Antenna module and antenna device

Abstract

To secure an isolation in each antenna element, and reduce an area occupied by an antenna module as compared with a conventional one.SOLUTION: An antenna module 70 comprises: an antenna element 1 that radiates an electric wave; an antenna substrate 2 that provides the antenna element 1; an amplifier 4 that amplifies a transmission signal that is radiated by the antenna element 1 as an electric wave; a heat transmission member 6 that receives heat generated by the amplifier 4; an antenna support substrate 3 that provides a space into which the amplifier 4 can be set, and signal wiring as wiring for transmitting the transmission signal to the antenna element 1; an amplifier substrate 5 to which the amplifier 4 is mounted, and a space where the transmission member 6 is passed and the signal wiring are provided; a phase adjustment circuit 9 that is amplified by the amplifier 4, and generates the transmission signal of a frequency of which a phase is adjusted and is determined; a phase adjustment circuit board 8 to which the phase adjustment circuit 9 is mounted, the space where the transmission member 6 is passed and the signal wiring are provided; and a shield structure 33 that electrically shields the signal wiring from an external part.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to an antenna module that constitutes an array antenna for transmitting radio waves, and an antenna device constituted by the antenna module. [Background technology]

[0002] It is desirable for antenna modules used in mobile communication devices to transmit and receive radio waves to be small yet have sufficient antenna characteristics. In order to improve the freedom of layout within a communication device while suppressing the deterioration of antenna characteristics, a configuration has been shown in which a first substrate on which a radiating element is arranged and a second substrate on which a power supply circuit is arranged are connected at their respective ends by a connecting member (see, for example, Patent Document 1).

[0003] In order to efficiently dissipate heat from a heat-generating component such as an amplifier mounted on a circuit board, a heat dissipation structure has been proposed in which a copper heat transfer part is brought into contact with the heat-generating component (see, for example, Patent Document 2).

[0004] In a high-frequency module, a configuration for improving isolation between a plurality of electronic components has been proposed (see, for example, Patent Document 3). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] WO2022 / 004080 [Patent Document 2] Patent Publication 2020-191410 [Patent Document 3] WO2022 / 130733 Summary of the Invention [Problem to be solved by the invention]

[0006] In Patent Document 1, the antenna module is composed of multiple substrates. The multiple substrates are connected at the ends, making it difficult to reduce the area required for the antenna module. When an antenna device used for wireless power transmission is composed of a combination of multiple antenna modules, it is desirable to reduce the area occupied by the antenna modules. When multiple antenna modules are arranged in close proximity, it is necessary to obtain sufficient isolation so that the multiple antenna modules do not electrically affect each other.

[0007] An object of the present invention is to reduce the area occupied by the antenna module compared to the conventional case while ensuring isolation between each antenna element. [Means for solving the problem]

[0008] The antenna module of the present invention includes an antenna element that radiates radio waves, an antenna board on which the antenna element is provided, an amplifier that amplifies a transmission signal radiated as radio waves by the antenna element, a heat transfer member connected to the surface of the amplifier opposite to the side on which the antenna board is provided and that receives heat generated by the amplifier, an antenna support board provided with a space for the amplifier to fit in, connected to the antenna board, and provided with signal wiring that is a wiring for transmitting a transmission signal to the antenna element, an amplifier board on which an amplifier is mounted on a main surface on which the antenna support board is provided, connected to the antenna support board, provided with a space through which the heat transfer member passes, and provided with the signal wiring, a phase adjustment circuit that generates a phase-adjusted transmission signal of a determined frequency that is amplified by the amplifier, a phase adjustment circuit board that is arranged on the side of the amplifier board on which the amplifier is not mounted, provided with a phase adjustment circuit on the main surface opposite to the side on which the amplifier board is provided, provided with a space through which the heat transfer member passes, and provided with the signal wiring, and a shielding structure that electrically shields the signal wiring from the outside.

[0009] Also, the present invention provides a method for manufacturing a transmission signal transmitting device comprising: an antenna substrate having an antenna element number of arrays, the antenna substrate having the antenna element number of arrays provided thereon; an amplifier having an amplifier number of arrays for amplifying a transmission signal supplied to each antenna element; an antenna support substrate having a space number of arrays for each amplifier to be accommodated therein, connected to the antenna substrate, and having signal wiring having a space number of arrays for each amplifier to pass through, the amplifier substrate having an amplifier number of arrays mounted on a main surface on the side where the antenna support substrate is present, the amplifier substrate having a space number of arrays for each heat transfer member to pass through, and having signal wiring; the phase adjustment circuit board is disposed on a side of the amplifier board on which an amplifier is not mounted, the phase adjustment circuit board being mounted on a main surface opposite to the side on which an amplifier board is mounted, the space for each heat transfer member to pass through being provided, and the signal wiring for the number of arrays being provided; and a shielding structure for the number of arrays that electrically shields the signal wiring for each of the regions of the antenna support board, the amplifier board, and the phase adjustment circuit board from the signal wiring for other regions and from the outside. Effect of the Invention

[0010] In the antenna module according to the present invention, the area occupied by the antenna module can be made smaller than that of the conventional antenna module while ensuring isolation between the antenna elements. [Brief description of the drawings]

[0011] [Figure 1] FIG. 2 is a plan view of the antenna module according to the first embodiment. [Diagram 2] FIG. 2 is a side view of the antenna module according to the first embodiment. [Diagram 3] 1 is a vertical sectional view of an antenna module according to a first embodiment. [Figure 4]1 is a horizontal cross-sectional view of an antenna module according to a first embodiment. [Diagram 5] 4 is another horizontal cross-sectional view of the antenna module according to the first embodiment. FIG. [Figure 6] 2 is a partially enlarged horizontal cross-sectional view of the antenna module according to the first embodiment. FIG. [Figure 7] 4 is a partially enlarged view of another horizontal cross-sectional view of the antenna module according to the first embodiment. FIG. [Figure 8] 1 is a plan view of an antenna device including an antenna module according to a first embodiment. [Figure 9] 11 is a vertical sectional view of the antenna module according to the second embodiment. FIG. [Figure 10] 11 is another horizontal cross-sectional view of the antenna module according to the second embodiment. FIG. [Figure 11] FIG. 11 is a plan view of an antenna module according to a third embodiment. [Figure 12] FIG. 11 is a side view of the antenna module according to the third embodiment. [Figure 13] 11 is a vertical sectional view of the antenna module according to the third embodiment. FIG. [Figure 14] 11 is a horizontal cross-sectional view of the antenna module according to the third embodiment. FIG. [Figure 15] 13 is another horizontal cross-sectional view of the antenna module according to the third embodiment. FIG. [Figure 16] FIG. 11 is a plan view of an antenna module according to a fourth embodiment. [Figure 17] FIG. 11 is a side view of the antenna module according to the fourth embodiment. [Figure 18] 13 is a vertical sectional view of the antenna module according to the fourth embodiment. FIG. [Figure 19] 13 is a horizontal cross-sectional view of the antenna module according to the fourth embodiment. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Embodiment 1 The structure of the antenna module according to the first embodiment will be described with reference to Figs. 1 to 7. Figs. 1 and 2 are a plan view and a side view of the antenna module 70 according to the first embodiment. Fig. 3 is a vertical cross-sectional view of the antenna module 70. Fig. 3 is a cross-sectional view taken along the line AA shown in Fig. 1. Figs. 4 and 5 are horizontal cross-sectional views of the antenna module 70. Fig. 4 is a cross-sectional view taken along the line BB shown in Fig. 2. Fig. 5 is a cross-sectional view taken along the line CC shown in Fig. 2. Fig. 6 is an enlarged view of range D shown in Fig. 4. Fig. 7 is an enlarged view of range E shown in Fig. 5.

[0013] The antenna module 70 mainly includes four antenna elements 1, an antenna substrate 2, an antenna support substrate 3, four amplifiers 4, an amplifier substrate 5, four heat transfer members 6, an amplifier support substrate 7, a phase adjustment circuit substrate 8, and four phase adjustment circuits 9. The antenna substrate 2, the antenna support substrate 3, the amplifier substrate 5, the amplifier support substrate 7, and the phase adjustment circuit substrate 8 are rectangular substrates of the same size (including a square). The antenna substrate 2, the antenna support substrate 3, the amplifier substrate 5, the amplifier support substrate 7, and the phase adjustment circuit substrate 8 are stacked in this order. The antenna substrate 2, the antenna support substrate 3, the amplifier substrate 5, the amplifier support substrate 7, and the phase adjustment circuit substrate 8 have rectangular external shapes and the same size. The antenna substrate 2, the amplifier substrate 5, and the phase adjustment circuit substrate 8 are approximately the same in thickness. The antenna substrate 2, the amplifier substrate 5, and the phase adjustment circuit substrate 8 are approximately three times as thick as the antenna substrate 2. The amplifier support substrate 7 is approximately twice as thick as the phase adjustment circuit substrate 8. In the substrate, the surface on which the circuit pattern is provided is called the main surface. The antenna substrate 2, antenna support substrate 3, amplifier substrate 5, amplifier support substrate 7 and phase adjustment circuit substrate 8 are each connected to an adjacent substrate in the stacking direction by soldering their main surfaces.

[0014] For convenience, the side of the antenna module 70 where the antenna substrate 2 exists is called the front side, and the side where the phase adjustment circuit substrate 8 exists is called the back side. The front side and back side are similarly defined for the antenna substrate 2, the antenna support substrate 3, the amplifier substrate 5, the amplifier support substrate 7, and the phase adjustment circuit substrate 8. The antenna support substrate 3 exists on the back side of the antenna substrate 2, and the antenna substrate 2 exists on the front side of the antenna support substrate 3. The amplifier substrate 5 exists on the back side of the antenna support substrate 3, and the antenna support substrate 3 exists on the front side of the amplifier substrate 5. The amplifier support substrate 7 exists on the back side of the amplifier substrate 5, and the amplifier support substrate 5 exists on the front side of the amplifier support substrate 7. The phase adjustment circuit substrate 8 exists on the back side of the amplifier support substrate 7, and the amplifier support substrate 7 exists on the front side of the phase adjustment circuit substrate 8. For each of the antenna substrate 2, the antenna support substrate 3, the amplifier substrate 5, the amplifier support substrate 7, and the phase adjustment circuit substrate 8, the front side is called the front surface, and the back side is called the back surface. The antenna substrate 2, antenna support substrate 3, amplifier substrate 5, amplifier support substrate 7 and phase adjustment circuit substrate 8 are called the first substrate, second substrate, third substrate, fourth substrate and fifth substrate, respectively. The side of amplifier 4 that is mounted on the substrate is called the back side, and the opposite side is called the front side. The surface of amplifier 4 facing the substrate is called the back side, and the opposite side is called the front side.

