Wafer housing container washing device

Abstract

To effectively washing and drying a wafer housing container.SOLUTION: A wafer housing container washing device according to an embodiment includes a washing tank for washing a wafer housing container. The washing tank houses a main body of the wafer housing container, and includes: a tank that can be opened and closed by an opening / closing lid via a hinge; a door holding part that is provided to the opening / closing lid, and holds a door of the wafer housing container; a washing nozze that supplies a washing liquid to the main body and the door; a rotational mechanism that rotates the main body and the door; a circular frame that is provided to surround an outside of the door, and has a height for covering part of a thickness of the door when the opening / closing lid is in a closing state; and an inclination cover that is provided to a position on the side opposite to the hinge while nipping the circular frame of the opening / closing lid when the opening / closing lid is in the closing state, is provided so as to be inclined so as to becomes higher toward the circular frame, and guides the washing liquid supplied to the door and scattered. An end part on the side where the hinge of the inclination cover is provided is provided to a position where the washing liquid is guided to the side surface of the circular frame when the opening / closing lid changes from the closing state to an opening state.SELECTED DRAWING: Figure 8

Description

[Technical field]

[0001] SUMMARY OF THE DISCLOSURE An embodiment of the present invention relates to a wafer container cleaning apparatus. [Background technology]

[0002] 2. Description of the Related Art Conventionally, there is a wafer container cleaning apparatus that performs various processes such as cleaning and drying on wafer containers such as front opening unified pods (FOUPs) and front opening shipping boxes (FOSBs) that accommodate semiconductor wafers.

[0003] For example, there is a wafer storage container cleaning device in which a FOUP body is placed inside a tank for cleaning and drying the FOUP, and the FOUP door is held by a door holder attached to a lid that is arranged to be able to open and close the opening of the tank, and liquid is discharged onto the FOUP body and door inside the tank to clean the FOUP body and door, and gas is sprayed inside the tank to dry the FOUP body and door.

[0004] In such equipment, after the FOUP body and door have been dried in the tank, the tank lid is opened and the FOUP body and door are removed from the tank by a robot. Water droplets generated during cleaning may not completely dry and remain inside the tank (including the lid). In this case, when the tank lid is opened, the water droplets on the lid may fall into the tank and adhere to the FOUP body. In this way, water droplets adhering to the FOUP after the drying process may cause contamination of the FOUP or contamination inside the wafer container cleaning equipment. If the FOUP becomes contaminated, it must be cleaned again, which reduces the cleaning efficiency. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2005-109523 A Summary of the Invention [Problem to be solved by the invention]

[0006] The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a wafer container cleaning apparatus that can efficiently clean and dry a wafer container. [Means for solving the problem]

[0007] In order to solve the above-mentioned problems and achieve the object, a wafer storage container cleaning apparatus according to one aspect of the present invention is a wafer storage container cleaning apparatus for cleaning a wafer storage container having a main body having a storage space for storing semiconductor wafers, the storage space being in communication with an opening, and a door that is detachable from the opening, the wafer storage container having a cleaning tank for cleaning the wafer storage container, the cleaning tank having a main body storage area for accommodating the main body, and having an inlet / outlet at an upper portion that can be opened and closed by an opening / closing lid via a hinge, a door holding part provided on the opening / closing lid and holding the door, the main body accommodated in the main body storage area, and a cleaning nozzle that supplies cleaning liquid to the door held by the door holding part, a rotation mechanism for rotating the main body and the door, and a door that does not interfere with the door rotated by the rotation mechanism. a circular frame that is disposed at a position not including the hinge and that surrounds the outside of the door held by the door holding portion, and has a height that covers part of the thickness of the door held by the door holding portion when the opening / closing lid is in a closed state; and a slanted cover that is disposed at a position on the opening / closing lid opposite the hinge across the circular frame when the opening / closing lid is in a closed state, and is slanted so that an end portion opposite the hinge is lowest and is higher toward the circular frame, and that guides the cleaning liquid that is supplied from the cleaning nozzle to the door held by the door holding portion and splashed thereon, and the end portion of the slanted cover on the side where the hinge is provided is disposed at a position that guides the cleaning liquid to the side of the circular frame when the opening / closing lid transitions from a closed state to an open state, and is configured to have a portion that overlaps with the circular frame in a side view. Effect of the Invention

[0008] According to one aspect of the present invention, it is possible to provide a wafer container cleaning apparatus capable of efficiently cleaning and drying a wafer container. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a plan view showing an example of a schematic configuration of a wafer container cleaning apparatus according to an embodiment. [Diagram 2] FIG. 2 is a perspective view showing the internal structure of the cleaning tank according to the embodiment. [Diagram 3] FIG. 3 is a perspective view of the cleaning tank according to the embodiment when the opening / closing lid is in an open state (when the opening / closing lid is open). [Figure 4] FIG. 4 is a side view showing the internal structure of the cleaning tank 5 according to the embodiment when the opening / closing lid of the cleaning tank is in an open state. [Diagram 5] FIG. 5 is a diagram showing an example of the internal structure of the cleaning tank according to the embodiment when the cleaning tank is in the middle of cleaning. [Figure 6] FIG. 6 is a diagram for explaining the cleaning position and standby position of the cleaning nozzle extending in the horizontal direction, and the drying position and standby position of the drying nozzle extending in the horizontal direction according to the embodiment. [Figure 7] FIG. 7 is a side view showing the internal structure of the cleaning tank 5 according to the embodiment when the opening / closing lid of the cleaning tank is in an open state. [Figure 8] FIG. 8 is a perspective view of the inclined cover as viewed from below. [Figure 9] FIG. 9 is a side view of the inclined cover according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment of a wafer storage container cleaning apparatus disclosed in the present application will be described in detail with reference to the attached drawings. Note that the wafer storage container cleaning apparatus disclosed in the present application is not limited to the following embodiment. In the following embodiment, a case will be described in which a wafer storage container that is the target of various processes such as cleaning and drying is a FOUP, but the wafer storage container that is the target of various processes is not limited to this. For example, the wafer storage container that is the target of various processes may be a FOSB.

