Exposure apparatus, exposure method, and article manufacturing method

Abstract

To provide a technique advantageous for measuring the positions of a plurality of marks in a short time.SOLUTION: An exposure apparatus comprises: a substrate driving mechanism; a first scope which performs imaging for alignment of a substrate via a projection optical system; a second scope which performs imaging for alignment of the substrate without the projection optical system; and a control part which executes first measurement of measuring the position of a first mark on the substrate by using the first scope and second measurement of measuring the positions of a plurality of second marks on the substrate by using the first scope and the second scope after the first measurement. Between the first measurement and the second measurement, time required for focusing by the focus mechanism is shorter than time required for driving the substrate in the first direction by the substrate driving mechanism for focusing the plurality of second marks.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to an exposure apparatus, an exposure method, and an article manufacturing method. [Background technology]

[0002] In a lithography process for manufacturing an article such as a semiconductor device or a display device, an exposure apparatus that transfers a pattern of an original onto a substrate may be used. The exposure apparatus exposes the substrate by projecting the pattern of the original onto the substrate using a projection optical system, thereby forming a latent image pattern in the photosensitive material of the substrate. The latent image pattern is converted into a physical pattern by a development process. The exposure apparatus may have a TTL (Through the Lens) type alignment scope (hereinafter, TTL scope) and an off-axis type alignment scope (hereinafter, off-axis scope). The TTL scope is an alignment scope that obtains information for alignment by imaging a mark on the substrate via a projection optical system. The off-axis scope is an alignment scope that obtains information for alignment by imaging a mark on the substrate without using a projection optical system. Patent Document 1 describes an apparatus that performs alignment using a TTL scope and an off-axis scope. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2004-303830 A Summary of the Invention [Problem to be solved by the invention]

[0004] The measurement process for aligning the substrate may include a first measurement process for measuring the position of a first mark on the substrate, and a second measurement process for measuring the positions of a plurality of second marks on the substrate based on the position of the first mark. The first measurement process may be called a rough measurement process. The second measurement process may be called a precision measurement process. In the first measurement process, the position of the first mark may be measured using a first scope that images the mark on the substrate via a projection optical system. In the second measurement process, the positions of the plurality of second marks may be measured in parallel using, in addition to the first scope that images the mark on the substrate via the projection optical system, a second scope that images the mark on the substrate without the projection optical system.

[0005] The present invention aims to provide an advantageous technology for measuring the positions of multiple marks in a short period of time using a first scope that images the marks on the substrate via a projection optical system and a second scope that images the marks on the substrate without using a projection optical system. [Means for solving the problem]

[0006] One aspect of the present invention relates to an exposure apparatus that exposes a substrate by projecting a pattern of an original onto the substrate by a projection optical system, the exposure apparatus including: a substrate driving mechanism capable of driving the substrate in a first direction parallel to an optical axis of the projection optical system and in a second direction perpendicular to the optical axis; a first scope that captures an image for alignment of the substrate via the projection optical system; a second scope that captures an image for alignment of the substrate without using the projection optical system; and a control unit that performs a first measurement using the first scope to measure a position of a first mark on the substrate; and a second measurement using the first scope and the second scope to measure positions of a plurality of second marks on the substrate after the first measurement, a first focus operation for the first scope can be performed by at least one of an operation of the focus mechanism and an operation of driving the substrate in the first direction by the substrate driving mechanism, and a second focus operation for the second scope can be performed by an operation of driving the substrate in the first direction by the substrate driving mechanism, and the control unit controls the first focus operation and the second focus operation so that a time required to drive the focus lens by the focus mechanism between the first measurement and the second measurement is shorter than a time required to drive the substrate in the first direction by the substrate driving mechanism for focusing the plurality of second marks between the first measurement and the second measurement. Effect of the Invention

