Foreign material library generation device, foreign material library generation method, analysis support device, and data structure

Abstract

To make it easier to analyze conditions that caused defects to enable more efficient process improvement.SOLUTION: A foreign material library generation device is provided, comprising a foreign material image generation unit for generating a foreign material image showing a region including a foreign material from a substrate image obtained by capturing a substrate containing the foreign material, a foreign material image storage unit for storing the foreign material image, and a foreign material-related information storage unit for storing foreign material-related information on the foreign material in association with the foreign material image.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a foreign substance library generating device, a foreign substance library generating method, an analysis support device, and a data structure. [Background technology]

[0002] Regarding board inspection equipment used to inspect the quality of the soldered components mounted on printed circuit boards (hereafter simply referred to as "boards"), there is a growing need to be able to inspect the entire surface for foreign bodies in order to guarantee the quality of the entire board.

[0003] If a defect due to a foreign substance is found during inspection, process improvements will be necessary, but without the following data, it will be difficult to analyze the cause. - Defect mode of the defect that occurred (solder ball, chip flying, etc.) - Coordinates of the location of the defect (near the land, near the component, etc.) -Which process detected the defect: the printing process, the mounting process, or the post-reflow process? What were the settings of the printer, mounting machine, and reflow oven at the time the defect was detected? (Were there any changes before and after the defect occurred?)

[0004] For example, Patent Document 1 discloses a technique in which image data of a defective product that has actually been photographed is stored in a storage unit, and the characteristics of the defect are transferred to an image of a non-defective product to generate a pseudo image of the defective product. Moreover, Patent Document 2 discloses a technique for optimizing inspection standards using a transferred image. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent Publication No. 2022-108855 [Patent Document 2] JP 2023-51102 A Summary of the Invention [Problem to be solved by the invention]

[0006] However, there was no mechanism provided for accumulating sufficient defect data on which such testing is based.

[0007] The present invention has been made in consideration of the above problems, and has an object to provide a technique that enables easier analysis of the conditions under which defects occurred and makes it possible to improve the efficiency of process improvements. [Means for solving the problem]

[0008] To solve the above problems, the present invention provides: a foreign matter image generating unit that generates a foreign matter image, which is an image of an area including the foreign matter, from a substrate image obtained by capturing an image of the substrate including the foreign matter; a foreign substance image storage unit that stores the foreign substance image; a foreign substance-related information storage unit that stores foreign substance-related information related to the foreign substance in association with the foreign substance image; The foreign substance library generating device is characterized by comprising:

[0009] According to this, a foreign substance library in which foreign substance images and foreign substance-related information are stored in association with each other is provided. It is possible to accumulate sufficient data relating to foreign substance defects, and by identifying a foreign substance image stored in the foreign substance image storage unit, it is possible to extract foreign substance-related information stored in the foreign substance-related information storage unit in association with the foreign substance image. This makes it possible to provide foreign substance-related information that enables easier analysis of the conditions under which a foreign substance defect occurred based on the foreign substance image, thereby achieving more efficient process improvement.

[0010] In the present invention, The foreign substance image generating section may generate the foreign substance image from a board image in which a defect including the foreign substance is confirmed by visual inspection of the board image.

[0011] According to this method, a foreign substance image is generated from a substrate image in which the presence of a foreign substance on the substrate has been confirmed by visual inspection, so that the foreign substance image and foreign substance-related information are highly useful.

[0012] In the present invention, The foreign substance image generating section may generate the foreign substance image from an image of the substrate that contains the foreign substance and is determined to be defective in an inspection device that inspects the substrate for the presence or absence of the foreign substance.

[0013] According to this, in an inspection device that inspects substrates for the presence or absence of foreign matter, a foreign matter image is generated from a substrate image that is determined to be defective and contains a foreign matter, so that the foreign matter image and the foreign matter-related information associated with it can be efficiently generated.

[0014] In the present invention, The foreign object-related information may include foreign object characteristic information regarding characteristics of the foreign object.

[0015] According to this, since it is possible to provide foreign substance characteristic information associated with a foreign substance image, it is possible to more easily analyze the conditions under which a foreign substance defect occurred, thereby making it possible to realize more efficient process improvement.

[0016] In the present invention, The foreign matter-related information may include relationship information regarding a relationship between the substrate and the foreign matter.

[0017] According to this, since it is possible to provide related information associated with a foreign substance image, it is possible to more easily analyze the conditions under which a foreign substance defect occurred, thereby making it possible to realize more efficient process improvement.

[0018] The present invention also provides a method for producing a semiconductor device comprising the steps of: An analysis support device that supports analysis of a substrate production process, a foreign matter image storage unit that stores a foreign matter image, which is an image of a region including a foreign matter, generated from a substrate image obtained by capturing an image of a substrate including the foreign matter; a foreign substance-related information storage unit that stores foreign substance-related information related to the foreign substance, including type information of the foreign substance, in association with the foreign substance image; an analysis support information generating unit that generates analysis support information used in an analysis of a production process of the substrate, the analysis support information including the foreign substance-related information related to at least one of the foreign substance images stored in the foreign substance image storage unit; The present invention is characterized by comprising:

[0019] According to this, analysis support screen information is generated, which includes foreign substance-related information stored in the foreign substance-related information storage unit in association with at least one foreign substance image stored in the foreign substance image storage unit. Therefore, it is possible to provide foreign substance-related information for more easily analyzing the conditions under which a foreign substance defect occurred based on the foreign substance image, thereby making it possible to realize more efficient process improvement.

[0020] In the present invention, A display unit for displaying information; An instruction input unit that accepts input of an instruction; Equipped with the display unit displays the plurality of foreign substance images in association with the foreign substance-related information; receiving, by the instruction input unit, a selection of any one of the plurality of foreign substance images displayed on the display unit; The display unit may display the foreign substance-related information associated with the foreign substance image related to the selection accepted by the instruction input unit.

[0021] According to this, analysis support screen information including foreign substance-related information stored in the foreign substance-related information storage unit in association with a foreign substance image selected from the multiple foreign substance images displayed on the display unit is displayed on the display unit. Therefore, foreign substance-related information is provided to more easily analyze the conditions under which a foreign substance defect occurred based on the foreign substance image, thereby making it possible to realize more efficient process improvement.

[0022] In the present invention, The analysis support information may include statistical information obtained by statistically processing the foreign substance-related information related to the plurality of foreign substance images stored in the foreign substance image storage unit.

