Acoustic wave device, filter, multiplexer, and method for manufacturing acoustic wave device
Patent Information
- Application Number
- JP2023148488
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-09-13
- Publication Date
- 2025-03-26
Smart Images
Figure 2025041295000001_ABST
Abstract
Description
[Technical field]
[0001] The present invention relates to an acoustic wave device, a filter, a multiplexer, and a method for manufacturing an acoustic wave device. [Background technology]
[0002] Filters and duplexers using piezoelectric thin film resonators are known as filters and duplexers for high-frequency circuits of wireless terminals such as mobile terminals. A piezoelectric thin film resonator includes a piezoelectric layer provided on a substrate, and a lower electrode and an upper electrode provided on the substrate with the piezoelectric layer sandwiched therebetween. The region where the lower electrode and the upper electrode face each other with the piezoelectric layer sandwiched therebetween is a resonance region where elastic waves are excited. It is known that a lithium niobate layer or a lithium tantalate layer is used for the piezoelectric layer (for example, Patent Document 1). It is also known that leakage of elastic waves can be suppressed by providing through holes in the piezoelectric layer along the resonance region (for example, Non-Patent Document 1). [Prior art documents] [Patent documents]
[0003] [Patent Document 1] JP 2008-42871 A [Non-patent literature]
[0004] [Non-Patent Document 1] Ting Wu and 4 others, "Application of Free Side Edges to Thickness Shear Bulk Acoustic Resonator On Lithium Niobate for Suppression of Transverse Resonance", Materials for the 2nd Research Meeting of the Consortium for Acoustic Wave Device Technology, March 8, 2021 Summary of the Invention [Problem to be solved by the invention]
[0005] When the piezoelectric layer is etched to form a through hole along the resonance region, a part of the lower electrode may be etched as well. In this case, the material removed by etching the piezoelectric layer and the lower electrode may adhere to the side surface of the upper electrode. If the etching material of the lower electrode adheres to the side surface of the upper electrode, the lower electrode and the upper electrode may be short-circuited through this adhesion film, which may deteriorate the device characteristics.
[0006] The present invention has been made in consideration of the above problems, and has an object to suppress short circuits between the lower electrode and the upper electrode. [Means for solving the problem]
[0007] The present invention is an acoustic wave device comprising: a substrate; a lower electrode provided on the substrate; an upper electrode provided on the lower electrode; a piezoelectric layer provided on the substrate with at least a portion sandwiched between the lower electrode and the upper electrode, the piezoelectric layer having a through hole along a resonance region where the lower electrode and the upper electrode overlap with at least a portion of the lower electrode in a planar view and in contact with a portion of the lower electrode; an insertion film provided between at least one of the lower electrode and the upper electrode and the piezoelectric layer, the insertion film having a higher resistivity than the lower electrode and the upper electrode; a first film provided on a side of the upper electrode and connected to the lower electrode, the insertion film containing constituent elements of the lower electrode; a second film provided between a side of the upper electrode and the first film, the second film having a higher concentration of constituent elements of the piezoelectric layer than the first film; and a third film provided at least one between the side of the upper electrode and the second film and between the first film and the second film, the insertion film having a higher concentration of elements different from the constituent elements of the piezoelectric layer than the second film and the piezoelectric layer having a lower concentration of elements different from the constituent elements of the insertion film than the second film.
[0008] In the above configuration, the second film and the third film may be configured so that the concentration of a constituent element of the lower electrode is lower than that of the first film.
[0009] In the above configuration, the second film and the third film may be configured not to contain any constituent element of the lower electrode.
[0010] In the above configuration, the first film may be configured so that the concentration of a constituent element of the insertion film is lower than that of the third film.
[0011] In the above configuration, the insertion film may be an inorganic insulating film.
[0012] In the above configuration, the insertion film may be configured to contain at least one of silicon oxide, silicon nitride, aluminum nitride, aluminum oxide, tantalum oxide, zirconium oxide, silicon carbide, yttrium oxide, hafnium oxide, titanium oxide, and magnesium oxide.
[0013] In the above configuration, the piezoelectric layer may be a single crystal lithium tantalate layer or a single crystal lithium niobate layer.
[0014] In the above configuration, the lower electrode and the upper electrode excite thickness-shear vibration in the piezoelectric layer in the resonance region, two through holes are provided on either side of the resonance region, and the vibration direction of the thickness-shear vibration can be a direction that intersects the direction in which the two through holes face each other on either side of the resonance region.
[0015] In the above configuration, the maximum distance between the through hole and the piezoelectric layer in the resonance region may be 3.2 times or less the thickness of the piezoelectric layer in the resonance region.
[0016] The present invention is a filter including the acoustic wave device described above.
[0017] The present invention is a multiplexer including the filter described above.
[0018] The present invention is a method for manufacturing an acoustic wave device, comprising the steps of: forming a lower electrode, a piezoelectric layer, and an upper electrode in this order on a substrate; and forming an insertion film having a higher resistivity than the lower electrode and the upper electrode at least either between the lower electrode and the piezoelectric layer or between the piezoelectric layer and the upper electrode; and etching the piezoelectric layer, the insertion film, and the lower electrode on the sides of a resonance region where the lower electrode and the upper electrode overlap with the piezoelectric layer in between, so that a second film attached by etching the piezoelectric layer is formed between a first film attached by etching the lower electrode and a side of the upper electrode, and a third film attached by etching the insertion film is formed at least either between the side of the upper electrode and the second film or between the first film and the second film, thereby forming a through hole in the piezoelectric layer along the resonance region.
