Electronic component mounting device and electronic component mounting method

Abstract

To provide an electronic component mounting device capable of accurately mounting electronic components onto a circuit board with high yield.SOLUTION: A disclosed electronic component mounting device includes:a circuit board holding unit that holds a circuit board; a height position measurement unit that acquires a piece of height position information SH2 regarding the height position of the upper surface of the circuit board held by the circuit board holding unit; a calculation unit that calculates a target height position when a component holder holding an electronic component descends toward the circuit board by using height position information PH1 regarding height position of the upper surface of a pre-measured solder precoat, a piece of height position information SH1 regarding a height position of the upper surface of the circuit board, the piece of height position information SH2 measured by the height position measurement unit; and a mounting head that mounts the electronic component on the solder precoat by lifting / lowering the component holder based on the target height position. The solder precoat is formed by melting the solder paste supplied onto the land, and has a solder paste residue on the surface. The height position information PH1 is the height of the upper surface of the residue.SELECTED DRAWING: Figure 15A

Description

[Technical field]

[0001] The present invention relates to an electronic component mounting device and an electronic component mounting method. [Background technology]

[0002] There is known an electronic component mounting method for manufacturing an electronic component mounted board by mounting electronic components on a board by solder bonding (for example, Patent Document 1). The method of Patent Document 1 includes a step of printing a solder paste and a step of placing electronic components on the solder paste and performing reflow soldering. However, such a method may not be suitable for high density mounting. For this reason, in recent years, a method of forming a solder coating in advance on the lands of a board on which electronic components are to be placed (solder precoat method) is once again attracting attention (for example, Patent Document 2). The formed solder coating is sometimes called a "solder precoat". [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2013-243222 A [Patent Document 2] JP 2018-167297 A Summary of the Invention [Problem to be solved by the invention]

[0004] When a manufacturer of electronic component mounting boards wants to manufacture electronic component mounting boards using the solder precoat method, they need to obtain boards with solder precoat formed in advance. There are two ways to obtain such boards: either procuring boards with solder precoat formed from outside or preparing them in-house. However, procuring from outside increases the manufacturing cost of electronic component mounting boards. In addition, it becomes difficult to quickly respond to design changes of electronic component mounting boards.

[0005] On the other hand, if you prepare it yourself, it is not impossible to use the mounting line that manufactures electronic component mounting boards to form the solder precoat. However, in that case, it is necessary to change the settings of the mounting line when forming the solder precoat and when manufacturing the electronic component mounting board, which makes the operation complicated and unrealistic.

[0006] In addition, when mounting electronic components on a substrate, it is necessary to mount the electronic components on the substrate accurately and with a high yield. However, due to the miniaturization of electronic components, it is becoming more difficult to mount electronic components on a substrate accurately and with a high yield.

[0007] In view of the above circumstances, an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method that are capable of mounting electronic components onto a board accurately with a high yield. [Means for solving the problem]

[0008] One aspect of the present invention relates to a mounting board manufacturing apparatus for manufacturing a mounting board including a board having lands and electronic components soldered to the lands, the manufacturing apparatus including a board conveying line for conveying the board having the lands, a solder precoat forming section for forming a solder precoat on the lands, a first board holding section for holding the board conveyed from the solder precoat forming section by the board conveying line, a first height position measuring section for acquiring height position information PH1 relating to the height position of an upper surface of the solder precoat and height position information SH1 relating to the height position of an upper surface of the board by a first height position measurement, on the board held by the first board holding section, and a second board holding section for holding the board conveyed from the first board holding section by the board conveying line. the second board holding unit, a second height position measurement unit that acquires height position information SH2 relating to the height position of the upper surface of the board held by the second board holding unit by a second height position measurement, an electronic component mounting unit that uses a component holder to mount the electronic component on the solder precoat of the board held by the second board holding unit, and a calculation unit that uses the height position information PH1, the height position information SH1, and the height position information SH2 to calculate a target height position when the component holder holding the electronic component descends toward the board to mount the electronic component on the solder precoat, and the electronic component mounting unit controls the lifting and lowering operation of the component holder based on the target height position to mount the electronic component on the solder precoat.

[0009] Another aspect of the present invention relates to a mounting substrate manufacturing apparatus. the manufacturing apparatus is a mounted board manufacturing apparatus for manufacturing a mounted board including a board having lands and electronic components soldered to the lands, and includes: a board transport line that transports the board having the lands; a solder precoat forming unit that forms a solder precoat on the lands; a board holding unit that holds the board transported from the solder precoat forming unit by the board transport line; a height position measuring unit that acquires height position information PH2 relating to the height position of the upper surface of the solder precoat on the board held by the board holding unit by height position measurement; an electronic component mounting unit that uses a component holder to mount the electronic components on the solder precoat of the board held by the board holding unit; and a calculation unit that uses the height position information PH2 to calculate a target height position when the component holder holding the electronic components descends toward the board to mount the electronic components on the solder precoat, and the electronic component mounting unit controls the lifting and lowering operation of the component holder based on the target height position to mount the electronic components on the solder precoat.

[0010] Another aspect of the present invention relates to a mounting board manufacturing method for manufacturing a mounting board including a board having lands and electronic components soldered to the lands, the manufacturing method including a solder precoat forming step of forming a solder precoat on the lands, a first height position measurement step of acquiring height position information PH1 relating to the height position of an upper surface of the solder precoat and height position information SH1 relating to the height position of an upper surface of the board by a first height position measurement while the board on which the solder precoat has been formed is held by a first board holding part, and a second height position measurement step of acquiring height position information SH2 relating to the height position of the upper surface of the board by a second height position measurement while the board after the first height position measurement step is held by a second board holding part. The method includes, in this order, a position measurement step and an electronic component mounting step of using a component holder to mount the electronic component on the solder precoat of the substrate held by the second substrate holding unit, and further includes, between the second height position measurement step and the electronic component mounting step, a calculation step of calculating a target height position when the component holder holding the electronic component descends toward the substrate to mount the electronic component on the solder precoat, using the height position information PH1, the height position information SH1 and the height position information SH2, and in the electronic component mounting step, the lifting and lowering operation of the component holder is controlled based on the target height position calculated in the calculation step, so that the electronic component is mounted on the solder precoat.

[0011] Another aspect of the present invention relates to a method for manufacturing a mounted substrate, the method comprising: a solder precoat forming step of forming a solder precoat on the lands; a height position measuring step of acquiring height position information PH2 relating to a height position of an upper surface of the solder precoat by height position measurement while the substrate on which the solder precoat is formed is held by a substrate holding unit; and an electronic component mounting step of mounting the electronic component on the solder precoat of the substrate held by the substrate holding unit using a component holder, in this order; and a calculation step of calculating, between the height position measuring step and the electronic component mounting step, a target height position when the component holder holding the electronic component descends toward the substrate to mount the electronic component on the solder precoat, using the height position information PH2, and in the electronic component mounting step, the electronic component is mounted on the solder precoat by controlling an elevation operation of the component holder based on the target height position. The present invention further includes the following techniques. (Technology 1) An electronic component mounting device that mounts electronic components on a substrate having a plurality of lands on which a solder precoat is formed, using a component holder, A substrate holder for holding the substrate; a height position measuring unit that acquires height position information SH2 relating to a height position of an upper surface of the substrate held by the substrate holding unit; a calculation unit that calculates a target height position when the component holder holding an electronic component descends toward the board to place the electronic component on the solder precoat, using height position information PH1 relating to the height position of the upper surface of the solder precoat measured in advance by a solder precoat inspection device, height position information SH1 relating to the height position of the upper surface of the board, and the height position information SH2 measured by the height position measurement unit; a mounting head that raises and lowers the component holder based on the target height position to mount the electronic component on the solder precoat, the solder precoat is formed by melting solder paste supplied onto the land and has a residue of the solder paste on its surface, and the height position information PH1 is the height of an upper surface of the residue. (Technology 2) Identification information for individually identifying the substrate is attached to the substrate; The electronic component mounting device described in Technology 1, wherein the calculation unit uses the height position information PH1 and the height position information SH1 stored in a height position measurement information storage unit together with the identification information by the solder precoat inspection device and acquired from the height position measurement information storage unit. (Technology 3) the substrate holding portion holds a substrate on which solder flux is applied on the solder precoat, The electronic component mounting device according to Technology 1 or 2, wherein the height position measuring unit acquires the height position information SH2 by performing height position measurement on a portion of the board that is not covered with the solder flux. (Technology 4) The electronic component mounting device according to any one of Techniques 1 to 3, wherein the height position measuring unit acquires the height position information SH2 by using a laser beam. (Technology 5) 1. An electronic component mounting method for mounting electronic components on a substrate having a plurality of lands on which a solder precoat is formed, using a component holder, comprising: A substrate, on which height position information PH1 relating to the height position of the upper surface of the solder precoat and height position information SH1 relating to the height position of the upper surface of the substrate have been measured by a solder precoat inspection device, is held by a substrate holding unit; measuring a height position of an upper surface of the substrate held by the substrate holding unit to obtain height position information SH2; calculating a target height position when the component holder holding the electronic component descends toward the board to place the electronic component on the solder precoat, using the height position information PH1, the height position information SH1, and the height position information SH2; a step of lowering the component holder holding the electronic component to the target height position and mounting the electronic component on the solder precoat of the substrate held by the substrate holder, the solder precoat is formed by melting solder paste supplied onto the land and has a residue of the solder paste on its surface, and the height position information PH1 is the height of an upper surface of the residue. (Technology 6) Identification information for individually identifying the substrate is attached to the substrate; The electronic component mounting method described in Technology 5, wherein the target height position is stored in a height position measurement information storage unit together with the identification information by the solder precoat inspection device, and is calculated using the height position information PH1 and the height position information SH1 acquired from the height position measurement information storage unit. (Technology 7) the substrate holding portion holds a substrate on which solder flux is applied on the solder precoat, The electronic component mounting method according to technique 5 or 6, wherein the height position information SH2 is acquired by performing height position measurement on a portion of the board that is not covered with the solder flux. Effect of the Invention

