Package having at least two contact points for microtechnology, method for handling package, and tool for executing method

Abstract

To provide a package which can perform an arrangement of a contact point at the same time and with high accuracy, and thereby can save time.SOLUTION: The present invention relates to a package 10 having at least two contact points 11 for a microtechnology. Each contact point 11 includes a contact surface 12, each contact point 11 is connected to at least one support structure body 13, and the contact points 11 are separated from each other. The contact surface 12 is distributed so as to be directed in the same direction while being distributed on the same plane. The support structure body 13 is manufactured from a connection material that can be separated and / or can be destroyed by a laser. In addition, the present invention relates to a method for handling the package 10 and a tool for executing the method.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The invention relates to a package with at least two contacts for microtechnology, to a method for handling a package with at least two contacts for microtechnology, and to a tool for implementing the method. [Background technology]

[0002] Due to the small size of the structures in microtechnology, the handling and manufacturing of electronic components is particularly laborious and must be performed with high precision. In particular, the placement of the contacts must be precise, otherwise parts of the electronic components may be shorted by incorrect placement of the contacts, or will not make sufficient contact and will not function as expected. In most cases, correction is not possible and the electronic components become unusable. If the placement is not precise, a large number of rejected parts will result. However, precise placement is time consuming.

[0003] As a result, there is a high demand for a rapid yet precise method for providing and placing contacts that can save time and effort without having to accept compromised quality of electronic components. Summary of the Invention [Problem to be solved by the invention]

[0004] It is therefore an object of the present invention to provide a contact that allows a simultaneous and still precise placement of the contacts, thus resulting in a time saving, so that the method can still be carried out with the usual high accuracy. [Means for solving the problem]

[0005] This object is achieved in a surprisingly simple and effective manner by a package comprising at least two contacts according to claim 1 and a method for arranging these contacts according to claim 13.

[0006] According to the invention, a package for microtechnology is proposed having at least two contacts, each of the contacts having a contact surface, the contacts being connected to at least one support structure and the contacts being spaced apart from one another and arranged such that the contact surfaces are arranged flush and oriented in the same direction.

[0007] The package is characterized in that the support structure is made of a connecting material that is separable and / or breakable by a laser. The invention is based on the basic idea that in electronic components in microtechnology, contacts are generally arranged at predefined positions at a predefined distance from each other on the electronic component. The positioning of these predefined positions is given in advance from the design of the electronic component. It is recognized within the scope of the invention that the predefined positions have a set distance from each other in order to allow the interchangeability of as many electronic components as possible. The predefined positions are arranged flush and oriented in the same direction. This means that if at least two contacts are arranged at a set distance on the electronic component before mounting, and the set distance corresponds to the distance of the predefined positions on the electronic component, then the precise orientation of the contacts is sufficient to also precisely and accurately orient at least one other contact. As a result, several contacts can be precisely oriented simultaneously, thus saving time.

[0008] In this regard, the precise distances contemplated by the present invention are ensured by a support structure which stabilizes the contacts at set distances relative to one another and allows the contacts to move together.

[0009] However, after mounting, the support structure must be removed, otherwise an unintended short circuit may occur between at least two contacts that may impair the function of the electronic component. Since the structures in microtechnology are very small, the separation and / or destruction of the support structure must be very precise. The laser beam is characterized by its coherent light and its high intensity, thus allowing to bring about an energy input in a selective and targeted manner with high precision. Since the structures in microtechnology are small, the selective and targeted separation and destruction of the support structure is made possible by the laser, which is separable and / or destructible by the laser, but without bringing about damage to other areas of the package, in particular the contacts, and / or the electronic component. Contacts in microelectronics serve to establish an electrically conductive connection, for example, to another electronic component or to a conductor. For this purpose, the contacts must be fixed at a predetermined position on the electronic component, typically arranged at a predetermined distance from each other. The predetermined positions are connected to the internal circuit of the electronic component and bring about its function. Apart from or instead of an electrical connection, some contacts can establish a mechanical connection to different electronic components. As a rule, the contacts are designed in such a way that it is possible to simply attach the contacts to different electronic components. Other contact designs are contemplated.

