Substrate processing system, and method for forming and removing protective layer
The substrate processing system addresses the issue of oxide film formation on metal regions by using a chemical solution to form a protective layer and ultraviolet light to remove it, enhancing the bonding process by preventing oxidation and ensuring better contact between substrates.
JP2025047164APending Publication Date: 2025-04-03EBARA CORP
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Patent Information
- Application Number
- JP2023155496
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-09-21
- Publication Date
- 2025-04-03
AI Technical Summary
Technical Problem
The existing methods for bonding semiconductor substrates face issues due to the formation of oxide films on metal regions after polishing, leading to poor contact between bonded substrates.
Method used
A substrate processing system that includes a protective film forming device using a chemical solution to create a protective layer on the substrate surface and a protective film removal device that uses ultraviolet light to remove the protective layer.
Benefits of technology
The system effectively protects the metal regions from oxidation, ensuring better contact between bonded substrates and improving the bonding process.
✦ Generated by Eureka AI based on patent content.
Abstract
To provide a substrate processing system and a method for forming and removing a protective layer such that a metallic area of a substrate can be protected from oxidation.SOLUTION: A method for forming and removing a protective layer according to the present disclosure is a method for forming and removing the protective layer and has a step for forming the protective film on the surface of a substrate using a chemical solution, and a step for removing the protective film by irradiating the protective film with ultraviolet light.SELECTED DRAWING: Figure 1
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