Optical apparatus

By employing a dual-substrate configuration with one substrate perpendicular and the other parallel to the optical axis, the optical device achieves a compact design by efficiently arranging electrical elements within the optical equipment, addressing the challenge of space-efficient substrate arrangement in existing designs.

JP2025042752APending Publication Date: 2025-03-28CANON KK
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Patent Information

Application Number
JP2023149865
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-09-15
Publication Date
2025-03-28

AI Technical Summary

Technical Problem

Existing optical equipment designs, such as those described in Patent Document 1, do not allow for a space-efficient arrangement of electrical substrates, making it difficult to reduce the size of the optical equipment.

Method used

The optical device comprises a first substrate with a main plane perpendicular to the optical axis and a second substrate with a main plane parallel to the optical axis, where the substrates are joined together, allowing for the placement of a first electrical element in a region extending across both mounting surfaces in the optical axis direction.

Benefits of technology

This configuration enables a compact optical device by efficiently utilizing space within the lens barrel, reducing the overall size of the optical equipment while minimizing voltage drop through direct soldering of the substrates.

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Abstract

To provide a compact optical apparatus.SOLUTION: An optical apparatus (101) includes: a first substrate (500) which has a main flat surface perpendicular to an optical axis; and a second substrate (600) which has a main flat surface parallel to the optical axis. The first substrate and the second substrate are joined to each other. The first substrate has: a first mounting surface (520); and a second mounting surface (521) on an opposite side of the first mounting surface. The second substrate has: a junction (601) joined to the first mounting surface of the first substrate; and a first region (630) extending to straddle in an optical axis direction the first mounting surface and the second mounting surface. A first electric element (610) is arranged in the first region (630).SELECTED DRAWING: Figure 6
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Description

[Technical field]

[0001] The present invention relates to optical instruments. [Background technology]

[0002] As functions such as autofocus and vibration isolation in optical devices such as interchangeable lenses improve, the scale of the control circuits mounted on the board inside the optical device increases, resulting in a larger board area. Patent Document 1 discloses an electric board mounting structure including at least one hard board substantially perpendicular to the optical axis, at least one hard board substantially parallel to the optical axis, and a board-to-board connector that connects both hard boards. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2003-172863 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the structure disclosed in Patent Document 1, the electric boards cannot be arranged with good spatial efficiency, making it difficult to reduce the size of the optical device.

[0005] Incidentally, a substrate used in an optical device may have relatively large electric elements mounted thereon, such as an LC filter and an actuator boost coil. Fig. 9 is a perspective view showing an example of an electric substrate (substrate) of an optical device as a comparative example. An electric element 910 is disposed on the subject side (upper side in Fig. 9) in the direction along the optical axis O (optical axis direction) on the substrate 900. In such a configuration, the higher the height of the electric element 910 in the optical axis direction, the larger the overall lens length of the optical device.

[0006] SUMMARY OF THE PRESENT EMBODIMENT An object of the present invention is to provide a compact optical device. [Means for solving the problem]

[0007] An optical device as one aspect of the present invention has a first substrate having a main plane perpendicular to an optical axis, and a second substrate having a main plane parallel to the optical axis, the first substrate and the second substrate being bonded to each other, the first substrate having a first mounting surface and a second mounting surface opposite the first mounting surface, the second substrate having a bonding portion bonded to the first mounting surface of the first substrate and a first region extending across the first mounting surface and the second mounting surface in the optical axis direction, and a first electrical element is disposed in the first region.

[0008] Other objects and features of the present invention will be described in the following embodiments. Effect of the Invention

[0009] According to the present invention, a small-sized optical device can be provided. [Brief description of the drawings]

