Circuit component

Abstract

To provide a circuit component capable of suppressing deterioration of high frequency characteristics of a transmission line.SOLUTION: A circuit component includes a first conductor layer, a second conductor layer, and a low-pass filter. The first conductor layer includes a DC circuit for passing a DC signal. The second conductor layer is disposed below the first conductor layer. The low-pass filter is disposed on the first conductor layer and connected to the DC line. The second conductor layer includes a first opening. The first opening is an opening for increasing the impedance of the DC circuit. The first opening is disposed in a portion corresponding to the low-pass filter.SELECTED DRAWING: Figure 13

Description

[Technical field]

[0001] The present invention relates to a circuit component. [Background technology]

[0002] Patent Document 1 discloses a circuit component equipped with an electromagnetic relay for switching high-frequency signals. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2011-96410 Summary of the Invention [Problem to be solved by the invention]

[0004] For example, in a circuit component including a circuit combining a high-frequency transmission line and a DC transmission line, a high-frequency signal may leak from the high-frequency transmission line to the DC transmission line, deteriorating the high-frequency characteristics (insertion loss, return loss, etc.) of the high-frequency transmission line. An object of the present invention is to provide a circuit component capable of suppressing the deterioration of the high-frequency characteristics of the transmission line.

[0005] A circuit component according to an embodiment of the present invention includes a first conductor layer, a second conductor layer, and a low-pass filter. The first conductor layer includes a DC circuit for passing a DC signal. The second conductor layer is disposed below the first conductor layer. The low-pass filter is disposed on the first conductor layer and connected to the DC line. The second conductor layer includes a first opening. The first opening is an opening for increasing the impedance of the DC circuit. The first opening is disposed in a portion corresponding to the low-pass filter.

[0006] In the circuit component according to this embodiment, the second conductor layer includes a first opening for increasing the impedance of the DC circuit, and therefore the impedance can be increased compared to when the second conductor layer does not include the first opening. As a result, for example, when the circuit component includes a high-frequency transmission line, it is possible to prevent a high-frequency signal from leaking into the DC transmission line and thus to prevent the high-frequency characteristics of the high-frequency transmission line from deteriorating. In addition, the deterioration of the high-frequency characteristics can be prevented with a simple configuration.

[0007] The low-pass filter may include an inductor. The first opening may face the inductor. In this case, deterioration of high-frequency characteristics can be effectively suppressed.

[0008] The circuit component may further include a switching unit. The first conductor layer may further include an RF circuit for passing an RF signal. The RF circuit may include a first transmission line and a second transmission line. The DC circuit may be connected to either the first transmission line or the second transmission line. The switching unit may be switchable between an ON state in which the first transmission line and the second transmission line are connected, and an OFF state in which the first transmission line and the second transmission line are disconnected. In this case, in a circuit component including a switching unit that switches between an RF circuit and a DC circuit, deterioration of high frequency characteristics of the RF circuit can be suppressed with a simple configuration.

[0009] The circuit component may further include a coil block and a movable block. The coil block may include a coil. The movable block may be operated by an electromagnetic force of the coil to switch between an on state and an off state via a switching unit. The switching unit may include a movable contact piece that is movable between a connection position that connects the first transmission line and the second transmission line and a disconnection position that disconnects the first transmission line and the second transmission line. In this case, the on state and the off state can be switched by operating the movable contact piece.

[0010] The circuit component may further include a third conductor layer disposed below the second conductor layer. The third conductor layer may be disposed in a portion corresponding to the low-pass filter and include a second opening for increasing the impedance of the DC circuit. In this case, the impedance of the DC circuit can also be increased by the second opening, so that deterioration of high frequency characteristics can be further suppressed.

