Component mounting device, control method for component mounting device, and component mounting system

Abstract

To provide a component mounting device that suppresses the occurrence of abnormal noise or vibration.SOLUTION: A component mounting device according to the present disclosure includes: a stage that supports a substrate; a component supply part that supplies components; a mounting head that holds the components supplied from the component supply part and mounts them onto the substrate supported by the stage; a head movement part that moves the mounting head; a camera that is positioned between the component supply part and the stage, and images the components; and a control part that controls the head movement part so as to accelerate or decelerate the mounting head within a range of the regulation acceleration toward a prescribed target path when moving the mounting head toward a first region from a second region in the second region that is closer to the component supply part relative to the first region being the region which is positioned above the camera and in which the camera images the components held by the mounting head.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present disclosure relates to a component mounting device, a control method for a component mounting device, and a component mounting system. [Background technology]

[0002] For example, Patent Document 1 discloses a component mounting apparatus including a mounting head that holds and moves an electronic component, an imaging device that images the electronic component held by the mounting head, and a control unit.

[0003] In the component mounting device of Patent Document 1, the mounting head moves above the imaging device at a constant speed under the control of the control unit, and the imaging device captures images of the electronic components held by the mounting head from below. The control unit adjusts the movement speed of the mounting head to align it at a preparation distance before imaging. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2007-201284 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, if the moving speed of the mounting head suddenly increases or decreases during alignment of the mounting head, abnormal noise or vibration may occur.

[0006] An object of the present disclosure is to solve the above-mentioned problems and to provide a component mounting device that suppresses the generation of abnormal noise or vibration. [Means for solving the problem]

[0007] The component mounting device of the present disclosure includes a stage that supports a substrate, a component supply unit that supplies components, a mounting head that holds the components supplied from the component supply unit and mounts them on a substrate supported by the stage, a head moving unit that moves the mounting head, a camera that is provided between the component supply unit and the stage and captures images of the components, and a control unit that is located above the camera and controls the head moving unit to accelerate or decelerate the mounting head within a regulated acceleration range toward a predetermined target path when moving the mounting head from a second region closer to the component supply unit to a first region in which the camera captures images of the components held by the mounting head.

[0008] A control method for a component mounting device according to the present disclosure is a method for controlling a component mounting device including a stage for supporting a substrate, a component supply unit for supplying components, and a mounting head for holding components supplied from the component supply unit and mounting them on a substrate supported by the stage, the method including a head moving unit moving the mounting head from a second region toward a first region, and a camera provided between the component supply unit and the stage capturing an image of the components held by the mounting head in the first region, the first region being a region located above the camera, and the second region being a region closer to the component supply unit than the first region, and the control unit controlling the head moving unit to accelerate or decelerate the mounting head within a regulated acceleration range toward a predetermined target path when moving the mounting head from the second region toward the first region.

[0009] The component mounting system according to the present disclosure includes a component mounting device and a processing device that communicates with the component mounting device via a network. The component mounting device has a stage that supports a substrate, a component supply unit that supplies components, a mounting head that holds components supplied from the component supply unit and mounts them on a substrate supported by the stage, a head moving unit that moves the mounting head, a camera that is provided between the component supply unit and the stage and captures images of the components, and a first communication unit. The processing device has a control unit located above the camera and that calculates control information to control the head moving unit to accelerate or decelerate the mounting head within a regulated acceleration range toward a predetermined target path when moving the mounting head from a first region in which the camera captures images of components held by the mounting head to a second region that is closer to the component supply unit, and a second communication unit that transmits the control information to the first communication unit via the network. Effect of the Invention

[0010] According to the present disclosure, it is possible to provide a component mounting device that suppresses the generation of abnormal noise and vibration. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a plan view of a component mounting device according to a first embodiment of the present disclosure. [Diagram 2] Side view of the component mounting device [Diagram 3] Cross-section of the part imaging camera [Figure 4] Control system block diagram [Figure 5A] Plan view of the mounting head and the part imaging camera [Figure 5B] Plan view of the mounting head and the part imaging camera [Figure 6] 1 is a flowchart showing a component mounting operation by a component mounting device. [Figure 7] A flowchart showing the alignment operation of the mounting head in the second area. [Figure 8A] A plan view showing the movement path of the mounting head [Figure 8B]Graph showing speed and acceleration of mounting head [Figure 9A] A plan view showing the movement path of the mounting head [Figure 9B] Graph showing speed and acceleration of mounting head [Figure 10A] A plan view showing the movement path of the mounting head [Figure 10B] Graph showing speed and acceleration of mounting head [Figure 11] Schematic diagram of a component mounting system according to a second embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] [Embodiment 1] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. The configurations, shapes, etc. described below are examples for the purpose of explanation, and can be appropriately changed according to the specifications of the component mounting device. In the following, the same reference numerals are used for corresponding elements in all drawings, and duplicated explanations will be omitted.

[0013] (Overall composition) Fig. 1 is a plan view of a component mounting device 1 according to a first embodiment of the present disclosure. Fig. 2 is a side view of the component mounting device 1. Fig. 2 diagrammatically illustrates a portion of the component mounting device 1 in Fig. 1. Fig. 1 and a portion thereof described later show an X-axis (left-right direction in Fig. 1) in the board transport direction and a Y-axis (up-down direction in Fig. 1) perpendicular to the board transport direction as two axes perpendicular to each other in a horizontal plane. Fig. 2 and a portion thereof described later show a Z-axis (up-down direction in Fig. 2) as a height direction perpendicular to the horizontal plane.

[0014] First, the overall configuration of the component mounting device 1 will be described with reference to Figures 1 and 2. The component mounting device 1 has a function of performing a component mounting operation of mounting components 14, such as dies and IC chips, supplied from a component supply unit 4 onto a substrate 3. As shown in Figure 1, the component mounting device 1 includes a base 1a, a stage 2, the component supply unit 4, a mounting head 8, a head moving unit 9, a component imaging camera 20, and a control unit 15.

[0015] The base 1a is a member that supports the stage 2, the head moving unit 9, and the like.

[0016] A stage 2 is provided in the center of the base 1a so as to be movable along the X-axis. The stage 2 supports the substrate 3 and transports it along the X-axis. The stage 2 transports the substrate 3 transported from the upstream (-X side) to a work position, positions it, and holds it. In addition, the stage 2 transports the substrate 3 downstream (+X side) after component mounting work has been completed.