[0019] In the above-mentioned configuration, the piezoelectric layer, the insertion film, and the lower electrode may be etched by using an ion milling method. Effect of the Invention
[0020] According to the present invention, it is possible to suppress short circuits between the lower electrode and the upper electrode. [Brief description of the drawings]
[0021] [Figure 1] FIG. 1 is a plan view of an acoustic wave device in accordance with a first embodiment. [Diagram 2] 2(a) is a cross-sectional view taken along line AA in FIG. 1, and FIG. 2(b) is a cross-sectional view taken along line BB in FIG. [Diagram 3] 3(a) and 3(b) are diagrams showing the relationship between the crystal orientation of a piezoelectric layer and the vibration direction of thickness-shear vibration when the piezoelectric layer is a lithium niobate layer or a lithium tantalate layer. [Figure 4] FIG. 4 is a cross-sectional view of model A used in the simulation. [Diagram 5] FIG. 5 shows the simulation results of ΔY versus the distance between the through hole and the resonance region in model A. [Figure 6] 6(a) to 6(c) are cross-sectional views (part 1) illustrating a method for manufacturing the acoustic wave device in accordance with the first embodiment. [Figure 7] 7(a) and 7(b) are cross-sectional views (part 2) illustrating a method for manufacturing the acoustic wave device in accordance with the first embodiment. [Figure 8] FIG. 8 is a cross-sectional view of the vicinity of the through hole in the first embodiment. [Figure 9] 9(a) and 9(b) are cross-sectional views (part 1) illustrating a through-hole forming step in Example 1. FIG. [Figure 10] 10(a) to 10(c) are cross-sectional views (part 2) illustrating a through-hole forming step in Example 1. FIG. [Figure 11] FIG. 11 is a diagram showing the experimental results of the composition analysis in Example 1. [Figure 12] FIG. 12 is a cross-sectional view of the vicinity of a through hole in the first modified example of the first embodiment. [Figure 13] FIG. 13 is a cross-sectional view of the vicinity of a through hole in the second modified example of the first embodiment. [Figure 14] FIG. 14 is a cross-sectional view of the vicinity of a through hole in a comparative example. [Figure 15] FIG. 15 is a diagram showing the experimental results of composition analysis in the comparative example. [Figure 16] 16(a) and 16(b) are cross-sectional views of an acoustic wave device in accordance with the second embodiment. [Figure 17] FIG. 17 is a circuit diagram of a filter in accordance with the third embodiment. [Figure 18] FIG. 18 is a circuit diagram of a duplexer in accordance with the fourth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0022] Hereinafter, embodiments of the present invention will be described with reference to the drawings. EXAMPLES
[0023] FIG. 1 is a plan view of an acoustic wave device 100 according to a first embodiment. FIG. 2(a) is a cross-sectional view taken along line AA in FIG. 1, and FIG. 2(b) is a cross-sectional view taken along line BB in FIG. 1. FIG. 1 mainly illustrates a lower electrode 12, a piezoelectric layer 14, and an upper electrode 16. For clarity, FIG. 1 illustrates a resonant region 50 with hatching, a through-hole 22 with a thicker line, and FIG. 2(b) omits the films formed on the side surfaces of the upper electrode 16 and the like. The normal direction of the piezoelectric layer 14 is the Z direction, and the directions perpendicular to each other in the planar direction of the piezoelectric layer 14 are the X direction and the Y direction.
[0024] As shown in FIG. 1, FIG. 2(a), and FIG. 2(b), an acoustic wave device 100 is a piezoelectric thin film resonator including a lower electrode 12, a piezoelectric layer 14, and an upper electrode 16. An acoustic reflection film 30 is provided on a substrate 10, and a piezoelectric layer 14 is provided on the acoustic reflection film 30. The upper and lower surfaces of the piezoelectric layer 14 are flat. An upper electrode 16 and a lower electrode 12 are provided above and below the piezoelectric layer 14. A region where the lower electrode 12 and the upper electrode 16 overlap in a plan view, sandwiching at least a part of the piezoelectric layer 14, is a resonance region 50. The planar shape of the resonance region 50 is, for example, substantially rectangular. The rectangle has four substantially straight sides. One pair of the four sides extends substantially along the Y direction, and another pair of sides extends substantially along the X direction.
[0025] The substrate 10 is, for example, a silicon substrate, a sapphire substrate, an alumina substrate, a spinel substrate, a quartz substrate, a crystal substrate, a glass substrate, a ceramic substrate, a GaAs substrate, or the like. The piezoelectric layer 14 is, for example, a single crystal lithium niobate layer or a single crystal lithium tantalate layer. The thickness of the piezoelectric layer 14 is, for example, about 200 nm to 1000 nm. The lower electrode 12 and the upper electrode 16 are, for example, a single layer film of ruthenium (Ru), chromium (Cr), aluminum (Al), titanium (Ti), copper (Cu), molybdenum (Mo), tungsten (W), tantalum (Ta), platinum (Pt), rhodium (Rh), iridium (Ir), or the like, or a laminated film thereof. The thickness of the lower electrode 12 and the upper electrode 16 is, for example, about 20 nm to 150 nm. The lower electrode 12 and the upper electrode 16 are, for example, formed of a metal element different from the constituent element of the piezoelectric layer 14.
[0026] When high-frequency power is applied between the lower electrode 12 and the upper electrode 16, an elastic wave is excited in the piezoelectric layer 14 in the resonance region 50. The wavelength λ of the elastic wave is approximately twice the thickness of the piezoelectric layer 14. When the piezoelectric layer 14 is a single-crystal lithium niobate layer or a single-crystal lithium tantalate layer, an elastic wave is excited in the piezoelectric layer 14 in which the displacement of the elastic wave vibrates in a direction approximately perpendicular to the Z direction (i.e., the strain direction relative to the thickness). This vibration is called thickness-shear vibration. The direction in which the displacement of the thickness-shear vibration is greatest (the displacement direction of the thickness-shear vibration) is set as the vibration direction 60 of the thickness-shear vibration. Here, the vibration direction 60 of the thickness-shear vibration is the Y direction. The lower electrode 12 and the upper electrode 16 are drawn out from the resonance region 50 in the Y direction, which is the same as the vibration direction 60 of the thickness-shear vibration.
[0027] The acoustic reflection film 30 has a film 32 with low acoustic impedance and a film 34 with high acoustic impedance. The films 32 with low acoustic impedance and the films 34 with high acoustic impedance are alternately arranged in the resonance region 50. The thicknesses of the films 32 and 34 in the resonance region 50 are, for example, approximately λ / 4 (λ is the wavelength of the elastic wave). This allows the acoustic reflection film 30 to reflect the elastic wave. The number of layers of the films 32 and 34 can be set arbitrarily. The acoustic reflection film 30 may be formed by stacking at least two types of layers with different acoustic characteristics with a gap therebetween. The substrate 10 may be one of the at least two types of layers with different acoustic characteristics of the acoustic reflection film 30. For example, the acoustic reflection film 30 may be formed by providing one layer of a film with different acoustic impedance in the substrate 10. In a plan view, the stacked portion of the films 32 and 34 overlaps the resonance region 50 and is the same size as the resonance region 50 or larger than the resonance region 50. By making the laminated portion of the film 32 and the film 34 larger than the resonance region 50 in a plan view, the acoustic waves leaking obliquely from the resonance region 50 can be reflected by the acoustic reflection film 30, and deterioration of characteristics can be suppressed. The film 32 with low acoustic impedance is, for example, a silicon oxide (SiO2) film, and the film 34 with high acoustic impedance is, for example, a tungsten (W) film.
