Temperature control device

Abstract

To achieve improvement of a temperature control ability for a temperature-controlled fluid and reduction in a pressure loss with a low flow amount.SOLUTION: A temperature control device comprises: a flow passage block 40 having flow passage grooves through which a fluid flows, the flow passage grooves provided on a front surface and rear surface thereof; a pair of heat transfer plates 11 that face the flow passage grooves 42 provided on the flow passage block 40; a heat transfer room 20 formed between the flow passage block 40 and the heat transfer plates 11; a fluid supply port 43 arranged on the periphery of the heat transfer room 20; and a fluid discharge port 44 arranged on the periphery of the heat transfer room. The heat transfer room is formed in a circular shape. The fluid supply port 43 and the fluid discharge port 44 are arranged so as to be radially apart from each other while sandwiching the center of the heat transfer room 20. The flow passage grooves 42 are formed so as to connect the fluid supply port 43 and the fluid discharge port 44.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present invention relates to a temperature adjustment device. [Background technology]

[0002] Patent Documents 1 and 2 disclose a fluid temperature control device that uses a thermoelectric module to heat or cool a treatment liquid, and a fluid temperature control device that uses a heater to heat a treatment liquid. These fluid temperature control devices include a flow path block in which a flow path groove is formed, a heat transfer plate that is installed in the flow path block to form a flow path, and a temperature control means that heats or cools the heat transfer plate, and heat is exchanged between the temperature control means and the treatment liquid passing through the flow path via the heat transfer plate.

[0003] As shown in Patent Document 3, a cooling structure is disclosed for cooling electronic devices, power electronic devices, and the like, in which zigzag projections are provided on the back side of a heat transfer surface. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2008-186913 A [Patent Document 2] JP 2003-338489 A [Patent Document 3] JP 2006-100293 A Summary of the Invention [Problem to be solved by the invention]

[0005] In the flow channel shape of Patent Document 1, the flow channel outlet is provided in the center of the heat transfer chamber, so air in the flow channel is difficult to escape, and a large flow rate of chemical liquid is required. Therefore, it is difficult to control the temperature of the chemical liquid at a low flow rate. In addition, since a large flow rate of chemical liquid is required, pressure loss is likely to increase. A pump with higher output is required, which increases the cost of the pump and the required power.

[0006] In the flow channel shape of Patent Document 2, the flow channel is formed widely on the surface of the main block, so the flow rate of the chemical solution is extremely slow, which tends to deteriorate heat transfer. This may lead to a decrease in heating or cooling capacity.

[0007] In the flow channel shape of Patent Document 3, the flow repeatedly meanders inside the flow channel, which tends to increase pressure loss.

[0008] An object of one aspect of the present invention is to achieve an improvement in temperature control capability for a fluid to be temperature controlled and a reduction in pressure loss at a low flow rate. [Means for solving the problem]

[0009] According to one aspect of the present invention, there is provided a temperature control device comprising: a flow path block having flow path grooves on its front and back surfaces through which a fluid flows; a pair of heat transfer plates facing the flow path grooves provided in the flow path block; a heat transfer chamber formed between the flow path block and the heat transfer plates; a fluid supply port arranged on an outer periphery of the heat transfer chamber; and a fluid discharge port arranged on the outer periphery of the heat transfer chamber, wherein the heat transfer chamber is formed in a circular shape, the fluid supply port and the fluid discharge port are arranged radially spaced apart on either side of the center of the heat transfer chamber, and a plurality of the flow grooves are formed by connecting the fluid supply port and the fluid discharge port. Effect of the Invention