[0017] Component supply units 4 are disposed on both sides of stage 2 (front-rear direction of the Y axis). Each component supply unit 4 has multiple tape feeders 5 attached along the X axis. The tape feeders 5 accommodate component tapes 12. Pockets are formed in the component tape 12, and components 14 are stored in the pockets. As shown in FIG. 2, the tape feeders 5 feed the component tape 12 in a direction from the outside of the component supply unit 4 toward the stage 2, and supply the components 14 to component supply positions 5a where the components 14 are picked up by the mounting head 8.

[0018] Returning to FIG. 1, a Y-axis table 6 equipped with a linear drive mechanism is arranged along the Y-axis at both ends of the X-axis on the upper surface of the base 1a. A beam 7 similarly equipped with a linear drive mechanism is coupled to the Y-axis table 6 so as to be freely movable along the Y-axis. The beam 7 extends along the X-axis. A mounting head 8 is attached to the beam 7 via a plate 7a so as to be freely movable along the X-axis. The mounting head 8 is equipped with a plurality of suction units 8a that can lift and lower while suction-holding the components 14 supplied to the component supply section 4. In the first embodiment, the mounting head 8 has eight suction units 8a. A nozzle N is attached to the lower end of each suction unit 8a. The nozzle N suctions and holds the components 14 at the tip Na.

[0019] The Y-axis table 6 and the beam 7 constitute a head moving unit 9 that moves the mounting head 8 along the X-axis and Y-axis between the base 1a and the component supply unit 4. The mounting head 8 and the head moving unit 9 hold the component 14 supplied to the component supply unit 4, move toward the stage 2, and perform a component mounting operation of mounting the component 14 at a mounting position on the substrate 3 supported by the stage 2.

[0020] 2, the mounting head 8 further includes a board imaging camera 10 and a head position acquisition unit 13. The board imaging camera 10 images the mounting position on the board 3 where the component 14 is to be mounted, and moves integrally with the mounting head 8. The head position acquisition unit 13 acquires the actual position of the mounting head 8 relative to a predetermined reference as, for example, XY coordinates. The head position acquisition unit 13 acquires the XY coordinates of the mounting head 8 from, for example, the linear drive mechanism of the Y-axis table 6 and the beam 7.

[0021] Returning to Fig. 1, a component imaging camera 20 is disposed between the component supply unit 4 and the stage 2. When the mounting head 8 moves from the component supply unit 4 toward the stage 2, the mounting head 8 moves above the component imaging camera 20. The component imaging camera 20 then images the component 14 held by the mounting head 8 from below. Based on the imaging results by the component imaging camera 20, the control unit 15 can use image processing to recognize the positional deviation of the component 14 with respect to the nozzle N.

[0022] The control unit 15 is configured to control the component mounting device 1. The control unit 15 includes a general-purpose processor such as a CPU, MPU, FPGA, DSP, or ASIC that executes a program to realize a predetermined function. The control unit 15 executes a program stored in a memory (not shown) to realize the function.

[0023] The control unit 15 controls the stage 2, the component supply unit 4, the head moving unit 9, the component imaging camera 20, etc., based on information stored in the memory or information acquired by other components. For example, the control unit 15 controls the head moving unit 9 based on the position of the mounting head 8 acquired by the head position acquisition unit 13.

[0024] Next, the configuration of the component imaging camera 20 will be described with reference to Fig. 3. Fig. 3 is a cross-sectional view of the component imaging camera 20.

[0025] 3, the component imaging camera 20 has a housing 21 and an imaging element 25. A part of the housing 21 is cut out and a transparent plate 22 is installed on the upper part of the housing 21. The imaging element 25 is disposed below the transparent plate 22. The imaging element 25 can capture an image, through the transparent plate 22, of the underside 14a of the component 14 held by the mounting head 8 that moves above the component imaging camera 20, i.e., within the field of view of the component imaging camera 20.

[0026] Next, the configuration of the control system will be described with reference to Fig. 4. Fig. 4 is a block diagram of the control system.

[0027] 4, the control unit 15 controls the stage 2, the component supply unit 4, the mounting head 8, the head moving unit 9, and the component imaging camera 20. The control unit 15 also acquires information from the head position acquisition unit 13. The control unit 15 has a storage unit 16 and a determination unit 17.

[0028] The storage unit 16 is a recording medium for recording various information and control programs, and may be a memory that functions as a work area for the control unit 15. The storage unit 16 is realized, for example, by a flash memory, an SSD (Solid State Device), a hard disk, a RAM, or other storage device, or by an appropriate combination of these. The determination unit 17 includes, for example, a processor that executes a predetermined calculation.

[0029] Specifically, the storage unit 16 stores on-board data 31, target route data 32, and restricted acceleration data 33, which will be described later.

[0030] The mounting data 31 includes information necessary for component mounting operations, such as the size of the board 3, the type, size (length, width, thickness) and mounting position (XY coordinates) of the component 14 to be mounted, for each type (board type) of board 3. The mounting data 31 further includes, for each component mounting operation, the position of the component 14 in the component supply unit 4, the position of the nozzle N that holds the component 14 in the mounting head 8, and the like.

[0031] The target path data 32 includes information on a target path along which the mounting head 8 moves from the component supply unit 4 toward the stage 2 for each component mounting task. First, the target path data 32 includes position information on the target path. The position information on the target path includes, for example, position information on a plurality of discrete reference positions where the mounting head 8 should be positioned on the target path. In the first embodiment, the storage unit 16 stores, as the position information on the reference positions, first reference data 32A including the X coordinates of each of the reference positions, and second reference data 32B including the Y coordinates of each of the reference positions. Each of the multiple X coordinates included in the first reference data 32A corresponds to any one of the multiple Y coordinates included in the second reference data 32B.

[0032] The target path data 32 may further include the speed at which the mounting head 8 is moved. In the first embodiment, the storage unit 16 stores a constant speed, a predetermined speed V1, as the speed at which the mounting head 8 is moved along the target path. Here, the predetermined speed V1 is a vector speed that is a combination of the speed in the X direction and the speed in the Y direction. By moving the mounting head 8 at the predetermined speed V1, it becomes easy to synchronize the movement of the mounting head 8 with the timing of imaging by the component imaging camera 20. On the other hand, the speed of the mounting head 8 may change midway along the target path, and the storage unit 16 may store the respective speeds.

[0033] The target path data 32 may include information related to time. For example, the target path data 32 includes information on how many milliseconds after the mounting head 8 starts moving in the X direction, the mounting head 8 starts moving in the Y direction.

