Electro-optical device and electronic apparatus
Patent Information
- Application Number
- JP2023134878
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-08-22
- Publication Date
- 2025-03-07
Smart Images

Figure 2025029954000001_ABST
Abstract
Description
[Technical field]
[0001] The present invention relates to an electro-optical device and an electronic device. [Background technology]
[0002] 2. Description of the Related Art Electronic devices such as projectors use electro-optical devices such as liquid crystal display devices that can change optical characteristics for each pixel. One known example of such electro-optical devices is the electro-optical device described in Patent Document 1.
[0003] The electro-optical device described in Patent Document 1 has a display area in which a plurality of pixels are arranged, and a parting area located outside the display area. The electro-optical device also includes an element substrate, an opposing substrate facing the element substrate, and a liquid crystal layer disposed between these substrates. The opposing substrate also has a lens layer. A portion of the lens layer in the display area is provided with a plurality of lenses that are convex portions on a substantially ellipsoidal surface. A portion of the lens layer in the parting area is provided with a flat portion that is lower in height than the convex portions. The lens layer is formed by dry etching using a patterned resist layer as a protective film. [Prior art documents] [Patent documents]
[0004] [Patent Document 1] JP 2016-151735 A Summary of the Invention [Problem to be solved by the invention]
[0005] In dry etching, the etching rate varies depending on the plane area of the resist layer. Therefore, in order to adjust the etching rate, it is necessary to adjust the flow rate of the etching gas used. However, it is difficult to form a lens of the desired shape and to uniformize the shapes of multiple lenses by only adjusting the flow rate of the etching gas. In addition, depending on the flow rate of the etching gas, the shape of the lens may deteriorate. If the desired lens shape is formed, the optical characteristics such as transmittance or contrast may deteriorate. Therefore, the quality of the electro-optical device may deteriorate. [Means for solving the problem]
[0006] One embodiment of the electro-optical device of the present invention is an electro-optical device including a display area having a plurality of pixels and a peripheral area located outside the display area, and comprises a first substrate, a second substrate, and an electro-optical layer disposed between the first substrate and the second substrate, the optical properties of which change in response to an electric field, the first substrate or the second substrate comprising a substrate and a lens layer disposed between the substrate and the electro-optical layer, the lens layer comprising a plurality of first lenses provided in the display area and arranged corresponding to a plurality of pixels, and a plurality of second lenses provided in the peripheral area, the planar area being different from the planar area of each of the plurality of first lenses.
[0007] One embodiment of the electro-optical device of the present invention is an electro-optical device including a display area having a plurality of pixels and a peripheral area located outside the display area, and comprises a first substrate, a second substrate, and an electro-optical layer disposed between the first substrate and the second substrate, the optical properties of which change in response to an electric field, the first substrate or the second substrate comprising a substrate and a lens layer disposed between the substrate and the electro-optical layer, the lens layer comprising a plurality of first lenses provided in the display area and arranged corresponding to a plurality of pixels, and an insulating portion provided in the peripheral area, the height of which is equal to or greater than the height of the plurality of first lenses, and the insulating portion having a flat surface. [Brief description of the drawings]
[0008] [Figure 1] FIG. 1 is a plan view of an electro-optical device according to a first embodiment. [Diagram 2] 2 is a cross-sectional view taken along the line AA of the electro-optical device shown in FIG. [Diagram 3] 2 is an equivalent circuit diagram showing an electrical configuration of the first substrate in FIG. 1. [Figure 4] FIG. 3 is a plan view of the first substrate in FIG. 2. [Diagram 5] 5 is a cross-sectional view taken along line A1-A1 of FIG. 4. [Figure 6] FIG. 6 is a plan view of the lens layer shown in FIG. [Figure 7] 5 is a cross-sectional view taken along line A2-A2 of FIG. 4. [Figure 8] FIG. 7 is a plan view of the lens layer shown in FIG. [Figure 9] 6A to 6C are cross-sectional views illustrating a method for manufacturing the lens layer shown in FIG. 5. [Figure 10] 8A to 8C are cross-sectional views illustrating a method for manufacturing the lens layer shown in FIG. 7. [Figure 11] 5A to 5C are cross-sectional views illustrating a manufacturing method of the lens layer of the first comparative example. [Figure 12] 11A and 11B are cross-sectional views illustrating a manufacturing method of a lens layer in a second comparative example. [Figure 13] FIG. 11 is a cross-sectional view showing a lens layer according to a second embodiment. [Figure 14] FIG. 14 is a plan view of the lens layer shown in FIG. [Figure 15] 14A to 14C are cross-sectional views illustrating a method for manufacturing the lens layer shown in FIG. [Figure 16] FIG. 11 is a cross-sectional view showing a lens layer according to a third embodiment. [Figure 17] 17A to 17C are cross-sectional views illustrating a method for manufacturing the lens layer shown in FIG. [Figure 18] FIG. 1 is a perspective view showing a personal computer as an example of an electronic device. [Figure 19] FIG. 1 is a plan view showing a smartphone as an example of an electronic device. [Figure 20] FIG. 1 is a schematic diagram illustrating a projector as an example of an electronic device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0009] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. Note that the dimensions, scale, and arrangement of each part in the drawings may differ from the actual ones, and some parts are shown diagrammatically to facilitate understanding. Furthermore, the scope of the present invention is not limited to these forms unless otherwise specified in the following description to the effect that the present invention is limited thereto.
[0010] 1. Electro-optical device 1A. First embodiment 1A-1.Basic configuration FIG. 1 is a plan view of an electro-optical device 100 according to a first embodiment. FIG. 2 is a cross-sectional view of the electro-optical device 100 shown in FIG. 1 along line AA. In the following, for convenience of explanation, the mutually orthogonal X-axis, Y-axis, and Z-axis are appropriately used. Moreover, one direction along the X-axis is denoted as the X1 direction, and the direction opposite to the X1 direction is denoted as the X2 direction. Similarly, one direction along the Y-axis is denoted as the Y1 direction, and the direction opposite to the Y1 direction is denoted as the Y2 direction. One direction along the Z-axis is denoted as the Z1 direction, and the direction opposite to the Z1 direction is denoted as the Z2 direction.
[0011] In this specification, "element β on element α" means that element β is located above element α. Therefore, "element β on element α" includes not only the case where element β is in direct contact with element α, but also the case where element α and element β are separated. Furthermore, "electrical connection" between element α and element β includes a configuration in which element α and element β are electrically connected by being directly joined, as well as a configuration in which element α and element β are indirectly electrically connected via another conductor. Furthermore, "equal" includes cases in which there is a difference within the range of measurement error, in addition to cases in which they are strictly equal.
