Socket

The socket design addresses the challenge of guiding semiconductor devices by using a partially overlapping guide portion and removable structure, ensuring stable positioning and reduced thickness, thus minimizing structural issues and adapting to various devices.

JP2025018502APending Publication Date: 2025-02-06YOKOWO CO LTD
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Patent Information

Application Number
JP2023122244
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-07-27
Publication Date
2025-02-06

AI Technical Summary

Technical Problem

Existing sockets for inspecting semiconductor devices face challenges in guiding objects to a specified position due to the increased speed and need for thinner probes and contactors, which can lead to structural distortion and breakage.

Method used

The socket design incorporates a guide portion that partially overlaps with the object to be inspected, is attached to a separate member, and can be replaced or made thinner by using a removable structure, along with a resist that guides electrodes to contact points, reducing the thickness and minimizing distortion.

Benefits of technology

This design allows for stable guidance of semiconductor devices while reducing the thickness of the guide structure, minimizing distortion and breakage, and enabling easier adaptation to different device types.

✦ Generated by Eureka AI based on patent content.

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Abstract

To make a structure for guiding an object to be inspected to a predetermined position thin.SOLUTION: A socket includes a contactor in contact with an object to be inspected and a guide portion for positioning at least a part of the object to be inspected against the contactor. The guide portion is partially positioned with respect to an area overlapping the object to be inspected.SELECTED DRAWING: Figure 2
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Description

[Technical field]

[0001] The present invention relates to a socket. [Background technology]

[0002] In recent years, various sockets have been developed for use in testing semiconductor devices such as BGAs (Ball Grid Arrays).

[0003] Patent Document 1 describes an example of a socket. The socket includes a probe, a housing through which the probe is inserted, and a movable base disposed on the upper surface side of the housing. The movable base defines a recess for accommodating an object to be inspected.

[0004] Patent Document 2 describes an example of a socket. The socket includes a contact sheet. Contact terminals that come into contact with the contact terminals of the semiconductor chip are provided on the upper surface of the contact sheet. Guides that guide the contact terminals of the semiconductor chip are provided on the outer periphery of the contact terminals. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2023-36137 A [Patent Document 2] JP 2000-30828 A Summary of the Invention [Problem to be solved by the invention]

[0006] The socket may have a structure for guiding an object to be inspected, such as a semiconductor device, to a predetermined position. The increasing speed of semiconductor devices may require shorter probes and thinner contactors. The shortening of probes and the thinning of contactors may require a thinner structure for guiding an object to be inspected to a predetermined position.

[0007] One object of the present invention is to provide a thin structure for guiding an object to be inspected to a predetermined position. Other objects of the present invention will become apparent from the description of this specification. [Means for solving the problem]

[0008] One aspect of the present invention is a contactor that comes into contact with the object to be inspected; a guide portion for positioning at least a portion of the object to be inspected relative to the contactor; Equipped with The guide portion is a socket that is partially positioned relative to an area that overlaps the object to be inspected.

[0009] One aspect of the present invention is a contactor that comes into contact with the object to be inspected; a guide portion for positioning at least a portion of the object to be inspected relative to the contactor; Equipped with The guide portion and a predetermined member positioned around the object to be inspected are attached to each other in a socket.

[0010] One aspect of the present invention is A contactor is provided to come into contact with the object to be inspected, The contactor is a socket having a resist that guides at least a portion of the test object.

[0011] According to the above aspect of the present invention, the structure for guiding the inspection object to a predetermined position can be made thin. [Brief description of the drawings]

[0012] [Figure 1] FIG. 2 is an exploded perspective view of the socket according to the first embodiment. [Diagram 2] FIG. 2 is a top view of the socket according to the first embodiment. [Diagram 3] 3 is a cross-sectional view taken along line AA in FIG. 2. [Figure 4]FIG. 11 is an exploded perspective view of a socket according to a second embodiment. [Diagram 5] FIG. 11 is a top view of a socket according to a second embodiment. [Figure 6] 6 is a cross-sectional view of FIG. 5 taken along line B-B. [Figure 7] FIG. 11 is a schematic cross-sectional view of a socket according to a third embodiment. [Figure 8] FIG. 8 is a diagram showing a socket according to a first modified example of FIG. 7. [Figure 9] 8 is a diagram showing a socket according to a second modified example of FIG. 7. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In all the drawings, the same components are given the same reference numerals, and the description will be omitted as appropriate.

[0014] In this specification, the terms "approximately," "about," "substantially," and the like, when modifying the state of an element, such as the shape, position, or numerical value, mean a range that would be understood by a person skilled in the art to enable the intended purpose to be achieved by that state.

[0015] To explain the directions, the X, Y and Z directions are defined. The Z direction is a direction parallel to the vertical direction. The X direction is one of the horizontal directions perpendicular to the Z direction. The Y direction is one of the horizontal directions perpendicular to the Z and X directions. In each embodiment, the direction indicated by the Z-axis arrow is defined as the upward direction. In Fig. 2 and Fig. 5, the white circle with a black dot indicating the Z direction indicates that the direction indicated by the Z-axis arrow is the direction from the back of the paper to the front. In Fig. 3 and Figs. 6 to 9, the white circle with a black dot indicating the Y direction indicates that the direction indicated by the Y-axis arrow is the direction from the back of the paper to the front.

