Microoscillator and method for manufacturing the same

Abstract

To provide a microoscillator comprising a curved part having a three-dimensional curved surface and a connection part and capable of suppressing a connection failure between a joining material and the connection part.SOLUTION: The base of this microoscillator includes a curved part having a three-dimensional curved surface, and a bottomed cylindrical connection part 22 recessed from the curved part, which is a connection part with the other member. The mounting surface 22b of the connection part 22 is a flattened flat surface, and a part intersecting the curved part of a side surface 22c is a corner 22d. The mounting surface 22b is flattened by reheating the tip of a bottomed cylindrical support part obtained by thermally deforming a process material to deform it or partially removing the tip.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present disclosure relates to a micro-vibrator having a three-dimensional curved surface and a manufacturing method thereof. [Background technology]

[0002] In recent years, the development of autonomous driving systems for vehicles has progressed, and this type of system requires highly accurate self-location estimation technology. For example, development of a self-location estimation system equipped with GNSS and IMU for so-called level 3 autonomous driving is underway. GNSS is an abbreviation for Global Navigation Satellite System. IMU is an abbreviation for Inertial Measurement Unit, and is, for example, a 6-axis inertial sensor consisting of a 3-axis gyro sensor and a 3-axis acceleration sensor. In order to realize so-called level 4 or higher autonomous driving in the future, an IMU with even higher accuracy than the current one will be required.

[0003] A method for manufacturing a micro-vibrator used in such an inertial sensor is described in, for example, Patent Document 1. The method for manufacturing a micro-vibrator described in Patent Document 1 includes preparing a mold having a recess and a support part protruding from the center of the bottom surface of the recess, capable of vacuum decompression within the recess, and a reflow material such as a quartz plate, and placing the reflow material on the recess and heating it with a flame or the like while decompressing the recess. As a result, a part of the reflow material softened by heating is pulled into the recess, while the center of the softened part is supported by the support part, and a micro-vibrator having a curved surface part having a three-dimensional curved surface and a cylindrical connection part with a bottom recessed toward the center of the hemispherical part formed by the curved surface part can be manufactured. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] US Patent Application Publication No. 2018 / 0079129 Summary of the Invention [Problem to be solved by the invention]

[0005] In the micro-vibrator manufactured by the method described in Patent Document 1, when the center part of the softened reflow material is supported by the support part, the end part rises up, and the part supported by the support part becomes a connection part having a shape that is recessed from the end part. Through intensive research by the present inventors, it has been newly discovered that when a micro-vibrator having such a shape is bonded to a mounting board with a bonding material, the bonding material peels off, which may reduce the reliability of the inertial sensor.

[0006] In view of the above, the present disclosure aims to provide a micro-vibrator and a manufacturing method thereof that has a curved portion having a three-dimensional curved surface and a connection portion, and that is capable of suppressing peeling between the connection portion and the joining member when the joining portion is joined to another member such as a mounting board using a joining member. [Means for solving the problem]

[0007] According to one aspect of the present disclosure, a manufacturing method for a micro-vibration body having a curved portion (21) having a three-dimensional curved surface and a cylindrical connection portion (22) with a bottom recessed from the curved portion includes the steps of setting a thermoplastic processing material (10) in a mold (100) having a recess (110) and a support portion (120) protruding from the center of the recess, heating the processing material to reduce the pressure in the recess blocked by the processing material, and deforming the processing material along the recess and the support portion, forming a portion of the deformed processing material that was supported by the support portion as a supporting portion (12), forming a surface of the support portion opposite to an abutment surface (12a) that abutted against a tip surface of the support portion as an opposite surface (12b), and flattening the opposite surface to form a mounting surface (22b).

