Display device and manufacturing method therefor

Abstract

To provide a display device manufactured using fewer masks.SOLUTION: A display device disclosed herein comprises a base substrate having a display area including a plurality of pixels and a non-display area near the display area, a first dam provided on the base substrate in the non-display area, a second dam provided on the base substrate in the non-display area and positioned between the first dam and the display area, a touch conductive layer provided on the first dam and the second dam, and a touch sensor layer including a touch organic layer provided on the touch conductive layer, where the touch organic layer ends inside the first dam, and the first dam and the second dam contain the same material.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present specification relates to a display device and a manufacturing method thereof. [Background technology]

[0002] 2. Description of the Related Art With the advancement of the information society, various demands for display devices that display images are increasing, and various types of display devices such as liquid crystal displays and organic light emitting diode displays are being used.

[0003] The display device includes a display panel and a touch sensor layer, which may be attached to the display panel as a separate layer from the display panel, or may be disposed directly on the display panel.

[0004] Recently, there have been efforts to reduce the number of masks used in manufacturing display devices including a display panel and a touch sensor layer. Summary of the Invention [Problem to be solved by the invention]

[0005] The problem to be solved by this specification is to provide a display device manufactured using a reduced number of masks.

[0006] The problems to be solved by the present specification are not limited to those described above, and other technical problems can be inferred from the following embodiments. [Means for solving the problem]

[0007] A display device according to one embodiment for solving the above problem includes a base substrate including a display region including a plurality of pixels and a non-display region surrounding the display region, a first dam disposed on the base substrate in the non-display region, a second dam disposed on the base substrate in the non-display region and between the first dam and the display region, a touch conductive layer disposed on the first dam and the second dam, and a touch sensor layer including a touch organic layer on the touch conductive layer, wherein the touch organic layer terminates inside the first dam, and the first dam and the second dam include the same material.

[0008] A display device according to another embodiment for solving the above problem includes a display area including a plurality of pixels and a non-display area located on the periphery of the display area, the non-display area including a first dam portion surrounding the display area and a second dam portion surrounding the display area and between the first dam portion and the display area, the first dam portion including a main dam portion having a first separation distance from the second dam portion and a protruding dam portion having a second separation distance from the second dam portion that is greater than the first separation distance. Effect of the Invention

[0009] According to the embodiment, when manufacturing a display device, one of the multiple touch organic layers in a conventional touch sensor layer can be omitted, thereby reducing the number of masks and simplifying the manufacturing process.

[0010] Meanwhile, the one touch organic layer includes a dam for preventing overflow to the pad portion of the other touch organic layer. According to the embodiment, the one touch organic layer is omitted, so that the dam can be formed using at least one of the organic layers of the display panel. That is, the laminated structure of the display device is simplified, and by forming a dam for preventing overflow to the pad portion of the other touch organic layer using at least one of the organic layers of the display panel, overflow to the pad portion of the other touch organic layer can be prevented.

[0011] According to the embodiment, when manufacturing a display device, the number of masks is reduced and the process is simplified, thereby optimizing the process.

[0012] However, the effects obtained in this specification are not limited to those described above, and other effects not mentioned will be clearly understood by those having ordinary skill in the art to which this specification pertains from the following description. [Brief description of the drawings]

[0013] [Figure 1] 1 is a schematic cross-sectional view of a display device according to an embodiment. [Diagram 2] FIG. 2 is a plan view of the display device according to FIG. [Diagram 3] 2 is a cross-sectional view showing a bent state of the display device according to FIG. 1; [Figure 4] FIG. 3 is a more detailed plan view of the display device according to FIG. [Diagram 5] FIG. 5 is an enlarged plan view of region A in FIG. [Figure 6] 3 is a cross-sectional view taken along line II' in FIG. 2. [Figure 7] 2A to 2C are cross-sectional views illustrating respective process steps of a manufacturing method of a display device according to an embodiment. [Figure 8] 2A to 2C are cross-sectional views illustrating respective process steps of a manufacturing method of a display device according to an embodiment. [Figure 9] FIG. 11 is a cross-sectional view of a display device according to another embodiment. [Figure 10] FIG. 11 is a cross-sectional view of a display device according to still another embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, embodiments will be described with reference to the drawings. In this specification, when a component (or a region, layer, portion, etc.) is referred to as being "on," "connected," or "coupled" to another component, it means that it may be directly connected / coupled to the other component, or a third component may be disposed therebetween.

[0015] The same reference numerals refer to the same components. In the drawings, the thickness, ratio, and size of the components are exaggerated for the purpose of effectively explaining the technical contents. "And / or" includes all combinations of one or more that can define the associated configuration.

[0016] Terms such as first and second can be used to describe various components, but the components are not limited by the terms. The terms are used only to distinguish one component from another. For example, the first component may be called the second component, and the second component may be called the first component, without departing from the scope of the present embodiment. A singular expression includes a plural expression unless otherwise clearly specified in the context.

[0017] Terms such as "under", "below", "up" and "above" are used to describe the relative relationships of features shown in the drawings. The above terms are relative concepts and are described with reference to the directions shown in the drawings.

[0018] It should be understood that terms such as "comprise" or "have" are intended to specify the presence of features, numbers, steps, operations, components, parts, or combinations thereof set forth in the specification, but do not preclude the possible presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0019] FIG. 1 is a schematic cross-sectional view of a display device according to an embodiment.

[0020] Referring to FIG. 1, a display device 1 according to an embodiment may include a display panel 100 and a touch sensor layer 200 on the display panel 100. The display panel 100 may include a substrate unit SUB, a circuit element layer CEL on the substrate unit SUB, an organic element layer EL on the circuit element layer CEL, a thin-film encapsulation layer TFE on the organic element layer EL, and a touch sensor layer 200 on the thin-film encapsulation layer TFE. In an embodiment, the display panel 100 may be an organic light-emitting display panel including the organic element layer EL. However, the present invention is not limited thereto, and the display panel 100 may be a liquid crystal display panel or an inorganic light-emitting display panel. The following description will be focused on the display panel 100 being an organic light-emitting display panel.

