Resin molding and method for producing the same

Abstract

To provide a resin molding and a method for producing the same capable of preventing decreases in production efficiency and production yield.SOLUTION: A resin molding according to an embodiment comprises an RFID tag, a first resin molding layer provided on a first surface of the RFID tag, and a first intermediate layer placed between the RFID tag and the first resin molding layer. The first intermediate layer is composed of delayed tack agent.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a resin molded article and a method for producing the same. [Background technology]

[0002] 2. Description of the Related Art RFID tags (see Patent Document 1) are known as components for recording information about an object and identifying the object. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2023-77961 A Summary of the Invention [Problem to be solved by the invention]

[0004] In order to protect the RFID tag, the RFID tag may be embedded in the resin during injection molding. In this case, the RFID tag placed in the mold during injection molding may be compressed by the flow of molten resin (injected resin), causing the RFID tag to be damaged, or the RFID tag may be swayed by the flow of injected resin, or may be displaced from its installed position, causing resin to adhere to unwanted locations. When the above-mentioned defects occur, the resin molded product including the RFID tag is a defective product because it is not manufactured in a desired state, and the manufacturing yield of the resin molded product decreases. From the viewpoint of improving the manufacturing yield, for example, it is possible to apply an adhesive to the RFID tag in advance and attach the RFID tag to the injected resin in the mold. However, in this case, since the RFID tag coated with the adhesive has adhesiveness, the handling of the RFID tag is reduced compared to when the adhesive is not applied, and as a result, the manufacturing efficiency of the resin molded product including the RFID tag decreases.

[0005] An object of the present disclosure is to provide a resin molded product and a manufacturing method thereof that can prevent a decrease in manufacturing efficiency and manufacturing yield. [Means for solving the problem]

[0006] A resin molded product according to one aspect of the present disclosure includes an RFID tag, a first resin molded layer provided on a first surface of the RFID tag, and a first intermediate layer disposed between the RFID tag and the first resin molded layer, the first intermediate layer being composed of a delayed tack agent.

[0007] The resin molded product has a first intermediate layer made of a delayed tack agent between the RFID tag and the first resin molded layer. Such a resin molded product can be manufactured, for example, by applying a delayed tack agent to the RFID tag and then forming the first resin molded layer by injection molding. The delayed tack agent does not exhibit adhesion below a certain temperature, but exhibits adhesion above a certain temperature. Therefore, it is possible to prevent the adhesion of the delayed tack agent from being exhibited until the RFID tag is placed in a mold for injection molding, and it is possible to attach the RFID tag to the resin (hereinafter sometimes referred to as "injected resin") melted by the adhesion of the delayed tack agent during injection molding. Since the adhesion of the delayed tack agent is not exhibited until the RFID tag is placed in the mold, the handling property of the RFID tag is not reduced even if the delayed tack agent is applied. Therefore, a reduction in manufacturing efficiency is prevented. During injection molding, the RFID tag adheres to the injected resin due to the adhesiveness of the delayed tack agent, so the RFID tag is unlikely to deform or become displaced from its designated position. This prevents a decrease in the production yield of the resin molded product. Therefore, the resin molded product having the above configuration can prevent a decrease in production efficiency and production yield.

[0008] The resin molded product according to one embodiment may further include a second resin molded layer on the opposite side of the RFID tag from the first resin molded layer, in which case the RFID tag can be protected by the first resin molded layer and the second resin molded layer.

[0009] The resin molded product according to one embodiment further includes a second intermediate layer disposed between the second resin molded layer and the RFID tag, and the second intermediate layer may be made of a delayed tack agent.

[0010] The resin molded product is manufactured, for example, as follows. First, a laminate is manufactured, which has a first resin molded product, a first intermediate layer, and an RFID tag, and in which the first intermediate layer and the RFID tag are laminated in order on the first resin molded product. Next, a delayed tack agent is applied to the surface of the RFID tag opposite to the first intermediate layer. Thereafter, a second resin molded layer is formed by injection molding on the laminate coated with the delayed tack agent, thereby obtaining a resin molded product having the second intermediate layer. Due to the characteristics of the delayed tack agent, it is possible to prevent the adhesiveness of the delayed tack agent from appearing until the laminate coated with the delayed tack agent is placed in a mold for injection molding, and it is possible to attach the laminate to the injected resin by the adhesiveness of the delayed tack agent during injection molding. Since the adhesiveness of the delayed tack agent is not appeared until the laminate is placed in the mold, the handleability of the laminate is not reduced even if the delayed tack agent is applied. Therefore, a reduction in manufacturing efficiency can be prevented. During injection molding, the adhesiveness of the delayed tack agent causes the laminate to stick to the injected resin, so the laminate is less likely to deform or shift from its designated position, and this helps prevent a decrease in production yield.

[0011] When the melting temperature of the resin constituting the first resin molding layer is Tm [°C], the delayed tack agent constituting the first intermediate layer may have adhesiveness at (Tm-80) [°C] or more and Tm [°C] or less. In this case, the adhesiveness of the delayed tack agent is not exhibited until the RFID tag is placed in the injection molding die, while the adhesiveness of the delayed tack agent makes it possible to more reliably attach the RFID tag to the injected resin during injection molding.

[0012] A manufacturing method for a resin molded product according to another aspect of the present disclosure includes a first coating step of coating a delayed tack agent on a first surface of an RFID tag, and a first injection molding step of injection molding the RFID tag coated with the delayed tack agent to form a first resin molded layer on the first surface side of the RFID tag.