[0008] This allows the processing material to be thermally deformed along the recesses and the support columns, and a micro-oscillator can be manufactured in which the support portion that was supported by the support columns becomes a bottomed tubular connection portion, and the surface of the support portion opposite the surface that abutted against the tip surface of the support column becomes a flattened mounting surface. By making the mounting surface a flat surface, the occurrence of starting points that can cause poor bonding on the mounting surface when connecting to another component such as a mounting board with a bonding member is suppressed, resulting in a manufacturing method for a micro-oscillator that can suppress peeling between the connection portion and the bonding member.

[0009] According to another aspect of the present disclosure, the micro-vibrator comprises a base (20) having a curved portion (21) having a three-dimensional curved surface, and a bottomed, tubular connection portion (22) that is a connection site with another component and is recessed from the curved portion, the side of the curved portion with a larger outer diameter is the front surface (2a), the surface opposite the front surface is the back surface (2b), the tip of the connection portion on the back surface side is a mounting surface (22b) that is a flat surface, the surface of the connection portion adjacent to the mounting surface and facing the curved portion is the side surface (22c), the end of the side surface on the mounting surface side has a curved shape, and the boundary between the mounting surface and the side surface of the connection portion is an obtuse corner (22d).

[0010] This micro-vibrator includes a base having a curved surface portion having a three-dimensional curved surface and a cylindrical connection portion having a bottom recessed from the curved surface portion, and the side of the base having a smaller outer diameter serves as the back surface, and the tip of the connection portion on the back surface side serves as a mounting surface that is flat. Therefore, when connecting to another member such as a mounting board with a bonding member, the occurrence of starting points that may cause bonding failure on the mounting surface is suppressed, resulting in a micro-vibrator that can suppress peeling between the connection portion and the bonding member.

[0011] The reference symbols in parentheses attached to each component indicate an example of the correspondence between the component and specific components described in the embodiments described below. [Brief description of the drawings]

[0012] [Figure 1] 1 is a cross-sectional view showing an example of an inertial sensor using a micro-vibrator according to an embodiment. [Diagram 2] 2 is a perspective cross-sectional view showing a cross section of the inertial sensor of FIG. 1 and a part thereof. [Diagram 3] 1 is a cross-sectional view showing a micro-vibrator according to an embodiment. [Figure 4] FIG. 4 is an enlarged cross-sectional view showing region IV in FIG. [Diagram 5] 4 is a cross-sectional view showing a first step in the manufacturing process of the micro-vibrator. FIG. [Figure 6] FIG. 6 is a cross-sectional view showing the next step following FIG. 5. [Figure 7] FIG. 7 is an enlarged cross-sectional view showing region VII of FIG. 6. [Figure 8] 11A and 11B are explanatory diagrams of a bonding defect that occurs when a micro-vibrator of a comparative example is bonded to a mounting substrate. [Figure 9] 7 is a cross-sectional view showing an example of a planarizing step of the mounting surface of the micro-vibrator, which is the next step following FIG. 6. FIG. [Figure 10] FIG. 10 is a cross-sectional view corresponding to FIG. 9 and showing another example of the planarization step of the mounting surface of the micro-vibrator. [Figure 11] FIG. 10 is a cross-sectional view corresponding to FIG. 9 and showing another example of the planarization step of the mounting surface of the micro-vibrator. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the following embodiments, parts that are the same or equivalent to each other will be denoted by the same reference numerals.

[0014] (Embodiment) An example of an inertial sensor 1 using a micro-vibrator 2 according to an embodiment will be described with reference to the drawings.

[0015] Fig. 1 corresponds to a cross-sectional view taken along line II in Fig. 2, and in order to make the configuration of the inertial sensor 1 easier to understand, the outlines of a first electrode portion 53 and an electrode film 531, which are located in another cross section and will be described later, are indicated by dashed lines. In Fig. 2, in order to make the configuration of the inertial sensor 1 easier to understand, a micro-vibrator 2, a lower substrate 4, and an upper substrate 5, which will be described later, of the inertial sensor 1 are omitted, and a cross-sectional configuration of the micro-vibrator 2 is partially shown. In Fig. 4, in order to make it easier to see, a surface electrode 23, which will be described later, of the micro-vibrator 2 is omitted.

