on one surface of a film substrate prior to the present invention. The inventors have found that a structure that can reduce light diffusion between light-emitting elements and does not block light emitted from the light-emitting elements can be realized by pressing the integrated encapsulating sheet against a light-emitting element so that the curable resin layer side faces the light-emitting surface side of the light-emitting element and curing the curable resin layer.

[0008] In the above-mentioned integrated encapsulating sheet, a protective layer is formed on the surface of the film substrate opposite to the surface on which the curable resin layer is formed. The protective layer is a resin layer and has a certain degree of durability that can withstand use in a display, but a layer having higher durability is also required.

[0009] The present invention has been made to solve the above problems, and aims to provide an integrated encapsulating sheet having a protective layer with higher durability, a light-emitting electronic component using the sheet, and a method for manufacturing a light-emitting electronic component. [Means for solving the problem]

[0010] (1) An integrated encapsulating sheet according to one embodiment for achieving the above object comprises: An integrated encapsulating sheet for pressure-bonding to a surface on which a plurality of light-emitting elements are arranged in an element-mounted substrate having a substrate on which a plurality of light-emitting elements are arranged, At least a curable resin layer and a glass layer are laminated. (2) In the integrated encapsulating sheet according to another embodiment, preferably, the curable resin layer includes at least a black curable resin layer and a transparent curable resin layer having a higher light transmittance than the black curable resin layer, The transparent curable resin layer may be formed between the black curable resin layer and the glass layer. (3) In the integrated encapsulating sheet according to another embodiment, preferably, the glass layer may have a thickness of 30 to 70 μm. (4) In order to achieve the above object, a light-emitting electronic component according to one embodiment comprises: a substrate having a plurality of light-emitting elements disposed thereon; an integrated encapsulating cured sheet pressure-bonded to a surface of the element-mounted substrate on which the plurality of light-emitting elements are arranged, the integrated encapsulating cured sheet includes at least a resin layer that is transmissible to light emitted from the light-emitting element and a glass layer laminated thereon, the resin layer and the glass layer being laminated in this order from the side closer to the element-mounted substrate, A portion of the resin layer is filled between the plurality of light emitting elements. (5) In the light-emitting electronic component according to another embodiment, preferably, the resin layer includes at least a black resin layer and a transparent resin layer having a higher light transmittance than the black resin layer, the black resin layer is formed between the element-mounted substrate and the transparent resin layer, the thickness of the transparent resin layer is 0.1 to 5.0 times the height of the plurality of light-emitting elements; The thickness of the black resin layer may be 0.1 to 0.9 times the height of the plurality of light emitting elements. (6) A method for producing a light-emitting electronic component according to one embodiment of the present invention for achieving the above object includes the steps of: A step of pressure-bonding the integrated encapsulating sheet described above to a surface of an element-mounted substrate on which a plurality of light-emitting elements are arranged; filling a portion of the curable resin layer between the plurality of light-emitting elements; and curing the curable resin layer. Effect of the Invention

[0011] According to the present invention, it is possible to provide an integrated encapsulating sheet having a protective layer with higher durability, a light-emitting electronic component using the sheet, and a method for producing a light-emitting electronic component. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 shows a cross-sectional view of an integrated encapsulating sheet according to one embodiment when cut along the thickness direction. [Diagram 2] FIG. 2 shows a cross-sectional view seen in the same manner as FIG. 1 when the integrated encapsulating sheet of FIG. 1 is disposed so that the black curable resin layer thereof is in contact with the top surface of the light emitting element of the element-mounted substrate. [Diagram 3] FIG. 3 shows a cross-sectional view, as seen from FIG. 1, of a state in which the integrated encapsulating sheet has been pressure-bonded to the element-mounted substrate, proceeding from the stage shown in FIG. 2 up to a state in which a part of the black curable resin layer shown in FIG. 1 is embedded between the light-emitting elements. [Figure 4] FIG. 4 shows a cross-sectional view, seen from the same angle as FIG. 1, of a light-emitting electronic component manufactured by proceeding further from the stage shown in FIG. 3, peeling off the protective sheet on the glass layer, and carrying out a curing treatment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Next, an embodiment of the present invention will be described with reference to the drawings. Note that the embodiment described below does not limit the invention according to the claims, and not all of the elements and combinations described in the embodiment are necessarily essential to the solution of the present invention. In addition, in this specification and claims, a numerical range expressed by "~" means a numerical range with the numerical values ​​before and after ~ as the lower and upper limits.

[0014] FIG. 1 shows a cross-sectional view of an integrated encapsulating sheet according to an embodiment when cut along the thickness direction. FIG. 2 shows a cross-sectional view of the integrated encapsulating sheet of FIG. 1 when the black curable resin layer is disposed in contact with the top surface of the light-emitting element of the element-mounted substrate. FIG. 3 shows a cross-sectional view of the integrated encapsulating sheet of FIG. 1 when the integrated encapsulating sheet is pressed against the element-mounted substrate until a part of the black curable resin layer of FIG. 1 is embedded between the light-emitting elements, proceeding from the stage of FIG. 2. FIG. 4 shows a cross-sectional view of the light-emitting electronic component of FIG. 1 produced by peeling off the protective sheet on the glass layer and performing a curing treatment, proceeding further from the stage of FIG. 3.

[0015] 1. Integrated encapsulating sheet The integrated encapsulating sheet 1 is an encapsulating sheet that is pressure-bonded to a surface of an element-mounted substrate 2, in which a plurality of light-emitting elements 21, 22, 23 are arranged on a substrate 20. The integrated encapsulating sheet 1 is formed by laminating at least a curable resin layer 15 capable of transmitting light emitted from the light-emitting elements 21, 22, 23 and a glass layer 12. The curable resin layer 15 is in a pre-cured state of a resin layer 45 capable of transmitting light emitted from the light-emitting elements 21, 22, 23.

[0016] The curable resin layer 15 preferably includes at least a black curable resin layer 10 and a transparent curable resin layer 11 having higher light transmittance than the black curable resin layer 10. In this case, the transparent curable resin layer 11 is formed between the black curable resin layer 10 and the glass layer 12. When the integrated encapsulating sheet 1 is not in use, the black curable resin layer 10 and the transparent curable resin layer 11 are uncured layers. In this embodiment, the curable resin layer 15 includes the black curable resin layer 10 and the transparent curable resin layer 11.

[0017] For ease of handling, the integrated encapsulating sheet 1 may further include a protective sheet on the outer surface of either one or both of the black curable resin layer 10 and the glass layer 12. FIG. 1 shows an example of the integrated encapsulating sheet 1 having protective sheets 13, 14 on the outer surfaces of both the black curable resin layer 10 and the glass layer 12. More specifically, the integrated encapsulating sheet 1 has a structure in which a protective sheet 14, a glass layer 12, a transparent curable resin layer 11, a black curable resin layer 10, and a protective sheet 13 are laminated in this order. Each layer constituting the integrated encapsulating sheet 1 will be described below.

[0018] (1) Black curable resin layer The black curable resin layer 10 is a layer for preventing light diffusion between the light emitting elements 21, 22, 23 and improving the contrast of the display. The black curable resin layer 10 also serves to sufficiently fill the gaps between the multiple light emitting elements 21, 22, 23 arranged on the element-mounted substrate 2 in a pressure bonding process represented by thermocompression bonding, and to prevent poor appearance due to expansion of unfilled gaps in a hardening process represented by thermosetting, and damage to the light emitting elements 21, 22, 23 due to external factors in a later process.

[0019] [Lab value] The Lab values ​​of the black curable resin layer 10 in a cured state measured in accordance with JIS Z8722 using a light source of D65, a field of view of 2°, and a transmission method are preferably L: 5 to 60, a: -3 to 7, and b: -20 to 20, and more preferably L: 10 to 50, a: -2 to 5, and b: -15 to 15. When the Lab values ​​in the cured state are within the preferred ranges, the black curable resin layer 10 can better prevent light diffusion between the light emitting elements 21, 22, and 23 after curing, and can further improve the contrast of the display.

[0020] [Total light transmittance] The total light transmittance of the black curable resin layer 10 in a cured state is lower than that of the transparent curable resin layer 11 in a cured state. Specifically, the black curable resin layer 10 is prepared so that the total light transmittance of the black curable resin layer 10 in a cured state is 0 to 50%. The total light transmittance of the black curable resin layer 10 in a cured state is preferably prepared so that the total light transmittance is 0 to 40%, more preferably 0 to 30%. When the total light transmittance is equal to or less than the upper limit value such as 50%, 40%, or 30%, the black curable resin layer 10 can further prevent light diffusion between the light emitting elements 21, 22, and 23 after curing. The total light transmittance in this specification can be measured by a haze meter in accordance with JIS K 7136. The total light transmittance in a cured state can be changed mainly by the presence or absence of carbon black or the amount of carbon black. The total light transmittance in a cured state can also be changed by the thickness of the black curable resin layer 10 and the type of resin composition.

