Ultrasonic plating utilizing megahertz ultrasonic wave and fine bubble

Abstract

To provide an ultrasonic plating method capable of achieving a target chemical reaction.SOLUTION: In plating treatment, megahertz ultrasonic vibration allow control of a resonance phenomenon and a nonlinear phenomenon according to an intended purpose, and thereby a chemical reaction due to an ultrasonic vibration phenomenon suitable for the chemical reaction on the surface of an object to be plated, or a cleaning phenomenon, is continuously achieved as efficient and uniform treatment. Further, through continuous use, water tank and jig surface residual stress of adjacent water tanks, generated by a phenomenon of ultrasonic propagation to the adjacent water tanks, is alleviated and uniformized, and thereby ultrasonic waves with a high frequency of 100 MHz or more propagate efficiently. Based on measurement, analysis and evaluation of the vibration state of each water tank, a uniform, stable and highly efficient plating treatment system is achieved by ultrasonic oscillation control.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to an ultrasonic plating method for utilizing megahertz ultrasonic vibration phenomena in plating processes. [Background technology]

[0002] Regarding the use of ultrasonic waves in plating processing, ultrasonic waves of 1MHz or less have traditionally been used for cleaning and plating processes.

[0003] In fact, the edges, curved surfaces, and multiple processed areas of the objects to be plated, which are shaped and processed at the nano level, cause large variations in chemical reactions, which in turn cause large variations in the plating results.

[0004] The ultrasonic plating of the present invention utilizes ultrasonic oscillation control to enable dynamic control of surface acoustic waves in the range of 1 Hz to 1 GHz on the plated portion, and resonance and nonlinear phenomena within a certain range.

[0005] In particular, simple ultrasonic oscillation can cause large variations in chemical reactions due to the occurrence of low-frequency resonance phenomena. By detecting the vibration phenomenon in each process of the plating process through ultrasonic sound pressure data analysis, we have developed a method based on the analytical evaluation of the nonlinear phenomenon of ultrasonic waves. It is possible to control (achieve) the optimization of ultrasonic propagation conditions to achieve the desired efficient chemical reaction.

[0006] Regarding control of plating condition Conventionally, the measurement, analysis, and evaluation of chemical reactions and megahertz vibration phenomena in plating processes have been insufficient. In particular, with regard to the optimization of nonlinear and resonance phenomena, analysis (evaluation of changes in bispectrum, autocorrelation, etc.) makes it possible to control the chemical reactions and vibration phenomena (oscillation control) of each plating process.

[0007] In this invention, ultrasonic oscillation control of 300 MHz or more is By analyzing and managing the sound pressure measurement data (changes in autocorrelation, bispectrum, power contribution rate, and impulse response), ultrasonic control of the plating process for the entire plating line is optimized. [Prior art documents] [Patent documents]

[0009] [Patent Document 1] Patent Publication No. 2021-161532 [Patent Document 2] Patent Publication No. 2021-125866 Summary of the Invention [Problem to be solved by the invention]

[0010] By continuously using ultrasonic vibrations of 300 megahertz or more for chemical reactions or cleaning phenomena in the plating process, it is possible to stably and effectively utilize the effects of ultrasound on the entire plating line (surface treatment system), including multiple adjacent water tanks. [Means for solving the problem]

[0011] To transmit ultrasonic vibrations to the surface of the plated object An ultrasonic oscillation control probe that takes into account the ultrasonic propagation characteristics of the bath, plating solution, object, tool, etc. is placed in the plating bath. (or attached to the surface of the aquarium).

[0012] In order to control resonance and nonlinear phenomena on the surface of objects that utilize chemical reactions, we optimize (ultrasonic oscillation control settings) the nonlinear vibration phenomenon (dynamic changes in the bispectrum) propagated by ultrasonic waves of 300 MHz or more based on confirmation of various acoustic characteristics and interactions.

