Multilayered electronic component

Abstract

To provide a multilayered electronic component which has excellent reliability, and in which generation of propagation of cracks are suppressed.SOLUTION: A laminated electronic component according to an embodiment of the present invention may include: a body that includes a dielectric layer and an internal electrode alternately arranged in a first direction, and includes a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface coupled to the first and second surfaces, and opposing each other in a second direction, and a fifth surface and a sixth surface coupled to the first, second, third, and fourth surfaces, and opposing each other in a third direction; and an external electrode arranged on the body, and coupled with the internal electrode. Therein: the internal electrode may include a plurality of electrode portions and disconnection portions; the disconnection portion may include at least one of the dielectric and a pore; and when a ratio of a length of the bore to a length of the disconnection portion is referred to as a porosity of the disconnection portion, a porosity of the disconnection portion measured in a central portion of the internal electrode in the third direction, in cross-sections of the body in the first and third directions, is referred to as Dc, and a porosity of the disconnection portion measured in an end of the internal electrode in the third direction is referred to as Dm, Dm / Dc may be less than 0.79.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present invention relates to a multilayer electronic component. [Background technology]

[0002] Multi-Layered Ceramic Capacitor (MLCC), a type of multi-layered electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products such as visual devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones to charge and discharge electricity.

[0003] Multilayer ceramic capacitors have the advantages of being small yet high capacitance and easy to mount, and therefore can be used as components of various electronic devices.

[0004] Since ceramics are relatively brittle, cracks may occur during mounting or use of the multilayer ceramic capacitor, and cracks may also occur or propagate during the sintering process used to manufacture the multilayer ceramic capacitor.

[0005] Therefore, a method for suppressing the occurrence and propagation of cracks in a multilayer ceramic capacitor is required. Summary of the Invention [Problem to be solved by the invention]

[0006] One of the various objects of the present invention is to provide a multilayer electronic component having excellent reliability.

[0007] One of the various objects of the present invention is to provide a multilayer electronic component in which the generation and propagation of cracks is suppressed.

[0008] However, the object of the present invention is not limited to the above-described content and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Means for Solving the Problems

[0009] A multilayer electronic component according to an embodiment of the present invention includes dielectric layers and internal electrodes alternately arranged in a first direction, a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and facing each other in a third direction, a main body including the above, and external electrodes disposed on the main body and connected to the internal electrodes. The internal electrodes include a plurality of electrode portions and cut portions. The cut portions include at least one of a dielectric and pores. The ratio of the length of the pores to the length of the cut portions is defined as the porosity of the cut portions. When the porosity of the cut portions measured at the central portion in the third direction of the internal electrodes in the cross sections of the main body in the first direction and the third direction is Dc, and the porosity of the cut portions measured at the end portions in the third direction of the internal electrodes is Dm, Dm / Dc can be less than 0.79.

[0010] A multilayer electronic component according to an embodiment of the present invention includes dielectric layers and internal electrodes alternately arranged in a first direction, a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and facing each other in a third direction, a main body including the above, and external electrodes disposed on the main body and connected to the internal electrodes. The internal electrodes include a plurality of electrode portions and cut portions. The cut portions include at least one of a dielectric and pores. The ratio of the length of the pores to the length of the cut portions is defined as the porosity of the cut portions. Among the cross sections of the main body in the first direction and the third direction, when the porosity of the cut portions measured at the central portion in the third direction of the internal electrodes is Dc, and the porosity of the cut portions measured at the end portions in the third direction of the internal electrodes is Dm, Dm is 40% or less, and Dm < Dc can be satisfied.

Advantages of the Invention

[0011] One of the various effects of the present invention is that the generation and propagation of cracks can be suppressed by controlling the porosity of the cut portions of the internal electrodes.

[0012] However, the various yet significant advantages and effects of the present invention are not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Brief description of the drawings]

[0013] [Figure 1] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Diagram 2] 2 is a schematic cross-sectional view taken along line II' of FIG. 1. [Diagram 3] 2 is a schematic cross-sectional view taken along line II-II' in FIG. 1. [Figure 4] This is a schematic exploded view of the main body. [Diagram 5] 1 is an enlarged schematic view of the internal electrodes. [Figure 6] 13 is an image obtained by observing the center part of the internal electrode in the third direction of an example of the invention (sample No. 7). [Figure 7] 13 is an image obtained by observing the end portion in the third direction of the internal electrode of an example of the invention (sample No. 7). [Figure 8] 13 is an image obtained by observing the center part in the third direction of the internal electrode of the comparative example (sample number 1). [Figure 9] 13 is an image obtained by observing the end portion in the third direction of the internal electrode of the comparative example (sample number 1). DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, the embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention may be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0015] In addition, in the drawings, parts that are not relevant to the description are omitted in order to clearly explain the present invention, and the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, so the present invention is not necessarily limited by the drawings. Furthermore, components having the same function within the same concept may be described using the same reference numerals. Furthermore, throughout the specification, when a part "includes" a certain component, it does not mean that the part excludes other components, but that the part may further include other components, unless otherwise specified to the contrary.

