Wiring body, and display device

Abstract

To provide a wiring body which can reduce its thickness while holding the shape of a conductive layer, and a display device.SOLUTION: A wiring body 200 includes a first resin layer 7 which has a first main surface 7a, and a second main surface 7b, and has a through hole 7c penetrating to the second main surface 7b from the first main surface 7a. The conductive layer 5 is arranged in the through hole 7c of the first resin layer 7. Therefore, the shape of the conductive layer 5 can be held by the first resin layer 7 without supporting the conductive layer 5 by a base material or the like. The wiring body 200 includes a first adhesive layer 1 covering the first resin layer 7 and the conductive layer 5 from the side of the first main surface 7a. Accordingly, the wiring body 200 can be bonded to another member by the first adhesive layer 1 without intervention of a base material or the like. Thereby, thickness of a base material or the like can be omitted. From the above, the thickness of the wiring body 200 can be reduced while holding the shape of the conductive layer 5.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a wiring body and a display device. [Background technology]

[0002] 2. Description of the Related Art Conventionally, a structure is known in which a conductive mesh pattern from which a substrate layer has been removed is mounted on a display device with a transparent adhesive layer (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 2017-504094 Summary of the Invention [Problem to be solved by the invention]

[0004] Here, the conductive mesh pattern mounted on the display device is configured with a pattern of very fine line width to reduce visibility. In the above-mentioned wiring body, the substrate layer is removed, so there is a possibility that the shape of the mesh pattern may be deformed. On the other hand, if a substrate layer is provided to maintain the shape of the mesh pattern, there is a problem that the thickness of the wiring body increases.

[0005] In view of the above, an object of the present disclosure is to provide a wiring body and a display device that can be made thinner while maintaining the shape of the conductive layer. [Means for solving the problem]

[0006] A wiring body according to one aspect of the present disclosure has a first main surface and a second main surface, and comprises a first resin layer having a through hole penetrating from the first main surface to the second main surface, a conductive layer disposed in the through hole, and a first adhesive layer covering the first resin layer and the conductive layer from the first main surface side.

[0007] A display device according to one aspect of the present disclosure includes the wiring body described above. Effect of the Invention

[0008] According to one aspect of the present disclosure, it is possible to provide a wiring body and a display device that can be made thinner while maintaining the shape of a conductive layer. [Brief description of the drawings]

[0009] [Figure 1] FIG. 2 is a plan view illustrating an embodiment of a conductive member including a wiring body. [Diagram 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Diagram 3] FIG. 11 is a cross-sectional view showing a conductive member according to a modified example. [Figure 4] FIG. 1 is a cross-sectional view showing an embodiment of a display device. [Diagram 5] FIG. 2 is a plan view of an antenna having a wiring body. [Figure 6] FIG. 6 is an enlarged cross-sectional view taken along line VI-VI shown in FIG. 5. [Figure 7] 7 is an enlarged cross-sectional view showing a configuration in the vicinity of an end face of a first conductive wire shown in FIG. 6. [Figure 8] 5A to 5C are schematic cross-sectional views showing a method for manufacturing a wiring body. [Figure 9] 5A to 5C are schematic cross-sectional views showing a method for manufacturing a wiring body. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, several embodiments of the present disclosure will be described in detail. However, the present disclosure is not limited to the following embodiments.

[0011] FIG. 1 is a plan view showing a conductive member 20 including a wiring body 200 according to an embodiment of the present disclosure, and FIG. 2 is a cross-sectional view taken along line II-II in FIG. 1. The conductive member 20 includes an antenna 300, and the antenna 300 includes the wiring body 200. The conductive member 20 shown in FIG. 1 and FIG. 2, i.e., the wiring body 200, includes a first resin layer 7, a conductive layer 5, and a first adhesive layer 1. The first resin layer 7 includes a first main surface 7a and a second main surface 7b. The first resin layer 7 includes a through hole 7c penetrating from the first main surface 7a to the second main surface 7b. The first resin layer 7 includes an insulating resin portion 7A that is a region having the through hole 7c, and a light-transmitting resin layer 7B. The conductive layer 5 is disposed within the through hole 7c. The conductive layer 5 includes a conductor portion 3 that includes a portion having a pattern including a plurality of openings 3a and extending in a direction along the main surfaces 7a and 7b. The insulating resin portion 7A is configured to fill the opening 3a of the conductor portion 3. In FIG. 2, the conductive layer 5 is shown in a deformed state, and the width of the conductor portion 3 is shown in an emphasized state. The thickness of each layer is also shown in a deformed state. Details of the thickness of each layer will be described later. In the example shown in FIG. 1, the conductive layer 5 is formed near one short side of the conductive member 20, but the position where the conductive layer 5 is formed is not particularly limited, and the conductive layer 5 may be formed near the long side. The first adhesive layer 1 covers the first resin layer 7 and the conductive layer 5 from the first main surface 7a side. The first adhesive layer 1 is a layer that exerts adhesive force against other members when the wiring body 200 is bonded to other members on the first main surface 7a side. The main surface 1a of the first adhesive layer 1 is arranged to contact the first main surface 7a of the first resin layer 7. It is not essential that the first adhesive layer 1 covers the entire surfaces of the first resin layer 7 and the conductive layer 5 on the first main surface 7a side.