[0013] By controlling the ultrasonic oscillation of

[0012] , the surface of the plating object is By realizing the propagation state of ultrasonic vibrations in the range of 20kHz to 300MHz or more and continuously analyzing and managing various sound pressure data from adjacent water tanks and the results of the plating process, the oscillation control conditions of megahertz ultrasonic waves can be optimized for the entire plating line in accordance with the object to be plated. Control condition examples: 1) Ultrasonic waves of 50 kHz or less 2) Degassing fine bubble generating liquid circulation system 3) Megahertz ultrasonic oscillation probe 4) Air blow 5) Oscillating operation of the target object 6) Processing liquid (liquid temperature, concentration, distribution, etc.) Effect of the Invention

[0013] Figure 1. Sound pressure measurement data for ultrasonic plating tank Graph 1 Vertical axis: Voltage max. 500mV Horizontal axis: Time max. 50μs Graph 2 Vertical axis: Power dBu Horizontal axis: Frequency up to 200MHz Ultrasonic oscillation 1 3MHz~20MHz Sweep oscillation Output 15W Ultrasonic oscillation 2 8MHz pulse oscillation Output 10W Ultrasonic oscillation 3 35kHz Output 300W Figure 2 Change in vibration mode due to continuous use of ultrasonic plating bath Graph 1 November 2015 Before improvement Graph 2 November 2019 Addition of ultrasonic and fine bubbles Graph 3 April 2022 Addition of megahertz ultrasound Analysis results of power contribution rate for sound pressure measurement data of water tank surface and processing liquid Figure 3 Sound pressure measurement management of plating processing line Drawing number explanation ▲1▼Parts to be plated ▲2▼Moving device ▲3▼Sound pressure measurement probe ▲4▼Sound pressure monitor Figure 4 Sound pressure measurement data for an adjacent tank without ultrasonic equipment Graph 1 Vertical axis: Voltage max. 500mV Horizontal axis: Time max. 50μs Graph 2 Vertical axis: Power dBu Horizontal axis: Frequency (max. 200 MHz) Figure 5 Liquid circulation by degassing fine bubble generating liquid circulation pump Megahertz ultrasonic waves and aeration optimization (sound pressure measurement control) Figure 6 Ultrasonic plating example Drawing number explanation ▲1▼Part to be plated ▲2▼Plating jig (hanger) ▲3▼Moving device ▲4▼Ultrasonic oscillation control probe ▲5▼Fixing member for moving device ▲6▼Sound pressure measurement probe ▲7▼Sound pressure monitor

Claims

1. An ultrasonic plating method that uses ultrasonic vibrations of 100 MHz or more that propagate through the surface of an object in plating processing, making the plating process (chemical reaction or cleaning) on ​​the surface of the object more efficient and uniform.

2. Regarding ultrasonic plating of

1. This ultrasonic plating method uses ultrasonic waves and fine bubbles to relax the surface residual stress in a plating bath, and can transmit ultrasonic vibrations of 20 kHz to 300 MHz or more to 5,000 liters of plating solution even with an ultrasonic output of 30 W or less.

3. Regarding the ultrasonic plating method of

2. , An ultrasonic plating method in which the resonance phenomenon of frequencies below 20 kHz is controlled by setting the ultrasonic sweep oscillation conditions based on the interactions (response characteristics and contribution rate by sound pressure measurement analysis) between the water tank, the plating object, the liquid, the jig, etc.

4. Regarding the ultrasonic plating method of

3. , Multiple different megahertz ultrasonic oscillation control probe control settings, 1) Sweep oscillation from several megahertz to several tens of megahertz 2) Pulse oscillation of several megahertz This ultrasonic plating method realizes uniform and stable plating by applying ultrasonic stimulation to the surface of the plating object and the plating solution at the nano level.

5. Regarding the ultrasonic plating of

4. , An ultrasonic plating method characterized by adjusting the flow rate, flow velocity, and flow state of the air blow in the water tank by measuring and analyzing the sound pressure of the ultrasonic waves so as to maximize the frequency of occurrence of nonlinear phenomena or the propagation frequency of harmonics.

6. Regarding the ultrasonic plating of

5. , An ultrasonic plating method characterized by the fact that, after three to six months of continuous use, the ultrasonic waves propagate to adjacent tanks and plating solutions, spreading the effects of the ultrasonic waves throughout the entire plating line.

7. Regarding the ultrasonic plating of

6. , Even if there is no direct connection to the adjacent tank, ultrasonic waves are propagated by anti-drip plates, fixed contact members, etc., and the ultrasonic vibrations of the entire system interact in a complex manner, realizing dynamic ultrasonic control. This is an ultrasonic plating method.

8. Regarding the ultrasonic plating of

7. , By using it continuously for several years or more, the ultrasonic propagation efficiency and the uniformity of the surfaces of various propagation members are improved, and even with an ultrasonic output of 30W or less, ultrasonic waves can propagate to two or three adjacent plating tanks of 5,000 liters, improving the quality of the plating process.

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