[0011] The low-pass filter may include an inductor, and the first opening and the second opening may face the inductor, which can more effectively prevent the high-frequency characteristics from deteriorating. Effect of the Invention

[0012] According to the present invention, it is possible to provide a circuit component capable of suppressing deterioration of high-frequency characteristics of a transmission line. [Brief description of the drawings]

[0013] [Figure 1] FIG. 2 is a perspective view of a circuit component including an electromagnetic relay. [Diagram 2] FIG. 2 is a perspective view of a circuit component including an electromagnetic relay. [Diagram 3] FIG. 2 is an exploded perspective view of a circuit component including an electromagnetic relay. [Figure 4] FIG. 2 is a perspective view of a substrate body of the circuit component. [Diagram 5] FIG. 2 is a top view of a substrate body of the circuit component. [Figure 6] 2 is a perspective view of the base assembly and the stand as viewed from below. FIG. [Figure 7] FIG. 4 is a perspective view of the base assembly as viewed from below. [Figure 8] FIG. [Figure 9] FIG. 2 is a cross-sectional view of a circuit component including an electromagnetic relay in an open state. [Figure 10] FIG. [Figure 11] FIG. 2 is a cross-sectional view of a circuit component including an electromagnetic relay in a closed state. [Figure 12] FIG. 4 is a plan view of a second conductor layer. [Figure 13] FIG. 6 is a partially enlarged view of FIG. [Figure 14] FIG. 6 is a partially enlarged view of FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, a circuit component 1 according to an embodiment will be described with reference to the drawings. The circuit component 1 according to the present embodiment includes an electromagnetic relay 2 used to switch between a high-frequency RF signal and a low-frequency DC signal.

[0015] 1 and 2 are perspective views of a circuit component 1 including an electromagnetic relay 2. As shown in Fig. 1 and 2, the electromagnetic relay 2 includes a case 3, a base assembly 4, and a stand 5. Note that the case 3 is omitted in Fig. 2. In the following description, the direction in which the base assembly 4 and the stand 5 are arranged with respect to a board body 10 of the circuit component 1, which will be described later, is defined as the upper side, and the opposite direction is defined as the lower side.

[0016] As shown in Fig. 1, the case 3 is attached to the board body 10 of the circuit component 1. The case 3 covers the upper surface of the board body 10 of the circuit component 1, the base assembly 4, and the stand 5. Fig. 3 is an exploded perspective view of the circuit component 1 including the electromagnetic relay 2. As shown in Fig. 3, the electromagnetic relay 2 includes a first movable contact piece 6A, a second movable contact piece 6B, and a shield plate 7. The first movable contact piece 6A, the second movable contact piece 6B, and the shield plate 7 are disposed on the board body 10 of the circuit component 1.

[0017] FIG. 4 is a perspective view of the board body 10 of the circuit component 1. In FIG. 4, the shield plate 7 is omitted. The circuit component 1 is a printed circuit board. However, the circuit component 1 may be a ceramic board, a resin molded product, a metal molded product, an FPC (flexible printed circuit board), or an MID (molded circuit component). As shown in FIG. 4, the board body 10 of the circuit component 1 includes first to fourth conductor layers 11-14 and first to third dielectric layers 15-17. The first to fourth conductor layers 11-14 are made of an electrically conductive material such as copper. The first to third dielectric layers 15-17 are made of a dielectric material. The first to fourth conductor layers 11-14 and the first to third dielectric layers 15-17 are alternately stacked.

[0018] The first conductor layer 11 is provided on the upper surface of the board body 10 of the circuit component 1. Fig. 5 is a top view of the board body 10 of the circuit component 1. Note that the shield plate 7 and the movable contact pieces 6A, 6B are omitted in Fig. 5. As shown in Figs. 4 and 5, the first conductor layer 11 is provided with a first RF line 21A, a second RF line 21B, a first DC line 22A, a second DC line 22B, and a ground line 23. The first RF line 21A is an example of an RF circuit. The first DC line 22A is an example of a DC circuit.

[0019] The first RF line 21A and the second RF line 21B are transmission lines for transmitting an RF signal. The first RF line 21A includes a first transmission line 24A and a second transmission line 25A. The first transmission line 24A and the second transmission line 25A are arranged apart from each other. The first transmission line 24A and the second transmission line 25A are electrically isolated from each other. The first transmission line 24A is connected to a first input terminal 26A. The second transmission line 25A is connected to a first RF terminal 27A. The first input terminal 26A and the first RF terminal 27A are through-hole terminals provided on the end surface of the board body 10 of the circuit component 1, respectively.