[0012] According to the mounting board manufacturing apparatus and the mounting board manufacturing method of the present invention, the steps from forming the solder precoat to soldering the electronic components to the board can be carried out continuously. According to the electronic component mounting apparatus and the electronic component mounting method of the present invention, the electronic components can be mounted on the board accurately with a high yield. The novel features of the present invention are set forth in the appended claims, but the present invention, both in terms of structure and content, together with other objects and features of the present invention, will be better understood from the following detailed description taken in conjunction with the drawings. [Brief description of the drawings]

[0013] [Figure 1] 1 is a diagram showing a schematic configuration of a mounting substrate manufacturing apparatus according to a first embodiment. [Diagram 2] 2 is a diagram illustrating an example of a control system of the mounting substrate manufacturing apparatus illustrated in FIG. 1. [Diagram 3] 2 is a diagram showing a schematic configuration of an example of a solder precoat forming section included in the apparatus shown in FIG. 1. FIG. [Figure 4] 4 is a diagram showing a schematic view of a part of the solder precoat forming portion shown in FIG. 3. [Diagram 5] 1A to 1C are diagrams illustrating a process of a method for applying solder paste to a substrate using the apparatus of the present embodiment. [Figure 6A] 3A to 3C are cross-sectional views each showing a schematic diagram of one step of an example process for forming a solder precoat using the apparatus of embodiment 1. [Figure 6B] FIG. 6B is a cross-sectional view showing a schematic diagram of a step following the step shown in FIG. 6A. [Figure 6C] FIG. 6C is a cross-sectional view illustrating a step following the step illustrated in FIG. 6B. [Figure 6D] FIG. 6D is a cross-sectional view illustrating a step following the step illustrated in FIG. 6C. [Figure 7] 2 is a diagram showing a schematic diagram of an example of a solder precoat inspection device included in the device shown in FIG. 1. FIG. [Figure 8] 4 is a flowchart showing an example of a process in a solder precoat inspection device. [Figure 9A] 1A to 1C are diagrams showing a schematic diagram of one step of an example of a method for holding a substrate in a solder precoat inspection device. [Figure 9B] FIG. 9B is a diagram showing a schematic diagram of a step subsequent to the step shown in FIG. 9A. [Figure 10] FIG. 2 is a top view showing a schematic diagram of measurement positions and the like in a solder precoat inspection device. [Figure 11] FIG. 13 is a schematic diagram for explaining height position measurement in a solder precoat inspection device. [Figure 12] 2 is a diagram illustrating an example of an electronic component mounting device included in the device illustrated in FIG. 1. FIG. [Figure 13] 13 is a flowchart showing an example of a process in the electronic component mounting apparatus shown in FIG. 12. [Figure 14] 13A to 13C are diagrams illustrating an example of a process for mounting electronic components in the electronic component mounting apparatus illustrated in FIG. 12. [Figure 15A] 3 is a cross-sectional view showing a schematic diagram of one step of an example of a process for manufacturing a mounting substrate in the manufacturing apparatus of embodiment 1. FIG. [Figure 15B] FIG. 15B is a cross-sectional view showing a schematic diagram of a step following the step shown in FIG. 15A. [Figure 15C] FIG. 15C is a cross-sectional view illustrating a step following the step illustrated in FIG. 15B. [Figure 15D] FIG. 15D is a cross-sectional view showing a schematic diagram of a step following the step shown in FIG. 15C. [Figure 15E] FIG. 15E is a cross-sectional view illustrating a step following the step illustrated in FIG. 15D. [Figure 16] 11 is a flow chart showing an example of a process in an electronic component mounting device included in the manufacturing apparatus of embodiment 2. [Figure 17] 13 is a schematic diagram for explaining height position measurement in an electronic component mounting device included in the manufacturing apparatus of embodiment 2. FIG. [Figure 18] 11 is a schematic diagram for explaining an example of a step of mounting an electronic component in an electronic component mounting device included in the manufacturing apparatus of embodiment 2. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, an embodiment of the present invention will be described with reference to an example. Note that the present invention is not limited to the example described below. In this specification, the term "height position" refers to a coordinate position when the vertical direction is the coordinate axis. The "height position" may be indicated as a relative height with respect to a reference height position.

[0015] (Mounting board manufacturing equipment) The manufacturing apparatus of this embodiment is an apparatus for manufacturing a mounted board on which a plurality of electronic components are mounted. The mounted board is a board on which electronic components are mounted. That is, the manufacturing apparatus of this embodiment is an electronic component mounted board manufacturing apparatus. Two examples of the manufacturing apparatus of this embodiment will be described below. These two examples may be referred to as "manufacturing apparatus (D1)" and "manufacturing apparatus (D2)".

[0016] (Manufacturing equipment (D1)) The manufacturing device (D1) is a manufacturing device for manufacturing a mounting board including a substrate having lands and electronic components soldered to the lands. The manufacturing device (D1) includes a substrate conveying line for conveying a substrate having lands, a solder precoat forming section for forming a solder precoat on the lands, a first substrate holding section for holding the substrate conveyed from the solder precoat forming section by the substrate conveying line, a first height position measuring section for acquiring height position information PH1 relating to the height position of the upper surface of the solder precoat and height position information SH1 relating to the height position of the upper surface of the substrate by a first height position measurement, on the substrate held by the first substrate holding section, and a substrate conveying section for conveying the substrate conveyed from the first substrate holding section by the substrate conveying line. the second board holding unit holds an electronic component on the solder precoat of the board held by the second board holding unit, a second height position measurement unit obtains height position information SH2 relating to the height position of the upper surface of the board held by the second board holding unit by a second height position measurement, an electronic component mounting unit uses a component holder to mount an electronic component on the solder precoat of the board held by the second board holding unit, and a calculation unit calculates a target height position when the component holder holding the electronic component descends toward the board to mount the electronic component on the solder precoat, using the height position information PH1, the height position information SH1, and the height position information SH2. The electronic component mounting unit controls the lifting and lowering operation of the component holder based on the target height position to mount the electronic component on the solder precoat.

[0017] The manufacturing apparatus (D1) can perform the steps from forming the solder precoat to mounting the electronic components on the substrate in a continuous manner, and can mount the electronic components on the substrate accurately with a high yield.

[0018] In the following, the terms "upstream side" and "downstream side" may be used according to the direction in which the board is transported. The board is transported from the upstream side to the downstream side, during which the solder precoat is formed and the electronic components are mounted. The solder paste supply unit, the heating unit, the solder flux application unit, the electronic component mounting unit, and the reflow unit are arranged in this order from the upstream side to the downstream side. The first board holding unit and the first height position measurement unit may be arranged between the heating unit and the solder flux application unit (described later), or may be included in other components. For example, the first board holding unit and the first height position measurement unit may be incorporated in a solder precoat inspection device (described later) or in the solder flux application unit.

[0019] The substrate is a substrate on which electronic components are mounted. The substrate has a wiring portion to which the electronic components are soldered. For example, the substrate may have a portion called a land to which the electronic components are soldered. There is no particular limitation on the substrate, and the substrate may be a known substrate on which electronic components are mounted.

[0020] It is preferable that the first substrate holding unit and the second substrate holding unit have the same configuration, which makes it possible to use height position information measured by the first substrate holding unit as height position information of the substrate held by the second substrate holding unit with high accuracy.

[0021] The manufacturing device (D1) may further include a height position measurement information storage unit that stores the height position information PH1 and the height position information SH1 obtained by the first height position measurement unit. In this case, the calculation unit may read the height position information PH1 and the height position information SH1 from the height position measurement information storage unit. With this configuration, the height position information obtained by the measurement by the first height position measurement unit can be reliably transmitted to the calculation unit.

[0022] The substrate may be provided with identification information for individually identifying the substrate. The first height position measurement unit may store the height position information PH1 and the height position information SH1 obtained by the first height position measurement in the height position measurement information storage unit together with the identification information. Furthermore, the calculation unit may read the identification information, the height position information PH1, and the height position information SH1 from the height position measurement information storage unit. With this configuration, appropriate height position information PH1 and height position information SH1 can be reliably transmitted to the calculation unit.

[0023] The solder precoat forming unit may include a solder paste supply unit that supplies solder paste onto the lands, and a heating unit that forms the solder precoat on the lands by heating the solder paste. According to this configuration, the solder precoat is formed using solder paste, so that the manufacturing cost of the mounting board can be reduced.

[0024] In a typical example, the solder precoat has a solder paste residue on its surface. In that case, the first height position measuring unit may measure the height of the upper surface of the residue. In this configuration, the solder precoat covered with the residue is measured by the first height position measuring unit. This makes it possible to omit equipment for removing the residue from the surface of the solder precoat, and simplifies the mounting board manufacturing device and the mounting board manufacturing process.

[0025] Flux residue is the result of the flux in the solder paste being denatured and hardened by heating. Unlike the flux before hardening, the flux residue has low optical transparency. Therefore, the height position of the surface of the flux residue can be measured optically more accurately than the flux before hardening.

[0026] In general mounting of electronic components, it is considered preferable to remove flux residue by cleaning or the like. However, in that case, a cleaning process using a cleaning device is required, and a drying process using a drying device may also be required. Therefore, when cleaning the flux residue, the mounting system for mounting the electronic components becomes long and complicated. Also, the time required for mounting the electronic components increases. With the manufacturing device of this embodiment and the manufacturing method (M) of this embodiment described later, it is possible to mount the electronic components without removing the flux residue. Therefore, the device and process required for removing the flux residue can be omitted.

