Imaging unit, imaging apparatus, and imaging system

Abstract

To reduce ESD noise superimposed on an image signal with a simple configuration in an imaging unit having a camera shake correction mechanism mounted thereon.SOLUTION: An imaging unit is accommodated in a housing, and comprises: an image pick-up device; an actuator unit including a movable part that movably supports the image pick-up device in a plane perpendicular to an optical axis, and a conductive stationary part relatively fixed to the movable part; a processing board that transmits and receives signals including an image signal to and from the image pick-up device; a conductive plate that is connected with the processing board, and has a surface facing the stationary part; a flexible wiring board that is arranged between the image pick-up device and the processing board, and includes wiring through which the signals including the image signal flow; and a conductive member that electrically connects the plate and the stationary part to each other, and has a facing surface facing the flexible wiring board.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an imaging unit, an imaging device, and an imaging system that are provided with a correction unit that corrects blurring during shooting. [Background technology]

[0002] In recent years, as imaging devices have become more powerful, an increasing number of imaging devices are equipped with a shake correction mechanism that moves the imaging element to suppress the influence of blurring caused by camera shake and the like on the image. At the same time, with the advancement of functionality such as lower power consumption and higher image quality of captured videos, the resistance of imaging devices to external noise such as ESD (Electro Static Discharge) has decreased. In these imaging devices, an element board on which the imaging element is mounted is electrically connected to a processing board on which a control circuit, an image processing circuit, and the like are mounted. Patent Document 1 discloses that a band-shaped flexible wiring board having flexibility so as not to impede the operation of the imaging element is used as a method of this connection in an imaging device equipped with a shake correction mechanism. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2006-081006 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, the flexible wiring board described in Patent Document 1 is susceptible to the influence of external noise such as ESD. The influence of noise can cause image distortion during image capture or operational errors in the imaging device, and depending on the level of the noise, it may actually cause these problems.

[0005] The present disclosure has been made in consideration of such phenomena, and one of its objects is to reduce ESD noise with a simple configuration in an imaging unit equipped with a shake correction mechanism. [Means for solving the problem]

[0006] In order to solve the above problems, an imaging unit according to one aspect of the present disclosure includes: An imaging unit housed in a housing, An imaging element; an actuator unit including a movable portion that supports the image sensor so as to be movable within a plane perpendicular to an optical axis, and a conductive fixed portion that is fixed relatively to the movable portion; a processing board for transmitting and receiving signals including image signals between the imaging element and the processing board; a conductive plate connected to the processing board and having a surface facing the fixed portion; a flexible wiring board disposed between the imaging element and the processing board, the flexible wiring board including wiring through which a signal including the image signal flows; a conductive member electrically connecting the plate and the fixed portion and having a surface facing the flexible wiring board; The present invention is characterized by comprising: Effect of the Invention

[0007] According to one aspect of the present disclosure, in an imaging unit equipped with a shake correction mechanism, ESD noise superimposed on an image signal can be reduced with a simple configuration. [Brief description of the drawings]

[0008] [Figure 1] FIG. 2 is a diagram illustrating a cross-sectional configuration of the imaging unit according to the first embodiment. [Diagram 2] FIG. 2 is a perspective view showing the structure of an imaging unit according to the first embodiment. [Diagram 3] 1A and 1B are a perspective view and an exploded perspective view of an actuator unit according to a first embodiment. [Figure 4] 3 is a perspective view showing the imaging unit 100 illustrated in FIG. 2 as viewed from the processing board 10 side, and a schematic diagram showing the configuration present in each cross section showing the opposing portions of the flexible wiring board 7 and the conductive member 14. [Diagram 5] 11 is a graph showing a simulation result regarding the effect of the present disclosure. [Figure 6] FIG. 2 is a schematic diagram showing the appearance of an imaging device (camera) equipped with an imaging unit. [Figure 7] FIG. 4 is a perspective view showing a connection state between a processing substrate and a plate. [Figure 8] FIG. 2 is a perspective view showing a mounting method of the actuator, the imaging element, and the sensor substrate. [Figure 9] 13A and 13B are diagrams illustrating modified examples of the conductive member. [Figure 10] FIG. 11 is a schematic diagram of an imaging unit according to a second embodiment. [Figure 11] FIG. 13 is a partial schematic diagram of an imaging unit according to a fourth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, an embodiment of an imaging unit according to the present disclosure, an imaging device including the imaging unit, and an imaging system including the imaging device and, for example, a lens device will be described with reference to the drawings. However, the embodiment described below is one form of the present disclosure, and the present disclosure according to the claims is not limited thereto. In addition, although a number of features are described in the embodiment, not all of these features are essential to the present disclosure, and the features may be combined in any manner.

[0010] The dimensions, materials, shapes, and relative positions of components described in the following examples are arbitrary and can be changed according to the configuration of the device to which the present disclosure is applied or various conditions. In addition, common configurations are described by mutually referring to multiple drawings, and descriptions of configurations with common symbols are omitted as appropriate. Separate items such as different members that are appropriate to be given the same name will be distinguished by adding "item and number", such as the first item and the second item.

[0011] In an imaging device equipped with a shake correction mechanism, an element board on which an imaging element is mounted and a processing board on which a control circuit and the like are mounted are connected by a band-shaped flexible wiring board having flexibility so as not to impede the operation of the imaging element. The flexible wiring board is arranged to have a folded portion in the imaging device, and this folded portion is intended to suppress loads such as pulling or pressing on the imaging element and the like by the flexible wiring board during shake correction. In this disclosure, a conductive member (such as conductive member 14 described later) connected to a GND potential is arranged at a position substantially opposite the folded portion, thereby suppressing the influence of ESD on the flexible wiring board. Specific configuration examples of this disclosure will be described below as examples.

[0012] <First Example> In the following description of the embodiments, an imaging unit, which is a main component of an imaging device and is housed in a housing, will be described first. Fig. 1 is a cross-sectional view showing a schematic structure of an imaging unit 100 according to a first embodiment. Fig. 2 is a perspective view showing the structure of the imaging unit 100, and Fig. 1 corresponds to the configuration present in the cross section shown by the line AA' of the imaging unit 100 shown in Fig. 2.

[0013] Here, the configuration of the imaging unit 100 will be described first with reference to Fig. 2. The imaging unit 100 according to this embodiment includes an actuator unit 5, an imaging element 6, a flexible wiring board 7 (see Fig. 1), a first connector 8 (see Fig. 1), a second connector 9 (see Fig. 1), a processing board 10, and a plate 11. In this embodiment, the imaging unit 100 also includes a conductive member 14 as a characteristic configuration of the present disclosure.

[0014] The imaging element 6 photoelectrically converts an optical image obtained by focusing light incident on the imaging element 6 along the optical axis 4, and outputs an image signal to the processing board 10. Furthermore, the power and other requirements for the imaging element 6 are supplied from the processing board 10. More specifically, the imaging element 6 is composed of an image sensor that performs photoelectric conversion, and a sensor board provided with circuits and wiring required for mutual communication with the processing board 10. This image sensor can be composed of, for example, a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor.