[0021] [Storage modulus] The storage modulus of the black curable resin layer 10 in an uncured state is preferably smaller than the storage modulus of the transparent curable resin layer 11 in an uncured state. The storage modulus of the black curable resin layer 10 in an uncured state at 100° C. is preferably 1.0×10 5 Pa or less, more preferably 1.0×10 2 Pa or more 1.0×10 5 Pa or less, and even more preferably 1.0×10 3 Pa or more 5.0×10 4Pa or less. In an uncured state, the storage modulus of the black curable resin layer 10 at 100°C is a preferred upper limit or less, so that the black curable resin layer 10 exhibits sufficient fluidity when pressure-bonded to the element-mounted substrate 2, and can sufficiently fill the gaps between the light-emitting elements 21, 22, 23 by following the unevenness of the element-mounted substrate 2 due to the light-emitting elements 21, 22, 23. In an uncured state, the storage modulus of the black curable resin layer 10 at 100°C is a preferred lower limit or more, so that pressure bias during thermocompression of the curable resin layer 15 can be prevented, and a uniform appearance can be maintained. In addition, the outflow of the resin outside a predetermined range can be prevented, and the film thickness after pressure bonding can be ensured.

[0022] The storage modulus of the black curable resin layer 10 at 60° C. after heat treatment at 120° C. for 1 hour is preferably 7×10 8 Pa or more 2×10 10 Pa or less. When the storage modulus is equal to or less than the preferred upper limit, it is possible to prevent cracks from occurring in the cured black curable resin layer 10 when the edge of the substrate 20 is cut. When the storage modulus is equal to or more than the preferred lower limit, it is possible to prevent the cured black curable resin layer 10 from deforming and expanding and contracting when the edge of the substrate 20 is cut, and to prevent the integrated encapsulating sheet 1 on the edge side of the substrate 20 from becoming wavy.

[0023] [Curable resin composition] The black curable resin layer 10 includes a curable resin composition. An example of the curable resin composition is a curable resin composition containing at least one resin selected from an epoxy resin, an acrylic resin, a polyester resin, a polyurethane resin, and a silicone resin, and a curing agent. Among the above curable resin compositions, an epoxy resin composition that can achieve curing at low temperatures and has excellent heat resistance and reliability is preferred. In this specification, the epoxy resin composition is a composition containing an epoxy resin as a main component, or a composition containing an epoxy resin and a curing agent as main components.

[0024] When the black curable resin layer 10 is made of an epoxy resin composition, it may contain a curing agent for epoxy resin other than the modified elastomer having a functional group capable of reacting with an epoxy group. Examples of the other curing agent include known curing agents such as phenol-based curing agents, acid anhydride-based curing agents, and amine-based curing agents. Two or more types of the other curing agents may be used in combination.

[0025] (Epoxy resin) In the present application, an epoxy resin is a compound having an epoxy group in a molecule. The epoxy resin used in the present invention is preferably one having two or more epoxy groups in one molecule. This is because a crosslinked structure is formed by reaction with a modified resin having a functional group capable of reacting with an epoxy group, and the cured product can exhibit high heat resistance. In addition, when an epoxy resin having two or more epoxy groups is used, the degree of crosslinking with a curing agent having a functional group capable of reacting with an epoxy group is sufficient, and sufficient heat resistance is obtained in the cured product.

[0026] Examples of epoxy resins include bifunctional epoxy resins having two epoxy groups in a molecule, polyfunctional epoxy resins having three or more epoxy groups in a molecule, and high molecular weight epoxy resins having a weight average molecular weight of 10,000 or more. They may also be hydrogenated epoxy resins. In this application, high molecular weight epoxy resins are not classified as bifunctional epoxy resins or polyfunctional epoxy resins, but as phenoxy-type epoxy resins, regardless of the number of epoxy groups in the molecule. The weight average molecular weight of an epoxy resin is a polystyrene-equivalent molecular weight measured by gel permeation chromatography.

[0027] Examples of epoxy resins include bisphenol A type epoxy resins, bisphenol F type epoxy resins, phenoxy type epoxy resins obtained by polymerizing these resins, and hydrogenated versions of these resins; glycidyl ester-based epoxy resins such as diglycidyl phthalate, diglycidyl isophthalate, diglycidyl terephthalate, glycidyl p-hydroxybenzoate, diglycidyl tetrahydrophthalate, diglycidyl succinate, diglycidyl adipic acid, diglycidyl sebacate, and triglycidyl trimellitate; ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, Examples of the epoxy resin include, but are not limited to, glycidyl ether-based epoxy resins such as 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, trimethylolpropane triglycidyl ether, pentaerythritol tetraglycidyl ether, tetraphenyl glycidyl ether ethane, triphenyl glycidyl ether ethane, polyglycidyl ether of sorbitol, and polyglycidyl ether of polyglycerol; glycidyl amine-based epoxy resins such as triglycidyl isocyanurate and tetraglycidyl diaminodiphenylmethane; and linear aliphatic epoxy resins such as epoxidized polybutadiene and epoxidized soybean oil. In addition, novolac-type epoxy resins such as xylene structure-containing novolac epoxy resins, naphthol novolac-type epoxy resins, phenol novolac epoxy resins, o-cresol novolac epoxy resins, and bisphenol A novolac epoxy resins can also be used.

[0028] Examples of epoxy resins that can be used include brominated bisphenol A type epoxy resins, phosphorus-containing epoxy resins, fluorine-containing epoxy resins, dicyclopentadiene skeleton-containing epoxy resins, naphthalene skeleton-containing epoxy resins, anthracene type epoxy resins, tertiary butyl catechol type epoxy resins, triphenylmethane type epoxy resins, tetraphenylethane type epoxy resins, biphenyl type epoxy resins, and bisphenol S type epoxy resins.

[0029] Examples of high molecular weight epoxy resins that can be used include phenoxy type epoxy resins, epoxy modified polybutadiene, copolymers of glycidyl methacrylate and methyl methacrylate, modified polymers obtained by epoxy modifying other resins, etc. These epoxy resins may be used alone or in combination of two or more.

[0030] Among the above epoxy resins, the epoxy resin used in the black curable resin layer 10 is preferably a multifunctional epoxy resin from the viewpoint of increasing the crosslink density after curing. Among the multifunctional epoxy resins, novolac-type epoxy resins are particularly more preferable for the following reasons. Novolac-type epoxy resins are epoxy resins that can be appropriately introduced with a flexible skeleton and can adjust the flexibility and softening point. This makes the cured product less likely to undergo brittle fracture, improves the stability of the performance of the cured product of the epoxy resin composition over long-term use, and increases the crosslink density. In addition, the heat resistance of the cured product is also improved.

[0031] Specific examples of novolac-type epoxy resins include "YX7700" manufactured by Mitsubishi Chemical Corporation, "NC7000L", "XD1000", and "EOCN-1020" manufactured by Nippon Kayaku Co., Ltd., "ESN485" manufactured by Nippon Steel Chemical & Material Co., Ltd., and "N-690", "N-695", and "HP-7200H" manufactured by DIC Corporation.

[0032] The blending amount of the polyfunctional epoxy resin in the black curable resin layer 10 is preferably 10 to 99% by mass, more preferably 40 to 95% by mass, and even more preferably 60 to 90% by mass, based on 100% by mass of the total resin solid content of the black curable resin layer 10. When the blending amount is equal to or more than the lower limit, the crosslinking density can be increased to impart chemical resistance and heat resistance. When the blending amount is equal to or less than the upper limit, the storage modulus during thermocompression bonding can be adjusted, and the fluidity of the black curable resin layer 10 can be ensured.

[0033] The black curable resin layer 10 preferably does not contain a high molecular weight epoxy resin, or if it contains a high molecular weight epoxy resin, it contains it in an amount less than that of the transparent curable resin layer 11. This makes it easier to ensure sufficient fluidity of the black curable resin layer 10 during thermocompression bonding. The amount of the high molecular weight epoxy resin in the black curable resin layer 10 is preferably less than 50% by mass, more preferably less than 30% by mass, and even more preferably less than 10% by mass, relative to 100% by mass of the total resin solid content of the black curable resin layer 10.

[0034] From the viewpoint of ensuring sufficient fluidity during thermocompression bonding, the black curable resin layer 10 preferably contains an epoxy resin having a softening point or melting point of 100° C. or less. From the viewpoint of handleability and heat resistance of the cured product, the black curable resin layer 10 more preferably contains an epoxy resin having a softening point or melting point of 40 to 95° C. By containing an epoxy resin having a softening point or melting point within the above range, it becomes easy to control the storage modulus of the black curable resin layer 10.