[0023] This makes it possible to more easily analyze the conditions under which foreign matter defects occur using statistically processed statistical information, thereby achieving more efficient process improvement.

[0024] In the present invention, The analysis support information may include recommendation information for improving a production process of the substrate.

[0025] This makes it possible to provide useful information for analyzing the conditions under which foreign matter defects occurred and for improving the process.

[0026] In the present invention, The apparatus may further include an improvement information providing section that generates process improvement information for improving the production process of the board and transmits the information to an external device.

[0027] According to this, since the process improvement information is transmitted to the external device, the process improvement can be advanced via the external device.

[0028] The present invention also provides a method for producing a semiconductor device comprising the steps of: generating a foreign matter image, which is an image of a region including the foreign matter, from a substrate image obtained by capturing an image of the substrate including the foreign matter; storing the foreign object image; storing foreign substance-related information about the foreign substance in association with the foreign substance image; The foreign substance library generating method includes the steps of:

[0029] According to this, data relating to foreign substance defects can be sufficiently accumulated as a foreign substance library in which foreign substance images and foreign substance-related information are stored in association with each other, and by identifying a stored foreign substance image, it becomes possible to extract the foreign substance-related information stored in association with the foreign substance image. This makes it easier to analyze the conditions under which a foreign substance defect occurs based on the foreign substance image. It is possible to provide foreign object-related information and realize efficient process improvement.

[0030] In the present invention, The board image may be a board image in which a defect including the foreign matter has been confirmed by visual inspection of the board image.

[0031] According to this method, a foreign substance image is generated from a substrate image in which the presence of a foreign substance on the substrate has been confirmed by visual inspection, so that the foreign substance image and foreign substance-related information are highly useful.

[0032] In the present invention, The substrate image may be an image of a substrate that is determined to be defective and contains a foreign matter by an inspection device that inspects the substrate for the presence or absence of the foreign matter.

[0033] According to this, in an inspection device that inspects substrates for the presence or absence of foreign matter, a foreign matter image is generated from a substrate image that is determined to be defective and contains a foreign matter, so that the foreign matter image and the foreign matter-related information associated with it can be efficiently generated.

[0034] In the present invention, The foreign object-related information may include foreign object characteristic information regarding characteristics of the foreign object.

[0035] According to this, since it is possible to provide foreign substance characteristic information associated with a foreign substance image, it is possible to more easily analyze the conditions under which a foreign substance defect occurred, thereby making it possible to realize more efficient process improvement.

[0036] In the present invention, The foreign matter-related information may include relationship information regarding a relationship between the substrate and the foreign matter.

[0037] According to this, since it is possible to provide related information associated with a foreign substance image, it is possible to more easily analyze the conditions under which a foreign substance defect occurred, thereby making it possible to realize more efficient process improvement.

[0038] The present invention also provides a method for producing a semiconductor device comprising the steps of: A foreign matter image which is an image of a foreign matter present on a substrate; foreign substance-related information related to the foreign substance image, the foreign substance type information being used to classify and display the foreign substance image; is a data structure in which the foreign substance-related information related to the classified foreign substance images is associated with the foreign substance-related information related to the classified foreign substance images in a manner that allows extraction of the foreign substance-related information.

[0039] According to this, by identifying one of the foreign object images displayed in a classification based on the foreign object type information, it is possible to extract the foreign object-related information stored in this foreign object image. Therefore, it is possible to provide foreign object-related information that enables easier analysis of the conditions under which a foreign object defect occurred based on the foreign object image, thereby achieving more efficient process improvement. Effect of the Invention

[0040] According to the present invention, the conditions under which a defect occurs can be more easily analyzed, and the efficiency of process improvement can be improved. [Brief description of the drawings]

[0041] [Figure 1] FIG. 2 is a functional block diagram of a production line according to an embodiment of the present invention. [Diagram 2] 1 is an overall configuration diagram of a production line according to an embodiment of the present invention; [Diagram 3] FIG. 2 is a diagram showing a hardware configuration of an inspection device and the like according to an embodiment of the present invention. [Figure 4] 11 is a flowchart illustrating a procedure for generating a foreign substance library according to an embodiment of the present invention. [Diagram 5]FIG. 13 is a diagram showing a display example of an individual information display screen according to an embodiment of the present invention. [Figure 6] FIG. 13 is a diagram showing a display example of a statistical information display screen according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0042] [Application example] Hereinafter, application examples of the present invention will be described with reference to the drawings. Fig. 1 is a functional block diagram of the production line 1. Fig. 2 is an overall configuration diagram of the production line 1. Fig. 3 is a hardware configuration diagram of an inspection device 10 and the like. The production line 1 is a surface mounting line for soldering electronic components onto the surface of a printed circuit board, and includes a solder printing device X1, a mounter X2, a reflow furnace X3, a solder print inspection device Y1, a component inspection device Y2, a visual inspection device Y3, an X-ray inspection device Y4, a management server 20, a teaching terminal 30, a visual inspection terminal 40, an analysis terminal 50, and a user terminal 60. The inspection device 10 shown in Fig. 1 collectively refers to the solder print inspection device Y1, the component inspection device Y2, the visual inspection device Y3, and the X-ray inspection device Y4.

[0043] The management server 20 includes a work information storage unit 21, an inspection parameter storage unit 22, a board image storage unit 23, an inspection result storage unit 24, a foreign substance image storage unit 25, a foreign substance image metadata storage unit 26, and a foreign substance library generation unit .

[0044] The work information storage unit 21 is a predetermined area of ​​the storage 20d that stores information such as lot, part number, and vendor related to the work such as a substrate to be inspected. The inspection parameter storage unit 22 is a predetermined area of ​​the storage 20d that stores inspection parameters such as thresholds of the inspection logic used in each inspection device. The substrate image storage unit 23 is a predetermined area of ​​the storage 20d that stores images of the substrate (substrate images) captured by each inspection device. The inspection result storage unit 24 is a predetermined area of ​​the storage 20d that stores the inspection results of each inspection device. The foreign substance image storage unit 25 is a predetermined area of ​​the storage 20d that stores foreign substance images described later. The foreign substance image metadata storage unit 26 is a predetermined area of ​​the storage 20d that stores foreign substance image metadata, which is metadata related to the foreign substance images. The foreign substance library generation unit 28 generates a foreign substance library 27 that includes foreign substance images and foreign substance image metadata associated with the foreign substance images.