[0007] According to the present invention, an advantageous technique is provided for measuring the positions of a plurality of marks in a short period of time using a first scope that images the marks on the substrate via a projection optical system and a second scope that images the marks on the substrate without using a projection optical system. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a diagram showing the arrangement of an exposure apparatus according to a first embodiment. [Diagram 2]2 is a diagram illustrating the procedures of a measurement method and an exposure method performed in the exposure apparatus shown in FIG. [Diagram 3] 2 is a diagram illustrating a processing procedure for successively exposing a plurality of substrates by the exposure apparatus shown in FIG. 1. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted. First Embodiment 1 is a schematic diagram showing the configuration of an exposure apparatus 100 of one embodiment. The exposure apparatus 100 exposes the substrate 16 to light by projecting a pattern of an original 3 onto the substrate 16 using a projection optical system 4. The substrate 16 can be, for example, a substrate in which a photosensitive material is applied onto a plate-like member whose base material is a glass plate, a wafer, or the like. The pattern of the original 3 can be transferred to the photosensitive material of the substrate 16 as a latent image pattern by exposure. The latent image pattern can be converted into a physical pattern by a development process.

[0010] In this specification and the drawings, directions are indicated according to the XYZ coordinate system. The Z axis in the XYZ coordinate system is parallel to the optical axis of the projection optical system 4. The Z axis can be parallel to the vertical direction. If the optical axis of the projection optical system 4 is folded, the optical axis of the projection optical system 4 may be understood as the optical axis of the projection optical system 4 between the exit surface 41 and the substrate 16. The direction parallel to the optical axis of the projection optical system 4, i.e., the direction parallel to the Z axis, is also referred to as the first direction. The direction perpendicular to the optical axis of the projection optical system 4, i.e., the direction parallel to the XY plane or the horizontal plane, is also referred to as the second direction.

[0011] The exposure apparatus 100 may include, for example, an illumination system 1 that illuminates the original 3, and a projection optical system 4 that projects the pattern of the original 3 onto a substrate 16. The illumination system 1 may include, for example, a light source and an illumination optical system. The light source may include, for example, a mercury lamp and an elliptical mirror. The illumination optical system may include a lens and a mirror. The illumination system 1 may illuminate an illumination area of ​​a predetermined shape so that a part of the original 3 is illuminated. The projection optical system 4 projects the pattern of the original 3 illuminated by the illumination system 1 onto the substrate 16. The original 3 is disposed on the object plane of the projection optical system 4, and the substrate 16 is disposed on the image plane of the projection optical system 4. The original 3 may be held and positioned by an original drive mechanism 22. The projection optical system 4 may be configured as any of an image forming optical system of unity magnification, enlargement, and reduction. The projection optical system 4 may have a mirror 14, a concave mirror 12, and a convex mirror 15 as exemplified in FIG. 1, but may further include a refractive optical system or may be configured only as a refractive optical system. In one example, an image of the pattern of the original 3 illuminated by the illumination system 1 can be formed at life-size on the substrate 16 via the mirror 14 of the projection optical system 4, the concave mirror 12, the convex mirror 15, the concave mirror 12 again, and the mirror 14.

[0012] The substrate 16 may be held by a substrate stage 17. The substrate stage 17 may be driven by a substrate driving mechanism 23. The substrate driving mechanism 23 may drive the substrate 16 by driving the substrate stage 17. The substrate driving mechanism 23 may be configured to be capable of driving the substrate 16 in at least a first direction parallel to the optical axis of the projection optical system 4 and a second direction perpendicular to the optical axis. More preferably, the substrate driving mechanism 23 may be configured to be capable of driving the substrate 16 in a direction parallel to the X-axis, a direction parallel to the Y-axis, a direction parallel to the Z-axis, and rotations about each of the X-axis, Y-axis, and Z-axis.

[0013] The exposure apparatus 100 may include a control unit 18. The control unit 18 may be configured, for example, by a PLD (abbreviation for Programmable Logic Device) such as an FPGA (abbreviation for Field Programmable Gate Array), or an ASIC (abbreviation for Application Specific Integrated Circuit), or a general-purpose or dedicated computer with a program embedded therein, or a combination of all or part of these.

[0014] The substrate driving mechanism 23 can drive the substrate stage 17 (substrate 16) in accordance with a driving command from the control unit 18. The control unit 18 can feedback-control the substrate stage 17 (substrate 16) with respect to the position and rotation of the substrate stage 17 measured by measuring instruments such as an interferometer and an encoder.