[0021] The display device 1 may include a display area DA and a non-display area NDA around the display area DA. The display area DA includes a plurality of pixels and can generate an image. The non-display area NDA may not generate an image. The non-display area NDA may not include pixels, but is not limited to this.

[0022] The display device 1 may further include a sensing area SA and a non-sensing area NSA around the sensing area SA. The sensing area SA and the non-sensing area NSA may correspond to the display area DA and the non-display area NDA, respectively, and may have the same area, but are not limited thereto. The sensing area SA may be an area in which touch electrodes TE and RE, which will be described later with reference to FIG. 4, are arranged, and the non-sensing area NSA may include a touch line TL connected to the touch electrodes TE and RE, and a touch pad TPAD connected to the touch line TL, etc.

[0023] The substrate portion SUB, the circuit element layer CEL, the organic element layer EL, the thin film encapsulation layer TFE, and the touch sensor layer 200 will be described later.

[0024] FIG. 2 is a plan view of the display device according to FIG.

[0025] 2, the planar shape of the display area DA may be a rectangle. However, the planar shape of the display area DA is not limited to this, and may be a square, a circle, an ellipse, or another polygon. For example, the display area DA may be a rectangle with rounded corners, but is not limited to this, and may be a rectangle with corners.

[0026] In the embodiment, the first direction DR1 and the second direction DR2 are different directions and intersect with each other, for example, they indicate a direction that intersects perpendicularly on a plan view. The third direction (see DR3 in FIG. 3) is a direction that intersects with a plane on which the first direction DR1 and the second direction DR2 are placed, for example, they indicate a direction that intersects perpendicularly with both the first direction DR1 and the second direction DR2. In FIG. 2, the first direction DR1 is approximately the same as the extension direction of the short side of the display panel 100, the second direction DR2 is the same as the extension direction of the long side of the display panel 100, and the third direction DR3 may be the same as the stacking direction of the substrate part SUB, the circuit element layer CEL, the organic element layer EL, the thin film encapsulation layer TFE, and the touch sensor layer 200 in FIG. 1. However, it should be understood that the directions mentioned in the embodiment refer to relative directions, and the embodiment is not limited to the mentioned directions.

[0027] The display area DA may include a short side extending along a first direction DR1 and a long side extending along a second direction DR2. The non-display area NDA may surround the display area DA. The non-display area NDA may be disposed on one side of the display area DA in the first direction DR1, the other side of the first direction DR1, one side of the display area DA in the second direction DR2, and the other side of the second direction DR2.

[0028] The non-display area NDA located on the other side of the display area DA in the second direction DR2 may further extend from a central portion of the other side of the display area DA in the second direction DR2 in the other direction of the second direction DR2. The width in the first direction DR1 of the non-display area NDA further extending from the central portion of the other side of the display area DA in the second direction DR2 in the other direction of the second direction DR2 in the other direction of the display area DA may be smaller than the width in the first direction DR1 of the non-display area NDA adjacent to the other side of the display area DA in the second direction DR2.

[0029] The display device 1 may include a main region MR, a sub-region SR, and a curved region BR between the main region MR and the sub-region SR. The display region DA and the non-display region NDA surrounding the display region DA on all four sides constitute the main region MR, and a portion extending from a center of the other side of the display region DA in the second direction DR2 to the other side of the second direction DR2 may constitute the curved region BR and the sub-region SR. The curved region BR may be disposed between the sub-region SR and the main region MR. The sub-region SR may include a first pad region PA1 and a second pad region PA2 located at an end of the other side of the sub-region SR in the second direction DR2. The display device 1 may further include a data driver 300 and a printed circuit board 500. The data driver 300 may be disposed in the first pad region PA1, and the printed circuit board 500 may be attached to the second pad region PA2. A plurality of pads connected to the data driver 300 and the printed circuit board 500 may be disposed in the first pad area PA1 and the second pad area PA2, respectively. The data driver 300 may be formed in the form of, for example, but not limited to, a driving chip (IC). In the embodiment, the data driver 300 is disposed in a chip on plastic manner directly mounted on the display panel 100, but is not limited to this, and may be disposed in a chip on glass manner or a chip on film manner.

[0030] As described in Fig. 1, the display area DA may include a plurality of pixels PX. The plurality of pixels PX may be connected to scan lines SL and data lines DL, respectively. In addition to the scan lines SL and data lines DL, the pixels PX may also include high-voltage power lines, low-voltage power lines, or various lines and capacitors in the art.

[0031] The display device 1 according to the embodiment may further include a first dam portion DP1 and a second dam portion DP2. The first dam portion DP1 and the second dam portion DP2 may each surround the display area DA. The first dam portion DP1 and the second dam portion DP2 may each have a closed loop shape that completely surrounds the display area DA. The second dam portion DP2 may be disposed between the first dam portion DP1 and the display area DA. The second dam portion DP2 may be disposed between the display area DA and a bending area BR described later.

[0032] The first dam part DP1 and the second dam part DP2 may be disposed in the non-display area NDA. For example, the second dam part DP2 may be disposed in the non-display area NDA adjacent to the display area DA and disposed in the main area MR. The first dam part DP1 may be disposed outside the second dam part DP2 and surround the second dam part DP2. The second dam part DP2 may include a main dam part DP1a, a protruding dam part DP1b, and a connecting dam part DP1c. The main dam part DP1a may be disposed in the non-display area NDA that is usually disposed adjacent to one side of the first direction DR1 of the display area DA, the other side of the first direction DR1, and one side of the second direction DR2. The main dam part DP1a may be disposed up to the periphery of the non-display area NDA adjacent to the other side of the second direction DR2 of the display area DA. The non-display area NDA arranged adjacent to one side of the display area DA in the first direction DR1, the other side of the display area DA in the first direction DR1, and one side of the display area DA in the second direction DR2, and the main dam part DP1a arranged in the peripheral part of the non-display area NDA adjacent to the other side of the display area DA in the second direction DR2 may be integrally formed. The main dam part DP1a may be arranged in the main area MR.

