Processing auxiliary tool

Abstract

To provide a processing auxiliary tool which enables even small chips to be discharged from a recovery chamber in a more reliable manner.SOLUTION: A processing auxiliary tool includes: a processing housing (5) where a processed material (30) is positioned in a predetermined position outside and a recovery chamber (51) for recovering chips from each of which the processed material (30) is punched is provided at the inside; and an airflow guide (20) which is disposed in the recovery chamber (51) and guides airflow (Air) occurring therein to a peripheral edge of the recovery chamber (51).SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to an auxiliary tool that is applied to a processing device that processes a portion of a metal member by cutting. [Background technology]

[0002] When a metal member is punched out using a press or the like to obtain a product, the parts separated from the metal member are collected. The separated parts are called scrap, cutting waste, chips, etc., but in this application, they are referred to as chips.

[0003] Patent Documents 1 and 2 make proposals regarding the recovery of chips and the like. The purpose of Patent Document 1 is to stably discharge scrap by actively controlling the orientation of the scrap as it falls to the scrap chute.To this end, Patent Document 1 provides an orientation correction protrusion that aligns the naturally falling scrap with the discharge direction before it falls into the scrap chute device that discharges the scrap outside the lower die. Patent Document 2 provides a scrap recovery method that can separate and recover scrap by metal type when different types of metal materials are pressed in the same device. In Patent Document 2, first scrap and second scrap are recovered in separate paths by separate means of gravity drop and suction. Judging from the contents of the embodiments described in Patent Documents 1 and 2, it is understood that the proposals in Patent Documents 1 and 2 are intended for chips having relatively large dimensions. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2018-069300 A [Patent Document 2] JP 2018-176248 A Summary of the Invention [Problem to be solved by the invention]

[0005] Among the chips separated from metal parts, there are some that are smaller than a few millimeters square, especially about 1 mm square. All of these tiny chips must be collected and discharged. When the chips are small, air flow is used to collect them. However, due to their size, they can adhere to some part during the discharge process due to processing oil or static electricity, preventing collection. The air flow referred to here includes both positive pressure, which forcibly supplies air, and negative pressure, which sucks in air.

[0006] SUMMARY OF THE PRESENT DISCLOSURE In view of the above, an object of the present invention is to provide a processing auxiliary tool that can more reliably recover even very small chips. [Means for solving the problem]

[0007] The processing aid of the present invention is a processing casing having an external chamber for positioning a workpiece at a predetermined position and for collecting chips punched out from the workpiece; The collecting chamber is provided with an airflow guide arranged in the collecting chamber and guiding the airflow generated inside toward the periphery of the collecting chamber.

[0008] The airflow guide preferably comprises: A first cone section whose diameter continuously increases from upstream to downstream; a constant diameter portion connected to the first conical portion and having a cylindrical shape; a second conical portion connected to the constant diameter portion and having a diameter that continuously decreases from the upstream side to the downstream side; The first guide body is placed in a fixed position in the collection chamber.

[0009] The airflow guide preferably comprises: A cylindrical second guide body having a central axis extending from the upstream to the downstream, The second guide body is An airflow passage is provided that is parallel to the central axis and passes through from the upstream side to the downstream side, The second guide body is placed in a fixed position in the collection chamber.

[0010] The airflow guide preferably comprises: The third guide body is an umbrella valve-shaped body whose diameter increases from upstream to downstream. The third guide body is capable of reciprocating between the upstream side and the downstream side. Effect of the Invention

[0011] According to the present invention, since an airflow guide that guides the airflow toward the periphery of the collection chamber is disposed in the collection chamber, even very small tips can be collected more reliably. [Brief description of the drawings]

