Information processor, exposure apparatus, production method of article, and program
The information processing device addresses the challenge of validating conditions in global alignment methods by predicting and displaying exposure results and their differences, enhancing the alignment process with improved visibility and effectiveness.
Patent Information
- Application Number
- JP2023163580
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-09-26
- Publication Date
- 2025-04-08
AI Technical Summary
In the global alignment method for exposure devices, it is challenging to intuitively confirm the improvement effect of each condition, making it difficult to recognize changes in conditions and judge the validity of optimizing these conditions for high-precision and high-throughput alignment.
An information processing device is introduced that includes a prediction unit to predict exposure results for each region under different conditions, a calculation unit to calculate the differences in exposure results, and a display control unit to display these results and differences in parallel on a user interface, allowing for easy recognition of changes and validity assessment.
This solution enables the determination of the validity of conditions set for an exposure device, facilitating the recognition of changes in correction residuals and improving the alignment process by providing a clear visualization of the improvement effects.
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Figure 2025054511000001_ABST
Abstract
Description
[Technical field]
[0001] The present invention relates to an information processing apparatus, an exposure apparatus, an article manufacturing method, and a program. [Background technology]
[0002] The exposure device transfers 10 or more layers of patterns (circuit patterns) onto the substrate in an overlapping manner, but if the overlapping accuracy of the patterns between the layers is not good, problems may occur with the circuit characteristics. In such cases, the chip will not meet the expected characteristics, resulting in a defective chip and a reduced yield. Therefore, it is necessary to precisely align each of the multiple areas (shot areas) to be exposed on the substrate with the original pattern.
[0003] In an exposure apparatus, alignment marks arranged in each region on a substrate are detected, and each region on the substrate is aligned with the pattern on the original based on position information of the alignment marks and position information of the pattern on the original. Ideally, the most accurate alignment is possible by detecting alignment marks in all regions on the substrate, but this is not realistic from the viewpoint of productivity. Therefore, the global alignment method is currently the mainstream method for aligning a substrate and an original (see Patent Document 1).
[0004] In the global alignment method, it is assumed that the relative position of each area on the substrate can be expressed by a function model of the position coordinates of the area, and the positions of alignment marks arranged in multiple sample areas on the substrate are measured. Next, parameters of the function model are estimated using regression analysis-like statistical calculation processing from the assumed function model and the measurement results of the alignment mark positions. Then, alignment is performed by calculating the position coordinates of each area in the stage coordinate system (arrangement of areas on the substrate) using the parameters and the function model. In the global alignment method, a polynomial model with the stage coordinates as a variable is generally used, and scaling, rotation, uniform offset, etc., which are first-order polynomials of the stage coordinates, are mainly used (see Patent Document 2). In addition, a technology using a regression model that also considers high-order components of the array of areas on the substrate as parameters has also been proposed (see Patent Document 3). [Prior art documents] [Patent documents]
[0005] [Patent Document 1] Japanese Patent Application Publication No. 62-84516 [Patent Document 2] Japanese Patent Application Publication No. 6-349705 [Patent Document 3] Patent No. 3230271 Summary of the Invention [Problem to be solved by the invention]
[0006] In the global alignment method, in order to achieve high-precision correction with high throughput, it is necessary to perform tests for multiple function models while changing the number and arrangement of sample areas on the substrate, and optimize conditions such as the function model, the number and arrangement of sample areas, etc. However, with conventional technology, there is no means to intuitively confirm the improvement effect under each condition, making it difficult to recognize changes for each condition, and making it impossible to judge the validity of changes (optimization) of conditions.
[0007] The present invention has been made in consideration of the problems with the conventional technology, and has an exemplary object to provide a technique that is advantageous for determining the validity of conditions set in an exposure apparatus that exposes a substrate. [Means for solving the problem]
[0008] In order to achieve the above-mentioned object, an information processing device as one aspect of the present invention is an information processing device that controls the display of a user interface, and is characterized in that, in an exposure apparatus that exposes a substrate, it has: a prediction unit that predicts the exposure result of each of a plurality of regions of the substrate when the each of the regions is exposed under a plurality of mutually different conditions; a calculation unit that calculates, for each of the plurality of regions, the difference of the exposure result predicted by the prediction unit for each of the plurality of conditions; and a display control unit that controls the exposure result predicted by the prediction unit for each of the plurality of conditions for each of the plurality of regions and the difference calculated by the calculation unit so that they are displayed in parallel on the user interface.