[0027] The manufacturing device (D1) may further include a solder flux applicator disposed between the first substrate holder and the second substrate holder. The solder flux applicator applies solder flux onto the solder precoat of the substrate. The second height position measuring unit may acquire height position information SH2 by performing a second height position measurement on a portion of the substrate that is not covered with solder flux. With this configuration, accurate measurement is possible since the surface of the substrate that is not covered with solder flux is measured.

[0028] (Manufacturing equipment (D2)) The manufacturing device (D2) is a device for manufacturing a mounting board including a board having lands and electronic components soldered to the lands. The manufacturing device (D2) includes a board conveying line for conveying a board having lands, a solder precoat forming section for forming a solder precoat on the lands, a board holding section for holding a board conveyed from the solder precoat forming section by the board conveying line, a height position measuring section for acquiring height position information PH2 relating to the height position of the upper surface of the solder precoat on the board held by the board holding section by measuring the height position, an electronic component mounting section for mounting electronic components on the solder precoat of the board held by the board holding section using a component holder, and a calculation section for calculating a target height position when the component holder holding the electronic components descends toward the board to mount the electronic components on the solder precoat using the height position information PH2. The electronic component mounting section controls the lifting and lowering operation of the component holder based on the target height position to mount the electronic components on the solder precoat.

[0029] The manufacturing apparatus (D2) can be realized by using a part or all of the configuration of the manufacturing apparatus (D1), and therefore, overlapping explanations may be omitted. The manufacturing apparatus (D2) can obtain the same effects as the manufacturing apparatus (D1).

[0030] The manufacturing device (D2) may further include a solder flux application unit disposed between the solder precoat forming unit and the substrate holding unit. The solder flux application unit may apply solder flux onto the solder precoat of the substrate. The height position measurement unit may acquire the height position information PH2 by performing a height position measurement on the solder precoat covered with the solder flux. In this case, the height position measurement unit may perform the height position measurement using a laser beam.

[0031] (Mounting board manufacturing method) The manufacturing method of this embodiment is a method for manufacturing a mounting board on which a plurality of electronic components are mounted. Two examples of the manufacturing method of this embodiment will be described below. These two examples may be referred to as "manufacturing method (M1)" and "manufacturing method (M2)". Since the manufacturing method (M1) and the manufacturing method (M2) correspond to the manufacturing apparatus (D1) and the manufacturing apparatus (D2), respectively, overlapping descriptions may be omitted. According to the manufacturing method (M1) and the manufacturing method (M2), the same effects as those of the manufacturing apparatus (D1) and the manufacturing apparatus (D2) can be obtained.

[0032] (Manufacturing method (M1)) The manufacturing method (M1) is a mounting board manufacturing method for manufacturing a mounting board including a board having lands and electronic components soldered to the lands. The manufacturing method (M1) includes, in this order, a solder precoat forming step of forming a solder precoat on the lands, a first height position measuring step of acquiring height position information PH1 relating to the height position of the upper surface of the solder precoat and height position information SH1 relating to the height position of the upper surface of the board by a first height position measurement while the board on which the solder precoat has been formed is held by a first board holding part, a second height position measuring step of acquiring height position information SH2 relating to the height position of the upper surface of the board by a second height position measurement while the board that has been subjected to the first height position measuring step is held by a second board holding part, and an electronic component mounting step of mounting electronic components on the solder precoat of the board held by the second board holding part using a component holder. The method further includes, between the second height position measurement step and the electronic component mounting step, a calculation step for calculating a target height position when the component holder holding the electronic component descends toward the board to mount the electronic component on the solder precoat, using height position information PH1, height position information SH1, and height position information SH2, and in the electronic component mounting step, the raising and lowering operation of the component holder is controlled based on the target height position calculated in the calculation step, so that the electronic component is mounted on the solder precoat.

[0033] The manufacturing method (M1) may further include a height position information storage step of storing the height position information PH1 and the height position information SH1 obtained by the first height position measurement step in a height position measurement information storage unit. In this case, in the calculation step, the height position information PH1 and the height position information SH1 may be read from the height position measurement information storage unit.

[0034] In the manufacturing method (M1), the substrate may be provided with identification information for individually identifying the substrate. In this case, in the first height position measurement step, the height position information PH1 and the height position information SH1 obtained by the first height position measurement may be stored in a height position measurement information storage unit together with the identification information. In this case, in the calculation step, the identification information and the height position information PH1 and the height position information SH1 may be read from the height position measurement information storage unit.

[0035] In the manufacturing method (M1), the solder precoat forming step may include a solder paste supplying step of supplying solder paste onto the lands, and a heating step of forming a solder precoat on the lands by heating the solder paste.

[0036] In a typical example, the solder precoat has a residue of solder paste on a surface thereof. In the manufacturing method (M1), the height of an upper surface of the residue may be measured in the first height position measuring step.

[0037] The manufacturing method (M1) may further include a solder flux applying step between the first height position measuring step and the second height position measuring step. The solder flux applying step is a step of applying solder flux onto the solder precoat of the substrate. In the second height position measuring step, the height position information SH2 may be acquired by performing a second height position measurement on a portion of the substrate that is not covered with the solder flux.

[0038] (Manufacturing method (M2)) The manufacturing method (M2) is a manufacturing method for manufacturing a mounting board including a board having lands and electronic components soldered to the lands. The manufacturing method (M2) includes, in this order, a solder precoat forming step of forming a solder precoat on the lands, a height position measuring step of acquiring height position information PH2 relating to the height position of the upper surface of the solder precoat by measuring the height position while the board on which the solder precoat is formed is held by a board holding part, and an electronic component mounting step of mounting an electronic component on the solder precoat of the board held by the board holding part using a component holder. The manufacturing method (M2) further includes, between the height position measuring step and the electronic component mounting step, a calculation step of calculating, using the height position information PH2, a target height position when the component holder holding the electronic component descends toward the board to mount the electronic component on the solder precoat. Then, in the electronic component mounting step, the lifting and lowering operation of the component holder is controlled based on the target height position to mount the electronic component on the solder precoat.

[0039] The manufacturing method (M2) may further include a solder flux application step between the solder precoat forming step and the electronic component mounting step. The solder flux application step is a step of applying solder flux onto the solder precoat of the board. In the height position measurement step, height position information PH2 may be acquired by performing height position measurement on the solder precoat covered with the solder flux.

[0040] In the manufacturing method (M2), in the height position measuring step, the height position may be measured by using a laser beam.

[0041] In the following, examples of the manufacturing apparatus and manufacturing method of the present invention will be specifically described with reference to the drawings. The above-mentioned components and steps can be applied to the components of the manufacturing apparatus and the steps of the manufacturing method described below. The components of the manufacturing apparatus and the steps of the manufacturing method described below can be modified based on the above description. The matters described below may be applied to the above embodiment. In the embodiments described below, components and steps that are not essential to the manufacturing apparatus and manufacturing method of the present invention may be omitted. In the following drawings, some members and some symbols may be omitted to facilitate understanding.

[0042] (Embodiment 1) In the first embodiment, an example of a manufacturing apparatus (D1) and an example of a manufacturing method (M1) will be described. The configuration of a mounting board manufacturing apparatus 10 of the first embodiment is shown in FIG. 1. The manufacturing apparatus 10 is an example of the above-mentioned manufacturing apparatus (D1). The manufacturing apparatus 10 includes a substrate conveying line 11, an information processing apparatus 20, a loader 50, a solder precoat forming section 90, a solder precoat inspection apparatus 300, a flux application apparatus (flux application section) 400, electronic component mounting apparatuses (electronic component mounting sections) 501 and 502, a mounting state inspection apparatus 600, a reflow apparatus 700, a substrate inspection apparatus 800, and an unloader 900. These are arranged in this order from the upstream side to the downstream side. A known configuration may be applied to configurations other than those specific to the present invention. Hereinafter, the electronic component mounting apparatuses 501 and 502 may be collectively referred to as "electronic component mounting apparatus 500".

[0043] The substrate conveying line 11 conveys the substrate 1 (described later) from the solder precoat forming unit 90 to the substrate inspection device 800. The substrate conveying line 11 does not have to be a single continuous line, and may be composed of multiple conveying lines. A known substrate conveying line can be used as the substrate conveying line 11.

[0044] FIG. 2 shows a schematic configuration of the manufacturing apparatus 10 for performing operations of each unit (each device) and information processing. The information processing apparatus 20 is connected to each unit (each device). The information processing apparatus 20 includes an arithmetic processing device 20a and a storage device 20b. The solder precoat inspection apparatus 300 includes an arithmetic processing device 302a and a storage device 302b that constitute a control unit. The electronic component mounting apparatus 501 includes an arithmetic processing device 501a and a storage device 501b that constitute a control unit. The arithmetic processing device 20a, the storage device 20b, the arithmetic processing device 302a, the storage device 302b, the arithmetic processing device 501a, and the storage device 501b include each unit shown in FIG. 2 or function as each unit shown in FIG. 2. The electronic component mounting apparatus 502 also includes an arithmetic processing device and a storage device, similar to the electronic component mounting apparatus 501.

[0045] The arithmetic processing device is configured with a CPU (Central Processing Unit) and the like. The storage device is configured with one or more RAMs (Random Access Memories), hard disks, and the like. These may be configured as individual circuits or LSIs (Large Scale Integrated Circuits), or may be configured as an integrated unit. The information processing device 20 is communicatively connected to other devices included in the mounting board manufacturing apparatus 10 (including the solder precoat forming section 90, the solder precoat inspection device 300, the flux application device 400, the electronic component mounting device 500, and the reflow device 700) via a local area network 20N, such as a wired or wireless network. The information processing device 20 exchanges data with these devices. Thereby, the information processing device 20 manages the processes performed in the mounting board manufacturing apparatus 10.