[0045] The teaching terminal 30 is a device that allows a user to set inspection parameters such as threshold values ​​of a predetermined inspection logic used for inspection in the inspection device 10 and feature quantities of an AI model.

[0046] The visual inspection terminal 40 is a device for visually checking the image of the printed circuit board captured by the inspection device 10. The visual inspection terminal 40 has an inspection NG image acquisition unit 41 that acquires images (inspection NG images) whose inspection results have been determined to be NG (defective) from among the board images stored in the board image storage unit 23 of the management server 20, and a visual inspection unit 42 that displays the inspection NG images. The user checks the inspection NG images displayed in the visual inspection unit 42, and information regarding the determination result of NG and the type of defect is transmitted to the management server 20 and stored in the inspection result storage unit 24 in association with the inspection NG images.

[0047] FIG. 4 is a flowchart illustrating the procedure of the foreign substance library generation process. In a production line 1 including a solder printing device X1 and the like, printed circuit boards are manufactured, and in this process, mass production inspection is performed in a solder printing inspection device Y1 and the like (step S1). The substrate image captured by the imaging unit 12 of the device 10 is stored in the image storage unit 14 in association with information about the substrate in question, and the results of the inspection performed in the inspection unit 13 (inspection results) are stored in the inspection result storage unit 15 in association with information about the substrate in question and information identifying the image captured thereof.

[0048] The images of the substrate and related information stored in the image storage unit 14 of each inspection device 10, and the inspection results and related information stored in the inspection result storage unit 15 are transmitted from each inspection device 10 to the management server 20 via the network NW, and are stored in the substrate image memory unit 23 and the inspection result memory unit 24 of the management server 20, respectively (step S2).

[0049] The NG inspection images from each inspection device 10 stored in the board image storage unit 23 of the management server 20 are transmitted to the visual inspection terminal 40 via the network NW (step S3). The NG inspection image acquisition unit 41 of the visual inspection terminal 40 acquires them and inputs them to the visual inspection unit 42. The visual inspection unit 42 displays the input NG inspection images on the output unit 40f and accepts input of the visual inspection results via the input unit 40e (step S4).

[0050] The visual inspection results in the visual inspection terminal 40 are associated with the visually inspected NG inspection image and related information and stored in the visual inspection result storage unit 43. The visual inspection results stored in the visual inspection result storage unit 43 are transmitted to the management server 20 via the network NW and stored in the inspection result memory unit 24 of the management server 20 (step S5).

[0051] In the management server 20, the foreign substance library generator 28 extracts images of substrates that have been judged as NG in the visual inspection for foreign substance inspection from among the inspection results stored in the inspection result storage unit 24 (step S6).The foreign substance library generator 28 then cuts out images of areas containing foreign substances (foreign substance images) from the NG-judged images of the visual inspection and stores them in the foreign substance image storage unit 25, and also stores information related to the foreign substance images (foreign substance image metadata) in the foreign substance image metadata storage unit 26 (step S7).

[0052] Based on the foreign substance library 27 generated as described above, the manufacturing process is analyzed and improved (step S8).

[0053] In the foreign substance library 27 generated in this manner, foreign substance images that enable clear recognition of the properties of the foreign substance are associated with foreign substance image metadata that includes information about the circumstances under which the foreign substance occurred during the production process. This makes it easier to analyze the conditions under which a foreign substance defect occurred, thereby enabling more efficient process improvement.

[0054] Example 1 In the following, a production line 1 according to a first embodiment of the present invention will be described in more detail with reference to the drawings. However, the configurations of the devices and systems described in this embodiment should be appropriately modified depending on various conditions. In other words, it is not intended to limit the scope of the present invention to the following embodiment.

[0055] Fig. 1 is a functional block diagram of the production line 1. Fig. 2 is an overall configuration diagram of the production line 1. Production line 1 is a surface mounting line that solders electronic components onto the surface of a printed circuit board, and mainly includes three processes: solder printing, component mounting, and reflow (solder deposition). The production process includes a manufacturing process using manufacturing equipment, which will be described later, and an inspection process using an inspection system. The production line 1 includes manufacturing equipment such as a solder printing device X1, a mounter X2, and a reflow furnace X3, and inspection equipment such as a solder printing inspection device Y1, a component inspection device Y2, and an appearance inspection device Y3. 1 includes a solder print inspection device Y1, a component inspection device Y2, an appearance inspection device Y3, and an X-ray inspection device Y4, a management server 20, a teaching terminal 30, a visual inspection terminal 40, an analysis terminal 50, and a user terminal 60. The inspection device 10 shown in Fig. 1 collectively refers to the solder print inspection device Y1, the component inspection device Y2, the appearance inspection device Y3, and the X-ray inspection device Y4, and actually corresponds to each of the inspection devices such as the appearance inspection device Y3 or a combination of them.

[0056] The production line 1 is provided with a solder printing device X1, a mounter X2, and a reflow furnace X3 in this order from the upstream side. The solder printing device X1 is a device that prints solder paste on electrode portions (called lands) on a printed circuit board by screen printing. The mounter X2 is a device that picks up electronic components to be mounted on the board and places the components on the solder paste at the corresponding locations, and is also called a chip mounter. The reflow furnace X3 is a heating device that heats and melts the solder paste, cools it, and solders the electronic components onto the board. When there are a large number and types of electronic components to be mounted on the board, multiple mounters X2 may be provided on the surface mounting line.

[0057] Additionally, production line 1 is equipped with an inspection system that includes inspection devices that inspect the condition of the boards at the exit of each manufacturing process, from solder printing to component mounting to reflow, and automatically detect defects or potential defects. The inspection system not only automatically separates non-defective products from defective products, but also has a function to provide feedback (e.g., changes to the mounting program) to the operation of manufacturing equipment such as solder printing device X1 that constitutes production line 1 based on the inspection results and their analysis results, and is responsible for the inspection process.

[0058] In the inspection system, a solder print inspection device Y1, a component inspection device Y2, a visual inspection device Y3, and an X-ray inspection device Y4 are provided in this order from the upstream side. The inspection device 10 shown in Fig. 1 collectively refers to the solder print inspection device Y1, the component inspection device Y2, the appearance inspection device Y3, and the X-ray inspection device Y4, and actually corresponds to an individual inspection device such as the appearance inspection device Y3 or a combination of them. The inspection device 10 is not limited to that included in the production line 1 illustrated in Fig. 2. The inspection system is also provided with a management server 20, a teaching terminal 30, a visual inspection terminal 40, and an analysis terminal 50, which will be described later. The user terminal 60 shown in Fig. 2 is a terminal used by the manager of the production line 1 or a person in charge of manufacturing equipment such as the solder print device X1 and / or inspection equipment such as the solder print inspection device Y1.

