Sensor element package and image display device including the same

Abstract

To provide a sensor element package having improved reliability and efficiency of signal transmission and reception, and an image display device including the same.SOLUTION: There are provided a sensor element package and an image display control including the same. The sensor element package includes a sensor element including touch sensing electrodes and an antenna unit, and a circuit board bonded to the sensor element. The circuit board includes a core layer including a first surface and a second surface which face each other, a first conductive layer including first touch sensor signal lines and a first antenna signal line distributed at the same level on the first surface of the core layer, a second conductive layer including second touch sensor signal lines and a second antenna signal line distributed at the same level on the second surface of the core layer, an antenna via structure which penetrates the core layer to connect the first antenna signal line and the second antenna signal line with each other, and a touch sensor via structure which penetrates the core layer to connect the first touch sensor signal lines and the second touch sensor signal lines to each other.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a sensor element package and an image display device including the same, and more particularly to a sensor element package including a sensor element and a circuit board, and an image display device including the same. [Background technology]

[0002] In recent years, with the development of the information society, wireless communication technologies such as Wi-Fi and Bluetooth (registered trademark) have been combined with image display devices, for example, in the form of smartphones. In this case, an antenna is combined with the image display device, and a communication function can be performed.

[0003] Furthermore, with the development of mobile communication technology, for example, an antenna for performing communication in high frequency or ultra-high frequency bands corresponding to 3G to 5G or higher can be combined with the image display device.

[0004] Meanwhile, electronic devices that realize both image display and information input functions have been developed by combining an image display device with a touch panel or touch sensor, which is an input device that selects instructions displayed on a screen with a person's hand or an object and inputs a user's command. For example, as shown in Patent Document 1, touch screen panels that combine various image display devices with touch sensors have been developed.

[0005] When the antenna structure is disposed together with the touch sensor, signal interference may occur between the antenna and the touch sensing electrode, and mutual signal interference may also occur in the circuit structures for respectively supplying power to the antenna structure and the touch sensor.

[0006] For example, Patent Document 2 discloses an antenna structure built into a portable terminal, but does not take into consideration compatibility with other electric elements such as a touch sensor. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Korean Patent Publication No. 2014-0092366 [Patent Document 2] Korean Patent Publication No. 2003-0095557 Summary of the Invention [Problem to be solved by the invention]

[0008] It is an object of the present invention to provide a sensor element package having improved reliability and efficiency of signal transmission and reception.

[0009] It is an object of the present invention to provide an image display device including a sensor element package having improved reliability and efficiency of signal transmission and reception. [Means for solving the problem]

[0010] 1. A sensor element package comprising: a sensor element including a touch sensing electrode and an antenna unit; and a circuit board bonded to the sensor element, the circuit board comprising: a core layer including a first surface and a second surface facing each other; a first conductive layer including a first touch sensor signal wiring and a first antenna signal wiring distributed at the same level on the first surface of the core layer; a second conductive layer including a second touch sensor signal wiring and a second antenna signal wiring distributed at the same level on the second surface of the core layer; an antenna via structure penetrating the core layer and connecting the first antenna signal wiring and the second antenna signal wiring to each other; and a touch sensor via structure penetrating the core layer and connecting each of the first touch sensor signal wiring and the second touch sensor signal wiring to each other.

[0011] 2. In the above-mentioned item 1, the sensor element further includes a touch sensor pad electrically connected to the touch sensing electrode and an antenna pad electrically connected to the antenna unit; the first touch sensor signal wiring of the circuit board is bonded to the touch sensor pad respectively, and the first antenna signal wiring of the circuit board is bonded to the antenna pad; a sensor element package;

[0012] 3. The sensor element package according to item 2, wherein the touch sensor pad and the antenna pad are arranged at one end of the sensor element to form a single pad row.

[0013] 4. The sensor element package according to item 3, wherein the sensor element is included in the single pad row, and further includes a blocking pad interposed between adjacent ones of the touch sensor pads, or a guard pad disposed at an end of the single pad row.

[0014] 5. In the above-mentioned item 4, the sensor element includes a trace connecting the touch sensing electrode and the touch sensor pad to each other; The sensor element package further includes a blocking line extending from the blocking pad between adjacent ones of the traces.

[0015] 6. The sensor element package according to item 4, wherein the sensor element further includes a loop-shaped guard line extending from the guard pad and surrounding the periphery of the touch sensing electrode.

[0016] 7. The sensor element package according to item 3, further comprising an anisotropic conductive film bonding the single pad row and the first conductive layer of the circuit board.

[0017] 8. The sensor element package according to item 2, wherein the antenna unit includes a radiator and a transmission line extending from the radiator and connected to the antenna pad.

[0018] 9. The sensor element package according to item 8, wherein a plurality of antenna units are arranged along a row direction, and the antenna pad is independently connected to each of the antenna units.

[0019] 10. A sensor element package according to item 9, wherein the transmission lines connected to each of the plurality of antenna units have a polygonal line shape and have the same length.

[0020] 11. The sensor element package according to item 9, wherein at least one of the touch sensor pads is disposed between the antenna pads connected to adjacent ones of the antenna units.

[0021] 12. In the above item 1, a touch sensor drive circuit / touch sensor connection structure electrically connected to the second touch sensor signal wiring on the second surface of the core layer; an antenna driving circuit / antenna connection structure electrically connected to the second antenna signal wiring on the second surface of the core layer.

[0022] 13. In the above-mentioned item 12, the antenna driving circuit / antenna connection structure includes an antenna driving integrated circuit chip or an antenna connector; The touch sensor driving circuit / touch sensor connection structure includes a touch sensor driving integrated circuit chip or a touch sensor connector; a sensor element package.

[0023] 14. The sensor element package according to item 1, wherein the circuit board further includes a mid-ground layer disposed within the core layer between the first conductive layer and the second conductive layer.