[0010] [Figure 1] 1 is an external view of an imaging system according to an embodiment of the present invention. [Diagram 2] FIG. 1 is a block diagram of an imaging system according to an embodiment of the present invention. [Diagram 3] FIG. 2 is a cross-sectional view (renormalized state) of the imaging system according to the present embodiment. [Figure 4] FIG. 2 is a cross-sectional view (extended state) of the imaging system according to the present embodiment. [Diagram 5] 2 is a perspective view showing a state in which a first substrate and a second substrate are bonded to each other in the embodiment. FIG. [Figure 6] 4 is a side view showing a state in which a first substrate and a second substrate are bonded to each other in the embodiment. FIG. [Figure 7] 3 is a top view showing a state in which a first substrate and a second substrate are bonded to each other in the present embodiment. FIG. [Figure 8] 2A and 2B are a rear view and a cross-sectional view of the optical device according to the embodiment. [Figure 9]FIG. 13 is a perspective view of a substrate of an optical device as a comparative example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. In each drawing, the same reference numerals are used for the same components, and duplicated explanations will be omitted. Note that in this embodiment, an interchangeable lens (lens device) will be described as an example of an optical device, but this embodiment is not limited to this, and can be applied to other optical devices such as a lens-integrated camera.

[0012] 1(a) and (b) are external views of an imaging system (camera system) 100 in this embodiment, with Fig. 1(a) being a perspective view seen from the front side and Fig. 1(b) being a perspective view seen from the back side. The imaging system 100 is configured with a camera body (digital camera, imaging device) 1 and an interchangeable lens (lens device, optical equipment) 101 that is detachable from the camera body 1.

[0013] As shown in Fig. 1(a), the optical axis direction in which the optical axis of the imaging optical system housed in the interchangeable lens 101 extends is defined as the X-axis direction, and two directions that are perpendicular to the optical axis and perpendicular to each other are defined as the Z-axis direction (horizontal direction) and the Y-axis direction (vertical direction). Hereinafter, the Z-axis direction and the Y-axis direction are collectively referred to as the Z / Y-axis direction. In addition, the rotation direction around the Z axis is defined as the pitch direction, and the rotation direction around the Y axis is defined as the yaw direction. The pitch direction and yaw direction (pitch / yaw direction) are the rotation directions around two axes, the Z axis and the Y axis, which are perpendicular to each other.

[0014] A grip section 2 is provided on the left side of the camera body 1 as viewed from the front (the subject side) (the right side as viewed from the rear) for the user to hold the camera body 1 with his / her hand. A power supply operation section 3 is also provided on the top surface of the camera body 1. When the user turns on the power supply operation section 3 while the camera body 1 is in the power-off state, the camera body 1 is turned on and image capture is possible. When the user turns off the power supply operation section 3 while the camera body 1 is in the power-on state, the camera body 1 is turned off.

[0015] A mode dial 4, a release button 5, and an accessory shoe 6 are provided on the top surface of the camera body 1. The user can switch between imaging modes by rotating the mode dial 4. The imaging modes include a manual still image imaging mode in which the user can arbitrarily set imaging conditions such as shutter speed and aperture value, an auto still image imaging mode in which an appropriate exposure amount is automatically obtained, and a video imaging mode for capturing videos. In addition, the user can instruct imaging preparation operations such as autofocus and auto exposure control by half-pressing the release button 5, and can instruct imaging by fully pressing the button. Accessories such as an external flash and an external viewfinder (EVF), not shown, are detachably attached to the accessory shoe 6. In addition, an imaging element that photoelectrically converts (captures) a subject image formed by an imaging optical system in the interchangeable lens 101 is provided in the camera body 1.

[0016] The interchangeable lens 101 is mechanically and electrically connected to the camera mount 7 provided on the camera body 1 via a lens mount (mount unit) 102. As described above, the interchangeable lens 101 houses an imaging optical system that forms an image of a subject by focusing light from the subject. The outer periphery of the interchangeable lens 101 is provided with a zoom ring 103 that can be rotated around an optical axis by a user's operation. The outer periphery of the zoom ring 103 is provided with a knurled shape to prevent the user's hand from slipping when operating it. When the zoom ring 103 is rotated by the user, the zoom group that constitutes the imaging optical system moves to a predetermined optical position corresponding to the angle of the zoom ring 103. This allows the user to take a picture at a desired angle of view.