[0046] The storage device of the information processing device 20 stores programs and data required for each device of the mounted board manufacturing device 10. For example, data required for the electronic component mounting devices 501 and 502 include a mounting program, control parameters, and work information. The mounting program is a program including coordinates of mounting points on the board 1 (mounting coordinates of the electronic components 4), information on the electronic components 4 to be mounted on the mounting points, supply positions of the electronic components 4, and the mounting order on the board 1. The control parameters are information (e.g., speed, acceleration, etc.) required for controlling the operation of the electronic component mounting devices 501 and 502. The work data includes at least information on the components and information on the board. The information on the electronic components includes data on the shapes and dimensions (width, length, thickness) of the electronic components. The information on the board includes data on the size and thickness of the board as well as coordinates of reference marks. The data required for the solder precoat inspection device 300 includes a measurement program including coordinates of measurement points on the board 1. Data required for the mounting state inspection device 600 corresponds to inspection data including the coordinates of the inspection target (electronic component) on the board 1, the judgment criteria and image processing parameters used in the inspection, etc. Data required for the reflow device 700 includes data such as the set temperature of the heating device for heating the board and the conveying speed of the board 1. The information processing device 20 transmits (downloads) these programs and data to each device constituting the mounted board manufacturing device 10 before starting operation. Each device downloads the program and data from the information processing device 20 and stores them in the control unit provided in each device. The control unit of each device includes an arithmetic processing device configured with a CPU and a storage device configured with one or more RAMs (random access memories), hard disks, etc., and each device executes predetermined processing and work based on the downloaded program and data.

[0047] The loader 50 supplies boards stored in a rack (not shown) to the solder precoat forming section 90. The unloader 900 retrieves completed mounted boards into the rack. Each device from the solder precoat forming section 90 to the board inspection device 800 includes a conveyor (board transport line 11) that transports boards. Each conveyor is positioned so that it can receive boards from a device on the upstream side (the loader 50 side) and pass them on to a device on the downstream side (the unloader 900 side).

[0048] Next, of the various sections (devices) that configure the mounted substrate manufacturing apparatus 10, the solder precoat forming section 90, the solder precoat inspection device 300, and the electronic component mounting device 500 will be described below.

[0049] (Solder precoat forming section) The configuration of the solder precoat forming unit 90 of the first embodiment is shown in Fig. 3. In this specification, the direction along the direction in which the substrate 1 is transported is the X-axis, the perpendicular direction is the Z-axis, and the direction perpendicular to the X-axis and Z-axis is the Y-axis. The directions along each axis are the X-direction, the Y-direction, and the Z-direction.

[0050] The solder precoat forming section 90 is an apparatus for forming a solder precoat on the substrate 1. As shown in Fig. 3, the solder precoat forming section 90 includes a control section 95, a solder paste supply section 100, a heating section 210, and a cooling section 220. These are arranged in a line in the X-axis direction on a base 101. Inside these, a substrate transport section 230 is arranged to transport the substrate along the X-axis direction. The transport section 230 constitutes a part of the substrate transport line 11.

[0051] The solder paste supply unit 100 supplies solder paste to the substrate 1. The heating unit 210 heats the solder paste supplied to the substrate 1 to melt the solder particles contained in the solder paste. The cooling unit 220 cools and solidifies the melted solder particles (hereinafter, sometimes referred to as "molten solder"). The substrate conveying unit 230 conveys the substrate 1 in the order of the solder paste supply unit 100, the heating unit 210, and the cooling unit 220. Inside the base 101, a control unit 95 for controlling the solder precoat forming unit 90 is disposed. The control unit 95 controls the solder paste supply unit 100, the heating unit 210, the cooling unit 220, and the substrate conveying unit 230 to cause the solder precoat forming unit 90 to perform the work of forming a solder precoat on the substrate 1. In this way, the solder precoat forming unit 90 of the present invention is an apparatus integrally equipped with the solder paste supply unit 100 and the heating unit 210 necessary for forming the solder precoat.

[0052] (Solder paste supply section) The solder paste supply unit 100 shown in the first embodiment supplies solder paste onto the substrate 1 by screen printing. The solder paste contains solder (solder alloy) particles and flux. The solder paste may be supplied by a method other than screen printing. For ease of understanding, FIG. 3 shows an example in which the substrate 1 is disposed in each of the solder paste supply unit 100, the heating unit 210, and the cooling unit 220.

[0053] The solder paste supply unit 100 includes a moving table 102, a lifting mechanism 103, a printing stage 104, a printing head 113, a camera unit 115, a mask plate (mask) 116, a printing stage conveyor (first board transport unit) 231, a board loading conveyor 234, and a board relay conveyor (second board transport unit) 232.

[0054] 4 and 5 are schematic diagrams showing the print stage 104 and the periphery of the print head 113 as viewed from the substrate carry-in conveyor 234 side.

[0055] A pair of support frames 91 are erected on a base 101 with a gap therebetween in the X direction. A movable table 102 is disposed on the base 101, sandwiched between the support frames 91. A lifting mechanism 103 that raises and lowers a print stage 104 is disposed on the movable table 102. The movable table 102 moves the lifting mechanism 103 in a horizontal direction (directions along the X-axis and Y-axis, and a rotation direction in a horizontal plane about the Z-axis as the rotation axis; the same applies below), thereby moving the print stage 104 in the horizontal direction. The lifting mechanism 103 moves the print stage 104 along the Z-axis, i.e., raises and lowers it.

[0056] The printing stage 104 includes a base 104a coupled to the lifting mechanism 103. A support column 104b is provided on the upper surface of the base 104a. A substrate guide 104c extending along the X-axis is coupled to the upper end of the support column 104b. A printing stage conveyor 231 including a belt for transporting the substrate 1 is disposed inside the substrate guide 104c.

[0057] The print stage conveyor 231 is capable of transferring the board 1 between a board carry-in conveyor 234 disposed to pass through an opening of one support frame 91, and a board relay conveyor 232 disposed to pass through an opening of the other support frame 91. The board 1 carried in by the board carry-in conveyor 234 is transferred to the print stage conveyor 231 and transported to the solder paste supply area PA, and held by the print stage 104. The board 1 to which solder paste has been supplied at the print stage 104 is carried out from the solder paste supply area PA of the print stage conveyor 231, and transferred to the board relay conveyor 232.

[0058] A backup lifting mechanism 104e is disposed on the upper surface of the base 104a. The backup lifting mechanism 104e raises and lowers a backup unit 104f that supports the substrate 1 from below. When the substrate 1 is carried into the solder paste supply area PA of the printing stage conveyor 231, the backup unit 104f is raised so that the bottom surface of the substrate 1 is supported by the backup unit 104f.

[0059] A side clamper 104d extending along the X-axis is provided on each of the upper surfaces of the pair of substrate guides 104c. The side clampers 104d are opened and closed by a drive mechanism (not shown). The backup section 104f supports the lower surface of the substrate 1 and at the same time raises the substrate 1 to a height where the upper surface of the substrate 1 and the upper surface of the side clampers 104d are aligned. When the side clampers 104d are closed with the substrate 1 and the side clampers 104d aligned at the same height, both side surfaces of the substrate 1 are sandwiched between the side clampers 104d and the substrate 1 is fixed. In this manner, the printing stage 104 holds the substrate 1.

[0060] A support beam 113a that supports the print head 113 is disposed at the upper ends of the pair of support frames 91 so as to be movable in the Y direction via a linear motion guide mechanism 11a. One end of the support beam 113a is connected to a well-known print head moving mechanism 91b that is made up of a feed screw and a motor that rotates the feed screw, etc. When the print head moving mechanism 91b is driven, the print head 113 moves back and forth in the Y direction, which is the squeegeeing direction.

[0061] 4, the print head 113 is equipped with a rear squeegee 113b and a front squeegee 113c that extend downward from a support beam 113a. By driving a squeegee driver 113d that is provided on the upper surface of the support beam 113a, either the rear squeegee 113b or the front squeegee 113c is lowered depending on the squeegeeing direction.

[0062] A mask plate 116 is disposed horizontally below the print head 113. The mask plate 116 has an opening 116a (see FIG. 6) formed therein, which penetrates in the thickness direction. The solder paste supply unit 100 performs screen printing, in which solder paste P (described below) is supplied to the upper surface of the mask plate 116 and is moved by either the rear squeegee 113b or the front squeegee 113c, thereby supplying the solder paste P onto the substrate 1 in a predetermined printing pattern. The solder paste P contains a solder alloy and flux.

[0063] A camera unit 115 is disposed below the mask plate 116 (see FIG. 3). The camera unit 115 can be moved in the X and Y directions by a known camera movement mechanism (not shown) fixed to the support frame 91. The camera unit 115 incorporates a camera that captures images of the substrate 1 and the mask plate 116 held on the print stage 104. A substrate reference mark (not shown) for recognizing the position of the substrate 1 is formed on the surface of the substrate 1. Meanwhile, a mask reference mark or hole for the same purpose is formed on the mask plate 116. The control unit 95 captures images of the substrate reference mark and the mask reference mark by the camera unit 115, and calculates the relative positional deviation between the substrate 1 and the mask plate 116 by performing image recognition of the acquired image. Then, the moving table 102 is driven to adjust the position of the print stage 104 so that the positional deviation between the two is zero or minimized, thereby aligning the substrate 1 and the mask plate 116.

[0064] (heating part) Next, a description will be given of the configuration of the heating unit 210. The heating unit 210 includes a housing 213 that covers the downstream side of the board relay conveyor 232 extending from the solder paste supply unit 100, and a board heating device 211 and a local heating device 212 (heating device) that are arranged inside the housing 213. The housing 213 is formed with an air hole 215 for exhausting volatile components from the solder paste generated by heating.