[0033] The protruding dam portion DP1b may be disposed in the bending region BR, and may not be disposed in the main region MR. That is, the main dam portion DP1a and the second dam portion DP2 may be disposed to have a first separation distance d1, and the protruding dam portion DP1b and the second dam portion DP2 may be disposed to have a second separation distance d2 larger than the first separation distance d1. The main dam portion DP1a and the protruding dam portion DP1b may be connected via the connection dam portion DP1c. The connection dam portion DP1c may be disposed across the bending region BR and the main region MR, but is not limited thereto. That is, when the protruding dam portion DP1b is disposed in the bending region BR so as to be adjacent to the boundary between the bending region BR and the main region MR, the connection dam portion DP1c may be disposed only in the main region MR.

[0034] In some embodiments, the protruding dam portion DP1b may be disposed in the main region MR.

[0035] In some embodiments, the second separation distance d2 may be the same as the first separation distance d1.

[0036] FIG. 3 is a cross-sectional view showing the display device according to FIG. 1 in a bent state.

[0037] 3, the bent region BR of the display panel 100 of the display device 1 according to an embodiment may be bent in a thickness direction (or a third direction DR3). As a result, the main region MR and the sub-region SR may overlap in the thickness direction. The display panel 100 may be bent such that a lower surface of the main region MR and an upper surface of the sub-region SR face each other. A printed circuit board 500 may be attached to an end of the sub-region SR.

[0038] Fig. 4 is a more detailed plan view of the display device according to Fig. 2. Fig. 5 is an enlarged plan view of region A of Fig. 4. Fig. 4 is a detailed view of the touch sensor layer (see 200 in Fig. 1), the touch line TL connected to the touch sensor layer 200, and the touch pad TPAD in the plan view of the display device 1 according to Fig. 2.

[0039] 4 and 5, the touch sensor layer 200 may include a plurality of touch electrodes TE, RE for sensing a user's touch by a capacitance method, and a touch line TL connecting the plurality of touch electrodes TE, RE to the touch pad TPAD. For example, the touch sensor layer 200 may sense a user's touch by a self-capacitance method or a mutual capacitance method.

[0040] A plurality of touch electrodes TE; 240_T, RE; 240_B may be arranged in the sensing area SA.

[0041] The plurality of touch electrodes TE;240_T, RE;240_B can form mutual capacitance or self-capacitance to sense the touch of an object or a person. The plurality of touch electrodes TE;240_T, RE;240_B may include a plurality of drive electrodes TE;240_T and a plurality of sense electrodes RE;240_B.

[0042] The plurality of driving electrodes TE;240_T may be arranged in a first direction DR1 and a second direction DR2. The plurality of driving electrodes TE;240_T may be spaced apart from each other in the first direction DR1 and the second direction DR2. The driving electrodes TE;240_T adjacent to each other in the second direction DR2 may be electrically connected via the bridge electrode 220_B.

[0043] The multiple sensing electrodes RE;240_B may extend in a first direction DR1 and be spaced apart from each other in a second direction DR2. The multiple sensing electrodes RE;240_B may be arranged in the first direction DR1 and the second direction DR2, and the sensing electrodes RE;240_B adjacent to each other in the first direction DR1 may be electrically connected via the connection portion 240_B.

[0044] The plurality of driving electrodes TE; 240_T and the sensing electrodes RE; 240_R may be connected to the plurality of touch pads TPAD via touch lines TL, respectively.

[0045] The bridge electrode 220_B may be disposed in a layer different from the plurality of driving electrodes TE;240_T and the plurality of sensing electrodes RE;240_R. The sensing electrodes RE;240_R adjacent to each other in the first direction DR1 may be electrically connected to each other through a connection portion 240_B disposed in the same layer as the plurality of driving electrodes TE;240_T or the plurality of sensing electrodes RE;240_R, and the driving electrodes TE;240_T adjacent to each other in the second direction DR2 may be electrically connected to each other through a bridge electrode 220_B disposed in a layer different from the plurality of driving electrodes TE;240_T or the plurality of sensing electrodes RE;240_R. Therefore, even if the bridge electrode 220_B overlaps with the plurality of sensing electrodes RE;240_R in the third direction DR3, the plurality of driving electrodes TE;240_T and the plurality of sensing electrodes RE;240_R can be insulated from each other. A mutual capacitance may be formed between the driving electrodes TE;240_T and the sensing electrodes RE;240_R.

[0046] FIG. 6 is a cross-sectional view taken along line II' in FIG.

[0047] Referring to Figure 6, the display device 1 may include a substrate portion SUB, a circuit element layer CEL on the substrate portion SUB, an organic element layer EL on the circuit element layer CEL, a thin-film encapsulation layer TFE on the organic element layer EL, and a touch sensor layer 200 on the thin-film encapsulation layer TFE.

[0048] The substrate unit SUB may include a base substrate 101. The base substrate 101 may support each layer disposed thereon. The base substrate 101 may be disposed across the display area DA and the non-display area NDA. The base substrate 101 may be made of an insulating material such as a polymer resin. Examples of the polymer material include polyethersulphone (PES), polyacrylate (PA), polyarylate (PAR), polyetherimide (PEI), polyethylene napthalate (PEN), polyethylene terepthalate (PET), polyphenylene sulfide (PPS), polyarylate, polyimide (PI), polycarbonate (PC), cellulose triacetate (CAT), cellulose acetate propionate (CAP), or a combination thereof. The base substrate 101 may be a flexible substrate that allows bending, folding, rolling, etc. An example of a material for a flexible substrate is polyimide (PI), but is not limited thereto. The base substrate 101 may be a rigid substrate made of glass, quartz, etc.

[0049] The circuit element layer CEL may be disposed on the substrate part SUB. The circuit element layer CEL may include a semiconductor layer 105, a gate insulating layer 111 on the semiconductor layer 105, a gate conductive layer including a gate electrode GE on the gate insulating layer 111, a first interlayer insulating layer 112 on the first conductive layer, a first source drain conductive layer 130 including a source electrode 131, a drain electrode 133, and a first touch pad portion TPAD1 of the touch pad TPAD on the first interlayer insulating layer 112, a second interlayer insulating layer 141 on the first source drain conductive layer 130, a connection electrode 151 on the second interlayer insulating layer 141, a second source drain conductive layer 150 including a second touch pad portion TPAD2 of the touch pad TPAD, and a bent bridge electrode CL, and a planarization layer 161 on the second source drain conductive layer 150, and a first organic layer 160 including a second lower dam DAM21.