[0009] Further objects or other aspects of the present invention will become apparent from the following description of the embodiments with reference to the accompanying drawings. Effect of the Invention
[0010] According to the present invention, for example, it is possible to provide a technique that is advantageous for determining the validity of conditions set in an exposure apparatus that exposes a substrate. [Brief description of the drawings]
[0011] [Figure 1] 1 is a schematic diagram showing a configuration of an exposure apparatus according to one aspect of the present invention. [Diagram 2] FIG. 2 is a schematic diagram showing a configuration of an alignment optical system. [Diagram 3] 2 is a flowchart for explaining an exposure process in the exposure apparatus shown in FIG. [Figure 4] FIG. 2 is a diagram showing an arrangement of shot areas on a substrate. [Diagram 5] FIG. 13 is a diagram illustrating an example of a relationship between the number of sample points and a correction residual. [Figure 6] FIG. 1 is a diagram showing an example of a screen displayed as a user interface on a display unit in the prior art. [Figure 7] FIG. 4 is a diagram showing an example of a screen displayed as a user interface on a display unit in the present embodiment. [Figure 8] FIG. 4 is a diagram showing an example of a screen displayed as a user interface on a display unit in the present embodiment. [Figure 9] FIG. 4 is a diagram showing an example of a screen displayed as a user interface on a display unit in the present embodiment. [Figure 10] FIG. 2 is a diagram showing an arrangement of shot areas on a substrate. [Figure 11] FIG. 4 is a diagram showing an example of a screen displayed as a user interface on a display unit in the present embodiment. [Figure 12] FIG. 4 is a diagram showing an example of a screen displayed as a user interface on a display unit in the present embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0012] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.
[0013] 1 is a schematic diagram showing the configuration of an exposure apparatus 1 according to one aspect of the present invention. The exposure apparatus 1 is a lithography apparatus used in the manufacturing process of devices such as semiconductor elements. In this embodiment, the exposure apparatus 1 projects a pattern of an original 2 (reticle or mask) onto a substrate 4 via a projection optical system 3 to expose the substrate 4 to light.
[0014] 1, the exposure apparatus 1 has a projection optical system 3 that projects (reduced projection) a pattern formed on an original 2, and a chuck 5 that holds a substrate 4 on which a base pattern and alignment marks have been formed in a previous process. The exposure apparatus 1 also has a substrate stage 6 that supports the chuck 5 and positions the substrate 4 at a predetermined position, an alignment optical system 7 that measures the position of the alignment mark on the substrate, a control unit CN, a storage unit SU, and a display unit DP.
[0015] The control unit CN is composed of, for example, a computer (information processing device) including a CPU, memory, etc., and performs overall control of each unit of the exposure apparatus 1 according to a program stored in the storage unit SU, etc. The control unit CN controls the exposure process for exposing the substrate 4 through the original 2, and also functions as a processing unit that determines the arrangement (shot arrangement, area arrangement) of multiple shot areas (multiple areas on the substrate) on the substrate. In this embodiment, the control unit CN also functions as an information processing device that provides an index for evaluating the exposure result in the exposure apparatus 1 that exposes the substrate 4, as will be described later.
[0016] The storage unit SU stores programs and various information (data) required to control each part of the exposure apparatus 1 and perform an exposure process for exposing the substrate 4. The storage unit SU also stores programs and various information (data) required for the control unit CN to determine a shot arrangement.
[0017] The display unit DP is a display device for displaying various types of information related to the exposure apparatus 1. In this embodiment, the display unit DP includes a touch panel, displays various user interfaces (screens), and accepts operations from the user. The display unit DP may be configured integrally with the exposure apparatus 1 (in a common housing), or may be configured separately from the exposure apparatus 1 (in a different housing). For example, the display unit DP may be provided in a management room where a user who manages the exposure apparatus 1 is located.