[0010] According to the aspects of the present invention, it is possible to improve the temperature adjustment capability for the fluid to be temperature adjusted and reduce the pressure loss at a low flow rate. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a schematic diagram showing an example of a cleaning system according to an embodiment. [Diagram 2] FIG. 2 is a side view that illustrates an example of a temperature adjustment device according to an embodiment. [Diagram 3] FIG. 3 is an enlarged cross-sectional view of a portion of the thermoelectric module plate according to the embodiment. [Figure 4] FIG. 4 is a perspective view showing an example of a flow path block and a heat transfer plate which are the main body of the temperature adjustment device according to the embodiment. [Diagram 5] FIG. 5 is a cross-sectional view showing an example of a flow path block and a heat transfer plate which are the main body of the temperature adjustment device according to the embodiment. [Figure 6] FIG. 6 is a partial enlarged view of an example of a flow path of a temperature adjustment device according to an embodiment. [Figure 7] FIG. 7 is a plan view showing an example of a flow path block of the temperature adjustment device according to the embodiment. [Figure 8] FIG. 8 is a cross-sectional view taken along line AA in FIG. [Figure 9] FIG. 9 is a cross-sectional view taken along line CC of FIG. [Figure 10] FIG. 10 is a partial enlarged view of the flow path. [Figure 11] FIG. 11 is a diagram showing the relationship between the flow rate and the thermal resistance. [Figure 12] FIG. 12 is a diagram showing the relationship between the flow rate and the pressure loss. [Figure 13] FIG. 13 is a perspective view that illustrates an example of a main body of a conventional temperature adjusting device, which is a comparative example. [Figure 14] FIG. 14 is a perspective view showing a modified example of a flow path block and a heat transfer plate which are the main body of the temperature adjustment device according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, an embodiment of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. The components of the embodiments described below can be appropriately combined. In addition, some components may not be used.

[0013] In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each part is described with reference to this XYZ orthogonal coordinate system. The direction parallel to the X axis in a predetermined plane is defined as the X-axis direction. The direction parallel to the Y axis perpendicular to the X axis in the predetermined plane is defined as the Y-axis direction. The direction parallel to the Z axis perpendicular to the predetermined plane is defined as the Z-axis direction. The XY plane including the X and Y axes is parallel to the predetermined plane. The YZ plane including the Y and Z axes is perpendicular to the XY plane. The XZ plane including the X and Z axes is perpendicular to each of the XY plane and the YZ plane. In the embodiment, the XY plane is parallel to the horizontal plane. The Z-axis direction is the vertical direction. The +Z direction (+Z side) is the upward direction (upper side). The -Z direction (-Z side) is the downward direction (lower side). The XY plane may be inclined with respect to the horizontal plane.

[0014] [Embodiment] <Cleaning system> An embodiment will be described. Fig. 1 is a diagram showing a schematic diagram of an example of a cleaning system 1 according to an embodiment. The cleaning system 1 uses a cleaning liquid LQ to clean a substrate W to be cleaned. The substrate W includes, for example, a semiconductor wafer. The liquid LQ is, for example, pure water or a chemical liquid. The chemical liquid is, for example, an ammonia hydrogen peroxide mixture, a hydrochloric acid hydrogen peroxide mixture, or a sulfuric acid hydrogen peroxide mixture.

[0015] The cleaning system 1 includes a storage tank 2, a temperature adjustment device 3, a substrate holding member 4, a nozzle 5, a first connection pipe 6, a pump 7, and a second connection pipe 8. The storage tank 2 stores the liquid LQ. The temperature adjustment device 3 adjusts the temperature of the liquid LQ supplied from the storage tank 2. The substrate holding member 4 holds the substrate W. The nozzle 5 supplies the liquid LQ, the temperature of which has been adjusted by the temperature adjustment device 3, to the substrate W. The first connection pipe 6 connects the storage tank 2 and the temperature adjustment device 3. The pump 7 is disposed in the first connection pipe 6. The second connection pipe 8 connects the temperature adjustment device 3 and the nozzle 5. In the cleaning system 1 thus configured, the liquid LQ stored in the storage tank 2 is supplied to the temperature adjustment device 3 via the first connection pipe 6 by driving the pump 7. The liquid LQ, the temperature of which has been adjusted by the temperature adjustment device 3, is supplied to the nozzle 5 via the second connection pipe 8. The liquid LQ is supplied from the nozzle 5, and the substrate W is cleaned.

[0016] <Temperature control device> 2 is a side view showing an example of a temperature adjustment device 3 according to an embodiment. As shown in FIG. 2, the temperature adjustment device 3 includes a pair of heat transfer plates 11, a thermoelectric module plate 12, a pair of heat exchange plates 13, and a flow path block 40.

[0017] The space surrounded by the flow path block 40 (described later) and the heat transfer plate 11 is a heat transfer chamber 20 through which the liquid LQ flows. The heat transfer chamber 20 is formed between the flow path block 40 and the heat transfer plate 11. The heat transfer chamber 20 is formed on each of the front surface 40A and the back surface 40B of the flow path block 40. The heat transfer chamber 20 is formed in a circular shape when viewed in the Z-axis direction.

