Probe card and thermal conduction device thereof

Abstract

To provide a probe card and a thermal conduction device thereof.SOLUTION: A thermal conduction device includes a plurality of first walls and a plurality of second walls. The first walls and the second walls are crossly arranged to form a plurality of accommodation spaces. Probe assemblies are disposed in the accommodation spaces. Each probe assembly includes a plurality of probes and a case which is configured to accommodate the probes. First ends of the probes face an opening of the corresponding accommodation space. Second ends of the probes face another opening of the corresponding accommodation space.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] (CROSS REFERENCE TO RELATED APPLICATIONS) This application claims priority to Taiwan Patent Application No. 112137966, filed on October 3, 2023, which is incorporated by reference in its entirety.

[0002] The present invention relates to a probe card, and more particularly to a probe card with a heat-conducting device. [Background technology]

[0003] Conventionally, semiconductor devices under test (DUTs) or chips undergo electrical testing using a probe card and a tester. The ambient temperature at which the testing is performed depends on the type of DUT or chip.

[0004] However, since the test usually requires high power (e.g., at least 1000 watts), a large amount of heat is generated, which is transferred to the DUT or chip through the probe card and may significantly affect the test or even damage the DUT or chip, significantly degrading the test accuracy. Also, the higher the ambient temperature is set, the more difficult it is to precisely control the heat generation, and the lower the test accuracy. Furthermore, the operating temperature range of the tester is usually narrow, e.g., 20°C to 30°C, and as a result, the tester will produce abnormal test results when operating outside the operating temperature range.

[0005] Taking memory testing as an example, when a probe card with a probe array block is used to test a memory, there is a drawback that the test accuracy deteriorates as a result of overheating after operating for a while, because the probe card does not have an additional flow path, and the probe array block is mostly cooled by air cooling technology, which is not effective in dissipating heat from the probes of each probe array block.

[0006] Therefore, temperature control of the probe card, which directly engages with the tester and comes into direct contact with the DUT or chip, is extremely important, and temperature control of the probe card is essential for steadily carrying out electrical tests.

[0007] The above description of the prior art serves as a background introduction, but is not intended to imply an admission that the described prior art discloses any subject matter of the present disclosure or constitutes prior art to the present disclosure. Moreover, the described prior art should not be considered as part of the present disclosure. Summary of the Invention [Problem to be solved by the invention]

[0008] SUMMARY OF THE PRESENT EMBODIMENT An object of the present invention is to provide a probe card and its heat conducting device to overcome the above-mentioned shortcomings of the prior art in that cooling cannot be effectively achieved in terms of steadily controlling the temperature of the probe card. [Means for solving the problem]

[0009] An embodiment of the present disclosure provides a probe card comprising a heat-conducting device and a plurality of probe assemblies. The heat-conducting device comprises a plurality of first walls and a plurality of second walls. The plurality of first walls and the plurality of second walls intersect with each other to define a plurality of accommodating spaces. The probe assemblies are disposed in the plurality of accommodating spaces. Each probe assembly comprises a plurality of probes and a case. The case receives the plurality of probes and is in contact with the heat-conducting device. First ends of the plurality of probes face an opening of the accommodating space. Second ends of the plurality of probes face another opening of the accommodating space.

[0010] Another embodiment of the present disclosure provides a heat-conducting device comprising a plurality of first walls, a plurality of second walls, and a plurality of accommodating spaces. The plurality of accommodating spaces are formed by the intersection of the plurality of first walls and the plurality of second walls. The plurality of accommodating spaces accommodate a plurality of probe assemblies. A plurality of cases of the plurality of probe assemblies are in contact with the heat-conducting device. Each accommodating space has a first opening and a second opening. The first opening exposes first ends of a plurality of probes of the probe assemblies. The second opening exposes second ends of the probes of the probe assemblies. When the plurality of accommodating spaces accommodate a plurality of probe assemblies, a plurality of heat-conducting paths are provided between the heat-conducting device and the cases of the probe assemblies. Effect of the Invention

[0011] In summary, the probe card of the present disclosure has a heat-conducting device and can precisely control the temperature of the probe card, since the probe assembly is accommodated in the accommodation space to dissipate the heat generated from the probe assembly and improve the cooling efficiency.