[0016] Hereinafter, as necessary, the side indicated by the X-axis arrow and the opposite side to the side indicated by the X-axis arrow will be referred to as the +X side and the -X side, respectively, the side indicated by the Y-axis arrow and the opposite side to the side indicated by the Y-axis arrow will be referred to as the +Y side and the -Y side, respectively, and the side indicated by the Z-axis arrow and the opposite side to the side indicated by the Z-axis arrow will be referred to as the +Z side and the -Z side, respectively.

[0017] Fig. 1 is an exploded perspective view of the socket 10A according to the first embodiment. Fig. 2 is a top view of the socket 10A according to the first embodiment. Fig. 3 is a cross-sectional view taken along line AA in Fig. 2. Fig. 2 shows an inspection object 20 to be inspected using the socket 10A according to the first embodiment in broken lines. Fig. 3 also shows the inspection object 20 to be inspected using the socket 10A according to the first embodiment. For the sake of explanation, the inspection object 20 shown in Figs. 2 and 3 is not shown in Fig. 1.

[0018] The socket 10A according to the first embodiment is used to inspect an object under inspection 20. In the first embodiment, the object under inspection 20 is a BGA (Ball Grid Array). As shown in FIG. 2, when viewed from the Z direction, the object under inspection 20 has a substantially square shape having a pair of sides parallel to the X direction and another pair of sides parallel to the Y direction. However, the shape of the object under inspection 20 is not limited to the shape shown in FIG. 2. As shown in FIG. 3, a plurality of electrodes 22 are provided on the lower surface of the object under inspection 20. Each electrode 22 is, for example, a solder ball. However, the object under inspection 20 may be a semiconductor device other than a BGA.

[0019] As shown in Figs. 1 to 3, the socket 10A according to the first embodiment includes a plurality of probes 100, a support 200, a frame 300, a guide member 400A, a plurality of springs 500, and a plurality of first screws 600. Figs. 1 and 3 show one probe 100 that contacts an electrode 22 provided on the underside of a corner on the -X side and +Y side of an inspection target 20. The support 200 has a pin block 210 and a pin plate 220. The frame 300 has a first frame portion 310, a plurality of first positioning pins 320, and a pedestal portion 330. The guide member 400A has a second frame portion 410A, a plurality of second positioning pins 420A, and a plurality of guide portions 430A.

[0020] In FIG. 3, the appearance of only one of the multiple probes 100 is illustrated. The probe 100 according to the first embodiment is a pogo pin that is expandable and contractible in the Z direction. The upper end and the lower end of the probe 100 are biased in a direction away from each other by a spring (not shown) provided inside the probe 100. The probe 100 is a contactor that comes into contact with the test object 20. Specifically, as shown in FIG. 3, when the test object 20 is tested using the socket 10A, the upper end of the probe 100 and the lower surface of the electrode 22 of the test object 20 come into contact with each other and are electrically connected to each other. When the test object 20 is tested using the socket 10A, the lower end of the probe 100 and the upper surface of the electrode of a test board such as a PCB (printed circuit board) not shown in FIGS. 1 to 3 come into contact with each other and are electrically connected to each other. Therefore, the electrode 22 of the test object 20 and the electrode of the test board can be electrically connected to each other via the probe 100. However, the structure of the probe 100 is not limited to a pogo pin.

[0021] The pin block 210 and the pin plate 220 overlap each other in the Z direction with the lower surface of the pin block 210 and the upper surface of the pin plate 220 in contact with each other. The pin block 210 and the pin plate 220 are, for example, insulating resin bodies. As shown in Fig. 1, when viewed from the Z direction, the pin block 210 and the pin plate 220 have a substantially rectangular plate shape having a pair of long sides parallel to the X direction and a pair of short sides substantially parallel to the Y direction. However, the shapes of the pin block 210 and the pin plate 220 are not limited to the shapes shown in Fig. 1.

[0022] As shown in Figs. 1 to 3, the pin block 210 and the pin plate 220 define a plurality of through holes 202. Each through hole 202 penetrates the pin block 210 and the pin plate 220 in the Z direction. In the example shown in Fig. 2, the plurality of through holes 202 are arranged in a plurality of rows and a plurality of columns in the X direction and the Y direction, respectively, as viewed from the Z direction. However, the arrangement of the plurality of through holes 202 is not limited to the arrangement shown in Fig. 2. As shown in Fig. 3, each probe 100 is inserted into each through hole 202. The support 200 supports the probe 100 parallel to the Z direction with the probe 100 inserted into the through hole 202.