[0015] The XYZ Cartesian coordinate system used to explain the structure of the antenna module 70 is defined as follows. The XY plane is a plane parallel to the main surfaces of the antenna substrate 2, the antenna support substrate 3, the amplifier substrate 5, the amplifier support substrate 7, and the phase adjustment circuit substrate 8. The X axis is the left-right direction in FIG. 1. The Y axis is the up-down direction in FIG. 1. The Z axis is an axis perpendicular to the main surface of the antenna module 70.

[0016] The antenna module 70 is square when viewed from the Z-axis direction. The four antenna elements 1 are provided in each of four regions obtained by dividing the rectangular antenna substrate 2 in half vertically and horizontally. The antenna element 1 is disposed in the center of each region. The antenna element 1 is a circular patch antenna. By arranging a plurality of antenna modules 70 in each of the X-axis and Y-axis directions, an antenna device in which the antenna elements 1 are disposed at equal intervals can be obtained. The antenna element may be a square patch antenna or another type of antenna.

[0017] The antenna support substrate 3, the amplifier substrate 5, the amplifier support substrate 7, and the phase adjustment circuit substrate 8 can also be divided into four regions. The four amplifiers 4 are mounted in each of the four regions on the surface of the amplifier substrate 5. The back side of the amplifier substrate 5 is the side on which the amplifiers 4 are not mounted. The antenna support substrate 3 is provided with four through holes 3a for accommodating the four amplifiers 4, respectively. One through hole 3a is provided in each of the four regions of the antenna support substrate 3. The four phase adjustment circuits 9 are mounted, one in each of the four regions of the phase adjustment circuit substrate 8. The through holes 3a are spaces into which the amplifiers 4 provided in the antenna support substrate 3 are accommodated. The spaces into which the amplifiers 4 are accommodated do not have to penetrate the antenna support substrate 3.

[0018] The amplifier 4 generates heat. A necessary and sufficient gap is provided between the amplifier 4 housed in the through hole 3a and the antenna substrate 2 so that the heat generated by the amplifier 4 is not transmitted to the antenna substrate 2. The antenna support substrate 3 has a thickness that provides a necessary and sufficient gap above the amplifier 4.

[0019] The antenna module 70 is divided into four regions. The four regions have a similar structure. Each region has one antenna element 1, one amplifier 4, one heat transfer member 6, one phase adjustment circuit 9, and a fixed number of electronic components 10 and 11. The electronic component 10 is mounted on the front side of the amplifier board 5 as shown in FIG. 3. The electronic component 11 is mounted on the back side of the amplifier board 5. In the figure, one electronic component 10 and one electronic component 11 are drawn, but there may be two or more electronic components.

[0020] The antenna support substrate 3 is provided so as to provide a necessary space between the front surface of the amplifier substrate 5 and the antenna substrate 2 so that the amplifier 4 and electronic components 10 can be mounted on the front surface of the amplifier substrate 5. The amplifier support substrate 7 is provided so as to provide a necessary space between the rear surface of the amplifier substrate 5 and the phase adjustment circuit substrate 8 so that the electronic components 11 can be mounted on the rear surface of the amplifier substrate 5.

[0021] Each of the four regions of the antenna module 70 can be considered as one module. The antenna module may be configured with one antenna element 1, one amplifier 4, one heat transfer member 6, one phase adjustment circuit 9, a predetermined number of electronic components 10 and 11, an antenna substrate, an antenna support substrate, an amplifier substrate, an amplifier support substrate, and a phase adjustment circuit substrate.

[0022] The antenna element 1 radiates the supplied transmission signal into space as a radio wave. The amplifier 4 amplifies the transmission signal supplied to the antenna element 1. The phase adjustment circuit 9 generates a transmission signal of a determined frequency with the phase adjusted. A reference signal of a relatively low frequency (for example, 10 MHz) generated by a signal generator or the like is input to the phase adjustment circuit 9. The phase adjustment circuit 9 converts the signal of the reference frequency into a radio frequency such as 5.8 GHz. The phase adjustment circuit 9 can adjust the phase of the output transmission signal to a specified value. The phase adjustment circuit 9 generates a transmission signal with a phase set to a specified value from the reference signal, for example, using a method described in JP 2023-66885 A.

[0023] The phase adjustment circuit 9 makes it possible to control the phase for each antenna element 1. The antenna module 70 does not have a complicated mechanism for distributing a high-frequency transmission signal and controlling the phase of the distributed transmission signal.

[0024] The transmission signal output by the phase adjustment circuit 9 is input to the amplifier 4 via a signal wiring 12. The transmission signal amplified by the amplifier is input to the antenna element 1 via a signal wiring 13. The signal wirings 12 and 13 are wirings that transmit the transmission signal to the antenna element 1. Note that the reference numerals for the signal wiring 12 and the signal wiring 13 are not shown in the figure. For ease of understanding, signal wirings that are actually placed at other cross-sectional positions are also shown in FIG. 3.

[0025] The signal wiring 12 can be considered to be divided into signal wirings 14 to 22. The signal wiring 14 is provided on the back surface of the phase adjustment circuit board 8. One end of the signal wiring 14 is connected to the phase adjustment circuit 9. The signal wiring 15 is provided to penetrate the phase adjustment circuit board 8. The end of the signal wiring 15 on the back surface side is connected to the other end of the signal wiring 14. The signal wiring 16 is provided on the front surface of the phase adjustment circuit board 8. One end of the signal wiring 16 is connected to the end of the signal wiring 15 on the front surface side.

[0026] The signal wiring 17 is provided on the back surface of the amplifier support substrate 7. The signal wiring 18 is provided penetrating the amplifier support substrate 7. The signal wiring 17 is provided around the opening on the back surface side of the through hole in which the signal wiring 18 is provided. The signal wiring 17 is connected to the other end of the signal wiring 16 by a solder bump 23. The end on the back surface side of the signal wiring 18 is connected to the signal wiring 17. The signal wiring 19 is provided on the front surface of the amplifier support substrate 7. The signal wiring 19 is provided around the opening on the front surface side of the through hole in which the signal wiring 18 is provided. The signal wiring 19 is connected to the end on the front surface side of the signal wiring 18.

[0027] The signal wiring 20 is provided on the back surface of the amplifier substrate 5. One end of the signal wiring 20 is connected to the signal wiring 19 by a solder bump 24. The signal wiring 20 is provided so as to pass through the electronic component 11. The signal wiring 20 is also provided at a position different from the cross section until it enters the electronic component 11. The signal wiring 21 is provided so as to penetrate the amplifier substrate 5. The end of the signal wiring 21 on the back surface side is connected to the other end of the signal wiring 20. The signal wiring 22 is provided on the front surface of the amplifier substrate 5. One end of the signal wiring 22 is connected to the end of the signal wiring 21 on the front surface side. The signal wiring 22 is provided so as to pass through the electronic component 10. The other end of the signal wiring 22 is connected to the input terminal of the amplifier 4.

[0028] The signal wiring 13 can be considered to be divided into signal wirings 25 to 29. The signal wiring 25 is provided on the front surface of the amplifier substrate 5. One end of the signal wiring 25 is connected to the output terminal of the amplifier 4. The other end of the signal wiring 25 is connected to a signal wiring 26 provided on the rear surface of the antenna support substrate 3 by a solder bump 31.

[0029] The signal wiring 27 is provided so as to penetrate the antenna support board 3. The signal wiring 26 is provided around the opening on the back side of the through-hole in which the signal wiring 27 is provided. The end on the back side of the signal wiring 27 is connected to the signal wiring 26. The signal wiring 28 is provided on the front side of the antenna support board 3. The signal wiring 28 is provided around the opening on the front side of the through-hole in which the signal wiring 27 is provided. The signal wiring 28 is connected to the end on the front side of the signal wiring 27.

[0030] The signal wiring 29 is provided on the back surface of the antenna substrate 2. The signal wiring 30 is provided penetrating the antenna substrate 2. The signal wiring 29 is provided around the opening on the back surface side of the through hole in which the signal wiring 30 is provided. The signal wiring 29 is connected to the signal wiring 28 by a solder bump 32. The end on the front surface side of the signal wiring 30 is connected to the antenna element 1.

[0031] A shielding structure 33 (reference numerals not shown) is provided to shield (isolate) the amplifiers 4 and signal wirings 12, 13 provided in each region from the amplifiers 4 and signal wirings 12, 13 in other regions and from the outside of the antenna module 70. The shielding structure 33 is provided to prevent electrical interference with the phase control circuit 9, amplifier 5, etc. due to radio waves radiated into space or generated within the antenna device. Since the antenna module 70 has the shielding structure 33, four sets of antenna elements 1, amplifiers 4, phase adjustment circuits 9, and signal wirings 12, 13 can be arranged on the respective substrates.

[0032] The shielding structure 33 has through-hole conductors provided on the periphery of each of the antenna support substrate 3, amplifier substrate 5, amplifier support substrate 7, and phase adjustment circuit substrate 8. The through-hole conductors provided on each substrate are provided at the same interval d and with the same radius, with a single straight line perpendicular to each substrate as a common central axis. The periphery of a region is a range of a predetermined distance from each side of the rectangular region. Figures 4 and 6 show the arrangement of the through-hole conductors provided on the phase adjustment circuit substrate 8. In Figures 4 and 6, the phase adjustment circuit substrate 8 is not hatched to make the drawings easier to see.

[0033] As the shielding structure 33, the antenna support substrate 3 is provided with through holes 34, through hole conductors 35, front surface lands 36, and back surface lands 37. Two rows of through holes 34 are provided at an interval d on the periphery of the antenna support substrate 3. The interval between the through holes 34 in different rows is also d, and three adjacent through holes 34 are arranged at the vertices of an equilateral triangle. At each corner of each region, the through hole 34 at the corner position in the inner row is arranged at the intersection of the perpendicular bisector of the line segment connecting the centers of the two through holes 34, including the corner, on two sides that intersect at right angles at the corner in the outer row of the through holes 34. The through holes are similarly arranged in the amplifier substrate 5, the amplifier support substrate 7, and the phase adjustment circuit substrate 8.