[0012] The electro-optical device 100 shown in Fig. 1 and Fig. 2 is a transmissive electro-optical device of an active matrix driving system. The electro-optical device 100 has a first substrate 2, a second substrate 3, a frame-shaped seal member 4, and a liquid crystal layer 5. As shown in Fig. 2, the first substrate 2, the liquid crystal layer 5, and the second substrate 3 are arranged in this order in the Z1 direction. Note that a "plan view" refers to a view from the Z1 direction or the Z2 direction in which these overlap. Also, although the shape of the electro-optical device 100 shown in Fig. 1 in a plan view is a rectangle, it may be a polygon other than a rectangle or a circle.
[0013] 2 includes a light-transmitting substrate 21, a light-transmitting laminate 20, a plurality of light-transmitting pixel electrodes 24, and a light-transmitting alignment film 29. The substrate 21, the laminate 20, the plurality of pixel electrodes 24, and the alignment film 29 are laminated in this order in the Z1 direction. "Light-transmitting" refers to transparency to visible light, and preferably refers to a visible light transmittance of 50% or more.
[0014] The substrate 21 is a flat plate having translucency and insulation, and is formed of, for example, a glass substrate or a quartz substrate. The laminate 20 includes a plurality of insulating films having translucency. The laminate 20 is also provided with a lens layer 25, a transistor 23, various wirings, and the like, which will be described later. The pixel electrodes 24 are used to apply an electric field to the liquid crystal layer 5. The pixel electrodes 24 include, for example, a transparent conductive material such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), and FTO (Fluorine-doped tin oxide). The alignment film 29 is also translucent and insulating. The alignment film 29 aligns the liquid crystal molecules of the liquid crystal layer 5. The alignment film 29 is disposed so as to cover the plurality of pixel electrodes 24. The material of the alignment film 29 is, for example, polyimide or silicon oxide.
[0015] The second substrate 3 is disposed opposite the first substrate 2. The second substrate 3 has a light-transmitting substrate 31, a light-transmitting inorganic insulating layer 32, a light-transmitting common electrode 33, and a light-transmitting alignment film 34. Although not shown, the second substrate 3 has a light-shielding partition surrounding the plurality of pixel electrodes 24 in a plan view. "Light-shielding property" refers to light-shielding property against visible light, and preferably refers to a visible light transmittance of less than 50%, and more preferably refers to 10% or less.
[0016] The substrate 31, the inorganic insulating layer 32, the common electrode 33, and the alignment film 34 are laminated in this order in the Z2 direction. The substrate 31 is a flat plate having translucency and insulation, and is composed of, for example, a glass substrate or a quartz substrate. The inorganic insulating layer 32 has translucency and insulation, and is formed of, for example, an inorganic material containing silicon, such as silicon oxide. The common electrode 33 is a counter electrode disposed with respect to the plurality of pixel electrodes 24 via the liquid crystal layer 5. The common electrode 33 is used to apply an electric field to the liquid crystal layer 5. The common electrode 33 has translucency and conductivity. The common electrode 33 includes, for example, a transparent conductive material, such as ITO, IZO, and FTO. The alignment film 34 has translucency and insulation. The alignment film 34 aligns the liquid crystal molecules of the liquid crystal layer 5. The material of the alignment film 34 is, for example, polyimide or silicon oxide.
[0017] The seal member 4 is disposed between the first substrate 2 and the second substrate 3. The seal member 4 is formed using an adhesive or the like containing various curable resins such as epoxy resin. The seal member 4 may contain a gap material made of an inorganic material such as glass.
[0018] The liquid crystal layer 5 is disposed within the region surrounded by the first substrate 2, the second substrate 3, and the seal member 4. The liquid crystal layer 5 is an electro-optical layer whose optical properties change in response to an electric field. The liquid crystal layer 5 contains liquid crystal molecules having positive or negative dielectric anisotropy. The orientation of the liquid crystal molecules changes in response to a voltage applied to the liquid crystal layer 5.
[0019] As shown in FIG. 1, a driving circuit 10 and a plurality of external terminals 13 are arranged on the first substrate 2. The driving circuit 10 includes two scanning line driving circuits 11 and a signal line driving circuit 12. Some of the plurality of external terminals 13 are connected to wiring (not shown) drawn from the driving circuit 10. The plurality of external terminals 13 also include a terminal to which a constant potential Vcom is applied. The terminal is electrically connected to a common electrode 33 of the second substrate 3 via wiring (not shown) and a plurality of conductive materials 15. Thus, the constant potential Vcom is supplied to the common electrode 33. Each conductive material 15 is provided at one of the four corners of the first substrate 2 in a plan view. Each conductive material 15 is used to electrically connect the first substrate 2 and the second substrate 3. Each conductive material 15 is, for example, a conductive adhesive containing a conductive material such as a metal such as silver.
[0020] The electro-optical device 100 has a display region A10 that displays an image, and a peripheral region A20 located outside the display region A10 in a planar view. A plurality of pixels P arranged in a matrix are provided in the display region A10. The pixels P are arranged in a matrix along the X-axis and the Y-axis. The pixels P are the smallest units that are independently controlled. A plurality of pixel electrodes 24 are arranged in a one-to-one relationship with the plurality of pixels P. A common electrode 33 is also provided in common to the plurality of pixels P. The peripheral region A20 surrounds the display region A10 in a planar view. The peripheral region A20 is a region between the outer edge of the electro-optical device 100 in a planar view and the display region A10. A scanning line driving circuit 11 and a signal line driving circuit 12 are arranged in the peripheral region A20.
[0021] In this embodiment, the electro-optical device 100 is a transmissive type. Specifically, as shown in Fig. 2, after light LL enters the second substrate 3, it is modulated while it is being emitted from the first substrate 2, thereby displaying an image. Note that the light that enters the first substrate 2 may be modulated while it is being emitted from the second substrate 3, thereby displaying an image.
[0022] The electro-optical device 100 is also applied to a display device that performs color display, such as a personal computer and a smartphone, which will be described later. When applied to such a display device, a color filter is appropriately used for the electro-optical device 100. The electro-optical device 100 is also applied to a projection-type projector, which will be described later. In this case, the electro-optical device 100 functions as a light valve. In this case, the color filter is omitted for the electro-optical device 100.