[0059] The solder printing device X1, mounter X2, reflow furnace X3, solder printing inspection device Y1, component inspection device Y2, appearance inspection device Y3, X-ray inspection device Y4, management server 20, teaching terminal 30, visual inspection terminal 40 and analysis terminal 50 are connected so as to be able to communicate with each other via a network NW.

[0060] The solder print inspection device Y1 is a device for inspecting the printed state of the solder paste on the board carried out from the solder printing device X1. The following will be described with reference to the functional blocks of the inspection device 10 shown in FIG. 1. In the solder print inspection device Y1, the solder paste printed on the board is captured by an imaging unit 12 such as an image sensor (camera), and an inspection unit 13 judges the quality of the solder paste based on the captured image using a predetermined inspection logic and a trained AI model (hereinafter, also simply referred to as an "AI model"). The captured image is stored in an image storage unit 14, and the inspection result of quality is stored in an inspection result storage unit 15 in association with the captured image. The solder print inspection device Y1 includes a control unit 11 that controls each unit of the inspection device 10 in order to execute a predetermined inspection process.

[0061] The component inspection device Y2 is a device for inspecting the arrangement of electronic components on the board carried out from the mounter X2. The configuration of the functional parts in the component inspection device Y2 is similar to that of the solder print inspection device Y1, so a detailed description will be omitted.

[0062] The appearance inspection device Y3 is a device for inspecting the quality of soldering on the board carried out from the reflow furnace X3. The configuration of the functional parts in the appearance inspection device Y3 is similar to that of the solder print inspection device Y1, so a detailed description will be omitted.

[0063] The X-ray inspection device Y4 is a device for inspecting the state of soldering on a circuit board using X-ray images. The configuration of the functional parts in the X-ray inspection device Y4 is the same as that of the solder print inspection device Y1 except that X-rays are used for imaging, so a detailed description will be omitted.

[0064] 3 is a hardware configuration diagram of the inspection device 10. The inspection device 10 has the same configuration as a general computer (information processing device), and includes a CPU (Central Processing Unit) 10a, a ROM (Read Only Memory) 10b, a RAM (Random Access Memory) 10c, a storage 10d, an input unit 10e, an output unit 10f, and a communication interface 10g. Each component is connected to each other via a bus 10h so as to be able to communicate with each other. The management server 20, the teaching terminal 30, the visual inspection terminal 40, the analysis terminal 50, and the user terminal 60 also have the same hardware configuration as the inspection device 10, so the corresponding configuration of each device is shown in parentheses, and detailed explanations of each configuration are omitted.

[0065] The CPU 10a is a central processing unit, and executes various programs and controls each configuration to realize each of the above-mentioned functional units. That is, the CPU 10a reads a program from the ROM 10b or the storage 10d, and executes the program using the RAM 10c as a working area. The CPU 10a controls each configuration and performs various arithmetic processing according to the program recorded in the ROM 10b or the storage 10d. Here, the CPU 10a and the RAM 10c constitute the control unit 11. The ROM 10b stores various programs and various data. The RAM 10c temporarily stores programs or data as a working area. The storage 10d is composed of a HDD (Hard Disk Drive), an SSD (Solid State Drive), or a flash memory, and stores various programs including an operating system and various data. The input unit 10e is, for example, a keyboard and / or a mouse, and is used to perform various inputs. The output unit 10f is, for example, a display, and displays a user interface. The output unit 10f may adopt a touch panel system to function as the input unit 10e. The communication interface 10g is an interface for communicating with other devices, and uses standards such as Ethernet (registered trademark), FDDI, or Wi-Fi (registered trademark).

[0066] The management server 20 is a computer device that manages the production line 1 including the inspection system. The management server 20 may be configured with one computer or multiple computers. Alternatively, all or part of the functions of the management server 20 may be implemented in a computer built into any of the devices such as the solder printing device X1 or the solder print inspection device Y1. Alternatively, part of the functions of the management server 20 may be realized by a server on a network (such as a cloud server).

[0067] The management server 20 includes a work information storage unit 21, an inspection parameter storage unit 22, a substrate image storage unit 23, an inspection result storage unit 24, a foreign substance image storage unit 25, a foreign substance image metadata storage unit 26, and a foreign substance library generation unit 28. Each of these storage units is configured by a storage 20d, and the foreign substance library generation unit 28 is configured by a CPU 20a and a RAM 20c. The management server 20 corresponds to the foreign substance library generation device of the present invention.

[0068] The workpiece information storage unit 21 is a predetermined area of ​​the storage 20d that stores information such as lot, part number, and vendor regarding the workpiece such as a substrate to be inspected. The inspection parameter storage unit 22 is a storage that stores inspection parameters such as thresholds of the inspection logic used in each inspection device. The storage 20d includes a storage unit 21 and a storage unit 22. The storage unit 21 includes a storage unit 22 and a storage unit 23. The storage unit 21 includes a storage unit 23 and a storage unit 24. The storage unit 23 ...

[0069] The teaching terminal 30 is a device for a user to set inspection parameters such as thresholds of a predetermined inspection logic used in inspection in the inspection device 10 and feature quantities of an AI model. The teaching terminal 30 has an inspection parameter adjustment unit 31 that adjusts the above-mentioned inspection parameters. The teaching terminal 30 also has an inspection unit 32 that performs inspection (test) on a model image using currently set logic and thresholds, and a result output unit 33 that displays the inspection results by the inspection unit 32 to the user. The teaching terminal 30 may have a learning unit that trains an AI model so that the inspection device 10 can determine whether a printed circuit board is good or bad based on previously learned data.

[0070] The visual inspection terminal 40 is a device for visually checking the image of the printed circuit board captured by the inspection device 10. The visual inspection terminal 40 has an inspection NG image acquisition unit 41 that acquires images (inspection NG images) whose inspection results have been determined to be NG (defective) from among the board images stored in the board image storage unit 23 of the management server 20, a visual inspection unit 42 that displays the inspection NG images for visual confirmation, and a visual inspection result storage unit 43 that stores the results of the visual inspection. The user checks the inspection NG images displayed in the visual inspection unit 42, and the information on the determination result of NG and the type of defect is stored in the visual inspection result storage unit 43 and transmitted to the management server 20, and stored in the inspection result storage unit 24 in association with the inspection NG images (step S5).