[0034] The through-hole conductor 35 is a conductor provided inside the through-hole 34. The front surface land 36 is a conductor provided around the through-hole 34 on the front surface of the antenna support substrate 3. The front surface land 36 is connected to the through-hole conductor 35. The back surface land 37 is a conductor provided around the through-hole 34 on the back surface of the antenna support substrate 3. The back surface land 37 is connected to the through-hole conductor 35.

[0035] A plurality of through-hole conductors 35 are provided on the inner surfaces of through-holes 34 provided at intervals shorter than half the wavelength of the radio wave on the periphery of each region of the antenna support board 3. The front surface lands 36 and the back surface lands 37 are main surface conductors provided so as to connect to the through-hole conductors 35 on each of the main surfaces on both sides of the antenna support board 3. The front surface lands 36 are provided separately for each of the through-hole conductors 35. The back surface lands 37 are provided separately for each of the through-hole conductors 35.

[0036] As the shielding structure 33, the amplifier board 5 is provided with through holes 38, through hole conductors 39, front surface lands 40, and back surface lands 41. Two rows of through holes 38 are provided at a distance d on the periphery of the amplifier board 5. The distance between the through holes 38 in different rows is also d, and three adjacent through holes 38 are arranged at the vertices of an equilateral triangle. The through hole conductors 39 are conductors provided inside the through holes 38. The front surface lands 40 are conductors provided around the through holes 38 on the front surface of the amplifier board 5. The front surface lands 40 are connected to the through hole conductors 39. The back surface lands 41 are conductors provided around the through holes 38 on the back surface of the amplifier board 5. The back surface lands 41 are connected to the through hole conductors 39.

[0037] A plurality of through-hole conductors 39 are provided on the inner surfaces of through-holes 38 provided at intervals shorter than half the wavelength of the radio wave on the periphery of each region of the amplifier substrate 5. The front surface lands 40 and the back surface lands 41 are main surface conductors provided so as to connect to the through-hole conductors 39 on each of the main surfaces on both sides of the amplifier substrate 5. The front surface lands 40 are provided separately for each of the through-hole conductors 39. The back surface lands 41 are provided separately for each of the through-hole conductors 39.

[0038] As the shielding structure 33, the amplifier support substrate 7 is provided with through holes 42, through hole conductors 43, front surface lands 44, and back surface lands 45. Two rows of through holes 42 are provided at a distance d on the periphery of the amplifier support substrate 7. The distance between the through holes 42 in different rows is also d, and three adjacent through holes 42 are arranged at the vertices of an equilateral triangle. The through hole conductors 43 are conductors provided inside the through holes 42. The front surface lands 44 are conductors provided around the through holes 42 on the front surface of the amplifier support substrate 7. The front surface lands 44 are connected to the through hole conductors 43. The back surface lands 45 are conductors provided around the through holes 42 on the back surface of the amplifier support substrate 7. The back surface lands 45 are connected to the through hole conductors 43.

[0039] A plurality of through-hole conductors 43 are provided on the inner surfaces of through-holes 42 provided at intervals shorter than half the wavelength of the radio wave on the periphery of each region of the amplifier support substrate 7. The front surface lands 44 and the back surface lands 45 are main surface conductors provided so as to connect to the through-hole conductors 43 on each of the main surfaces on both sides of the amplifier support substrate 7. The front surface lands 44 are provided separately for each of the through-hole conductors 43. The back surface lands 45 are provided separately for each of the through-hole conductors 43.

[0040] As the shielding structure 33, the phase adjustment circuit board 8 is provided with through holes 46, through hole conductors 47, surface lands 48, and a ground conductor 49. Two rows of through holes 46 are provided at a distance d on the periphery of the phase adjustment circuit board 8. The distance between the through holes 46 in different rows is also d, and three adjacent through holes 46 are arranged at the vertices of an equilateral triangle. The through hole conductors 47 are conductors provided inside the through holes 46. The surface lands 48 are conductors provided around the through holes 46 on the surface of the phase adjustment circuit board 8. The surface lands 48 are connected to the through hole conductors 47. The ground conductors 49 are conductors provided in a range including the periphery of the back surface of the phase adjustment circuit board 8. The ground conductors 49 are grounded. The ground conductors 49 are connected to all the through hole conductors 47.

[0041] A plurality of through-hole conductors 47 are provided on the inner surfaces of through-holes 46 provided at intervals shorter than half the wavelength of the radio wave on the periphery of each region of the phase adjustment circuit board 8. The surface lands 48 are main surface conductors provided so as to connect to the through-hole conductors 47 on the main surface of the phase adjustment circuit board 8 on the side where the amplifier board 5 is present. The surface lands 48 are provided separately for each of the through-hole conductors 47.

[0042] The spacing d of the through-hole conductors is set to be less than half the wavelength λ of the radio wave radiated by the antenna element 1. In other words, the following formula (1) holds between the spacing d and the wavelength λ. d<(1 / 2)*λ (1)

[0043] The space between adjacent through-hole conductors can be considered as a single waveguide. Since radio waves with a wavelength longer than half the length of the longer side of a waveguide with a rectangular cross section cannot pass through the waveguide, the spacing d between through-hole conductors is determined by formula (1).

[0044] The wavelength λ is 52 mm when the frequency is 5.8 GHz. The thickness of the board is at most a few mm, which is less than half the wavelength of the radio wave. Therefore, if the spacing d between the through-hole conductors satisfies equation (1), the length of the longer side of the waveguide between the through-hole conductors will be less than half the wavelength of the radio wave.

[0045] A main surface conductor 50 is provided in each region on the back surface of the antenna substrate 2. The main surface conductor 50 is provided in each region except around the signal wiring 29. The main surface conductor 50 is connected to each front surface land 36 provided on the front surface of the antenna support substrate 3 by solder bumps 51. One solder bump 51 connects one front surface land 36 to the main surface conductor 50. The main surface conductor 50 is provided with a determined width on the periphery of each region on the main surface of the antenna substrate 2 on the side where the antenna support substrate 3 is present.

[0046] Each back surface land 37 on the back surface of the antenna support substrate 3 is connected to each front surface land 40 provided on the front surface of the amplifier substrate 5 by a solder bump 52. One solder bump 52 connects one back surface land 37 to one front surface land 40.

[0047] Each back surface land 41 on the back surface of the amplifier substrate 5 is connected to each front surface land 44 provided on the front surface of the amplifier support substrate 7 by a solder bump 53. One solder bump 53 connects one back surface land 41 to one front surface land 44.

[0048] Each back surface land 45 on the back surface of the amplifier support substrate 7 is connected to each front surface land 48 provided on the front surface of the phase adjustment circuit substrate 8 by a solder bump 54. One solder bump 54 connects one back surface land 45 to one front surface land 48.

[0049] The main surface conductor 50 is connected to the ground conductor 49 via the through-hole conductors, front surface lands, back surface lands, and solder bumps provided on each board, and is therefore at ground potential. The through-hole conductors, front surface lands, back surface lands, and solder bumps that constitute the shielding structure 33 provided on each board are also at ground potential.

[0050] The solder bumps 51 to 54 are provided at intervals so that radio waves do not pass between the antenna substrate 2, the antenna support substrate 3, the amplifier substrate 5, the amplifier support substrate 7, and the phase adjustment circuit substrate 8. The solder bumps 51 to 54 are provided with the same thickness, the same diameter, and the same intervals. The solder bumps 51 to 54 are provided in correspondence with the positions where the through-hole conductors 35, 39, 43, and 47 are provided.

[0051] The arrangement of the solder bumps 54 is shown in Figures 5 and 7. Since there are two rows of through holes, the solder bumps 54 are also arranged in two rows. The solder bumps 54 are provided at an interval of d2. The interval between the solder bumps 54 in different rows is also d2, and three adjacent solder bumps 54 are arranged at the vertices of an equilateral triangle. At each corner of each region, the solder bump 54 at the corner position in the inner row is arranged at the intersection of the perpendicular bisector of the line segment connecting the centers of the two solder bumps 54, including the corner, on two sides that intersect at right angles at the corner in the solder bumps 54 in the outer row. Solder bumps 51 to 53 are arranged in the same manner as the solder bumps 54.

[0052] The distance d2 between the solder bumps 51 to 54 is set to be less than half the wavelength λ of the radio wave. That is, between the distance d2 and the wavelength λ, the following formula (2) is established. d2<(1 / 2)*λ (2)

[0053] The space between adjacent solder bumps can be considered as a single waveguide. After soldering, the diameter of a solder bump is greater than its thickness. The longer side of the waveguide between adjacent solder bumps is the side on the main surface side of the board. Since radio waves with a wavelength longer than half the longer side of a waveguide with a rectangular cross section cannot pass through the waveguide, the spacing between solder bumps is determined by formula (2).

[0054] The solder bumps 51 are solder joints provided at intervals shorter than half the wavelength of the radio wave to join the main surface conductor 50 provided on the main surface of the antenna substrate 2 on the side where the antenna support substrate 3 exists and the front surface land 36 provided on the main surface of the antenna support substrate 3 on the side where the antenna substrate 2 exists. The solder bumps 52 are solder joints provided at intervals shorter than half the wavelength of the radio wave to join the back surface land 37 provided on the main surface of the antenna support substrate 3 on the side where the amplifier substrate 5 exists and the front surface land 40 provided on the main surface of the amplifier substrate 5 on the side where the antenna support substrate 3 exists. The solder bumps 53 are solder joints provided at intervals shorter than half the wavelength of the radio wave to join the back surface land 41 provided on the main surface of the amplifier substrate 5 on the side where the amplifier support substrate 7 exists and the front surface land 44 provided on the main surface of the amplifier support substrate 7 on the side where the amplifier substrate 5 exists. The solder bumps 54 are solder joints provided at intervals shorter than half the wavelength of the radio waves to join a back surface land 45 provided on the main surface of the amplifier support substrate 7 on the side where the phase adjustment circuit substrate 8 exists and a front surface land 48 provided on the main surface of the phase adjustment circuit substrate 8 on the side where the amplifier support substrate 7 exists.

[0055] The solder bumps 51 to 54 are solder joints that join the main surface conductor 50 provided on the back surface of the antenna substrate 2, the front surface land 36 provided on the front surface of the antenna support substrate 3, the back surface land 37 provided on the back surface of the antenna support substrate 3, the front surface land 40 provided on the front surface of the amplifier substrate 5, the back surface land 41 provided on the back surface of the amplifier substrate 5, the front surface land 44 provided on the front surface of the amplifier support substrate 7, the back surface land 45 provided on the back surface of the amplifier support substrate 7, and the front surface land 48 provided on the front surface of the phase adjustment circuit substrate 8 to corresponding main surface conductors provided on the opposing main surfaces.