[0010] The package comprises at least two contacts that are arranged and mounted simultaneously. Preferably, the package comprises at least 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95 or 100 contacts. The contacts have contact surfaces that serve to electrically and / or mechanically connect to an electronic component at a predefined location. For this purpose, at least two contacts with contact surfaces must be arranged such that the contact surfaces are flush, oriented in the same direction and disposed at a predefined distance. In this way, the contacts can be attached simultaneously to two or more adjacent predefined locations of the electronic component. To ensure this orientation and the distance of the contacts from each other during the entire handling, the package has a support structure. This means that the support structure has the role of not only fixing the contacts to each other so that the contact surfaces remain flush and oriented in the same direction, but also ensuring the distance in the process. The person skilled in the art is familiar with suitable materials that have both the required separability and / or breakability and the required stability. Suitable materials are in particular metals and metal alloys. Suitable methods for separation and / or breakage by laser are described elsewhere.

[0011] Preferably, the connection material has a thermal conductivity of at least 10 W / mK. In the scope of the present invention, it is recognized that several methods for applying contacts to electronic components are used in microtechnology, which methods require heat or are heat-induced to establish a connection between the electronic component and the contacts during mounting. Applying heat to all contacts is cumbersome. In the scope of the present invention, it is recognized that the support structure is generally suitable for conducting heat from one contact to another. For this purpose, the support structure is made of a material with a thermal conductivity of at least 10 W / mK. Heat can then be conducted from one contact of the package to all the other contacts, which means that all contacts can be sufficiently heated when one of the contacts is heated. This means that it is possible to mount all contacts of the package simultaneously on the electronic component, in addition to positioning them simultaneously. In doing so, the support structure takes on the additional task of conducting the heat necessary for the connection process of said contacts to all contacts of the package when the contacts are mounted on the electronic component. To make this possible, the support structure is made of a connection material with a thermal conductivity of at least 10 W / mK. Due to the small size of the structures in microtechnology, this is a sufficiently high thermal conductivity, and a higher thermal conductivity is preferred.

[0012] The term "package" refers to a selected combination of at least two contacts fixed relative to one another.

[0013] The term "contact" refers to a conductive component that serves to electrically and / or mechanically connect an electronic component to another electronic component or electrical conductor.

[0014] The term "support structure" refers to a structure that secures at least two contacts in place relative to one another.

[0015] The term "connect material" refers to the material from which the support structure is made. The package according to the invention allows the simultaneous placement of several contacts on microtechnology electronic components, since the contacts are installed at the same time and can be connected to the electronic components at the same time, which results in significant savings in time and effort.

[0016] Advantageous embodiments of the invention, which can be realized individually or in combination with one another, are set out in the dependent claims.

[0017] The contacts are made from a contact material, the connection material possibly having a lower burn point and / or melting point than the contact material. As mentioned above, in order to eliminate a short circuit between two contacts caused by the support structure, it is necessary to separate and / or destroy the support structure after mounting the contacts on the electronic component. This can be done, for example, by burning and / or melting the support structure. In order not to impair the functionality of the contacts in this process, it is advantageous for the connection material of the support structure to have a lower burn point and / or melting point than the contact material.

[0018] Alternatively, to allow quick and easy manufacture of the package according to the invention, it is conceivable that the connecting material and the contact material are the same and therefore have the same properties.

[0019] In a further embodiment, it is conceivable that the contacts are flat and arranged parallel to one another. A flat design allows the contacts to be arranged at a preferred distance from one another. As a rule, the predefined positions for setting the distance between the contacts are adjacent to one another, and the contacts are intended to be arranged at said positions parallel to one another at a later stage. In this case, it is advantageous if the contacts are flat and arranged parallel to one another.

[0020] The term "flat" refers to an embodiment in which the extension of the contact in one spatial direction, i.e. in height, is significantly smaller than in the other two spatial directions. Particularly preferably, the contact is designed as an extrusion, in particular as a prism, and the extrusion takes place in the height direction. The term "parallel" refers to the orientation of the flat contact such that the sides limiting the height are oriented parallel to each other.

[0021] Furthermore, it is conceivable that the contacts are designed identically. An identical design of the contacts allows for easy and predictable handling. A different design of the contacts allows for a targeted adaptation of the contacts to the subsequently installed electronic component. It is then conceivable that in the package at least a first portion of the contacts, i.e. a first number of contacts, is included in a first embodiment and at least a second portion of the contacts, i.e. a second number of contacts, is included in a second embodiment. In this context, the first portion of the contacts can, for example, include identical contacts and the second portion of the contacts can also include identical contacts, although different compared to the first design.