[0012] The technical features and advantages of the present disclosure have been described generally and broadly above to make the following description of the present disclosure understandable. Other technical features and advantages of the subject matter of the claims of the present disclosure are described below. Those skilled in the art will understand that the concepts and specific embodiments presented below can be easily modified to design any other structure or manufacturing process, thereby achieving the same purpose of the present disclosure. Those skilled in the art will also understand that the equivalent constructions described above cannot depart from the spirit and scope defined in the appended claims of the present disclosure. [Brief description of the drawings]

[0013] Those skilled in the art can gain insight into the present disclosure by referring to the embodiments, claims, and drawings of the present disclosure, in which like elements are labeled with like reference numerals.

[0014] [Figure 1] FIG. 1 is a perspective view of a probe card according to some embodiments of the present disclosure. [Diagram 2] 1 is a perspective view of a heat transfer device according to some embodiments of the present disclosure. [Diagram 3] 1 is a cross-sectional view of a probe card according to some embodiments of the present disclosure. [Figure 4] 1 is a schematic diagram of a probe assembly according to some embodiments of the present disclosure. [Diagram 5] 1 is a cross-sectional view of a heat transfer device according to some embodiments of the present disclosure. [Figure 6] 1 is a cross-sectional view of a heat transfer device according to some embodiments of the present disclosure. [Figure 7] 1 is a schematic diagram of a method of using a probe card according to some embodiments of the present disclosure. [Figure 8] FIG. 1 is a perspective view of a probe card according to some embodiments of the present disclosure. [Figure 9] 1 is a perspective view of a heat transfer device according to some embodiments of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] The following description is attached to and incorporated in some of the drawings to illustrate embodiments of the present disclosure. However, the present disclosure is not limited to these embodiments. The embodiments described below may be appropriately combined to realize other embodiments.

[0016] As used herein, the intent of the phrases "one embodiment," "embodiment," "exemplary embodiment," "other embodiment," and "alternative embodiment" is to state that an embodiment of the present disclosure may include a particular feature, structure, or characteristic. However, not all embodiments need to include a particular feature, structure, or characteristic. Moreover, repeated use of the phrase "in one embodiment" does not necessarily mean that the same embodiment is being referred to, as it should not exclude the possibility of referring to the same embodiment.

[0017] The following description describes the steps and structures in detail so that the present disclosure can be fully understood. Obviously, the embodiments of the present disclosure do not impose any limitations on specific details well known to those skilled in the art. Moreover, well-known structures and steps are not repeated in this specification, so as not to impose unnecessary limitations on the present disclosure. The preferred embodiments of the present disclosure are described in detail below. However, in addition to the detailed description, the present disclosure can be widely implemented in other embodiments. The scope of the present disclosure is not limited to the detailed description, but is defined by the appended claims.

[0018] It should be noted that the detailed description below involves different embodiments or examples for use in implementing various features of the present disclosure. To simplify the description of the present disclosure, specific embodiments or examples of components and their arrangements are presented below. However, the specific embodiments or examples are illustrative rather than limiting. For example, the dimensions of the disclosed components are not limited to any disclosed ranges or values, but depend on the requirements of the associated manufacturing process and / or the expected characteristics of the associated device. Furthermore, concepts such as "forming a first feature above or on a second feature" as disclosed in the following description may be applied to embodiments, for example, "forming a first feature and a second feature such that the first feature and the second feature are in direct contact with each other" and "forming a first feature and a second feature such that an additional feature is formed between the first feature and the second feature to ensure that the contact between the first feature and the second feature is indirect" embodiments. For brevity and clarity, the accompanying drawings may be drawn to different scales to show various features, without mentioning the exclusion of some layers / features.

[0019] Additionally, for purposes of explanation, spatial relationship terms such as "lower," "below," "bottom," "upper," and "top" are used herein to describe the relationship between one component (or feature) and another component (or feature) as shown in the accompanying drawings. The spatial relationship terms are intended to indicate any other orientation in which the components may be used or operated in addition to the orientation shown in the accompanying drawings. The components may have any other orientation (rotated 90 degrees or aligned with another orientation) and the spatial relationship terms may be interpreted accordingly.

[0020] In some embodiments of the present disclosure, a probe card includes a heat-conducting device and a plurality of probe assemblies. The heat-conducting device includes a plurality of first walls and a plurality of second walls. The plurality of first walls and the plurality of second walls intersect with each other to define a plurality of accommodation spaces. Each of the accommodation spaces has a through-hole shape for accommodating a probe assembly. When the probe assembly is placed in the accommodation space, a case of the probe assembly contacts the heat-conducting device. Thus, ends of the plurality of probes of the probe assembly are exposed from an opening on a side of a part of the accommodation space and are directly or indirectly electrically connected to a tester, while other ends of the plurality of probes of the probe assembly are exposed from an opening on another side of the accommodation space and contact a device under test (DUT). Since the case of the probe assembly is in direct contact with the heat-conducting device inside the accommodation space, the heat-conducting device dissipates heat generated from the probe assemblies during operation, and improves the accuracy of temperature control of the probe card. Related structural features are illustrated by embodiments and described below.