[0023] 1A-2. Electrical configuration of the first substrate 2 Fig. 3 is an equivalent circuit diagram showing the electrical configuration of the first substrate 2 in Fig. 1. As shown in Fig. 3, the first substrate 2 has a plurality of transistors 23, n scanning lines 241, m signal lines 242, and n constant potential lines 243. n and m are each an integer of 2 or more. The transistors 23 are arranged corresponding to each intersection of the n scanning lines 241 and the m signal lines 242. Each transistor 23 is, for example, a TFT (Thin Film Transistor) that functions as a switching element. Each transistor 23 includes a gate, a source, and a drain.
[0024] Each of the n scanning lines 241 extends in the X1 direction, and the n scanning lines 241 are arranged at equal intervals in the Y1 direction. Each of the n scanning lines 241 is electrically connected to the gates of the corresponding transistors 23. The n scanning lines 241 are electrically connected to the scanning line driving circuit 11 shown in Fig. 1. Scanning signals G1, G2, ..., and Gn are supplied line-sequentially to the 1st to nth scanning lines 241 from the scanning line driving circuit 11.
[0025] Each of the m signal lines 242 shown in Fig. 3 extends in the Y1 direction, and the m signal lines 242 are arranged at equal intervals in the X1 direction. Each of the m signal lines 242 is electrically connected to the sources of the corresponding transistors 23. The m signal lines 242 are electrically connected to the signal line drive circuit 12 shown in Fig. 1. Image signals S1, S2, ..., and Sm are supplied in parallel to the 1 to m signal lines 242 from the signal line drive circuit 12.
[0026] 3 are electrically insulated from each other and arranged in a lattice pattern in plan view. An area surrounded by two adjacent scanning lines 241 and two adjacent signal lines 242 corresponds to a pixel P. A transistor 23, a pixel electrode 24, and a capacitance element 240 are provided for each pixel P. The pixel electrodes 24 are provided in a one-to-one correspondence with the transistors 23. Each pixel electrode 24 is electrically connected to the drain of the corresponding transistor 23.
[0027] Each of the n constant potential lines 243 extends in the X1 direction, and the n constant potential lines 243 are arranged at equal intervals in the Y2 direction. The n constant potential lines 243 are electrically insulated from the n scanning lines 241 and the m signal lines 242, and are arranged at intervals from these lines. A constant potential Vcom is applied to each of the constant potential lines 243. Each of the n constant potential lines 243 is electrically connected to one of two electrodes of a corresponding capacitance element 240. Each capacitance element 240 is a capacitance element for holding the potential of the pixel electrode 24. The capacitance element 240 is provided in a one-to-one relationship with the transistor 23. The other of the two electrodes of each capacitance element 240 is electrically connected to the corresponding pixel electrode 24. Therefore, a constant potential Vcom is applied to one electrode of the capacitance element 240, and the other electrode is electrically connected to the drain of the transistor 23.
[0028] When the scanning signals G1, G2, ..., and Gn are successively activated and n scanning lines 241 are successively selected, the transistor 23 connected to the selected scanning line 241 is turned on. Then, image signals S1, S2, ..., and Sm having a magnitude corresponding to the gradation to be displayed are taken into the pixel P corresponding to the selected scanning line 241 via m signal lines 242 and applied to the pixel electrode 24. As a result, a voltage corresponding to the gradation to be displayed is applied to the liquid crystal capacitance formed between the pixel electrode 24 and the common electrode 33 in FIG. 2, and the orientation of the liquid crystal molecules changes according to the applied voltage. In addition, the applied voltage is held by the capacitance element 240. Such a change in the orientation of the liquid crystal molecules modulates light, enabling gradation display.
[0029] 1A-3. First board 2 Fig. 4 is a plan view of the first substrate 2 of Fig. 2. As shown in Fig. 4, the first substrate 2 has a plurality of inspection portions 14. Each inspection portion 14 is disposed in the peripheral area A20. Each inspection portion 14 is, for example, an inspection pad used for measuring the film thickness of the laminate 20, or an inspection pad used for inspecting the continuity of the electro-optical device 100. Each inspection portion 14 includes a material with high reflectivity, such as aluminum, or a material having electrical conductivity.
[0030] For example, when each inspection unit 14 is an inspection pad for measuring film thickness, each inspection unit 14 is used to measure the film thickness of each insulating layer of the laminate 20 during the manufacture of the laminate 20. Light is irradiated to each inspection unit 14, and the film thickness of a specific insulating layer of the laminate 20 is measured using the reflected light from each inspection unit 14, while polishing the surface of the specific insulating layer by CMP (Chemical Mechanical Polishing). Also, for example, when each inspection unit 14 is an inspection pad for inspecting continuity, each inspection unit 14 is used to inspect the function of the transistor 23 and whether there is any abnormality in the operation of the electro-optical device 100, such as short-circuiting of various wirings.
[0031] Although each inspection unit 14 is disposed outside the drive circuit 10 in a plan view, it may be disposed inside the drive circuit 10 in a plan view.
[0032] In addition to the plurality of inspection sections 14, the peripheral area A20 is also provided with the plurality of conductive materials 15, the drive circuit 10, and the plurality of external terminals 13, as described above.
[0033] Fig. 5 is a cross-sectional view taken along the line A1-A1 in Fig. 4. As shown in Fig. 5, the laminate 20 of the first substrate 2 includes an inorganic insulating layer 22, a lens layer 25, a light-transmitting layer 26, and a moisture-absorbing layer 27. The laminate 20, the lens layer 25, the light-transmitting layer 26, and the moisture-absorbing layer 27 are disposed between the substrate 21 and the liquid crystal layer 5, and are laminated in this order in the Z1 direction from the substrate 21.
[0034] The inorganic insulating layer 22 is a portion of the laminate 20 excluding the lens layer 25, the light-transmitting layer 26, and the moisture-absorbing layer 27, and includes a plurality of insulating films. The materials of the insulating films are inorganic materials containing silicon, such as silicon oxide and silicon oxynitride. The inorganic insulating layer 22 is provided with the transistor 23, the capacitance element 240, the scanning line 241, the signal line 242, the constant potential line 243, and other wirings, etc., shown in FIG. 3 described above.
[0035] A plurality of relay electrodes 244 and a relay electrode 281 are disposed on the inorganic insulating layer 22. The relay electrode 244 is provided for each pixel electrode 24. The relay electrode 244 is electrically connected to the drain of the transistor 23. The relay electrode 281 is provided in correspondence with the conductive material 15 in Fig. 1. A constant potential Vcom, for example, is applied to the relay electrode 281.