[0015] The exposure apparatus 100 may include one or more first scopes (TTL scopes) 2 that capture images of marks on the substrate 16 via the projection optical system 4, and a first scope drive mechanism 25 that positions the first scope 2. The first scope 2 may be used to measure the position of the mark on the substrate 16. The first scope 2 may also be used to measure the relative position between the mark on the substrate 16 and the mark on the original 3. The first scope 2 may have a focus mechanism 19 that drives a focus lens. The focus lens may be composed of one or more lenses. The focus lens may be composed of, for example, a relay lens.

[0016] The exposure apparatus 100 may include one or more second scopes (off-axis scopes) 20 that capture an image of the mark on the substrate 16 without passing through the projection optical system 4, and a second scope drive mechanism 26 that positions the second scope 20. The second scope 20 may or may not have a focus mechanism that drives a focus lens. The second scope 20 that does not have a focus mechanism that drives a focus lens is suitable for miniaturization, and is advantageous for arrangement in a relatively narrow space to the side of the projection optical system 4.

[0017] The control unit 18 can control the original driving mechanism 22 and the substrate driving mechanism 23 so that the substrate 16 and the original 3 are aligned, based on the position and rotation of the substrate 16 measured using one or more first scopes 2 and one or more second scopes 20. The exposure apparatus 100 can be configured as a scanning exposure apparatus that transfers the pattern of the original 3 onto the substrate 16 while synchronously driving the original 3 and the substrate 16.

[0018] Figure 2 illustrates an example of the procedure of the measurement method and exposure method performed in exposure apparatus 100. The procedure shown in Figure 2 is controlled by controller 18. In step 401, controller 18 controls substrate driving mechanism 23, original driving mechanism 22, and first scope driving mechanism 25 so as to position substrate 16, original 3, and first scope 2 at their respective positions for measuring the first mark.

[0019] Following step 401, steps 402 and 403 may be performed in parallel. In step 402, the control unit 18 controls the substrate driving mechanism 23 so that the position in the Z axis direction (position in the first direction) of the substrate stage 17 coincides with a target stage position S1. The target stage position S1 is information for matching the first mark of the substrate 16 with a target focal position R1. The target stage position S1 may be a driving command value for specifying the position of the substrate stage 17, or information such as the position of the substrate stage 17.

[0020] In step 403, the control unit 18 controls the focus mechanism 19 so that the focal position on the object side of the first scope 2 coincides with a target focal position R1 for measuring the position of the first mark. The target focal position R1 may be a drive command value for specifying the position of a relay lens of the focus mechanism 19, or information on the position of the relay lens, etc.

[0021] Following steps S402 and 403, in step 404 (first measurement step of performing a first measurement), the control unit 18 measures the position of the first mark on the substrate 16 using the first scope 2. Specifically, the control unit 18 causes the first scope 2 to capture an image of the first mark, and detects the position of the first mark (position in the X direction and position in the Y direction) based on the image (first mark image) obtained thereby.

[0022] In step 405, the control unit 18 controls the positioning of the substrate 16, the original 3, the first scope 2, and the second scope to positions for performing position measurement of the multiple second marks. Specifically, the control unit 18 performs this by controlling the substrate driving mechanism 23, the original driving mechanism 22, the first scope driving mechanism 25, and the second scope driving mechanism 26.

[0023] Following step 405, steps 406 and 407 may be performed in parallel. In step 406, the control unit 18 controls the substrate driving mechanism 23 so that the position of the substrate stage 17 in the Z-axis direction (position in the first direction) coincides with the target stage position S2. The target stage position S2 is information for causing the second mark of the substrate 16 to coincide with the target focal position R2. The target stage position S2 may be a drive command value for specifying the position of the substrate stage 17, or information such as the position of the substrate stage 17. The target focal position R2 is a target value of the focal position on the object side of the second scope 20. The target focal position R2 may be a drive command value for specifying the position of a relay lens of the focus mechanism 19, or information such as the position of the relay lens.

[0024] In step 407, the control unit 18 controls the focus mechanism 19 so that the focal position on the object side of the first scope 2 coincides with the target focal position R2 for measuring the position of the second mark.