[0022] It is further conceivable that the contacts are oriented in the same direction and / or in different directions. The contacts are arranged such that the contact surfaces are arranged flush and oriented in the same direction. However, this allows the contacts to be rotated relative to one another around an axis perpendicular to this plane and / or to be displaced parallel to this plane. If the contacts are oriented in the same direction, they can be shifted relative to one another via a simple displacement in the plane, no rotation of the individual contacts is necessary. If the contacts are oriented in different directions, a rotation in the plane is required to shift the contacts relative to one another. It is particularly preferred that the contacts are oriented in different directions. Most preferably, the contacts are oriented such that they are rotated 180° relative to one another. In this context, it is also conceivable that in a package with three or more contacts, a first portion of the contacts is oriented in the same direction, a second portion of the contacts is oriented in the same direction, and the first portion is oriented in a different direction relative to the second portion.

[0023] In yet another further embodiment of the present invention, it is conceivable that at least one contact comprises at least one recess. Preferably, at least 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95 or 100 contacts of the package, in particular all contacts, comprise at least one recess. Even more preferably, at least one contact comprises 2, 3, 4, 5, 6, 7, 8, 9 or 10 identical or different recesses. The shape of the recesses is generally not important, but in particular preferably the recesses are rectangular. A portion of the support structure can be accommodated within the recess, so that the contact can be connected to the support structure in a simple yet reliable manner and thereby fixed.

[0024] It is further conceivable that the support structure comprises at least one bar. The bar is a rectangular element, preferably circular or rectangular. The bar is easy to manufacture, but can be effectively utilized as a support structure. In this connection, it is conceivable that the bar is at least partially disposed in at least one recess of one, two, more or all of the contacts, as described elsewhere. It is further conceivable that the bar is disposed laterally on the contacts.

[0025] It is further conceivable that the support structure comprises at least one block, the block being arranged between the two contacts. The block is a polyhedron, preferably a polyhedron made up of finite polyhedrons and / or rectangular parallelepipeds. Particularly preferably, the block is a rectangular parallelepiped. In this connection, the first contact is arranged on at least one first side surface of the block, and the second contact is arranged on at least one second side surface of the block, the second side surface being preferably opposite the first side surface. The block is preferably applied to the contacts, in particular to the side surfaces of the contacts.

[0026] In a further embodiment, it is conceivable that the package comprises at least three contacts and that the support structure is designed in a multi-part with a first portion, the first portion of the support structure being connected to two contacts. This means that the first portion of the support structure is connected to only two of the three contacts. In this connection, it is conceivable that the first portion is a block. Preferably, the first portion is disposed between two adjacent contacts. However, alternatively, it is conceivable that the first portion is connected to two non-adjacent contacts. This is possible in particular if at least two of the three contacts are designed differently and / or oriented in different directions.

[0027] It is conceivable that the support structure is connected to the contacts with a material bond and / or is monolithically designed with the contacts, the material bond and / or the monolithic design ensuring a reliable hold between the support structure and the contacts, and optimally ensuring the fixation of the contacts relative to each other and the heat transfer from the support structure to the contacts.

[0028] The term "monolithic" refers to an object that is continuous from one piece, designed to have no grooves, and cannot be separated without destruction.

[0029] In another further embodiment of the invention, it is conceivable that the package is stacked. In this connection, it is preferred to first apply a mask to the appropriate structures and / or surfaces by photolithography to shape the contacts, and then to manufacture the first contacts by ion plating. The photoresist forming the mask is removed together with any excess coating, after which another mask is manufactured by photolithography and the support structure is made by ion plating. The photoresist of the support structure mask is removed together with any excess coating and another mask is manufactured for another contact. These steps are repeated until the desired number of contacts in the package is obtained. The stacked design means that the package can be manufactured quickly, easily and precisely.

[0030] In yet another further embodiment of the invention, it is envisaged that the package has a length, width and / or height of at least 2500 μm. As mentioned above, the package is intended for use in microtechnology. These dimensions correspond to those used in microtechnology.