[0024] 15. A sensor element package according to item 14, wherein the antenna via structure and the touch sensor via structure are electrically isolated from the mid-ground layer and pass through the mid-ground layer.

[0025] 16. In the above-mentioned item 1, the sensor element further includes a base material layer, A sensor element package, wherein the touch sensing electrode and the antenna unit are arranged together at the same level on the top surface of the base layer.

[0026] 17. In the above-mentioned item 16, the base layer includes an active area in which the touch sensing electrodes are distributed and a peripheral area surrounding the active area; The antenna unit is disposed partially over the active area of ​​the sensor element package.

[0027] 18. An image display device comprising a display panel and the sensor element package according to any one of the preceding embodiments. Effect of the Invention

[0028] According to an embodiment of the present invention, the emitter and the sensing electrode are disposed together in the active area of ​​the sensor element, thereby improving space efficiency, and the touch sensor pad and the antenna pad are disposed together in the bonding area, thereby enabling power / signal transmission by one circuit board.

[0029] In an exemplary embodiment, the circuit board has a multi-layer structure including a first conductive layer and a second conductive layer, and each of the first conductive layer and the second conductive layer can include an antenna signal wiring and a touch signal wiring. An antenna via structure and a touch via structure interconnecting the first conductive layer and the second conductive layer can improve the reliability and efficiency of power supply to the antenna pad and the touch sensor pad through a single circuit board. [Brief description of the drawings]

[0030] [Figure 1] FIG. 1 is a schematic plan view illustrating a sensor element according to an exemplary embodiment. [Diagram 2] FIG. 2 is a schematic cross-sectional view illustrating a touch sensing electrode structure of a sensor element according to an exemplary embodiment. [Diagram 3] FIG. 3 is a schematic cross-sectional view of a sensor element package according to an exemplary embodiment. [Figure 4] FIG. 4 is a schematic cross-sectional view of a sensor element package according to an exemplary embodiment. [Diagram 5] FIG. 5 is a schematic partial enlarged plan view illustrating a sensor element package according to an exemplary embodiment. [Figure 6] FIG. 6 is a schematic cross-sectional view of a sensor element package according to an exemplary embodiment. [Figure 7] FIG. 7 is a schematic cross-sectional view of a sensor element package according to an exemplary embodiment. [Figure 8] FIG. 8 is a schematic plan view showing an image display device according to an exemplary embodiment. [Figure 9] FIG. 9 is a schematic cross-sectional view showing an image display device according to an exemplary embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0031] An embodiment of the present invention provides a sensor element package including a sensor element including an antenna unit and a sensing electrode, and a circuit board, and also provides an image display device including the sensor element package.

[0032] The antenna unit may be, for example, a microstrip patch antenna made in the form of a transparent film. The sensor element including the antenna unit may be applied, for example, to communication devices for high frequency or ultra-high frequency (e.g., 3G, 4G, 5G or higher) mobile communication. However, the sensor element is not limited to an image display device, and may be applied to various structures such as vehicles, home appliances, and buildings.

[0033] Hereinafter, the embodiments of the present invention will be described in more detail with reference to the drawings. However, the drawings attached to this specification are intended to illustrate preferred embodiments of the present invention and, together with the detailed description of the invention, serve to aid in further understanding of the technical concept of the present invention, and therefore the present invention should not be interpreted as being limited only to the matters depicted in the drawings.

[0034] As used in this specification, terms such as "first," "second," "one side," "other side," "one end," "other end," "top," "bottom," "upper portion," "lower portion," "column direction," and "row direction" are not intended to limit absolute positions or orders, but are used in a relative sense to distinguish different configurations or parts.

[0035] As used herein, the term "row direction" may correspond to a width direction parallel to an active or display surface of a sensor element or image display device, and a "column direction" may be a longitudinal direction parallel to said active or display surface and perpendicular to said row direction.

[0036] Fig. 1 is a schematic plan view showing a sensor element according to an exemplary embodiment. Fig. 2 is a schematic cross-sectional view showing a structure of a touch sensing electrode of a sensor element according to an exemplary embodiment. Fig. 2 is a cross-sectional view cut in the thickness direction along "I-I'" in Fig. 1.

[0037] 1 and 2, the sensor element may include a base layer 100, as well as touch sensing electrodes 110, 130 (hereinafter abbreviated as "sensing electrodes") and an antenna unit 200 arranged on the base layer 100.

[0038] The substrate layer 100 may include a support layer, an interlayer insulating layer, or a film-type substrate for forming the sensing electrodes 110, 130 and the antenna unit 200. For example, the substrate layer 100 may also serve as a dielectric layer of the antenna unit 200.

[0039] For example, the base layer 100 may include a transparent resin film including polyester-based resins such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, and polybutylene terephthalate; cellulose-based resins such as diacetyl cellulose and triacetyl cellulose; polycarbonate-based resins; acrylic resins such as polymethyl (meth)acrylate and polyethyl (meth)acrylate; styrene-based resins such as polystyrene and acrylonitrile-styrene copolymers; polyolefin-based resins such as polyethylene, polypropylene, polyolefins having a cyclo- or norbornene structure, and ethylene-propylene copolymers; vinyl chloride-based resins; amide-based resins such as nylon and aromatic polyamide; imide-based resins; polyethersulfone-based resins; sulfone-based resins; polyetheretherketone-based resins; polyphenylene sulfide-based resins; vinyl alcohol-based resins; vinylidene chloride-based resins; vinyl butyral-based resins; arylate-based resins; polyoxymethylene-based resins; epoxy-based resins; urethane-based or acrylic urethane-based resins; silicone-based resins, etc. These may be used alone or in combination of two or more.

[0040] In some embodiments, the base layer 100 can include an adhesive film such as an Optically Clear Adhesive (OCA), an Optically Clear Resin (OCR), or the like.

[0041] In some embodiments, the substrate layer 100 can include an inorganic insulating material, such as silicon oxide, silicon nitride, silicon oxynitride, glass, or the like.