[0018] 2 is a schematic diagram showing the configuration of the alignment optical system 7. The alignment optical system 7 has a function of optically detecting marks (alignment marks) assigned to each shot area of the substrate 4 to obtain position measurement data. In this embodiment, the alignment optical system 7 includes a light source 8, a beam splitter 9, lenses 10 and 13, and a sensor 14. Light from the light source 8 is reflected by the beam splitter 9 and illuminates the alignment mark 11 or 12 formed on the substrate 4 via the lens 10. The light diffracted by the alignment mark 11 or 12 is received by the sensor 14 via the lens 10, the beam splitter 9, and the lens 13.
[0019] The exposure process in the exposure apparatus 1 will be described with reference to Fig. 3. Here, the process from aligning the substrate 4 to exposing it will be described.
[0020] In S101, the substrate 4 is loaded into the exposure apparatus 1. The substrate 4 loaded into the exposure apparatus 1 is held by a chuck 5 supported by a substrate stage 6.
[0021] In S102, pre-alignment is performed. Specifically, alignment marks 11 for pre-alignment on the substrate are detected by the alignment optical system 7, and the position of the substrate 4 is roughly obtained. At this time, detection of the alignment marks 11 is performed for a plurality of shot areas of the substrate 4, and the overall shift and first-order linear components (magnification and rotation) of the substrate 4 are obtained.
[0022] In S103, fine alignment is performed. Specifically, first, based on the result of the pre-alignment, the substrate stage 6 is driven to a position where the alignment mark 12 for fine alignment on the substrate can be detected by the alignment optical system 7. Then, the alignment mark 12 provided in each of the multiple shot areas of the substrate 4 is detected by the alignment optical system 7, and the overall shift and first-order linear components (magnification and rotation) of the substrate 4 are precisely obtained. At this time, by obtaining the positions of many shot areas, it is also possible to precisely obtain high-order deformation components of the shot arrangement of the substrate 4. This makes it possible to obtain the precise position of each shot area of the substrate 4, i.e., the shot arrangement.
[0023] In S104, the substrate 4 is exposed. Specifically, each shot area of the substrate 4 is exposed while the substrate 4 is positioned via the substrate stage 6 based on the shot arrangement determined by fine alignment. As a result, the pattern of the original 2 is transferred to each shot area of the substrate 4 via the projection optical system 3.
[0024] In S105, the substrate 4 is unloaded from the exposure apparatus 1.
[0025] In this embodiment, if distortion occurs in the substrate 4, high-order deformation components are corrected in fine alignment (S103). Here, a five-dimensional polynomial model is taken as an example of a regression model for estimating the shot arrangement, but the present invention is not limited to this. For example, any order model may be used as the regression model, or a model other than a polynomial (a trigonometric function model or a logarithmic model) may be used.
[0026] When the deformation of the substrate 4 is expressed by a fifth-order polynomial model, the positional shift (ShiftX, ShiftY) of each shot area is expressed by the following formula (1). Note that the positional shift of each shot area can also be considered as a correction value (alignment correction value) for correcting such positional shift.
[0027]
number
[0028] In formula (1), x and y indicate the position of the shot area of the substrate 4. From the actual position measurement data of each shot area of the substrate 4, k1 to k 42 Then, based on the equation (1) for which the coefficients have been determined, the positional deviation of each shot area is calculated.
[0029] In order to obtain position measurement data, the alignment optical system 7 detects alignment marks 12 assigned to some shot areas, so-called sample shot areas (sample areas), among a plurality of shot areas on the substrate, as shown in FIG. 4, for example. In FIG. 4, the number of sample shot areas is 23, but the number is not limited thereto, and may be, for example, about 4 to 50. By increasing the number of sample shot areas, it is possible to correct higher-order deformation components of the substrate 4, and also to obtain position measurement data (actual measurement values) of coordinates that are singular points for each substrate, thereby enabling more accurate alignment. Here, the singular points are defective points on the substrate, and include, for example, points with large unevenness in resist coating, points with large peripheral distortion, points directly above the lift pins of the chuck 5, and the like.