[0031] The above term definitions and / or explanations are presumed to apply to all aspects described in the following description, unless stated to the contrary.

[0032] According to the invention, a method for handling packages as described elsewhere is proposed, said method comprising the following steps: a. gripping the package; b. heating at least one of the contacts to bond the contact surfaces of all of the contacts of the package; c. Separating and / or destroying the support structure with a laser.

[0033] Within the scope of the present invention, it is recognized that simultaneously processing contacts, in particular simultaneously bonding contacts of packages, saves time. This is achieved by handling several contacts simultaneously. This advantage can be achieved in particular by predefined positions of the electronic component to which the contacts are attached, which generally have a predefined distance from one another and a predefined orientation. For this reason, the contacts can be arranged at this distance and fixed by the support structure as early as possible during manufacture. In this way, several contacts can be gripped simultaneously and precisely arranged at different predefined positions simultaneously by precisely arranging the first contact. The support structure according to the invention makes it possible to heat all contacts simultaneously by heating only one contact. However, the support structure causes short circuits and impairs the functionality of the electronic component. For this reason, the support structure must be destroyed as a last step.

[0034] The laser beam is characterized by its coherent light and its high intensity, which means that it is possible to bring about the energy input in a selective and targeted manner with high precision. Due to the small size of the microtechnological structures, targeted separation and / or destruction of the support structures is made possible by the laser without damaging other areas of the package, in particular the contacts, and / or the electronic components.

[0035] First, the package is gripped by a suitable tool. After gripping, the tool allows the package to be transported, in particular to the electronic component on which it is to be installed. In a next step, which can be carried out before, during and / or after the package is transported to the desired location, the package is heated in preparation for bonding, so that the contact surfaces of the contacts are placed in the desired location and / or on a material applied thereto that allows bonding. The support structure is then destroyed and / or separated.

[0036] Preferably, the heating in step b is also performed by a laser, which allows the package to be heated in a selective and targeted manner at at least one contact without damaging other areas of the package, in particular the contacts and / or the electronic components. In a preferred embodiment, a laser beam is directed at at least one of the contacts during heating.

[0037] The term "bonding" refers to the formation of a permanent electrical and / or mechanical connection between a contact and a predetermined location on an electronic component.

[0038] The term "separation" refers to a process in which a support structure is divided and / or split into two or more portions.

[0039] The term "fracture" refers to a process that damages the support structure such that it loses its functionality. The function of the support structure in this context is to secure the contacts relative to each other.

[0040] In another further embodiment of the invention, it is envisaged that the separation and / or destruction of the support structure in step c) is carried out by laser ablation, which is a simple, rapid and precise method for separating and / or destroying the support structure.

[0041] In the context of lasers, the term "ablation" refers to the process by which a support structure is ablated through the use of a laser, whose energy is directed in a targeted manner at the material, particularly pulsed, causing the material to vaporize or be ablated in the form of particles. In doing so, the connecting material of the support structure is briefly heated at the surface to such a high temperature that the electrons forming the chemical bonds in the connecting material are excited and thermally vibrate such that the electrons break the chemical bonds and leave the connecting material. In doing so, the material can chip away due to Coulomb explosion, enhancing the ablation process.

[0042] It is further conceivable that the joining in step b is performed by soldering, in particular by means of a previously applied solder deposit. In this connection, it is preferably conceivable that the solder deposit is applied to the electronic component at a predetermined location and then fused via heat of the contacts, which are applied to the package when the package is placed in place and which also extend to the contact surfaces. Soldering is a simple but effective method for permanently electrically and mechanically connecting contacts to the electronic component at a predetermined location.

[0043] It is further conceivable that the gripping in step a is performed by a gripper with at least two jaws, each of which grips the package on the outer side or on the side of the contacts of the outermost contact of the package, and that the heating in step b is performed by transferring heat via the jaws to at least one of the contacts. Gripping by a gripper is an easy and controllable way to grip the package. The package can be gripped on the outer side of the corresponding outermost package, since this is a particularly easy and fast implementable way from a procedural point of view. Alternatively, the package can be gripped on one of the contacts, which allows a particularly precise positioning of the package, since it is possible to prevent displacement or damage of the already positioned package or contacts by the jaws of the gripper. The contacts are heated by one or more of the jaws to be heated, and the heat is dissipated via the jaws to one or more of the contacts. This has the advantage that the heating can be performed during the transport to the predetermined position and, if a laser is used for heating, damage to the support structure is prevented before bonding is prevented. Preferably, the gripper is designed as a two-jaw parallel gripper. It is conceivable that one or both jaws can be actuated to make it possible to grip a contact or a package, for example via form and / or force pairing.