[0042] In one embodiment, the substrate layer 100 may be provided in a substantially single layer.

[0043] In one embodiment, the substrate layer 100 may each include a multi-layer structure of at least two layers. For example, the substrate layer 100 may include a lower substrate and a dielectric layer, and may also include an adhesive layer between the lower substrate and the dielectric layer.

[0044] The base layer 100 forms an impedance or inductance with respect to the antenna unit 200, and can adjust the frequency band in which the antenna unit 200 can be driven or sensed. In some embodiments, the dielectric constant of the base layer 100 can be adjusted to a range of about 1.5 to 12. If the dielectric constant exceeds about 12, the driving frequency is too low, and driving in a high frequency band may not be realized.

[0045] In one embodiment, a ground plane (not shown) may be disposed beneath the bottom surface of the substrate layer 100 .

[0046] In one embodiment, the ground layer can provide a conductive member of an image display device or a display panel to which the sensor element is applied.

[0047] For example, the conductive member may include electrodes or wiring such as a gate electrode, a source / drain electrode, a pixel electrode, a common electrode, a data line, a scan line, etc., included in a thin film transistor (TFT) array panel.

[0048] In one embodiment, the ground layer can also serve as a SUS plate arranged on the rear surface of the image display device, a sensor component such as a digitizer, and a metallic component such as a heat dissipation sheet.

[0049] The top surface of the substrate layer 100 may include an active area (AA) and a peripheral area (PA) around the active area (AA). The sensing electrodes 110, 130 and the antenna unit 200 may be arranged on the active area (AA) of the substrate layer 100.

[0050] The sensing electrodes 110 and 130 may be disposed on the upper surface of the base layer 100 in the active area (AA). When a user's touch is input onto the active area (AA), a change in capacitance may occur due to the sensing electrodes 110 and 130. As a result, a predetermined sensing function may be performed by converting a physical touch into an electrical signal.

[0051] The sensing electrodes 110, 130 may include a first sensing electrode 110 and a second sensing electrode 130. The first sensing electrode 110 and the second sensing electrode 130 may be arranged in a direction crossing each other. The first sensing electrode 110 and the second sensing electrode 130 may be located in the same layer or at the same level on the upper surface of the base layer 100.

[0052] For example, the first sensing electrodes 110 may be arranged along a column direction (e.g., Y direction). The first sensing electrodes 110 may be connected along the column direction via a merging portion 115. The merging portion 115 may be integrally connected to the first sensing electrodes 110 and may be provided as a substantially single member.

[0053] A plurality of first sensing electrodes 110 may be connected by merging portions 115 to define a sensing channel column extending in the column direction. In addition, a plurality of the sensing channel columns may be arranged in a row direction (e.g., an X direction).

[0054] The second sensing electrodes 130 may be arranged along the row direction. Each of the second sensing electrodes 130 may have a pattern shape of islands spaced apart from each other. The second sensing electrodes 130 adjacent to each other in the second direction may be electrically connected to each other by a bridge electrode 135.

[0055] For example, a pair of second sensing electrodes 130 adjacent to each other across a merging portion 115 included in the sensing channel column may be electrically connected to each other by a bridge electrode 135. As a result, a sensing channel row may be defined by a plurality of second sensing electrodes 130 and bridge electrodes 135 connected in the row direction. In addition, a plurality of the sensing channel rows may be arranged along the column direction.

[0056] As shown in FIG. 2, an interlayer insulating layer 120 is formed to cover the first and second sensing electrodes 110 and 130, and the bridge electrodes 135 may penetrate the interlayer insulating layer 120 to connect the adjacent second sensing electrodes 130.

[0057] In some embodiments, a protective layer 190 covering the bridge electrode 135 may be formed on the interlayer insulating layer 120. The interlayer insulating layer 120 and the protective layer 190 may include the above-mentioned resin material or inorganic insulating material and may cover both the sensing electrodes 110, 130 and the antenna unit 200. The interlayer insulating layer 120 and the protective layer 190 may be removed in the bonding area (BA) to expose the pads.

[0058] 1 shows that each of the sensing electrodes 110, 130 has a diamond-shaped pattern, but the shapes of the sensing electrodes 110, 130 can be appropriately changed in consideration of the pattern density, compatibility with the optical characteristics of the image display device, the arrangement of the antenna unit 200, etc. For example, the sensing electrodes 110, 130 may be formed to have a wavy frame.

[0059] Although FIG. 1 shows that the sensing electrodes in the column direction are connected together by a merging portion and the sensing electrodes in the row direction are connected by a bridge electrode, the column direction and the row direction are used relatively to indicate two different intersecting directions and are not intended to limit a specific direction.

[0060] Also, in FIG. 1, for convenience of explanation, the number of sensing channel rows and sensing channel columns, as well as the number of sensing electrodes included therein, are shown only partially, and can be expanded depending on the area of ​​the active area (AA).

[0061] The area on the upper surface of the base layer 100 excluding the active area (AA) may be defined as a peripheral area (PA). The peripheral area (PA) may be defined as an area that at least partially surrounds the active area (AA). The peripheral area (PA) may include a bezel area of ​​the image display device, and may include a bonding area (BA) where pads are arranged. The active area (AA) may overlap with a display area of ​​the image display device.

[0062] The sensor element may further include a trace 140 and a touch sensor pad 150 .

[0063] The traces 140 may branch off from each of the sensing channel rows and sensing channel columns and extend onto the peripheral area (PA). The traces 140 may include a first trace 142 branching off from the sensing channel column and a second trace 144 branching off from the sensing channel row. The traces 140 may include substantially the same or similar conductive material and / or layered structure as the sensing electrodes 110, 130.

[0064] In some embodiments, the second traces 144 may be arranged in a double-routing manner: the second traces 144 may be distributed alternately on both sides of the peripheral area (PA) in the row direction.