[0030] 5 is a diagram showing an example of the relationship between the number of sample shot areas (number of sample points) in a specific device and the correction residual, which is an index of correction accuracy, where the horizontal axis indicates the number of sample points and the horizontal axis indicates the correction residual. The correction residual means an error that cannot be removed by correction when correcting the arrangement (misalignment) of multiple shot areas on a substrate in alignment. Specifically, the correction residual is a correction residual when correcting the positional deviation of each of multiple shot areas based on a shot arrangement estimated using a regression model from position measurement data obtained by measuring alignment marks assigned to the sample shot areas.
[0031] 5, it can be seen that the more the number of sample shot areas, the more the correction residual is reduced. Therefore, from the viewpoint of correction accuracy (measurement accuracy), it is desirable to have a larger number of sample shot areas from which position measurement data is obtained. However, since an increase in the number of sample shot areas is in a trade-off relationship with the measurement time (alignment time), in practice, the number of sample shot areas needs to be determined taking into consideration the correction accuracy and productivity required for each device.
[0032] FIG. 6 is a diagram showing an example of a screen 60 displayed on the display unit DP as a user interface when the number of sample shot areas is determined in the conventional technology. The screen 60 is provided by the control unit CN. The screen 60 includes a display area DA1 that displays the relationship between the number of sample shot areas (number of sample points) and the correction residual and productivity. In the display area DA1, a graph (dotted line) showing (the transition of) the correction residual with respect to the number of sample points and a graph (solid line) showing (the transition of) the productivity with respect to the number of sample points are displayed. The productivity is expressed by the number of substrates processed per unit time (wph). The user can select (specify) the number of sample points at which the correction residual and productivity are acceptable, by referring to the graph (relationship between the number of sample points, the correction residual, and the productivity) displayed in the display area DA1. For example, when the mouse pointer is placed over the graph displayed in the display area DA1, a partial area 101 including the position of the mouse pointer is displayed in a specific color by a rollover effect. By clicking the mouse in this state, the user can select the number of sample points corresponding to the partial area 101. Thus, in this embodiment, the display area DA1 functions as an interface for the user to specify the number of sample shot areas.
[0033] Moreover, the screen 60 includes a display area DA2 that displays the arrangement of sample shot areas on the substrate corresponding to the number of sample points specified via the display area DA1, and a map 102 that shows the correction residuals of each of the multiple shot areas on the substrate. In this embodiment, when the number of sample points is specified, the control unit CN determines (optimizes) the arrangement (position) of the sample shot areas corresponding to the specified number of sample points according to a predetermined algorithm. The control unit CN also predicts the correction residuals of each shot area based on a shot arrangement estimated using a regression model from position measurement data obtained by measuring the alignment marks assigned to the determined sample shot areas. The arrangement of the sample shot areas determined in this manner and the predicted correction residuals of each shot area are displayed as the map 102 in the display area DA2.
[0034] FIG. 6 shows a state in which a map 102 showing the arrangement of sample shot areas and the correction residual of each shot area corresponding to the sample points when "16" is specified via a graph displayed in the display area DA1 is displayed in the display area DA2. In FIG. 6, the correction residual (the magnitude) of each shot area is displayed as a vector (arrow). By referring to (checking) the map 102 displayed in the display area DA2, the user can recognize the arrangement of sample shot areas and the correction residual of each shot area corresponding to the specified sample points. However, in the conventional technology (FIG. 6), although the correction residual of each shot area in the specified sample points (conditions) can be recognized, the change from the correction residual of each shot area in the current sample points, that is, the improvement effect, cannot be recognized. Here, the current sample points are the sample points set before the user specifies (changes) the sample points. Thus, in the conventional technology, it is difficult to recognize the change in the correction residual of each shot area for each sample point, and the appropriateness of the specified sample points (change of sample points) cannot be determined.
[0035] Therefore, in this embodiment, a user interface is provided that allows the user to easily recognize the change in the correction residual of each shot area for each number of sample points via the display unit DP.
