Power supply system

Abstract

To suppress influence of leakage current on a PA module.SOLUTION: A power supply system includes: a first module including a power amplifier for amplifying a signal; a first power supply line for supplying power to the first module; a second power supply line for supplying power to the first module; a first capacitance whose one end is connected to the first power supply line; a second capacitance whose one end is connected to the second power supply line; a first switch for changing over between a first connection state in which the first power supply line is electrically connected to the first module and a second state in which the second power supply line is electrically connected to the first module; a second switch for connecting the other end of the first capacitance to a reference potential when the first power supply line is connected to the first module by the first switch; and a third switch for connecting the other end of the second capacitance to the reference potential when the second power supply line is connected to the first module by the first switch.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a power supply system. [Background technology]

[0002] In order to support multiple frequency bands in a wireless communication device, multiple power amplifier (hereinafter referred to as "PA") modules are sometimes installed. When multiple power amplifiers are installed, a power supply modulator is required to supply power to each power amplifier.

[0003] Patent Document 1 discloses a wireless communication device equipped with multiple power supply circuits. In Patent Document 1, a power supply circuit that supplies a low power supply voltage during low power and a power supply circuit that rapidly supplies a high power supply voltage during high power are provided. The power supply circuits are switched as necessary. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] US Patent Application Publication No. 2007 / 0010218 Summary of the Invention [Problem to be solved by the invention]

[0005] Regarding the power supply circuits for the PA modules, it is conceivable to provide the same number of power supply circuits as the PA modules so that there is a one-to-one relationship between the PA modules and the power supply circuits. In that case, if multiple PA modules are included, providing the same number of power supply circuits makes it difficult to make the device compact. Therefore, it is conceivable to reduce the number of power supply devices by providing a changeover switch and supplying power to multiple PA modules from one power supply circuit.

[0006] However, when multiple types of PA modules with different frequency bands are installed, leakage current may leak into the power line via the changeover switch, and such leakage current may affect the PA modules.

[0007] The present disclosure has been made in consideration of the above, and has as its object to provide a power supply system that can suppress the effects of leakage current from a PA module when a power supply circuit and a changeover switch are used. [Means for solving the problem]

[0008] In order to solve the above-mentioned problems and achieve the object, the power supply system according to the present disclosure includes a first module including a power amplifier that amplifies a signal, a first power supply line for supplying power to the first module, a second power supply line for supplying power to the first module, a first capacitor having one end connected to the first power supply line, a second capacitor having one end connected to the second power supply line, a first switch that switches between a first connection state in which the first power supply line is electrically connected to the first module and a second connection state in which the second power supply line is electrically connected to the first module, a second switch that connects the first power supply line to the first module by the first switch and connects the other end of the first capacitor to a reference potential when the first module is driven, and a third switch that connects the second power supply line to the first module by the first switch and connects the other end of the second capacitor to a reference potential when the first module is driven. Effect of the Invention

[0009] According to the present disclosure, when a power supply circuit and a changeover switch are used, the influence of leakage current from a PA module can be suppressed. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a block diagram showing a power supply system according to a first embodiment of the present disclosure. [Diagram 2] FIG. 2 is a diagram showing the operating states of each PA module and the states of each switch at that time. [Diagram 3] FIG. 3 is a block diagram showing a power supply system according to a second embodiment of the present disclosure. [Figure 4] FIG. 4 is a diagram showing the operating states of each PA module according to the switching of the switches, and the states of other switches at that time. [Diagram 5] FIG. 5 is a diagram for explaining band combinations that cause deterioration of intermodulation distortion characteristics. [Figure 6] FIG. 6 is a diagram illustrating the isolation characteristics between two power supply lines. [Figure 7] FIG. 7 is a diagram showing the operating states of the PA modules and the states of the switches at that time in the state shown in FIG. [Figure 8] FIG. 8 is a diagram showing an example of a leak signal in FIG. [Figure 9] FIG. 9 is a diagram showing an example of a power supply system using three power supply modulators for four PA modules. [Figure 10] FIG. 10 is a diagram showing whether a power supply modulator can handle the combinations of EN-DC shown in FIG. [Figure 11] FIG. 11 is a diagram showing an example in which two power supply modulators are used for four PA modules. [Figure 12] FIG. 12 is a diagram showing whether a power supply modulator can handle the combinations of EN-DC shown in FIG. [Figure 13] FIG. 13 is a diagram showing another example in which two power supply modulators are used for four PA modules. [Figure 14] FIG. 14 is a diagram showing whether a power supply modulator can handle the combinations of EN-DC shown in FIG. [Figure 15] FIG. 15 is a block diagram showing a power supply system according to the third embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, the embodiments of the present invention will be described in detail with reference to the drawings. In the following description of each embodiment, the same or equivalent components as those in other embodiments are given the same reference numerals, and their description will be simplified or omitted. The present invention is not limited to each embodiment. In addition, the components of each embodiment include those that are replaceable and easy for a person skilled in the art, or those that are substantially the same. The configurations described below can be appropriately combined. In addition, the configurations can be omitted, replaced, or modified within the scope of the gist of the invention.

[0012] (First embodiment) (composition) Fig. 1 is a block diagram showing a power supply system according to a first embodiment of the present disclosure. In Fig. 1, the power supply system 100 according to the first embodiment includes PA modules M1, M2, and M3, power supply modulators PM1 and PM2, switch circuits SW, capacitances C1, C2, C3, and C5, power supply lines L1, L2, and L3, a control circuit 10, and terminals T1 and T2. Fig. 1 mainly shows the connection state of the power supply lines for supplying power to the power supply system 100.

[0013] The PA module M1 includes a power amplifier PA1, a switch SW1, and a power supply line L3. The power amplifier PA1 amplifies a high-frequency signal. The power supply line L3 is connected to the PA module M1. The power supply line L3 electrically connects the switch SW1 and the PA module M1. The PA module M1 corresponds to the "first module" in this disclosure. The power supply line L3 corresponds to the "third power supply line" in this disclosure.