[0065] The local heating device 212 is disposed above the board relay conveyor 232 and can be moved horizontally by a moving mechanism 216 disposed in the housing 213. The local heating device 212 may be any device that locally heats the board 1 or the solder paste P, such as by microwave heating or induction heating. A heating area HA is provided on the board relay conveyor 232, and the local heating device 212 locally heats a part of the solder paste P of the board 1 located in the heating area HA to melt the solder contained in the part of the solder paste P. The board heating device 211 is disposed below the board relay conveyor 232 and heats the entire board 1 located in the heating area HA from below. The heating by the board heating device 211 supplementarily heats the board 1 to facilitate the melting of the solder by the local heating device 212. Note that if the solder in the solder paste P can be melted without the board heating device 211, the board heating device 211 may be omitted.

[0066] The board relay conveyor 232 receives the board 1 to which the solder paste P is supplied by the solder paste supply unit 100 and transports it to the heating area HA. ​​Then, when the melting of the solder by the local heating device 212 is completed, the board 1 is transported from the heating area HA to the cooling unit 220 described later. In this embodiment, the board relay conveyor 232 serves as a second board transport unit that transports the board 1 in the heating area HA where heating is performed by the heating device. The board relay conveyor 232 extends from the solder paste supply unit 100 to the heating unit 210 and is shared by both. This allows the board 1 to be transported smoothly from the solder paste supply unit 100 to the heating unit 210, and simplifies and downsizes the solder precoat manufacturing device. The board relay conveyor 232 may be configured with multiple board transport conveyors divided into a section that passes through the heating area HA and other sections.

[0067] (cooling section) Next, the configuration of the cooling section 220 will be described. The cooling section 220 includes a housing 224 that covers the board discharge conveyor 233, and a cooling fan (cooling device) 221 arranged inside the housing 224. The housing 224 has vent holes 220a and 220b for introducing and discharging cooling air. The board 1 on the board discharge conveyor 233 is cooled by operating the cooling fan 221. This cools and solidifies the solder melted in the heating section 210. In this embodiment, the board discharge conveyor 233 constitutes a part of the board transport section 230.

[0068] The process of forming the solder precoat will be described with reference to Fig. 6. As shown in Fig. 6, the substrate 1 includes a plate-shaped portion 1a and a plurality of lands 1b formed on the plate-shaped portion 1a. The lands 1b are part of the wiring pattern and are the portions on which the solder precoat is formed.

[0069] In forming the solder precoat, first, as shown in FIG. 6A, a mask plate 116 is placed on the substrate 1. As shown in FIG. 6A, a plurality of openings 116a are formed in the mask plate 116. The positions of the openings 116a correspond to the positions of the lands 1b. However, in the example shown in the first embodiment, the openings 116a are larger than the corresponding lands 1b. That is, the area of ​​the openings 116a is larger than the area of ​​the corresponding lands 1b. Therefore, when the substrate 1 is perfectly aligned with the mask plate 116 in an ideal state, the lands 1b are located inside the openings 116a.

[0070] When the size of the land 1b is small, if an opening 116a having the same shape (i.e., the same area) as the land 1b is used, the amount of solder particles filled in the opening 116a by screen printing may be insufficient. To avoid this, it is possible to use a solder paste in which the particle size of the solder particles is very small, but in that case, it is necessary to use an expensive solder paste. Therefore, by using an opening 116a larger than the area of ​​the corresponding land 1b as in this embodiment, it is possible to solve the problem of insufficient solder and the problem of cost. The size of the opening 116a may be equal to or smaller than the size of the land 1b.

[0071] Next, the solder paste P on the upper surface of the mask plate 116 is moved over the mask plate 116 using the rear squeegee 113b or the front squeegee 113c. As a result, as shown in FIG 6B, a portion of the solder paste P that has passed through the openings 116a fills the openings 116a.

[0072] Next, the lifting mechanism 103 is driven to separate the substrate 1 from the mask plate 116. Fig. 6C shows the substrate 1 after the mask plate 116 has been separated. Solder paste P is disposed on the lands 1b.

[0073] Thereafter, the substrate 1 is transported to the heating area HA in the heating unit 210. The substrate 1 transported to the heating area HA is heated by the substrate heating device 211. The heating by the substrate heating device 211 is auxiliary heating to facilitate melting of the solder by the local heating device 212. The control unit 95 heats the solder paste P of the substrate 1 located in the heating area HA by the local heating device 212 to melt the solder contained in the solder paste P. When a predetermined time has elapsed since the heating by the substrate heating device 211, the control unit 95 operates the moving mechanism 216 to sequentially make the local heating device 212 face the solder paste P supplied to the substrate 1. This causes the solder in the solder paste P to melt and spread over the surface of the land 1b. Note that even if the solder paste P is connected between adjacent lands 1b, the local heating device 212 melts the solder on the land 1b first, so that the solder between the lands 1b is attracted to the melted solder. Therefore, a so-called solder bridge in which molten solder connects between the lands 1b does not occur.

[0074] When the melting of the solder by the local heating device 212 is completed, the control unit 95 operates the board relay conveyor 232 and the board discharge conveyor 233 to transport the board 1 to the cooling unit 220. The cooling unit 220 operates the cooling fan 221 to blow air taken in from the ventilation holes 220a and / or the ventilation holes 220b onto the board 1 to cool it. Note that if there is no special need to cool the board 1, the cooling by the cooling unit 220 may be omitted.

[0075] The cooled board 1 is discharged from the cooling section 220 by driving the board discharge conveyor 233. In this manner, the solder precoat 2 is formed on the land 1b on the board 1 (FIG. 6D). The board 1 on which the solder precoat 2 has been formed is transported by the board transport line 11 to the solder precoat inspection device 300.

[0076] (Solder pre-coat inspection device) The configuration of the solder precoat inspection device 300 is shown in FIG. 7. The inspection device 300 is a device that inspects whether the solder precoat 2 is properly formed. The inspection device 300 includes an inspection head 310, a first board holding unit 320, and a board transport conveyor 330. The inspection head 310 includes a measuring device (first height position measuring unit) that measures the height position, and a camera unit. The inspection head 310 can be moved in the horizontal direction by a well-known XY moving device (not shown). The first height position measuring unit includes a distance sensor and a displacement sensor, and measures the height position in a non-contact manner.

[0077] The board transport conveyor 330 is provided on a pair of board guides 331 extending parallel to the X direction. The board transport conveyor 330 constitutes a part of the board transport line 11.

[0078] The first substrate holding part 320 includes a lifting platform 321, a plurality of backup pins 322 extending vertically upward from the lifting platform 321, and an upper surface presser 323. The lifting platform 321 is raised and lowered by a lifting mechanism 324.

[0079] As long as the first substrate holding part 320 is capable of holding the substrate 1, it may have a structure other than that shown in the figure, or may include another structure in addition to the structure shown in the figure.

[0080] The processing of the board 1 in the solder precoat inspection device 300 will be described with reference to FIGS. 8 to 10. First, the board 1 is carried into the inspection device 300 and held there (step S301). The board 1 is carried to a work area W1 (first work position) inside the device by the board carrying conveyor 330, where it is held by the first board holding unit 320. FIG. 9A shows the state before the board 1 is fixed, and FIG. 9B shows the state after the board 1 is fixed. As shown in FIG. 9B, when the board 1 is fixed, the backup pin 322 is raised. The raised backup pin 322 abuts against the lower surface of the board 1 to raise the board 1. The upper surface presser 323 presses the upper surface of the board 1 raised by the backup pin 322. By raising the backup pin 322, the board 1 is fixed between the backup pin 322 and the upper surface presser 323.

[0081] Data required for processing the substrate 1 (substrate information related to the substrate 1, etc.) may be stored in advance in the storage device 302b of the inspection device 300, or may be downloaded from the storage device 20b of the information processing device 20 and stored in the storage device 302b.

[0082] Next, under the control of the arithmetic processing device 302a, the reference mark 1r on the substrate 1 is recognized (step S302). Specifically, the substrate 1 is photographed by the camera unit, and the photographed image is subjected to recognition processing to recognize the reference mark 1r. A top view of an example of the substrate 1 is shown in FIG. 10. A plurality of reference marks 1r are formed on the substrate 1. From the positions of the plurality of reference marks 1r obtained by the recognition processing, information on the horizontal position of the substrate 1 held by the first substrate holding unit 320, i.e., the positions of the measurement points set on the substrate 1, is obtained. The inspection head 310 measures the height position of the measurement point set at a predetermined horizontal position, and at that time, the horizontal position of the inspection head 310 is adjusted based on the information on the horizontal position of the substrate 1.

[0083] Next, the height position measurement processing unit of the arithmetic processing device 302a controls the first height position measurement unit (inspection head 310) of the solder precoat inspection device 300 to obtain height position information PH1 regarding the height position of the upper surface of the solder precoat 2 and height position information SH1 regarding the height position of the upper surface of the substrate 1, on the substrate 1 held by the first substrate holding unit, by the first height position measurement (step S303). The obtained height position information PH1 and height position information SH1 are stored in the storage device 302b. At that time, the height position information PH1 and height position information SH1 are stored together with identification information for individually identifying the substrate 1.

[0084] The measurement point ph1 of the height position information PH1 regarding the height position of the upper surface of the solder precoat 2 is indicated by a black circle in FIG. 10. The position of the measurement point ph1 is selected, for example, from a position near the center (for example, the center) of the solder precoat 2. The height position information PH1 is a collection of height positions Hp of multiple measurement points ph1 obtained in the first height position measurement. Also, the measurement point sh1 of the height position information SH1 regarding the height position of the upper surface of the substrate 1 is indicated by an x ​​mark in FIG. 10. The position of the measurement point sh1 is, for example, a position away from the land 1b on which the solder precoat 2 is formed, and multiple positions are set. The height position information SH1 is a collection of height positions H1 of multiple measurement points sh1 obtained in the first height position measurement. In FIG. 10, the center of the mounting position of the electronic component is indicated by a + mark. Although a solder resist is formed on the substrate 1, the solder resist is not illustrated in FIG. 10.