[0035] The total amount of epoxy resin in the black curable resin layer 10 is preferably 10 to 100% by mass, more preferably 20 to 99% by mass, and even more preferably 35 to 95% by mass, relative to 100% by mass of the total resin solid content of the black curable resin layer 10. Within the above range, the storage modulus of the black curable resin layer 10 can be easily controlled, and appropriate fluidity during thermocompression bonding can be ensured. In addition, when the amount is equal to or greater than the above lower limit, the heat resistance of the black curable resin layer 10 after curing can be improved.

[0036] (Elastomer) The black curable resin layer 10 preferably contains an elastomer in addition to a resin such as an epoxy resin. By containing an elastomer, it becomes easier to control the storage modulus of the black curable resin layer 10, that is, to control the fluidity.

[0037] As the elastomer, a thermosetting elastomer, generally called "rubber", is preferred because it provides excellent heat resistance. Examples of the thermosetting elastomer include acrylonitrile butadiene rubber (NBR), which is a random copolymer of butadiene and acrylonitrile, acrylic rubber, styrene butadiene rubber, vinyl acetate resin, silicone resin, and the like. Among these, NBR is preferred. NBR has good compatibility with epoxy resins, making it easy to control the fluidity of the black curable resin layer 10 at around 100°C, and as a result, the adhesion between the black curable resin layer 10 and the transparent curable resin layer 11 and the element-mounted substrate 2 is good.

[0038] The weight average molecular weight of the elastomer is preferably 100,000 to 1,000,000, more preferably 120,000 to 500,000, and even more preferably 150,000 to 300,000. When the weight average molecular weight of the elastomer is within the above range, the storage modulus of the black curable resin layer 10 can be easily controlled, and the flowability during thermocompression bonding can be ensured. When the weight average molecular weight of the elastomer is equal to or less than the above upper limit, the compatibility between the elastomer and the epoxy resin is improved, and the flowability during thermal curing of the black curable resin layer 10 can be more effectively controlled.

[0039] In particular, when the black curable resin layer 10 is composed of an epoxy resin composition, it preferably contains a modified elastomer having a functional group capable of reacting with an epoxy group. The modified elastomer having a functional group capable of reacting with an epoxy group also acts as a curing agent for the epoxy resin. In addition, since the modified elastomer can react and bond with the epoxy resin, the heat resistance and reliability against thermal shock after curing of the black curable resin layer 10 are improved. Furthermore, the difference in polarity between the functional group capable of reacting with the epoxy resin and the resin skeleton has a favorable effect on dispersibility, and good dispersibility can be obtained when carbon black is contained in the black curable resin layer 10.

[0040] Examples of functional groups that can react with epoxy groups include acid groups such as carboxy groups, sulfo groups, nitro groups, and phosphoric acid groups, as well as their acid anhydride groups, hydroxyl groups, and amino groups. Among these, acid groups and acid anhydride groups are preferred because they can be cured at low temperatures and can ensure a long pot life. For the same reason, carboxy groups and carboxylic anhydride groups are particularly preferred.

[0041] That is, when the black curable resin layer 10 is composed of an epoxy resin composition, it preferably contains an acid-modified elastomer having an acid group or an acid anhydride group, more preferably contains an acid-modified elastomer having a carboxy group, and even more preferably contains modified NBR having a carboxy group.

[0042] The modified NBR having a carboxy group is preferably a carboxylated acrylonitrile rubber into which acrylic acid, methacrylic acid, maleic anhydride, etc. have been introduced. Commercially available products of the carboxylated acrylonitrile rubber include "NX775" and "1072CGJ" manufactured by Zeon Corporation. Two or more types of modified elastomers having a functional group capable of reacting with an epoxy group may be used in combination.

[0043] The amount of elastomer in the black curable resin layer 10 is preferably greater than the amount of elastomer in the transparent curable resin layer 11. This allows the storage modulus of the black curable resin layer 10 during thermocompression bonding to be adjusted to an appropriate range lower than that of the transparent curable resin layer 11, and allows flow during thermal curing to be suppressed, when the black curable resin layer 10 contains a large amount of low molecular weight components such as polyfunctional epoxy. As a result, the black curable resin layer 10 can have sufficient flowability during thermocompression bonding and can be prevented from flowing out during thermal curing.

[0044] The amount of the elastomer in the black curable resin layer 10 is preferably 0.01 to 90% by mass, more preferably 1 to 80% by mass, and even more preferably 5 to 65% by mass, based on 100% by mass of the total resin solid content of the black curable resin layer 10. Within the above range, the storage modulus of the black curable resin layer 10 can be easily controlled, and appropriate fluidity of the black curable resin layer 10 during thermocompression bonding can be ensured. In addition, when the amount is equal to or greater than the above lower limit, the dispersibility of carbon black in the epoxy resin composition is improved. Furthermore, the film-forming property of the epoxy resin composition is improved, and the distribution of film thickness when the epoxy resin composition is applied to form a film can be narrowed.

[0045] (hardening agent) When the black curable resin layer 10 is made of an epoxy resin composition, it may contain a curing agent for epoxy resin other than the modified elastomer having a functional group capable of reacting with an epoxy group. Examples of the other curing agent include known curing agents such as phenol-based curing agents, acid anhydride-based curing agents, and amine-based curing agents. Two or more types of the other curing agents may be used in combination.

[0046] (curing catalyst) When the black curable resin layer 10 is composed of an epoxy resin composition, it may contain a curing catalyst that promotes the curing reaction of the epoxy resin. Examples of the curing catalyst include imidazole-based, tertiary amine-based, and phosphorus compound-based. Among them, imidazole-based catalysts are preferred because they are compatible with epoxy resins and do not easily cause yellowing. Among imidazole-based curing catalysts, those having a cyanoethyl group are particularly preferred because they are easily dissolved in epoxy resins. The blending amount of the curing catalyst is preferably 0.01 to 5 parts by mass, more preferably 0.05 to 4 parts by mass, and even more preferably 0.1 to 3 parts by mass, relative to 100 parts by mass of the total resin solid content of the black curable resin layer 10. Within the above range, the curing of the black curable resin layer 10 can be sufficiently promoted, and the usable time of the integrated encapsulating sheet 1 can be secured. Two or more types of curing catalysts may be used in combination.

[0047] (Black pigment or black dye) The black curable resin layer 10 is colored black. For coloring, it is preferable that the black curable resin layer 10 contains a black pigment or a black dye, more preferable that the black pigment is contained, and further preferable that the black curable resin layer 10 contains carbon black. By coloring the black curable resin layer 10 black, light diffusion prevention properties between the multiple light emitting elements 21, 22, and 23 of the element-mounted substrate 2 can be obtained.

[0048] The particle size of the carbon black is preferably 10 to 500 nm, more preferably 10 to 300 nm, and even more preferably 10 to 100 nm. The particle size refers to the average particle size, and can be determined by a measuring device using the dynamic light scattering method. An example of the measuring device using the dynamic light scattering method is NanotracWave II UT151 manufactured by Microtrack Bell.

[0049] As the carbon black, one or more of known carbon blacks such as gas black, channel black, furnace black, thermal black, and lamp black can be used. Resin-coated carbon black may also be used. Furthermore, carbon nanofibers and carbon nanotubes may also be used.

[0050] Among the above carbon blacks, gas black is preferred because it has a large amount of surface functional groups, has high dispersibility, and exerts a sufficient light diffusion prevention function even when added in a small amount. In addition, when the black curable resin layer 10 contains a modified elastomer having a functional group capable of reacting with an epoxy resin, the dispersibility is further increased due to the interaction between the surface functional group of the gas black and the functional group of the modified elastomer having a functional group capable of reacting with an epoxy resin, and good light diffusion prevention properties and coating liquid stability can be ensured.

[0051] The blending amount of carbon black is preferably 0.1 to 15 mass %, more preferably 0.3 to 5 mass %, based on the total solid content of the black curable resin layer 10. When the blending amount of carbon black is equal to or more than the above lower limit, sufficient light blocking properties can be obtained. When the blending amount of carbon black is equal to or less than the above upper limit, the thixotropy of the black curable resin layer 10 is reduced and the fluidity of the black curable resin layer 10 during thermocompression bonding is increased, so that the black curable resin layer 10 can sufficiently fill the spaces between the multiple light emitting elements 21, 22, and 23 of the element-mounted substrate 2.

[0052] (Other Ingredients) The black curable resin layer 10 may contain an inorganic filler to improve flame retardancy and heat resistance and to adjust the refractive index. The black curable resin layer 10 may further contain, as necessary, a resin other than the epoxy resin and the elastomer, a thickener, a defoamer and / or a leveling agent, an adhesion imparting agent such as a coupling agent, and a flame retardant.

[0053] (2)Transparent curable resin layer The transparent curable resin layer 11 is a layer for sufficiently pressing the black curable resin layer 10 into spaces between the plurality of light emitting elements 21, 22, 23 arranged on the element-mounted substrate 2 in the thermocompression bonding step.