[0015] The image sensor converts incident light into an electrical signal, and an optical path for light incident in a direction approximately parallel to the optical axis 4 is secured on the light receiving surface side of the image sensor (the upper surface of the imaging element 6 in FIG. 1). The image sensor is housed in a package, and a ceramic package can be used for the package. Also, a package is not necessarily required, and the image sensor may be integrated into a substrate. The sensor substrate is provided with circuits, wiring, and components necessary for the operation of the image sensor.

[0016] The image signal is transmitted from the imaging element 6 to the processing board 10 via the first connector 8, the flexible wiring board 7, and the second connector 9. The imaging element 6 and the processing board 10 communicate with each other not only for the image signal but also for power transmission and control signals. Referring to FIG. 1, the first connector 8 is mounted on the surface of the sensor board opposite to the image sensor (the lower surface of the imaging element 6 in FIG. 1). One terminal of the flexible wiring board 7 is connected to the first connector 8. The other terminal of the flexible wiring board 7 is connected to a second connector 9 provided on the surface (back surface) of the processing board 10 opposite to the surface on which the imaging element 6 is disposed.

[0017] In this embodiment, the flexible wiring board 7 extends from one terminal connected to the first connector 8 so as to be parallel to the imaging element 6, and is folded back at a folding back portion 12, which will be described later in detail. Thereafter, it again extends so as to be parallel to the imaging element 6, is folded back again at a detouring portion 13, which will be described later in detail, reaches the rear surface of the processing board 10, and is connected to a second connector 9 provided on the rear surface of the processing board 10 at the detouring portion 13 side. That is, in this embodiment, the flexible wiring board 7 is disposed in the imaging unit 100 so as to form an inverted S-shape in FIG. 1. The flexible wiring board 7 includes differential signal wiring used for transmitting high-speed image signals, a GND line used for forming a reference potential, a power supply line used for transmitting power, and the like. The routing of the flexible wiring board 7 between other components in the imaging unit 100 and the details of their positional relationships will be described later.

[0018] The imaging element 6 is held by the actuator unit 5. The actuator unit 5 is a shake correction mechanism that suppresses the influence of blurring due to camera shake or the like on an image by translating the imaging element 6 in a plane substantially perpendicular to the optical axis 4 or by rotating the imaging element 6 about the optical axis 4. The actuator unit 5 is fixed to the exterior of the imaging unit 100 (see the camera exterior 210 in FIG. 6) with screws or the like. The actuator unit 5 (including components 61, 51, 71, and 75 in FIG. 1, which will be described later) and the processing board 10 are disposed to face each other.

[0019] In this embodiment, a conductive plate 11 is disposed between the actuator unit 5 and the processing substrate 10. The processing substrate 10 generates heat due to image processing and the like, and by disposing the plate 11 as a heat dissipation plate, it becomes possible to dissipate this heat to the outside. For this reason, the plate 11 is provided so as to face the processing substrate 10 over a wide surface, and is fixed to the processing substrate 10 at multiple points with screws or the like, and has a configuration in which it is electrically connected. In addition, the plate 11 has a wide facing surface and multiple electrical connection points, and therefore serves as a heat dissipation plate that dissipates heat from the processing substrate 10 to the outside and also serves as a GND connection plate.

[0020] Next, the configuration of the actuator unit 5 will be described with reference to Figures 3(a) and 3(b). Figure 3(a) is a perspective view of the actuator unit 5, and Figure 3(b) is an exploded perspective view of the actuator unit 5. The actuator unit 5 is composed of a movable part 50 that is movable relatively to the above-mentioned processing substrate 10 and plate 11, and an upper surface fixing part 60 and a lower surface fixing part 70 that are fixed relatively to the above-mentioned processing substrate 10 and plate 11.

[0021] The movable part 50 actually supports the imaging element 6. In this embodiment, the movable part 50 has a movable frame 51, a coil 53a, a coil 53b, a coil 53c, and a flexible wiring board (not shown) that transmits power to the three coils 53a, 53b, and 53c. More specifically, the imaging element 6 is fixed to the movable frame 51.

[0022] The movable frame 51 is provided with a substantially rectangular hole 22 in the center parallel to the optical axis 4, and holes 23a, 23b, and 23c on the end sides. Each coil is mounted on a flexible wiring board (not shown) arranged on the lower surface fixing part 70 side, and is arranged in the holes 23a, 23b, and 23c, respectively, and exposed on the upper surface fixing part 60 side. In order to fix the positions of the coils 53a, 53b, and 53c, insulating positioning members are provided between each coil and each hole. By providing the holes 21 (described later) and 22, it is possible to prevent the mounted components such as the first connector 8 of the sensor board provided on the imaging element 6 from interfering with the movable frame 51 and the base plate 71. The flexible wiring board 7 is connected to the first connector 8 and is configured to pass through the holes 21 and 22.

[0023] The upper surface fixing part 60 is composed of an upper surface yoke 61. The lower surface fixing part 70 is composed of a base plate 71, main spacers 73a, 73b, 73c, a lower surface yoke 75, and magnets 76a, 76b, 76c, 76d, 76e, 76f, which are permanent magnets. Rolling balls (not shown) that support the movable part 50 are disposed between the lower surface fixing part 70 and the movable part 50. Either or both of the upper surface fixing part 60 and the lower surface fixing part 70 are fixed to the exterior (not shown) of the imaging unit 100 with screws or the like.

[0024] The base plate 71 is made of a conductive metal, such as non-magnetic stainless steel. The base plate 71 has holes corresponding to the magnets 76a, 76b, 76c, 76d, 76e, and 76f, and the thickness of the base plate 71 is configured so that the surfaces of the magnets protrude from the holes toward the movable part 50. The base plate 71 and the lower yoke 75 are fixed with screws (not shown), and the magnets 76a, 76b, 76c, 76d, 76e, and 76f, which have a larger dimension in the thickness direction than the base plate 71, are fixed to the lower yoke 75 so as to protrude from the base plate 71. In addition, a hole 21 that is substantially rectangular and parallel to the optical axis 4 is opened in the center of the base plate 71, and the flexible wiring board 7 described later is arranged to pass through the hole 21.

[0025] The upper yoke 61 and the lower yoke 75 arranged on the lower fixing part 70 are made of a magnetic metal body. The upper yoke 61, the lower yoke 75 arranged on the lower fixing part 70, and the magnets 76a, 76b, 76c, 76d, 76e, and 76f form a magnetic circuit, which is a so-called closed magnetic circuit. The magnets 76a, 76b, 76c, 76d, 76e, and 76f are attached and fixed to the lower yoke 75 in a state of being attracted to the lower yoke 75. Each magnet is magnetized in the direction of the optical axis 4, and the combinations of adjacent magnets, magnets 76a and 76b, magnets 76c and 76d, and magnets 76e and 76f, are magnetized in different directions. In this way, a strong magnetic flux density is generated between the upper yoke 61 and the lower yoke 75 in the direction of the optical axis 4. Main spacers 73a, 73b, and 73c are arranged between the upper yoke 61 and the lower yoke 75 to maintain a predetermined distance. The movable part 50 is arranged with a gap between the upper yoke 61 and the lower yoke 75. Rubber is installed on the cylindrical side surfaces of the main spacers 73a, 73b, and 73c to form the mechanical ends (so-called stoppers) of the movable part.

