Interposer assembly and method

Abstract

To provide an improved interposer assembly for forming electrical connections between pads on opposed substrates.SOLUTION: An interposer assembly includes an insulating plate and a plurality of metal contacts, each contact including a plate material having a uniform thickness, each contact disposed in one of passages and having a pair of opposed contact sides, and each contact comprising a first cantilever spring arm at least partially located within the passage. The first cantilever spring arm extends from a contact base located within the passage to a strip end the within the passage and proximate a passage sidewall. The first cantilever spring arm comprises a pair of strips for defining a first contact slot. Each of the strips extends with a non-constant strip width between the contact side and a slot edge.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to an interposer assembly including a plate and a plurality of conductive contacts disposed in passages through the plate. The contacts enable the formation of electrical connections between contact pads on opposing upper and lower substrates. The contacts may include one or more cantilevered arms to facilitate the formation of electrical connections with the contact pads. [Background technology]

[0002] An interposer assembly having a molded plastic plate and metal contacts inserted into vias in the plate is used to make electrical connections between contact pads on opposing substrates. The contacts and pads are spaced very close to each other in rows and columns of a land grid array to establish multiple differential pair signal and ground connections that extend through the plate.

[0003] A conventional interposer assembly includes contacts with opposed ends that form pressure connections with pads on the substrates. A permanent solder connection can connect the contacts to the pads on one of the substrates.

[0004] It is desirable for the contacts of the interposer assembly to form a reliable electrical connection between opposing substrate pads.

[0005] The contacts of the interposer assembly include contact surfaces that mechanically engage the contact pads of the substrate to form an electrical connection with the contact pads. Conventional interposer assemblies have a single surface contact that engages with each pad to form a single electrical connection with each pad. The contacts can be wiped to improve the quality of the electrical connection. Impurities, oxides, or contaminants on either the contact surface or the pads can impair the formation of an electrical connection between the contact surface and the pads.

[0006] The contacts used in the interposer assembly may include a separate spring element for biasing a single contact surface against a pad.

[0007] Therefore, there is a need for an improved interposer assembly in which each contact forms redundant contacts with each pad, such that each contact establishes two reliable electrical connections with each pad. The connections should have a small contact area to increase the contact pressure between the contacts and the pads. Summary of the Invention

[0008] The interposer assembly of the present disclosure has improved interposer plates and contacts for making electrical connections between pads on opposing substrates.

[0009] The interposer assembly of the present disclosure includes contacts having one or more cantilevered arms that form redundant contacts with pads of a substrate. Each cantilevered arm includes a pair of contacts that extend away from the cantilevered arm. The contacts establish a reliable electrical connection with each pad. The contact area between the contacts and the contact pads is small to increase contact pressure between the contacts and the pads and ensure reliable formation of the electrical connection.

[0010] In some embodiments, a pair of contacts of the present disclosure are disposed on an inner portion of each cantilever arm to establish a reliable electrical connection at or near the center of the corresponding contact pad. This feature provides a reliable location of the electrical connection at each pad for improved electrical connection formation.

[0011] In another embodiment, the contact of the assembly can have an elongated U-shaped body with two sides and both a top and bottom connection end, the top end forming a shunt or redundant severable electrical connection with a pad on an upper substrate, and the bottom end forming an electrical connection with a pad on a lower substrate.

[0012] In other embodiments, a solder ball can be physically attached to the bottom end of the contact after the contact is inserted into the cavity in the plate to form a permanent reflow solder connection between the bottom connection end and a pad on the underlying substrate.

[0013] The contacts in each via make electrical connections with pads on the upper and lower substrates. Movement of the upper substrate toward the top surface of the plate of the interposer assembly engages the contacts and compresses them vertically into the vias. During initial downward movement of the upper substrate toward the plate, the top ends of the contacts engage the pads on the upper substrate, wipe the pads, and are compressed sufficiently into the vias in the plate to make electrical connections with the contact pads on the substrate, provided that the upper substrate does not deform from the significant forces caused by the compression of the assembly's multiple contacts, and provided that manufacturing tolerances do not prevent the connections from being made.