[0013] The delayed tack agent does not exhibit adhesiveness below a certain temperature, but exhibits adhesiveness above a certain temperature. Therefore, it is possible to prevent the adhesiveness of the delayed tack agent from appearing until the RFID tag is placed in the mold for injection molding, and it is possible to attach the RFID tag to the injected resin by the adhesiveness of the delayed tack agent during injection molding. Since the adhesiveness of the delayed tack agent is not exhibited until the RFID tag is placed in the mold, the handling property of the RFID tag does not decrease even if the delayed tack agent is applied. Therefore, it is possible to prevent a decrease in manufacturing efficiency. During injection molding, the RFID tag is attached to the injected resin by the adhesiveness of the delayed tack agent, so that defects such as deformation of the RFID tag or displacement from a predetermined position are unlikely to occur. Therefore, the above manufacturing method also prevents a decrease in the manufacturing yield of the resin molded product. Therefore, the above manufacturing method can prevent a decrease in manufacturing efficiency and manufacturing yield.

[0014] The manufacturing method of a resin molded product according to one embodiment may further include a second injection molding step of forming a second resin molded layer on a second surface side of the RFID tag opposite the first surface by injection molding a laminate of the RFID tag and the first resin molded layer obtained by the first injection molding step.

[0015] In this case, a resin molded product can be manufactured that includes a first resin molded layer, a first intermediate layer, an RFID tag, and a second resin molded layer, and that has the first intermediate layer, the RFID tag, and the second resin molded layer disposed in this order on the first resin molded layer. In this resin molded product, the RFID tag can be protected by the first resin molded layer and the second resin molded layer.

[0016] The manufacturing method of a resin molded product according to one embodiment may further include a second coating step, which is carried out between the first injection molding step and the second injection molding step, of coating the second surface with a delayed tack agent.

[0017] In this case, due to the characteristics of the delayed tack agent, the adhesiveness of the delayed tack agent is not manifested until the laminate coated with the delayed tack agent is placed in a mold for injection molding, while the adhesiveness of the delayed tack agent allows the laminate to be attached to the injected resin during injection molding. Since the adhesiveness of the delayed tack agent is not manifested until the laminate is placed in the mold, the handleability of the laminate does not decrease even if the delayed tack agent is applied. During injection molding, the adhesiveness of the delayed tack agent causes the laminate to adhere to the injected resin, so that defects such as deformation of the laminate or displacement from a predetermined position are unlikely to occur. Effect of the Invention

[0018] According to the present disclosure, it is possible to provide a resin molded product and a manufacturing method thereof that can prevent a decrease in manufacturing efficiency and manufacturing yield. [Brief description of the drawings]

[0019] [Figure 1] FIG. 1 is a plan view of an example of an RFID tag 10. As shown in FIG. [Diagram 2] FIG. 2 is a schematic diagram for explaining the configuration of the resin molded product according to the first embodiment. [Diagram 3] FIG. 3 is a schematic diagram for explaining the configuration of the resin molded product 1 according to the second embodiment. [Figure 4] FIG. 4 is a schematic diagram for explaining the configuration of a resin molded product 1B according to the third embodiment. [Diagram 5] FIG. 5 is a perspective view of a resin molded product according to the fourth embodiment. [Figure 6] FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. [Figure 7] FIG. 7 is a schematic diagram for explaining an example of the configuration of a resin molded product according to a reference example. [Figure 8] FIG. 8 is a schematic diagram for explaining another example of the configuration of the resin molded product according to the reference example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. The same elements are given the same reference numerals, and duplicated explanations will be omitted. The dimensional ratios of the drawings do not necessarily match those in the description.

[0021] An RFID tag (Radio Frequency Identification) 10 provided in the resin molded product described in the present disclosure will be described with reference to FIG. 1. FIG. 1 is a plan view of an example of the RFID tag 10. The RFID tag 10 is configured by disposing a main body 12 on a support sheet 11. The RFID tag 10 is also called an IC tag, an RF tag, an electronic tag, a wireless tag, an RFID inlay, or the like. The support sheet 11 is, for example, a resin sheet. An example of the material of the resin sheet as the support sheet 11 is polyethylene terephthalate (PET). The main body 12 includes an IC chip 121 in which information of an object to which the RFID tag 10 is attached is recorded, and an antenna 122 electrically connected to the IC chip 121 for communication. In the RFID tag 10, the surface on which the main body 12 is disposed is called a first surface 10a.

[0022] The planar shape of the RFID tag 10 (shape seen from the thickness direction) is not limited. In the following description, unless otherwise specified, the planar shape of the RFID tag 10 is rectangular. An example of the length of the RFID tag 10 in the longitudinal direction is 10 mm or more and 100 mm or less, and an example of the length of the RFID tag 10 in the lateral direction is 10 mm or more and 50 mm or less. An example of the thickness of the RFID tag 10 is 25 μm or more and 100 μm or less.

[0023] (First embodiment) 2 is a schematic diagram for explaining the configuration of the resin molded product 1 according to the first embodiment. The resin molded product 1 is an integrally molded product in which an RFID tag 10 and resin are integrated by injection molding. The shape of the resin molded product 1 may be a sheet shape, or may be the shape of the object itself recorded in the RFID tag 10. The resin molded product 1 has the RFID tag 10, a resin molded layer 21 (first resin molded layer), and an intermediate layer (first intermediate layer) 31.

[0024] The resin molded layer 21 is provided on the first surface 10a of the RFID tag 10. The material of the resin molded layer 21 is not limited as long as it is a resin (e.g., thermoplastic resin) that can be integrated with the RFID tag 10 by injection molding. Examples of the material of the resin molded layer 21 include soft polyvinyl chloride, polypropylene (PP), polyethylene (PE), and PET.