[0044] Furthermore, according to the invention, a tool for carrying out the method as described elsewhere is proposed, the tool comprising a gripper, the gripper comprising at least two jaws. The tool is characterized in that at least one of the jaws comprises a heat transfer area. Via the heat transfer area it is possible to heat at least one contact point while the gripper is holding the package. In doing so, a laser beam is directed to the heat transfer area and the heat is transferred via the jaws to the contact point where the jaws make contact. This has the advantage that damage to the support structure is prevented before joining.

[0045] The term "jaw" refers to the part of the gripper that is in direct contact with the object to be gripped, i.e. the contact or the package. The jaws can be replaceable and can be equipped with special friction pads to increase stiction. In particular, the jaws can be designed as gripping fingers that serve to hold the package or the contact together with at least one other gripping finger. At least one of the jaws is mounted so that it is movable about an axis. The jaws preferably have a shape adapted to their function. Particularly preferably, the jaws are flat and / or tapered.

[0046] The term "heat transfer area" refers to a surface or portion of the jaw, particularly an exposed surface or portion, any of which can be heated by a laser and is suitable for transferring heat input via the laser to a package having a contact or contacts.

[0047] Further details, features and advantages of the invention can be derived from the following description of preferred exemplary embodiments in conjunction with the dependent claims, where the individual features can be realized alone or in combination with one another. The invention is not limited to this exemplary embodiment. The exemplary embodiment is illustrated diagrammatically in the drawings. In the individual figures, the same reference numbers refer to the same elements, functionally equal elements and / or functionally corresponding elements to one another. [Brief description of the drawings]

[0048] [Figure 1] FIG. 2 is an isometric view of a first package according to the present invention. [Figure 2A] 2 shows a top view of a second embodiment of a package according to the invention. [Figure 2B] 2 shows a front view of a second embodiment of a package according to the invention; [Diagram 3] 1 shows an isometric view of a third embodiment of a package according to the invention. [Figure 4A] 1 shows a side view of a fourth embodiment of a package according to the present invention. [Figure 4B]FIG. 13 shows a front view of a fourth embodiment of a package according to the present invention. [Figure 4C] 1 shows a top view of a fourth embodiment of a package according to the present invention. [Figure 5A] 2 shows step a of the method according to the invention. [Figure 5B] 4 shows step b of the method according to the invention. [Figure 5C] 4 shows step c of the method according to the invention. [Figure 6] 3 shows a first embodiment of a gripper according to the invention during the implementation of step b of the method according to the invention; [Figure 7] 2 shows a second embodiment of a gripper according to the invention. [Figure 8] 3 shows a third embodiment of a gripper according to the invention. [Figure 9] 4 shows a fourth embodiment of a gripper according to the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0049] FIG. 1 shows an isometric view of a first embodiment of a package 10 according to the invention. The package 10 according to the invention comprises three flat identical contacts 11 oriented in the same direction and arranged parallel to one another. Each of the contacts 11 comprises a contact surface 12 arranged at the bottom of FIG. 1. The contact surfaces 12 of the contacts 11 are arranged flush and oriented in the same direction. The contacts 11 are connected via a support structure 13 designed in two parts, each of the two parts being designed as a beam. Each of the beams of the support structure 13 is arranged in a recess 14, each contact 11 having two recesses 14. Through the material-to-material bond of the support structure 13 in the recesses 14, the contacts 11 of the package 10 are fixed in their distance and their orientation relative to one another.

[0050] Figure 2A shows a top view and Figure 2B shows a front view of a second package 10 according to the invention. The package 10 also comprises three contacts 11 connected via a support structure 13 and thereby fixed in their distance and their orientation. Each of the contacts 11 comprises a contact surface 12, which is disposed at a predetermined position 21 of an electronic component 20 and connected thereto in Figures 2A and 2B. As can be seen especially in Figure 2B, the contact surfaces 12 are located flush and oriented in the same direction. The contacts 11 are identical, oriented in the same direction, flat and disposed parallel to one another.