[0014] Initial movement of the upper substrate towards the plate compresses the contacts in the plate with a high spring rate. Further movement of the substrate towards the plate to ensure all contacts are further compressed further compresses all contacts despite warpage and manufacturing tolerances. During this further compressive movement, all contacts are compressed with a lower or reduced spring rate to ensure electrical connection with all contacts. The lower spring rate during the final movement of the upper substrate towards the interposer plate reduces the compressive load on the assembly and reduces the need for very strong clamps to compress the assembly and hold the compressed assembly together.

[0015] Other objects and features of the present disclosure will become apparent as the description proceeds, especially when considered in conjunction with the accompanying drawings which illustrate an assembly. [Brief description of the drawings]

[0016] [Figure 1] FIG. 2 is an exploded perspective view of an interposer assembly, upper and lower substrates, and an interposer plate between the substrates. [Diagram 2] 1 is another exploded perspective view of the interposer assembly, the upper and lower substrates, and the interposer plate between the substrates. FIG. [Diagram 3] FIG. 13 is a top view of an interposer assembly in an alignment frame. [Figure 4] 1 is a top view of a portion of an interposer assembly showing an insulating plate and several contact members. [Diagram 5] FIG. [Figure 6] FIG. [Figure 7] FIG. [Figure 8] FIG. [Figure 9] FIG. [Figure 10] FIG. [Figure 11] FIG. 12 is a perspective view of the contact member shown in FIGS. 5 to 11 having a solder ball element. [Figure 12] 12 is a cross-sectional view taken generally along line 12-12 of FIG. 4 of the interposer assembly and upper and lower substrates prior to the formation of electrical connections. [Figure 13] 13 is a cross-sectional view similar to FIG. 12 illustrating movement of the upper substrate towards the lower substrate and compression of the contact members to form an electrical connection. [Figure 14]13 is a cross-sectional view similar to FIG. 12 illustrating movement of the upper substrate towards the lower substrate and compression of the contact members to form an electrical connection. [Figure 15] 13 is a cross-sectional view similar to FIG. 12 illustrating movement of the upper substrate towards the lower substrate and compression of the contact members to form an electrical connection. [Figure 16] 13 is a cross-sectional view similar to FIG. 12 illustrating movement of the upper substrate towards the lower substrate and compression of the contact members to form an electrical connection. [Figure 17] FIG. 2 is a perspective view of a passageway of an interposer plate. [Figure 18] FIG. 13 is a top view of the passages of the interposer plate. [Figure 19] FIG. 19 is a cross-sectional view taken generally along line 19-19 of FIG. 18. [Figure 20] FIG. 20 is a cross-sectional view taken generally along line 20-20 of FIG. 18. [Figure 21] FIG. 13 is a perspective view of a contact member according to another embodiment. [Figure 22] 22 is a side view of the contact member of the alternative embodiment of FIG. 21. [Figure 23] 22 is a front view of the contact member of the alternative embodiment of FIG. 21. FIG. [Figure 24] 22 is a rear view of the contact member of the alternative embodiment of FIG. 21. FIG. [Diagram 25] 22 is a top view of the contact member of the alternative embodiment of FIG. 21. [Figure 26] FIG. 26 is a cross-sectional view taken generally along line 26-26 of FIG. 25. [Figure 27] 22 is a cross-sectional view of an interposer assembly including the contact members of the alternative embodiment of FIG. 21 and the upper and lower substrates prior to the formation of electrical connections. [Figure 28] 22 is a cross-sectional view of an interposer assembly including the contact members of the alternative embodiment of FIG. 21 and the upper and lower substrates after electrical connections have been formed. [Figure 29]1 is a cross-sectional view of a substrate having contact pads for forming electrical contacts in an interposer assembly. [Diagram 30] FIG. 30 is a view similar to FIG. 29 showing wipe marks on the contact pads of the substrate. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] Interposer assembly 10 forms electrical connections between a number of contact pads 12 on a lower substrate 14 and a corresponding number of contact pads 16 on an upper substrate 18. Pads 12 and 16 are arranged in rows and columns in a land grid array. An integrated circuit 20 may be mounted on the top surface of substrate 18 and electrically connected to pads 16. Substrate 18 is removably mounted on assembly 10. Assembly 10 may be permanently mounted on substrate 14.