[0018] The heat transfer chamber 20, which is a flow path for the liquid LQ, is connected to a supply pipe 21 and a discharge pipe 22. The supply pipe 21 and the discharge pipe 22 are made of PTFE (PTFE: polytetrafluoroethylene) or PFA (perfluoroalkoxy alkane). The liquid LQ supplied to the heat transfer chamber 20 flows through the supply pipe 21 and is discharged to the discharge pipe 22. The supply pipe 21 is connected to the storage tank 2 via a first connecting pipe 6. The supply pipe 21 supplies the liquid LQ from the storage tank 2 to the heat transfer chamber 20. The discharge pipe 22 is connected to the nozzle 5 via a second connecting pipe 8. The liquid LQ, whose temperature has been adjusted by the temperature adjustment device 3, is supplied to the nozzle 5 via the discharge pipe 22.

[0019] FIG. 10 is a partial enlarged view of the flow path. As shown in FIG. 10, in the embodiment, the heat transfer chamber 20 includes a flat portion 20B where the distance between the flow path block 40 and the heat transfer plate 11 is narrow, and a recessed portion 20A where the distance between the flow path block 40 and the heat transfer plate 11 is wider than the flat portion 20B. The recessed portion 20A is formed between the flow path groove 42 and the heat transfer plate 11. In this way, the heat transfer chamber 20 includes the recessed portion 20A and the flat portion 20B, so that deep and shallow portions are formed in the flow path. With this configuration, the fluid flowing through the flow path has a portion where it becomes turbulent. The hydraulic diameter of the flow path at the recessed portion 20A, which is the deep portion, is calculated by (area of ​​the portion surrounded by the dashed line in FIG. 10×4) / (length of the dashed line).

[0020] The heat transfer plates 11 exchange heat with the liquid LQ flowing through the heat transfer chamber 20 via the corrosion-resistant plates 11P. The heat transfer plates 11 are connected to each of the front surface 40A and the back surface 40B of the flow path block 40 via the corrosion-resistant plates 11P. The heat transfer plates 11 include one heat transfer plate 11 facing the front surface 40A of the flow path block 40, and the other heat transfer plate 11 facing the back surface 40B of the flow path block 40. The heat transfer plates 11 face a flow path groove 42 provided in the flow path block 40. The heat transfer plates 11 are made of, for example, aluminum.

[0021] The corrosion-resistant plate 11P includes, for example, amorphous carbon. The corrosion-resistant plate 11P has corrosion resistance against the acidic or alkaline liquid LQ. The corrosion-resistant plate 11P has thermal conductivity.

[0022] The thermoelectric module plate 12 absorbs or generates heat to adjust the temperature of the liquid LQ flowing through the heat transfer chamber 20. The thermoelectric module plate 12 is connected to both one heat transfer plate 11 and the other heat transfer plate 11. The thermoelectric module plate 12 includes one thermoelectric module plate 12 connected to an upper surface of one heat transfer plate 11, and the other thermoelectric module plate 12 connected to a lower surface of the other heat transfer plate 11.

[0023] Fig. 3 is an enlarged cross-sectional view of a portion of the thermoelectric module plate 12 according to the embodiment. As shown in Fig. 3, the thermoelectric module plate 12 has a plurality of thermoelectric modules 30 and a case 31. The case 31 houses the plurality of thermoelectric modules 30. The case 31 is formed of an insulating material.

[0024] The thermoelectric module 30 absorbs or generates heat when supplied with electric power. The thermoelectric module 30 absorbs or generates heat due to the Peltier effect. The thermoelectric module 30 absorbs heat from the liquid LQ flowing through the heat transfer chamber 20 via the heat transfer plate 11, and provides heat to the liquid LQ flowing through the heat transfer chamber 20. The thermoelectric module 30 adjusts the temperature of the liquid LQ flowing through the heat transfer chamber 20 by absorbing or generating heat.

[0025] The thermoelectric module 30 has a thermoelectric semiconductor element 32, a first electrode 33, and a second electrode 34. The thermoelectric semiconductor element 32 includes a p-type thermoelectric semiconductor element 32P and an n-type thermoelectric semiconductor element 32N. In the XY plane, the p-type thermoelectric semiconductor element 32P and the n-type thermoelectric semiconductor element 32N are alternately arranged. The first electrode 33 is connected to each of the p-type thermoelectric semiconductor element 32P and the n-type thermoelectric semiconductor element 32N. The second electrode 34 is connected to each of the p-type thermoelectric semiconductor element 32P and the n-type thermoelectric semiconductor element 32N. The first electrode 33 is adjacent to the heat transfer plate 11. The second electrode 34 is adjacent to the heat exchange plate 13. One end surface of the p-type thermoelectric semiconductor element 32P and one end surface of the n-type thermoelectric semiconductor element 32N are each connected to the first electrode 33. The other end surface of the p-type thermoelectric semiconductor element 32P and the other end surface of the n-type thermoelectric semiconductor element 32N are each connected to a second electrode .