[0065] For example, the second traces 144 may be arranged alternately on both sides along the column direction. The second traces 144 may branch off from one end of one of the sensing channel rows, and the second traces 144 may branch off from the other end of a sensing channel row adjacent to the one sensing channel row.

[0066] The above-mentioned double routing arrangement can reduce the area of ​​the peripheral area (PA) on both sides while ensuring a sufficient area of ​​the active area (AA). In addition, the variation in length of the second trace 144 can be reduced to improve resistance / sensing uniformity. Furthermore, the conductive lines can be distributed on both sides to uniformly distribute stress caused by folding the sensor element.

[0067] In some embodiments, the first traces 142 may each branch off from one end of the sensing channel row adjacent to a bonding area (BA), thereby shortening the length of the first traces 142 and improving the sensing / signal transmission speed.

[0068] In one embodiment, a portion of the first trace 142 may branch off from the other end of the array of sensing channels and extend to a bonding area (BA).

[0069] As shown in FIGS. 1 and 2, the sensing electrodes 110 and 130 may be arranged in a mutual capacitance manner.

[0070] In some embodiments, the sensing electrodes 110, 130 may be arranged in a self-capacitance manner. In this case, each sensing electrode 110, 130 may have an independent island pattern shape, and the trace 140 may branch off from each island pattern sensing electrode 110, 130. Also, the merger 115 and the bridge electrode 135 may be omitted.

[0071] The traces 140 may extend over a peripheral area (PA) and meet at a bonding area (BA) within which a touch sensor pad 150 may be located that is connected to an end of the traces 140.

[0072] The touch sensor pad 150 may include a first touch sensor pad 152 electrically connected to each of the sensing channel columns via a first trace 142 and a second touch sensor pad 154 electrically connected to each of the sensing channel rows via a second trace 144.

[0073] In some embodiments, the blocking pad 151 and the guard pad 153 may be disposed adjacent to the touch sensor pad 150. The blocking pad 151 and the guard pad 153 may not be electrically or physically connected to the trace 140. The blocking pad 151 and the guard pad 153 are arranged independently and are not connected to the touch sensing electrodes 110, 130 and the first and second touch sensor pads 152, 154, but may be included as a configuration to enhance the reliability of touch sensing / driving.

[0074] The blocking pad 151 may be disposed between adjacent first and second touch sensor pads 152 and 154. For example, a plurality of first touch sensor pads 152 may be arranged in the row direction to form a first touchpad row, and a plurality of second touch sensor pads 154 may be arranged in the row direction to form a second touchpad row. The blocking pad 151 may be inserted between the first and second touchpad rows.

[0075] Blocking pads 151 provide improved isolation of currents and signals to the sensing channel rows and sensing channel columns, and prevent mutual interference between drive currents and receive currents.

[0076] The guard pads 153 may be located at the ends of a row of pads located in a bonding area (BA). For example, the guard pads 153 may be the outermost pads included in the row of pads.

[0077] In some embodiments, guard pads 153 may be placed at either end of the row of pads.

[0078] According to an exemplary embodiment, blocking lines 141 and guard lines 142 may be connected to blocking pads 151 and guard pads 153, respectively. Blocking lines 141 and guard lines 142 may extend from blocking pads 151 and guard pads 153, respectively, within a peripheral area (PA).

[0079] 1, a region in which first traces 142 extend in the row direction can be divided into a region in which second traces 144 extend in the row direction by a blocking line 141. The blocking line 141 prevents signal collision between the first trace 142 and the second trace 144, and prevents mutual interference between the driving current and the receiving current.

[0080] The guard lines 143 may extend to at least partially surround the active areas (AA). For example, the guard lines 143 may extend continuously between the guard pads 153 disposed at both ends of the pad row to form a loop. This can reduce / block interference between the touch signals in the active areas (AA) and external noise.

[0081] The antenna unit 200 may include a radiator 210 and a transmission line 220 .

[0082] For example, the radiator 210 can have a polygonal plate shape.

[0083] For example, the transmission line 220 may have a width less than that of the emitter 210 and may be connected to one end or side of the emitter 210. The emitter 210 and the transmission line 220 may be formed as a single member that is integrally connected to one another.

[0084] The target resonant frequency of the antenna unit 200 can be adjusted by the shape and size of the radiator 210. For example, the radiator 210 can be designed to be capable of radiating in high frequency / ultra-high frequency bands of 3G, 4G, 5G or more. For example, the radiator 210 can realize a radiation band of a frequency band of about 0.5 GHz or more, about 1 GHz or more, about 10 GHz or more, about 20 GHz or more, about 30 GHz or more, or about 40 GHz or more.

[0085] An antenna pad 250 can be arranged in the bonding area (BA) together with the touch sensor pad 150. An antenna power / drive signal for the antenna unit 200 can be transmitted from the antenna pad 250 to the transmission line 220.

[0086] In some embodiments, the transmission line 220 can have a variable width. As shown in FIG. 1, the transmission line 220 can include an extended line section 225 that has an increased width at the end adjacent to the radiator 210. The extended line section 225 can reduce loss of the signal transmitted from the antenna pad 250 to the radiator 210 and facilitate impedance matching with the radiator 210.

[0087] Each of the transmission lines 220 has a bent line shape, and can efficiently gather the antenna pads 250 within the bonding area (BA). For example, each of the transmission lines 220 can include two bent portions.

[0088] In some embodiments, the lengths of the transmission lines 220 of the antenna units 200 may all be substantially the same. In this case, the phase of the signals applied to each antenna unit 200 can be made uniform. This makes it possible to suppress phase interference and achieve radiation of a desired frequency band with high reliability.

[0089] According to an exemplary embodiment, the touch sensor pads 150 and the antenna pads 250 may form a single row of pads at one end of the sensor element, which may further include blocking pads 151 and guard pads 153.

[0090] The sensing electrodes 110, 130, traces 140 and / or antenna unit 200 may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), or an alloy containing at least one of these, which may be used alone or in combination of two or more.