[0016] For the sake of convenience, as shown in FIG. 2, one direction in the plane of the mounting substrate 3 (described later) is referred to as the "x direction", the other direction perpendicular to the one direction on the same plane is referred to as the "y direction", and the normal direction to the xy plane is referred to as the "z direction". The x, y, and z directions in figures other than FIG. 2 correspond to the x, y, and z directions in FIG. 2, respectively. In addition, in this specification, "upper" refers to the direction along the z direction in the figure, and refers to the arrow side, and "lower" refers to the opposite side to the upper side. Furthermore, in this specification, the state in which the inertial sensor 1, the micro-vibrator 2, or the mounting substrate 3 is viewed from above in the z direction may be referred to as "top view".

[0017] [Inertial Sensor] 1, the inertial sensor 1 includes a micro-vibrator 2 and a mounting substrate 3, and a part of the micro-vibrator 2 is joined to the mounting substrate 3. The inertial sensor 1 is capable of detecting an angular velocity applied to the inertial sensor 1 based on a change in electrostatic capacitance between a part of the thin-walled micro-vibrator 2 capable of vibrating in a wine glass mode and a plurality of first electrode portions 53 of the mounting substrate 3, for example.

[0018] In this embodiment, as shown in FIG. 1, for example, the micro-vibration body 2 includes a base 20 having a curved surface portion 21 including an outline of a three-dimensional curved surface of a substantially hemispherical shape, and a connection portion 22 extending from the apex side of the imaginary hemisphere formed by the curved surface portion 21 toward the center side of the hemisphere. The micro-vibration body 2 can also be called an oscillator or a resonator. The connection portion 22 is a cylindrical recess with a bottom, and is a connection portion that is connected to another member such as a mounting board 3. For example, the micro-vibration body 2 has a birdbath-shaped base 20 having the curved surface portion 21 that is a three-dimensional curved surface in the shape of a bowl, and the Q value of the vibration is 10 5 That's all.

[0019] In this embodiment, the micro-vibrator 2 has a base 20 made of a thermoplastic reflow material such as quartz glass, glass containing additives such as borosilicate glass, metallic glass, silicon, etc. The base of the micro-vibrator 2 has a curved surface portion 21 and a connection portion 22 formed thereon by a manufacturing process described later, but is not limited to the above-mentioned example of a reflow material. The micro-vibrator 2 has a size on the order of millimeters, such as a thickness of the curved surface portion 21 and the connection portion 22 of 10 μm to 100 μm, a dimension in the z direction of 2.5 mm, and an outer diameter of the surface 2a side of the rim 211 described later of 5 mm.

[0020] The end of the curved surface portion 21 opposite to the connection portion 22 is the rim 211, and the rim 211 is, for example, substantially cylindrical. The substantially cylindrical shape includes not only a cylindrical shape in which the diameter from the upper end to the lower end of the outer surface and the inner surface of the rim 211 is the same, but also a tubular shape in which the diameter from the upper end to the lower end varies. In other words, the curved surface portion 21 has the rim 211 that is an annular portion of an annular curved surface shape. When the micro-vibrator 2 is mounted on the mounting substrate 3, the surface 2a of the rim 211 faces the multiple first electrode portions 53 of the mounting substrate 3 at a distance. For example, as shown in FIG. 2, the micro-vibrator 2 is mounted so that the rim 211 and the multiple first electrode portions 53 are equally spaced from each other. 3, the micro-vibrator 2 has a configuration in which the surface of the rim 211 that faces the z direction and connects the front surface 2a and the back surface 2b is the undersurface 211a, and the undersurface 211a protrudes downward in the z direction from the mounting surface 22b. When mounted on the mounting board 3, the micro-vibrator 2 is a portion that is in a hollow state where the curved surface portion 21 including the rim 211 does not contact other members. In this embodiment, the micro-vibrator 2 has a three-dimensional symmetrical structure in which the hollow rim 211 can vibrate in a wine glass mode when mounted on the mounting board 3.