[0026] When a potential difference is applied between the first electrode 33 and the second electrode 34, charges move in the thermoelectric semiconductor element 32. The movement of charges causes heat to move in the thermoelectric semiconductor element 32. As a result, the thermoelectric module 30 absorbs or generates heat. For example, when a potential difference is applied between the first electrode 33 and the second electrode 34 so that the first electrode 33 generates heat and the second electrode 34 absorbs heat, the liquid LQ flowing through the heat transfer chamber 20 is heated. When a potential difference is applied between the first electrode 33 and the second electrode 34 so that the first electrode 33 absorbs heat and the second electrode 34 generates heat, the liquid LQ flowing through the heat transfer chamber 20 is cooled.

[0027] The heat exchange plate 13 exchanges heat with the thermoelectric module plate 12. The heat exchange plate 13 is connected to each of one thermoelectric module plate 12 and the other thermoelectric module plate 12. The heat exchange plate 13 includes one heat exchange plate 13 connected to the upper surface of one thermoelectric module plate 12 and the other heat exchange plate 13 connected to the lower surface of the other thermoelectric module plate 12. The heat exchange plate 13 has an internal flow path (not shown) through which a temperature control fluid flows. The temperature control fluid flows into the internal flow path from an inlet of the internal flow path after being temperature-controlled by a fluid temperature control device (not shown). The temperature control fluid flows through the internal flow path to remove heat from the heat exchange plate 13 or provide heat to the heat exchange plate 13. The temperature control fluid flows out from an outlet of the internal flow path and is returned to the fluid temperature control device.

[0028] In the embodiment, each of the flow path block 40, the heat transfer plate 11, the thermoelectric module plate 12, and the heat exchange plate 13 is substantially disk-shaped. In the following description, a virtual axis that passes through the center of each of the flow path block 40, the heat transfer plate 11, the thermoelectric module plate 12, and the heat exchange plate 13 and is parallel to the Z axis is appropriately referred to as a central axis AX.

[0029] <Flow passage block> FIG. 4 is a perspective view showing an example of a flow path block and a heat transfer plate which are the main body of the temperature adjustment device according to the embodiment. FIG. 5 is a cross-sectional view showing an example of a flow path block and a heat transfer plate which are the main body of the temperature adjustment device according to the embodiment. FIG. 6 is a partially enlarged view of an example of a flow path of the temperature adjustment device according to the embodiment. FIG. 7 is a plan view showing an example of a flow path block which is the temperature adjustment device according to the embodiment. FIG. 8 is a cross-sectional view taken along line AA in FIG. 7. FIG. 9 is a cross-sectional view taken along line CC in FIG. 8.

[0030] The flow path block 40 is made of, for example, polytetrafluoroethylene (PTFE), perfluoroalkoxy alkane (PFA), or polyvinylidene difluoride (PVDF).

[0031] The flow path block 40 has a front surface 40A and a back surface 40B. The flow path block 40 is sandwiched between a pair of heat transfer plates 11. The pair of heat transfer plates 11 and the flow path block 40 are fixed together by bolts and nuts, which are fastening members (not shown).

[0032] The flow path block 40 has flow path grooves 42 provided on the front surface 40A and the back surface 40B. The flow path grooves 42 are provided on the front surface 40A and the back surface 40B of the flow path block 40. A plurality of flow path grooves 42 are formed, connecting fluid supply ports 43 and fluid discharge ports 44.

[0033] The flow path groove 42 of the embodiment will be described. The shape of the flow path groove 42 affects the action and effect of the heat transfer chamber 20. Since the embodiment is required to achieve an improvement in the temperature adjustment capability for the temperature-adjusted fluid and a reduction in pressure loss with a low flow rate of the fluid LQ, the configuration of the flow path groove 42 and its surroundings for achieving these will be considered.

[0034] In order to enable the temperature adjustment device 3 to be used at a low flow rate, it is necessary to smoothly exhaust the air inside the heat transfer chamber 20, which is the flow path of the fluid LQ. For this reason, it is desirable that the flow path from the fluid supply port 43 to the fluid discharge port 44 is connected in a straight line or an arc shape without being interrupted or spiraling along the way.