[0025] The intermediate layer 31 is composed of a delayed tack agent. The delayed tack agent is an emulsion formed by dispersing and blending a solid plasticizer and a tackifier in a base latex. The delayed tack agent does not have adhesiveness up to a certain temperature, but becomes adhesive when heated to a certain temperature or higher. When the melting temperature of the resin constituting the resin molded layer 21 is Tm [°C], an example of the delayed tack agent is a delayed tack agent that satisfies the following condition (I). (Condition I) It exhibits adhesiveness at temperatures above (Tm-80) [℃] and below Tm [℃].

[0026] An example of a method for producing the above-mentioned resin molded product 1 will be described.

[0027] First, a delayed tack agent is applied to the first surface 10a of the RFID tag 10 (first application step). The delayed tack agent is dried. As a result, an intermediate layer 31 is formed on the first surface 10a as a coating layer of the delayed tack agent. Thereafter, the RFID tag 10 on which the intermediate layer (coating layer) 31 is formed is placed in a mold for injection molding and injection molded (first injection molding step). When placing the RFID tag 10 in the mold, the RFID tag 10 is placed in the mold so that the molten resin flows into the intermediate layer 31 side. By performing the first injection molding step, the resin molding layer 21 is formed on the intermediate layer 31, and the resin molded product 1 is obtained. Hereinafter, the resin that is supplied into the mold to become the resin molding layer 21 is also referred to as the injected resin.

[0028] In the configuration of the resin molded product 1, the RFID tag 10 is embedded in the resin molded product 1. This makes it possible to prevent the RFID tag 10 from deteriorating due to moisture, light, and the like. By using an opaque material for the support sheet 11 and the resin molded layer 21, or by applying printing or the like to the outer surface of the resin molded product 1 so that the RFID tag 10 is not visible, it is possible to conceal the location of the RFID tag 10 from anyone other than a person who knows the location of the RFID tag 10 in advance, such as a user. Therefore, the configuration of the resin molded product 1 contributes to preventing counterfeiting, tampering, and reuse of the RFID tag 10.

[0029] In view of the above, the resin molded product 1 can be used for theft prevention, authenticity verification, detailed display of product information, locating and manufacturing underground buried pipes, and guiding the blind and elderly.

[0030] As described above, the resin molded product 1 has the intermediate layer 31 between the RFID tag 10 and the resin molded layer 21. The intermediate layer 31 is formed of a delayed tack agent. Such a resin molded product 1 is manufactured by injection molding the RFID tag 10 coated with the delayed tack agent as described above.

[0031] Since the delayed tack agent becomes sticky when heat of a predetermined temperature or higher is applied, the delayed tack agent becomes sticky due to the heat of the injected resin during injection molding. Since the delayed tack agent becomes sticky, the RFID tag 10 sticks to the resin via the delayed tack agent in the first injection molding process. Therefore, even if the injected resin flows in the mold, the RFID tag 10 is prevented from swinging, and the RFID tag 10 can be held in a fixed position in the mold. Therefore, the occurrence of problems such as damage to the RFID tag 10 (including compression and crushing) due to the flow of the injected resin and adhesion of resin to an unexpected position on the RFID tag 10 is suppressed. Therefore, a decrease in the manufacturing yield of the resin molded product 1 can be prevented.

[0032] As a method for attaching the RFID tag 10 to the resin during injection molding, it is possible to use an adhesive, an anchor coating agent (hereinafter referred to as an "AC coating agent"), or a hot melt agent instead of a delayed tack agent.

[0033] However, when an adhesive is used, the adhesive becomes sticky at the stage of coating the RFID tag 10, so that the RFID tag 10 coated with the adhesive is difficult to store and the handling of the RFID tag 10 is reduced. Therefore, for example, a process of further laminating a separator to the adhesive or peeling off the laminated separator is required. When an AC coating is used, after the RFID tag 10 is coated with the AC coating agent, a hardening reaction progresses over time, so that the RFID tag 10 coated with the AC coating agent cannot be stored for a long period of time. Since the AC coating agent also has adhesiveness, the handling property is reduced and a process such as laminating the separator is required, as in the case of an adhesive. When a hot melt agent is used, since it is reversible due to heat, it softens under high temperature conditions, and there is a possibility that the RFID tag 10 in the resin molded product is peeled off from the resin molded layer.

[0034] The delayed tack agent does not develop adhesiveness when heated below a predetermined temperature. Therefore, even when the delayed tack agent is applied to the RFID tag 10, blocking, in which the RFID tag 10 unintentionally sticks to surrounding objects, does not occur. Therefore, the RFID tag 10 coated with the delayed tack agent is easy to store. For example, it is possible to apply the delayed tack agent to a connecting sheet (base sheet) of multiple RFID tags 10 that share the support sheet 11, dry it, and wind it up into a roll and store it. Alternatively, it is possible to store multiple RFID tags 10 coated with the delayed tack agent in a stacked manner. In order to more reliably prevent the blocking, the storage conditions (temperature, etc.) may be managed. Since the delayed tack agent has a property of not developing adhesiveness when heated below a predetermined temperature, the RFID tag 10 does not become sticky when placed in a mold, and there is no need to attach and peel off a separator as described above. Therefore, the RFID tag 10 coated with the delayed tack agent can be prevented from being difficult to handle, and the resin molded product 1 can be efficiently manufactured.