[0012] The first adhesive layer 1 has a degree of light transmittance required when the conductive member 20 is incorporated into a display device. Specifically, the first adhesive layer 1 may have a total light transmittance of 90 to 100%. The first adhesive layer 1 may have a haze of 0 to 5%.

[0013] The material of the first adhesive layer 1 may be, for example, acrylic, urethane, silicone, etc. The thickness of the first adhesive layer 1 may be 50 to 250 μm. The dielectric constant of the first adhesive layer 1 may be 2.5 to 4.5@1 MHz.

[0014] The conductor 3 constituting the conductive layer 5 includes a portion having a pattern including an opening 3a. The pattern including the opening 3a is a mesh-like pattern including a plurality of regularly arranged openings 3a formed by a plurality of linear parts intersecting each other. The conductor 3 having the mesh-like pattern can function well as, for example, a radiation conductor and a feed line of the antenna 300. The conductor 3 also has a planar pattern that does not have an opening 3a. The conductor 3 having the planar pattern functions as a terminal and a ground pad portion described later. The details of the configuration of the pattern of the conductor 3 in the conductive layer 5 will be described later.

[0015] The conductor portion 3 may contain a metal. The conductor portion 3 may contain at least one metal selected from copper, nickel, cobalt, palladium, silver, gold, platinum, and tin, or may contain copper. The conductor portion 3 may be a metal plating formed by a plating method. The conductor portion 3 may further contain a nonmetallic element such as phosphorus within a range in which appropriate conductivity is maintained.

[0016] The conductor section 3 may be a laminate composed of multiple layers. The conductor section 3 may have a blackened layer as a surface layer portion on the side opposite to the first adhesive layer 1. The blackened layer may contribute to improving the visibility of a display device incorporating a conductive member. Here, the side opposite to the first adhesive layer 1 is the surface layer portion, but the first adhesive layer 1 side may also be the surface layer portion. In that case, the first adhesive layer 1 may have a blackened layer as the surface layer portion.

[0017] The insulating resin part 7A is made of a light-transmitting resin and is provided so as to fill the opening 3a of the conductor part 3, and usually, the insulating resin part 7A and the conductor part 3 form a flat surface. Note that the flatness here allows for some unevenness (parts where the conductive layer is lower than the surface of the resin layer). In other words, it also allows for a state in which the outermost surfaces of the insulating resin part 7A and the conductor part 3 are not completely on the same plane.

[0018] The light-transmitting resin layer 7B is formed of a resin having light transparency. The light-transmitting resin layer 7B may have a total light transmittance of 90 to 100%. The light-transmitting resin layer 7B may have a haze of 0 to 5%.

[0019] The difference between the refractive index of the first adhesive layer 1 and the light-transmitting resin layer 7B may be 0.1 or less. This makes it easier to ensure good visibility of the displayed image. The refractive index (nd25) of the light-transmitting resin layer 7B may be, for example, 1.0 or more, and may be 1.7 or less, 1.6 or less, or 1.5 or less. The refractive index can be measured by a reflection spectroscopic film thickness meter. From the viewpoint of uniformity of the optical path length, the conductor portion 3, the insulating resin portion 7A, and the light-transmitting resin layer 7B may have substantially the same thickness.

[0020] The resin forming the insulating resin portion 7A and the light-transmitting resin layer 7B may be a cured product of a curable resin composition (a photocurable resin composition or a thermosetting resin composition). The curable resin composition forming the insulating resin portion 7A and / or the light-transmitting resin layer 7B includes a curable resin, examples of which include acrylic resin, amino resin, cyanate resin, isocyanate resin, polyimide resin, epoxy resin, oxetane resin, polyester, allyl resin, phenol resin, benzoxazine resin, xylene resin, ketone resin, furan resin, COPNA resin, silicon resin, dicyclopentadiene resin, benzocyclobutene resin, episulfide resin, ene-thiol resin, polyazomethine resin, polyvinylbenzyl ether compound, acenaphthylene, and ultraviolet-curable resins containing functional groups that undergo a polymerization reaction with ultraviolet light, such as unsaturated double bonds, and cyclic ethers and vinyl ethers.

[0021] The resin forming the insulating resin part 7A and the resin forming the light-transmitting resin layer 7B may be the same. Since the insulating resin part 7A and the light-transmitting resin layer 7B formed from the same resin have the same refractive index, the uniformity of the optical path length passing through the conductive member 20 can be further improved. When the resin forming the insulating resin part 7A and the resin forming the light-transmitting resin layer 7B are the same, the insulating resin part 7A and the light-transmitting resin layer 7B can be easily formed collectively, for example, by forming a pattern from one curable resin layer by an imprint method or the like.

[0022] A conductive member 20 (wiring body 200) as shown in FIG. 3 may be employed. The conductive member 20 (wiring body 200) shown in FIG. 3 further includes a second adhesive layer 2 covering the first resin layer 7 and the conductive layer 5 from the second main surface 7b side. The second adhesive layer 2 is a layer that exerts adhesive force to other members when the wiring body 200 is bonded to other members on the second main surface 7b side. The main surface 2a of the second adhesive layer 2 is disposed so as to contact the second main surface 7b of the first resin layer 7. However, when a second resin layer 8 described later is provided on the second main surface 7b, the second adhesive layer 2 contacts the second resin layer 8. The thickness, material, and other properties of the second adhesive layer 2 may be the same as those of the first adhesive layer 1. However, the first adhesive layer 1 and the second adhesive layer 2 may have different thicknesses and materials. Furthermore, the second adhesive layer 2 does not necessarily have to cover the entire surfaces of the first resin layer 7 and the conductive layer 5 on the second main surface 7b side.