[0035] Heat transfer in a channel is better when the flow conditions are turbulent than laminar. The flow conditions in a channel depend on the Reynolds number, which is calculated by Re=UD / ν. U is the average velocity of the fluid. ν is the kinematic viscosity. D is the hydraulic diameter of the channel, which is calculated by D=4A / Pwet. A is the cross-sectional area of ​​the channel. Pwet is the wetted perimeter of the channel. Pwet is the length of the wall in contact with the fluid in the cross section of the channel, for example, on a plane perpendicular to the flow. The flow conditions in a channel are laminar when Re<2300 and turbulent when Re>2300.

[0036] In flows with low Reynolds numbers, the flow transitions to laminar through the entrance region. It is known that high heat transfer occurs in the very short distance of the entrance region before the flow transitions to laminar.

[0037] In order to improve heat transfer while preventing air bubbles from remaining in the heat transfer chamber 20, it is conceivable to increase the flow velocity and improve heat transfer by making the flow path shallower. However, when the flow path is shallow, pressure loss increases.

[0038] Furthermore, when the flow rate of the liquid LQ is low, the Reynolds number does not increase even if the depth of the flow path is made shallower. For this reason, the flow does not transition to turbulent flow, and it is difficult to obtain sufficient heat transfer.

[0039] The configuration of the flow path grooves 42 and the convex portions 41 will be described with reference to Fig. 6. The flow path grooves 42 and the convex portions 41 are provided in the flow path block 40. In the embodiment, the flow path grooves 42 are separated from each other by the convex portions 41. In the embodiment, the convex portions 41 do not contact the heat transfer plate 11 when the flow path block 40 is assembled with the heat transfer plate 11 sandwiched between them. The flow path grooves 42 provide good heat transfer as turbulence, while the convex portions 41 make the flow paths extremely thin. These improve heat transfer.

[0040] In the embodiment, the flow channel 42 is formed in a straight line in the center of the heat transfer chamber 20, and is formed in a curved arc shape that curves more significantly as it moves away from the center. The flow channel 42 is formed in a curved arc shape that curves more significantly as it moves away from the straight line connecting the fluid supply port 43 and the fluid discharge port 44. The flow channel 42 is formed smoothly without being interrupted or spiraling. The multiple flow channel 42 are arranged in a striped pattern.

[0041] In the embodiment, the heat transfer chamber 20 has a supply-side reservoir 20C formed downstream of the fluid supply port 43, and a discharge-side reservoir 20D formed upstream of the fluid discharge port 44. The supply-side reservoir 20C allows the fluid LQ supplied from the fluid supply port 43 to be smoothly diffused throughout the entire heat transfer chamber 20 defined by the convex portion 41, the flow path groove 42, and the heat transfer plate 11. The discharge-side reservoir 20D allows the fluid LQ to be smoothly discharged from the entire heat transfer chamber 20 defined by the convex portion 41, the flow path groove 42, and the heat transfer plate 11 to the fluid discharge port 44.

[0042] The heat transfer plate 11 faces the flow passage grooves 42 and the protrusions 41. With the heat transfer plate 11 facing the flow passage grooves 42 and the protrusions 41, the peripheral portions of the front surface 40A and the back surface 40B come into contact with the heat transfer plate 11. The flow passage grooves 42 are covered with the heat transfer plate 11, and the peripheral portions of the front surface 40A and the back surface 40B come into contact with the heat transfer plate 11, thereby forming a heat transfer chamber 20.

[0043] The flow path block 40 has a fluid supply port 43 and a fluid discharge port 44. The fluid supply port 43 supplies the liquid LQ to the flow path groove 42. The fluid supply port 43 is disposed on the outer periphery of the heat transfer chamber 20. The fluid discharge port 44 discharges at least a portion of the liquid LQ in the flow path groove 42. The fluid discharge port 44 is disposed on the outer periphery of the heat transfer chamber 20. The fluid supply port 43 and the fluid discharge port 44 are disposed to be spaced apart in the radial direction with the center of the heat transfer chamber 20 in between. The flow path groove 42 is formed by connecting the fluid supply port 43 and the fluid discharge port 44.

[0044] The flow passage block 40 has a plurality of holes (not shown) penetrating in the thickness direction. Bolts and nuts are inserted through the holes.

[0045] The flow path block 40 is connected to the supply pipe 21 and the discharge pipe 22. The supply pipe 21 passes through which the liquid LQ that is supplied to the flow path groove 42 flows. At least a portion of the supply pipe 21 is disposed in the flow path block 40.