[0028] An insertion film 18 is provided between the lower electrode 12 and the piezoelectric layer 14 in the resonance region 50. The insertion film 18 is the same size as or larger than the resonance region 50 in a plan view. The insertion film 18 is a film having a higher volume resistivity than the lower electrode 12 and the upper electrode 16, for example, a silicon oxide (SiO2) film. The insertion film 18 has a thickness of, for example, about 5 nm to 20 nm, for example, 10% or less of the thickness of the piezoelectric layer 14. A protective film 20 is provided to cover the piezoelectric layer 14 and the upper electrode 16. The protective film 20 is an insulating film, for example, a silicon oxide (SiO2) film, a silicon nitride (SiN) film, an aluminum oxide (Al2O3) film, or the like.
[0029] A pair of through holes 22 are formed in the piezoelectric layer 14, sandwiching the resonance region 50 in the X direction and extending along the resonance region 50 in the Y direction. The through holes 22 are dug into a part of the lower electrode 12. The distance between each of the pair of through holes 22 and the piezoelectric layer 14 in the resonance region 50 is approximately the same. The through holes 22 have, for example, an approximately rectangular shape in a plan view. The provision of the through holes 22 suppresses the elastic waves excited in the resonance region 50 from leaking to the outside.
[0030] Here, the relationship between the crystal orientation of the piezoelectric layer 14 and the vibration direction 60 of the thickness-shear vibration when the piezoelectric layer 14 is a lithium niobate layer or a lithium tantalate layer will be described. First, the definition of Euler angles (φ, θ, ψ) will be described. In a right-handed XYZ coordinate system, the normal direction of the upper surface of the piezoelectric layer 14 is the Z direction, and the directions perpendicular to the Z direction and perpendicular to each other in the surface direction of the upper surface of the piezoelectric layer 14 are the X direction and the Y direction. The X direction, the Y direction, and the Z direction are the X axis direction, the Y axis direction, and the Z axis direction of the crystal orientation, respectively. Next, rotate from the +X direction to the +Y direction by an angle φ around the Z direction. Rotate from the +Y direction to the +Z direction by an angle θ around the X direction after the angle φ rotation. Rotate from the +X direction to the +Y direction by an angle ψ around the Z direction after the angle θ rotation. The Euler angles when rotated in this way are (φ, θ, ψ). Note that the Euler angles expressed using (φ, θ, ψ) include equivalent Euler angles.
[0031] 3(a) and 3(b) are diagrams showing the relationship between the crystal orientation of the piezoelectric layer 14 and the vibration direction 60 of the thickness-shear vibration when the piezoelectric layer 14 is a lithium niobate layer or a lithium tantalate layer. The dashed arrows on the left side of FIG. 3(a) and FIG. 3(b) indicate the orientation of the crystal axis of the piezoelectric layer 14. The solid arrows on the right side correspond to the X direction, the Y direction, and the Z direction in FIG. 1, FIG. 2(a), and FIG. 2(b). As shown in FIG. 3(a), the +X direction, the +Y direction, and the +Z direction are respectively the +X axis direction, the +Y axis direction, and the +Z axis direction of the crystal orientation of the piezoelectric layer 14. As shown in FIG. 3(b), from the state of FIG. 3(a), the +Y direction and the +Z direction are rotated 105° from the +Y direction to the -Z direction on the YZ plane around the X direction. When rotated in this way, the direction in which the +Z axis direction of the crystal orientation is rotated 105° toward the +Y axis direction becomes the +Z direction. At this time, the Y direction becomes the vibration direction 60 of the thickness-shear vibration. The Euler angles are (0°, -105°, 0°). When the Euler angles derived by the same method as above are (0°, -105°, 90°), the X direction becomes the vibration direction 60 of the thickness-shear vibration. Each angle of the Euler angles is allowed to be within a range of ±5°, and it is more preferable that it is within a range of ±1°.
[0032] [simulation] Fig. 4 is a cross-sectional view of model A used in the simulation. As shown in Fig. 4, model A includes an acoustic reflection film 30 having a film 32 with low acoustic impedance and a film 34 with high acoustic impedance on a substrate 10. A piezoelectric layer 14 is provided on the acoustic reflection film 30. A lower electrode 12 and an upper electrode 16 are provided to sandwich the piezoelectric layer 14. This forms a resonance region 50. A through hole 22 located on the side of the resonance region 50 is provided in the piezoelectric layer 14.
[0033] A simulation was performed on ΔY for model A when the distance L between the through hole 22 and the resonance region 50 was different. ΔY was calculated by obtaining the difference between the absolute value of admittance |Y| at the resonance frequency and the absolute value of admittance |Y| at the anti-resonance frequency from the simulation results of the frequency characteristics of admittance |Y|. The simulation conditions were as follows. Substrate 10: Silicon substrate Low acoustic impedance film 32: Silicon oxide (SiO2) film with a thickness of 150 nm in the resonance region 50 High acoustic impedance film 34: tungsten (W) film with a thickness of 115 nm in the resonance region 50 Bottom electrode 12: 44 nm thick aluminum (Al) film Piezoelectric layer 14: 310 nm thick single crystal lithium niobate (LiNbO3) layer Upper electrode 16: 44 nm thick aluminum (Al) film Width W of through hole 22: 1.0 μm Elastic wave wavelength λ: 620nm
[0034] FIG. 5 shows a simulation result of ΔY with respect to the distance L between the through hole 22 and the resonance region 50 in the model A. As shown in FIG. 5, ΔY decreased as the distance L increased until the distance L reached about 1000 nm. When the distance L exceeded 1000 nm, the decrease in ΔY saturated, and ΔY became almost the same. From this result, it can be said that it is preferable to form the through hole 22 at a position where the distance L from the resonance region 50 is 1.0 μm or less in order to suppress the deterioration of the device characteristics while suppressing the increase in size of the device. In other words, it can be said that it is preferable to form the through hole 22 at a position where the distance L from the resonance region 50 is 1.6 λ or less.
[0035] [Manufacturing method] 6(a) to 7(b) are cross-sectional views showing a method for manufacturing the acoustic wave device 100 according to the first embodiment. FIGS. 6(a) to 7(b) are cross-sectional views of a portion corresponding to the portion between BB in FIG. 1. As shown in FIG. 6(a), a piezoelectric substrate is prepared as the piezoelectric layer 14. An insertion film 18 and a lower electrode 12 are formed on the piezoelectric layer 14. The insertion film 18 and the lower electrode 12 are formed by forming a film using, for example, a sputtering method, a vacuum deposition method, or a CVD (Chemical Vapor Deposition) method, and then patterning the film into a desired shape using, for example, a photolithography method and an etching method. The insertion film 18 and the lower electrode 12 may be formed using a lift-off method.