[0017] As shown in FIG. 1(b), a rear operation unit 8 and a display unit 9 are provided on the rear of the camera body 1. The rear operation unit 8 includes a plurality of buttons and dials to which various functions are assigned. When the power of the camera 1 is on and a still image or video imaging mode is set, a through image of a subject image captured by an imaging element is displayed on the display unit 9. The display unit 9 also displays imaging parameters indicating imaging conditions such as shutter speed and aperture value (F value), and the user can change the setting values ​​of the imaging parameters by operating the rear operation unit 8 while viewing the display. The rear operation unit 8 includes a playback button for instructing playback of a recorded captured image, and the captured image is played back and displayed on the display unit 9 by the user operating the playback button.

[0018] 2 is a block diagram showing the electrical and optical configuration of the imaging system 100. The camera body 1 has a power supply unit 10 that supplies power to the camera body 1 and the interchangeable lens 101, the power operation unit 3 described above, a mode dial 4, a release button 5, and an operation unit 11 that includes a rear operation unit 8 and a touch panel function of the display unit 9. The camera body 1 and the interchangeable lens 101 as a whole system are controlled by a camera control unit 12 provided in the camera body 1 and a lens control unit 104 provided in the interchangeable lens 101 in cooperation with each other.

[0019] The camera control unit 12 reads out and executes a computer program stored in the storage unit 13. In this case, the camera control unit 12 communicates various control signals, data, and the like with the lens control unit 104 via a communication terminal of an electrical contact 105 provided on the lens mount 102. The electrical contact 105 includes a power supply terminal that supplies power from the power supply unit 10 described above to the interchangeable lens 101.

[0020] The imaging optical system of the interchangeable lens 101 includes a zoom group 110 that is connected to the zoom operation ring 103 and moves in the optical axis direction to change the angle of view, and an anti-vibration group 115 that includes a shift lens as an anti-vibration element that reduces image blur. The anti-vibration group 115 performs an anti-vibration operation to reduce image blur by moving (shifting) the shift lens in the Z / Y axis direction perpendicular to the optical axis O. The imaging optical system also includes an aperture group (aperture diaphragm) 201 that performs a light amount adjustment operation, and a focus group 112 that is a moving lens group including a focus lens that moves in the optical axis direction to adjust the focus. The interchangeable lens 101 also includes an anti-vibration driver 402 that drives the anti-vibration group 115 to shift the shift lens, an aperture driver 202 that drives the aperture group 201, and a focus driver 302 that drives the focus group 112 to move the focus lens.

[0021] The camera body 1 has a shutter unit 14, a shutter drive section 15, an image sensor 16, an image processing section 17, and the camera control section 12 described above. The shutter unit 14 controls the amount of light collected by the image sensor 16 through the image sensor 16 and exposed to the light. The image sensor 16 has a CMOS (Complementary Metal-Oxide-Semiconductor) sensor or the like, and performs photoelectric conversion on the subject image (optical image) formed by the image sensor 16, and outputs an image signal. The image processing section 17 performs various image processes on the image signal, and then generates an image signal. The display section 9 displays the image signal (through image) output from the image processing section 17, displays the image sensor parameters described above, or reproduces and displays the captured image recorded in the memory section 13 or a recording medium (not shown).

[0022] The camera control unit 12 controls the driving of the aperture group 201 and the shutter unit 14 via the aperture drive unit 202 and the shutter drive unit 15 in accordance with the setting values ​​of the aperture value and the shutter speed received from the operation unit 11. The camera control unit 12 also controls the driving of the focus group 112 in accordance with an image capture preparation operation (half-press operation) on the operation unit 11 (release button 5).

[0023] For example, when an autofocus operation is instructed, the focus detection unit 18 determines the focus state of the subject image formed by the image sensor 16 based on the image signal generated by the image processing unit 17, generates a focus signal, and transmits it to the camera control unit 12. At the same time, the focus driving unit 302 detects the current position of the focus group 112, and transmits the signal to the camera control unit 12 via the lens control unit 104. The camera control unit 12 compares the focus state of the subject image with the current position of the focus group 112, calculates the focus driving amount from the amount of deviation, and transmits it to the lens control unit 104. Then, the lens control unit 104 drives and controls the focus group 112 to a target position via the focus driving unit 302, and corrects the focus deviation of the subject image.