[0091] In one embodiment, the sensing electrodes 110, 130, the traces 140, and / or the antenna unit 200 may include silver (Ag) or a silver alloy (e.g., a silver-palladium-copper (APC) alloy), or copper (Cu) or a copper alloy (e.g., a copper-calcium (CuCa) alloy) to achieve low resistance and fine linewidth.

[0092] In some embodiments, the sensing electrodes 110, 130, the traces 140, and / or the antenna unit 200 may also include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (ITZO), zinc oxide (ZnOx), or the like.

[0093] In some embodiments, the sensing electrodes 110, 130, the traces 140, and / or the antenna unit 200 may include a laminated structure of a transparent conductive oxide layer and a metal layer, for example, a two-layer structure of a transparent conductive oxide layer-metal layer, or a three-layer structure of a transparent conductive oxide layer-metal layer-transparent conductive oxide layer. In this case, the metal layer can improve flexibility and reduce resistance to improve signal transmission speed, and the transparent conductive oxide layer can improve corrosion resistance and transparency.

[0094] The sensing electrodes 110, 130, the traces 140 and / or the antenna unit 200 may include a blackening treatment, which can reduce the reflectance on the surfaces of the sensing electrodes 110, 130, the traces 140 and / or the antenna unit 200, thereby reducing the visibility of the patterns due to light reflection.

[0095] In one embodiment, the surface of a metal layer included in the sensing electrodes 110, 130, the traces 140, and / or the antenna unit 200 may be converted to a metal oxide or metal sulfide to form a blackening layer. In one embodiment, a blackening layer such as a black material coating layer or a plating layer may be formed on the sensing electrodes 110, 130, the traces 140, and / or the antenna unit 200 or the metal layer. The black material or plating layer may include silicon, carbon, copper, molybdenum, tin, chromium, molybdenum, nickel, cobalt, or an oxide, sulfide, alloy, etc. containing at least one of these elements.

[0096] The composition and thickness of the blackening layer can be adjusted taking into consideration the effect of reducing reflectance and the radiation characteristics of the antenna.

[0097] In one embodiment, the sensing electrodes 110, 130 and the emitter 210 may include a mesh structure, which may prevent the sensing electrodes 110, 130 and the emitter 210 from being visually recognized by a user in the active area (AA).

[0098] In one embodiment, at least a portion of the transmission line 220 may include a solid structure formed from the aforementioned metal or alloy, which can reduce the increase in resistance between the antenna unit 200 and the antenna pad 250 and improve the power supply efficiency.

[0099] The antenna unit 200 may be located in the active area (AA) and partially located in the peripheral area (PA). For example, the transmission line 220 may be located in the peripheral area (PA). In one embodiment, the transmission line 220 may extend across the active area (AA) and the peripheral area (PA).

[0100] In one embodiment, the transmission line 220 may also share the mesh structure. The transmission line 220 may also have a partially solid structure.

[0101] In one embodiment, the sensing electrodes 110, 130 and / or the emitter 210 may also include solid thin-film transparent metal structures, which may further improve the sensing sensitivity and emission performance.

[0102] The touch sensor pad 150 and the antenna pad 250 may have a solid structure made of the aforementioned metals or alloys, which may reduce the bonding resistance with the circuit board 300.

[0103] In an exemplary embodiment, the sensing electrodes 110, 130 and the antenna unit 200 may be disposed in the same layer or at the same level. For example, the sensing electrodes 110, 130 and the emitter 210 may be formed together in the same layer and by the same patterning process to have a mesh structure.

[0104] In some embodiments, the antenna unit 200 and the traces 140 may be formed in the same layer.

[0105] According to an exemplary embodiment, the touch sensor pad 150 and the antenna pad 250 can be arranged on the same layer, allowing a single circuit board 300 to provide both antenna bonding and touch sensor bonding, as described below.

[0106] In some embodiments, the antenna unit 200 and the antenna pad 250 can be directly connected to each other on the same layer, which can reduce the antenna's feed resistance while suppressing the antenna's signal loss.

[0107] In some embodiments, the sensing electrodes 110, 130, the traces 140, and the touch sensor pads 150 can be directly connected to each other on the same layer, which can improve touch sensing sensitivity while reducing the resistance of the sensing channel.

[0108] As shown in FIG. 1, a plurality of antenna units 200 may be arranged in an array at one end of an active area (AA) adjacent to a bonding area (BA).

[0109] The sensing electrodes 110, 130 adjacent to the radiator 210 of the antenna unit 200 may have a smaller area than the other sensing electrodes 110, 130. This allows the mutual independence of touch sensing and antenna radiation to be maintained while securing an arrangement space for the antenna unit 200. For example, the sensing electrodes 110, 130 adjacent to the radiator 210 may include a recess that is etched so that the radiator 210 can be partially inserted therein.

[0110] In some embodiments, a touch sensor pad 150 (e.g., a first touch sensor pad 152) may be disposed between adjacent antenna pads 250. For example, a plurality of antenna pad units may be repeatedly arranged along the row direction with the touch sensor pads 150 interposed therebetween.

[0111] In some embodiments, an antenna ground pad (not shown) may be further disposed around the antenna pad 250. The antenna ground pad may improve the mutual independence and reliability of antenna power supply / radiation and touch sensing by the sensing electrodes 110 and 130.

[0112] In some embodiments, multiple touch sensor pads 150 may be disposed between adjacent antenna pads 250. For example, multiple first touch sensor pads 152 may be disposed between adjacent antenna pads 250. In this case, multiple first traces 142 may be disposed between adjacent antenna units 200.

[0113] In some embodiments, one touch sensor pad 150 may be disposed between adjacent antenna pads 250. For example, one first touch sensor pad 152 may be disposed between adjacent antenna pad units, thereby increasing the pad density in the pad row while reducing the number of touch sensor pads 150 sandwiched between the antenna pad units.