[0016] In the drawings, the first direction can be defined as the stacking direction or thickness (T) direction, the second direction can be defined as the length (L) direction, and the third direction can be defined as the width (W) direction.

[0017] Multilayer Electronic Components FIG. 1 is a schematic perspective view of a multilayer electronic component according to one embodiment of the present invention, FIG. 2 is a schematic cross-sectional view taken along line I-I' in FIG. 1, FIG. 3 is a schematic cross-sectional view taken along line II-II' in FIG. 1, FIG. 4 is a schematic exploded view of the main body, and FIG. 5 is a schematic enlarged view of internal electrodes.

[0018] Hereinafter, with reference to FIGS. 1 to 5, the multilayer electronic component 100 according to an embodiment of the present invention will be described in detail. Further, as an example of the multilayer electronic component, a multilayer ceramic capacitor (hereinafter referred to as "MLCC") will be described, but the present invention is not limited thereto, and it can also be applied to various multilayer electronic components using a ceramic material, such as an inductor, a piezoelectric element, a varistor, or a thermistor.

[0019] The multilayer electronic component 100 according to an embodiment of the present invention includes dielectric layers 111 and internal electrodes 121, 122 alternately arranged in a first direction, a first surface 1 and a second surface 2 facing each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface, the second surface, the third surface, and the fourth surface and facing each other in a third direction, a main body 110, and external electrodes 131, 132 disposed on the main body and connected to the internal electrodes. The internal electrodes include a plurality of electrode portions Ep and cut portions Cp, and the cut portions can include at least one of a dielectric D and pores P.

[0020] In one embodiment, when the ratio of the length of the pores P to the length of the cut portion Cp is defined as the porosity of the cut portion, the porosity Dc of the cut portion measured at the central portion in the third direction of the internal electrode in the cross section of the main body in the first direction and the third direction, and the porosity Dm of the cut portion measured at the end portion in the third direction of the internal electrode, Dm / Dc can be less than 0.79.

[0021] In one embodiment, when the ratio of the length of the pores P to the length of the cut portion Cp is defined as the porosity of the cut portion, the porosity Dc of the cut portion measured at the central portion in the third direction of the internal electrode in the cross section of the main body in the first direction and the third direction, and the porosity Dm of the cut portion measured at the end portion in the third direction of the internal electrode, Dm is 40% or less, and Dm < Dc can be satisfied.

[0022] The present invention aims to fundamentally understand the plastic behavior and the mechanism of crack generation during the process of manufacturing a multilayer electronic component, and to suppress the generation and propagation of cracks.

[0023] For cracks to form in the body or for the cracks to grow to the point of destruction, microcracks must exist inside the body, and energy must be present to grow these microcracks. Pores present in the cuts of the internal electrodes can act as such microcracks inside the body. In the present invention, the occurrence and propagation of cracks can be suppressed by controlling the porosity of the cuts of the internal electrodes. In particular, pores formed at the ends of the internal electrodes act as starting points for cracks, and the present invention aims to suppress the occurrence and propagation of cracks by suppressing the formation of pores at the ends of the internal electrodes and fundamentally eliminating the cause of crack occurrence.

[0024] Hereinafter, each component included in the multilayer electronic component 100 according to one embodiment of the present invention will be described.

[0025] The body 110 may have dielectric layers 111 and internal electrodes 121 and 122 stacked alternately.

[0026] Although there is no particular limitation on the specific shape of the body 110, the body 110 may be hexahedral or a similar shape as shown in the figure. Due to shrinkage of the ceramic powder contained in the body 110 during the firing process, the body 110 may not be a hexahedral shape with perfectly straight lines, but may be substantially hexahedral.

[0027] The main body 110 may have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in the second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2, connected to the third surface 3 and the fourth surface 4, and facing each other in the third direction.