[0056] In the shielding structure 33, the through-hole conductors 35, 39, 43, 47 and the solder bumps 51 to 54 are provided at intervals shorter than (1 / 2)*λ. Therefore, the transmission signals passing through the signal wirings 12, 13 do not affect the signal wirings 12, 13 in other regions. In addition, the signal wirings 12, 13 in each region are shielded from the outside of the antenna module 70 by the shielding structure 33.

[0057] The shielding structure 33 can prevent electrical interference from occurring in the phase control circuit 6 and the amplifier 4 due to radio waves radiated into space by the antenna elements 1 in other regions and radio waves generated inside the antenna module 70. The solder bumps 51-54 shield and electrically isolate each region of the antenna module 70, and also connect the boards together. The size, shape and arrangement of the solder bumps 51-54 are determined so as to obtain the required shielding performance and rigidity, while also taking into consideration ease of manufacture. Since the boards are connected by the solder bumps 51-54, there is no need for components that are used only for connecting the boards.

[0058] In the amplifier board 5, a through hole 5a is provided in a portion corresponding to the back side of the amplifier 4. The back side of the amplifier 4 is the surface opposite to the side on which the antenna board 1 is present. One through hole 5a is provided in each of the four regions of the amplifier board 5. A through hole 7a is provided in the amplifier support board 7 at a position corresponding to the through hole 5a. One through hole 7a is provided in each of the four regions of the amplifier support board 7. A through hole 8a is provided in the phase adjustment circuit board 8 at a position corresponding to the through hole 7a. One through hole 8a is provided in each of the four regions of the phase adjustment circuit board 8. One heat transfer member 6 passes through one set of the through holes 5a, 7a, and 8a that communicate with each other. The heat transfer member 6 is connected to the back side of the amplifier 4. The heat transfer member 6 receives heat generated in the amplifier 4 and transfers it to a heat dissipation unit 55 (not shown) provided outside the antenna module 70. Heat dissipation portion 55 dissipates to the outside air heat generated in amplifier 4. Through holes 5a, 7a and 8a are spaces through which heat transfer member 6 passes.

[0059] A step portion 3b that makes the thickness of the antenna support substrate 3 thinner than other portions is provided on the rear side of the antenna support substrate 3 at a position corresponding to the electronic component 10 mounted on the front surface of the amplifier substrate 5. By providing the step portion 3b, a space is created between the front surface of the amplifier substrate 5 and the rear surface of the antenna support substrate 3. The space created by providing the step portion 3b communicates with the through hole 3a.

[0060] A conductor at ground potential is provided on the surface of antenna support substrate 3 facing through hole 3a and step portion 3b. Amplifier substrate 5, amplifier support substrate 7 and phase adjustment circuit substrate 8 also have conductors at ground potential provided on their portions facing through holes 5a, 7a and 8a, respectively.

[0061] The electronic components 11 mounted on the back surface of the amplifier board 5 are provided so as to enter the through holes 7a provided in the amplifier support board 7. The through holes 7a are provided so that the heat transfer member 6 can pass through and accommodate the electronic components 11. A step may also be provided on the front side of the amplifier support board 7, and the electronic components may be accommodated in the space created by the step. When no electronic components are mounted on the back surface of the amplifier board 5, the antenna module may not have an amplifier support board. In an antenna module that does not have an amplifier support board, the phase adjustment circuit board is connected to the amplifier board. A back land provided on the main surface of the amplifier board on the side where the phase adjustment circuit board is present and a back land provided on the main surface of the phase adjustment circuit board on the side where the amplifier board is present are joined by solder bumps. The solder bumps are solder joints provided at intervals shorter than half the wavelength of the radio wave.

[0062] In the antenna module 70, the antenna element 1 is provided on the antenna board 2, the amplifier 4 is mounted on the front side of the amplifier board 5, and the phase adjustment circuit 9 is mounted on the back side of the phase adjustment circuit board 8. The back side of the phase adjustment circuit board 8 is opposite to the side on which the amplifier board 5 is present. Between the antenna board 2 and the amplifier board 5, an antenna support board 3 having a space for accommodating the amplifier 4 and the electronic component 10 is provided. Between the amplifier board 5 and the phase adjustment circuit board 8, an amplifier support board 7 having a space for accommodating the electronic component 11 is provided. The antenna board 2, the antenna support board 3, the amplifier board 5, the amplifier support board 7, and the phase adjustment circuit board 8 are formed into rectangles of the same size and stacked in this order. In the antenna module 70, since multiple boards are stacked, each board can be made small. In the antenna module 70, the area of ​​the antenna module 70 can also be made small when viewed from a direction perpendicular to the main surface of each board.

[0063] Since the antenna module 70 has the shielding structure 33 in each region for each antenna element 1, it is possible to obtain the necessary isolation between the outside and other regions of the antenna module 70. The antenna module 70 can ensure the isolation for each antenna element 1 while making the area occupied by the antenna module 70 smaller than that of the conventional antenna module.

[0064] Since the amplifier 4 is mounted on the side (front side) of the amplifier board 5 where the antenna element 1 is present, it is possible to shorten the signal wiring 13 connecting the amplifier 4 and the antenna element 1. It is also possible to reduce the distance between the amplifier 4 and the antenna element 1. Since the signal wiring 13 connecting the amplifier 4 and the antenna element 1 is short, it is possible to reduce loss when transmitting the amplified transmission signal.

[0065] Since the amplifier 4 is disposed inside the antenna module 70, heat generated by the amplifier 4 is transferred to a heat dissipation section 55 provided outside by the heat transfer member 6, and dissipated from the heat dissipation section 55. The heat transfer member 6 is made of copper, which is a material with high thermal conductivity. Outside air is blown onto the heat dissipation section 55 by a fan or the like to increase the heat dissipation efficiency.

[0066] In the antenna module 70, only the antenna element 1 is provided on the antenna substrate 2. Therefore, by arranging the antenna modules 70 side by side on the same plane, an antenna device of the required size can be configured. FIG. 8 shows a plan view of an antenna device 100 configured by arranging nine antenna modules 70 in three vertical rows and three horizontal rows. The antenna device 100 is configured by arranging a plurality of antenna modules so that the plurality of antenna elements 1 are present on the same plane and are arranged at a predetermined interval. By using the antenna module 70, the size of the antenna device can be changed, and the aperture diameter and output can be set arbitrarily.

[0067] The antenna module 70 is square in plan view. The antenna module 70 has four antenna elements 1, with a vertical and horizontal dimension of 2×2. The antenna module may have two antenna elements, with a vertical and horizontal dimension of 1×2, three antenna elements, with a horizontal dimension of 1×3, four antenna elements, with a vertical and horizontal dimension of 1×4, six antenna elements, with a vertical and vertical dimension of 2×3, eight antenna elements, with a vertical and vertical dimension of 2×4, or nine antenna elements, with a vertical and vertical dimension of 3×3, or the like. An antenna module may have one antenna element.

[0068] The antenna substrate may have a set of an antenna element, an amplifier, a heat transfer member, a phase adjustment circuit, a signal wiring, and a shielding structure, the number of which is an integer equal to or greater than 2. The antenna substrate is provided with one antenna element in each region divided into the number of arrays. The antenna support substrate is provided with a signal wiring and a space for one amplifier in each region divided into the number of arrays. The amplifier substrate is provided with one amplifier mounted in each region divided into the number of arrays, and a space for the signal wiring and one heat transfer member to pass through. The amplifier support substrate is provided with a space for the signal wiring and one heat transfer member to pass through in each region divided into the number of arrays. The phase adjustment circuit substrate is provided with one phase adjustment circuit mounted in each region divided into the number of arrays, and a space for the signal wiring and one heat transfer member to pass through. The shielding structure is provided on the periphery of each region divided into the number of arrays in the antenna support substrate, the amplifier substrate, the amplifier support substrate, and the phase adjustment circuit substrate.

[0069] Even if there is no amplifier support substrate, each substrate may have a similar configuration in each region divided according to the number of arrays.

[0070] The antenna module does not have to be rectangular when viewed in the Z-axis direction. It only needs to have a shape that allows it to be arranged on a flat surface with few gaps. The antenna modules only need to have a shape that allows them to be arranged side by side to form an antenna device and have a set number of antenna elements. The above also applies to the other embodiments.

[0071] Embodiment 2 In the second embodiment, the multiple solder bumps are replaced with a continuous solder joint area to improve the shielding effect. An antenna module 70C according to the second embodiment will be described with reference to Figs. 9 and 10. Fig. 9 is a vertical cross-sectional view of the antenna module 70C. Fig. 9 is a vertical cross-sectional view taken at a position similar to the AA cross-section shown in Fig. 1. Fig. 10 is a horizontal cross-sectional view of the antenna module 70C. Fig. 10 is a vertical cross-sectional view taken at a position similar to the CC cross-section shown in Fig. 2.

[0072] The antenna module 70C has a modified shielding structure 33C (reference numerals not shown). The shielding structure 33C has main surface conductors 56-62 instead of the front surface lands 36, 40, 44, 48 and the back surface lands 37, 41, 45. The main surface conductor 56 is a single conductor provided on the periphery of the front surface of each region of the antenna support substrate 3C. The main surface conductor 56 connects to each through hole conductor 35 provided in each region of the antenna support substrate 3C. The main surface conductor 57 is a single conductor provided on the periphery of the back surface of each region of the antenna support substrate 3C. The main surface conductor 57 connects to each through hole conductor 35 provided in each region of the antenna support substrate 3C. The main surface conductor 58 is a single conductor provided on the periphery of the front surface of each region of the amplifier substrate 5C. The main surface conductor 58 connects to each through hole conductor 39 provided in each region of the amplifier substrate 5C. The main surface conductor 59 is a single conductor provided on the periphery of the rear surface of each region of the amplifier substrate 5C. The main surface conductor 59 is connected to each through-hole conductor 39 provided in each region of the amplifier substrate 5C. The main surface conductor 60 is a single conductor provided on the periphery of the front surface of each region of the amplifier support substrate 7C. The main surface conductor 60 is connected to each through-hole conductor 43 provided in each region of the amplifier support substrate 7C. The main surface conductor 61 is a single conductor provided on the periphery of the rear surface of each region of the amplifier support substrate 7C. The main surface conductor 61 is connected to each through-hole conductor 43 provided in each region of the amplifier support substrate 7C. The main surface conductor 62 is a single conductor provided on the periphery of the front surface of each region of the phase adjustment circuit substrate 8C. The main surface conductor 62 is connected to each through-hole conductor 47 provided in each region of the phase adjustment circuit substrate 8C. The main surface conductors 56 to 62 are provided to have at least a determined width.