[0026] A flexible wiring board (not shown) mounted on the movable frame 51 supplies each coil with power required for driving. By passing a current through each coil from a driving circuit (not shown) via a flexible wiring board, a force according to Fleming's left-hand rule is generated, and the movable part 50 can be moved. In addition, a magnetic sensor (not shown) or the like detects the position of the movable part 50 when it moves in a plane substantially perpendicular to the optical axis 4, and a correction operation for blurring can be performed by feedback control. For the magnetic sensor, for example, a Hall element or the like can be used. However, the position of the movable part 50 when it moves may be detected by using a magnetic circuit including the magnets 76a, 76b, 76c, 76d, 76e, and 76f described above. Alternatively, a magnet and a magnetic circuit for position detection may be separately provided.

[0027] Note that the imaging operation by the imaging element 6 and the shake correction operation by the actuator unit 5 require the execution of imaging processing, image processing, recording / playback processing, and control processing of the actuator unit 5. However, since these processes executed in this embodiment are executed by generally known techniques or configurations, detailed explanations thereof will be omitted in this specification.

[0028] Next, a detailed configuration of the flexible wiring board 7 and its wiring within the imaging unit 100 will be described with reference to FIG. 1. The flexible wiring board 7 is a substantially rectangular flexible wiring board with one end electrically connected to the sensor board of the imaging element 6 and the other end electrically connected to the processing board 10. The flexible wiring board 7 has a first connection terminal (not shown) at one end for connection to a first connector 8. The flexible wiring board 7 also has a second connection terminal (not shown) at the other end for connection to a second connector 9. These first and second connection terminals are electronic components and are mounted perpendicular to the surface of the flexible wiring board 7.

[0029] The first connector 8 is mounted in a direction perpendicular to the surface of the sensor board. Therefore, when the first connection terminal is inserted into the first connector 8 and the sensor board and the flexible wiring board 7 are connected, the flexible wiring board 7 extends in a direction substantially parallel to the sensor board. In this embodiment, the flexible wiring board 7 extends in a direction from A' to A in the direction in which the AA' line extends in FIG. 1. After extending in the direction of A, the flexible wiring board 7 changes its routing direction via the folded portion 12. After passing through the folded portion 12, the flexible wiring board 7 extends in a direction from A to A' in the direction in which the AA' line extends.

[0030] During image stabilization operation by actuator unit 5, image sensor 6 moves within a plane perpendicular to optical axis 4. By providing folded-back portion 12 with a sufficient length in flexible wiring board 7 in this manner, the force with which flexible wiring board 7 pulls or pushes image sensor 6 during image stabilization operation is reduced to the minimum, and interference with the image stabilization operation by actuator unit 5 can be suppressed.

[0031] In this embodiment, the flexible wiring board 7 passes through the hole 22 provided in the movable frame 51 and the hole 21 provided in the base plate 71 between the connection part with the first connector 8 and the folded part 12. By arranging the flexible wiring board 7 in this manner, it is possible to pull out the flexible wiring board 7 on the opposite side of the image sensor of the imaging element 6 without interfering with each mechanical member. The flexible wiring board 7 that extends from the folded part 12 in the direction of A' changes its direction again via the detour part 13 that detours around the end of the processing board 10. After passing through the detour part 13, the flexible wiring board 7 extends again in the direction of A and is connected to the surface of the processing board 10 located on the opposite side of the imaging element 6. This connection is made by inserting the second connection terminal of the flexible wiring board 7 into the second connector 9 mounted on the surface of the processing board 10 located on the opposite side of the imaging element 6.

[0032] Regarding the positional relationship between the flexible wiring board 7 and each member located near it, the flexible wiring board 7 is arranged so as to face the sensor board of the imaging element 6 from the first connector 8 of the flexible wiring board 7 to just before the folded-back portion 12. The flexible wiring board 7 is arranged so as to face a part of the processing board 10 and the plate 11 from the end of the folded-back portion 12 of the flexible wiring board 7 to just before the detour portion 13. The flexible wiring board 7 is also arranged so as to face the lower surface fixing portion 70 (lower surface yoke 75) in a part of the flexible wiring board 7 from the end of the folded-back portion 12 to just before the detour portion 13. The flexible wiring board 7 is arranged so as to face the surface of the processing board 10 located on the opposite side to the imaging element 6 from the end of the detour portion 13 of the flexible wiring board 7 to the connector 9.

[0033] Note that the flexible wiring board 7 may be fixed to the lower surface yoke 75 of the lower surface fixing part 70 or the base plate 71 by adhesive or the like between the end of the folded-back part 12 and just before the detour part 13. With this configuration, the movement of the flexible wiring board 7 accompanying the shake correction operation of the actuator unit 5 is compensated for by the movement of the folded-back part 12, and it is possible to prevent the flexible wiring board 7 from moving from the adhesive fixing point to the connector 9. Therefore, it is possible to prevent the flexible wiring board 7 from coming into contact with the processing board 10 due to the movement of the position of the detour part 13 accompanying the shake correction operation of the actuator unit 5.

[0034] Next, the configuration of the conductive member 14, which is a feature of the present disclosure, will be described with reference to Fig. 1, Fig. 4(a), and Fig. 4(b). Fig. 4(a) is a perspective view showing the imaging unit 100 illustrated in Fig. 2 as viewed from the processing board 10 side. In Fig. 4(a), in order to explain the conductive member 14, only the actuator unit 5, the flexible wiring board 7, and the conductive member 14 are extracted and shown in a schematic diagram. Fig. 4(b) is a diagram showing a schematic configuration present in each cross section showing the opposing portions of the flexible wiring board 7 and the conductive member 14.

[0035] As shown in FIG. 1, the conductive member 14 is composed of a conductive member having a substantially rectangular parallelepiped shape, one end of which is connected to the base plate 71 and the other end of which is connected to the plate 11. The conductive member 14 is arranged so that a part of it faces the folded portion 12 of the flexible wiring board 7. More specifically, the flexible wiring board 7 has the folded portion 12 as a part that changes the direction of the folded portion, and the conductive member 14 is arranged so as to face the top of the folded portion or its vicinity. In this embodiment, the conductive member 14 connects the base plate 71 and the plate 11 and faces the folded portion 12, so that the conductive member 14 is located on the A direction side as viewed from the AA' line relative to the folded portion 12. More specifically, the folded portion 12 and the conductive member 14 are configured to overlap on a projection plane viewed from the A direction side to the A' direction side of the AA' line. That is, in a projection plane viewed from the A direction to the A' direction, the base plate 71, the conductive member 14, and the plate 11 are connected in a direction along the folded portion 12.

[0036] In this embodiment, the conductive member 14 is spaced apart enough so as not to come into contact with the folded-back portion 12, which is deformed by the operation of the actuator unit 5 associated with the shake correction. A specific distance may be, for example, ±several mm, which is the movable range of the movable portion 50. With this configuration, the conductive member 14 can be disposed without impairing the shake correction performance of the actuator unit 5. Note that, if there is no problem with the shake correction performance even if the folded-back portion 12 and the conductive member 14 come into contact with each other, the folded-back portion 12 and the conductive member 14 may be configured to come into contact with each other closer to each other.