[0021] The connection part 22 is a connection part that serves as an axis part to be connected to another member such as the mounting substrate 3, and is a cylindrical recess with a bottom. A recess bottom surface 22a on the front surface 2a side of the connection part 22 can be used, for example, for suction and transportation when mounting the micro-vibrator 2 on the mounting substrate 3. The side of the connection part 22 opposite to the recess bottom surface 22a, i.e., the surface on the back surface 2b side, is a mounting surface 22b that faces the mounting substrate 3.

[0022] For ease of explanation, hereinafter, as shown in Figures 3 and 4, the surface adjacent to mounting surface 22b and facing the curved portion 21 will be referred to as "side surface 22c," and the intersection portion between mounting surface 22b and side surface 22c, i.e., the boundary portion, will be referred to as "corner portion 22d."

[0023] In order to improve the bonding strength with the connected member such as the mounting board 3, the mounting surface 22b of the connection part 22 is made into a single flat surface by a manufacturing process described later. The end of the side surface 22c of the connection part 22 on the mounting surface 22b side is a curved surface, and the mounting surface 22b and the side surface 22c are not a continuous surface that is continuous as a single curved surface, but a discontinuous surface in which the flat surface and the curved surface intersect, and the intersection portion becomes a corner 22d. In other words, as shown in FIG. 4, for example, in the cross-sectional view of the connection part 22, the intersection point of the linear mounting surface 22b and the curved side surface 22c becomes the corner 22d. The corner 22d is generated by a flattening process described later when forming the mounting surface 22b, and is an obtuse angle in the example of FIG. 4, but the angle is not particularly limited. The process of forming the mounting surface 22b of the connection part 22 will be described later.

[0024] The surface electrode 23 is, for example, but not limited to, a laminated film of an adhesive layer formed of chromium or titanium from the base side and a conductive layer formed of any conductive material such as gold or platinum. The surface electrode 23 is formed on the front surface 2a and the back surface 2b of the micro-vibrator 2 by any film formation method such as sputtering, vapor deposition, CVD, or ALD. CVD is an abbreviation for Chemical Vapor Deposition. ALD is an abbreviation for Atomic Layer Deposition. The surface electrode 23 is formed on at least the mounting surface 22b and the front surface 2a of the rim 211, for example, and these parts are electrically connected. The surface electrode 23 may be a solid shape that covers the entire front and back surfaces of the micro-vibrator 2, or may be a pattern shape that covers a part of the front and back surfaces. For example, the part of the surface electrode 23 that covers the mounting surface 22b of the connection portion 22 of the micro-vibrator 2 is connected to the mounting board 3 via the bonding member 52.

[0025] The mounting substrate 3 includes a lower substrate 4 and an upper substrate 5, which are bonded together, as shown in FIG. 1, for example. For example, the mounting substrate 3 is obtained by subjecting the lower substrate 4, which is made of borosilicate glass, an insulating material, to etching and wiring film formation, and then an upper substrate 5, which is made of silicon, a semiconductor material, to the lower substrate 4 by anodizing and patterning. The mounting substrate 3 includes, for example, on the upper substrate 5 side, a plurality of inner frame portions 51, a plurality of first electrode portions 53 arranged apart from each other so as to surround the inner frame portion 51, and a second electrode portion 54 surrounding the plurality of first electrode portions 53 at a distance. The mounting substrate 3 also includes, for example, on the lower substrate 4 side, a ring-shaped groove 41 surrounding the plurality of inner frame portions 51 while separating the inner frame portion 51 from the plurality of first electrode portions 53, and a plurality of wirings 42 spanning the inside and outside of the groove 41.

[0026] 1 and 2, the groove 41 is a groove provided between the inner frame portion 51 and the multiple first electrode portions 53, and is formed by wet etching. The groove 41 has a dimension corresponding to the outer diameter of the rim 211 of the micro-vibrator 2, and is provided so that the rim 211 does not come into contact with the mounting substrate 3 when the micro-vibrator 2 is mounted on the mounting substrate 3.