[0021] Referring to Fig. 1, a perspective view of a probe card 1 according to some embodiments of the present disclosure is shown. Referring to Fig. 2, a perspective view of a heat-conducting device 11 according to some embodiments of the present disclosure is shown. Referring to Fig. 3, a cross-sectional view of a probe card 1 according to some embodiments of the present disclosure is shown. Referring to Fig. 4, a schematic view of a probe assembly 13 according to some embodiments of the present disclosure is shown. Referring to Figs. 5 and 6, cross-sectional views of a heat-conducting device 11 according to some embodiments of the present disclosure are shown. Specifically, the probe card 1 includes a heat-conducting device 11 and a plurality of probe assemblies 13. The heat-conducting device 11 has a plurality of accommodation spaces 110 for accommodating the plurality of probe assemblies 13.

[0022] In some embodiments, the heat-conducting device 11 comprises a plurality of first walls 111 and a plurality of second walls 113 that together define a storage space 110. The plurality of first walls 111 are parallel. The plurality of second walls 113 are parallel. The plurality of first walls 111 and the plurality of second walls 113 intersect with each other to define a plurality of storage spaces 110. In other words, the plurality of first walls 111 intersect with the plurality of second walls 113, respectively, and vice versa to define a plurality of storage spaces 110.

[0023] 2, the direction D10 and the direction D12 are perpendicular to each other. The first wall 111 extends along the direction D10 and is aligned along the direction D12. The second wall 113 extends along the direction D12 and is aligned along the direction D10. Thus, the first walls 111 are perpendicular to the second walls 113, respectively, and vice versa, whereby the first walls 111 and the second walls 113 intersect with each other to define a plurality of storage spaces 110 (i.e., the first walls 111 intersect with the second walls 113, respectively, and vice versa to define a plurality of storage spaces 110).

[0024] In some embodiments, the first wall 111 and the second wall 113 are stiffeners and therefore can provide mechanical support. In some embodiments, the first walls 111 and the second walls 113 are integrally formed (e.g., cast simultaneously in the same die). In some embodiments, the cells of the first walls 111 and the second walls 113 fall within an area defined by the dashed lines in FIG. 2 or a portion of an area defined by the dashed lines.

[0025] In some embodiments, the accommodation space 110 defined by the first wall 111 and the second wall 113 is a through hole having a first opening 110A and a second opening 110B, respectively. Each accommodation space 110 accommodates one probe assembly 13. In other words, the probe assemblies 13 are arranged in a one-to-one relationship in the accommodation space 110. Each probe assembly 13 includes a plurality of probes 131 and a case 133. The case 133 accommodates the plurality of probes 131. The first ends 131A and second ends 131B of the plurality of probes 131 protrude outward from both sides of the case 133, respectively, and are electrically connected to external components.

[0026] In some embodiments, when the probe assembly 13 is positioned within the accommodating space 110, the first ends 131A of the probes 131 protrude outward from the first openings 110A of the accommodating space 110 (which accommodate the probes 131), and the second ends 131B of the probes 131 protrude outward from the second openings 110B of the accommodating space 110 (which accommodate the probes 131).

[0027] In some embodiments, the inside of each accommodation space 110 forms a continuous inner circumferential surface along the first wall 111 and the second wall 113, and the outside of the case 133 of each probe assembly 13 forms a continuous outer circumferential surface. When the probe assembly 13 is accommodated in the accommodation space 110, the entire (or a part) of the outer circumferential surface (i.e., the outer circumferential side wall) of the case 133 of the probe assembly 13 directly contacts the entire (or a part) of the inner circumferential surface (i.e., the inner circumferential side wall) of the accommodation space 110, thereby enabling the case 133 of the probe assembly 13 to directly contact the heat conduction device 11, and a plurality of heat conduction paths 10P (shown by thick arrows in FIG. 3) are provided between the heat conduction device 11 and the probe assembly 13. Therefore, when a large amount of heat is generated during the operation of the probe assembly 13, the heat is transferred to the heat conduction device 11 through the heat conduction path 10P and is instantly dissipated by the heat conduction device 11, improving the accuracy of temperature control of the probe card 1.