[0037] Next, the surface of the conductive member 14 that faces the folded portion 12 will be described. As shown in FIG. 4(a), the conductive member 14 is disposed so as to face a part of the folded portion 12. FIG. 4(b) shows a partial cross-sectional view of a portion of the flexible wiring board 7 facing the conductive member 14, and the conductive member 14 disposed so as to face the conductive member 14. Note that in FIG. 4(b), for the sake of explanation, a GND wiring 120 and a differential signal wiring 121 for transmitting an image signal are shown as part of the multiple wirings. The differential signal wiring 121 is composed of two pairs of wirings, and transmits signals by the voltage between the paired wirings. FIG. 4(b) shows three pairs of differential signal wiring 121, in which the wirings 121a and 121b, the wirings 121c and 121d, and the wirings 121e and 121f are pairs that constitute a differential signal. Note that the flexible wiring board 7 further includes differential signal wirings, GND wirings, power supply wirings, and other control signal wirings, but these are omitted for the sake of explanation. As shown in FIG. 4(b), in this embodiment, the conductive member 14 is disposed so as to face the GND wiring 120 included in the flexible wiring board 7.

[0038] Next, a mechanism for reducing noise induced in the flexible wiring board 7 due to application of ESD and suppressing the occurrence of image distortion and error stop will be described by arranging the conductive member 14. Below, noise induction in the absence of the conductive member 14 will first be described, and then the noise reduction mechanism according to this embodiment in which the conductive member 14 is added will be described in comparison.

[0039] An electronic device exemplified by the imaging unit 100 has an external interface for connecting to other external products, various peripheral devices, or a computer, etc., and an insertion port for inserting a storage medium. There are also fastening parts for screws used to assemble the product. It is stipulated by law that ESD (electrostatic discharge) testing must be performed on metal parts exposed from the outside to ensure the safety of the product. The outline and test method of ESD testing are general, so a description thereof will be omitted here.

[0040] When ESD is applied to the metal part, ESD containing high-frequency noise penetrates into the inside of the imaging unit 100. The ESD propagates through a plate (not shown) or a metal exterior that is electrically connected to the applied metal part. In the case of the imaging unit 100, for example, the base plate 71 of the actuator unit 5 or the processing board 10 is fixed to the exterior and is also electrically connected. Therefore, the high-frequency component of the ESD also penetrates into the lower surface fixing part 70 of the actuator unit 5, the processing board 10, and the plate 11. When the ESD penetrates, an ESD current flows through the lower surface fixing part 70, the processing board 10, and the plate 11, causing a potential fluctuation. Furthermore, noise is induced around each member due to electromagnetic field coupling.

[0041] The flexible wiring board 7 is connected to the imaging element 6 and the processing board 10, and is disposed near the lower surface fixing part 70, the plate 11, and the processing board 10. Therefore, the arrangement is such that noise is likely to be induced by electromagnetic field coupling from the lower surface fixing part 70, the plate 11, and the processing board 10. Here, as described above, the flexible wiring board 7 is disposed so as to face the imaging element 6, the base plate 71, the lower surface fixing part 70, the plate 11, and the processing board 10. The imaging element 6, the base plate 71, the lower surface fixing part 70, the plate 11, and the processing board 10 are electrically connected to a metal housing or plate that constitutes the exterior, which is the largest reference GND of the imaging unit 100.

[0042] Therefore, the GND wiring 120, differential signal wiring 121, etc. included in the flexible wiring board 7 have lower impedance due to capacitive coupling on the opposing surfaces with each member. The lower impedance makes it difficult for electromagnetic field coupling to occur, and potential fluctuations in the flexible wiring board 7 are also suppressed. However, in the folded-back portion 12 of the flexible wiring board 7, if there is no opposing metal member, the impedance of the GND wiring 120, differential signal wiring 121, etc. becomes high. Therefore, noise from the surrounding members is induced in the folded-back portion 12 by electromagnetic field coupling, causing potential fluctuations.

[0043] In addition, the lower surface fixing part 70 and the plate 11 have different shapes and the paths of the high-frequency ESD that penetrate therein are also different. Therefore, a difference also occurs in the potential fluctuations that occur in the lower surface fixing part 70 and the plate 11. Therefore, when a high-frequency potential fluctuation occurs between the lower surface fixing part 70 and the plate 11 and the folded part 12 is located between the lower surface fixing part 70 and the plate 11, a large noise is induced by the folded part 12. When noise is induced in the GND wiring 120 or the differential signal wiring 121 included in the folded part 12, the noise propagates to an image processing circuit (not shown) mounted on the processing board 10, causing image distortion and an error stop.

[0044] In order to reduce such noise, in this embodiment, a conductive member 14 is disposed between the base plate 71 and the plate 11 so as to face the flexible wiring board 7, and the base plate 71 and the plate 11 are electrically connected to each other. The flexible wiring board 7 is originally disposed facing the imaging element 6, the base plate 71, the lower surface fixing part 70, the plate 11, and the processing board 10. By disposing the conductive member 14 facing the folded part 12, it is possible to reduce the impedance of each wiring included in the flexible wiring board 7 from the connector 8, which is one end to which the flexible board 7 is connected, to the connector 9, which is the other end. The lower impedance makes it difficult for electromagnetic field coupling to occur, and high-frequency potential fluctuations are also suppressed. Therefore, it is possible to suppress electromagnetic field coupling to the flexible wiring board 7 due to ESD penetration.

[0045] Moreover, the conductive member 14 conducts electricity between the base plate 71 and the plate 11. This suppresses high-frequency potential fluctuations between the lower surface fixing portion 70 and the plate 11 due to the intrusion of ESD, and suppresses electromagnetic field coupling to the flexible wiring board 7. Furthermore, the conductive member 14 conducts electricity between the base plate 71 and the plate 11 while facing the flexible wiring board 7. In other words, it conducts electricity between the base plate 71 and the plate 11 at a position closer to the flexible wiring board 7. Therefore, high-frequency potential fluctuations between the base plate 71 and the plate 11 are suppressed at a position closer to the flexible wiring board 7, and electromagnetic field coupling to the flexible wiring board 7 due to the intrusion of ESD can be further suppressed.

[0046] Furthermore, in the projection plane seen from the direction A to the direction A' of the AA' line, the base plate 71, the conductive member 14, and the plate 11 are connected in a direction along the folded portion 12. That is, the direction of the wiring included in the folded portion 12 is along the ESD noise current flowing through the conductive member 14. In the projection plane described above, if the conductive member 14 and the wiring included in the folded portion 12 are arranged to cross each other, a large change occurs in the capacitive coupling between the wiring and the conductive member 14, and a portion with high impedance is formed in the wiring. That is, the noise generated in the folded portion 12 increases due to electromagnetic coupling to the folded portion 12 caused by the ESD noise flowing through the conductive member 14.

[0047] Therefore, by arranging conductive member 14 so that the current flowing through conductive member 14 is along the wiring included in folded-back portion 12, it is possible to suppress electromagnetic field coupling to flexible wiring board 7 due to ESD penetration. By suppressing electromagnetic field coupling to flexible wiring board 7 due to ESD penetration, it is possible to reduce noise induced in wiring such as GND wiring 120 and differential signal wiring 121 included in flexible wiring board 7. This reduces noise propagating from the wiring included in flexible wiring board 7 to an image processing circuit (not shown) mounted on processing board 10, and suppresses image distortion and error stoppage.

