Component mounting device, component mounting system, and component mounting method

Abstract

To provide a component mounting device, a component mounting system, and a component mounting method that can easily align components to be mounted on a board.SOLUTION: A component mounting method for mounting a plurality of components on a board includes: reading information identifying a first component attached to a first component of the plurality of components (ST6); transmitting the information identifying the first component to an external device (ST7); receiving information from the external device as to whether the first component matches a second component already mounted on the board (ST8); and mounting the first component on the board when the first component matches the second component (Yes in ST9).SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present invention relates to a component mounting apparatus, a component mounting system, and a component mounting method for mounting components on a board. [Background technology]

[0002] A component mounting device manufactures a mounted board by mounting components and the like stored in trays supplied by a tray feeder onto a board. Large components and the like having special functions can be stored in the trays. Patent Document 1 discloses a component mounting device that picks up components from a tray feeder that supplies a pallet carrying multiple trays storing different types of components to a component pick-up position and mounts the components on a board. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2021-197516 A Summary of the Invention [Problem to be solved by the invention]

[0004] In a manufacturing factory for mounting boards, the components supplied by component manufacturers are sometimes rearranged on trays used by tray feeders. In such cases, components with the same specifications but made by different component manufacturers may be stored on the same tray. In addition, there is a problem that, even if the specifications are the same, communication module components, etc., made by different component manufacturers may cause differences in performance after mounting due to compatibility issues with other components, and the specified performance may not be obtained as a mounting board.

[0005] SUMMARY OF THE PRESENT DISCLOSURE An object of the present invention is to provide a component mounting apparatus, a component mounting system, and a component mounting method that can easily align components to be mounted on a board. [Means for solving the problem]

[0006] The component mounting device of the present invention is a component mounting device that mounts a plurality of components on a board, and is equipped with a component reading means that reads information identifying a first component attached to a first component of the plurality of components, a communication means that transmits the information identifying the first component to an external device, and a component mounting means that mounts the component on the board, wherein the communication means receives information from the external device indicating whether the first component matches a second component already mounted on the board, and the component mounting means mounts the first component on the board if the first component matches the second component.

[0007] Another component mounting device of the present invention is a component mounting device that mounts a plurality of components on a board, and includes a component reading means that reads information identifying a first component attached to a first component of the plurality of components, a combination determination means that determines whether the first component matches a second component already mounted on the board, and a component mounting means that mounts the first component on the board when the combination determination means determines that the first component matches the second component.

[0008] The component mounting system of the present invention is a component mounting system including a component mounting device that mounts a plurality of components on a board and an external device, wherein the component mounting device includes a component reading means that reads information identifying a first component attached to a first component of the plurality of components, a communication means that transmits the information identifying the first component to the external device, and a component mounting means that mounts the component on the board, wherein the communication means receives information from the external device indicating whether the first component matches a second component already mounted on the board, and the component mounting means mounts the first component on the board if the first component matches the second component.

[0009] A component mounting method of the present invention is a component mounting method for mounting a plurality of components on a board, which includes the steps of reading information identifying a first component attached to a first component of the plurality of components, transmitting the information identifying the first component to an external device, receiving information from the external device as to whether the first component matches a second component already mounted on the board, and mounting the first component on the board if the first component matches the second component. Effect of the Invention

[0010] According to the present invention, components to be mounted on a board can be easily aligned. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a plan view of a component mounting system according to an embodiment of the present invention; [Diagram 2] 1A, 1B, and 1C are plan and side views showing an example of a component mounted on a board by a component mounting apparatus according to an embodiment of the present invention; [Diagram 3] FIG. 1 is a block diagram showing a configuration of a component mounting system according to an embodiment of the present invention. [Figure 4] FIG. 2 is an explanatory diagram of an example of mounting data used in the component mounting device according to the embodiment of the present invention; [Diagram 5] FIG. 1 is an explanatory diagram of an example of a mounting board manufactured by a component mounting apparatus according to an embodiment of the present invention; [Figure 6] FIG. 1 is an explanatory diagram of an example of a combination table used in an external device according to an embodiment of the present invention; [Figure 7] 1 is a flow diagram of a component mounting method according to an embodiment of the present invention; [Figure 8] FIG. 1 is a flow diagram of a method for determining consistency according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for explanation, and can be appropriately changed according to the specifications of the component mounting system, the component mounting device, the external device, and the components. In the following, the same reference numerals are used for corresponding elements in all the drawings, and duplicated explanations are omitted. In FIG. 1 and in some parts described later, the X-axis (left-right direction in FIG. 1) in the board transport direction and the Y-axis (up-down direction in FIG. 1) perpendicular to the board transport direction are shown as two axes perpendicular to each other in the horizontal plane. In FIG. 1 and in some parts described later, the Z-axis (perpendicular to the paper surface in FIG. 1) is shown as the height direction perpendicular to the horizontal plane.