[0020] The second RF line 21B includes a third transmission line 24B and a fourth transmission line 25B. The third transmission line 24B and the fourth transmission line 25B are arranged apart from each other. The third transmission line 24B and the fourth transmission line 25B are electrically isolated from each other. The third transmission line 24B is connected to a second input terminal 26B. The fourth transmission line 25B is connected to a second RF terminal 27B. The second input terminal 26B and the second RF terminal 27B are through-hole terminals provided on the end surface of the board body 10 of the circuit component 1, respectively.

[0021] The first DC line 22A and the second DC line 22B are transmission lines for passing a DC signal. The first DC line 22A is connected to the first transmission line 24A and the ground line 23. A first inductor 28A and a first capacitor 29A are disposed on the first DC line 22A. Note that in Figs. 4 and 5, only a part of the first inductor 28A is labeled with the reference symbol 28A, and the reference symbols of the other first inductors 28A are omitted.

[0022] The first DC line 22A is connected to the first DC terminal 30A between the first inductor 28A and the first capacitor 29A. The first DC terminal 30A is a through-hole terminal provided on an end surface of the board body 10 of the circuit component 1. The first DC line 22A, the first inductor 28A, and the first capacitor 29A function as a low-pass filter that passes DC signals but cuts RF signals. The first inductor 28A and the first capacitor 29A are set to cut high-frequency signals of, for example, 1 kHz or higher.

[0023] The second DC line 22B is connected to the third transmission line 24B and the ground line 23. A second inductor 28B and a second capacitor 29B are disposed on the second DC line 22B. Note that in Fig. 4 and Fig. 5, only a part of the second inductor 28B is denoted by the reference symbol 28B, and the reference symbols of the other second inductors 28B are omitted.

[0024] The second DC line 22B is connected to the second DC terminal 30B between the second inductor 28B and the second capacitor 29B. The second DC terminal 30B is a through-hole terminal provided on an end surface of the board body 10 of the circuit component 1. The second DC line 22B, the second inductor 28B, and the second capacitor 29B function as a low-pass filter that passes DC signals but cuts RF signals. The second inductor 28B and the second capacitor 29B are set to cut high-frequency signals of, for example, 1 kHz or higher.

[0025] The second to fourth conductor layers 12-14 are ground layers. The second conductor layer 12 is disposed below the first conductor layer 11. The second conductor layer 12 is laminated on the first conductor layer 11 with a first dielectric layer 15 interposed therebetween. The third conductor layer 13 is disposed below the second conductor layer 12. The third conductor layer 13 is laminated on the second conductor layer 12 with a second dielectric layer 16 interposed therebetween. The fourth conductor layer 14 is laminated on the third conductor layer 13 with a third dielectric layer 17 interposed therebetween.

[0026] A plurality of through-hole terminals 31 are provided on an end surface of the board body 10 of the circuit component 1. In the drawings, only some of the through-hole terminals 31 are labeled with the reference numeral 31, and the reference numerals of the other through-hole terminals 31 are omitted. The through-hole terminals 31 connect the above-mentioned ground line 23 and the second to fourth conductor layers 12-14.

[0027] The first dielectric layer 15 is disposed between the first conductor layer 11 and the second conductor layer 12. The first dielectric layer 15 is disposed in contact with the lower surface of the first conductor layer 11 and the upper surface of the second conductor layer 12. The second dielectric layer 16 is disposed between the second conductor layer 12 and the third conductor layer 13. The second dielectric layer 16 is disposed in contact with the lower surface of the second conductor layer 12 and the upper surface of the third conductor layer 13. The third dielectric layer 17 is disposed between the third conductor layer 13 and the fourth conductor layer 14. The third dielectric layer 17 is disposed in contact with the lower surface of the third conductor layer 13 and the upper surface of the fourth conductor layer 14.