[0014] The PA module M2 includes a power amplifier PA2. The PA module M2 corresponds to the "second module" of the present disclosure, and the power amplifier PA2 corresponds to the "second power amplifier" of the present disclosure. The power amplifier PA2 amplifies a high-frequency signal. The PA module M2 is connected to the power line L1 without a switch SW1, and is connected to the opposite side of the PA module M1 with a capacitance C2 described later sandwiched therebetween. The PA module M3 includes a power amplifier PA3. The PA module M3 corresponds to the "third module" of the present disclosure, and the power amplifier PA3 corresponds to the "third power amplifier" of the present disclosure. The power amplifier PA3 amplifies a high-frequency signal. The PA module M3 is connected to the power line L2 without a switch SW1, and is connected to the opposite side of the PA module M1 with a capacitance C5 described later sandwiched therebetween.

[0015] The power modulators PM1 and PM2 output a power supply voltage. The PA module M2 and the power modulator PM1 are connected to a power supply line L1. The power modulator PM1 supplies a power supply voltage to the power supply line L1. The PA module M3 and the power modulator PM2 are connected to a power supply line L2. The power modulator PM2 supplies a power supply voltage to the power supply line L2. The power supply line L1 corresponds to the "first power supply line" in this disclosure. The power supply line L2 corresponds to the "second power supply line" in this disclosure.

[0016] The switch SW1 is provided in the PA module M1. The switch SW1 is a switch for switching the power supply modulator. The switch SW1 has contacts a, b, and c. A control signal output from the control circuit 10 is input to the switch SW1. Based on the input control signal, the switch SW1 is in a state in which the contact a and the contact b are connected, or in a state in which the contact a and the contact c are connected. The power supply line L3 is connected to the contact a. The power supply line L1 is connected to the contact b. The power supply line L2 is connected to the contact c. The switch SW1 may also be in an open state with none of the contacts connected.

[0017] When the switch SW1 connects the contact a and the contact b, the switch SW1 electrically connects the power supply line L1 and the power supply line L3. When the switch SW1 connects the contact a and the contact c, the switch SW1 electrically connects the power supply line L2 and the power supply line L3. Therefore, the switch SW1 switches between two connection states based on the input control signal. That is, the switch SW1 switches between a first connection state in which the power supply line L1 is electrically connected to the PA module M1 and a second connection state in which the power supply line L2 is electrically connected to the PA module M1.

[0018] The switch circuit SW is an integrated circuit including switches SW2, SW3, and SW5. That is, the switches SW2, SW3, and SW5 are provided in the same integrated circuit. A control signal output from a control circuit 10 is input to the switch circuit SW. The switches SW2, SW3, and SW5 are turned on (ON) or off (OFF) based on the control signal input from the control circuit 10. The switch SW2 is, for example, configured with a transistor, and when the transistor is turned on, the switch is turned on, and when the transistor is turned off, the switch is turned off. The switches SW3 and SW5 have the same configuration as the switch SW2.

[0019] One end of the capacitor C1 is connected to the power supply line L3. The other end of the capacitor C1 is connected to a reference potential. The reference potential is, for example, a ground potential. The same applies to the following description.

[0020] One end of the capacitance C2 is connected to the power supply line L1. Specifically, the capacitance C2 is connected between the PA module M2 and the switch SW1 on the power supply line L1. In other words, the capacitance C2 is connected between the PA module M1 and the PA module M2. The other end of the capacitance C2 is connected to the reference potential via the switch SW2. When the switch SW2 is on, the other end of the capacitance C2 is connected to the reference potential. When the switch SW1 connects the power supply line L2 to the PA module M1 and the PA module M1 is driven, the switch SW2 connects the other end of the capacitance C2 to the reference potential. The capacitance C2 corresponds to the "first capacitance" in this disclosure. The switch SW1 corresponds to the "first switch" in this disclosure. The switch SW2 corresponds to the "third switch" in this disclosure.

[0021] One end of the capacitance C5 is connected to the power supply line L2. The other end of the capacitance C5 is connected to the reference potential via the switch SW5. When the switch SW5 is on, the other end of the capacitance C5 is connected to the reference potential. When the switch SW1 connects the power supply line L1 to the PA module M1 and the PA module M1 is driven, the switch SW5 connects the other end of the capacitance C5 to the reference potential. The capacitance C5 corresponds to the "second capacitance" in this disclosure. The switch SW5 corresponds to the "second switch" in this disclosure.

[0022] One end of the capacitance C3 is connected to the power supply line L3. The other end of the capacitance C3 is connected to the reference potential via the switch SW3. When the switch SW3 is on, the other end of the capacitance C3 is connected to the reference potential. In other words, the switch SW3 switches between a state in which the other end of the capacitance C3 is connected to the reference potential and a state in which the other end of the capacitance C3 is not connected to the reference potential. The capacitance C3 corresponds to the "third capacitance" of the present disclosure.

[0023] (operation) Assuming that power is supplied from one power modulator to one PA module, even when the connection state is switched by the switch SW1, power is supplied from one power modulator to one PA module. When switching the connection state of the power modulators PM1 and PM2 to the power lines L1 and L2, the other switches are operated simultaneously with the switching of the switch SW1 to set the connection or non-connection of the capacitance. In other words, the switches SW2 to SW5 are switched in conjunction with both the switching of the power supply by the switch SW1 and the driving state of the PA module M1. Here, "switching in conjunction" includes not only the case where they are switched simultaneously, but also the case where the switching timing is not simultaneous but varies to some extent. When they are not switched simultaneously, it is desirable to switch the switches SW2 to SW5 first and then switch the switch SW1 in order to suppress the influence of the leakage current. More specific operations will be described below.