[0023] The conductive member described above can be incorporated into a display device as, for example, a planar transparent antenna. The display device may be, for example, a liquid crystal display device or an organic EL display device. FIG. 4 is a cross-sectional view showing an embodiment of a display device incorporating a wiring body 200. The display device 100 shown in FIG. 4 includes an image display unit 10 having an image display area 10S, a polarizing plate 30, a conductive member 20, and a cover glass 40. The polarizing plate 30, the conductive member 20, and the cover glass 40 are laminated in this order from the image display unit 10 side on the image display area 10S side of the image display unit 10. The configuration of the display device 100 is not limited to the form shown in FIG. 4, and can be appropriately changed as necessary. For example, the polarizing plate 30 may be provided between the cover glass 40 and the conductive member 20. The image display unit 10 may be, for example, a liquid crystal display unit. As the polarizing plate 30 and the cover glass 40, those usually used in display devices can be used. The polarizing plate 30 and the cover glass 40 do not necessarily have to be provided. In Fig. 4, the cover glass 40 is provided on the second main surface 7b side, and therefore the wiring body 200 shown in Fig. 3 is used. However, when the cover glass 40 is omitted, the wiring body 200 shown in Fig. 2 may be used. Light for image display emitted from the image display region 10S of the image display unit 10 passes through a path with a highly uniform optical path length including the conductive member 20. This enables a good image display with a high degree of uniformity in which moire is suppressed.

[0024] Next, with reference to FIG. 5, a configuration of an antenna 300 including a wiring body 200 according to an embodiment of the present disclosure will be described in detail. The antenna 300 includes the conductive layer 5 described above. FIG. 5 is a plan view of the antenna 300. FIG. 5 shows an enlarged view of a portion of the antenna 300 including the wiring body 200. In the following description, the XY coordinates are set with respect to a plane parallel to the main surface 1S. The Y-axis direction is a direction along the main surface 1S, and corresponds to a direction perpendicular to the side portion 20a of the conductive member 20 in the example shown in FIG. 1. The central side of the conductive member 20 is the positive side in the Y-axis direction, and the outer periphery side of the conductive member 20 is the negative side in the Y-axis direction. The X-axis direction is a direction perpendicular to the Y-axis direction along the main surface 1S, and corresponds to a direction in which the side portion 20a of the conductive member 20 extends in the example shown in FIG. 1. One side along which the side portion 20a of the conductive member 20 extends is the positive side in the X-axis direction, and the other side is the negative side in the X-axis direction. In the example shown in FIG. 5, the antenna 300 is shown as a single antenna element, but the present invention is not limited to this. A plurality of antennas 300 may be arranged in the X-axis direction to form an array antenna.

[0025] The conductive layer 5 of the antenna 300 has an electrode 26 including a radiation electrode 21 and power feed lines 25A and 25B, terminals 22A and 22B, and ground pad portions 24A, 24B, and 24C. The antenna 300 has a configuration that is axisymmetric with respect to a center line CL that is parallel to the Y-axis direction.

[0026] The radiation electrode 21 is a region that radiates a signal as the antenna 300. The radiation electrode 21 has a circular shape. The center of the radiation electrode 21 is located on the center line CL. The radiation electrode 21 is located at a position spaced away from the side portion 20a of the conductive member 20 to the positive side in the Y-axis direction. The radiation electrode 21 has a diameter R.

[0027] The feeder lines 25A and 25B are lines that feed power to the radiation electrode 21. That is, the antenna 300 functions as a dual-polarized antenna. For example, an obliquely polarized signal in the direction in which the inclined portion 25b of the feeder line 25A extends can be fed via the feeder line 25A, and an obliquely polarized signal in the direction in which the inclined portion 25b of the feeder line 25B extends can be fed via the feeder line 25B. The feeder lines 25A and 25B have a vertical portion 25a that extends perpendicular to the side portion 20a of the conductive member 20, and an inclined portion 25b that is inclined with respect to the Y-axis direction. The vertical portion 25a of the feeder line 25A extends from the terminal 22A formed on the side portion 20a side of the conductive member 20 to the positive side in the Y-axis direction. The vertical portion 25a of the power supply line 25A extends parallel to the center line CL (that is, in the Y-axis direction) at a position spaced from the center line CL to the negative side in the X-axis direction.

[0028] The inclined portion 25b of the feed line 25A is inclined from the end of the vertical portion 25a on the positive side in the Y-axis direction toward the center line CL (i.e., the positive side in the X-axis direction) as it moves toward the positive side in the Y-axis direction. The end of the inclined portion 25b on the positive side in the Y-axis direction is connected to the outer periphery 21a of the radiation electrode 21. The feed line 25A has a constant width dimension W1 in the vertical portion 25a and the inclined portion 25b. The feed line 25A also has a line length L1 that is the sum of the length dimension of the vertical portion 25a and the length dimension of the inclined portion 25b. Here, the width dimension W1 is the dimension in a direction perpendicular to the extension direction of the vertical portion 25a and the inclined portion 25b in the in-plane direction of the planar antenna 300, and the line length L1 is the dimension along the extension direction of the vertical portion 25a and the inclined portion 25b in the in-plane direction of the planar antenna 300.