[0027] The wiring 42 is made of a conductive material such as aluminum, and is disposed so as to pass between the first electrode portions 53 and is electrically independent from the first electrode portions 53. For example, a plurality of wirings 42 are provided, and one end of each wiring 42 is connected to the inner frame portion 51 and the other end is connected to the second electrode portion 54 while straddling the groove 41 in the lower substrate 4, electrically connecting these together. This allows the mounting substrate 3 to apply a voltage to the surface electrode 23 of the micro-vibrator 2 via the second electrode portion 54, the wiring 42, and the inner frame portion 51.

[0028] The inner frame portion 51 is formed together with a plurality of first electrode portions 53 and second electrode portions 54, for example, by performing dry etching such as DRIE on the upper substrate 5 anodically bonded to the lower substrate 4. DRIE is an abbreviation for Deep Reactive Ion Etching. The inner frame portion 51 is formed, for example, in a circular ring shape when viewed from above, and is configured so that the connection portion 22 of the micro-vibrator 2 can be inserted into the enclosed area.

[0029] The bonding member 52 is made of any conductive material, such as gold-tin or sintered silver, and fixes the connection portion 22 of the micro-vibrator 2 to the mounting substrate 3 and electrically connects them.

[0030] The first electrode parts 53 each have an electrode film 531 formed on the upper surface thereof, and are arranged at equal intervals from each other so as to form a ring on the xy plane while surrounding the rim 211 of the micro-vibrator 2 at a predetermined distance in top view. The first electrode parts 53 are connected to the electrode film 531 by wires (not shown), for example, and the potential can be controlled by an external circuit board (not shown). The first electrode parts 53 form a capacitor with the rim 211 of the micro-vibrator 2, and the electrostatic capacitance between the rim 211 can be detected. For example, some of the first electrode parts 53 are detection electrodes that detect electrostatic capacitance, and the other parts are drive electrodes that vibrate the micro-vibrator 2 by electrostatic force.

[0031] The second electrode section 54 is, for example, in a frame shape surrounding the inner frame section 51 and the multiple first electrode sections 53 arranged around the inner frame section 51 when viewed from above. The second electrode section 54 has, for example, at least one electrode film 541 made of aluminum or the like on the upper surface, and a wire (not shown) is connected to the electrode film 541. The second electrode section 54 is connected to the surface electrode 23 of the micro-vibration body 2 at least via the wiring 42, and may have any configuration that allows a voltage to be applied thereto, and may have a shape other than a frame shape, may be arranged in a plurality of parts, and the shape, arrangement, etc. may be appropriately changed.

[0032] The above is an example of the basic configuration of the inertial sensor 1. Note that the inertial sensor 1 is not limited to the above configuration, and some configurations of the micro-vibrator 2 and the mounting substrate 3 may be changed. For example, the micro-vibrator 2 may be configured such that the lower surface 211a of the rim 211 facing the z direction and the mounting surface 22b of the connection portion 22 are located on the same plane, or the mounting surface 22b protrudes from the lower surface 211a. For example, when the micro-vibrator 2 is configured such that the mounting surface 22b protrudes from the rim 211, the mounting substrate 3 may be configured without the groove 41.

[0033] [Method of manufacturing the micro-vibrator] Next, a method for manufacturing the micro-vibration body 2, in particular a method for forming the three-dimensional curved surface of the base portion 20, will be described with reference to the drawings.

[0034] In FIG. 9, in order to make it easier to understand the planarization process for forming the flat mounting surface 22b, the outline of the opposite surface 12b having a protruding portion 12c (described later) is shown by a broken line.

[0035] 5, a processing material 10 constituting the base 20 of the micro-vibration body 2 and a mold 100 for forming the curved surface portion 21 and the connection portion 22 are prepared. The processing material 10 is, for example, a plate material made of quartz glass with a thickness of 100 μm. The processing material 10 is arranged so as to cover the recess 110 of the mold 100.