[0024] The power supply modulator PM1 supplies a power supply voltage to the power supply line L1. That is, the power supply modulator PM1 supplies power to the power supply line L1. The power supply modulator PM2 supplies a power supply voltage to the power supply line L2. That is, the power supply modulator PM2 supplies power to the power supply line L2.

[0025] The PA module M1 is in an operating state when power, i.e., a power supply voltage, is input through the power supply line L3 and a predetermined bias is applied. The PA module M1 in an operating state amplifies a high-frequency signal input to a terminal (not shown). The PA module M2 is in an operating state when power, i.e., a power supply voltage, is input through the power supply line L1 and a predetermined bias is applied. The PA module M2 in an operating state amplifies a high-frequency signal input to a terminal T1. The PA module M3 is in an operating state when power, i.e., a power supply voltage, is input through the power supply line L2 and a predetermined bias is applied. The PA module M3 in an operating state amplifies a high-frequency signal input to a terminal T2.

[0026] The PA modules M1, M2, and M3 amplify signals in different frequency bands. The PA module M1 amplifies, for example, a UHB (Ultra High Band) signal (3.5 GHz band). The PA module M2 amplifies, for example, a LB (Low Band) signal (0.9 GHz band). The PA module M3 amplifies, for example, a MB (Mid Band) signal (1.8 GHz band).

[0027] FIG. 2 is a diagram showing the operating state of each PA module and the state of each switch at that time. FIG. 2 shows the operating state of each PA module according to the switching of the switch SW1 and the states of the other switches SW2, SW3, and SW5 at that time. The "ON" (hereinafter referred to as "on") state of each PA module in FIG. 2 indicates that the PA module is in a driving state and can amplify with a gain larger than 0. The "OFF" (hereinafter referred to as "off") state of each PA module in FIG. 2 indicates that the PA module is not in a driving state. The "ON" (hereinafter referred to as "on") state of each switch in FIG. 2 indicates that the switch is in a conducting state, and the "OFF" (hereinafter referred to as "off") indicates that the switch is not in a conducting state. FIG. 2 also shows the combinations of EN-DC (E-UTRA New Radio-Dual Connectivity) that can be realized. Note that "E-UTRA" is an abbreviation for Evolved Universal Terrestrial Radio Access.

[0028] In Fig. 2, when the contact a of the switch SW1 is connected to the contact b on the power supply modulator PM1 side, the PA module M1 is on, the PA module M2 is off, and the PA module M3 is on, the switches SW2 and SW3 are off, and the switch SW5 is on. In this state, the combination of UHB and MB can be realized.

[0029] By turning off the switch SW2 and the switch SW3, the influence of the capacitances C2 and C3 is eliminated, and the responsiveness of the PA module M1 can be improved. By turning on the switch SW5 and enabling the capacitance C5, the influence of a leak signal caused by a signal in the frequency band in which the PA module M1 operates or its harmonic signal leaking to the PA module M3 via the power supply lines L2 and L3 is suppressed. At the same time, by turning on the switch SW5 and enabling the capacitance C5, the influence of a leak signal caused by a signal in the frequency band in which the PA module M3 operates or its harmonic signal leaking to the PA module M1 via the power supply lines L2 and L3 is suppressed. This makes it possible to improve the isolation characteristics between the power supply lines L1 and L3 and the power supply line L2.

[0030] Here, if the capacitance C2 is connected between the power supply line L1 and the reference voltage, or if the capacitance C3 is connected between the power supply line L3 and the reference voltage, these capacitances will affect and deteriorate the rising response performance in the operation of the PA module M1. In other words, for the PA module M2 in the off state that shares the power supply line L1 with the PA module M1 in the on state, if the capacitances C2 and C3 connected to the power supply lines L1 and L3 connecting the PA module M2 and the PA module M1 are connected to the reference voltage, the rising response performance in the operation of the PA module M1 will deteriorate. In contrast, by turning off the switches SW2, SW3, and SW4 as described above, the influence of the capacitances C2, C3, and C4 is eliminated, and the deterioration of the rising response performance in the operation of the PA module M1 can be prevented.

[0031] 2, when the contact a of the switch SW1 is connected to the contact c on the power supply modulator PM2 side, the PA module M1 is on, the PA module M2 is on, and the PA module M3 is off, the switch SW2 is on, and the switches SW3 and SW5 are off. In this state, the combination of UHB and LB can be realized.

[0032] By turning off the switch SW3 and the switch SW5, the influence of the capacitances C3 and C5 is eliminated, and the responsiveness of the PA module M1 can be improved. By turning on the switch SW2 and enabling the capacitance C2, the influence of a leak signal caused by a signal in the frequency band in which the PA module M1 operates or its harmonic signal leaking to the PA module M2 via the power supply lines L1 and L3 is suppressed. At the same time, by turning on the switch SW2 and enabling the capacitance C2, the influence of a leak signal caused by a signal in the frequency band in which the PA module M2 operates or its harmonic signal leaking to the PA module M1 via the power supply lines L1 and L3 is suppressed. This makes it possible to improve the isolation characteristics between the power supply line L1 and the power supply lines L2 and L3.

[0033] Here, if the capacitance C5 is connected between the power supply line L2 and the reference voltage, or if the capacitances C3 and C4 are connected between the power supply line L3 and the reference voltage, these capacitances will affect and deteriorate the rising response performance in the operation of the PA module M1. In other words, for the PA module M3 in the off state that shares the power supply line L2 with the PA module M1 in the on state, if the capacitances C3 and C5 connected to the power supply lines L2 and L3 connecting the PA module M3 and the PA module M1 are connected to the reference voltage, the rising response performance in the operation of the PA module M1 will deteriorate. In contrast, by turning off the switches SW5, SW3, and SW4 as described above, the influence of the capacitances C5, C3, and C4 is eliminated, and deterioration of the rising response performance in the operation of the PA module M1 can be prevented.

