Processing apparatus

Abstract

To provide a processing apparatus that can check whether or not conveying means is appropriate when the conveying means conveys a frame unit and when the conveying means conveys a single wafer.SOLUTION: Conveying means of a processing apparatus includes: a first holding part 32 that sucks in and holds a workpiece; a second holding part that holds the workpiece using a suction force generated by the Bernoulli effect when air is injected; and a conveying arm 36 including a connection part 56 to which the first holding part 32 and the second holding part are selectively connected. When the first holding part 32 is connected to the connection part 56, an air supply port is closed, and when a second valve 76 is opened, a value of a second pressure gauge 74 is increased, which allows checking that the first holding part 32 is connected to the connection part 56. When the second holding part is connected to the connection part 56, an air supply port is closed, and when a first valve 70 is opened, a value of a first pressure gauge 68 is reduced, which allows checking that the second holding part is connected to the connection part 56.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a processing apparatus including a chuck table for holding a workpiece, cutting means for cutting the workpiece held on the chuck table, and transport means for transporting the workpiece to or from the chuck table. [Background technology]

[0002] Wafers, on whose surface multiple devices such as ICs and LSIs are formed, are divided along planned dividing lines, and then cut into individual device chips by a cutting machine. Each of the cut device chips is used in electrical equipment such as mobile phones and personal computers.

[0003] The cutting apparatus comprises a chuck table for holding a wafer, cutting means having a spindle that rotatably supports a cutting blade that cuts the wafer held on the chuck table, feeding means for feeding the chuck table and the cutting means relatively for processing, cleaning means for cleaning the cut wafer, a cassette table on which a cassette containing a plurality of wafers is placed, unloading means for unloading a wafer from the cassette placed on the cassette table and positioning it on the temporary placement table, a first transport means for transporting the unloaded wafer to the chuck table, and a second transport means for transporting the cut wafer to the cleaning means, and can divide the wafer into individual device chips with high precision (see, for example, Patent Document 1).

[0004] In addition, the wafer may be completely cut by the cutting means in the form of a frame unit in which the wafer is supported via tape on a frame having an opening in the center for accommodating the wafer, or may be incompletely half-cut by the cutting means as a single wafer.

[0005] Furthermore, since the first transport means and the second transport means have different configurations when transporting a frame unit and when transporting a single wafer, the operator needs to appropriately switch between the transport means. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2010-36275 A Summary of the Invention [Problem to be solved by the invention]

[0007] However, if the operator forgets to change the transport means or uses the wrong transport means, a problem occurs in that the wafer falls off the transport means while being transported by the transport means, or the wafer cannot be transported.

[0008] An object of the present invention is to provide a processing apparatus capable of checking whether or not a transport means is appropriate when transporting a frame unit and when transporting a single wafer. [Means for solving the problem]

[0009] According to the present invention, there is provided the following processing device that solves the above problems. "A processing device including a chuck table for holding a workpiece, a cutting means for cutting the workpiece held on the chuck table, and a transport means for transporting the workpiece to the chuck table or from the chuck table, The conveying means includes a first holding part that holds the workpiece by suction, a second holding part that holds the workpiece by suction force generated by the Bernoulli effect when air is injected, and a conveying arm having a connecting part that selectively connects the first holding part and the second holding part, an air suction port connected to the air suction passage of the connecting portion is formed in the first holding portion; an air supply port connected to the air supply path of the connecting portion is formed in the second holding portion; the air suction passage is connected to a suction source via a first pressure gauge and a first valve; the air supply line is connected to an air source via a second pressure gauge and a second valve; When the first holding part is connected to the connecting part, the air supply port is closed and the second valve is opened, so that the value of the second pressure gauge increases, and it can be confirmed that the first holding part is connected to the connecting part, When the second holding part is connected to the connecting part, the air suction port is closed and when the first valve is opened, the value of the first pressure gauge decreases, so that it is possible to confirm that the second holding part is connected to the connecting part.

[0010] Preferably, the work is either a frame unit in which a wafer is supported via tape on a frame having an opening in the center for accommodating a wafer, or a single wafer, the frame unit being held by the first holding part and the single wafer being held by the second holding part. Effect of the Invention