[0012] [Figure 1] 1 is a perspective view showing an appearance of a processing device according to an embodiment of the present invention; [Diagram 2] 2A to 2C are a top view, a front view, and a side view of a processing device having a configuration different from that of FIG. 1. [Diagram 3] FIG. 3 is a top view of FIG. 2 showing how a workpiece is punched out with a tool. [Figure 4] 1A shows the state when the workpiece is punched by the tool, and FIG. 1B shows the state when the tool has been retracted. [Diagram 5] FIG. 2 is a diagram showing an airflow guide attached to the processing device together with the processing device. [Figure 6] 1A and 1B show a processing device in which an airflow guide is inserted, where FIG. 1A shows an example in which a first airflow guide is inserted, and FIG. 1B shows an example in which a second airflow guide is inserted. [Figure 7] 1A and 1B show a processing device with a third airflow guide inserted therein, where (a) shows the third airflow guide retracted, and (b) shows the third airflow guide advanced. [Figure 8] FIG. 11 is a diagram showing the effect of the third air flow guide. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. [Overview of processing device 1: See Figures 1 and 2] In the processing device 1 shown in FIG. 1, a terminal group 30 in which a plurality of terminals 31 are connected by a carrier 33 is used as a workpiece, and the carrier 33 is punched with a tool 7 to separate individual terminals 31 from the terminal group 30. The processing device 1 includes a processing casing 3, and punches out the terminal group 30 by moving the tool 7 back and forth relative to the terminal group 30 positioned at a predetermined position outside the processing casing 3. The processing casing 3 is formed with a punching hole 4 through which the tool 7 completes punching out the carrier 33, penetrating the processing casing 3. As an example, two punching holes 4, 4 are provided in FIG. 1, and two tools 7, 7 are prepared corresponding to the punching holes. After the two carriers 33, 33 of the terminal group 30 are aligned with the punching holes 4, 4, the tool 7, 7 is advanced until it penetrates the punching holes 4, 4 to punch out the carriers 33, 33. The punched carriers 33, 33 are collected into the processing casing 3 as chips.

[0014] 2 and 3 show a processing device 2 equipped with three tools 8, 8, 8 having a different configuration from that shown in FIG. In the processing device 2, three punch holes 6, 6, 6 are formed in the processing casing 5 corresponding to the tools 8, 8, 8. The tool 8 has a cutting blade 81 provided on the tip side and a support 83 connected to the cutting blade 81, and has an L-shaped configuration in a plan view. The processing device 2 punches out the carrier 33 while sandwiching the terminal 31 between the adjacent cutting blades 81 in the first direction X and sandwiching the terminal 31 between the support 83 and the processing casing 5 in the second direction Y.

[0015] The punched carrier 33 becomes a chip C as shown in FIG. 3. The processing housing 5 has a recovery chamber 51 for the chip C therein, and an airflow Air for discharging the chip C recovered in the recovery chamber 51 flows in the direction of the outline arrow, that is, from the inlet 51A of the recovery chamber 51 to the outlet 51B. Ideally, the chip C is carried by the airflow Air and discharged from the outlet 51B. In the recovery chamber 51, the upstream (U) and downstream (L) are specified according to the flow direction of the airflow Air. As an example, a pump P is provided upstream of the inlet 51A, and the airflow Air is supplied to the recovery chamber 51 through the inlet 51A by driving the pump P to pump air. It is also possible to generate the airflow Air by providing a vacuum pump downstream of the outlet 51B and reducing the pressure in the recovery chamber 51.

[0016] [Chip C retention: see Fig. 4(a) and (b)] However, as will be described below, the tip C may remain in the recovery chamber 51. As shown by the arrows in FIG. 4(a), the speed of the airflow Air is faster in the center of the recovery chamber 51 and slower at the ends of the recovery chamber 51. Therefore, the closer to the side walls 53A and 53B constituting the processing casing 5, the smaller the conveying ability of the airflow Air for the chips C. Since the chips C are punched on the side of the side wall 53A, as shown in FIG. 4(b), the chips C may adhere to the side wall 53A due to processing oil or static electricity and remain in the recovery chamber 51 as is. In addition, the chips C that are not collected in the recovery chamber 51 may remain in the punching hole 6 or adhere to the tool 8, and these chips C may hinder the cutting of the next carrier 33.

[0017] [Airflow guide arrangement: see Figure 5] Therefore, an airflow guide 20 is disposed in a recovery chamber 51 through which the airflow Air of the processing casing 5 flows. Although several airflow guides 20 are illustrated on the outside of the processing casing 5 in Fig. 5, each airflow guide 20 is inserted into the recovery chamber 51 through an insertion duct 55 formed in the processing casing 5. Three preferable airflow guides 20, a first airflow guide 20A, a second airflow guide 20B, and a third airflow guide 20C, will be described below.

[0018] [First airflow guide 20A: see FIG. 6(a)] The first airflow guide 20A comprises a guide body 21A that guides the airflow Air toward the side walls 53A and 53B, i.e., toward the periphery of the recovery chamber 51, a support rod 22 connected to the guide body 21A at its tip, and a fitting body 23 that supports the rear end of the support rod 22 and is fitted into the insertion duct 55. The first guide body 21A has a spindle shape. That is, the first guide body 21A includes a first conical portion 21A1 whose diameter increases continuously from the upstream (U) to the downstream (L) of the airflow Air, a constant diameter portion 21A2 connected to the first conical portion 21A1 and having a cylindrical shape, and a second conical portion 21A3 connected to the constant diameter portion 21A2 and whose diameter decreases continuously from the upstream (U) to the downstream (L).