[0073] The shielding structure 33C has solder joint regions 63-66 instead of the solder bumps 51-54. The solder joint region 63 joins the main surface conductor 50 and the main surface conductor 56 between the antenna substrate 2 and the antenna support substrate 3C. The solder joint region 64 joins the main surface conductor 57 and the main surface conductor 58 between the antenna support substrate 3C and the amplifier substrate 5C. The solder joint region 64 joins the main surface conductor 59 and the main surface conductor 60 between the amplifier substrate 5C and the amplifier support substrate 7C. The solder joint region 65 joins the main surface conductor 61 and the main surface conductor 62 between the amplifier support substrate 7C and the phase adjustment circuit substrate 8C. As shown in FIG. 10, the solder joint regions 63-66 are provided without interruption so as to have a determined width on the periphery of each region of the substrate. The solder joint regions 63-66 are annular with a substantially rectangular outer shape when viewed from the Z-axis direction. Each of the solder joint regions 63 to 66 is a solder joint provided in an annular shape with a determined width. Each of the solder joint regions 63 to 66 can also be considered as a plurality of solders provided with zero spacing between them.

[0074] The widths and materials of the main surface conductors 56-62 and the solder bonding regions 63-66 are optimized taking into consideration weight, ease of manufacture, the required degree of electrical isolation, and cost.

[0075] The antenna module 70C can occupy a smaller area than before while ensuring isolation between the antenna elements 1. The antenna module 70C has more reliable isolation than the antenna module 70. In addition, it is no longer necessary to align the solder bumps with the front and back lands, making the antenna module 70C easier to manufacture than the antenna module 70.

[0076] Embodiment 3 The third embodiment is a modification of the second embodiment so as to have one set of antenna element, amplifier, phase adjustment circuit, heat transfer member, and signal wiring. An antenna module 70D according to the third embodiment will be described with reference to Figs. 11 to 15. Figs. 11 and 12 are a plan view and a side view of the antenna module 70D according to the third embodiment. Fig. 13 is a vertical cross-sectional view of the antenna module 70D. Fig. 13 is a cross-sectional view at the FF cross-section shown in Fig. 11. Figs. 14 and 15 are horizontal cross-sectional views of the antenna module 70D. Fig. 14 is a cross-sectional view at the GG cross-section shown in Fig. 12. Fig. 15 is a cross-sectional view at the HH cross-section shown in Fig. 12.

[0077] The antenna module 70D mainly includes one antenna element 1, an antenna substrate 2D, an antenna support substrate 3D, one amplifier 4, an amplifier substrate 5D, one heat transfer member 6, an amplifier support substrate 7D, a phase adjustment circuit substrate 8D, and one phase adjustment circuit 9. The antenna substrate 2D, the antenna support substrate 3D, the amplifier substrate 5D, the amplifier support substrate 7D, and the phase adjustment circuit substrate 8D are rectangular substrates of the same size. The antenna substrate 2D, the antenna support substrate 3D, the amplifier substrate 5D, the amplifier support substrate 7D, and the phase adjustment circuit substrate 8D are stacked in this order.

[0078] The antenna module 70D is similar to one of the four regions of the antenna module 70. The antenna module 70D has electronic components 10 and 11, signal wiring 12 and 13, and a shielding structure 33C. The shielding structure 33C has through-hole conductors and main surface conductors in each substrate. The substrates are joined by solder joint regions.

[0079] The antenna module 70D operates in the same manner as the antenna module 70, and provides the same effects. The antenna module 70D has the antenna element 1 and the shielding structure 33C, and therefore provides the necessary isolation between the antenna module 70D and the outside. The antenna module 70D can ensure isolation for each antenna element 1, while making the area occupied by the antenna module 70D smaller than that of the conventional antenna module.

[0080] Embodiment 4 In the fourth embodiment, the third embodiment is modified so that the shielding structure is not a through-hole conductor but includes a shielding box that houses an antenna support board, an amplifier board, an amplifier support board, and a phase adjustment circuit support board. An antenna module 70E according to the fourth embodiment will be described with reference to Figs. 16 to 19. Figs. 16 and 17 are a plan view and a side view of the antenna module 70E according to the fourth embodiment. Fig. 18 is a vertical cross-sectional view of the antenna module 70E. Fig. 18 is a cross-sectional view at the JJ cross-section shown in Fig. 16. Fig. 19 is a horizontal cross-sectional view of the antenna module 70E. Fig. 19 is a cross-sectional view at the KK cross-section shown in Fig. 17. The KK cross-section is a cross-section passing through the phase adjustment circuit board 8E.

[0081] The antenna module 70E mainly includes one antenna element 1, an antenna substrate 2D, an antenna support substrate 3E, one amplifier 4, an amplifier substrate 5E, one heat transfer member 6, an amplifier support substrate 7E, a phase adjustment circuit substrate 8E, and one phase adjustment circuit 9. The antenna substrate 2D, the antenna support substrate 3E, the amplifier substrate 5E, the amplifier support substrate 7E, and the phase adjustment circuit substrate 8E are rectangular substrates of the same size. The antenna substrate 2D, the antenna support substrate 3E, the amplifier substrate 5E, the amplifier support substrate 7E, and the phase adjustment circuit substrate 8E are stacked in this order.

[0082] In the antenna module 70E, the shielding structure 33C is changed to a shielding structure 33E, as compared with the antenna module 70D. The shielding structure 33E does not have a through-hole conductor, but has a shielding box 67. As shown in FIG. 19, the phase adjustment circuit board 8E does not have a through-hole and a through-hole conductor. The antenna support board 3E, the amplifier board 5E, and the amplifier support board 7E also do not have a through-hole and a through-hole conductor.

[0083] The shielding box 67 is a square tube having sides and a bottom. The sides of the shielding box 67 are parallel to the Z axis, and the bottom is parallel to the XY plane. The shielding box 67 is made of a metal having electrical conductivity. The shielding box 67 is large enough to accommodate the antenna board 2D, the antenna support board 3E, the amplifier board 5E, the amplifier support board 7E, and the phase adjustment circuit board 8E. The shielding box 67 has a height such that its upper end partially overlaps the antenna board 2D. The bottom of the shielding box 67 has a large rectangular opening in its center. The bottom of the shielding box 67 has only a peripheral portion. The bottom of the shielding box 67 is joined to the ground conductor 49 on the back side of the phase adjustment circuit board 8E by a solder joint area 68.

[0084] The phase adjustment circuit 9 attached to the back surface of the phase adjustment circuit board 8E passes through an opening in the bottom surface of the shielding box 67. The heat dissipation section 55 connected to the heat transfer member 6 is also provided so as to pass through the opening in the bottom surface of the shielding box 67. The shielding box 67 is a conductive metal cylinder that houses the antenna support board 3E, the amplifier board 5E, the amplifier support board 7E, and the phase adjustment circuit board 8E. When the antenna module does not have an amplifier support board, the shielding box houses the antenna support board, the amplifier board, and the phase adjustment circuit board.

[0085] The antenna module 70E operates in the same manner as the antenna module 70D, and provides the same effects. The antenna module 70E has a shielding structure 33E having a shielding box 67, and therefore can provide more reliable isolation. The antenna module 70E can ensure isolation for each antenna element 1 while reducing the area occupied by the antenna module 70E compared to the conventional case.

[0086] Although the preferred embodiments have been described in detail above, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the claims.

[0087] Various aspects of the present disclosure are summarized below as appendices.