[0054] [Total light transmittance] The total light transmittance of the transparent curable resin layer 11 in a cured state is preferably adjusted to be 30 to 99%, more preferably 35 to 95%, and even more preferably 40 to 90%.

[0055] When the total light transmittance is equal to or greater than the lower limit, even if the transparent curable resin layer 11 in a cured state remains on the light emitting elements 21, 22, and 23, it does not prevent light from reaching the viewer.

[0056] [Storage modulus] The storage elastic modulus of the transparent curable resin layer 11 in an uncured state is preferably greater than that of the black curable resin layer 10. Similarly, at 100° C. and 150° C., the storage elastic modulus of the transparent curable resin layer 11 is preferably greater than that of the black curable resin layer 10.

[0057] The storage elastic modulus of the transparent curable resin layer 11 is preferably greater than that of the black curable resin layer 10 at 100 to 150° C. When the storage elastic modulus of the transparent curable resin layer 11 is greater than that of the black curable resin layer 10 at 100° C. and 150° C., the storage elastic modulus of the transparent curable resin layer 11 is usually greater than that of the black curable resin layer 10 over the entire range of 100 to 150° C.

[0058] The storage modulus of the transparent curable resin layer 11 at 100° C. is preferably 1.0×10 3 Pa or more 1.0×10 7 Pa or less, more preferably 5.0×10 3 Pa or more 5.0×10 5 Pa or less.

[0059] Since the storage modulus of the transparent curable resin layer 11 at 100° C. is equal to or less than the preferred upper limit, sufficient fluidity is obtained that does not hinder the flow of the black curable resin layer 10 when pressure-bonded to the element-mounted substrate 2. In addition, the transparent curable resin layer 11 can sufficiently fill the spaces between the light-emitting elements 21, 22, and 23 by conforming to the unevenness of the element-mounted substrate 2 caused by the light-emitting elements 21, 22, and 23.

[0060] By making the storage modulus of the transparent curable resin layer 11 at 100°C equal to or greater than the preferred lower limit, the fluidity of the transparent curable resin layer 11 can be suppressed, and the surface of the transparent curable resin layer 11 can be made smoother after thermocompression bonding in accordance with the light emitting elements 21, 22, and 23. As a result, the appearance can be improved, and appearance defects such as a repellency phenomenon that creates recesses on the layer surface during thermal curing can be prevented.

[0061] The storage modulus of the transparent curable resin layer 11 at 150° C. is preferably 1.0×10 4 Pa or more, more preferably 1.0×10 4 Pa or more 5.0×10 7 Pa or less, and even more preferably 1.0×10 5 Pa or more 5.0×10 6 Pa or less. When the storage modulus of the transparent curable resin layer 11 at 150°C is equal to or less than the preferred upper limit, cracks due to cure shrinkage during thermal curing are unlikely to occur. When the storage modulus of the transparent curable resin layer 11 at 150°C is equal to or more than the preferred lower limit, flow during thermal curing of the transparent curable resin layer 11 can be suppressed, and poor appearance after curing, such as a repellency phenomenon, can be suppressed. Furthermore, problems are unlikely to occur when etching is performed in a later process.

[0062] The storage modulus of the transparent curable resin layer 11 at 100°C is preferably 10 to 1000 times, more preferably 30 to 500 times, the storage modulus of the black curable resin layer 10. The storage modulus of the transparent curable resin layer 11 at 150°C is preferably 5 to 10000 times, more preferably 10 to 1000 times, the storage modulus of the black curable resin layer 10. When the storage modulus of the transparent curable resin layer 11 is greater than that of the black curable resin layer 10 at 100°C and 150°C, the storage modulus of the transparent curable resin layer 11 is usually greater than that of the black curable resin layer 10 over the entire range of 100 to 150°C.

[0063] The storage modulus of the transparent curable resin layer 11 at 60° C. after heat treatment at 120° C. for 1 hour is preferably 7×10 8 Pa or more 2×10 10Pa or less. When the storage modulus is equal to or less than the preferred upper limit, cracks can be prevented in the cured transparent curable resin layer 11 when the edge of the substrate 20 is cut. When the storage modulus is equal to or more than the preferred lower limit, deformation and expansion / contraction of the cured transparent curable resin layer 11 can be prevented when the edge of the substrate 20 is cut. As a result, wavy distortion of the integrated encapsulating sheet 1 on the edge side of the substrate 20 can be prevented.

[0064] [Curable resin composition] The transparent curable resin layer 11 is composed of a curable resin composition. As with the black curable resin layer 10, the curable resin composition may be a curable resin composition containing at least one resin selected from an epoxy resin, an acrylic resin, a polyester resin, a polyurethane resin, and a silicone resin, and a curing agent. Among these, an epoxy resin composition is preferred because it can be cured at low temperatures and has excellent heat resistance and reliability.

[0065] (Epoxy resin) Examples of epoxy resins used in the transparent curable resin layer 11 include the same types as those used in the black curable resin layer 10. From the viewpoint of imparting an appropriate viscosity during compression to the transparent curable resin layer 11, the transparent curable resin layer 11 preferably contains a high molecular weight epoxy resin having a weight average molecular weight of 10,000 to 100,000. Moreover, from the viewpoint of having good compatibility with other resin components and being able to dissolve without mixing with a high boiling point solvent that may remain in the dry film even after drying, the transparent curable resin layer 11 more preferably contains a high molecular weight epoxy resin having a weight average molecular weight of 10,000 to 35,000.

[0066] The transparent curable resin layer 11 has an appropriate viscosity when heated because it contains a high molecular weight epoxy resin with a weight average molecular weight of 10,000 to 100,000. Therefore, the storage modulus of the transparent curable resin layer 11 at 100 to 150° C. can be adjusted to a preferred range. The high molecular weight epoxy resin is preferably a phenoxy type epoxy resin because it has good compatibility with other epoxy resins.

[0067] Phenoxy type epoxy resin has a relatively large molecular weight among epoxy resins and has a suitable viscosity when heated. Therefore, the storage modulus of the transparent curable resin layer 11 containing the phenoxy type epoxy resin in the range of 100 to 150 ° C. can be adjusted to a preferred range. Moreover, unlike other thermoplastic resins such as polyester, the phenoxy type epoxy resin can be cured as an epoxy resin. Therefore, the phenoxy type epoxy resin increases the crosslinking density and does not impair the heat resistance of the cured product or the reliability of the performance for long-term use. From the viewpoint of ensuring the storage modulus that presses the black curable resin layer 10 during thermocompression bonding, the glass transition temperature of the phenoxy type epoxy resin used in the transparent curable resin layer 11 is preferably 100 ° C. or higher.

[0068] Specific examples of phenoxy type epoxy resins include "1256", "YX7200", "YX8100", and "YX7180" manufactured by Mitsubishi Chemical Corporation, "YP-50", "YP-50S", and "YP-70" manufactured by Nippon Steel Chemical & Material Co., Ltd., "N-690" manufactured by DIC Corporation, and "H-157" and "EXA-192" manufactured by DIC Corporation.

[0069] The blending amount of the high molecular weight epoxy resin in the transparent curable resin layer 11 is preferably 30 to 80 mass %, more preferably 40 to 70 mass %, and even more preferably 45 to 60 mass %, relative to 100 mass % of the total resin solid content of the transparent curable resin layer 11. The same is true for the preferred blending amount of the phenoxy type epoxy resin in the transparent curable resin layer 11.

[0070] When the blending amount is within the above range, it becomes easy to control the storage modulus. This ensures a storage modulus that can press the transparent curable resin layer 11 during thermocompression bonding. In addition, flow during thermosetting can be suppressed, and poor appearance after curing such as a repellent phenomenon can be suppressed. Furthermore, problems are unlikely to occur when etching is performed in a later process. In addition, toughness is improved, and crack-like defects are unlikely to occur during thermocompression bonding. In addition, when the blending amount is equal to or less than the above upper limit, the crosslink density of the transparent curable resin layer 11 in the cured state can be increased, and the heat resistance and chemical resistance can be improved.

[0071] Furthermore, the epoxy resin used in the transparent curable resin layer 11 preferably contains a polyfunctional epoxy resin. The polyfunctional epoxy resin can increase the crosslink density, thereby further improving the stability of the performance of the cured product of the epoxy resin composition over long-term use and improving the heat resistance. In addition, the viscosity of the polyfunctional epoxy resin is lower than that of the phenoxy type epoxy resin in the range of 100 to 150°C. Therefore, the storage modulus of the transparent curable resin layer 11 can be adjusted by combining the polyfunctional epoxy resin with the phenoxy type epoxy resin.

[0072] Specific examples of polyfunctional epoxy resins include "YX7700", "157S70", and "1032S60" manufactured by Mitsubishi Chemical Corporation, "NC7000L", "XD1000", and "EOCN-1020" manufactured by Nippon Kayaku Co., Ltd., "ESN485" manufactured by Nippon Steel Chemical & Material Co., Ltd., and "N-690", "N-695", and "HP-7200H" manufactured by DIC Corporation.