[0034] 2, regardless of the connection states of the contacts a, b, and c of the switch SW1, that is, when the contact a of the switch SW1 is connected to the contact b and when the contact a of the switch SW1 is connected to the contact c, when the PA module M1 is off and the PA modules M2 and M3 are on, the switch SW2 is off, the switch SW3 is on, and the switch SW5 is off. In this state, the combination of MB and LB can be realized.

[0035] By turning off the switches SW2 and SW5, the effects of the capacitances C2 and C5 connected to the power supply lines L1 and L2 shared by the on-state PA modules M2 and M3 and the off-state PA module M1 are eliminated, improving the responsiveness of the PA modules M2 and M3. By turning on the switch SW3 and enabling the capacitance C3, the effects of leak signals leaking through the power supply lines L1 and L2 as signals in the frequency band in which the PA modules M2 and M3 operate or their harmonic signals are suppressed. This improves the isolation characteristics between the power supply lines L1 and L2.

[0036] When the contacts of switch SW1 are not connected and are in an open state, the PA module M1 is off, and the PA modules M2 and M3 are on, the switch SW2 or switch SW5 is on, and the switch SW3 is off. Even in this state, the combination of MB and LB can be realized.

[0037] By turning off the switch SW3, the effect of the capacitance C3 connected to the power supply line L3 shared via the switch SW1 between the on-state PA modules M2 and M3 and the off-state PA module M1 is eliminated, improving the responsiveness of the PA modules M2 and M3. By turning on the switch SW2 or SW5 and enabling the capacitance C2 or C5, the effect of a leak signal, which is a signal in the frequency band in which the PA modules M2 and M3 operate or a harmonic signal thereof leaking through the power supply lines L1 and L2, is suppressed. This makes it possible to improve the isolation characteristics between the power supply lines L1 and L2.

[0038] 2 also shows an example of a specific capacitance value of each capacitor. For example, the capacitance C2 is 10 pF, the capacitance C3 is 30 pF, and the capacitance C5 is 10 pF.

[0039] (effect) 2, a capacitance of an appropriate value can be connected to the power supply line depending on the operating state of each PA module. By connecting the other end of the capacitance to a reference potential, the influence of a leak signal leaking through the power supply line can be suppressed, and good isolation characteristics can be obtained between the power supply lines.

[0040] For capacitors that do not need to be connected, the switches are set to off so that they are not connected to the reference potential. This makes it possible to prevent deterioration of the rise response performance during the operation of the PA module.

[0041] A capacitance may be connected to the power line to eliminate noise on the power line or to determine the responsiveness of the power supply voltage. The capacitance connected to the power line is a fixed value regardless of the number of PA modules or the frequency band of the signal used. On the other hand, recent mobile communication terminals are equipped with multiple PA modules that support more frequency bands to enable high-speed and large-capacity communication. When power is supplied from a power modulator to multiple PA modules, if multiple PA modules with different frequency bands are connected to each power line, a fixed capacitance value cannot achieve good isolation performance to reduce power supply noise including harmonics.

[0042] According to the above-mentioned power supply system, the switch is turned on or off in conjunction with the switching of the power modulator that supplies power to the PA module, so that the influence of the leak signal leaking through the power line can be suppressed and good isolation characteristics can be obtained between the power lines. Also, deterioration of the start-up response performance during the operation of the PA module can be prevented. That is, in conjunction with the switching of the power modulator, the isolation characteristics of the power supply, the response when the power supply is switched, and the high efficiency and high linearity characteristics according to the power supply method such as APT or ET can be optimized according to the frequency band used by the PA module.

[0043] Second embodiment (composition) Fig. 3 is a block diagram showing a power supply system according to a second embodiment of the present disclosure. In Fig. 3, the power supply system 100a according to the second embodiment is configured by adding PA modules M4 and M5 and capacitances C3 and C4 to the power supply system 100 according to the first embodiment. The PA module M4 includes a power amplifier PA4. The power amplifier PA4 amplifies a high-frequency signal. The PA module M5 includes a power amplifier PA5. The power amplifier PA5 amplifies a high-frequency signal. The capacitance C3 is provided corresponding to the PA module M4. The capacitance C4 is provided corresponding to the PA module M5.

[0044] The PA module M4 operates with power supplied through the power line L3. The PA module M5 operates with power supplied through the power line L3. The frequency band of the signal amplified by the power amplifier PA1 in the PA module M1 is different from the frequency band of the signal amplified by the power amplifiers PA4 and PA5 in the PA modules M4 and M5. The PA modules M4 and M5 correspond to the "other modules" in this disclosure. The power amplifiers PA4 and PA5 correspond to the "other power amplifiers" in this disclosure.

[0045] In the first connection state described above, the power supply line L1 and the power supply line L3 are electrically connected to each other. In the first connection state, power is supplied to any one of the PA modules M1, M4, and M5 via the power supply line L1 and the power supply line L3.

[0046] In the second connection state described above, the power supply line L2 and the power supply line L3 are electrically connected. In the second connection state, power is supplied to all of the PA modules M1, M4, and M5 via the power supply line L2 and the power supply line L3. However, when a bias is supplied to the transistors constituting the PA modules, the PA modules are in a driven state and perform an amplification operation with a gain greater than 0. Therefore, of the PA modules M1, M4, and M5, only one of the PA modules M1, M4, and M5 is in a driven state.

[0047] Moreover, the switch circuit SWa of the power supply system 100a is configured by adding a switch SW4 to the switch circuit SW of the power supply system 100. The switch SW3 is provided corresponding to the capacitor C3 and the PA module M4. The switch SW4 is provided corresponding to the capacitor C4 and the PA module M5.

[0048] One end of the capacitor C4 is electrically connected to the power supply line L3. The other end of the capacitor C4 is connected to the reference potential via the switch SW4. When the switch SW4 is on, the other end of the capacitor C4 is connected to the reference potential.