[0034] In the component mounting operation, the control unit 15 controls each part of the component mounting device 1 based on the mounting data 31 and the target path data 32. Based on the mounting data 31, the control unit 15 controls each part of the component mounting device 1 so that the component 14 supplied from the component supply unit 4 is held, the component imaging camera 20 images the component 14, and the component 14 is mounted at a mounting position on the board 3 supported by the stage 2. When the mounting head 8 holding the component 14 moves from the component supply unit 4 toward the stage 2, the control unit 15 controls the head moving unit 9 based on the target path data 32 so that the mounting head 8 moves along the target path. By such control, the mounting head 8 passes above the component imaging camera 20 along a predetermined path. Therefore, the component imaging camera 20 can accurately image the position of the component 14 held by the mounting head 8.

[0035] 5A and 5B, a target path L along which the mounting head 8 moves from the component supply unit 4 toward the stage 2 will be described. Figures 5A and 5B are plan views that roughly show a state before the mounting head 8 passes above the component imaging camera 20 along the target path L.

[0036] After receiving components 14 from the component supply unit 4, the mounting head 8 moves toward the stage 2, crossing the field of view of the component imaging camera 20 in the Y direction, and reaches above the stage 2. In the first embodiment, two paths are provided as the target path L: a target path La (FIG. 5A) and a target path Lb (FIG. 5B). For each component mounting task, the control unit 15 specifies either the target path La or the target path Lb as the target path L. Meanwhile, the memory unit 16 may store any number of target paths.

[0037] As shown in Fig. 5A, on the diagonal forward target path La, the mounting head 8 moves diagonally from the upstream front side to the downstream rear side in the conveying direction of the board 3 above the component imaging camera 20. As shown in Fig. 5B, on the diagonal reverse target path Lb, the mounting head 8 moves diagonally from the downstream front side to the upstream rear side in the conveying direction of the board 3 above the component imaging camera 20. By the diagonal movement of the mounting head 8, the path along which the mounting head 8 moves is shortened, the movement time of the mounting head 8 is shortened, and the mounting efficiency of the component mounting device 1 is improved.

[0038] As shown in FIG. 5A and FIG. 5B, in a plan view seen from the Z direction, a region including the field of view of the imaging element 25 is defined as the first region R1. In other words, the first region R1 is a region in which the mounting head 8 is imaged. In addition, a region closer to the component supply unit 4 than the first region R1 and located on the -Y side is defined as the second region R2. In other words, the second region R2 is a region through which the mounting head 8 moves before reaching the first region R1. In the first embodiment, the second region R2 is a region between the component supply unit 4 and the first region R1, and is directly adjacent to the first region R1. Therefore, after the mounting head 8 holds the component 14 at the component supply unit 4, it passes through the second region R2 and then passes through the first region R1. On the other hand, another region may be provided between the first region R1 and the second region R2. In the first embodiment, the ratio of the length of the first region R1 to the length of the second region R2 in the Y direction is 2.5.

[0039] The operation of the head moving unit 9 and the control unit 15 may cause the mounting head 8 to deviate from the target path L. The determination unit 17 compares the target path data 32 with the actual position of the mounting head 8 obtained by the head position acquisition unit 13 at a position upstream of the first region R1 to determine whether the mounting head 8 has deviated from the target path L.

[0040] If it is determined that the mounting head 8 deviates from the target path L, the control unit 15 attempts to move the mounting head 8 closer to the target path L in the second region R2 before the mounting head 8 reaches the first region R1 and captures an image. Therefore, the second region R2 may be referred to as a preparation section in which the mounting head 8 is aligned for capturing an image.

[0041] In order to perform alignment in the second region R2, the control unit 15 controls the head moving unit 9 to accelerate or decelerate the mounting head 8. At that time, the control unit 15 controls the acceleration based on the regulated acceleration data 33.

[0042] The storage unit 16 stores a regulated acceleration range as regulated acceleration data 33. The regulated acceleration is a range of acceleration in which the generation of vibrations or abnormal noises due to acceleration / deceleration of the mounting head 8 is regulated. The regulated acceleration range may also be referred to as a usable acceleration range. The regulated acceleration range may be identified by experiment when the component mounting device 1 is manufactured. Specifically, when the component mounting device 1 is manufactured, a calibration process may be performed in which the mounting head 8 is moved at different accelerations to identify the accelerations during acceleration and deceleration at which abnormal noises or vibrations occur.

[0043] In the first embodiment, the storage unit 16 stores a first regulated acceleration A1, which is a limit value during acceleration, and a second regulated acceleration A2, which is a limit value during deceleration. When the acceleration during acceleration is a positive value and the acceleration during deceleration is a negative value, the range of regulated acceleration is defined as -A2≦A≦A1. By moving the mounting head 8 at an acceleration slower than the first regulated acceleration A1 or the second regulated acceleration A2, it is possible to regulate the occurrence of vibrations and abnormal noise in the component mounting device 1. In the first embodiment, the magnitude of the first regulated acceleration A1 and the magnitude of the second regulated acceleration A2 are the same.

[0044] The acceleration limit within the regulated acceleration range is applied when aligning the mounting head 8, specifically when the mounting head 8 moves through the second region R2. In the first embodiment, the acceleration limit within the regulated acceleration range is not applied when the mounting head 8 moves through the first region R1. Because alignment is completed when the mounting head 8 reaches the first region R1, in the first region R1, instead of the acceleration limit, a speed limit is applied so that the mounting head 8 moves at a predetermined speed V1.

[0045] The storage unit 16 further stores a predetermined time T1 as an upper limit of the time it takes for the mounting head 8 to move from the second area R2 to the first area, i.e., the time it takes for the mounting head 8 to pass through the second area R2. The predetermined time T1 is, for example, 20 msec.

[0046] (operation) Next, the operation of the component mounting device 1 will be described with reference to Fig. 6. Fig. 6 is a flow chart showing the component mounting operation by the component mounting device 1.

[0047] Based on the mounting data 31, the control unit 15 controls the head moving unit 9 to move the mounting head 8 to the component supply unit 4 and hold the component 14 (S1).

[0048] Next, the control unit 15 causes the head moving unit 9 to move the mounting head 8 from the component supply unit 4 toward the stage 2 to the second region R2 based on the target path data 32 (S2).

[0049] Next, the control unit 15 aligns the mounting head 8 in the second region R2 before the mounting head 8 reaches the first region R1 (S3).

[0050] Next, the control unit 15 causes the head moving unit 9 to move the mounting head 8 to the first region R1 (S4). Since alignment has been performed in step S3, in the first region R1, the mounting head 8 moves along the target path L. The control unit 15 causes the head moving unit 9 to move the mounting head 8 at a constant predetermined speed V1.