[0018] The interposer assembly 10 includes two rectangular molded insulating plastic interposer plates 22 fitted into a surrounding frame 24. Each plate 22 has a number of closely spaced contact vias 26 arranged in a dense land grid array. A dual conductor contact 54 is disposed within each contact via 26 to form a reliable dual current path electrical connection between opposing contact pads 12 and 16 on the substrates 14 and 18. The pads 12 and 16 are located below and above each via 26. The contacts 54 extend generally vertically between a top plate surface 32 and a bottom plate surface 34.

[0019] As shown in Figures 17-20, each passage 26 has a trapezoidal entrance 38 located on the top surface 32 with opposed parallel side walls 40 and 42 extending perpendicularly away from the entrance 38 to a trapezoidal bottom wall 44 located spaced above the plate bottom surface 34. A tapered side wall 46 extends between each side of the walls 40 and 42 such that the passages 26 have a uniform trapezoidal cross-section as shown in Figures 17 and 18. In some embodiments, a solder recess or pocket 48 is located on the plate bottom surface 34 below each terminal passage 26. A pair of tab passages 50 extend from the bottom wall 44 to the solder recess 48. A tapered wide end 52 at the upper end of the passage 50 opens into the contact passage 26. The solder recess or pocket 48 may have an entrance 49 that is wider than the solder recess 48, as permitted by the generally outwardly extending solder recess wall 51.

[0020] Disposed in each contact passage 26 is a two conductor ball grid array contact 54. The contacts 54 are shown in Figures 5-11. The contacts 54 are formed from a strip of metal stock which may be beryllium copper and may be plated with a conductive metal which may be gold or a gold alloy. The contacts 54 include a contact base 56 located at the bottom end of the contact and a pair of rounded contacts 58 located at the top of the contact. Two solder tabs 60 extend downwardly from either side of the base 56. The tabs 60 are bent inwardly toward each other as shown in Figures 7-9.

[0021] A continuous, one-piece metallic conductor 62 extends upwardly from the contact base 56 along one side of the contact 54 to the point 58. A discontinuous, two-piece metallic conductor 64 extends from the contact base 56 along the other side of the contact 54, remote from the conductor 62, to the point 58. See FIG.

[0022] The conductor 62 includes a wide continuous metal strip 66 that extends upwardly from the base 56 to the lower portion 68 of two V-shaped strips 70 above the strip 66 .

[0023] The contacts 58 are disposed on strips 70 on top of the contacts 54. The contacts 58 extend upwardly from the strips 70 adjacent elongated slots 72 formed therebetween.

[0024] The contact points 58 are located on the inside width of the contact 54 away from both sides 73 of the contact.

[0025] The continuous conductor 62 extends from the base 56 upwardly along the strip 66 and the V-shaped strip 70 to a point 58 at the upper end of the contact 54. See FIG.

[0026] The discontinuous conductor 64 includes a flexible narrow metal strip 74 extending upward from the base 56 on the side of the contact 54 remote from the conductor 62, and a short narrow strip 78 extending downward from the end of the strip 70 on the side of the contact 54 remote from the conductor 62 to an inwardly and upwardly rounded end 80. The end 80 is located a short distance above a flat follower 82 located at the upper end of an arm 76. The follower 82 at the upper end of the arm 76 is angled upwardly at an angle 100 of approximately 45° from the plane of the plate 22 when the contact 54 is uncompressed. See FIG. 12.

[0027] Strip 70, strip 78, and end 80 include a contact cantilever spring arm 104 that bears against contact 58. Cantilever spring arm 104 bends resiliently upon compression of the contact, providing high contact pressure at contact 58 against board pad 16.

[0028] During manufacture of assembly 10, contacts 54 are freely inserted into passages 26 with wide strip 66 flush with wide sidewall 42 and narrow strips 74 and 78 extending along and spaced inwardly a short distance from narrow sidewall 40. The contacts are not compressed during insertion into passages 26.

[0029] During insertion of the contact, the solder tab 60 passes through the lead end 52 of the passage 50 and protrudes into the solder recess 48. The inward taper of the tab 60 holds the contact in the passage 26 after insertion. The solder ball 84 is then forced into the recess 48, making a physical connection with the bottom end of the tab. The tab 60 and solder ball 84 hold the contact in the passage.