[0028] As a marginal region where the internal electrodes 121 and 122 are not disposed overlaps the dielectric layer 111, a step is generated due to the thickness of the internal electrodes 121 and 122, and the corners connecting the first surface with the third surface, the fourth surface, and the fifth surface and / or the corners connecting the second surface with the third surface, the fourth surface, and the fifth surface may have a shape that is shrunk toward the center of the first direction of the body 110 when viewed based on the first surface or the second surface. Alternatively, due to a shrinkage behavior during the sintering process of the body, the corners connecting the first surface 1 with the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 and / or the corners connecting the second surface 2 with the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 may have a shape that is shrunk toward the center of the first direction of the body 110 when viewed based on the first surface or the second surface. Alternatively, in order to prevent chipping defects, the corners connecting each surface of the body 110 may be rounded through a separate process, so that the corners connecting the first surface with the third surface, the fourth surface, the fifth surface, and the sixth surface and / or the corners connecting the second surface with the third surface, the fourth surface, the fifth surface, and the sixth surface may have a rounded shape.

[0029] On the other hand, in order to suppress steps caused by the internal electrodes 121, 122, if the internal electrodes are cut after lamination so as to be exposed on the fifth surface 5 and the sixth surface 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated in the third direction (width direction) on both side surfaces of the capacitance forming portion Ac to form margin portions 114, 115, the portions connecting the first surface to the fifth surface and the sixth surface and the portions connecting the second surface to the fifth surface and the sixth surface may not have a contracted shape.

[0030] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM). There is no particular need to limit the number of laminated dielectric layers, and this can be determined in consideration of the size of the laminated electronic component. For example, the main body can be formed by laminating 400 or more dielectric layers.

[0031] The dielectric layer 111 can be formed by manufacturing a ceramic slurry containing ceramic powder, an organic solvent, and a binder, applying and drying the slurry on a carrier film to provide a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained. For example, barium titanate-based (BaTiO3) powder, normal dielectric powder of a CaZrO3 substrate, etc. can be used as the ceramic powder. More specifically, examples of the barium titanate-based (BaTiO3) powder include BaTiO3, (Ba 1-x Ca x )TiO3(0 < x < 1), Ba(Ti 1-y Ca y )O3(0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3(0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3(0 < y < 1), and one or more of them can be used. The normal dielectric powder of the CaZrO3 substrate can be (Ca 1-x Sr x )(Zr 1-y Ti y )O3(0 < x < 1, 0 < y < 1).

[0032] Therefore, the dielectric layer 111 can contain one or more of BaTiO3, (Ba 1-x Ca x )TiO3(0 < x < 1), Ba(Ti 1-y Ca y )O3(0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3(0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3(0 < y < 1), and (Ca 1-x Sr x )(Zr 1-y Ti y )O3(0 < x < 1, 0 < y < 1). In one embodiment, the dielectric layer 111 is (Ca1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1) can be included as a main component.

[0033] The average thickness td of the dielectric layer 111 does not particularly need to be limited, but for example, it can be 2.5 μm or less. Also, the average thickness td of the dielectric layer 111 can be arbitrarily set according to desired characteristics and applications.

[0034] Here, the average thickness td of the dielectric layer 111 means the size in the first direction of the dielectric layer 111 disposed between the internal electrodes 121 and 122. The average thickness of the dielectric layer 111 can be measured by scanning the cross-sections in the first and second directions of the main body 110 with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the thickness can be measured at a number of points of one dielectric layer 111, for example, 30 points at equal intervals in the second direction, and the average value can be measured. The 30 points at the above equal intervals can be specified by the capacitance forming portion Ac described later. Also, when such average value measurement is extended to 10 dielectric layers 111 to measure the average value, the average thickness of the dielectric layer 111 can be further generalized.

[0035] The main body 110 includes a capacitance forming portion Ac in which a first internal electrode 121 and a second internal electrode 122 are disposed inside the main body 110 and are arranged to face each other with the dielectric layer 111 interposed therebetween, and a capacitance is formed, and cover portions 112 and 113 formed on the upper and lower portions in the first direction of the capacitance forming portion Ac.

[0036] Also, the capacitance forming portion Ac is a portion that contributes to the formation of the capacitance of the capacitor, and can be formed by repeatedly laminating a plurality of first internal electrodes 121 and second internal electrodes 121 with the dielectric layer 111 interposed therebetween.

[0037] The cover portions 112 and 113 can include an upper cover portion 112 disposed on the upper portion in the first direction of the capacitance forming portion Ac and a lower cover portion 113 disposed on the lower portion in the first direction of the capacitance forming portion Ac.

[0038] The upper cover part 112 and the lower cover part 113 may be formed by stacking a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the capacitance forming part Ac in the thickness direction, respectively, and may basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0039] The upper cover part 112 and the lower cover part 113 do not include an internal electrode and may include the same material as the dielectric layer 111 .

[0040] That is, the upper cover part 112 and the lower cover part 113 may include a ceramic material, for example, a barium titanate (BaTiO3) based ceramic material.

[0041] On the other hand, there is no need to particularly limit the thickness of the covers 112 and 113. However, in order to more easily achieve miniaturization and high capacity of the multilayer electronic component, the thickness tc of the covers 112 and 113 can be 15 μm or less.