[0071] The analysis terminal 50 is a terminal that performs analysis of quality conditions and the like for improving production processes including manufacturing processes and inspection processes based on the foreign substance library 27 and the like. The analysis terminal 50 has a foreign substance image storage unit 51 and a foreign substance image metadata storage unit 52 that store foreign substance image information and foreign substance image metadata acquired from the foreign substance library 27 of the management server 20, an analysis support information generation unit 53 that generates analysis support information based on information and the like stored in the foreign substance image storage unit 51 and the foreign substance image metadata storage unit 52, an analysis support information display unit 54 that displays an analysis support screen based on the generated analysis support information, and a process improvement information provision unit 55 that generates process improvement information for process improvement and provides it to an external device. The analysis support information generation unit 53 has a function of generating advice for process improvement based on information including the foreign substance library 27 using a rule base or a learned AI model. The foreign substance image storage unit 51 and the foreign substance image metadata storage unit 52 are configured from a predetermined area of ​​the storage 50d. The analysis support information generation unit 53 is configured to include a CPU 50a, a RAM 50c, and a communication IF 50h. The analysis support information display unit 54 includes an output unit 50f, and the process improvement information providing unit 55 includes a CPU 50a, a RAM 50c, and a communication IF 50h. Here, the foreign substance image storage unit 51 and the foreign substance image metadata storage unit 52 correspond to the foreign substance image storage unit and the foreign substance related information storage unit of the present invention, respectively. Here, the analysis terminal 50 corresponds to the analysis support device of the present invention. Also, the analysis support information generation unit 53 corresponds to the analysis support information generation unit of the present invention. The analysis support information display unit 54 corresponds to the display unit of the present invention. Also, the input unit 50e corresponds to the instruction input unit of the present invention. And the process improvement information providing unit 55 corresponds to the improvement information providing unit of the present invention.

[0072] As described above, the user terminal 60 is a terminal used by a manager of the production line 1, or a person in charge of and / or a manager in charge of and / or managing manufacturing equipment such as the solder printing device X1 and / or inspection equipment such as the solder printing inspection device Y1, and may be a mobile terminal such as a smartphone. The user terminal 60 includes an improvement information output unit 61 that outputs information for process improvement in the manufacturing equipment and / or inspection equipment that is in charge of or managed by the user to whom the user terminal 60 is assigned in the production process and / or the inspection process. The improvement information output unit 61 includes an output unit 60f.

[0073] (Foreign substance library generation process) FIG. 4 is a flowchart illustrating the procedure of the foreign substance library generation process. In a production system including a solder printing device X1 and the like, printed circuit boards are manufactured, and in this process, mass production inspection is performed in a solder printing inspection device Y1 and the like (step S1). In the inspection device 10, a predetermined inspection is performed in an inspection unit 13 based on an image of the board captured by an imaging unit 12. The board image captured by the imaging unit 12 is stored in an image storage unit 14 in association with information about the target board. Furthermore, the results of the inspection performed in the inspection unit 13 (inspection results) are stored in an inspection result storage unit 15 in association with information about the target board and information specifying the captured image.

[0074] The images of the substrate and related information stored in the image storage unit 14 of each inspection device 10, and the inspection results and related information stored in the inspection result storage unit 15 are transmitted from each inspection device 10 to the management server 20 via the network NW, and are stored in the substrate image memory unit 23 and the inspection result memory unit 24 of the management server 20, respectively (step S2).

[0075] The NG inspection images from each inspection device 10 stored in the board image storage unit 23 of the management server 20 are transmitted to the visual inspection terminal 40 via the network NW (step S3). The NG inspection image acquisition unit 41 of the visual inspection terminal 40 acquires them and inputs them to the visual inspection unit 42. The visual inspection unit 42 displays the input NG inspection images on the output unit 40f and accepts input of the visual inspection results through the input unit 40e (step S4). Here, the visual inspection results input by the person in charge of visual inspection include the type of foreign matter (defective type). The visual inspection unit 42 may also have a function of determining the defective type from the NG inspection images using a rule base or a trained AI model. The foreign matter library generation unit 28 of the management server 20 may also have a function of determining the defective type.

[0076] The visual inspection results in the visual inspection terminal 40 are associated with the visually inspected NG inspection image and related information and stored in the visual inspection result storage unit 43. The visual inspection results stored in the visual inspection result storage unit 43 are transmitted to the management server 20 via the network NW and stored in the inspection result memory unit 24 of the management server 20.

[0077] In the management server 20, the foreign substance library generating unit 28 extracts images (hereinafter referred to as "visually unacceptable images") of boards that have been judged to be unacceptable in the visual inspection for foreign substance inspection (hereinafter referred to as "visually unacceptable boards") from the inspection results stored in the inspection result storage unit 24 (step S6). Then, the foreign substance library generating unit 28 cuts out images of areas containing foreign substances (foreign substance images) from the visually unacceptable images and stores them in the foreign substance image storage unit 25, while also storing information related to the foreign substance images (foreign substance image metadata) in the foreign substance image metadata storage unit 26 (step S7). Specifically, the foreign substance area is cut out from the visually unacceptable images by removing background board parts and the like through image processing, and only the foreign substance area is cut out and stored in the foreign substance image storage unit 25. The foreign substance image metadata includes, but is not limited to, the inspection time, the type of foreign substance (defect type), the position of the foreign substance (defect position), the process in which the foreign substance occurred, the place (base) in which the visually unacceptable board was produced, and the manufacturing conditions of the manufacturing equipment in the manufacturing process before and after the foreign substance occurred. Here, the defect type may be, for example, The foreign object may include, but is not limited to, solder balls, waste, chips, and components. The defective position may include, but is not limited to, the periphery of a land, resist, and the like. The foreign object image data may include the conditions of the manufacturing device where the foreign object occurred, the lot information of the visually unacceptable board, and the like, which can be specified from the inspection time, but may also include these information in addition to the time. The extraction of the visually unacceptable images may be performed every time the board is judged as unacceptable in the visual inspection at the visual inspection terminal 40, or may be performed at an appropriate timing such as a predetermined cycle. Here, the foreign object library 27 is generated from images of boards judged as unacceptable in the mass production inspection and the visual inspection. However, even before the foreign object library is generated, foreign object images and foreign object image metadata may be generated from the board images and inspection results stored in the board image storage unit 23 and the inspection result storage unit 24 of the management server 20, and may be registered in the foreign object library 27. In addition to the unacceptable inspection images, foreign object images cut out from board images that were judged as acceptable during the inspection at the very limit of the threshold may be stored in the foreign object library 27. By using a foreign substance composite image obtained by combining such a foreign substance image with a non-defective board image, it is possible to optimize the inspection parameters so that foreign substances that were overlooked because the inspection parameters were not set appropriately during inspection can be properly detected. The above-mentioned board images may also be temporarily stored in the foreign substance library 27, including foreign substance images cut out from board images that have been inspected as OK, and checked to see whether they are truly OK, and foreign substance images that have been judged as NG may be left in the foreign substance library 27. In step S3, in addition to the inspection NG images, a part of the inspection OK images as described above may also be transmitted to the visual inspection terminal 40. Here, the foreign substance library generation unit 28 corresponds to the foreign substance image generation unit of the present invention. The defect type is an example of the foreign substance characteristic information and type information of the present invention, and the defect position is an example of the relationship information of the present invention. In this way, data related to foreign substance defects can be sufficiently accumulated as the foreign substance library 27. Furthermore, the foreign substance library 27 generated in this way can be applied not only to improvements in the manufacturing process described below, but also to improvements in the inspection process, such as generating a foreign substance composite image in which a foreign substance is combined with an image of a non-defective substrate, and optimizing inspection parameters in the inspection process using the same.