[0050] The organic element layer EL may include an organic light emitting element OLED including an anode electrode ANO, an organic layer OL, and a cathode electrode CAT on the first organic layer 160, and a second organic layer 170 including a bank layer 171, a second upper dam DAM22, and a first dam DAM1.

[0051] The thin film encapsulation layer TFE may include a first sealing inorganic layer 181 on the organic element layer EL, a sealing organic layer 182 on the first sealing inorganic layer 181 , and a second sealing inorganic layer 183 on the sealing organic layer 182 .

[0052] The touch sensor layer 200 may include a touch buffer layer 210 on the thin film encapsulation layer TFE, a first touch conductive layer 220 including a bridge electrode 220_B on the touch buffer layer 210 and a first touch line portion TL1 of the touch line TL, a touch insulation layer 230 on the first touch conductive layer 220, a second touch conductive layer 240 including a drive electrode 240_T on the touch insulation layer 230, a second touch line portion TL2 of the touch line TL, and a third touch pad portion TPAD3 of the touch pad TPAD, and a touch organic layer 250 on the second touch conductive layer 240.

[0053] A buffer layer may be disposed on the base substrate 101. The buffer layer can prevent impurity ions from diffusing and can prevent the penetration of moisture and outside air.

[0054] Alternatively, the buffer layer may include multiple layers, i.e., the buffer layer may be made of at least one alternating layer of silicon nitride (SiNx) and silicon oxide (SiOx).

[0055] A semiconductor layer 105 may be disposed in the display area DA on the buffer layer. The semiconductor layer 105 may include polycrystalline silicon. The semiconductor layer 105 may include a channel region, a source region, and a drain region. The polycrystalline silicon may be formed by crystallizing amorphous silicon. Examples of the crystallization method include, but are not limited to, a rapid thermal annealing (RTA) method, a solid phase crystallization (SPC) method, an excimer laser annealing (ELA) method, a metal induced crystallization (MIC) method, a metal induced lateral crystallization (MILC) method, and a sequential lateral solidification (SLS) method.

[0056] A gate insulating layer 111 may be disposed on the semiconductor layer 105. The gate insulating layer 111 may be generally disposed across the display area DA and the non-display area NDA. The gate insulating layer 111 may be a gate insulating film having a gate insulating function. The gate insulating layer 111 may include a silicon compound, a metal oxide, etc. For example, the gate insulating layer 111 may include silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, titanium oxide, etc. These may be used alone or in combination with each other. In the drawings, the gate insulating layer 111 is shown as being made of a single film, but in some cases, the gate insulating layer 111 may be a multi-layer film made of stacked films of different materials.

[0057] A gate conductive layer may be disposed on the gate insulating layer 111 .

[0058] In one embodiment, the gate conductive layer may include a gate electrode GE. Further, the gate conductive layer may further include a scanning signal line that transmits a scanning signal to the gate electrode GE. The gate electrode GE may be disposed so as to overlap with a channel region of the semiconductor layer 105.

[0059] The gate conductive layer may include one or more metals selected from molybdenum (Mo), aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), titanium (Ti), tantalum (Ta), tungsten (W), and copper (Cu). Although the drawings show only the case where the gate conductive layer is a single film, the gate conductive layer may be formed as a multilayer film in some cases. In this case, the multilayer film of the gate conductive layer may be formed as a stacked film of different metals from the above-mentioned metals.

[0060] A first interlayer insulating layer 112 may be disposed on the gate conductive layer. The first interlayer insulating layer 112 may be disposed across the display area DA and the non-display area NDA.

[0061] The first interlayer insulating layer 112 can insulate the gate conductive layer from the first source-drain conductive layer 130. The first interlayer insulating layer 112 may be an interlayer insulating film.

[0062] The first interlayer insulating layer 112 may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, hafnium oxide, aluminum oxide, titanium oxide, tantalum oxide, or zinc oxide, or an organic insulating material such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, an unsaturated polyester resin, a polyphenylene resin, a polyphenylenesulfides resin, or a benzocyclobutene (BCB). In the drawings, the first interlayer insulating layer 112 is illustrated as a single film, but is not limited thereto and may be a multilayer film made of stacked films containing different materials.

[0063] A first source drain conductive layer 130 may be disposed on the first interlayer insulating layer 112. The first source drain conductive layer 130 may include a source electrode 131, a drain electrode 133, and a first touch pad unit TPAD1. The source electrode 131 may be connected to a source region of the semiconductor layer 105, and the drain electrode 133 may be connected to a drain region of the semiconductor layer 105. The first touch pad unit TPAD1 may be disposed in the second pad area PA2. The first source drain conductive layer 130 may include aluminum (Al), copper (Cu), titanium (Ti), or the like, and may be formed as a multilayer or single layer. In one embodiment, the first source drain conductive layer 130 may have a multilayer structure of Ti / Al / Ti, but is not limited thereto. The source electrode 131, the drain electrode 133, and the first touch pad unit TPAD1 may include the same material and be formed by the same process.

[0064] A second interlayer insulating layer 141 may be disposed on the first source drain conductive layer 130. The second interlayer insulating layer 141 may be disposed in the display area DA and the non-display area NDA. In the non-display area NDA, the second interlayer insulating layer 141 may be disposed in the bending area BR, and may also be disposed in a part of the main area MR and the sub-area SR adjacent to the bending area BR. The second interlayer insulating layer 141 may include an organic insulating material such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, an unsaturated polyester resin, a polyphenylene resin, a polyphenylenesulfide resin, or benzocyclobutene (BCB).