[0042] The average thickness tc of the cover parts 112, 113 may mean the size in the first direction, and may be the average value of the size in the first direction of the cover parts 112, 113 measured at five equally spaced points on the upper or lower part of the capacitance forming part Ac.

[0043] Moreover, margin portions 114 and 115 can be disposed on the side surfaces of the capacitance forming portion Ac.

[0044] The margin portions 114, 115 may include a first margin portion 114 disposed on the fifth surface 5 of the body 110 and a second margin portion 115 disposed on the sixth surface 6. That is, the margin portions 114, 115 may be disposed on both end surfaces of the ceramic body 110 in the width direction.

[0045] The margin portions 114, 115 may refer to the regions between both ends of the first internal electrode 121 and the second internal electrode 122 and the boundary surface of the body 110 in a cross-section of the body 110 cut in the width-thickness (WT) direction, as shown in FIG. 3.

[0046] The margins 114 and 115 essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0047] The margin portions 114 and 115 may be formed by applying a conductive paste to the ceramic green sheet except for the areas where the margin portions are to be formed, to form internal electrodes.

[0048] In addition, in order to suppress steps caused by the internal electrodes 121, 122, the laminated internal electrodes can be cut so as to be exposed on the fifth surface 5 and the sixth surface 6 of the main body, and then a single dielectric layer or two or more dielectric layers can be laminated in the third direction (width direction) on both side surfaces of the capacitance forming portion Ac to form margin portions 114, 115.

[0049] On the other hand, there is no need to particularly limit the width of the marginal portions 114, 115. However, in order to more easily achieve a smaller size and higher capacity of the multilayer electronic component, the average width of the marginal portions 114, 115 can be 15 μm or less.

[0050] The average width of the margin portions 114, 115 may refer to the average size MW1 in the third direction of the region where the internal electrode is spaced from the fifth surface and the average size MW2 in the third direction of the region where the internal electrode is spaced from the sixth surface, and may be the average value of the sizes in the third direction of the margin portions 114, 115 measured at five equally spaced points on the side of the capacitance forming portion Ac.

[0051] Therefore, in one embodiment, the average sizes MW1 and MW2 in the third direction of the regions of the internal electrodes 121 and 122 spaced apart from the fifth and sixth faces may be 15 μm or less, respectively.

[0052] The internal electrodes 121 and 122 each include a plurality of electrode portions Ep and a cut portion Cp, and the cut portion Cp can include at least one of a dielectric D and a pore P.

[0053] Since the conductive paste for the internal electrodes and the ceramic green sheets have different shrinkage start temperatures, unevenness or breakage of the internal electrodes may occur after firing. Therefore, when observing a cross section of the body 110 cut in the lamination direction after firing, a break Cp, which is a portion where the connection between the internal electrodes 121 and 122 is broken, can be observed.

[0054] Generally, the cuts Cp of the internal electrodes are formed by pores P, and the pores P act as microcracks inside the body and may induce the generation and propagation of cracks. In the present invention, the cuts Cp of the internal electrodes are filled with a dielectric D to control the porosity of the cuts Cp, thereby suppressing the generation and propagation of cracks.

[0055] In one embodiment, when the ratio of the length of the pore P to the length of the cut Cp is the porosity of the cut, the porosity of the cut measured at the center of the internal electrode in the third direction in the cross section of the main body in the first and third directions is Dc, and the porosity of the cut measured at the end of the internal electrode in the third direction is Dm, Dm / Dc can be less than 0.79.

[0056] Since the pores P present at the end of the internal electrode in the third direction can act as the starting point of cracks, the porosity Dm of the cut portion measured at the end of the internal electrode in the third direction relative to the porosity Dc of the cut portion measured at the center of the internal electrode in the third direction can be controlled to less than 0.79, thereby fundamentally suppressing the cause of crack generation and suppressing the generation and propagation of cracks. Therefore, Dm / Dc is preferably less than 0.79, and more preferably 0.51 or less. On the other hand, the lower limit of Dm / Dc does not need to be particularly limited, and for example, Dm / Dc can be 0.26 or more.

[0057] In one embodiment, the porosity Dm of the cut part measured at the end of the internal electrode in the third direction is 40% or less, and Dm < Dc can be satisfied. Thereby, the cause of crack generation can be fundamentally suppressed, and the generation and propagation of cracks can be suppressed.

[0058] In one embodiment, the porosity Dm of the cut part measured at the end of the internal electrode in the third direction can be 40% or less.

[0059] When Dm exceeds 40%, cracks may easily occur. Therefore, Dm is preferably 40% or less, and more preferably Dm can be 19% or less.