[0028] As shown in FIG. 4, the first movable contact piece 6A and the second movable contact piece 6B are disposed on the board body 10 of the circuit component 1. The first movable contact piece 6A and the second movable contact piece 6B are disposed above the first conductor layer 11. The first movable contact piece 6A extends linearly between the first transmission line 24A and the second transmission line 25A. The second movable contact piece 6B extends linearly between the third transmission line 24B and the fourth transmission line 25B. The first movable contact piece 6A is disposed above the first RF line 21A. The width of the first movable contact piece 6A is approximately the same as the width of the first transmission line 24A and the second transmission line 25A.

[0029] The first movable contact piece 6A includes a first joint portion 32A, a first contact portion 33A, and a first intermediate portion 34A. The first joint portion 32A is a fixed end. The first joint portion 32A is joined to the first transmission line 24A. The first joint portion 32A is joined to the first transmission line 24A by a joining means such as welding or soldering. The first contact portion 33A is a free end. The first contact portion 33A is disposed facing the second transmission line 25A. The first contact portion 33A is disposed above the second transmission line 25A. The first contact portion 33A and a portion of the second transmission line 25A that can come into contact with the first contact portion 33A are an example of a switching portion. The first intermediate portion 34A is located between the first joint portion 32A and the first contact portion 33A. The first intermediate portion 34A extends substantially linearly in parallel to the first transmission line 24A and the second transmission line 25A. The first contact portion 33A has a single-break structure.

[0030] As described later, the first movable contact piece 6A is movable between a connection position and a disconnection position. When the first movable contact piece 6A is in the connection position, the first contact portion 33A contacts the second transmission line 25A. This causes the first movable contact piece 6A to connect the first transmission line 24A and the second transmission line 25A. When the first movable contact piece 6A is in the disconnection position, the first contact portion 33A separates from the second transmission line 25A. This causes the first movable contact piece 6A to disconnect the first transmission line 24A and the second transmission line 25A.

[0031] The second movable contact piece 6B is disposed above the second RF line 21B. The width of the second movable contact piece 6B is approximately the same as the width of the third transmission line 24B and the fourth transmission line 25B. The second movable contact piece 6B includes a second joint portion 32B, a second contact portion 33B, and a second intermediate portion 34B. The second joint portion 32B is joined to the third transmission line 24B by a joining means such as welding or soldering. The second contact portion 33B is disposed facing the fourth transmission line 25B. The second contact portion 33B is disposed above the fourth transmission line 25B. The second intermediate portion 34B is located between the second joint portion 32B and the second contact portion 33B. The second intermediate portion 34B extends in a substantially straight line parallel to the third transmission line 24B and the fourth transmission line 25B. The second contact portion 33B has a single break structure.

[0032] Like the first movable contact piece 6A, the second movable contact piece 6B is movable between a connection position and a disconnection position. When the second movable contact piece 6B is in the connection position, the second contact portion 33B contacts the fourth transmission line 25B. As a result, the second movable contact piece 6B connects the third transmission line 24B and the fourth transmission line 25B. When the second movable contact piece 6B is in the disconnection position, the second contact portion 33B separates from the fourth transmission line 25B. As a result, the second movable contact piece 6B disconnects the third transmission line 24B and the fourth transmission line 25B.

[0033] The shield plate 7 is disposed on the substrate body 10 of the circuit component 1. The shield plate 7 is made of a conductive material. The shield plate 7 is disposed above the first contact portion 33A and the second contact portion 33B. The shield plate 7 is connected to the ground line 23. The shield plate 7 improves the isolation characteristics between the first RF line 21A and the second RF line 21B.

[0034] Fig. 6 is a perspective view of the base assembly 4 and the stand 5 as viewed from below. Fig. 7 is a perspective view of the base assembly 4 as viewed from below. Fig. 8 is an exploded perspective view of the base assembly 4. Fig. 9 is a cross-sectional view of the electromagnetic relay 2 in an open state. As shown in Figs. 6 to 9, the base assembly 4 includes a base 40, a coil block 41, and a movable block 42.