[0023] 1 and 3, the first frame portion 310 is disposed on the upper surface side of the support 200. The first frame portion 310 is, for example, a metal block. As shown in FIGS. 1 and 2, when viewed from the Z direction, the first frame portion 310 has a substantially rectangular frame shape having a pair of long sides parallel to the X direction and a pair of short sides parallel to the Y direction. However, the shape of the first frame portion 310 is not limited to the shape shown in FIGS. 1 and 2.

[0024] As shown in Fig. 1 and Fig. 3, the first positioning pins 320 protrude from the lower surface of the first frame portion 310. In the example shown in Fig. 1, four first positioning pins 320 protrude from four corners of the lower surface of the first frame portion 310. However, the number and arrangement of the first positioning pins 320 are not limited to the number and arrangement shown in Fig. 1. The first frame portion 310 is disposed on the upper surface side of the support body 200 with the first positioning pins 320 inserted into the support body 200. By inserting the first positioning pins 320 into the support body 200, the support body 200 and the frame 300 can be positioned relative to each other.

[0025] As shown in Figs. 1 and 3, the base 330 is provided at the lower end of the inner surface of the first frame 310. In the example shown in Figs. 1 and 3, the first frame 310 and the base 330 are integrally molded. However, the first frame 310 and the base 330 may be separate members. In the example shown in Fig. 1, when viewed from the Z direction, the base 330 has a substantially square frame shape having a pair of sides parallel to the X direction and another pair of sides parallel to the Y direction. However, the shape of the base 330 is not limited to the shape shown in Fig. 1.

[0026] 1 and 3, the second frame portion 410A is disposed on the upper surface side of the support 200. In the example shown in Fig. 1 and 2, when viewed from the Z direction, the second frame portion 410A has a substantially square frame shape having a pair of sides parallel to the X direction and another pair of sides parallel to the Y direction. However, the shape of the second frame portion 410A is not limited to the shape shown in Fig. 1 and 2.

[0027] As shown in FIGS. 1 to 3, the second frame portion 410A defines an opening 412A. As shown in FIGS. 1 and 2, the opening 412A has a substantially square shape when viewed from the Z direction. However, the shape of the opening 412A is not limited to the shape shown in FIGS. 1 and 2. As shown in FIG. 3, when the inspection object 20 is inspected using the socket 10A, the inspection object 20 is placed inside the opening 412A. As shown in FIGS. 1 and 3, the width of the upper part of the opening 412A in a direction perpendicular to the Z direction decreases toward the bottom. Specifically, the inner side surface of the upper part of the opening 412A is tapered from the upper end of the opening 412A to the middle of the upper end and the lower end of the opening 412A. Therefore, compared to a case where the width of the upper part of the opening 412A in a direction perpendicular to the Z direction is constant regardless of the position in the Z direction, it is possible to easily guide the inspection object 20 toward the inside of the opening 412A. However, the width of the opening 412A in a direction perpendicular to the Z direction may be constant regardless of the position in the Z direction.

[0028] As shown in FIG. 1 and FIG. 3, the second positioning pins 420A protrude from the lower surface of the second frame part 410A. In the example shown in FIG. 1, two second positioning pins 420A protrude from both sides in the X direction of the lower surface of the second frame part 410A. The second positioning pin 420A provided in the +X side part of the second frame part 410A is located in the center in the Y direction of the +X side part of the second frame part 410A. The second positioning pin 420A provided in the -X side part of the second frame part 410A is located in the center in the Y direction of the -X side part of the second frame part 410A. However, the number and arrangement of the second positioning pins 420A are not limited to the number and arrangement shown in FIG. 1. The second frame part 410A is arranged on the upper surface side of the support body 200 with the second positioning pins 420A inserted into the base part 330. By inserting the second positioning pins 420A through the base portion 330, the frame 300 and the guide member 400A can be positioned relative to each other.

[0029] 1 to 3, the guide portions 430A are located at the bottom of the opening 412A. The second frame portion 410A and each guide portion 430A are integrally molded. In one example, the second frame portion 410A and each guide portion 430A are integrally molded from engineering plastic.

[0030] The guide parts 430A guide at least some of the electrodes 22 of the test object 20 to a predetermined position when the test object 20 is placed inside the opening 412A. Thus, the guide parts 430A position the electrodes 22 of the test object 20 relative to the probes 100. Specifically, as shown in FIG. 2 and FIG. 3, each guide part 430A defines a plurality of guide holes 432A. Each guide hole 432A penetrates the guide part 430A in the Z direction. As shown in FIG. 3, when the test object 20 is placed at a predetermined position inside the opening 412A, the electrodes 22 enter the guide holes 432A. By making the electrodes 22 enter the guide holes 432A, at least some of the electrodes 22 can be guided to a predetermined position by the guide parts 430A.