[0030] The plate 22 with the contacts and solder balls in place is then placed on the lower substrate 14 and the solder balls are heated and reflowed to form reliable solder electrical connections 92 between each contact and the corresponding pads 12 on the substrate 14.

[0031] 12, after plate 22 is attached to lower substrate 14, upper substrate 18 is placed over plate 22 with contact pads 16 positioned over contacts 54 in passages 26 of plate 22. Strips 70 and points 58 extend above plate upper surface 32.

[0032] The upper substrate 18 is then moved vertically downward in initial compression such that the pads 16 engage the contacts 58 on the top ends of the contacts 54. See Figures 12 and 13. Further lowering of the substrate 18 vertically compresses each of the two-conductor contacts 54 by rotating the strips 70 and the connected vertical strips 66 into the passages 26 and sliding the points 58 along the pads 16 away from the sidewall 42. The top ends of the strips 66, the V-shaped strips 70, and the strips 78 of the conductors 64 rotate away from the wall 42 in a clockwise direction 86 shown in Figure 14 as the upper substrate 18 moves downward toward the plate 22. As the strips 66 and 70 rotate, the contacts 58 wipe the pads 16, forming a reliable and redundant electrical connection between the contacts and the pads.

[0033] As shown in Figures 13-16, a short strip 78 joining the end of strip 70 remote from strip 66 presses against the narrow side wall 40 of the cavity and slides down said side wall 40, elastically bending the top of the contact. Simultaneously with this bending, a rounded free end 80 of strip 78 engages the top of side wall 40 and then engages a flat follower 82 at the top end of arm 76, rotates in a clockwise direction 86 into the passage away from wall 42, and travels along the side wall and surface while engaging follower 82 at the top end of vertical and relatively rigid strip 74. Follower 82 extends at an angle 100 of approximately 45° to the horizontal. The vertical strip 74 supports follower 82 against lateral deflection by its initial engagement with rounded end 80 as the top of the contact rotates in compression into the top of passage 26.

[0034] The top ends of the contacts 54 are relatively stiff to resist vertical compression and increase the normal force on the pads to form a reliable electrical connection with the pads, see Figures 14 and 15. Upon initial vertical compression of the contacts 54 by the upper substrate 18, the contacts are compressed vertically with a high spring rate to establish an electrical connection with the pads 16.

[0035] Each contact 54 forms a two-current path electrical connection between opposing pairs of pads on the upper and lower substrates. A wipe pressure connection is maintained between the two strips 66 and 78 of the discontinuous conductor 64 to facilitate current flow.

[0036] Due to manufacturing tolerances and possible warping of the mating circuit board, the initial compression may not compress all of the contacts far enough for mating. Additional or final compression is required. This additional compression occurs after the upper board 18 has moved downward a normal collapse distance, increasing the normal force that the compressed contacts exert on the clamping tool, board, and assembly.

[0037] Upon final vertical compression of contact 54 from the position of FIG. 15 to the position of FIG. 16, strip 74 rotates in a counterclockwise direction 90 into passage 26 and rounded end 80 slides further down along the top end of strip 74 into the passage at an angle 102 of approximately 50° with respect to the horizontal. Angle 102 increases during compression. Strip 74 is free to bend into passage 26, away from wall 40, during final compression. Because angle 102 is greater than angle 100, the compression spring rate decreases in final compression and the substrate drops toward the plate.

[0038] The reduction in compression spring rate at final compression reduces the rate of increase in clamping force during final compression. The reduction in the rate of increase in clamping force means that the clamping tool to close the assembly does not need to be as large and powerful as it would be if the spring rate were not reduced. The final downward movement of the board from the position of FIG. 15 to the fully clamped position of FIG. 16 where it engages the top of plate 22 further crushes the contacts, ensuring that each contact forms a reliable connection between opposing pads on the board despite dimensional differences due to possible plate warping and manufacturing tolerances.

[0039] During initial and final compression of the contact, base 56 is held in place at the bottom of passage 26 .

[0040] Another embodiment compression contact 200 for use in interposer assembly 10 is shown in FIGS.

[0041] Contact 200 is formed from a strip of metal stock similar to that disclosed above and has a generally C-shape.

[0042] The contact 200 includes a flat base or spine 210 with a slightly rounded upper contact support 212 and a slightly rounded lower contact support 214 at the top and bottom ends of the base or spine 210 .