[0035] The coil block 41 includes a coil 43, a spool 44, and an iron core 45. The coil 43 is wound around the spool 44. The iron core 45 is disposed within the coil 43. The iron core 45 includes an intermediate portion 46, a first attraction portion 47, and a second attraction portion 48. The intermediate portion 46 is disposed within the coil 43 and extends in the axial direction of the coil 43. The first attraction portion 47 protrudes from the coil 43 in the axial direction of the coil 43. The first attraction portion 47 is disposed facing downward. The second attraction portion 48 protrudes from the coil 43 in the opposite direction to the first attraction portion 47 in the axial direction of the coil 43. The second attraction portion 48 is disposed facing downward.

[0036] The movable block 42 is operated by the electromagnetic force of the coil 43, and can be switched between an ON state in which the first transmission line 24A and the second transmission line 25A are connected via the first movable contact piece 6A, and an OFF state in which the first transmission line 24A and the second transmission line 25A are disconnected. The movable block 42 is operated by the electromagnetic force of the coil 43, and can be switched between an ON state in which the third transmission line 24B and the fourth transmission line 25B are connected via the second movable contact piece 6B, and an OFF state in which the third transmission line 24B and the fourth transmission line 25B are disconnected.

[0037] The movable block 42 is operated by the electromagnetic force of the coil 43 to move the first movable contact piece 6A and the second movable contact piece 6B between the connection position and the disconnection position. Fig. 10 is a perspective view of the movable block 42. As shown in Fig. 10, the movable block 42 includes an iron piece 50, a first hinge spring 51, a second hinge spring 52, a permanent magnet 53, a card 54, and a movable insulating base 55.

[0038] The iron piece 50 is supported by a movable insulating stand 55. The iron piece 50 includes a first end 56 and a second end 57. The first end 56 protrudes from the movable insulating stand 55 in the axial direction of the coil 43. The first end 56 is disposed below the first attraction portion 47 of the iron core 45 and faces the first attraction portion 47. The second end 57 protrudes from the movable insulating stand 55 in the opposite direction to the first end 56 in the axial direction of the coil 43. The second end 57 is disposed below the second attraction portion 48 of the iron core 45 and faces the second attraction portion 48.

[0039] The first hinge spring 51 is supported by the movable insulating base 55. The first hinge spring 51 protrudes from the movable insulating base 55 toward one side of the movable insulating base 55. The second hinge spring 52 is supported by the movable insulating base 55. The second hinge spring 52 protrudes from the movable insulating base 55 toward the other side of the movable insulating base 55. The permanent magnet 53 is attached to the upper surface of the movable insulating base 55.

[0040] The card 54 is supported by the movable insulating base 55. The card 54 protrudes downward from the movable insulating base 55. The card 54 is disposed above the first movable contact piece 6A and the second movable contact piece 6B. In detail, the card 54 is disposed above the first intermediate portion 34A of the first movable contact piece 6A and the second intermediate portion 34B of the second movable contact piece 6B. The card 54 is connected to the lower surface of the first end portion 56 of the iron piece 50. The card 54 protrudes downward from the lower surface of the first end portion 56.

[0041] The movable insulating stand 55 is supported to be swingable relative to the base 40. As shown in FIG. 8, the base 40 includes support protrusions 58 and 59. As shown in FIG. 10, the movable insulating stand 55 includes support holes 60 and 61. The support protrusions 58 and 59 are disposed in the support holes 60 and 61, and support the movable insulating stand 55 to be swingable. Also, as shown in FIG. 8, the base 40 includes a first support recess 62 and a second support recess 63. The first hinge spring 51 is disposed in the first support recess 62. The first hinge spring 51 is connected to the base 40 at the first support recess 62. The second hinge spring 52 is disposed in the second support recess 63. The second hinge spring 52 is connected to the base 40 at the second support recess 63. The movable insulating stand 55 is supported to be swingable relative to the first hinge spring 51 and the second hinge spring 52 on the base 40.