[0036] A lens layer 25 is disposed on the inorganic insulating layer 22 so as to cover the multiple relay electrodes 244 and the relay electrodes 281. A light-transmitting layer 26 is disposed on the lens layer 25. The lens layer 25 and the light-transmitting layer 26 have light-transmitting properties and insulating properties. The refractive index of the lens layer 25 is different from the refractive index of the light-transmitting layer 26. The material of each of the lens layer 25 and the light-transmitting layer 26 is, for example, an inorganic material containing silicon, such as silicon oxide or silicon oxynitride.
[0037] The surface of the light-transmitting layer 26 opposite to the lens layer 25 is a flat surface. The flat surface is formed by polishing, for example, by CMP or the like. A plurality of relay electrodes 245 and a plurality of relay electrodes 282 are disposed on the lens layer 25. The relay electrode 245 is provided for each pixel electrode 24. The relay electrode 245 is electrically connected to the relay electrode 244 via a contact 246. The contact 246 is a conductive plug that fills a through hole that penetrates the lens layer 25 and the light-transmitting layer 26. The relay electrode 282 is electrically connected to the relay electrode 281 via a plurality of contacts 283. The contact 283 is a conductive plug that fills a through hole that penetrates the lens layer 25 and the light-transmitting layer 26.
[0038] The contact 246 may be a trench-type wiring formed integrally with the relay electrode 245. However, it is very difficult to form a trench-type wiring to penetrate the lens layer 25 and the light-transmitting layer 26. For this reason, the contact 246 is preferably a conductive plug. By being a conductive plug, it is possible to reliably establish electrical continuity between the relay electrode 244 and the relay electrode 245 even in a through hole with a high aspect ratio. Similarly, the contact 283 may be a trench-type wiring formed integrally with the relay electrode 282, but is preferably a conductive plug.
[0039] Furthermore, a plurality of contacts 283 and a plurality of relay electrodes 282 are provided for one relay electrode 281, but one contact 283 and one relay electrode 282 may be provided for one relay electrode 281. Furthermore, there may be a plurality of relay electrodes 281, and a plurality of relay electrodes 281 may be provided corresponding to a plurality of contacts 283.
[0040] A hygroscopic layer 27 is disposed on the lens layer 25 so as to cover the plurality of relay electrodes 245 and the plurality of relay electrodes 282. The hygroscopic layer 27 has hygroscopic properties, and is provided to prevent moisture from penetrating into layers below the hygroscopic layer 27. The material of the hygroscopic layer 27 is, for example, borophosphosilicate glass (BPSG).
[0041] A plurality of pixel electrodes 24 and an electrode 28 are disposed on the moisture absorbing layer 27. The electrode 28 is provided in the same layer as the plurality of pixel electrodes 24. Although not shown, the aforementioned external terminal 13 is also provided in the same layer as the plurality of pixel electrodes 24.
[0042] Each pixel electrode 24 is electrically connected to the relay electrode 245 via a contact 247. The contact 247 is a conductive plug that fills a through hole penetrating the moisture absorption layer 27. The contact 247 may be a trench-type wiring that is formed integrally with the pixel electrode 24. The electrode 28 is electrically connected to the relay electrode 282 via a contact 284. The contact 284 is a conductive plug that fills a through hole penetrating the moisture absorption layer 27. The contact 284 may be a trench-type wiring that is formed integrally with the electrode 28.
[0043] Also, the relay electrode 245 and the contact 247 may be omitted. In this case, the pixel electrode 24 is electrically connected to the relay electrode 244 via the contact 246. Similarly, the relay electrode 282 and the contact 284 may be omitted. In this case, the electrode 28 is electrically connected to the relay electrode 281 via the contact 283. Also, in these cases, the moisture absorbing layer 27 may be omitted.
[0044] The alignment film 29 is disposed so as to cover the plurality of pixel electrodes 24. The alignment film 29 is disposed so as to expose the electrodes 28, and is not provided on the electrodes 28. The electrodes 28 are connected to the conductive material 15.
[0045] The materials of the relay electrodes 244, 245, 281, and 282 include, for example, metals such as tungsten (W), titanium (Ti), chromium (Cr), iron, and aluminum (Al), metal nitrides, and metal silicides. These may be single-layered or multi-layered. For example, they are composed of a multi-layered structure of an aluminum film and a titanium nitride film. The electrode 28 includes the above-mentioned metals, metal nitrides, metal silicides, or transparent conductive materials such as ITO, IZO, and FTO.
[0046] Each of the contacts 246, 247, 283, and 284 includes, for example, a metal such as tungsten, titanium, chromium, iron, and aluminum (Al), a metal nitride, and a metal silicide. Each of the contacts 246, 247, 283, and 284 may be a single layer or a multilayer. In particular, each of the contacts 246, 247, 283, and 284 preferably includes, for example, tungsten. By using tungsten, through holes with a high aspect ratio can be filled well.
[0047] Fig. 6 is a plan view of the lens layer 25 shown in Fig. 5. As shown in Fig. 5 and Fig. 6, the lens layer 25 includes a base 250, a plurality of first lenses 251, a plurality of second lenses 252, and a plurality of third lenses 253.
[0048] As shown in FIG. 5, the base 250 is a flat plate-like portion that contacts the inorganic insulating layer 22 and spreads in the XY plane. Each of the first lenses 251, the second lenses 252, and the third lenses 253 is a convex lens that protrudes from the base 250 in the Z1 direction. Each of the first lens 251, the second lens 252, and the third lens 253 is hemispherical and has a semicircular lens surface. The outer edges of the first lens 251, the second lens 252, and the third lens 253 in a plan view are circular, but may be rectangular. The outer edges in the plan view may be rectangular at the contact portion with the base 250 and may change to a circle on the way from the base 250 to the apex. In addition, the second lens 252 and the third lens 253 are lens-shaped convex portions having a curved surface, and may not have the function of converging or diverging light.
[0049] The multiple first lenses 251 are disposed in the display region A10. The multiple first lenses 251 are disposed in a matrix along the X-axis and Y-axis in a planar view. The multiple first lenses 251 are arranged at equal intervals. The first lenses 251 are provided for each pixel P. The first lenses 251 overlap the pixel electrodes 24 in a planar view. The first lenses 251, for example, converge light incident from the second substrate 3. By providing the first lenses 251, incidence of light on the transistors 23 provided in the inorganic insulating layer 22 is suppressed.
[0050] The second lenses 252 are arranged in the peripheral area A20. The second lenses 252 are arranged in a matrix along the X-axis and Y-axis in a plan view. The second lenses 252 are arranged at equal intervals. The second lenses 252 are provided to form the first lens 251 into a desired shape.