[0011] (Embodiment) 1 is a plan view showing an example of a schematic configuration of a wafer container cleaning apparatus 1 according to an embodiment. The wafer container cleaning apparatus 1 is installed, for example, in a factory that manufactures semiconductor wafers, and cleans wafer containers and dries the cleaned wafer containers.

[0012] As shown in FIG. 1, the wafer container cleaning apparatus 1 includes a load port 2, a robot 3, a buffer (disassembly / connection stage) 4, a cleaning tank 5, a drying tank 6, an unload port 7, and a control unit 8.

[0013] The robot 3, the buffer 4, the cleaning tank 5, the drying tank 6 and the control unit 8 are provided inside the casing 1a of the wafer container cleaning apparatus 1. On the other hand, the load port 2 and the unload port 7 are provided across both the inside and the outside of the casing 1a of the wafer container cleaning apparatus 1.

[0014] The load port 2 carries the FOUP 20 to be cleaned and dried, which is placed on the outside of the casing 1a of the load port 2, into the inside of the casing 1a. The FOUP 20 includes a FOUP body (shell) 20a and a door (lid) 20b. The FOUP body 20a has an opening (FOUP body opening) and a storage space for storing semiconductor wafers. The storage space is located inside the FOUP body opening and communicates with the FOUP body opening. The door 20b can be disassembled / connected to the FOUP body 20a, and when connected to the FOUP body 20a, the door 20b is attached to the FOUP body opening in a state in which it can be opened and closed. That is, the door 20b is detachable from the FOUP body opening. The FOUP body 20a is an example of a body. The FOUP body 20a is provided with a flange 20c. The flange 20c is a portion that is gripped (held) when the FOUP 20 is transported by an OHT (Overhead Hoist Transport) or a robot 3, and is provided on a surface of the FOUP body 20a that intersects with a surface having the FOUP body opening.

[0015] For example, the FOUP 20 transported by the OHT is placed on the load port 2 at a portion outside the casing 1a. For example, as shown in FIG. 1, the FOUP 20 is placed so that the door 20b of the FOUP 20 faces a shutter 2a provided at the opening 1b of the casing 1a. When the FOUP 20 is placed on the load port 2 in this manner, the shutter 2a rises. This allows the FOUP 20 to be carried into the casing 1a from the opening 1b. That is, the FOUP 20 is allowed to be carried into the wafer container cleaning apparatus 1. The FOUP 20 is then slid in the direction of the arrow 2b by the slide device of the load port 2. This allows the FOUP 20 to be carried into the casing 1a.

[0016] Sliding by the sliding device will be described. For example, a pin provided on the sliding device is inserted into a hole provided on the bottom (mounting surface) of the FOUP 20, and the mounting surface of the FOUP 20 is fixed to the sliding device. In this state, the sliding device is slid in the direction of the arrow 2b, and the FOUP 20 is also slid along with the movement of the sliding device. As a result, the FOUP 20 is placed on a predetermined portion inside the casing 1a of the load port 2. When the FOUP 20 is thus carried into the inside of the casing 1a, the shutter 2a descends and the opening 1b of the casing 1a is closed. The sliding device descends together with the pin to a position lower than the lower end of the shutter 2a (the mounting surface of the FOUP 20) and returns to the original position outside the casing 1a.

[0017] The robot 3 transports the FOUP 20 to each section while gripping the flange 20c of the FOUP 20. The robot 3 is equipped with a robot arm 3a and a robot hand 3b (the gripping section of the robot 3). The robot 3 transports the FOUP 20 to each section by extending and retracting the robot arm 3a and rotating it while the robot hand 3b grips the flange 20c. When the robot 3 transports the door 20b alone that has been separated (disassembled) from the FOUP body 20a, it transports it by gripping both sides of the door 20b.

[0018] The buffer 4 is a placement table on which the FOUP 20 is placed, and disassembles (separates) the FOUP 20 into a FOUP body 20a and a door 20b, and connects the FOUP body 20a and the door 20b. For example, the FOUP 20 that has been brought into the casing 1a is transported to the buffer 4 by the robot 3. In this case, the buffer 4 disassembles the FOUP 20 into the FOUP body 20a and the door 20b. Note that disassembly can be rephrased as unlocking, and connection can be rephrased as locking.

[0019] The cleaning tank 5 is a tank for cleaning the FOUP 20. For example, the FOUP body 20a and the door 20b are separately transported to the cleaning tank 5 by the robot 3. The cleaning tank 5 performs a cleaning process on the FOUP 20 while the FOUP body 20a and the door 20b are separately held. That is, the cleaning tank 5 cleans the storage space while the FOUP body 20a and the door 20b are separated. For example, the cleaning tank 5 cleans the FOUP 20 by supplying (discharging) a cleaning liquid (e.g., pure water) to each of the FOUP body 20a and the door 20b from a cleaning nozzle while rotating the door 20b and the FOUP body 20a by a rotation mechanism while the door 20b is held by the opening / closing lid of the cleaning tank 5 and the tank of the cleaning tank 5 holds the FOUP body 20a. In addition, in the cleaning tank 5, the FOUP opening of the FOUP body 20a is arranged facing downward in consideration of the dischargeability of the cleaning liquid.

[0020] Once cleaning of the FOUP 20 is complete in the cleaning tank 5, the FOUP body 20a and door 20b are then rotated in the cleaning tank 5 and dried by blowing dry air onto them using a drying nozzle (air nozzle). The drying in the cleaning tank 5 here is a process (temporary drying) for removing the cleaning liquid adhering to the FOUP 20. Once the temporary drying of the FOUP 20 is complete in the cleaning tank 5, the robot 3 transports the FOUP body 20a and door 20b in the cleaning tank 5 separately to the drying tank 6.

[0021] The drying tank 6 is a device that vacuum dries (mainly dries) the FOUP 20. When the vacuum drying of the FOUP 20 is completed in the drying tank 6, the robot 3 transfers the FOUP body 20a and the door 20b in the drying tank 6 separately onto the buffer 4. Then, the buffer 4 connects the FOUP body 20a and the door 20b together.