[0114] 3 and 4 are schematic cross-sectional views showing a sensor element package according to an exemplary embodiment. Fig. 5 is a schematic partially enlarged plan view showing a sensor element package according to an exemplary embodiment. Fig. 5 is a plan view showing an enlarged structure around a bonding region of a sensor element.

[0115] Fig. 3 shows the connection between the antenna pad 250 and the antenna unit 200 via the circuit board 300. Fig. 4 shows the connection between the touch sensor pad 150 and the sensing electrodes 110, 130 of the touch sensor via the circuit board 300. For convenience of explanation, the sensor element packages are shown separately in Fig. 3 and Fig. 4, but as shown in Fig. 5, one circuit board 300 and one sensor element can be combined to realize a single sensor element package.

[0116] 3 to 5, the circuit board 300 may include a core layer 310, a first conductive layer 320, and a second conductive layer 330.

[0117] The core layer 310 may include a flexible resin such as polyimide resin, modified polyimide (MPI), epoxy resin, polyester, cycloolefin polymer (COP), liquid crystal polymer (LCP), etc. In a preferred embodiment, the core layer 310 may include polyimide resin or MPI.

[0118] The conductive layers 320, 330 of the circuit board 300 may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), tin (Sn), zinc (Zn), molybdenum (Mo), calcium (Ca), or an alloy containing at least one of these metals. In some embodiments, the conductive layers 320, 330 may include copper or a copper alloy in consideration of signal efficiency and ground efficiency.

[0119] In one embodiment, the circuit board 300 may be manufactured from a Copper Clad Laminate (CCL). The circuit board 300 may be provided as a flexible printed circuit board (FPCB).

[0120] The core layer 310 can have a first surface 310a and a second surface 310b facing each other. For example, the first surface 310a and the second surface 310b can correspond to the bottom surface and the top surface of the core layer 310, respectively. According to an exemplary embodiment, the first surface 310a can correspond to a bonding surface to the sensor element, and the second surface 310b can correspond to a mounting surface of the driving circuit / driving circuit connection structure.

[0121] The first conductive layer 320 and the second conductive layer 330 may be formed on the first surface 310a and the second surface 310b of the core layer 310, respectively.

[0122] The first conductive layer 320 may include a first antenna signal trace 322 and a first touch sensor signal trace 325. The second conductive layer 330 may include a second antenna signal trace 332 and a second touch sensor signal trace 335.

[0123] The first antenna signal trace 322 and the first touch sensor signal trace 325 can be distributed together at the same level on the first surface 310a of the core layer 310. The second antenna signal trace 332 and the second touch sensor signal trace 335 can be distributed together at the same level on the second surface 310b of the core layer 310.

[0124] 3, the first antenna signal wiring 322 may be bonded onto and electrically connected to the antenna pad 250 by a bonding intermediary structure 180. According to an exemplary embodiment, the bonding intermediary structure 180 may include an anisotropic conductive film (ACF).

[0125] 1, a plurality of antenna units 200 can be arranged in an array. In this case, a plurality of first antenna signal wirings 322 can be bonded or connected to antenna pads 250 individually so as to correspond to the respective antenna units.

[0126] Second antenna signal wiring 332 can be electrically connected to first antenna signal wiring 322 on second surface 310b of core layer 310. For example, multiple second antenna signal wirings 332 can be arranged on second surface 310b of core layer 310 so as to correspond to multiple first antenna signal wirings 322, respectively.

[0127] According to an example embodiment, the first antenna signal trace 322 and the second antenna signal trace 332 may be electrically connected to each other through an antenna via structure 324. The antenna via structure 324 may extend through the core layer 310 to connect the first antenna signal trace 322 and the second antenna signal trace 332.

[0128] For example, an antenna via hole may be formed penetrating the core layer 310 and filled with a plating process (e.g., copper plating) to form the antenna via structure 324. The antenna via structure 324 may be formed as a conductor that is substantially integral with the first antenna signal wiring 322 and the second antenna signal wiring 332.

[0129] The second antenna signal wiring 332 may be electrically connected to an antenna driving circuit / antenna connection structure 350. In one embodiment, the antenna driving circuit / antenna connection structure 350 may include an antenna connector. The antenna connector may be, for example, a board-to-board (B2B) connector. In this case, the circuit board 300 may be coupled to a chip mounting board via the antenna connector.

[0130] For example, the antenna driving circuit / antenna connection structure 350 may include an antenna driving integrated circuit (IC) chip. In this case, the antenna driving IC chip 350b may be directly mounted on the circuit board 300 via the antenna conductive intermediary structure 340. The antenna conductive intermediary structure 340 may include solder, conductive balls, conductive wires, etc.

[0131] As shown in FIG. 4, the first touch sensor signal wiring 325 may be bonded onto and electrically connected to the touch sensor pad 150 by the aforementioned bonding intermediary structure 180 .

[0132] A plurality of first touch sensor signal wirings 325 can be individually bonded or connected to touch sensor pads 150 corresponding to each trace 140 .

[0133] The second touch sensor signal wiring 335 can be electrically connected to the first touch sensor signal wiring 325 on the second surface 310b of the core layer 310. For example, a plurality of second touch sensor signal wirings 335 can be arranged on the second surface 310b of the core layer 310 to correspond to the plurality of first touch sensor signal wirings 325, respectively.

[0134] According to an exemplary embodiment, the first touch sensor signal trace 325 and the second touch sensor signal trace 335 can be electrically connected to each other through a touch sensor via structure 327. The touch sensor via structure 327 can penetrate the core layer 310 to connect the first touch sensor signal trace 325 and the second touch sensor signal trace 335.

[0135] For example, a touch sensor via hole may be formed penetrating the core layer 310, and the touch sensor via hole may be filled by a plating process (e.g., copper plating) to form the touch sensor via structure 327. The touch sensor via structure 327 may be formed as a conductor that is substantially integral with the first touch sensor signal wiring 325 and the second touch sensor signal wiring 335.