[0042] The stand 5 is disposed above the board body 10 of the circuit component 1, and supports the base assembly 4. In detail, the stand 5 supports the base 40. The coil block 41 is supported by the stand 5 via the base 40. The movable block 42 is supported by the stand 5 via the base 40. The stand 5 includes a frame 70 and a plurality of legs 71-74. As shown in FIG. 6, the frame 70 has an opening 75 in the center. The movable block 42 is disposed in the opening 75 of the frame 70. The card 54 extends downward through the opening 75.

[0043] The multiple legs 71-74 protrude downward from the frame 70. The multiple legs 71-74 each include a flat bottom surface 76-79. In detail, the multiple legs 71-74 include a first leg 71, a second leg 72, a third leg 73, and a fourth leg 74. The first to fourth legs 74 are disposed at the corners of the frame 70, respectively.

[0044] 12 to 14, the second conductor layer 12 includes a first opening 121 and a second opening 122. The first opening 121 and the second opening 122 are disposed in a portion corresponding to the low-pass filter. The first opening 121 is an opening for increasing the impedance of the first DC line 22A.

[0045] The first opening 121 is opened facing the first inductor 28A. The first opening 121 has a hole shape that penetrates the second conductor layer 12 in the up-down direction. The first opening 121 is formed in a rectangular shape. The first opening 121 is disposed below the first DC line 22A. When viewed from the up-down direction, the first opening 121 overlaps with the first DC line 22A and the first inductor 28A. The first dielectric layer 15 is disposed between the first opening 121 and the first inductor 28A.

[0046] The second opening 122 is an opening for increasing the impedance of the second DC line 22B. The second opening 122 is opened facing the second inductor 28B. The second opening 122 has a hole shape that penetrates the second conductor layer 12 in the up-down direction. The second opening 122 is formed in a rectangular shape. The second opening 122 is disposed below the second DC line 22B. The second opening 122 overlaps with the second DC line 22B and the second inductor 28B when viewed from the up-down direction. The first dielectric layer 15 is disposed between the second opening 122 and the second inductor 28B.

[0047] In this embodiment, the first openings 121 are provided below each of the first inductors 28A. The second openings 122 are provided below each of the second inductors 28B.

[0048] As shown in Fig. 12, the third conductor layer 13 has the same shape as the second conductor layer 12. As shown in Figs. 12 to 14, the third conductor layer 13 includes a third opening 131 (an example of a second opening) and a fourth opening 132. The third opening 131 has the same shape as the first opening 121, and the fourth opening 132 has the same shape as the second opening 122. The third opening 131 and the fourth opening 132 are arranged in portions corresponding to the low-pass filter.

[0049] The third opening 131 is an opening for increasing the impedance of the second DC line 22B. The third opening 131 is opened facing the first inductor 28A. The third opening 131 is disposed below the first DC line 22A. The third opening 131 overlaps with the first DC line 22A and the first inductor 28A when viewed from the top-bottom direction. The third opening 131 is disposed below the first opening 121.

[0050] The fourth opening 132 is an opening for increasing the impedance of the second DC line 22B. The fourth opening 132 is opened facing the second inductor 28B. The fourth opening 132 is disposed below the second DC line 22B. When viewed from the top-bottom direction, the fourth opening 132 overlaps with the second DC line 22B and the second inductor 28B. The fourth opening 132 is disposed below the second opening 122.

[0051] Next, the operation of the electromagnetic relay 2 will be described. FIG. 9 shows the electromagnetic relay 2 in an open state. When no current flows through the coil 43, the coil 43 is not excited, and the iron piece 50 is not attracted to the iron core 45. Due to the magnetic force of the permanent magnet 53, the first end 56 of the iron piece 50 is attracted to the first attraction portion 47 of the iron core 45 and is in contact with the first attraction portion 47. Therefore, the card 54 is separated from the first movable contact piece 6A and the second movable contact piece 6B, and the first movable contact piece 6A and the second movable contact piece 6B are each located at the disconnection position. Therefore, in the first RF line 21A, the first transmission line 24A and the second transmission line 25A are disconnected from each other. Also, in the second RF line 21B, the third transmission line 24B and the fourth transmission line 25B are disconnected from each other. In addition, in the interrupting position, the first movable contact piece 6A and the second movable contact piece 6B contact the insulating layer 20 arranged on the lower surface of the shield plate .