[0028] In some embodiments, the heat-conducting device 11 further comprises at least one heat dissipation component (not shown) configured to accelerate heat dissipation in contact with at least a portion of the first wall 111 and the second wall 113. The heat dissipation component includes a water-cooled heat dissipation component, a fin-contact heat dissipation component, or any combination of a water-cooled heat dissipation component and a fin-contact heat dissipation component.

[0029] For example, the heat dissipation component includes a fin-contact type heat dissipation component. The fin-contact type heat dissipation component is disposed on the upper surface of the heat conduction device 11 so as to contact at least a portion of the first wall 111 and the second wall 113 from above. In this way, when the fin-contact type heat dissipation component dissipates heat by air cooling, the heat conduction device 11 in contact with the fin-contact type heat dissipation component also dissipates heat. For example, the heat dissipation component includes a fin-contact type heat dissipation component configured to contact at least a portion of the first wall 111 and the second wall 113, and the cooling fluid of the water-cooled type heat dissipation component removes the heat introduced by the fin-contact type heat dissipation component. For example, the heat dissipation component includes a water-cooled type heat dissipation component, and the cooling fluid of the water-cooled type heat dissipation component directly cools at least a portion of the first wall 111 and the second wall 113.

[0030] 7, a schematic diagram of a method of using the probe card 1 according to some embodiments of the present disclosure is shown. Specifically, when the probe assembly 13 is accommodated in the accommodation space 110 of the heat conduction device 11, the first opening 110A of the accommodation space 110 exposes the first ends 131A of the multiple probes 131 of the probe assembly 13, respectively, allowing the multiple probes 131 to be electrically connected to the tester 9. When the probe assembly 13 is accommodated in the accommodation space 110, the second opening 110B of the accommodation space 110 exposes the second ends 131B of the multiple probes 131 of the probe assembly 13, respectively, allowing the multiple probes 131 to contact the electrical contacts of the device under test (DUT) 8. As shown in the figure, the multiple probes 131 are directly electrically connected to the tester 9, but the present disclosure is not limited thereto. In other embodiments, the multiple probes 131 are indirectly electrically connected to the tester 9 via an intervening component.

[0031] In some embodiments, the probe card 1 generates a large amount of heat while the DUT 8 is performing high frequency or high power testing on the probe card 1, and the heat is effectively removed by the thermal conduction device 11, thereby preventing the probe assembly 13 from deforming due to sudden temperature changes and affecting the testing, thereby improving the accuracy of the testing.

[0032] In some embodiments of the present disclosure, the probe assemblies (e.g., probe assemblies 1, 2, 3) are each a probe array block (PAB). In some embodiments of the present disclosure, the heat-conducting devices (e.g., heat-conducting devices 11, 21, and 31) are made of a rigid material with high thermal conductivity (e.g., thermal conductivity of 80 W / mK or more), e.g., metals such as iron and copper, or non-metals such as diamond and graphene. However, the aforementioned technical features are not intended to impose limitations on the embodiments of the present disclosure.

[0033] In some embodiments, each of the accommodation spaces 110 has a rectangular parallelepiped shape, and each of the probe assemblies 13 also has a rectangular parallelepiped shape. However, the above-mentioned technical features are not intended to impose limitations on the embodiments of the present invention, since a person skilled in the art can change the shapes of the accommodation spaces and the probe assemblies as necessary by referring to the above-mentioned technical features of the embodiments of the present invention.

[0034] Referring to Fig. 8, a perspective view of a probe card 2 according to some embodiments of the present disclosure is shown. Referring to Fig. 9, a perspective view of a heat-conducting device 21 according to some embodiments of the present disclosure is shown. Specifically, the probe card 2 includes the heat-conducting device 21 and a plurality of probe assemblies 23. The heat-conducting device 21 includes a plurality of accommodation spaces 210 for accommodating the plurality of probe assemblies 23. Each of the accommodation spaces 210 is cylindrical in shape, and each of the probe assemblies 23 is also cylindrical in shape.

[0035] For simplicity and clarity, only one accommodating space 110, 210, a first wall 111, a second wall 113, and a probe assembly 13, 23 are shown in the figures illustrating the embodiments, but this is not intended to limit the embodiments of the present disclosure, and therefore a person skilled in the art can gain insight into the accommodating space, walls, and probe assembly shown in the accompanying drawings.