[0029] 5, the vertical portion 25a of the power feed line 25A is disposed at a position farther away from the negative end of the radiation electrode 21 in the X-axis direction in the negative direction in the X-axis direction. Also, the positive end of the vertical portion 25a of the power feed line 25A in the Y-axis direction (i.e., the connection portion with the inclined portion 25b) is disposed at a position farther away from the negative end of the radiation electrode 21 in the Y-axis direction in the negative direction in the Y-axis direction in the negative direction in the Y-axis direction. However, the arrangement and shape of the vertical portion 25a and the inclined portion 25b are not particularly limited. The power feed line 25B has a structure that is linearly symmetrical to the power feed line 25A with respect to the center line CL. In this embodiment, the inclined portion 25b of the power feed line 25A and the inclined portion 25b of the power feed line 25B are connected to the outer peripheral edge 21a of the radiation electrode 21 so that a virtual line extending the inclined portion 25b of the power feed line 25A and a virtual line extending the inclined portion 25b of the power feed line 25B are perpendicular to each other. In other words, the angle formed by the virtual line extending the inclined portion 25b of the power feed line 25A and the virtual line extending the inclined portion 25b of the power feed line 25B is 90 degrees.

[0030] The terminals 22A and 22B are terminals connected to the power supply lines 25A and 25B, respectively. The terminals 22A and 22B are connected to external input / output terminals to supply power to the radiation electrode 21 via the power supply lines 25A and 25B. The terminals 22A and 22B are disposed near the side 20a of the conductive member 20. The terminals 22A and 22B extend from the negative end of the vertical portion 25a of the power supply lines 25A and 25B in the Y-axis direction to the negative side in the Y-axis direction to the side 20a. The terminals 22A and 22B extend in the Y-axis direction with a constant width dimension W2. The terminals 22A and 22B extend in the Y-axis direction with a length dimension L2. Here, the width dimension W2 is the dimension perpendicular to the extension direction of the terminals 22A, 22B in the in-plane direction of the planar antenna 300, and the length dimension L2 is the dimension along the extension direction of the terminals 22A, 22B in the in-plane direction of the planar antenna 300.

[0031] The ground pad portions 24A, 24B, and 24C are regions that are electrically in a ground state. The ground pad portions 24A, 24B, and 24C are connected to ground terminals (not shown). The ground pad portions 24A, 24B, and 24C are insulated from the terminals 22A and 22B by being arranged with a gap GP between them. The ground pad portion 24A is formed to extend in the X-axis direction along the side portion 20a in the region between the terminals 22A and 22B. The ground pad portion 24B is formed to extend in the X-axis direction along the side portion 20a in the region on the negative side of the X-axis direction of the terminal 22A. The ground pad portion 24C is formed to extend in the X-axis direction along the side portion 20a in the region on the positive side of the X-axis direction of the terminal 22B. The ground pad portions 24A, 24B, and 24C extend in a strip shape in the X-axis direction with a constant width in the Y-axis direction. The width of the ground pad portions 24A, 24B, and 24C is the same as the length dimension L2 of the terminals 22A and 22B.

[0032] As described above, terminal 22A, which is a signal line, has a structure in which it is sandwiched between ground pad portions 24A and 24B from both sides in the X-axis direction. Terminal 22B, which is a signal line, has a structure in which it is sandwiched between ground pad portions 24A and 24C from both sides in the X-axis direction. In this way, terminals 22A and 22B are coplanar lines.

[0033] As shown in FIG. 5, the antenna 300 has a mesh-shaped conductor pattern 50 as the conductor portion 3. Among the components of the antenna 300, the radiation electrode 21 and the power supply lines 25A and 25B (electrodes) have the mesh-shaped conductor pattern 50. The mesh-shaped conductor pattern 50 includes a plurality of first conductive wires 51 and a plurality of second conductive wires 52. The first conductive wires 51 are linear conductor portions 3 extending parallel to the Y-axis direction. The plurality of first conductive wires 51 are arranged so as to be spaced apart from each other in the X-axis direction. The plurality of first conductive wires 51 are arranged so as to be spaced apart at an equal pitch. The second conductive wires 52 are linear conductor portions 3 extending parallel to the X-axis direction. The plurality of second conductive wires 52 are arranged so as to be spaced apart from each other in the Y-axis direction. The plurality of second conductive wires 52 are arranged so as to be spaced apart at an equal pitch. The thickness of the conductive wires 51 and 52 is not particularly limited, but may be set to, for example, 1 to 3 μm. The pitch of the conductive wires 51, 52 is not particularly limited, and may be set to, for example, 50 to 300 μm. The first conductive wire 51 does not have to be parallel to the Y-axis direction as long as it extends in the Y-axis direction, and the second conductive wire 52 does not have to be parallel to the X-axis direction as long as it extends in the X-axis direction.

[0034] In this embodiment, the radiation electrode 21 and the power supply lines 25A and 25B have end conductive lines that form an outer periphery. The shape of the radiation electrode 21 formed by the end conductive lines is circular. The circular radiation electrode 21 is not limited to a strict perfect circle shape, and includes variations caused by manufacturing errors and the like. The end conductive lines that form the outer periphery of the radiation electrode 21 may not only be formed by curves, but may also include straight lines, wavy lines, and the like. Furthermore, the radiation electrode 21 and the power supply lines 25A and 25B may not include end conductive lines. In this case, it is sufficient that the shape of the first conductive line 51 or the second conductive line 52 included in the mesh-shaped conductor pattern 50 connected at the tips thereof is circular.