[0049] (operation) The PA modules M1, M2, M3, M4, and M5 amplify signals of different frequency bands. The PA module M1 amplifies, for example, a UHB signal (3.5 GHz band). The PA module M2 amplifies, for example, a LB signal (0.9 GHz band). The PA module M3 amplifies, for example, a MB signal (1.8 GHz band). The PA module M4 amplifies, for example, a UHB signal (5 GHz band). The PA module M5 amplifies, for example, a HB (High Band) signal (2.5 GHz band).

[0050] However, when the contact a and the contact b of the switch SW1 are connected and the power supply voltage is supplied to the power supply lines L1 and L3, it is also possible that the operation of the PA modules M1 and M2 is in the OFF state, and the operation of the PA module M3 and the PA module M4 or the PA module M5 is in the ON state. In this case, the switch SW2 corresponding to the capacitance C2 connected to the power supply line L1 shared by the PA module M4 or M5 in the ON state and the PA module M2 in the OFF state via the switch SW1 is turned OFF, and the switches SW3 and SW4 corresponding to the capacitances C3 and C4 connected to the power supply line L3 shared by the PA module M4 or M5 in the ON state and the PA module M1 in the OFF state are turned OFF. By turning OFF the switches SW3 and SW4 corresponding to the capacitances C3 and C4 connected to the power supply line L3, the influence of the capacitances C3 and C4 can be eliminated, and the responsiveness of the PA module M1 can be improved.

[0051] Furthermore, as described above, when the operation of the PA module M1 is in an off state and the operation of the PA module M4 or the PA module M5 is in an on state, the switch SW5 corresponding to the capacitance C5 connected to the power line L2 is turned on. That is, the switch SW5 is turned on to enable the capacitance C5. By enabling the capacitance C5, the influence of a leak signal in which a signal in the frequency band in which the PA module M4 or the PA module M5 operates or its harmonic signal leaks through the power line L2 to the PA module M3 in the on state is suppressed. This makes it possible to improve the isolation characteristics between the power lines L1, L3 and the power line L2.

[0052] When contact a and contact b of switch SW1 are connected, switches SW2, SW3, and SW4 corresponding to capacitance C2 connected to power supply line L1 and capacitances C3 and C4 connected to power supply line L2 are simultaneously turned off, and switch SW5 corresponding to capacitance C5 connected to power supply line L2 is turned on, thereby simultaneously achieving improved isolation performance and improved responsiveness between power supply lines L1 and L2.

[0053] In addition, when the contact a and the contact c of the switch SW1 are connected and the power supply voltage is supplied to the power supply lines L2 and L3, it is also possible that the operation of the PA modules M1 and M3 is in the OFF state, and the operation of the PA module M2 and the PA module M4 or the PA module M5 is in the ON state. In this case, the switch SW5 corresponding to the capacitance C5 connected to the power supply line L2 is turned OFF, and the switches SW3 and SW4 corresponding to the capacitances C3 and C4 connected to the power supply line L3 are turned OFF. By turning OFF the switch SW5 corresponding to the capacitance C5 connected to the power supply line L2 shared by the PA module M4 or M5 in the ON state and the PA module 3 in the OFF state via the switch SW1, the responsiveness of the PA module M4 can be improved. In addition, by turning OFF the switches SW3 and SW4 corresponding to the capacitances C3 and C4 connected to the power supply line L3 shared by the PA module M4 or M5 in the ON state and the PA modules M1 and M5 in the OFF state, the influence of the capacitances C3 and C4 can be eliminated, and the responsiveness of the PA module M4 can be improved.

[0054] Furthermore, as described above, when the operation of the PA module M1 is in the OFF state and the operation of the PA module M4 or the PA module M5 is in the ON state, the switch SW2 corresponding to the capacitance C2 connected to the power supply line L1 is turned ON. That is, the switch SW2 is turned ON to enable the capacitance C2. By enabling the capacitance C2, the influence of a leak signal in which a signal in the frequency band in which the PA module M4 or the PA module M5 operates or its harmonic signal leaks to the PA module M2 via the power supply line L1 is suppressed. This makes it possible to improve the isolation characteristics between the power supply line L1 and the power supply lines L2 and L3.

[0055] When contacts a and c of switch SW1 are connected, switches SW2, SW3, and SW4 corresponding to capacitance C5 connected to power supply line L2 and capacitances C3 and C4 connected to power supply line L2 are simultaneously turned off, and switch SW2 corresponding to capacitance C2 connected to power supply line L1 is turned on, thereby simultaneously achieving improved isolation performance between the power supply lines and improved responsiveness.

[0056] Alternatively, when contacts a and c of switch SW1 are connected, by simultaneously turning off switches SW2, SW3, and SW4 corresponding to capacitances C2, C3, and C4 on power supply line L1 and turning on switch SW5 corresponding to capacitance C5 on power supply line L2, it is possible to simultaneously achieve improved isolation performance between power supply lines L1 and L2 and improved responsiveness.

[0057] 4 is a diagram showing the operating states of each PA module according to the switching of the switch SW1, and the states of the other switches SW2, SW3, SW4, and SW5 at that time. Also, FIG. 4 shows possible combinations of EN-DC.

[0058] 4, when the contact a of the switch SW1 is connected to the contact b on the power supply modulator PM1 side, the PA module M1 is on, the PA module M2 is off, the PA module M3 is on, the PA module M4 is off, and the PA module M5 is off, the switches SW2, SW3, and SW4 are off, and the switch SW5 is on. In this state, the combination of UHB and MB can be realized.

[0059] 4, when the contact a of the switch SW1 is connected to the contact b on the power supply modulator PM1 side, the PA module M1 is off, the PA module M2 is off, the PA module M3 is on, the PA module M4 is on, and the PA module M5 is off, the switches SW2, SW3, and SW4 are off, and the switch SW5 is on. In this state, the combination of UHB and MB can be realized.

