Light diffusion packaging material applied to LED tape light and preparation method therefor

Abstract

To provide a light diffusion packaging material applied to an LED tape light and a preparation method therefor.SOLUTION: A light diffusion packaging material applied to an LED tape light is disclosed. The light diffusion packaging material comprises the following raw materials in percentage by weight: 94.09% of a phase A; 2.91% of a phase B; and 3% of a phase C; the phase A is prepared from the following raw materials in percentage by weight: 55 to 95 percent of polydimethylmethylvinylsiloxane, 5 to 45 percent of silicon dioxide, 0 to 8 percent of hydroxyl-terminated polydimethylsiloxane and 0 to 1 percent of auxiliaries; the phase B is prepared from the following raw materials in percentage by weight: 70 to 80 percent of silicon dioxide, 10 to 20 percent of polydimethylsiloxane, 6 to 10 percent of 107 raw rubber and 1.8 to 2.2 percent of a dispersing agent; the phase C is prepared from the following raw materials in percentage by weight: 60 to 70 percent of silicon dioxide, 10 to 20 percent of polydimethylsiloxane, 6 to 10 percent of 107 raw rubber, 4 to 6 percent of titanium dioxide and 5.88 to 7.78 percent of a dispersing agent; and 0.12 to 0.22 percent of a pigment. When the light diffusion packaging material applied to the LED tape light is applied, the problem of color drift of an LED after waterproof treatment is solved, and a color requirement of high-quality light is satisfied.SELECTED DRAWING: None

Description

[Technical field]

[0001] The present application relates to the technical field of polymeric compound compositions, and in particular to a light-diffusing encapsulant used in LED tape lights and a method for preparing the same. [Background technology]

[0002] LED light color temperature refers to the color of the LED light emitted, and is a scale for measuring color. The ingredients currently commonly used in the light diffusion encapsulant for LED strip lights are listed in order of weight percentage: a phase 97%, b phase 3%, Where: The components in phase a raw material are listed in order of predominance by weight percent: Polydimethylvinylsiloxane 55~95%, Silicon dioxide 5-45%, Hydroxy-terminated polydimethylsiloxane 0-8%, and Auxiliary agent 0~1%, The ingredients in phase b are listed in order of most abundant weight percent: Silicon dioxide 70-80%, Polydimethylsiloxane 10-20%, 107 Raw rubber 6~10%, Dispersant 1.8-2.2%.

[0003] However, the problem with using the raw materials for the light-diffusing encapsulant used in the above-mentioned LED tape lights is that after the LED tape lights undergo waterproof sealing processing, the color temperature changes due to the action of the encapsulant, making it impossible to accurately control the color temperature value of the product, and therefore making it impossible to control the color of the finished LED tape lights, and therefore unable to obtain the lighting color desired by users. Summary of the Invention [Problem to be solved by the invention]

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To achieve this objective, the present invention proposes a new light-diffusing encapsulant that can solve the problem of the change in color temperature of the finished LED tape light caused by the waterproofing treatment of the light-diffusing encapsulant. The following technical measures are adopted: [Means for solving the problem]

[0005] Light-diffusing encapsulants used in LED strip lights, in order of the weight percentage of the ingredients in the raw materials: Phase A 94.09%, B phase 2.91%, and C phase 3%, Phase A ingredients in order of most abundant weight percent: Polydimethylvinylsiloxane 55~95%, Silicon dioxide 5~45% Hydroxy-terminated polydimethylsiloxane 0-8%, and Dispersant 0~1%, Phase B ingredients in order of most abundant weight percent: Silicon dioxide 70-80%, Polydimethylsiloxane 10-20%, 107 Raw rubber 6~10%, Dispersant 1.8~2.2%, Phase C ingredients in order of weight percent: Silicon dioxide 60-70%, Polydimethylsiloxane 10-20%, 107 Raw rubber 6~10%, Titanium dioxide 4-6%, Dispersant 5.88~7.78%, Pigment 0.12-0.22%.

[0006] In order to solve the technical problem, one embodiment of the present invention adopts the technical means that the molecular weight of the polydimethylmethylvinylsiloxane of the A phase is 610,000 to 620,000.

[0007] In order to solve the technical problem, one embodiment of the present invention adopts the technical measure that the viscosity of the hydroxy-terminated polydimethylsiloxane in the A phase is 950-1050 Pa·s.

[0008] In order to solve the technical problem, one embodiment of the present invention adopts the following technical means: the dispersants in phase A, phase B, and phase C are all methyl silicone oil, and the viscosity of the methyl silicone oil is 9900 to 10100 Pa·s.