[0013] First, the configuration of the component mounting system 1 will be described with reference to Fig. 1. The component mounting system 1 is configured to include a component mounting device M and an external device CP that are connected via a communication network NT. The component mounting device M has a function of performing a component mounting operation of mounting components supplied from a component supply unit onto a board. The component mounting system 1 is not limited to having one component mounting device M, and may have two or more components. The external device CP has a function of storing information about the board worked on by the component mounting device M and information about the components mounted on the board, and supports the manufacture of a mounted board by the component mounting device M.

[0014] Next, the configuration of component mounting apparatus M will be described with reference to Fig. 1. In component mounting apparatus M, a board transport mechanism 2 is arranged along the X-axis at the center of a base 1a. The board transport mechanism 2 transports a board 3 carried in from upstream along the X-axis, and positions and holds the board 3 at a mounting operation position by a mounting head, which will be described below. The board transport mechanism 2 also carries out downstream the board 3 on which component mounting operation has been completed. A component supply unit 4 is installed on both sides (front and rear directions of the Y-axis) of the board transport mechanism 2.

[0015] A plurality of tape feeders 5 are attached in parallel along the X-axis to both component supply units 4. The tape feeders 5 feed the carrier tape, on which pockets for storing components are formed, in a direction (tape feed direction) from the outside of the component supply unit 4 toward the board transport mechanism 2, thereby supplying the components to the component removal position where the mounting head picks up the components. In addition, one of the component supply units 4 is attached with a tray feeder 8 that supplies a tray pallet 7, on which a plurality of trays 6 are placed, each of which contains components D such as large components, connectors, and communication modules, to the component removal position.

[0016] In Fig. 1, a Y-axis table 9 equipped with a linear drive mechanism is arranged along the Y-axis at both ends in the X-axis direction on the upper surface of a base 1a. A beam 10 similarly equipped with a linear mechanism is coupled to the Y-axis table 9 so as to be freely movable along the Y-axis. A mounting head 11 is attached to the beam 10 so as to be freely movable along the X-axis. The mounting head 11 is equipped with a plurality of suction units (not shown) that can hold a component D and move up and down in the Z-axis direction, and can rotate around a vertical axis (Z-axis). A suction nozzle (not shown) that suctions and holds the component D is attached to the lower end of each suction unit.

[0017] The Y-axis table 9 and the beam 10 constitute a mounting head moving mechanism that moves the mounting head 11 in the horizontal direction (X-axis direction, Y-axis direction). The mounting head moving mechanism and the mounting head 11 constitute a component mounting means 12 that performs a component mounting operation of taking out components D from the component supply unit 4 and mounting them at the mounting positions on the board 3. In the component mounting operation, the mounting head 11 moves above the component supply unit 4 and picks up predetermined components D with each suction nozzle. Next, the mounting head 11 moves above the board 3 and rotates the components D held by each suction nozzle in a predetermined direction, repeating a series of mounting turns to mount them at their respective mounting positions.

[0018] In Fig. 1, beam 10 is fitted with head camera 13, which is positioned on the underside of beam 10 and moves integrally with mounting head 11. As mounting head 11 moves, head camera 13 moves above board 3 positioned at the mounting operation position of board transport mechanism 2, and captures an image of board marks (not shown) and board code Lb provided on board 3. Board code Lb is a one-dimensional code or a two-dimensional code, and board information identifying board 3 is recorded. From the imaging result, the position of board 3 and the information identifying board 3 recorded in board code Lb are recognized. The imaging result by head camera 13 is transmitted to control device 20 (see Fig. 3) provided in component mounting device M.

[0019] A component recognition camera 14 and a code reader 15 are disposed between the component supply unit 4 and the board transport mechanism 2. When the mounting head 11, which has taken out a component D from the component supply unit 4, is positioned above the component recognition camera 14, the component recognition camera 14 captures an image of the component D held by the suction nozzle from below. From the captured image, the holding posture of the component D is recognized. During the component mounting operation of the mounting head 11, the mounting position is corrected taking into account the captured image of the board 3 by the head camera 13 and the captured image of the component D by the component recognition camera 14.