[0019] The first guide body 21A of the first airflow guide 20A is disposed at a fixed position in the recovery chamber 51. Then, at the periphery of the first conical portion 21A1, the flow path of the airflow Air narrows from the upstream (U) side toward the downstream (L), and the airflow Air is guided toward the periphery of the recovery chamber 51. Also, at the periphery of the constant diameter portion 21A2, the narrow flow path is maintained from the upstream (U) side toward the downstream (L). Furthermore, at the second conical portion 21A3, the flow path of the airflow Air continuously widens from the upstream (U) side toward the downstream (L).

[0020] The flow path of the airflow Air corresponding to the first conical portion 21A1 is defined as the first flow path FP1, the flow path of the airflow Air corresponding to the equal-diameter portion 21A2 is defined as the second flow path FP2, and the flow path of the airflow Air corresponding to the second conical portion 21A3 is defined as the third flow path FP3. In the first flow path FP1, as the flow path narrows, the airflow Air flows toward the periphery of the recovery chamber 51 and the flow velocity increases. For example, in the first flow path FP1, if the flow velocity at the most upstream (U) is V11 and the flow velocity at the most downstream (L) is V12, then V11 < V12. In the second flow path FP2, the flow velocity V12 at the most downstream (L) of the first flow path FP1 is maintained and it flows along the side walls 53A, 53B. In the third flow path FP3, if the flow velocity at the most upstream (U) is the same as the flow velocity V12 of the second flow path FP2 and the flow velocity at the most downstream (L) is V13, then V12 > V13.

[0021] The second flow path FP2 where the flow velocity of the airflow Air is the fastest overlaps with the processing area where the chip C is punched. Therefore, the chip C punched by the tools 8, 8 is exposed to the airflow Air with a high flow velocity, so the chip C is easily conveyed by the airflow Air toward the outlet 51B. Even if the chip C tries to adhere to the side walls 53A, 53B, the adhesion is prevented by the airflow Air, or even if it adheres once, it can be peeled off.

[0022] [Effect of the First Airflow Guide 20A] According to the processing apparatus 1, by simply inserting the member with a simple structure, the first airflow guide 20A, into the recovery chamber 51, it is possible to prevent the chip C from adhering to the side walls 53A, 53B in contact with the recovery chamber 51.

[0023] [Second Airflow Guide 20B: See Fig. 6(b)] The second airflow guide 20B has a second guide body 21B that is cylindrical. In the second airflow guide 20B, the same components as those of the first airflow guide 20A are given the same reference numerals as those of the first airflow guide 20A. The second guide body 21B of the second airflow guide 20B is arranged at a fixed position upstream (U) of the tool 8 and the punching hole 6 on the most upstream (U) side in the recovery chamber 51.

[0024] The second guide body 21B has an airflow passage 21B1 therein. The airflow passage 21B1 is provided parallel to the central axis C of the second guide body 21B and penetrates the second guide body 21B from the upstream (U) side to the downstream (L) side. Here, as an example, four airflow passages 21B1 are provided.

[0025] The second airflow guide 20B, particularly the second guide body 21B, is disposed in the recovery chamber 51. Then, the flow path (fourth flow path FP4) of the airflow Air around the second guide body 21B and between the side walls 53A, 53B becomes narrow. The four airflow paths 21B1 also become the flow paths (fifth flow path FP5) of the airflow Air, but this also has a narrower flow path for the airflow Air than the recovery chamber 51 where the second guide body 21B is not provided. Therefore, the flow speed of the airflow Air flowing from the upstream (U) becomes faster while passing through the fourth flow path FP4 around the second guide body 21B and the fifth flow path FP5 inside the second guide body 21B.

[0026] The chip C punched by the tool 8 passes through the fifth flow path FP5 and is exposed to the fast air current Air, so that the chip C is easily transported by the air current Air toward the outlet 51B. At this time, the chip C may separate from the side walls 53A, 53B, but since it is exposed to the fast air current Air flowing from the fifth flow path FP5, the chip C is easily transported toward the outlet 51B. Even if the chip C tries to adhere to the side walls 53A, 53B, the adhesion is prevented by the air current Air passing through the fourth flow path FP4, or even if it does adhere, it can be peeled off.