[0035] Since the delayed tack agent has adhesiveness at a predetermined temperature or higher, the RFID tag 10 is unlikely to peel off from the resin molding layer 21 even if the resin molding 1 is used in a high-temperature environment.

[0036] As described above, when the melting temperature of the resin forming the resin molding layer 21 is Tm [°C], an example of the above-mentioned predetermined temperature is (Tm-80) [°C]. In this case, the delayed tack agent does not exhibit adhesiveness at room temperature, typically 25°C, and the adhesiveness does not appear even at midsummer temperatures. Therefore, when storing the RFID tag 10 coated with the delayed tack agent, management of the storage condition is unnecessary or easy. Since the delayed tack agent needs to have adhesiveness during injection molding, the delayed tack agent exhibits adhesiveness at or below Tm [°C]. Therefore, a delayed tack agent that satisfies the above condition (I) is effective.

[0037] During injection molding, the RFID tag 10 is easily attached to the injected resin in the mold via the delayed tack agent due to the adhesiveness of the delayed tack agent. Therefore, moisture is unlikely to penetrate or accumulate between the RFID tag 10 and the resin molding layer 21. As a result, as described above, deterioration of the RFID tag 10 due to moisture can also be prevented. In other words, in the configuration of the resin molding 1, the RFID tag 10 is better protected against moisture.

[0038] The delayed tack agent exhibits adhesiveness by thermal activation after being applied to the RFID tag 10, and therefore has a lower affinity for the injected resin than the above-mentioned adhesives, AC coating agents, and hot melt agents. This allows greater freedom in the selection of the resin that forms the resin molding layer 21. This also increases the freedom in the selection of the application of the RFID tag 10.

[0039] Second embodiment Fig. 3 is a schematic diagram for explaining the configuration of a resin molded product 1A according to the second embodiment. The resin molded product 1A shown in Fig. 3 differs from the resin molded product 1 according to the first embodiment in that it further includes a resin molded layer (second resin molded layer) 22 on the opposite side of the resin molded layer 21 with respect to the RFID tag 10. An example of the material of the resin molded layer 22 of the resin molded product 1A is the same as that of the resin molded layer 21. The materials of the resin molded layer 21 and the resin molded layer 22 may be the same or different.

[0040] The resin molded product 1A is manufactured, for example, as follows. For convenience of explanation, in the resin molded product 1A, a laminate of the resin molded layer 21, the intermediate layer 31, and the RFID tag 10 is referred to as a "laminate 2." The laminate 2 is the same as the resin molded product 1 described in the first embodiment.

[0041] When manufacturing the resin molded product 1A, first, the laminate 2 is manufactured in the same manner as in the first embodiment. Then, the laminate 2 is placed in a mold and injection molded to form a resin molded layer 22 on the second surface 10b side of the RFID tag 10 of the laminate 2 (second injection molding step). As a result, the resin molded product 1A is obtained.

[0042] As described above, the laminate 2 included in the resin molded product 1A is the same as the resin molded product 1 described in the first embodiment, and the manufacturing method of the laminate 2 is also the same as that of the resin molded product 1. Therefore, in the stage of manufacturing the laminate 2, the occurrence of defects such as breakage of the RFID tag 10 is suppressed.

[0043] In the second injection molding step, injection molding is performed on the laminate 2 to form a resin molded layer 22. The laminate 2 has the resin molded layer 22 together with the RFID tag 10. Therefore, when injection molding is performed on the laminate 2, the laminate 2 is less likely to shake compared to the case where the RFID tag 10 is used alone. As a result, even at the stage of the second injection molding step, damage to the laminate 2 is less likely to occur. Therefore, the resin molded product 1A according to the second embodiment and the manufacturing method thereof can improve the manufacturing yield.

[0044] The effect of applying the delayed tack agent to the RFID tag 10 is the same as in the first embodiment.

[0045] Third embodiment 4 is a schematic diagram for explaining the configuration of a resin molded product 1B according to the third embodiment. The resin molded product 1B shown in FIG. 4 differs from the resin molded product 1A according to the second embodiment in that it further includes an intermediate layer (second intermediate layer) 32 between the RFID tag 10 and the resin molded layer 22. The intermediate layer 32 is formed of a delayed tack agent. The delayed tack agent of the intermediate layer 32 is the same as that of the intermediate layer 31. In the resin molded product 1B, the laminate of the resin molded layer 21, the intermediate layer 31, and the RFID tag 10 is referred to as the "laminate 2" as in the second embodiment.

[0046] In the process of producing the resin molded product 1A in the second embodiment, after preparing the laminate 2 and before the second injection molding step, the resin molded product 1 further includes a step (second coating step) of coating a delayed tack agent onto the second surface 10b of the RFID tag 10 of the laminate 2. Except for the second coating step, the resin molded product 1B can be produced in the same manner as in the production of the resin molded product 1A in the second embodiment.

[0047] The resin molded product 1B has the same configuration as the resin molded product 1A according to the second embodiment, except that it includes the intermediate layer 32. The manufacturing method of the resin molded product 1B is the same as the manufacturing method of the resin molded product 1A according to the second embodiment, except that it includes a second coating step. Therefore, the resin molded product 1B and its manufacturing method have the same effects as the resin molded product 1A according to the second embodiment and its manufacturing method.