[0024] Furthermore, when an automatic exposure control operation is instructed, the camera control unit 12 receives a luminance signal generated by the image processing unit 17 and performs a photometric calculation. Based on the result of the photometric calculation, the camera control unit 12 controls the driving of the aperture group 201 in response to an image capture instruction operation (full press operation) on the operation unit 11 (release button 5). At the same time, the camera control unit 12 controls the driving of the shutter unit 14 via the shutter driving unit 15, and performs an exposure process by the image sensor 16.

[0025] The camera body 1 has a pitch shake detection unit 19 and a yaw shake detection unit 20 as shake detection means capable of detecting image shake such as a user's hand shake. The pitch shake detection unit 19 and the yaw shake detection unit 20 respectively use an angular velocity sensor (vibration gyro) and an angular acceleration sensor to detect image shake in the pitch direction (rotation direction around the Z axis) and the yaw direction (rotation direction around the Y axis) and output a shake signal. The camera control unit 12 calculates the shift position of the vibration isolation group 115 (shift lens) in the Y axis direction using the shake signal from the pitch shake detection unit 19. Similarly, the camera control unit 12 calculates the shift position of the vibration isolation group 115 in the Z axis direction using the shake signal from the yaw shake detection unit 20. Then, the camera control unit 12 controls the drive of the vibration isolation group 115 to a target position according to the calculated shift position in the pitch / yaw direction, and performs a vibration isolation operation to reduce image shake during exposure or during through image display.

[0026] The interchangeable lens 101 has a zoom ring 103 for changing the angle of view of the imaging optical system, and a zoom detection unit 106 for detecting the angle of the zoom ring 103. The zoom detection unit 106 detects the angle of the zoom ring 103 operated by the user as an absolute value, and is configured using, for example, a resistive linear potentiometer. Information on the angle of view detected by the zoom detection unit 106 is transmitted to the lens control unit 104, and is reflected in various controls by the camera control unit 12 described above. Meanwhile, part of the various pieces of information are recorded in the storage unit 13 or a recording medium together with the captured image.

[0027] Next, the positional relationship of the components of the imaging system 100 will be described with reference to Fig. 3 and Fig. 4. Fig. 3 and Fig. 4 are cross-sectional views of the imaging system 100 on the XY plane including the optical axis, with Fig. 3 showing the zoom retracted state of the interchangeable lens 101 and Fig. 4 showing the zoom extended state.

[0028] This embodiment employs a seven-group configuration as an example of an imaging optical system. Each zoom group that has moved to a predetermined optical position according to the angle of view forms an image of light from a subject on the imaging surface of the imaging element 16. At this time, the focus group 112 functions as a second zoom group, and the vibration reduction group 115 functions as a fifth zoom group. The imaging optical system also has a first zoom group 111, an aperture group 201, a third zoom group 113, a fourth zoom group 114, a sixth zoom group 116, and a seventh fixed group 117.

[0029] The zoom group 110 of the imaging optical system has an object side zoom group 110a and an imaging surface side zoom group 110b. The object side zoom group 110a includes a first zoom group 111. The imaging surface side zoom group 110b includes a focus group (second zoom group) 112, a third zoom group 113, a fourth zoom group 114, a vibration reduction group (fifth zoom group) 115, a sixth zoom group 116, and an aperture group 201, which are connected to one another.

[0030] Note that this embodiment does not limit the configuration of the lens groups, and for example, the vibration isolation group 115 may function as a third zoom group. Also, some of the lens groups may not be movable but may be fixed.

[0031] The linear guide barrel 107 is fixed to a fixed barrel 109, and is a fixed part that is fixed to the lens mount 102 via the fixed barrel 109. Bayonet claws (not shown) are arranged at equal intervals on the outer circumferential surface of the linear guide barrel 107. Meanwhile, a circumferential groove (not shown) is provided on the inner circumferential surface of the cam barrel 108. Furthermore, the cam barrel 108 is connected to the zoom operation ring 103. When the zoom operation ring 103 is rotated, the cam barrel 108 rotates about the optical axis due to the engagement between the bayonet claws and the circumferential groove.