[0027] [Effect of the second airflow guide 20B] According to the second airflow guide 20B of the processing device 1, by simply inserting the second airflow guide 20B, which is a member having a simple structure, into the recovery chamber 51, it is possible to prevent the chips C from adhering to the side walls 53A and 53B in contact with the recovery chamber 51.

[0028] [Third airflow guide 20C: see Figures 7 and 8] The third airflow guide 20C has a third guide body 21C shaped like an umbrella valve. The first airflow guide 20A and the second airflow guide 20B are fixed in position, but the third airflow guide 20C moves back and forth upstream (U) and downstream (L) to guide the flow of the airflow Air.

[0029] The third airflow guide 20C does not include a fitting body 23, and a support rod 22 connected to the third guide body 21C slidably penetrates the wall of the processing casing 5. The support rod 22 is moved forward and backward upstream (U) and downstream (L) by a driving source (not shown), and accordingly, the third guide body 21C moves forward and backward as shown in Figures 7(a) and (b). During this forward and backward movement, the third guide body 21C reciprocates through an area where the chip C is punched out by the tool 8.

[0030] The above-described third guide body 21C is disposed in the collection chamber 51. Then, as shown in Fig. 8, the flow path (sixth flow path FP6) of the airflow Air around the third guide body 21C and between the side walls 53A and 53B becomes narrow. Therefore, the flow speed of the airflow Air flowing from the upstream (U) becomes faster while passing through the sixth flow path FP6 around the third guide body 21C.

[0031] The chips C punched by the tool 8 are exposed to the fast airflow Air through the sixth flow path FP6, so that the chips C are easily transported by the airflow Air toward the outlet 51B. At this time, the chips C may separate from the side walls 53A and 53B, but since they are exposed to the fast airflow Air flowing through the sixth flow path FP6, the chips C are easily transported toward the outlet 51B. Even if the chips C try to adhere to the side walls 53A and 53B, the airflow Air passing through the sixth flow path FP6 prevents the chips C from adhering, or, even if they do adhere, they can be peeled off. In particular, since the third guide body 21C guides the airflow Air toward the side walls 53A and 53B while moving forward and backward, it is possible to actively prevent the chips C from staying in a wide range from the upstream (U) to the downstream (L) of the collection chamber 51.

[0032] [Effect of the 3rd airflow guide 20C] According to the third airflow guide 20C of the processing device 1, by simply inserting the third airflow guide 20C, which is a member having a simple structure, into the recovery chamber 51, it is possible to prevent the chips C from adhering to the side walls 53A and 53B in contact with the recovery chamber 51.

[0033] In addition to the above, the configurations given in the above embodiments can be selected or appropriately changed to other configurations without departing from the spirit of the present invention. [Explanation of symbols]

[0034] 1 Processing equipment 3,5 Processing case 4,6 punching holes 7,8 Tools 20 Airflow Guide 21 Guide body 22 Support rod 23 Fitting body 20A 1st Airflow Guide 21A First guide body 21A1 First cone 21A2 Equal diameter part 21A3 Second cone 20B Second airflow guide 21B 2nd guide body 20C 3rd airflow guide 21C 3rd guide body 30 terminal group 31 Terminal 33 Career 51 Recovery Room 53A,53B side wall 55 Insertion Duct 81 Cutting edge 83 Support C center axis U Upstream L downstream

Claims

1. a processing casing having an exterior in which a workpiece is positioned at a predetermined position and an interior recovery chamber in which chips punched out from the workpiece are recovered; an airflow guide disposed in the collection chamber and configured to guide an airflow generated inside the collection chamber toward a periphery of the collection chamber; A processing aid equipped with:

2. The airflow guide is A first conical portion having a diameter that continuously increases from the upstream side to the downstream side; a constant diameter portion connected to the first conical portion and having a cylindrical shape; a second conical portion connected to the constant diameter portion and having a diameter that continuously decreases from the upstream side to the downstream side, The first guide body is placed in a fixed position in the collection chamber. The processing aid according to claim 1 .

3. The airflow guide is a cylindrical second guide body having a central axis extending from the upstream side to the downstream side, The second guide body includes: An airflow passage is provided that is parallel to the central axis and passes through from the upstream side to the downstream side, The second guide body is placed in a fixed position in the collection chamber. The processing aid according to claim 1 .

4. The airflow guide is a third guide body having an umbrella valve shape whose diameter increases from the upstream side toward the downstream side, The third guide body is reciprocally movable between the upstream side and the downstream side. The processing aid according to claim 1 .

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