[0051] Next, the control unit 15 causes the component imaging camera 20 to capture an image of the component 14 held by the mounting head 8 (S5).

[0052] Next, the control unit 15 controls the head moving unit 9 to move the mounting head 8 from the first region R1 to above the stage 2 (S6).

[0053] Next, the control unit 15 causes the board imaging camera 10 to image the mounting position on the board 3 supported by the stage 2 (S7).

[0054] Next, the control unit 15 aligns the mounting head 8 with respect to the board 3 based on the imaging results of the component imaging camera 20 and the imaging results of the board imaging camera 10 (S8).

[0055] Next, the control unit 15 lowers the suction unit 8a of the mounting head 8 to mount the component 14 on the board 3 (S9).

[0056] Here, the alignment of the mounting head 8 in step S3 will be described in more detail with reference to Fig. 7 and Fig. 8A to Fig. 10B. Fig. 7 is a flow chart showing the alignment operation of the mounting head 8 in the second region R2 (operation in step S3). Figs. 8A, 9A, and 10A are plan views showing the movement path of the mounting head 8. Figs. 8B, 9B, and 10B are graphs showing the change in the speed and acceleration of the mounting head 8 over time T.

[0057] As shown in Fig. 7, first, the control unit 15 causes the head moving unit 9 to move the mounting head 8 from the movement start position along the target path L (S31). The movement start position is a reference position corresponding to the upstream end of the target path L. The movement start position may be located upstream of the second region R2, for example, the component supply position 5a (Fig. 2). The control unit 15 inputs reference positions further downstream from the movement start position to the head moving unit 9 and controls the movement of the mounting head 8.

[0058] Next, the control unit 15 acquires the X and Y coordinates of a first reference position P1 (e.g., FIG. 8A) from among the reference positions stored in the memory unit 16 (S32). The first reference position P1 is a reference position where the mounting head 8, moving along the target path L, is located when it reaches the second area. In other words, the first reference position P1 is a planned arrival position of the mounting head 8 in the second area. Specifically, the control unit 15 acquires the X coordinate of the first reference position P1 from the first reference data 32A, and acquires the Y coordinate of the first reference position P1 from the second reference data 32B.

[0059] Next, the control unit 15 acquires the XY coordinates of the position of the mounting head 8 by the head position acquisition unit 13 (S33).

[0060] Next, the control unit 15, by the determination unit 17, determines whether or not the X coordinate of the position of the mounting head 8 coincides with the X coordinate of the first reference position P1 (S34).

[0061] If the X coordinate of the position of the mounting head 8 matches the X coordinate of the first reference position P1 (Yes in S34), the position of the mounting head 8 is set as the arrival position Q1. In other words, the arrival position Q1 corresponds to the first reference position P1 in that the X coordinates match. Next, the control unit 15, by using the determination unit 17, determines whether or not the Y coordinate of the arrival position Q1 (the Y coordinate of the mounting head 8) matches the Y coordinate of the first reference position P1 (S35). Through this operation, it can be determined whether or not the arrival position Q1 has shifted in the Y direction with the X direction as the reference.

[0062] If the X coordinate of the position of the mounting head 8 does not match the X coordinate of the first reference position P1 (No in S34), the control unit 15 continues the movement of the mounting head 8 for a predetermined period of time and then executes step S33 again.

[0063] If the Y coordinate of the arrival position Q1 and the Y coordinate of the first reference position P1 do not match (No in S35), the control unit 15 calculates the difference D1 between the Y coordinate of the arrival position Q1 and the Y coordinate of the first reference position P1 (S36).

[0064] If the Y coordinate of the arrival position Q1 matches the Y coordinate of the first reference position P1 (Yes in S35), as shown in FIGS. 8A and 8B, the control unit 15 determines that the mounting head 8 is moving along the target path L, ends step S3, and proceeds to step S4. In steps S2 to S4, the mounting head 8 moves along the target path L through the second region R2 and the first region R1 at a predetermined speed V1. In the first embodiment, the target path L that passes through the second region R2 and the first region R1 is a straight line. Therefore, the Y component of the predetermined speed V1 is a constant speed V1y.

[0065] Next, the control unit 15 acquires the XY coordinates of the second reference position P2 from the reference data stored in the memory unit 16 (S37). The second reference position P2 is a position on the target path L in the second region R2, and is located downstream from the first reference position P1. The second reference position P2 is a position where the mounting head 8 returns to the target path L by alignment. The control unit 15 controls the head moving unit 9 to accelerate and decelerate the misaligned mounting head 8, and return it to the second reference position P2.

[0066] Next, the control unit 15 calculates the acceleration switching position Q2 based on the difference D1, the Y coordinate of the second reference position P2, and the predetermined time T1 (S38). As shown in FIG. 9B and FIG. 10B, this is a position where the acceleration of the mounting head 8 is switched to deceleration, or deceleration is switched to acceleration. In FIG. 9B, the mounting head 8 accelerates from the arrival position Q1 to the acceleration switching position Q2 at the first regulated acceleration A1, and decelerates from the acceleration switching position Q2 to the second reference position P2 at the second regulated acceleration A2. In FIG. 10B, the mounting head 8 decelerates from the arrival position Q1 to the acceleration switching position Q2 at the second regulated acceleration A2, and accelerates from the acceleration switching position Q2 to the second reference position P2 at the first regulated acceleration A1. The control unit 15 determines the acceleration switching position Q2 and controls the acceleration and deceleration of the mounting head 8, so that the mounting head 8 can be returned to the target path L more reliably at the second reference position P2.

[0067] In the first embodiment, the control unit 15 further calculates the acceleration switching position Q2 based on the predetermined speed V1. Specifically, the control unit 15 calculates the acceleration switching position Q2 so that the mounting head 8 passes through the second reference position P2 at the predetermined speed V1.

[0068] Next, the control unit 15 judges whether the difference D1 is negative or not (S39). In other words, the control unit 15 judges whether the Y coordinate of the arrival position Q1 is larger than the Y coordinate of the first reference position P1. Specifically, if the Y coordinate of the arrival position Q1 is smaller than the Y coordinate of the first reference position P1, the difference D1 is negative, and the mounting head 8 is delayed with respect to the target path L. On the other hand, if the Y coordinate of the arrival position Q1 is larger than the Y coordinate of the first reference position P1, the difference D1 is positive, and the mounting head 8 is ahead of the target path L.