[0085] The inspection head 310, as an example, includes a light-emitting element and a light-receiving element. The light-emitting element is, for example, a laser element, and the light-receiving element is, for example, an image sensor or a photodiode (position detection element). Light (for example, laser light) emitted from the light-emitting element and reflected by the measurement object is received by the light-receiving element. The light-receiving element outputs a signal according to the light-receiving position. The height position of the measured point is obtained from the output signal of the light-receiving element. In order to obtain an accurate height position, a reference height position that serves as a reference for height measurement is set in the solder precoat inspection device 300, and an accurate height position can be obtained by associating the output signal of the light-receiving element corresponding to the reference height position. As the height reference position, a surface of a member arranged in the inspection device 300, such as the upper surface of the board guide 331, can be used. The height position of the measurement point may be a relative height based on the reference height position. These configurations are publicly known, and publicly known techniques can be applied. In addition, any height measuring device can be used, not limited to the inspection head 310 described here, as long as it can perform the measurements required for the present invention.

[0086] Next, the pass / fail determination unit of the arithmetic processing device 302a calculates the thickness of the solder precoat from the measured values ​​(step S304). The acquisition of the height position information PH1 and the height position information SH1 and the calculation of the thickness of the solder precoat will be described with reference to FIG.

[0087] In the inspection device 300, the height position Hp from the reference height H0 to the upper surface of the solder precoat 2 is acquired by the first height position measurement. Since the residue 2a exists on the surface of the solder precoat 2, each height position Hp may be a value indicating the height position of the upper surface of the residue 2a. However, considering that the residue 2a on the upper surface of the solder precoat 2 is a very thin film of about several micrometers and that, depending on the material, it may transmit light and not be detected as a height position, there is no problem in treating the height position Hp as a value indicating the height position of the solder precoat 2.

[0088] The height position H1 from the reference height H0 to the upper surface of the solder resist 1s on the substrate 1 is also acquired by the first height position measurement. Identification information for individually identifying the substrate 1 is attached to the substrate 1. The height position measurement information storage unit of the storage device 302b of the inspection device 300 stores the multiple height positions Hp (height position information PH1) and multiple height positions Hs (height position information SH1) obtained by the first height position measurement unit, and the identification information of the substrate 1 (height position information storage process). Note that, since it is only necessary to measure the height position of the upper surface of the substrate 1, the height position of the upper surface of the substrate 1 in the portion where the solder resist 1s is not formed may be measured instead of the height position of the upper surface of the solder resist 1s (the same applies to the height position measurement in the electronic component mounting device 501).

[0089] The height position H1 is measured to estimate the height position of the portion of the upper surface of the substrate 1 where the solder precoat 2 is formed. Therefore, the measurement position sh1 is preferably selected in the vicinity of the solder precoat 2. Furthermore, when estimating the shape of the upper surface of the substrate 1 from the measurement results, the number and positions of the measurement positions sh1 are selected so that the shape can be appropriately estimated.

[0090] The calculation unit of the arithmetic processing device 302a of the inspection device 300 reads the height position information PH1 and the height position information SH1 from the height position measurement information storage unit. The calculation unit of the arithmetic processing device 302a also uses the read values ​​to calculate the thickness TP of the solder precoat 2. Specifically, the thickness TP of the solder precoat is calculated by the following formula (1). TP=Hp(ph1)-Hs(ph1)-HL···(1) Here, the height position Hp(ph1) is the height from the reference height H0 at the measurement point ph1 to the upper surface of the solder precoat 2 (the upper surface of the residue 2a). The height position Hs(ph1) is the height from the reference height H0 at the measurement point ph1 to the upper surface of the substrate 1. Also, HL is the thickness of the land 1b. The thickness of the land 1b and the thickness Ds of the solder resist 1s are acquired in advance as information of the substrate 1.

[0091] Since solder precoat 2 exists at measurement point ph1, it is impossible to directly measure the height position Hs(ph1) of measurement point ph1 with the inspection head 310. However, the height position Hs(ph1) can be approximated by the height position Hs(sh1) of the top surface of the board 1 at one measurement point sh1 near measurement point ph1. When solder resist 1s exists at measurement point sh1, the thickness TP of the solder precoat can be calculated using formula (2). TP=Hp(ph1)-[H1(sh1)-Ds]-HL...(2) Here, H1(sh1) is the height position of the upper surface of the board at the measurement point sh1, so Hs(sh1) can be obtained by subtracting the thickness Ds of the solder resist 1s from H1(sh1). In other words, if Hs(sh1) is regarded as Hs(ph1), the thickness TP of the solder precoat can be obtained from the height position information SH1 and height position information PH1 acquired by the first height position measurement and the information of the board 1 (the thickness HL of the land 1b and the thickness Ds of the solder resist 1s). Alternatively, Hs(ph1) may be approximated by the average of the height positions Hs(sh1) of the upper surface of the board 1 at a plurality of measurement points sh1 in the vicinity of the measurement point ph1. In this case, the calculation formula may be such that "H1(sh1)" in formula (2) is replaced with the average value of the height positions of the plurality of measurement points sh1. Alternatively, the shape of the upper surface of the board 1 may be estimated from Hs(sh1) at a plurality of measurement points sh1, and Hs(ph1) may be calculated based on the estimated shape (virtual plane). Such an estimation of the virtual plane may be performed by a known method. In this case, the calculation formula can be obtained by replacing "Hs(ph1)" in formula (1) with Hs(ph1) estimated based on the virtual plane.

[0092] Next, the pass / fail determination unit of the arithmetic processing device 302a determines whether the solder pre-coat 2 passes or fails based on the calculated thickness TP of the solder pre-coat 2 (step S305). If the thickness TP of the solder pre-coat 2 is within a preset appropriate range, it is determined to pass, and if not, it is determined to fail. The board 1 whose solder pre-coat 2 has been determined to be unacceptable is removed from the manufacturing device (D1) to correct the rejected solder pre-coat 2, and once the correction is complete, it is re-inserted into the solder pre-coat inspection device 300 and sent to the remaining process. The board 1 whose solder pre-coat 2 has been determined to be acceptable is subjected to the subsequent process.

[0093] Next, the arithmetic processing device 302a uploads the inspection result information, including the height position information PH1 and SH1, the pass / fail judgment result of the solder pre-coat 2, the calculated thickness TP of the solder pre-coat 2, and the identification information of the inspected board 1, to the storage device 20b of the information processing device 20 (step S306). After the inspection of the solder pre-coat 2 is completed, the board 1 is released from the holding and carried out (step S307).

[0094] (Flux application device) The board 1 inspected by the inspection device 300 is carried into the flux application device 400 by the board conveying line 11. In the flux application device 400, flux for soldering by reflow is applied onto the solder precoat 2. There is no particular limitation on the method of applying the flux, and it may be applied by a known method (for example, screen printing). The board 1 to which the flux has been applied is carried by the board conveying line 11 to the electronic component mounting device 501.

[0095] (Electronic component mounting equipment) 12 is a schematic diagram showing the configuration of electronic component mounting device 501. Electronic component mounting device 502 has the same configuration and functions as electronic component mounting device 501, and therefore a duplicated description will be omitted.

[0096] Electronic component mounting device 501 mounts electronic components 4 on solder precoat 2 covered with flux (not shown). Electronic component mounting device 501 includes board transport conveyor 521 for transporting board 1, a plurality of component supply units 580 arranged on the sides of board transport conveyor 521, a mounting head 542, and a second board holder 550. Board transport conveyor 521 is provided on a pair of board guides 520 extending parallel to the X direction. Board transport conveyor 521 constitutes a part of board transport line 11.

[0097] The board transport conveyor 521 supports both ends of the board 1 in the Y direction from below, and is driven by a drive source (not shown) to transport the board 1 in the X direction. The middle part of the board transport conveyor 521 in the X direction is a work area W2 (second work position) where electronic components 4 are mounted on the board 1. A member (part of the board holding part 550) that supports the board 1 from below is disposed below this work area W2.

[0098] The board holding unit 550 includes a plurality of backup pins 552 that support the lower surface of the board 1, a lifting platform 551 on which the backup pins 552 are arranged, a lifting unit 553 that raises and lowers the lifting platform 551, and an upper surface presser 554. When the backup pin lifting unit 553 is driven in a state in which the board 1 is carried into the working area W2 by the board carrying conveyor 521, the backup pins 552 push up the board 1 and press the upper surfaces of both ends in the Y direction against the upper surface presser 554. As a result, the board 1 is temporarily fixed in the working area W2 while being sandwiched from above and below by the plurality of backup pins 552 and the pair of upper surface pressers 554. The board carrying conveyor 521 of the electronic component mounting device 501 carries the board 1 received from the upstream into the working area W2 in the device, and carries the board 1 on which the electronic components 4 have been mounted to a downstream device.

[0099] The electronic component mounting device 501 includes a mounting head 542, a movement mechanism (not shown) for moving the mounting head 542 in the X and Y directions, a height position measurement unit 543, and a known board camera (not shown). The height position measurement unit 543 and the board camera are attached to the mounting head 542, and are moved in the X and Y directions by a movement mechanism for moving the mounting head 542. The mounting head 542 incorporates a plurality of suction nozzles 541 for suctioning and holding the electronic components 4, and a nozzle drive mechanism (not shown) for raising and lowering the suction nozzles 541 and rotating them around the Z axis. The mounting head 542 holds the electronic components 4 supplied by the component supply unit 580 with the suction nozzles 541, and performs the task of mounting the electronic components 4 on the solder precoat 2 to which flux has been applied. The height position measuring unit 543 (second height position measuring part) acquires height position information SH2 relating to the height position of the upper surface of the substrate 1 held by the second substrate holding part (substrate holding part 550) by second height position measurement. The height position measuring unit 543 can have the configuration described in the first height position measuring part.