[0022] The unload port 7 carries out the cleaned and vacuum-dried FOUP 20 placed by the robot 3 in the portion of the unload port 7 inside the casing 1a to the outside of the casing 1a.

[0023] For example, the FOUP 20 is transferred by the robot 3 to the inside of the casing 1a of the unload port 7 after the vacuum drying process and placed thereon. When the FOUP 20 is placed on the unload port 7 in this way, the shutter 7a provided at the opening 1c of the casing 1a rises. This allows the FOUP 20 to be transported from the opening 1c to the outside of the casing 1a. That is, the FOUP 20 is in a state where it can be transported to the outside of the wafer container cleaning apparatus 1. Then, the FOUP 20 is slid in the direction of the arrow 7b by the slide device of the unload port 7 (having a mechanism similar to that of the slide device of the load port 2), and the FOUP 20 is transported to the outside of the casing 1a. When the FOUP 20 is transported to the outside of the casing 1a in this way, the shutter 7a descends and the opening 1c of the casing 1a is closed.

[0024] The control unit 8 controls the overall operation of the wafer container cleaning apparatus 1. For example, the control unit 8 controls the load port 2, the robot 3, the buffer 4, the cleaning tank 5, the drying tank 6, and the unload port 7 to operate the load port 2, the robot 3, the buffer 4, the cleaning tank 5, the drying tank 6, and the unload port 7 as described above.

[0025] For example, the control unit 8 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), a HDD (Hard Disk Drive), and a communication interface, all of which are connected via an internal bus.

[0026] The CPU executes various processes while using the memory area of ​​the RAM as a temporary storage area for data used in the various processes. The ROM and HDD store programs for executing the various processes described above, as well as various databases and tables used when executing the various processes. The communication interface is an interface for communicating with the above-mentioned components of the wafer container cleaning apparatus 1 and for communicating with external devices connected to the wafer container cleaning apparatus 1 via a network. For example, the communication interface is a network interface card.

[0027] Next, an example of the configuration of the cleaning tank 5 according to the present embodiment will be described. FIGS. 2 to 5 are diagrams showing an example of the configuration of the cleaning tank 5 according to the embodiment. FIG. 2 is a perspective view showing the internal structure of the cleaning tank 5 according to the embodiment. FIG. 3 is a perspective view of the cleaning tank 5 according to the embodiment when the openable / closable lid 52 is in an open state (open state of the openable / closable lid 52). FIG. 4 is a side view showing an example of the internal structure of the cleaning tank 5 when the openable / closable lid 52 of the cleaning tank 5 according to the embodiment is in an open state. FIG. 5 is a diagram showing an example of the internal structure of the cleaning tank 5 when the cleaning tank 5 according to the embodiment is being cleaned. In each of FIGS. 2 to 5, for convenience of explanation, the illustration of the members constituting the cleaning tank 5 is omitted as appropriate. For example, in FIG. 2, the illustration of the openable / closable lid 52 of the cleaning tank 5 is omitted. In addition, the X direction, the Y direction, and the Z direction in FIG. 2 represent three directions perpendicular to each other. The X direction is a direction parallel to the rotation axis of the hinge 51c described later, the Y direction is a direction perpendicular to the X direction in a horizontal plane, and the Z direction is a direction perpendicular to the X direction and the Y direction.

[0028] As shown in Figures 2 to 5, the cleaning tank 5 includes a tank 51, an opening / closing lid 52, rotating mechanisms 53a, 53b, a cleaning nozzle 54, a drying nozzle 55, a guide plate 56, a first eaves 57, a second eaves 58, a slanted cover 59 (see Figure 8), and a drain outlet 60.

[0029] The vat 51 is configured to be able to accommodate the FOUP body 20a and the door 20b when the opening / closing lid 52 is in a closed state (a state in which the opening / closing lid 52 is closed). For example, the vat 51 has a body accommodating area 51a and a loading / unloading opening 51b as shown in FIG. 2. The body accommodating area 51a is an area (space) capable of accommodating the FOUP body 20a. The loading / unloading opening 51b is an opening of the vat 51 through which the FOUP body 20a passes when the FOUP body 20a is loaded into or unloaded from the vat 51 by the robot 3. The body accommodating area 51a communicates with the loading / unloading opening 51b and is located inside the loading / unloading opening 51b.

[0030] Further, the tank 51 is provided with a hinge 51c and an air cylinder 51d (see FIG. 4), and an opening / closing lid 52 is attached via the hinge 51c.

[0031] The opening / closing lid 52 is attached to the tank 51 via a hinge 51c. The air cylinder 51d operates under the control of the control unit 8, thereby operating the hinge 51c, and the opening / closing lid 52 opens and closes with respect to the loading / unloading opening 51b of the tank 51 in conjunction with the operation of the hinge 51c. The opening / closing lid 52 is in a closed state while the FOUP 20 is being washed and dried, and is in an open state when the FOUP 20 is being loaded into the tank 51 or unloaded from the tank 51. The opening / closing lid 52 is provided with a door holder 52a that holds the door 20b.

[0032] 2, the rotation mechanism 53a is a mechanism that rotates the FOUP body 20a placed in the body accommodating area 51a. For example, the rotation mechanism 53a rotates the turntable in the body accommodating area 51a with the FOUP body 20a placed on the turntable, thereby rotating the FOUP body 20a in conjunction with the rotation of the turntable. The rotation mechanism 53a rotates the FOUP body 20a while the FOUP body 20a is being washed and while the FOUP body 20a is being dried. The rotation mechanism 53a includes, for example, a motor as a drive source that rotates the turntable.

[0033] As shown in FIG. 4, the rotation mechanism 53b is a mechanism for rotating the door 20b held by the door holding part 52a. For example, as shown in FIG. 5, the rotation mechanism 53b rotates the door 20b by rotating the rotation part 52b that holds both the door holding part 52a and the door 20b around a rotation axis 53c that extends perpendicularly to the two main surfaces of the door 20b as the rotation center in a state in which the door 20b is held by the door holding part 52a (see FIG. 4). When the opening / closing lid 52 is in a closed state, the two main surfaces of the door 20b are parallel to the horizontal plane. Therefore, when the opening / closing lid 52 is in a closed state, the rotation axis 53c is an axis that extends perpendicularly to the horizontal plane. The rotation mechanism 53b rotates the door 20b while the FOUP body 20a is being washed and while the FOUP body 20a is being dried. The rotation mechanism 53b includes, for example, a motor as a drive source that rotates the rotation part 52b.