[0020] 1, the code reader 15 reads the part code Ld (see FIG. 2) provided on the back side of the part D. The part code Ld is a one-dimensional code or a two-dimensional code, and part information identifying the part D is recorded therein. In other words, the code reader 15 is a part reading means that reads the part information identifying the part D from the part codes Ld provided to the multiple parts D.

[0021] A touch panel 16 operated by the worker is provided at the position where the worker works on the front side of the component mounting device M. The touch panel 16 displays various information on its display section, and the worker inputs data and operates the component mounting device M using operation buttons and the like displayed on the display section.

[0022] Next, with reference to Fig. 2, an example of a component D that is placed on a tray 6 and supplied will be described. Here, a module component such as a communication module composed of multiple component elements P such as an LSI, chip resistors, chip capacitors, and inductances will be described as an example. Multiple component elements P are arranged inside the component D. Also, multiple bumps B that are bonded to the substrate 3 are formed on the bottom surface of the component D. Also, a component code Ld is attached to the component D so that it is visible from the bottom side (so that it can be read by the code reader 15).

[0023] Next, the configuration of the control system of the component mounting system 1 will be described with reference to Fig. 3. Here, the description will focus on the function of manufacturing a mounted board by taking into consideration the consistency of multiple types of components D to be mounted on a board 3 by the component mounting device M. The board transport mechanism 2, component supply unit 4, component mounting means 12, head camera 13, component recognition camera 14, code reader 15, and touch panel 16 are connected to a control device 20 provided in the component mounting device M. The control device 20 also includes a mounting memory unit 21, a mounting control unit 22, a reading processing unit 23, and a mounting communication unit 24. The mounting memory unit 21 is a storage device, and stores mounting data 21a and the like.

[0024] The external device CP includes an external storage unit 31, an external communication unit 32, and a combination determination means 33. The external storage unit 31 is a storage device, and stores component information data 31a, board information data 31b, a combination table 31c, etc. The mounting communication unit 24 and the external communication unit 32 are communication devices, and are connected to each other via a communication network NT, and transmit and receive various types of data to and from each other.

[0025] 3, the reading processing unit 23 executes a reading process to recognize and process the image of the board code Lb captured by the head camera 13 and reads board information recorded in the board code Lb that identifies the board 3. That is, the head camera 13 and the reading processing unit 23 constitute board reading means 17 that reads information (board information) that identifies the board 3 from the board code Lb attached to the board 3.

[0026] The board information read by the board reading means 17 is transmitted to the external device CP via the mounting communication unit 24. The board information received by the external communication unit 32 is stored in the external storage unit 31 as board information data 31b, or the content of the board information data 31b is updated. Similarly, the mounting communication unit 24 transmits the component information of the component D read by the code reader 15 to the external device CP. The component information received by the external communication unit 32 is stored in the external storage unit 31 as component information data 31a, or the content of the component information data 31a is updated. In this way, the mounting communication unit 24 is a communication means that transmits information identifying the board 3 (board information) and information identifying the component D (component information) to the external device CP.

[0027] In FIG. 3, the mounting data 21a stores the production model name of the mounted board, the component number (type of component) that identifies the type of component D to be mounted on the board 3, the supply position of the component D in the component supply unit 4 (tape feeder 5, tray feeder 8, etc.), the mounting position (XY coordinates), the mounting direction, the mounting order, etc.

[0028] An example of mounting data 21a will now be described with reference to Fig. 4. The mounting data 21a in Fig. 4 is an example in which a mounting head 11 having four suction nozzles repeats mounting turns three times and places twelve components D on a board 3. The mounting data 21a includes a turn number 40, a nozzle number 41, a component number 42, combined component information 43, supply position information 44, and a mounting position 45. The turn number 40 is information for identifying which mounting turn it is. The nozzle number 41 is information for identifying the position of the suction nozzle of the mounting head 11. The component number 42 is information for identifying the type of component D.

[0029] The combination component information 43 is information for identifying whether the component D is a matching target component (indicated as "1") for which matching with other components D needs to be taken into consideration, or a matching non-target component (indicated as "0") for which matching with other components D does not need to be taken into consideration. The supply position information 44 is information for identifying whether the component D is supplied from the tape feeder 5 (indicated as "0") or from the tray feeder 8 (indicated as "1"). The mounting position 45 is information for identifying the X coordinate 45x, the Y coordinate 45y of the mounting position of the component D on the board 3, and the θ direction 45θ that is the mounting direction.