[0031] In the first embodiment, as shown in FIG. 1 and FIG. 2, four guide parts 430A are located at the four corners of the bottom of the opening 412A when viewed from the Z direction. Therefore, the multiple guide parts 430A are partially located in the area overlapping with the inspection object 20 in the Z direction. When the guide part 430A is partially located in the area overlapping with the inspection object 20 in the Z direction, the thickness of the guide part 430A in the Z direction can be made thinner than when the guide part 430A is located in the entire area overlapping with the inspection object 20 in the Z direction. Specifically, the faster the inspection object 20 is, the shorter the probe 100 in the Z direction may be required. The shorter the probe 100 in the Z direction may be, the thinner the thickness of the guide part 430A in the Z direction may be required. However, the thinner the thickness of the guide part 430A in the Z direction is when the second frame part 410A and the guide part 430A are integrally molded, the more likely defects such as distortion or breakage of the guide part 430A are to occur. In the first embodiment, the area of ​​the guide portion 430A can be made smaller than when the guide portion 430A is positioned over the entire area overlapping the inspection object 20 in the Z direction. The smaller the area of ​​the guide portion 430A, the easier it is to suppress defects such as distortion and breakage of the guide portion 430A. Therefore, in the first embodiment, the thickness in the Z direction of each guide portion 430A can be made thinner than when the guide portion 430A is positioned over the entire area overlapping the inspection object 20 in the Z direction.

[0032] 2, in the first embodiment, a pair of guide parts 430A located at diagonal corners of the bottom of the opening 412A are located on opposite sides of the center of the area overlapping with the inspection object 20 in the Z direction when viewed from the Z direction. Therefore, the inspection object 20 can be stably guided by the guide parts 430A, compared to a case where the guide parts 430A are located only on one side of both sides of the center of the area overlapping with the inspection object 20 in the Z direction.

[0033] As shown in Fig. 2, when viewed from the Z direction, the multiple through holes 202 in the portion of the support 200 overlapping with each guide portion 430A in the Z direction and the multiple guide holes 432A of each guide portion 430A overlap with each other in the Z direction. Therefore, as shown in Fig. 2, the upper end of each through hole 202 in the portion of the support 200 overlapping with each guide portion 430A in the Z direction and the lower end of each guide hole 432A of each guide portion 430A are communicated with each other. Therefore, the lower surface of the electrode 22 inserted into the guide hole 432A and the upper end of the probe 100 inserted into the through hole 202 communicating with the guide hole 432A can come into contact with each other.

[0034] The number and arrangement of the multiple guide portions 430A are not limited to the example according to the first embodiment. For example, when viewed from the Z direction, the guide portion 430A may be located at only one of the four corners of the bottom of the opening 412A. Alternatively, when viewed from the Z direction, the guide portion 430A may be located at at least one of the four sides of the bottom of the opening 412A instead of or in addition to the four corners of the bottom of the opening 412A. For example, when viewed from the Z direction, the guide portion 430A may be located on the opposite side of the bottom of the opening 412A.

[0035] 1, the multiple springs 500 are disposed between the upper surface of the base portion 330 and the lower surface of the second frame portion 410A, with the second frame portion 410A disposed on the upper surface side of the support 200. Therefore, the lower surface of the second frame portion 410A can be biased upward by the multiple springs 500. In the example shown in FIG. 1, four springs 500 are disposed between the four corners of the upper surface of the base portion 330 and the four corners of the lower surface of the second frame portion 410A. However, the number and arrangement of the springs 500 are not limited to the number and arrangement shown in FIG. 1.

[0036] As shown in FIG. 1, each first screw 600 has a shaft portion 610, a head portion 620, and a wide portion 630. The shaft portion 610 extends in the Z direction. The upper end of the shaft portion 610 and the lower surface of the head portion 620 are connected to each other. The dimension of the head portion 620 in a direction perpendicular to the Z direction is larger than the dimension of the shaft portion 610 in a direction perpendicular to the Z direction. The wide portion 630 is located below the head portion 620 around the shaft portion 610 in the Z direction. The dimension of the wide portion 630 in a direction perpendicular to the Z direction is larger than both the dimension of the shaft portion 610 in a direction perpendicular to the Z direction and the dimension of the head portion 620 in a direction perpendicular to the Z direction.

[0037] As shown in Figs. 1 to 3, each of the first screws 600 and the first frame portion 310 is fastened to each other in a state in which the shaft portion 610 is inserted into the first frame portion 310 and at least a portion of the wide portion 630 presses at least a portion of the upper surface of the second frame portion 410A downward against the elastic force of the spring 500. The position of the wide portion 630 in the Z direction can be adjusted by how deep the shaft portion 610 is inserted into the first frame portion 310 in the Z direction. The position of the second frame portion 410A in the Z direction can be adjusted by pressing the upper surface of the second frame portion 410A downward against the elastic force of each spring 500 by the wide portion 630. That is, in the example shown in Figs. 1 to 3, the guide member 400A is a floating plate that is movable in the Z direction. Therefore, even if the dimensions of the test object 20 differ depending on the type of the test object 20, the lower end of the electrode 22 and the upper end of the probe 100 can be reliably brought into contact with each other by adjusting the position of the second frame portion 410A in the Z direction. However, the guide member 400A may be fixed immovably in the Z direction.