[0073] The blending amount of the polyfunctional epoxy resin in the transparent curable resin layer 11 is preferably 90% by mass or less, more preferably 10 to 80% by mass, and even more preferably 25 to 60% by mass, relative to 100% by mass of the total resin solid content of the transparent curable resin layer 11. Within the above range, the storage modulus of the transparent curable resin layer 11 during thermocompression bonding can be controlled, and heat resistance and chemical resistance can be imparted in the cured state.

[0074] From the viewpoint of ensuring sufficient fluidity during thermocompression bonding, the transparent curable resin layer 11 preferably contains an epoxy resin having a softening point or melting point of 120° C. or less, and from the viewpoint of handleability and heat resistance of the cured product, more preferably contains an epoxy resin having a softening point or melting point of 50 to 105° C. By containing an epoxy resin having a softening point or melting point within the above range, it becomes possible to control the storage modulus.

[0075] The total amount of epoxy resin in the transparent curable resin layer 11 is preferably 10 to 100% by mass, more preferably 30 to 99% by mass, and even more preferably 50 to 95% by mass, relative to 100% by mass of the total resin solid content of the transparent curable resin layer 11. Within the above range, the storage modulus is easily controlled. This ensures a storage modulus that presses the black curable resin layer 10 during thermocompression bonding. Furthermore, within the above range, flow during thermal curing can be suppressed, and poor appearance after curing, such as a repellency phenomenon, can be suppressed. Furthermore, problems are unlikely to occur when etching is performed in a subsequent process. Furthermore, when the amount is equal to or greater than the above lower limit, heat resistance is improved in the cured state.

[0076] (Elastomer) The transparent curable resin layer 11 preferably contains an elastomer in addition to a resin such as an epoxy resin. By containing an elastomer, it becomes easy to control the storage modulus. As the elastomer, the same types as those of the black curable resin layer 10 can be mentioned. Among them, NBR is preferable for the following reasons. NBR has good compatibility with epoxy resin. In addition, it is because it can increase the storage modulus of the transparent curable resin layer 11 at about 150°C, and as a result, the adhesion between the transparent curable resin layer 11 and the black curable resin layer 10 becomes good. The preferable weight average molecular weight of the elastomer is the same as that of the black curable resin layer 10.

[0077] In particular, when the transparent curable resin layer 11 is composed of an epoxy resin composition, it preferably contains a modified elastomer having a functional group capable of reacting with an epoxy group. The modified elastomer also acts as a curing agent for the epoxy resin. In addition, since it can react and bond with the epoxy resin, it improves heat resistance and reliability against thermal shock. Furthermore, the difference in polarity between the functional group and the resin skeleton has a favorable effect on dispersibility. This allows good dispersibility to be obtained when carbon black is contained in the transparent curable resin layer 11.

[0078] Examples of functional groups capable of reacting with an epoxy group include the same types as those in the black curable resin layer 10. Among them, an acid group or an acid anhydride group is preferred, and a carboxy group or a carboxylic acid anhydride group is particularly preferred, since they can be cured at low temperatures and can ensure a long pot life.

[0079] When the transparent curable resin layer 11 is composed of an epoxy resin composition, it particularly preferably contains modified NBR having a carboxy group. Examples of modified NBR having a carboxy group include the same types as those of the black curable resin layer 10. Two or more types of modified elastomers having a functional group capable of reacting with an epoxy group may be used in combination.

[0080] The blending amount of the elastomer in the transparent curable resin layer 11 is preferably 0 to 50% by mass, more preferably 1 to 70% by mass, and even more preferably 5 to 50% by mass, based on 100% by mass of the total resin solid content of the transparent curable resin layer 11. Within the above range, the storage modulus can be controlled. Furthermore, when the blending amount is equal to or less than the upper limit, the storage modulus for pressing the black curable resin layer 10 during thermocompression bonding can be ensured. Furthermore, flow during thermal curing can be suppressed, and poor appearance after curing such as a repellent phenomenon can be suppressed. Furthermore, problems are unlikely to occur when etching is performed in a later process. Furthermore, when the blending amount is equal to or more than the lower limit, the dispersibility of carbon black is improved. Furthermore, the film-forming property is improved, and the distribution of film thickness can be narrowed when the epoxy resin composition is applied to form a film.

[0081] (hardening agent) When the transparent curable resin layer 11 is made of an epoxy resin composition, it may contain a curing agent for other epoxy resins in addition to the modified elastomer having a functional group capable of reacting with an epoxy group. Examples of the other curing agent include the same curing agents as those used for the black curable resin layer 10. Two or more types of the other curing agents may be used in combination.

[0082] (curing catalyst) When the transparent curable resin layer 11 is made of an epoxy resin composition, it may contain a curing catalyst that accelerates the curing reaction of the epoxy resin. Examples of the curing catalyst include the same curing catalysts as those for the black curable resin layer 10, and the preferred embodiments are also the same.

[0083] The blending amount of the curing catalyst is preferably 0.01 to 5 parts by mass, more preferably 0.05 to 4 parts by mass, and even more preferably 0.1 to 3 parts by mass, relative to 100 parts by mass of the total resin solid content of the transparent curable resin layer 11. When it is within the above range, curing can be sufficiently promoted and the pot life of the integrated encapsulating sheet 1 can be secured. Two or more types of curing catalysts may be used in combination.

[0084] (Other Ingredients) The transparent curable resin layer 11 may contain a black pigment or black dye in order to suppress uneven light emission or color unevenness.

[0085] When the transparent curable resin layer 11 contains carbon black, the blending amount of carbon black is preferably less than 5 parts by mass, more preferably 1 part by mass or less, and even more preferably 0.1 parts by mass or less, relative to 100 parts by mass of the total resin solid content, from the viewpoint of increasing the total light transmittance. The transparent curable resin layer 11 may further contain, as necessary, a resin other than the epoxy resin and the elastomer, a thickener, a defoamer and / or a leveling agent, an adhesion imparting agent such as a coupling agent, and a flame retardant.

[0086] (3) Glass layer The glass layer 12 is a layer for protecting the light-emitting electronic component 30 from scratches. In this specification, "glass" refers to inorganic glass. The glass used for the glass layer 12 is preferably in the form of a thin film.

[0087] The inorganic glass used for the glass layer 12 is not particularly limited as long as it does not prevent the transmission of light from the light-emitting element, and may be any of various known materials such as soda-lime glass, borosilicate glass, quartz glass, etc. In addition, according to classification based on the alkali component, it is preferable to use alkali-free glass, low-alkali glass, etc.

[0088] The glass layer 12 may be formed from a raw material, or may be a commercially available glass used as is or after polishing to a desired thickness. An example of commercially available glass is "G-Leaf (registered trademark)" manufactured by Nippon Electric Glass Co., Ltd.

[0089] Any appropriate method may be used to form the glass layer 12. For example, the glass layer 12 is produced by melting a mixture containing a main raw material such as silica, an antifoaming agent such as mirabilite or antimony oxide, and a reducing agent such as carbon at a temperature of 1400°C to 1600°C, forming it into a thin plate, and then cooling it. The method for forming the glass layer 12 is, for example, a slot downdraw method, a fusion method, a float method, or the like. The inorganic glass formed into a film by these methods may be chemically polished with a solvent such as hydrofluoric acid as necessary to make it thinner or to increase the smoothness.

[0090] [Total light transmittance] The total light transmittance of the glass layer 12 is not particularly limited as long as it does not prevent the transmission of light from the light emitting element, but is preferably 50% to 99%, more preferably 60% to 99%. By setting the total light transmittance of the glass layer 12 to the lower limit or more, the light is not prevented from reaching the viewer side.

[0091] [Storage modulus] The storage modulus of the glass layer 12 is not particularly limited, but is preferably 1.0×10 9 Pa or more 5.0×10 11 Pa or less, more preferably 2.0×10 9 Pa or more 3.0×10 11 Pa or less, and even more preferably 3.0×10 9 Pa or more 1.0×10 11Pa or less. By setting the storage modulus to a preferred upper limit or less, it is possible to impart appropriate flexibility that does not hinder the flow of the black cured resin layer 10 when it is pressure-bonded to the element-mounted substrate 2. This allows the black cured resin layer 10 to conform to the unevenness of the element-mounted substrate 2 formed by the multiple light-emitting elements 21, 22, 23 and to sufficiently fill in the spaces between the light-emitting elements 21, 22, 23. By setting the storage modulus to a preferred lower limit or more, the glass layer 12 can reliably transmit pressure to the cured resin layer 15 without being deformed when it is pressure-bonded to the element-mounted substrate 2.