[0030] 3, the mounting control unit 22 controls the component supply unit 4 and the component mounting means 12 based on the mounting data 21a to mount the component D supplied from the component supply unit 4 at the mounting position 45 on the board 3. When mounting the component D whose combination component information 43 in the mounting data 21a is "1", i.e., the matching target component, on the board 3, the mounting control unit 22 causes the code reader 15 to read the component code Ld attached to the matching target component.

[0031] Then, when the mounting communication unit 24 (communication means) receives information from the external device CP that the component D is compatible, it mounts the component D on the board 3. On the other hand, when the mounting communication unit 24 (communication means) receives information from the external device CP that the component D is not compatible, it causes the touch panel 16 to display (notify) a warning that "the component D (first component) held by the mounting head 11 is not compatible with other components (second components) already mounted on the board 3." In addition, the component mounting device M may notify by sounding a buzzer (not shown) or turning on a warning light (not shown). In addition, the component mounting device M may stop (interlock) the component mounting work at the same time as notifying.

[0032] 3, when board information is given to the board 3 and a board code Lb is assigned to it, the board information is stored as board information data 31b in the external storage unit 31 of the external device CP. Also, when component information is given to the alignment target component and a component code Ld is assigned to it when the alignment target component is delivered from the component manufacturer to the factory or when the alignment target component is placed (transferred) on the tray 6, the component information is stored in the external storage unit 31 as component information data 31a.

[0033] The combination table 31c stored in the external storage unit 31 includes, for each production model of the mounted board, information (combination information) regarding combinations of matching target components that can be mounted on the same board 3. Based on the component information data 31a, board information data 31b, and combination table 31c stored in the external storage unit 31, and the component information of the component D (first component) that the component mounting device M is attempting to mount on the board 3 received by the external communication unit 32, the combination determination means 33 determines whether or not the component D that the component mounting device M is attempting to mount on the board 3 is matched with another component D (second component) that has already been mounted on the board 3.

[0034] 3, when the combination determination means 33 determines that there is a match, the external communication unit 32 transmits a match to the component mounting device M. Then, information that the component D has been mounted on the board 3 is added to the board information stored in the board information data 31b. That is, the board information that identifies the board 3 included in the board information data 31b is stored in association with information (component information) that identifies the matching target component mounted on the board 3. This makes it possible to transmit a match report from the external device CP as to whether or not the component D (first component) to be mounted according to the board 3 matches the component D (second component) that has already been mounted.

[0035] Here, an example of matching target components to be mounted on a board and combination table 31c will be described with reference to Figures 5 and 6. Figure 5 shows an example of board 3A on which three matching target components D1 to D3 are mounted. Board 3A is assigned a board code Lb in which board information identifying board 3A is stored.

[0036] 6 shows an example of the combination table 31c for the board 3A. In this example, the parts D1 to D3 are manufactured by three parts manufacturers R, S, and T. The combination table 31c stores combination information 46, which is information on matching combinations among the combinations of the parts D1 to D3 made by the parts manufacturers R, S, and T that are mounted on the same board 3A. For example, if the part D1 is manufactured by company R, the part D2 and the part D3 are only made by company R and are compatible. Also, if the part D1 is manufactured by company S, the part D2 is only made by company S, and the part D3 is only made by company R and company S.

[0037] Here, the components D1 to D3 are matched to each other means that when the components D1 to D3 are mounted on the same board 3A, the board 3A can exhibit the specified performance. For example, in the case of communication module components, even if the module components are manufactured to the same specifications, they may not exhibit the specified performance when combined with other companies' products due to impedance relationships, etc., so the matching between the components D1 to D3 is important.

[0038] Next, a component mounting method in which a plurality of matching target components are mounted on a board by a component mounting device M will be described with reference to Figs. 5 and 6 along the flow of Fig. 7. Here, an example will be described in which a component D2 (second component) has already been mounted on the board 3A when it is transported to the component mounting device M, and then components D1 and D3 are mounted by the component mounting device M. First, the mounting control unit 22 controls the board transport mechanism 2 to transport the board 3A on which the component D2 (second component) has been mounted from upstream, positioning it at the mounting work position and holding it there (ST1: board carry-in process). Next, the mounting control unit 22 causes the board reading means 17 to read board information from the board code Lb attached to the board 3A (ST2: board reading process).