[0034] The cleaning nozzle 54 has a plurality of types of nozzles each having a different discharge direction (see FIG. 2), and cleans the FOUP 20 (FOUP body 20a and door 20b) by supplying (discharging) a cleaning liquid to the FOUP body 20a accommodated in the body accommodation area 51a and the door 20b held by the door holding portion 52a. As shown in FIG. 2, the cleaning nozzle 54 has two nozzles extending in the horizontal direction (X direction in the example of FIG. 2) and one nozzle extending in the Z direction. One of the cleaning nozzles 54 extending in the horizontal direction supplies the cleaning liquid toward the door 20b, and the other supplies the cleaning liquid toward the FOUP body 20a. The cleaning nozzle 54 extending in the Z direction supplies the cleaning liquid toward the FOUP body 20a. The cleaning nozzle 54 is connected to a cleaning liquid supply device (cleaning liquid supply device) not shown. The cleaning nozzle 54 supplies the cleaning liquid supplied from the cleaning liquid supply device to the FOUP body 20a and the door 20b.

[0035] When the cleaning nozzle 54 cleans the FOUP 20, first, the moving mechanism for moving the cleaning nozzle 54 moves the cleaning nozzle 54, which extends horizontally, to a cleaning position P1 (see FIG. 6B) at which the cleaning nozzle 54 can supply cleaning liquid to the FOUP body 20a and the door 20b. Then, at the cleaning position P1, the cleaning nozzle 54 discharges cleaning liquid to the FOUP body 20a and the door 20b being rotated by the rotation mechanisms 53a and 53b. The cleaning nozzle 54 performs such a cleaning process for a predetermined time. Then, after the cleaning process is completed, the moving mechanism moves the cleaning nozzle 54 to a standby position P2 (see FIG. 6A). Here, the cleaning position P1 is the position of the cleaning nozzle 54 during the cleaning process, and the standby position P2 is the position for the cleaning nozzle 54 that is not performing the cleaning process to wait. Note that the cleaning position P1 is not a single point position, but an area of ​​a certain size. FIG. 2 shows the cleaning nozzle 54 at the standby position P2.

[0036] The drying nozzle 55 has a plurality of types of nozzles each having a different discharge direction (see FIG. 2), and temporarily dries the FOUP 20 (FOUP body 20a and door 20b) by blowing dry air to the FOUP body 20a accommodated in the body accommodation area 51a and the door 20b held by the door holding part 52a. As shown in FIG. 2, the drying nozzle 55 has two nozzles extending in the horizontal direction (Y direction in the example of FIG. 2) and one nozzle extending in the Z direction. One of the drying nozzles 55 extending in the horizontal direction blows dry air toward the door 20b, and the other blows dry air toward the FOUP body 20a. The drying nozzle 55 extending in the Z direction blows dry air toward the FOUP body 20a. The drying nozzle 55 is connected to a dry air supply device (dry air supply device) not shown. The drying nozzle 55 supplies dry air supplied from the dry air supply device to the FOUP body 20a and the door 20b.

[0037] When the drying nozzle 55 dries the FOUP 20, first, a moving mechanism for moving the drying nozzle 55 moves the drying nozzle 55, which extends horizontally, to a drying position where the drying nozzle 55 can blow dry air to the FOUP body 20a and the door 20b. Then, at the drying position, the drying nozzle 55 blows dry air to the FOUP body 20a and the door 20b being rotated by the rotation mechanisms 53a and 53b. The drying nozzle 55 performs such a drying process for a predetermined time. Then, after the drying process is completed, the moving mechanism moves the drying nozzle 55 to a standby position. That is, the drying position is a position of the drying nozzle 55 during the drying process, and the standby position is a position for the drying nozzle 55 not during the drying process to wait. The drying position is an area within a certain size range. FIG. 2 shows the drying nozzle 55 at the standby position.

[0038] 6A to 6C are diagrams for explaining the cleaning position and standby position of the cleaning nozzle 54 extending horizontally as described above, and the drying position and standby position of the drying nozzle 55 extending horizontally. Note that (A) to (C) of FIG. 6 are top views of the cleaning tank 5 in which the FOUP body 20a is stored in the body storage area 51a, but the opening / closing lid 52 of the cleaning tank 5 and the like are omitted in (A) to (C) of FIG. 6. (A) of FIG. 6 shows a state in which the cleaning nozzle 54 is located at standby position P2 and the drying nozzle 55 is located at standby position P4. When the FOUP body 20a is carried into the tank 51, both the cleaning nozzle 54 and the drying nozzle 55 are located at their standby positions as shown in (A) of FIG. 6.

[0039] 6B shows a state in which the cleaning nozzle 54 is located at the cleaning position P1 and the drying nozzle 55 is located at the standby position P4. When the cleaning nozzle 54 supplies cleaning liquid to the FOUP body 20a and the door 20b to perform cleaning, the cleaning nozzle 54 and the drying nozzle 55 are located at the positions shown in FIG.

[0040] 6(C) shows a state in which the cleaning nozzle 54 is located at the standby position P2 and the drying nozzle 55 is located at the drying position P3. When the drying nozzle 55 is blowing dry air onto the FOUP body 20a and the door 20b to dry them, the cleaning nozzle 54 and the drying nozzle 55 are located at the positions shown in FIG. 6(C).

[0041] That is, the standby positions of the cleaning nozzle 54 and the drying nozzle 55 are positions where the nozzles do not interfere with the FOUP body 20a when the FOUP body 20a is carried in and out of the tank 51. Furthermore, the cleaning position of the cleaning nozzle 54 and the drying position of the drying nozzle 55 are positions where cleaning liquid or dry air can be supplied to at least a portion of the stationary FOUP body 20a, and where the cleaning liquid or dry air is supplied to the entire FOUP body 20a as the FOUP body 20a rotates.