[0025] Following steps S406 and 407, in step 408 (second measurement step of performing second measurement), the control unit 18 measures the positions of multiple second marks using the first scope 2 and the second scope 20. Specifically, the control unit 18 causes the first scope 2 to capture the second marks to be measured using the first scope 2, and detects the positions (positions in the X direction and the Y direction) of the second marks based on the image (second mark image) obtained thereby. The control unit 18 also causes the second scope 20 to capture the second marks to be measured using the second scope 20, and detects the positions (positions in the X direction and the Y direction) of the second marks based on the image (second mark image) obtained thereby. Note that, if the second marks to be imaged are not within the range of the allowable defocus amount by performing steps 406 and 407, a focus operation may be additionally performed on the second marks to be imaged.

[0026] Following step 408, in step 409, the control unit 18 controls the substrate driving mechanism 23 so that the substrate 16 is aligned in the X-axis direction, the Y-axis direction, and rotation around the Z-axis, based on the positions of the multiple second marks measured in step 408. Then, in step 410, the control unit 18 controls the illumination system 1, the original driving mechanism 22, the substrate driving mechanism 23, etc. so that the substrate 16 is exposed.

[0027] In the first embodiment, in step S404, the control unit 18 executes a first measurement to measure the position of a first mark on the substrate 16 using the first scope 2. After the first measurement, in step S4408, the control unit 18 executes a second measurement to measure the positions of a plurality of second marks on the substrate 16 using the first scope 2 and the second scope 20. The first focus operation for the first scope 2 can be executed by at least one of the operation of the focus mechanism 19 and the operation of driving the substrate 16 in the Z-axis direction (first direction) by the substrate driving mechanism 23. The second focus operation for the second scope 20 can be executed by the operation of driving the substrate 16 in the Z-axis direction (first direction) by the substrate driving mechanism 23.

[0028] The control unit 18 controls the first and second focus operations between the first and second measurements, that is, in steps 406 and S407. Here, the time required for the substrate driving mechanism 23 to drive the substrate 16 in the Z axis (first direction) for focusing the second marks in step 406 is defined as Ts. Also, the time required for the focus mechanism 19 to drive the focus lens in step 407 is defined as Tr. In the first embodiment, the control unit 18 controls the first and second focus operations so that the time Tr is shorter than the time Ts. This is advantageous when the time required for the focus mechanism 19 to generate a predetermined focus variation is longer than the time required for the substrate driving mechanism 23 to generate the predetermined focus variation.

[0029] It is preferable that, between the first measurement and the second measurement, controller 18 does not perform the operation of driving the focus lens by focus mechanism 19 after the operation of driving substrate 16 in the Z axis direction by substrate driving mechanism 23 for focusing on the multiple second marks is completed. In other words, it is preferable that controller 18 completes the focusing operation by focus mechanism 19 before the operation of driving substrate 16 in the Z axis direction by substrate driving mechanism 23 is completed for focusing on the multiple second marks. Such control contributes to improving the throughput of exposure apparatus 100.

[0030] FIG. 3 illustrates a procedure for continuously exposing a plurality of substrates by the exposure apparatus 100. The process shown in FIG. 3 is controlled by the control unit 18. In step 501, the control unit 18 executes the process shown in FIG. 2 according to the initial values S1’, R1’, S2’, and R2 of S1, R1, S2, and R2 for the first substrate (the first substrate in this example). Here, if the first mark does not fall within the allowable defocus amount range by performing steps 402 and 403, at least one of steps 402 and 403 may be additionally performed. Further, if the second mark of the imaging target does not fall within the allowable defocus amount range by performing steps 406 and 407, a focusing operation may be additionally performed on the second mark of the imaging target.

[0031] In step 502 (determination step), the control unit 18 determines the values (optimal values) of S1, R1, S2, and R2 as control information according to a predetermined algorithm based on the execution result of step 501. Here, let the driving amount of the focus lens by the focus mechanism 19 be Lr, and the driving amount of the substrate stage 17 (substrate 16) in the Z-axis direction by the substrate driving mechanism 23 be Ls. Also, let the driving speed of the focus lens by the focus mechanism 19 be Vr, and the driving speed of the substrate stage 17 (substrate 16) in the Z-axis direction by the substrate driving mechanism 23 be Vs. Ts and Tr can be expressed by the following equations.