[0039] Next, the mounting communication unit 24 (communication means) transmits the read board information to the external device CP (ST3: board information transmission step). Next, the mounting control unit 22 controls the component mounting means 12 based on the mounting data 21a to have the suction nozzles of the mounting head 11 pick up the components (ST4: component suction step). Next, the mounting control unit 22 determines whether or not there is a matching target component among the components picked up by the mounting head 11 (ST5: matching target component determination step). Specifically, the mounting control unit 22 determines that a component for which the combination component information 43 of the mounting data 21a is "1" is a matching target component.

[0040] In FIG. 7, if the component is a matching target component (Yes in ST5), then the mounting control unit 22 causes the code reader 15 (component reading means) to read component information from the component code Ld attached to the component (ST6: component reading step). Here, it is assumed that the component D1 (first component) is held by the mounting head 11. That is, the component reading means reads the component information identifying the first component attached to the first component (component D1) of the multiple components mounted on the board 3A. Next, the mounting communication unit 24 (communication means) transmits the read component information identifying the component D1 (first component) to the external device CP (ST7: component information transmission step).

[0041] The external device CP that has received the component information executes a matching determination, which will be described later, and transmits a determination result (matching information) as to whether or not the component D1 matches the board 3A from the external device CP. Next, the mounting communication unit 24 (communication means) receives the matching information from the external device CP as to whether or not the component D1 (first component) matches with the component D2 (second component) already mounted on the board 3A (ST8: matching information receiving step).

[0042] 7, if the received matching information indicates that the components are not matched (No in ST9), the mounting control unit 22 causes the touch panel 16 to notify that the component D1 is not matched (ST10: notifying step). If the received matching information indicates that the components are matched (Yes in ST9), the mounting control unit 22 controls the component mounting means 12 to mount the component D1 on the board 3A (ST11: component mounting step). The mounting control unit 22 also causes the components that are not the components to be matched and that are picked up by the mounting head 11 (No in ST5) to be mounted on the board 3A (ST11). In this way, if the first component (component D1) is matched with the second component (component D2) (Yes in ST9), the first component is mounted on the board 3A (ST11).

[0043] Next, if there are components to be mounted on the board 3A next (Yes in ST12), the mounting control unit 22 returns to the component pickup step (ST4) to execute the next mounting turn. If all components have been mounted on the board 3A (No in ST12), the mounting control unit 22 controls the board transport mechanism 2 to remove the board 3A from the mounting work position (ST13: board removal step). If there is a next board 3A on which components are to be mounted (Yes in ST14), the process returns to the board carry-in step (ST1), where the next board 3A is carried in. If there is no next board 3A (No in ST14), component mounting ends.

[0044] Next, a consistency determination method (consistency determination step) executed in the external device CP between the component information transmission step (ST7) and the consistency information receiving step (ST8) will be described with reference to Fig. 8. When the external communication unit 32 receives the component information (Yes in ST21), the combination determination means 33 refers to the component information data 31a to acquire information on the component manufacturer of the component. Next, the combination determination means 33 determines whether or not the component manufacturer is registered in the combination table 31c (ST22). If the component manufacturer is not registered in the combination table 31c (No in ST22), the external communication unit 32 transmits a message indicating that there is no consistency to the component mounting device M (ST23: inconsistency transmission step).

[0045] If the component manufacturer is registered in the combination table 31c (Yes in ST22), the combination determination means 33 refers to the board information data 31b and determines whether the component is the first matching target component to be mounted on the board 3A (ST24). For example, in the case of component D2 (second component), it is determined to be the first matching target component (Yes in ST24), and a message indicating that component D2 has been mounted is added to the board information data 31b (ST25). Then, the external communication unit 32 transmits a message indicating the matching to the component mounting device M (ST26: matching transmission step).

[0046] 8, when it is determined that the component is the second or subsequent matching target component (No in ST24), the combination determination means 33 determines whether the component matches with the matching target component already mounted on the board 3A based on the combination table 31c (ST27: matching determination step). For example, when the component D2 already mounted on the board 3A is manufactured by company S and the component D1 to be mounted is manufactured by company S, the combination determination means 33 determines that they match (Yes in ST27), and transmits a notification of the matching to the component mounting device M (ST26).

[0047] If the component D1 is manufactured by company R, the combination determination means 33 determines that they are incompatible (No in ST27), and transmits a message indicating that they are incompatible to the component mounting device M (ST23). That is, if the component manufacturer of the first component (component D1) and the component manufacturer of the second component (component D2) match (Yes in ST27), the external device CP transmits compatibility information indicating that the first component (component D1) is compatible with the second component (component D2) (ST26).