[0052] When a current flows through the coil 43, the electromagnetic relay 2 is in a closed state as shown in FIG. 11. When the electromagnetic relay 2 is in a closed state, the second end 57 of the iron piece 50 is attracted to the second attraction portion 48 of the iron core 45 by the electromagnetic force of the coil 43 and rises. This causes the iron piece 50 to swing and the first end 56 to descend. The card 54 descends together with the first end 56 and presses the first movable contact piece 6A and the second movable contact piece 6B, thereby moving the first movable contact piece 6A and the second movable contact piece 6B to their respective contact positions. This causes the first transmission line 24A and the second transmission line 25A to be connected to each other in the first RF line 21A. Also, the third transmission line 24B and the fourth transmission line 25B to be connected to each other in the second RF line 21B.

[0053] When the current to the coil 43 is interrupted, the iron piece 50 rotates in the opposite direction due to the spring reaction force of the first movable contact piece 6A, the second movable contact piece 6B, the first hinge spring 51, and the second hinge spring 52, and the magnetic force of the permanent magnet 53, so that the second end 57 descends and separates from the second attraction portion 48, and the first end 56 rises. The card 54 rises together with the first end 56 and separates from the first movable contact piece 6A and the second movable contact piece 6B. As a result, the first movable contact piece 6A and the second movable contact piece 6B return to their respective disconnected positions due to the elastic forces of the first movable contact piece 6A and the second movable contact piece 6B. As a result, the first transmission line 24A and the second transmission line 25A are disconnected from each other in the first RF line 21A. In the second RF line 21B, the third transmission line 24B and the fourth transmission line 25B are isolated from each other.

[0054] For example, when an RF signal is input to the first input terminal 26A and the second input terminal 26B of the electromagnetic relay 2, the electromagnetic relay 2 is closed. In this case, the first transmission line 24A and the second transmission line 25A are connected to each other, and the third transmission line 24B and the fourth transmission line 25B are connected to each other. Therefore, the RF signal is output from the first input terminal 26A through the first RF line 21A to the first RF terminal 27A. Also, the RF signal is output from the second input terminal 26B through the second RF line 21B to the second RF terminal 27B. On the other hand, the RF signal is cut at the first DC line 22A and the second DC line 22B, respectively, and therefore the RF signal is prevented from being output from the first and second DC terminals 30B.

[0055] When a DC signal is input to the first input terminal 26A and the second input terminal 26B of the electromagnetic relay 2, the electromagnetic relay 2 is opened. In this case, the first transmission line 24A and the second transmission line 25A are disconnected from each other, and the third transmission line 24B and the fourth transmission line 25B are disconnected from each other. Therefore, the DC signal is output from the first input terminal 26A through the first DC line 22A without passing through the first RF line 21A, and from the first DC terminal 30A. The DC signal is output from the second input terminal 26B through the second DC line 22B without passing through the second RF line 21B, and from the second DC terminal 30B. This prevents the DC signal from flowing to the first movable contact piece 6A and the second movable contact piece 6B.

[0056] In the above-described circuit component 1, the second conductor layer 12 includes the first opening 121 for increasing the impedance of the first DC line 22A, and therefore the impedance can be increased compared to when the second conductor layer 12 does not include the first opening 121. Also, the third conductor layer 13 includes the third opening 131 for increasing the impedance of the first DC line 22A, and therefore the impedance can be increased compared to when the third conductor layer 13 does not include the third opening 131. This makes it possible to prevent a high-frequency signal from leaking to the first DC line 22A and thus causing deterioration of the high-frequency characteristics of the first transmission line 24A of the first RF line 21A. Also, a simple configuration of providing openings in the second conductor layer 12 and the third conductor layer 13 makes it possible to prevent deterioration of the high-frequency characteristics.