[0043] A first upper cantilever spring arm 220 angles upwardly and inwardly from the contact support portion 212 to a contact top 222. A second upper cantilever spring arm 224 extends downwardly from the contact top 222 to a rounded arm end 226.

[0044] The contact 200 is generally symmetrical from top to bottom on either side of the center of the spine 210 such that the contact has a first lower cantilever spring arm 228 that slopes downwardly and inwardly from the lower contact support 214 to the contact bottom 230 and a second lower cantilever spring arm 228 that extends to a rounded arm end 232.

[0045] The contact central spine 210 , the upper contact support 212 , the lower contact support 214 , the first upper spring arm 220 , and the first lower spring arm 228 comprise a continuous one-piece metal conductor 234 that extends from the contact bottom 230 to the contact top 222 .

[0046] The second upper spring arm 224 and the second lower spring arm 228 include a discontinuous two-piece metal conductor 236 that extends from the contact bottom 230 to the contact top 222 .

[0047] The contact 200 includes an upper contact slot 240 and a lower contact slot 242 .

[0048] The upper contact slot 240 extends generally upward from the spine 210, through the contact support 212, the first upper spring arm 220, and the contact top 222 to the second upper spring arm 224. The symmetrical lower contact slot 242 extends generally downward from the spine 210, through the contact support 214, the first lower spring arm 228, and the contact bottom 230 to the second lower spring arm 228.

[0049] The upper contact slot 240 includes an upper slot edge 244 remote from the contact side 238 extending along the upper slot 240. Similarly, the lower contact slot 240 includes a lower slot edge 246 remote from the contact side 238 extending along the lower contact slot 242.

[0050] As shown, the contact 200 is generally flat between the contact sides 238 and has a generally uniform thickness.

[0051] A pair of upper contacts 250 are located at the contact tip 222 adjacent the upper contact slots 240. The upper contacts 250 are located inwardly of the width of the contact 200 away from the contact sides 238. The upper contacts 250 extend upwardly and away from the spine 210 and the contact tip 222. The upper contacts 250 are formed along and generally contiguous with the upper slot edges 244.

[0052] A pair of lower contacts 252 are located on the contact bottom 230 adjacent the lower contact slots 242. The lower contacts 252 are located inwardly of the width of the contact 200 away from the contact sides 238. The lower contacts 252 extend downwardly and away from the spine 210 and the contact bottom 230. The lower contacts 252 are formed along and generally contiguous with the lower slot edges 246.

[0053] 27 and 28 show cross-sectional views of an interposer assembly 10 having another embodiment of compressed contacts 200. An upper substrate 18 is positioned above the plate 22 with the contact pads 16 positioned above the contacts 200 in the passages 26 of the plate 22. A contact top 222 extends above the plate top surface 32 and a contact bottom 230 extends below the plate bottom surface 34.

[0054] The upper substrate 18 is then moved vertically downward such that the pad 16 engages the upper contact 250 of the contact 200 and the pad 12 engages the lower contact 252 of the contact 200. Upon full compression, the rounded arm end 226 and the rounded arm end 232 engage with one another, allowing the discontinuous two-piece metal conductor 236 to form an electrical connection between the contact top 222 and the contact bottom 230.

[0055] 29 shows the contact surface of an upper substrate 18 having pads 16 arranged in rows and columns in a land grid array. The pads' vertical and horizontal centerlines 300, 302 define a pad center point 304 on each pad 16. The lower substrate 14 has pads 12 in a similar configuration.

[0056] The pair of contacts 58 of the contacts 54 of the present disclosure and the pair of upper and lower contacts 250 and 252 of the contacts 200 of the present disclosure wipe the pad 16 or 12 to form a pair of wipe tracks 306 as shown in FIG. 30. Each pair of wipe tracks 306 is located proximate to the pad center point 304 and extends generally parallel to the longitudinal centerline 300 of the pad. The resilience of the compressed contacts urges the contacts 58, 250, 252 against the contact pad under high pressure as they move along the tracks 306, resulting in a redundant high pressure electrical connection between the contacts and the pad. The contact pressure is high because the contact area is small. The high pressure wipe engagement between the contacts 58, 250, 252 and the pad 16 breaks through any debris, oxides, or other surface contaminants that may be present on the contacts or pad. Providing redundant contacts at the ends of contacts 54 and 200, and locating contacts 58, 250, 252 near the center 304 of each contact pad, improves the reliability of the electrical connection between the contacts and the substrate pads.