[0069] 9A and 9B, if the difference D1 is negative (Yes in S39), the control unit 15 causes the head moving unit 9 to accelerate the mounting head 8 toward the acceleration switching position Q2, and decelerates the mounting head 8 when it passes the acceleration switching position Q2 (S40). In steps S40 and S41, the control unit 15 accelerates the mounting head 8 at an acceleration equal to or less than the first regulated acceleration A1, and decelerates the mounting head 8 at an acceleration equal to or less than the second regulated acceleration A2. In the first embodiment, the control unit 15 accelerates the mounting head 8 at a constant rate at the first regulated acceleration A1, and decelerates the mounting head 8 at a constant rate at the second regulated acceleration A2.

[0070] As shown in Figures 10A and 10B, if the difference D1 is positive (No in S39), the control unit 15 causes the head moving unit 9 to decelerate the mounting head 8 toward the acceleration switching position Q2, and accelerates the mounting head 8 when it passes the acceleration switching position Q2 (S41).

[0071] The control unit 15 may determine whether the mounting head 8 has reached the acceleration switching position Q2 or the second reference position P2 by determining whether the X coordinate of the position of the mounting head 8 acquired by the head position acquisition unit 13 matches the X coordinate of the acceleration switching position Q2 or the second reference position P2.

[0072] Then, the control unit 15 ends the operation. Through such an operation, the mounting head 8 returns to the target path L at the second reference position P2, and the positional deviation from the target path L is eliminated.

[0073] (summary) The above description is summarized to describe the features of the present disclosure.

[0074] In the component mounting device 1 according to the first embodiment, the mounting head 8 is aligned before capturing an image of the component 14 held by the mounting head 8. In aligning the mounting head 8, the control unit 15 controls the acceleration of the mounting head 8 to be within a regulated acceleration range. By controlling the acceleration of the mounting head 8 in this manner, the occurrence of abnormal noise and vibration can be regulated. By applying the regulated acceleration range to both acceleration and deceleration, the occurrence of abnormal noise and vibration can be further regulated.

[0075] In aligning the mounting head 8, the control unit 15 moves the mounting head 8 at a constant acceleration of the first regulated acceleration A1 or the second regulated acceleration A2, which are the limit values ​​of the range of regulated acceleration. This operation prevents the speed at which the mounting head 8 moves from stagnating, and allows the mounting head 8 to move at a higher speed, thereby shortening the time it takes for the mounting head 8 to move. In addition, a predetermined time T1 is stored in the memory unit 16 as the upper limit of the time it takes for the mounting head 8 to move through the second region R2. This configuration makes it possible to prevent an increase in the time it takes to align the mounting head 8 while limiting the acceleration.

[0076] (effect) According to the component mounting device 1 according to the first embodiment, the following effects can be achieved.

[0077] As described above, the component mounting device 1 of the first embodiment includes the stage 2 that supports the board 3, the component supply unit 4 that supplies the components 14, the mounting head 8, the head moving unit 9 that moves the mounting head 8, a camera (component imaging camera 20), and the control unit 15. The mounting head 8 holds the components 14 supplied from the component supply unit 4 and mounts them on the board 3 supported by the stage 2. The component imaging camera 20 is provided between the component supply unit 4 and the stage 2, and captures an image of the components 14. The control unit 15 controls the head moving unit 9 to accelerate or decelerate the mounting head 8 within a regulated acceleration range toward a predetermined target path when moving the mounting head 8 from the second region R2 toward the first region R1 in the second region R2. The first region R1 is located above the component imaging camera 20, and is an area in which the component imaging camera 20 captures an image of the components 14 held by the mounting head 8. The second region R2 is an area closer to the component supply unit 4 than the first region R1.

[0078] With this configuration, it is possible to perform alignment of the mounting head 8 upstream of the first region R1 where the image of the component 14 is captured, while preventing the generation of abnormal noise or vibration.

[0079] The component mounting device 1 of the first embodiment includes a storage unit 16 and a determination unit 17. The storage unit 16 stores reference data indicating a reference position where the mounting head 8 should be positioned as a target path. The determination unit 17 determines whether a first reference position P1 in the reference data when the mounting head 8 reaches the second region R2 coincides with an arrival position Q1 that corresponds to the first reference position P1 and is reached by the mounting head 8. If it is determined that the arrival position Q1 does not coincide with the first reference position P1, the control unit 15 controls the head moving unit 9 in the second region R2 so as to move the mounting head 8 closer to the target path.

[0080] With this configuration, it becomes easy to determine whether or not the mounting head 8 has deviated from the target path.

[0081] In the component mounting device 1 of the first embodiment, the head moving unit 9 has a first moving unit (beam 7) that moves the mounting head 8 in a first direction (X direction) and a second moving unit (Y-axis table 6) that moves the mounting head 8 in a second direction (Y direction) that intersects with the X direction. The reference data includes first reference data 32A indicating a position where the mounting head 8 should be located in the X direction and second reference data 32B indicating a position where the mounting head 8 should be located in the Y direction. The arrival position Q1 coincides with the first reference position P1 in the X direction. The control unit 15 controls the beam 7 so that the mounting head 8 passes through the first reference position P1 in the X direction. When the control unit 15 determines that the arrival position Q1 does not coincide with the first reference position P1 in the Y direction when the mounting head 8 passes through the first reference position P1 in the X direction, the control unit 15 controls the Y-axis table 6 so that the mounting head 8 approaches the second reference data 32B.

[0082] With this configuration, it is possible to determine whether or not the mounting head 8 has deviated from the target path in the Y direction, using the position of the mounting head 8 in the X direction as a reference.

[0083] In the component mounting device 1 of the first embodiment, when the mounting head 8 passes the first reference position P1 in the X direction, it may be determined that the arrival position Q1 coincides with the first reference position P1 in the Y direction. In this case, the control unit 15 controls the head moving unit 9 so that the mounting head 8 moves through the first region R1 and the second region R2 at a predetermined speed V1.

[0084] With this configuration, the mounting head 8 is moved at the predetermined speed V1 in the first region R1, which makes it easy to capture an image of the component 14. Also, by moving the mounting head 8 at the predetermined speed V1 in the second region R2 before reaching the first region R1, the moving speed of the mounting head 8 in the first region R1 can be stabilized. Therefore, the position of the component 14 can be captured more accurately in the first region R1.

[0085] In the component mounting device 1 of the first embodiment, the control unit 15 controls the head moving unit 9 so that the mounting head 8 moves from the second region R2 to the first region R1 within a predetermined time T1.