[0048] In this embodiment, the conductive member 14 is disposed so as to face mainly the GND wiring 120. This can reduce the impedance of the GND wiring 120 and the impedance of the differential signal wiring 121 disposed nearby. As a result, electromagnetic coupling due to ESD penetration into the GND wiring 120 and the differential signal wiring 121 can be reduced. It is also expected that noise induced in other wirings included in the flexible wiring board 7, such as the GND wiring 120 and the differential signal wiring 121, can be reduced by the same effect. Therefore, it is more preferable that the conductive member 14 is configured to face not only the GND wiring 120 but also the differential signal wiring 121. With this configuration, it is possible to further reduce electromagnetic coupling to the differential signal wiring 121. Furthermore, it is preferable that the conductive member 14 is configured to face not only the GND wiring 120 and the differential signal wiring 121 but also other power supply lines and control signal lines included in the flexible wiring board 7. With this configuration, it is possible to suppress the induction of noise to other wirings, and the induction of noise from other wirings to the GND wiring 120 and the differential signal wiring 121 due to the noise being induced therein.

[0049] In this embodiment, the conductive member 14 is disposed so as to face only the folded portion 12 of the flexible wiring board 7. However, the arrangement of the conductive member 14 is not limited to this, and for example, a conductive member facing the detour portion 13 may be disposed to obtain the same effect for the detour portion 13. For example, a configuration is conceivable in which the plate 11 is extended so as not to interfere with the flexible wiring board 7, and an additional conductive member is provided to connect the extended portion of the plate 11 and the lower surface fixing portion 70. With this configuration, the impedance of the wiring included in the detour portion 13 can be further reduced. The reduced impedance makes it difficult for electromagnetic field coupling to occur, and high-frequency potential fluctuations in the GND wiring 120 and the like in the detour portion 13 are also suppressed. Therefore, it is more preferable that the conductive member 14 is provided at two locations, one facing the folded portion 12 and the other facing the detour portion 13. With this configuration, the impedance of the wiring included in the flexible wiring board 7 can be further reduced and potential fluctuations can be suppressed.

[0050] Next, the results obtained by simulating a configuration in which such conductive member 14 is provided will be described with reference to the drawings. Fig. 5 is a graph showing the results of an electromagnetic field simulation comparing the noise voltage induced in the signal wiring included in the flexible wiring board 7 in configurations with and without the conductive member 14 in the imaging unit 100. First, an outline of the model used for the electromagnetic field simulation will be described.

[0051] In this simulation model, an imaging device (camera 200) is obtained by mounting an imaging unit 100 having the configuration shown in FIG. 2 inside a camera exterior 210 made of a magnesium alloy shown in FIG. 6. In the figure, a lens device 202 mounted on the camera 200 is also shown so that the camera 200 has the same optical axis as the optical axis 4 of the imaging unit 100. The camera 200 and the lens device 202 constitute an imaging system 300 according to the present disclosure. The camera exterior 210 is provided with an external interface 201 made of a conductor. The external interface 201 is fixed to the camera exterior 210 and is electrically connected to the camera exterior 210. In this simulation, noise simulating ESD was applied to the external interface 201.

[0052] Next, an overview of the grounding configuration (electrical connection) between the imaging unit 100 and the camera exterior 210 will be described. Fig. 7 is a perspective view showing only the processing board 10 and the plate 11 of the imaging unit 100. At a connection point 211, the processing board 10 is fixed to the camera exterior 210. At a connection point 212, the processing board 10 is fixed to the camera exterior 210 together with the plate 11. At a connection point 213, the plate 11 is fixed to the camera exterior 210. At a connection point 214, the plate 11 is fixed to the processing board 10.

[0053] 8 is a perspective view showing only the actuator unit 5 and the sensor board 220 of the imaging element 6 of the imaging unit 100. At the connection point 215, the base plate 71 is fixed to the camera exterior 210. Note that the connection points 211, 212, 213, 214, and 215 indicate holes through which screws are passed, and the above-mentioned components are fixed by fastening the screws while obtaining electrical conduction between them. The flexible wiring board 7 is provided with a GND wiring that connects the reference potential of the sensor board 220 and the processing board 10, and a differential signal wiring. Resistors corresponding to the terminals of the solid GND and the differential signal wiring that are the reference potential of each board are added to the sensor board 220 and the processing board 10, and are connected to each wiring of the flexible wiring board 7.

[0054] The conductive member 14 is a rectangular parallelepiped conductor having a length of 6 mm, a width of 3 mm, and a height of 1 mm, which connects the base plate 71 and the plate 11. The length corresponds to the distance between the base plate 71 and the plate 11, the width corresponds to the width of the facing surface facing the flexible wiring board 7, and the height corresponds to the thickness of the conductive member 14. The flexible wiring board 7 is approximately rectangular with a length of 115 mm and a width of 18 mm. The length of the flexible wiring board 7 facing the sensor board 220 is 18 mm, and the length of the flexible wiring board 7 located between the actuator unit 5 and the processing board 10 and facing the processing board 10 and the plate 11 is 45 mm. The length of the folded portion 12 of the flexible wiring board 7 is 10 mm, the length of the detouring portion 13 is 13 mm, and the length of the flexible wiring board 7 facing the surface of the processing board 10 located on the opposite side as viewed from the actuator unit 5 is 29 mm. The configurations of the other members are similar to those of this embodiment, so their explanations are omitted.

[0055] FIG. 5 is a graph showing the results of this simulation assuming the above dimensions and arrangement. For comparison, the noise voltage induced in the differential signal wiring is shown in the cases where the conductive member 14 is not present, where it is present, and where the conductive member 14 is wider and faces both the GND wiring 120 and the differential signal wiring 121 of the flexible wiring board 7. Note that the noise voltage here is the peak-to-peak value of the waveform observed until 18 nsec has elapsed after applying a waveform simulating ESD. From FIG. 5, it can be seen that the noise voltage induced in the signal wiring can be reduced by providing the conductive member 14. It can also be seen that the noise voltage can be further reduced by widening the width of the conductive member 14.

[0056] As described above, the imaging unit 100 according to the first embodiment is housed in a housing (exterior 210). The imaging unit 100 includes the imaging element 6, the actuator unit 5, the processing board 10, the plate 11, the flexible wiring board 7, and a conductive member 14. The actuator unit 5 includes a movable part 50 that supports the imaging element 6 so as to be movable within a plane perpendicular to the optical axis 4, and conductive fixed parts 60, 70 that are fixed relatively to the movable part 50. The processing board 10 exchanges signals including an image signal generated by the imaging element 6 with the imaging element 6, and generates image data by performing a predetermined image processing on the image signal. The plate 11, which also functions as a GND connection plate, is a conductive member provided for heat dissipation of the processing board 10, is connected to the processing board 10, and has a surface facing the fixed part (lower surface fixed part 70). The flexible wiring board 7 is disposed between the imaging element 6 and the processing board 10 to connect them, and is configured to include wiring (differential signal wiring 121, GND wiring 120) through which signals including the image signal described above flow. The conductive member 14 electrically connects the plate 11 and the fixed part 70 (base plate 71), and has a facing surface facing the flexible wiring board 7. In the present disclosure, the conductive member 14 electrically connecting the plate 11 and the fixed part 70 has a portion facing the wiring included in the flexible wiring board 7. With such a configuration, it is possible to lower the impedance of the wiring and reduce the influence of noise due to ESD (electrostatic discharge current) superimposed on the wiring.