[0036] As shown in Fig. 6(b), an acoustic reflection film 30 is formed on the piezoelectric layer 14, covering the insertion film 18 and the lower electrode 12. The acoustic reflection film 30 is formed by alternately depositing films 32 with low acoustic impedance and films 34 with high acoustic impedance, and patterning the film 34 with high acoustic impedance into a desired shape. The films 32 with low acoustic impedance and the film 34 with high acoustic impedance are deposited by, for example, sputtering or CVD, and the patterning is performed by, for example, photolithography and etching. Thereafter, the upper surface of the acoustic reflection film 30 is planarized by, for example, CMP (Chemical Mechanical Polishing).
[0037] As shown in FIG. 6(c), the acoustic reflection film 30 is bonded to the substrate 10. For example, a surface activation method is used for bonding. A bonding layer such as a silicon film may be provided between the substrate 10 and the acoustic reflection film 30. Next, the piezoelectric layer 14 is thinned to a desired thickness. For example, a grinding method and / or a CMP method is used for thinning. For example, the piezoelectric layer 14 is made to approximately the desired thickness by a grinding method, and the upper surface is flattened by a CMP method. As a result, the upper surface of the piezoelectric layer 14 becomes flat within the manufacturing tolerance.
[0038] As shown in Fig. 7(a), an upper electrode 16 and a protective film 20 are formed on the piezoelectric layer 14. The upper electrode 16 and the protective film 20 are formed by, for example, forming a film using a sputtering method, a vacuum deposition method, or a CVD method, and then patterning the film into a desired shape using, for example, a photolithography method and an etching method. The upper electrode 16 may be formed using a lift-off method. A resonance region 50 is formed in which the lower electrode 12 and the upper electrode 16 overlap in a plan view, sandwiching at least a portion of the piezoelectric layer 14 therebetween.
[0039] As shown in FIG. 7(b), the piezoelectric layer 14 on the sides of the resonance region 50 is removed to form through-holes 22 in the piezoelectric layer 14 along the resonance region 50. The piezoelectric layer 14 is removed by, for example, photolithography and etching. For example, the piezoelectric layer 14 is removed by dry etching, for example, ion milling using argon (Ar) gas. At this time, over-etching is performed so that the through-holes 22 penetrating the piezoelectric layer 14 are reliably formed. For this reason, the insertion film 18 and the lower electrode 12 are also etched. In this manner, the acoustic wave device 100 in accordance with the first embodiment is formed.
[0040] [Near the through hole] FIG. 8 is a cross-sectional view of the vicinity of the through hole 22 in Example 1. As shown in FIG. 8, a film 40 containing the material of the protective film 20 is formed on the side of the protective film 20. A film 41 containing the material of the upper electrode 16 is formed from the side of the upper electrode 16 to the side of the film 40. A film 42 containing the material of the piezoelectric layer 14 is formed from the side of the piezoelectric layer 14 to the side of the film 41. A film 43 containing the material of the insertion film 18 is formed from the side of the insertion film 18 to the side of the film 42. A film 44 containing the material of the lower electrode 12 is formed from the side of the lower electrode 12 to the side of the film 43. The films 40, 41, 42, 43, and 44 are attached films that are attached when the through hole 22 is formed, so they do not have a regular crystalline structure, that is, they contain a large proportion of amorphous.
[0041] The maximum distance L between the through hole 22 and the piezoelectric layer 14 in the resonance region 50 is 1.0 μm or less. This makes it possible to suppress an increase in the size of the device while suppressing deterioration of the device characteristics, as shown in Fig. 5. From the viewpoint of suppressing deterioration of the device characteristics, the distance L is preferably 0.8 μm or less, more preferably 0.5 μm or less, and even more preferably 0.2 μm or less.
[0042] The process of forming the films 40, 41, 42, 43, and 44 will be described with reference to the drawings. Fig. 9(a) to Fig. 10(c) are cross-sectional views showing the process of forming the through-hole 22 in Example 1. As shown in Fig. 9(a), a mask layer 70 made of photoresist is formed on the upper electrode 16. The mask layer 70 is formed to be located inside the end of the upper electrode 16.
[0043] As shown in FIG. 9(b), the protective film 20 and the upper electrode 16 are etched using the mask layer 70 as a mask. The etching is performed by a dry etching method, for example, an ion milling method using Ar gas. The material removed during the etching of the protective film 20 adheres to the side surfaces of the protective film 20 and the mask layer 70, and a film 40 containing the material of the protective film 20 is formed from the side surfaces of the protective film 20 to the side surfaces of the mask layer 70. In addition, the material removed during the etching of the upper electrode 16 adheres to the side surfaces of the upper electrode 16 and the film 40, and a film 41 containing the material of the upper electrode 16 is formed from the side surfaces of the upper electrode 16 to the side surfaces of the film 40.
[0044] 10(a), following the etching of the protective film 20 and the upper electrode 16, the piezoelectric layer 14 is etched using the mask layer 70 as a mask. As described above, the etching is performed by dry etching, for example, ion milling using Ar gas. The material removed during the etching of the piezoelectric layer 14 adheres to the side surfaces of the piezoelectric layer 14 and the side surfaces of the film 41, and a film 42 containing the material of the piezoelectric layer 14 is formed from the side surfaces of the piezoelectric layer 14 to the side surfaces of the film 41.
[0045] 10(b), following the etching of the piezoelectric layer 14, the insertion film 18 is etched using the mask layer 70 as a mask. As described above, the etching is performed by a dry etching method, for example, an ion milling method using Ar gas. The material removed during the etching of the insertion film 18 adheres to the side surface of the insertion film 18 and the side surface of the film 42, and the film 43 containing the material of the insertion film 18 is formed from the side surface of the insertion film 18 to the side surface of the film 42.
[0046] As shown in FIG. 10(c), following the etching of the insertion film 18, the lower electrode 12 is etched using the mask layer 70 as a mask. The reason for etching up to the lower electrode 12 is that if the through-holes 22 do not penetrate the piezoelectric layer 14, the device characteristics will deteriorate, and therefore over-etching is performed to ensure that the through-holes 22 penetrate the piezoelectric layer 14. As described above, the etching is performed using a dry etching method, for example, an ion milling method using Ar gas. The material removed during the etching of the lower electrode 12 adheres to the side surface of the lower electrode 12 and the side surface of the film 43, and a film 44 containing the material of the lower electrode 12 is formed from the side surface of the lower electrode 12 to the side surface of the film 43.