[0048] Also, when determining whether or not the part D3 (first part) is compatible with the part D2 (second part) already mounted on the board 3A, even if the part D2 is manufactured by company S and the part D3 is manufactured by company R, the combination determination means 33 determines that the part D3 is compatible (Yes in ST27). That is, the external device CP stores information (combination table 31c) on combinations including the part manufacturers of the first part (part D3) and the second part (part D2) that can be mounted on the board 3A, and the external device CP transmits compatibility information on whether or not the first part (part D3) is compatible with the second part (part D2) based on the combination table 31c (ST23, ST26). This makes it possible to easily match the parts D1 to D3 to be mounted on the board 3A.

[0049] As described above, the component mounting device M of this embodiment includes a component reading means (code reader 15) that reads component information that identifies a first component (components D1, D3) attached to a first component among the multiple components D1 to D3, a communication means (mounting communication unit 24) that transmits the component information that identifies the first component to the external device CP, and a component mounting means 12 that mounts the components D1 to D3 on the board 3A. The communication means receives matching information from the external device CP on whether the first component matches with a second component (component D2) already mounted on the board 3A, and the component mounting means 12 mounts the first component on the board 3A when the first component matches with the second component. This makes it possible to easily match the components D1 to D3 to be mounted on the board 3A.

[0050] In the above description, the component mounting device M and the external device CP for determining the compatibility are separate devices, but the present invention is not limited to this. For example, the component mounting device M may be configured to include combination determination means 33. That is, the component mounting device M may be configured to include a component reading means (code reader 15) for reading information for identifying a first component (components D1, D3) among the multiple components D1 to D3, a combination determination means 33 for determining whether the first component is compatible with a second component (component D2) already mounted on the board 3A, and a component mounting means 12 for mounting the first component on the board 3A when the combination determination means 33 determines that the first component is compatible with the second component. [Industrial Applicability]

[0051] INDUSTRIAL APPLICABILITY The component mounting apparatus, component mounting system, and component mounting method of the present invention have the effect of easily aligning components to be mounted on a board, and are useful in the field of mounting components on boards. [Explanation of symbols]

[0052] 1 Component mounting system 3, 3A board 12 Component mounting means 15 Code reader (part reading means) 17 Board reading means CP external device D, D1~D3 parts M Component Mounting Equipment

Claims

1. In a component mounting device that mounts a plurality of components on a board, a component reading means for reading information for identifying a first component, the information being attached to a first component among the plurality of components; A communication means for transmitting information identifying the first component to an external device; A component mounting means for mounting components onto a board; Equipped with the communication means receives information from the external device as to whether the first component is compatible with a second component already mounted on the board; The component mounting means mounts the first component on the board when the first component is aligned with the second component.

2. a substrate reading means for reading information for identifying the substrate, the information being attached to the substrate; 2. The component mounting device according to claim 1, wherein the communication means transmits information identifying the board to the external device, and receives information from the external device indicating whether the first component corresponding to the board is matched with the second component.

3. 3. The component mounting device according to claim 1, wherein the external device transmits information that the first component is compatible with the second component when a manufacturer of the first component and a manufacturer of the second component are the same.

4. the external device stores information regarding combinations including manufacturers of the first component and the second component that can be mounted on the board; The component mounting device according to claim 1 , wherein the external device transmits information on whether the first component matches the second component based on the information on the combination.

5. In a component mounting device that mounts a plurality of components on a board, a component reading means for reading information for identifying a first component, the information being attached to a first component among the plurality of components; a combination determining means for determining whether the first component is matched with a second component already mounted on the board; and a component mounting means for mounting the first component onto the board when the combination determination means determines that the first component matches the second component.

6. A component mounting system including a component mounting device that mounts a plurality of components on a board and an external device, The component mounting apparatus includes: a component reading means for reading information for identifying a first component, the information being attached to a first component among the plurality of components; A communication means for transmitting information identifying the first component to the external device; A component mounting means for mounting components onto a board; Equipped with the communication means receives information from the external device as to whether the first component is compatible with a second component already mounted on the board; A component mounting system, wherein the component mounting means mounts the first component on the board when the first component matches the second component.

7. 7. The component mounting system according to claim 6, wherein the external device further comprises a combination determination means for determining whether or not the first component is matched with the second component.

8. A component mounting method for mounting a plurality of components on a substrate, comprising the steps of: reading information identifying a first component that is attached to a first component among the plurality of components; Transmitting information identifying the first component to an external device; receiving information from the external device as to whether the first component is compatible with a second component already mounted on the board; If the first component matches the second component, the first component is mounted on the board.

Images