[0036] FIG. 7 is a diagram showing an example of a screen 70 displayed on the display unit DP as a user interface when the number of sample shot areas is determined in this embodiment. The screen 70 is an interface for providing an index for evaluating the correction residual of each shot area (exposure result in the exposure apparatus 1) provided by the control unit CN. The screen 70 includes a display area DA1 for displaying the relationship between the number of sample shot areas (number of sample points) and the correction residual and productivity, and a display area DA2 for displaying a map 102, as in the conventional technology. However, in this embodiment, in addition to the map 102, the display area DA2 displays a map 103 showing the arrangement of the sample shot areas on the substrate corresponding to the current number of sample points and the correction residuals of each of the multiple shot areas on the substrate. Also, in this embodiment, the display area DA2 further displays a difference map 104 showing the difference (improvement effect) between the correction residual of each shot area shown in the map 102 and the correction residual of each shot area shown in the map 103. In FIG. 7, the difference map 104 shows the magnitude of the difference between the correction residual of each shot area shown in the map 102 and the correction residual of each shot area shown in the map 103 in color, more specifically, in a gradation of color. However, the difference map 104 may show the magnitude of the difference between the correction residual of each shot area shown in the map 102 and the correction residual of each shot area shown in the map 103 in a type of color (hue) instead of in a gradation of color. In this case, for example, by changing the current sample points to a specified sample point number, a shot area in which the correction residual is improved is displayed in blue, and a shot area in which the correction residual is not improved is displayed in red. In this embodiment, the map 103 shows the correction residual predicted from the position measurement data obtained by the alignment optical system 7, for example, the position measurement data of the overlaid target layer, which is the base, but is not limited thereto. The measurement result of the target layer or the measurement result of the overlay after exposure may be shown in the map 103 as the correction residual.
[0037] In this manner, in this embodiment (FIG. 7), it is possible to recognize the correction residuals of each shot area corresponding to the current sample points and the designated sample points, and the improvement effect, which is the difference between them. Therefore, in this embodiment, it is possible to easily recognize the change in correction residuals (improvement effect) for each sample point (condition) for each of the multiple shot areas on the substrate, and it is possible to judge the appropriateness of the designated sample points (change in the sample points).
[0038] In this embodiment, in order to display the screen 70 (FIG. 7) on the display unit DP as a user interface, the control unit CN functions as a prediction unit, a calculation unit, and a display control unit, as described below. As described above, when the number of sample points is specified, the control unit CN acquires the arrangement of the sample shot areas corresponding to the current number of sample points in addition to determining the arrangement of the sample shot areas corresponding to the specified number of sample points according to a predetermined algorithm. Next, the control unit CN functions as a prediction unit, and predicts the correction residuals (exposure results of each area) of each shot area for each of the specified number of sample points and the current number of sample points (multiple conditions different from each other), as described above. As a result, the maps 102 and 103 are generated. In addition, the control unit CN functions as a calculation unit, and calculates the difference between the predicted correction residuals for each of the specified number of sample points and the current number of sample points for each shot area. As a result, a difference map 104, which is the difference between the maps 102 and 103, is generated. The control unit CN functions as a display control unit and controls the display unit DP to display, in parallel, the predicted correction residuals for the designated number of sample points and the current number of sample points for each shot area, and the difference between them. As a result, a screen 70 on which a map 102, a map 103, and a difference map 104 are displayed in parallel as a user interface is displayed on the display unit DP.
[0039] Also, instead of displaying the magnitude of the difference between the correction residual of each shot area shown in the map 102 and the correction residual of each shot area shown in the map 103 with a color, it may be displayed with a vector as shown in FIG. 8. In FIG. 8, the magnitude of the difference between the correction residual of each shot area shown in the map 102 and the correction residual of each shot area shown in the map 103 is displayed with a vector (vector expression shown by an arrow) as the difference map 105. In this way, instead of the difference map 104, the difference map 105 may be displayed in the display area DA2 of the screen 70. This makes it possible to easily recognize the tendency of the change in the correction residual of each shot area for each number of sample points. For example, when a singular point exists on the substrate, the tendency of the change in the correction residual changes only in the shot area where the singular point exists, so it is useful for recognizing the singular point existing on the substrate.