[0060] 4, when the contact a of the switch SW1 is connected to the contact b on the power supply modulator PM1 side, the PA module M1 is off, the PA module M2 is off, the PA module M3 is on, the PA module M4 is off, and the PA module M5 is on, the switches SW2, SW3, and SW4 are off, and the switch SW5 is on. In this state, the combination of HB and MB can be realized.

[0061] 4, when the contact a of the switch SW1 is connected to the contact c on the power supply modulator PM2 side, and the PA module M1 is on, the PA module M2 is on, the PA module M3 is off, the PA module M4 is off, and the PA module M5 is off, the switch SW2 is on, the switches SW3 and SW4 are off, and the switch SW5 is on. In this state, the combination of UHB and LB can be realized.

[0062] 4, when the contact a of the switch SW1 is connected to the contact c on the power supply modulator PM2 side, the PA module M1 is off, the PA module M2 is on, the PA module M3 is off, the PA module M4 is on, and the PA module M5 is off, the switch SW2 is on, and the switches SW3, SW4, and SW5 are off. In this state, the combination of UHB and LB can be realized.

[0063] 4, when the contact a of the switch SW1 is connected to the contact c on the power supply modulator PM2 side, and the PA module M1 is off, the PA module M2 is on, the PA module M3 is off, the PA module M4 is off, and the PA module M5 is on, the switch SW2 is on, the switch SW3 is off, the switch SW4 is off, and the switch SW5 is off. In this state, the combination of HB and LB can be realized.

[0064] Furthermore, in Fig. 4, regardless of the connection state of the contacts a, b, and c of the switch SW1, when the PA module M1 is off, the PA modules M2 and M3 are on, and the PA modules M4 and M5 are off, the switch SW2 is on or off, the switch SW3 is off, the switch SW4 is off, and the switch SW5 is off or on. In this state, the combination of MB and LB can be realized. The same is true even if the contacts of the switch SW1 are not connected and are in an open state.

[0065] 4 also shows an example of a specific capacitance value of each capacitor. For example, the capacitance C2 is 10 pF, the capacitance C3 is 30 pF, the capacitance C4 is 20 pF, and the capacitance C5 is 10 pF.

[0066] (Band Combination) Fig. 5 is a diagram for explaining band combinations that cause deterioration of intermodulation distortion characteristics. As band combinations, as shown in Fig. 5, the combination of LB and MB, the combination of LB and HB, the combination of LB and UHB, the combination of MB and HB, the combination of MB and UHB, and the combination of HB and UHB are possible. These combinations may cause intermodulation distortion (hereinafter referred to as "IMD").

[0067] In FIG. 5, for the combination of LB and MB, intermodulation distortion IMD2 may occur due to the second harmonic distortion 2HD of LB and MB. For the combination of LB and HB, intermodulation distortion IMD3 may occur due to the third harmonic distortion 3HD of LB and MB. For the combination of LB and UHB, intermodulation distortion IMD4 may occur due to the fourth harmonic distortion 4HD of LB and MB. For the combination of MB and HB, intermodulation distortion IMD4 may occur due to the fourth harmonic distortion 4HD of MB and the third harmonic distortion 3HD of HB. For the combination of MB and UHB, intermodulation distortion IMD2 may occur due to the second harmonic distortion 2HD of MB and UHB. For the combination of HB and UHB, intermodulation distortion IMD4 may occur due to the fourth harmonic distortion 4HD of HB and the third harmonic distortion 3HD of UHB.

[0068] In FIG. 5, it is of concern that the IMD level is high, particularly for the combination of LB and MB, the combination of LB and HB, the combination of LB and UHB, and the combination of MB and UHB. The IMD level increases as the level of the original signal that generates the IMD increases. The IMD level is relatively high for the combination of LB and MB, the combination of LB and HB, the combination of LB and UHB, and the combination of MB and UHB. If the IMD generated during transmission overlaps with the frequency band of reception, desense occurs due to deterioration of reception sensitivity, and the system standard of the terminal cannot be satisfied. For this reason, it is necessary to reduce the IMD level as much as possible, particularly for the combination of LB and MB, the combination of LB and HB, the combination of LB and UHB, and the combination of MB and UHB.

[0069] Fig. 6 is a diagram for explaining the isolation characteristics between two power supply lines. Fig. 6 shows the flow of a leak signal in the power supply system 100 described with reference to Fig. 1. Fig. 7 is a diagram showing the operating states of each PA module in the state shown in Fig. 6 and the states of each switch at that time.

[0070] 7, when the contact a of the switch SW1 is connected to the contact b on the power supply modulator PM1 side, the PA module M1 is on, the PA module M2 is off, and the PA module M3 is on, the switches SW2 and SW3 are off, and the switch SW5 is on. In this state, the combination of UHB and MB can be realized.

[0071] Returning to FIG. 6, when contact a and contact b are connected and contact a and contact c are not connected, a leak signal S1 may leak from the power line L3 to the power line L2. For example, the fundamental wave of the UHB band may leak as the leak signal S1. Also, a leak signal S2 may leak from the power line L2 to the power line L3. For example, the second harmonic of the MB band may leak as the leak signal S2. To suppress the effects of the leakage of these leak signals S1 and S2, the switch SW5 is turned on as shown by the arrow Y1, and a capacitor C5 is connected between the power line L2 and the reference potential. By connecting the capacitor C5 between the power line L2 and the reference potential, the effects of the leakage can be suppressed.

[0072] Fig. 8 is a diagram showing an example of the leak signal in Fig. 6. In Fig. 8, the horizontal axis is frequency (GHz) and the vertical axis is the level (dB) of the seek signal. Fig. 8 shows the leak signal Soff when the switch SW5 shown in Fig. 6 is turned off and the capacitor C5 is not connected, and the leak signal Son when the switch SW5 is turned on and the capacitor C5 is connected.