[0048] When manufacturing a resin molded product 1B having an intermediate layer 32, injection molding is performed on the laminate 2 coated with a delayed tack agent. Therefore, for the same reason as when injection molding is performed on the RFID tag 10 coated with a delayed tack agent in the first embodiment, the laminate 2 can maintain a more stable state even if the injected resin flows in the mold. As a result, the resin molded product 1B and its manufacturing method can prevent a decrease in manufacturing yield. Due to the characteristics of the delayed tack agent, the delayed tack agent does not exhibit adhesiveness until heat is applied in the mold. Therefore, even if the laminate 2 is coated with a delayed tack agent, the laminate 2 is easy to handle, and therefore a decrease in manufacturing efficiency can be prevented.

[0049] (Fourth embodiment) A resin molded product 1C according to a fourth embodiment will be described with reference to Fig. 5 and Fig. 6. Fig. 5 is a perspective view of the resin molded product 1C according to the fourth embodiment. Fig. 6 is a cross-sectional view taken along line VI-VI in Fig. 5.

[0050] The resin molded product 1C is a resin container. An example of the container is a jar container for storing cosmetic cream or the like. In Fig. 5, the illustration of the lid part is omitted. The resin molded product 1C corresponds to the resin molded product 1A of the second embodiment manufactured as a container.

[0051] Therefore, the resin molded product 1C has an RFID tag 10, a resin molded layer 21, an intermediate layer 31, and a resin molded layer 22. In the resin molded product 1C, the resin molded layer 21 is molded into a cylindrical shape so as to form the inner peripheral surface of the body of the container. The resin molded layer 22 is molded into a container shape (parts other than the lid) so as to form the outer peripheral surface of the container. The material of the resin molded layers 21 and 22 is injection moldable and is a material that corresponds to the contents (e.g., cosmetic cream) to be contained in the container.

[0052] The resin molded product 1C is manufactured by using a mold corresponding to the inner surface of the container as the mold used in the first injection molding process when manufacturing the resin molded product 1A in the second embodiment, and using a mold corresponding to the outer surface of the container (or the shape of the container) as the mold used in the second injection molding process.

[0053] As described above, the resin molded product 1C corresponds to the resin molded product 1A of the second embodiment manufactured as a container, and therefore the resin molded product 1C and its manufacturing method have the same effects as the resin molded product 1A and its manufacturing method.

[0054] 5 and 6 show an example in which the RFID tag 10 is embedded in the body of the container (resin molded product 1C), but the position of the RFID tag 10 is not limited to the position shown in the figures. For example, the RFID tag 10 may be embedded in the bottom of the container. In this case, the resin molded layer 21 is formed, for example, so as to constitute the inner surface of the bottom.

[0055] Below, experimental examples relating to resin molded articles will be described. In the following description of the experimental examples, the same elements as those described in the first to fourth embodiments will be given the same reference numerals, and duplicated descriptions will be omitted.

[0056] (Experimental Example 1) A resin molded product having the layer structure shown in Fig. 2 was manufactured as the resin molded product of Experimental Example 1. That is, the resin molded product of Experimental Example 1 had a resin molded layer 21, an intermediate layer 31, and an RFID tag 10. The intermediate layer 31 was disposed between the resin molded layer 21 and the RFID tag 10. The resin molded product of Experimental Example 1 was in a sheet shape.

[0057] The RFID tag 10 had a rectangular shape in plan view (shape seen from the thickness direction). The RFID tag 10 had a length of 60 mm in the longitudinal direction, a length of 25 mm in the lateral direction, and a thickness of 50 mm.

[0058] The material of the intermediate layer 31 was a delayed tack agent (Arontack (registered trademark) TT-1214 manufactured by Toagosei Co., Ltd.). The delayed tack agent had a property of exhibiting adhesiveness at 80°C to 130°C. The material of the resin molded layer 21 was a polypropylene (PP) resin (PM761A manufactured by SunAllomer Co., Ltd.). The thickness of the resin molded layer 21 was 10 mm.

[0059] The resin molded product of Experimental Example 1 was manufactured as follows. That is, the RFID tag 10 was unwound from a roll on which the RFID tag 10 was wound, and the above-mentioned delayed tack agent was applied to the first surface 10a of the RFID tag 10 (the surface on which the main body 12 was disposed). The amount of application was 10 g / m 2 The delayed tack agent was dried, and then the RFID tag 10 was wound up once into a roll. After that, the RFID tag 10 was unwound from the roll, cut into small pieces, and separated. Next, the RFID tag 10 coated with the delayed tack agent was placed in a mold, and injection molding was performed. A resin molding layer 21 was formed by the above-mentioned injection molding, and a resin molded product was manufactured. The injection temperature in the injection molding was 200 degrees.

[0060] (Experimental Example 2) A resin molded article having the layer structure shown in Fig. 3 was manufactured as the resin molded article of Experimental Example 2. That is, the resin molded article of Experimental Example 2 had a resin molded layer 21, an intermediate layer 31, an RFID tag 10, and a resin molded layer 22. The resin molded article of Experimental Example 2 was also in a sheet shape.

[0061] The configuration of the resin molded product of Experimental Example 2 was the same as that of the resin molded product of Experimental Example 1, except that the resin molded product of Experimental Example 2 had a resin molded layer 22 on the RFID tag 10. That is, as in the case of the second embodiment, if a portion of the resin molded product of Experimental Example 2 having the same configuration as the resin molded product of Experimental Example 1 is referred to as the laminate 2, the resin molded product of Experimental Example 2 has the resin molded layer 22 on the second surface 10b of the RFID tag 10 of the laminate 2. Since the configuration of the laminate 2 is the same as that of the resin molded product of Experimental Example 1, the configurations of the RFID tag 10, the intermediate layer 31, and the resin molded layer 21 were the same as those of Experimental Example 1. The material of the resin molded layer 22 was the same as that of the resin molded layer 21. The thickness of the resin molded layer 22 was 10 mm.