[0051] FIG. 3 shows an isometric view of a third embodiment of a package 10 according to the invention. The package 10 according to the invention comprises three flat identical contacts oriented in the same direction and arranged parallel to one another. Each of the contacts 11 comprises a contact surface 12 arranged at the bottom of FIG. 3. The contact surfaces 12 of the contacts 11 are located flush and oriented in the same direction. The contacts 11 are connected via a support structure 13 designed in parts, the parts being designed as blocks. In this connection, two blocks are arranged between the two contacts 11 in each case. On the outermost contacts 11, two blocks are also arranged on the outside, and a fourth contact 10 (not shown) can be arranged on the two blocks. Through the inter-material bonding of the blocks of the support structure 13, the contacts 11 of the package 10 are fixed in their distance and in their orientation relative to one another.

[0052] FIG. 4A shows a side view, FIG. 4B shows a front view and FIG. 4C shows a top view of a fourth embodiment of a package 10 according to the invention. The side view in FIG. 4A is a cut view of the package 10 cut along axis A in FIG. 4C. The package 10 also comprises three contacts 11 fixed in their distance and in their orientation via a support structure 13. The contacts 11 are flat and each comprises a contact surface 12, which are arranged in three predefined positions 21 of the electronic component 20. The contacts 11 are oriented in different directions but are parallel, the two outer contacts 11 are oriented in the same direction and the central contact 11 is rotated by 180°. The support structure 13 is designed in three parts. In this connection, it can be easily seen that a part of the support structure 13 designed as a block and a rectangular parallelepiped is arranged below the contacts 11 between the contacts 11 in each case. A block-shaped support structure 13 is disposed on the first contact 11 by a first side and on the second contact 11 by a second side. Between both external contacts 11 of the package 10 another part of the support structure 13 is disposed, which is connected to one of the contacts 11 as a block by a first side and to the other contact 11 as a block by a second side opposite the first side.

[0053] Figure 5A shows step a of the method according to the invention, in which a package 10 comprising three contacts 11 connected to each other via a support structure 13 is gripped via a gripping tool 31. Figure 5A further shows a second identical package, but not gripped.

[0054] Fig. 5B shows a step b of the method according to the invention, in which the package 10 gripped in step a is heated by a heating tool 32. The gripping tool 31 is not shown in this context. The heating tool 32 is a laser, which heats the package 10 by means of a laser beam 40. Furthermore, an electronic component 20 is shown with a number of predefined positions 21. In this context, the package 10 is already arranged at the predefined positions 21. It can further be seen in Fig. 5B at which predefined positions 21 the heated package 10 is to be arranged. Here, the contacts 11 of the heated package 10 are arranged at the predefined positions 21 of the electronic component 20, still free, and are soldered thereon by heat.

[0055] 5C shows step c of the method according to the invention, in which the support structure 13 of the package 10 is cut by a cutting tool 33. This separates the contacts 11 that do not have a direct electrical connection. The electronic components 20 can then be connected to other electronic components via the contacts 11. The support structure 13 is cut by a laser beam 40 emitted by a laser.

[0056] Fig. 6 shows a first embodiment of a gripper 50 during the implementation of step b of the method according to the invention. The gripper 50 grips the package 10 using two jaws 51. In this connection, one jaw 51 abuts on the outer side of the external contact 11. The gripper 50 transports the package 10, which is still free, to a predetermined position 21 on the electronic component 20 on which another package 10 is already arranged. A laser beam 40 of a heating tool 32 designed as a laser is directed to the heat transfer area 52. This causes the heat transfer area 52 to be heated and the heat is transferred via the jaws 51 to the contact 11, which means that said contact 11 can also heat the heated contact 11 and thus be joined at the predetermined position 21.

[0057] Figure 7 shows a second embodiment of a gripper 50 according to the invention. The gripper 50 corresponds to the gripper 50 shown in figure 6, with a heat transfer area 52 arranged on the other jaw 51. The gripper 50 grips a package 10 with three contacts 11. A laser beam 40 of a heating tool 32 designed as a laser is directed towards the heat transfer area 52. This means that the heat transfer area 52 is heated and the heat is transferred via the jaw 51 to the contact 11 shown on the right side of figure 7, said contact 11 also being heated. The other contact is heated via a support structure 13 which transfers the heat from the contact 11 shown on the right side of figure 7 to the other contact.