[0042] 4 and 5, guide plate 56 is provided on the hinge 51c (see FIG. 4) side of opening / closing lid 52, and is a member for guiding the cleaning liquid (droplets of cleaning liquid) adhering to opening / closing lid 52 to the wall surface of tank 51. In other words, guide plate 56 guides the cleaning liquid from opening / closing lid 52 to the wall surface of tank 51.

[0043] 5, one end 56_1 of the guide plate 56 is provided on the opening / closing lid 52. The guide plate 56 has a first vertical portion 56a, a first inclined portion 56b, a second vertical portion 56c, and a second inclined portion 56d, which are arranged in this order in a direction extending from the one end 56_1 of the guide plate 56.

[0044] 5, the surface of the first vertical portion 56a facing the door 20b and the surface of the second vertical portion 56c facing the door 20b are perpendicular to the horizontal plane when the opening / closing cover 52 is in the closed state. That is, the first vertical portion 56a and the second vertical portion 56c form surfaces perpendicular to the horizontal plane when the opening / closing cover 52 is in the closed state.

[0045] As shown in Fig. 5, the first inclined portion 56b is provided at a height position where the cleaning liquid splashed from the door 20b held by the door holding portion 52a and rotated by the rotation mechanism 53b hits when the opening / closing lid 52 is in the closed state. That is, the first inclined portion 56b is provided so that when the opening / closing lid 52 is in the closed state, a position where the cleaning liquid splashed by the centrifugal force from the door 20b hits is included between the upper end and the lower end of the first inclined portion 56b in the Z direction. The first inclined portion 56b has a surface that is inclined so that the upper end of the first inclined portion 56b is located closer to the inside of the tank 51 (the side of the rotation mechanism 53b (see Fig. 4)) than the lower end of the first inclined portion 56b when the opening / closing lid 52 is in the closed state.

[0046] 5, the first inclined portion 56b receives the cleaning liquid scattered in the centrifugal direction from the door 20b which rotates to receive the cleaning liquid supplied from the cleaning nozzle 54. Since the surface of the first inclined portion 56b facing the door 20b is inclined as described above, even if the first inclined portion 56b receives the cleaning liquid scattered from the door 20b, it is possible to prevent the cleaning liquid from being reflected toward the FOUP body 20a.

[0047] 5, the first inclined portion 56b may be provided at a height position where the cleaning liquid splashed from the end portion (edge ​​portion) 52b_1 of the rotating portion 52b collides when the opening / closing lid 52 is in the closed state. That is, the first inclined portion 56b is provided so that the height position of the end portion 52b_1 of the rotating portion 52b is included between the upper end and the lower end of the first inclined portion 56b in the height direction when the opening / closing lid 52 is in the closed state. Therefore, even if the first inclined portion 56b receives the cleaning liquid splashed from the end portion 52b_1 of the rotating portion 52b, it is possible to suppress the cleaning liquid from being reflected toward the FOUP body 20a, similar to the case where the first inclined portion 56b receives the cleaning liquid splashed from the door 20b.

[0048] The second inclined portion 56d is a member for preventing the cleaning liquid adhering to the opening / closing lid 52 and door 20b from dripping onto the FOUP body 20a when the opening / closing lid 52 is opened (when the opening / closing lid 52 transitions from a closed state to an open state) after cleaning and drying are completed in the cleaning tank 5, and for guiding the cleaning liquid adhering to the opening / closing lid 52 and door 20b to the wall surface of the tank 51.

[0049] The length of the second inclined portion 56d in the Z direction in the direction in which the second inclined portion 56d is inclined is such that when the open / close lid 52 of the tank 51 is in a closed state as shown in FIG. 5, the second inclined portion 56d does not interfere with the first eaves 57, the second eaves 58, the cleaning nozzle 53, the drying nozzle 54, etc., which will be described later. FIG. 7 is a side view showing the internal structure of the cleaning tank 5 when the open / close lid 52 of the cleaning tank 5 according to the embodiment is in an open state. Note that FIG. 7 is a view showing a case where the open / close lid 52 is opened 90 degrees with respect to a plane including the loading / unloading port 51b of the tank 51. The length of the second inclined portion 56d in the direction in which the second inclined portion 56d is inclined is also such that when the open / close lid 52 is opened 90 degrees as shown in FIG. 7, the cleaning liquid adhering to the open / close lid 52 and the door 20b does not leak out of the tank 51, but drips onto the first eaves 57 and the second eaves 58 installed in the tank 51.

[0050] In addition, when the opening / closing lid 52 is opened at 45 degrees as shown in FIG. 4, the connection portion between the second inclined portion 56d and the second vertical portion 56c is bent away from the FOUP body 20a side so that the cleaning liquid adhering to the opening / closing lid 52 and the door 20b does not drip onto the FOUP body 20a. Specifically, when the opening / closing lid 52 is opened at 45 degrees as shown in FIG. 4, the surface of the second inclined portion 56d on the door 20b side becomes a surface perpendicular to the horizontal plane. That is, when the opening / closing lid 52 is opened at 45 degrees, the second inclined portion 56d has a surface perpendicular to the horizontal plane. Note that a wall for preventing dripping of water droplets can be provided on the portion of the guide plate 56 that is located outside the tank 51 when the opening / closing lid 52 is opened at 90 degrees. That is, a pair of walls that rise vertically from each surface can be provided on the first vertical portion 56a, the first inclined portion 56b, and the second vertical portion 56c, as shown in FIG. 7. Even when the opening / closing lid 52 is in the 90 degree open state, the second inclined portion 56d, which is positioned so as to overlap the tank 51 in a plan view, does not need to be provided with a wall.

[0051] Furthermore, the guide plate 56 can be provided on the opening / closing lid 52 so that the end of the second inclined portion 56d opposite to the above-mentioned one end 56_1 (see FIG. 5) is located above the first eaves 57 and the second eaves 58, whether the opening / closing lid 52 is in the closed state or the open state. This allows the cleaning liquid to drip from the guide plate 56 onto the first eaves 57 and the second eaves 58, whether the opening / closing lid 52 is in the closed state, the 45 degree open state, or the 90 degree open state.