[0057] Interposer assembly 10 offers several advantages over prior art systems.

[0058] The use of contacts 54, 200 having elongated slots 72, 240, 242 that extend along the contact cantilever arms to the contact ends provides mechanical performance advantages in the interposer assembly 10. Specifically, the elongated slots allow for a reduction in the spring force generated by each cantilever arm and allow a longer arm travel path for the arms to flex upon installation of the interposer assembly onto the substrates 14 and 18. This allows for tuning and minimization of the overall normal forces generated during installation of the interposer assembly onto the substrates 14, 18.

[0059] The use of a pair of solder tabs 60 provides performance advantages in the interposer assembly 10. The use of two tabs allows for better impedance tuning / matching of the overall circuit system as well as improved mechanical strength of the connections between the tabs 60 and the solder balls 84.

[0060] The use of solder recesses or pockets 48 located at the bottom of bottom plate surface 34 allows for improved performance of solder reflow techniques to form solder electrical connections in assembly 10. Solder recesses or pockets 48 reduce the risk of undesired shorts between adjacent solder balls 84.

[0061] The use of contacts 54, 200 having contacts 58, 250, 252 located at the slot edges provides several performance advantages in the interposer assembly 10. First, it allows for smaller contact pads 12, 16 to be used in the assembly. The reduced size of the pads 12, 16 allows for reduced insertion loss and crosstalk and improved impedance tuning / matching, improving the signal integrity performance of the overall circuit system. The use of smaller contact pads 12, 16 also allows for wider trace paths to be used to route the printed circuit board on the board.