[0032] The linear guide barrel 107 is formed with linear guide grooves that restrict the movement of each zoom group in the rotation direction and guide the linear movement in the optical axis direction. The cam barrel 108 is formed with cam grooves that correspond to the object side zoom group 110a and the image plane side zoom group 110b and have trajectories at different angles in the rotation direction. On the other hand, the object side zoom group 110a and the image plane side zoom group 110b are each provided with a cam follower, and each cam follower engages with the corresponding linear guide groove and cam groove. When the user rotates the zoom operation ring 103, the cam barrel 108 rotates, and the cam follower moves the object side zoom group 110a and the image plane side zoom group 110b forward and backward in the optical axis direction along their respective trajectories by engaging with the linear guide groove and the cam groove.

[0033] 5 is a perspective view showing a state in which the first substrate 500 and the second substrate 600 of this embodiment are joined together. The first substrate 500 is a substrate having a main plane that is approximately perpendicular to the optical axis O. The first substrate 500 is a main substrate for controlling the vibration isolation driving unit 402, the aperture driving unit 202, the focus driving unit 302, and the like of the interchangeable lens 101. On the first substrate 500, a microcomputer equipped with basic control functions, driving ICs for various actuators, a connector 503 for connecting another substrate in the interchangeable lens 101, and the like are mounted.

[0034] Connector 503 is one of a plurality of connectors arranged on first substrate 500, and serves as a connection portion with a flexible printed circuit board (not shown). The flexible printed circuit board connected to connector 503 is connected to lens mount 102 shown in FIG. 4, which is connected to camera body 1.

[0035] The outer shape of the first substrate 500 is defined by a first substrate inner diameter 506, which is the inner diameter (minimum inner diameter) of the first substrate 500, and a first substrate outer diameter 507, which is the outer diameter (maximum outer diameter) of the first substrate 500. The first substrate inner diameter 506 and the first substrate outer diameter 507 have the same center (optical axis O of the lens, which is an optical element). The first substrate 500 has an arc shape.

[0036] The second substrate 600 is a substrate having a main plane substantially parallel to the optical axis O. The second substrate 600 is a substrate bonded perpendicularly to the first substrate 500, and is a substrate that assists the function of the first substrate 500. Details of the second substrate 600 will be described later.

[0037] The electric element (first electric element) 610 is an electric element such as an LC filter that cuts or passes a specific frequency band of an electric signal. In this embodiment, the electric element 610 is 5.0 mm (D) x 5.0 mm (W) x 3.0 mm (H). The height of the connector 503 is about 1.0 mm, and the heights of other peripheral components are 1.0 mm or less.

[0038] The electric element 610 may be an electric element having other functions, such as a boost coil for the actuator, etc. In this case, a larger electric element may be used as the electric element 610 to amplify the voltage of the actuator.

[0039] The first substrate 500 and the second substrate 600 are electrically connected to each other by soldering. Compared to joining via a connector, soldering can reduce the space occupied by the connector required to mount the connector. This allows optical devices such as the interchangeable lens 101 to be miniaturized. Furthermore, compared to joining via a connector, soldering can directly connect the substrates to each other, making it possible to reduce the contact resistance associated with the connection. As a result, it is possible to suppress voltage drop.

[0040] First substrate 500 has electric elements arranged on first mounting surface 520 and second mounting surface 521 (see FIG. 6 ) which is the back surface (opposite side of first mounting surface 520) of first mounting surface 520. The electric elements are arranged on first mounting surface 520 on the imaging element side, and on second mounting surface 521 on the subject side.

[0041] 6 is a side view (viewed from the electrical element mounting surface of the second substrate 600) showing a state in which the first substrate 500 and the second substrate 600 are joined to each other in this embodiment. The second substrate 600 has a joint 601 that is joined to the first mounting surface 520 of the first substrate 500. The first substrate 500 and the second substrate 600 are joined to each other by soldering at the joint 601 where the insulating layer is opened and the conductor is exposed.