[0060] The lower limit of Dm does not particularly need to be limited, and it can be most preferably 0%. However, it may be difficult to control Dm to 0% in the manufacturing process. Therefore, the lower limit of Dm can be, for example, 5% or more, or 9% or more.

[0061] In one embodiment, the porosity Dc of the cut part measured at the center of the internal electrode in the third direction can be 43% or less. Although the influence on the generation and suppression of cracks is less than that at the end of the internal electrode in the third direction, the center of the internal electrode in the third direction can also be a starting point of cracks. Therefore, Dc is preferably 43% or less.

[0062] The lower limit of Dc does not particularly need to be limited, and it is most preferably 0%. However, it may be difficult to control Dc to 0% in the manufacturing process. Therefore, the lower limit of Dc can be, for example, 20% or more, or 27% or more.

[0063] FIG. 5 is a drawing schematically showing an enlarged view of the internal electrode 121. Hereinafter, with reference to FIG. 4, the internal electrode of the present invention will be described in detail centering on the first internal electrode 121, but the same can be applied to the second internal electrode 122.

[0064] In one embodiment, the slits Cp may be arranged to penetrate the internal electrodes 121, 122 in the first direction. When the slits Cp are arranged to penetrate the internal electrodes 121, 122 in the first direction, cracks may occur more easily, and therefore, when the slits Cp are arranged to penetrate the internal electrodes 121, 122 in the first direction, the effect of suppressing the occurrence and propagation of cracks of the present invention may be more pronounced.

[0065] In one embodiment, the dielectric D may be disposed to connect the dielectric layers 111a and 111b adjacent to the cut portion Cp, thereby improving the bonding strength between the dielectric layers 111a and 111b, thereby improving the strength of the laminated electronic component, suppressing delamination and cracks, and improving the moisture resistance reliability.

[0066] In one embodiment, at least one of the plurality of cuts Cp can include both the dielectric D and the pores P.

[0067] Furthermore, at least one of the plurality of cut portions Cp has a length greater than the thickness of the internal electrode in a cross section in the first direction, thereby making it possible to further improve the bonding strength between adjacent dielectric layers.

[0068] At least one of the plurality of gaps Cp may be made of the dielectric D. That is, by filling all of the gaps Cp with the dielectric D, the bonding strength between the dielectric layers 111a and 111b can be further improved, and the effect of suppressing the occurrence and propagation of cracks can be further improved.

[0069] Meanwhile, not all of the dielectrics D included in the gap Cp may be arranged in a form that connects the adjacent dielectric layers 111a, 111b, and some of the dielectrics included in the gap Cp may be arranged in a form that is not connected to either the upper dielectric layer 111a or the lower dielectric layer 111b.

[0070] The air hole P can be filled with air as an empty space and is a part where no bonding force is formed.

[0071] Among the internal electrodes, the region excluding the cut portion Cp can be the electrode portion Ep, and the electrode portion Ep can be formed by sintering the conductive paste for the internal electrode.

[0072] In one embodiment, the dielectric can contain the same material as the above dielectric layer. For example, the dielectric D and the dielectric layer 111 can contain one or more of BaTiO3, (Ba 1-x Ca x )TiO3(0 < x < 1), Ba(Ti 1-y Ca y )O3(0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3(0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3(0 < y < 1), and (Ca 1-x Sr x )(Zr 1-y Ti y )O3(0 < x < 1, 0 < y < 1). In one embodiment, the dielectric D and the dielectric layer 111 can mainly contain (Ca 1-x Sr x )(Zr 1-y Ti y )O3(0 < x < 1, 0 < y < 1).

[0073] Also, the dielectric D can contain any one or more of Ca, Mg, Mn, Al, and Si. Ca, Mg, Mn, Al, and Si contained in the paste for the internal electrode can diffuse in the sintering process and be contained in the dielectric.

[0074] 5, the porosity of the cut portion Cp can be defined as a ratio of the total length of the pore P to the total length of the cut portion Cp, and can be measured by scanning an image of a cross section in the first direction and the third direction cut at the center of the second direction of the body 110 with a scanning electron microscope (SEM). After setting a certain area in the image, the total length of the cut portion Cp (g=g1+g2+g3+g4) and the total length of the pore P (p=p1+p2+p3) can be obtained, and (p / g)*100[%] can be determined as the porosity of the cut portion Cp.

[0075] Meanwhile, the porosity Dc of the cut portion at the center of the internal electrode in the third direction may be a value obtained by observing an area of ​​the internal electrode having a size of 23 μm in the third direction, and the porosity Dm of the cut portion at the end of the internal electrode in the third direction may be a value obtained by observing an area of ​​the internal electrode having a size of 15 μm in the third direction. Referring to FIG. 3, Dc may be a value obtained by observing an image scanned in the K1 region, and Dm may be a value obtained by observing an image scanned in the K2 region.