[0058] Figure 8 shows a third embodiment of a gripper 50 according to the invention. It corresponds to the gripper 50 shown in figure 7, with the jaws 51 narrowed. This allows the jaws 51 of the gripper 50 to be inserted at least partially into the gap between the two contacts 11. The gripper 50 can thus grip the package 10 at the central contact 11. A laser beam 40 of a heating tool 32 designed as a laser is directed towards the heat transfer area 52. This causes the heat transfer area 52 to be heated, which is transferred via the jaws 51 to the central contact 11.

[0059] Figure 9 shows a third embodiment of a gripper 50. It corresponds to the gripper 50 shown in figure 7, in which both jaws 51 are provided with a heat transfer area 52 towards which the laser beam 40 of the heating tool is directed. [Explanation of symbols]

[0060] List of codes 10 Packages 11 Contacts 12 Contact surface 13 Support structure 14 Recess 20 Electronic Components 21 In Place 31 Grip Tools 32 Heating Tools 33 Cutting Tools 40 Laser Beam 50 Gripper 51 Jaw 52 Heat Transfer Area

Claims

1. A package (10) for microtechnology comprising at least two contacts (11), each of said contacts (11) having a contact surface (12), said contacts (11) being connected to at least one support structure (13) and said contacts (11) being spaced apart from one another and arranged such that said contact surfaces (12) are arranged flush and oriented in the same direction, The support structure (13) is made of a connecting material that can be separated and / or broken by a laser. A package (10).

2. The contacts (11) are made from a contact material, the connection material having a lower burning point and / or melting point than the contact material. The package (10) according to claim 1, characterized in that

3. The contacts (11) are flat and arranged parallel to each other. A package (10) according to claim 1 or 2, characterized in that

4. Said contacts (11) are designed to be identical and / or different A package (10) according to any one of the preceding claims, characterized in that

5. The contacts (11) are oriented in the same and / or different directions. The package (10) according to claim 4, characterized in that

6. At least one contact (11) has at least one recess (14). A package (10) according to any one of the preceding claims, characterized in that

7. said support structure (13) comprising at least one bar A package (10) according to any one of the preceding claims, characterized in that

8. the bar is disposed laterally on the contact (11); The package (10) according to claim 7, characterized in that

9. The support structure (13) comprises at least one block, the block being disposed between the contacts (11). A package (10) according to any one of the preceding claims, characterized in that

10. The package (10) has at least three contacts (11), and the support structure (13) is designed in multiple parts, and a part of the support structure (13) is connected to two contacts (11). A package (10) according to any one of the preceding claims, characterized in that

11. The support structure (13) is connected to the contacts (11) by material-to-material bonds and / or is designed monolithically with the contacts (11). A package (10) according to any one of the preceding claims, characterized in that

12. To be built up in layers, especially by ion plating A package (10) according to any one of the preceding claims, characterized in that

13. having a length, width and / or height of up to 2500 μm A package (10) according to any one of the preceding claims, characterized in that

14. A method for handling a package (10) according to any one of the preceding claims, comprising: a. gripping the package (10); b) heating at least one of the contacts (11) to bond the contact surfaces of all the contacts (11) of the package (10); c. Separating and / or destroying said support structure (13) by a laser; A method comprising:

15. 15. The method of claim 14, wherein the separating and / or destroying in step c) is performed by ablation with the laser.

16. 16. The method according to claim 14 or 15, wherein the joining in step b is performed by soldering, in particular by means of a previously applied solder deposit.

17. 17. The method according to claim 14, wherein the gripping in step a is performed by a gripper (50) with at least two jaws (51), each jaw (51) gripping the package (10) at an outer surface of an outermost contact (11) of the package or at a side of a contact (11), and wherein the heating in step b is performed by transferring heat to at least one of the contacts (11) via the jaws (51).

18. A tool for carrying out the method according to any one of claims 14 to 17, comprising a gripper (50) with at least two jaws (51), At least one of said jaws (51) is provided with a heat transfer area (52). A tool characterized by:

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