[0088] (Appendix 1) An antenna element that radiates radio waves; an antenna substrate on which the antenna element is provided; an amplifier that amplifies a transmission signal radiated as the radio wave by the antenna element; a heat transfer member connected to a surface of the amplifier opposite to a surface on which the antenna substrate is disposed, and receiving heat generated by the amplifier; an antenna support substrate provided with a space for accommodating the amplifier, connected to the antenna substrate, and having a signal wiring that is a wiring for transmitting the transmission signal to the antenna element; an amplifier board on which the amplifier is mounted on a main surface on the side where the antenna support substrate is present, the amplifier board is connected to the antenna support substrate, a space is provided through which the heat transfer member passes, and the signal wiring is provided; a phase adjustment circuit for generating the transmission signal having a phase adjusted and a determined frequency, the transmission signal being amplified by the amplifier; a phase adjustment circuit board that is disposed on a side of the amplifier board on which the amplifier is not mounted, the phase adjustment circuit being mounted on a main surface opposite to the side on which the amplifier board is mounted, a space through which the heat transfer member passes being provided, and the signal wiring being provided; and a shielding structure for electrically shielding the signal wiring from the outside. (Appendix 2) the phase adjustment circuit board is connected to the amplifier board; The shielding structure comprises: a plurality of through-hole conductors provided on the inner surface of through-holes provided at intervals shorter than half the wavelength of the radio wave on the periphery of each of the antenna support substrate, the amplifier substrate, and the phase adjustment circuit substrate; a main surface conductor provided so as to be connected to each of the through-hole conductors on each of the main surfaces on both sides of the antenna support substrate, the main surfaces on both sides of the amplifier substrate, and the main surface of the phase adjustment circuit substrate on the side where the amplifier substrate is present, or provided with a predetermined width on the periphery of the main surface of the antenna substrate on the side where the antenna support substrate is present; solder joints which join the main surface conductor provided on the main surface of the antenna board on the side where the antenna support board is present to the main surface conductor provided on the main surface of the antenna support board on the side where the antenna board is present, join the main surface conductor provided on the main surface of the antenna support board on the side where the amplifier board is present to the main surface conductor provided on the main surface of the amplifier board on the side where the antenna support board is present, and join the main surface conductor provided on the main surface of the amplifier board on the side where the phase adjustment circuit board is present to the main surface of the phase adjustment circuit board on the side where the amplifier board is present, and are provided at intervals shorter than half the wavelength of the radio wave; and a grounded ground conductor provided on a main surface of the phase adjustment circuit board opposite to a side on which the amplifier board is present, to which the plurality of through-hole conductors provided in the phase adjustment circuit board are connected. (Appendix 3) The antenna module described in Appendix 2, wherein the shielding structure includes a plurality of main surface conductors provided separately for each of the through-hole conductors on each of opposite main surfaces of the antenna support substrate, on each of opposite main surfaces of the amplifier substrate, and on the main surface of the phase adjustment circuit substrate on the side where the amplifier substrate is present, and a plurality of the solder joints that join each of the main surface conductors to a corresponding main surface conductor on the opposing main surface. (Appendix 4) 3. The antenna module described in Appendix 2, wherein the shielding structure includes one main surface conductor connected to each of the through-hole conductors and the solder joints provided in a ring shape with a determined width on each of the main surfaces of the antenna support substrate, the main surfaces of the amplifier substrate, and the main surface of the phase adjustment circuit substrate on which the amplifier substrate is located. (Appendix 5) 2. The antenna module described in claim 1, wherein the shielding structure has a conductive metal cylinder that houses the antenna support board, the amplifier board, and the phase adjustment circuit board. (Appendix 6) 2. The antenna module according to claim 1, further comprising an amplifier support board arranged between the amplifier board and the phase adjustment circuit board, having a space through which the heat transfer member passes, connected to the amplifier board and the phase adjustment circuit board, and having the signal wiring provided thereon. (Appendix 7) The shielding structure comprises: a plurality of through-hole conductors provided on the inner surface of through-holes provided at intervals shorter than half the wavelength of the radio wave on the periphery of each of the antenna support substrate, the amplifier substrate, the amplifier support substrate, and the phase adjustment circuit substrate; a main surface conductor provided to connect to each of the through-hole conductors on each of the main surfaces on both sides of the antenna support substrate, the main surfaces on both sides of the amplifier substrate, the main surfaces on both sides of the amplifier support substrate, and the main surface of the phase adjustment circuit substrate on the side where the amplifier support substrate is present, or provided with a predetermined width on the peripheral portion of the main surface of the antenna substrate on the side where the antenna support substrate is present; solder joints provided at intervals shorter than half the wavelength of the radio wave, which join the main surface conductor provided on the main surface of the antenna board on the side where the antenna support board is present to the main surface conductor provided on the main surface of the antenna support board on the side where the antenna board is present, join the main surface conductor provided on the main surface of the antenna support board on the side where the amplifier board is present to the main surface conductor provided on the main surface of the amplifier board on the side where the antenna support board is present, join the main surface conductor provided on the main surface of the amplifier board on the side where the amplifier support board is present to the main surface of the amplifier support board on the side where the amplifier board is present, join the main surface conductor provided on the main surface of the amplifier support board on the side where the amplifier board is present to the main surface of the amplifier support board, and a grounded ground conductor provided on a main surface of the phase adjustment circuit board opposite to a side on which the amplifier support substrate is present, to which the plurality of through-hole conductors provided in the phase adjustment circuit board are connected. (Appendix 8) The antenna module described in Appendix 7, wherein the shielding structure includes a plurality of main surface conductors provided separately for each of the through-hole conductors on each of opposite main surfaces of the antenna support substrate, on each of opposite main surfaces of the amplifier substrate, on each of opposite main surfaces of the amplifier support substrate, and on a main surface of the phase adjustment circuit substrate on which the amplifier support substrate is present, and a plurality of the solder joints that join each of the main surface conductors to a corresponding main surface conductor on an opposing main surface. (Appendix 9) The antenna module described in Appendix 7, wherein the shielding structure includes one of the main surface conductors connected to each of the through-hole conductors and the solder joints provided in a ring shape with a determined width on each of the main surfaces of the antenna support substrate, the main surface of the amplifier substrate, the main surface of the amplifier support substrate, and the main surface of the phase adjustment circuit substrate on which the amplifier support substrate is present. (Appendix 10) 7. The antenna module described in claim 6, wherein the shielding structure has a conductive metal cylinder that houses the antenna support board, the amplifier board, the amplifier support board, and the phase adjustment circuit board. (Appendix 11) a number of sets of the antenna elements, the amplifiers, the heat transfer members, the phase adjustment circuits, the signal wiring, and the shielding structures, the number of which is an integer equal to or greater than 2; The antenna substrate is provided with one antenna element in each of the regions divided into the number of arrays, the antenna support substrate is provided with a space for accommodating the signal wiring and one of the amplifiers in each of the regions divided according to the number of arrangements; The amplifier board has one amplifier mounted in each of the regions divided into the number of arrays, and a space through which the signal wiring and one of the heat transfer members pass is provided, the phase adjustment circuit board is provided with one of the phase adjustment circuits mounted in each of the regions divided according to the number of arrangements, and a space through which the signal wiring and one of the heat transfer members pass is provided; The antenna module according to any one of claims 1 to 4, wherein the shielding structure is provided on the periphery of each area divided into the number of arrays on the antenna support substrate, the amplifier substrate, and the phase adjustment circuit substrate. (Appendix 12) a number of sets of the antenna elements, the amplifiers, the heat transfer members, the phase adjustment circuits, the signal wiring, and the shielding structures, the number of which is an integer equal to or greater than 2; The antenna substrate is provided with one antenna element in each of the regions divided into the number of arrays, the antenna support substrate is provided with a space for accommodating the signal wiring and one of the amplifiers in each of the regions divided according to the number of arrays; The amplifier board has one amplifier mounted in each of the regions divided into the number of arrays, and a space through which the signal wiring and one of the heat transfer members pass is provided, the amplifier support substrate is provided with a space through which the signal wiring and one of the heat transfer members pass in each of the regions divided into the number of arrays; the phase adjustment circuit board is provided with one of the phase adjustment circuits mounted in each of the regions divided according to the number of arrangements, and a space through which the signal wiring and one of the heat transfer members pass is provided; The antenna module according to any one of claims 6 to 9, wherein the shielding structure is provided on the periphery of each area divided into the number of arrays in the antenna support substrate, the amplifier substrate, the amplifier support substrate, and the phase adjustment circuit substrate. (Appendix 13) An array of antenna elements, the number of which is an integer equal to or greater than 2; an antenna substrate on which the number of antenna elements arranged is provided; an amplifier for amplifying a transmission signal supplied to each of the antenna elements; a heat transfer member connected to a surface of each of the amplifiers on a side where the antenna substrate is not present, the heat transfer member being equal to the number of the arrangements and adapted to receive heat generated by each of the amplifiers; an antenna support substrate provided with spaces corresponding to the number of arrays for accommodating each of the amplifiers, and provided with signal wiring corresponding to the number of arrays for connecting to the antenna substrate and transmitting the transmission signal to each of the antenna elements; an amplifier board on which the amplifiers in the number of arrangements are mounted on a main surface on the side where the antenna support substrate is present, the amplifier board is connected to the antenna support substrate, and has spaces in the number of arrangements through which the heat transfer members pass, and has the signal wirings in the number of arrangements; a phase adjustment circuit for generating a phase-adjusted transmission signal of a determined frequency, the phase-adjusted transmission signal being amplified by each of the amplifiers; a phase adjustment circuit board on a main surface opposite to a side on which the amplifier board is present, the phase adjustment circuits are mounted in the number of arrangements, spaces are provided for the number of arrangements through which the heat transfer members pass, and the signal wirings are provided in the number of arrangements; a phase adjustment circuit board arranged on a side of the amplifier board on which the amplifier is not mounted, the phase adjustment circuits being mounted on a main surface opposite to the side on which the amplifier board is mounted, the number of spaces being provided through which the heat transfer members pass, and the number of signal wirings being provided; An antenna module comprising: a shielding structure for electrically insulating each of the signal wirings arranged in the number of arrangements provided in each region of the antenna support substrate, the amplifier substrate, and the phase adjustment circuit substrate from the signal wirings arranged in other regions and from the outside. (Appendix 14) the phase adjustment circuit board is connected to the amplifier board; Each of the shielding structures is a plurality of through-hole conductors provided on inner surfaces of through-holes provided at intervals shorter than half the wavelength of the radio wave on the periphery of each region of the antenna support substrate, the amplifier substrate, and the phase adjustment circuit substrate; a main surface conductor provided so as to be connected to each of the through-hole conductors on each of a main surface of the antenna support substrate on the side where the amplifier substrate is present, main surfaces on both sides of the antenna support substrate, main surfaces on both sides of the amplifier substrate, and a main surface of the phase adjustment circuit substrate on the side where the amplifier substrate is present, or provided with a predetermined width on a peripheral portion of the main surface of the antenna substrate on the side where the antenna support substrate is present; a solder joint portion that joins the main surface conductor provided on the main surface of the antenna board on the side where the antenna support board is present to the main surface conductor provided on the main surface of the antenna support board on the side where the antenna board is present, joins the main surface conductor provided on the main surface of the antenna support board on the side where the amplifier board is present to the main surface conductor provided on the main surface of the amplifier board on the side where the antenna support board is present, and joins the main surface conductor provided on the main surface of the amplifier board on the side where the phase adjustment circuit board is present to the main surface of the phase adjustment circuit board on the side where the amplifier board is present; and a grounded ground conductor provided on a main surface of the phase adjustment circuit board opposite to a side on which the amplifier board is present, to which the plurality of through-hole conductors provided in the phase adjustment circuit board are connected. (Appendix 15) The antenna module described in Appendix 14, wherein each of the shielding structures includes a plurality of main surface conductors provided separately for each of the through-hole conductors on each of opposite main surfaces of the antenna support substrate, on each of opposite main surfaces of the amplifier substrate, and on the main surface of the phase adjustment circuit substrate on the side where the amplifier substrate is present, and a plurality of the solder joints that join each of the main surface conductors to a corresponding main surface conductor on the opposing main surface. (Appendix 16) The antenna module described in Appendix 14, wherein each of the shielding structures includes one of the main surface conductors connected to each of the through-hole conductors and the solder joints provided in a ring shape with a determined width on each of the main surfaces of the antenna support substrate, the main surfaces of the amplifier substrate, and the main surface of the phase adjustment circuit substrate on which the amplifier substrate is located. (Appendix 17) an amplifier support substrate disposed between the amplifier substrate and the phase adjustment circuit substrate, the support substrate having the number of spaces through which the heat transfer members pass, the support substrate being connected to the amplifier substrate and the phase adjustment circuit substrate, and the signal wirings being provided in the number of the signal wirings; 14. The antenna module according to claim 13, wherein each of the shielding structures is provided in each of the regions of the antenna support substrate, the amplifier substrate, the amplifier support substrate, and the phase adjustment circuit substrate in the number of arrangements. (Appendix 18) Each of the shielding structures is a plurality of through-hole conductors provided on the inner surface of through-holes provided at intervals shorter than half the wavelength of the radio wave on the periphery of each of the antenna support substrate, the amplifier substrate, the amplifier support substrate, and the phase adjustment circuit substrate; a main surface conductor provided to connect to each of the through-hole conductors on each of the main surfaces on both sides of the antenna support substrate, the main surfaces on both sides of the amplifier substrate, the main surfaces on both sides of the amplifier support substrate, and the main surface of the phase adjustment circuit substrate on the side where the amplifier support substrate is present, or provided with a predetermined width on the peripheral portion of the main surface of the antenna substrate on the side where the antenna support substrate is present; a solder joint portion for joining the main surface conductor provided on the main surface of the antenna board on the side where the antenna support board is present to the main surface conductor provided on the main surface of the antenna support board on the side where the antenna board is present, joining the main surface conductor provided on the main surface of the antenna support board on the side where the amplifier board is present to the main surface conductor provided on the main surface of the amplifier board on the side where the antenna support board is present, joining the main surface conductor provided on the main surface of the amplifier board on the side where the amplifier support board is present to the main surface of the amplifier support board on the side where the amplifier board is present, and joining the main surface conductor provided on the main surface of the amplifier support board on the side where the phase adjustment circuit board is present to the main surface of the phase adjustment circuit board on the side where the amplifier support board is present; and a grounded ground conductor provided on a main surface of the phase adjustment circuit board opposite to a side on which the amplifier support substrate is present, to which the plurality of through-hole conductors provided in the phase adjustment circuit board are connected. (Appendix 19) The antenna module described in Appendix 18, wherein each of the shielding structures includes a plurality of main surface conductors provided separately for each of the through-hole conductors on each of opposite main surfaces of the antenna support substrate, on each of opposite main surfaces of the amplifier substrate, on each of opposite main surfaces of the amplifier support substrate, and on a main surface of the phase adjustment circuit substrate on the side where the amplifier support substrate is present, and a plurality of the solder joints that join each of the main surface conductors to a corresponding main surface conductor on the opposing main surface. (Appendix 20) The antenna module described in Appendix 18, wherein each of the shielding structures includes one of the main surface conductors connected to each of the through-hole conductors and the solder joints provided in a ring shape with a determined width on each of the main surfaces of the antenna support substrate, the main surface of the amplifier substrate, the main surface of the amplifier support substrate, and the main surface of the phase adjustment circuit substrate on which the amplifier support substrate is present. (Appendix 21) 21. The antenna module of claim 1, wherein the antenna element is a patch antenna. (Appendix 22) The antenna module according to any one of claims 1 to 10 and 13 to 20, further comprising a heat dissipation section connected to the heat transfer member on a side of the phase adjustment circuit board on which the phase adjustment circuit is mounted. (Appendix 23) An antenna device comprising a plurality of antenna modules according to any one of Supplementary Note 1 to Supplementary Note 10 and Supplementary Note 13 to Supplementary Note 20, wherein the antenna elements are present on the same plane and are arranged at predetermined intervals. [Explanation of symbols]