[0036] The mold 100 includes, for example, a recess 110 having a substantially cylindrical shape, a support portion 120 having a substantially cylindrical shape protruding from the bottom of the recess 110, and a plurality of exhaust holes 130 that communicate with the recess 110, are connected to a vacuum source (not shown), and enable decompression of the space defined by the recess 110. The mold 100 is made of any material that has a higher heat resistance than the processing material 10, such as carbon or boron nitride, does not react with the softened processing material 10, and has a predetermined or higher thermal conductivity.

[0037] The shapes and sizes of the recesses 110 and the support 120 in the mold 100, and the number and arrangement of the exhaust holes 130 are not limited to the example shown in FIG. 5. For example, the recesses 110 may be substantially hemispherical with a constant radius of curvature recessed from the upper surface 100a, or may have a composite shape with a flat portion and a curved portion as the inner wall surface, and the shape, size, and the like may be changed as appropriate. The support 120 may be, for example, cylindrical or polygonal. The exhaust hole 130 may be only one or three or more, and may be arranged in a place other than the vicinity of the base of the support 120. In this way, the shape, etc. of the mold 100 may be changed as appropriate according to the design of the base 20 of the micro-vibration body 2.

[0038] Next, as shown in FIG. 6, the processing material 10 set in the mold 100 is heated by the heating device 200. The heating device 200 is, for example, a burner, and uses a flame F to locally heat the portion of the processing material 10 covering the recess 110. The heating device 200 may be any heat source other than a burner, as long as it can heat the processing material 10 to a temperature equal to or higher than the softening point. The processing material 10 is heated by the flame F of the heating device 200, and a softened portion that exceeds the temperature of the softening point is generated. Then, by depressurizing the closed space formed by the recess 110 and the processing material 10 in the mold 100 with a vacuum source (not shown), the processing material 10 is pushed by the pressure difference between the atmospheric pressure and the closed space, and the softened portion is deformed toward the recess 110 and the support portion 120. At this time, the processing material 10 is pulled and deformed at the portion not supported by the support portion 120 to become the curved portion 11, and the portion supported by the support portion 120 becomes the bottomed cylindrical support portion 12. In the workpiece 10 , the curved surface portion 11 becomes the curved surface portion 21 , and the support portion 12 becomes the connection portion 22 .

[0039] 7, the support portion 12 has a surface that abuts against the tip surface of the support portion 120 as a contact surface 12a, a surface opposite to the contact surface 12a as an opposite surface 12b, and a protruding portion 12c that protrudes from the center side is generated at the end of the opposite surface 12b. The support portion 12 undergoes a flattening process described later, whereby the protruding portion 12c is removed or re-deformed, so that the opposite surface 12b becomes a flat surface.

[0040] Here, a case where the micro-vibrator 6 of the comparative example is bonded to the mounting substrate 3 while leaving the portion corresponding to the protruding portion 12c, will be described with reference to FIG.

[0041] For ease of viewing, Figure 8 shows only a portion of the micro-vibration body 6 of the comparative example including the connection portion 61 and a portion of the mounting substrate 3 including the inner frame portion 51, while omitting other portions of the micro-vibration body 6 and mounting substrate 3 of the comparative example.

[0042] The micro-vibration body 6 of the comparative example has, for example, a three-dimensional curved surface portion (not shown) of a substantially hemispherical shape corresponding to the curved surface portion 21, and a cylindrical connection portion 61 with a bottom recessed from the three-dimensional curved surface portion toward its center. The bottom surface of the cylindrical inner side of the connection portion 61 is a recessed bottom surface 61a, and the opposite surface of the recessed bottom surface 61a is a mounting surface 61b, and the mounting surface 61b is a convex portion 611 whose end portion protrudes from the center and has a concave curved surface recessed at the center. When the micro-vibration body 6 of the comparative example is bonded to the mounting board 3 via the bonding member 52 as shown in FIG. 8, a gap 7 not filled with the bonding member 52 may occur due to the concave curved surface of the mounting surface 61b. In this case, a predetermined region of the mounting surface 61b including the center of the micro-vibration body 6 of the comparative example is not in contact with the bonding member 52, and the bonding strength with the mounting board 3 is reduced, resulting in reduced reliability.