[0009] In order to solve the technical problem, one embodiment of the present invention adopts the technical measure that the particle size of silicon dioxide in the A phase, B phase and C phase is less than 200 mesh, and the particle size of titanium dioxide in the C phase is less than 200 mesh.

[0010] In order to solve the technical problem, one embodiment of the present invention adopts a technical measure in which the molecular weight of polydimethylsiloxane in phases B and C is 610,000 to 620,000.

[0011] In order to solve the technical problem, one embodiment of the present invention adopts a technical measure in which the molecular weight of the 107 raw rubber in the B phase and the C phase is 670,000 to 580,000.

[0012] The present application discloses a method for preparing a light-diffusing encapsulant for use in the above-mentioned LED tape light, the method comprising the steps of: Step 1: Weigh out the raw materials for phase A, phase B, and phase C according to the formula, and use a fine mill to mill the silicon dioxide and titanium dioxide to a particle size of 200 mesh; A step 2 of uniformly kneading the raw materials of phase A and phase B in a rubber kneader to obtain material 1; The method includes step 3 of feeding the material 1 and the raw material of the C phase into a kneader and kneading them uniformly to obtain a light-diffusing encapsulant for use in an LED tape light. Effect of the Invention

[0013] The light diffusing encapsulant used in the LED tape light of the present application can solve the problem of color shift of the LED light source bare board caused by the use of the light diffusing encapsulant, and can solve the problem of color temperature change of the finished LED tape light caused by the waterproofing treatment of the light diffusing encapsulant, so as to solve the color shift problem of the LED after the waterproofing treatment, and meet the high-quality light color requirements.

[0014] The above and / or additional aspects and advantages of the present invention will become more apparent from and will become more readily apparent from the following detailed description of the preferred embodiments taken in conjunction with the accompanying drawings, in which: [Brief description of the drawings]

[0015] [Figure 1] 4 is a color temperature measurement chart after the light diffusing encapsulant in Example 1 is used on an LED light source bare board with a color temperature of 1800K. [Diagram 2] 4 is a color temperature measurement chart after the light diffusing encapsulant in Example 1 is used on an LED light source bare board with a color temperature of 5000K. [Diagram 3] 4 is a color temperature measurement chart after the light diffusing encapsulant in Example 1 is used on an LED light source bare board with a color temperature of 12000K. [Figure 4] 1 is a color temperature measurement chart of an LED light source bare board with a color temperature of 1800K in Comparative Example 1. [Diagram 5] 1 is a color temperature measurement chart of an LED light source bare board with a color temperature of 5000K in Comparative Example 1. [Figure 6] 1 is a color temperature measurement chart of an LED light source bare board with a color temperature of 12000K in Comparative Example 1. [Figure 7] 13 is a color temperature measurement chart after the light-diffusing encapsulant in Comparative Example 2 is used on an LED light source bare board with a color temperature of 1800K. [Figure 8] 13 is a color temperature measurement chart after the light-diffusing encapsulant in Comparative Example 2 is used on an LED light source bare board with a color temperature of 5000K. [Figure 9] 13 is a color temperature measurement chart after the light-diffusing encapsulant in Comparative Example 2 is used on an LED light source bare board with a color temperature of 12000K. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] Here, the specific embodiment of the present invention will be described in detail, and the preferred embodiment of the present invention is shown in the accompanying drawings. The role of the accompanying drawings is to illustrate and supplement the description of the specification text so that people can intuitively and clearly understand each technical feature and the overall technical means of the present invention, but it is not understood as a limitation on the protection scope of the present invention. In the description of the present invention, a plurality means two or more, and it is understood that larger, smaller, more, etc. do not include the number, and it is understood that more than, less than, within, etc. include the number.

[0017] The components contained in the raw materials of the light-diffusing encapsulant used in the LED tape light in this application are listed in order of weight percent: Phase A 94.09%, B phase 2.91%, and C phase 3%, Phase A ingredients in order of most abundant weight percent: Polydimethylvinylsiloxane 55~95%, Silicon dioxide 5~45% Hydroxy-terminated polydimethylsiloxane 0-8%, and Dispersant 0~1%, Phase B ingredients in order of most abundant weight percent: Silicon dioxide 70-80%, Polydimethylsiloxane 10-20%, 107 Raw rubber 6~10%, Dispersant 1.8~2.2%, Phase C ingredients in order of weight percent: Silicon dioxide 60-70%, Polydimethylsiloxane 10-20%, 107 Raw rubber 6~10%, Titanium dioxide 4-6%, Dispersant 5.88~7.78%, Pigment 0.12-0.22%.