[0057] Note that it is sufficient that the conductive member 14 has a surface facing the GND wiring 120 which is at least a part of the wiring included in the flexible wiring board 7. However, it is more preferable that the conductive member 14 also has a surface facing the differential signal wiring 121. By having a surface facing the GND wiring 120, it is possible to lower the impedance of the GND wiring 120 through which ESD penetrates into the imaging unit 100. However, since the effect of high-frequency ESD is also induced in the differential signal wiring 121, the effect of ESD can be further reduced by lowering the impedance of the differential signal wiring 121 as well.

[0058] The flexible wiring board 7 faces the plate 11 and the base plate 71 in close proximity. Therefore, the impedance of the wiring in the area where these facing members are present is low. However, it is necessary to reduce the restriction of the flexible wiring board 7 against the movement of the imaging element 6 by the movable part 50. For this reason, the flexible wiring board 7 is provided with a folded part 12 that bends the flexible wiring board 7 to change the direction in which the wiring extends. In the conventional configuration, since there is no facing configuration, the impedance of the wiring in this part remains high. In the present disclosure, the conductive member 14 is arranged so as to face at least the top of the bend, thereby achieving a reduction in the impedance of the wiring in the folded part 12.

[0059] As described above, according to the embodiment, the conductive member 14 is provided which connects the base plate 71 and the plate 11 and has a surface facing the flexible wiring board 7. By providing the imaging unit 100 with such a configuration, it is possible to reduce potential fluctuations that occur in the wiring included in the flexible wiring board 7 due to the intrusion of ESD.

[0060] <Modification of Conductive Member> In the first embodiment, the conductive member 14 is a rectangular parallelepiped conductor. However, the shape of the conductive member 14 is not limited to this, and may be configured to have a bent portion, for example. Alternatively, the conductive member 14 may be configured to have a bent portion or curved surface that fits the folded portion 12. Fig. 9(a) shows an enlarged view of the base plate 71 and plate 11 in Fig. 1, and a portion related to a modified example of the conductive member described here.

[0061] 9(a) shows a schematic diagram of a conductive member 14a configured to fit along the folded portion 12. This configuration can increase the capacitive coupling between the folded portion 12 and the conductive member 14 and reduce the change in capacitive coupling caused by the location on the flexible wiring board 7. That is, the impedance of the flexible wiring board 7 can be more uniformly lowered. Therefore, the electromagnetic field coupling to the flexible wiring board 7 due to the intrusion of ESD is further suppressed, and the noise induced in the wiring included in the flexible wiring board 7 can be reduced.

[0062] Moreover, the conductive member 14 may be composed of a plurality of conductors. FIG. 9(b) shows the conductive member according to this modification in the same manner as FIG. 9(a). Here, the portion facing the flexible wiring board 7 is composed of the upper conductive member 14b, and the connection portion with the plate 11 is composed of the lower conductive member 14c. The lower conductive member 14c is arranged diagonally in the figure, so that this portion can be configured to substantially face the flexible wiring board 7. However, the form of the conductive member is not limited to this example, and for example, the connection portion with the base plate 71, the connection portion with the plate 11, and the facing portion with the flexible wiring board 7 may each be configured to be made of different members and connected. Furthermore, the facing portion of the flexible wiring board 7 may be configured of a plurality of conductive members. Also, the individual conductive members may be connected at an angle as shown in FIG. 9(b), and the facing portion of the flexible wiring board 7 may be configured to form a folded portion of the conductive member along the folded portion 12 described above.

[0063] Moreover, the conductive member 14 may be made of a conductor, and may be made of, for example, a plate-shaped plate, a rectangular metal member, a cable-shaped conductor, or a gasket made of conductive cloth. FIG. 9(c) shows such a modified example in the same format as FIG. 9(a) and the like. Here, the gasket is not a sealing material for fixing, but may be, for example, gasket 14d in which polyurethane foam is covered with conductive cloth. In addition, any gasket capable of shielding noise, such as a clip gasket integrated with a clip, an arrowhead-shaped gasket that is easily attached by fitting it into a housing, or a film gasket with a reduced thickness, may be applied to the present disclosure.

[0064] The conductive member 14 is electrically connected to the base plate 71 and the plate 11, and the connection can be, for example, by fastening with a screw, bonding with a conductive adhesive, or crimping with another member. However, since it is desirable to have a lower impedance at the connection, it is preferable to connect them by fastening with a screw, which reduces the resistance value of the connection. Furthermore, if the conductive member 14 is made of a gasket such as a conductive cloth, the conductive member 14 can be provided even in the case of a complicated connection configuration or a simple configuration in which no space is reserved for screw tightening work, etc.

[0065] As described above, the form of the conductive member 14 is not limited to that described in the first embodiment. For example, the conductive member may have a bent portion (14a). In this case, the bent portion is arranged so as to follow the flexible wiring board 7, thereby making the opposing surface larger. By providing such a bent portion so as to face the folded-back portion 12, it is possible to reduce the impedance of the wiring in the folded-back portion 12 as a whole. In addition, the conductive member may be formed by connecting a plurality of conductive members (14b, 14c) or may be formed of a conductive gasket (14d). With such a configuration, it is possible to expect effects such as a degree of freedom in the shape of the conductive member and easy installation.

[0066] <Second Example> An imaging unit according to a second embodiment of the present disclosure will be described below with reference to Fig. 10. Note that in the imaging unit shown in the second embodiment, the same reference numerals are used for configurations similar to those of the imaging unit 100 described in the first embodiment, and descriptions thereof will be omitted here. The imaging unit according to this embodiment and the imaging unit 100 according to the first embodiment differ in the width of the conductive member. Note that the width of the conductive member described here corresponds to the dimension of the conductive member 14 in the lateral direction, specifically, in the direction perpendicular to the paper surface in Fig. 1.

[0067] The conductive member 14 in the first embodiment only had a width sufficient to face a portion of the flexible wiring board 7. In contrast, the conductive member (reference number 15 in FIG. 10) in the present embodiment has a width of about 1.5 times that of the flexible wiring board 7 that faces the flexible wiring board 7. At this time, the center positions in the width direction of the flexible wiring board 7 and the conductive member 15 overlap on the projection surface. With this configuration, it is possible to more effectively reduce noise induced by electromagnetic field coupling in the flexible wiring board 7 due to the intrusion of ESD.

[0068] This mechanism will be described below with reference to Figures 10(a) and 10(b) along with the structure of the imaging unit according to this embodiment. Figure 10(a) is a perspective view showing the relationship between the various structures of the imaging unit according to this embodiment as viewed from the processing board 10 side in the same format as Figure 4. In Figure 10(a), only the actuator unit 5, the flexible wiring board 7, and the conductive member 15 are extracted and shown in a schematic diagram in order to explain the conductive member 15 in this embodiment. Figure 10(b) is a schematic cross-sectional perspective view showing the relationship between the widths of the flexible wiring board 7 and the conductive member 15 and the flow direction of the noise current 231 that flows through the conductive member 15 when ESD is applied.