[0100] The operation of electronic component mounting device 501 will be described with reference to Fig. 13. Fig. 13 shows a flow of a task for mounting electronic components on one board 1. First, arithmetic processing device 501a of electronic component mounting device 501 downloads necessary data from storage device 20b of information processing device 20 and updates the storage unit of storage device 501b (step S501). The downloaded data may include at least data necessary for calculating a target height position, which will be described later. In this embodiment, inspection result information is downloaded.

[0101] Next, under the control of the arithmetic processing device 501a etc., the substrate 1 is carried into the electronic component mounting device 501, and the substrate 1 is held by the second substrate holding section (substrate holding section 550) (step S502).

[0102] Next, the arithmetic processing device 501a controls the camera of the mounting head 542 to recognize the reference mark 1r of the board 1 (step S503). This allows the horizontal position of the board 1 held by the board holding unit 550 to be obtained. Depending on the horizontal position of the board 1, height position measurement of a predetermined location and arrangement of the electronic component 4 are performed.

[0103] Next, the substrate height position measurement processing unit of the arithmetic processing device 501a acquires height position information SH2 relating to the height position of the upper surface of the substrate 1 held by the second substrate holding unit (substrate holding unit 550) by the second height position measurement (step S504). Acquisition of the height position information SH2 will be described with reference to FIG.

[0104] The electronic component mounting device 501 measures the height of the upper surface of the solder resist 1s at a predetermined measurement point sh2. Specifically, the height from the reference height H0 to the upper surface of the solder resist 1s (height position H2(sh2)) is measured by the height position measuring unit 543 (second height position measurement). The height position information SH2 acquired by the second height position measurement includes the height positions H2(sh2) of multiple measurement points sh2.

[0105] In order to ensure consistency of the measurement results between the solder precoat inspection device 300 and the electronic component mounting device 500, it is preferable to set the measurement location sh2 at the same location as the measurement location sh1. Also, it is preferable to set the measurement location sh2 at a location where the solder flux 3 is not applied in order to avoid erroneous detection due to the solder flux 3. That is, the second height position measuring unit may acquire the height position information SH2 by performing the second height position measurement at a portion of the board 1 that is not covered with the solder flux 3. By performing the measurement at a location where the solder flux 3 is not applied, more accurate measurement is possible. The measurement location sh2 may be a location where the solder resist 1s is not formed.

[0106] Next, the calculation unit of the arithmetic processing device 501a calculates a target height position NH when the suction nozzle 541 (component holder) descends toward the board 1 (step S505). Specifically, the arithmetic processing device 501a calculates a target height position NH of the bottom end of the suction nozzle 541 when the suction nozzle 541, which has sucked the electronic component 4, places the electronic component 4 on the solder pre-coat 2 (more specifically, on the solder pre-coat 2 to which the solder flux 3 has been applied).

[0107] The target height position NH at the mounting point including the measurement position ph1 is calculated by the following formula (3) from the thickness TP of the solder precoat 2 acquired by the solder precoat inspection device 300, the height position Hs(ph1) of the upper surface of the board 1 at the measurement position ph1, the thickness HL of the land 1b, and the thickness TE of the electronic component 4. Note that if there are multiple lands 1b at one mounting point and multiple height positions Hs(ph1) are available, the highest height position Hs(ph1) is adopted, and the thickness TP of the solder precoat 2 at the measurement position ph1 where the adopted height position Hs(ph1) was measured is used to calculate the target height position NH. NH = Hs(ph1) + HL + TP + TE (3)

[0108] Here, the height position Hs(ph1) of the upper surface of the board 1 at the measurement point ph1 can be approximated by the height position of one measurement point sh2 located in the vicinity of the mounting point including the measurement point ph1. In this case, the target height position NH is calculated by the formula (4). NH=[H2(sh2)-Ds]+HL+TP+TE···(4) Here, H2(sh2) is the height position at the measurement point sh2, and Hs(sh2) can be obtained by subtracting the thickness Ds of the solder resist 1s from H2(sh2). Therefore, according to formula (4), the electronic component mounting device 500 can obtain the target height position NH from the height position information SH2 acquired by the second height position measurement, the work information (thickness HL of the land 1b, thickness Ds of the solder resist 1s, thickness TE of the electronic component 4), and the thickness TP of the solder precoat 2 included in the inspection result information downloaded in S501. The thickness TP of the solder precoat 2 is calculated using the height position information PH1 regarding the height position of the upper surface of the solder precoat 2 and the height position information SH1 regarding the height position of the upper surface of the board 1. That is, formula (5) can be derived by applying formula (2) to formula (4). NH=H2(sh2)-H1(sh1)+Hp(ph1)+TE...(5) According to equation (5), the electronic component mounting device 500 can calculate NH from the height position information PH1 and height position information SH1 obtained in the first height position measurement, as well as the height position information SH2 obtained in the second height position measurement, and the dimension (thickness) of the electronic component 4.

[0109] In addition, the above equations (3) and (4) may include terms other than the height position information and the work information, for example, they may include terms that add or subtract parameters for deforming some margin or the elastic body that presses the suction nozzle 541 toward the substrate 1 (the same applies to other embodiments).

[0110] In addition, "H2(sh2)" in formula (4) and formula (5) may be approximated by the average of the height positions Hs(sh2) of the upper surface of the board 1 at a plurality of measurement points sh2 in the vicinity of the mounting point including the measurement point ph1. Alternatively, Hs(ph1) may be calculated based on a virtual plane estimated from the height positions Hs(sh2) at the plurality of measurement points sh2, and this may be applied to formula (3). Such an estimation of the virtual plane may be performed by a known method. In addition, the inspection result information used in formulas (3) to (5) includes identification information of the board 1 held by the second board holding unit (board holding unit 550).

[0111] Next, the electronic component mounting processing unit of the arithmetic processing device 501a controls the lifting and lowering operation of the suction nozzle 541 (component holder) based on the calculated target height position to mount the electronic component 4 on the solder pre-coat 2 (more specifically, on the solder pre-coat 2 to which the solder flux 3 has been applied) (step S506). Specifically, the electronic component mounting processing unit of the arithmetic processing device 501a drives the nozzle driving mechanism based on the target height position NH to lower the suction nozzle 541 holding the electronic component 4 toward the mounting point of the board 1. By controlling the operation of the suction nozzle 541 in this manner, the electronic component 4 can be released at an appropriate height position. As a result, mounting defects of the electronic component 4 can be reduced.

[0112] A solder flux 3 is applied onto the solder precoat 2 of the substrate 1 that is carried into the electronic component mounting device 501. It may be difficult to accurately measure the height position of the upper surface of the solder precoat 2 to which the solder flux 3 has been applied. In the first embodiment, the height position of the upper surface of the solder precoat 2 is measured before the solder flux 3 is applied, so that it is possible to calculate the thickness of the solder precoat 2 more accurately. Therefore, according to the manufacturing device and manufacturing method of the first embodiment, the electronic components 4 can be mounted on the solder precoat 2 with high yield and high precision.

[0113] After the mounting of the electronic components 4 in the electronic component mounting device 501 is completed, the substrate 1 is released from the electronic component mounting device 501 and is removed (step S507). In this manner, the processing of the substrate 1 in the electronic component mounting device 501 is completed. In the next electronic component mounting device 502, electronic components 4 are similarly mounted.

[0114] The board 1 on which all electronic components 4 have been mounted is transported to the mounting state inspection device 600 by the board transport line 11. The mounting state inspection device 600 inspects the mounting state of the electronic components 4 on the board 1. Inspection items include mounting misalignment, poor posture, and presence or absence of the electronic components 4. The mounting state inspection device 600 recognizes the mounting state of the electronic components 4, such as the mounting position, posture, and presence or absence, using an optical measuring device such as a camera or a three-dimensional measuring machine, and judges whether or not the mounting state satisfies a predetermined standard. If a board 1 on which electronic components 4 are not properly mounted is found, the board 1 may be excluded from the subsequent processing. Alternatively, the subsequent processing may be continued after the mounting defect of the electronic components 4 is corrected.

[0115] After the inspection, the board 1 is transported to the reflow device 700 by the board transport line 11. The reflow device 700 heats the board 1 on which the electronic components 4 are mounted to melt the solder precoat 2, and solders the electronic components 4 to the lands 1b. In this manner, a mounted board 1x on which the electronic components 4 are mounted is manufactured.

[0116] After the processing in the reflow apparatus 700 is completed, the mounted board 1x is transported by the board transport line 11 to the board inspection apparatus 800 for inspection. After the inspection in the board inspection apparatus 800 is completed, the mounted board 1x is transported by the board transport line 11 to the unloader 900. The unloader 900 collects the completed mounted board 1x into a rack.

[0117] 15A to 15E, the entire manufacturing process of the mounting board 1x will be described. First, the substrate 1 shown in Fig. 15A is prepared. The substrate 1 includes lands 1b. On the surface of the substrate 1, a solder resist 1s is formed.

[0118] Next, as shown in FIG. 15B, a solder precoat 2 is formed on the land 1b. The solder precoat 2 includes a surface residue 2a. The substrate 1 held by the substrate holder may be deformed, such as warped. Therefore, in order to accurately mount the electronic components 4 in the electronic component mounting device 501, it is preferable to calculate the target height position taking into account the warp of the substrate 1. According to the manufacturing device and manufacturing method of the present invention, it is possible to calculate the target height position taking into account the warp of the substrate 1.