[0035] The terminal 22 has a second conductor layer 56 that spreads in a planar manner over substantially the entire area of ​​the terminal 22. When the term "terminal 22" is used, the terminal 22A and the terminal 22B are not distinguished from each other, and the term "terminal 22" refers to both. In FIG. 5, the second conductor layer 56 is formed over the entire area of ​​the terminal 22, but the area of ​​the second conductor layer 56 is not particularly limited. For example, the area of ​​the second conductor layer 56 may be 95% or more of the area of ​​the entire terminal 22. The ground pad portions 24A, 24B, and 24C also have the second conductor layer 56. However, the ground pad portions 24A, 24B, and 24C may have a mesh-shaped conductor pattern 50.

[0036] Next, with reference to FIG. 6, a detailed cross-sectional configuration of the wiring body 200 will be described. FIG. 6 is a cross-sectional view taken along line VI-VI shown in FIG. 5. As shown in FIG. 6, the wiring body 200 includes the above-mentioned first adhesive layer 1, the conductive layer 5, and the first resin layer 7. The conductor pattern 50 of the conductive layer 5 has conductive lines 51, 52 that extend linearly in the extension direction of the first resin layer 7 (see FIG. 5). Here, the extension direction for the first conductive line 51 corresponds to the Y-axis direction. The extension direction for the second conductive line 52 corresponds to the X-axis direction. Since the first conductive line 51 is shown in FIG. 6, the Y-axis direction corresponds to the extension direction. Therefore, the orthogonal direction perpendicular to the extension direction corresponds to the X-axis direction. The height direction corresponds to the Z-axis direction. Moreover, one side in the height direction from the first main surface 7a toward the second main surface 7b corresponds to the positive side in the Z-axis direction. The other side in the height direction from the second main surface 7b toward the first main surface 7a corresponds to the negative side in the Z-axis direction. However, the orientation in the height direction is not particularly limited, and the first main surface 7a may be the surface layer (upper part). Fig. 6 shows a cross-sectional view of the first conductive wire 51 when cut in the X-axis direction, which is the perpendicular direction. Note that although Fig. 6 shows the configuration of the first conductive wire 51, the second conductive wire 52 has a similar structure, and therefore a description thereof will be omitted.

[0037] The first conductive wire 51 has side surfaces 61A and 61B facing each other in the X-axis direction, which is the width direction. The side surface 61A is disposed on the negative side in the X-axis direction, and the side surface 61B is disposed on the positive side in the X-axis direction. The first conductive wire 51 has an end surface 62 on the other side in the height direction (negative side in the Z-axis direction). The first conductive wire 51 has an end surface 63 on one side in the height direction (positive side in the Z-axis direction).

[0038] The first resin layer 7 has a trench 70 in which the first conductive wire 51 is disposed. In this embodiment, the trench 70 forms a through hole 7c extending from the second main surface 7b on one side (positive side in the Z-axis direction) in the height direction of the first resin layer 7 to the first main surface 7a on the other side (negative side in the Z-axis direction). The trench 70, i.e., the through hole 7c, is formed in a mesh shape. The side surfaces 61A and 61B of the first conductive wire 51 are in surface contact with the inner surface of the trench 70. The width (dimension in the X-axis direction) of the first conductive wire 51 is constant in the height direction. However, the width of the first conductive wire 51 may increase toward one side in the height direction (positive side in the Z-axis direction).

[0039] The first conductive wire 51 has a first portion 80 whose height from the second main surface 7b is lower than that of the first main surface 7a of the first resin layer 7. In FIG. 6, the height dimension of the lowest point of the first portion 80 from the second main surface 7b is indicated as "H1". That is, the first portion 80 is disposed at a position closer to the second main surface 7b (positive side in the Z-axis direction) than the first main surface 7a. In this embodiment, the end surface 62 is curved in the width direction (X-axis direction) such that the central portion 62a protrudes toward the negative side in the Z-axis direction. Therefore, at least the edge portion of the end surface 62 in the width direction corresponds to the first portion 80. The central portion 62a of the end surface 62 located on the most negative side in the Z-axis direction may correspond to the first portion 80. In this case, the entire end surface 62 corresponds to the first portion. Alternatively, the central portion 62a may not correspond to the first portion 80. In this case, a part near the central portion 62a has a height from the second main surface 7b higher than or equal to that of the first main surface 7a of the first resin layer 7. The first adhesive layer 1 enters the through hole 7c and contacts the first portion 80 of the first conductive wire 51 inside the through hole 7c. The first adhesive layer 1 contacts almost the entire end surface 62. The shape of the end surface 62 is not limited to the above, and is not limited to a curved shape in which the central portion 62a protrudes.