[0032] Ts = (S2 - S1) / Vs Tr = (R2 - R1) / Vr The control unit 18 can determine the target focus position R1n and the target stage position S1n for the first measurement of the second substrate (the second and subsequent substrates in this example) so that the time Tr is shorter than the time Ts, that is, Tr < Ts is satisfied.

[0033] Taking a specific example, the control unit 18, for example, R1n = R2 Determining R1n in this way means that the focus mechanism 19 is not operated in step 407. Such control is advantageous when the time required for the focus mechanism 19 to generate a predetermined focus fluctuation amount is longer than the time required for the substrate driving mechanism 23 to generate the predetermined focus fluctuation amount.

[0034] Furthermore, the control unit 18 converts the driving amount of the focus lens in step 407 into the driving amount in the Z axis direction of the substrate stage 17, and can determine the target stage position S1n in the first measurement that measures the position of the first mark according to the following formula.

[0035] S1n = S1 + (R2 - R1) × Ls / Lr In the above example, the first of the multiple substrates is the first substrate and the second is the second substrate, but the first substrate may be, for example, multiple. In this case, the second substrate is the third or subsequent substrate. Alternatively, R1n, S1n (or R1, S1) may be determined according to, for example, the thickness of the substrate 16. <Second embodiment> The second embodiment will be described below. Matters not mentioned in the second embodiment may follow the first embodiment.

[0036] In the second embodiment, the control unit 18 controls the first focus operation and the second focus operation so that the time Ts is shorter than the time Tr. This is advantageous in the case where the time required for the substrate driving mechanism 23 to generate a predetermined focus driving amount is longer than the time required for the focus mechanism 19 to generate the predetermined focus driving amount.

[0037] As a specific example of the second embodiment, the control unit 18, for example, S1n=S2 Determining S1n in this way means that it is not necessary to operate the substrate driving mechanism 23 for focusing in step 406.

[0038] Furthermore, the control unit 18 converts the driving amount of the substrate stage 17 (substrate 16) in step 406 into the driving amount of the focus lens, and can determine the target image plane position R1n in the first measurement (first measurement step) that measures the position of the first mark according to the following equation.