[0119] Next, as shown in Fig. 15C, solder flux 3 is applied onto the solder precoat 2. Next, as shown in Fig. 15D, an electronic component 4 is mounted onto the solder precoat 2 on which the solder flux 3 has been applied. Next, as shown in Fig. 15E, the solder precoat 2 is melted and then solidified, thereby solder-joining the land 1b and the terminal portion of the electronic component 4 via the solder 2x. In this manner, a mounting board 1x on which an electronic component 4 is mounted is manufactured.

[0120] (Embodiment 2) In the second embodiment, an example of a manufacturing apparatus (D2) and an example of a manufacturing method (M2) will be described. The mounting board manufacturing apparatus and the mounting board manufacturing method of the second embodiment differ from those of the first embodiment only in the method of acquiring the target height position of the electronic component mounting portion, and therefore a duplicated description will be omitted. The configuration of the mounting board manufacturing apparatus of the second embodiment may be the same as that of the mounting board manufacturing apparatus 10 of the first embodiment.

[0121] The manufacturing apparatus of the second embodiment includes a height position measuring unit that acquires height position information PH2 relating to the height position of the upper surface of the solder precoat on the substrate held by the substrate holding unit by measuring the height position. The substrate holding unit (second substrate holding unit 550) and the height position measuring unit (height position measuring unit 543) of electronic component mounting apparatus 501 of the first embodiment can be used for the substrate holding unit and the height position measuring unit. That is, the electronic component mounting unit (electronic component mounting apparatus 500) of manufacturing apparatus 10 of the first embodiment can be applied to the electronic component mounting unit in the manufacturing apparatus of the second embodiment.

[0122] The operation (electronic component mounting process) of electronic component mounting apparatus 501 will be described with reference to Fig. 16. Note that the operation of electronic component mounting apparatus 502 can be similar.

[0123] First, the arithmetic processing device 501a of the electronic component mounting device 501 downloads necessary data and updates the storage unit of the storage device 501b (step S1501). The downloaded data includes the solder precoat inspection result, i.e., the pass / fail judgment result. However, in the second embodiment, unlike the first embodiment, the value related to the thickness of the solder precoat and the data related to the height position obtained by the first height position measurement are not necessary for calculating the target height position. Therefore, these values ​​do not need to be downloaded.

[0124] Next, under the control of the arithmetic processing device 501a, the substrate 1 is carried into the electronic component mounting device 501, and the substrate 1 is held by the second substrate holding unit (substrate holding unit 550) (step S1502). Next, the arithmetic processing device 501a controls the camera of the mounting head 542 to recognize the reference mark 1r on the substrate 1 (step S1503). Steps S1502 and S1503 are the same processes as steps S502 and S503.

[0125] Next, the board height position measurement processing unit of the arithmetic processing device 501a acquires height position information PH2 related to the height position Hp of the upper surface of the solder precoat 2 on the board 1 held by the board holding unit by height position measurement (step S1504). Acquisition of the height position information PH2 will be described with reference to FIG.

[0126] In the second embodiment, at the measurement point ph1, the height position Hp(ph1) of the upper surface (upper surface of the residue 2a) of the solder precoat 2 to which the solder flux 3 is applied is acquired by the height position measuring unit 543. The height position Hp(ph1) is a height based on the reference height H0. The height position Hp(ph1) is height position information PH2. The position of the measurement point ph1 is selected, for example, from a position near the center (e.g., the center) of the solder precoat 2. As described above, the height position measuring unit 543 may perform the measurement using laser light.

[0127] Next, the calculation unit of the arithmetic processing device 501a calculates a target height position NH when the suction nozzle 541 (component holder) descends toward the board 1 (step S1505). For example, the arithmetic processing device 501a may calculate a target height position NH of the bottom end of the suction nozzle 541 when the suction nozzle 541, which has sucked the electronic component 4, moves the electronic component 4 onto the solder pre-coat 2 (more specifically, onto the solder pre-coat 2 to which the solder flux 3 has been applied) and releases the electronic component 4.

[0128] The target height position NH at the measurement point ph1 is calculated from the measured height position Hp(ph1) and the thickness TE of the electronic component 4 by the following formula (6). NH = Hp(ph1) + TE (6)

[0129] In the manufacturing apparatus and manufacturing method of the second embodiment, there is no need to measure the height position of the upper surface of the substrate 1 in the electronic component mounting apparatus 501. Therefore, the time required to mount the electronic components can be shortened.

[0130] 18, the electronic component mounting processing unit of the arithmetic processing device 501a controls the lifting and lowering operation of the suction nozzle 541 (component holder) based on the calculated target height position NH to mount the electronic component 4 on the solder pre-coat 2 (more specifically, on the solder pre-coat 2 to which the solder flux 3 has been applied) (step S1506). Step S1506 is similar to step S506.

[0131] After the mounting of the electronic components 4 in the electronic component mounting device 501 is completed, the substrate 1 is released from the electronic component mounting device 501, and the substrate 1 is carried out from the electronic component mounting device 501 (step S1507). Step S1507 is the same as step S507. In this manner, the mounting of the electronic components 4 in the electronic component mounting device 501 is performed.

[0132] The substrate 1 on which the electronic components 4 are mounted is processed in the same manner as in embodiment 1. In this manner, also in embodiment 2, a mounting substrate 1x on which the electronic components 4 are mounted is manufactured.

[0133] In this way, in the manufacturing equipment (D2) of the second embodiment, the height position Hp of the upper surface of the solder precoat 2 covered with the solder flux 3 is obtained by the height position measuring unit 543. For this reason, the solder flux 3 that can be used in the manufacturing equipment (D2) is limited to one that easily transmits the light used for height position measurement. In this respect, it is disadvantageous to the manufacturing equipment (D1) of the first embodiment, but by measuring the height position of the solder precoat 2 with the electronic component mounting device 500, it is advantageous in terms of productivity compared to the manufacturing equipment (D1). [Industrial Applicability]

[0134] This embodiment can be used in an electronic component mounting apparatus and an electronic component mounting method. Although the present invention has been described with respect to the presently preferred embodiments, such disclosure should not be interpreted as limiting. Various variations and modifications will no doubt become apparent to those skilled in the art to which the present invention pertains upon reading the above disclosure. Accordingly, the appended claims should be interpreted to cover all variations and modifications without departing from the true spirit and scope of the present invention. [Explanation of symbols]

[0135] 1: Substrate 1b: Land 1x: Mounting board 2: Solder precoat 2a:Residue 2x: solder 3: Solder flux 4: Electronic components 10: Mounting board manufacturing equipment 11: Substrate transport line 90: Solder precoat forming area 100: Solder paste supply section 210: Heating section 320: First substrate holder 500, 501, 502: Electronic component mounting device (electronic component mounting section) 550: Second substrate holder

Claims

1. An electronic component mounting device that mounts electronic components on a substrate having a plurality of lands on which a solder precoat is formed, using a component holder, A substrate holder for holding the substrate; a height position measuring unit that acquires height position information SH2 relating to a height position of an upper surface of the substrate held by the substrate holding unit; a calculation unit that calculates a target height position when the component holder holding an electronic component descends toward the board to place the electronic component on the solder precoat, using height position information PH1 relating to the height position of the upper surface of the solder precoat measured in advance by a solder precoat inspection device, height position information SH1 relating to the height position of the upper surface of the board, and the height position information SH2 measured by the height position measurement unit; a mounting head that raises and lowers the component holder based on the target height position to mount the electronic component on the solder precoat, The solder precoat is formed by melting solder paste supplied onto the land and has a residue of the solder paste on its surface, and the height position information PH1 is the height of an upper surface of the residue.

2. Identification information for individually identifying the substrate is attached to the substrate; 2. The electronic component mounting device of claim 1, wherein the calculation unit utilizes the height position information PH1 and the height position information SH1 that are stored in a height position measurement information storage unit together with the identification information by the solder precoat inspection device and acquired from the height position measurement information storage unit.

3. the substrate holding portion holds a substrate on which solder flux is applied on the solder precoat, 2. The electronic component mounting device according to claim 1, wherein the height position measuring unit acquires the height position information SH2 by measuring the height position in a portion of the board that is not covered with the solder flux.

4. The electronic component mounting device according to claim 1 , wherein the height position measuring unit obtains the height position information SH2 by using a laser beam.

5. 1. An electronic component mounting method for mounting electronic components on a substrate having a plurality of lands on which a solder precoat is formed, using a component holder, comprising: A substrate is held by a substrate holding unit, the substrate having height position information PH1 relating to the height position of the upper surface of the solder precoat and height position information SH1 relating to the height position of the upper surface of the substrate measured by a solder precoat inspection device; measuring a height position of an upper surface of the substrate held by the substrate holder to obtain height position information SH2; calculating a target height position when the component holder holding the electronic component descends toward the board to place the electronic component on the solder precoat, using the height position information PH1, the height position information SH1, and the height position information SH2; a step of lowering the component holder holding the electronic component to the target height position and mounting the electronic component on the solder precoat of the substrate held by the substrate holder, The solder precoat is formed by melting solder paste supplied onto the land and has a residue of the solder paste on its surface, and the height position information PH1 is the height of an upper surface of the residue.

6. Identification information for individually identifying the substrate is attached to the substrate; 6. The electronic component mounting method according to claim 5, wherein the target height position is stored in a height position measurement information storage unit together with the identification information by the solder precoat inspection device, and is calculated using the height position information PH1 and the height position information SH1 acquired from the height position measurement information storage unit.

7. the substrate holding portion holds a substrate on which solder flux is applied on the solder precoat, 6. The electronic component mounting method according to claim 5, wherein the height position information SH2 is acquired by performing height position measurement on a portion of the board that is not covered with the solder flux.

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