[0136] The second touch sensor signal wiring 335 may be electrically connected to a touch sensor driving circuit / touch sensor connection structure 370. In one embodiment, the touch sensor driving circuit / touch sensor connection structure 370 may include a touch sensor connector. The touch sensor connector may be, for example, a board-to-board (B2B) connector. In this case, the circuit board 300 may be coupled to the chip mounting substrate through the touch sensor connector.

[0137] For example, the touch sensor driving circuit / touch sensor connection structure 370 may include a touch sensor IC chip. In this case, the touch sensor driving IC chip 370b may be directly mounted on the circuit board 300 via the touch sensor conductive intermediary structure 360. The touch sensor conductive intermediary structure 360 ​​may include solder, conductive balls, conductive wires, etc.

[0138] According to the above-described exemplary embodiment, by arranging the touch sensor pad 150 and the antenna pad 250 together in the bonding area (BA) of the sensor element, a single circuit board 300 can provide power / signal transmission for both the antenna and the touch sensor.

[0139] The circuit board 300 is formed of a multi-layer conductive structure including a first conductive layer 320 and a second conductive layer 330, and the first conductive layer 320 and the second conductive layer 330 can be designed to include antenna signal wiring and touch signal wiring, respectively. Through the antenna via structure 324 and the touch sensor via structure 327 interconnecting the first conductive layer 320 and the second conductive layer 330, the single circuit board 300 can be used to improve the reliability and efficiency of power supply to the antenna pad 250 and the touch sensor pad 150.

[0140] In some embodiments, a reference potential or a ground potential can be applied to the blocking pad 151 and / or the guard pad 153. For example, a touch drive signal potential can be applied to the touch sensor pads 152 and 154 via the touch sensor drive IC chip 370b (see FIG. 9 ), and the reference potential or the ground potential can be applied to the blocking pad 151 and / or the guard pad 153.

[0141] The reference potential or ground potential may be less than the potential of the touch drive signal to the touch sensor pad 150 and the power supply potential to the signal pad 252. In one embodiment, the reference potential or ground potential may be substantially 0V.

[0142] In some embodiments, the touch sensor signal traces 325, 335 may further include signal traces connected to the blocking pad 151 and / or the guard pad 153 to apply the reference potential or ground potential.

[0143] In some embodiments, the reference or ground potential may be applied to the antenna ground pad (not shown).

[0144] The aforementioned reference potential / ground potential can increase the mutual independence of the antenna power supply / drive signal and the touch sensing signal.

[0145] 6 and 7 are schematic cross-sectional views showing a sensor element package according to an exemplary embodiment. Detailed description of configurations and structures that are substantially the same as or equivalent to those in FIGS.

[0146] 6 and 7, the circuit board 300 may further include a mid-ground layer 390 disposed between the first conductive layer 320 and the second conductive layer 330. In this case, the circuit board 300 may have a conductive layer structure of three or more layers.

[0147] The core layer 310 may be provided in the form of multiple interlayer insulating layers. According to an exemplary embodiment, a first interlayer insulating layer 312 may be disposed between the first conductive layer 320 and the mid-ground layer 390, and a second interlayer insulating layer 314 may be disposed between the mid-ground layer 390 and the second conductive layer 330.

[0148] The mid-ground layer 390 may be electrically and physically separated from the antenna via structure 324 and the touch sensor via structure 327. In one embodiment, the mid-ground layer 390 may include holes through which the antenna via structure 324 and the touch sensor via structure 327 each pass.

[0149] In one embodiment, a blocking insulating layer 395 may be formed between the mid-ground layer 390 and the via structures 324, 327. This allows the insulating separation between the mid-ground layer 390 and the via structures 324, 327 to be stably maintained.

[0150] The mid-ground layer 390 can improve the independence and efficiency of antenna signal transmission and touch sensor signal transmission by the first conductive layer 320 and the second conductive layer 330, respectively, while reducing overall signal / power loss.

[0151] 8 and 9 are a schematic plan view and a cross-sectional view, respectively, illustrating an image display device according to an exemplary embodiment.

[0152] 8 shows a front or window surface of an image display device 400 manufactured in the form of, for example, a smartphone. The front surface of the image display device 400 can include a display area (DA) 430 and a non-display area (NDA) 440. The non-display area 440 can correspond to, for example, a light shielding portion or a bezel portion of the image display device 400.

[0153] 8 and 9, an image display device 400 can include a display panel 410 and the above-mentioned sensor elements disposed on the display panel 410.

[0154] The sensor element according to the aforementioned exemplary embodiment can be arranged towards the front part of the image display device 400, for example, on the display panel, so that the antenna unit 200 included in the sensor element can be provided as an Antenna-On-Display (AOD) antenna.

[0155] In some embodiments, the sensor elements may be attached onto a display panel in the form of a film. In some embodiments, the sensor elements may be disposed across the display area 430 and the non-display area 440 of the image display device 400.

[0156] In some embodiments, the active area (AA) of the sensor element may overlap with the display area 430. In one embodiment, the sensing electrodes 110, 130 and / or the emitter 210 may at least partially overlap with the display area 430.

[0157] In some embodiments, the peripheral area (PA) of the sensor element may overlap with the non-display area 440. The trace 140 and / or the signal pad 230 of the antenna unit 200 may at least partially overlap with the non-display area 440. For example, a portion of the sensor element having a solid structure may overlap with the non-display area 440.

[0158] The sensor element can be powered or driven through the circuit board 300. As described in Figures 3 and 4, the circuit board 300 is electrically connected to the antenna driving circuit / antenna connection structure 350, which can include an antenna connector 350a and an antenna driving IC chip 350b. The touch sensor driving circuit / touch sensor connection structure 370 can include a touch sensor connector 370a and a touch sensor driving IC chip 370b.