[0076] In addition, Dc can be more generalized by calculating the porosity of the cuts for seven or more internal electrodes at the center of the internal electrodes in the third direction and then averaging the values, and Dm can be more generalized by calculating the porosity of the cuts for seven or more internal electrodes at the ends of the internal electrodes in the third direction and then averaging the values. That is, Dc can mean the average porosity of the cuts in the center of the internal electrodes in the third direction, and Dm can mean the average porosity of the cuts at the ends of the internal electrodes in the third direction.

[0077] On the other hand, the method for controlling the average porosity of the cut portion Cp is not particularly limited.

[0078] For example, the average porosity of the cut portion Cp can be controlled by applying an appropriate pressure to the body in the lamination direction during firing. The average porosity of the cut portion Cp can be controlled by adjusting the heating rate, time, firing atmosphere, etc. in the firing process. The average porosity of the cut portion Cp can be controlled by adjusting the amount of conductive powder, organic matter, and ceramic added to the conductive paste for the internal electrodes. The average porosity of the cut portion Cp can be controlled by mixing conductive powders of different sizes and adjusting their ratio, or by changing the printing conditions of the conductive paste.

[0079] As a specific example, when the firing temperature is set to 1185°C or higher in an atmosphere with a hydrogen concentration of 0.2 vol%, and the thickness of the internal electrode is adjusted to 1 μm or less, the average porosity of the cut portion Cp described above can be controlled to be satisfied. When the firing conditions are controlled in this way, the formation of pores due to fine oxidation of the end portion of the internal electrode can be suppressed.

[0080] The internal electrodes 121, 122 may include a first internal electrode 121 and a second internal electrode 122. The first internal electrodes 121 and the second internal electrodes 122 are alternately arranged to face each other with the dielectric layer 111 constituting the main body 110 interposed therebetween, and may be exposed to a third surface 3 and a fourth surface 4 of the main body 110, respectively.

[0081] The first internal electrode 121 may be spaced apart from the fourth surface 4 and exposed through the third surface 3, and the second internal electrode 122 may be spaced apart from the third surface 3 and exposed through the fourth surface 4. A first external electrode 131 may be disposed on the third surface 3 of the body and connected to the first internal electrode 121, and a second external electrode 132 may be disposed on the fourth surface 4 of the body and connected to the second internal electrode 122.

[0082] That is, the first internal electrode 121 is connected to the first external electrode 131 but not to the second external electrode 132, and the second internal electrode 122 is connected to the second external electrode 132 but not to the first external electrode 131. Therefore, the first internal electrode 121 may be formed to be spaced apart by a certain distance on the fourth surface 4, and the second internal electrode 122 may be formed to be spaced apart by a certain distance on the third surface 3. In addition, the first internal electrode 121 and the second internal electrode 122 may be disposed to be spaced apart from the fifth and sixth surfaces of the body 110.

[0083] The conductive metal contained in the internal electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti, and alloys thereof, but the present invention is not limited thereto. In addition, in order to control the porosity of the cut portion, the conductive paste for the internal electrodes may contain an appropriate amount of one or more of Ca, Mg, Mn, Al, and Si.

[0084] There is no particular limitation on the method for forming the internal electrodes 121 and 122. For example, the internal electrodes 121 and 122 may be formed by applying a conductive paste for internal electrodes containing a conductive metal onto a ceramic green sheet and firing the sheet. The conductive paste for internal electrodes may be applied by screen printing or gravure printing, but the present invention is not limited thereto.

[0085] The average thickness te of the internal electrodes does not need to be particularly limited. In this case, the thickness of the internal electrodes 121, 122 may refer to the size of the internal electrodes 121, 122 in the first direction. For example, when the average thickness te of the internal electrodes 121, 122 is 1.0 μm or less, the effect of suppressing the generation and propagation of cracks according to the present invention may be more significant.

[0086] Here, the average thickness te of the internal electrodes may be measured by scanning the cross sections of the body 110 in the first and second directions with a scanning electron microscope (SEM) with a magnification of 10,000. More specifically, the thickness may be measured at a number of points of one internal electrode 121, 122, for example, 30 points equally spaced in the second direction, and an average value may be measured. The 30 equally spaced points may be designated as the capacitance forming portion Ac. Furthermore, if such an average value measurement is extended to 10 internal electrodes 121, 122 to measure the average value, the average thickness of the internal electrodes 121, 122 may be further generalized.

[0087] The outer electrodes 131 and 132 are disposed on the body 110 and are connected to the inner electrodes 121 and 122 .