[0092] [Film thickness] The thickness of the glass layer 12 is not particularly limited as long as it does not prevent the transmission of light from the light-emitting elements, but is preferably 30 to 70 μm, more preferably 40 to 60 μm, and even more preferably 45 to 55 μm. By setting the thickness to be equal to or greater than the preferred lower limit, sufficient strength for protecting the light-emitting elements 21, 22, and 23 can be ensured. By setting the thickness to be equal to or less than the preferred upper limit, the visibility of the light from the light-emitting elements 21, 22, and 23 can be improved while the manufacturing cost can be reduced.

[0093] [hardness] The pencil hardness of the surface of the glass layer 12 is preferably 7H or more, more preferably 8H or more, and even more preferably 9H or more. By setting the pencil hardness to be equal to or more than the lower limit, the one-piece encapsulating sheet 1 can be provided with sufficient durability as a protective layer. In addition, by using the glass layer 12, it is not necessary to form a hard coat layer for scratch prevention on the outer surface.

[0094] [Reflectance] The reflectance measured by a glossmeter (JIS-Z-8741) on the glass layer 12 side is preferably 1 to 50%, more preferably 3 to 30%, and even more preferably 5 to 25%. By setting the reflectance to the lower limit or more, production can be facilitated. Furthermore, by setting the reflectance to the upper limit or less, visibility of the display can be improved.

[0095] [Total light transmittance across both layers] The total light transmittance of the two layers, the transparent curable resin layer 11 and the glass layer 12, as a whole is preferably 30 to 95%, more preferably 35 to 95%, and even more preferably 40 to 95%. By setting the total light transmittance of the two layers as a whole to be equal to or greater than the lower limit, it is possible to minimize the obstruction of light reaching the viewer side.

[0096] The glass layer 12 may be colored to prevent uneven light emission and color.

[0097] (4) Protective sheet The protective sheets 13 and 14 have a role of protecting the integrated encapsulating sheet 1. When the integrated encapsulating sheet 1 is formed, the protective sheet 13 can also be used as a sheet to which a coating liquid of a curable resin composition is applied.

[0098] The protective sheets 13 and 14 may be, for example, sheets made of polyesters such as polyethylene terephthalate and polyethylene naphthalate, thermoplastic resins such as polyimide, polyamideimide, polyethylene, polytetrafluoroethylene, polypropylene, and polystyrene, or surface-treated paper.

[0099] Among these, polyester sheets are preferably used from the viewpoints of heat resistance, mechanical strength, ease of handling, etc. The thickness of the protective sheets 13 and 14 is not particularly limited and is appropriately selected from the range of about 10 to 150 μm depending on the application. The surface of the protective sheet 13 on which the resin layer is to be provided may be subjected to a release treatment.

[0100] 2. Manufacturing method of integrated encapsulating sheet To obtain the integrated encapsulating sheet 1, first, a protective sheet 13 is prepared by applying and drying a coating liquid of a curable resin composition for the black curable resin layer 10, and a glass layer 12 is prepared by applying and drying a coating liquid of a curable resin composition for the transparent curable resin layer 11. When the glass layer 12 is used in this step, it is not necessary to form a hard coat layer for scratch prevention on the outer surface, and therefore the manufacturing process can be shortened compared to the conventional method.

[0101] Thereafter, these are stacked and laminated so that the transparent curable resin layer 11 and the black curable resin layer 10 are in contact with each other, thereby obtaining a laminate in which the black curable resin layer 10, the transparent curable resin layer 11, and the glass layer 12 are stacked in this order on the protective sheet 13. A protective sheet 14 may be laminated on the outer surface of the glass layer 12 as necessary.

[0102] The coating liquid of the curable resin composition of the black curable resin layer 10 and / or the coating liquid of the curable resin composition of the transparent curable resin layer 11 preferably contains an organic solvent in an amount that provides a viscosity that allows coating to be performed without problems. The organic solvent is not particularly limited, and examples thereof include ketones, aromatic hydrocarbons, glycol ethers, glycol ether acetates, esters, alcohols, aliphatic hydrocarbons, and petroleum-based solvents. Specific examples of the organic solvent include ketones such as methyl ethyl ketone, cyclohexanone, methyl butyl ketone, and methyl isobutyl ketone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; glycol ethers such as cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, and triethylene glycol monoethyl ether; ethyl acetate, butyl acetate, isobutyl acetate, ethyl ... Examples of the solvent include esters such as propylene glycol monoethyl ether acetate, dipropylene glycol methyl ether acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, and propylene glycol butyl ether acetate; alcohols such as ethanol, propanol, 2-methoxypropanol, n-butanol, isobutyl alcohol, isopentyl alcohol, ethylene glycol, and propylene glycol; aliphatic hydrocarbons such as octane and decane; petroleum solvents such as petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha, and solvent naphtha, as well as N,N-dimethylformamide (DMF), tetrachloroethylene, and turpentine. When carbon black is blended in the coating liquid, carbon black powder may be added to the coating liquid, or a liquid in which carbon black has been previously dispersed (carbon black dispersion) may be added.

[0103] Examples of the method for applying the curable resin composition include methods using various coaters such as a die coater, a gravure coater, a roll coater, a curtain flow coater, a spin coater, a bar coater, a reverse coater, a kiss coater, a fountain coater, a rod coater, an air doctor coater, a knife coater, a blade coater, a cast coater, a screen coater, etc. The drying temperature is preferably 60 to 160°C, more preferably 80 to 130°C, and even more preferably 90 to 120°C.

[0104] The temperature during lamination is preferably 20 to 120° C., more preferably 30 to 100° C., and even more preferably 40 to 80° C. By setting the temperature to a preferred lower limit or higher, it is possible to ensure adhesion between the black curable resin layer 10 and the transparent curable resin layer 11 that allows handling even in uncured state. Furthermore, by setting the temperature to a preferred upper limit or lower, it is possible to prevent air bubbles from being trapped between the black curable resin layer 10 and the transparent curable resin layer 11 and the occurrence of wrinkles in each layer 10, 11. Lamination can be performed using, for example, a roll laminator, a press machine, a vacuum press machine, or the like.

[0105] 3. Substrate with elements As shown in Fig. 2, the element-mounted substrate 2 has a plurality of light-emitting elements 21, 22, and 23 arranged on a substrate 20. Fig. 2 and other figures show a schematic view of a portion where three light-emitting elements (light-emitting element 21, light-emitting element 22, and light-emitting element 23) are arranged.

[0106] There is no limitation on the material of the substrate 20, but a known printed circuit board can be suitably used. Known printed circuit boards include a glass epoxy board, a fluororesin board, a ceramic board, and a glass board.

[0107] The light emitting elements 21, 22, and 23 are typically light emitting diodes. This embodiment is particularly suitable for the case where the light emitting elements 21, 22, and 23 are extremely small. For example, a light emitting diode having a height of 1000 nm to 200 μm and a side length of 0.001 to 0.5 mm can be used. In the element-mounted substrate 20 for obtaining mini LEDs or micro LEDs, light emitting diodes of three colors R, G, and B or blue light emitting diodes can be used as the light emitting elements 21, 22, and 23.

[0108] 4. Light-emitting electronic components and manufacturing method thereof A light-emitting electronic component 30 according to one embodiment includes an element-mounted substrate 2 having a plurality of light-emitting elements 21, 22, 23 arranged on a substrate 20, and an integrated sealing cured sheet 50 that is pressure-bonded to the surface of the element-mounted substrate 2 on which the plurality of light-emitting elements 21, 22, 23 are arranged. The integrated sealing cured sheet 50 has at least a resin layer 45 and a glass layer 12 that are transmissible to light emitted from the light-emitting elements 21, 22, 23 laminated therein, and the resin layer 45 and the glass layer 12 are laminated in this order from the side closer to the element-mounted substrate 2. A portion of the resin layer 45 is filled between the plurality of light-emitting elements 21, 22, 23.

[0109] The resin layer 45 preferably includes at least a black resin layer 40 and a transparent resin layer 41 having higher light transmittance than the black resin layer 40. In this case, the black resin layer 40 is formed between the element-mounted substrate 2 and the transparent resin layer 41. The thickness of the transparent resin layer 41 is not particularly limited, but is preferably 0.1 to 5.0 times the height of the plurality of light-emitting elements 21, 22, 23. The thickness of the black resin layer 32 is not particularly limited, but is preferably 0.1 to 0.9 times the height of the plurality of light-emitting elements 21, 22, 23. In this embodiment, the light-emitting electronic component 30 includes the black resin layer 40 and the transparent resin layer 41 as the resin layer 45, as shown in FIG. 4.

[0110] The manufacturing method of the light-emitting electronic component according to one embodiment includes a step of pressure-bonding the above-mentioned integrated encapsulating sheet 1 to the surface of the element-mounted substrate 2 on which the light-emitting elements 21, 22, 23 are arranged, the surface being in contact with the light-emitting elements 21, 22, 23, a step of filling the curable resin layer 15 between the light-emitting elements 21, 22, 23 by press-bonding, and a step of curing the curable resin layer 15 by heating. Hereinafter, the manufacturing method of the light-emitting electronic component according to one embodiment (also simply referred to as the "manufacturing method according to one embodiment") will be described with reference to Figs. 2 to 4.