[0062] The resin molded product of Experimental Example 2 was manufactured as follows. First, the laminate 2 was manufactured in the same manner as in the case of manufacturing the resin molded product of Experimental Example 1. Then, the laminate 2 was placed in a mold and injection molding was performed. A resin molded layer 22 was formed by the above-mentioned injection molding, and a resin molded product was manufactured. The injection temperature in the injection molding for forming the resin molded layer 22 was 200 degrees.

[0063] (Experimental Example 3) A resin molded article having the layer structure shown in Fig. 4 was manufactured as the resin molded article of Experimental Example 3. That is, the resin molded article of Experimental Example 3 had a resin molded layer 21, an intermediate layer 31, an RFID tag 10, an intermediate layer 32, and a resin molded layer 22. The resin molded article of Experimental Example 3 was also in a sheet shape.

[0064] The configuration of the resin molded product of Experimental Example 3 was the same as that of the resin molded product of Experimental Example 2, except that an intermediate layer 32 was provided between the RFID tag 10 and the resin molded layer 22. In other words, among the multiple layers of the resin molded product of Experimental Example 3, the configurations of the layers other than the intermediate layer 32 were the same as those of Experimental Example 2. The material of the intermediate layer 32 was the same delayed tack agent as the delayed tack agent used in Experimental Example 1.

[0065] The resin molded product of Experimental Example 3 was manufactured as follows. First, the laminate 2 was manufactured in the same manner as in the case of manufacturing the resin molded product of Experimental Example 2. Then, a delayed tack agent was applied to the second surface 10b of the RFID tag 10 of the laminate 2. The amount of the delayed tack agent applied was 10 g / m 2 After the delayed tack agent was dried, the laminate 2 coated with the delayed tack agent was placed in a mold, and the resin molded layer 22 was formed in the same manner as in the case of the experimental example 2, thereby producing the resin molded product of the experimental example 3.

[0066] <Experimental Examples 1-4> Experimental Examples 4 to 7 will be described as reference experimental examples in which the delayed tack agent described in the first to fourth embodiments is not used. For ease of explanation, the same elements described in the first to fourth embodiments are denoted by the same reference numerals in the explanation of Experimental Examples 4 to 7. Duplicate explanations will be omitted.

[0067] (Experimental Example 4) The resin molded product of Experimental Example 4 had a resin molded layer 21 and an RFID tag 10, as shown in Fig. 7. The resin molded layer 21 was provided on the first surface 10a of the RFID tag 10. The configuration of the resin molded product of Experimental Example 4 was the same as that of the resin molded product of Experimental Example 1, except that it did not have the intermediate layer 31. Therefore, the configurations of the RFID tag 10 and the resin molded layer 21 were the same as those of Experimental Example 1. The resin molded product of Experimental Example 4 was also sheet-shaped.

[0068] The resin molded product of Experimental Example 4 was manufactured as follows. The RFID tag 10 was placed in a mold and injection molding was carried out. The above-mentioned injection molding formed a resin molded layer 21, and the resin molded product was manufactured.

[0069] (Experimental Example 5) 8, the resin molded product of Experimental Example 5 had a resin molded layer 21, an intermediate layer 33, and an RFID tag 10. The resin molded layer 21 and the intermediate layer 33 were disposed on the first surface 10a side of the RFID tag 10. The intermediate layer 33 was disposed between the resin molded layer 21 and the RFID tag 10. The resin molded product of Experimental Example 5 was also in a sheet shape.

[0070] The RFID tag 10 and the resin molded layer 21 of the resin molded product of Experimental Example 5 were the same as those of Experimental Example 1. Therefore, the configurations of the RFID tag 10 and the resin molded layer 21 were the same as those of Experimental Example 1. The material of the intermediate layer 33 in Experimental Example 5 was an adhesive (Olivine (registered trademark) BPS5762K manufactured by Toyo Ink Co., Ltd.).

[0071] The resin molded product of Experimental Example 5 was manufactured as follows. The RFID tag 10 was unwound from a roll on which it was wound, and the above-mentioned adhesive was applied to the RFID tag 10. The coating amount was 10 g / m 2 After the adhesive was dried, a release film (separator) was attached, and the RFID tag 10 was once wound into a roll. The RFID tag 10 was then unwound from the roll, cut into small pieces, and separated. Next, the RFID tag 10 from which the release film had been peeled off and to which the adhesive had been applied was placed in a mold, and a resin molded layer 21 was formed by injection molding in the same manner as in Experimental Example 1. In this way, a resin molded product of Experimental Example 5 was obtained.

[0072] (Experimental Example 6) The resin molded product of Experimental Example 6 was different from the resin molded product of Experimental Example 5 in that the material of the intermediate layer 33 was an AC coating agent. The structure of the resin molded product of Experimental Example 6 was the same as that of the resin molded product of Experimental Example 5, except for the difference in the material of the intermediate layer 33. The AC coating agent was a mixture of UNISTOLE (registered trademark) XP01A manufactured by Mitsui Chemicals Inc. and TAKENATE (registered trademark) D-170N manufactured by the same company at a ratio of 200:6. The above mixture ratio of UNISTOLE and TAKENATE is the ratio in the undiluted state.

[0073] The resin molded product of Experimental Example 6 was manufactured in the same manner as in Experimental Example 5, except that the above-mentioned AC coating agent was applied to the RFID tag 10 instead of the adhesive. The coating amount of the AC coating agent was 10 g / m 2 In Experimental Example 6, after the AC coating agent was applied to the RFID tag 10, the solvent that was evaporated was ethyl acetate.