[0052] The first eaves 57 is a member for receiving the cleaning liquid dripping from the guide plate 56, i.e., the cleaning liquid running down the guide plate 56, and guiding the cleaning liquid to the wall surface of the tank 51. The first eaves 57 is a flat plate-shaped member and is provided below the guide plate 56. One end of the first eaves 57 is provided on the wall surface of the tank 51. The first eaves 57 is inclined so that the height position becomes higher from one end of the first eaves 57 to the other end. That is, the first eaves 57 is inclined so that the other end is higher than the one end. In addition, a hole 57a through which the cleaning liquid can pass is formed between one end of the first eaves 57 and the wall surface of the tank 51 (see FIG. 4). Therefore, when the first eaves 57 receives the cleaning liquid dripping from the guide plate 56, the cleaning liquid advances on the first eaves 57 toward the hole 57a and passes through the hole 57a.

[0053] The second eaves 58 is a member for more reliably guiding the cleaning liquid dripping from the guide plate 56 to the wall surface of the tank 51. Like the first eaves 57, the second eaves 58 is a member for receiving the cleaning liquid running down the guide plate 56 and guiding the cleaning liquid to the wall surface of the tank 51. Like the first eaves 57, the second eaves 58 is a flat plate-shaped member and is provided below the guide plate 56. However, when the cleaning nozzle 54 is located at the standby position 54b, the second eaves 58 is provided above the cleaning nozzle 54. Therefore, when the cleaning nozzle 54 does not supply the cleaning liquid, it waits at the standby position 54b provided between the second eaves 58 and the first eaves 57.

[0054] One end of the second eaves 58 is provided on the wall surface of the tank 51. The second eaves 58 is inclined so that the height position becomes higher from one end of the second eaves 58 to the other end. That is, the second eaves 58 is inclined so that the other end is higher than the one end. In addition, a hole 58a through which the cleaning liquid can pass is formed between one end of the second eaves 58 and the wall surface of the tank 51 (see FIG. 4). Therefore, when the second eaves 58 receives the cleaning liquid dripping from the guide plate 56, the cleaning liquid advances on the second eaves 58 toward the hole 58a and passes through the hole 58a. It is also possible to provide only the first eaves 57 without providing the second eaves 58. When the second eaves 58 is provided, the cleaning liquid can be more reliably guided to the wall surface of the tank 51.

[0055] The cleaning liquid having passed through the holes 57a of the first eaves 57 and the holes 58a of the second eaves 58 runs down the wall of the tank 51 and reaches the bottom surface 51e of the tank 51 (see Figs. 2 and 4). The cleaning liquid that has reached the bottom surface 51e is discharged (drained) from a drainage port 60 (see Figs. 2 and 4) provided on the bottom surface 51e through a pipe (not shown) to the outside of the tank 51. The drainage port 60 is provided on the opposite side of the bottom surface 51e from the side where the guide plate 56 is located. The bottom surface 51e is inclined so as to gradually become lower from the side where the guide plate 56 is located to the drainage port 60. Therefore, the cleaning liquid that has reached the bottom surface 51e or the cleaning liquid that has fallen onto the bottom surface 51e flows toward the drainage port 60. For this reason, in this embodiment, the cleaning liquid that has fallen onto the bottom surface 51e is discharged without accumulating on the bottom surface 51e.

[0056] Fig. 8 and Fig. 9 are diagrams showing an example of the inclined cover 59 according to the embodiment. Fig. 8 is a perspective view of the inclined cover 59 seen from below, and Fig. 9 is a side view of the inclined cover 59 according to the embodiment. Note that Fig. 9 omits illustrations other than the inclined cover 59 and a circular frame 52c described later.

[0057] The circular frame 52c will be described. As shown in Figs. 8 and 9, the circular frame 52c is a circular frame provided on the opening / closing cover 52 so as to surround the outside of the door 20b (see Fig. 4) held by the door holding portion 52a (see Fig. 4). The circular frame 52c is provided at a position where it does not interfere with the door 20b rotated by the rotation mechanism 53b. The circular frame 52c is provided to prevent the cleaning liquid from entering the inside of the door 20b through a hole (not shown) in the side surface of the door 20b. The door holding portion 52a is rotated together with the door 20b by the rotation mechanism 53b, but the circular frame 52c does not rotate.

[0058] 5, the circular frame 52c has a height sufficient to cover a part of the thickness of the door 20b held by the door holding portion 52a when the opening / closing lid 52 is in the closed state. The surface of the door 20b held by the door holding portion 52a opposite to the surface facing the opening / closing lid 52 is located lower than the circular frame 52c in the height direction (Z direction) of the tub 51. This allows the door 20b to be thoroughly washed with the washing liquid from the washing nozzle 54.

[0059] The inclined cover 59 is a flat member that is inclined so that an end 59a opposite the hinge 16 is lowest when the opening / closing lid 52 is in the closed state and becomes higher toward the center of the opening / closing lid 52. For example, when the opening / closing lid 52 is in the closed state, the inclined cover 59 is inclined so that the cleaning liquid adhering to the inclined cover 59 does not drip onto the FOUP body 20a but drips between the FOUP body 20a and the wall surface of the tank 51.

[0060] For example, when the opening / closing lid 52 is in the closed state, the inclined cover 59 receives the cleaning liquid scattered in the centrifugal direction from the door 20b which rotates to receive the cleaning liquid supplied from the cleaning nozzle 54. As described above, part of the cleaning liquid scattered from the door 20b heads toward the first inclined portion 56b. At the same time, part of the cleaning liquid runs down the inclined cover 59. Here, since the inclined cover 59 is inclined as described above, the inclined cover 59 guides the cleaning liquid so that the cleaning liquid adhering to the inclined cover 59 does not drip onto the FOUP body 20a, but drips between the FOUP body 20a and the wall surface of the tank 51. The cleaning liquid dripping between the FOUP body 20a and the wall surface of the tank 51 falls onto the bottom surface 51e of the tank 51. The cleaning liquid that falls onto the bottom surface 51e is discharged from the drain port 60 as described above. Therefore, even if the inclined cover 59 receives cleaning liquid splashed from the door 20b when the opening / closing lid 52 is in the closed state, the inclined cover 59 can prevent the cleaning liquid from dripping onto the FOUP body 20a.