[0038] 1 and 2, two first screws 600 are provided on both sides of the first frame portion 310 in the X direction. The first screws 600 provided on the +X side portion of the first frame portion 310 are positioned offset toward the +Y side with respect to the center in the Y direction of the +X side portion of the first frame portion 310. The first screws 600 provided on the -X side portion of the first frame portion 310 are positioned offset toward the -Y side with respect to the center in the Y direction of the -X side portion of the first frame portion 310. However, the number and arrangement of the first screws 600 are not limited to the number and arrangement shown in FIGS. 1 and 2.

[0039] The structure of the socket 10A is not limited to the structure described in the first embodiment.

[0040] The second frame portion 410A and the plurality of guide portions 430A according to the first embodiment are integrally molded. However, similar to the second embodiment described below, the second frame portion 410A and the plurality of guide portions 430A may be separate members.

[0041] The socket 10A according to the first embodiment includes a plurality of probes 100 and a support 200. However, the socket 10A may include a contactor such as a contactor 100C according to a third embodiment described later, instead of the plurality of probes 100 and the support 200. Therefore, the guide section 430A according to the first embodiment can be used not only to position at least a portion of the inspection object 20 relative to a contactor such as the probe 100, but also to position at least a portion of the inspection object 20 relative to a contactor such as a contactor 100C according to a third embodiment described later.

[0042] FIG. 4 is an exploded perspective view of the socket 10B according to the second embodiment. FIG. 5 is a top view of the socket 10B according to the second embodiment. FIG. 6 is a cross-sectional view taken along line BB of FIG. 5. In FIG. 5, an inspection object 20 to be inspected using the socket 10B according to the second embodiment is shown by a broken line. In FIG. 6, the inspection object 20 to be inspected using the socket 10B according to the second embodiment is also shown. In FIG. 4, the inspection object 20 shown in FIG. 5 and FIG. 6 is not shown for the sake of explanation. The socket 10B according to the second embodiment is similar to the socket 10A according to the first embodiment except for the following points.

[0043] 4 to 6, the socket 10B according to the second embodiment includes a plurality of probes 100, a support 200, a frame 300, a guide member 400B, a plurality of springs 500, a plurality of first screws 600, and a plurality of second screws 700B. The guide member 400B has a second frame portion 410B, a plurality of second positioning pins 420B, and a guide portion 430B. The second frame portion 410B defines an opening 412B.

[0044] As shown in FIG. 4, the guide portion 430B is in the shape of a substantially square plate having a pair of sides parallel to the X direction and another pair of sides parallel to the Y direction when viewed from the Z direction. However, the shape of the guide portion 430B is not limited to the shape shown in FIG. 4. As shown in FIGS. 4 and 5, the guide portion 430B is located over the entire bottom of the opening 412B. As shown in FIGS. 4 to 6, the guide portion 430B defines a plurality of guide holes 432B. As shown in FIGS. 5 and 6, the plurality of through holes 202 and the plurality of guide holes 432B overlap each other in the Z direction with the upper end of each through hole 202 and the lower end of each guide hole 432B communicating with each other. The guide portion 430B according to the second embodiment positions the plurality of electrodes 22 of the test object 20 with respect to the plurality of probes 100 in the same manner as the guide portion 430A according to the first embodiment.

[0045] In the second embodiment, the second frame portion 410B and the guide portion 430B are separate members. The second frame portion 410B according to the second embodiment is a molded engineering plastic. In contrast, the guide portion 430B according to the second embodiment is a resin sheet such as a polyimide sheet. Therefore, the second frame portion 410B is attached to a member located around the inspection object 20. When the second frame portion 410B is attached to a member located around the inspection object 20, the thickness of the guide portion 430B in the Z direction can be made thinner than when the second frame portion 410B and the guide portion 430B are integrally molded. Specifically, the speed of the inspection object 20 may increase, and the probe 100 may be required to be shortened in the Z direction. The shortening of the probe 100 in the Z direction may be required to be made thinner in the Z direction. However, when the second frame portion 410B and the guide portion 430B are integrally molded, the thinner the thickness of the guide portion 430B in the Z direction, the more likely defects such as distortion and breakage of the guide portion 430B occur. In the second embodiment, the second frame portion 410B and the guide portion 430B can be separate members. Therefore, in the second embodiment, defects such as distortion and breakage of the guide portion 430B can be easily suppressed compared to when the second frame portion 410B and the guide portion 430B are integrally molded. Therefore, in the second embodiment, the thickness of the guide portion 430B in the Z direction can be made thinner compared to when the second frame portion 410B and the guide portion 430B are integrally molded.

[0046] The second frame portion 410B and the guide portion 430B are attached to each other by a plurality of second screws 700B. Therefore, the second frame portion 410B and the guide portion 430B can be removed from each other by removing the plurality of second screws 700B. Therefore, the guide portion 430B can be replaced depending on conditions such as the type of the inspection object 20. For example, the number and arrangement of the guide holes 432B provided in the guide portion 430B can be changed depending on the type of the guide portion 430B.

[0047] 4, the four corners of the second frame portion 410B and the four corners of the guide portion 430B are attached to each other by four second screws 700B. The four second screws 700B are inserted from below to above through the guide portion 430B and the second frame portion 410B. However, the number and arrangement of the second screws 700B are not limited to those shown in FIG.