[0040] Also, the magnitude of the difference between the correction residual of each shot area shown in the map 102 and the correction residual of each shot area shown in the map 103 may be displayed in a graph 106 as shown in FIG. 9. For example, as shown in FIG. 10, consider a case where the number of shot areas on the substrate is "66" and each shot area is identified by a shot number. In this case, in the graph 106 shown in FIG. 9, the magnitude of the difference between the correction residual of each shot area shown in the map 102 and the correction residual of each shot area shown in the map 103 is displayed in a graph (numerical value) for each shot number (i.e., for each shot area). Note that the graph 106 also displays the correction residual of each shot area shown in the map 102 and the correction residual of each shot area shown in the map 103 in a graph (numerical value). In this way, instead of the difference map 104 or 105, the graph 106 may be displayed in the display area DA2 of the screen 70. This makes it possible to numerically recognize the tendency of the change in the correction residual of each shot area for each sample point.
[0041] In the embodiment described with reference to FIG. 7 to FIG. 9, the condition designated by the user is described as the number of sample shot areas, but the present invention is not limited to this. For example, the condition designated by the user may be the position of the sample shot areas. Specifically, as shown in FIG. 11, when the positions (arrangement) of some of the sample shot areas shown in the map 102 are arbitrarily changed, a map 107 including the arrangement of the sample shot areas reflecting the change is displayed in the display area DA2. The position of the sample shot area can be changed, for example, by placing the mouse pointer on the target sample shot area and dragging and dropping it. When the position of the sample shot area is changed, the control unit CN predicts the correction residual of each shot area based on the shot arrangement estimated using a regression model from the position measurement data obtained by measuring the alignment marks assigned to the changed sample shot area. The correction residual of each shot area predicted in this way is also displayed on the map 107. In addition, in the display area DA2, a difference map 108 indicating the difference (improvement effect) between the correction residual of each shot area shown in the map 102 and the correction residual of each shot area shown in the map 107 is further displayed. 11, the correction residuals of the shot areas corresponding to the sample shot areas before and after the change in the positions (arrangement) of the sample shot areas and the improvement effect, which is the difference between them, can be recognized. In this way, the conditions designated by the user may be information on the sample shot areas, that is, at least one of the number and positions of the sample shot areas.
[0042] Furthermore, in this embodiment, maps 102 and 103 indicate correction residuals predicted from statistical values (average values, etc.) of position measurement data obtained from each of a plurality of substrates for each of a plurality of mutually different conditions (numbers or positions of sample shot areas). It is also possible to display the correction residuals of each substrate under the same conditions predicted from the position measurement data obtained from each of a plurality of substrates, and the differences therebetween, as a map.
[0043] Further, up to this point, the present invention has been described using as an example the evaluation of information regarding sample shot areas, specifically, correction residuals (improvement effects) for the number and positions of sample shot areas, in fine alignment, but the present invention is not limited to this. For example, the present invention can be applied to evaluation of the positional deviation (improvement effect) in the height direction of each shot area with respect to the focus control parameter for controlling the position in the height direction of the substrate when exposing the substrate. Specifically, the control unit CN predicts the positional deviation in the height direction of each shot area for each of the current (before change) focus control parameter and the designated (after change) focus control parameter. As a result, as shown in FIG. 12, maps 111 and 112 are generated that indicate the positional deviation in the height direction of each shot area corresponding to the current focus control parameter and the designated focus control parameter. In addition, the control unit CN calculates the difference between the predicted positional deviation in the height direction for each of the current focus control parameter and the designated focus control parameter for each shot area. As a result, a difference map 113 that is the difference between the map 111 and the map 112 is generated. Then, the control unit CN controls the display unit DP to display the predicted positional deviation in the height direction for each of the current focus control parameter and the designated focus control parameter and the difference therebetween in parallel for each shot area. As a result, as shown in Fig. 12, a screen 80 in which the map 111, the map 111, and the difference map 113 are displayed in parallel as a user interface is displayed on the display unit DP. Note that in Fig. 12, the positional deviation in the height direction of each shot area and the magnitude of the difference are displayed by color gradation.