[0061] In addition, in a side view from the direction indicated by the arrow 90 in FIG. 9, the end of the inclined cover 59 on the central side of the opening / closing lid 52 is provided so as to have a portion overlapping with the circular frame 52c. In addition, the end of the inclined cover 59 on the central side of the opening / closing lid 52 is provided at a position to guide the cleaning liquid to the side surface of the circular frame 52c when the opening / closing lid 52 is opened (when the opening / closing lid 52 transitions from the closed state to the open state). Therefore, when the opening / closing lid 52 transitions from the closed state to the open state, the cleaning liquid attached to the inclined cover 59 passes through the side surface of the circular frame 52c and is guided to the guide plate 56. The cleaning liquid guided to the guide plate 56 passes through the first eaves 57 or the second eaves 58 and is finally discharged from the drain port 60. In this way, the inclined cover 59 guides the cleaning liquid supplied to the door 20b and splashed to the side surface of the circular frame 52c when the opening / closing lid 52 transitions from the closed state to the open state. Therefore, the inclined cover 59 can prevent the cleaning liquid from dripping onto the FOUP body 20a even when the opening / closing lid 52 transitions from the closed state to the open state.

[0062] As described above, the inclined cover 59 can prevent the cleaning liquid from dripping onto the FOUP body 20a both when the opening / closing lid 52 is in the closed state and when the opening / closing lid 52 transitions from the closed state to the open state. As a result, the cleaning liquid does not adhere to the FOUP 20 after the drying process, so there is no need to clean the FOUP 20 again. Therefore, the wafer storage container cleaning apparatus 1 according to this embodiment can efficiently clean and dry the FOUP 20.

[0063] Next, a procedure of the cleaning process and drying process performed by the wafer container cleaning apparatus 1 according to this embodiment will be described. First, when the FOUP body 20a and the door 20b are carried into the tank 51, the cleaning nozzle 54 moves from the standby position 54b to the cleaning position P1 and performs the cleaning process on the FOUP 20. During the cleaning process, the FOUP body 20a and the door 20b are rotated by the rotation mechanisms 53a and 53b.

[0064] When the cleaning process is completed, the cleaning nozzle 54 moves to the standby position P2, and the drying nozzle 55 moves from the standby position P4 to the drying position P3 to perform the drying process on the FOUP 20. While the drying process is being performed by the drying nozzle 55, the cleaning nozzle 54 is located at the standby position 54b above the drainage port 60, and the cleaning liquid remaining in the cleaning nozzle 54 falls, is guided along the first eaves 57 to the wall surface of the tank 51, and flows to the drainage port 60. During this time, the drying process is being performed by the drying nozzle 55, and the FOUP body 20a and the door 20b are rotated as in the cleaning process. Therefore, the gas from the drying nozzle 55 fills the tank 51 with centrifugal force. However, the cleaning liquid attached to the cleaning nozzle 54 flows along the wall surface of the tank 51 via the first eaves 57 and efficiently flows to the drainage port 60, so that it is possible to prevent the gas from the drying nozzle 55 from scattering into the tank 51 and re-adhering to the FOUP 20. When the drying process is completed, the drying nozzle 55 moves to the standby position P4.

[0065] When the drying process is completed, the opening / closing lid 52 of the tank 51 is opened. At this time, the cleaning liquid remaining on the opening / closing lid 52 flows in the direction indicated by the arrow along the guide plate 56, the first eaves 57, and the wall of the tank 51, and is discharged from the drainage outlet 60, as shown in Fig. 4. In this way, the cleaning liquid remaining on the opening / closing lid 52 is efficiently discharged along the wall of the tank 51, thereby preventing the cleaning liquid from dropping into the FOUP body 20a.

[0066] Furthermore, even if the cleaning liquid that has fallen from the guide plate 56 adheres to the cleaning nozzle 54 located at the waiting position 54b, when the next FOUP 20 to be processed is brought into the cleaning tank 5, the cleaning nozzle 54 supplies the same cleaning liquid as that adhered to the cleaning nozzle 54 to the FOUP 20, so there is no substantial problem.

[0067] The wafer storage container cleaning apparatus 1 according to this embodiment has been described above. The wafer storage container cleaning apparatus 1 has a cleaning tank 5 for cleaning the FOUP 20. The cleaning tank 5 includes a tank 51 having a main body accommodation area 51a for accommodating the FOUP main body 20a and an inlet / outlet 51b at the top that can be opened and closed by an open / close lid 52 via a hinge 51c, a door holding part 52a provided on the open / close lid 52 for holding the door 20b, a cleaning nozzle 54 for supplying cleaning liquid to the FOUP main body 20a accommodated in the main body accommodation area 51a and the door 20b held by the door holding part 52a, rotation mechanisms 53a and 53b for rotating the FOUP main body 20a and the door 20b, and a door holding part 52a and a door holding part 52b arranged at a position that does not interfere with the door 20b rotated by the rotation mechanism 53b. 2a so as to surround the outside of the door 20b held by the door holding part 52a, and has a height that covers a part of the thickness of the door 20b held by the door holding part 52a when the opening / closing lid 52 is in the closed state, and an inclined cover 59 is provided at a position on the opening / closing lid 52 opposite the hinge 51c across the circular frame 52c when the opening / closing lid 52 is in the closed state, and is inclined so that the end opposite the hinge 51c is the lowest and becomes higher toward the circular frame 52c, and guides the cleaning liquid that is supplied from the cleaning nozzle 54 to the door 20b held by the door holding part 52a and splashed. The end of the inclined cover 59 on the side where the hinge 51c is provided is provided at a position that guides the cleaning liquid to the side of the circular frame 52c when the opening / closing lid 52 transitions from the closed state to the open state, and is provided so as to have a portion that overlaps with the circular frame 52c in a side view.