[0043] On the other hand, in the micro-vibration body 2 according to the embodiment, the mounting surface 22b is flattened by flattening, so that no gaps are generated between the mounting surface 22b and the bonding member 52, and the reduction in bonding strength due to the shape of the mounting surface 22b is suppressed. For example, as shown in FIG. 9, the flattening is performed by hot stamping in which the opposite surface 12b of the support part 12 is pressed against the flat surface of the heating member 300. The heating member 300 is made of any material having a higher heat resistance than the processing material 10, and is heated to a temperature equal to or higher than the softening point of the processing material 10. As a result, the convex portion 12c of the opposite surface 12b is re-deformed, and the portion of the opposite surface 12b pressed against the flat surface of the heating member 300 is flattened to form the subsequent mounting surface 22b.

[0044] The flattening process is not limited to the above-mentioned hot stamping, and may be a method in which the opposite surface 12b is reheated by lamp annealing or laser annealing, and the reheated opposite surface 12b is pressed by another member having a flat surface. In other words, the flattening process may be performed by separating a process of reheating the opposite surface 12b of the support part 12 from a process of re-deforming by pressing thereafter.

[0045] The flattening process may be performed, for example, as shown in Fig. 10, by removing the processing material 10 from the mold 100 after deformation, irradiating the laser beam from the outside of the curved portion 11 toward the opposite surface 12b, and cutting and removing the convex portion 12c of the opposite surface 12b. In this case, as shown by the dashed line in Fig. 10, the opposite surface 12b of the support portion 12 has a flat cut surface caused by the laser beam from the side, and the convex portion 12c is removed. Note that the above-mentioned laser processing is focused on the opposite surface 12b and has no effect on the curved portion 11, so it is also effective in the case where the lower surface 111a of the end 111 of the curved portion 11, which will later become the rim 211, protrudes from the opposite surface 12b of the support portion 12.

[0046] Furthermore, the flattening process may be performed, for example, as shown in Fig. 11, by removing the processing material 10 from the mold 100 after deformation, and physically cutting, grinding or polishing the opposite surface 12b of the support portion 12 using a processing device 400 to remove the convex portion 12c and form a flat surface. The flattening process may also be performed by a cutting process method such as a water jet, which sprays water at high pressure to cut the opposite surface 12b. The flattening process by physical cutting or the like is also effective, for example, when the opposite surface 12b of the support portion 12 and the lower surface 111a of the end portion 111 are on the same plane, or when the opposite surface 12b protrudes beyond the lower surface 111a.

[0047] In addition, the portion of the processing material 10 that protrudes from the recess 110, i.e., the unnecessary portion, is removed by a separate process such as laser processing or CMP, but may be removed either before or after the planarization process. CMP is an abbreviation for Chemical Mechanical Polishing. When the unnecessary portion is removed by CMP or the like, for example, the processing material 10 after deformation is sealed with a sealing material made of any curable resin material. Then, after the unnecessary portion is removed together with the sealing material by CMP, the sealing material is entirely removed by any method such as heating or applying a chemical solution, and the remaining portion of the processing material 10 can be taken out. Finally, the surface electrode 23 is formed on the base 20 after the planarization process by any film formation method, thereby manufacturing the micro-vibration body 2 in which the mounting surface 22b of the connection portion 22 is made flat.

[0048] According to this embodiment, by forming the mounting surface 22b by planarization, when the connection portion 22 is joined to another member such as the mounting board 3 by the joining member 52, the entire mounting surface 22b comes into contact with the joining member 52, making it possible to manufacture a micro-vibrator 2 that is suppressed from causing peeling. The micro-vibrator 2 manufactured by this manufacturing method has a flat mounting surface 22b, which suppresses peeling between the connection portion 22 and the joining member 52, and has a structure that ensures bonding strength and therefore reliability.