[0088] As shown in FIG. 2, the first external electrode 131 and the second external electrode 132 may be disposed on the third surface 3 and the fourth surface 4 of the body 110, respectively, and connected to the first internal electrode 121 and the second internal electrode 122, respectively.

[0089] In this embodiment, a structure in which the multilayer electronic component 100 has two external electrodes 131, 132 is described, but the number and shapes of the external electrodes 131, 132 can be changed depending on the configuration of the internal electrodes 121, 122 and other purposes.

[0090] Meanwhile, the external electrodes 131 and 132 may be formed using any material having electrical conductivity, such as a metal, and the specific material may be determined taking into consideration electrical characteristics, structural stability, etc., and may further have a multi-layer structure.

[0091] For example, the external electrodes 131 and 132 may include electrode layers 131a and 132a disposed on the body 110 and plating layers 131b and 132b formed on the electrode layers 131a and 132a.

[0092] As a more specific example of the electrode layers 131a and 132a, the electrode layers 131a and 132a may be firing electrodes including a conductive metal and glass, or resin-based electrodes including a conductive metal and resin.

[0093] The electrode layers 131a and 132a may be formed by sequentially forming a fired electrode and a resin-based electrode on the main body, and may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto the fired electrode.

[0094] The conductive metal contained in the electrode layers 131a and 132a may be any material having excellent electrical conductivity, but is not limited thereto. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and alloys thereof.

[0095] The plating layers 131b and 132b serve to improve mounting characteristics. The type of the plating layers 131b and 132b is not particularly limited, and may be a plating layer containing one or more of Ni, Sn, Pd, and alloys thereof, and may be formed of multiple layers.

[0096] As a more specific example of the plating layers 131b, 132b, the plating layers 131b, 132b may be Ni plating layers or Sn plating layers, and may be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the electrode layers 131a, 132a, or in a form in which a Sn plating layer, a Ni plating layer, and a Sn plating layer are sequentially formed. The plating layers 131b, 132b may also include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0097] (Example) Table 1 below shows the porosity Dc of the cut portion measured at the center in the third direction of the internal electrode, the porosity Dm of the cut portion measured at the end of the internal electrode in the third direction, the porosity Ic of the internal electrode measured at the center in the third direction of the internal electrode, and the porosity Im of the internal electrode measured at the end of the internal electrode in the third direction of each sample obtained by changing the firing conditions, and also shows the frequency of crack occurrence in each sample.

[0098] Dc, Dm, Ic and Im are the average values ​​of the values ​​for 7 or more internal electrodes measured by scanning the image of the cross section in the first direction and the third direction cut at the center of the second direction of the body with a scanning electron microscope (SEM). Dc and Ic are the values ​​obtained by observing an area with a size of 23 μm in the third direction at the center of the internal electrode in the third direction, and Dm and Im are the values ​​obtained by observing an area with a size of 15 μm in the third direction at the end of the internal electrode in the third direction.

[0099] Here, referring to FIG. 5, the porosity of the internal electrode means the ratio of the total length of the pores P (p=p1+p2+p3) to the total length a of the internal electrode in the observation area.

[0100] The frequency of cracks was measured by preparing 100 sample chips for each sample number, and observing 18 points per sample chip, 3 points each at the top, center, and bottom, on the cross sections in the first and third directions cut at the center of the second direction of the sample chip, and recording the percentage of points where cracks occurred out of a total of 1800 points for each sample number. The frequency of cracks was measured using an indenter (Nano Indentor) under the condition of a pressing strength of 0.2 kgf.

[0101] [Table 1]

[0102] It can be seen that samples 1 to 6 have a high frequency of cracks, with Dm / Dc being 0.79 or more.

[0103] On the other hand, for sample numbers 7 to 11, it can be confirmed that Dm / Dc is less than 0.79, the frequency of cracks is low, and the generation and propagation of cracks are suppressed.

[0104] Also, for sample numbers 7 to 11, Dm is 40% or less, satisfying Dm < Dc, the frequency of cracks is low, and it can be confirmed that the generation and propagation of cracks are suppressed.

[0105] On the other hand, in the case of the porosity of the internal electrode, it can be confirmed that there is no significant correlation with the frequency of cracks, and it can be confirmed that the frequency of cracks has a correlation with the porosity of the cut part rather than the porosity of the internal electrode.

[0106] FIG. 6 is an image of observing the central part of the internal electrode of the invention example (sample number 7) in the third direction, FIG. 7 is an image of observing the end part of the internal electrode of the invention example (sample number 7) in the third direction, FIG. 8 is an image of observing the central part of the internal electrode of the comparative example (sample number 1) in the third direction, and FIG. 9 is an image of observing the end part of the internal electrode of the comparative example (sample number 1) in the third direction.