[0046] The liquid LQ discharged from the flow path groove 42 flows through the discharge pipe 22. At least a portion of the discharge pipe 22 is disposed in the flow path block 40.

[0047] A seal groove 48 in which a seal member 47 is disposed is provided around the flow path groove 42. The seal groove 48 is provided on the front surface 40A and the back surface 40B of the flow path block 40. The seal member 47 includes, for example, an O-ring. When disposed in the seal groove 48, the seal member 47 comes into contact with the heat transfer plate 11 facing the flow path groove 42. The seal member 47 is pressed against the heat transfer plate 11 and crushed by fastening the pair of heat transfer plates 11 and the flow path block 40 with bolts and nuts. In this way, the seal member 47 seals the boundaries between the front surface 40A and the back surface 40B of the flow path block 40 and the heat transfer plate 11.

[0048] The sealing member 47 is required to be able to withstand high pressure because the temperature adjustment device 3 is installed on the floor below where the liquid LQ is used and a filter is installed downstream of the temperature adjustment device 3. By making the sealing member 47 circular, the pressing pressure applied to the sealing surface by the liquid LQ can be received evenly, improving the sealing performance.

[0049] <effect> Next, the operation of the temperature adjustment device 3 according to the embodiment will be described. The liquid LQ is supplied to the heat transfer chamber 20 via the supply pipe 21 and the fluid supply port 43. The liquid LQ is guided by the recessed portion 20A of the heat transfer chamber 20, and flows toward the fluid discharge port 44. The liquid LQ also flows toward the fluid discharge port 44 in the flat portion 20B of the heat transfer chamber 20, guided by the flow of the fluid LQ flowing through the recessed portion 20A. In this way, the liquid LQ supplied from the fluid supply port 43 to the flow path groove 42 flows through the heat transfer chamber 40, and is discharged from the fluid discharge port 44.

[0050] By applying a potential difference to the thermoelectric module 30, the temperature adjustment device 3 starts adjusting the temperature of the liquid LQ flowing through the flow path groove 42. The temperature of the liquid LQ flowing through the flow path groove 42 is adjusted by the thermoelectric module 30 absorbing or generating heat.

[0051] In the heat transfer chamber 20, the convex portion 41 has a large resistance, so most of the liquid LQ flows through the flow path grooves 42. Most of the flow is concentrated in the concave portion 20A of the heat transfer chamber 20. The flow path grooves 42 can have a large hydraulic diameter. In the concave portion 20A of the heat transfer chamber 20, the flow becomes faster and is prone to turbulence, improving heat transfer.

[0052] The flow path is shallow and laminar in the flat portion 20B of the heat transfer chamber 20. In the flat portion 20B of the heat transfer chamber 20, the proportion of the fluid that contributes to heat transfer is increased, and the heat transfer is improved.

[0053] In the recessed portion 20A of the heat transfer chamber 20, the fluid flows along the flow path grooves 42. In the flat portion 20B of the heat transfer chamber 20, the fluid flows so as to spread throughout the entire heat transfer chamber 20. Because the shape of the heat transfer chamber 20 is circular, the flow in the flat portion 20B and the flow in the recessed portion 20A intersect with each other. This generates a swirling flow, which makes the flow prone to become turbulent.

[0054] As described above, since the heat transfer chamber 20 has the recessed portion 20A and the flat portion 20B, even if the flow rate is low and would result in laminar flow in a flow path of uniform depth, there will be areas where the flow path will become turbulent because there are deep and shallow areas.

[0055] In the heat transfer chamber 20, the fluid supply port 43 and the fluid discharge port 44 are smoothly connected without being interrupted, so that an increase in pressure loss is suppressed. In the protrusion 41, although LQ becomes a laminar flow, the depth of the flow path is thin. This allows for better heat transfer than a flow path of uniform depth.

[0056] 11 to 13, the measurement results of the thermal resistance and pressure loss of the flow path of an example of the embodiment and a comparative example having a conventional configuration will be described. FIG. 11 is a diagram showing the relationship between the flow rate and the thermal resistance. FIG. 12 is a diagram showing the relationship between the flow rate and the pressure loss. FIG. 13 is a perspective view showing a schematic diagram of an example of a main body of a conventional temperature adjustment device, which is a comparative example. In FIGS. 11 and 12, Example (1) shows the embodiment, and the comparative example shows the conventional temperature adjustment device shown in FIG. 13.