[0040] The first conductive wire 51 has a second portion 81 whose height from the first main surface 7a is lower than that of the second main surface 7b of the first resin layer 7. In FIG. 6, the height dimension of the lowest point of the second portion 81 from the first main surface 7a is indicated by "H2". That is, the second portion 81 is disposed at a position closer to the first main surface 7a (negative side in the Z-axis direction) than the second main surface 7b. In this embodiment, the end surface 63 has a shape in the width direction (X-axis direction) such that the edge portion is directed toward the negative side in the Z-axis direction as it moves toward the outside in the width direction. The region near the center in the width direction of the end surface 63 is disposed at the same height as the second main surface 7b. The first resin layer 7 has a cover portion 82 that covers the second portion 81 from the second main surface 7b side (see also FIG. 7). The cover portion 82 extends toward the center in the width direction along the curved shape of the second portion 81. Therefore, the end face 63 is covered by the second main surface 7b at part of both edge portions in the width direction, and a part on the central side is exposed from the second main surface 7b.

[0041] The height difference between the second main surface 7b and the second portion 81 is smaller than the height difference between the first main surface 7a and the first portion 80. When comparing the two, the points of the first portion 80 and the second portion 81 that are furthest from the main surfaces 7a, 7b are compared. The height difference between the first main surface 7a and the lowest first portion 80 is indicated as "G1". The height difference between the second main surface 7b and the lowest second portion 81 is indicated as "G2". In this case, "G1>G2" holds true.

[0042] The wiring body 200 further includes a second resin layer 8 covering the first resin layer 7 and the conductive layer 5 from the second main surface 7b side. The second resin layer 8 is a layer called a hard coat layer. The main surface 8a of the second resin layer 8 is provided so as to contact the second main surface 7b of the first resin layer 7 and the end surface 63 of the first conductive wire 51. The second resin layer 8 may be a layer containing a resin and an inorganic filler. An example of the resin constituting the second resin layer 8 is an acrylic resin. An example of the inorganic filler is silica. The thickness of the second resin layer 8 may be, for example, 5 nm or more, 100 nm or more, or 200 nm or more, and may be 10 μm or less, 5 μm or less, or 2 μm or less.

[0043] Fig. 7 is an enlarged cross-sectional view showing the configuration in the vicinity of end surface 63 of first conductive wire 51 shown in Fig. 6. The configuration in the vicinity of the boundary between second resin layer 8 and first resin layer 7 will be described with reference to Fig. 7. Second resin layer 8 contains inorganic particles 84. Metallic fine particles 85 are dispersed in first resin layer 7 on the interface side with second resin layer 8.

[0044] The inorganic particles 84 are dispersed in the second resin layer 8. Some of the inorganic particles 84 may protrude from the main surface 8a of the second resin layer 8 and contact the first resin layer 7. Examples of the inorganic particles 84 include silica, alumina, titania, tantalum oxide, zirconia, silicon nitride, barium titanate, barium carbonate, magnesium carbonate, aluminum hydroxide, magnesium hydroxide, lead titanate, lead zirconate titanate, lead lanthanum zirconate titanate, gallium oxide, spinel, mullite, cordierite, talc, aluminum titanate, barium silicate, boron nitride, calcium carbonate, barium sulfate, calcium sulfate, zinc oxide, magnesium titanate, hydrotalcite, mica, calcined kaolin, and carbon. The inorganic particles 84 may be one type alone or two or more types in combination.

[0045] The shape of the inorganic particles 84 is not particularly limited, and may be, for example, spherical, ellipsoidal, polyhedral, plate-like, scaly, columnar, or the like.

[0046] The average particle diameter of the inorganic particles 84 may be, for example, 10 nm or more, 15 nm or more, or 20 nm or more, or 400 nm or less, 300 nm or less, or 200 nm or less. The average particle diameter of the inorganic particles 84 is calculated by observing a cross section of the wiring body 200 along the thickness direction with a TEM, measuring the maximum length of each of the inorganic particles 84 present within a range of 1.5 μm in the extension direction of the wiring body 200 in the TEM image of the cross section, and averaging the maximum lengths.

[0047] The metal fine particles 85 may be one or more inorganic particles selected from Pd, Cu, Ni, Co, Au, Ag, Pd, Rh, Pt, In, and Sn, and may contain Pd. The metal fine particles 85 may be one type alone or a combination of two or more types of inorganic particles.

[0048] The shape of the metal fine particles 85 is not particularly limited, and may be, for example, spherical, ellipsoidal, polyhedral, plate-like, scaly, columnar, or the like.

[0049] The average particle diameter of the metal fine particles 85 may be 10 nm or less, 8 nm or less, or 5 nm or less from the viewpoint of excellent transparency of the conductive member 20. The average particle diameter of the metal fine particles 85 may be, for example, 0.1 nm or more, 0.5 nm or more, or 1 nm or more. The average particle diameter of the metal fine particles 85 is calculated by observing a cross section of the wiring body 200 along the thickness direction with a TEM, measuring the maximum length of each of the metal fine particles 85 present within a range of 1.5 μm in the extension direction of the wiring body 200 in the TEM image of the cross section, and averaging the maximum lengths.

[0050] The average particle diameter of the metal particles 85 may be smaller than the average particle diameter of the inorganic particles 84. The ratio of the average particle diameter of the metal particles 85 to the average particle diameter of the inorganic particles 84 (average particle diameter of the metal particles 85 / average particle diameter of the inorganic particles 84) may be 0.3 or less, or 0.1 or less, or may be 0.01 or more, 0.02 or more, or 0.05 or more.