[0073] As shown in Fig. 8, when the switch SW5 is turned on and the capacitor C5 is connected, the level of the leak signal Son drops at a frequency fh of about 3.5 GHz, which corresponds to the UHB signal. In contrast, when the switch SW5 is turned off and the capacitor C5 is not connected, the leak signal Soff does not drop. Therefore, by turning on the switch SW5 and connecting the capacitor C5, the effect of leakage of the leak signal can be suppressed.

[0074] (Example of power modulator application for PM module combination) 9 to 14 are diagrams showing examples of application of a power modulator to a combination of PM modules.

[0075] Fig. 9 is a diagram showing an example of a power supply system using three power modulators for four PA modules. The power supply system shown in Fig. 9 includes a PA module MM1 that amplifies signals in the LB band, a PA module MM2 that amplifies signals in the MB band and the HB band, a PA module MM3 that amplifies signals in the HB band, and a PA module MM4 that amplifies signals in the UHB band. The power supply system shown in Fig. 9 also includes power modulators PM1, PM2, and PM3.

[0076] The power modulator PM1 is connected to the PA module MM1. The power modulator PM2 is connected to the PA module MM2. The power modulator PM3 is connected to the PA modules MM3 and MM4.

[0077] FIG. 10 is a diagram showing whether the power modulator can support the combination of EN-DC shown in FIG. 9. As shown in FIG. 10, when the LB band signal and the MB band signal are amplified using the PA module MM1 and the PA module MM2, power is supplied from the power modulators PM1 and PM2, so such a combination is supported. When the LB band signal and the HB band signal are amplified using the PA module MM1 and the PA module MM2, power is supplied from the power modulators PM1 and PM2, so such a combination is supported. When the LB band signal and the UHB band signal are amplified using the PA module MM1 and the PA module MM4, power is supplied from the power modulators PM1 and PM3, so such a combination is supported. When the MB band signal and the HB band signal are amplified using the PA module MM2 and the PA module MM3, power is supplied from the power modulators PM2 and PM3, so such a combination is supported. When using PA module MM2 and PA module MM4 to amplify MB band signals and UHB band signals, power is supplied from power modulators PM2 and PM3, so such combinations can be supported. When using PA module MM3 and PA module MM4 to amplify HB band signals and UHB band signals, power is supplied from power modulators PM2 and PM3, so such combinations can be supported. In other words, using three power modulators PM1 to PM3 allows any combination of EN-DC to be supported.

[0078] Fig. 11 is a diagram showing an example in which two power modulators are used for four PA modules. Fig. 11 shows a configuration in which the power modulator PM3 is deleted from the configuration shown in Fig. 9. The power modulator PM1 is connected to the PA modules MM1 and MM2. The power modulator PM2 is connected to the PA modules MM3 and MM4.

[0079] Figure 12 is a diagram showing whether the power supply modulators are compatible with the EN-DC combinations shown in Figure 11. Unlike the case of Figure 10, the number of power supply modulators is reduced, so some combinations cannot be supported. That is, when amplifying LB band signals and MB band signals, it is necessary to supply power from the power supply modulator PM1 to the two PA modules MM1 and MM2, and such combinations cannot be supported.

[0080] When amplifying LB band signals and HB band signals, power is supplied from the power modulator PM1 to the PA module MM1, and power is supplied from the power modulator PM2 to the PA module MM3, so such combinations can be supported. When amplifying LB band signals and UHB band signals, power is supplied from the power modulator PM1 to the PA module MM1, and power is supplied from the power modulator PM2 to the PA module MM4, so such combinations can be supported. When amplifying MB band signals and HB band signals, power is supplied from the power modulator PM1 to the PA module MM2, and power is supplied from the power modulator PM2 to the PA module MM3, so such combinations can be supported. When amplifying MB band signals and UHB band signals, power is supplied from the power modulator PM1 to the PA module MM2, and power is supplied from the power modulator PM2 to the PA module MM4, so such combinations can be supported. When amplifying a signal in the HB band and a signal in the UHB band, power is supplied from the power modulator PM1 to the PA module MM2, and power is supplied from the power modulator PM2 to the PA module MM4, so that such a combination can be supported.

[0081] Fig. 13 is a diagram showing another example in which two power supply modulators are used for four PA modules. In Fig. 13, as described with reference to Figs. 1 and 3, by providing switch SW1, two power supply modulators are used for four PA modules. In this example, switch SW1 is provided in PA module MM4a. By switching the connection state of the power supply line with switch SW1, all combinations of EN-DC can be supported even when two power supply modulators are used for four PA modules.

[0082] FIG. 14 is a diagram showing whether the power modulator can support the combination of EN-DC shown in FIG. 13. As shown in FIG. 14, when LB band signals and MB band signals are amplified, power is supplied from the power modulators PM1 and PM2 to the PA module MM1 and the PA module MM2 by the setting of the switch SW1, so such combinations can be supported. When LB band signals and HB band signals are amplified, power is supplied from the power modulators PM1 and PM2 to the PA module MM1 and the PA module MM2 by the setting of the switch SW1, so such combinations can be supported. When LB band signals and UHB band signals are amplified, power is supplied from the power modulator PM1 to the PA module MM1 and from the power modulator PM2 to the PA module MM4a by the setting of the switch SW1, so such combinations can be supported. When MB band signals and HB band signals are amplified, power is supplied from the power modulator PM2 to the PA module MM2 and from the power modulator PM1 to the PA module MM3 by the setting of the switch SW1, so such combinations can be supported. When amplifying MB band signals and UHB band signals, the setting of switch SW1 allows power to be supplied from power modulator PM2 to PA module MM2 and from power modulator PM1 to PA module MM4a, respectively, so that such combinations can be supported. When amplifying HB band signals and UHB band signals, the setting of switch SW1 allows power to be supplied from power modulator PM1 to PA module MM3 and from power modulator PM2 to PA module MM4a, respectively, so that such combinations can be supported. In other words, unlike the cases of Figures 11 and 12, even if two power modulators PM1 and PM2 are used, any combination of EN-DC can be supported by switching switch SW1.