[0086] With this configuration, it is possible to prevent the occurrence of abnormal noise or vibration, while suppressing an increase in the time required for holding the component 14 and capturing an image of it.

[0087] In the component mounting device 1 of the first embodiment, the control unit 15 controls the head moving unit 9 so that the mounting head 8 moves in the first region R1 at a predetermined speed V1.

[0088] With this configuration, the control unit 15 can switch the control method by controlling the acceleration in the second region R2 and controlling the speed in the first region R1.

[0089] In the component mounting device 1 of the first embodiment, the control unit 15 does not apply an acceleration limit within the regulated acceleration range when the mounting head 8 moves in the first region R1.

[0090] With this configuration, it is possible to simplify the control of the head moving unit 9 during the component mounting operation.

[0091] In the component mounting device 1 of the first embodiment, the range of the regulated acceleration includes a first regulated acceleration A1 as a limit value during acceleration and a second regulated acceleration A2 as a limit value during deceleration.

[0092] With this configuration, it is possible to prevent abnormal noise or vibration from occurring when the mounting head 8 accelerates or decelerates.

[0093] In the component mounting device 1 of the first embodiment, the first restricted acceleration A1 and the second restricted acceleration A2 have the same magnitude.

[0094] With this configuration, it becomes easier to restrict abnormal noise or vibration that may occur due to acceleration and deceleration of the mounting head 8 to the same extent.

[0095] The method of the first embodiment is a method of controlling the component mounting device 1. The component mounting device 1 includes a stage 2 that supports a substrate 3, a component supply unit 4 that supplies components 14, and a mounting head 8 that holds the components 14 supplied from the component supply unit 4 and mounts the components 14 on the substrate 3 supported by the stage 2. The method includes a head moving unit 9 moving the mounting head 8 from the second region R2 toward the first region R1. The method includes a component imaging camera 20 provided between the component supply unit 4 and the stage 2 capturing an image of the components 14 held by the mounting head 8 in the first region R1. The first region R1 is an area located above the component imaging camera 20. The second region R2 is an area closer to the component supply unit 4 than the first region R1. The control unit 15 controls the head moving unit 9 to accelerate or decelerate the mounting head 8 toward a predetermined target path L within a regulated acceleration range when moving the mounting head 8 from the second region R2 toward the first region R1.

[0096] With this configuration, it is possible to perform alignment of the mounting head 8 upstream of the first region R1 where the image of the component 14 is captured, while preventing the generation of abnormal noise or vibration.

[0097] In the first embodiment, an example has been described in which the control unit 15 controls both the acceleration and deceleration of the mounting head 8 in the second region R2, but the present invention is not limited to this. The control unit 15 may apply the regulated acceleration range only when the mounting head 8 accelerates or only when the mounting head 8 decelerates. In this case, the storage unit 16 stores only one of the first regulated acceleration A1 or the second regulated acceleration A2.

[0098] In the first embodiment, the first restricted acceleration A1 and the second restricted acceleration A2 have the same magnitude, but the present invention is not limited to this. The first restricted acceleration A1 and the second restricted acceleration A2 may have different magnitudes. In other words, the first restricted acceleration A1 and the second restricted acceleration A2 may have a magnitude relationship.

[0099] In the first embodiment, the control unit 15 moves the mounting head 8 in the second region R2 at the first regulation acceleration A1 or the second regulation acceleration A2, but the present invention is not limited to this. The control unit 15 may move the mounting head 8 at an acceleration slower than the first regulation acceleration A1 or the second regulation acceleration A2. The control unit 15 may also change the acceleration of the mounting head 8.

[0100] In the first embodiment, the control unit 15 does not apply the regulated acceleration range in the first region R1, but the present invention is not limited to this. The control unit 15 may apply the regulated acceleration range in a region other than the second region R2, for example, in the first region R1. Also, in a region other than the second region R2, the control unit 15 may apply an acceleration range different from that in the second region R2.

[0101] In the first embodiment, the mounting head 8 has the head position acquisition unit 13. However, the present invention is not limited to this. For example, the control unit 15 may acquire the position of the mounting head directly from the head moving unit 9.

[0102] In the first embodiment, the reference position is stored in the storage unit 16 as XY coordinates, but the present invention is not limited to this. The reference position may be stored in another format.

[0103] In the first embodiment, an example has been described in which the comparison between the reference position on the target path and the position of the mounting head 8 is performed once, but the present invention is not limited to this. The control unit 15 may compare the position of the mounting head 8 with the reference position on the target path multiple times. For example, the control unit 15 may compare the position of the mounting head 8 with another reference position between the second reference position P2 and the first region R1, and adjust the position of the mounting head 8 based on the comparison result as in steps S36 to S41.

[0104] In the first embodiment, the control unit 15 determines whether the arrival position Q1 is shifted in the Y direction based on the X direction, but the present invention is not limited to this. The control unit 15 may determine whether the arrival position Q1 is shifted in the X direction based on the Y direction. That is, the X direction and the Y direction may be interchanged in steps S34 and S35. The control unit 15 may use the direction in which the movable mass of the component mounting device 1 is larger as the reference, either the X direction or the Y direction. The movable mass is the sum of the masses of structures and members that can move in a predetermined direction. By such control, abnormal noise or vibration can be further suppressed.

[0105] In the first embodiment, an example has been described in which the control unit 15 determines whether or not the arrival position Q1 is displaced in the Y direction with the X direction as a reference, but the present invention is not limited to this. For example, the target path data 32 may include time information regarding the target path L in addition to position information regarding the target path L. The time information regarding the target path L is, for example, a scheduled time at which the mounting head 8 passes each reference position. Thus, the control unit 15 may determine whether or not the arrival position Q1 is displaced in the Y direction with a predetermined time in the time information regarding the target path L as a reference.

[0106] In the first embodiment, an example has been described in which the target path L passing through the second region R2 and the first region R1 is a straight line, but the present invention is not limited to this. The target path L may be a curved line. On the other hand, when the target path L passing through the second region R2 and the first region R1 is a straight line, the movement time of the mounting head 8 until the image of the component 14 is captured can be shortened.

[0107] [Embodiment 2] A component mounting system 100 according to a second embodiment of the present disclosure will be described. In the second embodiment, differences from the first embodiment will be mainly described, and descriptions that overlap with the first embodiment will be omitted. In the second embodiment, configurations that are the same as or equivalent to those in the first embodiment will be described with the same reference numerals.

[0108] FIG. 11 is a schematic diagram of a component mounting system 100 according to the second embodiment of the present disclosure.