[0051] The state in which the inorganic particles 84 are dispersed in the second resin layer 8 means that when a cross section of the wiring body 200 along the thickness direction is observed by a TEM, at least one particle is present in each of 500 μm squares. The state in which the metal particles 85 are dispersed in the first resin layer 7 at the interface side with the second resin layer 8 means that the metal particles 85 are dispersed within a range of 100 μm in the thickness direction at the boundary between the main surfaces 7b and 8a of the first resin layer 7. The state in which the metal particles 85 are dispersed within this range means that when a cross section of the wiring body 200 along the thickness direction is observed by a TEM, at least one particle is present in each of 100 nm squares.

[0052] Next, a method for manufacturing wiring body 200 will be described with reference to Fig. 8 and Fig. 9. Fig. 8 and Fig. 9 are schematic cross-sectional views showing the method for manufacturing wiring body 200. First, as shown in Fig. 8, a substrate 9 having a second resin layer 8 formed on its upper surface is prepared. Note that in Figs. 8 and 9, unlike Figs. 2 to 4, 6 and 7, the substrate is arranged so that first main surface 7a is on the upper side and second main surface 7b is on the lower side.

[0053] The base material 9 may be, for example, COP (cycloolefin polymer), PET (polyethylene terephthalate), PC (polycarbonate), or the like, and is not particularly limited. The second resin layer 8 contains inorganic particles 84 (see FIG. 7). A third resin layer 11 shown by a virtual line is laminated on the main surface 8a of the second resin layer 8. The third resin layer 11 contains metal fine particles 85 (see FIG. 7). The third resin layer 11 is removed by an ashing process or the like. At this time, the resin component of the third resin layer 11 is removed, but the metal fine particles 85 present in the third resin layer 11 are not removed and remain on the main surface 8a side of the second resin layer 8. A resin composition containing the resin component forming the first resin layer 7 is applied onto the main surface 8a on which the metal fine particles 85 are deposited, thereby forming the first resin layer 7. A mesh-shaped through hole 7c is formed in the first resin layer 7. The conductive layer 5 is formed by subjecting the member having the mesh-like through holes 7c (the member including the substrate 9, the metal fine particles 85, the second resin layer 8, and the first resin layer 7) to electroless plating and / or electrolytic plating.

[0054] 9, the base material 9 is removed. There is no particular limitation on the method for removing the base material 9, but a method of peeling off the base material 9 after forming the first adhesive layer 1 on the first main surface 7a side of the first resin layer 7 may be used. In this way, the wiring body 200 is completed.

[0055] Next, the functions and effects of the wiring body 200 and the display device 100 according to this embodiment will be described.

[0056] The wiring body 200 of this embodiment has a first main surface 7a and a second main surface 7b, and comprises a first resin layer 7 having a through hole 7c penetrating from the first main surface 7a to the second main surface 7b, a conductive layer 5 disposed in the through hole 7c, and a first adhesive layer 1 covering the first resin layer 7 and the conductive layer 5 from the first main surface 7a side.

[0057] The wiring body 200 includes a first resin layer 7 having a first main surface 7a and a second main surface 7b, and a through hole 7c penetrating from the first main surface 7a to the second main surface 7b. The conductive layer 5 is disposed in the through hole 7c of the first resin layer 7. Therefore, the shape of the conductive layer 5 can be maintained by the first resin layer 7 without supporting the conductive layer 5 with a base material or the like. The wiring body 200 includes a first adhesive layer 1 covering the first resin layer 7 and the conductive layer 5 from the first main surface 7a side. Therefore, the wiring body 200 can be bonded to another member by the first adhesive layer 1 without using a base material or the like. This allows the thickness of the base material or the like to be omitted. As a result, the thickness of the wiring body 200 can be reduced while maintaining the shape of the conductive layer 5.

[0058] The conductive layer 5 has a first portion 80 whose height from the second main surface 7b is lower than the first main surface 7a of the first resin layer 7, and the first adhesive layer 1 may be in contact with the first portion 80 of the conductive layer 5 within the through hole 7c. In this case, the adhesiveness between the first adhesive layer 1 and the first resin layer 7 and the conductive layer 5 can be improved due to the anchor effect of the first adhesive layer 1 that has entered the through hole 7c.

[0059] The wiring body 200 may further include a second resin layer 8 that covers the first resin layer 7 and the conductive layer 5 from the second principal surface 7b side. In this case, the second resin layer 8 can protect the conductive layer 5 from the second principal surface 7b side.

[0060] The second resin layer 8 may contain inorganic particles 84. In this case, the weather resistance and rust resistance of the wiring body 200 are improved.

[0061] Metallic fine particles 85 may be dispersed on the interface side of the first resin layer 7 with the second resin layer 8. In this case, when viewed from the second main surface 7b side, the metallic fine particles 85 are present around the interface between the conductive layer 5 and the first resin layer 7. Therefore, the color of the metallic fine particles 85 blends with the color of the conductive layer 5, and thus it is possible to prevent the visibility of the interface between the conductive layer 5 and the first resin layer 7 from becoming high.

[0062] The wiring body 200 may further include a second adhesive layer 2 covering the first resin layer 7 and the conductive layer 5 from the second principal surface 7b side. In this case, the wiring body 200 can be adhered to other members on both the first principal surface 7a and the second principal surface 7b, making it possible to apply the wiring body 200 to a device having a layered structure.