[0051] The plane area of the second lens 252 is different from the plane area of the first lens 251. The plane area is the area seen from the direction along the Z axis. The width W2 of the second lens 252 is different from the width W1 of the first lens 251. Each of the widths W1 and W2 is an average width in the direction along the X axis or the Y axis. Furthermore, the height T2 of the second lens 252 is equal to the height T1 of the first lens 251. Each of the heights T1 and T2 is a maximum length along the Z axis. Furthermore, the pitch P2 of the multiple second lenses 252 is equal to the pitch P1 of the multiple first lenses 251. Each of the pitches P1 and P2 is a center-to-center distance.
[0052] The multiple third lenses 253 are arranged in the peripheral region A20. The multiple third lenses 253 are arranged in a matrix along the X-axis and Y-axis in a planar view. The multiple third lenses 253 are arranged at equal intervals. The multiple third lenses 253 are arranged corresponding to the conductive material 15 and the electrodes 28. The multiple third lenses 253 overlap the conductive material 15 and the electrodes 28 in a planar view. The third lenses 253 are provided for each contact 283.
[0053] The plane area of the third lens 253 is equal to the plane area of the first lens 251. Specifically, the width W3 of the third lens 253 is equal to the width W1 of the first lens 251. The width W3 is the average width in the direction along the X-axis or Y-axis. Furthermore, the height T3 of the third lens 253 is equal to the height T1 of the first lens 251. The height T3 is the maximum length along the Z-axis. Furthermore, the pitch P3 of the multiple third lenses 253 is equal to the pitch P1 of the multiple first lenses 251. The pitch P3 is the center-to-center distance.
[0054] FIG. 7 is a cross-sectional view taken along the line A2-A2 in FIG. 4. FIG. 8 is a plan view of the lens layer 25 shown in FIG. 6. As shown in FIGS. 7 and 8, the lens layer 25 further has an insulating portion 254. The insulating portion 254 is a portion that protrudes from the base portion 250 in the Z1 direction. A surface 2541 of the insulating portion 254 in the Z1 direction is a flat surface along the XY plane. For example, the insulating portion 254 is provided along the outer edge of the first substrate 2. The planar area of the insulating portion 254 is larger than the planar area of the first lens 251.
[0055] Furthermore, the inspection section 14 is provided on the inorganic insulating layer 22. The inspection section 14 may be provided on the substrate 21 instead of on the inorganic insulating layer 22. The first lens 251, the second lens 252, the third lens 253, and the insulating section 254 are not provided in a portion of the lens layer 25 that overlaps with the inspection section 14 in a planar view. Only the base section 250 is disposed in this portion.
[0056] 1A-4. Manufacturing method of lens layer 25 Fig. 9 is a cross-sectional view for explaining a method for manufacturing lens layer 25 shown in Fig. 5. Fig. 10 is a cross-sectional view for explaining a method for manufacturing lens layer 25 shown in Fig. 7. First, lens substrate 25a, which is a base material of lens layer 25, is formed on inorganic insulating layer 22 by a plasma CVD (Chemical Vapor Deposition) method or the like. Next, resist is applied onto lens substrate 25a by spin coating or the like, and exposed and developed using a photomask, thereby forming resist layer 6.
[0057] As shown in FIG. 9, the resist layer 6 has a pattern corresponding to the first lens 251, the second lens 252, and the third lens 253. Specifically, the resist layer 6 includes a plurality of first portions 61, a plurality of second portions 62, and a plurality of third portions 63. The first portions 61 correspond to the first lens 251. The second portions 62 correspond to the second lens 252. The third portions 63 correspond to the third lens 253. Also, as shown in FIG. 10, the resist layer 6 has a pattern corresponding to the insulating portion 254. Specifically, the resist layer 6 has a fourth portion 64 corresponding to the insulating portion 254.
[0058] Next, the lens substrate 25a is dry-etched using the resist layer 6 as a protective film to form the lens layer 25. When the material of the lens layer 25 is an inorganic material containing silicon, the etching gas may be, for example, a mixed gas of CF4 (carbon tetrafluoride) and O2 (oxygen). The more O2, the faster the etching rate.
[0059] 1A-5. Effects of lens layer 25 As described above, the first lens 251 is provided in the display area A10 and is provided to change the traveling direction of light transmitted through the second substrate 3. In contrast, the second lens 252 is provided in the peripheral area A20 and does not contribute to the display of images in the display area A10. The second lens 252 is provided to form the first lens 251 into a desired shape. The plane area of the second lens 252 is different from the plane area of the first lens 251.
[0060] As described above, the first lens 251 is formed by dry etching using the resist layer 6 as a protective film. The etching rate varies depending on the plane area of the resist layer 6. For this reason, in order to adjust the etching rate, it is necessary to adjust the flow rate of the etching gas used in the dry etching. However, when a resist layer having a pattern corresponding only to the first lens 251 is used, it is difficult to form the first lens 251 in the desired shape or to uniform the shape of the multiple first lenses 251 by only adjusting the flow rate of the etching gas. In addition, depending on the flow rate of the etching gas, the shape of the first lens 251 may deteriorate.
[0061] In this embodiment, the second lens 252 is provided. Therefore, when forming the first lens 251, a resist layer 6 having a pattern corresponding to the first lens 251 and the second lens 252 is used. By providing the second lens 252, it is easier to adjust the plane area of the resist layer 6 compared to when the second lens 252 is not provided. Specifically, in order to obtain the first lens 251 of the desired shape, the pattern of the portion corresponding to the peripheral region A20 of the resist layer 6 can be adjusted. By using the resist layer 6 having the pattern corresponding to the first lens 251 and the second lens 252, it is possible to form the first lens 251 of the desired shape or to uniformize the shape of the multiple first lenses 251 without requiring advanced flow rate adjustment of the etching gas. Since the desired first lens 251 can be obtained, it is possible to suppress the deterioration of optical characteristics such as transmittance or contrast. Therefore, it is possible to suppress the deterioration of the quality of the electro-optical device 100.
[0062] FIG. 11 is a diagram showing a resist layer 6x for forming a lens layer 25x of the first comparative example. For example, consider a case where the second lens 252 is not provided in the peripheral region A20, and the lens layer 25x is formed in which the peripheral region A20 is only the base portion 250. In this case, the resist layer 6x is not provided in the peripheral region A20. Therefore, the aperture ratio of the resist layer 6 of the present embodiment shown in FIG. 9 is lower than the aperture ratio of the resist layer 6x of the first comparative example shown in FIG. 11. Therefore, in this embodiment, the region to be dry etched is reduced compared to the first comparative example. Therefore, in this embodiment, the etching rate for forming the first lens 251 is faster compared to the first comparative example. By increasing the etching rate of the first lens 251, it is easy to form the height T1 of the multiple first lenses 251 high. Therefore, it is easy to form the first lens 251 having the desired refractive index.