[0011] The processing apparatus of the present invention comprises: A processing device including a chuck table for holding a workpiece, cutting means for cutting the workpiece held on the chuck table, and transport means for transporting the workpiece to the chuck table or from the chuck table, The conveying means includes a first holding part that holds the workpiece by suction, a second holding part that holds the workpiece by suction force generated by the Bernoulli effect when air is injected, and a conveying arm having a connecting part that selectively connects the first holding part and the second holding part, an air suction port connected to the air suction passage of the connecting portion is formed in the first holding portion; an air supply port connected to the air supply path of the connecting portion is formed in the second holding portion; the air suction passage is connected to a suction source via a first pressure gauge and a first valve; the air supply line is connected to an air source via a second pressure gauge and a second valve; When the first holding part is connected to the connecting part, the air supply port is closed and the second valve is opened, so that the value of the second pressure gauge increases, and it can be confirmed that the first holding part is connected to the connecting part, When the second holding part is connected to the connecting part, the air suction port is blocked and the first valve is opened, so that the value of the first pressure gauge decreases, and it can be confirmed that the second holding part is connected to the connecting part. Therefore, it can be confirmed whether the transport means is appropriate when transporting a frame unit and when transporting a single wafer. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 is a perspective view of a processing device according to the present invention. [Diagram 2] FIG. 4 is a perspective view of the conveying means to which the first holding portion is connected. [Diagram 3] FIG. 3 is an exploded perspective view of the conveying means shown in FIG. 2. [Figure 4] FIG. 13 is a perspective view of the conveying means to which the second holding portion is connected. [Diagram 5] FIG. 5 is an exploded perspective view of the conveying means shown in FIG. 4. [Figure 6] FIG. [Figure 7] FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, preferred embodiments of the processing apparatus according to the present invention will be described with reference to the drawings.

[0014] (Processing equipment 2) Referring to FIG. 1, the processing device 2 includes a chuck table 4 for holding a workpiece, a cutting means 6 for cutting the workpiece held on the chuck table 4, and a transport means 8 for transporting the workpiece to or from the chuck table 4.

[0015] (Chuck table 4) 1, a circular suction chuck 10 is disposed on the upper end of the chuck table 4. The suction chuck 10 is formed of a porous material such as porous ceramics. The suction chuck 10 is connected to a suction means (not shown). In the chuck table 4, the suction means generates a suction force on the upper surface of the suction chuck 10, and the workpiece placed on the upper surface of the suction chuck 10 is sucked and held.

[0016] The chuck table 4 is fed for processing in the X-axis direction by an X-axis feed means (not shown), and is rotated by a chuck table motor (not shown) about its axis in the Z-axis direction.

[0017] The X-axis direction is the direction indicated by the arrow X in Fig. 1. The Z-axis direction is a direction perpendicular to the X-axis direction, and is the up-down direction indicated by the arrow Z in Fig. 1. The Y-axis direction indicated by the arrow Y in Fig. 1 is a direction perpendicular to the X-axis and Z-axis directions. The plane defined by the X-axis and Y-axis directions is substantially horizontal.

[0018] (Cutting means 6) The cutting means 6 includes a spindle housing 12 configured to be movable in both the Y-axis and Z-axis directions, a spindle 14 rotatably supported by the spindle housing 12, an annular cutting blade 16 fixed to the tip of the spindle 14, and a motor (not shown) that rotates the spindle 14. The cutting means 6 performs cutting by cutting the cutting edge of the cutting blade 16, which is rotated at high speed, into the workpiece held by suction on the chuck table 4.

[0019] (Transportation means 8) The transport means 8 includes a first transport means 20 that transports the uncut workpiece carried out to the temporary placement table 18 to the chuck table 4, and a second transport means 24 that transports the cut workpiece from the chuck table 4 to the cleaning means 22. The workpieces are carried out to the temporary placement table 18 from a cassette 26 that contains a plurality of workpieces by a carry-out means 28. The cassette 26 contains a plurality of workpieces, and is set on a cassette table 30 that can be raised and lowered.

[0020] Here, the second conveying means 24 will be described first before the first conveying means 20. Explaining with reference to Figures 2 to 5, the second conveying means 24 includes a first holding unit 32 (see Figures 2 and 3) that sucks and holds the workpiece, a second holding unit 34 (see Figures 4 and 5) that holds the workpiece by suction force generated by the Bernoulli effect when air is sprayed, and a conveying arm 36 equipped with a connecting unit that selectively connects the first holding unit 32 and the second holding unit 34.

[0021] (First holding portion 32) 3, the first holding part 32 has a plate-shaped holding piece 38 and a plurality of (four in this embodiment) suction pads 40 provided on the lower surface of the holding piece 38. The upper surface of the holding piece 38 is provided with an air suction port 38a communicating with each of the suction pads 40, two female screws 38b, and two protrusions 38c.

[0022] (Second holding portion 34) As shown in FIG. 5, the second holding part 34 has a disk-shaped main part 42 and a rectangular plate-shaped connecting piece 44 attached to the upper surface of the main part 42. The main part 42 generates a suction force by the Bernoulli effect when air is ejected downward. The upper surface of the connecting piece 44 is provided with an air supply port 44a communicating with the lower surface of the main part 42, two female screws 44b, and two protrusions 44c. The positional relationship between the female screw 44b and the protrusion 44c of the second holding part 34 is the same as the positional relationship between the female screw 38b and the protrusion 38c of the first holding part 32. However, the arrangement of the air supply port 44a in the second holding part 34 (the arrangement of the air supply port 44a relative to the female screw 44b or the protrusion 44c) is different from the arrangement of the air suction port 38a in the first holding part 32 (the arrangement of the air suction port 38a relative to the female screw 38b or the protrusion 38c).