[0065] A second source drain conductive layer 150 may be disposed on the second interlayer insulating layer 141. The second source drain conductive layer 150 may include a connection electrode 151 connected to the drain electrode 133, a second touch pad portion TPAD2 disposed on the first touch pad portion TPAD1 and directly disposed on the first touch pad portion TPAD1, and a curved bridge electrode CL connected to the touch line TL around the curved region BR and passing through the curved region BR. The second source drain conductive layer 150 may include aluminum (Al), copper (Cu), titanium (Ti), etc., and may be formed as a multilayer or single layer. In one embodiment, the second source drain conductive layer 150 may have a multilayer structure of Ti / Al / Ti, but is not limited thereto. The connection electrode 151, the second touch pad portion TPAD2, and the curved bridge electrode CL may include the same material and be formed by the same process.

[0066] A first organic layer 160 may be disposed on the second source / drain conductive layer 150. The first organic layer 160 may include a planarization layer 161 and a second lower dam DAM21.

[0067] The first organic layer 160 may include an organic insulating material such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, an unsaturated polyester resin, a polyphenylene resin, a polyphenylenesulfides resin, or benzocyclobutene (BCB). The planarization layer 161 and the second lower dam DAM21 may include the same material and be formed by the same process.

[0068] The planarization layer 161 may be disposed in the display region DA, the bending region BR, and the sub-region SR. In the display region DA, the planarization layer 161 may be disposed on the connection electrodes 151 and the second interlayer insulating layer 141. In the bending region BR, the planarization layer 161 may be disposed on the bending bridge electrodes CL and the second interlayer insulating layer 141. In the sub-region SR, the planarization layer 161 may be disposed on the first interlayer insulating layer 112.

[0069] The second lower dam DAM21 can constitute a second dam DAM2 together with the second upper dam DAM22.

[0070] The anode electrode ANO may be disposed on the planarization layer 161 in the display area DA. The anode electrode ANO may be electrically connected to the connection electrode 151 through the planarization layer 161. The connection electrode 151 can electrically connect the anode electrode ANO and the drain electrode 133.

[0071] A second organic layer 170 may be disposed on the anode electrode ANO. The second organic layer 170 may include a bank layer 171, a second upper dam DAM22, and a first dam DAM1.

[0072] The second organic layer 170 may include an organic insulating material such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, an unsaturated polyester resin, a polyphenylene resin, a polyphenylenesulfides resin, or benzocyclobutene (BCB). The bank layer 171, the second upper dam DAM22, and the first dam DAM1 may include the same material and be formed by the same process.

[0073] The bank layer 171 is disposed in the display area DA, and can expose a part of the upper surface of the anode electrode ANO. The bank layer 171 can define a light-emitting area by exposing the center part of the upper surface of the anode electrode ANO. In the display area DA, the area where the bank layer 171 is disposed can be defined as a non-light-emitting area.

[0074] The second upper dam DAM22 may be disposed on the second lower dam DAM21. The second upper dam DAM22 may overlap the second lower dam DAM21 in the thickness direction. The width of the second upper dam DAM22 is larger than the width of the second lower dam DAM21, and the second upper dam DAM22 can cover even the side surfaces of the second lower dam DAM21.

[0075] The second dam DAM2 may include a second lower dam DAM21 and a second upper dam DAM22, and one or more of the second dams DAM2 may be provided. FIG. 6 illustrates an example in which there are two second dams DAM2. Two or more second dams DAM2 may be disposed apart from each other. One or more second dams DAM2 may be disposed in the second dam portion DP2. The second dam DAM2 may prevent the sealing organic layer 182 of the thin film sealing layer TFE described later from flooding the bending region BR. For example, the sealing organic layer 182 may be terminated at the second dam DAM2 located on the outer side of the two second dams DAM2. As a result, the sealing organic layer 182 does not extend to the bending region BR and does not overlap at all with the structure located in the bending region BR. The sealing organic layer 182 may not overlap the first dam DAM1.

[0076] The first dam DAM1 may be disposed in the bending region BR. The first dam DAM1 may be disposed in the first dam portion DP1. One or more first dams DAM1 may be provided. FIG. 6 illustrates an example in which there are two first dams DAM1. Two or more first dams DAM1 may be disposed in the first dam portion DP1. The first dam DAM1 may prevent the touch organic layer 250 described later from overflowing into the sub-region SR. For example, the touch organic layer 250 may terminate at the first dam DAM1 located on the outer side of the two first dams DAM1. As a result, the touch organic layer 250 does not extend to the sub-region SR and does not overlap at all with the structure located in the sub-region SR. The first dam DAM1 may be disposed on the second interlayer insulating layer 141 and the planarization layer 161. The first dam DAM1 may be disposed to overlap the second interlayer insulating layer 141 and the planarization layer 161.

[0077] In some embodiments, a spacer may be further disposed on the second organic layer 170. The spacer may include at least one of the materials exemplified for the second organic layer 170. In some embodiments, at least one of the first dam DAM1 and the second dam DAM2 may be formed to further include the spacer. For example, the first dam DAM1 may have a structure in which the spacer is stacked on the first dam DAM1 in FIG. 6, and the second dam DAM2 may have a structure in which the second lower dam DAM21, the second upper dam DAM22, and the spacer are stacked.

[0078] For example, the first dam DAM1 and the second dam DAM2 may have various stacked structures. In some embodiments, the first dam DAM1 may have a structure in which the first dam DAM1 of FIG. 6 is stacked with a lower planarization layer 161. In this case, the planarization layer 161 may be patterned like the first dam DAM1, and the patterned planarization layer 161 may be stacked with the first dam DAM1 of FIG. 6 to form the first dam.

[0079] In some embodiments, the second dam DAM2 may not include the second lower dam DAM21 and may be formed only by the second upper dam DAM22.

[0080] In some embodiments, the second dam DAM2 may be formed only by the second lower dam DAM21 without including the second upper dam DAM22.

[0081] An upper surface of the first dam DAM1 may have a first surface height H1 from the base substrate 101, and an upper surface of the second dam DAM2 may have a second surface height H2 from the base substrate 101. The first surface height H1 may be greater than the second surface height H2. The first surface height H1 may be greater than the second surface height H2 by, but is not limited to, the thickness of the first dam DAM1.