[0063] In addition, since the etching rate is increased, for example, when a mixed gas of CF4 and O2 is used as the etching gas, the flow rate of O2 can be reduced. By reducing the flow rate of O2, the etching rate of the first lens 251 is prevented from becoming excessively fast. Therefore, the variation in the shapes of the multiple first lenses 251 can be reduced.
[0064] 12 is a diagram showing a resist layer 6y for forming a lens layer 25y of a second comparative example. For example, consider the case of forming a lens layer 25y in which a first lens 251 is provided in the display region A10 and the peripheral region A20. In this case, in the resist layer 6y, a first portion 61 is provided in the entire display region A10 and the peripheral region A20.
[0065] As described above, the plane area of the second lens 252 is smaller than the plane area of the first lens 251. Therefore, the aperture ratio of the resist layer 6 of the present embodiment shown in FIG. 9 is higher than the aperture ratio of the resist layer 6y of the second comparative example shown in FIG. 12. Therefore, in the present embodiment, the area that is dry etched is increased compared to the second comparative example. Thus, in the embodiment, the etching rate for forming the first lens 251 is slower compared to the second comparative example. By slowing down the etching rate of the first lens 251, it is possible to reduce the variation in the shapes of the multiple first lenses 251.
[0066] By making the planar area of the second lens 252 smaller than the planar area of the first lens 251, it is possible to reduce variation in the shapes of the multiple first lenses 251, and it is easy to form first lenses 251 having the desired refractive index.
[0067] 6, the pitch P2 of the second lenses 252 is equal to the pitch P1 of the first lenses 251. By making the pitch P2 equal to the pitch P1, it is possible to reduce the variation in the shape of the first lenses 251 caused by unevenness in the etching gas over the entire lens layer 25. This makes it possible to reduce the variation in the shape of the first lenses 251. Note that the pitch P2 may be different from the pitch P1.
[0068] In addition, since the multiple second lenses 252 are used to make the first lenses 251 have a desired shape, they do not have to be arranged at equal intervals in a matrix, and may be arranged randomly. However, by arranging them at equal intervals in a matrix, it is possible to reduce the variation in the shape of the multiple first lenses 251 caused by unevenness in the etching gas over the entire lens layer 25, compared to the case where they are arranged randomly. In addition, each of the multiple second lenses 252 does not have to have the same shape. However, it is preferable that they have the same shape so that the variation in the shape of the multiple first lenses 251 caused by unevenness in the etching gas over the entire lens layer 25 can be reduced.
[0069] As described above, the display region A10 is provided with a plurality of contacts 246 that connect the plurality of pixel electrodes 24 and the plurality of first lenses 251. Each of the contacts 246 shown in FIG. 5 is a conductive plug that penetrates the lens layer 25 and the light-transmitting layer 26.
[0070] The contacts 246 are formed after the lens layer 25 and the light-transmitting layer 26 are formed. When the contacts 246 are formed, a heat treatment is performed. The shape of the first lens 251 may change due to the heat treatment. In particular, when each contact 246 contains tungsten, the heat treatment temperature of the contacts 246 is about 400°C. In contrast, when the lens layer 25 is formed by, for example, a plasma CVD method, the film formation temperature is about 200°C. Compared to the film formation temperature of 200°C, the heat treatment temperature of the contacts 246, 400°C, is high. For this reason, it is preferable to form the lens layer 25 at the heat treatment temperature when the contacts 246 are formed, so as to suppress the shape change of the first lens 251 due to the heat treatment when the contacts 246 are formed.
[0071] When the deposition temperature of the lens layer 25 is increased, the etching rate tends to decrease. Therefore, the height of the first lens 251 is likely to be low. Therefore, when the deposition temperature of the lens layer 25 is set to the deposition temperature of the contact 246, the height T1 of the first lens 251 is likely to be high compared to the second comparative example by making the plane area of the second lens 252 smaller than the plane area of the first lens 251. Therefore, it is easy to form the first lens 251 having the desired refractive index. Note that, if the second lens 252 is not provided, it is difficult to sufficiently suppress the variation in the shape of the multiple first lenses 251.
[0072] As described above, the lens layer 25 has a plurality of third lenses 253. The planar area of the third lenses 253 is equal to the planar area of the first lenses 251. The contacts 283 have the same shape as the contacts 247. For this reason, the contacts 283 are easier to form than when the contacts 283 have a different shape from the contacts 247. Therefore, it is preferable that the third lenses 253 also have a planar area equal to the planar area of the first lenses 251 from the viewpoint of ease of formation.
[0073] 7, the lens layer 25 has an insulating portion 254. A surface 2541 of the insulating portion 254 is flat. The insulating portion 254 is provided in the peripheral region A20. A height T4 of the insulating portion 254 is equal to or greater than a height T1 of the first lenses 251. The insulating portion 254 is formed by dry etching using the fourth portion 64 of the resist layer 6 as a protective portion. Therefore, the insulating portion 254 is a portion that is not removed by etching from the lens substrate 25a.
[0074] Providing the insulating portion 254 in addition to the second lens 252 may make it easier to form the first lens 251 into a desired shape. Providing the insulating portion 254 reduces the aperture ratio of the resist layer 6 compared to when the insulating portion 254 is not provided. Therefore, the etching rate for forming the first lens 251 can be increased, and the variation in the shapes of the multiple first lenses 251 can be reduced.
[0075] The third lens 253 and the insulating portion 254 may be omitted. The planar areas of the second lenses 252 are all the same, but may be different.
[0076] As described above, by adjusting the aperture ratio of the resist layer 6 in the peripheral region A20, it is possible to form the desired first lens 251 without requiring advanced adjustment of the flow rate of the etching gas. In addition, it is possible to prevent deterioration of the shape of the first lens 251 due to an increase in the flow rate of the etching gas.
[0077] Furthermore, lenses such as the first lens 251, the second lens 252, and the third lens 253 are not provided in the portion of the lens layer 25 that overlaps with the inspection unit 14 in a planar view. By not providing lenses in this portion, for example, when measuring the film thickness of a specific insulating layer in the laminate 20 using reflected light from the inspection unit 14, the reflected light is prevented from being refracted by the lens. This makes it possible to prevent a decrease in the accuracy of film thickness measurement using the inspection unit 14.