[0111] In one embodiment of the manufacturing method, first, as shown in FIG. 2, an integrated encapsulating sheet 1 from which the protective sheet 13 has been peeled off to expose the black curable resin layer 10 is placed on the surface of the element-mounted substrate 2 on which the light-emitting elements 21, 22, and 23 are arranged, so that the black curable resin layer 10 is in contact with the surface.

[0112] Before compression bonding, the thickness of the black curable resin layer 10 is preferably 10 to 95% of the height of the light emitting elements 21, 22, 23. The lower limit is more preferably 15% or more, and even more preferably 30% or more. The upper limit is more preferably 85% or less, and even more preferably 75% or less.

[0113] When the thickness of the black curable resin layer 10 is 10% or more of the height of the light emitting elements 21, 22, 23, the function of preventing light diffusion between the light emitting elements 21, 22, 23 is sufficient. In addition, when the storage modulus of the black curable resin layer 10 is relatively low and the layer 10 is rich in fluidity, the resin can be sufficiently filled between the light emitting elements 21, 22, 23. When the thickness of the black curable resin layer 10 is 15% or more of the height of the light emitting elements 21, 22, 23, even if the fluidity of the transparent curable resin layer 11 is relatively low, crack-like defects are unlikely to occur on the surface. When the thickness of the black curable resin layer 10 is 30% or more of the height of the light emitting elements 21, 22, 23, the black curable resin layer 10 having the light diffusion prevention function can be appropriately filled between the light emitting elements 21, 22, 23.

[0114] If the thickness of the black curable resin layer 10 is 95% or less of the height of the light emitting elements 21, 22, 23, leakage to the outside of the black curable resin layer 10 during thermocompression bonding can be prevented, and light from the light emitting elements 21, 22, 23 is unlikely to be hindered from reaching the viewer. If the thickness of the black curable resin layer 10 is 85% or less of the height of the light emitting elements 21, 22, 23, the film thickness of the black curable resin layer 10 that flows after pressing is unlikely to vary, and black shading is unlikely to occur. If the thickness of the black curable resin layer 10 is 75% or less of the height of the light emitting elements 21, 22, 23, the black curable resin layer 10 having a light diffusion prevention function can be appropriately filled between the light emitting elements 21, 22, 23.

[0115] The thickness of the transparent curable resin layer 11 before compression bonding is preferably 10 to 500% of the height of the light emitting elements 21, 22, 23. The lower limit is more preferably 20% or more, and even more preferably 30% or more. The upper limit is more preferably 200% or less, and even more preferably 150% or less.

[0116] When the thickness of the transparent curable resin layer 11 is 10% or more relative to the height of the light emitting elements 21, 22, 23, it is easy to function as a sealing layer covering the light emitting elements 21, 22, 23. In addition, when the storage modulus of the transparent curable resin layer 11 is relatively high and the fluidity of the transparent curable resin layer 11 is suppressed, the transparent curable resin layer 11 can be suppressed from flowing together with the black curable resin layer 10 during thermal curing, and appearance defects are unlikely to occur on the surface. When the thickness of the transparent curable resin layer 11 is 20% or more relative to the height of the light emitting elements 21, 22, 23, the range in which the transparent curable resin layer 11 can flow is sufficient, and crack-like defects are unlikely to occur on the surface. When the thickness of the transparent curable resin layer 11 is 30% or more relative to the height of the light emitting elements 21, 22, 23, the transparent curable resin layer 11 is easy to function as a sealing layer covering the light emitting elements 21, 22, 23. Furthermore, when the storage modulus of the transparent curable resin layer 11 is relatively high and the fluidity of the transparent curable resin layer 11 is suppressed, the transparent curable resin layer 11 can sufficiently press into the black curable resin layer 10.

[0117] The total thickness of the black curable resin layer 10 and the transparent curable resin layer 11 before compression bonding is preferably 110 to 550% of the height of the light emitting elements 21, 22, 23. If the total thickness is equal to or more than the above lower limit value with respect to the height of the light emitting elements 21, 22, 23, a part of the integrated encapsulating sheet 1 can be sufficiently embedded between the light emitting elements 21, 22, 23. If the total thickness is equal to or less than the above upper limit value with respect to the height of the light emitting elements 21, 22, 23, thickness unevenness is unlikely to occur during compression bonding, and appearance defects are unlikely to occur on the surface.

[0118] The ratio of the thickness of the black cured resin layer 10 before compression to the total thickness of the transparent cured resin layer 11 and the black cured resin layer 10 before compression is preferably 10 to 90%, more preferably 15 to 70%. If the thickness ratio is equal to or greater than the lower limit, the degree of blackness can be increased and the contrast of the display can be sufficiently improved. If the thickness ratio is equal to or less than the upper limit, the black cured resin layer 10 is unlikely to remain on the light emitting elements 21, 22, and 23 during compression, and the brightness can be sufficiently improved.

[0119] 2, the black curable resin layer 10 and a part of the transparent curable resin layer 11 of the integrated encapsulating sheet 1 are embedded between the light emitting elements 21, 22, and 23 as shown in Fig. 3. At this time, if the storage modulus of the black curable resin layer 10 is relatively low and the fluidity of the layer 10 is ensured, the black curable resin layer 10 will easily fill between the light emitting elements 21, 22, and 23 while following the unevenness of the light emitting elements 21, 22, and 23, and will not easily remain on the light emitting elements 21, 22, and 23.

[0120] The temperature in the thermocompression bonding is preferably 80 to 120° C., and more preferably 90 to 110° C. By setting the temperature at 80° C. or higher, the fluidity of the curable resin layer 15 of the integrated encapsulating sheet 1 is easily ensured. Furthermore, by setting the temperature at 120° C. or lower, the light emitting elements 21, 22, and 23 are less likely to be damaged. By setting the temperature at 90 to 110° C., the fluidity of the curable resin layer 15 can be more precisely controlled, and the occurrence of unevenness or crack-like defects can be suppressed.

[0121] The pressure in the thermocompression bonding is preferably 0.05 to 1.0 MPa, more preferably 0.1 to 0.5 MPa. By setting the pressure to a preferable lower limit or more, the black curable resin layer 10 does not remain on the light emitting elements 21, 22, 23, and the light from the light emitting elements 21, 22, 23 is not prevented from reaching the viewer. By setting the pressure to a preferable upper limit or less, the light emitting elements 21, 22, 23 are less likely to be damaged. The thermocompression bonding is preferably performed using a vacuum press machine capable of molding in a vacuum state. This makes it easier to avoid defects caused by air being mixed into the obtained light emitting electronic component 30.

[0122] 4, the protective sheet 14 is peeled off and then thermally cured to form the black curable resin layer 10 of the integrated encapsulating sheet 1 into a black resin layer 40 (a cured layer of the black curable resin layer 10) and the transparent curable resin layer 11 into a transparent resin layer 41 (a cured layer of the transparent curable resin layer 11). In this way, a light-emitting electronic component 30 is obtained.

[0123] The curing temperature is preferably 100 to 160° C., and more preferably 110 to 150° C. By setting the curing temperature to 100° C. or more, the curable resin layer 15 of the integrated encapsulating sheet 1 can be reliably cured. By setting the curing temperature to 110° C. or more, the curing time of the curable resin layer 15 can be shortened. In addition, by setting the curing temperature to the above upper limit temperature or less, the light emitting elements 21, 22, and 23 are less likely to be damaged.

[0124] The curing time varies depending on the curing temperature, but is preferably 30 to 360 minutes, and more preferably 45 to 180 minutes. If the storage modulus of the transparent curable resin layer 11 is relatively high and the fluidity of the layer 11 is suppressed at the curing temperature, poor appearance of the curable resin layer 15 after curing can be suppressed.

[0125] 2 to 4, a light-emitting electronic component 30 is obtained in which an integrated sealing cured sheet 50 is pressure-bonded to the surface of the element-mounted substrate 2 on which the light-emitting elements 21, 22, and 23 are arranged, the surface being formed by the element-mounted substrate 2 having the light-emitting elements 21, 22, and 23 arranged on the substrate 20. In the light-emitting electronic component 30 thus obtained, the black curable resin layer 10 and the transparent curable resin layer 11 are cured. Parts of the black resin layer 40 and the transparent resin layer 41 are filled between the light-emitting elements 21, 22, and 23. EXAMPLES

[0126] (Example) [Coating liquid for transparent curable resin layer] 50 parts by mass of EPICLON (registered trademark) N660 (manufactured by DIC Corporation) and 30 parts by mass of EPICLON (registered trademark) HM-091 (manufactured by DIC Corporation) as epoxy resins, 20 parts by mass of Nipol (registered trademark) NX775 (manufactured by Nippon Zeon Corporation) as elastomer, and 3 parts by mass of Curesol (registered trademark) 2PZ-CN (manufactured by Shikoku Kasei Corporation) as curing catalyst were mixed in a solvent of MEK / PGM = 80 / 20 (volume ratio) to prepare a coating liquid for a transparent curable resin layer with a solid content concentration of 35 mass%.