[0089] 100 Antenna device, 70, 70C, 70D, 70E Antenna Modules, 1 antenna element, 2. 2D antenna board, 3, 3C, 3D, 3E antenna support board, 3a through hole, 3b Step part, 4 amplifiers, 5, 5C, 5D, 5E amplifier boards, 5a through hole, 6 heat transfer member, 7, 7C, 7D, 7E amplifier support board, 7a through hole, 8, 8C, 8D, 8E Phase adjustment circuit board, 8a through hole, 9 Phase adjustment circuit, 10 Electronic components, 11 Electronic components, 12 Signal wiring, 13 Signal wiring, 14 Signal wiring, 15 Signal wiring, 16 signal wiring, 17 Signal wiring, 18 signal wiring, 19 Signal wiring, 20 signal wiring, 21 Signal wiring, 22 signal wiring, 23 solder bumps, 24 solder bumps, 25 signal wiring, 26 signal wiring, 27 Signal wiring, 28 signal wiring, 29 Signal wiring, 30 signal wiring, 31 solder bumps, 32 solder bumps, 33, 33C, 33E shielding structure, 34 through holes, 35 through hole conductors, 36 Surface land (main surface conductor), 37 Back surface land (main surface conductor), 38 through holes, 39 through hole conductors, 40 Surface land (main surface conductor), 41 Back surface land (main surface conductor), 42 through holes, 43 through hole conductor, 44 Surface land (main surface conductor), 45 Backside land (main surface conductor), 46 through holes, 47 through hole conductors, 48 Surface land (main surface conductor), 49 Ground conductor, 50 Main surface conductor, 51 Solder bump (solder joint), 52 Solder bump (solder joint), 53 Solder bumps (solder joints), 54 Solder bumps (solder joints), 55 Heat dissipation part, 56 Main surface conductor, 57 Main surface conductor, 58 Main surface conductor, 59 Main surface conductor, 60 Main surface conductor, 61 Main surface conductor, 62 Main surface conductor, 63 Solder joint area (solder joint), 64 solder joint area (solder joint), 65 solder joint area (solder joint), 66 Solder joint area (solder joint), 67 Shielding box (tube), 68 Solder joint area (solder joint).

Claims

1. An antenna element that radiates radio waves; an antenna substrate on which the antenna element is provided; an amplifier that amplifies a transmission signal radiated as the radio wave by the antenna element; a heat transfer member connected to a surface of the amplifier opposite to a surface on which the antenna substrate is disposed, and receiving heat generated by the amplifier; an antenna support substrate provided with a space for accommodating the amplifier, connected to the antenna substrate, and having a signal wiring that is a wiring for transmitting the transmission signal to the antenna element; an amplifier board on which the amplifier is mounted on a main surface on the side where the antenna support substrate is present, the amplifier board is connected to the antenna support substrate, a space is provided through which the heat transfer member passes, and the signal wiring is provided; a phase adjustment circuit for generating the transmission signal having a phase adjusted and a determined frequency, the transmission signal being amplified by the amplifier; a phase adjustment circuit board that is disposed on a side of the amplifier board on which the amplifier is not mounted, the phase adjustment circuit being mounted on a main surface opposite to the side on which the amplifier board is mounted, a space through which the heat transfer member passes being provided, and the signal wiring being provided; and a shielding structure for electrically shielding the signal wiring from the outside.

2. the phase adjustment circuit board is connected to the amplifier board; The shielding structure comprises: a plurality of through-hole conductors provided on the inner surface of through-holes provided at intervals shorter than half the wavelength of the radio wave on the periphery of each of the antenna support substrate, the amplifier substrate, and the phase adjustment circuit substrate; a main surface conductor provided so as to be connected to each of the through-hole conductors on each of the main surfaces on both sides of the antenna support substrate, the main surfaces on both sides of the amplifier substrate, and the main surface of the phase adjustment circuit substrate on the side where the amplifier substrate is present, or provided with a predetermined width on the periphery of the main surface of the antenna substrate on the side where the antenna support substrate is present; solder joints which join the main surface conductor provided on the main surface of the antenna board on the side where the antenna support board is present to the main surface conductor provided on the main surface of the antenna support board on the side where the antenna board is present, join the main surface conductor provided on the main surface of the antenna support board on the side where the amplifier board is present to the main surface conductor provided on the main surface of the amplifier board on the side where the antenna support board is present, and join the main surface conductor provided on the main surface of the amplifier board on the side where the phase adjustment circuit board is present to the main surface of the phase adjustment circuit board on the side where the amplifier board is present, and are provided at intervals shorter than half the wavelength of the radio wave; 2. The antenna module according to claim 1, further comprising: a grounded conductor provided on a main surface of the phase adjustment circuit board opposite to a side on which the amplifier board is present, the grounded conductor being connected to a plurality of through-hole conductors provided on the phase adjustment circuit board.

3. 3. The antenna module according to claim 2, wherein the shielding structure includes a plurality of main surface conductors provided separately for each of the through-hole conductors on each of opposite main surfaces of the antenna support substrate, on each of opposite main surfaces of the amplifier substrate, and on each of the main surfaces of the phase adjustment circuit substrate on which the amplifier substrate is present, and a plurality of the solder joints that join each of the main surface conductors to a corresponding main surface conductor on an opposing main surface.

4. 3. The antenna module according to claim 2, wherein the shielding structure includes one main surface conductor connected to each of the through-hole conductors and the solder joints provided in a ring shape with a determined width on each of the main surfaces of the antenna support substrate, the main surfaces of the amplifier substrate, and the main surface of the phase adjustment circuit substrate on which the amplifier substrate is located.

5. 2. The antenna module according to claim 1, wherein the shielding structure comprises a conductive metal cylinder that houses the antenna support board, the amplifier board, and the phase adjustment circuit board.

6. The antenna module according to claim 1, further comprising an amplifier support substrate disposed between the amplifier substrate and the phase adjustment circuit substrate, having a space through which the heat transfer member passes, connected to the amplifier substrate and the phase adjustment circuit substrate, and having the signal wiring provided thereon.

7. The shielding structure comprises: a plurality of through-hole conductors provided on the inner surface of through-holes provided at intervals shorter than half the wavelength of the radio wave on the periphery of each of the antenna support substrate, the amplifier substrate, the amplifier support substrate, and the phase adjustment circuit substrate; a main surface conductor provided to connect to each of the through-hole conductors on each of the main surfaces on both sides of the antenna support substrate, the main surfaces on both sides of the amplifier substrate, the main surfaces on both sides of the amplifier support substrate, and the main surface of the phase adjustment circuit substrate on the side where the amplifier support substrate is present, or provided with a predetermined width on the peripheral portion of the main surface of the antenna substrate on the side where the antenna support substrate is present; solder joints provided at intervals shorter than half the wavelength of the radio wave, which join the main surface conductor provided on the main surface of the antenna board on the side where the antenna support board is present to the main surface conductor provided on the main surface of the antenna support board on the side where the antenna board is present, join the main surface conductor provided on the main surface of the antenna support board on the side where the amplifier board is present to the main surface conductor provided on the main surface of the amplifier board on the side where the antenna support board is present, join the main surface conductor provided on the main surface of the amplifier board on the side where the amplifier support board is present to the main surface of the amplifier support board on the side where the amplifier board is present, join the main surface conductor provided on the main surface of the amplifier support board on the side where the amplifier board is present to the main surface of the amplifier support board, 7. The antenna module according to claim 6, further comprising: a grounded conductor provided on a main surface of the phase adjustment circuit board opposite to a side on which the amplifier support substrate is present, the grounded conductor being connected to a plurality of through-hole conductors provided on the phase adjustment circuit board.