[0069] As shown in FIG. 10(a), the conductive member 15 has a width wider than that of the flexible wiring board 7. ESD applied to a metal part located outside the camera (200), such as the camera exterior 210 or the external interface 201, propagates to the metal parts of the entire connected camera. Therefore, a noise current 231 also flows through the conductive member 15. Specifically, since the conductive member 15 is a conductor that connects the base plate 71 and the plate 11, the noise current 231 flows from the base plate 71 to the plate 11, or from the plate 11 to the base plate 71 via the conductive member 15.

[0070] ESD, which is high-frequency noise, has the characteristic of flowing through the ends of metal members when flowing through a metal conductor. Therefore, noise current 231 also flows through the ends of conductive member 15. By configuring conductive member 15 to be wider than flexible wiring board 7, it is possible to lower the impedance of flexible wiring board 7 and to separate the ends of conductive member 15 through which noise current 231 flows from flexible wiring board 7. Therefore, electromagnetic field coupling of noise to flexible wiring board 7 due to intrusion of ESD can be further suppressed.

[0071] In this embodiment, conductive member 15 has a width about 1.5 times the width of flexible wiring board 7. However, the width of conductive member 15 is not limited to this, and for the reasons described above, conductive member 15 may have a width equal to or greater than that of flexible wiring board 7 in the region facing flexible wiring board 7. More preferably, by making the width of conductive member 15 1.5 times or more the width of flexible wiring board 7, noise induced in flexible wiring board 7 by ESD can be further reduced.

[0072] 10(b), the wiring of the flexible wiring board 7 that is closer to the end of the conductive member 15 is set as the GND wiring 120, and the differential signal wiring 121 is positioned closer to the center in the width direction of the flexible wiring board 7 than the GND wiring 120. With this configuration, the GND wiring 120 can shield the ESD noise that enters the differential signal wiring 121 from the end of the conductive member 15 due to electromagnetic field coupling.

[0073] <Third Example> In the first and second embodiments described above, the conductive member is configured to connect the base plate 71 and the plate 11. In this case, the plate 11 is connected to the processing substrate 10 and is disposed between the actuator unit 5 and the processing substrate 10. However, the plate 11 may be configured to be located farther away than the processing substrate 10 when viewed from the actuator unit 5. In this case, for example, the length of the processing substrate 10 in the direction A in FIG. 1 is shortened, and the conductive member is disposed so as to pass beside the right end of the processing substrate 10 with respect to the plate 11 disposed below the processing substrate 10 in the figure.

[0074] With this configuration, even if the plate 11 is located farther away from the process substrate 10, the conductive member can be made to face the flexible wiring board 7. As a result, even if the plate 11 is provided in an arrangement different from that of the first embodiment, etc., the impedance of the wiring included in the flexible wiring board 7 can be reduced. Therefore, the reduced impedance makes it difficult for electromagnetic field coupling to occur, suppresses potential fluctuations, and makes it possible to suppress electromagnetic field coupling to the flexible wiring board 7 due to ESD penetration.

[0075] <Fourth Example> In this embodiment, the imaging unit 100 is disposed in the exterior 210. The exterior 210 is made of a metallic member, for example, a magnesium alloy. As described with reference to FIG. 6, the exterior 210 is electrically connected to the base plate 71 and the plate 11. Therefore, the exterior 210 can also be used as the conductive member 14. An example of such a configuration is shown in FIG. 11 in the same format as FIG. 1. In this embodiment, the flexible wiring board 7 is disposed so that the distance of the folded portion 12 of the flexible wiring board 7 to the exterior 210 is approximately equal to the distance between the flexible wiring board 7 and the plate 11 when the flexible wiring board 7 and the plate 11 are disposed opposite each other. By disposing in this manner, the exterior 210 can reduce the impedance of the wiring included in the flexible wiring board 7. Note that the term "approximately equal" does not mean "strictly the same," but means an equality that allows the difference in impedance described above to be less than a desired value, taking into account assembly errors and positional changes of the flexible wiring board 7 accompanying the operation of the actuator unit 5.

[0076] Here, the plate 11 and the base plate 71 are electrically connected even in the conventional configuration, and have the same potential in terms of direct current. However, in a high-frequency region such as ESD, each member has an impedance due to the influence of an inductance component or the like of each member, and the impedance causes the potential in each high-frequency region to differ. For this reason, as described in the first embodiment, it is preferable that the connection portion of the plate 11, the base plate 71, and the conductive member connecting them is provided in a position close to the flexible wiring board, particularly the folded portion 12. Here, the plate 11 and the base plate 71 are electrically connected. In such a configuration, as described in the second embodiment, it is preferable that the flow direction of ESD between these members in the exterior 210 is arranged so that the extension direction of the wiring included in the flexible wiring board 7 is aligned with the flow direction of ESD.

[0077] It is also possible to configure the exterior 210 from a non-conductive material, such as resin, etc. In such a case, the internal conductive members may be configured to be connected by a plate or the like, and the conductive member 14 in the first embodiment or a conductive plate or the like associated with the exterior 210 may be provided and arranged to satisfy the above-mentioned conditions.

[0078] In addition, in each of the above-mentioned embodiments, a configuration is described on the premise that the plate 11 is arranged to suitably dissipate the heat generated by the processing substrate 10. However, for example, when the processing substrate 10 has higher heat resistance or when the heat generation of the processing substrate 10 itself can be suitably suppressed, the plate 11 may be omitted. In this case, the conductive member 14 of the first embodiment can electrically connect the base plate 71 and other members that increase the impedance of the wiring included in the flexible wiring substrate 7. In addition, it is preferable that these electrical connections are made at positions closer to the flexible wiring substrate 7.

[0079] In the above-described embodiment, the imaging unit 100 mounted on an imaging device such as the camera 200 has been described as an example of the present disclosure. However, the application of the present disclosure is not limited to imaging units, and the present disclosure can be applied to imaging units used to capture other images such as still images and videos, such as network cameras, video cameras, cameras for broadcasting equipment, and machine vision cameras.