[0057] In Fig. 13, the same reference numerals as in the embodiment denote the same components as in the embodiment. In the body 10 of the conventional temperature control device, the heat transfer chamber 20, which is a flow path, is formed in a spiral shape. The fluid supply port 43 is disposed on the outer periphery of the body 10, and the fluid discharge port 44 is disposed in the center of the body 10.

[0058] 11, in both Example (1) and the Comparative Example, the lower the thermal resistance, the better the heat transfer of the flow passage. It can be seen that the flow passage of Example (1) has heat transfer that is comparable to that of the flow passage of the Comparative Example.

[0059] 12, it is understood that the flow path of Example (1) has a lower pressure loss than the comparative example. Regarding the flow path of Example (1), no air bubbles remained inside the flow path.

[0060] <Effects> As described above, in the embodiment, the heat transfer chamber 20 is formed in a circular shape. In the embodiment, the fluid supply port 43 and the fluid discharge port 44 are arranged at a distance from each other in the radial direction across the center of the heat transfer chamber 20. In the embodiment, a plurality of flow grooves 42 are formed by connecting the fluid supply port 43 and the fluid discharge port 44. In the embodiment, in the heat transfer chamber 20, the fluid supply port 43 and the fluid discharge port 44 are smoothly connected without being interrupted or spiraling. This makes it possible to suppress an increase in pressure loss in the embodiment. In this way, according to the embodiment, it is possible to achieve an improvement in the temperature control ability for the temperature-controlled fluid and a reduction in pressure loss at a low flow rate.

[0061] In the embodiment, the flow path block 40 includes the flow path groove 42 and the protruding portion 41, so that the heat transfer chamber 20 can include the recessed portion 20A and the flat portion 20B. The embodiment having such a heat transfer chamber 20 can obtain the following effects.

[0062] In the embodiment, since the resistance of the convex portion 41 is large in the heat transfer chamber 20, most of the liquid LQ flows along the flow path grooves 42 in the concave portion 20A rather than in the flat portion 20B. In the embodiment, most of the flow is concentrated in the concave portion 20A of the heat transfer chamber 20. In the embodiment, the flow path grooves 42 can have a large hydraulic diameter. According to the embodiment, the flow is fast in the concave portion 20A of the heat transfer chamber 20 and is prone to turbulence, so that heat transfer can be improved.

[0063] In the embodiment, the flat portion 20B of the heat transfer chamber 20 has a shallow flow path and is laminar. According to the embodiment, the flat portion 20B of the heat transfer chamber 20 has a large ratio of fluid that contributes to heat transfer, and can improve heat transfer. As a result, according to the embodiment, better heat transfer can be obtained than in a flow path of uniform depth.

[0064] In the embodiment, in the recessed portion 20A of the heat transfer chamber 20, the fluid flows along the flow path groove 42. In the embodiment, in the flat portion 20B of the heat transfer chamber 20, the fluid flows so as to spread throughout the entire heat transfer chamber 20. In the embodiment, since the shape of the heat transfer chamber 20 is circular, the flow in the flat portion 20B and the flow in the recessed portion 20A cross each other. As a result, in the embodiment, a swirling flow is generated, which can easily generate a turbulent flow.

[0065] Thus, in the embodiment, the heat transfer chamber 20 includes the recessed portion 20A and the flat portion 20B. According to the embodiment, even if the flow rate is low and the flow rate would be laminar in a flow path of uniform depth, turbulent flow can be generated because the flow path has deep and shallow portions. According to the embodiment, the recessed portion 20A of the heat transfer chamber 20 provides good heat transfer as turbulent flow, and at the same time, the flat portion 20B allows the flow path to be extremely thin. As a result, the embodiment can improve heat transfer.

[0066] In the embodiment, the flow channel groove 42 is formed in a straight line in the center of the heat transfer chamber 20, and is formed in a circular arc shape that curves more significantly as it moves away from the center. According to the embodiment, striped flow channels can be appropriately formed over the entire circular heat transfer chamber 20. In the embodiment, the fluid supply port 43 and the fluid discharge port 44 can be smoothly connected without being interrupted midway or forming a spiral shape.

[0067] In the embodiment, the heat transfer chamber 20 has a supply-side reservoir 20C formed downstream of the fluid supply port 43, and a discharge-side reservoir 20D formed upstream of the fluid discharge port 44. According to the embodiment, the supply-side reservoir 20C allows the fluid LQ supplied from the fluid supply port 43 to be smoothly diffused throughout the heat transfer chamber 20. According to the embodiment, the discharge-side reservoir 20D allows the fluid LQ to be smoothly discharged from the entire heat transfer chamber 20 to the fluid discharge port 44.