[0078] In this embodiment, the second lens 252 is not provided in the portion of the peripheral region A20 that overlaps with the conductive material 15 and the external terminal 13 in a planar view. As described above, the third lens 253 is preferably provided in the portion that overlaps with the conductive material 15 in a planar view. Similarly, the third lens 253 is preferably provided in the portion that overlaps with the external terminal 13 in a planar view. The external terminal 13 is provided in the same layer as the pixel electrode 24, and is electrically connected to wiring and the like provided in the inorganic insulating layer 22 by a conductive plug that penetrates the lens layer 25 and the light-transmitting layer 26. For this reason, from the viewpoint of ease of manufacture, the third lens 253 is preferably provided in the portion that overlaps with the external terminal 13 in a planar view.
[0079] 4, the third lens 253 is disposed in a portion of the peripheral region A20 that overlaps with the plurality of conductive materials 15 and the plurality of external terminals 13 in a planar view. Also, the insulating portion 254 is disposed in a portion of the peripheral region A20 that is outwardly positioned in a planar view from the plurality of conductive materials 15 and the plurality of external terminals 13. And the second lens 252 is disposed in a portion of the peripheral region A20 excluding the plurality of conductive materials 15, the plurality of external terminals 13, and the regions outwardly positioned therefrom.
[0080] In other words, the peripheral region A20 has a first peripheral region in which the second lens 252 is provided, a second peripheral region in which the insulating portion 254 is provided, a third peripheral region in which the third lens 253 is provided, and a fourth peripheral region in which the first lens 251, the second lens 252, the third lens 253, and the insulating portion 254 are not provided. In this embodiment, as described above, the inspection portion 14 is arranged in the fourth peripheral region.
[0081] 1B. Second embodiment A second embodiment will be described. In the following examples, elements having the same functions as those in the first embodiment will be designated by the same reference numerals as those in the first embodiment, and detailed descriptions thereof will be omitted as appropriate.
[0082] Fig. 13 is a cross-sectional view showing a lens layer 25A of the second embodiment. Fig. 14 is a plan view of the lens layer 25A shown in Fig. 13. Fig. 15 is a cross-sectional view for explaining a manufacturing method of the lens layer 25A shown in Fig. 13. In the second embodiment, the lens layer 25A is provided instead of the lens layer 25.
[0083] 13 and 14, in the lens layer 25A, the planar area of the second lens 252A is different from the planar area of the second lens 252 in the first embodiment. Specifically, the planar area of the second lens 252A is larger than the planar area of the first lens 251. The width W2 of the second lens 252A is larger than the width W1 of the first lens 251. In addition, the height T2 of the multiple second lenses 252A is equal to the height T1.
[0084] As shown in FIG. 15, the resist layer 6A has a second portion 62A with a width larger than the plane area of the second portion 62 in the first embodiment. Therefore, the aperture ratio of the resist layer 6A is lower than that of the resist layer 6 in the first embodiment. Therefore, in the second embodiment, the area to be dry etched is reduced compared to the first embodiment and the second comparative example. Therefore, in the second embodiment, the etching rate for forming the first lens 251 can be made faster compared to the first embodiment and the second comparative example. Therefore, in the second embodiment, the height T1 of the multiple first lenses 251 is easily formed to be high compared to the first embodiment and the second comparative example. Therefore, it is easy to form the first lens 251 having the desired refractive index.
[0085] It is difficult to change the heights T1, T2, and T3 with one resist layer 6. Therefore, when the planar area of the second lens 252A is larger than the planar area of the first lens 251, the pitch P2 of the multiple second lenses 252 is different from the pitch P1 of the multiple first lenses 251. Specifically, the pitch P2 is larger than the pitch P1.
[0086] 1C. Third embodiment A third embodiment will be described. In the following examples, elements having the same functions as those in the first embodiment will be designated by the same reference numerals as those in the first embodiment, and detailed descriptions thereof will be omitted as appropriate.
[0087] Fig. 16 is a cross-sectional view showing lens layer 25B of the third embodiment. Fig. 17 is a cross-sectional view for explaining a manufacturing method of lens layer 25B shown in Fig. 16. In the third embodiment, lens layer 25B is provided instead of lens layer 25.
[0088] 16, in the lens layer 25B, an insulating portion 255 is provided instead of the second lens 252. The insulating portion 255 is a portion that protrudes from the base portion 250 in the Z1 direction. A surface 2551 of the insulating portion 254 in the Z1 direction is a flat surface along the XY plane. The plane area of the insulating portion 255 is larger than the plane area of the first lens 251.
[0089] As shown in FIG. 17, the resist layer 6B has an insulating portion 255 with a planar area larger than the total planar area of the plurality of second portions 62 in the first embodiment. Therefore, the aperture ratio of the resist layer 6B is lower than that of the resist layer 6 in the first embodiment. Therefore, in the second embodiment, the area to be dry etched is reduced compared to the first embodiment and the second comparative example. Therefore, in the third embodiment, the etching rate for forming the first lens 251 can be made faster compared to the first embodiment and the second comparative example. Therefore, in the third embodiment, the height T1 of the number of first lenses 251 can be easily formed higher compared to the first embodiment and the second comparative example. Therefore, it is easy to form the first lens 251 having the desired refractive index.
[0090] 1D. Variations The above-described embodiment may be modified in various ways. Specific modified aspects that may be applied to the above-described embodiment are illustrated below. Two or more aspects selected from the following examples may be combined as appropriate to the extent that they are not mutually contradictory.
[0091] In the above-described embodiment, the first substrate 2 has a "lens layer", but the second substrate 3 may have a "lens layer". In this case, for example, the "lens layer" is provided on the inorganic insulating layer 32. Even if the second substrate 3 is a "lens layer", a "first lens" is provided in the display region A10, and a "second lens" is provided in the peripheral region A20.
[0092] In each of the above-described embodiments, the electro-optical device 100 is an active matrix type, but the driving method of the electro-optical device 100 is not limited to this, and may be, for example, a passive matrix type or the like.
[0093] The driving method of the "electro-optical device" is not limited to the vertical electric field method, but may be a horizontal electric field method. The horizontal electric field method may be, for example, an IPS (In-Plane Switching) mode. The vertical electric field method may be, for example, a TN (Twisted Nematic) mode, a VA (Vertical Alignment), a PVA mode, or an OCB (Optically Compensated Bend) mode.