[0068] With this configuration, as described above, when the opening / closing lid 52 of the cleaning tank 5 is shifted from the closed state to the open state, droplets of the cleaning liquid present on the back of the opening / closing lid 52 flow from the inclined cover 59, along the circular frame 52c, and toward the hinge 51c. Therefore, according to the wafer storage container cleaning apparatus 1 of this embodiment, it is possible to prevent droplets of the cleaning liquid from adhering to the FOUP body 20a held below the opening / closing lid 52, and therefore the FOUP 20 can be efficiently cleaned and dried.

[0069] In addition, a space for the robot 3 to enter the tank 51 is provided on the front side of the tank 51 of the cleaning tank 5 (the side to which the flange 20c of the FOUP body 20a faces when the FOUP body 20a is carried into the cleaning tank 5). This space is necessary for the robot 3 to grip the flange 20c of the FOUP body 20a and place the FOUP body 20a in the tank 51 so that the FOUP opening of the FOUP body 20a faces downward. Since the tank 51 has this space, the area of ​​the opening / closing cover 52 must be increased, and the margin other than the part holding the door 20b becomes large. Therefore, the problem is to efficiently collect the cleaning liquid while preventing the cleaning liquid adhering to this margin from dripping onto the FOUP body 20a. According to the wafer storage container cleaning apparatus 1 of this embodiment, this problem can be solved by having the inclined cover 59 as described above.

[0070] In the wafer container cleaning apparatus 1 according to this embodiment, the surface of the door 20b held by the door holding part 52a opposite to the surface facing the opening / closing lid 52 is located lower than the circular frame 52c in the height direction of the tank 51. A guide plate 56 for guiding the cleaning liquid from the opening / closing lid 52 to the wall surface of the tank 51 is provided between the circular frame 52c and the hinge 51c of the opening / closing lid 52. The guide plate 56 is provided at a height including a height position where the cleaning liquid splashing from the door 20b held by the door holding part 52a collides when the opening / closing lid 52 is in the closed state, and has a first inclined part 56b having a surface inclined so that the upper end is located closer to the inside of the tank 51 than the lower end.

[0071] With this configuration, as described above, the cleaning liquid splashed from door 20b hits first inclined portion 56b of guide plate 56 and is guided to the wall surface of tank 51. This prevents the cleaning liquid from hitting other locations in tank 51 and bouncing back onto FOUP body 20a, thereby preventing dirt removed from door 20b from adhering to FOUP body 20a. [Explanation of symbols]

[0072] 1. Wafer container cleaning equipment 5. Cleaning tank 51 tank 52a Door retaining part 52c Circular Frame 53a, 53b Rotation mechanism 54 Cleaning nozzle 59 Slope Cover

Claims

1. 1. A wafer storage container cleaning device for cleaning a wafer storage container, the wafer storage container having a body having a storage space for storing semiconductor wafers, the storage space being in communication with an opening, and a door detachable from the opening, a cleaning tank for cleaning the wafer container; The cleaning tank comprises: a tank having a main body accommodating area for accommodating the main body and having an inlet / outlet at an upper portion thereof that can be opened and closed by an opening / closing lid via a hinge; a door holding portion provided on the opening / closing cover for holding the door; a cleaning nozzle for supplying a cleaning liquid to the main body accommodated in the main body accommodation area and the door held by the door holding portion; a rotation mechanism for rotating the main body and the door; a circular frame provided at a position not interfering with the door rotated by the rotation mechanism, surrounding the outside of the door held by the door holding portion, the circular frame having a height sufficient to cover a portion of the thickness of the door held by the door holding portion when the opening / closing cover is in the closed state; a tilted cover that is provided on the opening / closing cover at a position opposite the hinge across the circular frame when the opening / closing cover is in a closed state, tilted so that the end opposite the hinge is lowest and tilted toward the circular frame, and that guides the cleaning liquid that is supplied from the cleaning nozzle to the door held by the door holding portion and splashed thereon; having A wafer storage container cleaning apparatus, wherein the end of the inclined cover on the side where the hinge is provided is positioned to guide the cleaning liquid to the side of the circular frame when the opening / closing lid transitions from a closed state to an open state, and is configured so as to have a portion that overlaps with the circular frame in a side view.

2. A surface of the door held by the door holding portion opposite to a surface facing the opening / closing lid is located lower than the circular frame in a height direction of the tub, a guide plate is provided between the circular frame and the hinge of the opening / closing lid to guide the cleaning liquid from the opening / closing lid to a wall surface of the tank; 2. The wafer storage container cleaning apparatus of claim 1, wherein the guide plate is provided at a height position including a height position at which the cleaning liquid splashing from the door held by the door holding portion collides when the opening / closing lid is in a closed state, and has a first inclined portion having a surface that is inclined so that an upper end is located more inside the tank than a lower end.

3. One end of the guide plate is provided on the opening / closing cover, the guide plate includes a first vertical portion, the first inclined portion, a second vertical portion, and a second inclined portion, the first vertical portion, the first inclined portion, the second vertical portion, and the second inclined portion being arranged in this order in a direction extending from the one end of the guide plate; the first vertical portion and the second vertical portion form a surface perpendicular to a horizontal plane when the opening / closing cover is in a closed state; 3. The wafer container cleaning apparatus according to claim 2, wherein the second inclined portion has a surface that is perpendicular to a horizontal plane when the opening / closing lid is opened at an angle of 45 degrees.

4. a first eaves having one end provided on the wall surface of the tank below the guide plate, receiving the cleaning liquid running down the guide plate and directing the cleaning liquid to the wall surface of the tank; 4. The wafer storage container cleaning apparatus according to claim 2, wherein the first eave is inclined so that the other end is higher than the one end, and a hole through which the cleaning liquid can pass is formed between the one end and the wall surface.

5. a second eaves is provided on the wall surface of the tank between the lower end of the guide plate and the first eaves, the second eaves is inclined so that the other end is higher than the first end, and the second eaves has a hole between the first end and the wall surface through which the cleaning liquid can pass, 5. The wafer container cleaning apparatus according to claim 4, wherein the cleaning nozzle waits at a waiting position provided between the second overhang and the first overhang when the cleaning liquid is not being supplied.

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