[0062] As an additional or alternative aspect of the present invention, the following configuration can be adopted. [Clause 1] 1. An interposer assembly, comprising: an insulating plate having an upper surface and a lower surface and a plurality of passages extending through a thickness of the insulating plate, each passage having a pair of opposed parallel sidewalls; Multiple metal contacts and each contact comprises a plate material of uniform thickness, each contact is disposed in one of the passages and has a pair of opposing contact sides, each contact comprises a first cantilever spring arm located at least partially within the passage, the first cantilever spring arm extending from a contact base located within the passage to a strip end located within the passage and proximate a sidewall of the passage, the first cantilever spring arm comprises a pair of strips defining a first contact slot, each strip extending with a non-constant strip width between a contact side and a slot edge, each slot edge adjacent the contact slot, An interposer assembly, wherein a first contact slot extends from within the passageway along a first cantilever spring arm out of the passageway, and each strip has a contact that extends away from each of the passageways. [Clause 2] 2. The interposer assembly of claim 1, wherein each strip has a V-shaped portion at an upper portion of a contact base. [Clause 3] 3. The interposer assembly of claim 2, wherein the first contact slot has a non-constant slot width between opposing slot edges. [Article 4] 4. The interposer assembly of claim 3, wherein the first contact slot is elongated in shape. [Article 5] An interposer assembly as described in clause 4, wherein the first cantilever spring arm further comprises a first pair of contacts located outside the passage, the first pair of contacts located adjacent the slot edge and away from the contact side. [Article 6] 6. The interposer assembly of claim 5, wherein the first cantilever spring arm is curved. [Article 7] 7. The interposer assembly of claim 6, wherein the first pair of contacts is located above the insulating plate. [Article 8] 8. An interposer assembly as recited in clause 7, wherein each of the contacts is contiguous with a slot edge. [Article 9] An interposer assembly as described in clause 8, wherein the contact has a second cantilever spring arm extending from the contact base away from the first cantilever spring arm, the second cantilever spring arm extending to a strip end located within the passage and proximate to a side wall of the passage, the second cantilever spring arm having a second contact slot, the second contact slot having a set of strips defining the second contact slot, each of the strips extending with a non-constant strip width between a contact side and a slot edge, each of the slot edges being proximate to the second contact slot, the second contact slot extending from within the passage to outside the passage along the second cantilever spring arm. [Article 10] 9. An interposer assembly as described in clause 8, wherein the contacts have one or more solder tabs connected to a contact base, the solder tabs being located proximate to the underside of the insulating plate and connected to solder balls proximate to the underside of the insulating plate. [Article 11] An interposer assembly as described in clause 10, wherein the one or more passages have a passage bottom wall located between the upper and lower surfaces of the insulating plate and extending between the side walls, the one or more tab passages extend through the passage bottom wall to a solder pocket adjacent the lower surface of the insulating plate, the one or more solder tabs are located within the one or more tab passages, the first contact slot extends from within the passage to outside the passage along the first cantilever spring arm, and the solder balls are disposed within the solder pockets. [Article 12] 12. The interposer assembly of claim 11, wherein the bottom surface of the insulating plate comprises a solder pocket opening that is wider than the solder pocket. [Article 13] An interposer assembly as described in clause 1, wherein the contact has a second cantilever spring arm extending from the contact base away from the first cantilever spring arm, the end of the first cantilever spring arm being rounded inwardly and upwardly, and the end of the second cantilever spring arm being provided with a follower, the follower being inclined upwardly relative to the plane of the insulating plate. [Article 14] 1. An interposer assembly for making electrical connections between contacts on opposing substrates, comprising: an insulating plate having a top surface, a bottom surface, a thickness between the top surface and the bottom surface, and a plurality of through vias, each via having a pair of opposed parallel sidewalls; and a plurality of one-piece conductive contact members, each contact member having a uniform thickness of plate material and opposite contact sides, each contact member extending generally from a contact top to a contact bottom, a contact base within the through via, a first cantilever spring arm extending from the contact base to a first strip end, and a second cantilever spring arm extending from the contact base to a second strip end. and a first cantilever spring arm including a first spring arm piece and a second spring arm piece, each of the first spring arm piece extending a non-constant width between a contact side and a slot edge and including a contact extending away from a respective passageway, the first spring arm piece and the second spring arm piece defining a first slot extending through the contact member, the first slot being located between the contact sides and near the contact top, the contact base and the first cantilever spring arm including a continuous one-piece metal conductor extending from the contact top to the contact bottom and adjacent the first passageway sidewall. [Article 15] 15. The interposer assembly of claim 14, wherein the first spring arm piece and the second spring arm piece have a V-shaped portion at an upper portion of the contact base. [Article 16] 16. The interposer assembly of clause 15, wherein the first slot has a non-constant slot width between opposing slot edges. [Article 17] 17. The interposer assembly of claim 16, wherein the first slot is elongated in shape. [Article 18] 18. An interposer assembly as described in clause 17, wherein the first slot includes a pair of top contacts, each top contact adjacent a slot edge and extending away from the contact member and the contact apex. [Article 19] An interposer assembly as described in clause 18, wherein the first cantilever spring arm and the second cantilever spring arm have a metal conductor having a discontinuous portion, the metal conductor extending from the contact top to the contact bottom proximate to a second passage sidewall opposite the first passage sidewall. [Article 20] 20. The interposer assembly of claim 19, wherein the contact tops are positioned above a top