[0074] (Experimental Example 7) The resin molded product of Experimental Example 7 was different from the resin molded product of Experimental Example 5 in that the material of the intermediate layer 33 was a hot melt agent. The structure of the resin molded product of Experimental Example 7 was the same as that of the resin molded product of Experimental Example 5, except for the different material of the intermediate layer 33. The hot melt agent was TOYOMELT (registered trademark) H-297J manufactured by TOYOCHEM CORPORATION.

[0075] Experimental Example 7 was manufactured as follows. That is, the above hot melt agent was applied to the first surface 10a (the surface on which the main body portion 12 is disposed) of the RFID tag 10. The amount of application was, for example, 30 μm. After the hot melt agent was cooled and dried, the RFID tag 10 was placed in a mold, and injection molding was performed under the same conditions as in Experimental Example 4. A resin molded layer 21 was formed by the above injection molding, and a resin molded product was manufactured.

[0076] <Evaluation of resin molded products of Experimental Examples 1 to 7> The resin molded articles of Experimental Examples 1 to 7 were evaluated from the following viewpoints. The evaluation of the resin molded articles also includes an evaluation of the manufacturing process thereof.

[0077] (1) Handling The handleability of the RFID tag 10, which should be placed in a mold when manufacturing a resin molded product, was evaluated. The evaluation was performed based on the presence or absence of the intermediate layers 31, 32, and 33 and the material properties of the intermediate layers 31, 32, and 33. The evaluation criteria were as follows. Evaluation "A": The film can be stored or supplied without occurrence of blocking, and additional steps for preventing blocking (such as lamination and peeling of a separator) are not required. The term "storable without occurrence of blocking" includes, for example, the case where the film can be wound into a roll and stored, and the case where the film can be stacked and stored. Rating "B": Blocking occurs or an additional step is required to prevent blocking.

[0078] (2) Formability An evaluation was made as to whether or not the desired molding had been achieved in the injection molding. Since the resin molding layers 21 and 22 are transparent, the state of the RFID tag 10 of the resin molding was visually observed and evaluated. The evaluation criteria were as follows: Evaluation "A": The desired molding was achieved. The desired shaping is (a) RFID tag 10 is placed in a predetermined position; (b) The RFID tag 10 is not compressed or otherwise deformed; and (c) The resin does not flow around to unnecessary positions in the RFID tag 10 (for example, when forming the resin molding layer 21 on the first surface 10a, the resin does not flow around to the second surface 10b side); It means a state in which the above conditions are met. Grade "B": The desired molding was not achieved. Specifically, at least one of the above (a) to (c) was not satisfied.

[0079] (3) First reading performance Immediately after the resin molding was produced (before the long-term storage described below), an evaluation was made as to whether or not the information on the RFID tag 10 could be read by an RFID reader. The evaluation criteria were as follows. Rating "A": The RFID reader was able to read the information on RFID tag 10. Rating "B": The RFID reader was unable to read the information on RFID tag 10.

[0080] (4) Secondary reading performance After the resin molded product was manufactured, it was stored for six months under conditions of an environmental temperature of 40° C. and a humidity of 90%, and then an evaluation was made as to whether the information on the RFID tag 10 could be read by an RFID reader. The evaluation criteria were as follows. Rating "A": The RFID reader was able to read the information on RFID tag 10. Rating "B": The RFID reader was unable to read the information on RFID tag 10.

[0081] (5) Resistance to the operating environment The following resistance tests were carried out: (Tolerance test) The ambient temperature of the resin molded product was alternately changed between high (85°C) and low (-40°C). A combination of high and low temperature environments was counted as one cycle (42 minutes), and 50 cycles were repeated. The resin molded product was placed in each of the high and low temperature environments for approximately 20 minutes, and the transition between the high and low temperature environments was carried out while changing the temperature at 55°C / min.

[0082] After the above resistance test, a cross section of the resin molded product was observed to evaluate whether the RFID tag 10 had peeled off from the resin molded layer 21. The peeled state included a state in which a part of the RFID tag 10 was floating from the resin molded layer 21 (a state in which a gap was generated). In Experimental Examples 2 and 3, it was evaluated whether the RFID tag 10 had peeled off from the resin molded layer 22. The meaning of the state in which the RFID tag 10 had peeled off from the resin molded layer 22 is the same as in the case of the resin molded layer 21. The evaluation criteria were as follows: Evaluation "A": No peeling occurred. Evaluation "B": Peeling occurred. In Experimental Examples 2 and 3, the case where the RFID tag 10 did not peel off from both of the resin molding layers 21, 22 was evaluated as "A", and the case where peeling occurred from either one was evaluated as "B".

[0083] The evaluation results of the resin molded products of Experimental Examples 1 to 3 from the viewpoints of (1) to (5) above were as shown in Table 1. The evaluation results of the resin molded products of Experimental Examples 4 to 7 from the viewpoints of (1) to (5) above were as shown in Table 1. [Table 1] [Table 2]

[0084] As shown in Table 2, in Experimental Examples 4 to 7 in which no delayed tack agent was used, at least one of the handleability and moldability was evaluated as "B."