[0094] 2.Electronic equipment The electro-optical device 100 can be used in various electronic devices.
[0095] 18 is a perspective view showing a personal computer 2000, which is an example of an electronic device. The personal computer 2000 has an electro-optical device 100 that displays various images, a main body 2010 on which a power switch 2001 and a keyboard 2002 are installed, and a control unit 2003. The control unit 2003 includes, for example, a processor and a memory, and controls the operation of the electro-optical device 100.
[0096] 19 is a plan view showing a smartphone 3000 as an example of an electronic device. The smartphone 3000 has an operation button 3001, an electro-optical device 100 that displays various images, and a control unit 3002. The screen content displayed on the electro-optical device 100 changes in response to an operation of the operation button 3001. The control unit 3002 includes, for example, a processor and a memory, and controls the operation of the electro-optical device 100.
[0097] 20 is a schematic diagram showing a projector, which is an example of an electronic device. The projection display device 4000 is, for example, a three-plate projector. The electro-optical device 1r is an electro-optical device 100 corresponding to a red display color, the electro-optical device 1g is an electro-optical device 100 corresponding to a green display color, and the electro-optical device 1b is an electro-optical device 100 corresponding to a blue display color. That is, the projection display device 4000 has three electro-optical devices 1r, 1g, and 1b corresponding to red, green, and blue display colors, respectively. The control unit 4005 includes, for example, a processor and a memory, and controls the operation of the electro-optical device 100.
[0098] The illumination optical system 4001 supplies a red component r of light emitted from an illumination device 4002, which is a light source, to an electro-optical device 1r, a green component g to an electro-optical device 1g, and a blue component b to an electro-optical device 1b. Each of the electro-optical devices 1r, 1g, and 1b functions as an optical modulator such as a light valve that modulates each monochromatic light supplied from the illumination optical system 4001 according to a display image. The projection optical system 4003 combines the light emitted from each of the electro-optical devices 1r, 1g, and 1b and projects the combined light onto a projection surface 4004.
[0099] The above electronic devices include the electro-optical device 100 described above and the control unit 2003, 3002, or 4005. The electro-optical device 100 described above is prevented from deteriorating in optical characteristics. This reduces the risk of display defects. Thus, by including the electro-optical device 100, the display quality of the personal computer 2000, the smartphone 3000, or the projection display device 4000 can be improved.
[0100] Note that electronic devices to which the electro-optical device of the present invention can be applied are not limited to the exemplified devices, and examples thereof include PDAs (Personal Digital Assistants), digital still cameras, televisions, video cameras, car navigation devices, in-vehicle displays, electronic organizers, electronic paper, calculators, word processors, workstations, videophones, and POS (Point of Sale) terminals, etc. Furthermore, examples of electronic devices to which the present invention can be applied include printers, scanners, copiers, video players, and devices equipped with touch panels, etc.
[0101] Although the present invention has been described based on the preferred embodiment, the present invention is not limited to the above embodiment. Furthermore, the configuration of each part of the present invention can be replaced with any configuration that exhibits the same function as the above embodiment, and any configuration can be added.
[0102] In the above description, a liquid crystal display device has been described as an example of the electro-optical device of the present invention, but the electro-optical device of the present invention is not limited to this. For example, the electro-optical device of the present invention can also be applied to an image sensor, etc. [Explanation of symbols]
[0103] 2...first substrate, 3...second substrate, 4...sealing member, 5...liquid crystal layer, 6...resist layer, 14...inspection section, 15...conductive material, 21...substrate, 23...transistor, 24...pixel electrode, 25...lens layer, 28...electrode, 100...electro-optical device, 246...contact, 247...contact, 250...base, 251...first lens, 252...second lens, 253...third lens, 254...insulating section, 255...insulating section, 283...contact, 284...contact, 2541...surface, A10...display area, A20...peripheral area, P...pixel, P1...pitch, P2...pitch, P3...pitch, T1...height, T2...height, T3...height, T4...height.
Claims
1. 1. An electro-optical device including a display area having a plurality of pixels and a peripheral area located outside the display area, a first substrate, a second substrate, and an electro-optic layer disposed between the first substrate and the second substrate, the electro-optic layer having optical properties that change in response to an electric field; The first substrate or the second substrate is A substrate; a lens layer disposed between the substrate and the electro-optic layer; The lens layer is a plurality of first lenses provided in the display area and arranged corresponding to a plurality of pixels; and a plurality of second lenses provided in the peripheral region and having a planar area different from each of the planar areas of the plurality of first lenses. Electro-optical device.
2. A planar area of each of the second lenses is smaller than a planar area of each of the first lenses.
2. The electro-optical device according to claim 1.
3. the pitch of the second lenses is equal to the pitch of the first lenses; 3. The electro-optical device according to claim 2.
4. A planar area of each of the second lenses is larger than a planar area of each of the first lenses.
2. The electro-optical device according to claim 1.
5. The insulating portion is provided in the peripheral region, has a height equal to or greater than the height of the first lenses, and has a flat surface. The electro-optical device according to claim 1 .
6. 1. An electro-optical device including a display area having a plurality of pixels and a peripheral area located outside the display area, a first substrate, a second substrate, and an electro-optic layer disposed between the first substrate and the second substrate, the electro-optic layer having optical properties that change in response to an electric field; The first substrate or the second substrate is A substrate; a lens layer disposed between the substrate and the electro-optic layer; The lens layer is a plurality of first lenses provided in the display area and arranged corresponding to a plurality of pixels; an insulating portion provided in the peripheral region, the insulating portion being equal to or greater than the height of the first lenses and having a flat surface; Electro-optical device.
7. a plurality of pixel electrodes provided in the display region and corresponding to the plurality of first lenses; a plurality of contacts connecting the plurality of pixel electrodes and the plurality of first lenses; the plurality of contacts extend through the lens layer; 7. The electro-optical device according to claim 1 or 6.
8. each of the plurality of contacts comprises tungsten; 8. The electro-optical device according to claim 7.
9. A plurality of pixel electrodes corresponding to the plurality of pixels; an electrode provided in the same layer as the plurality of pixel electrodes; and a plurality of third lenses provided in the peripheral region and having a planar area equal to each of the planar areas of the plurality of first lenses.
7. The electro-optical device according to claim 1 or 6.
10. The electro-optical device according to claim 1 or 6; and a control unit for controlling an operation of the electro-optical device.
Citation Information
Patent Citations
Lens array substrate, electro-optic device, electronic apparatus, and method for manufacturing lens array substrate
JP2016151735A