[0047] [experiment] In Example 1, the low acoustic impedance film 32, the lower electrode 12, the insertion film 18, the piezoelectric layer 14, the upper electrode 16, and the protective film 20 were formed with the following materials and thicknesses, and the through-hole 22 was formed by ion milling using Ar gas. The lower electrode 12 was dug about 22 nm by over-etching when forming the through-hole 22. Low acoustic impedance film 32: Silicon oxide film Bottom electrode 12: Aluminum film with a thickness of 44 nm Insertion film 18: Silicon oxide film with a thickness of 20 nm Piezoelectric layer 14: Lithium niobate layer with a thickness of 310 nm Top electrode 16: Aluminum film with a thickness of 44 nm Protective film 20: Silicon oxide film with a thickness of 20 nm At this time, the compositions of the films 41, 42, 43, and 44 were analyzed at the locations indicated by the arrows A in Fig. 8. The composition analysis was performed by energy dispersive X-ray spectroscopy (EDX).
[0048] Fig. 11 is a diagram showing the experimental results of the composition analysis in Example 1. In Fig. 11, the horizontal axis represents the distance from the side surface of the upper electrode 16 in the direction of arrow A when the position of the side surface of the upper electrode 16 is set as the origin 0, and the vertical axis represents the concentration. Table 1 shows the experimental results of the composition analysis in Example 1. [Table 1]
[0049] As shown in FIG. 11 and Table 1, the film 41 contains aluminum (Al). This shows that the film 41 is formed by the adhesion of material removed during etching of the upper electrode 16. Carbon (C) is considered to have been incorporated due to etching of the mask layer 70 made of photoresist. Oxygen (O) is considered to have been incorporated due to oxygen contained in the films 40 and 42, which contain materials removed during etching of the protective film 20 and the piezoelectric layer 14. Silicon (Si) is considered to have been incorporated due to silicon contained in the film 40. Argon (Ar) is considered to have been incorporated due to the gas used in the ion milling method. Niobium (Nb) is considered to have been incorporated due to niobium contained in the film 42.
[0050] The film 42 does not contain aluminum, has a higher niobium concentration than the other films 41, 43, and 44, and has a lower silicon concentration than the film 43. For example, the niobium concentration of the film 42 is 1.3 times or more, and 1.5 times or more, the niobium concentration of the film 44. This shows that the film 42 is formed by the attachment of material removed during etching of the piezoelectric layer 14. It is considered that the carbon was incorporated by etching the mask layer 70. It is considered that the oxygen concentration is high because oxygen, which is a constituent element of the piezoelectric layer 14, was incorporated when the piezoelectric layer 14 was etched. It is considered that the silicon was incorporated from the silicon contained in the film 43. It is considered that the argon was incorporated from the gas used in the ion milling method. It is considered that the reason why the film 42 did not contain lithium (Li), which is a constituent element of the piezoelectric layer 14, is that lithium is light and difficult to incorporate.
[0051] The film 43 does not contain aluminum, has a higher silicon concentration than the other films 41, 42, and 44, and has a lower niobium concentration than the film 42. For example, the silicon concentration of the film 43 is 1.8 times or more, or 2.0 times or more, of the silicon concentration of the film 42. The niobium concentration of the film 43 is 0.8 times or less, or 0.7 times or less, of the niobium concentration of the film 42. This shows that the film 43 is made of material removed during etching of the insertion film 18. It is considered that carbon was taken in by etching the mask layer 70. It is considered that oxygen, which is a constituent element of the insertion film 18, was taken in when the insertion film 18 was etched, and thus the concentration of oxygen is high. It is considered that argon was taken in by the gas used in the ion milling method. It is considered that niobium was taken in by niobium contained in the film 42.
[0052] Film 44 contains aluminum. This shows that film 44 is formed by the adhesion of material removed during etching of lower electrode 12. The carbon is believed to have entered as a result of etching mask layer 70. The oxygen and silicon are believed to have been introduced as a result of etching film 32, which has a low acoustic impedance, and as a result of the oxygen contained in film 43 entering the film. The argon is believed to have been introduced as a gas used in the ion milling method. The niobium is believed to have entered as a result of the niobium contained in films 42 and 43 entering the film.
[0053] The thicknesses of the films 41, 42, 43, and 44 correspond, for example, to the etching amounts of the top electrode 16, the piezoelectric layer 14, the intercalation membrane 18, and the bottom electrode 12. For example, if the piezoelectric layer 14 is thicker than the top electrode 16, the intercalation membrane 18, and the bottom electrode 12, then the film 42 will be thicker than the films 41, 43, and 44. If the thickness of the top electrode 16 is greater than the thickness of the intercalation membrane 18 and the recession amount of the bottom electrode 12, then the film 41 will be thicker than the films 43 and 44. If the thickness of the intercalation membrane 18 and the recession amount of the bottom electrode 12 are of the same order of magnitude, then the films 43 and 44 will have approximately the same thickness.
[0054] [Variations] FIG. 12 is a cross-sectional view of the vicinity of the through hole 22 in the first modification of the first embodiment. As shown in FIG. 12, in the acoustic wave device 110 according to the first modification of the first embodiment, the insertion film 18 is not provided between the lower electrode 12 and the piezoelectric layer 14 in the resonance region 50, and instead, the insertion film 18a is provided between the piezoelectric layer 14 and the upper electrode 16. The insertion film 18a is the same size as the resonance region 50 or larger than the resonance region 50 in a plan view. Therefore, a film 43a containing the material of the insertion film 18a is formed from the side surface of the insertion film 18a to the side surface of the film 41. A film 42 containing the material of the piezoelectric layer 14 is formed from the side surface of the piezoelectric layer 14 to the side surface of the film 43a. The other configurations are the same as those of the first embodiment, and therefore will not be described.
[0055] 13 is a cross-sectional view of the vicinity of the through hole 22 in the second modification of the first embodiment. As shown in FIG. 13, in the acoustic wave device 120 according to the second modification of the first embodiment, in the resonance region 50, the insertion film 18 is provided between the lower electrode 12 and the piezoelectric layer 14, and the insertion film 18a is provided between the piezoelectric layer 14 and the upper electrode 16. Therefore, the film 43a containing the material of the insertion film 18a is formed from the side surface of the insertion film 18a to the side surface of the film 41. The film 42 containing the material of the piezoelectric layer 14 is formed from the side surface of the piezoelectric layer 14 to the side surface of the film 43a. The other configurations are the same as those in the first embodiment, and therefore will not be described.