[0063] The conductive layer 5 may have a second portion 81 whose height from the first main surface 7a is lower than the second main surface 7b of the first resin layer 7. In this case, when viewed from the second main surface 7b side, the second portion 81 is disposed at a position recessed from the second main surface 7b, making it difficult to see. As described above, the invisibility of the conductive layer 5 can be improved. Note that, since the second portion 81 is provided at the edge portion in the width direction of the end surface 63, it can be made invisible from the oblique line of sight V from the second main surface 7b side (see FIG. 7).

[0064] The difference in height between the second main surface 7b and the second portion 81 may be smaller than the difference in height between the first main surface 7a and the first portion 80. In this case, the invisibility of the conductive layer 5 can be improved while ensuring the conductor volume of the conductive layer 5.

[0065] The first resin layer 7 may have a cover portion 82 that covers the second portion 81. In this case, the adhesion between the first resin layer 7 and the conductive layer 5 can be improved.

[0066] The conductive layer 5 may be disposed in the through holes 7c that are provided in a mesh shape. In this case, the conductive layer 5 can be formed in a mesh shape.

[0067] A display device according to one aspect of the present disclosure includes the wiring body described above.

[0068] According to the above-described display device 100, the same functions and effects as those of the above-described wiring body 200 can be obtained.

[0069] The present disclosure is not limited to the above-described embodiments.

[0070] In the above embodiment, the wiring body 200 is applied to the display device 100, but the application of the wiring body 200 is not particularly limited. For example, the wiring body 200 can be applied to window glass, etc. For example, when the second adhesive layer 2 is not provided as in FIG. 2, the first adhesive layer 1 can be adhered to the glass portion to form a transparent antenna.

[0071] In the above embodiment, the wiring body 200 has the second resin layer 8. However, the second resin layer 8 may be omitted. Accordingly, the inorganic particles 84 and the metal fine particles 85 may also be omitted.

[0072] [Form 1] a first resin layer having a first main surface and a second main surface and a through hole extending from the first main surface to the second main surface; A conductive layer disposed within the through hole; a first adhesive layer covering the first resin layer and the conductive layer from the first main surface side; [Form 2] the conductive layer has a first portion whose height from the second main surface is lower than the first main surface of the first resin layer; 2. The wiring body according to claim 1, wherein the first adhesive layer is in contact with the first portion of the conductive layer within the through hole. [Form 3] 3. The wiring body according to embodiment 1 or 2, further comprising a second resin layer covering the first resin layer and the conductive layer from the second main surface side. [Form 4] The wiring body according to embodiment 3, wherein the second resin layer contains inorganic particles. [Form 5] 5. The wiring body according to embodiment 3 or 4, wherein metal fine particles are dispersed on the interface side of the first resin layer with the second resin layer. [Form 6] 6. The wiring body of claim 1, further comprising a second adhesive layer covering the first resin layer and the conductive layer from the second main surface side. [Form 7] The wiring body according to embodiment 2, wherein the conductive layer has a second portion whose height from the first main surface is lower than the second main surface of the first resin layer. [Form 8] The wiring body according to embodiment 7, wherein a difference in height between the second main surface and the second portion is smaller than a difference in height between the first main surface and the first portion. [Form 9] The wiring body according to embodiment 7 or 8, wherein the first resin layer has a cover portion that covers the second portion from the second main surface side. [Form 10] 10. The wiring body according to any one of embodiments 1 to 9, wherein the conductive layer is disposed in the through holes arranged in a mesh shape. [Form 11] A display device comprising the wiring body according to any one of the first to tenth embodiments. [Explanation of symbols]

[0073] 1...first adhesive layer, 2...second adhesive layer, 5...conductive layer, 7...first resin layer, 7a...first main surface, 7b...second main surface, 7c...through hole, 8...second resin layer, 80...first portion, 81...second portion, 82...cover portion, 84...inorganic particles, 85...metallic microparticles, 100...display device, 200...wiring body.

Claims

1. a first resin layer having a first main surface and a second main surface and a through hole extending from the first main surface to the second main surface; A conductive layer disposed in the through hole; a first adhesive layer covering the first resin layer and the conductive layer from the first main surface side.

2. the conductive layer has a first portion whose height from the second main surface is lower than the first main surface of the first resin layer; The wiring body according to claim 1 , wherein the first adhesive layer is in contact with the first portion of the conductive layer within the through hole.

3. The wiring body according to claim 1 , further comprising a second resin layer covering the first resin layer and the conductive layer from the second main surface side.

4. The wiring body according to claim 3 , wherein the second resin layer contains inorganic particles.

5. The wiring body according to claim 3 , wherein metal particles are dispersed on the first resin layer at an interface side with the second resin layer.

6. The wiring body according to claim 1 , further comprising a second adhesive layer covering the first resin layer and the conductive layer from the second main surface side.

7. The wiring body according to claim 2 , wherein the conductive layer has a second portion whose height from the first main surface is lower than the second main surface of the first resin layer.

8. The wiring body according to claim 7 , wherein a difference in height between the second main surface and the second portion is smaller than a difference in height between the first main surface and the first portion.

9. The wiring body according to claim 7 , wherein the first resin layer has a cover portion that covers the second portion from the second main surface side.

10. The wiring body according to claim 1 , wherein the conductive layer is disposed in the through holes that are provided in a mesh shape.

11. A display device comprising the wiring body according to any one of claims 1 to 10.

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