[0049] (Other embodiments) Although the present disclosure has been described based on the embodiment, it is understood that the present disclosure is not limited to the embodiment or structure. The present disclosure also includes various modifications and modifications within the equivalent range. In addition, various combinations and forms, and other combinations and forms including only one element, more than one, or less than one, are also within the scope and concept of the present disclosure.

[0050] In each of the above embodiments, it goes without saying that the elements constituting the embodiment are not necessarily essential, except when it is specifically stated that they are essential or when it is clearly considered essential in principle. In addition, in each of the above embodiments, when the numbers, values, amounts, ranges, etc. of the components of the embodiment are mentioned, they are not limited to the specific numbers, except when it is specifically stated that they are essential or when it is clearly limited to a specific number in principle. In addition, in each of the above embodiments, when the shapes, positional relationships, etc. of the components are mentioned, they are not limited to the shapes, positional relationships, etc., except when it is specifically stated that they are essential or when it is clearly limited to a specific shape, positional relationship, etc. in principle. [Explanation of symbols]

[0051] 10...working material, 12...supporting portion, 12a...contact surface, 12b...opposite surface 12c... (opposite surface) end portion, 20... base portion, 21... curved surface portion, 211... rim, 211a... lower surface 22...connection portion, 22b...mounting surface, 22c...side surface, 22d...corner portion, 2a...front surface, 2b...rear surface 100: mold; 110: recess; 120: support portion

Claims

1. A method for manufacturing a micro-vibration body having a curved surface portion (21) having a three-dimensional curved surface and a bottomed tubular connection portion (22) recessed from the curved surface portion, comprising: A thermoplastic processing material (10) is set in a mold (100) having a recess (110) and a support portion (120) protruding from the center of the recess; heating the processed material, reducing the pressure in the recesses blocked by the processed material, and deforming the processed material along the recesses and the support portions; a portion of the deformed processed material that was supported by the support portion as a support portion (12), a surface of the support portion opposite a contact surface (12a) that was in contact with the tip surface of the support portion as an opposite surface (12b), and the opposite surface is flattened to form a mounting surface (22b).

2. 2. The method for manufacturing a micro-vibration body according to claim 1, wherein the flattening of the opposite surface is carried out by completing the deformation of the processing material, stopping heating, and then removing a part or all of the opposite surface including an end portion (12c) protruding beyond the center.

3. 2. The method for manufacturing a micro-vibration body according to claim 1, wherein the opposite surface is flattened by reheating the opposite surface resulting from the deformation of the processing material to deform it into a flat surface.

4. 4. The method for manufacturing a micro-vibrator according to claim 1, wherein the processing material is quartz glass.

5. A micro-vibration body, The present invention comprises a base (20) having a curved surface portion (21) having a three-dimensional curved surface, and a connection portion (22) having a bottom and a cylindrical shape recessed from the curved surface portion, which is a connection portion with another member; a surface (2a) of the curved portion having a larger outer diameter, a surface (2b) opposite to the surface (2a) of the curved portion, and a tip of the connection portion on the side of the back surface (2b) being a mounting surface (22b) that is a flat surface; A surface of the connection portion adjacent to the mounting surface and facing the curved portion is a side surface (22c), and an end portion of the side surface on the mounting surface side is curved, The connecting portion has a corner (22d) at a boundary between the mounting surface and the side surface.

6. The micro-vibration body according to claim 5 , wherein the base portion is made of quartz glass.

7. The micro-vibration body described in claim 5 or 6, wherein the end of the curved portion opposite the connection portion is a rim (211), the surface of the rim connecting the front surface and the back surface is a bottom surface (211a), and one of the mounting surface and the bottom surface of the base protrudes more than the other.

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