[0039] R1n = R1 + (S2 - S1) × Lr / Ls <Third embodiment> A third embodiment will be described below. The third embodiment relates to an article manufacturing method for manufacturing an article according to the exposure method according to the first or second embodiment, or using the exposure apparatus 100. The article manufacturing method includes an exposure step of exposing a substrate according to the exposure method or using the exposure apparatus 100, a development step of developing the substrate that has undergone the exposure step, and a processing step of processing the substrate that has undergone the development step to obtain an article. The processing step may include, for example, a step of etching the substrate using a physical pattern (resist pattern) obtained through the development step. <Disclosures> (Item 1) 1. An exposure apparatus that exposes a substrate by projecting a pattern of an original onto the substrate using a projection optical system, comprising: a substrate driving mechanism capable of driving the substrate in a first direction parallel to an optical axis of the projection optical system and in a second direction perpendicular to the optical axis; a first scope that captures an image for alignment of the substrate via the projection optical system; a second scope that captures an image for alignment of the substrate without using the projection optical system; a control unit that executes a first measurement that measures a position of a first mark on the substrate using the first scope, and a second measurement that measures positions of a plurality of second marks on the substrate using the first scope and the second scope after the first measurement, the first scope has a focus mechanism that drives a focus lens, a first focus operation for the first scope can be performed by at least one of an operation of the focus mechanism and an operation of driving the substrate in the first direction by the substrate driving mechanism, and a second focus operation for the second scope can be performed by an operation of driving the substrate in the first direction by the substrate driving mechanism; the control unit controls the first focus operation and the second focus operation such that a time required for driving the focus lens by the focus mechanism between the first measurement and the second measurement is shorter than a time required for driving the substrate in the first direction by the substrate driving mechanism for focusing the plurality of second marks between the first measurement and the second measurement. An exposure apparatus comprising: (Item 2) the control unit does not perform an operation of driving the focus lens by the focus mechanism after an operation of driving the substrate in the first direction by the substrate driving mechanism for focusing the plurality of second marks is completed between the first measurement and the second measurement. 2. An exposure apparatus according to item 1, (Item 3) The control unit does not operate the focus mechanism between the first measurement and the second measurement. 2. An exposure apparatus according to item 1, (Item 4) The second scope does not have a focus mechanism that drives a focus lens. 4. The exposure apparatus according to any one of items 1 to 3. (Item 5) the control unit determines control information for controlling the first focus operation based on information obtained for exposing a first substrate, and controls the first focus operation based on the control information when exposing a second substrate. 5. The exposure apparatus according to any one of items 1 to 4. (Item 6) An exposure method for exposing a substrate using an exposure apparatus having a substrate driving mechanism capable of driving a substrate in a first direction parallel to an optical axis of a projection optical system and a second direction perpendicular to the optical axis, a first scope that captures an image for alignment of the substrate via the projection optical system, and a second scope that captures an image for alignment of the substrate without via the projection optical system, comprising: a first measurement step of measuring a position of a first mark on the substrate using the first scope; a focusing step of performing a first focusing operation for the first scope and a second focusing operation for the second scope to measure positions of a plurality of second marks on the substrate using the first scope and the second scope after the first measurement step; a second measurement step of measuring positions of the plurality of second marks using the first scope and the second scope after the focusing step; an alignment step of aligning the substrate based on a result obtained in the second measurement step for exposure of the substrate; a first focus operation for the first scope can be performed by at least one of an operation of a focus mechanism provided in the first scope and an operation of driving the substrate in the first direction by the substrate driving mechanism, and a second focus operation for the second scope can be performed by an operation of driving the substrate in the first direction by the substrate driving mechanism, the focusing step is performed such that a time required for driving a focus lens by the focusing mechanism is shorter than a time required for driving the substrate in the first direction by the substrate driving mechanism for focusing the plurality of second marks. 13. An exposure method comprising: (Item 7) in the focusing step, after an operation of driving the substrate in the first direction by the substrate driving mechanism for focusing the plurality of second marks is completed, an operation of driving the focus lens by the focusing mechanism is not performed. 7. The exposure method according to item 6, (Item 8) In the focusing step, the focusing mechanism is not operated. 7. The exposure method according to item 6, (Item 9) The second scope does not have a focus mechanism that drives a focus lens. 9. The exposure method according to any one of items 6 to 8, (Item 10) determining control information for controlling the first focus operation based on information obtained for exposing a first substrate; a control step of controlling the first focus operation before the first measurement step is performed in order to expose a second substrate; 10. The exposure method according to any one of items 6 to 9, further comprising: (Item 11) An exposure step of exposing a substrate by the exposure method according to any one of items 6 to 10; a developing step of developing the substrate that has been subjected to the exposure step; a processing step of processing the substrate that has undergone the developing step to obtain an article; A method for manufacturing an article, comprising: (Item 12) 1. An exposure apparatus that exposes a substrate by projecting a pattern of an original onto the substrate using a projection optical system, comprising: a substrate driving mechanism capable of driving the substrate in a first direction parallel to an optical axis of the projection optical system and in a second direction perpendicular to the optical axis; a first scope that captures an image for alignment of the substrate via the projection optical system; a second scope that captures an image for alignment of the substrate without using the projection optical system; a control unit that executes a first measurement that measures a position of a first mark on the substrate using the first scope, and a second measurement that measures positions of a plurality of second marks on the substrate using the first scope and the second scope after the first measurement, the first scope has a first focus mechanism that drives a first focus lens, A first focus operation for the first scope can be performed by at least one of an operation of the first focus mechanism and an operation of driving the substrate in the first direction by the substrate driving mechanism, and a second focus operation for the second scope can be performed by an operation of driving the substrate in the first direction by the substrate driving mechanism. the control unit controls the first focusing operation and the second focusing operation such that a time required for driving the substrate in the first direction by the substrate driving mechanism for focusing the plurality of second marks between the first measurement and the second measurement is shorter than a time required for driving the first focus lens by the first focusing mechanism between the first measurement and the second measurement. An exposure apparatus comprising: (Item 13) An exposure method for exposing a substrate using an exposure apparatus having a substrate driving mechanism capable of driving a substrate in a first direction parallel to an optical axis of a projection optical system and a second direction perpendicular to the optical axis, a first scope that captures an image for alignment of the substrate via the projection optical system, and a second scope that captures an image for alignment of the substrate without via the projection optical system, comprising: a first measurement step of measuring a position of a first mark on the substrate using the first scope; a focusing step of performing a first focusing operation for the first scope and a second focusing operation for the second scope to measure positions of a plurality of second marks on the substrate using the first scope and the second scope after the first measurement step; a second measurement step of measuring positions of the plurality of second marks using the first scope and the second scope after the focusing step; an alignment step of aligning the substrate based on a result obtained in the second measurement step; A first focus operation for the first scope can be performed by at least one of an operation of a first focus mechanism provided on the first scope and an operation of driving the substrate in the first direction by the substrate driving mechanism, and a second focus operation for the second scope can be performed by an operation of driving the substrate in the first direction by the substrate driving mechanism. the focusing step is performed such that a time required for the substrate driving mechanism to drive the substrate in the first direction for focusing the plurality of second marks is shorter than a time required for the first focus mechanism to drive a first focus lens. 13. An exposure method comprising: (Item 14) an exposure step of exposing a substrate by the exposure method according to item 13; a developing step of developing the substrate that has been subjected to the exposure step; a processing step of processing the substrate that has undergone the developing step to obtain an article; A method for manufacturing an article, comprising: <Other> The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0040] 2: first scope, 3: original, 4: projection optical system, 16: substrate, 17: stage, 18: control unit, 19: focus mechanism, 20: second scope, 23: substrate driving mechanism, 100: exposure apparatus