[0018] In this application, the dispersing agent in phase A, phase B and phase C is methyl silicone oil. The silicon dioxide in phases A, B and C was pulverized in a fine mill until the particle size was 200 mesh or less, and the pigment in phase C was purchased from BASF under the brand name Blue K 7090.

[0019] In light of the above, examples of the present application are proposed. Tables 1 to 3 show the specific raw materials of phases A, B, and C of the light-diffusing encapsulant in Examples 1 to 3, as well as their technical specifications.

[0020] [Table 1]

[0021] In Examples 1 to 3, the molecular weight of the polydimethylvinylsiloxane in phase A is 610,000 to 620,000; The particle size of the silicon dioxide is 200 mesh or less. The viscosity of the hydroxy-terminated polydimethylsiloxane is 950-1050 Pa·s. The viscosity of methyl silicone oil is 10,000 Pa·s to 10,100 Pa·s.

[0022] [Table 2]

[0023] In Examples 1 to 3, the particle size of the silicon dioxide in phase B is 200 mesh or less; The molecular weight of polydimethylsiloxane is 610,000 to 620,000. 107 The molecular weight of raw rubber is 580,000 to 670,000. The viscosity of methyl silicone oil dispersant is 9900-10100 Pa·s.

[0024] [Table 3]

[0025] In Examples 1 to 3, the particle sizes of the silicon dioxide and titanium dioxide in the C phase are both 200 mesh or less; The molecular weight of polydimethylsiloxane is 610,000 to 620,000. 107 The molecular weight of raw rubber is 580,000 to 670,000 molecular weight. The brand of titanium dioxide is Huntsman RTC30. The viscosity of methyl silicone oil dispersant is 9900~10100 Pa·s. The pigment brand is Blue K 7090 manufactured by BASF.

[0026] After the preparation of the raw materials in Examples 1 to 3 is completed, the method for preparing the light-diffusing encapsulating materials in Examples 1 to 3 is as follows: Step 1: Weigh out the raw materials for phase A, phase B, and phase C according to the formula, and mill the silicon dioxide and titanium dioxide to a particle size of 200 mesh or less using a fine mill; Step 2 is to mix and knead the raw materials of phase A and phase B, and obtain a material 1 containing 97% by weight of phase A and 3% by weight of phase B after uniform mixing; and step 3 of feeding 97% by weight of material 1 and 3% by weight of phase C raw material into a kneader and kneading them uniformly to obtain a light-diffusing encapsulant for use in LED tape lights.

[0027] The light-diffusing encapsulant obtained in Example 1 was drop-cast in a fixed amount onto LED light source bare boards with color temperatures of 1800K, 5000K, and 12000K. After curing, the spectrum of the LED light source bare board onto which the light-diffusing encapsulant of Example 1 was drop-cast was measured, and the test reports are shown in Figures 1 to 3, respectively.

[0028] Comparative Example 1 The spectra of LED light source bare boards with color temperatures of 1800K, 5000K, and 12000K were measured, and the test reports are shown in Figures 4 to 6.

[0029] Comparative Example 2 The weight percentages of the components contained in the raw materials of the light-diffusing encapsulant in Comparative Example 2 are in descending order: a phase 97%, b phase 3%, Here, the weight percent of the components in the a phase raw material is: Polydimethylvinylsiloxane 55~95%, Silicon dioxide 5~45% Hydroxy-terminated polydimethylsiloxane 0-8%, and Auxiliary agent 0~1%, The ingredients in phase b are listed in order of most abundant weight percent: Silicon dioxide 70-80%, Polydimethylsiloxane 10-20%, 107 Raw rubber 6~10%, Dispersant 1.8-2.2%.

[0030] Tables 4 and 5 show the technical specifications of the specific raw materials of phase a and phase b in Comparative Example 2 and the contents of the raw materials, respectively.

[0031] [Table 4]

[0032] [Table 5]

[0033] Preparation method of light-diffusing encapsulant in Comparative Example 2 Step 1: Weigh out the raw materials for phase A and phase B according to the formula, and use a fine mill to reduce the particle size of the silicon dioxide to 200 mesh or less. Step 2: The raw materials of phase a and phase b were put into a rubber kneader and uniformly kneaded to obtain a light-diffusing encapsulant containing 97% by weight of phase a and 3% by weight of phase b.

[0034] The light-diffusing encapsulant obtained in Comparative Example 2 was drop-cast in a fixed amount onto LED light source bare boards with color temperatures of 1800K, 5000K, and 12000K. After curing, the spectrum of the LED light source bare board onto which the light-diffusing encapsulant of Comparative Example 2 was drop-cast was measured, and the test reports are shown in Figures 7 to 9, respectively.