[0023] (Transport arm 36) The transport arm 36 includes an arm body 46 that is movable in the Y-axis direction, and a Y-axis movement mechanism 48 that moves the arm body 46 in the Y-axis direction. The Y-axis movement mechanism 48 includes a ball screw 50 that is connected to the arm body 46 and extends in the Y-axis direction, and a motor 52 that rotates the ball screw 50. The Y-axis movement mechanism 48 converts the rotational motion of the motor 52 into linear motion using the ball screw 50 and transmits it to the arm body 46, and moves the arm body 46 in the Y-axis direction along a pair of guide rails 54.

[0024] The transport arm 36 also includes a connecting portion 56 that selectively connects the first holding portion 32 and the second holding portion 34. As shown in FIG. 3, the connecting portion 56 has two through holes 58, into which bolts 60 are inserted. The first holding portion 32 is connected to the connecting portion 56 by screwing the two bolts 60 into the female threads 38b of the holding piece 38 of the first holding portion 32 (see FIG. 2). Alternatively, the second holding portion 34 is connected to the connecting portion 56 by screwing the two bolts 60 into the female threads 44b of the connecting piece 44 of the second holding portion 34 (see FIG. 4). In this way, the first and second holding portions 32 and 34 are selectively connected to the connecting portion 56. The connecting portion 56 has a lower surface formed with a recess (not shown) that fits the protrusion 38c of the holding piece 38 and the protrusion 44c of the connecting piece 44.

[0025] Furthermore, the transfer arm 36 is equipped with a Z-axis movement mechanism 62 that moves the connecting portion 56 in the Z-axis direction. The Z-axis movement mechanism 62 can be composed of, for example, a pair of air cylinders extending in the Z-axis direction.

[0026] As shown in FIG. 2, an air suction passage 64 and an air supply passage 66 are formed in the connecting portion 56 of the transfer arm 36. The air suction passage 64 is connected to a suction source 72 via a first pressure gauge 68 and a first valve 70. The air supply passage 66 is connected to an air source 78 via a second pressure gauge 74 and a second valve 76. When the first holding portion 32 is connected to the connecting portion 56, the air suction passage 64 is connected to the air suction port 38a of the first holding portion 32, while the air supply passage 66 is blocked by the holding piece 38 of the first holding portion 32. When the second holding portion 34 is connected to the connecting portion 56, the air supply passage 66 is connected to the air supply port 44a of the second holding portion 34, while the air suction passage 64 is blocked by the connecting piece 44 of the second holding portion 34.

[0027] (First conveying means 20) The first conveying means 20, like the second conveying means 24, includes a first holding section that sucks and holds the workpiece, a second holding section that holds the workpiece by suction force generated by the Bernoulli effect when air is sprayed, and a conveying arm equipped with a connecting section that selectively connects the first holding section and the second holding section. The configurations of the first and second holding sections and the connecting section in the first conveying means 20 may be the same as the configurations of the first and second holding sections 32, 34 and the connecting section 56 in the second conveying means 24.

[0028] The suction source and air source connected to the connecting portion of the first conveying means 20 may have the same configuration as the suction source 72 and air source 78 connected to the connecting portion of the second conveying means 24. However, the suction source 72 and air source 78 are not shared by the first and second conveying means 20 and 24, but are provided separately.

[0029] In the first transport means 20, the arm body of the transport arm and the drive mechanism for the arm body may be different from those of the second transport means 24. Specifically, in the first transport means 20 of this embodiment, the L-shaped arm body 80 is configured to be rotatable, and a rotation motor (not shown) for rotating the arm body 80 is provided instead of the Y-axis moving mechanism 48.

[0030] (82 single wafers) 6 shows a single wafer 82 as a workpiece that can be cut by the processing device 2. The wafer 82 is disk-shaped and can be made of an appropriate semiconductor material such as silicon. A surface 82a of the wafer 82 is partitioned into a plurality of rectangular regions by lattice-shaped division lines 84. A device 86 such as an IC or an LSI is formed in each of the rectangular regions.

[0031] (Frame unit) 7 shows a frame unit 88 as a workpiece that can be cut by the processing device 2. An annular frame 90 of the frame unit 88 has an opening 90a in the center for accommodating a wafer 82. In the frame unit 88, a back surface 82b of the wafer 82 is attached to a dicing tape 92, and an outer periphery of the dicing tape 92 is attached to the annular frame 90. That is, the wafer 82 is supported by the annular frame 90 via the dicing tape 92.