[0036] In conclusion, the probe card and heat-conducting device in the embodiments of the present disclosure advantageously achieves heat conduction through direct contact between the heat-conducting device and the probe assembly inside the containment space, and enhances the efficiency and accuracy of controlling the temperature of the probe card. For example, in some use environments, the inside of the probe assembly may be in a vacuum state when the probe card is engaged with the tester, which may prevent effective cooling of the probe by introducing cooling gas. Therefore, the aforementioned shortcomings of the prior art are overcome by the present disclosure, since the present disclosure teaches enhancing the efficiency of heat conduction through direct contact between the heat-conducting device, the case, and the walls of the probe.

[0037] Although the present disclosure and its advantages have been described in detail above, it should be understood that various modifications, substitutions, and alterations can be made to the embodiments of the present disclosure without departing from the spirit and scope defined by the appended claims of the present disclosure. For example, the manufacturing processes described above can be carried out in different ways and replaced with other manufacturing processes or combinations thereof.

[0038] The scope of the present disclosure is not limited to the specific embodiments of any process, machine, manufacture, composition of matter, means, methods, and steps described herein. The disclosure described herein enables a person skilled in the art to practice the present disclosure using any existing or potential process, machine, manufacture, composition of matter, means, methods, or steps that have the same function or can achieve substantially the same result as those disclosed in the above embodiments. Thus, these processes, machines, manufacture, compositions of matter, means, methods, and steps fall within the scope of the appended claims of the present disclosure.

Claims

1. 1. A heat transfer device, comprising: Multiple first walls, a plurality of second walls, the first wall and the second wall intersecting each other to define a plurality of storage spaces; a heat transfer device comprising: a plurality of probe assemblies disposed within the receiving space, each of which comprises: A plurality of probes; a case for housing the probe; a plurality of probe assemblies comprising: A probe card comprising: the case is in contact with the heat-conducting device; A probe card, wherein a first end of the probe faces an opening of the receiving space and a second end of the probe faces another opening of the receiving space.

2. The probe card of claim 1 , wherein each of the probe assemblies is disposed within a corresponding one of the receiving spaces.

3. 2. The probe card of claim 1, wherein the inside of each of the storage spaces forms a continuous inner circumferential surface along the first wall and the second wall, and the outside of the case of the probe assembly forms a continuous outer circumferential surface, and the inner circumferential surface and the outer circumferential surface are in contact with each other.

4. The probe card according to claim 1 , wherein the extension direction of the first wall is perpendicular to the extension direction of the second wall.

5. The probe card of claim 1 , wherein the first wall and the second wall are stiffeners.

6. The probe card of claim 1 , wherein the first wall and the second wall are integrally formed.

7. The probe card of claim 1 , wherein the heat-conducting device further comprises at least one heat dissipation component in contact with at least a portion of the first wall and the second wall.

8. 8. The probe card of claim 7, wherein the at least one heat dissipation component comprises a water-cooled heat dissipation component, a fin-contact heat dissipation component, or a combination of a water-cooled heat dissipation component and a fin-contact heat dissipation component.

9. The probe card according to claim 1 , wherein each of the storage spaces has a rectangular parallelepiped or cylindrical shape.

10. The probe card of claim 1 , wherein the first end or the second end of the probe is electrically connected to a device under test (DUT).

11. 1. A heat transfer device, comprising: Multiple first walls, Multiple second walls, a plurality of accommodating spaces formed by an intersection between the first wall and the second wall, the plurality of accommodating spaces accommodating a plurality of probe assemblies, and a plurality of cases of the probe assemblies are in contact with the heat-conducting device; A heat transfer device comprising: Each of the accommodating spaces has a first opening and a second opening, the first opening exposing first ends of a plurality of probes of the probe assembly, and the second opening exposing second ends of the probes of the probe assembly; A heat-conducting device, wherein when the receiving space receives the probe assembly, a plurality of heat-conducting paths are provided between the heat-conducting device and the case of the probe assembly.

12. The heat transfer device of claim 11 , further comprising at least one heat dissipation component in contact with at least a portion of the first wall and the second wall.

13. The heat-conducting device of claim 12 , wherein the at least one heat dissipation component comprises a water-cooled heat dissipation component, a fin-contact heat dissipation component, or a combination of a water-cooled heat dissipation component and a fin-contact heat dissipation component.

14. The heat transfer device of claim 11 , wherein each of the containing spaces is rectangular or cylindrical in shape.

15. The heat transfer device of claim 11 , wherein the heat transfer path transfers heat from the probe assembly to the heat transfer device.

16. 12. The heat transfer device of claim 11, wherein the heat transfer device is made from a material having a thermal conductivity of 80 W / mK or greater.

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