[0080] The above disclosure includes the following configurations. (Configuration 1) An imaging unit housed in a housing, An imaging element; an actuator unit including a movable portion that supports the image sensor so as to be movable within a plane perpendicular to an optical axis, and a conductive fixed portion that is fixed relatively to the movable portion; a processing board for transmitting and receiving signals including image signals between the imaging element and the processing board; a conductive plate connected to the processing board and having a surface facing the fixed portion; a flexible wiring board disposed between the imaging element and the processing board, the flexible wiring board including wiring through which a signal including the image signal flows; a conductive member electrically connecting the plate and the fixed portion and having a surface facing the flexible wiring board; An imaging unit comprising: (Configuration 2) 2. The imaging unit according to claim 1, wherein the conductive member has a surface facing at least a portion of the wiring included in the flexible wiring board. (Configuration 3) 2. The imaging unit according to configuration 1, wherein the conductive member has a width greater than a width of the flexible wiring board in a region facing the flexible wiring board. (Configuration 4) The imaging unit according to any one of configurations 1 to 3, wherein the conductive member has a bent portion, and the bent portion is arranged along the flexible wiring board to form the opposing surface. (Configuration 5) The imaging unit described in any one of configurations 1 to 4, characterized in that the conductive member is arranged so as to face at least the apex of a fold that is a fold portion that folds the flexible wiring board to change the direction in which the wiring extends, and is configured to reduce any restriction imposed by the flexible wiring board on the movement of the imaging element by the movable part. (Configuration 6) 6. The imaging unit according to any one of configurations 1 to 5, wherein the conductive member is configured by connecting a plurality of conductive members. (Configuration 7) 7. The imaging unit according to any one of configurations 1 to 6, wherein the conductive member is formed of a gasket having electrical conductivity. (Configuration 8) 8. The imaging unit according to any one of configurations 1 to 7, wherein the processing board performs a predetermined image processing on the image signal to generate image data. (Configuration 9) An imaging element; an actuator unit including a movable portion that supports the image sensor so as to be movable within a plane perpendicular to an optical axis, and a conductive fixed portion that is fixed relatively to the movable portion; a processing board for transmitting and receiving signals including image signals between the imaging element and the processing board; a conductive plate connected to the processing board and having a surface facing the fixed portion; a flexible wiring board disposed between the imaging element and the processing board, the flexible wiring board including wiring through which a signal including the image signal flows; a conductive member disposed opposite at least a top of the fold of the fold that folds the flexible wiring board to change the direction in which the wiring extends, the conductive member electrically connecting the plate and the fixed part and allowing an applied electrostatic discharge current to flow from the plate to the fixed part or from the fixed part to the plate; The conductive member or the flexible wiring board is arranged so that the extension direction of the wiring through which signals including the image signal flow contained in the flexible wiring board flows is along the flow direction of the electrostatic discharge current, thereby reducing the impedance of the wiring. (Configuration 10) The imaging unit according to configuration 9, wherein the conductive member is disposed on the side of a housing that houses the imaging unit. (Configuration 11) The imaging unit of configuration 9, wherein the flexible wiring board is disposed within the housing so that the distance between the top of the flexible portion and the conductive member is approximately equal to the distance between the flexible wiring board and the plate. (Configuration 12) An imaging unit housed in a housing, An imaging element; an actuator unit including a movable portion that supports the image sensor so as to be movable within a plane perpendicular to an optical axis, and a conductive fixed portion that is fixed relatively to the movable portion; a processing board for transmitting and receiving signals including image signals between the imaging element and the processing board; a flexible wiring board disposed between the imaging element and the processing board and having wiring through which signals including the image signal flow; an electrically conductive member that is arranged to face at least the apex of the fold of the fold portion that folds the flexible wiring board to change the direction in which the wiring extends, the fold portion being configured to reduce any restriction imposed by the flexible wiring board on the movement of the imaging element by the movable portion, and that is electrically connected to the fixed portion. (Configuration 13) The housing; An imaging device comprising: an imaging unit according to any one of configurations 1 to 12. (Configuration 14) An imaging device according to configuration 13; and a lens device having the same optical axis as the optical axis. [Explanation of symbols]

[0081] 5 Actuator Unit 6. Image sensor 7 Flexible wiring board 10 Processing Board 11 Plate 14 Conductive materials 100 Imaging unit 200 Imaging device 210 Exterior 300 Imaging System

Claims

1. An imaging unit housed in a housing, An imaging element; an actuator unit including a movable portion that supports the image sensor so as to be movable within a plane perpendicular to an optical axis, and a conductive fixed portion that is fixed relatively to the movable portion; a processing board for transmitting and receiving signals including image signals between the imaging element and the processing board; a conductive plate connected to the processing board and having a surface facing the fixed portion; a flexible wiring board disposed between the imaging element and the processing board, the flexible wiring board including wiring through which a signal including the image signal flows; a conductive member electrically connecting the plate and the fixed portion and having a surface facing the flexible wiring board; An imaging unit comprising:

2. The imaging unit according to claim 1 , wherein the conductive member has a surface facing at least a part of the wiring included in the flexible wiring board.

3. 2. The image pickup unit according to claim 1, wherein the conductive member has a width greater than a width of the flexible wiring board in a region facing the flexible wiring board.

4. 2. The imaging unit according to claim 1, wherein the conductive member has a bent portion, and the bent portion is disposed along the flexible wiring board to form the opposing surface.

5. The imaging unit according to claim 1, characterized in that the conductive member is arranged so as to face at least the apex of a fold, the fold being a fold portion that folds the flexible wiring board to change the direction in which the wiring extends, and is configured to reduce any restriction imposed by the flexible wiring board on the movement of the imaging element by the movable part.

6. 6. The image pickup unit according to claim 1, wherein the conductive member is configured by connecting a plurality of conductive members.

7. 6. The image pickup unit according to claim 1, wherein the conductive member is made of a conductive gasket.

8. 6. The imaging unit according to claim 1, wherein the processing board performs a predetermined image processing on the image signal to generate image data.

9. An imaging element; an actuator unit including a movable portion that supports the image sensor so as to be movable within a plane perpendicular to an optical axis, and a conductive fixed portion that is fixed relatively to the movable portion; a processing board for transmitting and receiving signals including image signals between the imaging element and the processing board; a conductive plate connected to the processing board and having a surface facing the fixed portion; a flexible wiring board disposed between the imaging element and the processing board, the flexible wiring board including wiring through which a signal including the image signal flows; a conductive member disposed opposite at least a top of the fold of the fold that folds the flexible wiring board to change the direction in which the wiring extends, the conductive member electrically connecting the plate and the fixed part and allowing an applied electrostatic discharge current to flow from the plate to the fixed part or from the fixed part to the plate; The conductive member or the flexible wiring board is arranged so that the extension direction of the wiring through which signals including the image signal flow contained in the flexible wiring board flows is along the flow direction of the electrostatic discharge current, thereby reducing the impedance of the wiring.

10. 10. The imaging unit according to claim 9, wherein the conductive member is disposed on a side of a housing that houses the imaging unit.

11. 10. The imaging unit according to claim 9, wherein the flexible wiring board is positioned within the housing so that the distance between the top of the flexible portion and the conductive member is approximately equal to the distance between the flexible wiring board and the plate.

12. An imaging unit housed in a housing, An imaging element; an actuator unit including a movable portion that supports the image sensor so as to be movable within a plane perpendicular to an optical axis, and a conductive fixed portion that is fixed relatively to the movable portion; a processing board for transmitting and receiving signals including image signals between the imaging element and the processing board; a flexible wiring board disposed between the imaging element and the processing board and having wiring through which signals including the image signal flow; an electrically conductive member that is arranged to face at least the apex of the fold of the fold portion that folds the flexible wiring board to change the direction in which the wiring extends, the fold portion being configured to reduce any restriction imposed by the flexible wiring board on the movement of the imaging element by the movable portion, and that is electrically connected to the fixed portion.

13. The housing; An imaging device comprising: an imaging unit according to claim 1 .

14. The imaging device according to claim 13 ; and a lens device having the same optical axis as the optical axis.

Images