[0082] An organic layer OL may be disposed on the upper surface of the anode electrode ANO and in the openings of the bank layer 171. In the drawing, the organic layer OL is shown to be disposed only in the openings of the bank layer 171, but is not limited thereto, and the organic layer OL may be disposed extending from the openings of the bank layer 171 to the upper surface of the bank layer 171.

[0083] The organic layer OL may include an organic light-emitting layer, a hole injection / transport layer, and an electron injection / transport layer.

[0084] A cathode electrode CAT is disposed on the organic layer OL and the bank layer 171. The cathode electrode CAT may be a common electrode disposed across a plurality of pixels PX in the display area DA. The organic layer OL, the anode electrode ANO, and the cathode electrode CAT may form an organic light emitting element OLED.

[0085] A thin-film encapsulation layer TFE is disposed on the cathode electrode CAT. The thin-film encapsulation layer TFE can cover the organic light-emitting element OLED. The thin-film encapsulation layer TFE can be a laminated film in which an inorganic film and an organic film are alternately laminated. For example, the thin-film encapsulation layer TFE can include a first encapsulation inorganic layer 181, an encapsulation organic layer 182, and a second encapsulation inorganic layer 183, which are sequentially laminated. The encapsulation inorganic layers 181 and 183 can include an inorganic material. The encapsulation organic layer 182 can include an organic material. The encapsulation organic layer 182 can be terminated inside the second dam DAM2 without flooding the bending region BR due to the second dam DAM2. In the second dam portion DP2, the second encapsulation inorganic layer 183 can be in direct contact with the first encapsulation inorganic layer 181. For example, since the encapsulation organic layer 182 is terminated inside the second dam DAM2, the encapsulation organic layer 182 is not disposed on the second dam DAM2. On the second dam DAM2, the second sealing inorganic layer 183 may be in direct contact with the first sealing inorganic layer 181.

[0086] The sealing inorganic layers 181 and 183 may be disposed not only in the display area DA but also in the non-display area NDA. The sealing inorganic layers 181 and 183 may be disposed in the bending area BR and the sub-area SR, but not in the second pad area PA2, exposing the second touch pad part TPAD2.

[0087] On the thin film encapsulation layer TFE, a touch sensor layer 200 may be disposed. On the second encapsulation inorganic layer 183, a touch buffer layer 210 may be disposed.

[0088] A touch sensor layer 790 may be disposed on the encapsulation layer 780. In the touch sensor layer 790, the touch buffer layer 210 may be located between the touch sensor metal including the touch electrode connecting lines 792, 794 and the touch electrodes 795, 796 and the cathode electrode 773 of the light emitting element (OLED).

[0089] The touch buffer layer 210 can prevent a chemical solution (such as a developer or an etchant) used in a manufacturing process of the touch electrodes 240_T and 240_R disposed on the touch buffer layer 210 or moisture from the outside from penetrating into the organic light emitting element OLED including the organic layer. Thus, the touch buffer layer 210 can prevent damage to the organic light emitting element OLED, which is vulnerable to chemical solutions or moisture. The touch buffer layer 210 may include an inorganic material or an organic material. The touch buffer layer 210 extends from the display area DA to the bending area BR and the sub-area SR, and can expose the second touch pad part TPAD2 in the second pad area PA2.

[0090] A first touch conductive layer 220 may be disposed on the touch buffer layer 210. The first touch conductive layer 220 may include a bridge electrode 220_B and a first touch line portion TL1. The bridge electrode 220_B is disposed in the sensing area SA (or the display area DA) and can electrically connect adjacent driving electrodes 240_T. The bridge electrode 220_B may be insulated from the connection portion 240_B by the touch insulating layer 230.

[0091] In Figure 6, as an example, the bridge electrode 220_B is shown to electrically connect adjacent drive electrodes 240_T, but this is not limited to the above, and the bridge electrode 220_B may electrically connect adjacent sensing electrodes 240_R, and the connection portion 240_B may electrically connect adjacent drive electrodes 240_T.

[0092] A first touch line portion TL1 may be disposed in the display area DA and the non-display area NDA. The first touch line portion TL1 may be electrically connected to the sensing electrode 240_R or the driving electrode 240_T. The first touch line portion TL1 may extend to the bending area BR through the second dam portion DP2. The first touch line portion TL1 may constitute a touch line TL together with the second touch line portion TL2 and may play a role in electrically connecting the touch electrodes 240_T, 240_R to the touch pad TPAD.

[0093] A touch insulating layer 230 may be disposed on the first touch conductive layer 220. The touch insulating layer 230 may include an inorganic material. The touch insulating layer 230 extends from the display area DA to the bending area BR and the sub-area SR, but in the second pad area PA2, the second touch pad part TPAD2 may be exposed.

[0094] A second touch conductive layer 240 may be disposed on the touch insulating layer 230. The second touch conductive layer 240 may include a driving electrode 240_T, a second touch line portion TL2, and a third touch pad portion TPAD3.

[0095] The second touch line portion TL2 may include a 2-1 touch line portion TL2a and a 2-2 touch line portion TL2b. The 2-1 touch line portion TL2a may overlap the first touch line portion TL1 in the thickness direction. The 2-1 touch line portion TL2a may be disposed in a part of the main region MR and the bending region BR. The 2-1 touch line portion TL2a may be electrically connected to the first touch line portion TL1 through a third contact hole CT3 penetrating the touch insulating layer 230 in the thickness direction. The 2-1 touch line portion TL2a may be electrically connected to the first touch line portion TL1 through the third contact hole CT3 penetrating the touch insulating layer 230 in the thickness direction, thereby reducing the resistance of the touch line TL. The third contact hole CT3 may be located on the second dam portion DP2, but is not limited thereto. The 2-1 touch line portion TL1a may be electrically connected to the bending bridge electrode CL in the bending region BR. The 2-1 touch line portion TL1a may be electrically connected to the bent bridge electrode CL through a first contact hole CT1 penetrating the touch insulating layer 230, the touch buffer layer 210, the second sealing inorganic layer 183, the first sealing inorganic layer 181, and the planarization layer 161. The first contact hole CT1 may be disposed in the bending region BR, but is not limited thereto. The first contact hole CT1 may be disposed between the second dam DAM2 and the first dam DAM1. The 2-2 touch line portion TL2b may be disposed in a part of the bending region BR and in the sub-region SR. The 2-2 touch line portion TL2b may be electrically connected to the bent bridge electrode CL in the bending region BR. The 2-2 touch line portion TL2b may be electrically connected to the bent bridge electrode CL through a second contact hole CT2 penetrating the touch insulating layer 230, the touch buffer layer 210, the second sealing inorganic layer 183, the first sealing inorganic layer 181, and the planarization layer 161. The second contact hole CT2 may be disposed in the bent region BR, but is not limited to this. The second contact hole CT2 may be disposed between the first dam DAM1 and the touch pad TPAD.