8. 8. The antenna module according to claim 7, wherein the shielding structure includes a plurality of main surface conductors provided separately for each of the through-hole conductors on each of opposite main surfaces of the antenna support substrate, on each of opposite main surfaces of the amplifier substrate, on each of opposite main surfaces of the amplifier support substrate, and on a main surface of the phase adjustment circuit substrate on which the amplifier support substrate is present, and a plurality of the solder joints that join each of the main surface conductors to a corresponding main surface conductor on an opposing main surface.

9. 8. The antenna module according to claim 7, wherein the shielding structure includes one of the main surface conductors connected to each of the through-hole conductors and the solder joints provided in a ring shape with a determined width on each of the main surfaces of the antenna support substrate, the main surfaces of the amplifier substrate, the main surfaces of the amplifier support substrate, and the main surface of the phase adjustment circuit substrate on which the amplifier support substrate is present.

10. 7. The antenna module according to claim 6, wherein the shielding structure comprises a conductive metal cylinder that houses the antenna support board, the amplifier board, the amplifier support board, and the phase adjustment circuit board.

11. a number of sets of the antenna elements, the amplifiers, the heat transfer members, the phase adjustment circuits, the signal wiring, and the shielding structures, the number of which is an integer equal to or greater than 2; The antenna substrate is provided with one antenna element in each of the regions divided into the number of arrays, the antenna support substrate is provided with a space for accommodating the signal wiring and one of the amplifiers in each of the regions divided according to the number of arrangements; The amplifier board has one amplifier mounted in each of the regions divided into the number of arrays, and a space through which the signal wiring and one of the heat transfer members pass is provided, the phase adjustment circuit board is provided with one of the phase adjustment circuits mounted in each of the regions divided according to the number of arrangements, and a space through which the signal wiring and one of the heat transfer members pass is provided; 5. The antenna module according to claim 1, wherein the shielding structure is provided on the periphery of each of the areas divided into the number of arrays on the antenna support board, the amplifier board and the phase adjustment circuit board.

12. a number of sets of the antenna elements, the amplifiers, the heat transfer members, the phase adjustment circuits, the signal wiring, and the shielding structures, the number of which is an integer equal to or greater than 2; The antenna substrate is provided with one antenna element in each of the regions divided into the number of arrays, the antenna support substrate is provided with a space for accommodating the signal wiring and one of the amplifiers in each of the regions divided into the number of arrays; The amplifier board has one amplifier mounted in each of the regions divided into the number of arrays, and a space through which the signal wiring and one of the heat transfer members pass is provided, the amplifier support substrate is provided with a space through which the signal wiring and one of the heat transfer members pass in each of the regions divided into the number of arrays; the phase adjustment circuit board is provided with one of the phase adjustment circuits mounted in each of the regions divided according to the number of arrangements, and a space through which the signal wiring and one of the heat transfer members pass is provided; 10. The antenna module according to claim 6, wherein the shielding structure is provided on the periphery of each of the areas divided into the number of arrangements in the antenna support substrate, the amplifier substrate, the amplifier support substrate and the phase adjustment circuit substrate.

13. An array of antenna elements, the number of which is an integer equal to or greater than 2; an antenna substrate on which the number of antenna elements arranged is provided; an amplifier for amplifying a transmission signal supplied to each of the antenna elements; a heat transfer member connected to a surface of each of the amplifiers on a side where the antenna substrate is not present, the heat transfer member being equal to the number of the arrangements and adapted to receive heat generated by each of the amplifiers; an antenna support substrate provided with spaces corresponding to the number of arrays for accommodating each of the amplifiers, and provided with signal wiring corresponding to the number of arrays for connecting to the antenna substrate and transmitting the transmission signal to each of the antenna elements; an amplifier board on which the amplifiers in the number of arrangements are mounted on a main surface on the side where the antenna support substrate is present, the amplifier board is connected to the antenna support substrate, and has spaces in the number of arrangements through which the heat transfer members pass, and has signal wiring in the number of arrangements; a phase adjustment circuit for generating a phase-adjusted transmission signal of a determined frequency, the phase-adjusted transmission signal being amplified by each of the amplifiers; a phase adjustment circuit board on a main surface opposite to the side where the amplifier board is present, the phase adjustment circuits are mounted in the number of arrangements, spaces are provided for the number of arrangements through which the heat transfer members pass, and the signal wirings are provided in the number of arrangements; a phase adjustment circuit board arranged on a side of the amplifier board on which the amplifier is not mounted, the phase adjustment circuits being mounted on a main surface opposite to the side on which the amplifier board is mounted in the number of arrays, spaces being provided for the number of arrays through which each of the heat transfer members passes, and the signal wirings being provided in the number of arrays; An antenna module comprising: a shielding structure for electrically insulating each of the signal wirings arranged in the number of arrangements provided in each region of the antenna support substrate, the amplifier substrate, and the phase adjustment circuit substrate from the signal wirings arranged in other regions and from the outside.

14. the phase adjustment circuit board is connected to the amplifier board; Each of the shielding structures is a plurality of through-hole conductors provided on inner surfaces of through-holes provided at intervals shorter than half the wavelength of the radio wave on the periphery of each region of the antenna support substrate, the amplifier substrate, and the phase adjustment circuit substrate; a main surface conductor provided so as to be connected to each of the through-hole conductors on each of a main surface of the antenna support substrate on the side where the amplifier substrate is present, main surfaces on both sides of the antenna support substrate, main surfaces on both sides of the amplifier substrate, and a main surface of the phase adjustment circuit substrate on the side where the amplifier substrate is present, or provided with a predetermined width on a peripheral portion of the main surface of the antenna substrate on the side where the antenna support substrate is present; a solder joint portion that joins the main surface conductor provided on the main surface of the antenna board on the side where the antenna support board is present to the main surface conductor provided on the main surface of the antenna support board on the side where the antenna board is present, joins the main surface conductor provided on the main surface of the antenna support board on the side where the amplifier board is present to the main surface conductor provided on the main surface of the amplifier board on the side where the antenna support board is present, and joins the main surface conductor provided on the main surface of the amplifier board on the side where the phase adjustment circuit board is present to the main surface of the phase adjustment circuit board on the side where the amplifier board is present; 14. The antenna module according to claim 13, further comprising: a grounded conductor provided on a main surface of the phase adjustment circuit board opposite to a side on which the amplifier board is present, the grounded conductor being connected to a plurality of through-hole conductors provided on the phase adjustment circuit board.

15. 15. The antenna module according to claim 14, wherein each of the shielding structures includes a plurality of main surface conductors provided separately for each of the through-hole conductors on each of opposite main surfaces of the antenna support substrate, on each of opposite main surfaces of the amplifier substrate, and on a main surface of the phase adjustment circuit substrate on which the amplifier substrate is present, and a plurality of the solder joints that join each of the main surface conductors to a corresponding main surface conductor on an opposing main surface.

16. 15. The antenna module according to claim 14, wherein each of the shielding structures includes one of the main surface conductors connected to each of the through-hole conductors and the solder joints provided in a ring shape with a determined width on each of the main surfaces of the antenna support substrate on both sides, the main surfaces of the amplifier substrate on both sides, and the main surface of the phase adjustment circuit substrate on which the amplifier substrate is present.

17. an amplifier support substrate disposed between the amplifier substrate and the phase adjustment circuit substrate, the support substrate having the number of spaces through which the heat transfer members pass, the support substrate being connected to the amplifier substrate and the phase adjustment circuit substrate, and the signal wirings being provided in the number of the signal wirings; The antenna module according to claim 13 , wherein each of the shielding structures is provided in each of the regions of the antenna support board, the amplifier board, the amplifier support board and the phase adjustment circuit board, the number of which is equal to the number of arrays.

18. Each of the shielding structures is a plurality of through-hole conductors provided on the inner surface of through-holes provided at intervals shorter than half the wavelength of the radio wave on the periphery of each of the antenna support substrate, the amplifier substrate, the amplifier support substrate, and the phase adjustment circuit substrate; a main surface conductor provided to connect to each of the through-hole conductors on each of the main surfaces on both sides of the antenna support substrate, the main surfaces on both sides of the amplifier substrate, the main surfaces on both sides of the amplifier support substrate, and the main surface of the phase adjustment circuit substrate on the side where the amplifier support substrate is present, or provided with a predetermined width on the peripheral portion of the main surface of the antenna substrate on the side where the antenna support substrate is present; a solder joint portion for joining the main surface conductor provided on the main surface of the antenna board on the side where the antenna support board is present to the main surface conductor provided on the main surface of the antenna support board on the side where the antenna board is present, joining the main surface conductor provided on the main surface of the antenna support board on the side where the amplifier board is present to the main surface conductor provided on the main surface of the amplifier board on the side where the antenna support board is present, joining the main surface conductor provided on the main surface of the amplifier board on the side where the amplifier support board is present to the main surface of the amplifier support board on the side where the amplifier board is present, and joining the main surface conductor provided on the main surface of the amplifier support board on the side where the phase adjustment circuit board is present to the main surface of the phase adjustment circuit board on the side where the amplifier support board is present; The antenna module according to claim 17, further comprising: a grounded conductor provided on a main surface of the phase adjustment circuit board opposite to a side on which the amplifier support substrate is present, to which the plurality of through-hole conductors provided on the phase adjustment circuit board are connected.

19. 19. The antenna module according to claim 18, wherein each of the shielding structures includes a plurality of main surface conductors provided separately for each of the through-hole conductors on each of opposite main surfaces of the antenna support substrate, on each of opposite main surfaces of the amplifier substrate, on each of opposite main surfaces of the amplifier support substrate, and on a main surface of the phase adjustment circuit substrate on which the amplifier support substrate is present, and a plurality of the solder joints that join each of the main surface conductors to a corresponding main surface conductor on an opposing main surface.

20. 19. The antenna module according to claim 18, wherein each of the shielding structures includes one of the main surface conductors connected to each of the through-hole conductors and the solder joints provided in a ring shape with a determined width on each of the main surfaces of the antenna support substrate, the main surfaces of the amplifier substrate, the main surfaces of the amplifier support substrate, and the main surface of the phase adjustment circuit substrate on which the amplifier support substrate is present.

21. The antenna module according to any one of claims 1 to 10 and claims 13 to 20, wherein the antenna element is a patch antenna.

22. The antenna module according to any one of claims 1 to 10 and claims 13 to 20, further comprising a heat dissipation portion connected to the heat transfer member on the side of the phase adjustment circuit board on which the phase adjustment circuit is mounted.

23. An antenna device comprising a plurality of antenna modules according to any one of claims 1 to 10 and claims 13 to 20, the antenna elements being present on the same plane and arranged at predetermined intervals.

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