[0042] 5 and 6, the bonding portion 601 is disposed on both sides of the second substrate 600, the side on which the electric element 610 is disposed and the back side (not shown). The bonding portion 601 may be reinforced with a material other than solder, such as an adhesive. Note that in this embodiment, one bonding portion is shown as the bonding portion 601, but the present invention is not limited to this. The bonding portion 601 may have multiple bonding portions on both sides, or at multiple different positions.

[0043] The second substrate 600 has a crossing portion (second region) 620 and an extension portion (first region) 630. In the optical axis direction, the extension portion 630 protrudes from the second mounting surface 521 of the first substrate 500, and the crossing portion 620 protrudes from the first mounting surface 520 of the first substrate 500. The extension portion 630 extends from the joint portion 601 to straddle an end portion (external end portion) 530 of the first substrate 500 in a direction perpendicular to the optical axis O. The crossing portion 620 intersects with the end portion 530 of the first substrate 500 in a direction perpendicular to the optical axis O.

[0044] In this embodiment, a capacitor (second electric element) 611 is disposed on the crossing portion 620. In this case, the capacitor 611 is disposed on the first mounting surface 520 side of the first substrate 500 in a direction along the optical axis O (optical axis direction). However, this embodiment is not limited thereto, and the capacitor 611 may be disposed in a region of the second substrate 600 that overlaps with the first substrate 500 in a direction perpendicular to the optical axis O.

[0045] The extension portion 630 extends from the crossing portion 620 toward the second mounting surface 521 of the first substrate 500 so as to straddle the optical axis direction. In the configuration of this embodiment, an electric element 610 is disposed in the extension portion 630. In this case, the electric element 610 is disposed on the second mounting surface 521 side of the first substrate 500 in the optical axis direction.

[0046] In this embodiment, the second substrate 600 has an L-shaped substrate shape, but may have another substrate shape having the crossing portion 620 and the extension portion 630.

[0047] FIG. 7 is a top view (viewed from the electric element mounting surface of the first substrate 500) showing a state in which the first substrate 500 and the second substrate 600 of this embodiment are joined to each other. The second substrate 600 is arranged so that the longitudinal direction of the connector 503 of the first substrate 500 and the transverse portion 620 of the second substrate 600 are substantially parallel to each other (so that the main plane of the second substrate 600 is substantially parallel to the longitudinal direction of the connector 503). In this configuration, when a flexible printed circuit board (not shown) is inserted into the connector 503 from the first substrate inner diameter 506 side of the first substrate 500, the area between the connector 503 and the first substrate outer diameter 507 of the first substrate 500 can be utilized. For example, an electric element constituting a circuit related to a power supply circuit is mounted on the second substrate 600. That is, the configuration in which the connector 503 and the second substrate 600 are arranged close to each other can shorten the electric connection path from the lens mount 102 to the electric element 610, so that the voltage drop can be suppressed.

[0048] According to the configuration of this embodiment, the electric element 610 can be arranged so as not to overlap with the first substrate 500 (substrate region between the first mounting surface 520 and the second mounting surface 521) in the optical axis direction. Furthermore, according to this embodiment, when viewed from the optical axis direction (on a projection plane perpendicular to the optical axis O), at least a part of the electric element 610 (the upper surface or the outermost side of the electric element 610) can be arranged so as to protrude outward (at a position farther from the optical axis O) than the first substrate outer diameter 507.

[0049] 7, when viewed from the optical axis direction, the extension portion 630 and the crossing portion 620 of the second substrate 600 are disposed between the minimum inner diameter and the maximum outer diameter of the first substrate 500. When viewed from the optical axis direction, at least a portion of the electric element 610 protrudes outward beyond the maximum outer diameter of the first substrate 500. When viewed from the optical axis direction, the extension portion 630 of the second substrate 600 extends in a region of the first substrate 500 having an outer diameter smaller than the maximum outer diameter.

[0050] In a conventional configuration, when attempting to place the electric element 610 on the first substrate 500, the position at which the electric element 610 is placed is limited by the substrate shape, such as the inner diameter and outer diameter, of the first substrate 500. On the other hand, according to the configuration of the present embodiment, the electric element 610 can be placed in the space within the lens barrel without being affected by the substrate shape of the first substrate 500.