[0078] Based on the foreign substance library 27 generated as described above, the manufacturing process is analyzed and improved (step S8). Specific methods for process improvement will be explained together with the analysis support method described later.

[0079] The analysis support method using the foreign substance library 27 will be described below. FIG. 5 shows an example of an individual information display screen 100 displayed on the output section 50f of the analysis terminal 50. As shown in FIG. An individual information column 110a indicating the type of information and a statistical information column 110b are displayed at the top of the individual information display screen 100. Here, the individual information column 110a is active, and the characters are displayed in white, indicating that what is currently being displayed is individual information.

[0080] A foreign object image selection field 120 is displayed on the upper side of the individual information display screen 100. An item row 121 labeled "defective type" is displayed at the top of the foreign object image selection field 120, and the lower part of the item row 121 is divided into multiple columns, and from the left, a solder ball field 122, a rubbish field 123, a chip skip field 124, and a component skip field 125 are arranged. The defective types are solder balls, rubbish, chip skip, and component skip. In the solder ball field 122, solder ball images 122a, 122b, and 122c are displayed from the top, with the identification numbers ID:1, ID:5, and ID:9, respectively. Similarly, in the rubbish field 123, rubbish images 123a, 123b, and 123c are displayed from the top, with the identification numbers ID:2, ID:6, and ID:10, respectively. Similarly, in the chip skipping field 124, chip skipping images 124a, 124b, and 124c are displayed, from top to bottom, with the identification numbers ID:3, ID:7, and ID:11. Similarly, in the component skipping field 125, component skipping images 125a, 125b, and 125c are displayed, from top to bottom, with the identification numbers ID:4, ID:8, and ID:12. Solder ball images 122a to 122c, debris images 123a to 123c, chip-flying images 124a to 124c, and component-flying images 125a to 125c displayed in image selection field 120 are examples of foreign matter images registered in foreign matter image storage unit 25.

[0081] The individual information display screen 100 shown in Figure 5 shows a state in which a user has selected, for example, a chip skip image 124b using the input section 50e, etc., and the chip skip image 124b with ID:7 displayed in the foreign matter image selection field 120 is highlighted by being surrounded by a thick frame 126. Then, on the left side below the foreign substance image selection column 120 on the individual information display screen 100, the board image 130 including the chip jump image 124b is displayed, and on the right side thereof, a metadata column 140 is displayed.

[0082] The board image 130 is an image of a region of the captured board that includes at least the chip jump image 124b displayed in the foreign object image selection field 120. In the individual information display screen 100 shown in Fig. 5, an image of the chip 133 included in the chip jump image 124b is displayed surrounded by a frame line 134. In this board image 130, it can be seen that the chip 133 is located near the land 132b out of the lands 132a and 132b for connecting the chip 131.

[0083] In the metadata column 140, metadata related to the foreign object image is displayed in an item column 141 and a value column 142. Here, the metadata is displayed for each item of inspection time, defect type, defect position, process, and base. The metadata displayed in the metadata column 140 is not limited to these. In the value column 142 of the inspection time row 144, the time when the board on which the chip jump image 124b was captured was inspected is displayed as "2023 / 11 / 11 11:22:33". In addition, in the value column 142 of the defect type row 145, the defect type associated with the chip jump image 124b is displayed as "chip jump". In addition, in the value column 142 of the defect position row 146, the position of the chip 133 on the board that is the subject of the inspection image including the chip jump image 124b is displayed as "land surroundings". In addition, in the value column 142 of the process row 147, the process on which the inspection image including the chip jump image 124b was captured is displayed as "post-mount process". Moreover, in the value column 142 of the base line 148, the place where the substrate that is the subject of the inspection image including the chip missing image 124b was manufactured is displayed as "Ishikawa Factory."

[0084] By using the individual information contained in the individual information display screen 100 shown in FIG. 5 and displayed on the output section 50f of the analysis terminal 50, the manufacturing process of the substrate that has been determined to be NG in the foreign substance inspection can be individually analyzed based on a specific foreign substance image selected by the user and included in the foreign substance library 27.

[0085] FIG. 6 shows an example of a statistical information display screen 200 displayed on the output section 50 f of the analysis terminal 50 . On the left side of the upper end of the statistical information display screen 200, an individual information field 210a and a statistical information field 210b showing the type of information are displayed. Here, the statistical information field 210b is in an active state, and the characters are displayed in white, indicating that what is currently being displayed is statistical information. When the individual information field 110a is in an active state on the individual information display screen 100 shown in FIG. 5, the display of the output field 50f may be transitioned to the statistical information display screen 200 by the user selecting the statistical information field 110b using the input unit 50e.

[0086] A message 211 is displayed on the right side of the upper end of the statistical information display screen 200. Here, the message 211 reads, "There may be an abnormality in the mounter head nozzle. We recommend that you check it." The message 211 corresponds to the recommended information of the present invention.