Claims

1. 1. An exposure apparatus that exposes a substrate by projecting a pattern of an original onto the substrate using a projection optical system, comprising: a substrate driving mechanism capable of driving the substrate in a first direction parallel to an optical axis of the projection optical system and in a second direction perpendicular to the optical axis; a first scope that captures an image of the substrate for alignment via the projection optical system; a second scope that captures an image for alignment of the substrate without passing through the projection optical system; a control unit that executes a first measurement that measures a position of a first mark on the substrate using the first scope, and a second measurement that measures positions of a plurality of second marks on the substrate using the first scope and the second scope after the first measurement, the first scope has a focus mechanism that drives a focus lens, a first focus operation for the first scope can be performed by at least one of an operation of the focus mechanism and an operation of driving the substrate in the first direction by the substrate driving mechanism, and a second focus operation for the second scope can be performed by an operation of driving the substrate in the first direction by the substrate driving mechanism; the control unit controls the first focusing operation and the second focusing operation such that a time required for driving the focus lens by the focusing mechanism between the first measurement and the second measurement is shorter than a time required for driving the substrate in the first direction by the substrate driving mechanism for focusing the plurality of second marks between the first measurement and the second measurement. An exposure apparatus comprising:

2. the control unit does not perform an operation of driving the focus lens by the focus mechanism after an operation of driving the substrate in the first direction by the substrate driving mechanism for focusing the plurality of second marks is completed between the first measurement and the second measurement.

2. The exposure apparatus according to claim 1.

3. The control unit does not operate the focus mechanism between the first measurement and the second measurement.

2. The exposure apparatus according to claim 1.

4. The second scope does not have a focus mechanism that drives a focus lens.

2. The exposure apparatus according to claim 1.

5. the control unit determines control information for controlling the first focus operation based on information obtained for exposing a first substrate, and controls the first focus operation based on the control information when exposing a second substrate.

5. An exposure apparatus according to claim 1, wherein the exposure apparatus is a liquid crystal display.

6. 1. An exposure method for exposing a substrate using an exposure apparatus having a substrate driving mechanism capable of driving a substrate in a first direction parallel to an optical axis of a projection optical system and a second direction perpendicular to the optical axis, a first scope that captures an image for alignment of the substrate via the projection optical system, and a second scope that captures an image for alignment of the substrate without via the projection optical system, a first measurement step of measuring a position of a first mark on the substrate using the first scope; a focusing step of performing a first focusing operation for the first scope and a second focusing operation for the second scope to measure positions of a plurality of second marks on the substrate using the first scope and the second scope after the first measurement step; a second measurement step of measuring positions of the plurality of second marks using the first scope and the second scope after the focusing step; an alignment step of aligning the substrate based on a result obtained in the second measurement step for exposure of the substrate; a first focus operation for the first scope can be performed by at least one of an operation of a focus mechanism provided in the first scope and an operation of driving the substrate in the first direction by the substrate driving mechanism, and a second focus operation for the second scope can be performed by an operation of driving the substrate in the first direction by the substrate driving mechanism, the focusing step is performed such that a time required for driving a focus lens by the focus mechanism is shorter than a time required for driving the substrate in the first direction by the substrate driving mechanism for focusing the plurality of second marks.