[0048] The method of attaching the second frame portion 410B and the guide portion 430B to each other is not limited to screw fastening. The lower surface of the second frame portion 410B and the upper surface of the guide portion 430B may be attached to each other by, for example, double-sided tape.

[0049] The structure of the socket 10B is not limited to the structure described in the second embodiment.

[0050] The guide portion 430B according to the second embodiment is attached to the second frame portion 410B. However, the guide portion 430B may be attached to a member different from the second frame portion 410B. The member to which the guide portion 430B is attached may be a member located around the inspection object 20 when viewed from the Z direction.

[0051] The guide portion 430B according to the second embodiment is located in the entire area overlapping with the inspection object 20 in the Z direction. However, similar to the guide portions 430A according to the first embodiment, the guide portions 430B may be located partially in the area overlapping with the inspection object 20 in the Z direction.

[0052] The socket 10B according to the second embodiment includes a plurality of probes 100 and a support 200. However, the socket 10B may include a contactor such as the contactor 100C according to the third embodiment described later, instead of the plurality of probes 100 and the support 200. Therefore, the guide section 430B according to the second embodiment can be used not only to position at least a portion of the inspection object 20 relative to a contactor such as the probe 100, but also to position at least a portion of the inspection object 20 relative to a contactor such as the contactor 100C according to the third embodiment described later.

[0053] 7 is a schematic cross-sectional view of a socket 10C according to embodiment 3. The socket 10C according to embodiment 3 is similar to the socket 10A according to embodiment 1 or the socket 10B according to embodiment 2, except for the following points.

[0054] The socket 10C according to the third embodiment includes a contactor 100C. The contactor 100C is disposed in the Z direction between the test object 20 and a test board such as a PCB not shown in FIG. 7. The contactor 100C according to the third embodiment includes an elastic material 110C, a plurality of first contact portions 120C, a plurality of second contact portions 130C, a plurality of connection conductor portions 140C, and a resist 150C. Each of the first contact portions 120C includes a first base portion 122C and a plurality of first protrusion portions 124C. The second contact portion 130C includes a second base portion 132C and a plurality of second protrusion portions 134C.

[0055] The elastic material 110C is an elastically deformable material. The elastic material 110C is, for example, an elastomer such as silicone rubber, urethane, etc. The elastic material 110C has a sheet shape that extends in a direction perpendicular to the Z direction.

[0056] The first base portion 122C and the first protrusions 124C are made of metal and are formed by, for example, electroforming.

[0057] The first base 122C is disposed on the upper surface side of the elastic material 110C. In the third embodiment, the first base 122C is circular when viewed from the Z direction. However, the shape of the first base 122C is not limited to the shape according to the third embodiment. The first protrusions 124C protrude from the upper surface of the first base 122C. When the test object 20 is tested using the socket 10C, the upper ends of the first protrusions 124C and the lower surfaces of the electrodes 22 contact each other. In the third embodiment, the first protrusions 124C are arranged at equal intervals around the center of the first base 122C when viewed from the Z direction. Specifically, the four first protrusions 124C are arranged at 90° intervals around the center of the first base 122C when viewed from the Z direction. Therefore, when the upper end of each first protrusion 124C and the lower surface of the electrode 22 are in contact with each other, the center of the electrode 22 and the center of the first base 122C can be easily overlapped in the Z direction when viewed from the Z direction. However, the number and arrangement of the first protrusions 124C are not limited to the number and arrangement according to the third embodiment.

[0058] The second base portion 132C and the second protrusion portion 134C are made of metal and are formed by, for example, electroforming.

[0059] The second base 132C is disposed on the lower surface side of the elastic material 110C. In the embodiment, the second base 132C is circular when viewed from the Z direction. However, the shape of the second base 132C is not limited to the shape according to the third embodiment. The second protrusion 134C protrudes from the lower surface of the second base 132C. When the test object 20 is tested using the socket 10C, the lower end of the second protrusion 134C and the upper surface of the electrode of the test board not shown in FIG. 7 come into contact with each other. When viewed from the Z direction, the second protrusion 134C is located at the center of the second base 132C. However, the number and arrangement of the second protrusions 134C are not limited to the example according to the third embodiment.

[0060] Each connection conductor 140C is located between each first contact portion 120C and each second contact portion 130C in the Z direction. Each connection conductor 140C is located on the inner surface of a through hole provided in the elastic material 110C. Each connection conductor 140C is electrically connected to the lower surface of each first contact portion 120C and the upper surface of each second contact portion 130C. Therefore, each first contact portion 120C and each second contact portion 130C are electrically connected to each other via the connection conductor 140C.

[0061] The resist 150C is located on the upper surface side of the elastic material 110C. The resist 150C defines a plurality of guide holes 152C. Each guide hole 152C at least partially exposes the upper surface of each first base portion 122C. The resist 150C is formed by patterning such as photolithography. The resist 150C is formed after the first contact portion 120C is formed. Alternatively, each first contact portion 120C may be formed by electroforming using the resist 150C as a mold, or each first contact portion 120C may be formed by a 3D printer or the like.