[0056] [Comparative Example] Fig. 14 is a cross-sectional view of the vicinity of through-hole 22 in the comparative example. As shown in Fig. 14, in the acoustic wave device 500 according to the comparative example, an insertion film 18 is not provided between the lower electrode 12 and the piezoelectric layer 14. Therefore, a film 44 containing the material of the lower electrode 12 is formed from the side surface of the lower electrode 12 to the side surface of the film 42 in contact with a film 42 containing the material of the piezoelectric layer 14 formed from the side surface of the piezoelectric layer 14 to the side surface of the film 41. In other words, a film 43 containing the material of the insertion film 18 is not formed between the film 42 and the film 44. The other configurations are the same as those of the first embodiment, and therefore a description thereof will be omitted.
[0057] [experiment] In the comparative example, the low acoustic impedance film 32, the lower electrode 12, the piezoelectric layer 14, the upper electrode 16, and the protective film 20 were formed with the following materials and thicknesses, and the through-holes 22 were formed by ion milling using Ar gas. The lower electrode 12 was dug about 22 nm by over-etching when forming the through-holes 22. Low acoustic impedance film 32: Silicon oxide film Bottom electrode 12: Aluminum film with a thickness of 44 nm Piezoelectric layer 14: Lithium niobate layer with a thickness of 310 nm Top electrode 16: Aluminum film with a thickness of 44 nm Protective film 20: Silicon oxide film with a thickness of 20 nm At this time, composition analysis was performed on the films 41, 42, and 44 at the location indicated by the arrow A in Fig. 14. The composition analysis was performed by energy dispersive X-ray spectroscopy (EDX).
[0058] Fig. 15 is a diagram showing the experimental results of the composition analysis in the comparative example. In Fig. 15, the horizontal axis represents the distance from the side surface of the upper electrode 16 in the direction of the arrow A when the position of the side surface of the upper electrode 16 is set as the origin 0, and the vertical axis represents the concentration. Table 2 shows the experimental results of the composition analysis in the comparative example. [Table 2]
[0059] As shown in FIG. 15 and Table 2, film 41 contains aluminum. This indicates that film 41 is formed by the deposition of material removed during etching of upper electrode 16. Film 42 does not contain aluminum, and has a higher niobium concentration than films 41 and 44. This indicates that film 42 is formed by the deposition of material removed during etching of piezoelectric layer 14. Film 44 contains aluminum. This indicates that film 44 is formed by the deposition of material removed during etching of lower electrode 12.
[0060] In the comparative example, as shown in FIG. 14, the film 44 is provided in contact with the film 42. The film 41 is conductive because the material removed during etching of the upper electrode 16 is attached to the film 41. The film 44 is conductive because the material removed during etching of the lower electrode 12 is attached to the film 41. The film 42 is conductive because the material removed during etching of the piezoelectric layer 14 is attached to the film 42, but the film quality is poor because it is amorphous, for example. For this reason, the film 41 and the film 44 are electrically connected at a thin portion of the film 42, and the lower electrode 12 and the upper electrode 16 may be short-circuited through the films 41, 42, and 44. If a short circuit occurs, the device characteristics will deteriorate. Note that the thicker the film 42, the higher the insulation, but since the film 42 corresponds to the film thickness of the piezoelectric layer 14, and the film thickness of the piezoelectric layer 14 is determined by the wavelength of the desired elastic wave, it is difficult to make the film 42 thick.
[0061] On the other hand, in the first embodiment and its modified examples, as shown in Figs. 8, 12, and 13, the insertion films 18, 18a having a higher resistivity than the lower electrode 12 and the upper electrode 16 are provided between at least one of the lower electrode 12 and the upper electrode 16 and the piezoelectric layer 14. Therefore, the films 43, 43a, which are films to which the material removed during etching of the insertion films 18, 18a is attached, are formed at least between the film 44 and the film 42 and between the side surface of the upper electrode 16 and the film 42. The film 44 (first film) is a film to which the material removed during etching of the lower electrode 12 is attached, and is connected to the lower electrode 12, and contains Al, which is a constituent element of the lower electrode 12, as shown in Fig. 11 and Table 1. The film 42 (second film) is a film to which the material removed during etching of the piezoelectric layer 14 is attached, and therefore has a higher concentration of Nb, which is a constituent element of the piezoelectric layer 14, than the film 44. The films 43, 43a (third films) are films to which the material removed during etching of the insertion films 18, 18a is attached, so that the concentration of Si, which is a constituent element of the insertion films 18, 18a but not a constituent element of the piezoelectric layer 14, is higher than that of the film 42, and the concentration of Nb, which is a constituent element of the piezoelectric layer 14 but not a constituent element of the insertion films 18, 18a, is lower than that of the film 42. The films 43, 43a are films to which the material removed during etching of the insertion films 18, 18a, which have a higher resistivity than the lower electrode 12 and the upper electrode 16, are attached, so that they have higher insulation properties than the film 41, which is a film to which the material removed during etching of the upper electrode 16 is attached, and the film 44, which is a film to which the material removed during etching of the lower electrode 12 is attached. Therefore, by providing at least one of the films 43 and 43a between the films 41 and 44, electrical connection between the films 41 and 44 is suppressed. Therefore, it is possible to suppress short-circuiting between the lower electrode 12 and the upper electrode 16.
[0062] In the manufacturing method of Example 1 and its modified examples, as shown in Fig. 7(a), the lower electrode 12, the piezoelectric layer 14, and the upper electrode 16 are formed in this order on the substrate 10, and the insertion films 18, 18a are formed at least one between the lower electrode 12 and the piezoelectric layer 14 and between the piezoelectric layer 14 and the upper electrode 16 (see also Figs. 12 and 13). As shown in Fig. 7(b) and Figs. 9(a) to 10(c), the piezoelectric layer 14, the insertion films 18, 18a, and the lower electrode 12 on the sides of the resonance region 50 are etched to form a through hole 22 in the piezoelectric layer 14. At this time, a film 42 (second film) attached by etching the piezoelectric layer 14 is formed between a film 44 (first film) attached by etching the lower electrode 12 and the side surface of the upper electrode 16, and films 43, 43a (third films) attached by etching the insertion films 18, 18a are formed at least one between the side surface of the upper electrode 16 and the film 42 and between the film 44 and the film 42 (see also Figs. 12 and 13). As a result, at least one of the films 43 and 43a is provided between the film 41 and the film 44, so that electrical connection between the film 41 and the film 44 is suppressed, and a short circuit between the lower electrode 12 and the upper electrode 16 can be suppressed.