13. An exposure method comprising:

7. in the focusing step, after an operation of driving the substrate in the first direction by the substrate driving mechanism for focusing the plurality of second marks is completed, an operation of driving the focus lens by the focusing mechanism is not performed.

7. The exposure method according to claim 6.

8. In the focusing step, the focusing mechanism is not operated.

7. The exposure method according to claim 6.

9. The second scope does not have a focus mechanism that drives a focus lens.

7. The exposure method according to claim 6.

10. determining control information for controlling the first focus operation based on information obtained for exposing a first substrate; a control step of controlling the first focus operation before the first measurement step is performed in order to expose a second substrate; 7. The exposure method according to claim 6, further comprising:

11. an exposure step of exposing a substrate by the exposure method according to any one of claims 6 to 10; a developing step of developing the substrate that has been subjected to the exposure step; a processing step of processing the substrate that has undergone the developing step to obtain an article; A method for manufacturing an article, comprising:

12. 1. An exposure apparatus that exposes a substrate by projecting a pattern of an original onto the substrate using a projection optical system, comprising: a substrate driving mechanism capable of driving the substrate in a first direction parallel to an optical axis of the projection optical system and in a second direction perpendicular to the optical axis; a first scope that captures an image of the substrate for alignment via the projection optical system; a second scope that captures an image for alignment of the substrate without passing through the projection optical system; a control unit that executes a first measurement that measures a position of a first mark on the substrate using the first scope, and a second measurement that measures positions of a plurality of second marks on the substrate using the first scope and the second scope after the first measurement, the first scope has a first focus mechanism that drives a first focus lens, A first focus operation for the first scope can be performed by at least one of an operation of the first focus mechanism and an operation of driving the substrate in the first direction by the substrate driving mechanism, and a second focus operation for the second scope can be performed by an operation of driving the substrate in the first direction by the substrate driving mechanism. the control unit controls the first focusing operation and the second focusing operation such that a time required for driving the substrate in the first direction by the substrate driving mechanism for focusing the plurality of second marks between the first measurement and the second measurement is shorter than a time required for driving the first focus lens by the first focusing mechanism between the first measurement and the second measurement. An exposure apparatus comprising:

13. 1. An exposure method for exposing a substrate using an exposure apparatus having a substrate driving mechanism capable of driving a substrate in a first direction parallel to an optical axis of a projection optical system and a second direction perpendicular to the optical axis, a first scope that captures an image for alignment of the substrate via the projection optical system, and a second scope that captures an image for alignment of the substrate without via the projection optical system, a first measurement step of measuring a position of a first mark on the substrate using the first scope; a focusing step of performing a first focusing operation for the first scope and a second focusing operation for the second scope to measure positions of a plurality of second marks on the substrate using the first scope and the second scope after the first measurement step; a second measurement step of measuring positions of the plurality of second marks using the first scope and the second scope after the focusing step; an alignment step of aligning the substrate based on a result obtained in the second measurement step, A first focus operation for the first scope can be performed by at least one of an operation of a first focus mechanism provided on the first scope and an operation of driving the substrate in the first direction by the substrate driving mechanism, and a second focus operation for the second scope can be performed by an operation of driving the substrate in the first direction by the substrate driving mechanism. the focusing step is performed such that a time required for the substrate driving mechanism to drive the substrate in the first direction for focusing the plurality of second marks is shorter than a time required for the first focus mechanism to drive a first focus lens.

13. An exposure method comprising:

14. an exposure step of exposing a substrate by the exposure method according to claim 13; a developing step of developing the substrate that has been subjected to the exposure step; a processing step of processing the substrate that has undergone the developing step to obtain an article; A method for manufacturing an article, comprising:

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