[0062] Each electrode 22 enters each guide hole 152C in a state where the lower surface of each electrode 22 and the upper end of each first protrusion 124C are in contact with each other. By inserting each electrode 22 into each guide hole 152C, the resist 150C guides each electrode 22 to a predetermined position. In the third embodiment, the resist 150C at least partially surrounds the first contact portion 120C when viewed from the Z direction. Therefore, it is possible to easily guide each electrode 22 toward each first contact portion 120C by the resist 150C. The thickness of the resist 150C in the Z direction can be made thinner than the thickness of the structure formed by cutting. Therefore, when the structure for guiding the electrode 22 is formed by the resist 150C, the thickness of the structure for guiding the electrode 22 in the Z direction can be made thinner than when the structure for guiding the electrode 22 is formed by cutting.

[0063] The width of at least a portion of each guide hole 152C in a direction perpendicular to the Z direction decreases with increasing distance from the inspection object 20. In the example shown in FIG. 7, the width of each guide hole 152C in the X direction decreases at the upper portion of each guide hole 152C with increasing distance from the inspection object 20. Specifically, the inner surfaces on both sides in the X direction of the upper portion of each guide hole 152C are tapered. Therefore, compared to a case where the width of each guide hole 152C in the X direction is constant regardless of the distance from the inspection object 20, each electrode 22 can be more easily guided toward each first contact portion 120C.

[0064] 7, the outer surface of each first base portion 122C around the Z direction and the portion of each first base portion 122C around the Z direction of the resist 150C are in contact with each other. In consideration of the processing position accuracy, the portion of each guide hole 152C around the Z direction of the resist 150C covers the portion of the upper surface of each first base portion 122C around the Z direction of each guide hole 152C. For example, the inner surface of each guide hole 152C is shifted by several tens of μm in the direction perpendicular to the Z direction toward the center of each guide hole 152C relative to the outer surface of each first base portion 122C.

[0065] FIG. 8 is a diagram showing a socket 10C1 according to a first modified example of FIG.

[0066] In the example shown in FIG. 8, the socket 10C1 has a contactor 100C1. The contactor 100C1 includes a resist 150C1. The resist 150C1 defines a plurality of guide holes 152C1. In the example shown in FIG. 8, the outer surface around the Z direction of each first base portion 122C and the portion of the resist 150C1 around the Z direction of each first base portion 122C are separated from each other via a gap. Therefore, the width in the X direction of the upper portion of the guide hole 152C1 shown in FIG. 8 can be made wider than the width in the X direction of the upper portion of the guide hole 152C shown in FIG. 7. Therefore, in the example shown in FIG. 8, it is possible to easily guide a larger electrode 22 toward each first contact portion 120C by the resist 150C1 than in the example shown in FIG. 7.

[0067] FIG. 9 is a diagram showing a socket 10C2 according to a second modified example of FIG.

[0068] In the example shown in FIG. 9, the socket 10C2 has a contactor 100C2. The contactor 100C2 includes a resist 150C2. The resist 150C2 includes a first resist 150C2a and a second resist 150C2b. The first resist 150C2a and the second resist 150C2b are laminated in order from the upper surface of the elastic material 110C. The width of the second resist 150C2b in the X direction is less than the width of the first resist 150C2a in the X direction. The resist 150C2 defines a plurality of guide holes 152C2.

[0069] The width of at least a portion of each guide hole 152C2 in a direction perpendicular to the Z direction decreases with increasing distance from the inspection target 20. In the example shown in FIG. 9, the width of each guide hole 152C2 in the X direction decreases from the second resist 150C2b to the first resist 150C2a with increasing distance from the inspection target 20. Specifically, the inner side surfaces on both sides in the X direction of each guide hole 152C2 have a step shape from the second resist 150C2b to the first resist 150C2a. Therefore, compared to a case where the width of each guide hole 152C2 in the X direction is constant regardless of the distance from the inspection target 20, each electrode 22 can be easily guided toward each first contact portion 120C. In addition, in the example shown in FIG. 9, the step shape of the inner side surfaces on both sides in the X direction of the guide hole 152C2 can be formed by laminating the first resist 150C2a and the second resist 150C2b. Therefore, the width of each guide hole 152C2 in the X direction can be made to decrease more easily with increasing distance from the inspection object 20 than if the inner side surfaces on both sides in the X direction of the resist 150C2 were formed in a tapered shape.

[0070] 9, the stepped shape of the inner side surfaces on both sides in the X direction of the resist 150C2 is formed by two layers of resist, a first resist 150C2a and a second resist 150C2b. However, the inner side surfaces on both sides in the X direction of the resist 150C2 may be formed by three or more layers of resist.

[0071] Although the embodiments of the present invention have been described above with reference to the drawings, these are merely examples of the present invention, and various configurations other than those described above can also be adopted.