[0085] In contrast, as shown in Table 1 above, in Experimental Example 1 having the intermediate layer 31 formed by the delayed tack agent, and Experimental Examples 2 and 3 having the intermediate layers 31 and 32 formed by the delayed tack agent, the evaluations of handleability and moldability were both "A". Since the evaluation of moldability was "A", in Experimental Examples 1 to 3, it was possible to manufacture a resin molded product in a state (desired molded state) that satisfies the above-mentioned (a) to (c). If a resin molded product cannot be manufactured in the desired molded state, it may be judged as a defective product. Therefore, in Experimental Examples 1 to 3, it is understood that the possibility of being judged as a defective product is reduced, and therefore a decrease in manufacturing yield is prevented. Furthermore, in Experimental Examples 1 to 3, it is understood that a decrease in the manufacturing efficiency of resin molded products can also be prevented, since the evaluation of handleability was "A".

[0086] As shown in Table 1 above, in Experimental Examples 1 to 3, evaluation items other than handleability and moldability were also rated "A". From the fact that the first reading performance was rated "A", it can be seen that a decrease in manufacturing yield is prevented. From the fact that the second reading performance was rated "A", it can be seen that the resin molded product can be used stably for a long period of time. Furthermore, from the fact that the resistance evaluation to the usage environment was also rated "A", it can be seen that the flexibility of the range of application of the resin molded product has been improved.

[0087] In Experimental Example 4, the handleability was rated "A", but the other evaluation items were rated "B". In particular, regarding moldability, the RFID tag 10 was compressed and deformed during injection molding, and as a result, the first reading performance and the second reading performance were rated "B". From the results of the evaluation of resistance to the usage environment, it can be seen that simply forming the resin molding layer 21 on the RFID tag 10 by injection molding will cause problems due to changes in the usage environment. Therefore, it can be seen that Experimental Examples 1 to 3, which used a delayed tack agent, are superior to Experimental Example 4.

[0088] The resin molded product of Experimental Example 6 was rated "B" for handleability, moldability, and resistance to the use environment. As for handleability, the manufacturing efficiency is reduced from the same viewpoint as Experimental Example 5. As for moldability, as can be seen from the evaluations of the first reading performance and the second reading performance of "A", the RFID tag 10 did not deform to such an extent that the RFID tag 10 could not be read, but a problem occurred in which the resin was wrapped around the second surface 10b side of the RFID tag 10. Since the AC coating agent used in Experimental Example 6 does not have adhesiveness after curing, the resistance to the use environment was also rated "B". Therefore, in Table 2, the resin molded products of Experimental Examples 1 to 3 are superior to the resin molded product of Experimental Example 6 in terms of the items rated "B".

[0089] The resin molded product of Experimental Example 7 was rated "B" for moldability and resistance to the usage environment. As with Experimental Example 6, no deformation occurred to the extent that the RFID tag 10 could not be read, but a problem occurred in which the resin wrapped around the second surface 10b of the RFID tag 10. The hot melt agent used in Experimental Example 7 softens in a high-temperature environment, so the resistance to the usage environment was also rated "B". Therefore, in terms of the items rated "B" in Table 2, the resin molded products of Experimental Examples 1 to 3 are superior to the resin molded product of Experimental Example 7.

[0090] Although the embodiments of the present disclosure have been described above, the present invention is not limited to the above embodiments, and is intended to include the scope indicated by the claims, and is intended to include all modifications within the meaning and scope of the claims.

[0091] For example, the delayed tack agent constituting intermediate layer 32 (second intermediate layer) may be different from the delayed tack agent constituting intermediate layer 31 (first intermediate layer). The delayed tack agent constituting intermediate layer 32 may be a delayed tack agent that satisfies the condition when Tm in Condition I above is set to T1m, where T1m is the melting temperature of the resin constituting resin molded layer (second resin molded layer) 22.

[0092] Tm, which indicates the melting temperature of the resin under condition I, corresponds to the melting temperature of the injected resin when injection molding is performed on a member (such as an RFID tag) coated with a delayed tack agent. [Explanation of symbols]

[0093] Reference Signs List: 1, 1A, 1B, 1C...resin molded product, 2...laminate, 10...RFID tag, 10a...first surface, 10b...second surface, 21...resin molded layer (first resin molded layer), 22...resin molded layer (second resin molded layer), 31...intermediate layer (first intermediate layer), 32...intermediate layer (second intermediate layer).

Claims

1. An RFID tag; a first resin molding layer provided on a first surface of the RFID tag; a first intermediate layer disposed between the RFID tag and the first resin molded layer; Equipped with The first intermediate layer is composed of a delayed tack agent. Resin molded product.

2. Further, a second resin molding layer is provided on the opposite side of the first resin molding layer with respect to the RFID tag. The resin molded product according to claim 1.

3. a second intermediate layer disposed between the second resin molding layer and the RFID tag; The second intermediate layer is composed of a delayed tack agent. The resin molded product according to claim 2.

4. When the melting temperature of the resin constituting the first resin molded layer is Tm [°C], the delayed tack agent constituting the first intermediate layer has adhesiveness at a temperature of (Tm-80) [°C] or more and Tm [°C] or less. The resin molded product according to any one of claims 1 to 3.

5. a first coating step of coating a delayed tack agent on a first surface of the RFID tag; a first injection molding step of forming a first resin molded layer on the first surface side of the RFID tag by injection molding the RFID tag coated with the delayed tack agent; Equipped with A method for manufacturing a resin molded product.

6. a second injection molding step of forming a second resin molding layer on a second surface side of the RFID tag opposite to the first surface by injection molding a laminate of the RFID tag and the first resin molding layer obtained by the first injection molding step, A method for producing the resin molded product according to claim 5.

7. The method further includes a second coating step, which is performed between the first injection molding step and the second injection molding step, of coating the second surface with a delayed tack agent. The method for producing the resin molded product according to claim 6.

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