[0063] In addition, in the first embodiment and its modified examples, the ion milling method is used for etching the piezoelectric layer 14, the insertion films 18, 18a, and the lower electrode 12. This allows the through holes 22 to be formed in the piezoelectric layer 14 regardless of the type of the piezoelectric layer 14. When the ion milling method is used, the material removed during etching is likely to adhere to the side surfaces of the upper electrode 16, etc., forming an adhesion film. At this time, when the insertion films 18, 18a are not provided as in the comparative example, a short circuit may occur between the lower electrode 12 and the upper electrode 16. Therefore, when the ion milling method is used, it is preferable to form the insertion films 18, 18a at least one between the lower electrode 12 and the piezoelectric layer 14 and between the piezoelectric layer 14 and the upper electrode 16.
[0064] In the first embodiment and its modified examples, the film 42 is a film to which the material removed during etching of the piezoelectric layer 14 is attached, so that the film 42 has a lower concentration of Al, which is a constituent element of the lower electrode 12, than the film 44, and does not contain Al, as shown in FIG. 11 and Table 1. The films 43 and 43a are films to which the material removed during etching of the insertion films 18 and 18a is attached, so that the film 43 has a lower concentration of Al, which is a constituent element of the lower electrode 12, than the film 44, and does not contain Al, for example. This suppresses electrical connection between the film 41 and the film 44, and suppresses short-circuiting between the lower electrode 12 and the upper electrode 16. The Al concentrations of the films 42 and 43 are preferably 0.1 times or less, more preferably 0.02 times or less, and even more preferably 0.01 times or less, of the Al concentration of the film 44. Furthermore, since the film 44 is a film to which the material removed during etching of the lower electrode 12 has adhered, the concentration of Si, which is a constituent element of the insertion films 18, 18a, is lower than that of the films 43, 43a, for example, 0.9 times or less.
[0065] In the first embodiment and its modified examples, the insertion films 18 and 18a are silicon oxide films, which are oxides of Si. In this case, the insulation of the films 43 and 43a, which are films to which the material removed during etching of the insertion films 18 and 18a is attached, can be improved. Thus, electrical connection between the film 41 and the film 44 is suppressed, and a short circuit between the lower electrode 12 and the upper electrode 16 can be suppressed. The insertion films 18 and 18a may be nitrides or carbides of metal elements in addition to oxides of metal elements, as long as they have a higher resistivity than the lower electrode 12 and the upper electrode 16. Specifically, silicon oxide (SiO2), silicon nitride (SiN), aluminum nitride (AlN), aluminum oxide (Al2O3), tantalum oxide (Ta2O5), zirconium oxide (ZrO2), silicon carbide (SiC), yttrium oxide (Y2O3), hafnium oxide (HfO2), titanium oxide (TiO2), magnesium oxide (MgO), titanium nitride (TiN), vanadium nitride (VN), chromium nitride (CrN ), niobium nitride (NbN), molybdenum nitride (MoN), hafnium nitride (HfN), tantalum nitride (TaN), tungsten nitride (WN), titanium carbide (TiC), vanadium carbide (VC), chromium carbide (CrC), niobium carbide (NbC), molybdenum carbide (MoC), hafnium carbide (HfC), tantalum carbide (TaC), and tungsten carbide (WC) may be included. Here, in this specification, semimetal elements such as boron (B), silicon (Si), and germanium (Ge) are also considered to be metal elements. Note that the insertion films 18 and 18a may be metal films as long as they have a higher resistivity than the lower electrode 12 and the upper electrode 16.
[0066] The insertion films 18, 18a are preferably inorganic insulating films in order to enhance the insulating properties of the films 43, 43a. Specifically, the insertion films 18, 18a are preferably formed to contain at least one of silicon oxide (SiO2), silicon nitride (SiN), aluminum nitride (AlN), aluminum oxide (Al2O3), tantalum oxide (Ta2O5), zirconium oxide (ZrO2), silicon carbide (SiC), yttrium oxide (Y2O3), hafnium oxide (HfO2), titanium oxide (TiO2), and magnesium oxide (MgO). Here, an insulating film is an inorganic insulating film having a resistivity of 10 8 The film has a resistance of Ω·cm or more.
[0067] In the first embodiment and its modified examples, the piezoelectric layer 14 is a single crystal lithium tantalate layer or a single crystal lithium niobate layer. In this case, an ion milling method is generally used to form the through holes 22 in the piezoelectric layer 14. Therefore, the material removed during etching adheres to the side surfaces of the upper electrode 16 and the like, and an adhesion film is easily formed. Therefore, when the piezoelectric layer 14 is a single crystal lithium tantalate layer or a single crystal lithium niobate layer, it is preferable to form the insertion film 18, 18a at least one between the lower electrode 12 and the piezoelectric layer 14 and between the piezoelectric layer 14 and the upper electrode 16. The piezoelectric layer 14 may be other than the single crystal lithium tantalate layer and the single crystal lithium niobate layer, and may be, for example, an aluminum nitride layer, a zinc oxide layer, a lead zirconate titanate layer, or a lead titanate layer.
[0068] In the first embodiment and its modified example, the lower electrode 12 and the upper electrode 16 excite thickness-shear vibration in the piezoelectric layer 14 in the resonance region 50. As shown in Fig. 1, two through-holes 22 are provided on either side of the resonance region 50, and the vibration direction 60 of the thickness-shear vibration is a direction (e.g., Y direction) that intersects with the direction (e.g., X direction) in which the two through-holes 22 face each other on either side of the resonance region 50. This makes it possible to suppress leakage of elastic waves from the resonance region 50.
[0069] In Example 1 and its modified examples, the maximum distance L (see FIG. 8) between the through hole 22 and the piezoelectric layer 14 in the resonance region 50 is 1.6λ or less, that is, 3.2 times or less the thickness of the piezoelectric layer 14. This makes it possible to suppress an increase in the size of the device while suppressing deterioration of the device characteristics, as shown in FIG. 5. From the viewpoint of suppressing deterioration of the device characteristics, the distance L is preferably 2.6 times or less the thickness of the piezoelectric layer 14, more preferably 1.6 times or less, and further preferably 0.7 times or less. EXAMPLES
[0070] 16(a) and 16(b) are cross-sectional views of an acoustic wave device 200 in accordance with the second embodiment. As shown in Fig. 16(a) and 16(b), in the acoustic wave device 200 in accordance with the second embodiment, a gap 36 is provided instead of the acoustic reflection film 30. The gap 36 is formed in, for example, an insulating film 38 provided on the substrate 10, and communicates with the through-hole 22. The other configurations are the same as those in the first embodiment, and therefore will not be described.