[0159] 9 shows antenna connector 350a and touch sensor connector 370a as a single connector, but as described above, antenna connector 350a and touch sensor connector 370a can be mounted as independent separate members on circuit board 300. Antenna driving IC chip 350b and touch sensor driving IC chip 370b can also be mounted on chip mount substrate 450 as independent, separated chips.

[0160] The circuit board 300 is bent toward the rear surface of the image display device 400 so as to be connectable to the driving IC chips 350 b and 370 b mounted on a chip mount substrate 450 .

[0161] For example, the antenna unit 200 and the circuit board 300 can be electrically connected to the antenna driving IC chip 350b through the antenna connector 350a. The sensing electrodes 110, 130 of the touch sensor and the circuit board 300 can be electrically connected to the touch sensor driving IC chip 370b through the touch sensor connector 370a.

[0162] The chip mount substrate 450 may be a rigid printed circuit board, for example, the main board of the image display device 400 .

[0163] As described with reference to FIGS. 3 and 4, the antenna driving IC chip 350b and the touch sensor driving IC chip 370b can also be mounted directly on the circuit board 300.

[0164] According to an exemplary embodiment, the display panel 410 may further include an optical layer 420. For example, the optical layer 420 may be a polarizing layer including a polarizer or a polarizing plate. In some embodiments, the sensor element may be disposed on the optical layer 420. [Explanation of symbols]

[0165] 100: Base material layer 110: first sensing electrode 115: Merger Section 130: second sensing electrode 135: Bridge electrode 140: Trace 142: First trace 144: Second trace 150: Touch sensor pad 152: 1st touch sensor pad 154: 2nd touch sensor pad 180: Bonding Intermediate Structure 200: Antenna unit 210: Radiator 220: Transmission line 250: Antenna pad 300: Circuit board 310: Core layer 320: First conductive layer 322: 1st antenna signal wiring 324: Antenna via structure 325: 1st touch sensor signal wiring 327: Touch sensor via structure 330: second conductive layer 332: Second antenna signal wiring 335: 2nd touch sensor signal wiring 340: Antenna conductive mediating structure 350: Antenna driving circuit / antenna connection structure 360: Touch sensor conductive intermediary structure 370: Touch sensor drive circuit / touch sensor connection structure 390: Mid-ground layer

Claims

1. a sensor element including a touch sensing electrode and an antenna unit; a circuit board bonded to the sensor element; The circuit board includes: a core layer including a first surface and a second surface opposed to each other; a first conductive layer including a first touch sensor signal wiring and a first antenna signal wiring distributed at the same level on the first surface of the core layer; a second conductive layer including a second touch sensor signal wiring and a second antenna signal wiring distributed at the same level on the second surface of the core layer; an antenna via structure that penetrates the core layer and connects the first antenna signal wiring and the second antenna signal wiring to each other; a touch sensor via structure penetrating the core layer and connecting the first touch sensor signal wiring and the second touch sensor signal wiring to each other;

2. the sensor element further includes a touch sensor pad electrically connected to the touch sensing electrode and an antenna pad electrically connected to the antenna unit; The sensor element package according to claim 1 , wherein the first touch sensor signal wiring of the circuit board is bonded to the touch sensor pad, and the first antenna signal wiring of the circuit board is bonded to the antenna pad.

3. The sensor element package of claim 2 , wherein the touch sensor pads and the antenna pads are arranged at one end of the sensor element to form a single row of pads.

4. 4. The sensor element package of claim 3, wherein the sensor element is included in the single pad row and further includes a blocking pad interposed between adjacent ones of the touch sensor pads or a guard pad disposed at an end of the single pad row.

5. The sensor element includes a trace connecting the touch sensing electrode and the touch sensor pad together; 5. The sensor element package of claim 4, further comprising: a blocking line extending from said blocking pad between adjacent ones of said traces.

6. The sensor element package of claim 4 , wherein the sensor element further includes a loop-shaped guard line extending from the guard pad and surrounding a periphery of the touch sensing electrode.

7. 4. The sensor element package of claim 3, further comprising an anisotropic conductive film bonding said single row of pads and said first conductive layer of said circuit board.

8. The sensor element package according to claim 2 , wherein the antenna unit includes a radiator and a transmission line extending from the radiator and connected to the antenna pad.

9. The sensor element package according to claim 8 , wherein a plurality of antenna units are arranged along a row direction, and the antenna pad is independently connected to each of the antenna units.

10. The sensor element package according to claim 9 , wherein the transmission lines connected to each of the plurality of antenna units have a polygonal shape and have the same length.

11. The sensor element package according to claim 9 , wherein at least one of the touch sensor pads is disposed between the antenna pads connected to adjacent ones of the antenna units.

12. a touch sensor drive circuit / touch sensor connection structure electrically connected to the second touch sensor signal wiring on the second surface of the core layer; The sensor element package of claim 1 , further comprising an antenna driving circuit / antenna connection structure electrically connected to the second antenna signal wiring on the second surface of the core layer.

13. The antenna driving circuit / antenna connection structure includes an antenna driving integrated circuit chip or an antenna connector; The sensor element package according to claim 12 , wherein the touch sensor driving circuit / touch sensor connection structure comprises a touch sensor driving integrated circuit chip or a touch sensor connector.

14. The sensor element package according to claim 1 , wherein the circuit board further includes a mid-ground layer disposed within the core layer between the first conductive layer and the second conductive layer.

15. The sensor element package of claim 14 , wherein the antenna via structure and the touch sensor via structure are electrically isolated from and pass through the mid-ground layer.

16. The sensor element further includes a substrate layer, The sensor element package according to claim 1 , wherein the touch sensing electrode and the antenna unit are arranged together at the same level on the top surface of the base layer.

17. the base layer includes an active area in which the touch sensing electrodes are distributed and a peripheral area surrounding the active area; The sensor element package according to claim 16, wherein the antenna unit is disposed partially over the active area.

18. A display panel; An image display device comprising the sensor element package according to claim 1.

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