[0044] 12, the positional deviation in the height direction of each shot area corresponding to the current focus control parameter and the specified focus control parameter, and the improvement effect, which is the difference between them, can be recognized. Therefore, it is possible to easily recognize the change in positional deviation in the height direction (improvement effect) for each focus control parameter (condition) for each of the multiple shot areas on the substrate, and the validity of the specified focus control parameter can be determined.
[0045] The manufacturing method of the article in the embodiment of the present invention is suitable for manufacturing articles such as semiconductor elements, liquid crystal display elements, flat panel displays, and MEMS. The manufacturing method includes a step of exposing a substrate coated with a photosensitive agent using the above-mentioned exposure apparatus 1, and a step of developing the exposed photosensitive agent. In addition, an etching step, an ion implantation step, and the like are performed on the substrate using the developed photosensitive agent pattern as a mask, and a circuit pattern is formed on the substrate. These steps of exposure, development, etching, and the like are repeated to form a circuit pattern consisting of multiple layers on the substrate. In a post-process, dicing (processing) is performed on the substrate on which the circuit pattern is formed, and chip mounting, bonding, and inspection steps are performed. In addition, the manufacturing method may include other well-known steps (oxidation, film formation, deposition, doping, planarization, resist peeling, etc.). The manufacturing method of the article in the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to the conventional method.
[0046] The present invention can also be realized by a process in which a program for implementing one or more of the functions of the above-described embodiments is supplied to a system or device via a network or a storage medium, and one or more processors in a computer of the system or device read and execute the program. The present invention can also be realized by a circuit (e.g., ASIC) for implementing one or more of the functions.
[0047] The disclosure of this specification includes the following information processing apparatus, exposure apparatus, article manufacturing method, and program.
[0048] (Item 1) An information processing device for controlling a display of a user interface, a prediction unit configured to predict, for each of a plurality of regions of a substrate when the substrate is exposed under a plurality of mutually different conditions, an exposure result for each of the regions; a calculation unit that calculates a difference in an exposure result for each of the plurality of conditions predicted by the prediction unit for each of the plurality of regions; a display control unit that controls the user interface to display, in parallel, the exposure results for each of the plurality of conditions predicted by the prediction unit and the differences calculated by the calculation unit for each of the plurality of regions; and 13. An information processing device comprising:
[0049] (Item 2) the prediction unit predicts a correction residual when correcting a positional deviation of each of the plurality of areas based on an arrangement of the plurality of areas estimated using a regression model from position measurement data obtained by measuring a mark assigned to a sample area among the plurality of areas as a result of the exposure; The condition includes information about the sample area. 2. The information processing device according to item 1,
[0050] (Item 3) 3. The information processing device according to item 2, wherein the information about the sample areas includes at least one of the number and positions of the sample areas.
[0051] (Item 4) the plurality of conditions includes a first number of the sample areas and a second number of the sample areas different from the first number; the first number is the current number of sample regions; the second number being the number of sample regions specified by a user; 4. The information processing device according to item 3.
[0052] (Item 5) 5. The information processing device according to item 4, wherein the user interface includes an interface for specifying the number of sample regions.
[0053] (Item 6) the prediction unit predicts, as a result of the exposure, a positional deviation in the height direction of each of the plurality of regions based on a focus control parameter for controlling a position in the height direction of the substrate when the substrate is exposed; the condition includes the focus control parameter, 2. The information processing device according to item 1,
[0054] (Item 7) The information processing device described in any one of items 1 to 6, characterized in that the display control unit controls the user interface so that the magnitude of the difference calculated by the calculation unit is displayed in color for each of the multiple areas.
[0055] (Item 8) The information processing device described in any one of items 1 to 6, characterized in that the display control unit controls the user interface so that the magnitude of the difference calculated by the calculation unit is displayed as a vector for each of the multiple areas.
[0056] (Item 9) The information processing device described in any one of items 1 to 6, characterized in that the display control unit controls the user interface so that the magnitude of the difference calculated by the calculation unit is displayed in a graph for each of the multiple areas.