[0051] Fig. 8(a) is a rear view of the interchangeable lens 101 equipped with the first substrate 500 and the second substrate 600 of this embodiment. Fig. 8(b) is a cross-sectional view taken along line AA in Fig. 8(a). Fig. 8(a) is a view showing the interchangeable lens 101 from the imaging surface side, illustrating the arrangement of the lens mount 102. Fig. 8(b) illustrates the arrangement of the first substrate 500 and the second substrate 600 within the interchangeable lens 101.

[0052] The lens mount 102 is fixed to an exterior ring 120, which is an exterior part of the interchangeable lens 101, with screws 130. Taking into consideration the connection with the camera body 1, the first substrate 500 is disposed directly below the lens mount 102. In this configuration, the crossing portion 620 or the joint portion 601 of the second substrate 600 is disposed between the first mounting surface 520 of the first substrate 500 and the lens mount 102.

[0053] The electric element 610 is disposed close to the exterior ring 120. In the conventional configuration, the electric element 610 is disposed large in order to avoid interference with the internal lens barrel. On the other hand, the arrangement of this embodiment provides a good spatial efficiency in the shape of the lens barrel components and the board arrangement. Therefore, the configuration of this embodiment can provide a board arrangement that effectively utilizes the space between the lens mount 102 and the first board 500 and the space inside the exterior ring 120.

[0054] In the configuration of this embodiment, by mounting electric element 610 and capacitor 611 on second substrate 600, the component arrangement space of first substrate 500 can be reduced and the components can be arranged efficiently in the space inside the lens barrel. Furthermore, the configuration of this embodiment including crossing portion 620 and extension portion 630 can utilize not only the component arrangement area of ​​first substrate 500 but also the areas on first mounting surface 520 side and second mounting surface 521 side, making it possible to expand the component arrangement area in the optical axis direction.

[0055] According to this embodiment, the second substrate 600 has a joint portion 601, a crossing portion 620, and an extension portion 630, and the electric element 610 is arranged in the extension portion 630, thereby realizing a substrate arrangement that can be arranged with good spatial efficiency in the lens barrel. Therefore, according to this embodiment, a small optical device can be provided. In addition, the first substrate 500 and the second substrate 600 are electrically connected directly by soldering, thereby making it possible to suppress voltage drop.

[0056] In this embodiment, the first substrate 500 has an arc shape, but is not limited thereto, and may have a rectangular shape, or a irregular shape such as a part of the first substrate inner diameter 506 or the first substrate outer diameter 507 being a straight line. When the substrate shape of the first substrate 500 is rectangular, the first substrate 500 may be disposed on the fixed barrel 109 or the like, instead of directly below the lens mount 102.