[0068] <Modification> A modified example of the embodiment will be described with reference to FIG. 14. FIG. 14 is a perspective view showing a modified example of the flow path block and the heat transfer plate, which are the main body of the temperature control device according to the embodiment. As shown in FIG. 14, the flow path block 40 of the temperature control device 3 may be arranged so that the supply pipe 21 is located on the lower side in the Z-axis direction and the discharge pipe 22 is located on the upper side in the Z-axis direction. The temperature control device 3 shown in FIG. 14 is a state in which the temperature control device shown in FIG. 4 is rotated 90° around the X-axis in FIG. 4. In the modified example, the fluid supply port 43 is located on the lower side in the Z-axis direction and the fluid discharge port 44 is located on the upper side in the Z-axis direction. From the fluid supply port 43 to the fluid discharge port 44, the flow path is connected in a straight line or in a circular arc shape without being interrupted or spiraling from the lower side to the upper side in the Z-axis direction. As a result, the air inside the heat transfer chamber 20, which is the flow path of the fluid LQ, is discharged more smoothly from the discharge pipe 22 located on the upper side. As a result, the temperature control device 3 can be used at a low flow rate.

[0069] <Other embodiments> In the above-described embodiment, the temperature adjustment device 3 adjusts the temperature of the liquid LQ flowing through the heat transfer chamber 20 by using a thermoelectric module, but the present invention is not limited to this. For example, a heater may be built into the heat transfer plate 11 to adjust the temperature of the liquid LQ flowing through the heat transfer chamber 20.

[0070] In the above-described embodiment, the temperature adjustment device 3 adjusts the temperature of the liquid LQ. The temperature adjustment device 3 may adjust the temperature of a gas. By supplying a gas to the flow path groove 42, the temperature adjustment device 3 can use the thermoelectric semiconductor element 32 to adjust the temperature of the gas flowing through the flow path groove 42. [Explanation of symbols]

[0071] 1...cleaning system, 2...storage tank, 3...temperature control device, 4...substrate holding member, 5...nozzle, 6...first connecting pipe, 7...pump, 8...second connecting pipe, 11...heat transfer plate, 11P...corrosion-resistant plate, 12...thermoelectric module plate, 13...heat exchange plate, 20...heat transfer chamber, 20A...recess, 20B...flat portion, 21...supply pipe, 22...discharge pipe, 30...thermoelectric module, 31...case, 32...thermoelectric semiconductor element, 32P...p-type thermoelectric semiconductor element, 32N...n-type thermoelectric semiconductor element, 33...first electrode, 34...second electrode, 40...flow path block, 40A...surface, 40B...reverse side, 41...convex portion, 42...flow path groove, 43...fluid supply port, 44...fluid discharge port, 47...sealing member, 48...sealing groove, LQ...liquid, W...substrate.

Claims

1. a flow path block having flow path grooves provided on a front surface and a back surface through which a fluid flows; a pair of heat transfer plates facing the flow passage grooves provided in the flow passage block; a heat transfer chamber formed between the flow path block and the heat transfer plate; A fluid supply port disposed on an outer periphery of the heat transfer chamber; A fluid outlet disposed on an outer periphery of the heat transfer chamber; Equipped with The heat transfer chamber is formed in a circular shape, The fluid supply port and the fluid discharge port are disposed radially apart from each other across a center of the heat transfer chamber, The flow channel is formed in plurality, connecting the fluid supply port and the fluid discharge port. Temperature control device.

2. The flow path groove is formed in a straight line at the center of the heat transfer chamber, and is formed in an arc shape that curves more significantly as it moves away from the center. The temperature control device according to claim 1 .

3. the heat transfer chamber includes a flat portion in which a gap between the flow path block and the heat transfer plate is narrow, and a recessed portion in which a gap between the flow path block and the heat transfer plate is wider than the flat portion, The recess is formed between the flow path groove and the heat transfer plate. The temperature control device according to claim 1 or 2.

4. The heat transfer chamber has a supply-side reservoir formed downstream of the fluid supply port and a discharge-side reservoir formed upstream of the fluid discharge port. The temperature control device according to claim 1 or 2.

5. The fluid supply port is positioned below in the vertical direction, The fluid outlet is positioned vertically upward. The temperature control device according to claim 1 or 2.

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