[0109] 11, component mounting system 100 includes component mounting device 101 and processing device 102. The second embodiment is different from the first embodiment in that component mounting system 100 includes control unit 104 outside component mounting device 101.

[0110] Unless otherwise specified, the component mounting device 101 has the same configuration as the component mounting device 1 in the embodiment 1. The component mounting device 101 further includes a first communication unit 103.

[0111] The first communication unit 103 receives, via a network, information transmitted by the processing device 102. The first communication unit 103 includes a circuit for receiving information from the processing device 102 in accordance with a predetermined communication standard (e.g., LAN, Wi-Fi (registered trademark), Bluetooth (registered trademark)).

[0112] The processing device 102 includes a control unit 104 and a second communication unit 105. The processing device 102 is a computer. For example, the processing device 102 is a server or a cloud.

[0113] The control unit 104, in place of the control unit 15 in the first embodiment, calculates information for controlling each unit of the component mounting device 101. Specifically, the control unit 104 calculates control information for controlling the head moving unit 9 to accelerate or decelerate the mounting head 8 toward the target path L within the regulated acceleration range.

[0114] During a component mounting operation, the second communication unit 105 transmits control information related to each unit of the component mounting device 101, for example, control information for the head moving unit 9, via the network. The second communication unit 105 includes a circuit that performs transmission to the first communication unit 103 in accordance with a predetermined communication standard (for example, LAN, Wi-Fi (registered trademark), Bluetooth (registered trademark)).

[0115] (effect) According to the component mounting system 100 of the second embodiment, the following effects can be achieved.

[0116] As described above, the component mounting system 100 of the second embodiment includes the component mounting device 101 and the processing device 102 that communicates with the component mounting device 101 via a network. The component mounting device 1 includes the stage 2 that supports the substrate 3, the component supply unit 4 that supplies the components 14, the mounting head 8, the head moving unit 9 that moves the mounting head 8, a camera (component imaging camera 20), and a first communication unit 103. The mounting head 8 holds the components 14 supplied from the component supply unit 4 and mounts them on the substrate 3 supported by the stage 2. The component imaging camera 20 is provided between the component supply unit 4 and the stage 2, and captures an image of the components 14. The processing device 102 includes a control unit 104 and a second communication unit 105. The control unit 104 calculates control information for controlling the head moving unit 9 to accelerate or decelerate the mounting head 8 toward a predetermined target path within a regulated acceleration range when moving the mounting head 8 from the second region R2 toward the first region R1 in the second region R2. The first area R1 is located above the component imaging camera 20, and is an area where the component imaging camera 20 captures an image of the component 14 held by the mounting head 8. The second area R2 is an area closer to the component supply unit 4 than the first area R1. The second communication unit 105 transmits control information to the first communication unit 103 via the network.

[0117] With this configuration, the acceleration of the mounting head 8 during alignment can be controlled from outside the component mounting device 101, thereby preventing the generation of abnormal noise and vibration.

[0118] The component mounting device in the first aspect includes a stage that supports a substrate, a component supply unit that supplies components, a mounting head that holds the components supplied from the component supply unit and mounts them on a substrate supported by the stage, a head moving unit that moves the mounting head, a camera that is provided between the component supply unit and the stage and captures images of the components, and a control unit that is located above the camera and controls the head moving unit to accelerate or decelerate the mounting head within a regulated acceleration range when moving the mounting head from a first region in which the camera captures images of the components held by the mounting head to a second region that is closer to the component supply unit.

[0119] As a component mounting device in a second aspect, the component mounting device in the first aspect is provided with a memory unit that stores reference data indicating a reference position where the mounting head should be positioned as a target path, and a judgment unit that judges whether a first reference position when the second area is reached in the reference data coincides with a reach position that the mounting head reaches, which corresponds to the first reference position, and if it is determined that the reach position does not coincide with the first reference position, the control unit controls the head moving unit in the second area to move the mounting head closer to the target path.

[0120] As a component mounting device in a third aspect, in the component mounting device in the second aspect, the head moving unit has a first moving unit that moves the mounting head in a first direction and a second moving unit that moves the mounting head in a second direction intersecting the first direction, the reference data includes first reference data indicating the position of the mounting head in the first direction and second reference data indicating the position of the mounting head in the second direction, the arrival position coincides with the first reference position in the first direction, and the control unit controls the first moving unit so that the mounting head passes through the first reference position in the first direction, and when it is determined that the arrival position does not coincide with the first reference position in the second direction when the mounting head passes the first reference position in the first direction, controls the second moving unit to move the mounting head closer to the second reference data.

[0121] As a component mounting device in a fourth aspect, in the component mounting device in the third aspect, when it is determined that the arrival position in the second direction coincides with the first reference position when the mounting head passes a first reference position in the first direction, the control unit controls the head moving unit so that the mounting head moves between the first area and the second area at a predetermined speed.

[0122] As a component mounting device in a fifth aspect, in the component mounting device in any of the first to fourth aspects, the control unit controls the head moving unit so that the mounting head moves from the second area to the first area within a predetermined time.

[0123] As a component mounting device according to a sixth aspect, in the component mounting device according to any one of the first to fifth aspects, the control unit controls the head moving unit so that the mounting head moves in the first area at a predetermined speed.

[0124] As a component mounting device according to a seventh aspect, in the component mounting device according to the sixth aspect, the control unit does not apply an acceleration limit within the regulated acceleration range when the mounting head moves in the first area.

[0125] As the component mounting device in an eighth aspect, in the component mounting device in any one of the first to seventh aspects, the range of the regulated acceleration includes the first regulated acceleration as a limit value during acceleration.

[0126] As the component mounting device in a ninth aspect, in the component mounting device in any one of the first to seventh aspects, the range of the regulated acceleration includes the second regulated acceleration as a limit value during deceleration.

[0127] As a component mounting device in a tenth aspect, in the component mounting device in any of the first to seventh aspects, the range of the regulated acceleration includes a first regulated acceleration as the limit value during acceleration and a second regulated acceleration as the limit value during deceleration.

[0128] As a component mounting device in an eleventh aspect, in the component mounting device in the tenth aspect, the first regulation acceleration and the second regulation acceleration have the same magnitude.

[0129] As a component mounting device in a twelfth aspect, in the component mounting device in the tenth aspect, the first regulation acceleration and the second regulation acceleration have different magnitudes.