surface of the insulating plate. [Article 21] 21. An interposer assembly as described in clause 20, wherein each of the top contacts is contiguous with the first slot edge. [Article 22] 22. The interposer assembly of claim 21, wherein the second cantilever spring arm includes a second slot extending through the contact member. [Article 23] 23. The interposer assembly of clause 22, wherein the contact bottom is located below the lower surface of the insulating plate. [Article 24] An interposer assembly as described in clause 23, wherein one or more passages have a passage bottom wall located between the upper and lower surfaces of the insulating plate and extending between the side walls, and two tab passages extend through the passage bottom wall to a solder pocket adjacent the lower surface of the insulating plate, each of the solder tabs being located within the tab passage and a solder ball being disposed within the solder pocket. [Article 25] 25. The interposer assembly of claim 24, wherein the bottom surface of the insulating plate comprises a solder pocket opening that is wider than the solder pocket. [Article 26] An interposer assembly as described in clause 14, wherein at the contact, an end of the first cantilever spring arm is rounded inwardly and upwardly and an end of the second cantilever spring arm is provided with a follower, the follower being inclined upwardly relative to the plane of the insulating plate. [Article 27] An interposer assembly comprising: an insulating plate having a top surface, a bottom surface, a thickness between the top surface and the bottom surface, and a plurality of through vias, each via having a pair of opposed side walls; and a plurality of one-piece conductive contact members, each contact member located in a through via, each contact member having a uniform thickness, opposite contact sides, a contact base, and a first cantilever spring arm extending from the contact base to a contact top and a first strip end, the first cantilever spring arm being adapted to contact a pair of contact strips. each contact strip having a contact extending from the through passage away from the contact member, a pair of contact strips having a pair of slot edges extending through the slot edges of the contact member, the slot edges defining a contact slot extending with a non-uniform slot width between opposing slot edges, and the contact base and first cantilever spring arm having a continuous one-piece conductor extending from the contact top to the contact bottom and adjacent the first passage sidewall. [Article 28] 28. An interposer assembly as recited in clause 27, wherein the slot edge has a V-shaped portion at the top of the contact base. [Article 29] 29. The interposer assembly of clause 28, wherein each contact strip extends with a non-constant strip width between the contact side and the contact edge. [Article 30] 30. The interposer assembly of claim 29, wherein the contact slot is elongated in shape. [Article 31] 30. An interposer assembly as described in clause 29, wherein each of the slot edges includes a contact, the contacts being spaced apart from the contact member and the contact apex, and the contacts being located above the upper surface of the insulating plate. [Article 32] An interposer assembly as described in clause 31, wherein the contact has a second cantilever spring arm extending from the contact base, the second cantilever spring arm extending to the second strip end, the first cantilever spring arm and the second cantilever spring arm having a metal conductor having a discontinuous portion, the metal conductor extending from the contact top to the contact bottom proximate to a second passage sidewall opposite the first passage sidewall. [Article 33] An interposer assembly as described in clause 32, wherein the second cantilever spring arm has a second pair of contact strips, the second pair of contact strips having a second pair of slot edges extending through slot edges of the contact member, each of the slot edges defining a second contact slot. [Article 34] 33. The interposer assembly of claim 32, wherein the contact comprises two solder tabs connected to a contact base, the solder tabs being located proximate to the contact bottom. [Article 35] An interposer assembly as described in clause 34, wherein one or more passages have a passage bottom wall located between the upper surface of the insulating plate and the lower surface of the insulating plate and extending between the side walls, and two tab passages extend through the passage bottom wall to a solder pocket adjacent the lower surface of the insulating plate, each of the solder tabs being located within the tab passage and the solder balls being disposed within the solder pockets. [Article 36] 36. An interposer assembly as described in clause 35, wherein the bottom surface of the insulating plate includes a solder pocket opening that is wider than the solder pocket. [Article 37] 28. An interposer assembly as described in clause 27, wherein the contact has a second cantilever spring arm extending from the contact base away from the first cantilever spring arm, the end of the first cantilever spring arm being rounded inwardly and upwardly, and the end of the second cantilever spring arm being provided with a follower, the follower being inclined upwardly relative to the plane of the insulating plate.

[0063] While one or more embodiments of the assembly have been disclosed and described in detail, it should be understood that this may be varied, and that the scope of the disclosure is not limited to the exact details described, but also includes such variations as would be apparent to one of ordinary skill in the art upon review of the present disclosure, as well as such changes and modifications as would come within the scope of the following claims.

Claims

[Claim 1] 1. An interposer assembly, comprising: an insulating plate having an upper surface and a lower surface and a plurality of passages extending through a thickness of the insulating plate, each passage having a pair of opposed parallel sidewalls; Multiple metal contacts and each contact comprises a plate material of uniform thickness, each contact is disposed in one of the passages and has a pair of opposing contact sides, each contact comprises a first cantilever spring arm located at least partially within the passage, the first cantilever spring arm extending from a contact base located within the passage to a strip end located within the passage and adjacent a sidewall of the passage, the first cantilever spring arm comprises a pair of strips defining a first contact slot, each of the strips extending with a non-constant strip width between the contact side and a slot edge, each of the slot edges adjacent the contact slot, an interposer assembly, wherein the first contact slot extends from within the passage along the first cantilever spring arm out of the passage, and each of the strips has a contact that extends away from each of the passages.

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