[0087] A statistical target field 212 is displayed below the statistical information field 210b on the statistical information display screen 200. The statistical target field 212 displays items to be statistically processed for foreign substance images included in the foreign substance library 27. Here, as statistical targets, a defect type field 212a, a defect position field 212b, a process field 212c, and a base field 212d included in the items of the metadata field 140 on the individual information display screen 100 are displayed. Among the statistical target fields 212, the defect type field 212a is active and the characters are displayed in white, indicating that the defect type is the one that is currently the statistical target and the statistical information is displayed. The user may use the input unit 50e to select any field other than the defect type field 212a of the statistical target field 212, thereby causing the statistical target on the statistical information display screen 200 to transition to displaying statistical information related to the defect position, process, and base.

[0088] A counting period field 213 is displayed below the statistical target field 212 on the statistical information display screen 200. The counting period field 213 displays the counting period for the items that are the subject of statistical processing. Here, it is shown that statistical information related to defect types whose inspection times fall within the period from Nov. 1, 2023 to Dec. 1, 2023 is displayed. A graph 214 is displayed below the counting period column 213 on the statistical information display screen 200. In this graph 214, bar graphs showing the numbers of solder balls, debris, chips flying, and components flying are displayed in the colors assigned to them. Here, debris 214a and chips flying 214b are displayed, and at the bottom of the graph 214, a legend 214c is displayed showing the correspondence between each defect type and the color assigned to that defect type. The graph 214 is an example of statistical information of the present invention.

[0089] The individual information display screen 100 and the statistical information display screen 200 may be displayed on a single screen of the output section 50f of the analysis terminal 50, or may be displayed on separate screens. Displaying the individual information display screen 100 and the statistical information display screen 200 on a single screen of the output section 50f of the analysis terminal 50 enables a more multifaceted analysis of the occurrence of foreign matter defects.

[0090] Based on the information displayed on the individual information display screen 100 and / or the statistical information display screen 200, measures are taken to improve the production and inspection processes.

[0091] For example, if the analyst judges that the message 211 on the statistical information display screen 200 shown in FIG. 6 is appropriate, the analyst transmits a similar message to the user terminal 60 used by the person in charge of the mounter X2 and / or the manager. In this case, the process improvement information providing unit 55 displays the message transmission destination, the message to be transmitted, and a button for instructing transmission on the output unit 50f, and the analyst can receive an instruction input from the input unit 50e and transmit the message for process improvement to the specified user terminal 60 via the communication IF 50g. The process improvement information providing unit 55 may select and display a predetermined transmission destination according to the contents of the message, or the analyst may select from a displayed transmission destination list. In addition, the process improvement information providing unit 55 may transmit the message displayed on the statistical information display screen 200 as the message to be transmitted, or the analyst may edit this message by the input unit 50e, or may display the message in a displayable form on the output unit 50f so that the analyst can freely input a message, and transmit the edited message. Based on the received message displayed on the improvement information output unit 61, the person in charge of the mounter X2 checks the head nozzle of the mounter X2 and takes necessary measures such as adjusting parameters as necessary, thereby improving the process. Here, the message sent from the process improvement information providing unit 55 corresponds to the process improvement information of the present invention, and the user terminal 60 corresponds to the external device of the present invention.

[0092] In addition, when the analyst determines that it is desirable to change the inspection parameters for a position where the risk of foreign matter defects is high in order to improve the process, a message to that effect may be sent to the user terminal 60 used by the analyst. In this case, the process improvement information providing unit 55 However, the message destination, the message to be sent, and a button for instructing sending are displayed on the output unit 50f, and the analyst can receive an instruction input from the input unit 50e and send a message recommending a change in the inspection parameters of the position where the risk of foreign matter defects is high to the designated user terminal 60 via the communication IF 50g. Here, the process improvement information providing unit 55 may select the analyst from the displayed destination list. In addition, the process improvement information providing unit 55 displays a text input area on the output unit 50f so that the analyst can freely input a message using the input unit 50e, and transmits the input message. The analyst who receives the message adjusts the inspection parameters, such as the threshold value of the inspection logic of the corresponding inspection device, using the inspection parameter adjusting unit 31 of the teaching terminal 30. Then, the inspection is performed in the corresponding inspection device according to the inspection logic, etc., for which the inspection parameters have been adjusted, thereby improving the process. Here, the message indicating that it is desirable to change the inspection parameters for locations where there is a high risk of foreign matter defects corresponds to the process improvement information of the present invention, and the user terminal 60 or teaching terminal 30 where the person in charge receives the message corresponds to the external device of the present invention.

[0093] The information provided by the process improvement information providing unit 55 for process improvement is not limited to the above, and a part or all of the foreign substance library 27 stored in the foreign substance image storage unit 51 and the foreign substance image metadata storage unit 52 may be transmitted to a manufacturing device such as the solder printing device X1 as an external device.