[0107] Comparing FIG. 6 and FIG. 8, there is no significant difference in the porosity of the cut part in the central part of the internal electrode between the invention example and the comparative example. However, comparing FIG. 7 and FIG. 9, in the case of the invention example, it can be confirmed that the porosity of the cut part at the end of the internal electrode is surely lower than that of the comparative example.

[0108] As described above, the embodiments of the present invention have been described in detail. However, the present invention is not limited by the above-described embodiments and the attached drawings, but is limited by the attached claims. Therefore, within the scope not departing from the technical idea of the present invention described in the claims, various forms of substitution, modification, and change are possible by those having ordinary knowledge in the technical field, and it can be said that these also belong to the scope of the present invention.

[0109] In addition, the expression "one embodiment" used in the present disclosure does not mean the same embodiment, but is provided to emphasize and describe each unique feature that is different from the others. However, the above-mentioned one embodiment does not exclude being realized in combination with the features of another embodiment. For example, even if a matter described in a specific embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, unless there is a description that is opposite or contradictory to the matter in the other embodiment.

[0110] The terms used in the present disclosure are merely used to describe one embodiment and are not intended to limit the present disclosure. In this case, the singular expression includes the plural expression unless the context clearly indicates otherwise. [Explanation of symbols]

[0111] 100 Multilayer electronic components 110 Main unit 111 Dielectric layer 112, 113 Cover part 114, 115 Margin 121, 122 Internal electrode 131, 132 External electrode 131a, 132a electrode layer 131b, 132b plating layer

Claims

1. a body including dielectric layers and internal electrodes alternately arranged in a first direction, the body including first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in the second direction, and fifth and sixth surfaces connected to the first, second, third and fourth surfaces and facing each other in the third direction; an external electrode disposed on the body and connected to the internal electrode, the internal electrode includes a plurality of electrode portions and a cut portion, the cut portion including at least one of a dielectric material and a pore; a porosity of the cut measured at a center of the internal electrode in the third direction in a cross section of the body in the first direction and the third direction, Dc, and a porosity of the cut measured at an end of the internal electrode in the third direction, Dm, wherein Dm / Dc is less than 0.

79.

2. 2. The multilayer electronic component according to claim 1, wherein the Dm / Dc is 0.51 or less.

3. 2. The multilayer electronic component according to claim 1, wherein the Dm / Dc is equal to or greater than 0.26 and equal to or less than 0.

51.

4. 2. The multilayer electronic component according to claim 1, wherein a size in the third direction of the central portion of the internal electrode in the third direction is 23 μm, and a size in the third direction of the end portion of the internal electrode in the third direction is 15 μm.

5. 2. The multilayer electronic component according to claim 1, wherein the Dm is 40% or less.

6. 2. The multilayer electronic component according to claim 1, wherein Dm is 19% or less.

7. The multilayer electronic component according to claim 1 , wherein the cut portion is disposed so as to penetrate the internal electrode in the first direction.

8. The multilayer electronic component according to claim 1 , wherein the dielectric is disposed so as to connect the dielectric layers adjacent to the cut portion.

9. The multilayer electronic component according to claim 1 , wherein at least one of the plurality of cut portions includes both the dielectric material and the pores.

10. 2. The multilayer electronic component according to claim 1, wherein at least one of the plurality of cut portions is made of the dielectric material.

11. The laminated electronic component according to claim 1 , wherein the dielectric material comprises the same material as the dielectric layer.

12. 2. The multilayer electronic component according to claim 1, wherein the dielectric material contains at least one of Ca, Mg, Mn, Al, and Si.

13. 13. The multilayer electronic component according to claim 1, wherein the internal electrodes have an average thickness of 1 μm or less.

14. a body including dielectric layers and internal electrodes alternately arranged in a first direction, the body including first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in the second direction, and fifth and sixth surfaces connected to the first, second, third and fourth surfaces and facing each other in the third direction; an external electrode disposed on the body and connected to the internal electrode, the internal electrode includes a plurality of electrode portions and a cut portion, the cut portion including at least one of a dielectric material and a pore; A multilayer electronic component in which the porosity of the cut is the ratio of the length of a pore to the length of the cut, the porosity of the cut measured at the center of the internal electrode in the third direction in a cross-section of the main body in the first direction and the third direction is Dc, and the porosity of the cut measured at the end of the internal electrode in the third direction is Dm, Dm is 40% or less and satisfies Dm < Dc.

15. The multilayer electronic component according to claim 13 , wherein the Dm is 19% or less.

16. The multilayer electronic component according to claim 13 , wherein the Dc is 43% or less.

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