[0127] [Coating liquid for black curable resin layer] 75 parts by mass of EPICLON (registered trademark) N660 (manufactured by DIC Corporation) as an epoxy resin, 25 parts by mass of Nipol (registered trademark) NX775 (manufactured by Nippon Zeon Corporation) as an elastomer, 3 parts by mass of Curesol (registered trademark) 2PZ-CN (manufactured by Shikoku Kasei Corporation) as a curing catalyst, and 10 parts by mass of carbon black Special Black 4 (manufactured by Orion Engineered Carbons) were mixed in a solvent of MEK / PGM = 80 / 20 (volume ratio) to prepare a coating liquid for a black curable resin layer with a solid content concentration of 35 mass%.

[0128] [Film with transparent curable resin layer] The glass layer was G-Leaf (registered trademark) OA-10G (50 μm thick) (manufactured by Nippon Electric Glass Co., Ltd.). The transparent curable resin layer coating liquid was applied to the OA-10G using an applicator so that the dry film thickness was 10 μm, and the film was dried at 120° C. for 5 minutes to obtain a film with a transparent curable resin layer (transmittance 82.8%) that had a glass layer and a transparent curable resin layer.

[0129] [Film with black curable resin layer] Onto the release surface of release PET 1-E (Nippa Corporation, 50 μm), a coating liquid for the black curable resin layer was applied using an applicator so that the dry film thickness was 5 μm, and then dried at 120° C. for 5 minutes to obtain a film with a black curable resin layer in which the black curable resin layer was supported by the release PET.

[0130] [Integrated encapsulating sheet] The obtained film with a transparent curable resin layer and the film with a black curable resin layer were overlaid so that the transparent curable resin layer and the black curable resin layer were in contact with each other, and laminated with a roll laminator at 60°C to obtain an integrated encapsulating sheet in which a glass layer, a transparent curable resin layer, and a black curable resin layer were laminated.

[0131] <Substrate with evaluation element> A substrate with elements for evaluation was prepared by arranging multiple LED light-emitting elements, each measuring 0.03 x 0.025 mm and 9 μm high, at equal intervals of 0.3 mm in an area of ​​30 mm square in the center of a 50 mm x 50 mm quartz glass substrate.

[0132] [implementation] The obtained integrated encapsulating sheet was cut into 40 mm squares, the release PET 1-E on the black curable resin layer side was peeled off, and the black curable resin layer was placed so that it was in contact with the LED light emitting element of the evaluation element-attached substrate. After that, it was pressed in a vacuum press under conditions of a vacuum degree of 100 hPa, 100°C, 0.36 MPa, and 3 minutes, and then heated in an oven at 150°C for 1 hour to thermally cure, thereby obtaining a light-emitting electronic component.

[0133] (Comparative Example) The glass layer OA-10G in the film with a transparent curable resin layer was replaced with a PET film, COSMOSHINE (registered trademark) A4160 (manufactured by Toyobo Co., Ltd., 50 μm thick), in the same manner as in Example 1. The transmittance of the obtained film with a transparent curable resin layer was 80.1%.

[0134] [Evaluation method for glass layer and PET film] The OA-10G (referred to as glass layer in Table 1) used in the examples and the A4160 (referred to as PET film in Table 1) used in the comparative examples were evaluated for the items shown in Table 1 below. The evaluation results are shown in Table 1.

[0135] <Total light transmittance> The total light transmittance was measured in accordance with JIS K 7361 using a haze meter NDH5000 manufactured by Nippon Denshoku Industries Co., Ltd.

[0136] <Storage modulus> The storage modulus at 100° C. was measured using a viscoelasticity measuring device (RSA-G2 manufactured by TA Instruments) under conditions of a measurement frequency of 1 Hz and a heating rate of 5° C. / min in accordance with JIS K 7244.

[0137] <Pencil hardness> The pencil hardness was measured using a pencil hardness tester (JIS K 5600-5-4).

[0138] <Water vapor permeability> The water vapor permeability was measured based on JIS K 7129.

[0139] <Oxygen permeability> The oxygen permeability was measured based on JIS K 7126-2.

[0140] [Table 1]

[0141] [Evaluation method for each integrated encapsulating sheet] Each of the integrated encapsulating sheets of the Examples and Comparative Examples was evaluated for the items shown in the following Table 2. The evaluation results are shown in Table 2.

[0142] <Luminance transmittance> The luminance transmittance was calculated by the following formula. The luminance was measured using a luminance meter CA-410 [product name] (Konica Minolta) and a φ10 mm probe CA-P410H [product name] (Konica Minolta) for the luminance of the LED substrate after mounting the integrated encapsulant sheet and the luminance of the LED substrate before mounting the integrated encapsulant sheet. Brightness transmittance = (Brightness of LED board after mounting / Brightness of LED board before mounting) × 100% (Formula 1)

[0143] <Dimensional stability> The dimensional stability was calculated by the following formula after measuring the vertical and horizontal dimensions of the integrated encapsulating sheet. The values ​​shown in Table 2 are average values ​​calculated from the vertical and horizontal dimensional differences before and after mounting. Dimensional stability = Dimension of encapsulating film before mounting - Dimension of encapsulating film after mounting (Formula 2)

[0144] <Moisture and heat resistance> The integrated encapsulating sheet was subjected to a pressure cooker test. The pressure cooker test was performed for 144 hours under conditions of 121°C and 100% humidity. After that, the appearance of the integrated encapsulating sheet was evaluated.

[0145] <Heat resistance> The integrated encapsulating sheet was left to stand for 1000 hours under the condition of 150° C. After cooling, the appearance of the integrated encapsulating sheet was evaluated.

[0146] [Table 2]

[0147] (Evaluation Results) As shown in Table 1, the pencil hardness of the glass layer was significantly higher than that of the PET film having no hard coat layer. Also, as shown in Table 2, the examples showed no change in appearance even under extremely high humidity and high temperature conditions, and were improved in moist heat resistance and heat resistance compared to the comparative examples. Therefore, it is considered that the integrated encapsulating sheet according to the present invention has higher durability than conventional sheets. [Industrial Applicability]

[0148] The integrated encapsulating sheet according to the present invention can be used, for example, as a sheet for encapsulating a substrate on which a plurality of light emitting elements are arranged. [Explanation of symbols]

[0149] DESCRIPTION OF SYMBOLS 1...integrated encapsulating sheet, 2...substrate with element, 10...black curable resin layer, 11...transparent curable resin layer, 12...glass layer, 13, 14...protective sheet, 15...curable resin layer, 20...substrate, 21, 22, 23...light-emitting element, 30...light-emitting electronic component, 40...black resin layer, 41...transparent resin layer, 45...resin layer, 50...integrated encapsulating curable sheet.

Claims

1. An integrated encapsulating sheet for pressure-bonding to a surface on which a plurality of light-emitting elements are arranged in an element-mounted substrate having a substrate on which a plurality of light-emitting elements are arranged, The integrated sealing sheet comprises at least a curable resin layer and a glass layer laminated together.

2. The curable resin layer includes at least a black curable resin layer and a transparent curable resin layer having higher light transmittance than the black curable resin layer, The integrated sealing sheet according to claim 1 , wherein the transparent curable resin layer is formed between the black curable resin layer and the glass layer.

3. The integrated sealing sheet according to claim 2, wherein the glass layer has a thickness of 30 to 70 μm.

4. a substrate having a plurality of light-emitting elements disposed thereon; an integrated encapsulating cured sheet pressure-bonded to a surface of the element-mounted substrate on which the plurality of light-emitting elements are arranged, the integrated encapsulating cured sheet includes at least a resin layer that is transmissible to light emitted from the light-emitting element and a glass layer laminated thereon, the resin layer and the glass layer being laminated in this order from the side closer to the element-mounted substrate, A light-emitting electronic component in which a part of the resin layer is filled between the plurality of light-emitting elements.

5. the resin layer includes at least a black resin layer and a transparent resin layer having a higher light transmittance than the black resin layer, the black resin layer is formed between the element-mounted substrate and the transparent resin layer, the thickness of the transparent resin layer is 0.1 to 5.0 times the height of the plurality of light-emitting elements; 5. The light-emitting electronic component according to claim 4, wherein the thickness of the black resin layer is 0.1 to 0.9 times the height of the plurality of light-emitting elements.

6. A step of pressure-bonding the integrated encapsulating sheet according to claim 1 to a surface of an element-mounted substrate on which a plurality of light-emitting elements are arranged; filling a portion of the curable resin layer between the plurality of light-emitting elements; and curing the curable resin layer.

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