[0072] According to the present specification, there is provided a socket having the following aspects. (Aspect 1) In aspect 1, the socket comprises a contactor that contacts the object to be tested and a guide portion that positions at least a portion of the object to be tested relative to the contactor, the guide portion being partially positioned relative to an area that overlaps with the object to be tested.

[0073] The "contactor" corresponds to the "probe" in the above embodiment.

[0074] According to the above-mentioned aspect, it is possible to easily suppress defects such as distortion and breakage of the guide portion, compared to a case where the guide portion is positioned over the entire area overlapping the inspection object. Therefore, according to the above-mentioned aspect, it is possible to make the guide portion thinner, compared to a case where the guide portion is positioned over the entire area overlapping the inspection object.

[0075] (Aspect 2) In a second aspect, the guide portions are located on opposite sides of a center of the region that overlaps with the object to be inspected.

[0076] According to the above-described aspect, the object to be inspected can be stably guided by the guide portion compared to a case in which the guide portion is positioned on only one of the two sides of the central portion of the area overlapping with the object to be inspected.

[0077] (Aspect 3) In aspect 3, the socket comprises a contactor that contacts the object to be inspected and a guide portion that positions at least a portion of the object to be inspected relative to the contactor, and the guide portion and a specified member positioned around the object to be inspected are attached to each other.

[0078] The "contactor" corresponds to the "probe" in the above embodiment.

[0079] According to the above-mentioned aspect, it is possible to easily suppress defects such as distortion and breakage of the guide portion, compared to when the guide portion and the specified member are integrally molded. Therefore, according to the above-mentioned aspect, it is possible to make the guide portion thinner, compared to when the guide portion and the specified member are integrally molded.

[0080] (Aspect 4) In a fourth aspect, the guide portion and the predetermined member are detachable from each other.

[0081] According to the above-described aspect, the guide portion can be replaced depending on conditions such as the type of the object to be inspected.

[0082] (Aspect 5) In aspect 5, the method includes providing a contactor that contacts the test object, the contactor having a resist that guides at least a portion of the test object.

[0083] According to the above-mentioned aspect, the thickness of the resist can be made thinner than the thickness of the structure formed by cutting. Therefore, according to the above-mentioned aspect, the structure for guiding at least a portion of the inspection object can be made thinner than when the structure for guiding at least a portion of the inspection object is formed by cutting.

[0084] (Aspect 6) In aspect 6, the contactor has a contact portion that contacts the object to be inspected, and the resist at least partially surrounds the contact portion.

[0085] According to the above-described aspect, at least a portion of the object to be inspected can be easily guided toward the contact portion by the resist.

[0086] (Aspect 7) In an embodiment, the resist defines an aperture at least partially exposing the contact portion, the aperture having a width that decreases with distance from the test object.

[0087] According to the above-described aspect, it is possible to more easily guide at least a portion of the test object toward the contact portion, compared to a case in which the width of the hole is constant regardless of the distance from the test object. [Explanation of symbols]

[0088] 10A, 10B, 10C, 10C1, 10C2 socket, 20 inspection object, 22 electrode, 100 probe, 100C, 100C1, 100C2 contactor, 110C elastic material, 120C first contact portion, 122C first base portion, 124C first protrusion portion, 130C second contact portion, 132C second base portion, 134C second protrusion portion, 140C connection conductor portion, 150C, 150C1, 150C2 resist, 150C2a first resist, 150C2b second resist, 152C, 152C1, 152C2 guide hole, 200 support, 202 through hole, 210 pin block, 220 pin plate, 300 frame, 310 first frame portion, 320 first positioning pin, 330 Base portion, 400A, 400B guide member, 410A, 410B second frame portion, 412A, 412B opening, 420A, 420B second positioning pin, 430A, 430B guide portion, 432A, 432B guide hole, 500 spring, 600 first screw, 610 shaft portion, 620 head portion, 630 wide portion, 700B second screw

Claims

1. a contactor that comes into contact with the object to be inspected; a guide portion for positioning at least a portion of the object to be inspected relative to the contactor; Equipped with The guide portion is positioned partially relative to an area that overlaps the object to be inspected.

2. The socket according to claim 1 , wherein the guide portions are located on opposite sides of a center of the region that overlaps with the object to be inspected.

3. a contactor that comes into contact with the object to be inspected; a guide portion for positioning at least a portion of the object to be inspected relative to the contactor; Equipped with The guide portion and a predetermined member located around the object to be inspected are attached to each other in a socket.

4. The socket according to claim 3 , wherein the guide portion and the predetermined member are detachable from each other.

5. A contactor is provided to come into contact with the object to be inspected, The contactor has a resist that guides at least a portion of the test object. A socket.

6. the contactor has a contact portion that comes into contact with the object to be inspected, The socket of claim 5 , wherein the resist at least partially surrounds the contact portion.

7. the resist defines an aperture at least partially exposing the contact portion; 7. The socket of claim 6, wherein at least a portion of said aperture has a width that decreases with distance from said test object.

Citation Information

Patent Citations

  • Semiconductor chip and contact sheet

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    JP2023036137A