[0094] In the following, the components of the present invention will be described with reference to the reference numerals in the drawings in order to make it possible to compare the components of the present invention with the configurations of the embodiments. <Appendix 1> a foreign matter image generating unit (28) that generates a foreign matter image, which is an image of an area including the foreign matter, from a substrate image obtained by capturing an image of the substrate including the foreign matter; a foreign substance image storage unit (25) for storing the foreign substance image; a foreign substance-related information storage unit (26) that stores foreign substance-related information related to the foreign substance in association with the foreign substance image; A foreign substance library generating device (20) comprising: <Appendix 2> The foreign substance library generation device (20) described in Appendix 1, characterized in that the foreign substance image generation unit (28) generates the foreign substance image from the substrate image in which a defect including the foreign substance is confirmed by visual inspection of the substrate image. <Appendix 3> The foreign object library generation device (20) described in Appendix 1, characterized in that the foreign object image generation unit (28) generates the foreign object image from a substrate image determined to be defective and containing the foreign object in an inspection device (10) that inspects the substrate for the presence or absence of the foreign object. <Appendix 4> 4. The foreign object library generating device (20) according to any one of claims 1 to 3, wherein the foreign object-related information includes foreign object characteristic information relating to characteristics of the foreign object. <Appendix 5> 5. The foreign object library generating device (20) according to any one of claims 1 to 4, wherein the foreign object-related information includes relationship information regarding a relationship between the substrate and the foreign object. <Appendix 6> An analysis support device (50) for supporting analysis of a substrate production process, a foreign matter image storage unit (51) that stores a foreign matter image, which is an image of an area including a foreign matter, generated from a substrate image obtained by capturing an image of a substrate including the foreign matter; a foreign substance-related information storage unit (52) that stores foreign substance-related information related to the foreign substance, including type information of the foreign substance, in association with the foreign substance image; Analysis support information used for analyzing a production process of the substrate is stored in the foreign matter image storage unit. an analysis support information generating unit (53) that generates analysis support information including the foreign substance-related information related to at least one of the stored foreign substance images; An analysis support device (50) comprising: <Appendix 7> A display unit (54) for displaying information; an instruction input unit (50e) for receiving an input of an instruction; Equipped with the display unit displays the plurality of foreign substance images in association with the foreign substance-related information; receiving, by the instruction input unit, a selection of any one of the plurality of foreign substance images displayed on the display unit; The analysis support device (50) according to claim 6, wherein the display unit displays the foreign substance-related information associated with the foreign substance image related to the selection accepted by the instruction input unit. <Appendix 8> The analysis support device (50) according to claim 6 or 7, characterized in that the analysis support information includes statistical information obtained by statistically processing the foreign substance-related information related to the plurality of foreign substance images stored in the foreign substance image storage unit. <Appendix 9> The analysis support device (50) according to any one of appendices 6 to 8, wherein the analysis support information includes recommendation information for improving a production process of the substrate. <Appendix 10> 10. An analysis support device (55) according to any one of appendices 6 to 9, comprising an improvement information providing unit (55) that generates process improvement information for improving a production process of the substrate and transmits it to an external device (60). <Appendix 11> generating a foreign matter image, which is an image of a region including the foreign matter, from a substrate image obtained by capturing an image of the substrate including the foreign matter; storing the foreign object image; storing foreign substance-related information about the foreign substance in association with the foreign substance image; A method for generating a foreign substance library, comprising: <Appendix 12> The method for generating a foreign substance library according to claim 11, wherein the substrate image is a substrate image in which a defect including the foreign substance is confirmed by visual inspection of the substrate image. <Appendix 13> The foreign object library generation method according to claim 11, characterized in that the substrate image is a substrate image that is determined to be defective and contains the foreign object by an inspection device (10) that inspects the substrate for the presence or absence of the foreign object. <Appendix 14> 14. The foreign object library generating method according to claim 11, wherein the foreign object-related information includes foreign object characteristic information relating to characteristics of the foreign object. <Appendix 15> 15. The foreign object library generating method according to claim 11, wherein the foreign object-related information includes relationship information regarding a relationship between the substrate and the foreign object. <Appendix 16> A foreign matter image which is an image of a foreign matter present on a substrate; foreign substance-related information related to the foreign substance image, the foreign substance type information being used to classify and display the foreign substance image; and a data structure (27) extractably associating the foreign object-related information related to the classified foreign object image. [Explanation of symbols]

[0095] 20: Management server 25: Foreign object image storage unit 26: Foreign object image metadata storage unit 28: Foreign substance library generation unit

Claims

1. a foreign matter image generating unit that generates a foreign matter image, which is an image of an area including the foreign matter, from a substrate image obtained by capturing an image of the substrate including the foreign matter; a foreign substance image storage unit that stores the foreign substance image; a foreign substance-related information storage unit that stores foreign substance-related information related to the foreign substance in association with the foreign substance image; A foreign substance library generating device comprising:

2. 2. The foreign substance library generating device according to claim 1, wherein the foreign substance image generating unit generates the foreign substance image from a substrate image in which a defect including the foreign substance is confirmed by visual inspection of the substrate image.

3. 2. The foreign substance library generation device according to claim 1, wherein the foreign substance image generation unit generates the foreign substance image from a substrate image determined to be defective and containing the foreign substance in an inspection device that inspects the substrate for the presence or absence of the foreign substance.

4. The foreign object library generating apparatus according to claim 1 , wherein the foreign object-related information includes foreign object characteristic information relating to characteristics of the foreign object.

5. The foreign object library generating apparatus according to claim 1 , wherein the foreign object-related information includes relationship information regarding a relationship between the substrate and the foreign object.

6. An analysis support device that supports analysis of a substrate production process, a foreign matter image storage unit that stores a foreign matter image, which is an image of a region including a foreign matter, generated from a substrate image obtained by capturing an image of a substrate including the foreign matter; a foreign substance-related information storage unit that stores foreign substance-related information related to the foreign substance, including type information of the foreign substance, in association with the foreign substance image; an analysis support information generating unit that generates analysis support information used in an analysis of a production process of the substrate, the analysis support information including the foreign substance-related information related to at least one of the foreign substance images stored in the foreign substance image storage unit; An analysis support device comprising:

7. A display unit for displaying information; An instruction input unit that accepts input of an instruction; Equipped with the display unit displays the plurality of foreign substance images in association with the foreign substance-related information; receiving, by the instruction input unit, a selection of any one of the plurality of foreign substance images displayed on the display unit; 7. The analysis support device according to claim 6, wherein the display unit displays the foreign substance-related information associated with the foreign substance image related to the selection accepted by the instruction input unit.

8. 7. The analysis support device according to claim 6, wherein the analysis support information includes statistical information obtained by statistically processing the foreign substance-related information related to the plurality of foreign substance images stored in the foreign substance image storage unit.

9. 7. The analysis support device according to claim 6, wherein the analysis support information includes recommendation information for improving a production process of the substrate.

10. 7. The analysis support device according to claim 6, further comprising an improvement information providing unit that generates process improvement information for improving a production process of the board and transmits the process improvement information to an external device.

11. generating a foreign matter image, which is an image of a region including the foreign matter, from a substrate image obtained by capturing an image of the substrate including the foreign matter; storing the foreign object image; storing foreign substance-related information about the foreign substance in association with the foreign substance image; A method for generating a foreign substance library, comprising:

12. The method for generating a foreign substance library according to claim 11 , wherein the substrate image is a substrate image in which a defect including the foreign substance is confirmed by visual inspection of the substrate image.

13. 12. The foreign substance library generating method according to claim 11, wherein the substrate image is an image of a substrate that contains the foreign substance and is determined to be defective by an inspection device that inspects the substrate for the presence or absence of the foreign substance.

14. The method of claim 11 , wherein the foreign object related information includes foreign object characteristic information relating to characteristics of the foreign object.

15. The method for generating a foreign object library according to claim 11 , wherein the foreign object-related information includes relationship information regarding a relationship between the substrate and the foreign object.

16. A foreign matter image which is an image of a foreign matter present on a substrate; foreign substance-related information related to the foreign substance image, the foreign substance type information being used to classify and display the foreign substance image; and a data structure extractably associating the foreign substance-related information related to the classified foreign substance image.

Images