[0057] (Item 10) An exposure apparatus for exposing a substrate, comprising: A processing unit for controlling display of a user interface, The processing unit includes: a prediction unit that predicts an exposure result of each of a plurality of regions of the substrate when the regions are exposed under each of a plurality of mutually different conditions; a calculation unit that calculates a difference in an exposure result for each of the plurality of conditions predicted by the prediction unit for each of the plurality of regions; a display control unit that controls the user interface to display, in parallel, the exposure results for each of the plurality of conditions predicted by the prediction unit and the differences calculated by the calculation unit for each of the plurality of regions; and An exposure apparatus comprising:
[0058] (Item 11) Exposing a substrate using the exposure apparatus according to item 10; developing the exposed substrate; producing an article from the developed substrate; A method for producing an article, comprising the steps of:
[0059] (Item 12) A program that causes a computer to function as each part of the information processing device according to any one of items 1 to 9.
[0060] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]
[0061] 1: Exposure device 70: Screen 102: Map 103: Map 104: Difference map CN: Control unit DP: Display unit
Claims
1. An information processing device for controlling a display of a user interface, a prediction unit configured to predict, for each of a plurality of regions of a substrate when the substrate is exposed under a plurality of mutually different conditions, an exposure result for each of the regions; a calculation unit that calculates a difference in an exposure result for each of the plurality of conditions predicted by the prediction unit for each of the plurality of regions; a display control unit that controls the user interface to display, in parallel, the exposure results for each of the plurality of conditions predicted by the prediction unit and the differences calculated by the calculation unit for each of the plurality of regions; and 13. An information processing device comprising:
2. the prediction unit predicts a correction residual when correcting a positional deviation of each of the plurality of areas based on an arrangement of the plurality of areas estimated using a regression model from position measurement data obtained by measuring a mark assigned to a sample area among the plurality of areas as a result of the exposure; The condition includes information about the sample area.
2. The information processing apparatus according to claim 1,
3. The information processing apparatus according to claim 2 , wherein the information relating to the sample regions includes at least one of the number and positions of the sample regions.
4. the plurality of conditions includes a first number of the sample areas and a second number of the sample areas different from the first number; the first number is the current number of sample regions; the second number being the number of sample regions specified by a user; 4. The information processing apparatus according to claim 3.
5. The information processing apparatus according to claim 4 , wherein the user interface includes an interface for designating the number of the sample regions.
6. the prediction unit predicts, as a result of the exposure, a positional deviation in the height direction of each of the plurality of regions based on a focus control parameter for controlling a position in the height direction of the substrate when the substrate is exposed; the condition includes the focus control parameter, 2. The information processing apparatus according to claim 1,
7. The information processing device according to claim 1 , wherein the display control unit controls the user interface so that the magnitude of the difference calculated by the calculation unit is displayed in a color for each of the plurality of regions.
8. The information processing device according to claim 1 , wherein the display control unit controls the user interface so that the magnitude of the difference calculated by the calculation unit is displayed as a vector for each of the plurality of regions.
9. The information processing apparatus according to claim 1 , wherein the display control unit controls the user interface so that the magnitude of the difference calculated by the calculation unit is displayed in the form of a graph for each of the plurality of regions.
10. An exposure apparatus for exposing a substrate, comprising: A processing unit for controlling display of a user interface, The processing unit includes: a prediction unit that predicts an exposure result of each of a plurality of regions of the substrate when the regions are exposed under each of a plurality of mutually different conditions; a calculation unit that calculates a difference in an exposure result for each of the plurality of conditions predicted by the prediction unit for each of the plurality of regions; a display control unit that controls the user interface to display, in parallel, the exposure results for each of the plurality of conditions predicted by the prediction unit and the differences calculated by the calculation unit for each of the plurality of regions; and An exposure apparatus comprising:
11. exposing a substrate using the exposure apparatus according to claim 10; developing the exposed substrate; producing an article from the developed substrate; A method for producing an article, comprising the steps of:
12. A program for causing a computer to function as each unit of the information processing device according to any one of claims 1 to 9.
Citation Information
Patent Citations
Alignment of position
JP1987084516A
Alignment method
JP1994349705A
ALIGNMENT METHOD, ALIGNMENT APPARATUS, EXPOSURE METHOD AND EXPOSURE APPARATUS
JP3230271B2