[0130] A method in a thirteenth aspect is a method for controlling a component mounting device having a stage that supports a substrate, a component supply unit that supplies components, and a mounting head that holds the components supplied from the component supply unit and mounts them on a substrate supported by the stage, the method including a head moving unit moving the mounting head from a second area toward a first area, and a camera provided between the component supply unit and the stage capturing an image of the components held by the mounting head in the first area, the first area being an area located above the camera, and the second area being an area closer to the component supply unit than the first area, and the control unit controlling the head moving unit to accelerate or decelerate the mounting head within a regulated acceleration range toward a predetermined target path when moving the mounting head from the second area toward the first area.

[0131] A component mounting system in a fourteenth aspect includes a component mounting device and a processing device that communicates with the component mounting device via a network, the component mounting device having a stage that supports a substrate, a component supply unit that supplies components, a mounting head that holds components supplied from the component supply unit and mounts them on a substrate supported by the stage, a head moving unit that moves the mounting head, a camera provided between the component supply unit and the stage to capture images of the components, and a first communication unit, the processing device having a control unit located above the camera and configured to calculate control information for controlling the head moving unit to accelerate or decelerate the mounting head within a regulated acceleration range toward a predetermined target path when moving the mounting head from a first area in which the camera captures images of the components held by the mounting head to a second area that is closer to the component supply unit, and a second communication unit that transmits the control information to the first communication unit via the network.

[0132] Although the present disclosure has been fully described in connection with the preferred embodiments with reference to the accompanying drawings, various changes and modifications will be apparent to those skilled in the art, and such changes and modifications should be understood to be included within the scope of the present invention as defined by the appended claims, unless they depart therefrom. [Industrial Applicability]

[0133] The component mounting device of the present disclosure is particularly useful in a component mounting device that, when mounting a component on a board, captures an image of the component and aligns the component with the board based on the image capture result. [Explanation of symbols]

[0134] 1. Parts mounting equipment 2 Stage 3. Substrate 4. Parts Supply Department 6 Y-axis table 7 Beam 8 Mounting Head 9 Head movement section 13 Head position acquisition unit 14 parts 15 Control section 16 Memory section 17 Judgment section 20 Parts imaging camera L Target Route A1 First regulation acceleration A2 Second regulation acceleration R1 1st area R2 2nd area P1 1st reference position P2 2nd reference position Q1 Arrived position Q2 Acceleration switching position V1 Predetermined speed T1 Predetermined time

Claims

1. A stage for supporting the substrate; a parts supply unit that supplies parts; a mounting head that holds the component supplied from the component supply unit and mounts the component on the substrate supported by the stage; a head moving unit that moves the mounting head; a camera provided between the component supply unit and the stage for capturing an image of the component; a control unit that controls the head moving unit to accelerate or decelerate the mounting head within a regulated acceleration range toward a predetermined target path when moving the mounting head from a first area, which is located above the camera and in a second area close to the component supply unit, to a first area in which the camera images the component held by the mounting head.

2. a storage unit that stores reference data indicating a reference position where the mounting head should be positioned as the target path; a determination unit that determines whether a first reference position when the mounting head reaches the second area in the reference data coincides with a reach position that corresponds to the first reference position and that the mounting head reaches, 2. The component mounting device according to claim 1, wherein when it is determined that the arrival position does not coincide with the first reference position, the control unit controls the head moving unit in the second area so as to bring the mounting head closer to the target path.

3. the head moving unit has a first moving unit that moves the mounting head in a first direction and a second moving unit that moves the mounting head in a second direction intersecting the first direction, the reference data includes first reference data indicating a position of the mounting head in the first direction and second reference data indicating a position of the mounting head in the second direction, the arrival position coincides with the first reference position in the first direction, The control unit is controlling the first moving unit so that the mounting head passes through the first reference position in the first direction; 3. The component mounting device according to claim 2, further comprising: a control unit for controlling the second moving unit to move the mounting head closer to the second reference position when it is determined that the arrival position does not coincide with the first reference position in the second direction when the mounting head passes the first reference position in the first direction.

4. 4. The component mounting device of claim 3, wherein when the mounting head passes the first reference position in the first direction, if it is determined that the arrival position in the second direction coincides with the first reference position, the control unit controls the head moving unit so that the mounting head moves through the first area and the second area at a predetermined speed.

5. The component mounting device according to claim 1 , wherein the control unit controls the head moving unit so that the mounting head moves from the second area to the first area within a predetermined time.

6. The component mounting device according to claim 1 , wherein the control unit controls the head moving unit so that the mounting head moves in the first area at a predetermined speed.

7. The component mounting device according to claim 6 , wherein the control unit does not apply an acceleration limit within the regulated acceleration range when the mounting head moves in the first area.

8. The component mounting device according to claim 1 , wherein the range of the regulated acceleration includes a first regulated acceleration as a limit value during acceleration.

9. The component mounting device according to claim 1 , wherein the range of the regulated acceleration includes a second regulated acceleration as a limit value during deceleration.

10. 8. The component mounting device according to claim 1, wherein the range of the regulated acceleration includes a first regulated acceleration as a limit value during acceleration and a second regulated acceleration as a limit value during deceleration.

11. The component mounting device according to claim 10 , wherein the first and second acceleration regulations have the same magnitude.

12. The component mounting device according to claim 10 , wherein the first and second acceleration regulations have different magnitudes.

13. A method for controlling a component mounting device including a stage for supporting a substrate, a component supply unit for supplying components, and a mounting head for holding components supplied from the component supply unit and mounting the components on a substrate supported by the stage, the method comprising the steps of: a head moving unit moving the mounting head from the second area toward the first area; a camera provided between the component supply unit and the stage capturing an image of the component held by the mounting head in the first area; The first area is an area located above the camera, The second area is closer to the component supply unit than the first area, A method in which a control unit controls the head moving unit to accelerate or decelerate the mounting head within a regulated acceleration range toward a predetermined target path when moving the mounting head from the second area toward the first area.

14. A part mounting device; a processing device that communicates with the component mounting device via a network; Equipped with The component mounting device includes: A stage for supporting the substrate; a parts supply unit that supplies parts; a mounting head that holds the component supplied from the component supply unit and mounts the component on the substrate supported by the stage; a head moving unit that moves the mounting head; a camera provided between the component supply unit and the stage for capturing an image of the component; A first communication unit, The processing device includes: a control unit that calculates control information for controlling the head moving unit to accelerate or decelerate the mounting head within a regulated acceleration range toward a predetermined target path when moving the mounting head from a first area, which is an area where the camera captures an image of the components held by the mounting head, to a second area close to the component supply unit; and a second communication unit that transmits the control information to the first communication unit via the network.

Images