[0032] In the processing device 2 as described above, when cutting the wafer 82 of the frame unit 88, the first holding unit 32 is connected to the connecting part 56 of the first and second transport means 20, 24. When the first holding unit 32 is connected to the connecting part 56, the air suction path 64 is connected to the air suction port 38a of the first holding unit 32. Meanwhile, the air supply path 66 is blocked by the holding piece 38 of the first holding unit 32. Therefore, when the air source 78 is operated and the second valve 76 is opened, the pressure of the air supply path 66 increases because the air supply path 66 is blocked, and the value of the second pressure gauge 74 increases. This makes it possible to confirm that the first holding unit 32 suitable for transporting the frame unit 88 is connected to the connecting part 56.

[0033] When the frame unit 88 is held by the first holding part 32, the suction source 72 is operated and the first valve 70 is opened. Then, air is sucked from the suction pad 40 of the first holding part 32 through the air suction path 64. That is, a suction force is generated in the suction pad 40. This allows the annular frame 90 of the frame unit 88 to be sucked and held by the suction pad 40. Then, by operating the drive mechanism (the Y-axis movement mechanism 48 and the Z-axis movement mechanism 62 in the second transport means 24), the frame unit 88 sucked and held by the suction pad 40 can be transported.

[0034] On the other hand, in the above-described processing apparatus 2, when cutting a single wafer 82, the second holding unit 34 is connected to the connecting unit 56 of the first and second transport means 20, 24. When the second holding unit 34 is connected to the connecting unit 56, the air supply path 66 is connected to the air supply port 44a of the second holding unit 34. On the other hand, the air suction path 64 is blocked by the connecting piece 44 of the second holding unit 34. Therefore, when the suction source 72 is operated and the first valve 70 is opened, the air suction path 64 is blocked, so the pressure in the air suction path 64 decreases and the value of the first pressure gauge 68 decreases. This makes it possible to confirm that the second holding unit 34 suitable for transporting a single wafer 82 is connected to the connecting unit 56.

[0035] When a single wafer 82 is held by the second holding unit 34, the air source 78 is operated and the second valve 76 is opened. Then, air is ejected from the main part 42 of the second holding unit 34 via the air supply path 66, and a suction force is generated on the lower surface of the main part 42 by the Bernoulli effect. This makes it possible to hold the single wafer 82 by suction on the lower surface of the main part 42 of the second holding unit 34. Then, by operating the drive mechanism, the wafer 82 held by suction by the second holding unit 34 can be transported.

[0036] As described above, in the processing apparatus 2 of the illustrated embodiment, it is possible to check whether the transport means 8 is appropriate when transporting a frame unit 88 and when transporting a single wafer 82. Therefore, the operator will not forget to replace the transport means 8 or mix up the transport means 8. As a result, the problem of the workpiece falling off the transport means 8 or being unable to be transported while being transported by the transport means 8 (frame unit 88 or single wafer 82) is eliminated. [Explanation of symbols]

[0037] 2: Processing equipment 4: Chuck table 6:Cutting means 8: Means of transportation 32: First holding part 34: Second holding part 36: Transport arm 38a: Air suction port 44a: Air supply port 56:Connection part 64: Air suction passage 66: Air supply line 68: First pressure gauge 70: First valve 72: Suction source 74: Second pressure gauge 76: Second Valve 78: Air source 82: Wafer 82a: Surface of wafer 82b: Back side of wafer 88: Frame unit 90: Circular frame 90a: opening 92: Dicing tape

Claims

1. A processing device including a chuck table for holding a workpiece, cutting means for cutting the workpiece held on the chuck table, and transport means for transporting the workpiece to the chuck table or from the chuck table, The conveying means includes a first holding part that holds the workpiece by suction, a second holding part that holds the workpiece by suction force generated by the Bernoulli effect when air is injected, and a conveying arm having a connecting part that selectively connects the first holding part and the second holding part, an air suction port connected to the air suction passage of the connecting portion is formed in the first holding portion; an air supply port connected to the air supply path of the connecting portion is formed in the second holding portion; the air suction passage is connected to a suction source via a first pressure gauge and a first valve; the air supply line is connected to an air source via a second pressure gauge and a second valve; When the first holding part is connected to the connecting part, the air supply port is closed and the second valve is opened, so that the value of the second pressure gauge increases, and it can be confirmed that the first holding part is connected to the connecting part, When the second holding part is connected to the connecting part, the air suction port is closed and the first valve is opened, so that the value of the first pressure gauge decreases, thereby enabling confirmation that the second holding part is connected to the connecting part.

2. The workpiece is either a frame unit in which a wafer is supported by a tape on a frame having an opening in the center for accommodating the wafer, or a single wafer; 2. The processing apparatus according to claim 1, wherein the frame unit is held by the first holding portion, and the single wafer is held by the second holding portion.

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