[0096] The touch line TL according to an embodiment may include a first touch line portion TL1, a second touch line portion TL2, and a curved bridge electrode CL. The touch line TL includes the curved bridge electrode CL having a material that is more flexible than the first and second touch line portions TL1 and TL2 in the bending region BR, thereby preventing breakage or cracks of the touch line TL due to bending.

[0097] The 2-2 touch line portion TL2b may be connected to the third touchpad portion TPAD3 in the second pad area PA2. The third touchpad portion TPAD3 may overlap the second touchpad portion TPAD2 in the thickness direction and be disposed directly on the second touchpad portion TPAD2. The third touchpad portion TPAD3 may be disposed not only on the upper surface of the second touchpad portion TPAD2 but also on a side surface of the second touchpad portion TPAD2. The third touchpad portion TPAD3 may also be in direct contact with the outer periphery of the upper surface of the first touchpad portion TPAD1 where the second touchpad portion TPAD2 is exposed, but is not limited thereto.

[0098] The touch organic layer 250 may be disposed on the second touch conductive layer 240. The touch organic layer 250 may be formed on the second touch conductive layer 240 by an inkjet method. In the process of forming the touch organic layer 250 on the second touch conductive layer 240 by an inkjet method, the touch organic layer 250 may overflow into the sub-region SR, and a dam other than the second dam DAM2 may be required to prevent this. Conventionally, a dam for preventing overflow of the touch organic layer 250 in the first dam portion DP1 is formed by using another organic layer between the touch organic layer 250 and the second touch conductive layer 240. However, in this case, a process of forming another organic layer and a process of forming a dam using the another organic layer as a mask are added, which complicates the process of the display device 1. However, in the display device 1 according to the embodiment, the first dam DAM1 is formed in the process of forming the second upper dam DAM22 of the second dam DAM2 without forming the separate organic layer, so that the process of forming the separate organic layer and the process of forming the dam using the separate organic layer as a mask can be omitted. This reduces the number of masks and simplifies the manufacture of the display device 1. The touch organic layer 250 is disposed in the main region MR and the bending region BR, and can be terminated inside the first dam DAM1.

[0099] Hereinafter, a method for manufacturing the display device 1 will be described. When describing the method for manufacturing the display device according to Fig. 7 and Fig. 8, reference will also be made to Fig. 6. When describing the method for manufacturing the display device based on Fig. 7 and Fig. 8, duplicated descriptions of the configuration of the display device 1 already described in Fig. 6 can be omitted, and the manufacturing steps of the configuration of the display device 1 already described can be performed in the stacking order of the display device 1.

[0100] 7 and 8 are cross-sectional views illustrating respective process steps of a method for manufacturing a display device according to an embodiment.

[0101] 6 to 8, first, as shown in FIG 7, a first organic layer 160 is formed on the second source / drain conductive layer 150. The first organic layer 160 may include a planarization layer 161 and a second lower dam DAM21.

[0102] The first organic layer 160 may include an organic insulating material such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, an unsaturated polyester resin, a polyphenylene resin, a polyphenylenesulfides resin, or benzocyclobutene (BCB). The planarization layer 161 and the second lower dam DAM21 may include the same material and be formed by the same process.

[0103] The planarization layer 161 may be disposed in the display region DA, the bending region BR, and the sub-region SR. In the display region DA, the planarization layer 161 may be disposed on the connection electrodes 151 and the second interlayer insulating layer 141. In the bending region BR, the planarization layer 161 may be disposed on the bending bridge electrodes CL and the second interlayer insulating layer 141. In the sub-region SR, the planarization layer 161 may be disposed on the first interlayer insulating layer 112.

[0104] The second lower dam DAM21 can constitute a second dam DAM2 together with the second upper dam DAM22.

[0105] As shown in FIG. 8, after the first organic layer 160 is formed, the second organic layer 170 is formed.

[0106] The second organic layer 170 may include an organic insulating material such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, an unsaturated polyester resin, a polyphenylene resin, a polyphenylenesulfides resin, or benzocyclobutene (BCB). The bank layer 171, the second upper dam DAM22, and the first dam DAM1 may include the same material and be formed by the same process.

[0107] The bank layer 171 is disposed in the display area DA, and can expose a part of the upper surface of the anode electrode ANO. The bank layer 171 can define a light-emitting area by exposing the center part of the upper surface of the anode electrode ANO. In the display area DA, the area where the bank layer 171 is disposed can be defined as a non-light-emitting area.

[0108] The second upper dam DAM22 may be disposed on the second lower dam DAM21. The second upper dam DAM22 may overlap the second lower dam DAM21 in the thickness direction. The width of the second upper dam DAM22 is larger than the width of the second lower dam DAM21, and the second upper dam DAM22 can cover even the side surfaces of the second lower dam DAM21.

[0109] The second dam DAM2 may include a second lower dam DAM21 and a second upper dam DAM22, and one or more second dams DAM2 may be provided. FIG. 6 illustrates an example in which there are two second dams DAM2. Two or more second dams DAM2 may be arranged at a distance from each other. Two or more second dams DAM2 may be arranged in the second dam portion DP2. The second dam DAM2 may prevent the sealing organic layer 182 of the thin film sealing layer TFE described later from flooding the bending region BR. For example, the sealing organic layer 182 may be terminated at the second dam DAM2 located on the outer side of the two second dams DAM2. As a result, the sealing organic layer 182 does not extend to the bending region BR and does not overlap at all with the structure located in the bending region BR.