[0035] According to the contents of Figures 1 to 9, the following can be seen: (1) As can be seen from the measurement results shown in Figures 4 to 6, the color temperatures obtained in the 1800K, 5000K and 12000K LED light source bare board tests were 1760K, 5006K and 11968K. All of the color temperatures of the LED light source bare board light source caused color shifts. (2) As can be seen from the measurement results shown in Figs. 7 to 9, when the light-diffusing encapsulant obtained in Comparative Example 2 was used on 1800K, 5000K, and 12000K LED light source bare boards, the final color temperatures were 1679K, 4193K, and 7472K, respectively. Compared to Comparative Example 1, the color shift of the light source due to the light-diffusing encapsulant used in Comparative Example 2 was large. (3) As can be seen from the measurement results shown in Figs. 1 to 3, when the light-diffusing encapsulant obtained in Example 1 was used on LED light source bare boards of 1800K, 5000K, and 12000K, the final color temperatures were 1766K, 5043K, and 12282K, respectively. Compared with Comparative Example 2, there is basically no change in the color temperature of the light-diffusing encapsulant obtained in Example 1, which solves the influence of conventional light-diffusing encapsulants on the LED color temperature, resolves the color shift problem after LED waterproofing treatment, and also solves the problem of being unable to accurately control the color temperature of the LED light source and therefore unable to control the color of the finished LED tape light.

[0036] Of course, the present invention is not limited to the above embodiments, and those skilled in the art can make equivalent modifications or substitutions without departing from the spirit of the present invention, and such equivalent modifications or substitutions are included in the scope defined by the claims of the present invention.

Claims

1. A light-diffusing encapsulant for use in an LED tape light, comprising: The ingredients consist of the following components in order of predominance by weight: Phase A 94.09%, B phase 2.91%, and C phase 3%, Phase A ingredients in order of most abundant weight percent: Polydimethylvinylsiloxane 55-95%, Silicon dioxide 5-45% 0-8% hydroxy-terminated polydimethylsiloxane, and Dispersant 0-1%, Phase B ingredients in order of weight percent: Silicon dioxide 70-80%, Polydimethylsiloxane 10-20%, 107 Raw rubber 6-10%, Dispersant 1.8-2.2%, The ingredients in Phase C are listed in order of weight percent: Silicon dioxide 60-70%, Polydimethylsiloxane 10-20%, 107 Raw rubber 6-10%, Titanium dioxide 4-6%, Dispersant 5.88-7.78%, Pigment 0.12-0.22% Includes A light-diffusing encapsulant for use in an LED tape light.

2. The molecular weight of the polydimethylmethylvinylsiloxane of the A phase is 610,000 to 620,000. A light-diffusing encapsulant for use in the LED tape light according to claim 1.

3. The viscosity of the hydroxy-terminated polydimethylsiloxane in phase A is 950-1050 Pa·s. A light-diffusing encapsulant for use in the LED tape light according to claim 1.

4. The dispersants in the A, B and C phases are all methyl silicone oils, and the viscosity of the methyl silicone oils is 9900 to 10100 Pa·s. A light-diffusing encapsulant for use in the LED tape light according to claim 1.

5. The particle size of the silicon dioxide in the A, B and C phases is 200 mesh or less, and the particle size of the titanium dioxide in the C phase is 200 mesh or less. A light-diffusing encapsulant for use in the LED tape light according to claim 1.

6. The molecular weight of the polydimethylsiloxane in the phases B and C is 610,000 to 620,000. A light-diffusing encapsulant for use in the LED tape light according to claim 1.

7. The molecular weight of the 107 rubber in the B and C phases is 670,000 to 580,000. A light-diffusing encapsulant for use in the LED tape light according to claim 1.

8. A method for preparing a light-diffusing encapsulant used in the LED tape light according to any one of claims 1 to 7, comprising the steps of: Step 1: Weigh out the raw materials for phase A, phase B, and phase C according to the formulation, and mill the silicon dioxide and titanium dioxide to a particle size of 200 mesh using a fine mill; A step 2 of uniformly kneading the raw materials of phase A and phase B in a rubber kneader to obtain material 1; The material 1 and the raw material of the C phase are put into a kneader and uniformly kneaded, and then a process 3 is carried out to obtain a light-diffusing encapsulant to be used in an LED tape light. Includes 13. A method for preparing a light-diffusing encapsulant for use in an LED tape light, comprising:

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