[0071] The acoustic wave device may be an SMR (Solidly Mounted Resonator) in which an acoustic reflection film 30 that reflects acoustic waves is provided under the lower electrode 12, as in Example 1 and its modified examples, or an FBAR (Film Bulk Acoustic Resonator) in which a gap 36 is provided under the lower electrode 12, as in Example 2. EXAMPLES
[0072] FIG. 17 is a circuit diagram of a filter 300 according to a third embodiment. As shown in FIG. 17, in the filter 300 according to the third embodiment, one or more series resonators S1 to S4 are connected in series between an input terminal Tin and an output terminal Tout. One or more parallel resonators P1 to P3 are connected in parallel between the input terminal Tin and the output terminal Tout. The acoustic wave device according to the first embodiment, the modified example of the first embodiment, or the second embodiment may be used for at least one of the series resonators S1 to S4 and the parallel resonators P1 to P3. The numbers of the series resonators and the parallel resonators can be appropriately set. Although a ladder-type filter is shown as an example of the filter, the filter may be a multimode filter.
[0073] In the third embodiment, the acoustic wave devices according to the first embodiment, the modified example of the first embodiment, and the second embodiment are used as filters, but the present invention is not limited to this. For example, the acoustic wave devices may be used as actuators such as inkjet micropumps, RF-MEMS switches, or optical mirrors, or sensors such as acceleration sensors, gyros, or energy harvesters. EXAMPLES
[0074] FIG. 18 is a circuit diagram of a duplexer 400 according to a fourth embodiment. As shown in FIG. 18, in the duplexer 400 according to the fourth embodiment, a transmission filter 80 is connected between a common terminal Ant and a transmission terminal Tx. A reception filter 82 is connected between the common terminal Ant and a reception terminal Rx. The transmission filter 80 passes a signal in a transmission band among high-frequency signals inputted from the transmission terminal Tx to the common terminal Ant as a transmission signal, and suppresses signals of other frequencies. The reception filter 82 passes a signal in a reception band among high-frequency signals inputted from the common terminal Ant to the reception terminal Rx as a reception signal, and suppresses signals of other frequencies. At least one of the transmission filter 80 and the reception filter 82 may be the filter of the second embodiment. Although a duplexer has been shown as an example of a multiplexer, a triplexer or a quadplexer may be used.
[0075] Although the embodiment of the present invention has been described in detail above, the present invention is not limited to such specific embodiment, and various modifications and variations are possible within the scope of the gist of the present invention described in the claims. [Explanation of symbols]
[0076] 10...substrate, 12...lower electrode, 14...piezoelectric layer, 16...upper electrode, 18, 18a...insertion film, 20...protection film, 22...through hole, 30...acoustic reflection film, 32...film with low acoustic impedance, 34...film with high acoustic impedance, 36...gap, 38...insulating film, 40...film, 41...film, 42...film, 43, 43a...film, 44...film, 50...resonance region, 60...vibration direction of thickness shear vibration, 70...mask layer, 80...transmitting filter, 82...receiving filter, 100, 110, 120, 200, 500...acoustic wave device, 300...filter, 400...duplexer
Claims
1. A substrate; a lower electrode provided on the substrate; an upper electrode provided on the lower electrode; a piezoelectric layer provided on the substrate with at least a portion thereof sandwiched between the lower electrode and the upper electrode, the piezoelectric layer having a through hole extending along a resonance region where the lower electrode and the upper electrode overlap with each other in a plan view and contacting a portion of the lower electrode; an insertion film provided between at least one of the lower electrode and the upper electrode and the piezoelectric layer, the insertion film having a resistivity higher than that of the lower electrode and the upper electrode; a first film provided on a side surface of the upper electrode and connected to the lower electrode, the first film including a constituent element of the lower electrode; a second film provided between a side surface of the upper electrode and the first film, the second film having a higher concentration of a constituent element of the piezoelectric layer than that of the first film; An elastic wave device comprising: a third film provided at least one between a side of the upper electrode and the second film and between the first film and the second film, the third film having a higher concentration of constituent elements of the insertion film that are different from the constituent elements of the piezoelectric layer than the second film and a lower concentration of constituent elements of the piezoelectric layer that are different from the constituent elements of the insertion film than the second film.
2. The acoustic wave device according to claim 1 , wherein the second film and the third film have a lower concentration of a constituent element of the lower electrode than the first film.
3. The acoustic wave device according to claim 1 , wherein the second film and the third film do not contain any constituent element of the lower electrode.
4. The acoustic wave device according to claim 1 , wherein the first film has a lower concentration of a constituent element of the insertion film than the third film.
5. The acoustic wave device according to claim 1 , wherein the insertion film is an inorganic insulating film.
6. 6. The acoustic wave device according to claim 5, wherein the insertion film is formed containing at least one of silicon oxide, silicon nitride, aluminum nitride, aluminum oxide, tantalum oxide, zirconium oxide, silicon carbide, yttrium oxide, hafnium oxide, titanium oxide, and magnesium oxide.
7. 3. The acoustic wave device according to claim 1, wherein the piezoelectric layer is a single crystal lithium tantalate layer or a single crystal lithium niobate layer.
8. the lower electrode and the upper electrode excite a thickness-shear vibration in the piezoelectric layer in the resonance region; The through holes are provided in two positions on either side of the resonance region, The acoustic wave device according to claim 7 , wherein a vibration direction of the thickness-shear vibration is a direction intersecting a direction in which the two through holes face each other across the resonance region.
9. The acoustic wave device of claim 8 , wherein a maximum distance between the through hole and the piezoelectric layer in the resonance region is equal to or less than 3.2 times a thickness of the piezoelectric layer in the resonance region.
10. A filter comprising the acoustic wave device according to claim 1 or 2.
11. A multiplexer including the filter of claim 10.
12. forming a lower electrode, a piezoelectric layer, and an upper electrode on a substrate in this order, and forming an insertion film having a higher resistivity than the lower electrode and the upper electrode at least one between the lower electrode and the piezoelectric layer and between the piezoelectric layer and the upper electrode; a second film attached by etching the piezoelectric layer between a first film attached by etching the lower electrode and a side of the upper electrode, and a third film attached by etching the insertion film is formed at least one of between the side of the upper electrode and the second film and between the first film and the second film, thereby forming a through hole in the piezoelectric layer along the resonance region.
13. The method for manufacturing an acoustic wave device according to claim 12 , wherein the piezoelectric layer, the insertion film, and the lower electrode are etched by an ion milling method.
Citation Information
Patent Citations
Piezoelectric thin film device
JP2008042871A