[0110] The first dam DAM1 may be disposed in the bending region BR. The first dam DAM1 may be disposed in the first dam portion DP1. One or more first dams DAM1 may be provided. FIG. 6 illustrates an example in which there is one first dam DAM1. One or more first dams DAM1 may be disposed in the first dam portion DP1. The first dam DAM1 can prevent the touch organic layer 250, which will be described later, from overflowing into the sub-region SR. For example, the touch organic layer 250 can be terminated at the first dam DAM1 located on the outer side of the two first dams DAM1. As a result, the touch organic layer 250 does not extend to the sub-region SR and does not overlap at all with the configuration located in the sub-region SR.

[0111] Other embodiments of the display device will be described below. In the following embodiments, repeated explanations of the configuration of the display device 1 already described in FIG. 6 may be omitted.

[0112] FIG. 9 is a cross-sectional view of a display device according to another embodiment.

[0113] 9, a touch line TL_1 of a display device 2 according to the present embodiment differs from the display device 1 according to FIG. 6 in that it does not include a first touch line portion TL1.

[0114] More specifically, the touch line TL_1 may include a second touch line portion TL2 and a curved bridge electrode CL. The first touch conductive layer 220_1 may not include the first touch line portion TL1 of FIG.

[0115] The rest of the description has been given with reference to FIG. 6, so detailed description will be omitted below.

[0116] FIG. 10 is a cross-sectional view of a display device according to still another embodiment.

[0117] Referring to FIG. 10, the display device 3 of this embodiment differs from the display device 1 of FIG. 6 in that the second touch conductive layer 240_1 does not include the second touch line portion TL2 and the third touch pad portion TPAD3, and the first touch conductive layer 220_2 includes the first touch line portion TL1_1 and the third touch pad portion TPAD3_1.

[0118] More specifically, the upper surface of the second touch line portion TL2 of the display device 1 in FIG. 6 is in direct contact with the touch organic layer 250. That is, if moisture enters the second touch line portion TL2 through the touch organic layer 250, corrosion of the second touch line portion TL2 may occur. However, according to the present embodiment, the second touch line portion TL2 is omitted, the touch line TL_2 is formed via the first touch line portion TL1_1 and the bent bridge electrode CL, and the touch insulating layer 230 is disposed between the first touch line portion TL1_1 and the touch organic layer 250, thereby improving moisture permeability to the touch line TL_2.

[0119] The rest of the description has been given with reference to FIG. 6, so detailed description will be omitted below.

[0120] Although an embodiment has been described above with reference to the attached drawings, it will be understood that the above technical configuration can be implemented in other specific forms by those skilled in the art to which this specification pertains without changing the technical idea or essential features. Therefore, it should be understood that the above embodiment is illustrative in all respects and is not limiting. The scope of the present invention is defined by the claims below rather than the above detailed description. Furthermore, all modifications or alterations derived from the meaning and scope of the claims and their equivalent concepts should be interpreted as being included in the scope of the present invention. [Explanation of symbols]

[0121] 1:Display device 100: Display panel 200: Touch sensor layer SUB: Substrate section CEL: Circuit element layer EL: Organic element layer TFE: Thin film encapsulation layer

Claims

1. A base substrate including a display area including a plurality of pixels and a non-display area around the display area; a first dam disposed on the base substrate in the non-display area; a second dam disposed on the base substrate in the non-display area and between the first dam and the display area; a touch conductive layer disposed on the first dam and the second dam; a touch sensor layer including a touch organic layer on the touch conductive layer; the touch organic layer terminates inside the first dam; The display device, wherein the first dam and the second dam comprise the same material.

2. The display device of claim 1 , wherein a surface height of the first dam is greater than a surface height of the second dam.

3. a thin film encapsulation layer between the first dam and the touch sensor layer; The display device of claim 1 , wherein the thin-film sealing layer includes a first sealing inorganic layer, a sealing organic layer on the first sealing inorganic layer, and a second sealing inorganic layer on the sealing organic layer.

4. The display device of claim 3 , wherein the sealing organic layer terminates inside the second dam.

5. The display device according to claim 4 , wherein the sealing organic layer does not overlap the first dam.

6. the non-display region includes a bending region where the display device is bent in a thickness direction, the first dam is disposed in the bend region; The display device of claim 1 , wherein the second dam is disposed between the bend region and the display region.

7. Further comprising an organic element layer disposed on the base substrate in the display area; The display device according to claim 1 , wherein the organic element layer includes an anode electrode, a bank layer exposing a part of an upper surface of the anode electrode, an organic layer on the exposed upper surface of the anode electrode, and a cathode electrode on the organic layer.

8. The display device according to claim 7 , wherein the first dam and the second dam are disposed in the same layer as the bank layer.

9. The display device according to claim 1 , wherein two or more first dams are provided.

10. The display device according to claim 1 , wherein the first dam is disposed on a second interlayer insulating layer between a bank layer and the base substrate.

11. The display device according to claim 1 , wherein the first dam is disposed on a planarization layer between a bank layer and the base substrate.

12. a planarization layer between the second interlayer insulating layer and the bank layer; The display device of claim 10 , wherein the first dam is disposed on the second interlayer insulating layer and the planarization layer.

13. a display area including a plurality of pixels; a non-display area located around the display area, the non-display area includes a first dam portion surrounding the display area, and a second dam portion surrounding the display area and between the first dam portion and the display area, A display device, wherein the first dam portion includes a main dam portion having a first distance from the second dam portion, and a protruding dam portion having a second distance from the second dam portion that is greater than the first distance.

14. The display device according to claim 13 , wherein the first dam portion and the second dam portion each have a closed loop shape.

15. The display device of claim 13 , wherein the first dam portion further comprises a connecting dam portion connecting the main dam portion and the protruding dam portion.

16. The non-display area further includes a bending area where the display device is bent in a thickness direction, The display device of claim 14 , wherein the protruding dam portion is disposed in the bending region.

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