[0057] The disclosure of each embodiment includes the following configurations. (Configuration 1) A first substrate having a main plane perpendicular to an optical axis; a second substrate having a main plane parallel to the optical axis; the first substrate and the second substrate are bonded to each other; the first substrate has a first mounting surface and a second mounting surface opposite the first mounting surface; the second substrate has a joint portion joined to the first mounting surface of the first substrate, and a first region extending across the first mounting surface and the second mounting surface in an optical axis direction, An optical device comprising: a first electric element disposed in the first region. (Configuration 2) The optical device described in configuration 1, wherein the second substrate has a second region that intersects with an end of the first substrate in a direction perpendicular to the optical axis. (Configuration 3) The optical device described in configuration 2, characterized in that a second electrical element is disposed in the second region of the second substrate or in a region that overlaps with the first substrate in a direction perpendicular to the optical axis. (Configuration 4) The imaging device further includes a mount portion connectable to the imaging device, 4. The optical device of any one of configurations 1 to 3, wherein the joint portion of the second substrate is disposed between the first mounting surface of the first substrate and the mount portion. (Configuration 5) 5. The optical device according to any one of configurations 1 to 4, wherein the first electrical element is disposed so as not to overlap with the first substrate in the optical axis direction. (Configuration 6) An optical device described in any one of configurations 1 to 5, characterized in that, when viewed from the optical axis direction, at least a portion of the first electrical element is positioned at a position farther from the optical axis than the maximum outer diameter of the first substrate. (Configuration 7) a connector is disposed on the first mounting surface of the first substrate, 7. The optical device according to any one of configurations 1 to 6, wherein the main plane of the second substrate is parallel to the longitudinal direction of the connector in a direction perpendicular to the optical axis. (Configuration 8) 8. The optical device according to any one of configurations 1 to 7, wherein the first substrate and the second substrate are joined to each other by solder. (Configuration 9) In the optical axis direction, the second substrate has the first region protruding from the second mounting surface of the first substrate and a second region protruding from the first mounting surface of the first substrate, When viewed from the optical axis direction, the first region and the second region of the second substrate are disposed between a minimum inner diameter and a maximum outer diameter of the first substrate; At least a portion of the first electric element protrudes outward beyond the maximum outer diameter of the first substrate; 9. The optical device of any one of configurations 1 to 8, wherein the first region of the second substrate is extended in a region of the first substrate having an outer diameter smaller than the maximum outer diameter. (Configuration 10) 10. The optical device according to any one of configurations 1 to 9, wherein the optical device is a lens device. (Configuration 11) 10. The optical device according to any one of configurations 1 to 9, wherein the optical device is an imaging device.

[0058] Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist of the present invention. [Explanation of symbols]

[0059] 101 Interchangeable lenses (optical equipment) 500 First board 520 First mounting surface 521 Second mounting surface 600 Second board 601 Joint 610 Electrical elements (first electrical elements) 630 Extension section (first area)

Claims

1. A first substrate having a main plane perpendicular to an optical axis; a second substrate having a main plane parallel to the optical axis; the first substrate and the second substrate are bonded to each other; the first substrate has a first mounting surface and a second mounting surface opposite the first mounting surface; the second substrate has a joint portion joined to the first mounting surface of the first substrate, and a first region extending across the first mounting surface and the second mounting surface in an optical axis direction, An optical device comprising: a first electric element disposed in the first region.

2. The optical device according to claim 1 , wherein the second substrate has a second region that intersects with an end of the first substrate in a direction perpendicular to the optical axis.

3. 3. The optical device according to claim 2, wherein a second electric element is disposed in the second region of the second substrate or in a region that overlaps with the first substrate in a direction perpendicular to the optical axis.

4. The imaging device further includes a mount portion connectable to the imaging device, 2 . The optical device according to claim 1 , wherein the joint portion of the second substrate is disposed between the first mounting surface of the first substrate and the mount portion.

5. The optical device according to claim 1 , wherein the first electric element is disposed so as not to overlap with the first substrate in the optical axis direction.

6. The optical device according to claim 1 , wherein, when viewed from the optical axis direction, at least a portion of the first electrical element is disposed at a position farther from the optical axis than a maximum outer diameter of the first substrate.

7. a connector is disposed on the first mounting surface of the first substrate, 2. The optical device according to claim 1, wherein the main plane of the second substrate is parallel to a longitudinal direction of the connector in a direction perpendicular to the optical axis.

8. 2. The optical device according to claim 1, wherein the first substrate and the second substrate are joined to each other by soldering.

9. In the optical axis direction, the second substrate has the first region protruding from the second mounting surface of the first substrate and a second region protruding from the first mounting surface of the first substrate, When viewed from the optical axis direction, the first region and the second region of the second substrate are disposed between a minimum inner diameter and a maximum outer diameter of the first substrate; At least a portion of the first electric element protrudes outward beyond the maximum outer diameter of the first substrate; 2. The optical device according to claim 1, wherein the first region of the second substrate extends in a region of the first substrate that has an outer diameter smaller than the maximum outer diameter.

10. 10. The optical device according to claim 1, wherein the optical device is a lens device.

11. 10. The optical device according to claim 1, wherein the optical device is an imaging device.

Citation Information

Patent Citations

  • Electric substrate mounting structure for interchangeable lens

    JP2003172863A