[0083] (effect) When switching the connection state of the power supply modulators PM1, PM2 to the power supply lines L1, L2, by operating other switches simultaneously with the switching of the switch SW1, as in the first embodiment, it is possible to suppress the effects of leakage signals leaking through the power supply lines and obtain good isolation characteristics between the power supply lines.

[0084] Furthermore, by setting the switches of the capacitors that do not need to be connected to off, it is possible to prevent deterioration of the start-up response performance during the operation of the PA module.

[0085] Third embodiment Fig. 15 is a block diagram showing a power supply system according to a third embodiment of the present disclosure. In Fig. 3, the power supply system 100b according to the third embodiment is different from the power supply system 100 according to the first embodiment in that a switch SW1 is provided separately from the PA module M1a. That is, while the power supply system 100 according to the first embodiment provides the switch SW1 in the PA module M1, the power supply system 100b provides the switch SW1 outside the PA module M1a.

[0086] Even if the switch SW1 is provided outside the PA module M1, the operation is the same as that of the power supply system 100 according to the first embodiment. Therefore, by setting the switch SW1, it is possible to improve the isolation characteristics between the power supply line L1 and the power supply line L2. In addition, by setting the other switches SW2, SW3, and SW5, it is possible to prevent deterioration of the start-up response performance in the operation of the PA module.

[0087] (Modification) In each of the above-described embodiments, the switch circuit SW or SWa may be realized as a switch array IC in which only the switches are integrated. The switch circuit SW or SWa may be mounted in any of the PA modules. The switch circuit SW or SWa may be mounted on a substrate outside the PA module.

[0088] In addition, the capacitors C1 to C5 connected to the power supply lines L1, L2, and L3 may be SMD components mounted in any of the PA modules, or may be provided in the switch circuit SW or SWa. The capacitors C1 to C5 may be realized by combining multiple capacitors. The capacitors C1 to C5 may be fixed capacitances, or may have a function of switching the capacitance value via a switch that switches multiple capacitors. [Explanation of symbols]

[0089] 10 Control circuit 100, 100a, 100b Power Supply System C1~C5 Capacity L1~L3 Power lines M1~M5, M1a, MM1~MM4, MM4a PA modules PA1~PA5 Power Amplifiers PM1~PM3 Power Modulators SW, SWa Switch circuit SW1~SW5 Switches

Claims

1. a first module including a first power amplifier for amplifying a signal; a first power line for supplying power to the first module; a second power line for supplying power to the first module; a first capacitor having one end connected to the first power supply line; a second capacitor having one end connected to the second power supply line; a first switch that switches between a first connection state in which the first power supply line is electrically connected to the first module and a second connection state in which the second power supply line is electrically connected to the first module; a second switch that connects the first power supply line to the first module by the first switch and is capable of connecting the other end of the second capacitance to a reference potential when the first module is driven; a third switch that connects the second power supply line to the first module by the first switch and is capable of connecting the other end of the first capacitance to a reference potential when the first module is driven; A power supply system including:

2. Other modules, including other power amplifiers to amplify the signal, a third power supply line electrically connecting the first switch and the first module; Further comprising: In the first connection state, power is supplied to one of the first module and the other module via the first power supply line and the third power supply line; In the second connection state, power is supplied to either the first module or the other module via the second power supply line and the third power supply line. The power supply system according to claim 1 .

3. a second module including a second power amplifier for amplifying the signal; the second module is connected to the first power supply line without passing through the first switch; the second switch connects the other end of the second capacitance to a reference potential when the first module and the second module are driven; The power supply system according to claim 1 .

4. a third module including a third power amplifier for amplifying the signal; the third module is connected to the second power supply line without passing through the first switch; the second capacitance is connected between the first switch and the third module in the second power supply line; The power supply system according to claim 3 .

5. a third module including a third power amplifier for amplifying the signal; the third module is connected to the second power supply line without passing through the first switch; the third switch connects the other end of the first capacitance to a reference potential when the first module and the third module are driven; The power supply system according to claim 1 .

6. a second module including a second power amplifier for amplifying the signal; the second module is connected to the first power supply line without passing through the first switch; the first capacitance is connected between the first switch and the second module in the first power supply line; The power supply system according to claim 5 .

7. a frequency band of a signal amplified by the first power amplifier in the first module and a frequency band of a signal amplified by the other power amplifier in the other module are different from each other; The power supply system according to claim 2 .

8. a frequency band of a signal amplified by the first power amplifier in the first module and a frequency band of a signal amplified by the second power amplifier in the second module are different from each other; The power supply system according to claim 3 .

9. a frequency band of a signal amplified by the first power amplifier in the first module and a frequency band of a signal amplified by the third power amplifier in the third module are different from each other; The power supply system according to claim 4.

10. a third capacitor having one end connected to the third power supply line; a fourth switch that switches between a state in which the other end of the third capacitance is connected to a reference potential and a state in which the other end of the third capacitance is not connected to the reference potential; Further comprising: The power supply system according to claim 2 .

11. a second module including a second power amplifier for amplifying the signal; and a third module including a third power amplifier for amplifying the signal. Further comprising: the third capacitance is connected to a node between the first module and the other module on the third power supply line; the fourth switch connects the other end of the third capacitance to a reference potential when the second module and the third module are driven; The power supply system according to claim 10.

12. The second switch and the third switch are provided in the same integrated circuit. The power supply system according to claim 1 or 2.

13. The first switch is provided in the first module. The power supply system according to claim 1 or 2.

Images