[0057] Similarly, the second opening 122 and the fourth opening 132 can prevent the high-frequency characteristics of the third transmission line 24B of the second RF line 21B from deteriorating.

[0058] Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications are possible without departing from the gist of the invention.

[0059] The configuration of the circuit component 1 is not limited to that of the above embodiment, and may be modified. The configuration of the transmission line of the circuit component 1 is not limited to that of the above embodiment, and may be modified. For example, the second RF line 21B and the second DC line 22B may be omitted. The configuration of the terminal of the board body 10 of the circuit component 1 is not limited to that of the above embodiment, and may be modified. For example, the second input terminal 26B, the second RF terminal 27B, and the second DC terminal 30B may be omitted. A signal may be passed in the opposite direction to that of the above embodiment. The configuration of the base assembly 4 is not limited to that of the above embodiment, and may be modified. For example, the stand 5 is not limited to being separate from the base 40, and may be integrated with it.

[0060] The first DC line 22A of the circuit component 1 may be configured to be connected to the second transmission line 25A. The second DC line 22B of the circuit component 1 may be configured to be connected to the fourth transmission line 25B.

[0061] The coil block 41 may be of a solenoid type.

[0062] The shapes of the first opening 121 and the second opening 122 may be changed. The corners of the first opening 121 and the second opening 122 may have an R-shaped or C-shaped surface. The shapes of the third opening 131 and the fourth opening 132 may be changed. The corners of the third opening 131 and the fourth opening 132 may have an R-shaped or C-shaped surface. The shapes or arrangements of the first opening 121 and the third opening 131 may be different from each other. The shapes or arrangements of the second opening 122 and the fourth opening 132 may be different from each other. The third opening 131 and the fourth opening 132 of the third conductor layer 13 may be omitted.

[0063] The first opening 121 may not be provided below each of the first inductors 28A. The second opening 122 may not be provided below each of the second inductors 28B. The first opening 121 may not overlap with the first inductor 28A when viewed from the top-bottom direction. The second opening 122 may not overlap with the second inductor 28B when viewed from the top-bottom direction. [Explanation of symbols]

[0064] 1: circuit component, 6A: first movable contact piece, 11: first conductor layer, 12: second conductor layer, 13: third conductor layer, 21A: first RF line, 22A: first DC line, 24A: first transmission line, 25A: second transmission line, 28A: first inductor, 41: coil block, 42: movable block, 43: coil, 121: first opening, 131: third opening (an example of a second opening)

Claims

1. a first conductor layer including a DC circuit for passing a DC signal; A second conductor layer disposed below the first conductor layer; a low pass filter disposed on the first conductor layer and connected to the DC circuit; Equipped with the second conductor layer is disposed in a portion corresponding to the low-pass filter and includes a first opening for increasing impedance of the DC circuit; Circuit components.

2. the low pass filter includes an inductor; The first opening faces the inductor. The circuit component according to claim 1 .

3. A switching unit is further provided, the first conductor layer further includes an RF circuit for passing an RF signal; the RF circuit includes a first transmission line and a second transmission line; the DC circuit is connected to one of the first transmission line and the second transmission line; the switching unit is switchable between an ON state in which the first transmission line and the second transmission line are connected and an OFF state in which the first transmission line and the second transmission line are disconnected. The circuit component according to claim 1 or 2.

4. A coil block including a coil; a movable block that switches between the on state and the off state via the switching unit by being operated by an electromagnetic force of the coil; Further equipped with the switching unit includes a movable contact piece that is movable between a connection position at which the first transmission line and the second transmission line are connected and a disconnection position at which the first transmission line and the second transmission line are disconnected. The circuit component according to claim 3 .

5. Further comprising a third conductor layer disposed below the second conductor layer; the third conductor layer is disposed in a portion corresponding to the low-pass filter and includes a second opening for increasing impedance of the DC circuit; The circuit component according to claim 1 .

6. the low pass filter includes an inductor; the first opening and the second opening are open facing the inductor; The circuit component according to claim 5 .

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